WO2015102342A1

WO2015102342A1 - Dicing film and dicing die bonding film

Info

Publication number: WO2015102342A1
Application number: PCT/KR2014/012981
Authority: WO
Inventors: 김세라; 조정호; 김영국; 김희정; 이광주; 김정학; 남승희
Original assignee: 주식회사 엘지화학
Priority date: 2014-01-03
Filing date: 2014-12-29
Publication date: 2015-07-09

Abstract

The present invention relates to a dicing film which comprises a base film and an adhesive layer, wherein the storage elastic modulus of the adhesive layer is 3×10⁵ to 4×10⁶ Pa at 30°C and the cross-linking density of the adhesive layer is 80% to 99%; to a dicing die bonding film comprising the dicing film; and to a method for dicing a semiconductor wafer using the dicing die bonding film.

Description

【Specification】

[Name of invention]

Dicing Film and Dicing Die Bonding Film

Technical Field

The present invention relates to a dicing film and a dicing die-bonding film, and more particularly, a dicing film and dicing capable of improving pick-up property and preventing damage to a thinned semiconductor chip during a dicing process of a semiconductor packaging process. Dicing die film containing a film and a dicing method of a semiconductor wafer using the said dicing die bonding film.

[Technique to become background of invention]

In general, the manufacturing process of the semiconductor chip includes a process of forming a fine pattern on the wafer and a process of polishing and packaging the wafer to meet the specifications of the final device. The packaging process includes a wafer inspection process for inspecting a defect of a semiconductor chip; A dicing step of cutting the wafer into separate chips; A die bonding process of attaching the separated chip to a circuit film (ci rcui t f i lm) or a mounting plate of a lead frame; A wire bonding process of connecting the chip pad provided on the semiconductor chip and the circuit pattern of the circuit film or the lead frame with electrical connection means such as wire; A molding process of wrapping the outside with an encapsulant to protect the internal circuit and other components of the semiconductor chip; Trim process for cutting the dam bar connecting the lead and the lead; Forming process of bending leads into desired shapes; And a finished product inspection process for inspecting defects of the finished package.

Through the dicing process, individual chips separated from each other from a semiconductor wafer on which a plurality of chips are formed are manufactured. In general, a dicing process is a process of manufacturing a plurality of individual chips separated from each other by grinding the back surface of the semiconductor wafer and cutting the semiconductor wafer along a dicing line between the chips. Meanwhile, with the miniaturization of electronic devices and the increase in memory capacity, MCP (mul ti ^L chip package) technology, in which semiconductor chips are stacked vertically, has been widely used in recent years, and individual chip thicknesses have to be thin in order to stack many chips.

According to the thinning of the semiconductor wafer as described above, if excessive force is applied when separating the adhesive layer and the adhesive layer, the thinned chip may be damaged. There was a problem that the pickup properties are lowered.

[Content of invention]

Problem to be solved

The present invention uses a dicing film and a dicing die-bonding film including the dicing film and the dicing film that can improve the pickup properties in the dicing process of the semiconductor packaging process and prevent damage to the thinned semiconductor wafer It is for providing a dicing method of a semiconductor wafer.

[Measures of problem]

In this specification, a base film; And it comprises a pressure-sensitive adhesive layer, the storage modulus of the pressure-sensitive adhesive layer is 3.0 * 10 ⁵ to 4.0 * 10 ⁶ Pa at 30 ^° C, the cross-linking density of the pressure-sensitive adhesive is provided with a dicing film of 80% to 99%.

The storage modulus of the adhesive layer 1.0 eseo 80 ^° C * 10 ⁵ Pa may be more than, or 1.0 * 10 ⁵ Pa to 4.0 * 10 ⁵ Pa.

The adhesive layer may include an adhesive resin, a photoinitiator, and a crosslinking agent.

The adhesive resin has a glass transition temperature of 28 ^° C to -58 ^° C

(Meth) acrylate type resin can be included. In the present specification, (meth) acrylate is meant to include both acrylate and (meth) acrylate.

The crosslinking agent may include at least one compound selected from the group consisting of an isocyanate compound, an aziridine compound, an epoxy compound, and a metal chelate compound.

The adhesive layer may include 0.1 to 20 parts by weight of the photoinitiator and 0.1 to 40 parts by weight of the crosslinking agent with respect to 100 parts by weight of the adhesive resin.

