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WO2015076236A1 - Adhesive film for semiconductor bonding - Google Patents

Adhesive film for semiconductor bonding Download PDF

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Publication number
WO2015076236A1
WO2015076236A1 PCT/JP2014/080442 JP2014080442W WO2015076236A1 WO 2015076236 A1 WO2015076236 A1 WO 2015076236A1 JP 2014080442 W JP2014080442 W JP 2014080442W WO 2015076236 A1 WO2015076236 A1 WO 2015076236A1
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WO
WIPO (PCT)
Prior art keywords
adhesive film
wafer
resin
semiconductor bonding
wiring pattern
Prior art date
Application number
PCT/JP2014/080442
Other languages
French (fr)
Japanese (ja)
Inventor
さやか 脇岡
穣 末▲崎▼
江南　俊夫
幸平 竹田
Original Assignee
積水化学工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 積水化学工業株式会社 filed Critical 積水化学工業株式会社
Priority to CN201480056218.7A priority Critical patent/CN105637623B/en
Priority to JP2014557899A priority patent/JP5799180B1/en
Priority to KR1020167009767A priority patent/KR20160088291A/en
Publication of WO2015076236A1 publication Critical patent/WO2015076236A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
    • H01L2223/5446—Located in scribe lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05553—Shape in top view being rectangular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05617—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/05624—Aluminium [Al] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/061—Disposition
    • H01L2224/0612—Layout
    • H01L2224/0613—Square or rectangular array
    • H01L2224/06134—Square or rectangular array covering only portions of the surface to be connected
    • H01L2224/06136—Covering only the central area of the surface to be connected, i.e. central arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area

