WO2015148637A1 - Cellules solaires à couches minces dotées de grilles de contact métalliques - Google Patents
Cellules solaires à couches minces dotées de grilles de contact métalliques Download PDFInfo
- Publication number
- WO2015148637A1 WO2015148637A1 PCT/US2015/022442 US2015022442W WO2015148637A1 WO 2015148637 A1 WO2015148637 A1 WO 2015148637A1 US 2015022442 W US2015022442 W US 2015022442W WO 2015148637 A1 WO2015148637 A1 WO 2015148637A1
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- WO
- WIPO (PCT)
- Prior art keywords
- cell
- electrode layer
- layer
- photovoltaic conversion
- metallic grid
- Prior art date
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 230000003287 optical effect Effects 0.000 claims abstract description 11
- 239000011521 glass Substances 0.000 claims abstract description 8
- 238000006243 chemical reaction Methods 0.000 claims description 34
- 238000005096 rolling process Methods 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 claims description 6
- 238000001459 lithography Methods 0.000 claims description 5
- 239000006096 absorbing agent Substances 0.000 claims description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 3
- 239000006117 anti-reflective coating Substances 0.000 claims 1
- 229910021424 microcrystalline silicon Inorganic materials 0.000 claims 1
- 230000008569 process Effects 0.000 description 19
- 239000000463 material Substances 0.000 description 11
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 10
- 238000000059 patterning Methods 0.000 description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- 238000000149 argon plasma sintering Methods 0.000 description 7
- 238000013461 design Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- HQWPLXHWEZZGKY-UHFFFAOYSA-N diethylzinc Chemical compound CC[Zn]CC HQWPLXHWEZZGKY-UHFFFAOYSA-N 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000013082 photovoltaic technology Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/206—Electrodes for devices having potential barriers
- H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/16—Material structures, e.g. crystalline structures, film structures or crystal plane orientations
- H10F77/169—Thin semiconductor films on metallic or insulating substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/244—Electrodes made of transparent conductive layers, e.g. transparent conductive oxide [TCO] layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to solar cells having metallic electrical contacts, and a method for forming such devices.
- Photovoltaic devices also known as solar cells
- solar cells are entering the mainstream as a reliable and cost-effective source of renewable energy.
- One of the main drivers of adoption of photovoltaic technology has been the decrease of price per watt (or kilowatt) that each generation of devices has been able to reach, along with increased performance manifested primarily as power generated per unit area. Therefore, active research and development efforts are directed at achieving ongoing cost reductions in all the layers that comprise a thin film solar cell and all the processes of forming thereof.
- TCO transparent conductive oxide
- ZnO zinc oxide
- Sn0 2 tin oxide
- ITO indium tin oxide
- TCO materials are used in the form of a transparent layer as electrical contacts.
- a particularly critical layer is the front electrical contact which faces the light source, i.e the sun.
- TCO materials are their relatively high cost, particularly if they contain indium (In), but zinc-containing LPCVD precursors, like diethyl-zinc can be also be expensive. Besides having a relatively high cost, TCO materials also in some cases limit the current density
- zinc oxide in particular has a favorable crystal structure with an approximately 50° angle between crystal facets, and is thus a very effective scatterer of light. It is deposited typically via a low pressure chemical vapor deposition (LPCVD) or sputtering process in a layer 1 to 2 ⁇ thick, and is highly transparent (>95%) in the 400 to 800nm light wavelength range, thus suitable for solar energy capture. Every alternative electrical contact solution would thus need to address light scattering as well as electrical performance.
- LPCVD low pressure chemical vapor deposition
- sputtering process in a layer 1 to 2 ⁇ thick, and is highly transparent (>95%) in the 400 to 800nm light wavelength range, thus suitable for solar energy capture. Every alternative electrical contact solution would thus need to address light scattering as well as electrical performance.
