WO2015041189A1

WO2015041189A1 - Method for manufacturing multilayer wiring substrate, and three-dimensional modeling device used for same

Info

Publication number: WO2015041189A1
Application number: PCT/JP2014/074338
Authority: WO
Inventors: 新井　義之; 岩出　卓
Original assignee: 東レエンジニアリング株式会社
Priority date: 2013-09-17
Filing date: 2014-09-16
Publication date: 2015-03-26

Abstract

　To provide a method for manufacturing a multilayer wiring substrate in which the production process can be simplified and the production cost can be reduced, and a three-dimensional modeling device used for the method. Specifically, a method for manufacturing a multilayer wiring substrate obtained by stacking wiring layers comprising an electroconductive part (13) and an insulating part (14), wherein the method includes: a wiring layer formation step for discharging an electroconductive material or an insulating material onto a predetermined position while performing a scanning motion, causing the discharged material to accumulate to a predetermined thickness (Thn), and forming a wiring layer; and a wiring layer stacking step for discharging an electroconductive material or an insulating material onto a predetermined position on the surface of the wiring layer while performing a scanning motion, causing the discharged material to accumulate to a predetermined thickness (Thn), and forming a further wiring layer.

Description

Multilayer wiring board manufacturing method and three-dimensional modeling apparatus used therefor

The present invention relates to a method for manufacturing a multilayer wiring board and a three-dimensional modeling apparatus used therefor.

Conventionally, a method of forming a circuit shape by a photolithographic technique is known in a method for manufacturing a wiring board having a circuit made of a conductor such as copper wiring. The circuit on the wiring substrate is formed by applying a photosensitive resist on a metal film formed on the surface of the insulating substrate, exposing and developing through a photomask, and dry etching the exposed film portion. . For example, it is like patent document 1.

Also, a method for manufacturing a multilayer wiring board in which wiring boards are laminated is known in order to cope with the recent downsizing and complexity of electronic devices and the like. A multilayer wiring board is manufactured by laminating and pressing a wiring board produced by the manufacturing method described in Patent Document 1 and repeatedly forming an inner layer pattern by drilling, plating, etching, or the like. However, since the multilayer wiring board is manufactured by a more complicated process of the wiring board manufactured by the manufacturing method described in Patent Document 1, there is a problem that the process becomes complicated and the production cost increases.

Japanese Patent Laid-Open No. 8-24259

An object of the present invention is to provide a method for manufacturing a multilayer wiring board capable of simplifying a production process and suppressing production costs, and a three-dimensional modeling apparatus used therefor.

The problems to be solved by the present invention are as described above. Next, means for solving the problems will be described.

That is, the present invention is a method of manufacturing a multilayer wiring board in which a wiring layer composed of a conductive portion and an insulating portion is laminated, and discharges either a conductive material or an insulating material to a predetermined position while performing a scanning motion. A wiring layer forming step of depositing to a predetermined thickness to form a wiring layer, and discharging either a conductive material or an insulating material to a predetermined position on the surface of the wiring layer while performing a scanning motion, And a wiring layer stacking step of forming a wiring layer by depositing to a thickness.

The present invention further includes a polishing step of polishing the surface of the wiring layer.

The present invention further includes an element embedding step of performing the wiring layer stacking step in a state where elements are arranged in the wiring layer.

The present invention relates to a method of manufacturing a multilayer wiring board in which wiring layers composed of a conductive portion and an insulating portion are laminated, and one of a conductive material and an insulating material is placed at a predetermined position while performing a scanning motion. A discharge step of discharging and depositing, and a coating step of applying the other material to a portion other than the conductive portion or the insulating portion deposited by the discharge step.

In the present invention, the wiring layer forming step is further performed on a support substrate having a flat surface.

In the present invention, a release layer having releasability from the wiring layer is further formed on the surface of the support substrate.

In the present invention, a flexible multilayer wiring board is manufactured using a resin having flexibility when formed into a film as the insulating material.

The present invention is a three-dimensional modeling apparatus used for manufacturing a multilayer wiring board in which a wiring layer composed of a conductive portion and an insulating portion is laminated, a modeling stage, a conductive material discharge nozzle for discharging a conductive material, Insulating material discharge nozzle for discharging insulating material, curing device for curing conductive material and insulating material, drive device for driving said conductive material discharge nozzle, said insulating material discharge nozzle, and said curing device And a control device having a function of controlling the modeling stage, the conductive material discharge nozzle, the insulating material discharge nozzle, the curing device, and the driving device.

In the present invention, the curing device is a combination of two types of curing devices, a photocuring device and a thermosetting device.

The present invention further includes a polishing device for polishing the surface of the wiring layer, and the control device has a function of controlling the polishing device.

The present invention is a three-dimensional modeling apparatus used for manufacturing a multilayer wiring board in which a wiring layer composed of a conductive portion and an insulating portion is laminated, and discharges either a modeling stage and a conductive material or an insulating material. Nozzle, coating device for applying either conductive material or insulating material, curing device for curing conductive material and insulating material, driving device for driving nozzle, coating device, and curing device And a control device having a function of controlling the modeling stage, the nozzle, the coating device, the curing device, and the driving device.

As the effects of the present invention, the following effects are obtained.

In the present invention, a multilayer wiring board is formed without going through a process of forming a circuit or removing unnecessary portions by exposure / development and etching. Thereby, a production process can be simplified and production cost can be suppressed.

In the present invention, since the accuracy of the deposited thickness of the conductive material and the insulating material is improved, even if a multilayer wiring board in which a plurality of wiring layers are laminated is configured, the total thickness is maintained within a predetermined range. The Thereby, a production process can be simplified and production cost can be suppressed.