Definitions

  • the present invention when dicing along a scribe line (dicing line) while being bonded to the wafer surface, peeling is unlikely to occur at the interface with the wafer, particularly at the interface with the wafer having an aluminum wiring pattern on the scribe line.
  • the present invention relates to an adhesive film for semiconductor bonding.
  • FIG. 1 is a top view schematically showing a region of the silicon wafer surface on which scribe lines are formed. As shown in FIG. 1, scribe lines 2 are formed in a lattice shape on the silicon wafer 1, and semiconductor chips 3 are obtained by dicing along the scribe lines 2.
  • the semiconductor chip 3 is provided with a plurality of protruding electrodes 4.
  • An object is to provide an adhesive film for semiconductor bonding.
  • the present invention is an adhesive film for semiconductor bonding to be bonded to a wafer with an aluminum wiring pattern, and (1) the storage elastic modulus at a frequency corresponding to the rotational speed of a dicing blade is 7.5 GPa or less, and / or (2)
  • the dispersion component ( ⁇ sd) in the surface free energy ⁇ of the surface to be bonded to the wafer with the aluminum wiring pattern, measured using two or more kinds of measuring reagents with known surface energy is 30 mJ / m 2 or more. It is an adhesive film.
  • the present invention is described in detail below.
  • the present inventors have (1) a storage elastic modulus at a frequency corresponding to the number of revolutions of a dicing blade and / or (2) a dispersion in surface free energy ⁇ of an adhesive film for semiconductor bonding to be bonded to a wafer with an aluminum wiring pattern.
  • the adhesive film for semiconductor bonding of the present invention is bonded to a wafer with an aluminum wiring pattern.
  • the wafer with the aluminum wiring pattern is not particularly limited, and examples thereof include a wafer made of a semiconductor such as silicon and gallium arsenide, in which scribe lines are formed in a lattice shape, and the aluminum wiring pattern exists on the scribe line. It is done.
  • a semiconductor chip is obtained by dicing such a wafer along a scribe line.
  • the obtained semiconductor chip is preferably provided with a plurality of protruding electrodes made of solder or the like.
  • the adhesive film for semiconductor bonding of the present invention comprises (1) a storage elastic modulus at a frequency corresponding to the number of revolutions of a dicing blade is 7.5 GPa or less, and / or (2) a measuring reagent having a known surface energy.
  • the dispersion component ( ⁇ sd) in the surface free energy ⁇ of the surface to be bonded to the wafer with the aluminum wiring pattern, measured using two or more types, is 30 mJ / m 2 or more.
  • the adhesive film for semiconductor bonding of the present invention may satisfy both of the above (1) and (2), or may satisfy only one of them.
  • the storage elastic modulus at a frequency corresponding to the number of revolutions of the dicing blade in (1) exceeds 7.5 GPa, it is used for semiconductor bonding at the interface with the wafer, particularly at the interface with the wafer where the aluminum wiring pattern exists on the scribe line.
  • the adhesive film is easily peeled off.
  • the storage elastic modulus is preferably 7.4 GPa or less, and more preferably 7.3 GPa or less.
  • the lower limit of the storage elastic modulus is not particularly limited, but dicing in a state where the semiconductor bonding adhesive film is bonded to the wafer surface, and thereafter, the semiconductor chip having the semiconductor bonding adhesive film bonded thereto is thermocompression bonded to a substrate or the like. In view of this, the preferable lower limit is 3.5 GPa, and the more preferable lower limit is 4.0 GPa. If the storage elastic modulus is less than 3.5 GPa, the machinability during dicing may be reduced.
  • the storage elastic modulus at a frequency corresponding to the number of revolutions of the dicing blade in (1) above is measured by frequency dispersion using a dynamic viscoelasticity measuring device (for example, DVA-200 manufactured by IT Measurement Control Co., Ltd.) It can be estimated by creating a master curve at a water temperature during dicing (for example, about 5 to 50 ° C.) and reading the storage elastic modulus at a specific frequency on the master curve.
  • a dynamic viscoelasticity measuring device for example, DVA-200 manufactured by IT Measurement Control Co., Ltd.
  • the frequency corresponding to the rotation speed of the dicing blade is a frequency corresponding to a general rotation speed (unit: rpm) of the dicing blade when performing blade typing with the semiconductor bonding adhesive film bonded to the wafer surface.
  • Unit: rpm a general rotation speed of the dicing blade when performing blade typing with the semiconductor bonding adhesive film bonded to the wafer surface.
  • Hz generally 10,000 to 60000 rpm (167 to 1000 Hz in terms of frequency), and preferably 20000 to 50000 rpm (333 to 833 Hz in terms of frequency).
  • the dispersion component (? Sd) is preferably from 32 mJ / m 2 or more, 35 mJ / m 2 or more is more preferable.
  • the upper limit of the dispersion component ( ⁇ sd) is not particularly limited, but dicing in the state where the adhesive film for semiconductor bonding is bonded to the wafer surface, or thereafter, the semiconductor chip having the adhesive film for semiconductor bonding is heated on the substrate or the like. In consideration of pressure bonding, the preferable upper limit is 55 mJ / m 2 , and the more preferable upper limit is 50 mJ / m 2 .
  • preferable lower limit is 0.01 mJ / m 2
  • a preferred upper limit is 5 mJ / m 2.
  • the polar component ( ⁇ sp) exceeds 0.01 mJ / m 2 or less than 5 mJ / m 2
  • the polarity difference between the adhesive film and aluminum for a semiconductor junction is increased, the interface with the wafer, particularly aluminum wiring on the scribe line
  • the semiconductor bonding adhesive film may be easily peeled off at the interface with the wafer on which the pattern exists.
  • a more preferable lower limit of the polar component ( ⁇ sp) is 0.02 mJ / m 2
  • a more preferable upper limit is 4 mJ / m 2 .
  • the surface free energy ⁇ can be obtained by the sum of the dispersion component ( ⁇ sd) and the polar component ( ⁇ sp).
  • the surface free energy ⁇ is not particularly limited, but a preferred lower limit is 30 mJ / m 2 and a preferred upper limit is 55 mJ / m 2 .
  • the adhesive film for semiconductor bonding may be easily peeled off at the interface with the wafer, particularly at the interface with the wafer having an aluminum wiring pattern on the scribe line.
  • a more preferred lower limit of the surface free energy ⁇ is 35 mJ / m 2, and more preferable upper limit is 50 mJ / m 2.
  • the surface free energy ⁇ , and the dispersion component ( ⁇ sd) and polar component ( ⁇ sp) in the surface free energy ⁇ are surfaces to be bonded to the wafer with an aluminum wiring pattern of the adhesive film for semiconductor bonding using a contact angle meter (
  • the contact angles of two or more kinds of measurement reagents with respect to the solid surface) are measured, and calculated from the obtained contact angles using a geometric average method.
  • the two or more kinds of measurement reagents are not particularly limited as long as the surface energy is known, and examples thereof include water, diiodomethane, bromonaphthalene, and ethylene glycol.
  • the surface free energy and the dispersion component ( ⁇ sd) and polar component ( ⁇ sp) in the surface free energy ⁇ are based on the following formulas (1) to (3). Can be calculated.
  • ⁇ H contact angle of water with solid surface
  • ⁇ I contact angle of diiodomethane with solid surface
  • the adhesive film for semiconductor bonding preferably contains a thermosetting resin, a thermosetting agent and a high molecular weight compound, and may contain an inorganic filler, an additive or the like as required.
  • the content of the liquid component at room temperature (25 ° C.) and the high molecular weight compound having a glass transition temperature (Tg) of 0 ° C. or less is 5 to 15% by weight, or the surface is treated with a silane coupling agent.
  • the liquid component at room temperature may be a thermosetting resin, a thermosetting agent, or a high molecular weight compound, and other components (for example, a diluent, a cup Ring agents, additives such as adhesion promoters, etc.) may be used.
  • thermosetting resin is not specifically limited,
  • cured by reaction such as addition polymerization, polycondensation, polyaddition, addition condensation, ring-opening polymerization
  • the thermosetting resin include urea resin, melamine resin, phenol resin, resorcinol resin, epoxy resin, acrylic resin, polyester resin, polyamide resin, polybenzimidazole resin, diallyl phthalate resin, xylene resin, alkyl -Benzene resin, epoxy acrylate resin, silicon resin, urethane resin and the like.
  • an epoxy resin and an acrylic resin are preferable from a viewpoint of ensuring the intensity
  • the epoxy resin is not particularly limited, and examples thereof include bisphenol type epoxy resins such as bisphenol A type, bisphenol F type, bisphenol AD type and bisphenol S type, novolac type epoxy resins such as phenol novolak type and cresol novolak type, and resorcinol type epoxy.
  • Resin aromatic epoxy resin such as trisphenolmethane triglycidyl ether, naphthalene type epoxy resin, fluorene type epoxy resin, dicyclopentadiene type epoxy resin, polyether modified epoxy resin, NBR modified epoxy resin, CTBN modified epoxy resin, and These hydrogenated products can be mentioned.
  • These epoxy resins may be used independently and may use 2 or more types together.
  • the epoxy resin may be an epoxy resin that is liquid at room temperature, or may be an epoxy resin that is solid at room temperature, or may be used in appropriate combination.
  • commercially available products include, for example, bisphenol A type epoxy resins such as EPICLON 840, 840-S, 850, 850-S, EXA-850CRP (above, manufactured by DIC), EPICLON 830, Bisphenol F type epoxy resins such as 830-S and EXA-830CRP (made by DIC), naphthalene type epoxy resins such as EPICLON HP-4032 and HP-4032D (made by DIC), EPICLON EXA-7015 (DIC) And hydrogenated bisphenol A type epoxy resin such as EX-252 (manufactured by Nagase ChemteX), and resorcinol type epoxy resin such as EX-201 (manufactured by Nagase ChemteX).
  • epoxy resins that are solid at room temperature
  • commercially available products include, for example, bisphenol A type epoxy resins such as EPICLON 860, 10550, 1055 (manufactured by DIC), and bisphenol S such as EPICLON EXA-1514 (manufactured by DIC).
  • Type epoxy resin naphthalene type epoxy resin such as EPICLON HP-4700, HP-4710, HP-4770 (manufactured by DIC), dicyclopentadiene type epoxy resin such as EPICLON HP-7200 series (made by DIC), EPICLON Examples thereof include cresol novolac type epoxy resins such as HP-5000 and EXA-9900 (manufactured by DIC).
  • thermosetting agent is not specifically limited, A conventionally well-known thermosetting agent can be suitably selected according to the said thermosetting resin.
  • the thermosetting agent may be, for example, an acid anhydride curing agent, a phenol curing agent, an amine curing agent, a latent curing agent such as dicyandiamide, or a cationic catalytic curing. Agents and the like. These thermosetting agents may be used independently and may use 2 or more types together. Of these, an acid anhydride curing agent is preferable because of excellent curing speed, physical properties of the cured product, and the like.
  • the content of the thermosetting agent is not particularly limited.
  • the content of the thermosetting agent is for semiconductor bonding.
  • the preferable lower limit with respect to the total amount of epoxy groups contained in the adhesive film is 60 equivalents, and the preferable upper limit is 110 equivalents.
  • the content is less than 60 equivalents, the adhesive film for semiconductor bonding may not be sufficiently cured. Even if the content exceeds 110 equivalents, it does not contribute particularly to the curability of the adhesive film for semiconductor bonding, and may cause voids due to volatilization of an excessive thermosetting agent.
  • the more preferable lower limit of the content is 70 equivalents, and the more preferable upper limit is 100 equivalents.
  • the adhesive film for semiconductor bonding of the present invention may further contain a curing accelerator for the purpose of adjusting the curing speed, the physical properties of the cured product, and the like.
  • the said hardening accelerator is not specifically limited, For example, an imidazole series hardening accelerator, a tertiary amine type hardening accelerator, etc. are mentioned. Of these, an imidazole curing accelerator is preferred because it is easy to control the reaction system for adjusting the curing speed and the physical properties of the cured product.
  • the imidazole curing accelerator is not particularly limited, and examples thereof include Fujicure 7000 (manufactured by T & K TOKA, liquid at room temperature (25 ° C.)), 1-cyanoethyl-2-phenylimidazole in which the 1-position of imidazole is protected with a cyanoethyl group, Imidazole-based curing accelerator with basicity protected with isocyanuric acid (trade name “2MA-OK”, manufactured by Shikoku Kasei Kogyo Co., Ltd., solid at room temperature (25 ° C.)), 2MZ, 2MZ-P, 2PZ, 2PZ-PW, 2P4MZ , C11Z-CNS, 2PZ-CNS, 2PZCNS-PW, 2MZ-A, 2MZA-PW, C11Z-A, 2E4MZ-A, 2MAOK-PW, 2PZ-OK, 2MZ-OK, 2PHZ, 2PHZ-PW
  • Content of the said hardening accelerator is not specifically limited,
  • the preferable minimum with respect to 100 weight part of thermosetting agents is 2 weight part, and a preferable upper limit is 50 weight part.
  • a preferable upper limit is 50 weight part.
  • the content is less than 2 parts by weight, heating for a long time at a high temperature may be required for thermosetting the adhesive film for semiconductor bonding.
  • the content exceeds 50 parts by weight, the storage stability of the adhesive film for semiconductor bonding may be insufficient, or voids may be caused by excessive volatilization of the curing accelerator.
  • a more preferred lower limit of the content is 3 parts by weight, and a more preferred upper limit is 30 parts by weight.
  • the high molecular weight compound is not particularly limited.
  • a high molecular weight compound having an epoxy group is preferable.
  • the cured product of the adhesive film for semiconductor bonding exhibits excellent flexibility. That is, the cured product of the adhesive film for semiconductor bonding is excellent in mechanical strength, heat resistance and moisture resistance derived from the epoxy resin as the thermosetting resin, and excellent in the high molecular weight compound having the epoxy group. Since it combines flexibility, it will be excellent in cold-heat cycle resistance, solder reflow resistance, dimensional stability, etc., and will exhibit high joint reliability and high conduction reliability.
  • the high molecular weight compound having an epoxy group is not particularly limited as long as it is a high molecular weight compound having an epoxy group at the terminal and / or side chain (pendant position).
  • an epoxy group-containing acrylic rubber, an epoxy group-containing butadiene rubber examples thereof include bisphenol type high molecular weight epoxy resin, epoxy group-containing phenoxy resin, epoxy group-containing acrylic resin, epoxy group-containing urethane resin, and epoxy group-containing polyester resin.
  • an epoxy group containing acrylic resin is preferable.
  • These high molecular weight compounds having an epoxy group may be used alone or in combination of two or more.
  • the preferred lower limit of the weight average molecular weight of the high molecular weight compound having the epoxy group is 10,000, and the preferred upper limit is 1,000,000. It is.
  • the weight average molecular weight is less than 10,000, the film forming property of the adhesive film for semiconductor bonding may be insufficient, or the flexibility of the cured product of the adhesive film for semiconductor bonding may not be sufficiently improved.
  • the weight average molecular weight exceeds 1,000,000, the high molecular weight compound may have a reduced solubility in a solvent and a handleability.
  • the preferable lower limit of the epoxy equivalent of the high molecular weight compound having the epoxy group is 200, and the preferable upper limit is 1000. If the epoxy equivalent is less than 200, the flexibility of the cured product of the adhesive film for semiconductor bonding may not be sufficiently improved. If the epoxy equivalent exceeds 1000, the mechanical strength or heat resistance of the cured product of the adhesive film for semiconductor bonding may be insufficient.
  • Content of the said high molecular weight compound in the adhesive film for semiconductor joining of this invention is not specifically limited,
  • the preferable minimum in the adhesive film for semiconductor joining of this invention is 3 weight%, and a preferable upper limit is 30 weight%. If the content is less than 3% by weight, sufficient reliability against thermal strain may not be obtained. When content exceeds 30 weight%, the heat resistance of the adhesive film for semiconductor joining may fall.
  • the adhesive film for semiconductor bonding of the present invention may further contain an inorganic filler.
  • an inorganic filler When an inorganic filler is contained, it is preferable to contain 20 to 60% by weight of an inorganic filler surface-treated with a silane coupling agent. When the content exceeds 60% by weight, the film-forming property of the adhesive film for semiconductor bonding becomes insufficient, the storage elastic modulus at a frequency corresponding to the number of rotations of the dicing blade increases, and it becomes easy to peel off during dicing. There are things to do.
  • the minimum of content of the said inorganic filler in the adhesive film for semiconductor joining of this invention is not specifically limited, From a viewpoint of ensuring the intensity
  • the inorganic filler is not particularly limited, and examples thereof include silica, alumina, aluminum nitride, boron nitride, silicon nitride, silicon carbide, magnesium oxide, and zinc oxide.
  • spherical silica is preferable because of excellent fluidity, and spherical silica surface-treated with a methylsilane coupling agent, a phenylsilane coupling agent, a vinylsilane coupling agent, a methacrylic silane coupling agent, or the like is more preferable.
  • spherical silica surface-treated with a phenylsilane coupling agent is preferable from the viewpoint of controlling the dispersion component ( ⁇ sd) in the surface free energy ⁇ .
  • the average particle diameter of the inorganic filler is not particularly limited, but is preferably about 0.01 to 1 ⁇ m from the viewpoint of transparency, fluidity, bonding reliability, etc. of the adhesive film for semiconductor bonding.
  • the said inorganic filler may be used independently, and may mix and use a multiple types of inorganic filler.
  • the adhesive film for semiconductor bonding of the present invention is further provided with an adhesive imparting agent such as a diluent, a thixotropy imparting agent, a solvent, an inorganic ion exchanger, a bleed inhibitor, and an imidazole silane coupling agent, as necessary.
  • an adhesive imparting agent such as a diluent, a thixotropy imparting agent, a solvent, an inorganic ion exchanger, a bleed inhibitor, and an imidazole silane coupling agent, as necessary.
  • Other additives such as an agent and a stress relaxation agent such as rubber particles may be contained.
  • the thickness of the adhesive film for semiconductor bonding of the present invention is not particularly limited, the preferable lower limit is 5 ⁇ m, the preferable upper limit is 60 ⁇ m, the more preferable lower limit is 10 ⁇ m, and the more preferable upper limit is 50 ⁇ m.
  • the method for producing the adhesive film for semiconductor bonding of the present invention is not particularly limited.
  • a predetermined amount of other additives are blended in a thermosetting resin, a thermosetting agent, and a high molecular weight compound as necessary.
  • examples thereof include a method of coating the obtained resin composition on a release film and drying it to produce a film.
  • the mixing method is not particularly limited, and examples thereof include a method using a homodisper, a universal mixer, a Banbury mixer, a kneader and the like.
  • the adhesive film for semiconductor bonding of the present invention is bonded to a wafer with an aluminum wiring pattern, and is diced along a scribe line (dicing line) while being bonded to the wafer surface. Thereby, the semiconductor chip which affixed the adhesive film for semiconductor joining of this invention is obtained. The obtained semiconductor chip is thermocompression bonded to a substrate or the like with the adhesive film for semiconductor bonding of the present invention.
  • the method for bonding the adhesive film for semiconductor bonding of the present invention to the wafer with an aluminum wiring pattern is not particularly limited, and examples thereof include laminating under normal pressure and vacuum laminating.
  • Air may be involved in lamination under normal pressure, but after bonding, heat in a pressurized atmosphere using a pressure curing oven (eg, PCO-083TA (manufactured by NTT Atvans Technology)).
  • a pressure curing oven eg, PCO-083TA (manufactured by NTT Atvans Technology)
  • the void may be removed.
  • the dicing method is not particularly limited, and examples thereof include conventionally known blade dicing.
  • Example 1 The materials listed in Table 1 were used. According to the composition shown in Table 2, each material was added to methyl ethyl ketone (MEK) as a solvent, and an adhesive solution was produced by stirring and mixing using a homodisper. The obtained adhesive solution was applied onto a release PET film using an applicator so that the thickness after drying was 20 ⁇ m, and dried to produce an adhesive film. Until use, the surface of the obtained adhesive layer was protected with a release PET film (protective film). Using a dynamic viscoelasticity measuring device (DVA-200 manufactured by IT Measurement & Control Co., Ltd.), the step temperature was raised in the temperature range of ⁇ 50 to 130 ° C., and the storage elastic modulus was measured in the frequency dispersion mode.
  • DVA-200 dynamic viscoelasticity measuring device manufactured by IT Measurement & Control Co., Ltd.
  • a contact angle meter KSV CAM200 manufactured by KSV Instruments
  • the contact angle of water and diiodomethane to the surface (solid surface) to be bonded to the wafer with the aluminum wiring pattern of the adhesive film was measured, and from the obtained contact angle.
  • the geometric mean method the surface free energy ⁇ , and the dispersion component ( ⁇ sd) and the polar component ( ⁇ sp) at the surface free energy ⁇ were calculated by the above formulas (1) to (3). 2 ⁇ L of water and 3 ⁇ L of diiodomethane were dropped, and the contact angle after 30 seconds of dropping was measured.
  • Examples 2-7, Comparative Examples 1-2 An adhesive film was obtained in the same manner as in Example 1 except that the composition shown in Table 2 was used.
  • FIG. 2 is a top view schematically illustrating an evaluation method of dicing evaluation using a wafer with an aluminum film.
  • a dicing blade ZH05-SD4800N1-70 manufactured by DISCO
  • a blade rotation speed 40000 rpm
  • a feed rate 20 mm / sec
  • the wafer 1 was diced.
  • the wafer cutting depth was set to 100 ⁇ m.
  • the intersection 6 of the wafer incision line is observed with a microscope at 25 locations, and the adhesive film in contact with the incision line is peeled off 4 points (substantially zero), 2 points (several locations), 0 points (occurrence of many) 3
  • a score was assigned at the level, and the total score was scored (0 to 100 pt).
  • a determination was made as follows. ⁇ : 0 to 30 pt ⁇ : 31-60 pt ⁇ : 61-90 pt A: 91-100 pt
  • Dicing evaluation using a wafer with an aluminum wiring pattern Dicing evaluation was performed using a wafer (12 inch size, thickness 100 ⁇ m) on which an aluminum wiring pattern was formed on a scribe line.
  • An adhesive film was bonded to the entire wafer surface using a vacuum laminator (ATM-812 manufactured by Takatori) at 80 ° C. and a vacuum of 100 Pa, and then a dicing blade (ZH05-SD4800N1-70 manufactured by DISCO) was used.
  • Dicing was performed by fully cutting the wafer along the scribe line at a water temperature of 23 ° C., a blade rotation speed of 40000 rpm, and a feed rate of 20 mm / sec. The presence or absence of peeling of the adhesive film was visually observed, and the case where there was a peeled portion was judged as x, and the case where there was no peeled portion was judged as ⁇ .

