WO2014168108A1 - Resin composition containing fluorine compound, molded body, wavelength dispersion adjustment agent, and method for adjusting wavelength dispersion of resin - Google Patents
Resin composition containing fluorine compound, molded body, wavelength dispersion adjustment agent, and method for adjusting wavelength dispersion of resin Download PDFInfo
- Publication number
- WO2014168108A1 WO2014168108A1 PCT/JP2014/060081 JP2014060081W WO2014168108A1 WO 2014168108 A1 WO2014168108 A1 WO 2014168108A1 JP 2014060081 W JP2014060081 W JP 2014060081W WO 2014168108 A1 WO2014168108 A1 WO 2014168108A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- group
- resin
- bis
- fluorene
- epoxy compound
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 55
- 229920005989 resin Polymers 0.000 title claims description 99
- 239000011347 resin Substances 0.000 title claims description 99
- 239000006185 dispersion Substances 0.000 title claims description 40
- 238000000034 method Methods 0.000 title claims description 29
- 239000003795 chemical substances by application Substances 0.000 title description 10
- 150000002222 fluorine compounds Chemical class 0.000 title 1
- 150000001875 compounds Chemical class 0.000 claims abstract description 141
- 239000004593 Epoxy Substances 0.000 claims abstract description 92
- 239000003822 epoxy resin Substances 0.000 claims abstract description 29
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 29
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 27
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 21
- 125000003277 amino group Chemical group 0.000 claims abstract description 10
- 125000001424 substituent group Chemical group 0.000 claims abstract description 9
- 125000003396 thiol group Chemical group [H]S* 0.000 claims abstract description 6
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 claims abstract 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 claims description 184
- -1 acryloyloxy group Chemical group 0.000 claims description 159
- 125000003118 aryl group Chemical group 0.000 claims description 34
- 229920002678 cellulose Polymers 0.000 claims description 24
- 125000000217 alkyl group Chemical group 0.000 claims description 22
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 20
- 239000001913 cellulose Substances 0.000 claims description 19
- 239000004645 polyester resin Substances 0.000 claims description 14
- 230000003287 optical effect Effects 0.000 claims description 13
- 229920001225 polyester resin Polymers 0.000 claims description 13
- 229920005992 thermoplastic resin Polymers 0.000 claims description 12
- 239000012788 optical film Substances 0.000 claims description 11
- 229920005672 polyolefin resin Polymers 0.000 claims description 11
- 125000004122 cyclic group Chemical group 0.000 claims description 10
- 229920005668 polycarbonate resin Polymers 0.000 claims description 10
- 239000004431 polycarbonate resin Substances 0.000 claims description 10
- 125000001624 naphthyl group Chemical group 0.000 claims description 9
- 125000003545 alkoxy group Chemical group 0.000 claims description 8
- 239000000654 additive Substances 0.000 claims description 7
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 7
- 239000000113 methacrylic resin Substances 0.000 claims description 7
- HPHCUWNVOLOGRP-UHFFFAOYSA-N 1-[9-(2-hydroxynaphthalen-1-yl)fluoren-9-yl]naphthalen-2-ol Chemical compound C1=CC=C2C(C3(C4=CC=CC=C4C4=CC=CC=C43)C3=C4C=CC=CC4=CC=C3O)=C(O)C=CC2=C1 HPHCUWNVOLOGRP-UHFFFAOYSA-N 0.000 claims description 6
- PTBCCLLVPOLXES-UHFFFAOYSA-N 2-[9-(2-hydroxyphenyl)fluoren-9-yl]phenol Chemical compound OC1=CC=CC=C1C1(C=2C(=CC=CC=2)O)C2=CC=CC=C2C2=CC=CC=C21 PTBCCLLVPOLXES-UHFFFAOYSA-N 0.000 claims description 6
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 4
- 239000003638 chemical reducing agent Substances 0.000 claims description 4
- 230000000996 additive effect Effects 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 2
- RMBPEFMHABBEKP-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2C3=C[CH]C=CC3=CC2=C1 RMBPEFMHABBEKP-UHFFFAOYSA-N 0.000 claims 7
- 125000001153 fluoro group Chemical group F* 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 81
- 150000002220 fluorenes Chemical class 0.000 description 29
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 26
- 239000000178 monomer Substances 0.000 description 24
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 22
- 125000005036 alkoxyphenyl group Chemical group 0.000 description 18
- 235000010980 cellulose Nutrition 0.000 description 18
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 17
- 229920001577 copolymer Polymers 0.000 description 17
- 150000001335 aliphatic alkanes Chemical class 0.000 description 14
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 14
- NQXNYVAALXGLQT-UHFFFAOYSA-N 2-[4-[9-[4-(2-hydroxyethoxy)phenyl]fluoren-9-yl]phenoxy]ethanol Chemical compound C1=CC(OCCO)=CC=C1C1(C=2C=CC(OCCO)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 NQXNYVAALXGLQT-UHFFFAOYSA-N 0.000 description 13
- 150000001336 alkenes Chemical class 0.000 description 13
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 13
- 125000001183 hydrocarbyl group Chemical group 0.000 description 11
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 10
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 10
- 238000006467 substitution reaction Methods 0.000 description 10
- 229930185605 Bisphenol Natural products 0.000 description 9
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 9
- 125000004464 hydroxyphenyl group Chemical group 0.000 description 9
- 238000002834 transmittance Methods 0.000 description 9
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 8
- 150000004945 aromatic hydrocarbons Chemical group 0.000 description 8
- 238000006116 polymerization reaction Methods 0.000 description 8
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 7
- 125000004171 alkoxy aryl group Chemical group 0.000 description 7
- 125000004453 alkoxycarbonyl group Chemical group 0.000 description 7
- 239000013078 crystal Substances 0.000 description 7
- BKQXUNGELBDWLS-UHFFFAOYSA-N 9,9-diphenylfluorene Chemical group C1=CC=CC=C1C1(C=2C=CC=CC=2)C2=CC=CC=C2C2=CC=CC=C21 BKQXUNGELBDWLS-UHFFFAOYSA-N 0.000 description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 6
- 239000003963 antioxidant agent Substances 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 229930195733 hydrocarbon Natural products 0.000 description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 6
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 6
- 229920002284 Cellulose triacetate Polymers 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 5
- 125000002252 acyl group Chemical group 0.000 description 5
- 150000001924 cycloalkanes Chemical class 0.000 description 5
- 150000002009 diols Chemical class 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229920001281 polyalkylene Polymers 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- ODIGIKRIUKFKHP-UHFFFAOYSA-N (n-propan-2-yloxycarbonylanilino) acetate Chemical compound CC(C)OC(=O)N(OC(C)=O)C1=CC=CC=C1 ODIGIKRIUKFKHP-UHFFFAOYSA-N 0.000 description 4
- NUDSREQIJYWLRA-UHFFFAOYSA-N 4-[9-(4-hydroxy-3-methylphenyl)fluoren-9-yl]-2-methylphenol Chemical compound C1=C(O)C(C)=CC(C2(C3=CC=CC=C3C3=CC=CC=C32)C=2C=C(C)C(O)=CC=2)=C1 NUDSREQIJYWLRA-UHFFFAOYSA-N 0.000 description 4
- 229920001634 Copolyester Polymers 0.000 description 4
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 4
- 239000004713 Cyclic olefin copolymer Substances 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 4
- 229920013820 alkyl cellulose Polymers 0.000 description 4
- 125000001118 alkylidene group Chemical group 0.000 description 4
- 229920002301 cellulose acetate Polymers 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 125000005027 hydroxyaryl group Chemical group 0.000 description 4
- 230000001771 impaired effect Effects 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- ILJSQTXMGCGYMG-UHFFFAOYSA-N triacetic acid Chemical compound CC(=O)CC(=O)CC(O)=O ILJSQTXMGCGYMG-UHFFFAOYSA-N 0.000 description 4
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 3
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 3
- XTIUBELQKDSHEO-UHFFFAOYSA-N 2-[[2-[9-[2-(oxiran-2-ylmethoxy)phenyl]fluoren-9-yl]phenoxy]methyl]oxirane Chemical class C1OC1COC1=CC=CC=C1C1(C2=CC=CC=C2C2=CC=CC=C21)C1=CC=CC=C1OCC1CO1 XTIUBELQKDSHEO-UHFFFAOYSA-N 0.000 description 3
- LCSAOPVSVLGDLE-UHFFFAOYSA-N 2-[[4-[9-[4-(oxiran-2-ylmethoxy)phenyl]fluoren-9-yl]phenoxy]methyl]oxirane Chemical compound C1OC1COC(C=C1)=CC=C1C1(C2=CC=CC=C2C2=CC=CC=C21)C(C=C1)=CC=C1OCC1CO1 LCSAOPVSVLGDLE-UHFFFAOYSA-N 0.000 description 3
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical compound OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 description 3
- PCBPVYHMZBWMAZ-UHFFFAOYSA-N 5-methylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(C)CC1C=C2 PCBPVYHMZBWMAZ-UHFFFAOYSA-N 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- 241001120493 Arene Species 0.000 description 3
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 3
- 229920008347 Cellulose acetate propionate Polymers 0.000 description 3
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 3
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 229920001283 Polyalkylene terephthalate Polymers 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 230000003078 antioxidant effect Effects 0.000 description 3
- 229920006217 cellulose acetate butyrate Polymers 0.000 description 3
- 229920003086 cellulose ether Polymers 0.000 description 3
- 125000004093 cyano group Chemical group *C#N 0.000 description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 125000005843 halogen group Chemical group 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 125000005395 methacrylic acid group Chemical group 0.000 description 3
- 125000005487 naphthalate group Chemical group 0.000 description 3
- SJYNFBVQFBRSIB-UHFFFAOYSA-N norbornadiene Chemical compound C1=CC2C=CC1C2 SJYNFBVQFBRSIB-UHFFFAOYSA-N 0.000 description 3
- 150000002848 norbornenes Chemical class 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 229920005862 polyol Polymers 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 3
- 125000004400 (C1-C12) alkyl group Chemical group 0.000 description 2
- 125000004209 (C1-C8) alkyl group Chemical group 0.000 description 2
- 125000006713 (C5-C10) cycloalkyl group Chemical group 0.000 description 2
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 2
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical compound CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 2
- GQEZCXVZFLOKMC-UHFFFAOYSA-N 1-hexadecene Chemical compound CCCCCCCCCCCCCCC=C GQEZCXVZFLOKMC-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- HFDVRLIODXPAHB-UHFFFAOYSA-N 1-tetradecene Chemical compound CCCCCCCCCCCCC=C HFDVRLIODXPAHB-UHFFFAOYSA-N 0.000 description 2
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- IHRQAMGCFUCIAH-UHFFFAOYSA-N 2-[[1-[9-[2-(oxiran-2-ylmethoxy)naphthalen-1-yl]fluoren-9-yl]naphthalen-2-yl]oxymethyl]oxirane Chemical class C1OC1COC1=CC=C2C=CC=CC2=C1C1(C2=CC=CC=C2C2=CC=CC=C21)C(C1=CC=CC=C1C=C1)=C1OCC1CO1 IHRQAMGCFUCIAH-UHFFFAOYSA-N 0.000 description 2
- WWUVJRULCWHUSA-UHFFFAOYSA-N 2-methyl-1-pentene Chemical compound CCCC(C)=C WWUVJRULCWHUSA-UHFFFAOYSA-N 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- YWFPGFJLYRKYJZ-UHFFFAOYSA-N 9,9-bis(4-hydroxyphenyl)fluorene Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 YWFPGFJLYRKYJZ-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- 229920001747 Cellulose diacetate Polymers 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 2
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 2
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 229920002292 Nylon 6 Polymers 0.000 description 2
- 229920002302 Nylon 6,6 Polymers 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000005250 alkyl acrylate group Chemical group 0.000 description 2
- 125000005189 alkyl hydroxy group Chemical group 0.000 description 2
- 125000004414 alkyl thio group Chemical group 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 125000004104 aryloxy group Chemical group 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000001768 carboxy methyl cellulose Substances 0.000 description 2
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 2
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 2
- 229940105329 carboxymethylcellulose Drugs 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 125000001309 chloro group Chemical group Cl* 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229920006038 crystalline resin Polymers 0.000 description 2
- 150000001925 cycloalkenes Chemical class 0.000 description 2
- 125000000392 cycloalkenyl group Chemical group 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- LPIQUOYDBNQMRZ-UHFFFAOYSA-N cyclopentene Chemical compound C1CC=CC1 LPIQUOYDBNQMRZ-UHFFFAOYSA-N 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 125000000623 heterocyclic group Chemical group 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 2
- 239000001863 hydroxypropyl cellulose Substances 0.000 description 2
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 125000005647 linker group Chemical group 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- 125000001160 methoxycarbonyl group Chemical group [H]C([H])([H])OC(*)=O 0.000 description 2
- AEBDJCUTXUYLDC-UHFFFAOYSA-N methyl 5-methylbicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)OC)(C)CC1C=C2 AEBDJCUTXUYLDC-UHFFFAOYSA-N 0.000 description 2
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- CCCMONHAUSKTEQ-UHFFFAOYSA-N octadec-1-ene Chemical compound CCCCCCCCCCCCCCCCC=C CCCMONHAUSKTEQ-UHFFFAOYSA-N 0.000 description 2
- 125000005702 oxyalkylene group Chemical group 0.000 description 2
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 2
- YNPNZTXNASCQKK-UHFFFAOYSA-N phenanthrene Chemical compound C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920001432 poly(L-lactide) Polymers 0.000 description 2
