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WO2015150330A1 - Method and device for joining structures on a substrate and arrangement comprising said joined structures - Google Patents

Method and device for joining structures on a substrate and arrangement comprising said joined structures Download PDF

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Publication number
WO2015150330A1
WO2015150330A1 PCT/EP2015/056904 EP2015056904W WO2015150330A1 WO 2015150330 A1 WO2015150330 A1 WO 2015150330A1 EP 2015056904 W EP2015056904 W EP 2015056904W WO 2015150330 A1 WO2015150330 A1 WO 2015150330A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate material
structural element
connecting surface
pressing
substrate
Prior art date
Application number
PCT/EP2015/056904
Other languages
German (de)
French (fr)
Inventor
Lutz Rissing
Meriem Ben-Salah AKIN
Original Assignee
Leibniz Universität Hannover
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leibniz Universität Hannover filed Critical Leibniz Universität Hannover
Publication of WO2015150330A1 publication Critical patent/WO2015150330A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0511—Diffusion patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Definitions

  • the invention relates to a method for joining structural elements in the form of coatings and / or components on organic or non-organic substrate materials according to claim 1.
  • the invention further relates to an arrangement of at least one organic or non-organic substrate material and at least one materially connected thereto structural element according to claim 8 and a device for the manufacture of such an arrangement according to claim 9.
  • the invention relates to the joining of coatings and / or components to substrate materials, ie their cohesive connection with the substrate material.
  • substrate materials ie their cohesive connection with the substrate material.
  • An important area of application is the production of electrical and / or electronic circuits. These are built according to the prior art either on solid printed circuit boards (boards), or there are used flex conductors having a flexible substrate, which is provided with conductor tracks.
  • Flexible substrates usually consist of polymer-based materials.
  • the tracks are formed of primarily metallic materials.
  • various problems have to be solved, for example different coefficients of linear expansion, essentially no possibility of producing chemical bonds between polymers and metals due to different atomic structures, and the consideration of different melting temperatures when using a thermal joining process.
  • the invention is therefore based on the object of specifying a method for joining structural elements on substrate materials, which combines a high precision in the production with a high durability of the joint connection. Furthermore, a corresponding arrangement and a device for producing such an arrangement should be specified.
  • This object is achieved according to claim 1 by a method for joining structural elements in the form of coatings and / or components on organic or non-organic substrate materials, in which a connecting surface of at least one structural element is adhesively bonded to a connecting surface of at least one substrate material, with the steps : a) producing an oxidized surface at the bonding surface of the structural element and / or the substrate material or using a structural element and / or substrate material with an already oxidized surface at the bonding surface thereof,
  • the invention has the advantage that it allows the production of considerably more durable joint connections with relatively little technical effort than known methods. In particular, other disadvantages of known methods, which lead to problems in manufacturing precision, are avoided. Thus, in the invention, e.g. no problems with overflowing melt, which has to be removed again afterwards.
  • the inventive method is also relatively robust to production-related inhomogeneities of the arrangement produced, so that a high degree of reproducibility of production, especially in mass production, can be achieved with relatively little effort.
  • the joining method according to the invention can also be carried out without additives which are necessary for the preparation of the joining compound in known processes, e.g. without soldering or welding agent.
  • the substrate material may be an electrically conductive or an electrically insulating material.
  • an organic plastic material may be used, e.g. in the form of a foil or a thin plate.
  • a substrate material e.g. a polymeric material may be used, e.g. Polyethylene terephthalate or polyimide.
  • the substrate material may in particular be an optical polymer material, e.g. a clear transparent material, e.g. Plexiglas.
  • polycarbonates can be advantageously used as a substrate material.
  • the above-mentioned steps of the method can be carried out one after the other in chronological succession, or can be performed in whole or in part, overlapping in time or even simultaneously.
  • the step of producing the oxidized surface at the bonding surface of the structural element and / or the substrate material may be performed during the heating process.
  • the heating process e.g. the exposure of an indium-containing bonding surface under the influence of temperature during the joining process sufficient oxidation of the surface. Accordingly, oxidation of the bonding surface as a separate process step is no longer required in such cases. This can shorten the manufacturing process.
  • connection surface of the structural element to a metal, a metal alloy or a metal-containing material said material is oxidizable.
  • the metal alloy can in particular be a eutectic alloy.
  • the metal-containing material may be, for example, a composite material.
  • the structural element has a low-melting metal or a metal alloy at least in the region of the connection surface. It may be, for example, an indium-tin alloy, for example 52ln48Sn, or another indium-metal alloy.
  • the alloy materials it is advantageous to select the alloy materials as materials having substantially the same dynamic viscosity.
  • the joining partner is provided homogeneously, whereby a particularly homogeneous diffusion process of the oxide layer can be achieved.
  • the substrate material is bent relative to its present during the Anpressvorgangs shape to loosen the punch after the Anpressvorgangs, in particular bent convexly with respect to the punch.
  • This makes it possible to achieve a simple and reliable release of the structural elements from the stamp while they continue to adhere to the substrate material or its connection surface.
  • the substrate material with the connecting surface already present thereon can be provided on a roll as a quasi-continuous material, and after being unwound from the roll, can be equipped with the structural elements and then rolled up to another roll, whereby at the same time the aforementioned step of bending the substrate material can be performed.
  • the structural element in particular in the form of the coating, can also be designed as a multilayer system, e.g. in the form of printed conductors which, as the current-conducting element, comprise a noble metal or semi-precious metal layer, e.g. Gold, silver or copper, wherein at the connecting surface of the structural element, the said metal layer or metal alloy layer which is oxidizable dib is arranged.
  • a noble metal or semi-precious metal layer e.g. Gold, silver or copper
  • the structural element is pressed against the substrate material by means of a structured stamp, the stamp being an image of the geometric structure of a coating of the substrate material to be produced on the substrate material.
  • the stamp being an image of the geometric structure of a coating of the substrate material to be produced on the substrate material.
  • electronic circuits can be manufactured with great precision quickly and inexpensively.
  • the structuring of the stamp e.g. can correspond to the conductor track structure to be generated
  • the desired conductor tracks can be pressed onto the substrate material and at the same time be fastened by the diffusion bonding by means of the oxide layer materially.
  • electronic components of the electronic circuit to be generated can also be attached to the substrate material at the same time.
  • the contact pressure to be set when pressing must be greater than zero and should be selected from its height so that within a desired, shortest possible period of time the specific depth of diffusion the diffusion of the oxide layer is achieved in the material of the other connection surface.
  • the contact pressure must not be so high that the structural element or the substrate material is irreversibly deformed or otherwise damaged.
  • the contact pressure can be selected, for example, in the range from 0.1 to 0.3 N / mm 2 , for example at 0, on a polymer film as substrate material. 2 N / mm 2 .
  • the heating is carried out to a temperature which is in the region of the solidus temperature of the material of the structural element at least at its connecting surface and is less than the liquidus temperature of the substrate material.
  • a melting away of the substrate material is avoided and at the same time promotes the diffusion of the oxide layer in the material of the other connection surface, for example, from an oxidized metal or metal alloy layer of the structural element in the bonding surface of the substrate material.
  • the temperature may be equal to the solidus temperature of the material of the structural element at least at its connection surface, or slightly above or below it. If the material of the structural element is a non-eutectic material at least at its connecting surface, it is advantageous if the temperature is below the liquidus temperature of this material.
  • the heating is carried out to a temperature which is below the glass transition temperature of the substrate material.
  • the oxidized surface at the bonding surface of the structural element and / or the substrate material may already be produced or provided thereby. be placed by the connecting surface of the ambient air is exposed and thereby oxidized automatically.
  • the oxidation of the connection surface is carried out as a controlled, uniformly controlled oxidation process, in particular as an accelerated oxidation process. This has the advantage that a particularly uniform, homogeneous oxide layer can be produced. This in turn means that the precision and reproducibility of the joint connection is further improved.
  • the oxide layer in the form of a continuous, uniform oxidation proceeding inwards from the outside of the connection surface.
  • the controlled, uniformly controlled oxidation process can be carried out, for example, by means of an oxidation furnace.
  • the oxidation can be further optimized by supplying a suitable oxidizing gas, for example using precursors and / or reactors to avoid unwanted reactions or impurities on the connection surface.
  • the structural element and / or the substrate material is temporarily fixed during the implementation of the joining process by means of negative pressure.
  • negative pressure small differential pressures to the ambient pressure are already sufficient to ensure a secure fixation.
  • the negative pressure can be maintained during the entire joining process. Due to the negative pressure, the structural element or the substrate material is sucked and thereby held on a component pickup.
  • the flow direction of the material of the coating can be controlled during the Anpressvorgangs by means of a Anpresswerkzeugs taking advantage of the capillary.
  • Anpresswerkzeugs taking advantage of the capillary.
  • the pressing tool can have suction channels for generating the negative pressure.
  • An additional venting channel inserted in the pressing tool can be vented if necessary to reduce the negative pressure.
  • a pressing tool e.g. serve the aforementioned stamp.
  • the present invention ensures a cohesive, precise joining process that is component-independent or component-independent in terms of production technology, with the advantage that post-processing processes can be dispensed with, joining tools similar to a stamp can be used, and thus access to mass production is made possible.
  • the above object is further achieved by an arrangement of at least one organic or non-organic substrate material and at least one materially connected thereto structural element, wherein structural elements coatings and / or components may be, wherein the cohesive connection as a diffusion bond between a connecting surface of Substrate material and a connecting surface of the structural element is formed and within a diffusion zone of the diffusion compound is at least a part of an oxidized surface of the bonding surface of the substrate material and / or the structural element.
  • the diffusion connection is a cohesive connection produced by diffusion between the two connection surfaces.
  • the arrangement can be designed in particular as a flexible electronic circuit.
  • the aforementioned object is further achieved according to claim 9 by a device for producing an arrangement of the aforementioned type using a method of the type described above, with a pressing device for pressing the connecting surface of the substrate material to the connecting surface of the structural element with a defined contact pressure. With such a device, the aforementioned advantages can also be achieved.
  • the device has a structured stamp which has a structuring corresponding to an image of the geometrical structure of a coating of the substrate material to be produced on the substrate material.
