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WO2014168108A1 - Resin composition containing fluorine compound, molded body, wavelength dispersion adjustment agent, and method for adjusting wavelength dispersion of resin - Google Patents

Resin composition containing fluorine compound, molded body, wavelength dispersion adjustment agent, and method for adjusting wavelength dispersion of resin Download PDF

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Publication number
WO2014168108A1
WO2014168108A1 PCT/JP2014/060081 JP2014060081W WO2014168108A1 WO 2014168108 A1 WO2014168108 A1 WO 2014168108A1 JP 2014060081 W JP2014060081 W JP 2014060081W WO 2014168108 A1 WO2014168108 A1 WO 2014168108A1
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WO
WIPO (PCT)
Prior art keywords
group
resin
bis
fluorene
epoxy compound
Prior art date
Application number
PCT/JP2014/060081
Other languages
French (fr)
Japanese (ja)
Inventor
一史 高野
小林 綾子
祐輝 大内
信輔 宮内
山田 昌宏
大策 荘所
完爾 若林
中嶋 孝宏
Original Assignee
大阪ガスケミカル株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大阪ガスケミカル株式会社 filed Critical 大阪ガスケミカル株式会社
Priority to CN201480018415.XA priority Critical patent/CN105308122A/en
Priority to KR1020157027936A priority patent/KR20150142682A/en
Priority to JP2015511249A priority patent/JPWO2014168108A1/en
Publication of WO2014168108A1 publication Critical patent/WO2014168108A1/en

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62Alcohols or phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/15Heterocyclic compounds having oxygen in the ring
    • C08K5/151Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515Three-membered rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/36Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37Thiols

Definitions

  • the present invention relates to a resin composition containing a compound having a fluorene skeleton (9,9-bisarylfluorene skeleton), a molded product thereof, a wavelength dispersion adjusting agent, and a resin wavelength dispersion adjusting method.
  • a compound having a fluorene skeleton (such as a 9,9-bisphenylfluorene skeleton) is known to have excellent functions such as a high refractive index and high heat resistance.
  • fluorene compounds having a reactive group such as bisphenol fluorene (BPF), biscresol fluorene
  • BPF bisphenol fluorene
  • BCF bisphenoxyethanol fluorene
  • BPEF bisphenoxyethanol fluorene
  • Patent Document 1 discloses a molding material composed of a polyester resin having a 9,9-bisphenylfluorene skeleton.
  • Patent Document 2 discloses a polyurethane resin having a 9,9-bisphenylfluorene skeleton and crosslinked with a crosslinking agent.
  • 9,9-bis (4-hydroxyphenyl) fluorene or 9,9-bis [4- (2-hydroxyethoxy) phenyl] fluorene (bisphenoxyethanol) is used as a part of the diol component constituting the resin. Fluorene skeleton is introduced into the resin.
  • Patent Document 3 discloses a resin composition comprising a compound having a 9,9-bisphenylfluorene skeleton and a thermoplastic resin. This document describes that a compound having a 9,9-bisphenylfluorene skeleton can be added to a thermoplastic resin to impart a high refractive index to the thermoplastic resin.
  • a transparent resin film is prepared by mixing 30 to 40 parts by weight of a specific compound (bisphenol fluorenediglycidyl ether, bisphenoxyethanol fluorene or bisphenoxyethanol fluoredenyl acrylate) with 100 parts by weight of a polycarbonate resin. And that the refractive index has increased.
  • a specific compound bisphenol fluorenediglycidyl ether, bisphenoxyethanol fluorene or bisphenoxyethanol fluoredenyl acrylate
  • Patent Document 4 discloses an optical resin composition composed of a transparent resin and a fluorene compound having a 9,9-bisarylfluorene skeleton. And this document describes that the birefringence can be reduced without impairing the mechanical properties and heat resistance of the transparent resin, and in a specific example, the fluorene-containing polyester resin is compared with the polycarbonate resin.
  • Patent Document 5 discloses that a phenol compound functions as a nucleating agent ( ⁇ crystal nucleating agent) for forming a ⁇ crystal structure in a crystalline resin such as polylactic acid.
  • ⁇ crystal nucleating agent a nucleating agent for forming a ⁇ crystal structure in a crystalline resin such as polylactic acid.
  • ⁇ crystal nucleating agent a nucleating agent for forming a ⁇ crystal structure in a crystalline resin such as polylactic acid.
  • 1 to 5% by weight of 9,9-bis (4-hydroxy-3-methylphenyl) fluorene was added to the ⁇ -crystal (melting point: 168 ° C.) poly-L lactic acid and melted. Kneading to obtain poly L-lactic acid in which ⁇ crystals (melting point: 163 ° C.) were formed, and Tg was changed from 56.5 ° C. to 60.9-62.1 ° C. as the crystal structure was changed. It is described that changed.
  • JP 2012-211252 A discloses a film containing a cellulose derivative (such as cellulose triacetate) and a fluorene compound having a 9,9-bisarylfluorene skeleton (such as bisphenoxyethanol fluorene). ing. And in the Example of this document, it is described that the retardation value of the stretched film containing cellulose triacetate and bisphenoxyethanol fluorene was 0 or a negative value.
  • JP 2002-284864 A (Claims, Examples) JP 2002-284834 A (Claims, Examples) Japanese Patent Laying-Open No. 2005-162785 (Claims and Examples) JP 2011-8017 A (Claims, Examples) Japanese Patent Laying-Open No. 2011-21083 (Claims and Examples) JP 2012-211252 A (Claims, Examples)
  • Another object of the present invention is to provide a resin composition to which a compound having a fluorene skeleton can be added without impairing mechanical strength, a molded article formed with this resin composition, a wavelength dispersion adjusting agent, and a resin wavelength dispersion adjusting method. Is to provide.
  • Still another object of the present invention is to provide a resin composition capable of adjusting or controlling wavelength dispersibility, a molded article formed from the resin composition, a wavelength dispersion adjusting agent, and a resin wavelength dispersion adjusting method.
  • the present inventors surprisingly have a compound in which a compound having a fluorene skeleton has a reverse wavelength dispersibility (or negative wavelength dispersibility, a phase difference (or birefringence) that increases as the wavelength increases) with respect to the resin. ) Can be imparted (or expressed).
  • resins especially thermoplastic resins.
  • the wavelength dispersion of the resin can be reduced (or adjusted to low wavelength dispersion)]
  • the present invention has been completed.
  • the resin composition of the present invention includes a non-epoxy resin, a non-epoxy compound having a 9,9-bisarylfluorene skeleton, and an epoxy compound.
  • the non-epoxy compound having a 9,9-bisarylfluorene skeleton may be, for example, a compound represented by the following formula (1).
  • ring Z is an aromatic hydrocarbon ring, R 1 and R 2 are substituents, X is a group — [(OR 3 ) nY] (wherein Y is a hydroxyl group, a mercapto group, or A (meth) acryloyloxy group, R 3 is an alkylene group, n is an integer of 0 or more) or an amino group, k is an integer of 0 to 4, m is an integer of 0 or more, and p is an integer of 1 or more] .
  • non-epoxy compound having a 9,9-bisarylfluorene skeleton may be a compound represented by the following formula (1A).
  • the ring Z may be a benzene ring or a naphthalene ring
  • R 1 may be an alkyl group
  • k may be 0 to 1
  • R 2 may be It may be an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group or an alkoxy group
  • m may be 0 to 2
  • R 3 may be a C 2-4 alkylene group
  • n is 0 May be 2 and p may be 1 to 3.
  • Non-epoxy compounds having a 9,9-bisarylfluorene skeleton typically include 9,9-bis (hydroxyphenyl) fluorene, 9,9-bis (alkyl-hydroxyphenyl) fluorene, and 9,9-bis.
  • (Aryl-hydroxyphenyl) fluorene 9,9-bis (di or trihydroxyphenyl) fluorene, 9,9-bis (hydroxynaphthyl) fluorene, 9,9-bis (hydroxyalkoxyphenyl) fluorene, 9,9-bis It may be at least one selected from (alkyl-hydroxyalkoxyphenyl) fluorene, 9,9-bis (aryl-hydroxyalkoxyphenyl) fluorene, and 9,9-bis (hydroxyalkoxynaphthyl) fluorene.
  • the non-epoxy resin may be a thermoplastic resin, and in particular, may be at least one selected from a cyclic olefin resin, a methacrylic resin, an aromatic polycarbonate resin, an aromatic polyester resin, and a cellulose derivative.
  • the epoxy compound may particularly contain at least a polyfunctional epoxy compound.
  • the ratio of each component to 100 parts by weight of the non-epoxy resin is, for example, that the ratio of the non-epoxy compound having a 9,9-bisarylfluorene skeleton is about 0.5 to 50 parts by weight.
  • the ratio of the epoxy compound may be about 0.1 to 30 parts by weight.
  • the proportion of the epoxy compound may be, for example, about 1 to 100 parts by weight with respect to 100 parts by weight of the non-epoxy compound having a 9,9-bisarylfluorene skeleton. .
  • the present invention also includes a molded body formed from the resin composition.
  • a molded article may be an optical molded article [such as an optical film (such as a retardation film)].
  • the molded body of the present invention may be a film (film-shaped molded body), and such a molded body may be a stretched film.
  • the wavelength dispersion of the non-epoxy resin is adjusted or controlled by adding a non-epoxy compound having a 9,9-bisarylfluorene skeleton to the non-epoxy resin in combination with the epoxy compound ( For example, the wavelength dispersion can be reduced).
  • the present invention relates to an additive for adjusting or controlling (for example, reducing) the wavelength dispersion of a non-epoxy resin, and a non-epoxy compound having an 9,9-bisarylfluorene skeleton and an epoxy compound Are also included (for example, a wavelength dispersion reducing agent).
  • a wavelength dispersion adjusting agent for example, a wavelength dispersion reducing agent
  • a method of adjusting the wavelength dispersion of the resin is also included.
  • the ratio of each component and the use ratio with respect to resin are the same as in the resin composition.
  • the wavelength range for adjusting the dispersibility is not particularly limited.
  • the visible light range is about 300 to 800 nm (for example, 350 to 770 nm), preferably about 400 to 750 nm (for example, 400 to 700 nm). Also good.