- 229920000747 poly(lactic acid) Polymers 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 125000003367 polycyclic group Chemical group 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 239000004626 polylactic acid Substances 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 229920001567 vinyl ester resin Polymers 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- OJOWICOBYCXEKR-APPZFPTMSA-N (1S,4R)-5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound CC=C1C[C@@H]2C[C@@H]1C=C2 OJOWICOBYCXEKR-APPZFPTMSA-N 0.000 description 1
- JBVMSEMQJGGOFR-FNORWQNLSA-N (4e)-4-methylhexa-1,4-diene Chemical compound C\C=C(/C)CC=C JBVMSEMQJGGOFR-FNORWQNLSA-N 0.000 description 1
- PRBHEGAFLDMLAL-GQCTYLIASA-N (4e)-hexa-1,4-diene Chemical compound C\C=C\CC=C PRBHEGAFLDMLAL-GQCTYLIASA-N 0.000 description 1
- 125000000027 (C1-C10) alkoxy group Chemical group 0.000 description 1
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 description 1
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 description 1
- 125000004191 (C1-C6) alkoxy group Chemical group 0.000 description 1
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 description 1
- 0 ***(CC1)CC(*)CCC1(C1(C2(C3)NC3(*)CC*(*)C2)c2ccccc2-c2ccccc12)N Chemical compound ***(CC1)CC(*)CCC1(C1(C2(C3)NC3(*)CC*(*)C2)c2ccccc2-c2ccccc12)N 0.000 description 1
- CCYZSFPSPHPQPQ-UHFFFAOYSA-N 1,3,4,5,6,8-hexamethyl-2,7-bis(oxiran-2-ylmethoxy)-9-phenyl-9h-xanthene Chemical compound CC1=C2C(C=3C=CC=CC=3)C=3C(C)=C(OCC4OC4)C(C)=C(C)C=3OC2=C(C)C(C)=C1OCC1CO1 CCYZSFPSPHPQPQ-UHFFFAOYSA-N 0.000 description 1
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 1
- QTYUSOHYEPOHLV-FNORWQNLSA-N 1,3-Octadiene Chemical compound CCCC\C=C\C=C QTYUSOHYEPOHLV-FNORWQNLSA-N 0.000 description 1
- BWWOFKDFAGVASS-UHFFFAOYSA-N 1-[4-[9-[4-(2-hydroxypropoxy)-3-methylphenyl]fluoren-9-yl]-2-methylphenoxy]propan-2-ol Chemical compound C1=C(C)C(OCC(O)C)=CC=C1C1(C=2C=C(C)C(OCC(C)O)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 BWWOFKDFAGVASS-UHFFFAOYSA-N 0.000 description 1
- MJMYTWUUAMWUNG-UHFFFAOYSA-N 1-[4-[9-[4-(2-hydroxypropoxy)phenyl]fluoren-9-yl]phenoxy]propan-2-ol Chemical compound C1=CC(OCC(O)C)=CC=C1C1(C=2C=CC(OCC(C)O)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 MJMYTWUUAMWUNG-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- ZGNJHKOQQSEQRR-UHFFFAOYSA-N 2,3-bis(trifluoromethyl)bicyclo[2.2.1]hept-5-ene Chemical compound C1C2C=CC1C(C(F)(F)F)C2C(F)(F)F ZGNJHKOQQSEQRR-UHFFFAOYSA-N 0.000 description 1
- IXYRIJMHJORGEM-UHFFFAOYSA-N 2,3-bis(trifluoromethyl)bicyclo[2.2.1]hepta-2,5-diene Chemical compound C1C2C(C(F)(F)F)=C(C(F)(F)F)C1C=C2 IXYRIJMHJORGEM-UHFFFAOYSA-N 0.000 description 1
- LAZHUUGOLCHESB-UHFFFAOYSA-N 2,3-dimethylbicyclo[2.2.1]hept-5-ene Chemical compound C1C2C(C)C(C)C1C=C2 LAZHUUGOLCHESB-UHFFFAOYSA-N 0.000 description 1
- BCIDSTPBNXYOCW-UHFFFAOYSA-N 2,3-dimethylbicyclo[2.2.1]hepta-2,5-diene Chemical compound C1C2C(C)=C(C)C1C=C2 BCIDSTPBNXYOCW-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- BBBUAWSVILPJLL-UHFFFAOYSA-N 2-(2-ethylhexoxymethyl)oxirane Chemical compound CCCCC(CC)COCC1CO1 BBBUAWSVILPJLL-UHFFFAOYSA-N 0.000 description 1
- VXHYVVAUHMGCEX-UHFFFAOYSA-N 2-(2-hydroxyphenoxy)phenol Chemical class OC1=CC=CC=C1OC1=CC=CC=C1O VXHYVVAUHMGCEX-UHFFFAOYSA-N 0.000 description 1
- BLDLRWQLBOJPEB-UHFFFAOYSA-N 2-(2-hydroxyphenyl)sulfanylphenol Chemical class OC1=CC=CC=C1SC1=CC=CC=C1O BLDLRWQLBOJPEB-UHFFFAOYSA-N 0.000 description 1
- XSVZEASGNTZBRQ-UHFFFAOYSA-N 2-(2-hydroxyphenyl)sulfinylphenol Chemical class OC1=CC=CC=C1S(=O)C1=CC=CC=C1O XSVZEASGNTZBRQ-UHFFFAOYSA-N 0.000 description 1
- QUWAJPZDCZDTJS-UHFFFAOYSA-N 2-(2-hydroxyphenyl)sulfonylphenol Chemical class OC1=CC=CC=C1S(=O)(=O)C1=CC=CC=C1O QUWAJPZDCZDTJS-UHFFFAOYSA-N 0.000 description 1
- XKZQKPRCPNGNFR-UHFFFAOYSA-N 2-(3-hydroxyphenyl)phenol Chemical compound OC1=CC=CC(C=2C(=CC=CC=2)O)=C1 XKZQKPRCPNGNFR-UHFFFAOYSA-N 0.000 description 1
- QYYCPWLLBSSFBW-UHFFFAOYSA-N 2-(naphthalen-1-yloxymethyl)oxirane Chemical compound C=1C=CC2=CC=CC=C2C=1OCC1CO1 QYYCPWLLBSSFBW-UHFFFAOYSA-N 0.000 description 1
- HPILSDOMLLYBQF-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COC(CCC)OCC1CO1 HPILSDOMLLYBQF-UHFFFAOYSA-N 0.000 description 1
- WQXMOKCISCKDLG-UHFFFAOYSA-N 2-[1-[4-[9-[4-[2-(oxiran-2-ylmethoxy)propoxy]phenyl]fluoren-9-yl]phenoxy]propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COC(C=C1)=CC=C1C1(C2=CC=CC=C2C2=CC=CC=C21)C(C=C1)=CC=C1OCC(C)OCC1CO1 WQXMOKCISCKDLG-UHFFFAOYSA-N 0.000 description 1
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 1
- NSNFKOPUSIHWGF-UHFFFAOYSA-N 2-[2-[9-[2-(2-hydroxyethoxy)phenyl]fluoren-9-yl]phenoxy]ethanol Chemical compound OCCOC1=CC=CC=C1C1(C=2C(=CC=CC=2)OCCO)C2=CC=CC=C2C2=CC=CC=C21 NSNFKOPUSIHWGF-UHFFFAOYSA-N 0.000 description 1
- GUWKBHIOYUAAIO-UHFFFAOYSA-N 2-[4-(9h-fluoren-1-yl)-2,6-dimethylphenoxy]ethanol Chemical compound CC1=C(OCCO)C(C)=CC(C=2C3=C(C4=CC=CC=C4C3)C=CC=2)=C1 GUWKBHIOYUAAIO-UHFFFAOYSA-N 0.000 description 1
- LUXQHIIWBDDUDE-UHFFFAOYSA-N 2-[4-[9-[4-(2-hydroxyethoxy)-3-methylphenyl]fluoren-9-yl]-2-methylphenoxy]ethanol Chemical compound C1=C(OCCO)C(C)=CC(C2(C3=CC=CC=C3C3=CC=CC=C32)C=2C=C(C)C(OCCO)=CC=2)=C1 LUXQHIIWBDDUDE-UHFFFAOYSA-N 0.000 description 1
- HBTONAMIPDVQRI-UHFFFAOYSA-N 2-[4-[9-[4-(2-hydroxyethoxy)-3-phenylphenyl]fluoren-9-yl]-2-phenylphenoxy]ethanol Chemical compound OCCOC1=CC=C(C2(C3=CC=CC=C3C3=CC=CC=C32)C=2C=C(C(OCCO)=CC=2)C=2C=CC=CC=2)C=C1C1=CC=CC=C1 HBTONAMIPDVQRI-UHFFFAOYSA-N 0.000 description 1
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 1
- FHZQOYSKWUJKDZ-UHFFFAOYSA-N 2-[6-[9-[6-(2-hydroxyethoxy)naphthalen-2-yl]fluoren-9-yl]naphthalen-2-yl]oxyethanol Chemical compound C1=C(OCCO)C=CC2=CC(C3(C4=CC=CC=C4C4=CC=CC=C43)C3=CC4=CC=C(C=C4C=C3)OCCO)=CC=C21 FHZQOYSKWUJKDZ-UHFFFAOYSA-N 0.000 description 1
- OGRULRAOMCDCBO-UHFFFAOYSA-N 2-[[1-(oxiran-2-ylmethoxy)naphthalen-2-yl]oxymethyl]oxirane Chemical class C1OC1COC1=CC=C2C=CC=CC2=C1OCC1CO1 OGRULRAOMCDCBO-UHFFFAOYSA-N 0.000 description 1
- HIGURUTWFKYJCH-UHFFFAOYSA-N 2-[[1-(oxiran-2-ylmethoxymethyl)cyclohexyl]methoxymethyl]oxirane Chemical compound C1OC1COCC1(COCC2OC2)CCCCC1 HIGURUTWFKYJCH-UHFFFAOYSA-N 0.000 description 1
- SZKLFAJGTPMXRG-UHFFFAOYSA-N 2-[[1-[2-(oxiran-2-ylmethoxy)naphthalen-1-yl]naphthalen-2-yl]oxymethyl]oxirane Chemical compound C1OC1COC1=CC=C2C=CC=CC2=C1C(C1=CC=CC=C1C=C1)=C1OCC1CO1 SZKLFAJGTPMXRG-UHFFFAOYSA-N 0.000 description 1
- XOSCKTQMAZSFBZ-UHFFFAOYSA-N 2-[[1-[[2,7-bis(oxiran-2-ylmethoxy)naphthalen-1-yl]methyl]-7-(oxiran-2-ylmethoxy)naphthalen-2-yl]oxymethyl]oxirane Chemical compound C1OC1COC(C=C1C=2CC=3C4=CC(OCC5OC5)=CC=C4C=CC=3OCC3OC3)=CC=C1C=CC=2OCC1CO1 XOSCKTQMAZSFBZ-UHFFFAOYSA-N 0.000 description 1
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 1
- ABXGZTBEQZOCEE-UHFFFAOYSA-N 2-[[2-methyl-4-[9-[3-methyl-4-(oxiran-2-ylmethoxy)phenyl]fluoren-9-yl]phenoxy]methyl]oxirane Chemical compound CC1=CC(C2(C3=CC=CC=C3C3=CC=CC=C32)C=2C=C(C)C(OCC3OC3)=CC=2)=CC=C1OCC1CO1 ABXGZTBEQZOCEE-UHFFFAOYSA-N 0.000 description 1
- HDDQXUDCEIMISH-UHFFFAOYSA-N 2-[[4-[1,2,2-tris[4-(oxiran-2-ylmethoxy)phenyl]ethyl]phenoxy]methyl]oxirane Chemical compound C1OC1COC(C=C1)=CC=C1C(C=1C=CC(OCC2OC2)=CC=1)C(C=1C=CC(OCC2OC2)=CC=1)C(C=C1)=CC=C1OCC1CO1 HDDQXUDCEIMISH-UHFFFAOYSA-N 0.000 description 1
- HMJNPCQTCGSAOK-UHFFFAOYSA-N 2-[[4-[9-[3,4-bis(oxiran-2-ylmethoxy)phenyl]fluoren-9-yl]-2-(oxiran-2-ylmethoxy)phenoxy]methyl]oxirane Chemical compound C1OC1COC1=CC=C(C2(C3=CC=CC=C3C3=CC=CC=C32)C=2C=C(OCC3OC3)C(OCC3OC3)=CC=2)C=C1OCC1CO1 HMJNPCQTCGSAOK-UHFFFAOYSA-N 0.000 description 1
- OCOLKPHPPUVUMZ-UHFFFAOYSA-N 2-[[4-[9-[3,5-dimethyl-4-(oxiran-2-ylmethoxy)phenyl]fluoren-9-yl]-2,6-dimethylphenoxy]methyl]oxirane Chemical compound CC1=CC(C2(C3=CC=CC=C3C3=CC=CC=C32)C=2C=C(C)C(OCC3OC3)=C(C)C=2)=CC(C)=C1OCC1CO1 OCOLKPHPPUVUMZ-UHFFFAOYSA-N 0.000 description 1
- BUHCEVSAMMJHLV-UHFFFAOYSA-N 2-[[6-(oxiran-2-ylmethoxy)naphthalen-2-yl]oxymethyl]oxirane Chemical compound C1OC1COC(C=C1C=C2)=CC=C1C=C2OCC1CO1 BUHCEVSAMMJHLV-UHFFFAOYSA-N 0.000 description 1
- ASNAZMDOXQFMNI-UHFFFAOYSA-N 2-[[7-(oxiran-2-ylmethoxy)naphthalen-2-yl]oxymethyl]oxirane Chemical compound C1OC1COC(C=C1C=2)=CC=C1C=CC=2OCC1CO1 ASNAZMDOXQFMNI-UHFFFAOYSA-N 0.000 description 1
- WKVWOPDUENJKAR-UHFFFAOYSA-N 2-cyclohexyl-4-[2-(3-cyclohexyl-4-hydroxyphenyl)propan-2-yl]phenol Chemical compound C=1C=C(O)C(C2CCCCC2)=CC=1C(C)(C)C(C=1)=CC=C(O)C=1C1CCCCC1 WKVWOPDUENJKAR-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- WJASVEQGPTWZHE-UHFFFAOYSA-N 2-phenylphenol propane Chemical compound CCC.OC1=C(C=CC=C1)C=1C=CC=CC1 WJASVEQGPTWZHE-UHFFFAOYSA-N 0.000 description 1
- ZDRSNHRWLQQICP-UHFFFAOYSA-N 2-tert-butyl-4-[2-(3-tert-butyl-4-hydroxyphenyl)propan-2-yl]phenol Chemical compound C1=C(O)C(C(C)(C)C)=CC(C(C)(C)C=2C=C(C(O)=CC=2)C(C)(C)C)=C1 ZDRSNHRWLQQICP-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- YMTYZTXUZLQUSF-UHFFFAOYSA-N 3,3'-Dimethylbisphenol A Chemical compound C1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=CC=2)=C1 YMTYZTXUZLQUSF-UHFFFAOYSA-N 0.000 description 1
- CKNCVRMXCLUOJI-UHFFFAOYSA-N 3,3'-dibromobisphenol A Chemical compound C=1C=C(O)C(Br)=CC=1C(C)(C)C1=CC=C(O)C(Br)=C1 CKNCVRMXCLUOJI-UHFFFAOYSA-N 0.000 description 1
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 description 1
- SKKHNUKNMQLBTJ-UHFFFAOYSA-N 3-bicyclo[2.2.1]heptanyl 2-methylprop-2-enoate Chemical compound C1CC2C(OC(=O)C(=C)C)CC1C2 SKKHNUKNMQLBTJ-UHFFFAOYSA-N 0.000 description 1
- OLGHJTHQWQKJQQ-UHFFFAOYSA-N 3-ethylhex-1-ene Chemical compound CCCC(CC)C=C OLGHJTHQWQKJQQ-UHFFFAOYSA-N 0.000 description 1
- YPVPQMCSLFDIKA-UHFFFAOYSA-N 3-ethylpent-1-ene Chemical compound CCC(CC)C=C YPVPQMCSLFDIKA-UHFFFAOYSA-N 0.000 description 1
- OGJJVYFQXFXJKU-UHFFFAOYSA-N 3-methylbicyclo[2.2.1]hepta-2,5-diene Chemical compound C1C2C(C)=CC1C=C2 OGJJVYFQXFXJKU-UHFFFAOYSA-N 0.000 description 1
- YHQXBTXEYZIYOV-UHFFFAOYSA-N 3-methylbut-1-ene Chemical compound CC(C)C=C YHQXBTXEYZIYOV-UHFFFAOYSA-N 0.000 description 1
- YAICWJNVEOOIEM-UHFFFAOYSA-N 3-phenylbicyclo[2.2.1]hepta-2,5-diene Chemical compound C1C(C=2)C=CC1C=2C1=CC=CC=C1 YAICWJNVEOOIEM-UHFFFAOYSA-N 0.000 description 1
- VWGKEVWFBOUAND-UHFFFAOYSA-N 4,4'-thiodiphenol Chemical compound C1=CC(O)=CC=C1SC1=CC=C(O)C=C1 VWGKEVWFBOUAND-UHFFFAOYSA-N 0.000 description 1
- SUJVAMIXNUAJEY-UHFFFAOYSA-N 4,4-dimethylhex-1-ene Chemical compound CCC(C)(C)CC=C SUJVAMIXNUAJEY-UHFFFAOYSA-N 0.000 description 1
- KLCNJIQZXOQYTE-UHFFFAOYSA-N 4,4-dimethylpent-1-ene Chemical compound CC(C)(C)CC=C KLCNJIQZXOQYTE-UHFFFAOYSA-N 0.000 description 1
- NZGQHKSLKRFZFL-UHFFFAOYSA-N 4-(4-hydroxyphenoxy)phenol Chemical compound C1=CC(O)=CC=C1OC1=CC=C(O)C=C1 NZGQHKSLKRFZFL-UHFFFAOYSA-N 0.000 description 1
- RQCACQIALULDSK-UHFFFAOYSA-N 4-(4-hydroxyphenyl)sulfinylphenol Chemical compound C1=CC(O)=CC=C1S(=O)C1=CC=C(O)C=C1 RQCACQIALULDSK-UHFFFAOYSA-N 0.000 description 1
- AHIPJALLQVEEQF-UHFFFAOYSA-N 4-(oxiran-2-ylmethoxy)-n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1COC(C=C1)=CC=C1N(CC1OC1)CC1CO1 AHIPJALLQVEEQF-UHFFFAOYSA-N 0.000 description 1
- UMPGNGRIGSEMTC-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)-3,3,5-trimethylcyclohexyl]phenol Chemical compound C1C(C)CC(C)(C)CC1(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 UMPGNGRIGSEMTC-UHFFFAOYSA-N 0.000 description 1
- OVVCSFQRAXVPGT-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)cyclopentyl]phenol Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCC1 OVVCSFQRAXVPGT-UHFFFAOYSA-N 0.000 description 1
- ITWGALJCERRSSU-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)ethyl]phenol;4-[(4-hydroxyphenyl)methyl]phenol Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1.C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 ITWGALJCERRSSU-UHFFFAOYSA-N 0.000 description 1
- ODJUOZPKKHIEOZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3,5-dimethylphenyl)propan-2-yl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=C(C)C=2)=C1 ODJUOZPKKHIEOZ-UHFFFAOYSA-N 0.000 description 1
- IJWIRZQYWANBMP-UHFFFAOYSA-N 4-[2-(4-hydroxy-3-propan-2-ylphenyl)propan-2-yl]-2-propan-2-ylphenol Chemical compound C1=C(O)C(C(C)C)=CC(C(C)(C)C=2C=C(C(O)=CC=2)C(C)C)=C1 IJWIRZQYWANBMP-UHFFFAOYSA-N 0.000 description 1
- QHJPJZROUNGTRJ-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)octan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(CCCCCC)C1=CC=C(O)C=C1 QHJPJZROUNGTRJ-UHFFFAOYSA-N 0.000 description 1
- ISRGQNIKZSNQGN-UHFFFAOYSA-N 4-[9-(2,4-dihydroxyphenyl)fluoren-9-yl]benzene-1,3-diol Chemical compound OC1=CC(O)=CC=C1C1(C=2C(=CC(O)=CC=2)O)C2=CC=CC=C2C2=CC=CC=C21 ISRGQNIKZSNQGN-UHFFFAOYSA-N 0.000 description 1
- RAIOQXXWEGZKAI-UHFFFAOYSA-N 4-[9-(3,4-dihydroxyphenyl)fluoren-9-yl]benzene-1,2-diol Chemical compound C1=C(O)C(O)=CC=C1C1(C=2C=C(O)C(O)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 RAIOQXXWEGZKAI-UHFFFAOYSA-N 0.000 description 1
- SNPPMOSOWNHABX-UHFFFAOYSA-N 4-[9-(4-hydroxy-3,5-dimethylphenyl)fluoren-9-yl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(C2(C3=CC=CC=C3C3=CC=CC=C32)C=2C=C(C)C(O)=C(C)C=2)=C1 SNPPMOSOWNHABX-UHFFFAOYSA-N 0.000 description 1
- FLMZHPQIDVOWEJ-UHFFFAOYSA-N 4-[9-(4-hydroxy-3-phenylphenyl)fluoren-9-yl]-2-phenylphenol Chemical compound OC1=CC=C(C2(C3=CC=CC=C3C3=CC=CC=C32)C=2C=C(C(O)=CC=2)C=2C=CC=CC=2)C=C1C1=CC=CC=C1 FLMZHPQIDVOWEJ-UHFFFAOYSA-N 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- SUWJESCICIOQHO-UHFFFAOYSA-N 4-methylhex-1-ene Chemical compound CCC(C)CC=C SUWJESCICIOQHO-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- VSQLAQKFRFTMNS-UHFFFAOYSA-N 5-methylhexa-1,4-diene Chemical compound CC(C)=CCC=C VSQLAQKFRFTMNS-UHFFFAOYSA-N 0.000 description 1
- PGNNHYNYFLXKDZ-UHFFFAOYSA-N 5-phenylbicyclo[2.2.1]hept-2-ene Chemical compound C1=CC2CC1CC2C1=CC=CC=C1 PGNNHYNYFLXKDZ-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- 239000004953 Aliphatic polyamide Substances 0.000 description 1
- DJHGAFSJWGLOIV-UHFFFAOYSA-K Arsenate3- Chemical compound [O-][As]([O-])([O-])=O DJHGAFSJWGLOIV-UHFFFAOYSA-K 0.000 description 1
- VOWWYDCFAISREI-UHFFFAOYSA-N Bisphenol AP Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=CC=C1 VOWWYDCFAISREI-UHFFFAOYSA-N 0.000 description 1
- HTVITOHKHWFJKO-UHFFFAOYSA-N Bisphenol B Chemical compound C=1C=C(O)C=CC=1C(C)(CC)C1=CC=C(O)C=C1 HTVITOHKHWFJKO-UHFFFAOYSA-N 0.000 description 1