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Abstract

The purpose of the present invention is to provide an adhesive film for semiconductor bonding which, when laminated to a wafer surface and diced along a scribe line (dicing line), is less apt to peel off at the interface between the adhesive film and the wafer, in particular, at the interface between the adhesive film and the wafer having an aluminum wiring pattern present on the scribe line. This adhesive film for semiconductor bonding is to be laminated to a wafer having an aluminum wiring pattern formed thereon and has the following feature (1) and/or (2). (1) The adhesive film has a storage modulus of 7.5 GPa or less at a frequency corresponding to the rotation speed of the dicing blade; and (2) the surface of the adhesive film which is to be laminated to the wafer having an aluminum wiring pattern formed thereon has a surface free energy γ when examined using two or more analysis reagents each having a known surface energy, the surface free energy γ including a dispersion component (γsd) of 30 mJ/m2 or greater.

Description

半導体接合用接着フィルムAdhesive film for semiconductor bonding
本発明は、ウエハ表面に貼り合わせた状態でスクライブライン（ダイシングライン）に沿ってダイシングしたとき、ウエハとの界面、特にスクライブライン上にアルミ配線パターンが存在するウエハとの界面で剥離が生じにくい半導体接合用接着フィルムに関する。 In the present invention, when dicing along a scribe line (dicing line) while being bonded to the wafer surface, peeling is unlikely to occur at the interface with the wafer, particularly at the interface with the wafer having an aluminum wiring pattern on the scribe line. The present invention relates to an adhesive film for semiconductor bonding.
近年、ますます進展する半導体装置の小型化、高集積化に対応するために、半田等からなる突起電極（バンプ）を有する半導体チップを用いたフリップチップ実装が注目されている。 2. Description of the Related Art In recent years, flip-chip mounting using a semiconductor chip having bump electrodes made of solder or the like has been attracting attention in order to cope with the further miniaturization and higher integration of semiconductor devices.
フリップチップ実装においては、一般的に、半導体チップの突起電極と、他の半導体チップ又は基板の電極とを接合した後、アンダーフィルを注入して樹脂封止を行う方法が用いられている（例えば、特許文献１）。
しかしながら、近年、半導体チップの小型化が進行するとともに電極間のピッチもますます狭くなっており、また、これらに伴って半導体チップ同士又は半導体チップと基板との間のギャップが狭くなっていることから、アンダーフィルの注入時に空気が巻き込まれ、ボイドが発生しやすくなっている。
そこで、電極接合後にアンダーフィルを注入するのではなく、基板又は半導体チップに予め熱硬化型の接着フィルムを貼り付けておき、加熱により電極接合と接着フィルムの硬化とを同時に行う方法が用いられている（例えば、特許文献２）。 In flip chip mounting, a method is generally used in which a protruding electrode of a semiconductor chip and an electrode of another semiconductor chip or a substrate are joined, and then an underfill is injected to perform resin sealing (for example, Patent Document 1).
However, in recent years, semiconductor chips have been miniaturized, and the pitch between electrodes has been narrowed. In addition, the gap between semiconductor chips or between a semiconductor chip and a substrate has been narrowed. Therefore, air is trapped when the underfill is injected, and voids are easily generated.
Therefore, instead of injecting underfill after electrode bonding, a method is used in which a thermosetting adhesive film is attached in advance to a substrate or a semiconductor chip, and electrode bonding and curing of the adhesive film are simultaneously performed by heating. (For example, Patent Document 2).
半導体チップに予め接着フィルムを貼り付けておく方法として、シリコンウエハ表面に接着フィルムを貼り合わせ、接着フィルムの表面からスクライブライン（ダイシングライン）に沿ってダイシングすることで、接着フィルムを貼り付けた半導体チップを得る方法が用いられている。図１に、スクライブラインが形成されたシリコンウエハ表面の一領域を模式的に示す上面図を示す。図１に示すように、シリコンウエハ１にはスクライブライン２が格子状に形成されており、スクライブライン２に沿ってダイシングすることで半導体チップ３が得られる。半導体チップ３には、複数の突起電極４が設けられている。 As a method of attaching an adhesive film to a semiconductor chip in advance, a semiconductor with an adhesive film attached by bonding the adhesive film to the surface of a silicon wafer and dicing along the scribe line (dicing line) from the surface of the adhesive film. A method of obtaining a chip is used. FIG. 1 is a top view schematically showing a region of the silicon wafer surface on which scribe lines are formed. As shown in FIG. 1, scribe lines 2 are formed in a lattice shape on the silicon wafer 1, and semiconductor chips 3 are obtained by dicing along the scribe lines 2. The semiconductor chip 3 is provided with a plurality of protruding electrodes 4.
しかしながら、接着フィルムの表面からブレードタイシングを行う場合、接着フィルムとシリコンウエハとの界面で剥離が生じることがある。
特に、図１に示すように、スクライブライン２上にアクセサリと呼ばれアライメントマーク等として利用される金属配線パターン５が存在する場合、この部分で特に接着フィルム界面との剥離が生じやすく、剥離による接合信頼性の低下や、剥離した部分にダイシングのくずが混入する等の問題がある。
更に、金属配線パターン５の最表面にアルミニウムが存在する場合、アルミニウムは表面に酸化膜を形成しやすく酸化アルミニウムは密着力が弱いため、このようなアルミ配線パターンと接着フィルムとの界面で剥離が生じやすいことが問題である。 However, when blade typing is performed from the surface of the adhesive film, peeling may occur at the interface between the adhesive film and the silicon wafer.
In particular, as shown in FIG. 1, when a metal wiring pattern 5 called an accessory and used as an alignment mark or the like is present on the scribe line 2, separation from the adhesive film interface is particularly likely to occur at this portion. There are problems such as a decrease in bonding reliability and mixing of dicing waste into the peeled portion.
Further, when aluminum is present on the outermost surface of the metal wiring pattern 5, aluminum easily forms an oxide film on the surface, and aluminum oxide has a weak adhesion. Therefore, peeling occurs at the interface between the aluminum wiring pattern and the adhesive film. The problem is that it tends to occur.
特開２０１０－２７８３３４号公報JP 2010-278334 A 特開２０１１－２９３９２号公報JP 2011-29392 A
本発明は、ウエハ表面に貼り合わせた状態でスクライブライン（ダイシングライン）に沿ってダイシングしたとき、ウエハとの界面、特にスクライブライン上にアルミ配線パターンが存在するウエハとの界面で剥離が生じにくい半導体接合用接着フィルムを提供することを目的とする。 In the present invention, when dicing along a scribe line (dicing line) while being bonded to the wafer surface, peeling is unlikely to occur at the interface with the wafer, particularly at the interface with the wafer having an aluminum wiring pattern on the scribe line. An object is to provide an adhesive film for semiconductor bonding.
本発明は、アルミ配線パターン付きウエハに貼り合わせる半導体接合用接着フィルムであって、（１）ダイシングブレードの回転数に相当する周波数における貯蔵弾性率が７．５ＧＰａ以下であるか、及び／又は、（２）表面エネルギーが既知の測定試薬を２種類以上用いて測定した、アルミ配線パターン付きウエハに貼り合せる面の表面自由エネルギーγにおける分散成分（γｓｄ）が３０ｍＪ／ｍ２以上である半導体接合用接着フィルムである。
以下、本発明を詳述する。 The present invention is an adhesive film for semiconductor bonding to be bonded to a wafer with an aluminum wiring pattern, and (1) the storage elastic modulus at a frequency corresponding to the rotational speed of a dicing blade is 7.5 GPa or less, and / or (2) For semiconductor bonding, wherein the dispersion component (γsd) in the surface free energy γ of the surface to be bonded to the wafer with the aluminum wiring pattern, measured using two or more kinds of measuring reagents with known surface energy, is 30 mJ / m 2 or more. It is an adhesive film.
The present invention is described in detail below.
本発明者らは、アルミ配線パターン付きウエハに貼り合わせる半導体接合用接着フィルムの（１）ダイシングブレードの回転数に相当する周波数における貯蔵弾性率、及び／又は、（２）表面自由エネルギーγにおける分散成分（γｓｄ）を特定範囲に調整することにより、ウエハとの界面、特にスクライブライン上にアルミ配線パターンが存在するウエハとの界面での半導体接合用接着フィルムの剥離を抑制できることを見出し、本発明を完成させるに至った。 The present inventors have (1) a storage elastic modulus at a frequency corresponding to the number of revolutions of a dicing blade and / or (2) a dispersion in surface free energy γ of an adhesive film for semiconductor bonding to be bonded to a wafer with an aluminum wiring pattern. By adjusting the component (γsd) to a specific range, it has been found that peeling of the adhesive film for semiconductor bonding at the interface with the wafer, particularly the interface with the wafer where the aluminum wiring pattern is present on the scribe line, can be suppressed. It came to complete.
本発明の半導体接合用接着フィルムは、アルミ配線パターン付きウエハに貼り合わせるものである。
上記アルミ配線パターン付きウエハは特に限定されず、例えば、シリコン、ガリウム砒素等の半導体からなり、スクライブラインが格子状に形成されており、該スクライブライン上にアルミ配線パターンが存在するウエハ等が挙げられる。このようなウエハをスクライブラインに沿ってダイシングすることで、半導体チップが得られる。得られる半導体チップには、半田等からなる複数の突起電極が設けられていることが好ましい。 The adhesive film for semiconductor bonding of the present invention is bonded to a wafer with an aluminum wiring pattern.
The wafer with the aluminum wiring pattern is not particularly limited, and examples thereof include a wafer made of a semiconductor such as silicon and gallium arsenide, in which scribe lines are formed in a lattice shape, and the aluminum wiring pattern exists on the scribe line. It is done. A semiconductor chip is obtained by dicing such a wafer along a scribe line. The obtained semiconductor chip is preferably provided with a plurality of protruding electrodes made of solder or the like.
本発明の半導体接合用接着フィルムは、（１）ダイシングブレードの回転数に相当する周波数における貯蔵弾性率が７．５ＧＰａ以下であるか、及び／又は、（２）表面エネルギーが既知の測定試薬を２種類以上用いて測定した、アルミ配線パターン付きウエハに貼り合せる面の表面自由エネルギーγにおける分散成分（γｓｄ）が３０ｍＪ／ｍ２以上である。
上記（１）のダイシングブレードの回転数に相当する周波数における貯蔵弾性率、及び／又は、上記（２）の表面自由エネルギーγにおける分散成分（γｓｄ）を上記範囲に調整することにより、ウエハとの界面、特にスクライブライン上にアルミ配線パターンが存在するウエハとの界面での半導体接合用接着フィルムの剥離を抑制することができる。本発明の半導体接合用接着フィルムは、上記（１）及び上記（２）の両方を満たしていたのでもよいし、いずれか一方のみを満たしていたのでもよい。 The adhesive film for semiconductor bonding of the present invention comprises (1) a storage elastic modulus at a frequency corresponding to the number of revolutions of a dicing blade is 7.5 GPa or less, and / or (2) a measuring reagent having a known surface energy. The dispersion component (γsd) in the surface free energy γ of the surface to be bonded to the wafer with the aluminum wiring pattern, measured using two or more types, is 30 mJ / m 2 or more.
By adjusting the storage elastic modulus at a frequency corresponding to the rotational speed of the dicing blade (1) and / or the dispersion component (γsd) in the surface free energy γ (2) to the above range, It is possible to suppress peeling of the adhesive film for semiconductor bonding at the interface, particularly at the interface with the wafer where the aluminum wiring pattern is present on the scribe line. The adhesive film for semiconductor bonding of the present invention may satisfy both of the above (1) and (2), or may satisfy only one of them.
上記（１）のダイシングブレードの回転数に相当する周波数における貯蔵弾性率が７．５ＧＰａを超えると、ウエハとの界面、特にスクライブライン上にアルミ配線パターンが存在するウエハとの界面で半導体接合用接着フィルムが剥離しやすくなる。上記貯蔵弾性率は７．４ＧＰａ以下が好ましく、７．３ＧＰａ以下がより好ましい。
上記貯蔵弾性率の下限は特に限定されないが、ウエハ表面に半導体接合用接着フィルムを貼り合わせた状態でダイシングしたり、その後、半導体接合用接着フィルムを貼り付けた半導体チップを基板等に熱圧着したりすることを考慮すると、好ましい下限は３．５ＧＰａ、より好ましい下限は４．０ＧＰａである。上記貯蔵弾性率が３．５ＧＰａ未満であると、ダイシング時の切削性が低下することがある。 When the storage elastic modulus at a frequency corresponding to the number of revolutions of the dicing blade in (1) exceeds 7.5 GPa, it is used for semiconductor bonding at the interface with the wafer, particularly at the interface with the wafer where the aluminum wiring pattern exists on the scribe line. The adhesive film is easily peeled off. The storage elastic modulus is preferably 7.4 GPa or less, and more preferably 7.3 GPa or less.
The lower limit of the storage elastic modulus is not particularly limited, but dicing in a state where the semiconductor bonding adhesive film is bonded to the wafer surface, and thereafter, the semiconductor chip having the semiconductor bonding adhesive film bonded thereto is thermocompression bonded to a substrate or the like. In view of this, the preferable lower limit is 3.5 GPa, and the more preferable lower limit is 4.0 GPa. If the storage elastic modulus is less than 3.5 GPa, the machinability during dicing may be reduced.
上記（１）のダイシングブレードの回転数に相当する周波数における貯蔵弾性率は、動的粘弾性測定装置（例えば、アイティー計測制御社製のＤＶＡ－２００等）を用いて周波数分散測定を行い、ダイシング時の水温（例えば、５～５０℃程度）におけるマスターカーブを作成し、マスターカーブ上で特定の周波数における貯蔵弾性率を読み取ることによって見積もることができる。
なお、一般的に、粘弾性測定においては、周波数と温度との間に一定の関係がある（温度－時間換算則）ため、例えば、温度の変化を周波数の変化に換算し、一定温度における粘弾性特性の周波数依存性を調べることができる。この方法により、実測不可能な広い周波数域での粘弾性特性を任意の温度における特性として予測することができる。 The storage elastic modulus at a frequency corresponding to the number of revolutions of the dicing blade in (1) above is measured by frequency dispersion using a dynamic viscoelasticity measuring device (for example, DVA-200 manufactured by IT Measurement Control Co., Ltd.) It can be estimated by creating a master curve at a water temperature during dicing (for example, about 5 to 50 ° C.) and reading the storage elastic modulus at a specific frequency on the master curve.
