WO2015012254A1 - Optical display device manufacturing system - Google Patents

Abstract

This optical display device manufacturing system is provided with: an image pickup apparatus (210), which is disposed to face a first surface of a laminated body (S) wherein a sheet piece (FA), as an optical member (F), is bonded to an optical display component (P), and which picks up an image of the laminated body (S); a lighting apparatus (240), which is disposed to face a second surface of the laminated body (S), said second surface being on the reverse side of the first surface, and which lights the laminated body (S); a light shielding plate (250), which is disposed between the lighting apparatus (240) and the laminated body (S), and which shields a part of the optical display component (P) from light; and a cutting apparatus (220), which cuts a part of the sheet piece (FA) on the basis of the picked up image of the laminated body (S), said picked up image having been obtained from the image pickup apparatus (210).

Description

Optical display device production system

The present invention relates to an optical display device production system.
This application claims priority on July 23, 2013 based on Japanese Patent Application No. 2013-152991 filed in Japan, the contents of which are incorporated herein by reference.

Conventionally, in a production system of an optical display device such as a liquid crystal display, a mother panel is formed by sandwiching and bonding a liquid crystal layer between two mother glasses, and then the mother panel is divided into a plurality of liquid crystal panels (optical display components). ) Is used (so-called multi-chamfering). The mother panel can be divided into a plurality of liquid crystal panels by, for example, imprinting a scribe line on the mother glass, then pressurizing and dividing along the scribe line (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 11-90900

The liquid crystal panel is bonded with optical members such as a polarizing film, a retardation film, and a brightness enhancement film. The optical member is cut into a sheet piece that is slightly larger than the display area in consideration of variations in dimensions of the liquid crystal panel and the sheet piece, and a bonding variation (positional deviation) of the sheet piece with respect to the liquid crystal panel. Therefore, there is a problem that an extra area (frame part) is formed around the display area, and downsizing of the device is hindered.

Therefore, the present applicant has proposed a method in which a sheet piece larger than the liquid crystal panel is cut out and bonded to the liquid crystal panel, and then the sheet piece is cut in accordance with the external dimensions of the liquid crystal panel. According to this method, since the optical member can be cut out in accordance with the outer shape of the liquid crystal panel, the frame portion of the liquid crystal panel can be reduced to enlarge the display area and downsize the device.

In this method, it is necessary to detect the outer peripheral edge of the bonding surface of the liquid crystal panel over the sheet piece and cut the sheet piece along the outer peripheral edge. However, when the liquid crystal panel is manufactured by multi-chamfering, burrs or misalignment of the end surface position between the upper and lower substrates occurs on the end surface of the liquid crystal panel, and the original bonding surface when the bonding surface is seen over the sheet piece. And the edges of burrs and lower substrates (substrates on the opposite side of the bonding side) are visually recognized together with the bonding surface, and their boundaries may not be recognized. For this reason, when detecting the bonding surface through the sheet piece, there has been a demand for means capable of accurately detecting only the bonding surface while eliminating the influence of burrs and displacement of the end surface position between the upper and lower substrates.

An object of the present invention is to detect an outer peripheral edge of a bonding surface of an optical display component with high accuracy, and to process an optical member based on the detected outer peripheral edge. An object of the present invention is to provide an optical display device production system that can be easily produced.

(1) The production system of an optical display device of the present invention is arranged so that a sheet piece as an optical member faces a first surface of a laminate, which is bonded to an optical display component, and an image of the laminate is displayed. An imaging device that captures an image, an illumination device that is disposed to face the second surface of the laminate that is opposite to the first surface, and that illuminates the laminate, and between the illumination device and the laminate And a light shielding plate that shields a part of the optical display component, and a cutting device that cuts a part of the sheet piece based on a captured image of the laminate from the imaging device.

Here, “the area inside the bonding surface” refers to the area inside the outline of the bonding surface (the center side of the area surrounded by the outline). “Shielding the area inside the bonding surface” means shielding at least a part of the area inside the outline of the bonding surface and in the vicinity of the outline.

(2) In the optical display device production system according to (1), at least a part of the outer edge of the optical display component is locally illuminated with light from the illumination device. A part of the optical display component may be shielded from light.

(3) In the optical display device production system according to (1) or (2), at least a part of an outer edge portion of the optical display component of the light shielding plate is illuminated with light from the illumination device. Thus, it may be arranged so as to cover a part of the optical display component.

(4) In the optical display device production system according to any one of (1) to (3), the optical display component may include two substrates bonded to each other.