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 1
- MSULEAYRKSGRIJ-UHFFFAOYSA-N C(C1CO1)OC1=CC=CC2=CC(=CC=C12)OCC1CO1.C(C1CO1)OC1=CC=CC2=C(C=CC=C12)OCC1CO1 Chemical compound C(C1CO1)OC1=CC=CC2=CC(=CC=C12)OCC1CO1.C(C1CO1)OC1=CC=CC2=C(C=CC=C12)OCC1CO1 MSULEAYRKSGRIJ-UHFFFAOYSA-N 0.000 description 1
- NHVIOJAIGUOFPP-UHFFFAOYSA-N C(C1CO1)OCCOC1=C(C=C(C=C1)C1(C2=CC=CC=C2C=2C=CC=CC12)C1=CC(=C(C=C1)OCCOCC1CO1)C1=CC=CC=C1)C1=CC=CC=C1 Chemical compound C(C1CO1)OCCOC1=C(C=C(C=C1)C1(C2=CC=CC=C2C=2C=CC=CC12)C1=CC(=C(C=C1)OCCOCC1CO1)C1=CC=CC=C1)C1=CC=CC=C1 NHVIOJAIGUOFPP-UHFFFAOYSA-N 0.000 description 1
- 125000006374 C2-C10 alkenyl group Chemical group 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 1
- DQEFEBPAPFSJLV-UHFFFAOYSA-N Cellulose propionate Chemical compound CCC(=O)OCC1OC(OC(=O)CC)C(OC(=O)CC)C(OC(=O)CC)C1OC1C(OC(=O)CC)C(OC(=O)CC)C(OC(=O)CC)C(COC(=O)CC)O1 DQEFEBPAPFSJLV-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 241000257303 Hymenoptera Species 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 229920000305 Nylon 6,10 Polymers 0.000 description 1
- 229920000572 Nylon 6/12 Polymers 0.000 description 1
- RAHMUEUAQNTXSA-UHFFFAOYSA-N O(C1=CC=CC=C1)C(C)(O)OC1=CC=CC=C1.OCCOC1=CC=C(C=C1)C1(C2=CC=CC=C2C=2C=CC=CC12)C1=CC=C(C=C1)OCCO Chemical compound O(C1=CC=CC=C1)C(C)(O)OC1=CC=CC=C1.OCCOC1=CC=C(C=C1)C1(C2=CC=CC=C2C=2C=CC=CC12)C1=CC=C(C=C1)OCCO RAHMUEUAQNTXSA-UHFFFAOYSA-N 0.000 description 1
- MZSKBUVAADVBTR-UHFFFAOYSA-N OC(COC1=C(C=C(C=C1)C1(C2=CC=CC=C2C=2C=CC=CC12)C1=CC(=C(C=C1)OCC(C)O)C1=CC=CC=C1)C1=CC=CC=C1)C Chemical compound OC(COC1=C(C=C(C=C1)C1(C2=CC=CC=C2C=2C=CC=CC12)C1=CC(=C(C=C1)OCC(C)O)C1=CC=CC=C1)C1=CC=CC=C1)C MZSKBUVAADVBTR-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920007962 Styrene Methyl Methacrylate Polymers 0.000 description 1
- 229920000147 Styrene maleic anhydride Polymers 0.000 description 1
- AWMVMTVKBNGEAK-UHFFFAOYSA-N Styrene oxide Chemical compound C1OC1C1=CC=CC=C1 AWMVMTVKBNGEAK-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- KYPYTERUKNKOLP-UHFFFAOYSA-N Tetrachlorobisphenol A Chemical compound C=1C(Cl)=C(O)C(Cl)=CC=1C(C)(C)C1=CC(Cl)=C(O)C(Cl)=C1 KYPYTERUKNKOLP-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 208000020329 Zika virus infectious disease Diseases 0.000 description 1
- XMUZQOKACOLCSS-UHFFFAOYSA-N [2-(hydroxymethyl)phenyl]methanol Chemical compound OCC1=CC=CC=C1CO XMUZQOKACOLCSS-UHFFFAOYSA-N 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- DPXJVFZANSGRMM-UHFFFAOYSA-N acetic acid;2,3,4,5,6-pentahydroxyhexanal;sodium Chemical compound [Na].CC(O)=O.OCC(O)C(O)C(O)C(O)C=O DPXJVFZANSGRMM-UHFFFAOYSA-N 0.000 description 1
- 125000004423 acyloxy group Chemical group 0.000 description 1
- 125000005073 adamantyl group Chemical group C12(CC3CC(CC(C1)C3)C2)* 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 229920003231 aliphatic polyamide Polymers 0.000 description 1
- 229920003232 aliphatic polyester Polymers 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000004448 alkyl carbonyl group Chemical group 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 229920003180 amino resin Polymers 0.000 description 1
- 229920006127 amorphous resin Polymers 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 229940000489 arsenate Drugs 0.000 description 1
- 125000002102 aryl alkyloxo group Chemical group 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 125000002619 bicyclic group Chemical group 0.000 description 1
- MFJNQSKGBMOIDF-UHFFFAOYSA-N bicyclo[2.2.1]hept-2-en-7-one Chemical compound C1CC2C=CC1C2=O MFJNQSKGBMOIDF-UHFFFAOYSA-N 0.000 description 1
- KOKLYLSZOGGBHE-UHFFFAOYSA-N bicyclo[2.2.1]hept-2-ene-4-carbonitrile Chemical compound C1CC2C=CC1(C#N)C2 KOKLYLSZOGGBHE-UHFFFAOYSA-N 0.000 description 1
- BMAXQTDMWYDIJX-UHFFFAOYSA-N bicyclo[2.2.1]hept-2-ene-5-carbonitrile Chemical compound C1C2C(C#N)CC1C=C2 BMAXQTDMWYDIJX-UHFFFAOYSA-N 0.000 description 1
- CUHKVFZQDYKLSL-UHFFFAOYSA-N bicyclo[2.2.1]hepta-1,3-dien-5-one Chemical compound C1=C(C2)C(=O)CC2=C1 CUHKVFZQDYKLSL-UHFFFAOYSA-N 0.000 description 1
- PNWJGYFRNDJCTN-UHFFFAOYSA-N bicyclo[2.2.1]hepta-1,3-diene-2-carbonitrile Chemical compound N#CC1=C2CCC(C2)=C1 PNWJGYFRNDJCTN-UHFFFAOYSA-N 0.000 description 1
- NMTOJNONWQWGOI-UHFFFAOYSA-N bicyclo[2.2.1]hepta-2,5-diene-3-carbonitrile Chemical compound C1C2C(C#N)=CC1C=C2 NMTOJNONWQWGOI-UHFFFAOYSA-N 0.000 description 1
- ZDZHCHYQNPQSGG-UHFFFAOYSA-N binaphthyl group Chemical group C1(=CC=CC2=CC=CC=C12)C1=CC=CC2=CC=CC=C12 ZDZHCHYQNPQSGG-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 125000004744 butyloxycarbonyl group Chemical group 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 125000004181 carboxyalkyl group Chemical group 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 229920003123 carboxymethyl cellulose sodium Polymers 0.000 description 1
- 229940063834 carboxymethylcellulose sodium Drugs 0.000 description 1
- HKQOBOMRSSHSTC-UHFFFAOYSA-N cellulose acetate Chemical compound OC1C(O)C(O)C(CO)OC1OC1C(CO)OC(O)C(O)C1O.CC(=O)OCC1OC(OC(C)=O)C(OC(C)=O)C(OC(C)=O)C1OC1C(OC(C)=O)C(OC(C)=O)C(OC(C)=O)C(COC(C)=O)O1.CCC(=O)OCC1OC(OC(=O)CC)C(OC(=O)CC)C(OC(=O)CC)C1OC1C(OC(=O)CC)C(OC(=O)CC)C(OC(=O)CC)C(COC(=O)CC)O1 HKQOBOMRSSHSTC-UHFFFAOYSA-N 0.000 description 1
- 229920001727 cellulose butyrate Polymers 0.000 description 1
- 229920006218 cellulose propionate Polymers 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000006258 conductive agent Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 239000003484 crystal nucleating agent Substances 0.000 description 1
- 125000000000 cycloalkoxy group Chemical group 0.000 description 1
- 125000006254 cycloalkyl carbonyl group Chemical group 0.000 description 1
- CFBGXYDUODCMNS-UHFFFAOYSA-N cyclobutene Chemical compound C1CC=C1 CFBGXYDUODCMNS-UHFFFAOYSA-N 0.000 description 1
- ZXIJMRYMVAMXQP-UHFFFAOYSA-N cycloheptene Chemical compound C1CCC=CCC1 ZXIJMRYMVAMXQP-UHFFFAOYSA-N 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- PJFPFKALGCPVLG-UHFFFAOYSA-N cyclohexane;3,6-dioxabicyclo[6.2.2]dodeca-1(10),8,11-triene-2,7-dione Chemical compound C1CCCCC1.O=C1OCCOC(=O)C2=CC=C1C=C2 PJFPFKALGCPVLG-UHFFFAOYSA-N 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
- GNQDOFSOPLSHLF-UHFFFAOYSA-N cyclohexyl 5-methylbicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C(C=C2)CC2C1(C)C(=O)OC1CCCCC1 GNQDOFSOPLSHLF-UHFFFAOYSA-N 0.000 description 1
- URYYVOIYTNXXBN-UPHRSURJSA-N cyclooctene Chemical compound C1CCC\C=C/CC1 URYYVOIYTNXXBN-UPHRSURJSA-N 0.000 description 1
- 239000004913 cyclooctene Substances 0.000 description 1
- 125000002433 cyclopentenyl group Chemical group C1(=CCCC1)* 0.000 description 1
- 125000004855 decalinyl group Chemical group C1(CCCC2CCCCC12)* 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 125000004663 dialkyl amino group Chemical group 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- HANKSFAYJLDDKP-UHFFFAOYSA-N dihydrodicyclopentadiene Chemical compound C12CC=CC2C2CCC1C2 HANKSFAYJLDDKP-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- VGQLNJWOULYVFV-UHFFFAOYSA-N dimethyl bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylate Chemical compound C1C2C=CC1C(C(=O)OC)C2C(=O)OC VGQLNJWOULYVFV-UHFFFAOYSA-N 0.000 description 1
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- HCUYBXPSSCRKRF-UHFFFAOYSA-N diphosgene Chemical compound ClC(=O)OC(Cl)(Cl)Cl HCUYBXPSSCRKRF-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 229940069096 dodecene Drugs 0.000 description 1
- 125000003754 ethoxycarbonyl group Chemical group C(=O)(OCC)* 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 235000010944 ethyl methyl cellulose Nutrition 0.000 description 1
- 125000004672 ethylcarbonyl group Chemical group [H]C([H])([H])C([H])([H])C(*)=O 0.000 description 1
- 125000000219 ethylidene group Chemical group [H]C(=[*])C([H])([H])[H] 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000007849 furan resin Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 125000001188 haloalkyl group Chemical group 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- 229920013821 hydroxy alkyl cellulose Polymers 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 239000001866 hydroxypropyl methyl cellulose Substances 0.000 description 1
- 229920003088 hydroxypropyl methyl cellulose Polymers 0.000 description 1
- 235000010979 hydroxypropyl methyl cellulose Nutrition 0.000 description 1
- UFVKGYZPFZQRLF-UHFFFAOYSA-N hydroxypropyl methyl cellulose Chemical compound OC1C(O)C(OC)OC(CO)C1OC1C(O)C(O)C(OC2C(C(O)C(OC3C(C(O)C(O)C(CO)O3)O)C(CO)O2)O)C(CO)O1 UFVKGYZPFZQRLF-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- IWVKTOUOPHGZRX-UHFFFAOYSA-N methyl 2-methylprop-2-enoate;2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.COC(=O)C(C)=C IWVKTOUOPHGZRX-UHFFFAOYSA-N 0.000 description 1
- ADFPJHOAARPYLP-UHFFFAOYSA-N methyl 2-methylprop-2-enoate;styrene Chemical compound COC(=O)C(C)=C.C=CC1=CC=CC=C1 ADFPJHOAARPYLP-UHFFFAOYSA-N 0.000 description 1
- RMAZRAQKPTXZNL-UHFFFAOYSA-N methyl bicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)OC)CC1C=C2 RMAZRAQKPTXZNL-UHFFFAOYSA-N 0.000 description 1
- ABYXLSPPPNXLTQ-UHFFFAOYSA-N methyl bicyclo[2.2.1]hepta-2,5-diene-3-carboxylate Chemical compound C1C2C(C(=O)OC)=CC1C=C2 ABYXLSPPPNXLTQ-UHFFFAOYSA-N 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 125000004674 methylcarbonyl group Chemical group CC(=O)* 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- 229920003087 methylethyl cellulose Polymers 0.000 description 1
- 125000002816 methylsulfanyl group Chemical group [H]C([H])([H])S[*] 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 150000002846 norbornadienes Chemical class 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 125000004043 oxo group Chemical group O=* 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- RGSFGYAAUTVSQA-UHFFFAOYSA-N pentamethylene Natural products C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 1
- 125000004675 pentylcarbonyl group Chemical group C(CCCC)C(=O)* 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 239000002530 phenolic antioxidant Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- BSCCSDNZEIHXOK-UHFFFAOYSA-N phenyl carbamate Chemical compound NC(=O)OC1=CC=CC=C1 BSCCSDNZEIHXOK-UHFFFAOYSA-N 0.000 description 1
- IGALFTFNPPBUDN-UHFFFAOYSA-N phenyl-[2,3,4,5-tetrakis(oxiran-2-ylmethyl)phenyl]methanediamine Chemical compound C=1C(CC2OC2)=C(CC2OC2)C(CC2OC2)=C(CC2OC2)C=1C(N)(N)C1=CC=CC=C1 IGALFTFNPPBUDN-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 125000005575 polycyclic aromatic hydrocarbon group Chemical group 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 125000004076 pyridyl group Chemical group 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- JWHOQZUREKYPBY-UHFFFAOYSA-N rubonic acid Natural products CC1(C)CCC2(CCC3(C)C(=CCC4C5(C)CCC(=O)C(C)(C)C5CC(=O)C34C)C2C1)C(=O)O JWHOQZUREKYPBY-UHFFFAOYSA-N 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000000807 solvent casting Methods 0.000 description 1
- 229920003066 styrene-(meth)acrylic acid ester copolymer Polymers 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- UCPYLLCMEDAXFR-UHFFFAOYSA-N triphosgene Chemical compound ClC(Cl)(Cl)OC(=O)OC(Cl)(Cl)Cl UCPYLLCMEDAXFR-UHFFFAOYSA-N 0.000 description 1
- LMISWUPDWKMCIH-UHFFFAOYSA-N undeca-3,7-diene Chemical compound CCCC=CCCC=CCC LMISWUPDWKMCIH-UHFFFAOYSA-N 0.000 description 1
- AZGPUOZQDCSPRB-UHFFFAOYSA-N undeca-3,8-diene Chemical compound CCC=CCCCC=CCC AZGPUOZQDCSPRB-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 125000001834 xanthenyl group Chemical group C1=CC=CC=2OC3=CC=CC=C3C(C12)* 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1515—Three-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/37—Thiols
Definitions
- the present invention relates to a resin composition containing a compound having a fluorene skeleton (9,9-bisarylfluorene skeleton), a molded product thereof, a wavelength dispersion adjusting agent, and a resin wavelength dispersion adjusting method.
- a compound having a fluorene skeleton (such as a 9,9-bisphenylfluorene skeleton) is known to have excellent functions such as a high refractive index and high heat resistance.
- fluorene compounds having a reactive group such as bisphenol fluorene (BPF), biscresol fluorene
- BPF bisphenol fluorene
- BCF bisphenoxyethanol fluorene
- BPEF bisphenoxyethanol fluorene
- Patent Document 1 discloses a molding material composed of a polyester resin having a 9,9-bisphenylfluorene skeleton.
- Patent Document 2 discloses a polyurethane resin having a 9,9-bisphenylfluorene skeleton and crosslinked with a crosslinking agent.
- 9,9-bis (4-hydroxyphenyl) fluorene or 9,9-bis [4- (2-hydroxyethoxy) phenyl] fluorene (bisphenoxyethanol) is used as a part of the diol component constituting the resin. Fluorene skeleton is introduced into the resin.
- Patent Document 3 discloses a resin composition comprising a compound having a 9,9-bisphenylfluorene skeleton and a thermoplastic resin. This document describes that a compound having a 9,9-bisphenylfluorene skeleton can be added to a thermoplastic resin to impart a high refractive index to the thermoplastic resin.
- a transparent resin film is prepared by mixing 30 to 40 parts by weight of a specific compound (bisphenol fluorenediglycidyl ether, bisphenoxyethanol fluorene or bisphenoxyethanol fluoredenyl acrylate) with 100 parts by weight of a polycarbonate resin. And that the refractive index has increased.
- a specific compound bisphenol fluorenediglycidyl ether, bisphenoxyethanol fluorene or bisphenoxyethanol fluoredenyl acrylate
- Patent Document 4 discloses an optical resin composition composed of a transparent resin and a fluorene compound having a 9,9-bisarylfluorene skeleton. And this document describes that the birefringence can be reduced without impairing the mechanical properties and heat resistance of the transparent resin, and in a specific example, the fluorene-containing polyester resin is compared with the polycarbonate resin.
- Patent Document 5 discloses that a phenol compound functions as a nucleating agent ( ⁇ crystal nucleating agent) for forming a ⁇ crystal structure in a crystalline resin such as polylactic acid.