In the present invention, the embedded wiring layer is formed simply by disposing the element and discharging the conductive material and the insulating material. Thereby, a production process can be simplified and production cost can be suppressed.

In the present invention, an optimal process is selected from the discharge process and the coating process in forming the conductive portion and the insulating portion. Thereby, a production process can be simplified and production cost can be suppressed.

Schematic which shows the whole structure of the three-dimensional modeling apparatus which concerns on one Embodiment of this invention. The figure which shows the example with which the drive device which concerns on one Embodiment of this invention was equipped with two types of hardening devices. The block diagram which shows the control structure of the three-dimensional modeling apparatus which concerns on one Embodiment of this invention. The figure which shows the flowchart showing the control aspect of the three-dimensional modeling apparatus in the manufacturing method of the multilayer wiring board which concerns on 1st embodiment of this invention. Schematic which shows each process in the manufacturing method of the multilayer wiring board which concerns on 1st embodiment of this invention. Schematic which shows a part of process in the manufacturing method of the multilayer wiring board which concerns on another embodiment of this invention. Schematic which shows the embedding process of the terminal in the manufacturing method of the multilayer wiring board which concerns on another embodiment of this invention. The figure which shows the flowchart showing the control aspect of the three-dimensional modeling apparatus in the manufacturing method of the multilayer wiring board which concerns on 2nd embodiment of this invention. Schematic which shows a part of process in the manufacturing method of the multilayer wiring board which concerns on 2nd embodiment of this invention. The figure which shows the flowchart showing the control aspect of the three-dimensional modeling apparatus in the manufacturing method of the multilayer wiring board which concerns on 3rd embodiment of this invention. Schematic which shows a part of process in the manufacturing method of the multilayer wiring board which concerns on 3rd embodiment of this invention. The conceptual diagram which shows the structure of the spatial coordinate of the three-dimensional modeling apparatus which concerns on one Embodiment of this invention.

First, with reference to FIG. 1 and FIG. 3, a three-dimensional modeling apparatus 1 that is an embodiment of a method for manufacturing a multilayer wiring board according to the present invention will be described. In the following description, the direction in which the scanning motion is performed is defined as the X direction, the Y direction orthogonal to the direction in which the scanning motion is performed, and the movement direction of the modeling stage 7 described later is the Z direction. To do. In addition, in this embodiment, although the inkjet type three-dimensional modeling apparatus 1 is demonstrated as one Embodiment of the three-dimensional modeling apparatus 1, it is not limited to this.

Here, the conductive material and the insulating material constitute the wiring layer. The base material of the conductive material and the insulating material is composed of a photocurable resin such as an epoxy type or polyimide type having electrical insulation. In this embodiment, the base material of the conductive material and the insulating material is composed of a photo-curing resin such as an epoxy-based or polyimide-based material having ultraviolet curing properties, but is not limited thereto, and is cured by heating. Any thermosetting resin that cures by some physical or chemical action may be used.

The conductive material is for forming a conductor portion (circuit pattern) of the wiring layer. The conductive material is configured by adding metal powder such as gold, silver, silver palladium, platinum, copper, etc. to a resin having photo-curability such as epoxy or polyimide having electrical insulation. In other words, the conductive material ensures conductivity by adding these metal powders to a photo-curing resin that is an insulating material. The insulating material is for forming an insulating portion (a portion other than the circuit pattern) of the wiring layer. The insulating material is composed of a base material (an epoxy-based or polyimide-based photocurable resin) to which metal powder is not added.

As shown in FIG. 1, the three-dimensional modeling apparatus 1 manufactures an arbitrary modeled object by discharging, depositing, and curing a conductive material and an insulating material that are modeling materials. The three-dimensional modeling apparatus 1 includes a discharge device 2, a modeling stage 7, and a control device 10.

The discharge device 2 discharges a modeling material. The discharge device 2 includes a conductive material discharge nozzle 3, an insulating material discharge nozzle 4, a curing device 5, and a driving device 6. In the discharge device 2, a conductive material discharge nozzle 3, an insulating material discharge nozzle 4 and a curing device 5 are integrally configured. The discharge device 2 is configured such that the conductive material discharge nozzle 3, the insulating material discharge nozzle 4 and the curing device 5 are integrally moved in the X direction and the Y direction above the modeling stage 7 by the driving device 6. . That is, the discharge device 2 can move the conductive material discharge nozzle 3, the insulating material discharge nozzle 4, and the curing device 5 to any position above the modeling stage 7 by the driving device 6.

The conductive material discharge nozzle 3 and the insulating material discharge nozzle 4 discharge the conductive material and the insulating material, respectively. The conductive material discharge nozzle 3 and the insulating material discharge nozzle 4 can discharge (spout) the conductive material and the insulating material by a discharge force generated by the volume change of the piezoelectric element, that is, the piezoelectric element. It is configured. The conductive material discharge nozzle 3 and the insulating material discharge nozzle 4 are configured such that the deposition thickness per unit area of the conductive material and the insulating material becomes the deposition thickness D by one discharge. The conductive material discharge nozzle 3 and the insulating material discharge nozzle 4 are ink jet in this embodiment. However, the present invention is not limited to this, and the conductive material and the insulating material are discharged by a deposition thickness D. Anything is possible.