(5) In the optical display device production system according to any one of (1) to (4), the imaging device is disposed at a position corresponding to a plurality of corners of the optical display component. You may have a some camera unit.

(6) In the optical display device production system according to any one of (1) to (5) above, the distance between the outer peripheral edge of the light shielding plate and the outer peripheral edge of the optical display component is 0. It may be 3 mm or more and 2 mm or less.

(7) The optical display device production system according to any one of (1) to (6) may further include a bonding apparatus that bonds the sheet piece to the optical display component.

According to the present invention, the outer peripheral edge of the bonding surface of the optical display component is accurately detected, and by processing the optical member based on the detected outer peripheral edge, the narrowed optical display device is obtained. An optical display device production system that can be easily produced can be provided.

It is a schematic sectional drawing which shows the production system of an optical display device. It is a schematic diagram which shows an optical member sheet | seat. It is a schematic diagram which shows a mode that a laminated body is imaged using an imaging device. It is a cross-sectional schematic diagram which shows a mode that the outer periphery of the bonding surface of a liquid crystal panel and a sheet piece is imaged from the side by which the sheet piece was bonded. It is a figure which shows an example of the method of cut | disconnecting a sheet piece along the outer periphery of the bonding surface based on the image of the laminated body imaged by the imaging device. It is a figure which shows the image of the corner | angular part of a laminated body when the edge of an upper and lower board | substrate corresponds.

Hereinafter, a production system for an optical display device according to the present embodiment will be described with reference to FIGS.

An optical display device is obtained by bonding an optical member to at least one surface of an optical display component and performing an electronic component mounting process on a terminal portion of the optical display component as necessary. In this embodiment, a liquid crystal panel is illustrated as an optical display component, and a polarizing plate is illustrated as an optical member, but the optical display component and the optical member are not limited to these. As the optical display component, an organic EL panel or the like can be used in addition to the liquid crystal panel. As the optical member, in addition to the polarizing plate, a retardation film or a brightness enhancement film can be used.

FIG. 1 is a schematic cross-sectional view showing the main configuration of an optical display device production system 100 (hereinafter, production system 100). The production system 100 cuts the sheet piece FA into the optical member F by bonding the sheet piece FA to the liquid crystal panel (optical display component) P conveyed on the line, and forms the optical member F. The cutting part 20 which manufactures the optical member bonding body which has F and liquid crystal panel P is provided.

(Pasting part)
The bonding unit 10 includes a transport device 11 that transports the belt-shaped optical member sheet F1 in the longitudinal direction of the optical member sheet F1, a cutting device 12 that cuts out the sheet piece FA from the optical member sheet F1, and the sheet piece FA as a liquid crystal panel. And a bonding device 13 for bonding to the upper surface of P.

FIG. 2 is a schematic diagram showing the optical member sheet F1. As shown in FIG. 2, the optical member sheet F <b> 1 is a belt-shaped optical member original fabric F <b> 2 from which a sheet piece FA to be bonded to the liquid crystal panel P is obtained by cutting to a unit length, And a separator sheet F3 provided in a stacked manner. The separator sheet F3 is used as a carrier for conveying the optical member original fabric F2.

An adhesive layer F4 is provided between the optical member original fabric F2 and the separator sheet F3. The optical member original fabric F2 is cut into a unit length (sheet piece FA unit) along a cut line C formed over the entire width in the width direction of the optical member sheet F1 together with the adhesive layer F4. Become. The sheet piece FA is peeled from the separator sheet F3 and bonded to the upper surface of the liquid crystal panel P as will be described later.

Returning to FIG. 1, the conveying device 11 holds the original roll R1 around which the belt-shaped optical member sheet F1 is wound, and also feeds the optical member sheet F1 along the longitudinal direction of the optical member sheet F1. And a winding unit 112 that holds the separator roll R2 that winds up the separator sheet F3 that has been separated from the sheet piece FA.

Although not shown, the transport device 11 has a plurality of guide rollers for winding the optical member sheet F1 along a predetermined transport path. The optical member sheet F1 has a width that is wider than the substrate on the side on which the sheet pieces of the liquid crystal panel P are bonded in the horizontal direction (sheet width direction) orthogonal to the conveying direction of the optical member sheet F1.

The unwinding unit 111 and the winding unit 112 are driven in synchronization with each other, for example. Thereby, the operation of the unwinding unit 111 that feeds the optical member sheet F1 in the transport direction and the operation of the winding unit 112 that winds up the separator sheet F3 are synchronized, and the slack of the optical member sheet F1 and the separator sheet F3 is suppressed. To do. The unwinding unit 111 and the winding unit 112 convey the optical member sheet F1 unwound from the original fabric roll R1 toward the cutting device 12 side with the optical member original fabric F2 side facing.