- ⁇ crystal nucleating agent a nucleating agent for forming a ⁇ crystal structure in a crystalline resin such as polylactic acid.
- ⁇ crystal nucleating agent a nucleating agent for forming a ⁇ crystal structure in a crystalline resin such as polylactic acid.
- 1 to 5% by weight of 9,9-bis (4-hydroxy-3-methylphenyl) fluorene was added to the ⁇ -crystal (melting point: 168 ° C.) poly-L lactic acid and melted. Kneading to obtain poly L-lactic acid in which ⁇ crystals (melting point: 163 ° C.) were formed, and Tg was changed from 56.5 ° C. to 60.9-62.1 ° C. as the crystal structure was changed. It is described that changed.
- JP 2012-211252 A discloses a film containing a cellulose derivative (such as cellulose triacetate) and a fluorene compound having a 9,9-bisarylfluorene skeleton (such as bisphenoxyethanol fluorene). ing. And in the Example of this document, it is described that the retardation value of the stretched film containing cellulose triacetate and bisphenoxyethanol fluorene was 0 or a negative value.
- JP 2002-284864 A (Claims, Examples) JP 2002-284834 A (Claims, Examples) Japanese Patent Laying-Open No. 2005-162785 (Claims and Examples) JP 2011-8017 A (Claims, Examples) Japanese Patent Laying-Open No. 2011-21083 (Claims and Examples) JP 2012-211252 A (Claims, Examples)
- Another object of the present invention is to provide a resin composition to which a compound having a fluorene skeleton can be added without impairing mechanical strength, a molded article formed with this resin composition, a wavelength dispersion adjusting agent, and a resin wavelength dispersion adjusting method. Is to provide.
- Still another object of the present invention is to provide a resin composition capable of adjusting or controlling wavelength dispersibility, a molded article formed from the resin composition, a wavelength dispersion adjusting agent, and a resin wavelength dispersion adjusting method.
- the present inventors surprisingly have a compound in which a compound having a fluorene skeleton has a reverse wavelength dispersibility (or negative wavelength dispersibility, a phase difference (or birefringence) that increases as the wavelength increases) with respect to the resin. ) Can be imparted (or expressed).
- resins especially thermoplastic resins.
- the wavelength dispersion of the resin can be reduced (or adjusted to low wavelength dispersion)]
- the present invention has been completed.
- the resin composition of the present invention includes a non-epoxy resin, a non-epoxy compound having a 9,9-bisarylfluorene skeleton, and an epoxy compound.
- the non-epoxy compound having a 9,9-bisarylfluorene skeleton may be, for example, a compound represented by the following formula (1).
- ring Z is an aromatic hydrocarbon ring, R 1 and R 2 are substituents, X is a group — [(OR 3 ) nY] (wherein Y is a hydroxyl group, a mercapto group, or A (meth) acryloyloxy group, R 3 is an alkylene group, n is an integer of 0 or more) or an amino group, k is an integer of 0 to 4, m is an integer of 0 or more, and p is an integer of 1 or more] .
- non-epoxy compound having a 9,9-bisarylfluorene skeleton may be a compound represented by the following formula (1A).
- the ring Z may be a benzene ring or a naphthalene ring
- R 1 may be an alkyl group
- k may be 0 to 1
- R 2 may be It may be an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group or an alkoxy group
- m may be 0 to 2
- R 3 may be a C 2-4 alkylene group
- n is 0 May be 2 and p may be 1 to 3.
- Non-epoxy compounds having a 9,9-bisarylfluorene skeleton typically include 9,9-bis (hydroxyphenyl) fluorene, 9,9-bis (alkyl-hydroxyphenyl) fluorene, and 9,9-bis.
- (Aryl-hydroxyphenyl) fluorene 9,9-bis (di or trihydroxyphenyl) fluorene, 9,9-bis (hydroxynaphthyl) fluorene, 9,9-bis (hydroxyalkoxyphenyl) fluorene, 9,9-bis It may be at least one selected from (alkyl-hydroxyalkoxyphenyl) fluorene, 9,9-bis (aryl-hydroxyalkoxyphenyl) fluorene, and 9,9-bis (hydroxyalkoxynaphthyl) fluorene.
- the non-epoxy resin may be a thermoplastic resin, and in particular, may be at least one selected from a cyclic olefin resin, a methacrylic resin, an aromatic polycarbonate resin, an aromatic polyester resin, and a cellulose derivative.
- the epoxy compound may particularly contain at least a polyfunctional epoxy compound.
- the ratio of each component to 100 parts by weight of the non-epoxy resin is, for example, that the ratio of the non-epoxy compound having a 9,9-bisarylfluorene skeleton is about 0.5 to 50 parts by weight.
- the ratio of the epoxy compound may be about 0.1 to 30 parts by weight.
- the proportion of the epoxy compound may be, for example, about 1 to 100 parts by weight with respect to 100 parts by weight of the non-epoxy compound having a 9,9-bisarylfluorene skeleton. .
- the present invention also includes a molded body formed from the resin composition.
- a molded article may be an optical molded article [such as an optical film (such as a retardation film)].
- the molded body of the present invention may be a film (film-shaped molded body), and such a molded body may be a stretched film.
- the wavelength dispersion of the non-epoxy resin is adjusted or controlled by adding a non-epoxy compound having a 9,9-bisarylfluorene skeleton to the non-epoxy resin in combination with the epoxy compound ( For example, the wavelength dispersion can be reduced).
- the present invention relates to an additive for adjusting or controlling (for example, reducing) the wavelength dispersion of a non-epoxy resin, and a non-epoxy compound having an 9,9-bisarylfluorene skeleton and an epoxy compound Are also included (for example, a wavelength dispersion reducing agent).
- a wavelength dispersion adjusting agent for example, a wavelength dispersion reducing agent
- a method of adjusting the wavelength dispersion of the resin is also included.
- the ratio of each component and the use ratio with respect to resin are the same as in the resin composition.
- the wavelength range for adjusting the dispersibility is not particularly limited.
- the visible light range is about 300 to 800 nm (for example, 350 to 770 nm), preferably about 400 to 750 nm (for example, 400 to 700 nm). Also good.
- 9,9-bis (hydroxyaryl) fluorenes and “9,9-bis (hydroxy (poly) alkoxyaryl) fluorenes” mean “9,9-bis (hydroxyaryl)”. As long as it has “) fluorene skeleton” or “9,9-bis (hydroxy (poly) alkoxyaryl) fluorene skeleton”, it includes compounds having substituents on aryl groups and fluorene skeletons (specifically, positions 2 to 7 of fluorene) Use for meaning.
- 9,9-bis (hydroxy (poly) alkoxyaryl) fluorene means 9,9-bis (hydroxyalkoxyaryl) fluorene and 9,9-bis (hydroxypolyalkoxyaryl) fluorene. Used to mean including
- the resin composition of the present invention is a novel resin composition containing a compound (non-epoxy compound) having a fluorene skeleton (9,9-bisarylfluorene skeleton).
- a resin composition has resin characteristics according to the type of resin (non-epoxy resin), and also conventionally known effects obtained by adding a compound having a fluorene skeleton (improvement of refractive index, reduction of birefringence) , Improvement of stretchability, etc.) can be obtained.
- a resin composition contains a compound having a fluorene skeleton which is a low molecule, but does not impair the mechanical properties, in particular, a compound having only a fluorene skeleton. Compared with the case of containing, the mechanical properties can be further improved or improved, so that it is very useful.
- the compound having a fluorene skeleton seems to be able to impart reverse wavelength dispersion to the resin.
- the wavelength dispersion is adjusted or Can be controlled.
- the addition of a compound having a fluorene skeleton imparts reverse wavelength dispersibility to the resin, but when combined with an epoxy compound, the wavelength dispersibility becomes uniform, or a low wavelength dispersible resin (composition Product) can be easily obtained.
- the resin composition of the present invention comprises a non-epoxy resin (hereinafter sometimes referred to simply as a resin) and a non-epoxy compound having a 9,9-bisarylfluorene skeleton (hereinafter sometimes referred to as a fluorene compound). And an epoxy compound.
- a non-epoxy resin hereinafter sometimes referred to simply as a resin
- a non-epoxy compound having a 9,9-bisarylfluorene skeleton hereinafter sometimes referred to as a fluorene compound
- resin a wide range of resins can be used (or applied), and any of a thermoplastic resin and a curable resin (thermal or photo-curable resin) may be used.
- thermoplastic resin examples include olefin resin ⁇ eg, chain olefin resin [ethylene resin (eg, polyethylene), propylene resin (eg, polypropylene), polymethylpentene, etc.], cyclic olefin resin, etc. ⁇ , halogen-containing resin) Vinyl resins (polyvinyl chloride, fluororesins, etc.), vinyl resins (eg, polyvinyl alcohol, acrylonitrile resins), acrylic resins (eg, methacrylic resins such as polymethyl methacrylate), styrene resins [eg, styrene Monomers or copolymers of polystyrene monomers (polystyrene, styrene- ⁇ -methylstyrene copolymer, etc.), copolymers of styrene monomers and copolymerizable monomers (styrene-acrylonitrile copolymers ( AS resin), styrene
- polylactic acid, etc. aromatic polyester resin, etc.] polyacetal resin, polyamide resin (for example, aliphatic polyamide resin such as polyamide 6, polyamide 66, polyamide 610, polyamide 11, polyamide 12, polyamide 612, polyamide 6/66; Aromatic polyamide resins such as polyamide MXD), polyphenylene ether resins, polysulfone resins, polyphenylene sulfide resins, polyimide resins, polyether ketone resins, cellulose derivatives, and thermoplastic elastomers. And so on.
- polyamide resin for example, aliphatic polyamide resin such as polyamide 6, polyamide 66, polyamide 610, polyamide 11, polyamide 12, polyamide 612, polyamide 6/66; Aromatic polyamide resins such as polyamide MXD), polyphenylene ether resins, polysulfone resins, polyphenylene sulfide resins, polyimide resins, polyether ketone resins, cellulose derivatives, and thermoplastic elast
- Resins may be used alone or in combination of two or more.
- the molecular weight of the thermoplastic resin can be selected according to the type of the resin.
- the number average molecular weight can be selected from a range of 2000 or more (for example, 3000 or more), 5000 or more (for example, 8000 to 1000000), preferably May be 10,000 or more (for example, 12,000 to 800,000), more preferably 15,000 or more (for example, 20,000 to 500,000).
- the molecular weight can be measured in terms of polystyrene by a conventional method such as gel permeation chromatography (GPC).
- curable resin examples include acrylic resin (thermal or photocurable resin, non-epoxy curable resin), acrylic resin (thermal or photocurable acrylic resin), phenol resin, amino resin (urea resin, melamine resin, etc.). ), Furan resins, unsaturated polyester resins, thermosetting urethane resins, silicone resins, thermosetting polyimide resins, diallyl phthalate resins, vinyl ester resins, and the like.
- the curable resins may be used alone or in combination of two or more.
- the curable resin may contain a curing agent, a curing accelerator, or the like depending on the type.
- Resins may be used alone or in combination of two or more.
- the resin may be either a crystalline resin or an amorphous resin.
- the resin may be a resin having a positive wavelength dispersion or a resin having a negative wavelength dispersion (reverse wavelength dispersion).
- the resin may typically be a thermoplastic resin.
- the resin may be a resin having excellent transparency, for example, a cyclic olefin resin, a methacrylic resin, an aromatic polycarbonate resin, an aromatic polyester resin, a cellulose derivative, or the like.
- Cyclic olefin resin is resin which uses cyclic olefin as a polymerization component at least.
- the cyclic olefin may be a monocyclic olefin or a polycyclic olefin.
- the cyclic olefin includes a substituent such as a hydrocarbon group [eg, an alkyl group (eg, a C 1-10 alkyl group such as a methyl group, preferably a C 1-5 alkyl group), a cycloalkyl group (eg, cyclohexyl group).
- a C 5-10 cycloalkyl group such as a group), an aryl group (eg, a C 6-10 aryl group such as a phenyl group), an alkenyl group (eg, a C 2-10 alkenyl group such as a propenyl group), a cycloalkenyl group (For example, C 5-10 cycloalkenyl group such as cyclopentenyl group, cyclohexenyl group, etc.), alkylidene group (eg, C 2-10 alkylidene group such as ethylidene group, preferably C 2-5 alkylidene group, etc.) , polar group [e.g., alkoxy groups (e.g., C 1-10 alkoxy group such as methoxy group, preferred Ku is C 1-6 alkoxy group), an acyl group (e.g., a C 2-5 alkanoyl group such as acetyl group), an acyloxy group [e.
- cyclic olefins include monocyclic olefins [eg, cycloalkenes (eg, cycloC 3-10 alkenes such as cyclobutene, cyclopentene, cycloheptene, cyclooctene, etc.), cycloalkadienes (eg, cyclopentadiene, etc.
- cycloalkenes eg, cycloC 3-10 alkenes such as cyclobutene, cyclopentene, cycloheptene, cyclooctene, etc.
- cycloalkadienes eg, cyclopentadiene, etc.
- bicyclic olefins ⁇ eg norbornenes [eg norbornene (eg 2-norbornene), alkyl norbornene (eg 5-methyl-2-norbornene, 5, 5 or 5,6-dimethyl-2-norbornene, 5-ethylidene-2-norbornene), aryl norbornene (eg, 5-phenyl-2-norbornene), norbornene having a polar group (eg, 5-cyano-2-norbornene, etc.) Cyanonorbornene Acyloxynorbornene such as 5-methoxycarbonyl-2-norbornene, 5-methyl-5-methoxycarbonyl-2-norbornene, 5,6-dimethoxycarbonyl-2-norbornene, 5-methyl-5-cyclohexyloxycarbonyl-2-norbornene (Alkoxycarbonyl norbornene,
- Acyloxynorbornadiene (such as alkoxycarbonylnorbornadiene); haloalkylnorbornadiene such as 5,6-di (trifluoromethyl) -2,5-norbornadiene; oxonorbornadiene such as 7-oxo-2-norbornadiene)], tricyclic olefin ⁇
- tricycloalkenes eg, C 6-25 tricycloalkenes such as dihydrodicyclopentadienes (such as dihydrodicyclopentadiene)]
- tricycloalkadienes eg, Dicyclopentadiene (dicyclopentadiene, methyldicyclopentadiene, etc.), tricyclo [4.4.0.1 2,5 ] undeca-3,7-diene, tricyclo [4.4.0.1 2,5 ]
- a C 6-25 tricycloalkadiene such as undeca-3,8-diene, etc.]
- cyclic olefins e.g., hexa cycloalkenes (e.g., hexacyclo [6.6.1.1 3,6 .0 2,7 .0 9,14] -4- heptadecene C such as 12-40 Hexacycloalkene) and the like ⁇ and the like.
- the cyclic olefin resin may be a cyclic olefin homopolymer or a copolymer (for example, a copolymer of a monocyclic olefin and a polycyclic olefin, a copolymer of a plurality of polycyclic olefins, etc.), or cyclic.
- a copolymer of an olefin and a copolymerizable monomer may be used.
- Examples of the copolymerizable monomer include a chain olefin [alkene (eg, ethylene, propylene, 1-butene, 1-pentene, 1-hexene, 3-methyl-1-butene, 2-methyl-1-pentene).
- alkene eg, ethylene, propylene, 1-butene, 1-pentene, 1-hexene, 3-methyl-1-butene, 2-methyl-1-pentene.
- 3-ethyl-1-pentene 4-methyl-1-pentene, 4-methyl-1-hexene, 4,4-dimethyl-1-hexene, 4,4-dimethyl-1-pentene, 4-ethyl-1 C 2-20 alkenes such as -hexene, 3-ethyl-1-hexene, 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 1-eicocene), alkadienes (for example , 1,4-hexadiene, 4-methyl-1,4-hexadiene, 5-methyl-1,4-hexadiene, 1,7-nonconjugated C 5-20 a such octadiene Cadien etc.), polymerizable nitrile compounds (eg (meth) acrylonitrile etc.), (meth) acrylic monomers (eg (meth) acrylic acid such as methyl
- the ratio of cyclic olefin is, for example, 10 mol% or more (for example, 20 mol) with respect to the total amount of cyclic olefin and copolymerizable monomer. % Or more), preferably 30 mol% or more, more preferably 40 mol% or more.
- Preferred cyclic olefin resins include cyclic olefin copolymers ⁇ eg, cyclic olefins (eg, cyclic olefins containing at least norbornenes) and copolymerizable monomers [eg, chain olefins (eg, C 2 ⁇ Copolymer) with a copolymerizable monomer containing at least 6 alkene).
- cyclic olefin copolymers eg, cyclic olefins (eg, cyclic olefins containing at least norbornenes) and copolymerizable monomers [eg, chain olefins (eg, C 2 ⁇ Copolymer) with a copolymerizable monomer containing at least 6 alkene).
- a cyclic olefin copolymer having a polar group for example, a cyclic olefin having a polar group ⁇ eg, norbornene having a polar group [eg, acyloxynorbornene (eg, 5-methoxycarbonyl-2 An alkoxycarbonyl group such as norbornene or 5-methyl-5-methoxycarbonyl-2-norbornene (eg, norbornene substituted with a C 1-10 alkoxycarbonyl group, preferably a C 1-4 alkoxycarbonyl group), etc.]
- a copolymerizable monomer for example, a copolymerizable monomer [for example, a copolymerizable monomer containing at least a chain olefin (eg, C 2-6 alkene such as ethylene)] is preferable. .
- the ratio of the cyclic olefin having a polar group to the whole cyclic olefin is, for example, 10 mol% or more, preferably 20 mol% or more, more preferably 30 mol% or more. May be.
- the cyclic olefin resins may be used alone or in combination of two or more.
- the methacrylic resin examples include resins having at least a methacrylic acid ester as a polymerization component.
- the methacrylic resin is an alkyl methacrylate [for example, an alkyl methacrylate ester (for example, a C 1-20 alkyl methacrylate such as methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl methacrylate, 2-ethylhexyl methacrylate,
- the alkyl methacrylates may be used alone or in combination of two or more.