The base film may be a polyolefin film, polyester film, polycarbonate film, polyvinyl chloride film, polytetrafluoroethylene film, polybutene film, polybutadiene film, vinyl chloride copolymer film, ethylene-vinyl acetate copolymer film , An ethylene-propylene copolymer film, and an ethylene-alkyl acrylate copolymer film.

The base film may have a thickness of 10 kPa to 200, and the adhesive layer may have a thickness of 5 ηι to 100 kPa. In addition, in the present specification, the dicing film; And an adhesive layer formed on at least one surface of the dicing film. The adhesive layer may include a thermoplastic resin, an epoxy resin, and a curing agent. The thermoplastic resin may be polyimide, polyether imide, polyester imide, polyamide, polyether sulfone, polyether ketone, polyolefin, polyvinyl chloride, phenoxy, reactive butadiene acrylonitrile copolymer rubber and (meth) acrylate It may include one or more polymer resins selected from the group consisting of resins.

The curing agent may include at least one compound selected from the group consisting of a phenolic resin, an amine curing agent, and an acid anhydride curing agent.

The adhesive layer may include 10 to 1,000 parts by weight of the thermoplastic resin and 10 to 700 parts by weight of the curing agent relative to 100 parts by weight of the epoxy resin.

The adhesive layer may further include at least one curing catalyst selected from the group consisting of phosphorus compounds, boron compounds, phosphorus-boron compounds and imidazole compounds.

The adhesive layer may have a thickness of 1 to 300. In addition, in this specification, a dicing die-bonding film; And a wafer stacked on at least one surface of the dicing die ¾ film; a preprocessing step of partially or partially dividing the semiconductor wafer; A method of dicing a semiconductor wafer is provided, comprising: irradiating ultraviolet rays to the base film of the preprocessed semiconductor wafer and picking up individual chips separated by the division of the semiconductor wafer. 【Effects of the Invention】

According to the present invention, a dicing die bonding film and the dicing die bonding film including the dicing film and the dicing film capable of improving pick-up property and preventing damage to a thinned semiconductor wafer during the dicing process of the semiconductor packaging process A dicing method of a semiconductor wafer using may be provided.

When excessive force is applied when the adhesive layer and the adhesive layer are separated according to the thinning of the semiconductor wafer, the thinned chip may be damaged and the pickup property may be degraded. There was a problem, according to the dicing method of the dicing film, dicing die-bonding film and semiconductor wafer, improve the pick-up property to enable a smooth pick-up process and to prevent damage to the thinned semiconductor chip.

[Specific contents to carry out invention]

Hereinafter, a dicing film, a dicing die bonding film, and a dicing method of a semiconductor wafer of a specific embodiment of the present invention will be described in detail. According to one embodiment of the invention, a base film; And a pressure-sensitive adhesive layer, wherein the storage modulus of the pressure-sensitive adhesive layer is 3 * 10 ⁵ to 4 * 10 ⁶ Pa at 30 ^° C., and the crosslinking density of the pressure-sensitive adhesive layer is 80% to 99%. Can be.

The present inventors have conducted research on a method for improving pickup performance and preventing damage to a thinned semiconductor chip, and using a dicing film containing an adhesive layer having a specific storage modulus and crosslinking density, The experiment confirmed that the pick-up property can be improved and the damage of the thinned semiconductor chip can be prevented through the experiment.

In the past, a method of increasing the pick-up property by reducing the adhesive force of the adhesive layer of the dicing film has been attempted, but simply lowering the adhesive force of the adhesive layer has a limit in improving the pickup property, and rather, the pick-up property has been deteriorated. . The present inventors have solved this problem by applying the adhesive layer having the specific storage elasticity and crosslinking density described above.

As described above, the storage modulus of the adhesive layer may be 3 * 10 ⁵ to 4 * 10 ⁶ Pa at 30 ^° C. When the storage modulus of the adhesive layer is less than 3 * 10 ⁵ Pa at 30 ^° C., a large force is required when separating the adhesive layer from the adhesive layer, and may cause damage to the thinned semiconductor chip during the dicing process. In addition, when the storage elasticity of the adhesive layer is greater than 4 * 10 ⁶ Pa at 30 ^° C, the strength of the adhesive layer is increased, the pick-up property can be reduced $ 1.