  • the punch on recesses for receiving by means of the stamp on the substrate material applied components has the advantage that, in particular, electronic circuits can be produced in one work step in such a way that both the electrical conductor tracks are fastened to the substrate material and electric and / or electronic components are fastened to the substrate material or the produced conductor tracks and attached thereto
  • the stamp has on its pressure side, with which it comes into contact with the coating to be applied to the substrate material, a non-stick coating.
  • a non-stick coating is on its pressure side, with which it comes into contact with the coating to be applied to the substrate material.
  • the device has a heating device which is set up to heat the structural element and / or substrate material at least in the region of the connecting surfaces.
  • the heating device may e.g. be completely or partially integrated in the structured stamp.
  • the heating device may e.g. be designed in the form of cartridges or as a hot air heater.
  • the hot-air heating thin air ducts can be provided in the stamp.
  • active suction devices can be used for the purpose of melt management.
  • FIGS. 1 to 3 the steps of producing coatings in the form of printed conductors on a polymer film; and FIGS. 4 to 7 the steps of monolithic coating of a polymer film with printed conductors and the assembly of components and a sectional image of a real sample which forms a diffusion bond between a structural element in FIG Form of a coating and a substrate in the form of a polymer film and has
  • FIG. 9 shows a further embodiment of a joining method.
  • the device 1 shown in FIGS. 1 to 3 for producing an arrangement according to the invention has a structured stamp 8, on which structures of printed conductors are arranged on a side provided with an anti-adhesion coating 7, which as a coating 3 on a substrate material 2, here For example, a polymer film to be applied.
  • the coatings 3 are formed as a layer structure of a metal 5 forming a conductor track and as an upper layer 6 made of an oxidized metal alloy, which forms a connecting surface 30 of the coating 3.
  • an indium-based alloy may be provided as the oxidized upper layer 6.
  • the polymer film 2 is arranged on a support surface, not shown in the figures, of the device 1 and fixed thereto, for example, by adhesion.
  • the substrate material 2 has a connection surface 20 directed to the coatings 3.
  • a channel system 9 which is coupled to a heating and suction head 1 6.
  • suction of the coatings 3 onto the non-stick-coated surface of the stamp 8 can take place by means of negative pressure.
  • heating to achieve sufficient heating in the region of the connection surfaces 20, 30 can be effected by passing heated air through heating channels of the channel system 9.
  • the punch 8 is further connected to a micropositioning unit 10, with which a highly accurate positioning of the punch relative to the substrate material 2 can take place in three spatial directions.
  • FIG. 1 shows the device 1 in a fitted state prepared with the coatings 3.
  • the step of pressing the connecting surface 30 of the coatings 3 onto the connecting surface 20 of the polymer material 2 takes place.
  • a contact pressure 11 is generated which generates a predetermined contact pressure between the substrate material and the structural element.
  • the interconnected surfaces pressed against each other are heated to a temperature above a minimum temperature, at least above 50 ° C.
  • the heating can be carried out to a temperature which is close to or above the solidus temperature of the material of the coatings 3 at least at their connection surfaces 30 and is less than the glass transition temperature of the polymer material 2.
  • the oxide layer begins to diffuse into the material of the connection surface 20 or into the polymer material 2. In this case, oxygen bridges form between the oxide layer and the polymer material 2.
  • the state according to FIG. 2 is maintained until the oxide layer of the oxidized surface at the connection surface 30 has diffused sufficiently deep into the material of the connection surface 20 or into the polymer material 2. After reaching a certain diffusion depth, the contact pressure Operation and heating ended.
  • the punch 8 is removed by means of a tensile force 12 from the now finished arrangement of the substrate material 2 and the coatings 3. This succeeds thanks to the non-stick coating 7 substantially residue-free.
  • the method described with reference to FIGS. 1 to 3 for joining the coatings 3 to the substrate material 2 can also be expanded to a monolithic coating and assembly method in which electronic components are simultaneously attached by means of the punch 8 to the substrate material 2 serving as a flexible printed circuit board become.
  • a device 1 is used which is constructed essentially as described above with reference to FIGS. 1 to 3.
  • the plunger 8 has one or more recesses for receiving a respective component 4.
  • a component 4 may be e.g. between two coatings 3 in a recess of the punch 8 are arranged.
  • the component 4 is already provided with a solder layer 13 on the side facing the substrate material 2, e.g. with solder.
  • the heating as well as the fixing of the coatings 3 and this case in addition of the component 4 takes place as before by means of the combined heating and suction head 1 6.
  • the component 4 can e.g. an SMD component (SMD - Surface Mounted Device), e.g. a light emitting diode, a resistor or a capacitor.
  • SMD component SMD - Surface Mounted Device
  • the attachment of the component 4 to the substrate material 2 can also be done by gluing, e.g. with an anisotropic (electrically conductive) adhesive.
  • the pressing process for producing the cohesive diffusion bond between the oxide layer on the connection surface 30 with the substrate material 2 takes place again, as explained above with reference to FIG.
  • the component 4 and the solder layer 13 is not acted upon at this time.
  • a soldering connection can be produced directly for electrically contacting the component 4 with the adjacent printed conductors 5, as shown in FIG. 6 on the basis of the gaps 14 now bridged by the solder.
  • the solder can be liquefied, for example by heating by means of the punch 8. After cooling of the solder, the component 4 is mechanically fixed to the substrate material 2 at the same time. Then the punch 8 is removed, as shown in FIG. FIG. 7 shows at the same time a finished arrangement of the substrate material 2 with the coatings 3 and the component 4 connected thereto.
  • FIG. 8 shows a section of a real sample with the diffusion bond between the component 3 and the substrate material 2. It can be seen that the oxidized upper layer 6 of the indium-based alloy has uniformly diffused into the polymer material 2 and has formed diffusion regions 17. In this case, in particular, a continuous, uniform oxidation proceeding from the outside to the inside is advantageous, as marked by the ellipse 15 in FIG.
  • FIG. 9 shows a further embodiment of a manufacturing device for carrying out the joining method according to the invention.
  • the illustrated device has a rotatable primary roller 90 on which the substrate material 2 is held in roll form.
  • the substrate material 2 is unrolled from the primary roll 90 and rolled up on a secondary roll 91.
  • the substrate material 2 is formed in this case, for example, as a polymer film.
  • a production device 93 for example a robot-controlled gripper, one-time punches 8 prepared with structural elements 5 are removed from a supply 92 and pressed onto the substrate material 2, which is supported by a production surface 94 at this point.
  • the manufacturing device 93 is then removed from the disposable punch 8. As FIG. 9 shows, the disposable punches 8 initially remain on the band-shaped substrate material 2.
  • the substrate material 2 When being wound onto the secondary roller 91, the substrate material 2 is bent. This dissolves the disposable donut 8 automatically from the remaining on the substrate material 2 structural elements 5.
  • the disposable punches 8 are collected in a container 95 and can be supplied to a recycling process, for example.
  • the finished fabricated structures provided with struktu- structures, such as electronic circuits.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention relates to a method for joining structural elements in the form of coatings and/or components on organic or non-organic substrate materials, in which a connecting surface of at least one structural element is integrally connected to a connecting surface of at least one substrate material, comprising the steps: a) producing an oxidized surface on the connecting surface of the structural element and/or the substrate material or using a structural element and/or substrate material having an already oxidized surface on the connecting surface thereof, b) pressing the connecting surface of the structural element against the connecting surface of the substrate material by means of a specific contact pressure not equal to zero, while simultaneously heating at least one of the connecting surfaces pressed against each other to a temperature above a minimum temperature, c) ending the pressing and the heating after reaching a specific diffusion depth of the diffusion of at least one constituent part of the oxide layer of the oxidized surface at the one connecting surface into the material of the other connecting surface. The invention further relates to an arrangement comprising at least one organic or non-organic substrate material and at least one structural element integrally connected thereto, and to a device for producing such an arrangement.

Description

VERFAHREN UND EINRICHTUNG ZUM FÜGEN VON STRUKTUREN AUF EINEM  METHOD AND DEVICE FOR ADDING STRUCTURES TO ONE
SUBSTRAT SOWIE ANORDNUNGUMFASSEND SOLCHER GEFÜGTEN STRUKTUREN  SUBSTRATE AND ARRANGEMENT COMPRISING SUCH STRUCTURES
Die Erfindung betrifft ein Verfahren zum Fügen von Strukturelementen in Form von Beschichtungen und/oder Bauteilen auf organischen oder nichtorganischen Substratmaterialien gemäß dem Anspruch 1 . Die Erfindung betrifft ferner eine Anordnung aus wenigstens einem organischen oder nichtorganischen Substratmaterial und wenigstens einem stoffschlüssig damit verbundenen Strukturelement gemäß Anspruch 8 sowie eine Einrichtung zur Her- Stellung einer solchen Anordnung gemäß Anspruch 9. The invention relates to a method for joining structural elements in the form of coatings and / or components on organic or non-organic substrate materials according to claim 1. The invention further relates to an arrangement of at least one organic or non-organic substrate material and at least one materially connected thereto structural element according to claim 8 and a device for the manufacture of such an arrangement according to claim 9.