- An aspect of the invention includes a thin film solar cell, comprising a substrate and a front electrode layer adjacent the substrate, the front electrode layer comprising a metallic grid.
- the substrate can comprise glass, which may be diffusive, or textured, or nanotextured.
- the glass may comprise a
- the solar cell further comprises a current-generating layer stack, which may comprise multiple photovoltaic conversion units, such as p-i-n or n-i-p photovoltaic conversion units, which may comprise amorphous and/or crystalline silicon absorbers.
- a current-generating layer stack may comprise multiple photovoltaic conversion units, such as p-i-n or n-i-p photovoltaic conversion units, which may comprise amorphous and/or crystalline silicon absorbers.
- Alternative embodiments may include photovoltaic conversion units comprising copper indium selenide (CIS), copper indium gallium selenide (CIGS), dye solar cells, or may comprise a hybrid of multiple aforementioned types of photovoltaic conversion units.
- a back electrode layer is formed on the opposite side of the current-generating layer stack, wherein the back electrode layer can also comprise a metallic grid.
- the front electrode layer has an optical transmission greater than about 95%, and a sheet resistance of less than about 30 ⁇ per square, preferably less than about 20 ⁇ per square.
- Another aspect of the invention includes a front, or back, or both electrode layers that comprise a transparent conductive oxide (TCO) layer and/or a p-oxide contact layer in addition to the metallic grids.
- TCO transparent conductive oxide
- Yet another aspect of the invention includes the process of forming front and back electrode layer metallic grids using rolling mask lithography (RML), to pattern the metallic grid, wherein the patterning step is followed by an etch and/or liftoff step to pattern a metallic layer from which the metallic grid is formed.
- RML rolling mask lithography
- FIG. 1 shows a cross section of an exemplary photovoltaic device in accordance with an embodiment of the invention.
- FIG. 2 shows a view of the metallic grid contact layer in accordance with an embodiment of the invention.
- FIG. 3 shows a schematic of the rolling mask lithography (RML) process.
- FIG. 4 shows a comparison of optical and electrical performance
- FIG. 5 shows photovoltaic device current density for various types of contact structures.
- Embodiments of the present invention relate to design of and method of forming a photovoltaic device, i.e. a solar cell.
- photovoltaic device which represents a device capable of conversion of incoming light energy into electrical energy
- terms such as cell, solar cell, solar panel, etc.
- the invention is also applicable to other types of devices that require or can optionally have optically transparent or semi-transparent electrical contacts, such as for example various display devices, liquid crystal display (LCD) devices, light emitting diodes (LED) and similar lighting devices, etc.
- LCD liquid crystal display
- LED light emitting diodes
- embodiment means that a particular feature, structure, material, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention, but do not denote that they are present in every embodiment.
- appearances of the phrases “in one embodiment” or “in an embodiment” in various places throughout this specification are not necessarily referring to the same
- FIG. 1 shows a cross section of a thin film solar cell 100 in accordance with an embodiment of the invention.
- the solar cell is formed on a transparent substrate 1 10, typically made of glass or other suitable transparent material.
- the lower side of the substrate is the side from which light is incident onto the solar cell (not shown) and may be coated with an a nti reflective coating 105, to reduce reflections and maximize coupling of the incident irradiation.
- a current-generating layer stack 155 is formed comprising (in this example) a tandem of two p-i-n silicon
- the photovoltaic conversion units 150 and 160 The first p-i-n photovoltaic conversion unit
- the 150 may be an amorphous silicon photovoltaic conversion unit.
- the second p-i-n photovoltaic conversion unit 160 may be a crystalline photovoltaic conversion unit.
- the current-generating layer stack 155 may comprise additional, i.e. 3 or more photovoltaic conversion units, and the photovoltaic conversion units themselves do not need to comprise silicon, but may comprise copper indium selenide (CIS), copper indium gallium selenide (CIGS), dye photovoltaic conversion units, etc.