  • 9,9-bis (hydroxyaryl) fluorenes and “9,9-bis (hydroxy (poly) alkoxyaryl) fluorenes” mean “9,9-bis (hydroxyaryl)”. As long as it has “) fluorene skeleton” or “9,9-bis (hydroxy (poly) alkoxyaryl) fluorene skeleton”, it includes compounds having substituents on aryl groups and fluorene skeletons (specifically, positions 2 to 7 of fluorene) Use for meaning.
  • 9,9-bis (hydroxy (poly) alkoxyaryl) fluorene means 9,9-bis (hydroxyalkoxyaryl) fluorene and 9,9-bis (hydroxypolyalkoxyaryl) fluorene. Used to mean including
  • the resin composition of the present invention is a novel resin composition containing a compound (non-epoxy compound) having a fluorene skeleton (9,9-bisarylfluorene skeleton).
  • a resin composition has resin characteristics according to the type of resin (non-epoxy resin), and also conventionally known effects obtained by adding a compound having a fluorene skeleton (improvement of refractive index, reduction of birefringence) , Improvement of stretchability, etc.) can be obtained.
  • a resin composition contains a compound having a fluorene skeleton which is a low molecule, but does not impair the mechanical properties, in particular, a compound having only a fluorene skeleton. Compared with the case of containing, the mechanical properties can be further improved or improved, so that it is very useful.
  • the compound having a fluorene skeleton seems to be able to impart reverse wavelength dispersion to the resin.
  • the wavelength dispersion is adjusted or Can be controlled.
  • the addition of a compound having a fluorene skeleton imparts reverse wavelength dispersibility to the resin, but when combined with an epoxy compound, the wavelength dispersibility becomes uniform, or a low wavelength dispersible resin (composition Product) can be easily obtained.
  • the resin composition of the present invention comprises a non-epoxy resin (hereinafter sometimes referred to simply as a resin) and a non-epoxy compound having a 9,9-bisarylfluorene skeleton (hereinafter sometimes referred to as a fluorene compound). And an epoxy compound.
  • a non-epoxy resin hereinafter sometimes referred to simply as a resin
  • a non-epoxy compound having a 9,9-bisarylfluorene skeleton hereinafter sometimes referred to as a fluorene compound
  • resin a wide range of resins can be used (or applied), and any of a thermoplastic resin and a curable resin (thermal or photo-curable resin) may be used.
  • thermoplastic resin examples include olefin resin ⁇ eg, chain olefin resin [ethylene resin (eg, polyethylene), propylene resin (eg, polypropylene), polymethylpentene, etc.], cyclic olefin resin, etc. ⁇ , halogen-containing resin) Vinyl resins (polyvinyl chloride, fluororesins, etc.), vinyl resins (eg, polyvinyl alcohol, acrylonitrile resins), acrylic resins (eg, methacrylic resins such as polymethyl methacrylate), styrene resins [eg, styrene Monomers or copolymers of polystyrene monomers (polystyrene, styrene- ⁇ -methylstyrene copolymer, etc.), copolymers of styrene monomers and copolymerizable monomers (styrene-acrylonitrile copolymers ( AS resin), styrene
  • polylactic acid, etc. aromatic polyester resin, etc.] polyacetal resin, polyamide resin (for example, aliphatic polyamide resin such as polyamide 6, polyamide 66, polyamide 610, polyamide 11, polyamide 12, polyamide 612, polyamide 6/66; Aromatic polyamide resins such as polyamide MXD), polyphenylene ether resins, polysulfone resins, polyphenylene sulfide resins, polyimide resins, polyether ketone resins, cellulose derivatives, and thermoplastic elastomers. And so on.
  • polyamide resin for example, aliphatic polyamide resin such as polyamide 6, polyamide 66, polyamide 610, polyamide 11, polyamide 12, polyamide 612, polyamide 6/66; Aromatic polyamide resins such as polyamide MXD), polyphenylene ether resins, polysulfone resins, polyphenylene sulfide resins, polyimide resins, polyether ketone resins, cellulose derivatives, and thermoplastic elast
  • Resins may be used alone or in combination of two or more.
  • the molecular weight of the thermoplastic resin can be selected according to the type of the resin.
  • the number average molecular weight can be selected from a range of 2000 or more (for example, 3000 or more), 5000 or more (for example, 8000 to 1000000), preferably May be 10,000 or more (for example, 12,000 to 800,000), more preferably 15,000 or more (for example, 20,000 to 500,000).
  • the molecular weight can be measured in terms of polystyrene by a conventional method such as gel permeation chromatography (GPC).
  • curable resin examples include acrylic resin (thermal or photocurable resin, non-epoxy curable resin), acrylic resin (thermal or photocurable acrylic resin), phenol resin, amino resin (urea resin, melamine resin, etc.). ), Furan resins, unsaturated polyester resins, thermosetting urethane resins, silicone resins, thermosetting polyimide resins, diallyl phthalate resins, vinyl ester resins, and the like.
  • the curable resins may be used alone or in combination of two or more.
  • the curable resin may contain a curing agent, a curing accelerator, or the like depending on the type.
  • Resins may be used alone or in combination of two or more.
  • the resin may be either a crystalline resin or an amorphous resin.
  • the resin may be a resin having a positive wavelength dispersion or a resin having a negative wavelength dispersion (reverse wavelength dispersion).
  • the resin may typically be a thermoplastic resin.
  • the resin may be a resin having excellent transparency, for example, a cyclic olefin resin, a methacrylic resin, an aromatic polycarbonate resin, an aromatic polyester resin, a cellulose derivative, or the like.
  • Cyclic olefin resin is resin which uses cyclic olefin as a polymerization component at least.
  • the cyclic olefin may be a monocyclic olefin or a polycyclic olefin.
  • the cyclic olefin includes a substituent such as a hydrocarbon group [eg, an alkyl group (eg, a C 1-10 alkyl group such as a methyl group, preferably a C 1-5 alkyl group), a cycloalkyl group (eg, cyclohexyl group).
  • a C 5-10 cycloalkyl group such as a group), an aryl group (eg, a C 6-10 aryl group such as a phenyl group), an alkenyl group (eg, a C 2-10 alkenyl group such as a propenyl group), a cycloalkenyl group (For example, C 5-10 cycloalkenyl group such as cyclopentenyl group, cyclohexenyl group, etc.), alkylidene group (eg, C 2-10 alkylidene group such as ethylidene group, preferably C 2-5 alkylidene group, etc.) , polar group [e.g., alkoxy groups (e.g., C 1-10 alkoxy group such as methoxy group, preferred Ku is C 1-6 alkoxy group), an acyl group (e.g., a C 2-5 alkanoyl group such as acetyl group), an acyloxy group [e.
  • cyclic olefins include monocyclic olefins [eg, cycloalkenes (eg, cycloC 3-10 alkenes such as cyclobutene, cyclopentene, cycloheptene, cyclooctene, etc.), cycloalkadienes (eg, cyclopentadiene, etc.
  • cycloalkenes eg, cycloC 3-10 alkenes such as cyclobutene, cyclopentene, cycloheptene, cyclooctene, etc.
  • cycloalkadienes eg, cyclopentadiene, etc.
  • bicyclic olefins ⁇ eg norbornenes [eg norbornene (eg 2-norbornene), alkyl norbornene (eg 5-methyl-2-norbornene, 5, 5 or 5,6-dimethyl-2-norbornene, 5-ethylidene-2-norbornene), aryl norbornene (eg, 5-phenyl-2-norbornene), norbornene having a polar group (eg, 5-cyano-2-norbornene, etc.) Cyanonorbornene Acyloxynorbornene such as 5-methoxycarbonyl-2-norbornene, 5-methyl-5-methoxycarbonyl-2-norbornene, 5,6-dimethoxycarbonyl-2-norbornene, 5-methyl-5-cyclohexyloxycarbonyl-2-norbornene (Alkoxycarbonyl norbornene,
  • Acyloxynorbornadiene (such as alkoxycarbonylnorbornadiene); haloalkylnorbornadiene such as 5,6-di (trifluoromethyl) -2,5-norbornadiene; oxonorbornadiene such as 7-oxo-2-norbornadiene)], tricyclic olefin ⁇
  • tricycloalkenes eg, C 6-25 tricycloalkenes such as dihydrodicyclopentadienes (such as dihydrodicyclopentadiene)]
  • tricycloalkadienes eg, Dicyclopentadiene (dicyclopentadiene, methyldicyclopentadiene, etc.), tricyclo [4.4.0.1 2,5 ] undeca-3,7-diene, tricyclo [4.4.0.1 2,5 ]
  • a C 6-25 tricycloalkadiene such as undeca-3,8-diene, etc.]
  • cyclic olefins e.g., hexa cycloalkenes (e.g., hexacyclo [6.6.1.1 3,6 .0 2,7 .0 9,14] -4- heptadecene C such as 12-40 Hexacycloalkene) and the like ⁇ and the like.
  • the cyclic olefin resin may be a cyclic olefin homopolymer or a copolymer (for example, a copolymer of a monocyclic olefin and a polycyclic olefin, a copolymer of a plurality of polycyclic olefins, etc.), or cyclic.
  • a copolymer of an olefin and a copolymerizable monomer may be used.
  • Examples of the copolymerizable monomer include a chain olefin [alkene (eg, ethylene, propylene, 1-butene, 1-pentene, 1-hexene, 3-methyl-1-butene, 2-methyl-1-pentene).
  • alkene eg, ethylene, propylene, 1-butene, 1-pentene, 1-hexene, 3-methyl-1-butene, 2-methyl-1-pentene.
  • 3-ethyl-1-pentene 4-methyl-1-pentene, 4-methyl-1-hexene, 4,4-dimethyl-1-hexene, 4,4-dimethyl-1-pentene, 4-ethyl-1 C 2-20 alkenes such as -hexene, 3-ethyl-1-hexene, 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 1-eicocene), alkadienes (for example , 1,4-hexadiene, 4-methyl-1,4-hexadiene, 5-methyl-1,4-hexadiene, 1,7-nonconjugated C 5-20 a such octadiene Cadien etc.), polymerizable nitrile compounds (eg (meth) acrylonitrile etc.), (meth) acrylic monomers (eg (meth) acrylic acid such as methyl
  • the ratio of cyclic olefin is, for example, 10 mol% or more (for example, 20 mol) with respect to the total amount of cyclic olefin and copolymerizable monomer. % Or more), preferably 30 mol% or more, more preferably 40 mol% or more.