The cutting device 12 is disposed facing the optical member original fabric F2 in the process of conveying the optical member sheet F1. The cutting device 12 includes, for example, a circular cutting blade, and is configured to be movable in the set cutting direction of the optical member sheet F1.

The cutting device 12 cuts the optical member original fabric F2 included in the optical member sheet F1 over the entire width in the sheet width direction of the optical member sheet F1 every time the optical member sheet F1 is fed out by a preset unit length. . A cut line C is formed in the cut optical member sheet F1 over the entire width of the optical member original fabric F2 in the sheet width direction. The range defined by the cut line C is the sheet piece FA, and the cutting device 12 forms the sheet piece FA on the separator sheet F3. The length of the sheet piece FA in the conveyance direction of the optical member sheet F1 is longer than the length of the substrate on the side on which the sheet piece of the liquid crystal panel P is bonded.

In the following description, not cutting all of the thickness direction of the optical member sheet F1, but cutting the optical member original fabric F2 in a state where at least a part of the separator sheet F3 is connected is referred to as “half cut”. Sometimes called.

In order to prevent the optical member sheet F1 (separator sheet F3) from being broken by the tension acting during the conveyance of the optical member sheet F1, the cutting device 12 advances and retracts the cutting blade so that a predetermined thickness remains on the separator sheet F3. And half-cut to the vicinity of the interface between the adhesive layer F4 and the separator sheet F3. In addition, you may burn out using the apparatus which inject | emits a laser beam instead of a cutting blade.

The size and shape of the sheet piece FA formed by the cutting device 12 can be arbitrarily set according to the shape of the optical member, the setting direction of the optical axis in the optical member, and the like. In the present embodiment, the optical member sheet F1 is half-cut in a direction intersecting with the longitudinal direction of the optical member sheet F1, and a cut line C is formed in the optical member sheet F1 with a predetermined interval, thereby forming a sheet piece FA. Have gained.

The laminating apparatus 13 winds the optical member sheet F1 at an acute angle and separates the sheet piece FA from the separator sheet F3, holds the sheet piece FA, and transports and pastes it onto the liquid crystal panel P. It has the bonding head 132 to combine, and the mounting base 133 by which liquid crystal panel P is mounted and the liquid crystal panel P and sheet piece FA are bonded.

The peeling portion 131 is positioned below the optical member sheet F1 that is conveyed substantially horizontally with the separator sheet F3 side downward in FIG. 1, and extends at least over the entire width of the optical member sheet F1 in the sheet width direction. . An optical member sheet F1 after half cut is wound around the peeling portion 131 so that the separator sheet F3 side is in contact therewith.

The tip 131a of the peeling part 131 is formed at an acute angle in a sectional view. When the optical member sheet F1 is folded at an acute angle at the distal end portion 131a of the peeling portion 131, the sheet piece FA is turned up and peeled from the separator sheet F3 starting from the cut line C formed by the above-described half cut. When the sheet piece FA is peeled off, the adhesive layer F4 formed between the sheet piece FA and the separator sheet F3 is peeled off from the separator sheet F3 together with the sheet piece FA. Therefore, in the sheet piece FA that peels from the separator sheet F3, the adhesive layer F4 is disposed on the lower surface.

The pasting head 132 has an arc-shaped holding surface 132a that is parallel to the sheet width direction and convex downward. The holding surface 132a has, for example, a weaker adhesion force than the adhesive layer F4 of the sheet piece FA, and can repeatedly perform the adhesion and peeling of the sheet piece FA.

Further, the bonding head 132 has a driving device (not shown), can move up and down by a predetermined amount above the peeling portion 131 (tip portion 131a) and above a mounting table 133 described later, and is mounted on the peeling portion 131. It can be appropriately moved between the table 133. Furthermore, the bonding head 132 can be translated (rotated) in both the forward and reverse directions around the normal line of the placement surface for horizontal position correction.

The pasting head 132 is configured to be tiltable along the curvature of the holding surface 132a around the axis along the sheet width direction of the optical member sheet F1. Tilt of the bonding head 132 is appropriately performed when the sheet piece FA is bonded and held, and when the bonded sheet piece FA is bonded to the liquid crystal panel P.

The mounting table 133 mounts the liquid crystal panel P, and can be translated and rotated for horizontal position correction.