The curing device 5 cures a conductive material and an insulating material made of an ultraviolet curable resin. In the present embodiment, the curing device 5 includes a laser irradiation device that locally irradiates ultraviolet light. That is, the curing device 5 is configured to irradiate the conductive material and the insulating material discharged from the conductive material discharge nozzle 3 and the insulating material discharge nozzle 4 as fine droplets with ultraviolet light. . In the present embodiment, the curing device 5 is configured by a laser irradiation device that irradiates ultraviolet light, but is not limited to this, and a laser irradiation device that irradiates infrared light in a thermosetting resin, a flash lamp, or the like. Any material that matches the curing characteristics of the conductive material and the insulating material may be used. Further, the curing method may be different between the conductive material and the insulating material. For example, as shown in FIG. 2, the curing device 5 includes a photocuring device 5P for ultraviolet curing resin and a thermosetting device 5T for thermosetting resin. May be combined.

The driving device 6 drives the conductive material discharge nozzle 3, the insulating material discharge nozzle 4 and the curing device 5 integrally. The drive device 6 is composed of an actuator such as a linear motor. The drive device 6 is configured to move the conductive material discharge nozzle 3, the insulating material discharge nozzle 4, and the curing device 5 along a guide guide (not shown) provided in the X direction and the Y direction. The drive device 6 configured as described above causes the conductive material discharge nozzle 3, the insulating material discharge nozzle 4 and the curing device 5 to scan in the X direction, and moves by a predetermined amount in the Y direction for each scanning motion. Is configured to do. That is, the driving device 6 is configured to move the conductive material discharge nozzle 3, the insulating material discharge nozzle 4, and the curing device 5 to all positions on the XY plane.

The modeling stage 7 constitutes a modeling space for the multilayer wiring board. The modeling stage 7 includes a modeling table 8 and a driving device 9. The modeling table 8 is composed of a substantially rectangular plate member. The modeling table 8 is configured so that the conductive material and the insulating material can be discharged from the discharge device 2 onto the table. The modeling stage 7 is configured such that the modeling table 8 is moved by the drive device 9 in the Z direction orthogonal to the X direction and the Y direction.

As shown in FIG. 3, the control device 10 controls the discharge device 2, the modeling stage 7, and the like. The control device 10 may actually be configured such that a CPU, ROM, RAM, HDD, or the like is connected by a bus, or may be configured by a one-chip LSI or the like. An input device 11 for inputting data and various settings is connected to the control device 10.

The control device 10 stores various programs for controlling the discharge device 2, the modeling stage 7, and the like. Specifically, the control device 10 uses the coordinate data (multi-dimensional CAD data, etc.) of the input multilayer wiring board to obtain spatial coordinate data composed of an X coordinate, a Y coordinate, and a Z coordinate for each predetermined thickness. A spatial coordinate calculation program for calculating the spatial coordinates S (X (i), Y (j), Z (k)) is stored. Here, X (i) represents the i-th X coordinate, Y (j) represents the j-th Y coordinate, and Z (k) represents the k-th Z coordinate (see FIG. 12). Moreover, the control apparatus 10 calculates the discharge command which calculates the presence or absence of each discharge of an electroconductive material and an insulating material for every created space coordinate S (X (i), Y (j), Z (k)). A calculation program is stored.

The control device 10 can acquire the configuration data and various set values of the multilayer wiring board input from the input device 11.

The control device 10 is connected to the conductive material discharge nozzle 3 and the insulating material discharge nozzle 4, and can control the discharge timing of the conductive material discharge nozzle 3 and the insulating material discharge nozzle 4, respectively.

The control device 10 is connected to the curing device 5 and can control the oscillation and irradiation timing of the laser light irradiated by the curing device 5. Here, when the curing device 5 is a combination of the photocuring device 5P and the thermosetting device 5T, the control device 10 can control each of the photocuring device 5P and the thermosetting device 5T.

The control device 10 is connected to the drive device 6 of the discharge device 2 and can control the movement amount of the discharge device 2 in the X direction and the Y direction by controlling the drive device 6.

The control device 10 is connected to the driving device 9 of the modeling stage 7 and can control the movement amount of the modeling stage 7 in the Z direction by controlling the driving device 9.

The control device 10 is connected to the input device 11 and based on the configuration data (three-dimensional CAD data, etc.) of the multilayer wiring board input from the input device 11, from the X coordinate, Y coordinate, and Z coordinate for each predetermined thickness. It is possible to calculate the spatial coordinates S (X (i), Y (j), Z (k)), which is the spatial coordinate data configured.

The control device 10 configured as described above uses the discharge command calculated by the discharge command calculation program for each spatial coordinate S (X (i), Y (j), Z (k)) calculated by the spatial coordinate calculation program. Based on this, the conductive material discharge nozzle 3, the insulating material discharge nozzle 4, the curing device 5 and the modeling stage 7 are controlled so that the conductive material and the insulating material are discharged.

Hereinafter, the control mode of the three-dimensional modeling apparatus 1 in the first embodiment of the method for manufacturing a multilayer wiring board according to the present invention will be specifically described with reference to FIG.

As shown in FIG. 4, in step S110, the control device 10 acquires the configuration data and various set values of the multilayer wiring board input from the input device 11, and shifts the step to step S120.

In step S120, the control device 10 calculates the spatial coordinates S (X (i), Y (j), Z (k)) from the spatial coordinate calculation program based on the acquired structure data and various set values of the multilayer wiring board. To do. Further, the control device 10 determines each spatial coordinate S (X (X) from the discharge command calculation program based on the acquired various set values and each calculated spatial coordinate S (X (i), Y (j), Z (k)). (I), Y (j), Z (k)) are calculated, and the process proceeds to step S130.

