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WO2015039920A1 - Heat sink - Google Patents

Heat sink Download PDF

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Publication number
WO2015039920A1
WO2015039920A1 PCT/EP2014/069128 EP2014069128W WO2015039920A1 WO 2015039920 A1 WO2015039920 A1 WO 2015039920A1 EP 2014069128 W EP2014069128 W EP 2014069128W WO 2015039920 A1 WO2015039920 A1 WO 2015039920A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
heat
electrically insulating
emc
plate
Prior art date
Application number
PCT/EP2014/069128
Other languages
German (de)
French (fr)
Inventor
Ludwig Arlt
Stefan Dietz
Lars Balschat
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2015039920A1 publication Critical patent/WO2015039920A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/06—Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • Heatsink The present invention relates to a heat sink.
  • heat sinks made of aluminum which have to make do without the use of a shielding plate and thus offer no solution to EMC problems.
  • a grounding of the metallic heat sink is required.
  • the voltage-carrying areas are covered with an insulating layer and having a heat sink a heat sink made of a good heat conducting material with a large surface area.
  • the heat sink consists of a molding compound which is interspersed with heat-conducting metal.
  • the molding compound consists of a curable synthetic material ⁇ .
  • thermally conductive layer material is known, which is produced by pressure or press bonding with a conductive film over a base layer. Further- It is disclosed that, when using a magnetic film, the effect of electromagnetic wave shielding on the conductive film is further improved.
  • the layer material is used as a heat-conducting layer between a heat-generating element and a heat-dissipating element.
  • US 2001/0024724 AI discloses a plastic heat sink comprising a plate made of a carbon-carbon matrix, which improves the heat spreading without the mechanical stability and thus the freedom of design of the heatsink to impair ⁇ gen.
  • the invention has for its object to provide a heat sink, which provides an advantageous solution in the cooling of electrical components and components even in the presence of electromagnetic interference.
  • FIG. 1 shows a representation of the individual components for constructing a heat sink according to the invention made of plastic
  • FIG. 2 shows the back of the heat sink according to the invention according to FIG. 1
  • a heat sink 1 which is made essentially of electrically insulating, heat-conducting plastic.
  • the plastic is a particle / fiber composite material for molded parts with poly ⁇ mermatrix of elastomers and electrically insulating fillers.
  • an EMC shield plate 2 is integrated.
  • a metallic plate eg a copper plate, which in addition to its EMC shielding also has the advantage of good heat conduction.
  • the EMC shield plate 2 is connected according to FIG 1 with a Abstandshal ⁇ ter 3, which is suitable for connecting an electrical component to be cooled or device. 2 shows the back of a heat sink 1 according to the invention in the assembled state.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Thermal Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to a heat sink (1) which is made of an electrically insulating, heat-conducting plastic material.