Furthermore, the bonding unit 10 is disposed below the leading end 131a of the peeling unit 131, and is bonded and held on the holding surface 132a and the first detection camera 141 that detects the leading end of the sheet piece FA on the downstream side of the sheet conveyance. A second detection camera 142 that images the sheet piece FA and a third detection camera 143 that images the liquid crystal panel P on the mounting table 133 are provided. It is also possible to use sensors in place of the detection cameras 141 to 143.

Such a bonding part 10 is driven as follows as a whole.
When the optical member sheet F1 is fed out, for example, when the first detection camera 141 detects the downstream end of the sheet piece FA, the transport device 11 temporarily stops, and the cutting device 12 half-cuts the optical member sheet F1. That is, the distance along the sheet conveyance path between the detection position by the first detection camera 141 (the optical axis extension position of the first detection camera 141) and the cutting position by the cutting device 12 (the cutting blade advance / retreat position of the cutting device 12) is This corresponds to the length of the sheet piece FA.

The cutting device 12 is movable along the sheet conveyance path, and the distance along the sheet conveyance path between the detection position by the first detection camera 141 and the cutting position by the cutting device 12 can be changed. it can. For example, when the length of the created sheet piece FA is different from the preset standard of the sheet piece FA, the deviation is corrected by the movement of the cutting device 12, and the sheet piece FA having a predetermined length is formed. can do. Further, the sheet pieces FA having different lengths can be formed by the movement of the cutting device 12.

At the same time, the bonding head 132 is tilted so that the curved one end 132x of the holding surface 132a is on the lower side (inclined to the right in FIG. 1; indicated by the symbol α). The curved one end side 132x of the holding surface 132a is pressed from above, and the downstream end of the sheet piece FA at the leading end 131a is adhered to the holding surface 132a. Thereafter, the connection between the bonding head 132 and the driving device is cut off so that the bonding head 132 can be tilted.

When the unwinding unit 111 and the winding unit 112 are driven in this state and the sheet piece FA is unwound, the bonding head 132 is arranged such that the curved other end side 132y of the holding surface 132a is on the lower side (in FIG. 1). Tilt to the left (indicated by the symbol β) and tilt passively. Thereby, the whole sheet piece FA is stuck on the holding surface 132a.

The laminating head 132 holding the sheet piece FA moves above the mounting table 133. At that time, the sheet piece FA held by the bonding head 132 is imaged by the second detection camera 142 when moving from above the peeling unit 131 to above the mounting table 133. The captured image data is sent to a control device (not shown), and the holding posture of the sheet piece FA on the holding surface 132a of the bonding head 132 (the position in the horizontal direction, the rotation angle around the normal line of the holding surface 132a). Detected.

The liquid crystal panel P mounted on the mounting table 133 is imaged by the third detection camera 143. The captured image data is sent to a control device (not shown), and the attitude of the liquid crystal panel P on the mounting table 133 (horizontal position, rotation around the normal of the upper surface of the mounting table on which the liquid crystal panel P is mounted) Angle) is detected.

The bonding head 132 and the mounting table 133 adjust the relative positions of the sheet piece FA and the liquid crystal panel P based on the detected position of the sheet piece FA and the liquid crystal panel P, respectively. In the mounting table 133, the bonding head 132 is actively tilted, for example, by the operation of a driving device, and a sheet piece is formed on the upper surface of the liquid crystal panel P mounted on the mounting table 133 along the curvature of the holding surface 132a. Press the FA and paste it securely.

Thereby, the laminate S in which the sheet piece FA as the optical member and the liquid crystal panel P as the optical display component are bonded is formed. By bonding the liquid crystal panel P and the sheet piece FA, the relative positions of which are adjusted, the bonding variation of the sheet piece FA is suppressed, and the accuracy of the optical axis direction of the sheet piece FA with respect to the liquid crystal panel P is improved. The display device is enhanced in definition and contrast.

When the cutting device 12 half-cuts the optical member sheet F1, the first detection camera 141 may also detect a defect mark marked on the optical member original fabric F2 of the optical member sheet F1. The defect mark is provided by using an ink jet apparatus or the like on the optical member original fabric F2 at the defect location found in the optical member sheet F1 when the original fabric roll R1 is manufactured. The sheet piece FA in which the defect mark is detected is pasted on the pasting head 132, and is not pasted on the liquid crystal panel P, but is moved to a separately disposed pasting position and pasted on a waste material sheet or the like. In addition, when the defect mark is detected, the cutting device 12 may be moved, cut shorter than the sheet piece FA that can be bonded to the liquid crystal panel P, and the portion including the defect mark may be cut and discarded.

