WO2015059944A1

WO2015059944A1 - Sheet for forming resin film

Info

Publication number: WO2015059944A1
Application number: PCT/JP2014/060298
Authority: WO
Inventors: 久保田　新; 幸範村上; 野村　秀一
Original assignee: リンテック株式会社
Priority date: 2013-10-21
Filing date: 2014-04-09
Publication date: 2015-04-30
Also published as: TW201515852A; TWI623432B; KR102171423B1; JPWO2015059944A1; CN107364191A; CN105658422B; JP6369996B2; CN105658422A; KR20160075510A

Abstract

The present invention addresses the problem of providing a sheet for forming a resin film, said sheet being such a sheet that the occurrence of winding marks in a resin-film-forming layer in winding the sheet into a roll can be suppressed. This sheet for forming a resin film is a sheet which is obtained by laminating a support sheet, a resin-film-forming layer, and a release film in this order and in which the thickness of the release film is 50μm or more.

Description

Resin film forming sheet

The present invention relates to a resin film forming sheet capable of efficiently forming a resin film having high adhesive strength on a chip and capable of manufacturing a highly reliable semiconductor device.

A semiconductor wafer manufactured in a large diameter state is sometimes cut and separated (diced) into element pieces (semiconductor chips) and then transferred to a bonding process which is the next process. At this time, the semiconductor wafer is subjected to dicing, cleaning, drying, expanding, and pick-up processes in a state of being adhered to the adhesive sheet in advance, and then transferred to the next bonding process.

Among these processes, various dicing / die bonding adhesive sheets having both a wafer fixing function and a die bonding function have been proposed in order to simplify the pick-up process and the bonding process. For example, by using the adhesive sheet, it is possible to obtain a semiconductor chip having an adhesive layer attached to the back surface, and direct die bonding such as between an organic substrate and a chip, between a lead frame and a chip, and between a chip and a chip is possible. It becomes.

Patent Document 1 (Japanese Patent Application Laid-Open No. 2005-350520) describes an adhesive sheet having a structure in which a release substrate, an adhesive layer, an adhesive layer, and a substrate film are sequentially laminated as an adhesive sheet for dicing and die bonding. ing.

In recent years, semiconductor devices have been manufactured using a so-called “face-down” mounting method. In the face-down method, a semiconductor chip (hereinafter simply referred to as “chip”) having electrodes such as bumps on a circuit surface is used, and the electrodes are bonded to a substrate. For this reason, the surface (chip back surface) opposite to the circuit surface of the chip may be exposed.

The exposed chip back surface may be protected by an organic film. Conventionally, a chip having a protective film made of an organic film is obtained by applying a liquid resin to the back surface of a wafer by spin coating, drying and curing, and cutting the protective film together with the wafer. However, since the thickness accuracy of the protective film formed in this way is not sufficient, the product yield may be lowered.

In order to solve the above problem, Patent Document 2 (Japanese Patent Laid-Open No. 2012-33557) discloses that a dicing tape with an adhesive layer in which an adhesive layer is formed on a dicing tape has the adhesive layer as a bonding surface. Thus, there is described a film for manufacturing a semiconductor device laminated on a separator at a predetermined interval.

JP 2005-350520 A JP 2012-33557 A

The resin film forming sheet described in Patent Document 1 or Patent Document 2 and used for obtaining a chip with an adhesive layer or a protective film is wound in a roll shape until it is used after its manufacture. It may be stored in the state. When the release film (release substrate or separator) does not have a sufficient thickness, when the resin film forming sheet is rolled up, the thickness on the resin film forming sheet is not uniform on the adhesive layer or the protective film. In some cases, a winding mark that may be caused by a level difference in the portion occurred.

When the adhesive layer has a winding mark, the thickness accuracy of the adhesive layer is reduced, air biting when the adhesive layer is stuck to the wafer, and the semiconductor chip through the adhesive layer (substrate or other parts). In some cases, the adhesiveness may be deteriorated or voids may be generated. As a result, it has been difficult to obtain a semiconductor device having excellent reliability.

In addition, when a winding mark is generated in the protective film, it may cause a defective appearance in addition to the above.

The present invention has been made in view of the prior art as described above. That is, the subject of this invention is providing the sheet | seat for resin film formation which can suppress that a winding mark generate | occur | produces in a resin film formation layer when winding in roll shape.

The present invention includes the following gist.
[1] A support sheet, a resin film forming layer, and a release film are laminated in this order,
A sheet for forming a resin film, wherein the release film has a thickness of 50 μm or more.

[2] In the release film, a cut portion is formed along the outer periphery of the resin film forming layer from the surface on the resin film forming layer side,
The sheet for forming a resin film according to [1], wherein the cut depth of the cut portion is 1/2 or more of the thickness of the release film.

[3] The diameter of the support sheet is larger than the diameter of the resin film forming layer,
In the release film, a cut portion is formed along the outer periphery of the support sheet from the surface on the support sheet side,
The notch depth of the notch part formed along the outer periphery of the resin film forming layer is not less than the notch depth of the notch part formed along the outer periphery of the support sheet. Sheet.

[4] The sheet for forming a resin film according to [3], wherein a cut depth of a cut portion formed along the outer periphery of the support sheet is 3/5 or less of the thickness of the release film.

According to the resin film forming sheet of the present invention, it is possible to prevent the occurrence of winding marks in the resin film forming layer even if the sheet is wound in a roll shape.

The top view of the sheet | seat for resin film formation concerning this invention is shown. FIG. 2 shows a schematic cross-sectional view (the resin film forming sheet of the first embodiment) when the resin film forming sheet shown in FIG. 1 is cut along the line AA. The sheet | seat for resin film formation of a 2nd aspect is shown. The sheet | seat for resin film formation of a 3rd aspect is shown. The sheet | seat for resin film formation of a 4th aspect is shown. FIG. 4 is a series of process diagrams for performing an operation of attaching a laminated body including a support sheet 11 and a resin film forming layer 12 to a semiconductor wafer 32. FIG. 4 is a series of process diagrams for performing an operation of attaching a laminated body including a support sheet 11 and a resin film forming layer 12 to a semiconductor wafer 32. FIG. 4 is a series of process diagrams for performing an operation of attaching a laminated body including a support sheet 11 and a resin film forming layer 12 to a semiconductor wafer 32. FIG. 4 is a series of process diagrams for performing an operation of attaching a laminated body including a support sheet 11 and a resin film forming layer 12 to a semiconductor wafer 32. FIG. 11 is a series of process diagrams for performing a conventional operation of attaching a laminated body including a support sheet and a resin film forming layer to a semiconductor wafer 32.

Hereinafter, details of the resin film-forming sheet of the present invention will be described.

FIG. 1 is a plan view showing a first embodiment of a resin film-forming sheet 10 of the present invention, and FIG. 2 shows a case where the resin film-forming sheet 10 shown in FIG. 1 is cut along the line AA. FIG. As shown in FIGS. 1 and 2, the resin film forming sheet 10 of the present invention has a configuration in which a support sheet 11, a resin film forming layer 12, and a release film 13 are sequentially laminated.

Further, the support sheet 11 and the resin film forming layer 12 are cut into a desired planar shape and are partially laminated on the release film 13. Here, the desired planar shape of the laminate comprising the support sheet 11 and the resin film forming layer 12 is not particularly limited as long as the laminate is partially laminated on the release film 13. Is preferably a shape that matches the planar shape of a workpiece such as a semiconductor wafer, for example, a circle, a substantially circle, a quadrangle, a pentagon, a hexagon, an octagon, or a wafer shape (a part of the outer periphery of the circle is a straight line). The shape is preferably a shape that can be easily attached to a semiconductor wafer. Among these, a circular shape or a wafer shape is preferable in order to reduce useless portions other than the portion attached to the semiconductor wafer.

(Peeling film)
The thickness of the release film is 50 μm or more, preferably 50 to 200 μm. When the release film is less than 50 μm, when the resin film-forming sheet is wound into a roll, winding marks are generated in the resin film-forming layer. When a winding mark is generated in the resin film forming layer, the thickness accuracy of the resin film forming layer is reduced, and the semiconductor chip is resinated in air biting when the resin film forming layer is attached to the wafer or in a semiconductor device manufacturing method described later. This may cause a decrease in adhesiveness or void generation when bonded to a chip mounting portion (substrate, other chip, or the like) through the film forming layer. As a result, it becomes difficult to obtain a semiconductor device having excellent reliability. In addition, when the resin film forming layer is used as a protective film for protecting the back surface of the chip, the traces of the resin film forming layer cause an appearance defect in addition to the above.
In the sheet for forming a resin film of the present invention, the above problem can be solved by setting the thickness of the release film within the above range.