In step S <b> 130, the control device 10 lowers the modeling table 8 of the modeling stage 7 by the driving device 6 by the deposition thickness D in one scanning movement of the conductive material and the insulating material, that is, the increase in the Z coordinate. , The process proceeds to step S140.

In step S140, the control device 10 has the same Z coordinate among the calculated spatial coordinates S (X (i), Y (j), Z (k)) (for example, Z (a), where a is a constant). Each of the spatial coordinates S (X (i), Y (j), Z (a)) and the ejection command for each calculated spatial coordinate S (X (i), Y (j), Z (a)). Based on this, the conductive material and the insulating material are respectively discharged from the conductive material discharge nozzle 3 and the insulating material discharge nozzle 4 to each spatial coordinate S (X (i), Y (j), Z (a)). To do. At the same time, the control device 10 irradiates a laser beam composed of ultraviolet light from the curing device 5. That is, the control device 10 discharges the conductive material and the insulating material at predetermined positions on the same XY plane, and irradiates the conductive material and the insulating material with ultraviolet light, and the process proceeds to step S150. Let

In step S150, the control device 10 determines the spatial coordinates S (X) where the Z coordinates are the same Z (a) among the calculated spatial coordinates S (X (i), Y (j), Z (k)). (I), Y (j), Z (a)) It is determined whether or not the conductive material or the insulating material is discharged and ultraviolet light is irradiated at the necessary positions of the coordinate positions.

As a result, when the conductive material or the insulating material is discharged at the necessary positions of all the coordinate positions of the spatial coordinates S (X (i), Y (j), Z (a)) having the same Z coordinate, ultraviolet light is emitted. When it is determined that the irradiation is completed, the control device 10 shifts the step to step S160 (step S360 in FIGS. 8 and 10).

On the other hand, at all coordinate positions of the spatial coordinates S (X (i), Y (j), Z (a)) having the same Z coordinate, the conductive material or the insulating material is ejected and irradiated with ultraviolet light. If it is determined that the process has not been completed, the control device 10 moves the XY coordinates in step S260 and then proceeds to step S140 (step S440 in FIG. 10).

In step S160, the control device 10 determines whether or not the total lowering amount L of the modeling stage 8 of the modeling stage 7 by the driving device 6 is equal to the total thickness Th0 of the multilayer wiring board (see FIG. 5G). That is, the control device 10 determines whether or not all layers of the multilayer wiring board are formed on the modeling table 8.

As a result, the total descending amount L of the modeling stage 8 of the modeling stage 7 by the driving device 6 is equal to the total thickness Th0 of the multilayer wiring board, that is, all the layers of the multilayer wiring board are formed on the modeling table 8. If determined to be, the control device 10 ends the step.

On the other hand, the total lowering amount L of the modeling stage 8 of the modeling stage 7 by the driving device 6 is not equal to the total thickness Th0 of the multilayer wiring board, that is, not all the layers of the multilayer wiring board are formed on the modeling table 8. If determined to be, the control device 10 shifts the step to step S270.

In step S270, the control device 10 sets a of the Z coordinate Z (a) to a = a + 1, that is, the control device 10 sets the spatial coordinate S for discharging the conductive material and the insulating material to the same Z coordinate. As the spatial coordinates S (X (i), Y (j), Z (a + 1)) which are the Z coordinates Z (a + 1), the step proceeds to step S130.

By configuring in this way, the three-dimensional modeling apparatus 1 is configured so that the conductive material and the spatial coordinate S (X (i), Y (j), Z (k)) calculated from the configuration data of the multilayer wiring board An insulating material is discharged and cured at a predetermined position. Thereby, the three-dimensional modeling apparatus 1 can deposit the conductive material and the insulating material by the deposition thickness D to form the conductor portion and the insulator portion of the multilayer wiring board simultaneously and three-dimensionally.

Next, the first embodiment of the method for manufacturing a multilayer wiring board according to the present invention will be specifically described with reference to FIG. The method for manufacturing a multilayer wiring board according to the present invention includes a wiring layer forming step, a wiring layer laminating step, a one-side terminal forming step, a base material peeling step, and an other-side terminal forming step.

As shown in FIG. 5A, in the wiring layer forming step, the conductive part 13 is insulated from the support substrate 12 serving as a base material disposed on the modeling table 8 of the three-dimensional modeling apparatus 1 by the three-dimensional modeling apparatus 1. A wiring layer composed of the portion 14 is formed. Specifically, based on the calculated spatial coordinates S (X (i), Y (j), Z (1)) and the discharge command, the conductive material is insulated from the conductive material by the three-dimensional modeling apparatus 1 on the support substrate 12. Material is discharged. In addition, the three-dimensional modeling apparatus 1 cures the conductive material and the insulating material with the curing device 5 for each discharge. Here, the Z coordinate Z (1) represents the Z coordinate at the time of the first discharge. Thereby, in the multilayer wiring board, a wiring film composed of the conductive portion 13 and the insulating portion 14 in which the conductive material and the insulating material are deposited on the support substrate 12 by the deposition thickness D is formed. Here, as long as the support substrate 12 has a flat plane, a material such as metal, glass, plastic, or the like can be used. Further, it is preferable that a release layer having releasability with respect to the wiring layer is formed on the surface of the support substrate 12, and the releasability of the release layer with respect to the wiring layer is expressed by light irradiation or a chemical solution. May be.