(Cutting part)
The cutting unit 20 includes an imaging device 210 that captures an image of the stacked body S, an optical member F that is a portion facing the display area of the liquid crystal panel P, the sheet piece FA included in the stacked body S, and the optical member F. A cutting device 220 that separates the excess portion FX on the outside and a control device 230 that controls the cutting device 220 based on an image (captured image) captured by the imaging device 210 are provided. Furthermore, the illumination device 240 that illuminates the laminate S from the side opposite to the imaging device 210 across the laminate S, and a part of the liquid crystal panel P (liquid crystal) are disposed between the illumination device 240 and the laminate S. And a light shielding plate 250 that shields light from a substrate on the side of the panel P to which the sheet piece FA is bonded and a region inside the bonding surface of the sheet piece FA. In other words, the imaging device 210 is disposed so as to face the first surface S1 on which the sheet pieces FA in the stacked body S are bonded, and the lighting device 240 is the first surface on the opposite side of the first surface S1 in the stacked body S. It arrange | positions so that 2 surface S2 may be faced. The imaging device 210 is disposed adjacent to the first surface S1 of the multilayer body S and facing the first surface S1 of the multilayer body S, and the illumination device 240 is adjacent to the second surface S2 of the multilayer body S. It arrange | positions facing the 2nd surface S1 of the laminated body S. FIG.

Here, “the area inside the bonding surface” refers to the area inside the outline of the bonding surface (the center side of the area surrounded by the outline). “Shielding the area inside the bonding surface” means shielding at least a part of the area inside the outline of the bonding surface and in the vicinity of the outline.

3 to 5 are diagrams for explaining the operation of the cutting unit 20.
FIG. 3 is a schematic diagram illustrating a state in which the stacked body S is imaged using the imaging device 210. First, as shown in FIG. 3, a plurality of imaging devices 210 are used to capture (capture) the periphery of the corner portion of the liquid crystal panel P (portion indicated by a thick line in the drawing) in the stacked body S. The imaging device 210 includes, for example, a plurality of camera units (210) arranged at positions corresponding to a plurality of corners in the liquid crystal panel P, respectively. In the example of FIG. 3, four camera units (210, imaging device) are respectively arranged at positions corresponding to the four corners of the counter substrate P1 having a rectangular shape.

The laminate S has a liquid crystal panel P and a sheet piece FA bonded to the liquid crystal panel P. The liquid crystal panel P has a liquid crystal layer sandwiched between the counter substrate P1 and the element substrate P2. Further, in the liquid crystal panel P, the counter substrate P1 has a smaller area in plan view than the element substrate P2, and one end side of the element substrate P2 is exposed in plan view when the two are overlapped. A terminal portion is provided in the exposed region P3 of the element substrate P2. The sheet piece FA is bonded to the surface of the counter substrate P1. In the stacked body S, the sheet piece FA has a rectangular shape in plan view, and has a larger plan view area than the counter substrate P1.

For such a laminate S, the imaging device 210 is used to image the imaging area AR (see FIG. 5) including the corners of the counter substrate P1. At that time, the lighting device 240 shown in FIG. 1 is used to irradiate the stacked body S by irradiating light L from the side opposite to the imaging device 210 with the stacked body S interposed therebetween. Thereby, compared with the case where the laminated body S is illuminated from the same side as the imaging device 210, it is possible to suppress the halation caused by the reflected light generated in the sheet piece FA. Note that a blue LED is used as the illumination device 240.

The image data of the image captured by the imaging device 210 is input to the control device 230, and the next processing (image processing, calculation) is performed.

FIG. 4 is a schematic cross-sectional view showing a state in which the outer peripheral edge ED of the bonding surface SA between the liquid crystal panel P and the sheet piece FA is imaged from the side where the sheet piece FA is bonded at the corner portion K of the liquid crystal panel P. is there. Here, the “bonding surface” refers to the surface facing the sheet piece FA of the liquid crystal panel P, and the “outer peripheral edge of the bonding surface” specifically refers to the sheet piece FA on the liquid crystal panel P. It refers to the outer peripheral edge of the combined substrate (the counter substrate P1 in FIG. 4). In other words, on the first surface S1 side of the laminate S, the sheet piece FA is bonded onto the bonding surface SA.