- Specific methacrylic resins include alkyl methacrylates (especially alkyl methacrylates containing at least methyl methacrylate) homopolymers or copolymers, alkyl methacrylates (particularly alkyl methacrylates containing at least methyl methacrylate) and copolymers. And a copolymer with a functional monomer.
- the copolymerizable monomer is not particularly limited as long as it is copolymerizable.
- a (meth) acrylic monomer ⁇ for example, (meth) acrylic acid, alkyl acrylate (for example, methyl acrylate, ethyl acrylate) C 1-10 alkyl acrylates such as propyl acrylate and butyl acrylate), alicyclic (meth) acrylates (eg, (meth) acrylic acid C 5-10 cycloalkyl esters such as cyclohexyl (meth) acrylate; Decalinyl (meth) acrylate, norbornyl (meth) acrylate, bornyl (meth) acrylate, bi to tetracycloalkyl (meth) acrylate such as adamantyl (meth) acrylate, etc.], hydroxyalkyl (meth) acrylate [for example, (meth) acrylic Acid hydroxyethyl etc.
- an alkane diol di (meth) acrylate e.g., ethylene glycol di (meth) acrylate, diethylene glycol di ( (Meth) acrylate, tetraethylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, etc.
- alkanetriol di to tri (meth) acrylate for example, trimethylolethane tri (meth) acrylate, trimethylolpropane tri ( Meth) acrylates
- polyols such as alkanetetraol di to tetra (meth) acrylates (pentaerythritol tetra (meth) acrylate etc.), poly (meth) acrylates, polyols Alkylene oxide (e.g., C 2-4 alkylene
- Preferred methacrylic resins include resins having methyl methacrylate as a polymerization component, such as polymethyl methacrylate, copolymers having methyl methacrylate as a polymerization component [for example, copolymers of methyl methacrylate and alkyl methacrylate esters. (For example, methyl methacrylate-methacrylic acid C 2-8 alkyl ester copolymer) and the like].
- the proportion of methyl methacrylate is determined based on the total amount of monomers [methyl methacrylate and other monomers (methacrylic acid C 2-8 alkyl ester, copolymerizable monomer). Body etc.)], for example, about 55 to 99.9% by weight, preferably 60% or more (for example, about 65 to 99% by weight), more preferably 70% or more (for example, 75%). Or about 95% by weight).
- Aromaatic polycarbonate resin examples include resins having an aromatic diol and a carbonate-forming compound as polymerization components.
- aromatic diol examples include bisphenols and dihydroxyarene (hydroquinone, resorcinol, etc.).
- bisphenols include dihydroxyarenes [eg, di ( hydroxyC 6-10 arenes) such as 4,4′-dihydroxybiphenyl], bis (hydroxyphenyl) alkanes [eg, bis (4-hydroxyphenyl) methane 1,1-bis (4-hydroxyphenyl) ethane, 1,1-bis (4-hydroxyphenyl) -1-phenylethane, 2,2-bis (4-hydroxyphenyl) propane, 2,2-bis ( 4-hydroxy-3-methylphenyl) propane, 2,2-bis (4-hydroxy-3-isopropylphenyl) propane, 2,2-bis (3-tert-butyl-4-hydroxyphenyl) propane, 2,2 -Bis (4-hydroxyphenyl) butane, 2,2-bis (4-hydroxyphenyl) octane, 2,2 Bis (3-bromo-4-hydroxyphenyl) propane, 2,2-bis
- aromatic diols in particular, bis (hydroxyphenyl) alkanes [especially bis (hydroxyphenyl) C 1-4 alkanes such as 2,2-bis (4-hydroxyphenyl) propane], bis (hydroxyphenyl) Bisphenols such as -alkyl) arenes [bis (hydroxyphenyl-C 1-4 alkyl) benzene etc.] are preferred.
- Aromatic diols may be used alone or in combination of two or more.
- Examples of the carbonate-forming compound include carbonates such as phosgene (phosgene, diphosgene, triphosgene, etc.), carbonates [eg, dialkyl carbonate (dimethyl carbonate, diethyl carbonate, etc.), diaryl carbonate (diphenyl carbonate, dinaphthyl carbonate, etc.). Diesters] and the like. Among these, phosgene, diphenyl carbonate and the like may be preferably used.
- the carbonate-forming compounds may be used alone or in combination of two or more.
- the aromatic polycarbonate resin may be used alone or in combination of two or more.
- aromatic polyester resins include polyalkylene arylate resins, polyarylate resins [for example, aromatic dicarboxylic acids (such as terephthalic acid) and aromatic diols (biphenol, bisphenol A, xylylene glycol, alkylene oxide adducts thereof, etc.) And the like)], and liquid crystalline polyester resins.
- polyalkylene arylate resin examples include polyalkylene terephthalate resin [for example, polyalkylene terephthalate (eg, poly C 2-4 alkylene terephthalate such as polyethylene terephthalate, polypropylene terephthalate, polybutylene terephthalate), alkylene terephthalate unit (polyalkylene terephthalate unit) ), Polyalkylene naphthalate resin [for example, polyalkylene naphthalate (for example, poly C 2-4 alkylene naphthalate such as polyethylene naphthalate), alkylene naphthalate unit (polyalkylene naphthalate unit) Having a copolyester], polycycloalkane dialkylene terephthalate resin [for example, polycycloalkanedia Sharp emission terephthalate (e.g., poly cyclohexane dimethylene terephthalate), such as a copolyester having cycloalkan
- the copolymer component includes, for example, a diol component [eg, alkane diol (eg, C 2-6 alkane diol such as ethylene glycol, propylene glycol, butane diol, hexane diol), polyalkane diol (eg, diethylene glycol).
- alkane diol eg, C 2-6 alkane diol such as ethylene glycol, propylene glycol, butane diol, hexane diol
- polyalkane diol eg, diethylene glycol
- Di-hexaC 2-4 alkanediols such as polytetramethylene glycol), alicyclic diols (eg 1,4-cyclohexanedimethanol etc.), aromatic diols (eg C 2-4 alkylenes of bisphenols) Oxide adducts, etc.)], dicarboxylic acid components ⁇ eg aliphatic dicarboxylic acids (eg C 4-12 alkane dicarboxylic acids such as glutaric acid, adipic acid, sebacic acid), aromatic dicarboxylic acids [eg asymmetric aromatics] Zika Rubonic acid (eg phthalic acid, isophthalic acid etc.), diphenyldicarboxylic acid etc.] ⁇ , hydroxycarboxylic acid component (eg hydroxybenzoic acid etc.) and the like.
- the copolymerization components may be used alone or in combination of two or more.
- the proportion of alkylene arylate units may be, for example, 40% by weight or more, preferably 50% by weight or more.
- the aromatic polyester resin may be crystalline or non-crystalline.
- the aromatic polyester resin may have a linear structure or a branched structure.
- Aromatic polyester resins may be used alone or in combination of two or more.
- the cellulose derivative is not particularly limited, and various cellulose derivatives such as cellulose ester, cellulose carbamate (for example, cellulose phenyl carbamate), cellulose ether and the like can be used.
- cellulose ester examples include cellulose acetate such as cellulose diacetate (DAC) and cellulose triacetate (TAC); cellulose C 3-5 acylate such as cellulose propionate and cellulose butyrate; cellulose acetate propionate (CAP), And cellulose acylate such as cellulose acetate C 3-5 acylate such as cellulose acetate butyrate (CAB).
- DAC cellulose diacetate
- TAC cellulose triacetate
- cellulose C 3-5 acylate such as cellulose propionate and cellulose butyrate
- CAP cellulose acetate propionate
- CAB cellulose acetate butyrate
- cellulose ether examples include alkyl celluloses (eg, C 1-4 alkyl celluloses such as methyl cellulose and ethyl cellulose), hydroxyalkyl celluloses (eg, hydroxy C 2 ⁇ such as hydroxyethyl cellulose (HEC) and hydroxypropyl cellulose (HPC)).
- alkyl celluloses eg, C 1-4 alkyl celluloses such as methyl cellulose and ethyl cellulose
- hydroxyalkyl celluloses eg, hydroxy C 2 ⁇ such as hydroxyethyl cellulose (HEC) and hydroxypropyl cellulose (HPC)
- hydroxyalkylalkyl cellulose eg, hydroxy C 2-4 alkyl C 1-4 alkyl cellulose such as hydroxypropylmethyl cellulose
- carboxyalkyl cellulose such as carboxymethyl cellulose (CMC)
- alkyl-carboxyalkyl cellulose Such as methyl carboxymethyl cellulose
- carboxymethyl cellulose sodium CMC salts such as alkali metal salts
- cellulose esters and cellulose ethers are preferable, and cellulose esters (cellulose acylates) such as cellulose acetate and cellulose acetate C 3-4 acylate are particularly preferable. More specifically, cellulose esters such as cellulose diacetate, cellulose triacetate, cellulose acetate propionate, and cellulose acetate butyrate may be suitably used as the cellulose derivative.
- the cellulose derivatives may be used alone or in combination of two or more.
- the fluorene compound only needs to have a 9,9-bisarylfluorene skeleton, such as a compound having no reactive group [for example, 9,9-bisarylfluorene (for example, 9,9-bisphenylfluorene), etc.
- a compound having no reactive group for example, 9,9-bisarylfluorene (for example, 9,9-bisphenylfluorene), etc.
- a compound in which p is 0 in formula (1) described later] may be used, but usually has a reactive group.
- the reactive group examples include non-epoxy reactive groups such as a hydroxyl group, a mercapto group, a carboxyl group, an amino group, and a (meth) acryloyloxy group.
- the fluorene compound may have these reactive groups singly or in combination of two or more.
- the reactive group may be directly bonded to 9,9-bisarylfluorene, or may be bonded via an appropriate linking group (for example, a (poly) oxyalkylene group).
- fluorene compound examples include a compound represented by the following formula (1).
- ring Z is an aromatic hydrocarbon ring, R 1 and R 2 are substituents, X is a group — [(OR 3 ) nY] (wherein Y is a hydroxyl group, a mercapto group, or A (meth) acryloyloxy group, R 3 is an alkylene group, n is an integer of 0 or more) or an amino group, k is an integer of 0 to 4, m is an integer of 0 or more, and p is an integer of 1 or more] .
- examples of the aromatic hydrocarbon ring represented by the ring Z include a benzene ring, a condensed polycyclic aromatic hydrocarbon ring [for example, a condensed bicyclic hydrocarbon (for example, indene, naphthalene, etc. Condensed bicyclic to tetracyclic hydrocarbons such as C 8-20 condensed bicyclic hydrocarbons, preferably C 10-16 condensed bicyclic hydrocarbons), condensed tricyclic hydrocarbons (eg anthracene, phenanthrene, etc.), etc.
- a condensed polycyclic aromatic hydrocarbon ring for example, a condensed bicyclic hydrocarbon (for example, indene, naphthalene, etc. Condensed bicyclic to tetracyclic hydrocarbons such as C 8-20 condensed bicyclic hydrocarbons, preferably C 10-16 condensed bicyclic hydrocarbons), condensed tricyclic hydrocarbons (eg anthracene, phen
- a ring assembly hydrocarbon ring (bi or ter C 6-10 arene ring such as biphenyl ring, terphenyl ring or binaphthyl ring).
- the two rings Z may be the same or different rings, and may usually be the same ring.
- Preferred rings Z include a benzene ring, a naphthalene ring, and a biphenyl ring, and may be a benzene ring.
- examples of the group R 1 include a cyano group, a halogen atom (a fluorine atom, a chlorine atom, a bromine atom, etc.), a hydrocarbon group [eg, an alkyl group, an aryl group (C 6 such as a phenyl group). -10 aryl group) and the like] and acyl groups (for example, alkylcarbonyl groups such as methylcarbonyl, ethylcarbonyl, pentylcarbonyl, etc.) and the like, and in particular, alkyl groups are often used.
- a cyano group e.g, an alkyl group, an aryl group (C 6 such as a phenyl group). -10 aryl group) and the like
- acyl groups for example, alkylcarbonyl groups such as methylcarbonyl, ethylcarbonyl, pentylcarbonyl, etc.
- alkyl group examples include C 1-12 alkyl groups such as a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, and a t-butyl group (for example, a C 1-8 alkyl group, particularly a C 1-1 such as a methyl group). 4 alkyl group) and the like.
- k is plural (2 to 4)
- the types of the plural groups R 1 may be the same or different from each other.
- the kind of group R ⁇ 1 > substituted by the different benzene ring may be the same or different.
- the bonding position (substitution position) of the group R 1 is not particularly limited, and examples thereof include the 2nd, 7th, 2nd and 7th positions of the fluorene ring.
- the preferred substitution number k is 0 to 1, in particular 0.
- the two substitution numbers k may be the same or different.
- the substituent R 2 substituted on the ring Z is usually a non-reactive substituent, for example, an alkyl group (eg, a C 1-12 alkyl group such as a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, C 1-8 alkyl group etc.), cycloalkyl group (C 5-8 cycloalkyl group such as cyclohexyl group), aryl group (eg phenyl group, tolyl group, xylyl group, naphthyl group etc.) Hydrocarbon groups such as 6-10 aryl groups), aralkyl groups (C 6-10 aryl-C 1-4 alkyl groups such as benzyl and phenethyl groups); alkoxy groups (C 1 such as methoxy groups and ethoxy groups) -8 an alkoxy group), such as C 5-10 cycloalkyl group such as a cycloalkoxy group
- a group such as an alkylthio group such as a C 1-8 alkylthio group such as a methylthio group) —SR (wherein R is as defined above); an acyl group (such as a C 1-6 acyl group such as an acetyl group); Alkoxycarbonyl group (C 1-4 alkoxy-carbonyl group such as methoxycarbonyl group); halogen atom (fluorine atom, chlorine atom, bromine atom, iodine atom etc.); nitro group; cyano group; substituted amino group (for example, dimethyl group) And a dialkylamino group such as an amino group).
- R is as defined above
- an acyl group such as a C 1-6 acyl group such as an acetyl group
- Alkoxycarbonyl group C 1-4 alkoxy-carbonyl group such as methoxycarbonyl group
- halogen atom fluorine atom, chlorine atom, bromine atom,
- Preferred groups R 2 include hydrocarbon groups [eg, alkyl groups (eg, C 1-6 alkyl groups), cycloalkyl groups (eg, C 5-8 cycloalkyl groups), aryl groups (eg, C 6-10 Aryl group), aralkyl group (for example, C 6-8 aryl-C 1-2 alkyl group and the like), alkoxy group (C 1-4 alkoxy group and the like) and the like.
- Further preferred groups R 2 include an alkyl group [C 1-4 alkyl group (particularly methyl group) and the like], an aryl group [eg C 6-10 aryl group (particularly phenyl group) and the like] and the like.
- the group R 2 may form the ring assembly hydrocarbon ring together with the ring Z.
- the types of the groups R 2 may be the same or different from each other.
- the type of the group R 2 may be the same or different.
- the number of substitutions m can be selected according to the type of the ring Z, and may be, for example, 0 to 8, preferably 0 to 4 (eg, 0 to 3), and more preferably 0 to 2.
- the number of substitutions m may be the same or different from each other, and may usually be the same.
- examples of the alkylene group represented by the group R 3 include C 2-6 alkylene such as ethylene group, propylene group, trimethylene group, 1,2-butanediyl group, and tetramethylene group.
- a group preferably a C 2-4 alkylene group, and more preferably a C 2-3 alkylene group.
- the type of alkylene group may be composed of different alkylene groups, and may be generally composed of the same alkylene group.
- the types of the groups R 3 may be the same or different, and may be usually the same.
- the number (addition mole number) n of oxyalkylene groups (OR 3 ) may be 0 or more (for example, 0 to 20), for example, 0 to 15 (for example, 1 to 12), preferably 0 to 10 ( For example, it may be 1 to 6), more preferably 0 to 4 (eg 1 to 4), particularly 0 to 2 (eg 0 to 1). Further, depending on the type of resin, there may be a case where a remarkable improvement effect is obtained when n is 0 or when n is 1 or more. Therefore, either a compound in which n is 0 or a compound in which n is 1 or more may be selected depending on the type of resin. The number of substitutions n may be the same or different for different rings Z.
- Preferred X is a group — [(OR 3 ) nY], and particularly Y is preferably a hydroxyl group.
- the compound whose Y is a hydroxyl group is represented by following formula (1A).
- the substitution number p of the group X may be 1 or more (for example, 1 to 6), for example, 1 to 4, preferably 1 to 3, more preferably 1 to 2, particularly 1.
- the substitution number p may be the same or different in each ring Z, and is usually the same in many cases.
- the substitution position of the group X is not particularly limited, and it may be substituted at an appropriate substitution position on the ring Z.
- the group X may be substituted at the 2-6 position of the phenyl group, and may preferably be substituted at the 4 position.
- the group X is a hydrocarbon ring different from the hydrocarbon ring bonded to the 9-position of fluorene in the condensed polycyclic hydrocarbon ring (for example, naphthalene
- the ring is substituted at least on the 5th and 6th positions of the ring.
- Specific fluorene compounds include 9,9-bis (hydroxyaryl) fluorenes [or 9,9-bis (hydroxyaryl) fluorene skeletons.
- X is a group in the formula (1), such as - [(OR 3) n- OH] , compound; this In al compounds, hydroxyl group, and the like mercapto group, or
- the 9,9-bis (hydroxyphenyl) fluorenes include, for example, 9,9-bis (hydroxyphenyl) fluorene [for example, 9,9-bis (4-hydroxyphenyl) fluorene], 9,9-bis (alkyl 9,9-bis such as 9,9-bis (4-hydroxy-3-methylphenyl) fluorene, 9,9-bis (4-hydroxy-3,5-dimethylphenyl) fluorene (Mono or di C 1-4 alkyl-hydroxyphenyl) fluorene], 9,9-bis (aryl-hydroxyphenyl) fluorene [eg, 9,9-bis (4-hydroxy-3-phenylphenyl) fluorene, etc.