The release film serves as a carrier film when the resin film-forming sheet is used. For example, a polyethylene film, a polypropylene film, a polybutene film, a polybutadiene film, a polymethylpentene film, a polyvinyl chloride film, and a vinyl chloride film are used. Polymer film, polyethylene terephthalate film, polyethylene naphthalate film, polybutylene terephthalate film, polyurethane film, ethylene vinyl acetate copolymer film, ionomer resin film, ethylene / (meth) acrylic acid copolymer film, ethylene / (meth) An acrylic ester copolymer film, a polystyrene film, a polycarbonate film, a polyimide film, a fluororesin film, or the like is used. These crosslinked films are also used. Furthermore, these laminated films may be sufficient.

The surface tension of the surface of the release film in contact with the resin film forming layer is preferably 40 mN / m or less, more preferably 37 mN / m or less, and particularly preferably 35 mN / m or less. The lower limit is usually about 25 mN / m. Such a release film having a relatively low surface tension can be obtained by appropriately selecting the material, and can also be obtained by applying a release agent to the surface of the release film and performing a release treatment. .

As the release agent used for the release treatment, alkyd, silicone, fluorine, unsaturated polyester, polyolefin, wax, and the like are used. In particular, alkyd, silicone, and fluorine release agents are heat resistant. This is preferable.

In order to release the surface of a film or the like as a base of a release film using the above release agent, the release agent is used without any solvent, or diluted or emulsified with a solvent, and then a gravure coater, Mayer bar coater, air knife coater. The release sheet coated with a release coater may be applied at room temperature or under heating, or may be cured with an electron beam to form a release agent layer.

Also, the surface tension of the release film may be adjusted by laminating the film by wet lamination, dry lamination, hot melt lamination, melt extrusion lamination, coextrusion processing, or the like. That is, a film in which the surface tension of at least one surface is within a preferable range as the surface in contact with the resin film forming layer of the release film described above is set so that the surface is in contact with the resin film forming layer. It is good also as a peeling film by manufacturing the laminated body laminated | stacked with this film.

(Resin film forming layer)
At least the functions required for the resin film-forming layer are (1) sheet shape maintenance, (2) initial adhesiveness, and (3) curability.

The resin film forming layer can be provided with (1) sheet shape maintaining property and (3) curability by adding a binder component. As the binder component, the polymer component (A) and the curable component (B). Or a second binder component containing a curable polymer component (AB) having the properties of the component (A) and the component (B).
In addition, it is a function for temporarily adhering the resin film forming layer to the work until curing. (2) The initial adhesiveness may be pressure-sensitive adhesiveness, and is a property of being softened and bonded by heat. It may be. (2) The initial adhesiveness is usually controlled by adjusting various properties of the binder component and adjusting the blending amount of the inorganic filler (C) described later.

(First binder component)
A 1st binder component provides a sheet | seat shape maintenance property and sclerosis | hardenability to a resin film formation layer by containing a polymer component (A) and a sclerosing | hardenable component (B). In addition, the 1st binder component does not contain a curable polymer component (AB) for the convenience of distinguishing from a 2nd binder component.

(A) Polymer component The polymer component (A) is added to the resin film forming layer mainly for the purpose of imparting sheet shape maintenance to the resin film forming layer.
In order to achieve the above object, the weight average molecular weight (Mw) of the polymer component (A) is usually 20,000 or more, preferably 20,000 to 3,000,000. The value of the weight average molecular weight (Mw) is a value when measured by a gel permeation chromatography method (GPC) method (polystyrene standard). The measurement by such a method is carried out, for example, by using a high-speed GPC apparatus “HLC-8120GPC” manufactured by Tosoh Corporation and a high-speed column “TSK gold column H _XL- H”, “TSK Gel GMH _XL ”, “TSK Gel G2000 H _XL ”. (The above, all manufactured by Tosoh Corporation) are connected in this order, and the detector is used as a differential refractometer at a column temperature of 40 ° C. and a liquid feed rate of 1.0 mL / min.
In addition, for convenience to distinguish from the curable polymer (AB) described later, the polymer component (A) does not have a curing functional functional group described later.

As the polymer component (A), an acrylic polymer, polyester, phenoxy resin (for the purpose of distinguishing from the curable polymer (AB) described later, limited to those having no epoxy group), polycarbonate, polyether, polyurethane Polysiloxane, rubber polymer, etc. can be used. Further, it is an acrylic urethane resin obtained by reacting a urethane prepolymer having an isocyanate group at a molecular terminal with an acrylic polyol which is an acrylic polymer having a hydroxyl group, which is a combination of two or more of these. May be. Furthermore, two or more of these may be used in combination, including a polymer in which two or more are bonded.

(A1) As the acrylic polymer polymer component (A), acrylic polymer (A1) is preferably used. The glass transition temperature (Tg) of the acrylic polymer (A1) is preferably in the range of −60 to 50 ° C., more preferably −50 to 40 ° C., and further preferably −40 to 30 ° C. If the glass transition temperature of the acrylic polymer (A1) is high, the adhesiveness of the resin film forming layer is lowered, and transfer to the workpiece becomes impossible, or the resin film forming layer or the resin film forming layer is cured from the workpiece after transfer. Problems such as peeling of the resulting resin film may occur. In addition, when the glass transition temperature of the acrylic polymer (A1) is low, the peeling force between the resin film forming layer and the support sheet is increased, and transfer failure of the resin film forming layer may occur.

The weight average molecular weight of the acrylic polymer (A1) is preferably 100,000 to 1,500,000. When the weight average molecular weight of the acrylic polymer (A1) is high, the adhesiveness of the resin film forming layer is lowered, and transfer to the workpiece becomes impossible, or the resin film forming layer or the resin film peels off from the workpiece after transfer. May occur. Further, when the weight average molecular weight of the acrylic polymer (A1) is low, the adhesiveness between the resin film forming layer and the support sheet is increased, and transfer failure of the resin film forming layer may occur.

The acrylic polymer (A1) contains (meth) acrylic acid ester in at least a constituent monomer.
Examples of (meth) acrylic acid esters include alkyl (meth) acrylates having an alkyl group having 1 to 18 carbon atoms, specifically methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl ( (Meth) acrylate, 2-ethylhexyl (meth) acrylate, etc .; (meth) acrylate having a cyclic skeleton, specifically cycloalkyl (meth) acrylate, benzyl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentanyl ( Examples include meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, and imide (meth) acrylate. Moreover, what is (meth) acrylic acid ester can be illustrated among what is illustrated as a monomer which has a hydroxyl group mentioned later, a monomer which has a carboxyl group, and a monomer which has an amino group.

In addition, in this specification, (meth) acryl may be used in the meaning including both acryl and methacryl.

As the monomer constituting the acrylic polymer (A1), a monomer having a hydroxyl group may be used. When such a monomer is used, when a hydroxyl group is introduced into the acrylic polymer (A1) and the resin film forming layer additionally contains an energy ray-curable component (B2), this and the acrylic polymer Compatibility with (A1) is improved. Examples of the monomer having a hydroxyl group include (meth) acrylic acid ester having a hydroxyl group such as 2-hydroxylethyl (meth) acrylate and 2-hydroxypropyl (meth) acrylate; N-methylol (meth) acrylamide and the like.

As the monomer constituting the acrylic polymer (A1), a monomer having a carboxyl group may be used. When such a monomer is used, a carboxyl group is introduced into the acrylic polymer (A1), and the resin film forming layer additionally contains an energy ray curable component (B2). Compatibility with the polymer (A1) is improved. Examples of the monomer having a carboxyl group include (meth) acrylic acid esters having a carboxyl group such as 2- (meth) acryloyloxyethyl phthalate and 2- (meth) acryloyloxypropyl phthalate; Maleic acid, fumaric acid, itaconic acid and the like can be mentioned. When using an epoxy-based thermosetting component as the curable component (B) described below, the carboxyl group and the epoxy group in the epoxy-based thermosetting component react with each other. The amount used is preferably small.

As a monomer constituting the acrylic polymer (A1), a monomer having an amino group may be used. Examples of such a monomer include (meth) acrylic acid esters having an amino group such as monoethylamino (meth) acrylate.

As the monomer constituting the acrylic polymer (A1), vinyl acetate, styrene, ethylene, α-olefin and the like may be used.

The acrylic polymer (A1) may be cross-linked. Crosslinking is performed by adding a crosslinking agent to the composition for forming the resin film-forming layer in which the acrylic polymer (A1) before being crosslinked has a crosslinkable functional group such as a hydroxyl group. This is carried out by the reaction of the functional group with the functional group of the crosslinking agent. By crosslinking the acrylic polymer (A1), the cohesive force of the resin film forming layer can be adjusted.

Examples of the crosslinking agent include organic polyvalent isocyanate compounds and organic polyvalent imine compounds.