In addition, the crosslinking density of the adhesive layer may be 80% to 99%, or 85% to 98 ⁾ . When the degree of crosslinking of the adhesive layer is less than 80%, the anchoring action between the adhesive and the adhesive is increased to increase the force required to separate them, thereby lowering the pickup property of the semiconductor wafer. In addition, when the degree of crosslinking of the pressure-sensitive adhesive layer is greater than 99%, the adhesion of the pressure-sensitive adhesive layer is greatly reduced, resulting in chip flying during the dicing process. And so on.

In addition, to increase the pickup of the semiconductor wafer when using the dicing film, the storage modulus of the adhesive layer is 3 * 10 ⁵ to 4 * 10 ⁶ Pa at 30 ^° C, the storage modulus of the adhesive layer is 1 at 80 ^° C. . may be O10 ⁵ Pa or more, or 1.0 * 10 ⁵ Pa to 4.0 * 10 ⁶ Pa.

Except for the above-mentioned contents, the specific composition of the adhesive layer is not particularly limited, and for example, the adhesive layer may include an adhesive resin, a photoinitiator, and a crosslinking agent.

The crosslinking agent may include at least one compound selected from the group consisting of an isocyanate compound, an aziridine compound, an epoxy compound, and a metal chelate compound. The pressure-sensitive adhesive layer may include 0.1 to 40 parts by weight of a crosslinking agent relative to 100 parts by weight of the pressure-sensitive adhesive resin. If the content of the crosslinking agent is too small, the cohesive force of the adhesive layer may be insufficient. If the content of the crosslinking agent is too high, the adhesive layer may not sufficiently secure the adhesive force before photocuring and chip scattering may occur.

Specific examples of the photoinitiator are not limited, and commonly known photoinitiators may be used. In addition, the adhesive layer may include 0.01 to 20 parts by weight of the photoinitiator relative to 100 parts by weight of the adhesive resin.

The specific kind of the base film is not particularly limited as long as it is a commonly used base film, for example, a polyolefin film, a polyester film, a polycarbonate film, a polyvinyl chloride film, a polytetrafluoroethylene film, a polybutene film, poly It may be one polymer film selected from the group consisting of butadiene film, vinyl chloride copolymer film, ethylene-vinyl acetate copolymer film, ethylene propylene copolymer film, and ethylene ᅳ alkyl acrylate copolymer film. The base film may have a thickness of 10 to 200, and the adhesive layer may have a thickness of 5!

Specifically, the adhesive resin may include a (meth) acrylate-based resin having a glass transition temperature of -28 ^° C to -58 ^° C, or ᅳ 30 ^° C to-55 ^° C. In the present specification, (meth) acrylate is meant to include both acryl'ate and (meth) acrylate. The (meth) acrylate resin may be, for example, a copolymer of a (meth) acrylic acid ester monomer and a crosslinkable functional group-containing monomer. At this time, examples of the (meth) acrylic acid ester monomer include alkyl (meth) acrylate, and more specifically, monomers having an alkyl group having 1 to 12 carbon atoms, such as pentyl (meth) acrylate and 11-butyl (meth). ) Acrylate, ethyl (meth) acrylate, methyl (meth) acrylate, nucleus (meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, 2-ethylnuclear (meth) acrylic And a mixture of one or more kinds of dodecyl (meth) acrylate or decyl (meth) acrylate.

Examples of the crosslinkable functional group-containing monomer include one or more kinds of hydroxy group-containing monomers, carboxyl group-containing monomers, or nitrogen-containing monomers.

Examples of the hydroxyl group-containing compound include 2—hydroxyethyl (meth) acrylate,. 2'Hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxynuclear (meth) acrylate, 8- hydroxyoctyl (meth) acrylate, 2-hydroxyethylene glycol (Meth) acrylate, or 2-hydroxypropylene glycol (meth) acrylate, etc. are mentioned.

Examples of the carboxyl group-containing compound include (meth) acrylic acid, 2- (meth) acryloyloxyacetic acid, 3- (meth) acryloyloxypropyl acid, 4- (meth) acryloyloxybutyl acid, acrylic acid double Sieve, itaconic acid, maleic acid, or maleic acid ϋ ^ α dode number Examples of such nitrogen-containing monomers include (meth) acrylonitrile, Ν-vinyl pyridone or Ν-vinyl caprolactam.

The (meth) acrylate resin may further include vinyl acetate, styrene or acrylonitrile, etc., in view of improving other functionalities such as compatibility.

The adhesive layer may further include an ultraviolet curable compound.