  • Preferred cyclic olefin resins include cyclic olefin copolymers ⁇ eg, cyclic olefins (eg, cyclic olefins containing at least norbornenes) and copolymerizable monomers [eg, chain olefins (eg, C 2 ⁇ Copolymer) with a copolymerizable monomer containing at least 6 alkene).
  • cyclic olefin copolymers eg, cyclic olefins (eg, cyclic olefins containing at least norbornenes) and copolymerizable monomers [eg, chain olefins (eg, C 2 ⁇ Copolymer) with a copolymerizable monomer containing at least 6 alkene).
  • a cyclic olefin copolymer having a polar group for example, a cyclic olefin having a polar group ⁇ eg, norbornene having a polar group [eg, acyloxynorbornene (eg, 5-methoxycarbonyl-2 An alkoxycarbonyl group such as norbornene or 5-methyl-5-methoxycarbonyl-2-norbornene (eg, norbornene substituted with a C 1-10 alkoxycarbonyl group, preferably a C 1-4 alkoxycarbonyl group), etc.]
  • a copolymerizable monomer for example, a copolymerizable monomer [for example, a copolymerizable monomer containing at least a chain olefin (eg, C 2-6 alkene such as ethylene)] is preferable. .
  • the ratio of the cyclic olefin having a polar group to the whole cyclic olefin is, for example, 10 mol% or more, preferably 20 mol% or more, more preferably 30 mol% or more. May be.
  • the cyclic olefin resins may be used alone or in combination of two or more.
  • the methacrylic resin examples include resins having at least a methacrylic acid ester as a polymerization component.
  • the methacrylic resin is an alkyl methacrylate [for example, an alkyl methacrylate ester (for example, a C 1-20 alkyl methacrylate such as methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl methacrylate, 2-ethylhexyl methacrylate,
  • the alkyl methacrylates may be used alone or in combination of two or more.
  • Specific methacrylic resins include alkyl methacrylates (especially alkyl methacrylates containing at least methyl methacrylate) homopolymers or copolymers, alkyl methacrylates (particularly alkyl methacrylates containing at least methyl methacrylate) and copolymers. And a copolymer with a functional monomer.
  • the copolymerizable monomer is not particularly limited as long as it is copolymerizable.
  • a (meth) acrylic monomer ⁇ for example, (meth) acrylic acid, alkyl acrylate (for example, methyl acrylate, ethyl acrylate) C 1-10 alkyl acrylates such as propyl acrylate and butyl acrylate), alicyclic (meth) acrylates (eg, (meth) acrylic acid C 5-10 cycloalkyl esters such as cyclohexyl (meth) acrylate; Decalinyl (meth) acrylate, norbornyl (meth) acrylate, bornyl (meth) acrylate, bi to tetracycloalkyl (meth) acrylate such as adamantyl (meth) acrylate, etc.], hydroxyalkyl (meth) acrylate [for example, (meth) acrylic Acid hydroxyethyl etc.
  • an alkane diol di (meth) acrylate e.g., ethylene glycol di (meth) acrylate, diethylene glycol di ( (Meth) acrylate, tetraethylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, etc.
  • alkanetriol di to tri (meth) acrylate for example, trimethylolethane tri (meth) acrylate, trimethylolpropane tri ( Meth) acrylates
  • polyols such as alkanetetraol di to tetra (meth) acrylates (pentaerythritol tetra (meth) acrylate etc.), poly (meth) acrylates, polyols Alkylene oxide (e.g., C 2-4 alkylene
  • Preferred methacrylic resins include resins having methyl methacrylate as a polymerization component, such as polymethyl methacrylate, copolymers having methyl methacrylate as a polymerization component [for example, copolymers of methyl methacrylate and alkyl methacrylate esters. (For example, methyl methacrylate-methacrylic acid C 2-8 alkyl ester copolymer) and the like].
  • the proportion of methyl methacrylate is determined based on the total amount of monomers [methyl methacrylate and other monomers (methacrylic acid C 2-8 alkyl ester, copolymerizable monomer). Body etc.)], for example, about 55 to 99.9% by weight, preferably 60% or more (for example, about 65 to 99% by weight), more preferably 70% or more (for example, 75%). Or about 95% by weight).
  • Aromaatic polycarbonate resin examples include resins having an aromatic diol and a carbonate-forming compound as polymerization components.
  • aromatic diol examples include bisphenols and dihydroxyarene (hydroquinone, resorcinol, etc.).
  • bisphenols include dihydroxyarenes [eg, di ( hydroxyC 6-10 arenes) such as 4,4′-dihydroxybiphenyl], bis (hydroxyphenyl) alkanes [eg, bis (4-hydroxyphenyl) methane 1,1-bis (4-hydroxyphenyl) ethane, 1,1-bis (4-hydroxyphenyl) -1-phenylethane, 2,2-bis (4-hydroxyphenyl) propane, 2,2-bis ( 4-hydroxy-3-methylphenyl) propane, 2,2-bis (4-hydroxy-3-isopropylphenyl) propane, 2,2-bis (3-tert-butyl-4-hydroxyphenyl) propane, 2,2 -Bis (4-hydroxyphenyl) butane, 2,2-bis (4-hydroxyphenyl) octane, 2,2 Bis (3-bromo-4-hydroxyphenyl) propane, 2,2-bis
  • aromatic diols in particular, bis (hydroxyphenyl) alkanes [especially bis (hydroxyphenyl) C 1-4 alkanes such as 2,2-bis (4-hydroxyphenyl) propane], bis (hydroxyphenyl) Bisphenols such as -alkyl) arenes [bis (hydroxyphenyl-C 1-4 alkyl) benzene etc.] are preferred.
  • Aromatic diols may be used alone or in combination of two or more.
  • Examples of the carbonate-forming compound include carbonates such as phosgene (phosgene, diphosgene, triphosgene, etc.), carbonates [eg, dialkyl carbonate (dimethyl carbonate, diethyl carbonate, etc.), diaryl carbonate (diphenyl carbonate, dinaphthyl carbonate, etc.). Diesters] and the like. Among these, phosgene, diphenyl carbonate and the like may be preferably used.
  • the carbonate-forming compounds may be used alone or in combination of two or more.
  • the aromatic polycarbonate resin may be used alone or in combination of two or more.
  • aromatic polyester resins include polyalkylene arylate resins, polyarylate resins [for example, aromatic dicarboxylic acids (such as terephthalic acid) and aromatic diols (biphenol, bisphenol A, xylylene glycol, alkylene oxide adducts thereof, etc.) And the like)], and liquid crystalline polyester resins.
  • polyalkylene arylate resin examples include polyalkylene terephthalate resin [for example, polyalkylene terephthalate (eg, poly C 2-4 alkylene terephthalate such as polyethylene terephthalate, polypropylene terephthalate, polybutylene terephthalate), alkylene terephthalate unit (polyalkylene terephthalate unit) ), Polyalkylene naphthalate resin [for example, polyalkylene naphthalate (for example, poly C 2-4 alkylene naphthalate such as polyethylene naphthalate), alkylene naphthalate unit (polyalkylene naphthalate unit) Having a copolyester], polycycloalkane dialkylene terephthalate resin [for example, polycycloalkanedia Sharp emission terephthalate (e.g., poly cyclohexane dimethylene terephthalate), such as a copolyester having cycloalkan
  • the copolymer component includes, for example, a diol component [eg, alkane diol (eg, C 2-6 alkane diol such as ethylene glycol, propylene glycol, butane diol, hexane diol), polyalkane diol (eg, diethylene glycol).
  • alkane diol eg, C 2-6 alkane diol such as ethylene glycol, propylene glycol, butane diol, hexane diol
  • polyalkane diol eg, diethylene glycol
  • Di-hexaC 2-4 alkanediols such as polytetramethylene glycol), alicyclic diols (eg 1,4-cyclohexanedimethanol etc.), aromatic diols (eg C 2-4 alkylenes of bisphenols) Oxide adducts, etc.)], dicarboxylic acid components ⁇ eg aliphatic dicarboxylic acids (eg C 4-12 alkane dicarboxylic acids such as glutaric acid, adipic acid, sebacic acid), aromatic dicarboxylic acids [eg asymmetric aromatics] Zika Rubonic acid (eg phthalic acid, isophthalic acid etc.), diphenyldicarboxylic acid etc.] ⁇ , hydroxycarboxylic acid component (eg hydroxybenzoic acid etc.) and the like.
  • the copolymerization components may be used alone or in combination of two or more.
  • the proportion of alkylene arylate units may be, for example, 40% by weight or more, preferably 50% by weight or more.
  • the aromatic polyester resin may be crystalline or non-crystalline.
  • the aromatic polyester resin may have a linear structure or a branched structure.
  • Aromatic polyester resins may be used alone or in combination of two or more.
  • the cellulose derivative is not particularly limited, and various cellulose derivatives such as cellulose ester, cellulose carbamate (for example, cellulose phenyl carbamate), cellulose ether and the like can be used.
  • cellulose ester examples include cellulose acetate such as cellulose diacetate (DAC) and cellulose triacetate (TAC); cellulose C 3-5 acylate such as cellulose propionate and cellulose butyrate; cellulose acetate propionate (CAP), And cellulose acylate such as cellulose acetate C 3-5 acylate such as cellulose acetate butyrate (CAB).
  • DAC cellulose diacetate
  • TAC cellulose triacetate
  • cellulose C 3-5 acylate such as cellulose propionate and cellulose butyrate
  • CAP cellulose acetate propionate
  • CAB cellulose acetate butyrate
  • cellulose ether examples include alkyl celluloses (eg, C 1-4 alkyl celluloses such as methyl cellulose and ethyl cellulose), hydroxyalkyl celluloses (eg, hydroxy C 2 ⁇ such as hydroxyethyl cellulose (HEC) and hydroxypropyl cellulose (HPC)).