Allgemein betrifft die Erfindung das Fügen von Beschichtungen und/oder Bauteilen auf Substratmaterialien, d.h. deren stoffschlüssige Verbindung mit dem Substratmaterial. Für solche Fügeverfahren gibt es diverse Anwendungen . Ein wichtiger Anwendungsbereich liegt in der Herstellung elektrischer und/oder elektronischer Schaltungen. Diese werden gemäß dem Stand der Technik entweder auf festen Leiterplatten (Platinen) aufgebaut, oder es werden Flexleiter verwendet, die ein flexibles Substrat aufweisen, das mit Leiterbahnen versehen wird. Flexible Substrate bestehen meistens aus auf Polymerbasis entwickelten Werkstoffen. Die Leiterbahnen werden aus vornehmlich metallischen Werkstoffen gebildet. Bei Verbindungen von Polymeren mit Metallen sind verschiedene Probleme zu lösen, z.B. verschiedene Längenausdehnungskoeffizienten, im Wesentlichen keine Möglichkeit der Herstellung chemischer Verbindungen zwischen Polymeren und Metallen aufgrund verschiedener Atomstrukturen sowie die Beachtung verschiedener Schmelztemperaturen, wenn ein thermischer Fü- geprozess verwendet wird. Aber auch außerhalb der Flexleitertechnologie ist grundsätzlich ein Trend zur Verwendung von Leiterbahnen bzw. Metallisierungen auf Polymersubstraten erkennbar, da diese im Gegensatz zu Keramiken leicht sind und außerdem von Fall zu Fall dotierbar und strukturierbar sind. Dabei werden allerdings bisher dotierte und strukturierte Varianten bevorzugt, da wie erwähnt Metall/Polymerverbindungen meist unter produktionstechnisch hohem Aufwand durch thermische Fügetechnologien erstellt werden. Hier gilt es insbesondere die Reproduzierbarkeit einer präzisen Fertigung sicher zu stellen. In general, the invention relates to the joining of coatings and / or components to substrate materials, ie their cohesive connection with the substrate material. There are various applications for such joining methods. An important area of application is the production of electrical and / or electronic circuits. These are built according to the prior art either on solid printed circuit boards (boards), or there are used flex conductors having a flexible substrate, which is provided with conductor tracks. Flexible substrates usually consist of polymer-based materials. The tracks are formed of primarily metallic materials. In the case of compounds of polymers with metals, various problems have to be solved, for example different coefficients of linear expansion, essentially no possibility of producing chemical bonds between polymers and metals due to different atomic structures, and the consideration of different melting temperatures when using a thermal joining process. But even outside of the flex conductor technology is a trend for the use of interconnects or metallization on polymer substrates recognizable, since they are in contrast to ceramics are light and also be doped and structurable from case to case. In this case, however, hitherto doped and structured variants are preferred because, as mentioned, metal / polymer compounds are usually created under high production costs by thermal joining technologies. In particular, the reproducibility of a precise production must be ensured.
Bekannte Fügeverfahren haben ferner den Nachteil, dass sie Probleme der Positionierung im Hinblick auf ihre Zugänglichkeit für eine Massenfertigung nicht befriedigend lösen können . Bei Flexleitern ist außerdem die Dauerhaltbarkeit der Fügeverbindung noch nicht zufriedenstellend, insbesondere wenn der Flexleiter häufigen Biegebelastungen unterworfen ist. Known joining methods also have the disadvantage that they can not satisfactorily solve problems of positioning with regard to their accessibility for mass production. In flex conductors also the durability of the joint connection is still not satisfactory, especially when the flex conductor is subjected to frequent bending loads.
Der Erfindung liegt daher die Aufgabe zugrunde, ein Verfahren zum Fügen von Strukturelementen auf Substratmaterialien anzugeben, das eine hohe Präzision bei der Herstellung mit einer hohen Haltbarkeit der Fügeverbindung verbindet. Ferner soll eine dementsprechende Anordnung sowie eine Einrichtung zur Herstellung einer solchen Anordnung angegeben werden . Diese Aufgabe wird gemäß Anspruch 1 gelöst durch ein Verfahren zum Fügen von Strukturelementen in Form von Beschichtungen und/oder Bauteilen auf organischen oder nicht-organischen Substratmaterialien, bei dem eine Verbindungsoberfläche wenigstens eines Strukturelements mit einer Verbindungsoberfläche wenigstens eines Substratmaterials stoffschlüssig verbunden wird, mit den Schritten : a) Erzeugen einer oxidierten Oberfläche an der Verbindungsoberfläche des Strukturelements und/oder des Substratmaterials oder Verwenden eines Strukturelements und/oder Substratmaterials mit einer bereits oxidierten Oberfläche an dessen Verbindungsoberfläche, The invention is therefore based on the object of specifying a method for joining structural elements on substrate materials, which combines a high precision in the production with a high durability of the joint connection. Furthermore, a corresponding arrangement and a device for producing such an arrangement should be specified. This object is achieved according to claim 1 by a method for joining structural elements in the form of coatings and / or components on organic or non-organic substrate materials, in which a connecting surface of at least one structural element is adhesively bonded to a connecting surface of at least one substrate material, with the steps : a) producing an oxidized surface at the bonding surface of the structural element and / or the substrate material or using a structural element and / or substrate material with an already oxidized surface at the bonding surface thereof,
b) Pressen der Verbindungsoberfläche des Strukturelements gegen die Verbindungsoberfläche des Substratmaterials mit einem bestimmten Anpressdruck ungleich Null bei gleichzeitiger Erwärmung zumindest der aneinander gepressten Verbindungsoberflächen auf eine Temperatur oberhalb einer Mindesttemperatur, b) pressing the connecting surface of the structural element against the connecting surface of the substrate material with a certain contact pressure equal to zero while simultaneously heating at least the pressing surfaces pressed against each other to a temperature above a minimum temperature,
c) Beenden des Anpressens und der Erwärmung nach Erreichen einer bestimmten Diffusionstiefe der Diffusion wenigstens eines Bestandteils der Oxidschicht der oxidierten Oberfläche an der einen Verbindungsoberfläche in das Material der anderen Verbindungsoberfläche. c) terminating the pressing and the heating after reaching a certain diffusion depth of the diffusion of at least one component of the oxide layer of the oxidized surface at the one connecting surface into the material of the other connecting surface.
Die Erfindung hat den Vorteil, dass sie mit relativ geringem technischen Aufwand die Herstellung erheblich haltbarer Fügeverbindungen erlaubt als bekannte Verfahren . Insbesondere werden auch andere Nachteile bekannter Verfahren, die zu Problemen bei der Herstellpräzision führen, vermieden. So gibt es bei der Erfindung z.B. keine Probleme mit übertretender Schmelze, die nachträglich erst wieder entfernt werden muss. Das erfindungsgemäße Verfahren ist auch relativ robust gegenüber fertigungsbedingten Inhomogenitäten der erzeugten Anordnung, sodass ein hoher Grad an Reproduzierbarkeit der Fertigung, gerade auch in Massenfertigung, mit vergleichsweise geringem Aufwand erreicht werden kann . Das erfindungsgemäße Fügeverfahren kann ferner ohne Zusatzstoffe, die zur Herstellung der Fügeverbindung bei bekannten Verfahren erforderlich sind, durchgeführt werden, z.B. ohne Löt- oder Schweißmittel . The invention has the advantage that it allows the production of considerably more durable joint connections with relatively little technical effort than known methods. In particular, other disadvantages of known methods, which lead to problems in manufacturing precision, are avoided. Thus, in the invention, e.g. no problems with overflowing melt, which has to be removed again afterwards. The inventive method is also relatively robust to production-related inhomogeneities of the arrangement produced, so that a high degree of reproducibility of production, especially in mass production, can be achieved with relatively little effort. The joining method according to the invention can also be carried out without additives which are necessary for the preparation of the joining compound in known processes, e.g. without soldering or welding agent.
Mit dem erfindungsgemäßen Verfahren können z.B. elektrische und/oder elektronische Schaltungen hergestellt werden . Das Substratmaterial dient dabei als Träger, ähnlich wie die Platine oder das Flexleiter-Substrat bei bekannten Schaltungen. Als Beschichtung können Leiterbahnen auf das Substratmaterial aufgebracht werden. Ferner können Bauteile, z.B. elektrische und elektronische Bauteile, auf das Substratmaterial aufgebracht werden . Die Erfindung eignet sich aber auch für andere Anwendungsbereiche, in denen ein Fügepro- zess mit hoher Haltbarkeit erforderlich ist. With the method according to the invention, for example, electrical and / or electronic circuits can be produced. The substrate material serves as a carrier, similar to the board or the flex conductor substrate in known circuits. As a coating, conductor tracks can be applied to the substrate material be applied. Furthermore, components, for example electrical and electronic components, can be applied to the substrate material. However, the invention is also suitable for other applications in which a joining process with high durability is required.
Das Substratmaterial kann ein elektrisch leitendes oder ein elektrisch isolierendes Material sein. Als elektrisch isolierendes Material kann als Substratmaterial insbesondere ein organisches Kunststoffmaterial verwendet werden, z.B. in Form einer Folie oder einer dünnen Platte. So kann als Substratmaterial z.B. ein Polymermaterial verwendet werden, z.B. Polyethylenterephtalat oder Po- lyimid . Vorteilhaft sind insbesondere weiche Kunststoffe. Das Substratmaterial kann insbesondere ein optisches Polymermaterial sein, z.B. ein klartransparentes Material, wie z.B. Plexiglas. Auch Polycarbonate können vorteilhaft als Substratmaterial eingesetzt werden. The substrate material may be an electrically conductive or an electrically insulating material. As the electrically insulating material, as the substrate material, in particular, an organic plastic material may be used, e.g. in the form of a foil or a thin plate. Thus, as a substrate material, e.g. a polymeric material may be used, e.g. Polyethylene terephthalate or polyimide. Particularly advantageous are soft plastics. The substrate material may in particular be an optical polymer material, e.g. a clear transparent material, e.g. Plexiglas. Also, polycarbonates can be advantageously used as a substrate material.
Hierbei können die vorgenannten Schritte des Verfahrens zeitlich getrennt voneinander nacheinander ausgeführt werden, oder ganz oder teilweise auch zeitlich überlappend oder sogar gleichzeitig durchgeführt werden . Gemäß einer vorteilhaften Weiterbildung der Erfindung kann insbesondere der Schritt des Erzeugens der oxidierten Oberfläche an der Verbindungsoberfläche des Strukturelements und/oder des Substratmaterials während des Erwärmungsprozesses durchgeführt werden. So zeigt z.B. das Aussetzen einer Indium-haltigen Verbindungsoberfläche unter Temperatureinfluss während des Fügeprozesses eine ausreichende Oxidation der Oberfläche. Dementsprechend ist in solchen Fällen eine Oxidation der Verbindungsoberfläche als separater Prozessschritt nicht mehr erforderlich. Hierdurch kann der Herstellungsprozess verkürzt werden. In this case, the above-mentioned steps of the method can be carried out one after the other in chronological succession, or can be performed in whole or in part, overlapping in time or even simultaneously. According to an advantageous development of the invention, in particular, the step of producing the oxidized surface at the bonding surface of the structural element and / or the substrate material may be performed during the heating process. Thus, e.g. the exposure of an indium-containing bonding surface under the influence of temperature during the joining process sufficient oxidation of the surface. Accordingly, oxidation of the bonding surface as a separate process step is no longer required in such cases. This can shorten the manufacturing process.