Further, as shown in FIG. 5 (b), it is formed on the support substrate 12 of the modeling table 8 based on the calculated spatial coordinates S (X (i), Y (j), Z (k)) and the ejection command. A conductive material is discharged by the three-dimensional modeling apparatus 1 onto the conductive portion 13 that has been formed. Similarly, in the multilayer wiring board, the insulating material is discharged by the three-dimensional modeling apparatus 1 onto the insulating portion 14 formed on the support substrate 12 of the modeling table 8. Thereby, in the multilayer wiring board, the conductive portion 13 in which the conductive material is deposited by the deposition thickness D is formed on the conductive portion 13, and the insulating portion in which the insulating material is deposited by the deposition thickness D on the insulating portion 14. 14 is formed. In this way, the multilayer wiring board is insulated from the conductive material by the three-dimensional modeling apparatus 1 until the deposition thickness reaches the wiring layer thickness Thn (Th1 in FIG. 5C) which is a predetermined thickness of each layer. By repeating the discharge with the conductive material, the first level wiring layer constituting the multilayer wiring board is formed.

As shown in FIG. 5D and FIG. 5E, in the wiring layer stacking step, the multilayer wiring board is three-dimensionally formed on the wiring layer of the first layer of the multilayer wiring board formed on the modeling table 8. The device 1 further forms a conductive portion 13 and an insulating portion 14. Specifically, the conductive material and the insulating material are deposited on the wiring layer of the first layer of the formed multilayer wiring board until the wiring layer thickness Thn of each layer reaches Thn (Th2 in FIG. 5D). The conductive portion 13 and the insulating portion 14 are further formed by repeating the wiring layer forming process in which the thickness D is discharged. As a result, in the multilayer wiring substrate, the conductive portion 13 and the insulating portion 14 constituting the second and subsequent layers of the multilayer wiring substrate are formed in the wiring layer stacking step.

As shown in FIG. 5 (f), when a wiring layer of a predetermined level is formed in the one-side terminal formation step, it is placed at a predetermined position on one side surface of the multilayer wiring board (the surface of the wiring layer of the final layer) A connection terminal 15 made of a conductive material is formed by the three-dimensional modeling apparatus 1. Specifically, the multilayer wiring board is discharged to a predetermined position on the final wiring layer by the three-dimensional modeling apparatus 1 until the conductive material reaches a predetermined deposition thickness by a deposition thickness D. As a result, in the multilayer wiring board, the conductive portion 13 in which the conductive material is deposited at a predetermined deposition thickness is formed as a connection terminal 15 at a predetermined position on the wiring layer of the final layer.

When the connection terminal 15 is formed on the one-side surface, the other-side surface (the surface of the first layer wiring layer) is inverted so as to face the ejection device 2 of the three-dimensional modeling apparatus 1. The reversal of the multilayer wiring board is performed by a reversing device (not shown) provided in the three-dimensional modeling apparatus 1. Next, the support substrate 12 which is the base material on the other surface is peeled off. Peeling of the support substrate 12 is performed by a base material peeling device (not shown) provided in the three-dimensional modeling apparatus 1.

As shown in FIG. 5G, in the other-side terminal forming step, the connection terminal 15 is formed by the three-dimensional modeling apparatus 1 at a predetermined position on the other-side surface (the surface of the first layer wiring layer). Specifically, the conductive material is discharged by a three-dimensional modeling apparatus 1 in a predetermined position on the wiring layer of the first layer until the predetermined deposition thickness is reached by the deposition thickness D. As a result, a conductive portion 13 in which a conductive material is deposited at a predetermined deposition thickness at a predetermined position on the first layer wiring layer is formed as a connection terminal 15. In addition, the order of the base material peeling step and the one side (other side) terminal forming step is not limited to the order in the present embodiment, and the one side (other side) terminal forming step is performed after the base material peeling step. The structure to do may be sufficient.

Further, as another embodiment of the first embodiment of the method for manufacturing a multilayer wiring board according to the present invention, a configuration may be included in which a curing process is performed in which the wiring layers of each layer in the multilayer wiring board are cured after being formed.

As shown in FIG. 6, in the curing process, the multilayer wiring board is irradiated with ultraviolet light by an ultraviolet lamp 16 when a wiring layer of one layer is formed on the modeling table 8. Specifically, when the conductive material and the insulating material are deposited until the wiring layer thickness Thn of each layer is reached by the wiring layer formation step or the wiring layer lamination step (FIG. 6A, FIG. b)), and ultraviolet light is irradiated by the ultraviolet lamp 16 (see FIG. 6C). The curing process is not limited to the curing of each wiring layer in one layer, but the configuration in which ultraviolet light is irradiated every time the conductive material and the insulating material are discharged, or the wiring of all layers of the multilayer wiring board A configuration may be employed in which ultraviolet light is irradiated after the layer is formed. Moreover, the structure hardened | cured by heat processing using the thermosetting resin hardened | cured by heating may be sufficient.

In addition, as another embodiment of the first embodiment of the method for manufacturing a multilayer wiring board according to the present invention, a structure including an element embedding step of arranging the element E when forming the second and subsequent layers by the wiring layer stacking step is included. May be.

As shown in FIG. 7, in the element embedding process, in the multilayer wiring board, the element E is embedded with a conductive material and an insulating material on the wiring layer of one layer formed on the modeling table 8. Specifically, in a state where the element E (for example, a resistor or a capacitor) is disposed on the wiring layer of one layer formed by the wiring layer forming step or the wiring layer stacking step (see FIG. 7A). ), A conductive material and an insulating material are discharged (see FIG. 7B). As a result, a wiring layer composed of the conductive portion 13 and the insulating portion 14 constituting the second and subsequent layers of the multilayer wiring board is formed in a state where the element E is arranged by the wiring layer stacking step. That is, the multilayer wiring board is formed in a state where necessary elements E are embedded in the wiring layer of one layer (see FIG. 7C).