Examples of organic polyvalent isocyanate compounds include aromatic polyvalent isocyanate compounds, aliphatic polyvalent isocyanate compounds, alicyclic polyvalent isocyanate compounds, trimers of these organic polyvalent isocyanate compounds, and these organic polyvalent isocyanate compounds. Examples thereof include terminal isocyanate urethane prepolymers obtained by reacting with a polyol compound.

Specific examples of the organic polyvalent isocyanate compound include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane-4,4′-. Diisocyanate, diphenylmethane-2,4′-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4′-diisocyanate, dicyclohexylmethane-2,4′-diisocyanate, lysine isocyanate, and these Examples thereof include polyhydric alcohol adducts.

Specific examples of organic polyvalent imine compounds include N, N′-diphenylmethane-4,4′-bis (1-aziridinecarboxamide), trimethylolpropane-tri-β-aziridinylpropionate, tetramethylol. Mention may be made of methane-tri-β-aziridinylpropionate and N, N′-toluene-2,4-bis (1-aziridinecarboxamide) triethylenemelamine.

The crosslinking agent is usually 0.01 to 20 parts by weight, preferably 0.1 to 10 parts by weight, more preferably 0.5 to 5 parts by weight with respect to 100 parts by weight of the acrylic polymer (A1) before crosslinking. Used in ratio.

In the present invention, when the content of the component constituting the resin film forming layer is determined based on the content of the polymer component (A), the polymer component (A) is a crosslinked acrylic polymer. In some cases, the reference content is the content of the acrylic polymer before being crosslinked.

(A2) Non-acrylic resin In addition, as the polymer component (A), polyester, phenoxy resin (for the purpose of distinguishing from the curable polymer (AB) described later, limited to those having no epoxy group), polycarbonate, poly One type of non-acrylic resin (A2) selected from ethers, polyurethanes, polysiloxanes, rubber polymers, or a combination of two or more of these may be used, or a combination of two or more types. Such a resin preferably has a weight average molecular weight of 20,000 to 100,000, more preferably 20,000 to 80,000.

The glass transition temperature of the non-acrylic resin (A2) is preferably in the range of −30 to 150 ° C., more preferably in the range of −20 to 120 ° C.

When the non-acrylic resin (A2) is used in combination with the above-mentioned acrylic polymer (A1), when the resin film forming layer is transferred to the workpiece using the resin film forming sheet, the support sheet and the resin film are used. Delamination with the forming layer can be easily performed, and furthermore, the resin film forming layer can follow the transfer surface, and generation of voids and the like can be suppressed.

When the non-acrylic resin (A2) is used in combination with the above-mentioned acrylic polymer (A1), the content of the non-acrylic resin (A2) is such that the non-acrylic resin (A2) and the acrylic polymer ( The mass ratio (A2: A1) to A1) is usually in the range of 1:99 to 60:40, preferably 1:99 to 30:70. When the content of the non-acrylic resin (A2) is in this range, the above effect can be obtained.

(B) Curable component The curable component (B) is added to the resin film forming layer mainly for the purpose of imparting curability to the resin film forming layer. As the curable component (B), a thermosetting component (B1) or an energy beam curable component (B2) can be used. Moreover, you may use combining these. The thermosetting component (B1) contains at least a compound having a functional group that reacts by heating. The energy ray-curable component (B2) contains a compound (B21) having a functional group that reacts by irradiation with energy rays, and is polymerized and cured when irradiated with energy rays such as ultraviolet rays and electron beams. Curing is realized by the functional groups of these curable components reacting to form a three-dimensional network structure. Since the curable component (B) is used in combination with the polymer component (A), from the viewpoint of suppressing the viscosity of the coating composition for forming the resin film-forming layer and improving the handleability, etc. Usually, its weight average molecular weight (Mw) is 10,000 or less, preferably 100 to 10,000.

(B1) Thermosetting component As the thermosetting component, for example, an epoxy thermosetting component is preferable.
The epoxy thermosetting component preferably contains a compound (B11) having an epoxy group and a combination of a compound (B11) having an epoxy group and a thermosetting agent (B12).

(B11) Compound having an epoxy group As the compound (B11) having an epoxy group (hereinafter sometimes referred to as “epoxy compound (B11)”), a conventionally known compound can be used. Specifically, polyfunctional epoxy resin, bisphenol A diglycidyl ether and its hydrogenated product, orthocresol novolac epoxy resin, dicyclopentadiene type epoxy resin, biphenyl type epoxy resin, bisphenol A type epoxy resin, bisphenol F type Examples thereof include epoxy compounds having two or more functional groups in the molecule, such as epoxy resins and phenylene skeleton type epoxy resins. These can be used individually by 1 type or in combination of 2 or more types.

When the epoxy compound (B11) is used, the resin film forming layer preferably contains 1 to 1500 parts by mass of the epoxy compound (B11), more preferably 100 parts by mass of the polymer component (A). Is contained in an amount of 3 to 1200 parts by mass. When there are few epoxy compounds (B11), there exists a tendency for the adhesiveness after hardening of a resin film formation layer to fall. Moreover, when there are many epoxy compounds (B11), the peeling force of a resin film formation layer and a support sheet will become high, and the transfer defect of a resin film formation layer may arise.

(B12) Thermosetting agent The thermosetting agent (B12) functions as a curing agent for the epoxy compound (B11). A preferable thermosetting agent includes a compound having two or more functional groups capable of reacting with an epoxy group in one molecule. Examples of the functional group include a phenolic hydroxyl group, an alcoholic hydroxyl group, an amino group, a carboxyl group, and an acid anhydride. Of these, phenolic hydroxyl groups, amino groups, acid anhydrides and the like are preferable, and phenolic hydroxyl groups and amino groups are more preferable.

Specific examples of the phenolic curing agent include polyfunctional phenolic resin, biphenol, novolac type phenolic resin, dicyclopentadiene type phenolic resin, zylock type phenolic resin, and aralkylphenolic resin.
A specific example of the amine curing agent is DICY (dicyandiamide).
These can be used individually by 1 type or in mixture of 2 or more types.

The content of the thermosetting agent (B12) is preferably 0.1 to 500 parts by mass and more preferably 1 to 200 parts by mass with respect to 100 parts by mass of the epoxy compound (B11). When there is little content of a thermosetting agent, there exists a tendency for the adhesiveness after hardening to fall.

(B13) Curing accelerator A curing accelerator (B13) may be used to adjust the thermosetting speed of the resin film-forming layer. The curing accelerator (B13) is particularly preferably used when an epoxy thermosetting component is used as the thermosetting component (B1).

Preferred curing accelerators include tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol; 2-methylimidazole, 2-phenylimidazole, 2-phenyl- Imidazoles such as 4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole and 2-phenyl-4-methyl-5-hydroxymethylimidazole; Organic phosphines such as tributylphosphine, diphenylphosphine and triphenylphosphine; And tetraphenylboron salts such as tetraphenylphosphonium tetraphenylborate and triphenylphosphinetetraphenylborate. These can be used individually by 1 type or in mixture of 2 or more types.

The curing accelerator (B13) is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 1 part by mass with respect to 100 parts by mass of the total amount of the epoxy compound (B11) and the thermosetting agent (B12). Included in the amount of. By containing the curing accelerator (B13) in an amount within the above range, it has excellent adhesiveness even when exposed to high temperatures and high humidity, and has high reliability even when exposed to severe reflow conditions. Can be achieved. By adding the curing accelerator (B13), the adhesiveness of the resin film forming layer after curing can be improved. Such an action becomes stronger as the content of the curing accelerator (B13) increases.

(B2) Energy ray-curable component The resin film-forming layer contains the energy-ray-curable component, so that the resin film-forming layer can be cured without performing a heat curing step that requires a large amount of energy and a long time. . Thereby, the manufacturing cost can be reduced.
As the energy ray-curable component, the compound (B21) having a functional group that reacts by irradiation with energy rays may be used alone, but the compound (B21) having a functional group that reacts by irradiation with energy rays and a photopolymerization initiator ( It is preferable to use a combination of B22).

(B21) Compound having a functional group that reacts upon irradiation with energy rays Compound (B21) having a functional group that reacts upon irradiation with energy rays (hereinafter sometimes referred to as “energy ray-reactive compound (B21)”) Specifically, trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, 1,4-butylene glycol diacrylate, 1,6-hexanediol diacrylate Examples include acrylate compounds such as acrylates, oligoester acrylates, urethane acrylate oligomers, epoxy acrylates, polyether acrylates, and esters. A acrylate compound having a polymerizable structure acrylate compounds such as Con acid oligomer include those of relatively low molecular weight. Such a compound has at least one polymerizable double bond in the molecule.

When the energy ray reactive compound (B21) is used, the resin film forming layer preferably contains 1 to 1500 parts by mass of the energy ray reactive compound (B21) with respect to 100 parts by mass of the polymer component (A). More preferably, it is contained in an amount of 3 to 1200 parts by mass.