Gemäß einer vorteilhaften Weiterbildung weist die Verbindungsoberfläche des Strukturelements ein Metall, eine Metalllegierung oder einen metallhaltigen Werkstoff auf, wobei dieses Material oxidierbar ist. Die Metalllegierung kann insbesondere eine eutektische Legierung sein. Der metallhaltige Werkstoff kann z.B. ein Kompositmaterial sein. Gemäß einer vorteilhaften Weiterbildung der Erfindung weist das Strukturelement zumindest im Bereich der Verbindungsoberfläche ein niedrigschmelzendes Metall oder eine Metalllegierung auf. Es kann sich z.B. um eine Indium-Zinn-Legierung handeln, z.B. 52ln48Sn, oder eine andere Indium-Metall-Legierung. Im Falle einer Metalllegierung ist es vorteilhaft, die Legierungsmaterialien als Materialien mit im Wesentlichen gleicher dynamischer Viskosität auszuwählen. Hierdurch wird der Fügepartner homogen bereitgestellt, wodurch ein besonders homogener Diffusionsprozess der Oxid- schicht erreicht werden kann . According to an advantageous development, the connection surface of the structural element to a metal, a metal alloy or a metal-containing material, said material is oxidizable. The metal alloy can in particular be a eutectic alloy. The metal-containing material may be, for example, a composite material. According to an advantageous development of the invention, the structural element has a low-melting metal or a metal alloy at least in the region of the connection surface. It may be, for example, an indium-tin alloy, for example 52ln48Sn, or another indium-metal alloy. In the case of a metal alloy, it is advantageous to select the alloy materials as materials having substantially the same dynamic viscosity. As a result, the joining partner is provided homogeneously, whereby a particularly homogeneous diffusion process of the oxide layer can be achieved.
Gemäß einer vorteilhaften Weiterbildung der Erfindung weist die Verbindungsoberfläche eine Dicke im Bereich von 100 bis 300 Nanometern auf, insbesondere 180 bis 220 Nanometer. Es ist zusätzlich vorteilhaft, hierbei die Oberflä- chenrauheiten zu minimieren, z.B. eine Oberflächenrauheit RA<100 Nanometer zu erzeugen. Durch die dünne Verbindungsoberfläche können Überschüsse des Materials der als Haftvermittler verwendeten Verbindungsoberfläche minimiert werden. Hierdurch kann der erfindungsgemäße Anpressprozess, z.B. mittels des strukturierten Stempels, weiter optimiert und vereinfacht werden, da sich das Strukturelement zuverlässig mit der Verbindungsoberfläche verbindet und daran festhaftet. Ferner kann hierdurch ein späterer Polierprozess entfallen. According to an advantageous development of the invention, the connection surface has a thickness in the range of 100 to 300 nanometers, in particular 180 to 220 nanometers. It is additionally advantageous to minimize surface roughness, e.g. to produce a surface roughness RA <100 nanometers. Due to the thin connection surface surpluses of the material of the bonding surface used as adhesion promoter can be minimized. As a result, the pressing process according to the invention, e.g. by means of the structured stamp, further optimized and simplified, since the structural element reliably connects to the connection surface and adheres to it. Furthermore, a later polishing process can thereby be dispensed with.
Gemäß einer vorteilhaften Weiterbildung der Erfindung wird zum Lösen des Stempels nach dem Anpressvorgang das Substratmaterial gegenüber seiner während des Anpressvorgangs vorliegenden Form verbogen, insbesondere bezüglich des Stempels konvex verbogen. Hierdurch lässt sich ein einfaches und sicheres Lösen der Strukturelemente von dem Stempel erreichen, während diese weiterhin an dem Substratmaterial bzw. dessen Verbindungsoberfläche anhaften. Hierdurch lassen sich weitere fertigungstechnische Vorteile realisieren, z.B. bei Verwendung ausreichend flexiblen Substratmaterials ein Transport von„Rolle zu Rolle", wie nachfolgend in den Ausführungsbeispielen näher beschrieben ist. Insbesondere kann das Substratmaterial mit der darauf bereits vorhandenen Verbindungsoberfläche auf einer Rolle als Quasi-Endlosmaterial bereitgestellt werden, nach dem Abrollen von der Rolle mit den Strukturele- menten bestückt werden und danach auf eine weitere Rolle aufgerollt werden, wodurch zugleich der zuvor erwähnte Schritt des Verbiegens des Substratmaterials durchgeführt werden kann. According to an advantageous embodiment of the invention, the substrate material is bent relative to its present during the Anpressvorgangs shape to loosen the punch after the Anpressvorgangs, in particular bent convexly with respect to the punch. This makes it possible to achieve a simple and reliable release of the structural elements from the stamp while they continue to adhere to the substrate material or its connection surface. In this way, further manufacturing advantages can be realized, for example when using sufficiently flexible substrate material a transport In particular, the substrate material with the connecting surface already present thereon can be provided on a roll as a quasi-continuous material, and after being unwound from the roll, can be equipped with the structural elements and then rolled up to another roll, whereby at the same time the aforementioned step of bending the substrate material can be performed.
Das Strukturelement, insbesondere in Form der Beschichtung, kann auch als Mehrschichtsystem ausgebildet sein, z.B. in Form von Leiterbahnen, die als stromleitendes Element eine Edelmetall- oder Halbedelmetallschicht, z.B. Gold, Silber oder Kupfer, aufweisen, wobei an der Verbindungsoberfläche des Strukturelements die genannte Metallschicht oder Metalllegierungsschicht, die oxi- dierbar ist, angeordnet ist. The structural element, in particular in the form of the coating, can also be designed as a multilayer system, e.g. in the form of printed conductors which, as the current-conducting element, comprise a noble metal or semi-precious metal layer, e.g. Gold, silver or copper, wherein at the connecting surface of the structural element, the said metal layer or metal alloy layer which is oxidizable dib is arranged.
Gemäß einer vorteilhaften Weiterbildung der Erfindung wird das Strukturelement mittels eines strukturierten Stempels gegen das Substratmaterial ge- presst, wobei der Stempel ein Abbild der auf dem Substratmaterial zu erzeugenden geometrischen Struktur einer Beschichtung des Substratmaterials ist. Auf diese Weise können z.B. elektronische Schaltungen mit großer Präzision schnell und kostengünstig hergestellt werden. Mittels der Strukturierung des Stempels, die z.B. der zu erzeugenden Leiterbahnstruktur entsprechen kann, können die gewünschten Leiterbahnen auf dem Substratmaterial aufgepresst und zugleich durch die Diffusionsverbindung mittels der Oxidschicht stoff- schlüssig befestigt werden . Bei entsprechender Ausgestaltung des Stempels können auch zugleich elektronische Bauteile der zu erzeugenden elektronischen Schaltung an dem Substratmaterial angebracht werden . According to an advantageous development of the invention, the structural element is pressed against the substrate material by means of a structured stamp, the stamp being an image of the geometric structure of a coating of the substrate material to be produced on the substrate material. In this way, e.g. electronic circuits can be manufactured with great precision quickly and inexpensively. By means of the structuring of the stamp, e.g. can correspond to the conductor track structure to be generated, the desired conductor tracks can be pressed onto the substrate material and at the same time be fastened by the diffusion bonding by means of the oxide layer materially. With a corresponding design of the stamp, electronic components of the electronic circuit to be generated can also be attached to the substrate material at the same time.
Der beim Pressen einzustellende Anpressdruck muss selbstverständlich größer Null sein und sollte von seiner Höhe her so gewählt werden, dass innerhalb eines gewünschten, möglichst kurzen Zeitraums die bestimmte Diffusionstiefe der Diffusion der Oxidschicht in das Material der anderen Verbindungsoberfläche erreicht wird . Der Anpressdruck darf aber nicht so hoch gewählt werden, dass dabei das Strukturelement oder das Substratmaterial irreversibel deformiert oder anderweitig beschädigt wird. Beim Erzeugen von Beschichtungen, bei denen an der Verbindungsoberfläche das genannte niedrigschmelzende Metall oder die Metalllegierung vorhanden ist, auf einer Polymerfolie als Substratmaterial kann der Anpressdruck z.B. im Bereich von 0, 1 bis 0,3 N/mm2 gewählt werden, z.B. bei 0,2 N/mm2. Gemäß einer vorteilhaften Weiterbildung der Erfindung wird die Erwärmung auf eine Temperatur durchgeführt, die im Bereich der Solidustemperatur des Materials des Strukturelements zumindest an dessen Verbindungsoberfläche ist und geringer als die Liquidustemperatur des Substratmaterials ist. Hierdurch wird ein Wegschmelzen des Substratmaterials vermieden und zugleich die Diffusion der Oxidschicht in das Material der anderen Verbindungsoberfläche gefördert, z.B. von einer oxidierten Metall- oder Metalllegierungsschicht des Strukturelements in die Verbindungsoberfläche des Substratmaterials. Die Temperatur kann dabei gleich der Solidustemperatur des Materials des Strukturelements zumindest an dessen Verbindungsoberfläche sein, oder geringfügig darüber oder darunter. Wenn das Material des Strukturelements zumindest an dessen Verbindungsoberfläche ein nicht-eutektisches Material ist, ist es vorteilhaft, wenn die Temperatur unterhalb der Liquidustemperatur dieses Materials ist. Of course, the contact pressure to be set when pressing must be greater than zero and should be selected from its height so that within a desired, shortest possible period of time the specific depth of diffusion the diffusion of the oxide layer is achieved in the material of the other connection surface. However, the contact pressure must not be so high that the structural element or the substrate material is irreversibly deformed or otherwise damaged. When producing coatings in which the said low-melting metal or metal alloy is present on the connection surface, the contact pressure can be selected, for example, in the range from 0.1 to 0.3 N / mm 2 , for example at 0, on a polymer film as substrate material. 2 N / mm 2 . According to an advantageous development of the invention, the heating is carried out to a temperature which is in the region of the solidus temperature of the material of the structural element at least at its connecting surface and is less than the liquidus temperature of the substrate material. As a result, a melting away of the substrate material is avoided and at the same time promotes the diffusion of the oxide layer in the material of the other connection surface, for example, from an oxidized metal or metal alloy layer of the structural element in the bonding surface of the substrate material. The temperature may be equal to the solidus temperature of the material of the structural element at least at its connection surface, or slightly above or below it. If the material of the structural element is a non-eutectic material at least at its connecting surface, it is advantageous if the temperature is below the liquidus temperature of this material.