Description

Beschreibung description
Kühlkörper Die vorliegende Erfindung betrifft einen Kühlkörper. Heatsink The present invention relates to a heat sink.
Aus dem Stand der Technik sind Kühlkörper mit metallischen Materialien bekannt. Sie haben eine Veränderung der EMV Heat sinks with metallic materials are known from the prior art. You have a change in EMC
(Elektromagnetische Verträglichkeit) und der elektrischen Si- cherheit zur Folge. Bisher eingesetzte metallische Kühlkörper können die Abstrahlung verstärken und die Schirmfunktionali¬ tät verschlechtern. Darüber hinaus können metallische berührbare Gehäuseteile bei elektrischen Geräten eine Gefahr darstellen und benötigen eine zusätzliche Erdung. (Electromagnetic compatibility) and the electrical safety result. Previously used metallic heat sink can amplify the radiation and worsen the Schirmfunktionali ¬ ity. In addition, metallic touchable housing parts can represent a danger in electrical devices and require additional grounding.
Es sind beispielsweise Kühlkörper aus Aluminium bekannt, die ohne Einsatz eines Schirmblechs auskommen müssen und somit keine Lösung bei EMV-Problemen bieten. Außerdem ist eine Erdung des metallischen Kühlkörpers erforderlich. For example, heat sinks made of aluminum are known which have to make do without the use of a shielding plate and thus offer no solution to EMC problems. In addition, a grounding of the metallic heat sink is required.
Aus DE 25 11 010 AI ist ein elektrisches Bauelement bekannt, dessen spannungsführende Bereiche mit einer Isolationsschicht abgedeckt sind und das zur Wärmeabführung einen Kühlkörper aus einem gut wärmeleitenden Material mit großer Oberfläche aufweist. Der Kühlkörper besteht aus einer Pressmasse, die mit wärmeleitendem Metall durchsetzt ist. Weiterhin ist auch bekannt, dass die Pressmasse aus einem aushärtbaren Kunst¬ stoff besteht. Aus US 2004/0226707 AI ist ein Kunststoffkühlkörper bekannt, wobei die Kunststoffmatrix des Kunststoffkühlkörpers mit wär¬ meleitendem Material durchsetzt ist und er eine wärmeleiten¬ de, verformbare und klebende Seite zum Aufbringen auf ein zu kühlendes Gerät aufweist. From DE 25 11 010 Al an electrical component is known, the voltage-carrying areas are covered with an insulating layer and having a heat sink a heat sink made of a good heat conducting material with a large surface area. The heat sink consists of a molding compound which is interspersed with heat-conducting metal. Furthermore, it is also known that the molding compound consists of a curable synthetic material ¬ . From US 2004/0226707 Al a plastic heat sink is known, wherein the plastic matrix of the plastic heat sink is interspersed with wär ¬ meleitendem material and it has a wärmeleiten ¬ de, deformable and adhesive side for application to a device to be cooled.
Aus DE 601 30 176 T2 ist ein wärmeleitendes Schichtmaterial bekannt, das durch Druck- oder Pressverbinden mit einer leitenden Folie über eine Grundschicht hergestellt wird. Weiter- hin wird offenbart, dass bei Verwendung einer magnetischen Folie, die Wirkung der Abschirmung elektromagnetischer Wellen bei der leitenden Folie weiter verbessert wird. Dabei wird das Schichtmaterial als wärmeleitende Schicht zwischen einem wärmeerzeugenden Element und einem wärmezerstreuenden Element verwendet . From DE 601 30 176 T2 a thermally conductive layer material is known, which is produced by pressure or press bonding with a conductive film over a base layer. Further- It is disclosed that, when using a magnetic film, the effect of electromagnetic wave shielding on the conductive film is further improved. In this case, the layer material is used as a heat-conducting layer between a heat-generating element and a heat-dissipating element.
US 2001/0024724 AI offenbart einen Kunststoffkühlkörper der eine Platte aus einer Karbon-Karbon-Matrix enthält, die die Wärmespreizung verbessert ohne die mechanische Stabilität und damit die Gestaltungsfreiheit der Kühlkörper zu beeinträchti¬ gen . US 2001/0024724 AI discloses a plastic heat sink comprising a plate made of a carbon-carbon matrix, which improves the heat spreading without the mechanical stability and thus the freedom of design of the heatsink to impair ¬ gen.
Der Erfindung liegt die Aufgabe zugrunde, einen Kühlkörper vorzuschlagen, der auch bei Vorliegen elektromagnetischer Störstrahlung eine vorteilhafte Lösung bei der Kühlung von elektrischen Baugruppen und Komponenten bietet. The invention has for its object to provide a heat sink, which provides an advantageous solution in the cooling of electrical components and components even in the presence of electromagnetic interference.
Ein Ausführungsbeispiel der Erfindung wird nachfolgend anhand einer Zeichnung näher erläutert. Hierbei zeigen: An embodiment of the invention will be explained in more detail with reference to a drawing. Hereby show:
FIG 1 eine Darstellung der Einzelkomponenten zum Aufbau eines erfindungsgemäßen Kühlkörpers aus Kunststoff und 1 shows a representation of the individual components for constructing a heat sink according to the invention made of plastic and
FIG 2 die Rückseite des erfindungsgemäßen Kühlkörpers nach FIG 1. 2 shows the back of the heat sink according to the invention according to FIG. 1
In FIG 1 ist der Aufbau eines erfindungsgemäßen Kühlkörpers 1 dargestellt, der im Wesentlichen aus elektrisch isolierenden, wärmeleitenden Kunststoff hergestellt ist. Der Kunststoff ist ein Teilchen-/Faser-Verbundwerkstoff für Formteile mit Poly¬ mermatrix aus Elastomeren und elektrisch isolierenden Füllstoffen . In Figure 1, the structure of a heat sink 1 according to the invention is shown, which is made essentially of electrically insulating, heat-conducting plastic. The plastic is a particle / fiber composite material for molded parts with poly ¬ mermatrix of elastomers and electrically insulating fillers.
Im Kühlkörper 1 ist ein EMV-Schirmblech 2 integriert. Anstel- le des EMV-Schirmblechs 2 kann auch eine metallische Platte, z.B. eine Kupferplatte, verwendet werden, die neben ihrer EMV-Schirmung auch den Vorteil einer guten Wärmeleitung hat. Das EMV-Schirmblech 2 ist gemäß FIG 1 mit einem Abstandshal¬ ter 3 verbunden, der zur Anbindung eines zu kühlenden elektrischen Bauteils oder Geräts geeignet ist. FIG 2 zeigt die Rückseite eines erfindungsgemäßen Kühlkörpers 1 im zusammengesetzten Zustand. In the heat sink 1, an EMC shield plate 2 is integrated. Instead of the EMC shielding plate 2, it is also possible to use a metallic plate, eg a copper plate, which in addition to its EMC shielding also has the advantage of good heat conduction. The EMC shield plate 2 is connected according to FIG 1 with a Abstandshal ¬ ter 3, which is suitable for connecting an electrical component to be cooled or device. 2 shows the back of a heat sink 1 according to the invention in the assembled state.