- CIS copper indium selenide
- CGS copper indium gallium selenide
- dye photovoltaic conversion units etc.
- the photovoltaic conversion units may be n-i-p photovoltaic conversion units and/or the current-generating layer stack 155 may comprise a hybrid of multiple types of photovoltaic conversion units, e.g. a silicon and a CIS/CIGS photovoltaic conversion unit.
- the makeup of the current-generating layer stack will not be discussed in further detail here, and the reader is directed to copending U.S. Patent Application No. 14/159,002, entitled "SYSTEM AND METHOD FOR TRAPPING LIGHT IN A SOLAR CELL", and copending U.S. Provisional Patent Application No.
- a front electrode layer is formed between the substrate 1 10 and the first photovoltaic conversion unit 150.
- the front electrode layer comprises a metallic grid 140 formed on the surface 120 of substrate 1 10.
- the surface 120 of substrate 1 10 may be polished flat or it may be textured to increase light scattering into the photovoltaic conversion units 150 and 160.
- the glass can be textured by etching, scribing, or any other suitable method known to those skilled in the art.
- the surface 120 may be nanotextured or may comprise a nanoimprinted layer to form a texture or features for increased light scattering.
- the metallic grid may be formed from a metal such as silver (Ag), aluminum (Al), copper (Cu), or other suitable metal.
- FIG. 2 shows a cut-away view of thin film solar cell 100 of FIG. 1 with just the substrate 1 10 and metallic grid 140 shown formed thereupon, for clarity.
- the metallic grid 140 comprises grid elements 142 that enclose openings 145, wherein the size of the openings 145, the cross sections of grid elements 142, are selected such that a high optical transmission of the metallic grid 140 is achieved, in the range of 90% or higher, typically around 95%, and to preserve the current carrying capability of the metallic grid (i.e. having a low resistance).
- the front electrode layer may further comprise an optional front contact layer 130 in addition to the metallic grid 140.
- the front contact layer 130 may comprise a thin layer of transparent conductive oxide (TCO) or a p- doped oxide layer, wherein the front contact layer 130 serves to provide additional scattering of light (as in the case of a TCO) and/or to protect the first photovoltaic conversion unit 150 from diffusion of species from metallic grid 140 and substrate 1 10.
- Suitable transparent conductive oxides include but are not limited to zinc oxide (ZnO), tin oxide (Sn0 2 ), and indium tin oxide (ITO).
- the p-oxide layer may comprise a ⁇ - ⁇ 3 ⁇ / ⁇ - ⁇ 3 ⁇ layer stack, for example.
- the thickness of the front contact layer 130 may be greater than about 5nm, for example.
- a similar contact structure may be formed on the back side of the current- generating layer stack 155. While it is not critical for a metallic grid to be used as a back contact, because less light coupling therethrough, it is still preferable from the standpoint of maximizing solar cell performance, and from a cost perspective.
- a back electrode layer may be formed atop the second photovoltaic conversion unit 160 (or atop a stack comprising more than two photovoltaic conversion units), the back electrode layer comprising a metallic grid 170.
- Metallic grid 170 may be similar to metallic grid 140, of FIGs. 1 and 2, or it may be of a different geometry and comprising a different material. With the back electrode layer formed, a reflector 190 is typically added to the solar cell 100, to reflect transmitted light back into solar cell so it can be fully utilized in energy conversion.
- the back electrode layer may also comprise a back contact layer 180 comprising a thin layer of transparent conductive oxide (TCO), to protect the second photovoltaic conversion unit 160 from diffusion of species from metallic grid 170.
- TCO transparent conductive oxide
- An effective thickness of the back contact layer 180 may be about 5nm, or higher.
- FIG. 4 shows the achievable range 410 of optical transmission and sheet resistance for metallic grids formed by a rolling mask lithography (RML) process commercialized by Rolith, Inc., of 5880 W. Las Positas Blvd #51 , Pleasanton, CA 94588, United States.