The liquid crystal panel P of this embodiment is manufactured by multi-chamfering. For this reason, in the vicinity of the corner K of the liquid crystal panel P, burrs, displacement of the end surface position between the upper and lower substrates P1 and P2, and the like may occur. As shown in FIG. 4, when the outer peripheral edge of the element substrate P <b> 2 is shifted outward from the outer peripheral edge of the counter substrate P <b> 1, the outer peripheral edge of the counter substrate P <b> 1 and the outer peripheral edge of the element substrate P <b> 2 are Detected. As the element substrates P1 and P2, for example, a substrate having translucency is used.

When detecting the outer peripheral edge ED of the bonding surface SA of the counter substrate P1 and the sheet piece FA from the side where the sheet piece FA of the laminate S is bonded, the focus of the imaging device 210 is set to the upper surface of the sheet piece FA. It is preferable to match. Thereby, the outer periphery of the counter substrate P1 can be imaged more clearly than the outer periphery of the element substrate P2, and the outer periphery ED of the bonding surface SA can be easily detected. However, when the liquid crystal panel P is imaged through the sheet piece FA, the outer peripheral edge of the counter substrate P1 may be slightly blurred, and the outer peripheral edge of the element substrate P2, which is originally different from the bonding surface SA, is visible together with the bonding surface SA. And their boundaries may become unrecognizable.

Therefore, in the cutting unit 20 of the present embodiment, a light shielding plate 250 that shields a region inside the bonding surface SA between the counter substrate P1 and the sheet piece FA is installed between the lighting device 240 and the stacked body S. Only the vicinity of the outer peripheral edge ED of the bonding surface SA is irradiated with the light L. According to this configuration, only the light L emitted substantially vertically from directly below the outer peripheral edge of the bonding surface SA is incident on the imaging device 210. Therefore, the light L that contributes to imaging can be approximated to straight light that is perpendicularly incident on the stacked body S, and contributes to increasing the contrast of the image of the outer peripheral edge of the counter substrate P1.

The reason why the outer peripheral edge of the counter substrate P1 is blurred is not clear, but according to the study of the present inventor, it is presumed that the light L obliquely incident on the laminate S affected the blurring of the outer peripheral edge. In other words, the light L obliquely incident on the end surface of the counter substrate P1 creates a shadow on the end surface, and the shadow appears blurred due to the influence of reflection, refraction, or change in polarization characteristics of the sheet piece FA. I guess that. Therefore, in the cutting part 20 of the present embodiment, the light L obliquely incident on the end surface of the counter substrate P1 is cut by the light shielding plate 250, thereby suppressing the shadow of the end surface. Thereby, the outer periphery of the counter substrate P1 is imaged as a clear line, and the outer periphery ED of the bonding surface SA can be accurately detected.

The light shielding area BA that is shielded by the light shielding plate 250 is preferably an area as close as possible to the outer periphery of the counter substrate P1 in the imaging area of the imaging device 210. In one example, the light shielding plate 250 can be disposed so as to shield the entire range of the imaging region excluding the vicinity of the outer peripheral edge ED of the bonding surface SA (slit illumination and frame illumination along the outer peripheral edge ED). In another example, the light shielding plate 250 can be disposed so as to shield only the area inside the outer peripheral edge ED of the bonding surface SA. The light shielding plate 250 may be disposed so as to border the outer peripheral edge ED of the bonding surface SA. In other words, the light shielding plate 250 shields a part of the liquid crystal panel P from the illumination device 240 so that at least a part of the outer edge of the liquid crystal panel P is locally illuminated by the light from the illumination device 240. Are arranged as follows. Or, in other words, the light shielding plate 250 is disposed so as to cover a part of the liquid crystal panel P so that at least a part of the outer edge of the liquid crystal panel P is illuminated with light from the illumination device 240. In the present embodiment, the light shielding plate 250 is configured as a rectangular plate (for example, an aluminum plate) slightly smaller than the counter substrate P1. The distance d1 between the outer periphery of the counter substrate P1 and the outer periphery of the element substrate P2 is, for example, 0.1 mm, and the distance d2 between the outer periphery of the element substrate P2 and the outer periphery of the light shielding plate 250 is, for example, 1 mm. The distance d3 between the outer peripheral edge of the light shielding plate 250 and the outer peripheral edge of the counter substrate P1 is, for example, 0.9 mm.