- the 9,9-bis (hydroxynaphthyl) fluorenes correspond to the 9,9-bis (hydroxyphenyl) fluorenes, and are compounds in which the phenyl group is substituted with a naphthyl group, for example, 9,9-bis ( Hydroxynaphthyl) fluorene [eg, 9,9-bis (6-hydroxy-2-naphthyl) fluorene, 9,9-bis (5-hydroxy-1-naphthyl) fluorene] and the like.
- 9,9-bis ( Hydroxynaphthyl) fluorene eg, 9,9-bis (6-hydroxy-2-naphthyl) fluorene, 9,9-bis (5-hydroxy-1-naphthyl) fluorene
- 9,9-bis (hydroxy (poly) alkoxyphenyl) fluorenes include, for example, 9,9-bis (hydroxyalkoxyphenyl) fluorene ⁇ eg, 9,9-bis [4- (2-hydroxyethoxy) phenyl] fluorene, 9,9-bis [4- (2-hydroxypropoxy) phenyl] fluorene such as 9,9-bis (hydroxy C 2-4 alkoxyphenyl) fluorene ⁇ , 9,9-bis (alkyl - hydroxy alkoxyphenyl) Fluorene ⁇ eg, 9,9-bis [4- (2-hydroxyethoxy) -3-methylphenyl] fluorene, 9,9-bis [4- (2-hydroxypropoxy) -3-methylphenyl] fluorene, Such as 9-bis [4- (2-hydroxyethoxy) -3,5-dimethylphenyl] fluorene 9,9-bis (mono or di C 1-4 alkyl-hydroxy C 2-4 alkoxy
- 9,9-bis (hydroxy (poly) alkoxynaphthyl) fluorenes compounds corresponding to the 9,9-bis (hydroxy (poly) alkoxyphenyl) fluorenes, wherein a phenyl group is substituted with a naphthyl group
- 9,9-bis (hydroxyalkoxynaphthyl) fluorene ⁇ eg, 9,9-bis [6- (2-hydroxyethoxy) -2-naphthyl] fluorene, 9,9-bis [6- (2-hydroxypropoxy) 9,9-bis (hydroxyalkoxynaphthyl) fluorenes such as 9,9-bis (hydroxyC 2-4 alkoxynaphthyl) fluorene ⁇ such as) -2-naphthyl] fluorene.
- 9,9-bis (hydroxyphenyl) fluorene 9,9-bis (alkyl-hydroxyphenyl) fluorene [for example, 9,9-bis (mono or di C 1-4 alkyl- Hydroxyphenyl) fluorene], 9,9-bis (aryl-hydroxyphenyl) fluorene [eg, 9,9-bis (mono or diC 6-10 aryl-hydroxyphenyl) fluorene], 9,9-bis (di or A compound in which n is 0 in the above formula (1A) such as trihydroxyphenyl) fluorene and 9,9-bis (hydroxynaphthyl) fluorene; 9,9-bis (hydroxyalkoxyphenyl) fluorene ⁇ eg, 9,9-bis (hydroxy C 2-4 alkoxyphenyl) fluorene ⁇ , 9,9-bis (alkyl - hydroxy alkoxyphenyl) fluorene ⁇ e.g., 9,9-bis (hydroxyphenyl) fluorene
- n is 1 or more (for example, 1 to 4, preferably 1 to 2, more preferably 1) in the above formula (1A) such as -4alkoxynaphthyl) fluorene ⁇ is preferable.
- 9,9-bis (hydroxyalkoxyphenyl) fluorene such as 9,9-bis (hydroxyethoxyphenyl) fluorene may be used from the standpoint that the effect of homogenizing wavelength dispersion by the epoxy compound appears remarkably.
- Fluorene compounds may be used alone or in combination of two or more.
- the ratio of the fluorene compound can be selected, for example, from the range of about 0.1 parts by weight or more (for example, 0.2 to 200 parts by weight) with respect to 100 parts by weight of the resin. It may be 0.5 to 80 parts by weight, more preferably about 1 to 50 parts by weight, usually 0.5 to 50 parts by weight (for example, 0.5 to 40 parts by weight, preferably 0.7 to 30 parts by weight). Parts, more preferably 1 to 20 parts by weight, particularly 2 to 18 parts by weight, particularly preferably 3 to 15 parts by weight). In particular, since the effect of homogenizing the wavelength dispersion by the epoxy compound appears remarkably, the ratio of the fluorene compound is 5 to 15 parts by weight (particularly 8 to 13 parts by weight) with respect to 100 parts by weight of the resin. Good.
- the proportion of the fluorene compound used is 20 parts by weight or less (for example, 0.1 to 18 parts by weight), preferably 15 parts by weight or less (for example, 0.2 to 12 parts by weight) with respect to 100 parts by weight of the resin. Part), more preferably 10 parts by weight or less (for example, 0.3 to 7 parts by weight), particularly 5 parts by weight or less (for example, 0.5 to 5 parts by weight).
- the resin properties can often be maintained or improved at a high level even if a relatively large proportion of the fluorene compound is added. Therefore, the proportion of the fluorene compound used is 20 parts by weight or more (for example, 20 to 100 parts by weight), preferably 25 parts by weight or more (for example, 25 to 80 parts by weight), more preferably 100 parts by weight of the resin. It may be 30 parts by weight or more (for example, 30 to 70 parts by weight).
- the epoxy compound (or epoxy resin) can be roughly classified into a monofunctional epoxy compound (monofunctional epoxy compound) and a polyfunctional epoxy compound (polyfunctional epoxy compound).
- monofunctional epoxy compounds include glycidyl ethers (monoglycidyl ether) [eg, alkyl glycidyl ether (eg, 2-ethylhexyl glycidyl ether), alkenyl glycidyl ether (eg, allyl glycidyl ether), aryl glycidyl ether, etc.
- polyfunctional epoxy compound examples include diglycidyl ether, alkanediol diglycidyl ether (for example, C 2-10 alkane such as butanediol diglycidyl ether, neopentyl glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether).
- alkanediol diglycidyl ether for example, C 2-10 alkane such as butanediol diglycidyl ether, neopentyl glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether.
- Diol diglycidyl ether Diol diglycidyl ether
- polyalkane diol diglycidyl ether eg, poly C 2-4 alkane diaudiglycidyl ether such as polypropylene glycol diglycidyl ether
- cycloalkane dialkanol diglycidyl ether eg cyclohexane dimethanol diglycidyl ether
- Glycidyl ethers [for example, di- or triglycidyls of C 3-10 alkanetri- or tetraols such as di- to hexa-glycidyl ethers of alkane tri to hexaols (eg trimethylolpropane di or triglycidyl ethers, glycerin
- (Glycidyloxy) naphthalene bis (2-glycidyl Jill oxy naphthyl) diglycidyl sulfopropyl such as bis (glycidyloxy naphthyl) C 1-6 alkanes such as methane, binding these di (glycidyloxy) naphthalenes directly or Tetraglycidyl ether (eg bis [2,7-di (glycidyloxy) naphthyl] methane etc.) linked via a linking group (eg alkylene group such as methylene group, ethylene group or alkylidene group)], Glycidyl ether type epoxy compounds such as glycidyl ether compounds having a xanthene skeleton (for example, 9-phenyl-2,7-diglycidyloxy-1,3,4,5,6,8-hexamethylxanthene); glycidyl ester type Epoxy compounds [eg aromatic dica Boric acid (
- the polyfunctional epoxy compound (particularly, glycidyl ether type epoxy compound) includes an epoxy compound having a fluorene skeleton (polyfunctional epoxy compound).
- the epoxy compound having a fluorene skeleton include a compound represented by the following formula (1B) (that is, a compound in which Y is a glycidyloxy group in X of the formula (1)).
- Specific epoxy compounds having a fluorene skeleton include 9,9-bis (glycidyloxyaryl) fluorenes [or 9,9-bis (glycidyloxyaryl) fluorenes.
- 9,9-bis (glycidyloxyphenyl) fluorenes include, for example, 9,9-bis (glycidyloxyphenyl) fluorene [eg, 9,9-bis (4-glycidyloxyphenyl) fluorene], 9,9- Bis (alkyl-glycidyloxyphenyl) fluorene [eg, 9,9-bis (4-glycidyloxy-3-methylphenyl) fluorene, 9,9-bis (4-glycidyloxy-3,5-dimethylphenyl) fluorene, etc.
- 9,9-bis (mono- or di-C 1-4 alkyl-glycidyloxyphenyl) fluorene]
- 9,9-bis (aryl-glycidyloxyphenyl) fluorene for example, 9,9-bis (4-glycidyloxy- 9,9-bis such as 3-phenylphenyl) fluorene (mono- or di-C 6-10 ants Ru-glycidyloxyphenyl) fluorene]
- 9,9-bis (polyglycidyloxyphenyl) fluorene eg, 9,9-bis (3,4-diglycidyloxyphenyl) fluorene, 9,9-bis (2,4 9,9-bis (di- or triglycidyloxyphenyl) fluorene such as -diglycidyloxyphenyl) fluorene].
- the 9,9-bis (glycidyloxynaphthyl) fluorenes correspond to the 9,9-bis (glycidyloxyphenyl) fluorenes and are compounds in which a phenyl group is substituted with a naphthyl group, such as 9,9- Bis (glycidyloxynaphthyl) fluorene [eg, 9,9-bis (6-glycidyloxy-2-naphthyl) fluorene, 9,9-bis (5-glycidyloxy-1-naphthyl) fluorene] and the like.
- 9,9- Bis (glycidyloxynaphthyl) fluorene eg, 9,9-bis (6-glycidyloxy-2-naphthyl) fluorene, 9,9-bis (5-glycidyloxy-1-naphthyl) fluorene
- 9,9-bis (glycidyloxy (poly) alkoxyphenyl) fluorenes include, for example, 9,9-bis (glycidyloxyalkoxyphenyl) fluorene ⁇ eg, 9,9-bis [4- (2-glycidyloxyethoxy) ) Phenyl] fluorene, 9,9-bis [4- (2-glycidyloxypropoxy) phenyl] fluorene and other 9,9-bis (glycidyloxy C 2-4 alkoxyphenyl) fluorene ⁇ , 9,9-bis (alkyl) -Glycidyloxyalkoxyphenyl) fluorene ⁇ eg, 9,9-bis [4- (2-glycidyloxyethoxy) -3-methylphenyl] fluorene, 9,9-bis [4- (2-glycidyloxypropoxy) -3 -Methylphenyl] fluorene, 9,9-bis [4- (2
- the 9,9-bis (glycidyloxy (poly) alkoxynaphthyl) fluorenes correspond to the 9,9-bis (glycidyloxy (poly) alkoxyphenyl) fluorenes, and the phenyl group is substituted with a naphthyl group.
- the multifunctional epoxy compounds may be used alone or in combination of two or more.
- the epoxy compounds may be used alone or in combination of two or more.
- the epoxy compound may contain at least a polyfunctional epoxy compound.
- an epoxy compound may be comprised only with a polyfunctional epoxy compound, and may combine a polyfunctional epoxy compound and a monofunctional epoxy compound.
- the epoxy compound may be solid or liquid at normal temperature (eg, about 15 to 25 ° C.).
- the viscosity (25 ° C.) of the liquid epoxy compound may be, for example, 1 to 6000 mPa ⁇ s, preferably 10 to 4000 mPa ⁇ s, more preferably about 50 to 2000 mPa ⁇ s, and 1000 mPa ⁇ s or less.
- An epoxy compound having a low viscosity of for example, 1 to 500 mPa ⁇ s, preferably 300 mPa ⁇ s or less (eg 50 to 200 mPa ⁇ s), more preferably 150 mPa ⁇ s or less (eg 70 to 140 mPa ⁇ s)] May be used.
- the proportion of the epoxy compound can be selected from the range of, for example, about 0.05 parts by weight or more (for example, 0.07 to 100 parts by weight) with respect to 100 parts by weight of the resin. It may be about 0.3 to 50 parts by weight, more preferably about 0.5 to 40 parts by weight, usually 0.1 to 30 parts by weight (eg, 0.3 to 25 parts by weight, preferably 0.5 to 20 parts by weight, more preferably 0.7 to 15 parts by weight, particularly 0.8 to 10 parts by weight, particularly preferably 1 to 5 parts by weight.
- the ratio of the epoxy compound is, for example, 0.1 to 200 parts by weight (eg 0.5 to 150 parts by weight), preferably 1 to 100 parts by weight (eg 2 to 2 parts by weight) with respect to 100 parts by weight of the fluorene compound. 80 parts by weight), more preferably 3 to 60 parts by weight, particularly about 5 to 40 parts by weight, usually 1 to 100 parts by weight (eg 2 to 80 parts by weight, preferably 3 to 50 parts by weight, More preferably, it may be about 5 to 30 parts by weight, particularly 8 to 25 parts by weight.
- the resin composition of the present invention may contain other additives ⁇ additives that are neither a fluorene compound nor an epoxy compound, for example, a filler or a reinforcing agent, a colorant (dye pigment), a conductive agent, if necessary.
- additives may be used alone or in combination of two or more.
- the ratio of another additive can be suitably selected according to the kind.
- the proportion of the stabilizer is about 0.001 to 10 parts by weight, preferably 0.01 to 7 parts by weight, more preferably about 0.05 to 5 parts by weight with respect to 100 parts by weight of the thermoplastic resin. Also good.
- the resin composition can be obtained by mixing a resin, a fluorene compound, and an epoxy compound [further, with other components (such as other additives) as necessary].
- the mixing method is not particularly limited, and may be mixed by, for example, melt kneading or may be mixed by dissolving each component in a solvent.
- the present invention also includes a molded body formed of such a resin composition.
- the shape of such a molded body is not particularly limited, and can be appropriately selected depending on the application. For example, a two-dimensional structure (film shape, sheet shape, plate shape, etc.), a three-dimensional structure (tubular, rod shape, tube) Shape, hollow shape, etc.).
- the resin composition of the present invention is often excellent in optical properties, and an optical material or an optical molded body (in particular, an optical film, an optical lens, etc.) may be suitably formed.
- the molded body can be manufactured using, for example, an injection molding method, an injection compression molding method, an extrusion molding method, a transfer molding method, a blow molding method, a pressure molding method, a casting molding method, and the like.
- the resin composition of the present invention is often excellent in various optical properties and is useful for forming a film (particularly an optical film). Therefore, the present invention also includes a film (such as an optical film) formed from the resin composition.
- the thickness of the film can be selected from the range of about 1 to 1000 ⁇ m according to the application, and may be, for example, 1 to 200 ⁇ m, preferably 5 to 150 ⁇ m, and more preferably about 10 to 120 ⁇ m.
- Such a film (such as an optical film) is formed by forming (or molding) the resin composition using a conventional film forming method, casting method (solvent casting method), melt extrusion method, calendar method, or the like. Can be manufactured.
- the film may be a stretched film.
- a stretched film may be either a uniaxially stretched film or a biaxially stretched film.
- the stretching ratio may be about 1.05 to 10 times (for example, 1.1 to 5 times) in each direction in uniaxial stretching or biaxial stretching, and is usually 1.1 to 3 times (for example, 1. 2 to 2.5 times).
- biaxial stretching it may be equal stretching or partial stretching.
- uniaxial stretching longitudinal stretching or lateral stretching may be used.
- the thickness of the stretched film may be, for example, about 1 to 150 ⁇ m, preferably 3 to 120 ⁇ m, and more preferably about 5 to 100 ⁇ m.
- Such a stretched film can be obtained by subjecting a film after film formation (or an unstretched film) to a stretching treatment.
- the stretching method is not particularly limited. In the case of uniaxial stretching, a wet stretching method or a dry stretching method may be used. In the case of biaxial stretching, a tenter method (also referred to as a flat method), a tube method, or the like may be used. Good.
- Tear strength A tear test was performed using a digital Elmendorf tear tester SA-WP (manufactured by Toyo Seiki Seisakusho). The sample used was a 75 mm ⁇ 63 mm rectangular sample (conforming to JISK7128-2) with a 20 mm cut in the center, and the obtained results were converted to tear strength per 30 ⁇ m.
- the retardation of the film was measured with a high-speed retardation measuring device RE-100 manufactured by Otsuka Electronics Co., Ltd. Moreover, (the retardation value at each wavelength and N 400, N 589, N 700 ) in evaluating the wavelength dispersion, the 400 nm, 589 nm, measurement of retardation values of 700 nm.
- the ratio of hindered phenolic antioxidant was 2000 ppm with respect to the total amount of TAC and BPEF, and the ratio of phosphorus antioxidant was 1000 ppm with respect to the total amount of TAC and BPEF.
- the resin composition was transparent and was mixed uniformly.
- the obtained resin composition was melt-pressed (hot pressed) using a press molding machine to obtain a film (unstretched film).
- the tear strength of the film was 0.11 N
- the yield strength was 71.6 MPa
- the elongation at break was 9.9%.
- the phase difference (N 400 ) at a wavelength of 400 nm is 0.12 nm
- the phase difference (N 589 ) at a wavelength of 589 nm is 0.21 nm
- the haze of the film was 0.9, and the total light transmittance was 92%.
- Example 1 In Reference Example 1, a resin composition was obtained in the same manner as in Reference Example 1 except that 1.6 parts by weight of an epoxy compound (trimethylolpropane triglycidyl ether) was further melt-kneaded. In addition, the resin composition was transparent and was mixed uniformly.
- an epoxy compound trimethylolpropane triglycidyl ether
- the tear strength is 0.13 N
- the yield point strength is 79.8 MPa
- the elongation at break is 11.2%
- the phase difference (N 400 ) at a wavelength of 400 nm is 0.16 nm
- the phase difference (N 589 ) at a wavelength of 589 nm is 0.15 nm
- the phase difference (N 700 ) at a wavelength of 700 nm is 0.15 nm
- the haze was 0.6 and the total light transmittance was 92%.
- Example 2 Reference Example 1 and Reference Example 1 except that 2.0 parts by weight of 9,9-bis (4-glycidyloxyphenyl) fluorene (Osaka Gas Chemical Co., Ltd.) were melt-kneaded as an epoxy compound. Similarly, a resin composition was obtained. In addition, the resin composition was transparent and was mixed uniformly.