Claims

Patentansprüche claims
1. Kühlkörper (1), der aus einem elektrisch isolierenden, wärmeleitenden Kunststoff besteht, 1. heat sink (1), which consists of an electrically insulating, heat-conducting plastic,
d a d u r c h g e k e n n z e i c h n e t, characterized,
dass ein EMV-Schirmblech (2) in den Kühlkörper (1) integriert ist . an EMC shield plate (2) is integrated in the heat sink (1).
2. Kühlkörper nach Anspruch 1, d a d u r c h g e - k e n n z e i c h n e t , dass der elektrisch isolierende, wärmeleitende Kunststoff ein Teilchen-/Faser-Verbundwerkstoff für Formteile mit Polymermatrix aus Elastomeren und elektrisch isolierenden Füllstoffen ist. 2. Cooling body according to claim 1, characterized in that the electrically insulating, heat-conducting plastic is a particle / fiber composite material for molded parts with polymer matrix of elastomers and electrically insulating fillers.
3. Kühlkörper nach Anspruch 1 oder 2, d a d u r c h g e k e n n z e i c h n e t , dass die Füllstoffe keramische Teilchen oder Glasfasern sind. 3. A heat sink according to claim 1 or 2, wherein a filler is ceramic particles or glass fibers.
4. Kühlkörper nach einem der vorangehenden Ansprüche, d a - d u r c h g e k e n n z e i c h n e t , dass das EMV- Schirmblech (2) mit einem Abstandshalter (3) verbunden ist. 4. The heat sink according to claim 1, wherein the EMC shielding plate (2) is connected to a spacer (3).
5. Kühlkörper nach einem der vorangehenden Ansprüche, d a d u r c h g e k e n n z e i c h n e t , dass der Ab- Standshalter (3) zur Anbindung eines zu kühlenden elektrischen Bauteils oder Geräts geeignet ist. 5. Heatsink according to one of the preceding claims, d a d u r c h e k e n e c i n e in that the Abstand holder (3) for connecting an electrical component or device to be cooled is suitable.
6. Kühlkörper nach einem der vorangehenden Ansprüche, d a d u r c h g e k e n n z e i c h n e t , dass anstelle des EMV-Schirmblechs (2) eine wärmeleitfähige Platte in den Kühl¬ körper (1) integriert ist. 6. Heatsink according to one of the preceding claims, characterized in that instead of the EMC shielding plate (2) a thermally conductive plate in the cooling ¬ body (1) is integrated.
PCT/EP2014/069128 2013-09-19 2014-09-09 Heat sink WO2015039920A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102013218826.9A DE102013218826A1 (en) 2013-09-19 2013-09-19 heatsink
DE102013218826.9 2013-09-19

Publications (1)

Publication Number Publication Date
WO2015039920A1 true WO2015039920A1 (en) 2015-03-26

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ID=51589263

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DE (1) DE102013218826A1 (en)
WO (1) WO2015039920A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107708342A (en) * 2016-08-05 2018-02-16 罗伯特·博世有限公司 Housing and manufacture method for electronic control unit
US11150700B2 (en) 2018-11-02 2021-10-19 Microsoft Technology Licensing, Llc Radio frequency filter fin pack design in consumer electronics

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106488690B (en) * 2016-11-16 2019-01-25 国电南瑞科技股份有限公司 A water-cooled radiator with low electromagnetic interference