  • alkyl celluloses eg, C 1-4 alkyl celluloses such as methyl cellulose and ethyl cellulose
  • hydroxyalkyl celluloses eg, hydroxy C 2 ⁇ such as hydroxyethyl cellulose (HEC) and hydroxypropyl cellulose (HPC)
  • hydroxyalkylalkyl cellulose eg, hydroxy C 2-4 alkyl C 1-4 alkyl cellulose such as hydroxypropylmethyl cellulose
  • carboxyalkyl cellulose such as carboxymethyl cellulose (CMC)
  • alkyl-carboxyalkyl cellulose Such as methyl carboxymethyl cellulose
  • carboxymethyl cellulose sodium CMC salts such as alkali metal salts
  • cellulose esters and cellulose ethers are preferable, and cellulose esters (cellulose acylates) such as cellulose acetate and cellulose acetate C 3-4 acylate are particularly preferable. More specifically, cellulose esters such as cellulose diacetate, cellulose triacetate, cellulose acetate propionate, and cellulose acetate butyrate may be suitably used as the cellulose derivative.
  • the cellulose derivatives may be used alone or in combination of two or more.
  • the fluorene compound only needs to have a 9,9-bisarylfluorene skeleton, such as a compound having no reactive group [for example, 9,9-bisarylfluorene (for example, 9,9-bisphenylfluorene), etc.
  • a compound having no reactive group for example, 9,9-bisarylfluorene (for example, 9,9-bisphenylfluorene), etc.
  • a compound in which p is 0 in formula (1) described later] may be used, but usually has a reactive group.
  • the reactive group examples include non-epoxy reactive groups such as a hydroxyl group, a mercapto group, a carboxyl group, an amino group, and a (meth) acryloyloxy group.
  • the fluorene compound may have these reactive groups singly or in combination of two or more.
  • the reactive group may be directly bonded to 9,9-bisarylfluorene, or may be bonded via an appropriate linking group (for example, a (poly) oxyalkylene group).
  • fluorene compound examples include a compound represented by the following formula (1).
  • ring Z is an aromatic hydrocarbon ring, R 1 and R 2 are substituents, X is a group — [(OR 3 ) nY] (wherein Y is a hydroxyl group, a mercapto group, or A (meth) acryloyloxy group, R 3 is an alkylene group, n is an integer of 0 or more) or an amino group, k is an integer of 0 to 4, m is an integer of 0 or more, and p is an integer of 1 or more] .
  • examples of the aromatic hydrocarbon ring represented by the ring Z include a benzene ring, a condensed polycyclic aromatic hydrocarbon ring [for example, a condensed bicyclic hydrocarbon (for example, indene, naphthalene, etc. Condensed bicyclic to tetracyclic hydrocarbons such as C 8-20 condensed bicyclic hydrocarbons, preferably C 10-16 condensed bicyclic hydrocarbons), condensed tricyclic hydrocarbons (eg anthracene, phenanthrene, etc.), etc.
  • a condensed polycyclic aromatic hydrocarbon ring for example, a condensed bicyclic hydrocarbon (for example, indene, naphthalene, etc. Condensed bicyclic to tetracyclic hydrocarbons such as C 8-20 condensed bicyclic hydrocarbons, preferably C 10-16 condensed bicyclic hydrocarbons), condensed tricyclic hydrocarbons (eg anthracene, phen
  • a ring assembly hydrocarbon ring (bi or ter C 6-10 arene ring such as biphenyl ring, terphenyl ring or binaphthyl ring).
  • the two rings Z may be the same or different rings, and may usually be the same ring.
  • Preferred rings Z include a benzene ring, a naphthalene ring, and a biphenyl ring, and may be a benzene ring.
  • examples of the group R 1 include a cyano group, a halogen atom (a fluorine atom, a chlorine atom, a bromine atom, etc.), a hydrocarbon group [eg, an alkyl group, an aryl group (C 6 such as a phenyl group). -10 aryl group) and the like] and acyl groups (for example, alkylcarbonyl groups such as methylcarbonyl, ethylcarbonyl, pentylcarbonyl, etc.) and the like, and in particular, alkyl groups are often used.
  • a cyano group e.g, an alkyl group, an aryl group (C 6 such as a phenyl group). -10 aryl group) and the like
  • acyl groups for example, alkylcarbonyl groups such as methylcarbonyl, ethylcarbonyl, pentylcarbonyl, etc.
  • alkyl group examples include C 1-12 alkyl groups such as a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, and a t-butyl group (for example, a C 1-8 alkyl group, particularly a C 1-1 such as a methyl group). 4 alkyl group) and the like.
  • k is plural (2 to 4)
  • the types of the plural groups R 1 may be the same or different from each other.
  • the kind of group R ⁇ 1 > substituted by the different benzene ring may be the same or different.
  • the bonding position (substitution position) of the group R 1 is not particularly limited, and examples thereof include the 2nd, 7th, 2nd and 7th positions of the fluorene ring.
  • the preferred substitution number k is 0 to 1, in particular 0.
  • the two substitution numbers k may be the same or different.
  • the substituent R 2 substituted on the ring Z is usually a non-reactive substituent, for example, an alkyl group (eg, a C 1-12 alkyl group such as a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, C 1-8 alkyl group etc.), cycloalkyl group (C 5-8 cycloalkyl group such as cyclohexyl group), aryl group (eg phenyl group, tolyl group, xylyl group, naphthyl group etc.) Hydrocarbon groups such as 6-10 aryl groups), aralkyl groups (C 6-10 aryl-C 1-4 alkyl groups such as benzyl and phenethyl groups); alkoxy groups (C 1 such as methoxy groups and ethoxy groups) -8 an alkoxy group), such as C 5-10 cycloalkyl group such as a cycloalkoxy group
  • a group such as an alkylthio group such as a C 1-8 alkylthio group such as a methylthio group) —SR (wherein R is as defined above); an acyl group (such as a C 1-6 acyl group such as an acetyl group); Alkoxycarbonyl group (C 1-4 alkoxy-carbonyl group such as methoxycarbonyl group); halogen atom (fluorine atom, chlorine atom, bromine atom, iodine atom etc.); nitro group; cyano group; substituted amino group (for example, dimethyl group) And a dialkylamino group such as an amino group).
  • R is as defined above
  • an acyl group such as a C 1-6 acyl group such as an acetyl group
  • Alkoxycarbonyl group C 1-4 alkoxy-carbonyl group such as methoxycarbonyl group
  • halogen atom fluorine atom, chlorine atom, bromine atom,
  • Preferred groups R 2 include hydrocarbon groups [eg, alkyl groups (eg, C 1-6 alkyl groups), cycloalkyl groups (eg, C 5-8 cycloalkyl groups), aryl groups (eg, C 6-10 Aryl group), aralkyl group (for example, C 6-8 aryl-C 1-2 alkyl group and the like), alkoxy group (C 1-4 alkoxy group and the like) and the like.
  • Further preferred groups R 2 include an alkyl group [C 1-4 alkyl group (particularly methyl group) and the like], an aryl group [eg C 6-10 aryl group (particularly phenyl group) and the like] and the like.
  • the group R 2 may form the ring assembly hydrocarbon ring together with the ring Z.
  • the types of the groups R 2 may be the same or different from each other.
  • the type of the group R 2 may be the same or different.
  • the number of substitutions m can be selected according to the type of the ring Z, and may be, for example, 0 to 8, preferably 0 to 4 (eg, 0 to 3), and more preferably 0 to 2.
  • the number of substitutions m may be the same or different from each other, and may usually be the same.
  • examples of the alkylene group represented by the group R 3 include C 2-6 alkylene such as ethylene group, propylene group, trimethylene group, 1,2-butanediyl group, and tetramethylene group.
  • a group preferably a C 2-4 alkylene group, and more preferably a C 2-3 alkylene group.
  • the type of alkylene group may be composed of different alkylene groups, and may be generally composed of the same alkylene group.
  • the types of the groups R 3 may be the same or different, and may be usually the same.
  • the number (addition mole number) n of oxyalkylene groups (OR 3 ) may be 0 or more (for example, 0 to 20), for example, 0 to 15 (for example, 1 to 12), preferably 0 to 10 ( For example, it may be 1 to 6), more preferably 0 to 4 (eg 1 to 4), particularly 0 to 2 (eg 0 to 1). Further, depending on the type of resin, there may be a case where a remarkable improvement effect is obtained when n is 0 or when n is 1 or more. Therefore, either a compound in which n is 0 or a compound in which n is 1 or more may be selected depending on the type of resin. The number of substitutions n may be the same or different for different rings Z.
  • Preferred X is a group — [(OR 3 ) nY], and particularly Y is preferably a hydroxyl group.
  • the compound whose Y is a hydroxyl group is represented by following formula (1A).
  • the substitution number p of the group X may be 1 or more (for example, 1 to 6), for example, 1 to 4, preferably 1 to 3, more preferably 1 to 2, particularly 1.
  • the substitution number p may be the same or different in each ring Z, and is usually the same in many cases.
  • the substitution position of the group X is not particularly limited, and it may be substituted at an appropriate substitution position on the ring Z.
  • the group X may be substituted at the 2-6 position of the phenyl group, and may preferably be substituted at the 4 position.
  • the group X is a hydrocarbon ring different from the hydrocarbon ring bonded to the 9-position of fluorene in the condensed polycyclic hydrocarbon ring (for example, naphthalene
  • the ring is substituted at least on the 5th and 6th positions of the ring.
  • Specific fluorene compounds include 9,9-bis (hydroxyaryl) fluorenes [or 9,9-bis (hydroxyaryl) fluorene skeletons.
  • X is a group in the formula (1), such as - [(OR 3) n- OH] , compound; this In al compounds, hydroxyl group, and the like mercapto group, or
  • the 9,9-bis (hydroxyphenyl) fluorenes include, for example, 9,9-bis (hydroxyphenyl) fluorene [for example, 9,9-bis (4-hydroxyphenyl) fluorene], 9,9-bis (alkyl 9,9-bis such as 9,9-bis (4-hydroxy-3-methylphenyl) fluorene, 9,9-bis (4-hydroxy-3,5-dimethylphenyl) fluorene (Mono or di C 1-4 alkyl-hydroxyphenyl) fluorene], 9,9-bis (aryl-hydroxyphenyl) fluorene [eg, 9,9-bis (4-hydroxy-3-phenylphenyl) fluorene, etc.