- Optical transmission in excess of 95% can be achieved with metallic grid geometries and dimensions similar to those shown in FIGs. 1 and 2, with a sheet resistance of less than 10 ⁇ per square - all marked improvements over traditional TCOs.
- Typical performance may include an optical transmission in the 95% range, a wavelength passband from 350nm to 1200nm, and a sheet resistance of 10 to 30 ⁇ per square.
- the total photocurrent can be significantly increased due to reduced absorption losses in wavelength ranges inaccessible with the use of typical TCOs, i.e. blue, violet, and UV with wavelengths less than about 400nm, and red and infrared with wavelengths greater than about 800nm. All that may be achieved at a lower per-area cost, provided an inexpensive patterning and metal deposition solution is used, compared to traditional TCO layer forming.
- FIG. 5 shows actual measured current densities vs total thickness for traditional TCOs, in a smooth state (plot 520) and rough condition for improved light trapping (plot 510).
- a theoretical current density curve 530 is plotted for the case with no TCO, and a plot 540 is provided calculated based on anticipated performance of aforementioned metallic grids 140 and 170 used in lieu of TCO contacts, without the use of optional additional front and back contact layers 130 and 180.
- a photocurrent improvement in the range of 2.5 to 3 mA/cm 2 is readily apparent over traditional TCOs, allowing a higher conversion efficiency to be achieved in a thin film solar cell.
- the metallic grid 140 does provide some light scattering into the current- generating layer stack 155, it is advantageous to use additional methods of inducing light scattering, particularly in the case where a TCO front contact layer 130 is not used.
- Methods to induce light scattering may include using a diffuse glass substrate 1 10, or a substrate 1 10 where the surface 120 is textured or nanotextured, or where it has a pattern formed thereupon, for example using nanoimprinting or other patterning methods.
- a higher solar cell performance can be achieved, manifested by a higher open circuit voltage Voc and a higher fill factor FF.
- the conditioning of the substrate 1 10 and its surface 120 also can be tailored to improve index matching, to reduce unwanted internal reflection losses.
- a design of a thin film solar cell with metallic grids 140 and 170, and in particular the decision whether to include TCO front and back contact layers 130 and 180 will involve making design tradeoffs.
- a TCO-free thin film solar call would be expected to exhibit a higher level of reliability, due to absence of TCO-related problems, such as moisture-, or UV-induced degradation, or anodic degradation.
- the use of metallic grids only allows the decoupling of electrical and optical functions of the contact scheme.
- a TCO front and back contact layers introduce additional light scattering, which is beneficial, and they also serve as diffusion barriers.
- the introduction of metallic grids may require changes in bus bar design and scribing processes. Overall, the design will necessarily become a result of an optimization process, with many parameters taken into account.
- FIG. 3 depicts a schematic of the patterning process 300, in which a substrate 1 10 is moved through a patterning process that begins with dispensing photoresist from a nozzle (or set of nozzles) 310, to form a photoresist layer 320.
- Patterning of the photoresist layer 320 is accomplished by exposure to UV light from a UV source 340 placed inside a rolling mask 330.
- the rolling mask 330 comprises a pattern that is to be formed in the photoresist layer 320.
- the RML process proceeds at a continuous high rate, forming a latent image of the pattern inside photoresist layer 320.
- the exposed photoresist layer 320 is then subjected to a development process wherein developer is dispensed onto the photoresist layer 320 from nozzle(s) 350 to form a pattern 370.
- the process completes with a rinse step in which a rinse liquid is dispensed from rinse nozzle(s) 360, to clean the pattern 370 atop substrate 1 10, and prepare it for further processing steps.
- the pattern 370 can be formed as a negative of the metallic grid pattern, and the metallic grid can be formed by simple metal deposition into the pattern openings and across the negative pattern 370. This step is followed by a liftoff etch process in which the negative pattern 370 is lifted off along with the overlying metal layer, to expose a metallic grid.