In general, in viscoelasticity measurement, since there is a fixed relationship between frequency and temperature (temperature-time conversion rule), for example, a change in temperature is converted into a change in frequency, and the viscosity at a constant temperature is calculated. The frequency dependence of elastic properties can be examined. By this method, viscoelastic characteristics in a wide frequency range that cannot be measured can be predicted as characteristics at an arbitrary temperature.
上記ダイシングブレードの回転数に相当する周波数とは、ウエハ表面に半導体接合用接着フィルムを貼り合わせた状態でブレードタイシングを行うときのダイシングブレードの一般的な回転数（単位ｒｐｍ）に相当する周波数（単位Ｈｚ）を意味し、一般的には１００００～６００００ｒｐｍ（周波数換算で１６７～１０００Ｈｚ）であり、好ましくは２００００～５００００ｒｐｍ（周波数換算で３３３～８３３Ｈｚ）である。 The frequency corresponding to the rotation speed of the dicing blade is a frequency corresponding to a general rotation speed (unit: rpm) of the dicing blade when performing blade typing with the semiconductor bonding adhesive film bonded to the wafer surface. (Unit: Hz), generally 10,000 to 60000 rpm (167 to 1000 Hz in terms of frequency), and preferably 20000 to 50000 rpm (333 to 833 Hz in terms of frequency).
上記（２）の表面自由エネルギーγにおける分散成分（γｓｄ）が３０ｍＪ／ｍ２未満であると、ウエハとの界面、特にスクライブライン上にアルミ配線パターンが存在するウエハとの界面で半導体接合用接着フィルムが剥離しやすくなる。上記分散成分（γｓｄ）は３２ｍＪ／ｍ２以上が好ましく、３５ｍＪ／ｍ２以上がより好ましい。
上記分散成分（γｓｄ）の上限は特に限定されないが、ウエハ表面に半導体接合用接着フィルムを貼り合わせた状態でダイシングしたり、その後、半導体接合用接着フィルムを貼り付けた半導体チップを基板等に熱圧着したりすることを考慮すると、好ましい上限は５５ｍＪ／ｍ２、より好ましい上限は５０ｍＪ／ｍ２である。 When the dispersion component (γsd) in the surface free energy γ of (2) is less than 30 mJ / m 2 , bonding for semiconductor bonding at the interface with the wafer, particularly at the interface with the wafer having an aluminum wiring pattern on the scribe line. The film becomes easy to peel. The dispersion component (? Sd) is preferably from 32 mJ / m 2 or more, 35 mJ / m 2 or more is more preferable.
The upper limit of the dispersion component (γsd) is not particularly limited, but dicing in the state where the adhesive film for semiconductor bonding is bonded to the wafer surface, or thereafter, the semiconductor chip having the adhesive film for semiconductor bonding is heated on the substrate or the like. In consideration of pressure bonding, the preferable upper limit is 55 mJ / m 2 , and the more preferable upper limit is 50 mJ / m 2 .
また、表面自由エネルギーγにおける極性成分（γｓｐ）は特に限定されないが、好ましい下限が０．０１ｍＪ／ｍ２、好ましい上限が５ｍＪ／ｍ２である。上記極性成分（γｓｐ）が０．０１ｍＪ／ｍ２未満又は５ｍＪ／ｍ２を超えると、半導体接合用接着フィルムとアルミニウムとの極性差が大きくなり、ウエハとの界面、特にスクライブライン上にアルミ配線パターンが存在するウエハとの界面で半導体接合用接着フィルムが剥離しやすくなることがある。上記極性成分（γｓｐ）のより好ましい下限は０．０２ｍＪ／ｍ２、より好ましい上限は４ｍＪ／ｍ２である。 Although not surface polar component in the free energy γ (γsp) particularly limited, preferable lower limit is 0.01 mJ / m 2, a preferred upper limit is 5 mJ / m 2. When the polar component (γsp) exceeds 0.01 mJ / m 2 or less than 5 mJ / m 2, the polarity difference between the adhesive film and aluminum for a semiconductor junction is increased, the interface with the wafer, particularly aluminum wiring on the scribe line The semiconductor bonding adhesive film may be easily peeled off at the interface with the wafer on which the pattern exists. A more preferable lower limit of the polar component (γsp) is 0.02 mJ / m 2 , and a more preferable upper limit is 4 mJ / m 2 .
また、表面自由エネルギーγは、上記分散成分（γｓｄ）と上記極性成分（γｓｐ）との和によって求めることができる。上記表面自由エネルギーγは特に限定されないが、好ましい下限が３０ｍＪ／ｍ２、好ましい上限が５５ｍＪ／ｍ２である。上記表面自由エネルギーγが３０ｍＪ／ｍ２未満であると、ウエハとの界面、特にスクライブライン上にアルミ配線パターンが存在するウエハとの界面で半導体接合用接着フィルムが剥離しやすくなることがある。上記表面自由エネルギーγのより好ましい下限は３５ｍＪ／ｍ２、より好ましい上限は５０ｍＪ／ｍ２である。 Further, the surface free energy γ can be obtained by the sum of the dispersion component (γsd) and the polar component (γsp). The surface free energy γ is not particularly limited, but a preferred lower limit is 30 mJ / m 2 and a preferred upper limit is 55 mJ / m 2 . When the surface free energy γ is less than 30 mJ / m 2 , the adhesive film for semiconductor bonding may be easily peeled off at the interface with the wafer, particularly at the interface with the wafer having an aluminum wiring pattern on the scribe line. A more preferred lower limit of the surface free energy γ is 35 mJ / m 2, and more preferable upper limit is 50 mJ / m 2.
上記表面自由エネルギーγ、並びに、その表面自由エネルギーγにおける分散成分（γｓｄ）及び極性成分（γｓｐ）は、接触角計を用いて、半導体接合用接着フィルムのアルミ配線パターン付きウエハに貼り合せる面（固体表面）に対する２種類以上の測定試薬の接触角を測定し、得られた接触角から、幾何学平均法を使って算出する。
上記２種類以上の測定試薬は、表面エネルギーが既知のものであれば特に限定されず、例えば、水、ジヨードメタン、ブロモナフタレン、エチレングリコール等が挙げられる。例えば、水とジヨードエタンとを測定試薬として用いた場合、表面自由エネルギー、並びに、その表面自由エネルギーγにおける分散成分（γｓｄ）及び極性成分（γｓｐ）は、下記式（１）～（３）に基づき算出することができる。 The surface free energy γ, and the dispersion component (γsd) and polar component (γsp) in the surface free energy γ are surfaces to be bonded to the wafer with an aluminum wiring pattern of the adhesive film for semiconductor bonding using a contact angle meter ( The contact angles of two or more kinds of measurement reagents with respect to the solid surface) are measured, and calculated from the obtained contact angles using a geometric average method.
The two or more kinds of measurement reagents are not particularly limited as long as the surface energy is known, and examples thereof include water, diiodomethane, bromonaphthalene, and ethylene glycol. For example, when water and diiodoethane are used as measurement reagents, the surface free energy and the dispersion component (γsd) and polar component (γsp) in the surface free energy γ are based on the following formulas (1) to (3). Can be calculated.
γ＝γｓｄ＋γｓｐ　　式（１） γ = γsd + γsp Formula (1)
７２．８（１＋ｃｏｓθＨ）＝
２（２１．８×γｓｄ）１／２＋２（５１．０×γｓｐ）１／２　　式（２） 72.8 (1 + cos θ H ) =
2 (21.8 × γsd) 1/2 +2 (51.0 × γsp) 1/2 Equation (2)
５０．８（１＋ｃｏｓθＩ）＝
２（４８．５×γｓｄ）１／２＋２（２．３×γｓｐ）１／２　　式（３） 50.8 (1 + cos θ I ) =
2 (48.5 × γsd) 1/2 +2 (2.3 × γsp) 1/2 Equation (3)
θＨ：固体表面に対する水の接触角
θＩ：固体表面に対するジヨードメタンの接触角 θ H : contact angle of water with solid surface θ I : contact angle of diiodomethane with solid surface
上記（１）のダイシングブレードの回転数に相当する周波数における貯蔵弾性率、及び／又は、上記（２）の表面自由エネルギーγにおける分散成分（γｓｄ）を上記範囲に調整するためには、本発明の半導体接合用接着フィルムは、熱硬化性樹脂、熱硬化剤及び高分子量化合物を含有することが好ましく、必要に応じて無機フィラーや添加剤等を含有してもよい。なかでも、常温（２５℃）で液状の成分とガラス転移温度（Ｔｇ）が０℃以下の高分子量化合物とを合わせた含有量が５～１５重量％であることや、シランカップリング剤で表面処理された無機フィラーを２０～６０重量％含有することが好ましい。
なお、常温（２５℃）で液状の成分は、熱硬化性樹脂であっても、熱硬化剤であっても、高分子量化合物であってもよく、これら以外の成分（例えば、希釈剤、カップリング剤、密着性付与剤等の添加剤等）であってもよい。 In order to adjust the storage elastic modulus at a frequency corresponding to the rotational speed of the dicing blade (1) and / or the dispersion component (γsd) of the surface free energy γ (2) to the above range, the present invention is used. The adhesive film for semiconductor bonding preferably contains a thermosetting resin, a thermosetting agent and a high molecular weight compound, and may contain an inorganic filler, an additive or the like as required. In particular, the content of the liquid component at room temperature (25 ° C.) and the high molecular weight compound having a glass transition temperature (Tg) of 0 ° C. or less is 5 to 15% by weight, or the surface is treated with a silane coupling agent. It is preferable to contain 20 to 60% by weight of the treated inorganic filler.
The liquid component at room temperature (25 ° C.) may be a thermosetting resin, a thermosetting agent, or a high molecular weight compound, and other components (for example, a diluent, a cup Ring agents, additives such as adhesion promoters, etc.) may be used.
上記熱硬化性樹脂は特に限定されず、例えば、付加重合、重縮合、重付加、付加縮合、開環重合等の反応により硬化する化合物が挙げられる。上記熱硬化性樹脂として、具体的には例えば、ユリア樹脂、メラミン樹脂、フェノール樹脂、レゾルシノール樹脂、エポキシ樹脂、アクリル樹脂、ポリエステル樹脂、ポリアミド樹脂、ポリベンズイミダゾール樹脂、ジアリルフタレート樹脂、キシレン樹脂、アルキル－ベンゼン樹脂、エポキシアクリレート樹脂、珪素樹脂、ウレタン樹脂等が挙げられる。なかでも、半導体接合用接着フィルムの硬化物の強度及び接合信頼性を確保する観点から、エポキシ樹脂、アクリル樹脂が好ましい。 The said thermosetting resin is not specifically limited, For example, the compound hardened | cured by reaction, such as addition polymerization, polycondensation, polyaddition, addition condensation, ring-opening polymerization, is mentioned. Specific examples of the thermosetting resin include urea resin, melamine resin, phenol resin, resorcinol resin, epoxy resin, acrylic resin, polyester resin, polyamide resin, polybenzimidazole resin, diallyl phthalate resin, xylene resin, alkyl -Benzene resin, epoxy acrylate resin, silicon resin, urethane resin and the like. Especially, an epoxy resin and an acrylic resin are preferable from a viewpoint of ensuring the intensity | strength and joining reliability of the hardened | cured material of the adhesive film for semiconductor joining.
上記エポキシ樹脂は特に限定されず、例えば、ビスフェノールＡ型、ビスフェノールＦ型、ビスフェノールＡＤ型、ビスフェノールＳ型等のビスフェノール型エポキシ樹脂、フェノールノボラック型、クレゾールノボラック型等のノボラック型エポキシ樹脂、レゾルシノール型エポキシ樹脂、トリスフェノールメタントリグリシジルエーテル等の芳香族エポキシ樹脂、ナフタレン型エポキシ樹脂、フルオレン型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、ポリエーテル変性エポキシ樹脂、ＮＢＲ変性エポキシ樹脂、ＣＴＢＮ変性エポキシ樹脂、及び、これらの水添化物等が挙げられる。これらのエポキシ樹脂は、単独で用いてもよく、２種以上を併用してもよい。 The epoxy resin is not particularly limited, and examples thereof include bisphenol type epoxy resins such as bisphenol A type, bisphenol F type, bisphenol AD type and bisphenol S type, novolac type epoxy resins such as phenol novolak type and cresol novolak type, and resorcinol type epoxy. Resin, aromatic epoxy resin such as trisphenolmethane triglycidyl ether, naphthalene type epoxy resin, fluorene type epoxy resin, dicyclopentadiene type epoxy resin, polyether modified epoxy resin, NBR modified epoxy resin, CTBN modified epoxy resin, and These hydrogenated products can be mentioned. These epoxy resins may be used independently and may use 2 or more types together.
上記エポキシ樹脂は、常温で液状のエポキシ樹脂であっても、常温で固体のエポキシ樹脂であってもよく、これらを適宜組み合わせて用いてもよい。
上記常温で液状のエポキシ樹脂のうち、市販品として、例えば、ＥＰＩＣＬＯＮ　８４０、８４０－Ｓ、８５０、８５０－Ｓ、ＥＸＡ－８５０ＣＲＰ（以上、ＤＩＣ社製）等のビスフェノールＡ型エポキシ樹脂、ＥＰＩＣＬＯＮ　８３０、８３０－Ｓ、ＥＸＡ－８３０ＣＲＰ（以上、ＤＩＣ社製）等のビスフェノールＦ型エポキシ樹脂、ＥＰＩＣＬＯＮ　ＨＰ－４０３２、ＨＰ－４０３２Ｄ（以上、ＤＩＣ社製）等のナフタレン型エポキシ樹脂、ＥＰＩＣＬＯＮ　ＥＸＡ－７０１５（ＤＩＣ社製）、ＥＸ－２５２（ナガセケムテックス社製）等の水添ビスフェノールＡ型エポキシ樹脂、ＥＸ－２０１（ナガセケムテックス社製）等のレゾルシノール型エポキシ樹脂等が挙げられる。 The epoxy resin may be an epoxy resin that is liquid at room temperature, or may be an epoxy resin that is solid at room temperature, or may be used in appropriate combination.
Among the epoxy resins that are liquid at room temperature, commercially available products include, for example, bisphenol A type epoxy resins such as EPICLON 840, 840-S, 850, 850-S, EXA-850CRP (above, manufactured by DIC), EPICLON 830, Bisphenol F type epoxy resins such as 830-S and EXA-830CRP (made by DIC), naphthalene type epoxy resins such as EPICLON HP-4032 and HP-4032D (made by DIC), EPICLON EXA-7015 (DIC) And hydrogenated bisphenol A type epoxy resin such as EX-252 (manufactured by Nagase ChemteX), and resorcinol type epoxy resin such as EX-201 (manufactured by Nagase ChemteX).
上記常温で固体のエポキシ樹脂のうち、市販品として、例えば、ＥＰＩＣＬＯＮ　８６０、１０５５０、１０５５（以上、ＤＩＣ社製）等のビスフェノールＡ型エポキシ樹脂、ＥＰＩＣＬＯＮ　ＥＸＡ－１５１４（ＤＩＣ社製）等のビスフェノールＳ型エポキシ樹脂、ＥＰＩＣＬＯＮ　ＨＰ－４７００、ＨＰ－４７１０、ＨＰ－４７７０（以上、ＤＩＣ社製）等のナフタレン型エポキシ樹脂、ＥＰＩＣＬＯＮ　ＨＰ－７２００シリーズ（ＤＩＣ社製）等のジシクロペンタジエン型エポキシ樹脂、ＥＰＩＣＬＯＮ　ＨＰ－５０００、ＥＸＡ－９９００（以上、ＤＩＣ社製）等のクレゾールノボラック型エポキシ樹脂等が挙げられる。 Among the epoxy resins that are solid at room temperature, commercially available products include, for example, bisphenol A type epoxy resins such as EPICLON 860, 10550, 1055 (manufactured by DIC), and bisphenol S such as EPICLON EXA-1514 (manufactured by DIC). Type epoxy resin, naphthalene type epoxy resin such as EPICLON HP-4700, HP-4710, HP-4770 (manufactured by DIC), dicyclopentadiene type epoxy resin such as EPICLON HP-7200 series (made by DIC), EPICLON Examples thereof include cresol novolac type epoxy resins such as HP-5000 and EXA-9900 (manufactured by DIC).
上記熱硬化剤は特に限定されず、従来公知の熱硬化剤を上記熱硬化性樹脂に合わせて適宜選択することができる。上記熱硬化性樹脂としてエポキシ樹脂を用いる場合、上記熱硬化剤として、例えば、酸無水物系硬化剤、フェノール系硬化剤、アミン系硬化剤、ジシアンジアミド等の潜在性硬化剤、カチオン系触媒型硬化剤等が挙げられる。これらの熱硬化剤は、単独で用いてもよく、２種以上を併用してもよい。なかでも、硬化速度、硬化物の物性等に優れることから、酸無水物系硬化剤が好ましい。 The said thermosetting agent is not specifically limited, A conventionally well-known thermosetting agent can be suitably selected according to the said thermosetting resin. When an epoxy resin is used as the thermosetting resin, the thermosetting agent may be, for example, an acid anhydride curing agent, a phenol curing agent, an amine curing agent, a latent curing agent such as dicyandiamide, or a cationic catalytic curing. Agents and the like. These thermosetting agents may be used independently and may use 2 or more types together. Of these, an acid anhydride curing agent is preferable because of excellent curing speed, physical properties of the cured product, and the like.