  • the 9,9-bis (hydroxynaphthyl) fluorenes correspond to the 9,9-bis (hydroxyphenyl) fluorenes, and are compounds in which the phenyl group is substituted with a naphthyl group, for example, 9,9-bis ( Hydroxynaphthyl) fluorene [eg, 9,9-bis (6-hydroxy-2-naphthyl) fluorene, 9,9-bis (5-hydroxy-1-naphthyl) fluorene] and the like.
  • 9,9-bis ( Hydroxynaphthyl) fluorene eg, 9,9-bis (6-hydroxy-2-naphthyl) fluorene, 9,9-bis (5-hydroxy-1-naphthyl) fluorene
  • 9,9-bis (hydroxy (poly) alkoxyphenyl) fluorenes include, for example, 9,9-bis (hydroxyalkoxyphenyl) fluorene ⁇ eg, 9,9-bis [4- (2-hydroxyethoxy) phenyl] fluorene, 9,9-bis [4- (2-hydroxypropoxy) phenyl] fluorene such as 9,9-bis (hydroxy C 2-4 alkoxyphenyl) fluorene ⁇ , 9,9-bis (alkyl - hydroxy alkoxyphenyl) Fluorene ⁇ eg, 9,9-bis [4- (2-hydroxyethoxy) -3-methylphenyl] fluorene, 9,9-bis [4- (2-hydroxypropoxy) -3-methylphenyl] fluorene, Such as 9-bis [4- (2-hydroxyethoxy) -3,5-dimethylphenyl] fluorene 9,9-bis (mono or di C 1-4 alkyl-hydroxy C 2-4 alkoxy
  • 9,9-bis (hydroxy (poly) alkoxynaphthyl) fluorenes compounds corresponding to the 9,9-bis (hydroxy (poly) alkoxyphenyl) fluorenes, wherein a phenyl group is substituted with a naphthyl group
  • 9,9-bis (hydroxyalkoxynaphthyl) fluorene ⁇ eg, 9,9-bis [6- (2-hydroxyethoxy) -2-naphthyl] fluorene, 9,9-bis [6- (2-hydroxypropoxy) 9,9-bis (hydroxyalkoxynaphthyl) fluorenes such as 9,9-bis (hydroxyC 2-4 alkoxynaphthyl) fluorene ⁇ such as) -2-naphthyl] fluorene.
  • 9,9-bis (hydroxyphenyl) fluorene 9,9-bis (alkyl-hydroxyphenyl) fluorene [for example, 9,9-bis (mono or di C 1-4 alkyl- Hydroxyphenyl) fluorene], 9,9-bis (aryl-hydroxyphenyl) fluorene [eg, 9,9-bis (mono or diC 6-10 aryl-hydroxyphenyl) fluorene], 9,9-bis (di or A compound in which n is 0 in the above formula (1A) such as trihydroxyphenyl) fluorene and 9,9-bis (hydroxynaphthyl) fluorene; 9,9-bis (hydroxyalkoxyphenyl) fluorene ⁇ eg, 9,9-bis (hydroxy C 2-4 alkoxyphenyl) fluorene ⁇ , 9,9-bis (alkyl - hydroxy alkoxyphenyl) fluorene ⁇ e.g., 9,9-bis (hydroxyphenyl) fluorene
  • n is 1 or more (for example, 1 to 4, preferably 1 to 2, more preferably 1) in the above formula (1A) such as -4alkoxynaphthyl) fluorene ⁇ is preferable.
  • 9,9-bis (hydroxyalkoxyphenyl) fluorene such as 9,9-bis (hydroxyethoxyphenyl) fluorene may be used from the standpoint that the effect of homogenizing wavelength dispersion by the epoxy compound appears remarkably.
  • Fluorene compounds may be used alone or in combination of two or more.
  • the ratio of the fluorene compound can be selected, for example, from the range of about 0.1 parts by weight or more (for example, 0.2 to 200 parts by weight) with respect to 100 parts by weight of the resin. It may be 0.5 to 80 parts by weight, more preferably about 1 to 50 parts by weight, usually 0.5 to 50 parts by weight (for example, 0.5 to 40 parts by weight, preferably 0.7 to 30 parts by weight). Parts, more preferably 1 to 20 parts by weight, particularly 2 to 18 parts by weight, particularly preferably 3 to 15 parts by weight). In particular, since the effect of homogenizing the wavelength dispersion by the epoxy compound appears remarkably, the ratio of the fluorene compound is 5 to 15 parts by weight (particularly 8 to 13 parts by weight) with respect to 100 parts by weight of the resin. Good.
  • the proportion of the fluorene compound used is 20 parts by weight or less (for example, 0.1 to 18 parts by weight), preferably 15 parts by weight or less (for example, 0.2 to 12 parts by weight) with respect to 100 parts by weight of the resin. Part), more preferably 10 parts by weight or less (for example, 0.3 to 7 parts by weight), particularly 5 parts by weight or less (for example, 0.5 to 5 parts by weight).
  • the resin properties can often be maintained or improved at a high level even if a relatively large proportion of the fluorene compound is added. Therefore, the proportion of the fluorene compound used is 20 parts by weight or more (for example, 20 to 100 parts by weight), preferably 25 parts by weight or more (for example, 25 to 80 parts by weight), more preferably 100 parts by weight of the resin. It may be 30 parts by weight or more (for example, 30 to 70 parts by weight).
  • the epoxy compound (or epoxy resin) can be roughly classified into a monofunctional epoxy compound (monofunctional epoxy compound) and a polyfunctional epoxy compound (polyfunctional epoxy compound).
  • monofunctional epoxy compounds include glycidyl ethers (monoglycidyl ether) [eg, alkyl glycidyl ether (eg, 2-ethylhexyl glycidyl ether), alkenyl glycidyl ether (eg, allyl glycidyl ether), aryl glycidyl ether, etc.
  • polyfunctional epoxy compound examples include diglycidyl ether, alkanediol diglycidyl ether (for example, C 2-10 alkane such as butanediol diglycidyl ether, neopentyl glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether).
  • alkanediol diglycidyl ether for example, C 2-10 alkane such as butanediol diglycidyl ether, neopentyl glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether.
  • Diol diglycidyl ether Diol diglycidyl ether
  • polyalkane diol diglycidyl ether eg, poly C 2-4 alkane diaudiglycidyl ether such as polypropylene glycol diglycidyl ether
  • cycloalkane dialkanol diglycidyl ether eg cyclohexane dimethanol diglycidyl ether
  • Glycidyl ethers [for example, di- or triglycidyls of C 3-10 alkanetri- or tetraols such as di- to hexa-glycidyl ethers of alkane tri to hexaols (eg trimethylolpropane di or triglycidyl ethers, glycerin
  • (Glycidyloxy) naphthalene bis (2-glycidyl Jill oxy naphthyl) diglycidyl sulfopropyl such as bis (glycidyloxy naphthyl) C 1-6 alkanes such as methane, binding these di (glycidyloxy) naphthalenes directly or Tetraglycidyl ether (eg bis [2,7-di (glycidyloxy) naphthyl] methane etc.) linked via a linking group (eg alkylene group such as methylene group, ethylene group or alkylidene group)], Glycidyl ether type epoxy compounds such as glycidyl ether compounds having a xanthene skeleton (for example, 9-phenyl-2,7-diglycidyloxy-1,3,4,5,6,8-hexamethylxanthene); glycidyl ester type Epoxy compounds [eg aromatic dica Boric acid (
  • the polyfunctional epoxy compound (particularly, glycidyl ether type epoxy compound) includes an epoxy compound having a fluorene skeleton (polyfunctional epoxy compound).
  • the epoxy compound having a fluorene skeleton include a compound represented by the following formula (1B) (that is, a compound in which Y is a glycidyloxy group in X of the formula (1)).
  • Specific epoxy compounds having a fluorene skeleton include 9,9-bis (glycidyloxyaryl) fluorenes [or 9,9-bis (glycidyloxyaryl) fluorenes.
  • 9,9-bis (glycidyloxyphenyl) fluorenes include, for example, 9,9-bis (glycidyloxyphenyl) fluorene [eg, 9,9-bis (4-glycidyloxyphenyl) fluorene], 9,9- Bis (alkyl-glycidyloxyphenyl) fluorene [eg, 9,9-bis (4-glycidyloxy-3-methylphenyl) fluorene, 9,9-bis (4-glycidyloxy-3,5-dimethylphenyl) fluorene, etc.
  • 9,9-bis (mono- or di-C 1-4 alkyl-glycidyloxyphenyl) fluorene]
  • 9,9-bis (aryl-glycidyloxyphenyl) fluorene for example, 9,9-bis (4-glycidyloxy- 9,9-bis such as 3-phenylphenyl) fluorene (mono- or di-C 6-10 ants Ru-glycidyloxyphenyl) fluorene]
  • 9,9-bis (polyglycidyloxyphenyl) fluorene eg, 9,9-bis (3,4-diglycidyloxyphenyl) fluorene, 9,9-bis (2,4 9,9-bis (di- or triglycidyloxyphenyl) fluorene such as -diglycidyloxyphenyl) fluorene].
  • the 9,9-bis (glycidyloxynaphthyl) fluorenes correspond to the 9,9-bis (glycidyloxyphenyl) fluorenes and are compounds in which a phenyl group is substituted with a naphthyl group, such as 9,9- Bis (glycidyloxynaphthyl) fluorene [eg, 9,9-bis (6-glycidyloxy-2-naphthyl) fluorene, 9,9-bis (5-glycidyloxy-1-naphthyl) fluorene] and the like.
  • 9,9- Bis (glycidyloxynaphthyl) fluorene eg, 9,9-bis (6-glycidyloxy-2-naphthyl) fluorene, 9,9-bis (5-glycidyloxy-1-naphthyl) fluorene
  • 9,9-bis (glycidyloxy (poly) alkoxyphenyl) fluorenes include, for example, 9,9-bis (glycidyloxyalkoxyphenyl) fluorene ⁇ eg, 9,9-bis [4- (2-glycidyloxyethoxy) ) Phenyl] fluorene, 9,9-bis [4- (2-glycidyloxypropoxy) phenyl] fluorene and other 9,9-bis (glycidyloxy C 2-4 alkoxyphenyl) fluorene ⁇ , 9,9-bis (alkyl) -Glycidyloxyalkoxyphenyl) fluorene ⁇ eg, 9,9-bis [4- (2-glycidyloxyethoxy) -3-methylphenyl] fluorene, 9,9-bis [4- (2-glycidyloxypropoxy) -3 -Methylphenyl] fluorene, 9,9-bis [4- (2
  • the 9,9-bis (glycidyloxy (poly) alkoxynaphthyl) fluorenes correspond to the 9,9-bis (glycidyloxy (poly) alkoxyphenyl) fluorenes, and the phenyl group is substituted with a naphthyl group.