Gemäß einer vorteilhaften Weiterbildung der Erfindung wird die Erwärmung auf eine Temperatur durchgeführt, die unterhalb der Glasübergangstemperatur des Substratmaterials ist. Hierdurch wird insbesondere bei Substratmaterialien aus Kunststoffen eine unerwünschte Beschädigung oder Verformung während des Fügeprozesses vermieden. Die oxidierte Oberfläche an der Verbindungsoberfläche des Strukturelements und/oder des Substratmaterials kann bereits dadurch erzeugt oder bereitge- stellt werden, indem die Verbindungsoberfläche der Umgebungsluft ausgesetzt wird und dadurch selbsttätig oxidiert. Gemäß einer vorteilhaften Weiterbildung der Erfindung wird die Oxidation der Verbindungsoberfläche als kontrollierter, gleichmäßig gesteuerter Oxidationsprozess durchgeführt, insbesondere als be- schleunigter Oxidationsprozess. Dies hat den Vorteil, dass eine besonders gleichmäßige, homogene Oxidschicht erzeugt werden kann . Dies führt wiederum dazu, dass die Präzision und Reproduzierbarkeit der Fügeverbindung weiter verbessert wird . Hierbei ist es vorteilhaft, die Oxidschicht in Form einer kontinuierlichen, gleichmäßigen von der Außenseite der Verbindungsoberfläche nach Innen verlaufenden Oxidation durchzuführen. Der kontrollierte, gleichmäßig gesteuerte Oxidationsprozess kann z.B. mittels eines Oxidationsofens durchgeführt werden . Hierbei kann die Oxidation weiter optimiert werden durch Zuführung eines geeigneten Oxidationsgases, z.B. unter Verwendung von Präkursoren und/oder Reaktoren zur Vermeidung von ungewollten Reaktionen o- der Verunreinigungen an der Verbindungsoberfläche. According to an advantageous development of the invention, the heating is carried out to a temperature which is below the glass transition temperature of the substrate material. As a result, undesirable damage or deformation during the joining process is avoided in particular with substrate materials made of plastics. The oxidized surface at the bonding surface of the structural element and / or the substrate material may already be produced or provided thereby. be placed by the connecting surface of the ambient air is exposed and thereby oxidized automatically. According to an advantageous development of the invention, the oxidation of the connection surface is carried out as a controlled, uniformly controlled oxidation process, in particular as an accelerated oxidation process. This has the advantage that a particularly uniform, homogeneous oxide layer can be produced. This in turn means that the precision and reproducibility of the joint connection is further improved. In this case, it is advantageous to carry out the oxide layer in the form of a continuous, uniform oxidation proceeding inwards from the outside of the connection surface. The controlled, uniformly controlled oxidation process can be carried out, for example, by means of an oxidation furnace. In this case, the oxidation can be further optimized by supplying a suitable oxidizing gas, for example using precursors and / or reactors to avoid unwanted reactions or impurities on the connection surface.
Gemäß einer vorteilhaften Weiterbildung der Erfindung wird das Strukturelement und/oder das Substratmaterial während der Durchführung des Fügeverfahrens mittels Unterdruck temporär fixiert. Dies hat den Vorteil, dass die häu- fig relativ kleinen und/oder empfindlichen Strukturelemente und Substratmaterialien zuverlässig gehalten werden können, ohne sie dabei zu beschädigen. Für die Erzeugung des Unterdrucks reichen kleine Differenzdrücke zum Umgebungsdruck bereits aus, um eine sichere Fixierung zu gewährleisten. Der Unterdruck kann dabei während des gesamten Fügeprozesses aufrecht erhalten werden. Durch den Unterdruck wird das Strukturelement bzw. das Substratmaterial angesaugt und hierdurch an einem Bauteilaufnehmer gehalten. According to an advantageous embodiment of the invention, the structural element and / or the substrate material is temporarily fixed during the implementation of the joining process by means of negative pressure. This has the advantage that the frequently relatively small and / or sensitive structural elements and substrate materials can be reliably held without damaging them. For generating the negative pressure, small differential pressures to the ambient pressure are already sufficient to ensure a secure fixation. The negative pressure can be maintained during the entire joining process. Due to the negative pressure, the structural element or the substrate material is sucked and thereby held on a component pickup.
Gemäß einer vorteilhaften Weiterbildung der Erfindung kann während des Anpressvorgangs mittels eines Anpresswerkzeugs unter Ausnutzung des Kapillar- drucks die Fließrichtung des Materials der Beschichtung kontrolliert werden. So kann beim Aufsetzen des Anpresswerkzeugs auf das zu verfügende Bauteil temperaturbedingt ein nahezu luftdichtes System erzeugt werden, weil die in Folge der Erwärmung erzeugte„halbflüssige" Schicht wie eine Dichtung wirkt. Dies ist wiederum vorteilhaft für die Durchführung der Unterdruck-Ansaugung des Bauteils. Aber auch nahezu vollkommen flüssige Schichten sind durch das beschriebene Verfahren verfügbar. According to an advantageous embodiment of the invention, the flow direction of the material of the coating can be controlled during the Anpressvorgangs by means of a Anpresswerkzeugs taking advantage of the capillary. Thus, when placing the Anpresswerkzeugs on the component to be equipped A nearly airtight system can be produced by temperature, because the "semi-liquid" layer produced as a result of heating acts like a seal, which in turn is advantageous for carrying out the vacuum suction of the component, but almost completely liquid layers are also available by the method described ,
Das Anpresswerkzeug kann dabei über Ansaugkanäle für die Erzeugung des Unterdrucks verfügen. Ein zusätzlich in das Anpresswerkzeug eingebrachter Entlüftungskanal kann im Bedarfsfall zum Abbau des Unterdrucks belüftet wer- den. Als Anpresswerkzeug kann z.B. der bereits erwähnte Stempel dienen. The pressing tool can have suction channels for generating the negative pressure. An additional venting channel inserted in the pressing tool can be vented if necessary to reduce the negative pressure. As a pressing tool, e.g. serve the aforementioned stamp.
Die vorliegende Erfindung gewährleistet einen stoffschlüssigen, präzisen Fü- geprozess, der produktionstechnisch bauteil- bzw. substratunabhängig ist, mit dem Vorteil, dass Nachbearbeitungsprozesse entfallen können, Fügewerkzeu- ge ähnlich einem Stempel eingesetzt werden können und hierdurch der Zugang zur Massenfertigung ermöglicht wird. The present invention ensures a cohesive, precise joining process that is component-independent or component-independent in terms of production technology, with the advantage that post-processing processes can be dispensed with, joining tools similar to a stamp can be used, and thus access to mass production is made possible.
Die eingangs genannte Aufgabe wird ferner gemäß Anspruch 8 gelöst durch eine Anordnung aus wenigstens einem organischen oder nicht-organischen Substratmaterial und wenigstens einem stoffschlüssig damit verbundenen Strukturelement, wobei Strukturelemente Beschichtungen und/oder Bauteile sein können, wobei die stoffschlüssige Verbindung als Diffusionsverbindung zwischen einer Verbindungsoberfläche des Substratmaterials und einer Verbindungsoberfläche des Strukturelements ausgebildet ist und innerhalb einer Diffusionszone der Diffusionsverbindung sich wenigstens ein Bestandteil einer oxidierte Oberfläche der Verbindungsoberfläche des Substratmaterials und/oder des Strukturelements befindet. Die Diffusionsverbindung ist dabei eine durch Diffusion erzeugte stoffschlüssige Verbindung zwischen den beiden Verbindungsoberflächen. Mit einer solchen Anordnung können ebenfalls die zuvor genannten Vorteile erzielt werden. Die Anordnung kann aus den zuvor für das Fügeverfahren genannten Materialien gebildet werden, insbesondere im Hinblick auf das Substratmaterial und das Material der Strukturelemente. Die Anordnung kann insbesondere als flexible elektronische Schaltung ausgebildet sein. Die eingangs genannte Aufgabe wird ferner gemäß Anspruch 9 gelöst durch eine Einrichtung zur Herstellung einer Anordnung der zuvor genannten Art unter Verwendung eines Verfahrens der zuvor beschriebenen Art, mit einer Anpressvorrichtung zum Anpressen der Verbindungsoberfläche des Substratmaterials an die Verbindungsoberfläche des Strukturelements mit einer definierten Anpresskraft. Mit einer solchen Einrichtung können ebenfalls die zuvor genannten Vorteile erzielt werden. The above object is further achieved by an arrangement of at least one organic or non-organic substrate material and at least one materially connected thereto structural element, wherein structural elements coatings and / or components may be, wherein the cohesive connection as a diffusion bond between a connecting surface of Substrate material and a connecting surface of the structural element is formed and within a diffusion zone of the diffusion compound is at least a part of an oxidized surface of the bonding surface of the substrate material and / or the structural element. In this case, the diffusion connection is a cohesive connection produced by diffusion between the two connection surfaces. With such an arrangement, the aforementioned advantages can also be achieved. The arrangement can be formed from the materials mentioned above for the joining process, in particular in With regard to the substrate material and the material of the structural elements. The arrangement can be designed in particular as a flexible electronic circuit. The aforementioned object is further achieved according to claim 9 by a device for producing an arrangement of the aforementioned type using a method of the type described above, with a pressing device for pressing the connecting surface of the substrate material to the connecting surface of the structural element with a defined contact pressure. With such a device, the aforementioned advantages can also be achieved.
Gemäß einer vorteilhaften Weiterbildung der Erfindung weist die Einrichtung einen strukturierten Stempel auf, der eine Strukturierung entsprechend einem Abbild der auf dem Substratmaterial zu erzeugenden geometrischen Struktur einer Beschichtung des Substratmaterials aufweist. According to an advantageous development of the invention, the device has a structured stamp which has a structuring corresponding to an image of the geometrical structure of a coating of the substrate material to be produced on the substrate material.