上記酸無水物系硬化剤のうち、市販品として、例えば、ＹＨ－３０６、ＹＨ－３０７（以上、三菱化学社製、常温（２５℃）で液状）、ＹＨ－３０９（三菱化学社製、常温（２５℃）で固体）等が挙げられる。 Among the above acid anhydride curing agents, commercially available products include, for example, YH-306, YH-307 (manufactured by Mitsubishi Chemical Corporation, liquid at room temperature (25 ° C.)), YH-309 (manufactured by Mitsubishi Chemical Corporation, room temperature). (Solid at 25 ° C.)).
上記熱硬化剤の含有量は特に限定されず、上記熱硬化性樹脂としてエポキシ樹脂を用い、エポキシ基と等量反応する熱硬化剤を用いる場合、上記熱硬化剤の含有量は、半導体接合用接着フィルム中に含まれるエポキシ基の総量に対する好ましい下限が６０当量、好ましい上限が１１０当量である。含有量が６０当量未満であると、半導体接合用接着フィルムを充分に硬化させることができないことがある。含有量が１１０当量を超えても、特に半導体接合用接着フィルムの硬化性には寄与せず、過剰な熱硬化剤が揮発することによってボイドの原因となることがある。含有量のより好ましい下限は７０当量、より好ましい上限は１００当量である。 The content of the thermosetting agent is not particularly limited. When an epoxy resin is used as the thermosetting resin and a thermosetting agent that reacts with an epoxy group in an equal amount is used, the content of the thermosetting agent is for semiconductor bonding. The preferable lower limit with respect to the total amount of epoxy groups contained in the adhesive film is 60 equivalents, and the preferable upper limit is 110 equivalents. When the content is less than 60 equivalents, the adhesive film for semiconductor bonding may not be sufficiently cured. Even if the content exceeds 110 equivalents, it does not contribute particularly to the curability of the adhesive film for semiconductor bonding, and may cause voids due to volatilization of an excessive thermosetting agent. The more preferable lower limit of the content is 70 equivalents, and the more preferable upper limit is 100 equivalents.
本発明の半導体接合用接着フィルムは、硬化速度、硬化物の物性等を調整する目的で、更に、硬化促進剤を含有してもよい。
上記硬化促進剤は特に限定されず、例えば、イミダゾール系硬化促進剤、３級アミン系硬化促進剤等が挙げられる。なかでも、硬化速度、硬化物の物性等の調整をするための反応系の制御をしやすいことから、イミダゾール系硬化促進剤が好ましい。 The adhesive film for semiconductor bonding of the present invention may further contain a curing accelerator for the purpose of adjusting the curing speed, the physical properties of the cured product, and the like.
The said hardening accelerator is not specifically limited, For example, an imidazole series hardening accelerator, a tertiary amine type hardening accelerator, etc. are mentioned. Of these, an imidazole curing accelerator is preferred because it is easy to control the reaction system for adjusting the curing speed and the physical properties of the cured product.
上記イミダゾール系硬化促進剤は特に限定されず、例えば、フジキュアー７０００（Ｔ＆Ｋ　ＴＯＫＡ社製、常温（２５℃）で液状）、イミダゾールの１位をシアノエチル基で保護した１－シアノエチル－２－フェニルイミダゾール、イソシアヌル酸で塩基性を保護したイミダゾール系硬化促進剤（商品名「２ＭＡ－ＯＫ」、四国化成工業社製、常温（２５℃）で固体）、２ＭＺ、２ＭＺ－Ｐ、２ＰＺ、２ＰＺ－ＰＷ、２Ｐ４ＭＺ、Ｃ１１Ｚ－ＣＮＳ、２ＰＺ－ＣＮＳ、２ＰＺＣＮＳ－ＰＷ、２ＭＺ－Ａ、２ＭＺＡ－ＰＷ、Ｃ１１Ｚ－Ａ、２Ｅ４ＭＺ－Ａ、２ＭＡＯＫ－ＰＷ、２ＰＺ－ＯＫ、２ＭＺ－ＯＫ、２ＰＨＺ、２ＰＨＺ－ＰＷ、２Ｐ４ＭＨＺ、２Ｐ４ＭＨＺ－ＰＷ、２Ｅ４ＭＺ・ＢＩＳ、ＶＴ、ＶＴ－ＯＫ、ＭＡＶＴ、ＭＡＶＴ－ＯＫ（以上、四国化成工業社製）等が挙げられる。これらのイミダゾール系硬化促進剤は、単独で用いてもよく、２種以上を併用してもよい。 The imidazole curing accelerator is not particularly limited, and examples thereof include Fujicure 7000 (manufactured by T & K TOKA, liquid at room temperature (25 ° C.)), 1-cyanoethyl-2-phenylimidazole in which the 1-position of imidazole is protected with a cyanoethyl group, Imidazole-based curing accelerator with basicity protected with isocyanuric acid (trade name “2MA-OK”, manufactured by Shikoku Kasei Kogyo Co., Ltd., solid at room temperature (25 ° C.)), 2MZ, 2MZ-P, 2PZ, 2PZ-PW, 2P4MZ , C11Z-CNS, 2PZ-CNS, 2PZCNS-PW, 2MZ-A, 2MZA-PW, C11Z-A, 2E4MZ-A, 2MAOK-PW, 2PZ-OK, 2MZ-OK, 2PHZ, 2PHZ-PW, 2P4MHZ, 2P4MHZ -PW, 2E4MZ ・ BIS, VT, VT-OK, MAVT, MAVT-O (Or more, Shikoku Chemicals Co., Ltd.), and the like. These imidazole type hardening accelerators may be used independently and may use 2 or more types together.
上記硬化促進剤の含有量は特に限定されず、熱硬化剤１００重量部に対する好ましい下限が２重量部、好ましい上限が５０重量部である。含有量が２重量部未満であると、半導体接合用接着フィルムの熱硬化のために高温で長時間の加熱を必要とすることがある。含有量が５０重量部を超えると、半導体接合用接着フィルムの貯蔵安定性が不充分となったり、過剰な硬化促進剤が揮発することによってボイドの原因となったりすることがある。含有量のより好ましい下限は３重量部、より好ましい上限は３０重量部である。 Content of the said hardening accelerator is not specifically limited, The preferable minimum with respect to 100 weight part of thermosetting agents is 2 weight part, and a preferable upper limit is 50 weight part. When the content is less than 2 parts by weight, heating for a long time at a high temperature may be required for thermosetting the adhesive film for semiconductor bonding. When the content exceeds 50 parts by weight, the storage stability of the adhesive film for semiconductor bonding may be insufficient, or voids may be caused by excessive volatilization of the curing accelerator. A more preferred lower limit of the content is 3 parts by weight, and a more preferred upper limit is 30 parts by weight.
上記高分子量化合物は、特に限定されず、例えば、ユリア樹脂、メラミン樹脂、フェノール樹脂、レゾルシノール樹脂、エポキシ樹脂、アクリル樹脂、ポリエステル樹脂、ポリアミド樹脂、ポリベンズイミダゾール樹脂、ジアリルフタレート樹脂、キシレン樹脂、アルキル－ベンゼン樹脂、エポキシアクリレート樹脂、珪素樹脂、ウレタン樹脂等の公知の高分子量化合物が挙げられる。なかでも、エポキシ基を有する高分子量化合物が好ましい。 The high molecular weight compound is not particularly limited. For example, urea resin, melamine resin, phenol resin, resorcinol resin, epoxy resin, acrylic resin, polyester resin, polyamide resin, polybenzimidazole resin, diallyl phthalate resin, xylene resin, alkyl -Known high molecular weight compounds such as benzene resin, epoxy acrylate resin, silicon resin and urethane resin. Among these, a high molecular weight compound having an epoxy group is preferable.
上記エポキシ基を有する高分子量化合物を添加することで、半導体接合用接着フィルムの硬化物は、優れた可撓性を発現する。即ち、半導体接合用接着フィルムの硬化物は、上記熱硬化性樹脂としてのエポキシ樹脂に由来する優れた機械的強度、耐熱性及び耐湿性と、上記エポキシ基を有する高分子量化合物に由来する優れた可撓性とを兼備することとなるので、耐冷熱サイクル性、耐ハンダリフロー性、寸法安定性等に優れるものとなり、高い接合信頼性及び高い導通信頼性を発現することとなる。 By adding the high molecular weight compound having an epoxy group, the cured product of the adhesive film for semiconductor bonding exhibits excellent flexibility. That is, the cured product of the adhesive film for semiconductor bonding is excellent in mechanical strength, heat resistance and moisture resistance derived from the epoxy resin as the thermosetting resin, and excellent in the high molecular weight compound having the epoxy group. Since it combines flexibility, it will be excellent in cold-heat cycle resistance, solder reflow resistance, dimensional stability, etc., and will exhibit high joint reliability and high conduction reliability.
上記エポキシ基を有する高分子量化合物は、末端及び／又は側鎖（ペンダント位）にエポキシ基を有する高分子量化合物であれば特に限定されず、例えば、エポキシ基含有アクリルゴム、エポキシ基含有ブタジエンゴム、ビスフェノール型高分子量エポキシ樹脂、エポキシ基含有フェノキシ樹脂、エポキシ基含有アクリル樹脂、エポキシ基含有ウレタン樹脂、エポキシ基含有ポリエステル樹脂等が挙げられる。なかでも、エポキシ基を多く含む高分子量化合物を得ることができ、硬化物の機械的強度及び耐熱性がより優れたものとなることから、エポキシ基含有アクリル樹脂が好ましい。これらのエポキシ基を有する高分子量化合物は、単独で用いてもよく、２種以上を併用してもよい。 The high molecular weight compound having an epoxy group is not particularly limited as long as it is a high molecular weight compound having an epoxy group at the terminal and / or side chain (pendant position). For example, an epoxy group-containing acrylic rubber, an epoxy group-containing butadiene rubber, Examples thereof include bisphenol type high molecular weight epoxy resin, epoxy group-containing phenoxy resin, epoxy group-containing acrylic resin, epoxy group-containing urethane resin, and epoxy group-containing polyester resin. Especially, since the high molecular weight compound containing many epoxy groups can be obtained and the mechanical strength and heat resistance of hardened | cured material will become more excellent, an epoxy group containing acrylic resin is preferable. These high molecular weight compounds having an epoxy group may be used alone or in combination of two or more.
上記高分子量化合物として、上記エポキシ基を有する高分子量化合物、特に、エポキシ基含有アクリル樹脂を用いる場合、上記エポキシ基を有する高分子量化合物の重量平均分子量の好ましい下限は１万、好ましい上限は１００万である。重量平均分子量が１万未満であると、半導体接合用接着フィルムの製膜性が不充分となったり、半導体接合用接着フィルムの硬化物の可撓性が充分に向上しなかったりすることがある。重量平均分子量が１００万を超えると、高分子量化合物は、溶媒への溶解性が低下して取扱い性が低下することがある。 When the high molecular weight compound having an epoxy group, particularly an epoxy group-containing acrylic resin is used as the high molecular weight compound, the preferred lower limit of the weight average molecular weight of the high molecular weight compound having the epoxy group is 10,000, and the preferred upper limit is 1,000,000. It is. When the weight average molecular weight is less than 10,000, the film forming property of the adhesive film for semiconductor bonding may be insufficient, or the flexibility of the cured product of the adhesive film for semiconductor bonding may not be sufficiently improved. . When the weight average molecular weight exceeds 1,000,000, the high molecular weight compound may have a reduced solubility in a solvent and a handleability.
上記高分子量化合物として、上記エポキシ基を有する高分子量化合物、特に、エポキシ基含有アクリル樹脂を用いる場合、上記エポキシ基を有する高分子量化合物のエポキシ当量の好ましい下限が２００、好ましい上限が１０００である。エポキシ当量が２００未満であると、半導体接合用接着フィルムの硬化物の可撓性が充分に向上しないことがある。エポキシ当量が１０００を超えると、半導体接合用接着フィルムの硬化物の機械的強度又は耐熱性が不充分となることがある。 When the high molecular weight compound having an epoxy group, particularly an epoxy group-containing acrylic resin is used as the high molecular weight compound, the preferable lower limit of the epoxy equivalent of the high molecular weight compound having the epoxy group is 200, and the preferable upper limit is 1000. If the epoxy equivalent is less than 200, the flexibility of the cured product of the adhesive film for semiconductor bonding may not be sufficiently improved. If the epoxy equivalent exceeds 1000, the mechanical strength or heat resistance of the cured product of the adhesive film for semiconductor bonding may be insufficient.
本発明の半導体接合用接着フィルムにおける上記高分子量化合物の含有量は特に限定されず、本発明の半導体接合用接着フィルムにおける好ましい下限は３重量％、好ましい上限は３０重量％である。含有量が３重量％未満であると、熱ひずみに対する充分な信頼性が得られないことがある。含有量が３０重量％を超えると、半導体接合用接着フィルムの耐熱性が低下することがある。 Content of the said high molecular weight compound in the adhesive film for semiconductor joining of this invention is not specifically limited, The preferable minimum in the adhesive film for semiconductor joining of this invention is 3 weight%, and a preferable upper limit is 30 weight%. If the content is less than 3% by weight, sufficient reliability against thermal strain may not be obtained. When content exceeds 30 weight%, the heat resistance of the adhesive film for semiconductor joining may fall.
本発明の半導体接合用接着フィルムは、更に、無機フィラーを含有してもよい。無機フィラーを含有する場合は、シランカップリング剤で表面処理された無機フィラーを２０～６０重量％含有することが好ましい。含有量が６０重量％を超えると、半導体接合用接着フィルムの製膜性が不充分となったり、ダイシングブレードの回転数に相当する周波数における貯蔵弾性率が高くなり、ダイシング時に剥離しやすくなったりすることがある。本発明の半導体接合用接着フィルムにおける上記無機フィラーの含有量の下限は特に限定されないが、半導体接合用接着フィルムの硬化物の強度及び接合信頼性を確保する観点から、好ましい下限は２０重量％である。 The adhesive film for semiconductor bonding of the present invention may further contain an inorganic filler. When an inorganic filler is contained, it is preferable to contain 20 to 60% by weight of an inorganic filler surface-treated with a silane coupling agent. When the content exceeds 60% by weight, the film-forming property of the adhesive film for semiconductor bonding becomes insufficient, the storage elastic modulus at a frequency corresponding to the number of rotations of the dicing blade increases, and it becomes easy to peel off during dicing. There are things to do. Although the minimum of content of the said inorganic filler in the adhesive film for semiconductor joining of this invention is not specifically limited, From a viewpoint of ensuring the intensity | strength and joining reliability of the hardened | cured material of the adhesive film for semiconductor joining, a preferable minimum is 20 weight%. is there.