The type of the ultraviolet curable compound is not particularly limited, and for example, a polyfunctional compound having a weight average molecular weight of about 500 to 300, 000 (ex. Polyfunctional urethane acrylate, polyfunctional acrylate monomer or oligomer, etc.). )of Can be used. The average person skilled in the art can easily select the appropriate compound according to the intended use. The content of the ultraviolet curable compound may be 1 part by weight to 400 parts by weight, preferably 5 parts by weight to 200 parts by weight, based on 100 parts by weight of the above-mentioned adhesive resin. If the content of the ultraviolet curable compound is less than 1 part by weight, there is a risk that the lowering of the adhesive strength after curing is not sufficient, and the pick-up property may be degraded. If the content of the ultraviolet curable compound exceeds 400 parts by weight, the cohesive force of the adhesive may be insufficient before peeling off the ultraviolet ray, There is a possibility that it may not be easily performed. .

The ultraviolet curable pressure sensitive adhesive may be used in a form in which carbon-carbon double bonds are bonded to side chains or main chain ends of the acrylic copolymer, as well as the additive type ultraviolet curable compound. That is, the (meth) acrylic co-polymer may further include an ultraviolet curable compound bonded to the side chain of the main chain including the (meth) acrylic acid ester monomer and the crosslinkable functional group-containing monomer.

The type of the ultraviolet curable compound includes 1 to 5, preferably 1 or 2, photocurable functional groups (ex. Ultraviolet polymerizable carbon-carbon double bonds) per molecule, and is also included in the main chain. and a functional group capable of banung ^■ does not specifically limit having a functional group. At this time, examples of the crosslinkable functional group and the functional group that can be reacted include an isocyanate group or an epoxy group, but are not limited thereto.

Specific examples of the UV-curable compound include a functional group capable of reacting with a hydroxyl group included in the main chain, (meth) acryloyloxy isocyanate, (meth) acryloyloxy methyl isocyanate, 2- (meth) acrylic Loyloxy ethyl isocyanate, 3- (meth) acryloyloxy propyl isocyanate, 4- (meth) acryloyloxy butyl isocyanate, m-propenyl-α, α-dimethyl _. Benzyl isocyanate, methacryloyl isocyanate, or allyl isocyanate; Acryloyl monoisocyanate compounds obtained by reacting a diisocyanate compound or a polyisocyanate compound with 2'hydroxyethyl (meth) acrylic acid; Acryloyl monoisocyanate compounds obtained by reacting a diisocyanate compound or a polyisocyanate compound, a polyol compound, and 2-hydroxyethyl (meth) acrylate; Or comprising a carboxyl group and a functional group that can react with the main chain. One kind or fish species such as glycidyl (meth) acrylate or allyl glycidyl ether may be mentioned, but is not limited thereto.

The ultraviolet curable compound may be included in the side chain of the base resin by substituting 5 mol% to 90 mol% of the crosslinkable functional groups included in the main chain. When the amount of substitution is less than 5 mol%, there is a risk that the peeling force decrease due to ultraviolet irradiation may not be divided, and when it exceeds 90 mol¾, the cohesion force of the pressure-sensitive adhesive before ultraviolet irradiation may be lowered. The adhesive layer may suitably include a tackifier such as rosin resin, terpene resin, phenol resin, styrene resin, aliphatic petroleum resin, aromatic petroleum resin or aliphatic aromatic copolymerized petroleum resin.

A method of forming the adhesive layer on the base film does not _i being particularly limited, for example, once the pressure-sensitive adhesive composition on a substrate by coating a pressure-sensitive adhesive composition of the present invention directly on the film method of forming a pressure-sensitive adhesive layer or a releasable base The pressure-sensitive adhesive layer may be coated to prepare an pressure-sensitive adhesive layer, and a method of transferring the pressure-sensitive adhesive layer onto a base film using the peelable base material may be used.

The method of applying and drying the pressure-sensitive adhesive composition is not particularly limited, and for example, a composition including each of the above components may be used as it is, or diluted in a suitable organic solvent, such as a comma coater, gravure coater, die coater or reverse coater. After application by means of 6 (rc to 2 (xrc), a method of drying the solvent for 10 seconds to 30 minutes at a temperature of xrc may be used. In addition, in the above process, an aging process for advancing a sufficient crosslinking reaction of the pressure-sensitive adhesive ( On the other hand, according to another embodiment of the present invention, a dicing die-bonding film, including a dicing film and an adhesive layer formed on at least one surface of the dicing film may be provided. .