  • the multifunctional epoxy compounds may be used alone or in combination of two or more.
  • the epoxy compounds may be used alone or in combination of two or more.
  • the epoxy compound may contain at least a polyfunctional epoxy compound.
  • an epoxy compound may be comprised only with a polyfunctional epoxy compound, and may combine a polyfunctional epoxy compound and a monofunctional epoxy compound.
  • the epoxy compound may be solid or liquid at normal temperature (eg, about 15 to 25 ° C.).
  • the viscosity (25 ° C.) of the liquid epoxy compound may be, for example, 1 to 6000 mPa ⁇ s, preferably 10 to 4000 mPa ⁇ s, more preferably about 50 to 2000 mPa ⁇ s, and 1000 mPa ⁇ s or less.
  • An epoxy compound having a low viscosity of for example, 1 to 500 mPa ⁇ s, preferably 300 mPa ⁇ s or less (eg 50 to 200 mPa ⁇ s), more preferably 150 mPa ⁇ s or less (eg 70 to 140 mPa ⁇ s)] May be used.
  • the proportion of the epoxy compound can be selected from the range of, for example, about 0.05 parts by weight or more (for example, 0.07 to 100 parts by weight) with respect to 100 parts by weight of the resin. It may be about 0.3 to 50 parts by weight, more preferably about 0.5 to 40 parts by weight, usually 0.1 to 30 parts by weight (eg, 0.3 to 25 parts by weight, preferably 0.5 to 20 parts by weight, more preferably 0.7 to 15 parts by weight, particularly 0.8 to 10 parts by weight, particularly preferably 1 to 5 parts by weight.
  • the ratio of the epoxy compound is, for example, 0.1 to 200 parts by weight (eg 0.5 to 150 parts by weight), preferably 1 to 100 parts by weight (eg 2 to 2 parts by weight) with respect to 100 parts by weight of the fluorene compound. 80 parts by weight), more preferably 3 to 60 parts by weight, particularly about 5 to 40 parts by weight, usually 1 to 100 parts by weight (eg 2 to 80 parts by weight, preferably 3 to 50 parts by weight, More preferably, it may be about 5 to 30 parts by weight, particularly 8 to 25 parts by weight.
  • the resin composition of the present invention may contain other additives ⁇ additives that are neither a fluorene compound nor an epoxy compound, for example, a filler or a reinforcing agent, a colorant (dye pigment), a conductive agent, if necessary.
  • additives may be used alone or in combination of two or more.
  • the ratio of another additive can be suitably selected according to the kind.
  • the proportion of the stabilizer is about 0.001 to 10 parts by weight, preferably 0.01 to 7 parts by weight, more preferably about 0.05 to 5 parts by weight with respect to 100 parts by weight of the thermoplastic resin. Also good.
  • the resin composition can be obtained by mixing a resin, a fluorene compound, and an epoxy compound [further, with other components (such as other additives) as necessary].
  • the mixing method is not particularly limited, and may be mixed by, for example, melt kneading or may be mixed by dissolving each component in a solvent.
  • the present invention also includes a molded body formed of such a resin composition.
  • the shape of such a molded body is not particularly limited, and can be appropriately selected depending on the application. For example, a two-dimensional structure (film shape, sheet shape, plate shape, etc.), a three-dimensional structure (tubular, rod shape, tube) Shape, hollow shape, etc.).
  • the resin composition of the present invention is often excellent in optical properties, and an optical material or an optical molded body (in particular, an optical film, an optical lens, etc.) may be suitably formed.
  • the molded body can be manufactured using, for example, an injection molding method, an injection compression molding method, an extrusion molding method, a transfer molding method, a blow molding method, a pressure molding method, a casting molding method, and the like.
  • the resin composition of the present invention is often excellent in various optical properties and is useful for forming a film (particularly an optical film). Therefore, the present invention also includes a film (such as an optical film) formed from the resin composition.
  • the thickness of the film can be selected from the range of about 1 to 1000 ⁇ m according to the application, and may be, for example, 1 to 200 ⁇ m, preferably 5 to 150 ⁇ m, and more preferably about 10 to 120 ⁇ m.
  • Such a film (such as an optical film) is formed by forming (or molding) the resin composition using a conventional film forming method, casting method (solvent casting method), melt extrusion method, calendar method, or the like. Can be manufactured.
  • the film may be a stretched film.
  • a stretched film may be either a uniaxially stretched film or a biaxially stretched film.
  • the stretching ratio may be about 1.05 to 10 times (for example, 1.1 to 5 times) in each direction in uniaxial stretching or biaxial stretching, and is usually 1.1 to 3 times (for example, 1. 2 to 2.5 times).
  • biaxial stretching it may be equal stretching or partial stretching.
  • uniaxial stretching longitudinal stretching or lateral stretching may be used.
  • the thickness of the stretched film may be, for example, about 1 to 150 ⁇ m, preferably 3 to 120 ⁇ m, and more preferably about 5 to 100 ⁇ m.
  • Such a stretched film can be obtained by subjecting a film after film formation (or an unstretched film) to a stretching treatment.
  • the stretching method is not particularly limited. In the case of uniaxial stretching, a wet stretching method or a dry stretching method may be used. In the case of biaxial stretching, a tenter method (also referred to as a flat method), a tube method, or the like may be used. Good.
  • Tear strength A tear test was performed using a digital Elmendorf tear tester SA-WP (manufactured by Toyo Seiki Seisakusho). The sample used was a 75 mm ⁇ 63 mm rectangular sample (conforming to JISK7128-2) with a 20 mm cut in the center, and the obtained results were converted to tear strength per 30 ⁇ m.
  • the retardation of the film was measured with a high-speed retardation measuring device RE-100 manufactured by Otsuka Electronics Co., Ltd. Moreover, (the retardation value at each wavelength and N 400, N 589, N 700 ) in evaluating the wavelength dispersion, the 400 nm, 589 nm, measurement of retardation values of 700 nm.
  • the ratio of hindered phenolic antioxidant was 2000 ppm with respect to the total amount of TAC and BPEF, and the ratio of phosphorus antioxidant was 1000 ppm with respect to the total amount of TAC and BPEF.
  • the resin composition was transparent and was mixed uniformly.
  • the obtained resin composition was melt-pressed (hot pressed) using a press molding machine to obtain a film (unstretched film).
  • the tear strength of the film was 0.11 N
  • the yield strength was 71.6 MPa
  • the elongation at break was 9.9%.
  • the phase difference (N 400 ) at a wavelength of 400 nm is 0.12 nm
  • the phase difference (N 589 ) at a wavelength of 589 nm is 0.21 nm
  • the haze of the film was 0.9, and the total light transmittance was 92%.
  • Example 1 In Reference Example 1, a resin composition was obtained in the same manner as in Reference Example 1 except that 1.6 parts by weight of an epoxy compound (trimethylolpropane triglycidyl ether) was further melt-kneaded. In addition, the resin composition was transparent and was mixed uniformly.
  • an epoxy compound trimethylolpropane triglycidyl ether
  • the tear strength is 0.13 N
  • the yield point strength is 79.8 MPa
  • the elongation at break is 11.2%
  • the phase difference (N 400 ) at a wavelength of 400 nm is 0.16 nm
  • the phase difference (N 589 ) at a wavelength of 589 nm is 0.15 nm
  • the phase difference (N 700 ) at a wavelength of 700 nm is 0.15 nm
  • the haze was 0.6 and the total light transmittance was 92%.
  • Example 2 Reference Example 1 and Reference Example 1 except that 2.0 parts by weight of 9,9-bis (4-glycidyloxyphenyl) fluorene (Osaka Gas Chemical Co., Ltd.) were melt-kneaded as an epoxy compound. Similarly, a resin composition was obtained. In addition, the resin composition was transparent and was mixed uniformly.
  • the tear strength is 0.12 N
  • the yield point strength is 77.4 MPa
  • the elongation at break is 12.9%, confirming that the mechanical properties are greatly improved as compared with Reference Example 1. did.
  • the retardation (N 400 ) at a wavelength of 400 nm is 0.21 nm
  • the retardation (N 589 ) at a wavelength of 589 nm is 0.20 nm
  • the retardation (N 700 ) at a wavelength of 700 nm is 0.20 nm
  • the haze was 1.2 and the total light transmittance was 92%.
  • the tear strength of the film was 0.38 N
  • the yield strength was 63.7 MPa
  • the elongation at break was 2.8%.
  • a phase difference at a wavelength of 400 nm (N 400) is 4.70Nm
  • the phase difference at a wavelength of 589 nm (N 589) is 5.08Nm
  • the phase difference at a wavelength 700 nm (N 700 ) was 5.18 nm
  • the haze of the film was 0.9, and the total light transmittance was 92%.
  • Example 3 In Reference Example 2, a resin composition was obtained in the same manner as in Reference Example 2 except that 1.6 parts by weight of an epoxy compound (trimethylolpropane triglycidyl ether) was further melt-kneaded. In addition, the resin composition was transparent and was mixed uniformly.
  • an epoxy compound trimethylolpropane triglycidyl ether
  • the tear strength is 0.58 N
  • the yield point strength is 67.4 MPa
  • the elongation at break is 5.7%
  • the phase difference (N 400 ) at a wavelength of 400 nm is 4.43 nm
  • the phase difference (N 598 ) at a wavelength of 589 nm is 4.59 nm
  • the phase difference (N 700 ) at a wavelength of 700 nm is 4.63 nm
  • N 400 / N 589 0.96
  • N 700 / N 589 1.01).
  • the haze was 0.6 and the total light transmittance was 92%.
  • Reference Example 3 In Reference Example 1, 11 parts by weight of BPEF was replaced with 18 parts by weight of 9,9-bis [4- (2-hydroxyethoxy) -3-phenylphenyl] fluorene (Osaka Gas Chemical Co., Ltd., hereinafter referred to as BOPPEF). Except for the above, a film (unstretched film) was obtained in the same manner as in Reference Example 1. The cylinder temperature was 210 to 280 ° C. And various characteristics were measured using the obtained film.