The distance d3 between the outer peripheral edge of the light shielding plate 50 and the outer peripheral edge of the counter substrate P1 is preferably 0.3 mm or more and 2 mm or less, for example. In this example, when d3 is larger than 2 mm, the directivity of the light L cannot be sufficiently increased, and the detection accuracy of the outer peripheral edge ED of the bonding surface SA is lowered. Moreover, in this example, when d3 is smaller than 0.3 mm, the light quantity of the light L that illuminates the outer peripheral edge ED of the bonding surface SA becomes small, resulting in a dark image. Therefore, also in this case, the detection accuracy of the outer peripheral edge ED of the bonding surface SA is lowered. In this example, by setting d3 to 0.3 mm or more and 2 mm or less, it is possible to capture an image of the outer peripheral edge of the counter substrate P1 as a clear line, and the detection accuracy of the outer peripheral edge ED of the bonding surface SA is increased. Each of the above distances is appropriately set according to the type and shape (thickness, etc.) of the substrate. The above numerical value is an example, and the present invention is not limited to this.

4 illustrates the case where the positions of the outer peripheral edges of the upper and lower substrates P1 and P2 are displaced, but the same phenomenon can occur even when the positions of the outer peripheral edges of the upper and lower substrates match. In this case, the directivity of the light L incident on the outer peripheral edge ED of the bonding surface SA is increased by shielding the inner region (region other than the outer edge portion) of the bonding surface SA with the light shielding plate 250, and bonding. It is possible to suppress blurring of the outline of the outer peripheral edge ED of the surface SA.

FIGS. 6A and 6B show images of the corners of the laminate when the edges of the upper and lower substrates match. FIG. 6A is an image when a light shielding plate is not provided between the lighting device and the laminate, and FIG. 6B is a case where a light shielding plate is provided between the lighting device and the laminate. It is an image. In the example of FIG. 6A, the outline of the counter substrate looks blurred as if blurred, but in the example of FIG. 6B, the outline of the counter substrate is recognized as a clear thin line. Therefore, it turns out that the detection accuracy of the outer periphery of a bonding surface is improved by installing a light-shielding plate between an illuminating device and a laminated body.

FIG. 5 is a diagram illustrating an example of a method of cutting the sheet piece FA along the outer peripheral edge of the bonding surface based on the image of the stacked body S imaged by the imaging device 210.

First, as shown in FIG. 5A, the coordinates of a plurality of points D that overlap with the outline (side) of the counter substrate are detected from the image data in the imaging area AR of each imaging device. The detection of the coordinates of the point D is performed on each of two sides sandwiching the corner portion CX of the counter substrate. It is preferable to detect the coordinates of a plurality of points that overlap each side. The coordinate axes of the coordinates to be detected are set, for example, with a predetermined position in the imaging area AR as the origin, the right direction of the image as the + X direction, and the downward direction of the image as the + Y direction.

Next, as shown in FIG. 5B, a straight line corresponding to the side overlapping the point D is approximated from the coordinates of the plurality of points D. As the approximation, a generally known statistical method can be used. For example, an approximation method for obtaining a regression line (approximate line) using the least square method can be given. In this case, due to the influence of burrs formed at the corner CX, the variation in the coordinates of the point D near the corner CX increases, which may adversely affect the calculation result of the approximate straight line. In such a case, an approximate straight line may be obtained using the remaining points D excluding the points D in the vicinity of the corner CX.

Next, as shown in FIG. 5C, an approximate contour OL of the counter substrate is obtained based on the approximate straight line obtained for each side. In this embodiment, this approximate contour OL is approximated as the outer periphery (outer periphery of the bonding surface) of the counter substrate. Then, by cutting the sheet piece FA along the approximate contour OL (outer peripheral edge of the bonding surface) by the cutting device 220 shown in FIG. 1, the optical member that is a portion facing the counter substrate is formed. F and a surplus portion FX outside the optical member F are separated.

As described above, the sheet piece FA can be cut substantially along the outer peripheral edge ED of the bonding surface SA shown in FIG. 4, and the optical member F is suitably bonded to the narrowed liquid crystal panel P. can do. Therefore, according to the production system 100 of the present embodiment, the outer peripheral edge ED of the bonding surface SA of the liquid crystal panel P can be detected with high accuracy by eliminating the influence of burrs and the shift of the end surface position between the upper and lower substrates P1, P2. By enabling the processing of the optical member F in accordance with the outer peripheral edge ED of the bonding surface SA, an optical display device with a narrow frame can be easily produced.

In the present embodiment, the sheet piece FA is cut along the approximate contour line OL. However, the present invention is not limited to this, and is, for example, a region inside the approximate contour OL and the frame of the liquid crystal panel P. The sheet piece FA may be cut at a position overlapping the portion (the portion located outside the display area). In that case, after calculating a shape that is smaller than the shape drawn by the approximate contour OL as a true cut portion on the basis of the calculated approximate contour OL, the control device 230 calculates this true cut. The cutting device 220 may be controlled so as to cut the sheet piece FA along the portion.