As described above, a multilayer wiring board is formed without going through a process of forming a circuit or removing unnecessary portions by exposure, development, etching, or the like. Further, the embedded wiring layer is formed simply by disposing the element E and discharging the conductive material and the insulating material. Thereby, a production process can be simplified and production cost can be suppressed.

Next, the control mode of the second embodiment of the method for manufacturing a multilayer wiring board according to the present invention will be specifically described with reference to FIGS. In the following embodiments, the same points as those of the above-described embodiments will not be specifically described, and different portions will be mainly described.

As shown in FIGS. 1 and 3, the three-dimensional modeling apparatus 1 manufactures an arbitrary modeled object by discharging, depositing, and curing a conductive material and an insulating material that are modeling materials. The three-dimensional modeling apparatus 1 includes a polishing apparatus 17.

The polishing apparatus 17 is for polishing the surface of the wiring layer. The polishing device 17 includes a roller-type polishing device or a disk-type polishing device, but is not limited thereto. The polishing apparatus 17 is configured to polish the surface of the wiring layer in each layer so that the deposited thickness of the conductive material and the insulating material discharged to form each layer becomes the wiring layer thickness Thn. The The polishing device 17 is formed integrally with the discharge device 2. The polishing device 17 is configured to move integrally above the modeling stage 7 in the X direction and the Y direction by the driving device 6 of the discharge device 2. In the present embodiment, the polishing device 17 is configured integrally with the discharge device 2 of the three-dimensional modeling apparatus 1, but is not limited thereto, and is separate from the discharge device 2 or the three-dimensional modeling device 1. It may be configured as follows.

The control device 10 is connected to the polishing device 17 and can control the positions of the driving device 6 in the X and Y directions and the polishing amount. The control device 10 configured as described above controls the polishing device 17 based on the spatial coordinates S (X (i), Y (j), Z (k)) calculated by the spatial coordinate calculation program.

Hereinafter, the control mode of the three-dimensional modeling apparatus 1 in the second embodiment of the method for manufacturing a multilayer wiring board according to the present invention will be specifically described with reference to FIG.

In step S360, the control device 10 determines whether or not the descent amount Ln for each layer of the modeling stage 8 of the modeling stage 7 by the driving device 6 is larger than the wiring layer thickness Thn of each layer. That is, the control device 10 determines whether or not one layer of the multilayer wiring board is formed on the modeling table 8 to be thicker than the wiring layer thickness Thn.

As a result, the lowering amount Ln for each layer of the modeling table 8 of the modeling stage 7 by the driving device 6 is larger than the wiring layer thickness Thn of each layer, that is, one layer of the multilayer wiring boards is formed on the modeling table 8. If it is determined that the wiring layer thickness Thn is greater than that of the wiring layer thickness Thn, the control device 10 proceeds to step S370 (step S470 in FIG. 10).

On the other hand, the lowering amount Ln for each layer of the modeling table 8 of the modeling stage 7 by the driving device 6 is not larger than the wiring layer thickness Thn of each layer, that is, one layer of the multilayer wiring boards is on the modeling table 8. If it is determined that the wiring layer thickness Thn is not greater than the thickness Thn, the control device 10 shifts the step to step S270.

In step S370, the control device 10 determines that the distance from the surface of the support substrate 12 of the modeling stage 8 of the modeling stage 7 or the surface of the first layer polished immediately before to the polishing position of the polishing device 17 is the wiring layer thickness of each layer. The modeling table 8 is raised to a predetermined position equal to the length Thn (see FIG. 9A), and the process proceeds to step S380.

In step S380, the control device 10 polishes the surface of the first layer formed on the modeling stage 8 of the modeling stage 7 by the polishing device 17, and shifts the step to step S390.

In step S390, the control device 10 determines whether or not the total lowering amount L of the modeling stage 8 of the modeling stage 7 by the driving device 6 is equal to the total thickness Th0 of the multilayer wiring board. That is, the control device 10 determines whether or not all layers of the multilayer wiring board are formed on the modeling table 8.

As a result, the total lowering amount L of the modeling table 8 of the modeling stage 7 by the driving device 6 is equal to the total thickness Th0 of the multilayer wiring board, that is, all the layers of the multilayer wiring board are formed on the modeling table 8. If determined to be, the control device 10 ends the step.

By configuring in this way, the three-dimensional modeling apparatus 1 is configured so that the conductive material and the spatial coordinate S (X (i), Y (j), Z (k)) calculated from the configuration data of the multilayer wiring board The insulating material is discharged and cured at a predetermined position, and the surface of the wiring layer is polished by the polishing device 17 for each layer of the multilayer wiring board. Thereby, the 3D modeling apparatus 1 can improve the smoothness of the surface of the wiring layer and the deposition accuracy of the wiring layer thickness Thn of each layer.

Next, a second embodiment of the method for manufacturing a multilayer wiring board according to the present invention will be specifically described with reference to FIG. The method for manufacturing a wiring layer according to the present invention includes a polishing step.

As shown in FIG. 9, in the polishing step, the surface of the multilayer wiring board is polished by the three-dimensional modeling apparatus 1 every time each layer is formed. Specifically, in the multilayer wiring board, the support substrate 12 is formed after the formation of the first layer by the wiring layer formation step and every time the formation of the second and subsequent layers by the wiring layer lamination step is completed. Is raised by the modeling table 8 to a predetermined position equal to the wiring layer thickness Thn of each layer from the surface of the layer polished immediately before or to the polishing position of the polishing apparatus 17 (see FIG. 9A). Then, the surface of the first layer of the multilayer wiring board is polished by the polishing apparatus 17 (see FIG. 9B). Thereby, in the multilayer wiring board, the deposition thickness of each layer is maintained within a predetermined range, and the surface roughness of each layer is maintained within a predetermined range (see FIG. 9C).