  • the tear strength of the film was 0.41 N
  • the yield strength was 68.0 MPa
  • the elongation at break was 4.5%.
  • the retardation at a wavelength of 400 nm was 4.66 nm
  • the retardation at a wavelength of 589 nm was 5.79 nm
  • the haze of the film was 0.9, and the total light transmittance was 92%.
  • Example 4 In Reference Example 3, a resin composition was obtained in the same manner as in Reference Example 3, except that 1.6 parts by weight of an epoxy compound (trimethylolpropane triglycidyl ether) was further melt-kneaded. In addition, the resin composition was transparent and was mixed uniformly.
  • an epoxy compound trimethylolpropane triglycidyl ether
  • the tear strength is 0.56 N
  • the yield point strength is 70.8 MPa
  • the elongation at break is 4.9%
  • the phase difference (N 400 ) at a wavelength of 400 nm is 5.39 nm
  • the phase difference (N 598 ) at a wavelength of 589 nm is 6.60 nm
  • the haze was 0.6 and the total light transmittance was 92%.
  • the resin composition of the present invention contains a combination of a fluorene compound and an epoxy compound, it can impart excellent properties derived from the fluorene compound to the resin without impairing mechanical properties. Further, the wavelength dispersion of the resin can be adjusted (for example, the wavelength dispersion of the resin can be reduced) by a combination of a fluorene compound and an epoxy compound.
  • the resin composition of the present invention is excellent in, for example, high refractive index, high heat resistance, high transparency, excellent moldability (such as high melt fluidity), although it depends on the type of resin constituting the resin composition. It has characteristics.
  • Such a resin composition is particularly useful for constructing (or forming) a molded product for optical use (optical molded product) because it is often excellent in optical properties.
  • Examples of the optical molded body formed (configured) with such a resin composition include optical films and optical lenses.
  • an optical film in addition to a phase film (or a retardation plate), a polarizing film (and a polarizing element and a polarizing plate protective film constituting the polarizing film), an alignment film (alignment film), a viewing angle expansion (compensation) film, a diffusion plate (Film), prism sheet, light guide plate, brightness enhancement film, near infrared absorption film, reflection film, antireflection (AR) film, reflection reduction (LR) film, antiglare (AG) film, transparent conductive (ITO) film, Anisotropic conductive film (ACF), electromagnetic wave shielding (EMI) film, electrode substrate film, color filter substrate film, barrier film, color filter layer, black matrix layer, adhesive layer or release layer between optical films, etc.
  • a phase film or a retardation plate
  • a polarizing film and a polarizing element and a polarizing plate protective film constituting the polarizing film
  • an alignment film alignment film
  • a viewing angle expansion (compensation) film a
  • the film of the present invention is useful as an optical film for use in an apparatus display.
  • the display member (or display) including the optical film of the present invention include FPD devices such as personal computer monitors, televisions, mobile phones, car navigation systems, and touch panels (for example, , LCD, PDP, etc.).

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Abstract

The present invention prepares a resin composition that can add a compound having a fluorine skeleton without losing mechanical properties by means of adding, to a non-epoxy resin, an epoxy compound and a non-epoxy compound having a 9,9-bisarylfluorine skeleton represented by formula (1). [In the formula: ring Z indicates an aromatic hydrocarbon ring; R1 and R2 indicate a substituent group; X indicates the group -[(OR3)n-Y] (in the formula: Y indicates a hydroxyl group, a mercapto group, or a (meth)acryloyloxy group; R3 indicates an alkylene group; and n indicates an integer that is at least 0) or an amino group; k indicates an integer from 0 to 4; m indicates an integer that is at least 0; and p indicates an integer that is at least 1.]

Description

フルオレン化合物を含む樹脂組成物および成形体並びに波長分散調整剤および樹脂の波長分散調整方法Resin composition and molded product containing fluorene compound, wavelength dispersion adjusting agent and resin wavelength dispersion adjusting method
 本発明は、フルオレン骨格(9,9-ビスアリールフルオレン骨格)を有する化合物を含む樹脂組成物およびその成形体並びに波長分散調整剤および樹脂の波長分散調整方法に関する。 The present invention relates to a resin composition containing a compound having a fluorene skeleton (9,9-bisarylfluorene skeleton), a molded product thereof, a wavelength dispersion adjusting agent, and a resin wavelength dispersion adjusting method.
 フルオレン骨格(9,9-ビスフェニルフルオレン骨格など)を有する化合物は、高屈折率、高耐熱性などの優れた機能を有することが知られている。このようなフルオレン骨格の優れた機能を樹脂に発現し、成形可能とする方法としては、反応性基(ヒドロキシル基、アミノ基など)を有するフルオレン化合物、例えば、ビスフェノールフルオレン(BPF)、ビスクレゾールフルオレン(BCF)、ビスフェノキシエタノールフルオレン(BPEF)などを樹脂の構成成分として利用し、樹脂の骨格構造の一部にフルオレン骨格を導入する方法が一般的である。 A compound having a fluorene skeleton (such as a 9,9-bisphenylfluorene skeleton) is known to have excellent functions such as a high refractive index and high heat resistance. As a method for expressing the excellent function of such a fluorene skeleton in a resin and making it moldable, fluorene compounds having a reactive group (hydroxyl group, amino group, etc.), such as bisphenol fluorene (BPF), biscresol fluorene In general, a method in which (BCF), bisphenoxyethanol fluorene (BPEF), or the like is used as a constituent component of a resin and a fluorene skeleton is introduced into a part of the skeleton structure of the resin.
 例えば、特開2002-284864号公報(特許文献1)には、9,9-ビスフェニルフルオレン骨格を有するポリエステル系樹脂で構成された成形材料が開示されている。また、特開2002-284834号公報(特許文献2)には、9,9-ビスフェニルフルオレン骨格を有し、架橋剤で架橋されたポリウレタン系樹脂が開示されている。これらの文献では、樹脂を構成するジオール成分の一部として、9,9-ビス(4-ヒドロキシフェニル)フルオレンや、9,9-ビス[4-(2-ヒドロキシエトキシ)フェニル]フルオレン(ビスフェノキシエタノールフルオレン)などを使用することにより、樹脂中にフルオレン骨格を導入している。 For example, Japanese Unexamined Patent Application Publication No. 2002-284864 (Patent Document 1) discloses a molding material composed of a polyester resin having a 9,9-bisphenylfluorene skeleton. Japanese Patent Laid-Open No. 2002-284834 (Patent Document 2) discloses a polyurethane resin having a 9,9-bisphenylfluorene skeleton and crosslinked with a crosslinking agent. In these documents, 9,9-bis (4-hydroxyphenyl) fluorene or 9,9-bis [4- (2-hydroxyethoxy) phenyl] fluorene (bisphenoxyethanol) is used as a part of the diol component constituting the resin. Fluorene skeleton is introduced into the resin.
 しかし、このような方法では、樹脂の骨格をフルオレン骨格で置換するため、煩雑な重合反応を必要とし、また、幅広い樹脂に適用できない。 However, in such a method, since the resin skeleton is replaced with a fluorene skeleton, a complicated polymerization reaction is required, and the method cannot be applied to a wide range of resins.
 また、フルオレン化合物を、ポリマー化することなく、直接的に樹脂に添加する試みもなされつつある。例えば、特開2005-162785号公報(特許文献3)には、9,9-ビスフェニルフルオレン骨格を有する化合物と、熱可塑性樹脂とで構成された樹脂組成物が開示されている。そして、この文献には、9,9-ビスフェニルフルオレン骨格を有する化合物を、熱可塑性樹脂に添加することで、高屈折率などを熱可塑性樹脂に付与できると記載されており、具体的な実施例では、ポリカーボネート樹脂100重量部に対して、特定の化合物(ビスフェノールフルオレンジグリシジルエーテル、ビスフェノキシエタノールフルオレン又はビスフェノキシエタノールフルオレンジアクリレート)を30~40重量部混合した樹脂組成物を作成し、透明なフィルムを得たことや屈折率が上昇したことなどが記載されている。 Also, attempts are being made to add the fluorene compound directly to the resin without polymerizing it. For example, JP-A-2005-162785 (Patent Document 3) discloses a resin composition comprising a compound having a 9,9-bisphenylfluorene skeleton and a thermoplastic resin. This document describes that a compound having a 9,9-bisphenylfluorene skeleton can be added to a thermoplastic resin to impart a high refractive index to the thermoplastic resin. In the example, a transparent resin film is prepared by mixing 30 to 40 parts by weight of a specific compound (bisphenol fluorenediglycidyl ether, bisphenoxyethanol fluorene or bisphenoxyethanol fluoredenyl acrylate) with 100 parts by weight of a polycarbonate resin. And that the refractive index has increased.
 特開2011-8017号公報(特許文献4)には、透明樹脂と、9,9-ビスアリールフルオレン骨格を有するフルオレン化合物とで構成された光学用樹脂組成物が開示されている。そして、この文献には、透明樹脂の機械的特性及び耐熱性を損なうことなく、複屈折を低下できると記載されており、具体的な実施例では、ポリカーボネート樹脂に対して、フルオレン含有ポリエステル系樹脂、9,9-ビス[4-(2-ヒドロキシエトキシ)フェニル]フルオレン、9,9-ビス(4-グリシジルオキシフェニル)フルオレン、又は9,9-ビス(4-ヒドロキシ-3-メチルフェニル)フルオレンとを含む樹脂組成物から延伸フィルムを作成し、複屈折が低下したことが記載されている。 JP 2011-8017 A (Patent Document 4) discloses an optical resin composition composed of a transparent resin and a fluorene compound having a 9,9-bisarylfluorene skeleton. And this document describes that the birefringence can be reduced without impairing the mechanical properties and heat resistance of the transparent resin, and in a specific example, the fluorene-containing polyester resin is compared with the polycarbonate resin. 9,9-bis [4- (2-hydroxyethoxy) phenyl] fluorene, 9,9-bis (4-glycidyloxyphenyl) fluorene, or 9,9-bis (4-hydroxy-3-methylphenyl) fluorene It is described that a stretched film was prepared from a resin composition containing and the birefringence was lowered.