The adhesive layer may include a thermoplastic resin, an epoxy resin, and a curing agent. The thermoplastic resin may be polyimide, polyether imide, polyester imide, polyamide, polyether sulfone, polyether ketone, polyolefin, polyvinyl chloride, phenoxy, semi-butadiene acrylonitrile copolymer rubber and (meth) acrylic One or more polymers selected from the group consisting of rate-based resins Resin may be included.

The epoxy resin may include an epoxy resin for general adhesives known in the art, and for example, an epoxy resin containing two or more epoxy groups in a molecule and having a weight average molecular weight of 100 to 2,000 may be used. . The epoxy resin may form a hard crosslinked structure through a curing process, and may exhibit excellent adhesion, heat resistance, and mechanical strength. More specifically, it is preferable that the epoxy resin uses an epoxy resin having an average epoxy equivalent of 100 to 1,000. When the epoxy equivalent of the said epoxy resin is less than 100, a crosslinking density may become high too much, and there exists a possibility that an adhesive film may show a hard property as a whole, and when it exceeds ι and οοο, heat resistance may fall.

Examples of the epoxy resin include bifunctional epoxy resins such as bisphenol A epoxy resin or bisphenol F epoxy resin; Or cresol novolac epoxy resin, phenol novolac sepoxy resin, tetrafunctional epoxy resin, biphenyl type epoxy resin, triphenol methane type epoxy resin, alkyl modified triphenol methane type epoxy resin, naphthalene type epoxy resin, dicyclopenta One kind or two or more kinds of polyfunctional epoxy resins having three or more functional groups, such as a diene type epoxy resin or a dicyclopentadiene-modified phenol type epoxy resin, are not limited thereto.

Moreover, it is preferable to use the mixed resin of a bifunctional epoxy resin and a polyfunctional epoxy resin as said epoxy resin. Terminology used herein

"Multifunctional epoxy resin" means an epoxy resin having three or more functional groups. That is, in general, bifunctional epoxy resins are excellent in flexibility and flowability at high temperatures, but are poor in heat resistance and curing rate, whereas polyfunctional epoxy resins having three or more functional groups are fast in curing rate and excellent in high crosslinking density. Heat resistance, but flexibility and flowability is poor. Therefore, by appropriately mixing and using the above two kinds of resins, it is possible to suppress the scattering of chips and the generation of burrs during the dicing process while controlling the elastic modulus and tack characteristics of the adhesive layer. The curing agent included in the adhesive layer is not particularly limited as long as it can react with the epoxy resin and / or thermoplastic resin to form a crosslinked structure. For example, the curing agent is a phenolic resin, an amine curing agent, and an acid anhydride type. As hardener It may include one or more compounds selected from the group consisting of.

The curing catalyst plays a role of promoting the action of the curing agent and curing of the resin composition for semiconductor bonding, and a curing catalyst known to be used in the manufacture of a semiconductor adhesive film or the like can be used without great limitation. For example, the curing catalyst may be one or more selected from the group consisting of phosphorus compounds, boron compounds, phosphorus-boron compounds and imidazole compounds. The amount of the curing catalyst may be appropriately selected in consideration of physical properties of the adhesive film to be finally prepared, for example, 0.5 to 10 weight based on a total of 100 parts by weight of the epoxy resin, the (meth) acrylate resin, and the phenol resin. Can be used as a wealth. The dicing die-bonding film may further include a release film formed on the adhesive layer. Examples of the release film that can be used include one or more kinds of polyethylene terephthalate film, pletetrafluoroethylene film, polyethylene film, polypropylene film, polybutene film, polybutadiene film, vinyl chloride copolymer film or polyimide film and the like. Plastic films;

The surface of the release film as described above may be released by one or more kinds of alkylide, silicone, fluorine, unsaturated ester, polyolefin, or wax or the like, and among these, alkyd, silicone, or fluorine based, particularly having heat resistance. Mold release agents, such as these, are preferable.

The release film is usually 5 to 500 ^ m, preferably may be formed in a thickness of about 10 to 200, but is not limited thereto.

The method for producing the above-mentioned dicing die-bonding film is not particularly limited, and for example, a method of sequentially forming an adhesive part, an adhesive part and a release film on a base film, or a dicing film (base film + adhesive part) And separately preparing a release film having a die-bonding film or an adhesive part formed thereon _. A method of laminating it may be used.