That is, “cutting the sheet piece FA along the outer peripheral edge ED of the bonding surface SA” is not limited to cutting the sheet piece FA along the actual outer peripheral edge ED detected based on the imaging data. When the sheet piece FA is cut along the approximate contour line OL obtained from the actual outer peripheral edge ED, or along the other cutting line created on the frame portion based on the approximate contour line OL. This also includes the case of cutting off.

As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to such examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

As described above, the optical display device production system 100 according to the present embodiment is an optical display device production system 100 in which the optical member F is bonded to the liquid crystal panel P, and the liquid crystal panel P includes the optical display device production system 100. An imaging device 210 that captures an image of the laminate S formed by laminating a sheet piece FA wider than the surface on the surface of the substrate from the side of the laminate S on which the sheet piece FA is laminated; An illumination device 240 that illuminates the laminate S from the opposite side of the imaging device 210 across the laminate S, and is disposed between the illumination device 240 and the laminate S, and the substrate and the sheet piece Based on the image of the laminated body S imaged by the light-shielding plate 250 which shields the area | region inside the bonding surface SA with FA, and the said imaging device 210, the said sheet piece FA is the outer periphery of the said bonding surface SA. A cutting device 12 for cutting the sheet piece FA into the optical member F, which is a portion facing the substrate, and the excess portion FX outside the optical member F by cutting along D. ing. In the optical display device production system 100 according to this embodiment, the liquid crystal panel P may be formed by bonding two substrates. In the optical display device production system 100 according to the present embodiment, the imaging device 210 may be disposed at positions corresponding to the four corners of the substrate having a rectangular shape. In the optical display device production system 100 according to the present embodiment, the distance between the outer peripheral edge ED of the light shielding plate 250 and the outer peripheral edge ED of the substrate may be 0.3 mm or more and 2 mm or less. Moreover, the production system 100 of the optical display device according to the present embodiment bonds the sheet piece FA wider than the surface to the surface of the substrate included in the liquid crystal panel P, and the liquid crystal panel P and the sheet piece. You may have the bonding apparatus 13 which forms the laminated body S which has FA.

DESCRIPTION OF SYMBOLS 10 Bonding part 11 Conveyance apparatus 12 Cutting apparatus 13 Bonding apparatus 20 Cutting part 100 Production system 210 Imaging apparatus 220 Cutting apparatus 230 Control apparatus 240 Illumination apparatus 250 Light-shielding plate AR Imaging area BA Light-shielding area d1 distance d2 distance d3 distance D point ED Outer peripheral edge of bonding surface F Optical member CX Corner part FA Sheet piece FX Excess part K Corner part L Light OL Approximate outline P Liquid crystal panel (Optical display component)
P1 Counter substrate P2 Element substrate S Laminate SA Bonding surface

Claims (7)

An optical display device production system,
An image pickup device that is arranged so as to face the first surface of the laminate, in which a sheet piece as an optical member is bonded to an optical display component, and that captures an image of the laminate,
An illuminating device that is disposed to face the second surface of the laminate that is opposite to the first surface and that illuminates the laminate;
A light-shielding plate that is disposed between the illumination device and the laminate and shields a part of the optical display component;
An optical display device production system comprising: a cutting device that cuts a part of the sheet piece based on a picked-up image of the laminate from the image pickup device. The said light-shielding plate light-shields a part of said optical display component so that at least one part of the outer edge part in the said optical display component is locally illuminated with the light from the said illuminating device. Optical display device production system. The said light shielding plate is arrange | positioned so that a part of said optical display components may be covered so that only at least one part of the outer edge part in the said optical display components may be illuminated with the light from the said illuminating device. 3. A production system of the optical display device according to 2. 4. The optical display device production system according to claim 1, wherein the optical display component includes two substrates bonded to each other. The optical display device production system according to any one of claims 1 to 4, wherein the imaging apparatus includes a plurality of camera units respectively arranged at positions corresponding to a plurality of corners of the optical display component. The optical display device production system according to any one of claims 1 to 5, wherein a distance between an outer peripheral edge of the light shielding plate and an outer peripheral edge of the optical display component is 0.3 mm or more and 2 mm or less. The production system for an optical display device according to any one of claims 1 to 6, further comprising a bonding apparatus for bonding the sheet piece to the optical display component.

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