上記無機フィラーは特に限定されず、例えば、シリカ、アルミナ、窒化アルミニウム、窒化ホウ素、窒化珪素、炭化珪素、酸化マグネシウム、酸化亜鉛等が挙げられる。なかでも、流動性に優れることから球状シリカが好ましく、メチルシランカップリング剤、フェニルシランカップリング剤、ビニルシランカップリング剤、メタクリルシランカップリング剤等で表面処理された球状シリカがより好ましい。なかでも特に、表面自由エネルギーγにおける分散成分（γｓｄ）を制御する観点で、フェニルシランカップリング剤で表面処理された球状シリカが好ましい。表面処理された球状シリカを用いることで、半導体接合用接着フィルムの製膜性を高めることができるとともに、貯蔵弾性率と表面自由エネルギーとを所定の範囲に調整することができる。 The inorganic filler is not particularly limited, and examples thereof include silica, alumina, aluminum nitride, boron nitride, silicon nitride, silicon carbide, magnesium oxide, and zinc oxide. Among them, spherical silica is preferable because of excellent fluidity, and spherical silica surface-treated with a methylsilane coupling agent, a phenylsilane coupling agent, a vinylsilane coupling agent, a methacrylic silane coupling agent, or the like is more preferable. Especially, spherical silica surface-treated with a phenylsilane coupling agent is preferable from the viewpoint of controlling the dispersion component (γsd) in the surface free energy γ. By using the surface-treated spherical silica, the film forming property of the adhesive film for semiconductor bonding can be improved, and the storage elastic modulus and the surface free energy can be adjusted to a predetermined range.
上記無機フィラーの平均粒子径は特に限定されないが、半導体接合用接着フィルムの透明性、流動性、接合信頼性等の観点から、０．０１～１μｍ程度が好ましい。
上記無機フィラーは単独で使用してもよいし、複数種の無機フィラーを混合して使用してもよい。 The average particle diameter of the inorganic filler is not particularly limited, but is preferably about 0.01 to 1 μm from the viewpoint of transparency, fluidity, bonding reliability, etc. of the adhesive film for semiconductor bonding.
The said inorganic filler may be used independently, and may mix and use a multiple types of inorganic filler.
本発明の半導体接合用接着フィルムは、必要に応じて、更に、希釈剤、チキソトロピー付与剤、溶媒、無機イオン交換体、ブリード防止剤、イミダゾールシランカップリング剤等の接着性付与剤、密着性付与剤、ゴム粒子等の応力緩和剤等のその他の添加剤を含有してもよい。 The adhesive film for semiconductor bonding of the present invention is further provided with an adhesive imparting agent such as a diluent, a thixotropy imparting agent, a solvent, an inorganic ion exchanger, a bleed inhibitor, and an imidazole silane coupling agent, as necessary. Other additives such as an agent and a stress relaxation agent such as rubber particles may be contained.
本発明の半導体接合用接着フィルムの厚みは特に限定されないが、好ましい下限は５μｍ、好ましい上限は６０μｍであり、より好ましい下限は１０μｍ、より好ましい上限は５０μｍである。 Although the thickness of the adhesive film for semiconductor bonding of the present invention is not particularly limited, the preferable lower limit is 5 μm, the preferable upper limit is 60 μm, the more preferable lower limit is 10 μm, and the more preferable upper limit is 50 μm.
本発明の半導体接合用接着フィルムを製造する方法は特に限定されず、例えば、熱硬化性樹脂、熱硬化剤及び高分子量化合物に、必要に応じてその他の添加剤を所定量配合して混合し、得られた樹脂組成物を離型フィルム上に塗工し、乾燥させてフィルムを製造する方法等が挙げられる。上記混合の方法は特に限定されず、例えば、ホモディスパー、万能ミキサー、バンバリーミキサー、ニーダー等を使用する方法が挙げられる。 The method for producing the adhesive film for semiconductor bonding of the present invention is not particularly limited. For example, a predetermined amount of other additives are blended in a thermosetting resin, a thermosetting agent, and a high molecular weight compound as necessary. Examples thereof include a method of coating the obtained resin composition on a release film and drying it to produce a film. The mixing method is not particularly limited, and examples thereof include a method using a homodisper, a universal mixer, a Banbury mixer, a kneader and the like.
本発明の半導体接合用接着フィルムは、アルミ配線パターン付きウエハに貼り合わせるものであり、ウエハ表面に貼り合わせた状態でスクライブライン（ダイシングライン）に沿ってダイシングされる。これにより、本発明の半導体接合用接着フィルムを貼り付けた半導体チップが得られる。得られた半導体チップは、本発明の半導体接合用接着フィルムにより基板等に熱圧着される。
上記アルミ配線パターン付きウエハに本発明の半導体接合用接着フィルムを貼り合わせる方法は特に限定されず、例えば、常圧下でのラミネート、真空ラミネート等が挙げられる。常圧下でのラミネートでは空気が巻き込まれる場合があるが、貼り合わせの後、加圧キュアオーブン（例えば、ＰＣＯ－０８３ＴＡ（ＮＴＴアトバンステクノロジ社製））等を用いて加圧雰囲気下で加熱して、ボイドを除去してもよい。
ダイシングの方法は特に限定されず、例えば、従来公知のブレードダイシング等が挙げられる。 The adhesive film for semiconductor bonding of the present invention is bonded to a wafer with an aluminum wiring pattern, and is diced along a scribe line (dicing line) while being bonded to the wafer surface. Thereby, the semiconductor chip which affixed the adhesive film for semiconductor joining of this invention is obtained. The obtained semiconductor chip is thermocompression bonded to a substrate or the like with the adhesive film for semiconductor bonding of the present invention.
The method for bonding the adhesive film for semiconductor bonding of the present invention to the wafer with an aluminum wiring pattern is not particularly limited, and examples thereof include laminating under normal pressure and vacuum laminating. Air may be involved in lamination under normal pressure, but after bonding, heat in a pressurized atmosphere using a pressure curing oven (eg, PCO-083TA (manufactured by NTT Atvans Technology)). The void may be removed.
The dicing method is not particularly limited, and examples thereof include conventionally known blade dicing.
本発明によれば、ウエハ表面に貼り合わせた状態でスクライブライン（ダイシングライン）に沿ってダイシングしたとき、ウエハとの界面、特にスクライブライン上にアルミ配線パターンが存在するウエハとの界面で剥離が生じにくい半導体接合用接着フィルムを提供することができる。 According to the present invention, when dicing along a scribe line (dicing line) while being bonded to the wafer surface, peeling occurs at the interface with the wafer, particularly with the wafer having an aluminum wiring pattern on the scribe line. It is possible to provide an adhesive film for semiconductor bonding that hardly occurs.
スクライブラインが形成されたシリコンウエハ表面の一領域を模式的に示す上面図である。It is a top view which shows typically one area | region of the silicon wafer surface in which the scribe line was formed. アルミ膜付きウエハを使ったダイシング評価の評価方法を模式的に説明する上面図である。It is a top view which illustrates typically the evaluation method of the dicing evaluation using the wafer with an aluminum film.
以下に実施例を掲げて本発明を更に詳しく説明するが、本発明はこれら実施例のみに限定されない。 Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to these examples.
（実施例１）
表１に記載の材料を用いた。表２に記載の配合組成に従って、各材料を溶媒としてのメチルエチルケトン（ＭＥＫ）に添加し、ホモディスパーを用いて攪拌混合することにより接着剤溶液を製造した。得られた接着剤溶液を、アプリケーターを用いて離型ＰＥＴフィルム上に乾燥後の厚みが２０μｍとなるように塗工し、乾燥することにより、接着フィルムを製造した。使用時まで、得られた接着剤層の表面を離型ＰＥＴフィルム（保護フィルム）で保護した。
動的粘弾性測定装置（アイティー計測制御社製のＤＶＡ－２００）を用いて、－５０～１３０℃の温度範囲でステップ昇温を行い、周波数分散モードで貯蔵弾性率測定を行った。ダイシング時の水温を想定して２３℃におけるマスターカーブを作成し、ダイシングブレードの回転数に相当する周波数として４００００ｒｐｍ／６０＝６６７Ｈｚを採用し、この周波数における貯蔵弾性率を読み取った。
接触角計（ＫＳＶ　Ｉｎｓｔｒｕｍｅｎｔｓ社製のＫＳＶ　ＣＡＭ２００）を用いて、接着フィルムのアルミ配線パターン付きウエハに貼り合せる面（固体表面）に対する水及びジヨードメタンの接触角を測定し、得られた接触角から、幾何学平均法を使って上記式（１）～（３）により表面自由エネルギーγ、並びに、その表面自由エネルギーγにおける分散成分（γｓｄ）及び極性成分（γｓｐ）算出した。なお、水は２μＬ、ジヨードメタンは３μＬ滴下し、滴下３０秒後における接触角を測定した。 Example 1
The materials listed in Table 1 were used. According to the composition shown in Table 2, each material was added to methyl ethyl ketone (MEK) as a solvent, and an adhesive solution was produced by stirring and mixing using a homodisper. The obtained adhesive solution was applied onto a release PET film using an applicator so that the thickness after drying was 20 μm, and dried to produce an adhesive film. Until use, the surface of the obtained adhesive layer was protected with a release PET film (protective film).
Using a dynamic viscoelasticity measuring device (DVA-200 manufactured by IT Measurement & Control Co., Ltd.), the step temperature was raised in the temperature range of −50 to 130 ° C., and the storage elastic modulus was measured in the frequency dispersion mode. A master curve at 23 ° C. was created assuming the water temperature during dicing, and 40000 rpm / 60 = 667 Hz was adopted as the frequency corresponding to the number of revolutions of the dicing blade, and the storage elastic modulus at this frequency was read.
Using a contact angle meter (KSV CAM200 manufactured by KSV Instruments), the contact angle of water and diiodomethane to the surface (solid surface) to be bonded to the wafer with the aluminum wiring pattern of the adhesive film was measured, and from the obtained contact angle, Using the geometric mean method, the surface free energy γ, and the dispersion component (γsd) and the polar component (γsp) at the surface free energy γ were calculated by the above formulas (1) to (3). 2 μL of water and 3 μL of diiodomethane were dropped, and the contact angle after 30 seconds of dropping was measured.
（実施例２～７、比較例１～２）
表２に記載の配合組成としたこと以外は実施例１と同様にして、接着フィルムを得た。 (Examples 2-7, Comparative Examples 1-2)
An adhesive film was obtained in the same manner as in Example 1 except that the composition shown in Table 2 was used.
＜評価＞
実施例、比較例で得られた接着フィルムについて以下の評価を行った。結果を表２に示した。 <Evaluation>
The following evaluation was performed about the adhesive film obtained by the Example and the comparative example. The results are shown in Table 2.
（１）アルミ膜付きウエハを使ったダイシング評価
アルミ膜付きウエハ（８インチサイズ、厚み７２５μｍ）を用意した。アルミ膜は、ウエハ全面に形成されており、熱酸化膜（１０００ű１０％）上にＡｌ－Ｃｕ膜（５０００ű１０％）が形成されたものであった。次いで、真空ラミネーター（タカトリ社製のＡＴＭ－８１２）を用いて８０℃、真空度１００Ｐａでウエハ表面に、５０ｍｍ×５０ｍｍサイズにカットした接着フィルム（厚み２０μｍ）を貼り合わせた。
図２に、アルミ膜付きウエハを使ったダイシング評価の評価方法を模式的に説明する上面図を示す。ダイシングブレード（ＤＩＳＣＯ社製のＺＨ０５－ＳＤ４８００Ｎ１－７０）を用いて、水温２３℃、ブレード回転数４００００ｒｐｍ、送り速度２０ｍｍ／ｓｅｃで、図２に示すように５ｍｍ間隔でＸＹ方向に接着フィルムの表面からウエハ１をダイシングした。このときのウエハの切り込み深さは１００μｍとした。ウエハの切り込みラインの交点６を２５箇所顕微鏡観察し、切り込みラインに接する接着フィルムの剥離の有無について４点（実質的にゼロ）、２点（数箇所あり）、０点（多数発生）の３水準で点数付けを行い、総合得点をポイント（０～１００ｐｔ）とした。以下のとおり○×判定を行った。
×：０～３０ｐｔ
△：３１～６０ｐｔ
○：６１～９０ｐｔ
◎：９１～１００ｐｔ (1) Dicing evaluation using a wafer with an aluminum film A wafer with an aluminum film (8-inch size, thickness 725 μm) was prepared. The aluminum film was formed on the entire surface of the wafer, and an Al—Cu film (5000 ± 10%) was formed on the thermal oxide film (1000 ± 10%). Next, an adhesive film (thickness 20 μm) cut to a size of 50 mm × 50 mm was bonded to the wafer surface at 80 ° C. and a vacuum degree of 100 Pa using a vacuum laminator (ATM-812 manufactured by Takatori).
FIG. 2 is a top view schematically illustrating an evaluation method of dicing evaluation using a wafer with an aluminum film. Using a dicing blade (ZH05-SD4800N1-70 manufactured by DISCO) at a water temperature of 23 ° C., a blade rotation speed of 40000 rpm, and a feed rate of 20 mm / sec, as shown in FIG. The wafer 1 was diced. At this time, the wafer cutting depth was set to 100 μm. The intersection 6 of the wafer incision line is observed with a microscope at 25 locations, and the adhesive film in contact with the incision line is peeled off 4 points (substantially zero), 2 points (several locations), 0 points (occurrence of many) 3 A score was assigned at the level, and the total score was scored (0 to 100 pt). A determination was made as follows.
×: 0 to 30 pt
Δ: 31-60 pt
○: 61-90 pt
A: 91-100 pt
（２）アルミ配線パターン付きウエハを使ったダイシング評価
スクライブライン上にアルミ配線パターンが形成されたウエハ（１２インチサイズ、厚み１００μｍ）を使って、ダイシング評価を行った。真空ラミネーター（タカトリ社製のＡＴＭ－８１２）を用いて８０℃、真空度１００Ｐａでウエハ表面全体に接着フィルムを貼り合わせたのち、ダイシングブレード（ＤＩＳＣＯ社製のＺＨ０５－ＳＤ４８００Ｎ１－７０）を用いて、水温２３℃、ブレード回転数４００００ｒｐｍ、送り速度２０ｍｍ／ｓｅｃで、スクライブラインに沿ってウエハをフルカットしてダイシングを行った。
接着フィルムの剥離の有無を目視にて観察し、剥離箇所のあったものを×、剥離箇所が無かったものを○として判定を行った。 (2) Dicing evaluation using a wafer with an aluminum wiring pattern Dicing evaluation was performed using a wafer (12 inch size, thickness 100 μm) on which an aluminum wiring pattern was formed on a scribe line. An adhesive film was bonded to the entire wafer surface using a vacuum laminator (ATM-812 manufactured by Takatori) at 80 ° C. and a vacuum of 100 Pa, and then a dicing blade (ZH05-SD4800N1-70 manufactured by DISCO) was used. Dicing was performed by fully cutting the wafer along the scribe line at a water temperature of 23 ° C., a blade rotation speed of 40000 rpm, and a feed rate of 20 mm / sec.
The presence or absence of peeling of the adhesive film was visually observed, and the case where there was a peeled portion was judged as x, and the case where there was no peeled portion was judged as ○.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000002
本発明によれば、ウエハ表面に貼り合わせた状態でスクライブライン（ダイシングライン）に沿ってダイシングしたとき、ウエハとの界面、特にスクライブライン上にアルミ配線パターンが存在するウエハとの界面で剥離が生じにくい半導体接合用接着フィルムを提供することができる。 According to the present invention, when dicing along a scribe line (dicing line) while being bonded to the wafer surface, peeling occurs at the interface with the wafer, particularly with the wafer having an aluminum wiring pattern on the scribe line. It is possible to provide an adhesive film for semiconductor bonding that hardly occurs.
１　シリコンウエハ
２　スクライブライン
３　半導体チップ
４　突起電極
５　金属配線パターン
６　切り込みラインの交点 1 Silicon wafer 2 Scribe line 3 Semiconductor chip 4 Protruding electrode 5 Metal wiring pattern 6 Intersection of cut line