(B22) By combining the photopolymerization initiator energy beam reactive compound (B21) with the photopolymerization initiator (B22), the polymerization curing time can be shortened and the amount of light irradiation can be reduced.

Specific examples of such a photopolymerization initiator (B22) include benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin methyl benzoate, and benzoin dimethyl ketal. 2,4-diethylthioxanthone, α-hydroxycyclohexyl phenyl ketone, benzyldiphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, benzyl, dibenzyl, diacetyl, 1,2-diphenylmethane, 2-hydroxy- 2-methyl-1- [4- (1-methylvinyl) phenyl] propanone, 2,4,6-trimethylbenzoyldiphenylphosphine oxide and Such as β- crawl anthraquinone, and the like. A photoinitiator (B22) can be used individually by 1 type or in combination of 2 or more types.

The blending ratio of the photopolymerization initiator (B22) is preferably 0.1 to 10 parts by mass and more preferably 1 to 5 parts by mass with respect to 100 parts by mass of the energy ray reactive compound (B21). .
If the blending ratio of the photopolymerization initiator (B22) is less than 0.1 parts by mass, sufficient curability may not be obtained due to insufficient photopolymerization, and if it exceeds 10 parts by mass, the residue does not contribute to photopolymerization. May cause a malfunction.

(Second binder component)
A 2nd binder component provides sheet shape maintenance property and curability to a resin film formation layer by containing a curable polymer component (AB).

(AB) Curable polymer component The curable polymer component is a polymer having a functional functional group. The curing functional group is a functional group that can react with each other to form a three-dimensional network structure, and examples thereof include a functional group that reacts by heating and a functional group that reacts by energy rays.
The functional functional group may be added to the unit of a continuous structure that becomes the skeleton of the curable polymer (AB) or may be added to the terminal. When the functional functional group is added in the unit of the continuous structure that becomes the skeleton of the curable polymer component (AB), the functional functional group may be added to the side chain or directly to the main chain. You may do it. The weight average molecular weight (Mw) of the curable polymer component (AB) is usually 20,000 or more from the viewpoint of achieving the purpose of imparting sheet shape maintainability to the resin film-forming layer.

An example of a functional group that reacts by heating is an epoxy group. Examples of the curable polymer component (AB) having an epoxy group include a high molecular weight epoxy group-containing compound and a phenoxy resin having an epoxy group. High molecular weight epoxy group-containing compounds are disclosed, for example, in JP-A No. 2001-261789.
Moreover, it is a polymer similar to the above-mentioned acrylic polymer (A1), which is polymerized using a monomer having an epoxy group as a monomer (epoxy group-containing acrylic polymer). Also good. Examples of the monomer having an epoxy group include (meth) acrylic acid esters having a glycidyl group such as glycidyl (meth) acrylate.
When an epoxy group-containing acrylic polymer is used, its preferred embodiment is the same as that of the acrylic polymer (A1) except for the epoxy group.

When the curable polymer component (AB) having an epoxy group is used, the thermosetting agent (B12) or the curing accelerator (B13) is used as in the case of using an epoxy thermosetting component as the curable component (B). ) May be used in combination.

Examples of the functional group that reacts with energy rays include a (meth) acryloyl group. As the curable polymer component (AB) having a functional group that reacts with energy rays, an acrylate compound having a polymer structure such as polyether acrylate, and the like having a high molecular weight can be used.
In addition, for example, a raw material polymer having a functional group X such as a hydroxyl group in a side chain, a functional group Y that can react with the functional group X (for example, an isocyanate group when the functional group X is a hydroxyl group) and energy beam irradiation Alternatively, a polymer prepared by reacting a low molecular compound having a functional group that reacts with the above may be used.
In this case, when the raw material polymer corresponds to the above-mentioned acrylic polymer (A1), the preferred mode of the raw material polymer is the same as that of the acrylic polymer (A1).

When the curable polymer component (AB) having a functional group that reacts with energy rays is used, the photopolymerization initiator (B22) may be used in the same manner as when the energy ray curable component (B2) is used. .

The second binder component may contain the above-described polymer component (A) and curable component (B) in combination with the curable polymer component (AB).

In addition to the binder component, the resin film forming layer may contain the following components.

(C) The inorganic filler resin film forming layer may contain an inorganic filler (C). By blending the inorganic filler (C) into the resin film forming layer, it becomes possible to adjust the thermal expansion coefficient of the cured resin film, and to optimize the thermal expansion coefficient of the cured resin film with respect to the workpiece. As a result, the reliability of the semiconductor device can be improved. It is also possible to reduce the hygroscopicity of the cured resin film.
In addition, when the resin film obtained by curing the resin film forming layer in the present invention is made to function as a protective film for a workpiece or a chip obtained by separating a workpiece, laser light is applied to the protective film by applying laser marking. The inorganic filler (C) is exposed at the portion scraped off by the above, and the reflected light diffuses to exhibit a color close to white. Therefore, when the resin film forming layer contains a colorant (D) described later, there is an effect that a contrast difference is obtained between the laser marking portion and other portions, and the printing becomes clear.

Preferred inorganic fillers include powders of silica, alumina, talc, calcium carbonate, titanium oxide, iron oxide, silicon carbide, boron nitride, and the like, beads formed by spheroidizing these, single crystal fibers, glass fibers, and the like. Among these, silica filler and alumina filler are preferable. The said inorganic filler (C) can be used individually or in mixture of 2 or more types.
The range of the content of the inorganic filler (C) for obtaining the above-mentioned effect more reliably is preferably 1 to 80 parts by mass with respect to 100 parts by mass of the total solid content constituting the resin film forming layer. The amount is preferably 20 to 75 parts by mass, particularly preferably 40 to 70 parts by mass.

(D) Colorant (D) can be mix | blended with a colorant resin film formation layer. By blending the colorant, malfunction of the semiconductor device due to infrared rays or the like generated from surrounding devices when the semiconductor device is incorporated into equipment can be prevented. Further, when the resin film is engraved by means such as laser marking, there is an effect that marks such as characters and symbols can be easily recognized. That is, in a semiconductor device or semiconductor chip on which a resin film is formed, the product number or the like is usually printed on the surface of the resin film by a laser marking method (a method in which the surface of the protective film is scraped off and printed). By containing the colorant (D), a sufficient difference in contrast between the portion of the resin film scraped by the laser beam and the portion not removed is obtained, and the visibility is improved.

As the colorant, organic or inorganic pigments and dyes are used. Among these, black pigments are preferable from the viewpoint of electromagnetic wave and infrared shielding properties. Examples of the black pigment include carbon black, iron oxide, manganese dioxide, aniline black, activated carbon, and the like, but are not limited thereto. Carbon black is particularly preferable from the viewpoint of increasing the reliability of the semiconductor device. A coloring agent (D) may be used individually by 1 type, and may be used in combination of 2 or more type.
The blending amount of the colorant (D) is preferably 0.1 to 35 parts by mass, more preferably 0.5 to 25 parts by mass, particularly preferably 100 parts by mass of the total solid content constituting the resin film forming layer. Is 1 to 15 parts by mass.

(E) Coupling agent A coupling agent (E) having a functional group that reacts with an inorganic substance and a functional group that reacts with an organic functional group is bonded to the work of the resin film forming layer, adhesion and / or aggregation of the resin film. It may be used to improve the property. Moreover, the water resistance can be improved by using a coupling agent (E), without impairing the heat resistance of the resin film obtained by hardening | curing a resin film formation layer. Examples of such coupling agents include titanate coupling agents, aluminate coupling agents, silane coupling agents, and the like. Of these, silane coupling agents are preferred.

As the silane coupling agent, the functional group that reacts with the organic functional group is a group that reacts with the functional group of the polymer component (A), the curable component (B), the curable polymer component (AB), and the like. Some silane coupling agents are preferably used.
Such silane coupling agents include γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ- (methacryloxy). Propyl) trimethoxysilane, γ-aminopropyltrimethoxysilane, N-6- (aminoethyl) -γ-aminopropyltrimethoxysilane, N-6- (aminoethyl) -γ-aminopropylmethyldiethoxysilane, N -Phenyl-γ-aminopropyltrimethoxysilane, γ-ureidopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, bis (3-triethoxysilylpropyl) tetrasulfane, methyltri Methoxysilane , Methyltriethoxysilane, vinyltrimethoxysilane, vinyltriacetoxysilane, and imidazolesilane. These can be used individually by 1 type or in mixture of 2 or more types.

The silane coupling agent is usually 0.1 to 20 parts by weight, preferably 0.8 parts per 100 parts by weight in total of the polymer component (A), the curable component (B) and the curable polymer component (AB). 2 to 10 parts by mass, more preferably 0.3 to 5 parts by mass. If the content of the silane coupling agent is less than 0.1 parts by mass, the above effect may not be obtained, and if it exceeds 20 parts by mass, it may cause outgassing.