Gemäß einer vorteilhaften Weiterbildung der Erfindung weist der Stempel Aussparungen zur Aufnahme von mittels des Stempels auf dem Substratmaterial aufzubringenden Bauteilen auf. Dies hat den Vorteil, dass insbesondere elektronische Schaltungen in einem Arbeitsschritt derart hergestellt werden können, dass sowohl die elektrischen Leiterbahnen auf dem Substratmaterial befestigt werden als auch elektrische und/oder elektronische Bauteile auf dem Substratmaterial oder den hergestellten Leiterbahnen befestigt und daran According to an advantageous embodiment of the invention, the punch on recesses for receiving by means of the stamp on the substrate material applied components. This has the advantage that, in particular, electronic circuits can be produced in one work step in such a way that both the electrical conductor tracks are fastened to the substrate material and electric and / or electronic components are fastened to the substrate material or the produced conductor tracks and attached thereto
elektrisch angeschlossen werden können. Dies erlaubt eine hoch effiziente Massenfertigung von Anordnungen der zuvor genannten Art, insbesondere in Form von elektronischen Schaltungen. can be connected electrically. This allows a highly efficient mass production of arrangements of the aforementioned type, in particular in the form of electronic circuits.
Gemäß einer vorteilhaften Weiterbildung der Erfindung weist der Stempel an seiner Andruckseite, mit der er mit der am Substratmaterial anzupressenden Beschichtung in Kontakt kommt, eine Antihaftbeschichtung auf. Dies hat den Vorteil, dass der Stempel nach Durchführung des Anpressvorgangs im Wesentlichen ohne Rückstände des Beschichtungsmaterials wieder entfernt werden kann . Hierdurch werden insbesondere unerwünschte Beschädigungen durch das Entfernen des Stempels am Beschichtungsmaterial vermieden . Die Anti- haftbeschichtung kann aus Teflon oder anderen Materialien, die eine Lotuseffekt-Oberfläche hervorrufen, verwendet werden. According to an advantageous development of the invention, the stamp has on its pressure side, with which it comes into contact with the coating to be applied to the substrate material, a non-stick coating. This has the Advantage that the stamp can be removed after performing the Anpressvorgangs substantially without residues of the coating material again. As a result, in particular unwanted damage caused by the removal of the stamp on the coating material. The anti-stick coating can be made from Teflon or other materials that create a lotus effect surface.
Gemäß einer vorteilhaften Weiterbildung der Erfindung weist die Einrichtung eine Beheizungseinrichtung auf, die zur Beheizung des Strukturelements und/oder Substratmaterials zumindest im Bereich der Verbindungsoberflächen eingerichtet ist. Dies hat den Vorteil, dass die erfindungsgemäße Einrichtung bereits integrierte Mittel zur Erzeugung der notwendigen Erwärmung im Bereich der Verbindungsoberflächen aufweist und keine externe Beheizung notwendig ist. Die Beheizungseinrichtung kann z.B. ganz oder teilweise in den strukturier- ten Stempel integriert sein . Die Beheizungseinrichtung kann z.B. in Form von Heizkartuschen oder als Heißluft-Heizung ausgebildet sein . Für die Realisierung der Heißluft-Heizung können im Stempel dünne Luftkanäle (Kapillare) vorgesehen sein. Generell ist es vorteilhaft, die sich in der Fügezone befindenden Werkzeugbestandteile im Hinblick auf ihre Geometrie abzurunden bzw. mit einer Antihaft- beschichtung zu versehen . Dies kann insbesondere bei den Kapillaren durch Erzeugen von Inlays realisiert werden, die zur Erzeugung von sehr dünnen Kanälen durch spanende Bearbeitung erzeugt werden können. Ferner können auch aktive Absaugvorrichtungen zum Zwecke der Schmelzeführung eingesetzt werden. According to an advantageous development of the invention, the device has a heating device which is set up to heat the structural element and / or substrate material at least in the region of the connecting surfaces. This has the advantage that the device according to the invention already has integrated means for generating the necessary heating in the region of the connecting surfaces and no external heating is necessary. The heating device may e.g. be completely or partially integrated in the structured stamp. The heating device may e.g. be designed in the form of cartridges or as a hot air heater. For the realization of the hot-air heating thin air ducts (capillary) can be provided in the stamp. In general, it is advantageous to round off the tool components located in the joining zone with respect to their geometry or to provide them with a non-stick coating. This can be realized in particular in the capillaries by producing inlays, which can be produced by machining to produce very thin channels. Furthermore, active suction devices can be used for the purpose of melt management.
Die Erfindung wird nachfolgend anhand von Ausführungsbeispielen unter Verwendung von Zeichnungen näher erläutert. The invention will be explained in more detail by means of embodiments using drawings.
Es zeigen: Figuren 1 bis 3 die Schritte des Erzeugens von Beschichtungen in Form von Leiterbahnen auf einer Polymerfolie und Figuren 4 bis 7 die Schritte des monolithischen Beschichtens einer Polymerfolie mit Leiterbahnen und des Bestückens mit Bauteilen und ein Schnittbild einer realen Probe, die eine Diffusionsverbindung zwischen einem Strukturelement in Form einer Beschichtung und einem Substrat in Form einer Polymerfolie aufweist und Show it: FIGS. 1 to 3 the steps of producing coatings in the form of printed conductors on a polymer film; and FIGS. 4 to 7 the steps of monolithic coating of a polymer film with printed conductors and the assembly of components and a sectional image of a real sample which forms a diffusion bond between a structural element in FIG Form of a coating and a substrate in the form of a polymer film and has
Figur 9 eine weitere Ausführungsform eines Fügeverfahrens. FIG. 9 shows a further embodiment of a joining method.
In den Figuren werden gleiche Bezugszeichen für einander entsprechende Elemente verwendet. In the figures, like reference numerals are used for corresponding elements.
Die in den Figuren 1 bis 3 dargestellte Einrichtung 1 zur Herstellung einer er- findungsgemaßen Anordnung weist einen strukturierten Stempel 8 auf, an dem an einer mit einer Antihaftschichtung 7 versehenen Seite Strukturen von Leiterbahnen angeordnet sind, die als Beschichtung 3 auf ein Substratmaterial 2, hier beispielhaft ein Polymerfilm, aufgebracht werden sollen. Die Beschichtungen 3 sind als Schichtaufbau aus einem eine Leiterbahn bildenden Metall 5 und als Oberschicht 6 aus einer oxidierten Metalllegierung ausgebildet, die eine Verbindungsoberfläche 30 der Beschichtung 3 bildet. Insbesondere kann eine indiumbasierte Legierung als oxidierte Oberschicht 6 vorgesehen sein. Der Polymerfilm 2 ist auf einer in den Figuren nicht dargestellten Auflagefläche der Einrichtung 1 angeordnet und daran z.B. durch Adhäsion fixiert. Das Sub- stratmaterial 2 weist eine zu den Beschichtungen 3 gerichtete Verbindungsoberfläche 20 auf. In dem Stempel 8 befindet sich ein Kanalsystem 9, das mit einem Heiz- und Saugkopf 1 6 gekoppelt ist. Hierüber kann ein Ansaugen der Besch ichtungen 3 an die antihaftbeschichtete Oberfläche des Stempels 8 mittels Unterdruck er- folgen . Zudem kann eine Beheizung zur Erreichung einer ausreichenden Erwärmung im Bereich der Verbindungsoberflächen 20, 30 durch Durchleiten erwärmter Luft durch Heizkanäle des Kanalsystems 9 erfolgen . Der Stempel 8 ist ferner mit einer Mikropositioniereinheit 1 0 verbunden, mit der eine hoch genaue Positionierung des Stempels gegenüber dem Substratmaterial 2 in drei Raumrichtungen erfolgen kann . The device 1 shown in FIGS. 1 to 3 for producing an arrangement according to the invention has a structured stamp 8, on which structures of printed conductors are arranged on a side provided with an anti-adhesion coating 7, which as a coating 3 on a substrate material 2, here For example, a polymer film to be applied. The coatings 3 are formed as a layer structure of a metal 5 forming a conductor track and as an upper layer 6 made of an oxidized metal alloy, which forms a connecting surface 30 of the coating 3. In particular, an indium-based alloy may be provided as the oxidized upper layer 6. The polymer film 2 is arranged on a support surface, not shown in the figures, of the device 1 and fixed thereto, for example, by adhesion. The substrate material 2 has a connection surface 20 directed to the coatings 3. In the stamp 8 is a channel system 9, which is coupled to a heating and suction head 1 6. By way of this, suction of the coatings 3 onto the non-stick-coated surface of the stamp 8 can take place by means of negative pressure. In addition, heating to achieve sufficient heating in the region of the connection surfaces 20, 30 can be effected by passing heated air through heating channels of the channel system 9. The punch 8 is further connected to a micropositioning unit 10, with which a highly accurate positioning of the punch relative to the substrate material 2 can take place in three spatial directions.
Die Figur 1 zeigt die Einrichtung 1 in einem mit den Beschichtungen 3 vorbereiteten, bestückten Zustand. Gemäß Figur 2 erfolgt der Schritt des Pressens der Verbindungsoberfläche 30 der Beschichtungen 3 an die Verbindungsoberfläche 20 des Polymermaterials 2. Hierbei wird eine Anpresskraft 1 1 erzeugt, die einen vorbestimmten Anpressdruck zwischen dem Substratmaterial und dem Strukturelement erzeugt. Zugleich erfolgt eine Erwärmung der aneinander ge- pressten Verbindungsoberflächen auf eine Temperatur oberhalb einer Mindesttemperatur, zumindest oberhalb von 50°C. Wie erwähnt, kann die Erwärmung auf eine Temperatur durchgeführt wird, die nahe oder oberhalb der Solidustem- peratur des Materials der Beschichtungen 3 zumindest an deren Verbindungsoberflächen 30 ist und geringer als der Glasübergangstemperatur des Polymermaterials 2 ist. Nun beginnt die Oxidschicht in das Material der Verbindungsoberfläche 20 bzw. in das Polymermaterial 2 hinein zu diffundieren. Hierbei bilden sich Sauerstoffbrücken zwischen der Oxidschicht und dem Polymermaterial 2. FIG. 1 shows the device 1 in a fitted state prepared with the coatings 3. According to FIG. 2, the step of pressing the connecting surface 30 of the coatings 3 onto the connecting surface 20 of the polymer material 2 takes place. In this case, a contact pressure 11 is generated which generates a predetermined contact pressure between the substrate material and the structural element. At the same time, the interconnected surfaces pressed against each other are heated to a temperature above a minimum temperature, at least above 50 ° C. As mentioned, the heating can be carried out to a temperature which is close to or above the solidus temperature of the material of the coatings 3 at least at their connection surfaces 30 and is less than the glass transition temperature of the polymer material 2. Now the oxide layer begins to diffuse into the material of the connection surface 20 or into the polymer material 2. In this case, oxygen bridges form between the oxide layer and the polymer material 2.