Lamination method in the above is not particularly limited, hot lamination or lamination press method can be used in terms of double continuous process possibility and efficiency The hot roll lamination method is preferable. Hot lamination method is at icrc to loo ° c

It may be performed at a pressure of 0.1 Kgf / cuf to 10 Kgf / ciif, but is not limited thereto. On the other hand, according to another embodiment of the invention, the dicing die bonding film; And a wafer stacked on at least one surface of the dicing die-bonding film; a pre-processing step of partially or partially dividing the semiconductor wafer. Irradiating ultraviolet rays to the base film of the pre-processed semiconductor wafer, and picking up the individual chips separated by the division of the semiconductor wafer, a dicing method of a semiconductor wafer can be provided.

It includes all the above-mentioned content regarding the dicing die-bonding film. Except for the detailed steps of the dicing method, a device, a method, and the like, which are commonly used for the dicing method of a known semiconductor wafer, may be used without particular limitation.

By using the dicing die-bonding film including the die film, it is possible to improve the pickup properties during the dicing process of the semiconductor packaging process and to prevent damage to the thinned semiconductor chip. Specific embodiments of the invention are described in more detail in the following examples. However, the following examples are merely to illustrate specific embodiments of the invention, the content of the present invention is not limited by the following examples. Preparation Example: Production of (meth) acrylate Crab Resin

Preparation Example 1

68.5 parts by weight of 2-ethylnuclear acrylate (2-EHA), 8.5 parts by weight of methyl acrylate (MA), as shown in Table 1, in a reaction vessel equipped with a nitrogen gas to reflux the nitrogen gas to facilitate temperature control. And a mixture of monomers composed of 23 parts by weight of hydroxyethyl acrylate (HEA).

Subsequently, based on 100 parts by weight of the monomer mixture, 400 parts of n_DDM which is a chain transfer agent (CTA) and 100 parts by weight of ethyl acetate (EAc) as a solvent. 3, in rc while injecting nitrogen to remove oxygen into the reactor

The mixture was mixed well for 30 minutes or more. Thereafter, the temperature was maintained at 62 ^° C., and a concentration of 300 ppm of the initiator V-60 (Azob isi sobut y 1 on itri 1 e) was added thereto, and the reaction was initiated. 24.6 parts by weight of 2—methacryloyloxyethylisocyanate (M0I) to the primary reactant (80 mol ¾ of HEA and 1% by weight of catalyst (DBTDL: dibutyl tin dilaurate) relative to HEA in the primary coarse water), Reaction was carried out at 40 ^° C for 24 hours to introduce an ultraviolet curing group to the polymer side chain in the primary reactant to prepare a (meth) acrylate-based polymer resin (glass transition temperature: -38.2 ^° C.) Preparation Examples 2 to 5

A (meth) acrylate polymer resin was prepared in the same manner as in Preparation Example 1, except for the composition shown in Table 1.

Table 1

2-EHA: 2-ethyl nucleus acrylate

MA: methyl acrylate

EHMA: 2-ethyl nuclear chamber methacrylate

HEA: hydroxy ethyl acrylate

M0I: 2-Methacroyloxyethylisocyanate Preparation Example: Production of Disim Film, Die Bonding Film, and Dicing Die Bonding Film Example 1

(1) Production of die bonding film

90 g of high molecular weight acrylic resin (Tg 20 ^° C, weight average molecular weight 850,000) and 30 g of epoxy resin (novolak-type epoxy resin, softening point 94 ^° C), phenolic resin (phenol novolak resin, softening point) 94 ^° C) 20 g, moderate temperature onset curing accelerator (2-methyl imidazole) O. 0.5 g of a high temperature start hardening accelerator (2 'phenyl- 4-methyl- imidazole), the composition which consists of 20 g of silica (average particle diameter: 75 kPa) as a filler, and methyl ethyl ketone were stirred and mixed.

This was applied to a release-treated thickness 38um PET, dried for 3 minutes at 11CTC to prepare a die-bonding film having a coating thickness of 20um.

(2) production of dicing film

A pressure-sensitive adhesive composition was prepared by mixing 7 g of TE) I-based isocyanate curing agent and 3 g of photoinitiator (Irgacure 184) with 100 g of the (meth) acrylate polymer resin of Preparation Example 1.