As described above, since the accuracy of the wiring layer thickness Thn of each layer of the conductive material and the insulating material is improved in the multilayer wiring board, the total thickness Th of the multilayer wiring board can be obtained even if a plurality of wiring layers are stacked. Is maintained within a predetermined range. Thereby, a production process can be simplified and production cost can be suppressed.

Next, the control mode of the third embodiment of the method for manufacturing a multilayer wiring board according to the present invention will be specifically described with reference to FIGS. In the following embodiments, the same points as those of the above-described embodiments will not be specifically described, and different portions will be mainly described.

As shown in FIGS. 3 and 11, the three-dimensional modeling apparatus 1 manufactures an arbitrary modeled object by discharging, depositing, and curing a conductive material and an insulating material that are modeling materials. The three-dimensional modeling apparatus 1 includes a coating device 18.

The coating device 18 applies a conductive material or an insulating material that is a modeling material. The coating device 18 is configured to apply a conductive material or an insulating material while moving on the wiring layer in one layer of the multilayer wiring board formed by the three-dimensional modeling apparatus 1. The coating device 18 is formed integrally with the discharge device 2. The coating device 18 is configured to move integrally above the modeling stage 7 in the X direction or the Y direction by the driving device 6 of the discharge device 2. In the present embodiment, the coating device 18 is configured integrally with the discharge device 2 of the three-dimensional modeling apparatus 1, but is not limited thereto, and is separate from the discharge device 2 or the three-dimensional modeling device 1. It may be configured as follows.

The control device 10 is connected to the coating device 18, and can control the moving speed and the coating amount of the coating device 18, respectively. The control device 10 configured as described above controls the coating device 18 based on the spatial coordinates S (X (i), Y (j), Z (k)) calculated by the spatial coordinate calculation program.

Hereinafter, the control mode of the three-dimensional modeling apparatus 1 in the third embodiment of the method for manufacturing a multilayer wiring board according to the present invention will be specifically described with reference to FIG.

In step S440, the control device 10 determines that each of the calculated spatial coordinates S (X (i), Y (j), Z (k)) has the same Z coordinate Z (a). (I), Y (j), Z (a)) and the calculated spatial coordinates S (X (i), Y (j), Z (a)) and the respective spatial coordinates S ( A conductive material or an insulating material is discharged onto X (i), Y (j), and Z (a)), and laser light composed of ultraviolet light is irradiated from the curing device 5. That is, the control device 10 discharges one of the conductive material and the insulating material to a predetermined position on the same plane and irradiates the ultraviolet light, and the process proceeds to step S150.

In step S <b> 470, the control device 10, other than the portion where one material of the conductive material and the insulating material is applied in one layer formed on the modeling table 8 of the modeling stage 7 by the coating device 18. The other material of the conductive material and the insulating material is applied to the portion and cured, and the process proceeds to step S390.

By configuring in this way, the three-dimensional modeling apparatus 1 is configured so that the conductive material and the spatial coordinate S (X (i), Y (j), Z (k)) calculated from the configuration data of the multilayer wiring board An insulating material is discharged or applied to a predetermined position and cured. Thereby, the three-dimensional modeling apparatus 1 can shorten the manufacturing time of a multilayer wiring board by forming the electroconductive part 13 or the insulating part 14 part with much deposition amount by an application | coating process.

Next, a third embodiment of the method for manufacturing a multilayer wiring board according to the present invention will be specifically described with reference to FIG. The method for manufacturing a multilayer wiring board according to the present invention includes a discharge process and a coating process. Here, the discharging step refers to a step of discharging one of a conductive material and an insulating material by discharging in the wiring layer forming step and the wiring layer stacking step.

As shown in FIG. 11, in the discharging process, in the multilayer wiring board, the conductive portion 13 or the insulating portion 14 of each layer is formed by the discharging device 2 of the three-dimensional modeling apparatus 1. Specifically, the multilayer wiring board is insulated from the conductive portion 13 of the wiring layer in one layer by discharging one of the conductive material and the insulating material in the wiring layer forming step and the wiring layer laminating step. Either one of the portions 14 is formed (see FIG. 11A).

Further, in the ejection step, when it is necessary to form the conductive portion 13 including a circuit pattern that is so fine that it cannot be formed by the three-dimensional modeling apparatus 1, only the portion may be formed by a photolithography technique. Here, it is preferable that the base material of the conductive material has photosensitivity because it is not necessary to apply a photosensitive resist.

In the coating process, the insulating material or the conductive material is applied to the multilayer wiring board by the coating device 18 after the conductive portions 13 or the insulating portions 14 of the respective layers are formed. Specifically, in the multilayer wiring board, the other material of the conductive material and the insulating material that has not been ejected in the ejection process is applied to the gap (space) between the deposited layers of one wiring layer by the coating device 18. ) (See FIG. 11B). That is, in the multilayer wiring board, the other material is applied to a space on one wiring layer where nothing is discharged by the coating device 18. As a result, the multilayer wiring board is manufactured by forming the conductive portion 13 or the insulating portion 14 having a large amount of deposition in each layer by coating, thereby reducing the manufacturing time.