Der Zustand gemäß Figur 2 wird solange beibehalten, bis die Oxidschicht der oxidierten Oberfläche an der Verbindungsoberfläche 30 ausreichend tief in das Material der Verbindungsoberfläche 20 bzw. in das Polymermaterial 2 diffundiert ist. Nach Erreichen einer bestimmten Diffusionstiefe werden der Anpress- Vorgang sowie die Erwärmung beendet. Der Stempel 8 wird mittels einer Zugkraft 12 von der nun fertigen Anordnung aus dem Substratmaterial 2 sowie den Beschichtungen 3 entfernt. Dies gelingt dank der Antihaftbeschichtung 7 im Wesentlichen rückstandsfrei. The state according to FIG. 2 is maintained until the oxide layer of the oxidized surface at the connection surface 30 has diffused sufficiently deep into the material of the connection surface 20 or into the polymer material 2. After reaching a certain diffusion depth, the contact pressure Operation and heating ended. The punch 8 is removed by means of a tensile force 12 from the now finished arrangement of the substrate material 2 and the coatings 3. This succeeds thanks to the non-stick coating 7 substantially residue-free.
Das anhand der Figuren 1 bis 3 beschriebene Verfahren zum Fügen der Beschichtungen 3 an dem Substratmaterial 2 kann auch erweitert werden zu einem monolithischen Beschichtungs- und Bestückungsverfahren, bei dem zugleich elektronische Bauteile mittels des Stempels 8 auf dem als flexible Lei- terplatte dienenden Substratmaterial 2 angebracht werden. Dies wird nachfolgend anhand der Figuren 4 bis 7 beschrieben . Es wird wiederum eine Einrichtung 1 verwendet, die im Wesentlichen so aufgebaut ist wie zuvor anhand der Figuren 1 bis 3 beschrieben. Im Unterschied zu der Einrichtung 1 gemäß den Figuren 1 bis 3 weist der Stempel 8 eine oder mehrere Aussparungen zur Auf- nähme jeweils eines Bauteils 4 auf. Wie in Figur 4 erkennbar, kann ein Bauteil 4 z.B. zwischen zwei Beschichtungen 3 in einer Aussparung des Stempels 8 angeordnet werden . Hierbei ist das Bauteil 4 bereits mit einer Lötmittelschicht 13 an der dem Substratmaterial 2 zugewandten Seite versehen, z.B. mit Lötzinn. Die Beheizung sowie das Fixieren der Beschichtungen 3 und diesem Fall zusätzlich des Bauteils 4 erfolgt wie zuvor mittels des kombinierten Heiz- und Saugkopfs 1 6. Das Bauteil 4 kann z.B. ein SMD-Bauteil (SMD - Surface Moun- ted Device) sein, z.B. eine Leuchtdiode, ein Widerstand oder ein Kondensator. The method described with reference to FIGS. 1 to 3 for joining the coatings 3 to the substrate material 2 can also be expanded to a monolithic coating and assembly method in which electronic components are simultaneously attached by means of the punch 8 to the substrate material 2 serving as a flexible printed circuit board become. This will be described below with reference to FIGS. 4 to 7. In turn, a device 1 is used which is constructed essentially as described above with reference to FIGS. 1 to 3. In contrast to the device 1 according to FIGS. 1 to 3, the plunger 8 has one or more recesses for receiving a respective component 4. As can be seen in Figure 4, a component 4 may be e.g. between two coatings 3 in a recess of the punch 8 are arranged. Here, the component 4 is already provided with a solder layer 13 on the side facing the substrate material 2, e.g. with solder. The heating as well as the fixing of the coatings 3 and this case in addition of the component 4 takes place as before by means of the combined heating and suction head 1 6. The component 4 can e.g. an SMD component (SMD - Surface Mounted Device), e.g. a light emitting diode, a resistor or a capacitor.
Die Befestigung des Bauteils 4 an dem Substratmaterial 2 kann auch durch Kleben erfolgen, z.B. mit einem anisotropen (elektrisch leitfähigen) Klebstoff. The attachment of the component 4 to the substrate material 2 can also be done by gluing, e.g. with an anisotropic (electrically conductive) adhesive.
Gemäß Figur 5 erfolgt wiederum der Anpressvorgang zum Erzeugen der stoffschlüssigen Diffusionsverbindung zwischen der Oxidschicht an der Verbindungsoberfläche 30 mit dem Substratmaterial 2, wie zuvor anhand der Figur 2 erläutert. Das Bauteil 4 sowie die Lötmittelschicht 13 wird zu diesem Zeitpunkt noch nicht beaufschlagt. Sobald die gewünschte Diffusionsverbindung mit der bestimmten Diffusionstiefe hergestellt ist, kann unmittelbar eine Herstellung einer Lötverbindung zum elektrischen Kontaktieren des Bauteils 4 mit den benachbarten Leiterbahnen 5 erfolgen, wie in der Figur 6 anhand der nun durch das Lötmittel überbrückten Lücken 14 dargestellt ist. Das Lötmittel kann z.B. durch Erwärmen mittels des Stempels 8 verflüssigt werden. Nach Erkalten des Lötmittels ist zugleich das Bauteil 4 mechanisch an dem Substratmaterial 2 fixiert. Sodann wird der Stempel 8 entfernt, wie in Figur 7 dargestellt. Die Figur 7 zeigt damit zugleich eine fertige Anordnung aus dem Substratmaterial 2 mit den damit verbundenen Beschichtungen 3 sowie dem Bauteil 4. According to FIG. 5, the pressing process for producing the cohesive diffusion bond between the oxide layer on the connection surface 30 with the substrate material 2 takes place again, as explained above with reference to FIG. The component 4 and the solder layer 13 is not acted upon at this time. Once the desired diffusion connection with the a specific soldering depth is established, a soldering connection can be produced directly for electrically contacting the component 4 with the adjacent printed conductors 5, as shown in FIG. 6 on the basis of the gaps 14 now bridged by the solder. The solder can be liquefied, for example by heating by means of the punch 8. After cooling of the solder, the component 4 is mechanically fixed to the substrate material 2 at the same time. Then the punch 8 is removed, as shown in FIG. FIG. 7 shows at the same time a finished arrangement of the substrate material 2 with the coatings 3 and the component 4 connected thereto.
Die Figur 8 zeigt einen Ausschnitt einer realen Probe mit der Diffusionsverbindung zwischen dem Bauteil 3 und dem Substratmaterial 2. Erkennbar ist, dass die oxidierte Oberschicht 6 der indiumbasierten Legierung gleichmäßig in das Polymermaterial 2 hinein diffundiert ist und Diffusionsbereiche 1 7 herausgebil- det hat. Vorteilhaft ist hierbei insbesondere eine kontinuierliche, gleichmäßige, von Außen nach Innen verlaufende Oxidation, wie durch die Ellipse 15 in Figur 8 markiert. FIG. 8 shows a section of a real sample with the diffusion bond between the component 3 and the substrate material 2. It can be seen that the oxidized upper layer 6 of the indium-based alloy has uniformly diffused into the polymer material 2 and has formed diffusion regions 17. In this case, in particular, a continuous, uniform oxidation proceeding from the outside to the inside is advantageous, as marked by the ellipse 15 in FIG.
Die Figur 9 zeigt eine weitere Ausführungsform einer Herstelleinrichtung zur Ausführung des erfindungsgemäßen Fügeverfahrens. Die dargestellte Einrichtung weist eine rotierbare Primärrolle 90 auf, auf der das Substratmaterial 2 in Rollenform vorgehalten wird . Das Substratmaterial 2 wird von der Primärrolle 90 abgerollt und auf eine Sekundärrolle 91 aufgerollt. Das Substratmaterial 2 ist in diesem Fall z.B. als Polymerfolie ausgebildet. Mittels einer Fertigungsein- richtung 93, z.B. einem robotergesteuerten Greifer, werden mit Strukturelementen 5 vorbereitete Einmalstempel 8 aus einem Vorrat 92 entnommen und auf das Substratmaterial 2, das durch eine Fertigungsfläche 94 an dieser Stelle abgestützt ist, aufgepresst. Die Fertigungseinrichtung 93 wird dann vom Einmalstempel 8 entfernt. Wie die Figur 9 zeigt, verbleiben die Einmalstempel 8 zunächst auf dem bandförmigen Substratmaterial 2. Beim Aufwickeln auf die Sekundärrolle 91 wird das Substratmaterial 2 gebogen. Hierdurch lösen sich die Einmalstennpel 8 selbsttätig von den auf dem Substratmaterial 2 verbleibenden Strukturelementen 5. Die Einmalstempel 8 werden in einem Behälter 95 aufgefangen und können z.B. einem Recyclingprozess zugeführt werden. Auf der Sekundärrolle 91 befinden sich dann die fertig hergestellten mit Struk- turelementen versehenen Strukturen, wie z.B. elektronische Schaltungen . FIG. 9 shows a further embodiment of a manufacturing device for carrying out the joining method according to the invention. The illustrated device has a rotatable primary roller 90 on which the substrate material 2 is held in roll form. The substrate material 2 is unrolled from the primary roll 90 and rolled up on a secondary roll 91. The substrate material 2 is formed in this case, for example, as a polymer film. By means of a production device 93, for example a robot-controlled gripper, one-time punches 8 prepared with structural elements 5 are removed from a supply 92 and pressed onto the substrate material 2, which is supported by a production surface 94 at this point. The manufacturing device 93 is then removed from the disposable punch 8. As FIG. 9 shows, the disposable punches 8 initially remain on the band-shaped substrate material 2. When being wound onto the secondary roller 91, the substrate material 2 is bent. This dissolves the disposable donut 8 automatically from the remaining on the substrate material 2 structural elements 5. The disposable punches 8 are collected in a container 95 and can be supplied to a recycling process, for example. On the secondary roller 91 are then the finished fabricated structures provided with struktu- structures, such as electronic circuits.