Claims (1)

  1. アルミ配線パターン付きウエハに貼り合わせる半導体接合用接着フィルムであって、
    （１）ダイシングブレードの回転数に相当する周波数における貯蔵弾性率が７．５ＧＰａ以下であるか、及び／又は、
    （２）表面エネルギーが既知の測定試薬を２種類以上用いて測定した、アルミ配線パターン付きウエハに貼り合せる面の表面自由エネルギーγにおける分散成分（γｓｄ）が３０ｍＪ／ｍ２以上である
    ことを特徴とする半導体接合用接着フィルム。     An adhesive film for semiconductor bonding to be bonded to a wafer with an aluminum wiring pattern,
    (1) The storage elastic modulus at a frequency corresponding to the rotational speed of the dicing blade is 7.5 GPa or less, and / or
    (2) The dispersion component (γsd) in the surface free energy γ of the surface to be bonded to the wafer with the aluminum wiring pattern, measured using two or more kinds of measuring reagents with known surface energy, is 30 mJ / m 2 or more. An adhesive film for semiconductor bonding.
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017038922A1 (en) * 2015-09-01 2017-03-09 リンテック株式会社 Adhesive sheet
JP2017059648A (en) * 2015-09-16 2017-03-23 古河電気工業株式会社 Film for semiconductor back surface
KR20190118566A (en) * 2017-02-28 2019-10-18 린텍 가부시키가이샤 Adhesive sheet
JP2020178013A (en) * 2019-04-17 2020-10-29 日東電工株式会社 Dicing die bond film
CN112980366A (en) * 2019-12-18 2021-06-18 日东电工株式会社 Chip bonding sheet and dicing chip bonding film
JP2023146653A (en) * 2022-03-29 2023-10-12 リンテック株式会社 Gas barrier laminate