(F) In addition to the above, various additives may be blended in the general-purpose additive resin film forming layer as necessary. Examples of various additives include leveling agents, plasticizers, antistatic agents, antioxidants, ion scavengers, gettering agents, chain transfer agents, release agents, and the like.

The resin film-forming layer is obtained, for example, using a composition (composition for forming a resin film) obtained by mixing the above-described components at an appropriate ratio. The resin film forming composition may be diluted with a solvent in advance, or may be added to the solvent during mixing. Moreover, you may dilute with a solvent at the time of use of the composition for resin film formation.
Examples of such a solvent include ethyl acetate, methyl acetate, diethyl ether, dimethyl ether, acetone, methyl ethyl ketone, acetonitrile, hexane, cyclohexane, toluene, heptane and the like.

The resin film forming layer has initial adhesiveness and curability, and in an uncured state, the resin film forming layer is easily adhered by being pressed against the workpiece at room temperature or under heating. Moreover, you may heat a resin film formation layer, when pressing. Then, after curing, a resin film having high impact resistance can be provided, the adhesive strength is excellent, and sufficient reliability can be maintained even under severe high temperature and high humidity conditions. The resin film forming layer may have a single layer structure or a multilayer structure.

The thickness of the resin film forming layer is preferably 1 to 100 μm, more preferably 2 to 90 μm, and particularly preferably 3 to 80 μm. By setting the thickness of the resin film forming layer in the above range, the resin film forming layer functions as a highly reliable protective film or adhesive.

(Support sheet)
The resin film forming layer as described above is detachably laminated on the support sheet.

As the support sheet, the same film as the above-mentioned release film can be used. Moreover, as shown in FIG. 3, an adhesive sheet can also be used as a support sheet.

FIG. 3 is a schematic cross-sectional view of the resin film forming sheet 10 of the second embodiment. When the workpiece is subjected to required processing such as dicing on the resin film forming sheet, an adhesive sheet in which an adhesive layer 11b is formed on a substrate 11a is used as the support sheet 11 as shown in FIG. be able to. In this embodiment, the resin film forming layer 12 is laminated on the pressure-sensitive adhesive layer 11 b provided on the support sheet 11. Examples of the base material 11a of the pressure-sensitive adhesive sheet include the above-described film exemplified as a release sheet. The pressure-sensitive adhesive layer 11b may be a weakly-adhesive layer having an adhesive strength that can peel the resin film-forming layer, or an energy-beam curable one that decreases in adhesive strength when irradiated with energy rays. May be.

The pressure-sensitive adhesive layer 11b includes various conventionally known pressure-sensitive adhesives (for example, rubber-based, acrylic-based, silicone-based, urethane-based, vinyl ether-based general-purpose pressure-sensitive adhesives, surface uneven pressure-sensitive adhesives, energy ray-curable pressure-sensitive adhesives). , Thermal expansion component-containing pressure-sensitive adhesive, etc.).
When the resin film forming sheet is configured as described above, the adhesion between the support sheet and the resin film forming layer is improved when the resin film forming sheet functions as a dicing sheet for supporting a workpiece in the dicing process. Thus, the effect of suppressing the chip with the resin film forming layer from peeling off from the support sheet in the dicing step can be obtained. When the resin film forming sheet functions as a dicing sheet for supporting the workpiece in the dicing process, there is no need to dice by dicing the dicing sheet separately on the workpiece with the resin film forming layer in the dicing process. The manufacturing process can be simplified.

In the resin film forming sheet, after removing the release film, the resin film forming layer is affixed to various workpieces, and in some cases, the workpiece is subjected to necessary processing such as dicing. Then, the support film is peeled off while the resin film forming layer remains fixed to the workpiece. That is, it is used in a process including a step of transferring a resin film forming layer from a support sheet to a workpiece.

The workpiece applicable in the present invention is not limited to the material, and examples thereof include various articles such as a semiconductor wafer, a glass substrate, a ceramic substrate, an organic material substrate such as an FPC, or a metal material such as precision parts. .

The resin film forming layer as described above can function as a film adhesive for fixing a chip obtained by separating a workpiece to a substrate or another chip. Such film adhesives are frequently used in the die bonding process of chips in recent years. The film-like adhesive is preferably formed from a resin film-forming composition containing an epoxy thermosetting component, and is formed on the support sheet so as to be peelable. can get.

Also, the resin film forming sheet of the present invention may be a dicing / die-bonding sheet having both a work fixing function during dicing and a die bonding function during die bonding. In this case, by making the film adhesive into a property having adhesiveness, or a property that can be applied to a work by being softened by heating, it is possible to hold the work or a chip obtained by separating the work in the dicing process. . And it functions as an adhesive for fixing the chip during die bonding. Hereinafter, the film-like adhesive that is a constituent element of the resin film-forming sheet is also referred to as an adhesive layer. The adhesive layer is cut together with the workpiece at the time of dicing, and an adhesive layer having the same shape as the cut chip is formed. When the chip is picked up after the dicing is completed, the adhesive layer is peeled off from the support sheet together with the chip. A chip with an adhesive layer is placed on a mounting portion such as a substrate or another chip, and heated to bond the chip and the chip mounting portion via the adhesive layer. Such a dicing / die-bonding sheet is formed by forming an adhesive layer having a work fixing function and a die bonding function on a support sheet.

Further, the resin film forming layer of the sheet for forming a resin film of the present invention may function as a protective film for a workpiece or a chip obtained by separating the workpiece. In this case, for example, a work is attached to the resin film forming layer, the resin film forming layer is cured to form a resin film, and then the work and the resin film are diced to obtain a chip having a resin film that functions as a protective film. . A sheet for forming such a protective film has an adhesive resin film-forming layer serving as a protective film on the support sheet. The resin film forming layer serving as the protective film contains, for example, a binder component (the first binder component and / or the second binder component), and an inorganic filler (C), a colorant (D), and the like as necessary. May be included.

As shown in FIGS. 2 and 3, in the resin film forming sheet 10, the release film 13 has a cut portion D <b> 1 along the outer periphery of the resin film forming layer 12 from the surface on the resin film forming layer side. It is formed and it is preferable that the cutting depth d1 of the cutting part D1 is 1/2 or more of the thickness of a peeling film.

If the thickness of the release film is 50 μm or more in order to prevent winding marks generated in the resin film formation layer when the resin film forming sheet is wound in a roll shape, the release film tends to be stiff and difficult to bend. is there. In general, the stiffness of the resin film forming layer tends to be weaker than that of the release film. Therefore, in the process of sticking such a resin film forming sheet to a workpiece, the peel plate 64 shown in FIG. 6 is applied to the release film 13 of the resin film forming sheet, and the release film 13 is formed at an acute angle toward the peel plate 64 side. If it is not bent, it may be difficult to create a peeling start point at the interface between the resin film forming layer and the peeling film, and the resin film forming layer may not be fed out. However, a release film of 50 μm or more is difficult to bend at an acute angle toward the peel plate 64 due to its thickness, and as shown in FIG. 7, it is difficult to feed out the resin film forming layer.

In the present invention, the above-mentioned problem is solved by forming the cut portion D1 in the release film 13 and setting the cut depth d1 of the cut portion D1 to ½ or more of the thickness of the release film. That is, as shown in FIG. 6 (b), even with a release film of 50 μm or more, it becomes possible to bend the release film at an acute angle starting from the cut portion D1, and at the interface between the resin film forming layer and the release film. It becomes easy to create a peeling start point.

Further, when the cut portion D1 having a predetermined depth is formed in the release film 13, the resin film forming layer can be reliably cut into a predetermined shape together with the support sheet. Further, by forming the cut portion D1 having a predetermined depth in the release film 13, even when the thickness of the release film is 50 μm or more, the resin film forming sheet can be easily wound into a roll shape, and can be stored during storage. Excellent.

Furthermore, in the process of attaching the resin film forming sheet to the workpiece shown in FIG. 6, stress is applied to the release film in its longitudinal direction (flow direction). If the cut portion D1 is not formed in the release film, the stress may propagate to the resin film forming layer and the resin film forming layer may extend in the flow direction. The deformation (elongation) of the resin film forming layer reduces the thickness accuracy. As a result, the reliability of a semiconductor device obtained using the resin film forming layer may be reduced. By forming the notch part of predetermined depth in a peeling film, the stress concerning a resin film formation layer can be relieve | moderated and a deformation | transformation of a resin film formation layer can be suppressed.

The resin film-forming sheet of the present invention may be the following third or fourth aspect. Hereinafter, each aspect of the resin film forming sheet will be described with reference to the drawings.

As shown in FIGS. 4 and 5, the third aspect and the fourth aspect are such that the diameter of the support sheet 11 is larger than the diameter of the resin film forming layer 12, and the release film 13 includes the cut portion D <b> 1. The cut portion D2 is formed along the outer periphery of the support sheet 11 from the surface on the support sheet side, and the cut depth d1 of the cut portion D1 is greater than or equal to the cut depth d2 of the cut portion D2.