Claims

Patentansprüche: Patent claims:
1 . Verfahren zum Fügen von Strukturelementen (3, 4) in Form von Beschich- tungen (3) und/oder Bauteilen (4) auf organischen oder nicht-organischen Substratmaterialien (2), bei dem eine Verbindungsoberfläche (30) wenigstens eines Strukturelements (3, 4) mit einer Verbindungsoberfläche (20) wenigstens eines Substratmaterials (2) stoffschlüssig verbunden wird, gekennzeichnet durch die Schritte: 1 . Method for joining structural elements (3, 4) in the form of coatings (3) and/or components (4) on organic or non-organic substrate materials (2), in which a connecting surface (30) of at least one structural element (3, 4) is cohesively connected to a connecting surface (20) of at least one substrate material (2), characterized by the steps:
a) Erzeugen einer oxidierten Oberfläche an der Verbindungsoberfläche (20, 30) des Strukturelements (3, 4) und/oder des Substratmaterials (2) oder Verwenden eines Strukturelements (3, 4) und/oder Substratmaterials (2) mit einer bereits oxidierten Oberfläche an dessen Verbindungsoberfläche (20, 30), a) Creating an oxidized surface on the connecting surface (20, 30) of the structural element (3, 4) and/or the substrate material (2) or using a structural element (3, 4) and/or substrate material (2) with an already oxidized surface on its connecting surface (20, 30),
b) Pressen der Verbindungsoberfläche (30) des Strukturelements (3, 4) gegen die Verbindungsoberfläche (20) des Substratmaterials (2) mit einem bestimmten Anpressdruck (1 1 ) ungleich Null bei gleichzeitiger Erwärmung zumindest der aneinander gepressten Verbindungsoberflächen (20, 30) auf eine Temperatur oberhalb einer Mindesttemperatur, c) Beenden des Anpressens und der Erwärmung nach Erreichen einer bestimmten Diffusionstiefe der Diffusion wenigstens eines Bestandteils der Oxidschicht der oxidierten Oberfläche an der einen Verbindungsoberfläche (20, 30) in das Material der anderen Verbindungsoberfläche (20, 30). b) pressing the connecting surface (30) of the structural element (3, 4) against the connecting surface (20) of the substrate material (2) with a certain contact pressure (1 1 ) other than zero while simultaneously heating at least the connecting surfaces (20, 30) pressed together a temperature above a minimum temperature, c) terminating the pressing and heating after reaching a certain diffusion depth of the diffusion of at least one component of the oxide layer of the oxidized surface on one connection surface (20, 30) into the material of the other connection surface (20, 30).
2. Verfahren nach Anspruch 1 , dadurch gekennzeichnet, dass das Strukturelement (3, 4) mittels eines strukturierten Stempels (8) gegen das Sub- stratmaterial (2) gepresst wird, wobei der Stempel (8) ein Abbild der auf dem Substratmaterial (2) zu erzeugenden geometrischen Struktur einer Beschichtung (3) des Substratmaterials (2) ist. 2. The method according to claim 1, characterized in that the structural element (3, 4) is pressed against the sub- strat material (2) is pressed, the stamp (8) being an image of the geometric structure of a coating (3) of the substrate material (2) to be produced on the substrate material (2).
Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Erwärmung auf eine Temperatur durchgeführt wird, die im Bereich der Solidustemperatur des Materials des Strukturelements (3, 4) zumindest an dessen Verbindungsoberfläche (30) ist und geringer als die Liquidustemperatur des Substratmaterials (2) ist. Method according to one of the preceding claims, characterized in that the heating is carried out to a temperature which is in the range of the solidus temperature of the material of the structural element (3, 4) at least on its connecting surface (30) and lower than the liquidus temperature of the substrate material (2 ) is.
Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Erwärmung auf eine Temperatur durchgeführt wird, die unterhalb der Glasübergangstemperatur des Substratmaterials (2) ist. Method according to one of the preceding claims, characterized in that the heating is carried out to a temperature which is below the glass transition temperature of the substrate material (2).
Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Verbindungsoberfläche (30) des Strukturelements (3, 4) ein Metall, eine Metalllegierung oder einen metallhaltigen Werkstoff aufweist, wobei dieses Material oxidierbar ist. Method according to one of the preceding claims, characterized in that the connecting surface (30) of the structural element (3, 4) has a metal, a metal alloy or a metal-containing material, this material being oxidizable.
Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Oxidation der Verbindungsoberfläche als kontrollierter, gleichmäßig gesteuerter Oxidationsprozess durchgeführt wird. Method according to one of the preceding claims, characterized in that the oxidation of the connection surface is carried out as a controlled, uniformly controlled oxidation process.
Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Strukturelement (3, 4) und/oder das Substratmaterial (2) während der Durchführung des Fügeverfahrens mittels Unterdruck temporär fixiert wird . Method according to one of the preceding claims, characterized in that the structural element (3, 4) and/or the substrate material (2) is temporarily fixed by means of negative pressure while the joining process is being carried out.
8. Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Substratmaterial (2) nach dem Anpressvorgang ge- genüber seiner während des Anpressvorgangs vorliegenden Form verbogen wird . 8. Method according to one of the preceding claims, characterized in that the substrate material (2) is pressed after the pressing process. is bent compared to its existing shape during the pressing process.
Anordnung aus wenigstens einem organischen oder nicht-organischen Substratmaterial (2) und wenigstens einem stoffschlüssig damit verbundenen Strukturelement (3, 4), wobei Strukturelemente (3, 4) Beschichtungen (3) und/oder Bauteile (4) sein können, wobei die stoffschlüssige Verbindung als Diffusionsverbindung zwischen einer Verbindungsoberfläche (20) des Substratmaterials (2) und einer Verbindungsoberfläche (30) des Strukturelements (3, 4) ausgebildet ist und innerhalb einer Diffusionszone (1 5) der Diffusionsverbindung sich wenigstens ein Bestandteil einer oxi- dierte Oberfläche der Verbindungsoberfläche (20, 30) des Substratmaterials (2) und/oder des Strukturelements (3, 4) befindet. Arrangement of at least one organic or non-organic substrate material (2) and at least one structural element (3, 4) connected thereto, wherein structural elements (3, 4) can be coatings (3) and / or components (4), the cohesive Connection is designed as a diffusion connection between a connection surface (20) of the substrate material (2) and a connection surface (30) of the structural element (3, 4) and within a diffusion zone (1 5) of the diffusion connection there is at least one component of an oxidized surface of the connection surface (20, 30) of the substrate material (2) and/or the structural element (3, 4).
10. Einrichtung (1 ) zur Herstellung einer Anordnung nach Anspruch 9 unter Verwendung eines Verfahrens nach einem der Ansprüche 1 bis 8, mit einer Anpressvorrichtung (7, 8) zum Anpressen der Verbindungsoberfläche (20) des Substratmaterials (2) an die Verbindungsoberfläche (30) des Strukturelements (3, 4) mit einer definierten Anpresskraft (1 1 ). 10. Device (1) for producing an arrangement according to claim 9 using a method according to one of claims 1 to 8, with a pressing device (7, 8) for pressing the connecting surface (20) of the substrate material (2) onto the connecting surface (30 ) of the structural element (3, 4) with a defined contact force (1 1).
1 1 . Einrichtung nach Anspruch 10, dadurch gekennzeichnet, dass die Einrichtung (1 ) einen strukturierten Stempel (8) aufweist, der eine Strukturierung entsprechend einem Abbild der auf dem Substratmaterial (2) zu erzeugenden geometrischen Struktur einer Beschichtung (3) des Substratmate- rials (2) aufweist. 1 1 . Device according to claim 10, characterized in that the device (1) has a structured stamp (8) which has a structuring corresponding to an image of the geometric structure of a coating (3) of the substrate material (2) to be produced on the substrate material (2). ) having.
1 2. Einrichtung nach Anspruch 1 1 , dadurch gekennzeichnet, dass der Stempel (8) Aussparungen zur Aufnahme von mittels des Stempels (8) auf dem Substratmaterial (2) aufzubringenden Bauteilen (4) aufweist. 1 2. Device according to claim 1 1, characterized in that the stamp (8) has recesses for receiving components (4) to be applied to the substrate material (2) by means of the stamp (8).
1 3. Einrichtung nach Anspruch 1 1 oder 1 2, dadurch gekennzeichnet, dass der Stempel (8) an seiner Andruckseite, mit der er mit der am Substratmaterial (2) anzupressenden Beschichtung (3) in Kontakt kommt, eine Antihaft- beschichtung (7) aufweist. 1 3. Device according to claim 1 1 or 1 2, characterized in that the stamp (8) has a non-stick coating (7) on its pressure side, with which it comes into contact with the coating (3) to be pressed onto the substrate material (2). ) having.
14. Einrichtung nach einem der Ansprüche 10 bis 1 3, dadurch gekennzeichnet, dass die Einrichtung eine Beheizungseinrichtung (16) aufweist, die zur Beheizung des Strukturelements (3, 4) und/oder des Substratmaterials (2) zumindest im Bereich der Verbindungsoberflächen (20, 30) eingerichtet ist. 14. Device according to one of claims 10 to 1 3, characterized in that the device has a heating device (16) which is used to heat the structural element (3, 4) and / or the substrate material (2) at least in the area of the connecting surfaces (20 , 30) is set up.
15. Einrichtung nach einem der Ansprüche 10 bis 14, dadurch gekennzeichnet, dass die Einrichtung dazu eingerichtet ist, das Substratmaterial (2) nach dem Anpressvorgang gegenüber seiner während des Anpressvorgangs vorliegenden Form zu verbiegen . 15. Device according to one of claims 10 to 14, characterized in that the device is set up to bend the substrate material (2) after the pressing process compared to its shape present during the pressing process.
GÜ/kow GÜ/kow
PCT/EP2015/056904 2014-03-31 2015-03-30 Method and device for joining structures on a substrate and arrangement comprising said joined structures WO2015150330A1 (en)

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