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Publication number Priority date Publication date Assignee Title
US3325582A (en) * 1964-08-27 1967-06-13 Bosch Gmbh Robert Arrangement for supporting and for conducting heat away from a semiconductor element in a capsule of electrically conductive material
DE2511010A1 (en) 1975-03-13 1976-09-23 Bosch Gmbh Robert Cooling for electronic components - involves using components embedded in heat conductive mass of metal powder in resin which has large heat transfer surface
US5294826A (en) * 1993-04-16 1994-03-15 Northern Telecom Limited Integrated circuit package and assembly thereof for thermal and EMI management
JP2000124660A (en) * 1998-10-12 2000-04-28 Polymatech Co Ltd Heat-conductive electromagnetic wave shield sheet
WO2001069996A1 (en) * 2000-03-15 2001-09-20 Infineon Technologies Ag Device for cooling an electric module
US20010024724A1 (en) 2000-02-01 2001-09-27 Mccullough Kevin A. Heat sink assembly with overmolded carbon matrix
US20040036162A1 (en) * 2002-08-21 2004-02-26 Shih-Fang Chuang Integrated circuit package with heatsink support
US20040118579A1 (en) * 2002-12-19 2004-06-24 3M Innovative Properties Company Flexible heat sink
US20040226707A1 (en) 2001-08-23 2004-11-18 Sagal E. Mikhail Method of manufacturing an elastomeric heat sink with a pressure sensitive adhesive backing
EP1873827A1 (en) * 2005-04-06 2008-01-02 Kabushiki Kaisha Toyota Jidoshokki Heat sink device
DE60130176T2 (en) 2000-08-10 2008-01-10 Kitagawa Industries Co., Ltd., Nagoya Thermally conductive plate with conductor foil
US20130049187A1 (en) * 2011-08-24 2013-02-28 Masanori Minamio Resin-diamagnetic material composite structure, method for producing the same, and semiconductor device using the same
US20130202848A1 (en) * 2012-02-03 2013-08-08 Samsung Electronics Co., Ltd. Functional sheet

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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DE2511010A1 (en) 1975-03-13 1976-09-23 Bosch Gmbh Robert Cooling for electronic components - involves using components embedded in heat conductive mass of metal powder in resin which has large heat transfer surface
US5294826A (en) * 1993-04-16 1994-03-15 Northern Telecom Limited Integrated circuit package and assembly thereof for thermal and EMI management
JP2000124660A (en) * 1998-10-12 2000-04-28 Polymatech Co Ltd Heat-conductive electromagnetic wave shield sheet
US20010024724A1 (en) 2000-02-01 2001-09-27 Mccullough Kevin A. Heat sink assembly with overmolded carbon matrix
WO2001069996A1 (en) * 2000-03-15 2001-09-20 Infineon Technologies Ag Device for cooling an electric module
DE60130176T2 (en) 2000-08-10 2008-01-10 Kitagawa Industries Co., Ltd., Nagoya Thermally conductive plate with conductor foil
US20040226707A1 (en) 2001-08-23 2004-11-18 Sagal E. Mikhail Method of manufacturing an elastomeric heat sink with a pressure sensitive adhesive backing
US20040036162A1 (en) * 2002-08-21 2004-02-26 Shih-Fang Chuang Integrated circuit package with heatsink support
US20040118579A1 (en) * 2002-12-19 2004-06-24 3M Innovative Properties Company Flexible heat sink
EP1873827A1 (en) * 2005-04-06 2008-01-02 Kabushiki Kaisha Toyota Jidoshokki Heat sink device
US20130049187A1 (en) * 2011-08-24 2013-02-28 Masanori Minamio Resin-diamagnetic material composite structure, method for producing the same, and semiconductor device using the same
US20130202848A1 (en) * 2012-02-03 2013-08-08 Samsung Electronics Co., Ltd. Functional sheet

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CHUNG D D L ED - RODRGUEZ-REINOSO FRANCISCO KYOTANI TAKASHI GOGOTSI YURY: "Electromagnetic interference shielding effectiveness of carbon materials", CARBON, ELSEVIER, OXFORD, GB, vol. 39, no. 2, 1 February 2001 (2001-02-01), pages 279 - 285, XP004319850, ISSN: 0008-6223, DOI: 10.1016/S0008-6223(00)00184-6 *
XIANGCHENG LUO ET AL: "Electromagnetic interference shielding using continuous carbon-fiber carbon-matrix and polymer-matrix composites", COMPOSITES PART B: ENGINEERING, vol. 30, no. 3, 1 April 1999 (1999-04-01), pages 227 - 231, XP055163353, ISSN: 1359-8368, DOI: 10.1016/S1359-8368(98)00065-1 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107708342A (en) * 2016-08-05 2018-02-16 罗伯特·博世有限公司 Housing and manufacture method for electronic control unit
US11150700B2 (en) 2018-11-02 2021-10-19 Microsoft Technology Licensing, Llc Radio frequency filter fin pack design in consumer electronics

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