In addition, in 3rd embodiment, you may further include the baking process which bakes the electroconductive part 13. FIG. Specifically, after the conductive portion 13 is formed in the discharge process, the conductive portion 13 is baked to increase conductivity in the baking step. Thereafter, an insulating material is applied in an application process.

In the third embodiment, a polishing step for polishing the surface of the wiring layer may be further included. Specifically, each time the coating process is completed, the multilayer wiring board is formed in each layer from the surface of the support substrate 12 or the immediately polished layer to the polishing position of the polishing device 17 in the three-dimensional modeling apparatus 1. The wiring layer is disposed at a predetermined position equal to the thickness Thn (see FIG. 9A). Then, the surface of the first layer of the multilayer wiring board is polished by the polishing apparatus 17 of the three-dimensional modeling apparatus 1 (see FIG. 9B). Thereby, in the multilayer wiring board, the deposition thickness of each layer is maintained within a predetermined range, and the surface roughness of each layer is maintained within a predetermined range (see FIG. 9C).

As described above, for the multilayer wiring board, an optimum process is selected from the discharge process and the coating process in forming the conductive portion 13 and the insulating portion 14. Thereby, a production process can be simplified and production cost can be suppressed. Further, since the accuracy of the deposited thickness of the conductive material and the insulating material is improved, even if a multilayer wiring board in which a plurality of wiring layers are stacked is configured, the total thickness is maintained within a predetermined range. Thereby, a production process can be simplified and production cost can be suppressed.
Moreover, a flexible multilayer wiring board can be easily obtained by using a resin having flexibility when formed into a film shape, such as a polyimide resin or a polyester resin, as the insulating material.

DESCRIPTION OF SYMBOLS 1 Three-dimensional modeling apparatus 2 Discharge apparatus 3 Conductive material discharge nozzle 4 Insulating material discharge nozzle 5 Curing apparatus 6 Drive apparatus 7 Modeling stage 10 Control apparatus 12 Support substrate 13 Conductive part 14 Insulating part 17 Polishing apparatus 18 Coating apparatus Thn Wiring layer Thickness Th0 Total thickness

Claims

A method for manufacturing a multilayer wiring board in which a wiring layer composed of a conductive portion and an insulating portion is laminated,
A wiring layer forming step of forming a wiring layer by discharging either a conductive material or an insulating material to a predetermined position while performing a scanning motion, and depositing it to a predetermined thickness;
A wiring layer stacking step in which either a conductive material or an insulating material is discharged to a predetermined position on the surface of the wiring layer while performing a scanning motion, and is further deposited to a predetermined thickness to form a wiring layer;
A method of manufacturing a multilayer wiring board including:
The method for manufacturing a multilayer wiring board according to claim 1, further comprising a polishing step of polishing the surface of the wiring layer.
The method for manufacturing a multilayer wiring board according to claim 1, further comprising an element embedding step of performing the wiring layer stacking step in a state where elements are arranged in the wiring layer.
A method for manufacturing a multilayer wiring board in which a wiring layer composed of a conductive portion and an insulating portion is laminated,
A discharging step of discharging and depositing one of a conductive material and an insulating material at a predetermined position while performing a scanning motion;
An application step of applying the other material to a portion other than the conductive portion or the insulating portion deposited by the discharge step;
A method of manufacturing a multilayer wiring board including:
The method for manufacturing a multilayer wiring board according to claim 4, further comprising a polishing step of polishing the surface of the wiring layer.
6. The method of manufacturing a multilayer wiring board according to claim 1, wherein the wiring layer forming step is performed on a support substrate having a flat plane.
The method for producing a multilayer wiring board according to claim 6, wherein a release layer having releasability from the wiring layer is formed on the surface of the support substrate.
The method for producing a multilayer wiring board according to any one of claims 1 to 7, wherein a flexible multilayer wiring board is produced using a resin having flexibility when formed into a film as the insulating material.
A three-dimensional modeling apparatus used to manufacture a multilayer wiring board in which a wiring layer composed of a conductive portion and an insulating portion is laminated,
Modeling stage,
A conductive material discharge nozzle for discharging the conductive material;
An insulating material discharge nozzle for discharging the insulating material;
A curing device for curing the conductive material and the insulating material;
A driving device for driving the conductive material discharge nozzle, the insulating material discharge nozzle, and the curing device;
A three-dimensional modeling apparatus comprising a control device having a function of controlling the modeling stage, the conductive material discharge nozzle, the insulating material discharge nozzle, the curing device, and the driving device.
The three-dimensional modeling apparatus according to claim 9, wherein the curing device is a combination of two types of curing devices, a photocuring device and a thermosetting device.
The three-dimensional modeling apparatus according to claim 9 or 10, further comprising a polishing device for polishing a surface of the wiring layer, wherein the control device has a function of controlling the polishing device.
A three-dimensional modeling apparatus used to manufacture a multilayer wiring board in which a wiring layer composed of a conductive portion and an insulating portion is laminated,
Modeling stage,
A nozzle that discharges either a conductive material or an insulating material;
An applicator for applying either a conductive material or an insulating material;
A curing device for curing the conductive material and the insulating material;
A driving device for driving the nozzle, the coating device, and the curing device;
A three-dimensional modeling apparatus comprising a control device having a function of controlling the modeling stage, the nozzle, the coating device, the curing device, and the driving device.
The three-dimensional modeling apparatus according to claim 12, wherein the curing device is a combination of two types of curing devices, a photocuring device and a thermosetting device.
The three-dimensional modeling apparatus according to claim 12 or 13, further comprising a polishing device for polishing a surface of the wiring layer, wherein the control device has a function of controlling the polishing device.