The pressure-sensitive adhesive composition was applied to a release-treated thickness 38um PET, and dried at 110 ^° C for 3 minutes to form a pressure-sensitive adhesive layer having a thickness of 10 訓. The formed pressure-sensitive adhesive layer was laminated on a 100% polyolefin base film and then subjected to aging to prepare a dicing film.

In addition, the pressure-sensitive adhesive layer formed on the release-treated thickness 38um PET was the same release treatment. After lamination to PET, it was used to measure the storage modulus of the adhesive after aging.

(3) Dicing die bonding film manufacturing

A dicing die bonding film was prepared after transferring the die bonding film circularly cut into the prepared dicing film through paper under a condition of 5 kgf / cm ² . Examples 2-5 and Comparative Examples 1-4

Dicing die bonding in the same manner as in Example 1 except for the use of the (meth) acrylate-based polymer resin shown in Table 2 in the manufacture of the dicing film A film was prepared.

Table 2

Experimental Example

The physical properties of the dicing die-bonding films of the Examples and Comparative Examples were evaluated by the following methods, and the results are shown in Table 3.

Experimental Example 1: Adhesive Storage Modulus

As described in [Production of Dicing Film] of the Examples and Comparative Examples, the sample aged after laminating a 10 μm thick adhesive layer formed on the release treated PET film (thickness 38 μm) to the release treated PET film (thickness 38 μm) Using the above, several adhesive layers were laminated | stacked, and the adhesive sample of thickness 1 隱 was manufactured.

The prepared measurement sample of thickness 1mm was cut into a rectangular shape having a length of 17mm and a width of 5ι. And then DMA (Dynami c Mechani cal Analys is, TA instrument) using a frequency of 1Hz, pre-load force 0.01 N, heating rate The storage modulus of 15 CTC was measured at -30 ^° C at 10 ^° C / min. Table 3 shows the storage modulus _(Pa) of the pressure sensitive adhesive ^at 3 (C and 80 ^° C ₎ .

Experimental Example 2: Adhesive Crosslink Density

After lOum thickness adhesive layer formed on the release-treated PET was laminated to the release-treated PET, 0.5g (a) of the adhesive layer was obtained from the aged sample, and solvent ethyl acetate was obtained.

It was soaked in 200g for 1 day. And, the weight of the solvent containing the pressure-sensitive adhesive layer

After filtering to 200 mesh mesh (c) and dried for 1 hour at 80 ^° C. The weight (b) was measured.

And the crosslinking density was measured by the following formula and shown in Table 3. Crosslinking density (%) = [(weight of adhesive and wire mesh after drying b-weight of wire mesh c) I (initial weight a)] X 100

Experimental Example 3: Adhesion Measurement

After cutting the dicing die-bonding film prepared in Examples and Comparative Examples to a width of 25ι 画, irradiated with ultraviolet light of 300mJ / cm ² (roughness 70n] W / cm ² ) light. To prepare a sample for measuring adhesion.

The prepared sample was measured at a temperature of 180 degrees at room temperature at a speed of 300 kV / s, and the force (gf / 25 i 丽) of peeling the die-bonding film in dicing was measured, and the results are shown in Table 3 below.

Experimental Example 4: Pickup Properties

After peeling off the release film of the dicing die-bonding film prepared in Examples and Comparative Examples, the die-bonding surface was mounted on a mirror wafer (8 inches, thickness 80uni) at a temperature of 60 ^° C and the chip size was 10 腿 X 10 Dicing was performed on the following conditions so that it might become kPa.

Then, the picked-up measurement sample was prepared by irradiating an ultraviolet-ray with a light quantity of 300 mJ / cm ² (roughness 70 mW / cm ² ) to the diced sample on the substrate surface of the dicing film.

Table 3 shows the results of measuring the success rate by using the SPA-400 (SHINKAWA) to prepare the sample under the following conditions.

-Dicing Condition- Equipment ： DFD-650 (DISCO)

Blade type ： 27HEBB (DISC0)

Cutting blade height (cut depth) ： 80 腿

Dicing Speed ： 5 () mm / s

^"Blade revolutions: 40, 000 rpm

—Pick-up condition-Equipment ： SPA-40CKSHINKAWA)

Expanding Height ： 3mm Number of needles ： 10

Needle iunge up height ： 0.2 隱

Needle piunge up speed ： 10mm / s

[Table 3]

As confirmed in Table 3, the adhesive layer of Examples 1 to 5 has a storage modulus of 3.0 * 10 ⁵ to 2: O10 ⁶ at 30 ^° C and a storage modulus of 80 ^° C or higher at 1.O10 ⁵ Pa and 80% at 80 ^° C. It has a cross-linking density of 99% to 99. Thus, when the adhesive layer and the adhesive layer are separated, it is confirmed that damage to the thinned chip does not occur and the pickup property can be improved.