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7479243B2 (en) 2020-08-14 2024-05-08 株式会社ディスコ How the chip is manufactured

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007148724A1 (en) * 2006-06-23 2007-12-27 Hitachi Chemical Company, Ltd. Production method of semiconductor device and bonding film
JP2012059769A (en) * 2010-09-06 2012-03-22 Nitto Denko Corp Film for semiconductor device and semiconductor device
JP2012177084A (en) * 2011-01-31 2012-09-13 Dainippon Printing Co Ltd Heat-resistant temporary adhesive composition and heat-resistant temporary adhesive tape
JP2013209559A (en) * 2012-03-30 2013-10-10 Furukawa Electric Co Ltd:The Ultraviolet light curable adhesive tape for processing semiconductor device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7829441B2 (en) * 2007-03-01 2010-11-09 Nitto Denko Corporation Thermosetting die-bonding film
JP2009124096A (en) * 2007-10-23 2009-06-04 Hitachi Chem Co Ltd Pressure-sensitive adhesive sheet
JP4939574B2 (en) * 2008-08-28 2012-05-30 日東電工株式会社 Thermosetting die bond film
JP2010278334A (en) 2009-05-29 2010-12-09 Elpida Memory Inc Semiconductor device
JP5577640B2 (en) 2009-07-24 2014-08-27 日立化成株式会社 Manufacturing method of semiconductor device
JP2012033637A (en) * 2010-07-29 2012-02-16 Nitto Denko Corp Dicing tape integrated semiconductor rear face film, and method of manufacturing semiconductor device
JP4865926B1 (en) * 2011-06-24 2012-02-01 古河電気工業株式会社 Wafer processing tape

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007148724A1 (en) * 2006-06-23 2007-12-27 Hitachi Chemical Company, Ltd. Production method of semiconductor device and bonding film
JP2012059769A (en) * 2010-09-06 2012-03-22 Nitto Denko Corp Film for semiconductor device and semiconductor device
JP2012177084A (en) * 2011-01-31 2012-09-13 Dainippon Printing Co Ltd Heat-resistant temporary adhesive composition and heat-resistant temporary adhesive tape
JP2013209559A (en) * 2012-03-30 2013-10-10 Furukawa Electric Co Ltd:The Ultraviolet light curable adhesive tape for processing semiconductor device

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017038922A1 (en) * 2015-09-01 2017-03-09 リンテック株式会社 Adhesive sheet
JPWO2017038922A1 (en) * 2015-09-01 2018-06-14 リンテック株式会社 Adhesive sheet
JP2017059648A (en) * 2015-09-16 2017-03-23 古河電気工業株式会社 Film for semiconductor back surface
WO2017047183A1 (en) * 2015-09-16 2017-03-23 古河電気工業株式会社 Film for back surface of semiconductor
KR20170048251A (en) * 2015-09-16 2017-05-08 후루카와 덴키 고교 가부시키가이샤 Film for semiconductor backside
KR101870066B1 (en) 2015-09-16 2018-06-22 후루카와 덴키 고교 가부시키가이샤 Film for semiconductor backside
KR20190118566A (en) * 2017-02-28 2019-10-18 린텍 가부시키가이샤 Adhesive sheet
KR102661574B1 (en) 2017-02-28 2024-04-26 린텍 가부시키가이샤 adhesive sheet
JP2020178013A (en) * 2019-04-17 2020-10-29 日東電工株式会社 Dicing die bond film
CN112980366A (en) * 2019-12-18 2021-06-18 日东电工株式会社 Chip bonding sheet and dicing chip bonding film
JP2021097156A (en) * 2019-12-18 2021-06-24 日東電工株式会社 Die bond sheet and dicing die bond film
JP7539769B2 (en) 2019-12-18 2024-08-26 日東電工株式会社 Die bond sheet and dicing die bond film
CN112980366B (en) * 2019-12-18 2024-12-10 日东电工株式会社 Die bonding sheet and dicing die bonding film
JP2023146653A (en) * 2022-03-29 2023-10-12 リンテック株式会社 Gas barrier laminate
JP7447179B2 (en) 2022-03-29 2024-03-11 リンテック株式会社 Gas barrier laminate

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