- the tear strength is 0.12 N
- the yield point strength is 77.4 MPa
- the elongation at break is 12.9%, confirming that the mechanical properties are greatly improved as compared with Reference Example 1. did.
- the retardation (N 400 ) at a wavelength of 400 nm is 0.21 nm
- the retardation (N 589 ) at a wavelength of 589 nm is 0.20 nm
- the retardation (N 700 ) at a wavelength of 700 nm is 0.20 nm
- the haze was 1.2 and the total light transmittance was 92%.
- the tear strength of the film was 0.38 N
- the yield strength was 63.7 MPa
- the elongation at break was 2.8%.
- a phase difference at a wavelength of 400 nm (N 400) is 4.70Nm
- the phase difference at a wavelength of 589 nm (N 589) is 5.08Nm
- the phase difference at a wavelength 700 nm (N 700 ) was 5.18 nm
- the haze of the film was 0.9, and the total light transmittance was 92%.
- Example 3 In Reference Example 2, a resin composition was obtained in the same manner as in Reference Example 2 except that 1.6 parts by weight of an epoxy compound (trimethylolpropane triglycidyl ether) was further melt-kneaded. In addition, the resin composition was transparent and was mixed uniformly.
- an epoxy compound trimethylolpropane triglycidyl ether
- the tear strength is 0.58 N
- the yield point strength is 67.4 MPa
- the elongation at break is 5.7%
- the phase difference (N 400 ) at a wavelength of 400 nm is 4.43 nm
- the phase difference (N 598 ) at a wavelength of 589 nm is 4.59 nm
- the phase difference (N 700 ) at a wavelength of 700 nm is 4.63 nm
- N 400 / N 589 0.96
- N 700 / N 589 1.01).
- the haze was 0.6 and the total light transmittance was 92%.
- Reference Example 3 In Reference Example 1, 11 parts by weight of BPEF was replaced with 18 parts by weight of 9,9-bis [4- (2-hydroxyethoxy) -3-phenylphenyl] fluorene (Osaka Gas Chemical Co., Ltd., hereinafter referred to as BOPPEF). Except for the above, a film (unstretched film) was obtained in the same manner as in Reference Example 1. The cylinder temperature was 210 to 280 ° C. And various characteristics were measured using the obtained film.
- the tear strength of the film was 0.41 N
- the yield strength was 68.0 MPa
- the elongation at break was 4.5%.
- the retardation at a wavelength of 400 nm was 4.66 nm
- the retardation at a wavelength of 589 nm was 5.79 nm
- the haze of the film was 0.9, and the total light transmittance was 92%.
- Example 4 In Reference Example 3, a resin composition was obtained in the same manner as in Reference Example 3, except that 1.6 parts by weight of an epoxy compound (trimethylolpropane triglycidyl ether) was further melt-kneaded. In addition, the resin composition was transparent and was mixed uniformly.
- an epoxy compound trimethylolpropane triglycidyl ether
- the tear strength is 0.56 N
- the yield point strength is 70.8 MPa
- the elongation at break is 4.9%
- the phase difference (N 400 ) at a wavelength of 400 nm is 5.39 nm
- the phase difference (N 598 ) at a wavelength of 589 nm is 6.60 nm
- the haze was 0.6 and the total light transmittance was 92%.
- the resin composition of the present invention contains a combination of a fluorene compound and an epoxy compound, it can impart excellent properties derived from the fluorene compound to the resin without impairing mechanical properties. Further, the wavelength dispersion of the resin can be adjusted (for example, the wavelength dispersion of the resin can be reduced) by a combination of a fluorene compound and an epoxy compound.
- the resin composition of the present invention is excellent in, for example, high refractive index, high heat resistance, high transparency, excellent moldability (such as high melt fluidity), although it depends on the type of resin constituting the resin composition. It has characteristics.
- Such a resin composition is particularly useful for constructing (or forming) a molded product for optical use (optical molded product) because it is often excellent in optical properties.
- Examples of the optical molded body formed (configured) with such a resin composition include optical films and optical lenses.
- an optical film in addition to a phase film (or a retardation plate), a polarizing film (and a polarizing element and a polarizing plate protective film constituting the polarizing film), an alignment film (alignment film), a viewing angle expansion (compensation) film, a diffusion plate (Film), prism sheet, light guide plate, brightness enhancement film, near infrared absorption film, reflection film, antireflection (AR) film, reflection reduction (LR) film, antiglare (AG) film, transparent conductive (ITO) film, Anisotropic conductive film (ACF), electromagnetic wave shielding (EMI) film, electrode substrate film, color filter substrate film, barrier film, color filter layer, black matrix layer, adhesive layer or release layer between optical films, etc.
- a phase film or a retardation plate
- a polarizing film and a polarizing element and a polarizing plate protective film constituting the polarizing film
- an alignment film alignment film
- a viewing angle expansion (compensation) film a
- the film of the present invention is useful as an optical film for use in an apparatus display.
- the display member (or display) including the optical film of the present invention include FPD devices such as personal computer monitors, televisions, mobile phones, car navigation systems, and touch panels (for example, , LCD, PDP, etc.).
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
樹脂としては、幅広い樹脂を使用(又は適用)でき、熱可塑性樹脂、硬化性樹脂(熱又は光硬化性樹脂)のいずれであってもよい。 [resin]
As the resin, a wide range of resins can be used (or applied), and any of a thermoplastic resin and a curable resin (thermal or photo-curable resin) may be used.
環状オレフィン系樹脂は、環状オレフィンを少なくとも重合成分とする樹脂である。 (Cyclic olefin resin)
Cyclic olefin resin is resin which uses cyclic olefin as a polymerization component at least.
メタクリル樹脂(メタクリル系樹脂、メタクリレート樹脂)としては、少なくともメタクリル酸エステルを重合成分とする樹脂などが挙げられる。通常、メタクリル樹脂は、メタクリル酸アルキル[例えば、メタクリル酸アルキルエステル(例えば、メタクリル酸メチル、メタクリル酸エチル、メタクリル酸プロピル、メタクリル酸ブチル、メタクリル酸2-エチルヘキシルなどのメタクリル酸C1-20アルキル、好ましくはメタクリル酸C1-12アルキル、さらに好ましくはメタクリル酸C1-6アルキル、特にメタクリル酸C1-4アルキル)など]を重合成分とする樹脂であってもよい。メタクリル酸アルキルは、単独で又は2種以上組みあわせてもよい。 (Methacrylic resin)
Examples of the methacrylic resin (methacrylic resin or methacrylate resin) include resins having at least a methacrylic acid ester as a polymerization component. Usually, the methacrylic resin is an alkyl methacrylate [for example, an alkyl methacrylate ester (for example, a C 1-20 alkyl methacrylate such as methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl methacrylate, 2-ethylhexyl methacrylate, Preferably, a resin having a polymerization component of C 1-12 alkyl methacrylate, more preferably C 1-6 alkyl methacrylate, particularly C 1-4 alkyl methacrylate) and the like. The alkyl methacrylates may be used alone or in combination of two or more.
芳香族ポリカーボネート樹脂としては、芳香族ジオールとカーボネート形成性化合物とを重合成分とする樹脂が挙げられる。 (Aromatic polycarbonate resin)
Examples of the aromatic polycarbonate resin include resins having an aromatic diol and a carbonate-forming compound as polymerization components.
芳香族ポリエステル樹脂としては、例えば、ポリアルキレンアリレート樹脂、ポリアリレート樹脂[例えば、芳香族ジカルボン酸(テレフタル酸など)と芳香族ジオール(ビフェノール、ビスフェノールA、キシリレングリコール、これらのアルキレンオキサイド付加体など)を重合成分として用いたポリアリレート樹脂など)など]、液晶性ポリエステル樹脂などが挙げられる。 (Aromatic polyester resin)
Examples of aromatic polyester resins include polyalkylene arylate resins, polyarylate resins [for example, aromatic dicarboxylic acids (such as terephthalic acid) and aromatic diols (biphenol, bisphenol A, xylylene glycol, alkylene oxide adducts thereof, etc.) And the like)], and liquid crystalline polyester resins.
セルロース誘導体としては、特に制限されず、種々のセルロース誘導体、例えば、セルロースエステル、セルロースカーバメート(例えば、セルロースフェニルカーバメートなど)、セルロースエーテルなどが使用できる。 (Cellulose derivative)
The cellulose derivative is not particularly limited, and various cellulose derivatives such as cellulose ester, cellulose carbamate (for example, cellulose phenyl carbamate), cellulose ether and the like can be used.
フルオレン化合物は、9,9-ビスアリールフルオレン骨格を有していればよく、反応性基を有しない化合物[例えば、9,9-ビスアリールフルオレン(例えば、9,9-ビスフェニルフルオレン)などの後述の式(1)においてpが0である化合物など]であってもよいが、通常、反応性基を有している。 [Fluorene compound]
The fluorene compound only needs to have a 9,9-bisarylfluorene skeleton, such as a compound having no reactive group [for example, 9,9-bisarylfluorene (for example, 9,9-bisphenylfluorene), etc. A compound in which p is 0 in formula (1) described later] may be used, but usually has a reactive group.
エポキシ化合物(又はエポキシ樹脂)としては、単官能エポキシ化合物(単官能性エポキシ化合物)、多官能エポキシ化合物(多官能性エポキシ化合物)に大別できる。単官能エポキシ化合物としては、例えば、グリシジルエーテル類(モノグリシジルエーテル)[例えば、アルキルグリシジルエーテル(例えば、2-エチルへキシルグリシジルエーテルなど)アルケニルグリシジルエーテル(例えば、アリルグリシジルエーテルなど)、アリールグリシジルエーテル(例えば、フェニルグリシジルエーテル、p-t-ブチルフェニルグリシジルエーテルなど)、これらの化合物に対応するアルキレンオキサイド付加体のグリシジルエーテル(例えば、フェノールのアルキレンオキサイド付加体のグリシジルエーテル)など]、アルケンオキサイド類(例えば、オクチレンオキサイド、スチレンオキサイドなど)などが挙げられる。単官能性エポキシ化合物は、単独で又は2種以上組み合わせてもよい。 [Epoxy compound]
The epoxy compound (or epoxy resin) can be roughly classified into a monofunctional epoxy compound (monofunctional epoxy compound) and a polyfunctional epoxy compound (polyfunctional epoxy compound). Examples of monofunctional epoxy compounds include glycidyl ethers (monoglycidyl ether) [eg, alkyl glycidyl ether (eg, 2-ethylhexyl glycidyl ether), alkenyl glycidyl ether (eg, allyl glycidyl ether), aryl glycidyl ether, etc. (Eg, phenyl glycidyl ether, pt-butylphenyl glycidyl ether, etc.), glycidyl ethers of alkylene oxide adducts corresponding to these compounds (eg, glycidyl ethers of alkylene oxide adducts of phenol), etc.], alkene oxides (For example, octylene oxide, styrene oxide, etc.). Monofunctional epoxy compounds may be used alone or in combination of two or more.
島津製作所製 オートグラフ(ロードセル:1kN)を用い、引張試験を実施した。なお、サンプルは幅を約7.5mm、長さを5cmのものを用い、チャック間距離を20mm、引張速度を10mm/分とした。 (Yield point strength, elongation at break)
A tensile test was performed using an autograph (load cell: 1 kN) manufactured by Shimadzu Corporation. A sample having a width of about 7.5 mm and a length of 5 cm was used, the distance between chucks was 20 mm, and the tensile speed was 10 mm / min.
デジタルエルメンドルフ引裂き試験機SA-WP(東洋精機製作所製)を用い、引裂試験を実施した。尚、サンプルは75mm×63mmの長方形型サンプル(JISK7128-2に準拠)の中央へ20mmの切り込みを入れたものを用い、得られた結果については、30μmあたりの引裂強度に換算した。 (Tear strength)
A tear test was performed using a digital Elmendorf tear tester SA-WP (manufactured by Toyo Seiki Seisakusho). The sample used was a 75 mm × 63 mm rectangular sample (conforming to JISK7128-2) with a 20 mm cut in the center, and the obtained results were converted to tear strength per 30 μm.
フィルムのレタデーションについては、大塚電子(株)製、高速レタデーション測定装置RE-100にて測定を行った。また、波長分散性を評価する上で、400nm、589nm、700nmのレタデーション値を測定した(各波長でのレタデーション値をN400、N589、N700とする)。 (Evaluation of phase difference and chromatic dispersion characteristics)
The retardation of the film was measured with a high-speed retardation measuring device RE-100 manufactured by Otsuka Electronics Co., Ltd. Moreover, (the retardation value at each wavelength and N 400, N 589, N 700 ) in evaluating the wavelength dispersion, the 400 nm, 589 nm, measurement of retardation values of 700 nm.
全光線透過率およびヘイズを、スガ試験機(株)ヘーズメーターHZ-2にて測定した。 (Haze, total light transmittance)
The total light transmittance and haze were measured with Suga Test Instruments Co., Ltd. Haze Meter HZ-2.
セルローストリアセテート((株)ダイセル製、LT55、以下、TACという)100重量部、9,9-ビス[4-(2-ヒドロキシエトキシ)フェニル]フルオレン(大阪ガスケミカル(株)製、以下、BPEFという)11重量部、安定剤[ヒンダードフェノール系酸化防止剤(BASFジャパン(株)製、IRGANOX1010)およびリン系酸化防止剤(住友化学(株)製、SUMILIZER GP)]を、二軸押出機(テクノベル社製 KZW15/30 MG)を用いて210~290℃のシリンダー温度にて溶融混練し、ペレット状の樹脂組成物を得た。なお、ヒンダードフェノール系酸化防止剤の割合は、TACとBPEFの総量に対して2000ppm、リン系酸化防止剤の割合はTACとBPEFの総量に対して1000ppmとした。なお、樹脂組成物は、透明であり、均一に混合されていた。 (Reference Example 1)
100 parts by weight of cellulose triacetate (manufactured by Daicel Corporation, LT55, hereinafter referred to as TAC), 9,9-bis [4- (2-hydroxyethoxy) phenyl] fluorene (manufactured by Osaka Gas Chemical Co., Ltd., hereinafter referred to as BPEF) ) 11 parts by weight, stabilizer [hindered phenol antioxidant (BASF Japan, IRGANOX1010) and phosphorus antioxidant (Sumitomo Chemical Co., Ltd., SUMILIZER GP)] Using KZW15 / 30 MG) manufactured by Technobel, melt-kneading was performed at a cylinder temperature of 210 to 290 ° C. to obtain a pellet-shaped resin composition. In addition, the ratio of hindered phenolic antioxidant was 2000 ppm with respect to the total amount of TAC and BPEF, and the ratio of phosphorus antioxidant was 1000 ppm with respect to the total amount of TAC and BPEF. In addition, the resin composition was transparent and was mixed uniformly.
参考例1において、さらに、エポキシ化合物(トリメチロールプロパントリグリシジルエーテル)1.6重量部を溶融混練したこと以外は、参考例1と同様にして樹脂組成物を得た。なお、樹脂組成物は、透明であり、均一に混合されていた。 (Example 1)
In Reference Example 1, a resin composition was obtained in the same manner as in Reference Example 1 except that 1.6 parts by weight of an epoxy compound (trimethylolpropane triglycidyl ether) was further melt-kneaded. In addition, the resin composition was transparent and was mixed uniformly.
参考例1において、さらに、エポキシ化合物として、9,9-ビス(4-グリシジルオキシフェニル)フルオレン(大阪ガスケミカル(株)製)2.0重量部を溶融混練したこと以外は、参考例1と同様にして樹脂組成物を得た。なお、樹脂組成物は、透明であり、均一に混合されていた。 (Example 2)
Reference Example 1 and Reference Example 1 except that 2.0 parts by weight of 9,9-bis (4-glycidyloxyphenyl) fluorene (Osaka Gas Chemical Co., Ltd.) were melt-kneaded as an epoxy compound. Similarly, a resin composition was obtained. In addition, the resin composition was transparent and was mixed uniformly.
参考例1において、BPEF11重量部を6,6-ビス(9-フルオレニリデン)―ジ(2-ナフトール)(大阪ガスケミカル(株)製、以下、BNFという)18重量部に代えた以外は、参考例1と同様にして、フィルム(未延伸フィルム)を得た。なお、シリンダー温度は210~280℃とした。そして、得られたフィルムを用いて各種特性を測定した。 (Reference Example 2)
Reference Example 1 except that 11 parts by weight of BPEF was replaced with 18 parts by weight of 6,6-bis (9-fluorenylidene) -di (2-naphthol) (Osaka Gas Chemical Co., Ltd., hereinafter referred to as BNF). In the same manner as in Example 1, a film (unstretched film) was obtained. The cylinder temperature was 210 to 280 ° C. And various characteristics were measured using the obtained film.
参考例2において、さらに、エポキシ化合物(トリメチロールプロパントリグリシジルエーテル)1.6重量部を溶融混練したこと以外は、参考例2と同様にして樹脂組成物を得た。なお、樹脂組成物は、透明であり、均一に混合されていた。 (Example 3)
In Reference Example 2, a resin composition was obtained in the same manner as in Reference Example 2 except that 1.6 parts by weight of an epoxy compound (trimethylolpropane triglycidyl ether) was further melt-kneaded. In addition, the resin composition was transparent and was mixed uniformly.
参考例1において、BPEF11重量部を9,9-ビス[4-(2-ヒドロキシエトキシ)-3-フェニルフェニル]フルオレン(大阪ガスケミカル(株)製、以下、BOPPEFという)18重量部に代えた以外は、参考例1と同様にして、フィルム(未延伸フィルム)を得た。なお、シリンダー温度は210~280℃とした。そして、得られたフィルムを用いて各種特性を測定した。 (Reference Example 3)
In Reference Example 1, 11 parts by weight of BPEF was replaced with 18 parts by weight of 9,9-bis [4- (2-hydroxyethoxy) -3-phenylphenyl] fluorene (Osaka Gas Chemical Co., Ltd., hereinafter referred to as BOPPEF). Except for the above, a film (unstretched film) was obtained in the same manner as in Reference Example 1. The cylinder temperature was 210 to 280 ° C. And various characteristics were measured using the obtained film.