In contrast, the tackifiers of Comparative Examples 1 and 2 confirmed that the crosslinking density of the adhesive was too low (Comparative Example 1) or the storage elastic modulus was too high at 30 ^° C. It became.

Claims

【Patent Claims】

【Claim 11

base film; and an adhesive layer,

The storage modulus of the adhesive layer is 3*10 ⁵ to 4*10 ⁶ Pa at 30 ^° C,

A dicing film wherein the adhesive layer has a crosslinking density of 80% to 99%.

[Claim 2]

In paragraph 1,

A dicing film where the storage elasticity of the adhesive layer is 1.0*10 ⁵ Pa or more at 80 ^° C.

'

[Claim 3]

In clause U,

The adhesive layer is a die-cast film comprising an adhesive resin, a photoinitiator, and a crosslinking agent.

【Claim 4】

In paragraph 3,

The adhesive resin is a dicing film comprising a (meth)acrylate-based resin having a glass transition temperature of -28 ^° C to -58 ^° C.

【Claim 5】

In paragraph 13,

The crosslinking agent is a dicing film comprising at least one compound selected from the group consisting of isocyanate-based compounds, aziridine-based compounds, epoxy-based compounds, and metal chelate-based compounds.

【Claim 6】

In clause 3, ^'

The adhesive layer includes 0.1 to 20 parts by weight of a photoinitiator and 0.1 to 40 parts by weight of ^a crosslinking agent, based on 100 parts by weight of the adhesive resin. A dicing film.

[Claim 7]

In paragraph 1,

The base film includes polyolefin film, polyester film, polycarbonate film, polyvinyl chloride film, polytetrafluoroethylene film, polybutene film, polybutadiene film, vinyl chloride copolymer film, ethylene-vinyl acetate copolymer film, A dicing film, which is a polymer film selected from the group consisting of ethylene-propylene copolymer film and ethylene-alkylacrylate copolymer film.

【Claim 8】

In paragraph 1,

The base film has a thickness of 10 to 200 卿,

The adhesive layer has a thickness of 5 ΐ to 100, a dicing film.

【Claim 9】.

. The dicing film of claim 1; And a dicing die-bonding film comprising an adhesive layer formed on at least one side of the dicing film. ^■

【Claim 10】

In clause 9,

The adhesive layer is a die-bonding film containing a thermoplastic resin, an epoxy resin, and a curing agent.

【Claim 11】

In paragraph 19,

The thermoplastic resins include polyimide, polyether imide, polyester imide, polyamide, polyether sulfone, polyether ketone, polyolefin, polyvinyl chloride, phenoxy, semi-male butadiene acrylonitrile copolymer rubber and (meth)acrylic. A dicing die-bonding film comprising at least one polymer resin selected from the group consisting of rate-based resins. _,

[Claim 12]

In paragraph 9,

The curing agent includes one or more compounds selected from the group consisting of phenolic resins, amine-based curing agents, and acid anhydride-based agents, ^'

Dicing die bonding film.

[Claim 13]

In paragraph 19,

The adhesive layer is a dicing die bonding film comprising 10 to 1,000 parts by weight of the thermoplastic resin and 10 to 700 parts by weight of the curing agent relative to 100 parts by weight of the epoxy resin.

【Claim 14】

In paragraph 19,

'The adhesive layer further includes one or more curing catalysts selected from the group consisting of phosphorus-based compounds, boron-based compounds, phosphorus-boron-based compounds, and imidazole-based compounds.

【Claim 15】

In clause 9,

The adhesive layer has a thickness of 1 to 300, a dicing die bonding film.

【Claim 16】

The dicing die bonding film of clause 9; and a wafer laminated on at least one side of the dicing die bonding film; a pretreatment step of completely dividing or partially processing the semiconductor wafer to enable division;

A dicing method for a semiconductor wafer, comprising the step of irradiating ultraviolet rays to the base film of the pretreated semiconductor wafer and picking up individual chips separated by dividing the semiconductor wafer.