In the third aspect and the fourth aspect, the cut depths d1 and d2 may be the same, or the cut depth d2 may be larger than the cut depth d1, but the support sheet is compared with the resin film forming layer. Because it is strong and firm, it is easy to create a peeling start point at the interface between the support sheet and the release film. From the viewpoint of completely cutting the support sheet and partially cutting the release film, the wear of the die cutting blade is suppressed. From the viewpoint, the removal process (removal process) of unnecessary parts after die cutting is easy, and if the cutting depth d2 is too large, the support sheet is cut when a predetermined amount is cut by the pressure of the die cutting blade Is the viewpoint of suppressing the possibility that the resin film forming layer is deformed because the laminated portion of the support sheet and the resin film forming layer is thicker than the support sheet portion, and pressure is applied to the resin film forming layer? The cut depth d2 of the cut portion D2 is preferably smaller than the cut depth d1 of the cut portion D1, more preferably 3/5 or less of the thickness of the release film, and preferably 1/2 or less. More preferably, it is particularly preferably 1/4 or less.

Furthermore, it is the outer peripheral part of the laminated body of the support sheet 11 and the resin film forming layer 12, between the release film 13 and the resin film formation layer 12, or between the release film 13 and the support sheet 11. A tool adhesive layer may be provided. As a jig | tool adhesion layer, the adhesive member which consists of an adhesive layer single-piece | unit, the adhesive member comprised from a base material and an adhesive layer, and the double-sided adhesive member which has a core material are employable.

The jig adhesive layer is, for example, an annular shape (ring shape), has a hollow portion (internal opening), and has a size that can be fixed to a jig such as a ring frame. Specifically, the inner diameter of the ring frame is smaller than the outer diameter of the jig adhesive layer. Further, the inner diameter of the ring frame is slightly larger than the inner diameter of the jig adhesive layer. The ring frame is usually a molded body of metal or plastic.

When a pressure-sensitive adhesive layer consisting of a single pressure-sensitive adhesive layer is used as a jig bonding layer, the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer is not particularly limited. For example, it is made of an acrylic pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, or a silicone pressure-sensitive adhesive. Is preferred. Of these, acrylic adhesive is preferred in view of removability from the ring frame. Moreover, the said adhesive may be used independently or may be used in mixture of 2 or more types.

The thickness of the pressure-sensitive adhesive layer constituting the jig adhesion layer is preferably 2 to 20 μm, more preferably 3 to 15 μm, and further preferably 4 to 10 μm. When the thickness of the pressure-sensitive adhesive layer is less than 2 μm, sufficient adhesiveness may not be exhibited. When the thickness of the pressure-sensitive adhesive layer exceeds 20 μm, a residue of the pressure-sensitive adhesive remains on the ring frame when it is peeled off from the ring frame, which may contaminate the ring frame.

When the pressure-sensitive adhesive member composed of the base material and the pressure-sensitive adhesive layer is used as the jig bonding layer, a ring frame is attached to the pressure-sensitive adhesive layer constituting the pressure-sensitive adhesive member.
The pressure-sensitive adhesive forming the pressure-sensitive adhesive layer is the same as the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer in the pressure-sensitive adhesive member composed of the above pressure-sensitive adhesive layer alone. The same applies to the thickness of the pressure-sensitive adhesive layer.

The base material constituting the jig adhesive layer is not particularly limited. For example, polyethylene film, polypropylene film, ethylene-vinyl acetate copolymer film, ethylene- (meth) acrylic acid copolymer film, ethylene- (meth) Examples thereof include polyolefin films such as acrylate copolymer films and ionomer resin films, polyvinyl chloride films, and polyethylene terephthalate films. Among these, in consideration of expandability, a polyethylene film and a polyvinyl chloride film are preferable, and a polyvinyl chloride film is more preferable.

The thickness of the base material constituting the jig adhesion layer is preferably 15 to 200 μm, more preferably 30 to 150 μm, and still more preferably 40 to 100 μm.

When a double-sided pressure-sensitive adhesive member having a core material is used as a jig adhesive layer, the double-sided pressure-sensitive adhesive member is formed on the core material, a laminating pressure-sensitive adhesive layer formed on one surface thereof, and the other surface. It consists of an adhesive layer for fixing. In the step of sticking the resin film forming layer of the resin film forming sheet to the wafer, the laminating pressure-sensitive adhesive layer is applied to the resin film forming layer in the case of the resin film forming sheet of the first aspect and the second aspect. In the case of the sheet for forming a resin film of the third aspect and the fourth aspect, it is a pressure-sensitive adhesive layer on the side attached to the support sheet. The fixing pressure-sensitive adhesive layer is the pressure-sensitive adhesive layer on the side that is attached to the ring frame in the attaching step.

As the core material of the double-sided pressure-sensitive adhesive member, the same material as the base material of the pressure-sensitive adhesive member can be mentioned. Of these, polyolefin film and plasticized polyvinyl chloride film are preferred in view of expandability.

The thickness of the core material is usually 15 to 200 μm, preferably 30 to 150 μm, more preferably 40 to 100 μm.

The double-sided pressure-sensitive adhesive layer and the fixing pressure-sensitive adhesive layer may be the same pressure-sensitive adhesive layer or different pressure-sensitive adhesive layers. The adhesive force between the fixing pressure-sensitive adhesive layer and the ring frame is appropriately selected so as to be smaller than the adhesive force between the resin film forming layer or the support sheet and the laminating pressure-sensitive adhesive layer. Examples of such adhesives include acrylic adhesives, rubber rubber adhesives, and silicone adhesives. Among these, an acrylic pressure-sensitive adhesive is preferable in consideration of removability from the ring frame. The pressure-sensitive adhesive forming the fixing pressure-sensitive adhesive layer may be used alone or in combination of two or more. The same applies to the adhesive layer for lamination.

The thickness of the laminating pressure-sensitive adhesive layer and the fixing pressure-sensitive adhesive layer is the same as the thickness of the pressure-sensitive adhesive layer of the pressure-sensitive adhesive member.

By providing the jig adhesive layer, it becomes easy to bond the laminate composed of the support sheet 11 and the resin film forming layer 12 to a jig such as a ring frame.

The shape of the resin film-forming sheet can be a belt-like shape in which a laminate composed of a support sheet and a resin film-forming layer is laminated on a long release film, which can be rolled up. In particular, a form in which a laminate composed of a support sheet and a resin film-forming layer cut out in accordance with a desired shape is laminated on a long release film at regular intervals so as to be peeled off. Further, the shape of the resin film forming sheet may be a single wafer.

When a laminate composed of a support sheet and a resin film-forming layer cut out in accordance with a desired shape is laminated on a long release film at regular intervals so as to be peeled, the support sheet and the resin film are formed. The thickness of the resin film-forming sheet is nonuniform between the portion where the layers are laminated and the portion where the support sheet and the resin film-forming layer are not laminated. When such a resin film forming sheet having a non-uniform thickness is wound into a roll shape, the thickness becomes non-uniform, the winding pressure becomes non-uniform, and the roll may collapse. Therefore, in the resin film forming sheet having such a form, it is preferable to make the thickness uniform. For this reason, on the outer side of the support sheet and the resin film forming layer cut out in accordance with a desired shape, as shown in FIG. 1, both edges 15 in the short direction of the long release film 13 are slightly spaced apart. The peripheral tape 14 having the same thickness as that of the laminate composed of the support sheet and the resin film forming layer is preferably bonded. Here, the distance between the laminate composed of the support sheet and the resin film forming layer and the peripheral tape 14 is preferably about 1 to 20 mm, particularly preferably about 2 to 10 mm. The peripheral tape 14 makes it easier to avoid the above problems by eliminating the uneven thickness.

(Manufacture of resin film forming sheet)
Next, a method for producing a sheet for forming a resin film in a form in which a laminate comprising a support sheet and a resin film forming layer cut out in accordance with a desired shape is laminated on a long release film at a predetermined interval so as to be peeled off The third embodiment shown in FIG. 4 will be described as an example, but the resin film forming sheet of the present invention is not limited to that obtained by such a manufacturing method.

First, the resin film forming layer on the release film is half-cut into a desired shape.

Specifically, two long release films (hereinafter referred to as a first long release film and a second long release film. The second long release film is the release film 13 in FIG. 4. ) To prepare a laminate having a resin film forming layer. A resin film forming layer formed in advance in a film shape may be sandwiched between two long release films, and a resin film forming composition for forming a resin film forming layer is used as one long release film. It may be coated and dried, and the other long release film may be bonded onto the coating film to form a laminate.