参考例3において、さらに、エポキシ化合物(トリメチロールプロパントリグリシジルエーテル)1.6重量部を溶融混練したこと以外は、参考例3と同様にして樹脂組成物を得た。なお、樹脂組成物は、透明であり、均一に混合されていた。 Example 4
In Reference Example 3, a resin composition was obtained in the same manner as in Reference Example 3, except that 1.6 parts by weight of an epoxy compound (trimethylolpropane triglycidyl ether) was further melt-kneaded. In addition, the resin composition was transparent and was mixed uniformly.
Claims (15)
- 非エポキシ系樹脂と、9,9-ビスアリールフルオレン骨格を有する非エポキシ系化合物と、エポキシ化合物とを含む樹脂組成物。 A resin composition comprising a non-epoxy resin, a non-epoxy compound having a 9,9-bisarylfluorene skeleton, and an epoxy compound.
- 9,9-ビスアリールフルオレン骨格を有する非エポキシ系化合物が、下記式(1)で表される化合物である請求項1記載の樹脂組成物。
- 9,9-ビスアリールフルオレン骨格を有する非エポキシ系化合物が、下記式(1A)で表される化合物である請求項1又は2記載の樹脂組成物。
- 環Zがベンゼン環又はナフタレン環、R1がアルキル基、kが0~1、R2がアルキル基、シクロアルキル基、アリール基、アラルキル基又はアルコキシ基、mが0~2、R3がC2-4アルキレン基、nが0~2、pが1~3である請求項2又は3記載の樹脂組成物。 Ring Z is a benzene ring or naphthalene ring, R 1 is an alkyl group, k is 0 to 1, R 2 is an alkyl group, cycloalkyl group, aryl group, aralkyl group or alkoxy group, m is 0 to 2, and R 3 is C The resin composition according to claim 2 or 3, wherein 2-4 alkylene group, n is 0 to 2, and p is 1 to 3.
- 9,9-ビスアリールフルオレン骨格を有する非エポキシ系化合物が、9,9-ビス(ヒドロキシフェニル)フルオレン、9,9-ビス(アルキル-ヒドロキシフェニル)フルオレン、9,9-ビス(アリール-ヒドロキシフェニル)フルオレン、9,9-ビス(ジ又はトリヒドロキシフェニル)フルオレン、9,9-ビス(ヒドロキシナフチル)フルオレン、9,9-ビス(ヒドロキシアルコキシフェニル)フルオレン、9,9-ビス(アルキル-ヒドロキシアルコキシフェニル)フルオレン、9,9-ビス(アリール-ヒドロキシアルコキシフェニル)フルオレン、9,9-ビス(ヒドロキシアルコキシナフチル)フルオレンから選択された少なくとも1種である請求項1~4のいずれかに記載の樹脂組成物。 Non-epoxy compounds having a 9,9-bisarylfluorene skeleton include 9,9-bis (hydroxyphenyl) fluorene, 9,9-bis (alkyl-hydroxyphenyl) fluorene, and 9,9-bis (aryl-hydroxyphenyl). ) Fluorene, 9,9-bis (di or trihydroxyphenyl) fluorene, 9,9-bis (hydroxynaphthyl) fluorene, 9,9-bis (hydroxyalkoxyphenyl) fluorene, 9,9-bis (alkyl-hydroxyalkoxy) The resin according to any one of claims 1 to 4, which is at least one selected from phenyl) fluorene, 9,9-bis (aryl-hydroxyalkoxyphenyl) fluorene, and 9,9-bis (hydroxyalkoxynaphthyl) fluorene. Composition.
- 非エポキシ系樹脂が、熱可塑性樹脂である請求項1~5のいずれかに記載の樹脂組成物。 6. The resin composition according to claim 1, wherein the non-epoxy resin is a thermoplastic resin.
- 非エポキシ系樹脂が、環状オレフィン樹脂、メタクリル樹脂、芳香族ポリカーボネート樹脂、芳香族ポリエステル樹脂およびセルロース誘導体から選択された少なくとも1種である請求項1~6のいずれかに記載の樹脂組成物。 7. The resin composition according to claim 1, wherein the non-epoxy resin is at least one selected from a cyclic olefin resin, a methacrylic resin, an aromatic polycarbonate resin, an aromatic polyester resin, and a cellulose derivative.
- エポキシ化合物が、多官能エポキシ化合物を含む請求項1~7のいずれかに記載の樹脂組成物。 The resin composition according to any one of claims 1 to 7, wherein the epoxy compound comprises a polyfunctional epoxy compound.
- 非エポキシ系樹脂100重量部に対して、9,9-ビスアリールフルオレン骨格を有する非エポキシ系化合物の割合が0.5~50重量部、エポキシ化合物の割合が0.1~30重量部である請求項1~8のいずれかに記載の樹脂組成物。 The proportion of the non-epoxy compound having a 9,9-bisarylfluorene skeleton is 0.5 to 50 parts by weight and the proportion of the epoxy compound is 0.1 to 30 parts by weight with respect to 100 parts by weight of the non-epoxy resin. The resin composition according to any one of claims 1 to 8.
- エポキシ化合物の割合が、9,9-ビスアリールフルオレン骨格を有する非エポキシ系化合物100重量部に対して、1~100重量部である請求項1~9のいずれかに記載の樹脂組成物。 10. The resin composition according to claim 1, wherein the ratio of the epoxy compound is 1 to 100 parts by weight with respect to 100 parts by weight of the non-epoxy compound having a 9,9-bisarylfluorene skeleton.
- 請求項1~10のいずれかに記載の樹脂組成物で形成された成形体。 A molded body formed of the resin composition according to any one of claims 1 to 10.
- 光学用成形体である請求項11記載の成形体。 The molded article according to claim 11, which is an optical molded article.
- 光学フィルムである請求項11又は12記載の成形体。 The molded article according to claim 11 or 12, which is an optical film.
- 非エポキシ系樹脂の波長分散性を低減するための添加剤であって、9,9-ビスアリールフルオレン骨格を有する非エポキシ系化合物およびエポキシ化合物で構成された波長分散性低減剤。 A wavelength dispersion reducing agent composed of a non-epoxy compound having an 9,9-bisarylfluorene skeleton and an epoxy compound, which is an additive for reducing the wavelength dispersion of a non-epoxy resin.
- 非エポキシ系樹脂に請求項14記載の波長分散性低減剤を添加し、非エポキシ系樹脂の波長分散性を低減する方法。 A method for reducing the wavelength dispersibility of a non-epoxy resin by adding the wavelength dispersibility reducing agent according to claim 14 to the non-epoxy resin.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201480018415.XA CN105308122A (en) | 2013-04-10 | 2014-04-07 | Resin composition containing fluorine compound, molded body, wavelength dispersion adjustment agent, and method for adjusting wavelength dispersion of resin |
KR1020157027936A KR20150142682A (en) | 2013-04-10 | 2014-04-07 | Resin composition containing fluorine compound, molded body, wavelength dispersion adjustment agent, and method for adjusting wavelength dispersion of resin |
JP2015511249A JPWO2014168108A1 (en) | 2013-04-10 | 2014-04-07 | Resin composition and molded product containing fluorene compound, wavelength dispersion adjusting agent and resin wavelength dispersion adjusting method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013082464 | 2013-04-10 | ||
JP2013-082464 | 2013-04-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014168108A1 true WO2014168108A1 (en) | 2014-10-16 |
Family
ID=51689516
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2014/060081 WO2014168108A1 (en) | 2013-04-10 | 2014-04-07 | Resin composition containing fluorine compound, molded body, wavelength dispersion adjustment agent, and method for adjusting wavelength dispersion of resin |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2014168108A1 (en) |
KR (1) | KR20150142682A (en) |
CN (1) | CN105308122A (en) |
TW (1) | TW201500429A (en) |
WO (1) | WO2014168108A1 (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016087966A (en) * | 2014-11-06 | 2016-05-23 | 大阪瓦斯株式会社 | Cellulose derivative film and method for producing the same |
WO2016139826A1 (en) * | 2015-03-02 | 2016-09-09 | 大阪ガスケミカル株式会社 | Fluidity improver and polyamide resin composition containing same |
WO2016147847A1 (en) * | 2015-03-13 | 2016-09-22 | 大阪ガスケミカル株式会社 | Resin composition and optical lens |
WO2017026250A1 (en) * | 2015-08-07 | 2017-02-16 | 大阪ガスケミカル株式会社 | Fiber-reinforced polyamide resin composition and molded body of same |
JPWO2015147116A1 (en) * | 2014-03-28 | 2017-04-13 | 富士フイルム株式会社 | (Meth) acrylic resin composition, film, polarizing plate protective film, polarizing plate and liquid crystal display device |
JP2017210514A (en) * | 2016-05-24 | 2017-11-30 | 旭化成株式会社 | Polyamide resin composition |
WO2021171756A1 (en) * | 2020-02-28 | 2021-09-02 | 大阪ガスケミカル株式会社 | Resin composiiton and fluidity improvement method |
JP2022096595A (en) * | 2020-12-17 | 2022-06-29 | 大阪ガスケミカル株式会社 | Polyarylene sulfide resin composition and its uses |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102556596B1 (en) * | 2018-08-17 | 2023-07-17 | 오사카 가스 케미칼 가부시키가이샤 | Retardation film and its manufacturing method |
US12234352B2 (en) * | 2018-11-27 | 2025-02-25 | Osaka Gas Co., Ltd. | Rubbery composition and method for producing the same |
KR102457502B1 (en) * | 2018-12-27 | 2022-10-21 | 삼성에스디아이 주식회사 | Polarizing plate and liquid crystal display apparatus comprising the same |
WO2021140927A1 (en) * | 2020-01-08 | 2021-07-15 | 大阪ガスケミカル株式会社 | Retardation film and applications thereof |
KR20230029590A (en) * | 2020-06-26 | 2023-03-03 | 미츠비시 가스 가가쿠 가부시키가이샤 | resin composition |
CN114349965A (en) * | 2021-12-27 | 2022-04-15 | 江南大学 | A kind of preparation method of high refractive index optical resin containing S element |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0931306A (en) * | 1995-07-21 | 1997-02-04 | Minnesota Mining & Mfg Co <3M> | Heat-resistant toughened epoxy resin composition |
JPH0971716A (en) * | 1995-09-06 | 1997-03-18 | Toyobo Co Ltd | Curable resin composition |
JP2004537165A (en) * | 2001-07-10 | 2004-12-09 | スリーエム イノベイティブ プロパティズ カンパニー | Capacitor with epoxy dielectric layer cured with aminophenylfluorene |
JP2008158165A (en) * | 2006-12-22 | 2008-07-10 | Nitto Denko Corp | Optical film, polarizing plate, and image display device |
JP2012136646A (en) * | 2010-12-27 | 2012-07-19 | Nippon Zeon Co Ltd | Curing resin composition, cured material, laminate body, multilayer circuit board, and electronic device |
JP2012211252A (en) * | 2011-03-31 | 2012-11-01 | Osaka Gas Co Ltd | Cellulose derivative film, and method for manufacturing the same |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4714362B2 (en) | 2001-03-26 | 2011-06-29 | 大阪瓦斯株式会社 | Low temperature molding material |
JP4321971B2 (en) | 2001-03-26 | 2009-08-26 | 大阪瓦斯株式会社 | Polyurethane resin and molded article for low temperature |
JP4410540B2 (en) | 2003-11-28 | 2010-02-03 | 大阪瓦斯株式会社 | Fluorene skeleton-containing resin composition and molded article thereof |
CN101592861A (en) * | 2004-10-07 | 2009-12-02 | 日立化成工业株式会社 | Resin composition for optical material, resin for optical material film and use its photoconduction |
JP5507128B2 (en) | 2009-06-25 | 2014-05-28 | 大阪瓦斯株式会社 | Optical resin composition and molded article |
JP5350923B2 (en) | 2009-07-14 | 2013-11-27 | 大阪瓦斯株式会社 | β crystal nucleating agent and crystalline resin composition with β crystal structure formed |
-
2014
- 2014-04-07 KR KR1020157027936A patent/KR20150142682A/en not_active Withdrawn
- 2014-04-07 CN CN201480018415.XA patent/CN105308122A/en active Pending
- 2014-04-07 WO PCT/JP2014/060081 patent/WO2014168108A1/en active Application Filing
- 2014-04-07 JP JP2015511249A patent/JPWO2014168108A1/en active Pending
- 2014-04-10 TW TW103113172A patent/TW201500429A/en unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0931306A (en) * | 1995-07-21 | 1997-02-04 | Minnesota Mining & Mfg Co <3M> | Heat-resistant toughened epoxy resin composition |
JPH0971716A (en) * | 1995-09-06 | 1997-03-18 | Toyobo Co Ltd | Curable resin composition |
JP2004537165A (en) * | 2001-07-10 | 2004-12-09 | スリーエム イノベイティブ プロパティズ カンパニー | Capacitor with epoxy dielectric layer cured with aminophenylfluorene |
JP2008158165A (en) * | 2006-12-22 | 2008-07-10 | Nitto Denko Corp | Optical film, polarizing plate, and image display device |
JP2012136646A (en) * | 2010-12-27 | 2012-07-19 | Nippon Zeon Co Ltd | Curing resin composition, cured material, laminate body, multilayer circuit board, and electronic device |
JP2012211252A (en) * | 2011-03-31 | 2012-11-01 | Osaka Gas Co Ltd | Cellulose derivative film, and method for manufacturing the same |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2015147116A1 (en) * | 2014-03-28 | 2017-04-13 | 富士フイルム株式会社 | (Meth) acrylic resin composition, film, polarizing plate protective film, polarizing plate and liquid crystal display device |
JP2016087966A (en) * | 2014-11-06 | 2016-05-23 | 大阪瓦斯株式会社 | Cellulose derivative film and method for producing the same |
JPWO2016139826A1 (en) * | 2015-03-02 | 2017-12-14 | 大阪ガスケミカル株式会社 | Fluidity improver and polyamide resin composition containing the same |
WO2016139826A1 (en) * | 2015-03-02 | 2016-09-09 | 大阪ガスケミカル株式会社 | Fluidity improver and polyamide resin composition containing same |
WO2016147847A1 (en) * | 2015-03-13 | 2016-09-22 | 大阪ガスケミカル株式会社 | Resin composition and optical lens |
JPWO2016147847A1 (en) * | 2015-03-13 | 2017-12-21 | 大阪ガスケミカル株式会社 | Resin composition and optical lens |
WO2017026250A1 (en) * | 2015-08-07 | 2017-02-16 | 大阪ガスケミカル株式会社 | Fiber-reinforced polyamide resin composition and molded body of same |
JP2017210514A (en) * | 2016-05-24 | 2017-11-30 | 旭化成株式会社 | Polyamide resin composition |
WO2021171756A1 (en) * | 2020-02-28 | 2021-09-02 | 大阪ガスケミカル株式会社 | Resin composiiton and fluidity improvement method |
JPWO2021171756A1 (en) * | 2020-02-28 | 2021-09-02 | ||
JP7052163B2 (en) | 2020-02-28 | 2022-04-11 | 大阪ガスケミカル株式会社 | Resin composition and method for improving fluidity |
US11760717B2 (en) | 2020-02-28 | 2023-09-19 | Osaka Gas Chemicals Co., Ltd. | Resin composition and fluidity improvement method |
JP2022096595A (en) * | 2020-12-17 | 2022-06-29 | 大阪ガスケミカル株式会社 | Polyarylene sulfide resin composition and its uses |
Also Published As
Publication number | Publication date |
---|---|
TW201500429A (en) | 2015-01-01 |
KR20150142682A (en) | 2015-12-22 |
JPWO2014168108A1 (en) | 2017-02-16 |
CN105308122A (en) | 2016-02-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2014168108A1 (en) | Resin composition containing fluorine compound, molded body, wavelength dispersion adjustment agent, and method for adjusting wavelength dispersion of resin | |
WO2014168107A1 (en) | Wavelength dispersion adjustment agent, resin composition, and method for adjusting wavelength dispersion of resin | |
JP6831650B2 (en) | High refractive index polycarbonate resin and molded product | |
JP6225150B2 (en) | Polyester resin having fluorene skeleton and molded product thereof | |
JP5507128B2 (en) | Optical resin composition and molded article | |
JP6242270B2 (en) | Birefringence modifier | |
JP5914259B2 (en) | Polyester resin having a fluorene skeleton | |
JP5437106B2 (en) | Polyester resin having a fluorene skeleton | |
JP5501790B2 (en) | Polyester resin having a fluorene skeleton | |
JP6214465B2 (en) | Resin fluidity improvement method | |
JP6334236B2 (en) | Strength improver | |
JP6077918B2 (en) | Abbe number improver | |
JP5225209B2 (en) | Polyester resin having a fluorene skeleton | |
JP2010055944A (en) | Conductive laminate film, and touch panel using the same | |
JP6235959B2 (en) | Cyclic olefin resin composition | |
JP6900312B2 (en) | Optical laminate, polarizing plate and liquid crystal display device | |
JP6285781B2 (en) | Crystallization accelerator | |
WO2017135239A1 (en) | Optical laminate and image display device in which said optical laminate is used | |
JP6175268B2 (en) | Moisture resistance improver | |
JP6242269B2 (en) | Polyester resin having a fluorene skeleton | |
JP6276076B2 (en) | Polyester resin having a fluorene skeleton | |
CN116997834A (en) | Polarizer protective film | |
JP2017179191A (en) | Wavelength dispersion adjusting agent, resin composition containing the same, and optical film using the resin composition | |
JP6200192B2 (en) | Heat resistance improver | |
JP6242271B2 (en) | Polyester resin having a fluorene skeleton |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 201480018415.X Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 14783141 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2015511249 Country of ref document: JP Kind code of ref document: A |
|
ENP | Entry into the national phase |
Ref document number: 20157027936 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 14783141 Country of ref document: EP Kind code of ref document: A1 |