- a more traditional approach can be taken, in which a metallic layer is formed prior to RML patterning, the pattern 370 being a positive pattern formed thereupon, and used as a mask for a subsequent etch step in which openings 145, for example, of metallic grid 140 are formed by etching the metal. Both processes can be followed by further cleaning steps to remove the lifted-off or etched material and photoresist from the substrate 1 10.
- a metallic grid for example metallic grid 140
- the usual process of forming a current-generating layer stack 155, the back electrode layer, and reflector 190, can proceed, as known to those skilled in the art.
Landscapes
- Photovoltaic Devices (AREA)
Abstract
L'invention concerne une cellule solaire améliorée ayant des grilles de contact métalliques seules ou en association avec une couche de contact d'oxyde conducteur transparent (TCO) ou une couche de contact de p-oxyde. L'invention concerne également un procédé de formation de telles cellules solaires. Des grilles de contact métalliques, avec ou sans couche d'oxyde conducteur transparent (TCO) ou couche de contact de p-oxyde, peuvent être utilisées avec divers types de piles de couches de génération de courant de cellule solaire à couches minces, et éventuellement combinées avec des substrats de verre imprimés ou à motifs, de diffusion ou texturés pour obtenir des caractéristiques électriques et optiques améliorées de cellule solaire.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US201461970264P | 2014-03-25 | 2014-03-25 | |
US61/970,264 | 2014-03-25 |
Publications (1)
Publication Number | Publication Date |
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WO2015148637A1 true WO2015148637A1 (fr) | 2015-10-01 |
Family
ID=54196342
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/US2015/022442 WO2015148637A1 (fr) | 2014-03-25 | 2015-03-25 | Cellules solaires à couches minces dotées de grilles de contact métalliques |
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WO (1) | WO2015148637A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20230268452A1 (en) * | 2020-06-26 | 2023-08-24 | Evolar Ab | Photovoltaic top module |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100096004A1 (en) * | 2006-10-25 | 2010-04-22 | Unidym, Inc. | Solar cell with nanostructure electrode(s) |
US20100197068A1 (en) * | 2008-10-30 | 2010-08-05 | Hak Fei Poon | Hybrid Transparent Conductive Electrode |
US20120103669A1 (en) * | 2009-05-26 | 2012-05-03 | Institucio Catalana De Recerca I Estudis Avancats | Metal transparent conductors with low sheet resistance |
US20120227794A1 (en) * | 2009-09-18 | 2012-09-13 | Applied Materials, Inc. | Threshold adjustment implants for reducing surface recombination in solar cells |
US20130340817A1 (en) * | 2010-09-03 | 2013-12-26 | Oerlikon Solar Ag, Trubbach | Thin film silicon solar cell in tandem junction configuration on textured glass |
-
2015
- 2015-03-25 WO PCT/US2015/022442 patent/WO2015148637A1/fr active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100096004A1 (en) * | 2006-10-25 | 2010-04-22 | Unidym, Inc. | Solar cell with nanostructure electrode(s) |
US20100197068A1 (en) * | 2008-10-30 | 2010-08-05 | Hak Fei Poon | Hybrid Transparent Conductive Electrode |
US20120103669A1 (en) * | 2009-05-26 | 2012-05-03 | Institucio Catalana De Recerca I Estudis Avancats | Metal transparent conductors with low sheet resistance |
US20120227794A1 (en) * | 2009-09-18 | 2012-09-13 | Applied Materials, Inc. | Threshold adjustment implants for reducing surface recombination in solar cells |
US20130340817A1 (en) * | 2010-09-03 | 2013-12-26 | Oerlikon Solar Ag, Trubbach | Thin film silicon solar cell in tandem junction configuration on textured glass |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20230268452A1 (en) * | 2020-06-26 | 2023-08-24 | Evolar Ab | Photovoltaic top module |
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