Next, the first long release film and the resin film forming layer are completely cut into a desired shape, and the first long release film and the resin film forming layer are formed so as to reach the second long release film 13. Die-cut (half cut). Die cutting is performed by a general-purpose apparatus or method such as die cutting. The cutting depth at this time is such that the first long release film and the resin film forming layer are completely cut to form a cut portion D1 having a cutting depth d1, and the thickness of the first long release film and the resin Cutting is performed at the total depth of the thickness of the film forming layer and the cutting depth d1. For this reason, the cut part D1 of the cut depth d1 is formed in the surface of a 2nd elongate peeling film. The cut depth d1 into the second long release film is preferably ½ or more of the thickness of the second long release film, and more preferably 3/5 or more. Specifically, when the thickness of the second long release film is 50 μm, the cutting depth d1 is preferably 25 μm or more, and more preferably 30 μm or more. When the thickness of the second long release film is 100 μm, the cutting depth d1 is preferably 50 μm or more, and more preferably 60 μm or more. The upper limit of the cutting depth d1 is preferably 4/5 or less of the thickness of the second release film so that there is no portion where the cutting blade penetrates completely through the second release film.

Next, an adhesive tape for peeling is attached in the longitudinal direction of the first release film so that the first release film that has been punched out is bonded. Then, by removing the peeling adhesive tape, the resin film forming layer 12 having a desired shape is left on the second long release film 13, and the remaining resin film forming layer together with the first long release film Remove. The remaining portions other than the resin film forming layer having a desired shape are continuous. For this reason, when the interface between the second long release film and the resin film forming layer is a starting point of peeling, the remaining resin film forming layer is removed together with the first long release film, and the resin film having a desired shape is obtained. The forming layer 12 remains on the second long release film 13. As a result, a laminated body in which the resin film forming layers 12 having a desired shape are aligned on the second long release film 13 is obtained.

Next, the support sheet 11 is attached to the surface of the second long release film 13 having the resin film forming layer 12 so as to be in contact with the second long release film 13 and the resin film forming layer 12.

Then, the support sheet is die-cut into a substantially circular shape with a size not less than the inner diameter and not more than the outer diameter of the ring frame. At this time, the die is cut so that the center point of the resin film forming layer 12 and the center point of the substantially circular support sheet 11 after die cutting coincide with each other. Moreover, in order to cut the support sheet completely and form the cut portion D2 having the cut depth d2, the cut depth is the total depth of the thickness of the support sheet and the cut depth d2. For this reason, the cut part D2 of the cut depth d2 is formed in the surface of a 2nd elongate peeling film.

The cut depth d2 into the second long release film may be the same as the cut depth d1 of the cut portion D1 or larger than the cut depth d1, but the cut depth into the second long peel film It is preferable that d2 is smaller than the cut depth d1 of the cut portion D1. The cutting depth d2 into the second long release film is preferably smaller than the cutting depth d1 of the cutting portion D1 and not more than 3/5 of the thickness of the second long release film. The thickness of the second long release film is more preferably ½ or less, and further preferably ¼ or less. Specifically, when the thickness of the second long release film is 50 μm, the cutting depth d2 is preferably 30 μm or less, more preferably 25 μm or less, and further preferably 12 μm or less. When the thickness of the second long release film is 100 μm, the cutting depth d2 is preferably 60 μm or less, more preferably 50 μm or less, and further preferably 25 μm or less.

Next, the substantially circular support sheet 11 is left on the second long release film 13, and the remaining support sheet is removed. As a result, the resin film forming sheet of the third aspect having the resin film forming layer of a desired shape on the second long release film 13 and further having the substantially circular support sheet 11 is obtained.

In the above, when the support sheet is punched out, the support sheet is cut into a substantially circular shape, and the second long release film is separated from the support sheet by a small distance outside the substantially circular support sheet 11. It is preferable to perform die cutting so that the supporting sheet as the peripheral tape 14 remains along the both edges 15 in the short direction. Thereafter, the substantially circular support sheet 11 and the peripheral tape 14 are left on the second long release film 13 and the remaining support sheet is removed, so that the substantially circular support sheet 11 and the resin film having a desired shape are obtained. The resin film-forming sheet 10 in a form in which the laminate composed of the forming layer 12 and the peripheral tape 14 are continuously bonded onto the long release film 5 is obtained.

(Method for manufacturing semiconductor device)
Next, a method for using the resin film forming sheet according to the present invention will be described taking as an example the case where the resin film forming sheet of the first aspect shown in FIG. 1 is applied to a method for manufacturing a semiconductor device.

According to a first aspect of the present invention, there is provided a method for manufacturing a semiconductor device using a resin film-forming sheet, wherein a resin film-forming layer of the sheet is attached to a work, the work is diced into a chip, and any of the chips It is preferable to include a step of fixing and leaving the resin film forming layer on the surface and peeling the resin film from the support sheet, and placing the chip on the die pad portion or another chip via the resin film forming layer.

Hereinafter, an example using a silicon wafer as a workpiece will be described.

The formation of a circuit on the wafer surface can be performed by various methods including conventionally used methods such as an etching method and a lift-off method. Next, the opposite surface (back surface) of the circuit surface of the wafer is ground. The grinding method is not particularly limited, and grinding may be performed by a known means using a grinder or the like. At the time of back surface grinding, an adhesive sheet called a surface protection sheet is attached to the circuit surface in order to protect the circuit on the surface. In the back surface grinding, the circuit surface side (that is, the surface protection sheet side) of the wafer is fixed by a chuck table or the like, and the back surface side on which no circuit is formed is ground by a grinder. The thickness of the wafer after grinding is not particularly limited, but is usually about 50 to 500 μm.

After that, if necessary, the crushed layer generated during back grinding is removed. The crushed layer is removed by chemical etching, plasma etching, or the like.

After the circuit formation and back surface grinding, the resin film forming layer of the resin film forming sheet is attached to the back surface of the wafer. The attaching method is not particularly limited. For example, the resin film forming layer is attached to the semiconductor wafer in the step shown in FIG.

6 (a) to 6 (d) are a series of process diagrams for performing an operation of attaching the laminated body of the support sheet 11 and the resin film forming layer 12 to the semiconductor wafer 32. FIG. As shown in FIG. 6A, the resin film-forming sheet 10 has a release film 13 serving as a carrier film, and is supported by two

rolls

62 and 66 and a peel plate 64 while one end thereof is A first roll 42 is formed while being connected to a cylindrical core 44, and a second roll 52 is formed by being wound with the other end connected to a cylindrical core 54. ing. A winding core driving motor (not shown) for rotating the winding core 54 is connected to the winding core 54 of the second roll 52, and the support sheet 11 and the resin film forming layer 12 are connected to each other. The release film 13 after the laminate is peeled is wound at a predetermined speed.

First, when the winding core driving motor rotates, the winding core 54 of the second roll 52 rotates, and the resin film forming sheet 10 wound around the winding core 44 of the first roll 42 becomes the first roll. 42 is pulled out to the outside. The drawn resin film forming sheet 10 is guided onto a disk-shaped semiconductor wafer 32 disposed on a movable stage and a ring frame 34 disposed so as to surround the semiconductor wafer 32.

Next, the laminate composed of the support sheet 11 and the resin film forming layer 12 is peeled from the release film 13. At this time, as shown in FIG. 6B, the peel plate 64 is applied from the release film 13 side of the resin film forming sheet 10, and the release film 13 has an acute angle starting from the cut portion D <b> 1 toward the peel plate 64 side. And a peeling start point is created between the release film 13 and the laminate composed of the support sheet 11 and the resin film forming layer 12. Furthermore, air may be blown to the boundary surface between the release film 13 and the laminate composed of the support sheet 11 and the resin film forming layer 12 so that the peeling start point can be created more efficiently.

After the separation starting point is created between the release film 13 and the laminate composed of the support sheet 11 and the resin film formation layer 12 as described above, the resin film formation layer 12 becomes a ring as shown in FIG. A laminate composed of the support sheet 11 and the resin film forming layer 12 is attached so as to be in close contact with the frame 34 and the semiconductor wafer 32. At this time, the laminate composed of the support sheet 11 and the resin film forming layer 12 is pressed against the semiconductor wafer 32 by the roll 68. Then, as shown in FIG. 6 (d), the attachment of the laminated body composed of the support sheet 11 and the resin film forming layer 12 onto the semiconductor wafer 32 is completed, and a semiconductor wafer with a laminated body is obtained.

By the procedure as described above, the laminate composed of the support sheet 11 and the resin film forming layer 12 can be attached to the semiconductor wafer 32 continuously in an automated process. As an apparatus for performing the operation of attaching the laminate composed of the support sheet 11 and the resin film forming layer 12 to the semiconductor wafer 32, for example, RAD-2500 (trade name) manufactured by Lintec Corporation can be cited. .

And when the laminated body which consists of the support sheet 11 and the resin film formation layer 12 is affixed on the semiconductor wafer 32 by such a process, the sheet | seat 10 for resin film formation in which the cut part D1 was formed in the peeling film 13 is used. Thus, when the outer periphery of the resin film forming layer 12 reaches the tip portion of the peel plate, even in a thick release film, the release film 13 can be bent at an acute angle starting from the cut portion D1, and the release film 13 and the support sheet 11 and a laminate composed of the resin film forming layer 12 can be easily created. As a result, it is possible to sufficiently suppress the occurrence of peeling failure of the laminate composed of the support film 11 and the resin film forming layer 12 from the release film 13.

When the resin film forming layer does not have tackiness at room temperature, it may be heated appropriately (although it is not limited, 40 to 80 ° C. is preferable).

Next, when the energy ray curable component (B2) is blended as the curable component (B) in the resin film forming layer, the resin film forming layer is irradiated with energy rays from the support sheet side, and the resin layer forming layer May be preliminarily cured to increase the cohesive force of the resin film-forming layer and to reduce the adhesive force between the resin film-forming layer and the support sheet.

Thereafter, the semiconductor wafer is cut using a cutting means such as a dicing saw to obtain a semiconductor chip. The cutting depth at this time is a depth that takes into account the sum of the thickness of the semiconductor wafer and the thickness of the resin film forming layer and the amount of wear of the dicing saw.
The energy beam irradiation may be performed at any stage after the semiconductor wafer is pasted and before the semiconductor chip is peeled off (pickup). For example, the irradiation may be performed after dicing or after the following expanding step. Although it is good, it is preferably performed after the semiconductor wafer is attached and before dicing. Further, the energy beam irradiation may be performed in a plurality of times.

Then, if necessary, when the resin film forming sheet is expanded, the interval between the semiconductor chips is expanded, and the semiconductor chips can be picked up more easily. At this time, a deviation occurs between the resin film forming layer and the support sheet, the adhesive force between the resin film forming layer and the support sheet is reduced, and the pick-up property of the semiconductor chip is improved. When the semiconductor chip is picked up in this manner, the cut resin film forming layer can be adhered to the back surface of the semiconductor chip and peeled off from the support sheet.

Next, the semiconductor chip is placed on the die pad of the lead frame or on the surface of another semiconductor chip (lower chip) through the resin film forming layer (hereinafter, the die pad or lower chip surface on which the chip is mounted is referred to as “chip mounting portion”. ).

The pressure when mounting is usually 1 kPa to 200 MPa. Further, the chip mounting portion may be heated before mounting the semiconductor chip or heated immediately after mounting. The heating temperature is usually 80 to 200 ° C., preferably 100 to 180 ° C., and the heating time is usually 0.1 seconds to 5 minutes, preferably 0.5 seconds to 3 minutes.

After the semiconductor chip is placed on the chip mounting portion, further heating may be performed as necessary. The heating conditions at this time are in the above heating temperature range, and the heating time is usually 1 to 180 minutes, preferably 10 to 120 minutes.

Alternatively, the resin film forming layer may be cured by using a heat in resin sealing that is normally performed in package manufacturing, without temporarily performing the heat treatment after placement. By passing through such a process, the resin film formation layer hardens | cures and the semiconductor device with which the semiconductor chip and the chip mounting part were adhere | attached firmly can be obtained. Since the resin film forming layer is fluidized under die bonding conditions, the resin film forming layer is sufficiently embedded in the unevenness of the chip mounting portion, and generation of voids can be prevented and the reliability of the semiconductor device is improved.

Further, in the method for manufacturing a semiconductor device according to the second aspect of the present invention, the resin film forming layer of the resin film forming sheet is pasted on the back surface of the semiconductor wafer having a circuit formed on the surface, and then the resin film is applied on the back surface. It is preferable to obtain a semiconductor chip having the same. The resin film is a protective film for a semiconductor chip. The method for manufacturing a semiconductor device according to the present invention preferably further includes the following steps (1) to (3), wherein the steps (1) to (3) are performed in an arbitrary order.
Step (1): peeling the resin film forming layer or resin film and the support sheet,
Step (2): The resin film forming layer is cured to obtain a resin film.
Step (3): dicing the semiconductor wafer and the resin film forming layer or resin film.

First, the resin film forming layer of the resin film forming sheet is attached to the back surface of the semiconductor wafer. This step is the same as the attaching step in the first method for manufacturing a semiconductor device.

Thereafter, steps (1) to (3) are performed in an arbitrary order. For example, the steps (1) to (3) are performed in the order of the steps (1), (2), (3), the steps (2), (1), (3), the steps (2), (3). , (1), steps (3), (2), (1), or steps (3), (1), (2). Details of this process are described in detail in JP-A-2002-280329. As an example, the case where it performs in order of process (1), (2), (3) is demonstrated.

First, a resin film forming layer of a resin film forming sheet is attached to the back surface of a semiconductor wafer having a circuit formed on the front surface. Next, the support sheet is peeled from the resin film forming layer to obtain a laminate of the semiconductor wafer and the resin film forming layer.
Next, the resin film forming layer is cured to form a resin film on the entire surface of the wafer. When the thermosetting component (B1) is used as the curable component (B) in the resin film forming layer, the resin film forming layer is cured by thermosetting. When the energy ray curable component (B2) is blended as the curable component (B), the resin film forming layer can be cured by energy ray irradiation, and the thermosetting component (B1) and When the energy beam curable component (B2) is used in combination, curing by heating and energy beam irradiation may be performed simultaneously or sequentially. Examples of the energy rays to be irradiated include ultraviolet rays (UV) and electron beams (EB), and preferably ultraviolet rays are used. As a result, a resin film made of a cured resin is formed on the back surface of the wafer, and the strength is improved as compared with the case of the wafer alone, so that damage during handling of the thinned wafer can be reduced. Further, compared with a coating method in which a coating solution for a resin film is directly applied to the back surface of a wafer or chip, the thickness of the resin film is excellent.

Thereafter, the laminated body of the semiconductor wafer and the resin film is diced for each circuit formed on the wafer surface. Dicing is performed so as to cut both the wafer and the resin film. The wafer is diced by a conventional method using a dicing sheet. As a result, a semiconductor chip having a resin film on the back surface is obtained.

Next, laser printing can be performed on the resin film. Laser printing is performed by a laser marking method, and the surface of the protective film is scraped off by laser light irradiation to mark a product number or the like on the protective film. Laser printing can also be performed before the resin film forming layer is cured.

Finally, by picking up the diced chip by a general means such as a collet, a semiconductor chip having a resin film on the back surface can be obtained. Then, the semiconductor device can be manufactured by mounting the semiconductor chip on a predetermined base by the face-down method. In addition, a semiconductor device can be manufactured by bonding a semiconductor chip having a resin film on the back surface to another member (on a chip mounting portion) such as a die pad portion or another semiconductor chip. According to the present invention, a highly uniform resin film can be easily formed on the back surface of the chip, and cracks after the dicing process and packaging are less likely to occur.

In addition, after sticking the resin film formation layer of the resin film formation sheet on the back surface of the semiconductor wafer, when performing the step (3) before the process (1), the resin film formation sheet serves as a dicing sheet. Can fulfill. That is, it can be used as a sheet for supporting the semiconductor wafer during the dicing process. In this case, the semiconductor wafer is bonded to the inner peripheral portion of the resin film forming sheet via the resin film forming layer, and the outer peripheral portion of the resin film forming sheet is bonded to another jig such as a ring frame, A resin film forming sheet affixed to the semiconductor wafer is fixed to the apparatus, and dicing is performed.

When the steps (3), (1), and (2) are performed in this order, a semiconductor chip having a resin film forming layer on the back surface is mounted on a predetermined base by a face-down method, and is usually used in package manufacturing. The resin film forming layer can also be cured by utilizing heating in the resin sealing performed.

DESCRIPTION OF SYMBOLS 10: Sheet | seat for resin film formation 11: Support sheet 12: Resin film formation layer 13: Release film D1: Notch part D2: Notch part

Claims

A support sheet, a resin film forming layer, and a release film are laminated in this order,
A sheet for forming a resin film, wherein the release film has a thickness of 50 μm or more.
In the release film, a cut portion is formed along the outer periphery of the resin film forming layer from the surface on the resin film forming layer side,
The sheet for forming a resin film according to claim 1, wherein the cut depth of the cut portion is ½ or more of the thickness of the release film.
The diameter of the support sheet is larger than the diameter of the resin film forming layer,
In the release film, a cut portion is formed along the outer periphery of the support sheet from the surface on the support sheet side,
3. The resin film formation according to claim 2, wherein the cut depth of the cut portion formed along the outer periphery of the resin film forming layer is equal to or greater than the cut depth of the cut portion formed along the outer periphery of the support sheet. Sheet.
The sheet for forming a resin film according to claim 3, wherein the cut depth of the cut portion formed along the outer periphery of the support sheet is 3/5 or less of the thickness of the release film.