 また、特開2011-21083号公報(特許文献5)には、フェノール化合物が、ポリ乳酸などの結晶性樹脂にβ晶構造を形成するための核剤(β晶核剤)として機能することが記載されている。そして、この文献の実施例では、α晶(融点168℃)のポリL乳酸に対して、9,9-ビス(4-ヒドロキシ-3-メチルフェニル)フルオレンを1~5重量%添加して溶融混練し、β晶(融点163℃)が形成されたポリL-乳酸を得たこと、また、結晶構造が変わったことに伴い、Tgが56.5℃から、60.9~62.1℃に変化したことが記載されている。 Japanese Patent Laid-Open No. 2011-21083 (Patent Document 5) discloses that a phenol compound functions as a nucleating agent (β crystal nucleating agent) for forming a β crystal structure in a crystalline resin such as polylactic acid. Are listed. In the examples of this document, 1 to 5% by weight of 9,9-bis (4-hydroxy-3-methylphenyl) fluorene was added to the α-crystal (melting point: 168 ° C.) poly-L lactic acid and melted. Kneading to obtain poly L-lactic acid in which β crystals (melting point: 163 ° C.) were formed, and Tg was changed from 56.5 ° C. to 60.9-62.1 ° C. as the crystal structure was changed. It is described that changed.
 さらに、特開2012-211252号公報(特許文献6)には、セルロース誘導体(セルローストリアセテートなど)と9,9-ビスアリールフルオレン骨格を有するフルオレン化合物(ビスフェノキシエタノールフルオレンなど)とを含むフィルムが開示されている。そして、この文献の実施例では、セルローストリアセテートとビスフェノキシエタノールフルオレンとを含む延伸フィルムのレタデーション値が、0又は負の値であったことが記載されている。 Furthermore, JP 2012-211252 A (Patent Document 6) discloses a film containing a cellulose derivative (such as cellulose triacetate) and a fluorene compound having a 9,9-bisarylfluorene skeleton (such as bisphenoxyethanol fluorene). ing. And in the Example of this document, it is described that the retardation value of the stretched film containing cellulose triacetate and bisphenoxyethanol fluorene was 0 or a negative value.
特開2002-284864号公報(特許請求の範囲、実施例)JP 2002-284864 A (Claims, Examples) 特開2002-284834号公報(特許請求の範囲、実施例)JP 2002-284834 A (Claims, Examples) 特開2005-162785号公報(特許請求の範囲、実施例)Japanese Patent Laying-Open No. 2005-162785 (Claims and Examples) 特開2011-8017号公報(特許請求の範囲、実施例)JP 2011-8017 A (Claims, Examples) 特開2011-21083号公報(特許請求の範囲、実施例)Japanese Patent Laying-Open No. 2011-21083 (Claims and Examples) 特開2012-211252号公報(特許請求の範囲、実施例)JP 2012-211252 A (Claims, Examples)
 本発明の目的は、フルオレン骨格(9,9-ビスアリールフルオレン骨格)を有する化合物(非エポキシ系化合物)を含む新規な樹脂組成物およびこの樹脂組成物で形成された成形体並びに波長分散調整剤および樹脂の波長分散調整方法を提供することにある。 An object of the present invention is to provide a novel resin composition containing a compound (non-epoxy compound) having a fluorene skeleton (9,9-bisarylfluorene skeleton), a molded article formed with this resin composition, and a wavelength dispersion regulator. Another object of the present invention is to provide a resin wavelength dispersion adjusting method.
 本発明の他の目的は、機械的強度を損なうことなく、フルオレン骨格を有する化合物を添加できる樹脂組成物およびこの樹脂組成物で形成された成形体並びに波長分散調整剤および樹脂の波長分散調整方法を提供することにある。 Another object of the present invention is to provide a resin composition to which a compound having a fluorene skeleton can be added without impairing mechanical strength, a molded article formed with this resin composition, a wavelength dispersion adjusting agent, and a resin wavelength dispersion adjusting method. Is to provide.
 本発明のさらに他の目的は、波長分散性を調整又は制御できる樹脂組成物およびこの樹脂組成物で形成された成形体並びに波長分散調整剤および樹脂の波長分散調整方法を提供することにある。 Still another object of the present invention is to provide a resin composition capable of adjusting or controlling wavelength dispersibility, a molded article formed from the resin composition, a wavelength dispersion adjusting agent, and a resin wavelength dispersion adjusting method.
 前記の通り、樹脂に対してフルオレン骨格を有する化合物を添加する技術がいくつか報告されているものの、特定の樹脂に対して添加することにより、屈折率の向上、複屈折の低減、結晶構造のα晶からβ晶への変化、可塑剤的な効果が見られるにとどまっており、未だ十分な開発がなされていないのが現状であった。 As described above, although several techniques for adding a compound having a fluorene skeleton to a resin have been reported, by adding to a specific resin, the refractive index is improved, the birefringence is reduced, the crystal structure is improved. The change from α-crystal to β-crystal and plasticizer effect are only seen, and the current situation is that the development has not been made yet.
 一方、本発明者らは、フルオレン骨格を有する化合物が、意外にも、樹脂に対して逆波長分散性(又は負の波長分散性、波長が大きくなるほど位相差(又は複屈折)が大きくなる特性)を付与(又は発現)できることを見出している。 On the other hand, the present inventors surprisingly have a compound in which a compound having a fluorene skeleton has a reverse wavelength dispersibility (or negative wavelength dispersibility, a phase difference (or birefringence) that increases as the wavelength increases) with respect to the resin. ) Can be imparted (or expressed).
 このような中、本発明者らは、前記課題を解決するため鋭意検討した結果、樹脂(特に熱可塑性樹脂)に対して、9,9-ビスアリールフルオレン骨格を有する非エポキシ系化合物とエポキシ化合物とを組み合わせて添加すると、低分子化合物である9,9-ビスアリールフルオレン骨格を有する非エポキシ系化合物の添加による機械的特性の低下を抑制できること、また、樹脂の波長分散性を調整(又は制御)[例えば、樹脂の波長分散性を低減(又は低波長分散性に調整)]できることを見出し、本発明を完成した。 Under such circumstances, the present inventors have intensively studied to solve the above problems, and as a result, non-epoxy compounds having a 9,9-bisarylfluorene skeleton and epoxy compounds with respect to resins (especially thermoplastic resins). When added in combination, it is possible to suppress a decrease in mechanical properties due to the addition of a non-epoxy compound having a 9,9-bisarylfluorene skeleton, which is a low molecular weight compound, and to adjust (or control) the wavelength dispersion of the resin. ) [For example, the wavelength dispersion of the resin can be reduced (or adjusted to low wavelength dispersion)], and the present invention has been completed.
 すなわち、本発明の樹脂組成物は、非エポキシ系樹脂と、9,9-ビスアリールフルオレン骨格を有する非エポキシ系化合物と、エポキシ化合物とを含む。 That is, the resin composition of the present invention includes a non-epoxy resin, a non-epoxy compound having a 9,9-bisarylfluorene skeleton, and an epoxy compound.
 9,9-ビスアリールフルオレン骨格を有する非エポキシ系化合物は、例えば、下記式(1)で表される化合物であってもよい。 The non-epoxy compound having a 9,9-bisarylfluorene skeleton may be, for example, a compound represented by the following formula (1).
Figure JPOXMLDOC01-appb-C000003
Figure JPOXMLDOC01-appb-C000003
[式中、環Zは芳香族炭化水素環、RおよびRは置換基、Xは、基-[(OR)n-Y](式中、Yは、ヒドロキシル基、メルカプト基、又は(メタ)アクリロイルオキシ基、Rはアルキレン基、nは0以上の整数を示す)又はアミノ基、kは0~4の整数、mは0以上の整数、pは1以上の整数を示す]。 [Wherein ring Z is an aromatic hydrocarbon ring, R 1 and R 2 are substituents, X is a group — [(OR 3 ) nY] (wherein Y is a hydroxyl group, a mercapto group, or A (meth) acryloyloxy group, R 3 is an alkylene group, n is an integer of 0 or more) or an amino group, k is an integer of 0 to 4, m is an integer of 0 or more, and p is an integer of 1 or more] .
 特に、9,9-ビスアリールフルオレン骨格を有する非エポキシ系化合物は、下記式(1A)で表される化合物であってもよい。 In particular, the non-epoxy compound having a 9,9-bisarylfluorene skeleton may be a compound represented by the following formula (1A).
Figure JPOXMLDOC01-appb-C000004
Figure JPOXMLDOC01-appb-C000004
(式中、Z、R、R、k、m、R、n、pは前記式(1)と同じ)。 (In the formula, Z, R 1 , R 2 , k, m, R 3 , n, and p are the same as those in the formula (1)).
 上記式(1)又は(1A)において、環Zはベンゼン環又はナフタレン環であってもよく、Rはアルキル基であってもよく、kは0~1であってもよく、Rはアルキル基、シクロアルキル基、アリール基、アラルキル基又はアルコキシ基であってもよく、mは0~2であってもよく、RはC2-4アルキレン基であってもよく、nは0~2であってもよく、pは1~3であってもよい。 In the above formula (1) or (1A), the ring Z may be a benzene ring or a naphthalene ring, R 1 may be an alkyl group, k may be 0 to 1, and R 2 may be It may be an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group or an alkoxy group, m may be 0 to 2, R 3 may be a C 2-4 alkylene group, and n is 0 May be 2 and p may be 1 to 3.
 9,9-ビスアリールフルオレン骨格を有する非エポキシ系化合物は、代表的には、9,9-ビス(ヒドロキシフェニル)フルオレン、9,9-ビス(アルキル-ヒドロキシフェニル)フルオレン、9,9-ビス(アリール-ヒドロキシフェニル)フルオレン、9,9-ビス(ジ又はトリヒドロキシフェニル)フルオレン、9,9-ビス(ヒドロキシナフチル)フルオレン、9,9-ビス(ヒドロキシアルコキシフェニル)フルオレン、9,9-ビス(アルキル-ヒドロキシアルコキシフェニル)フルオレン、9,9-ビス(アリール-ヒドロキシアルコキシフェニル)フルオレン、9,9-ビス(ヒドロキシアルコキシナフチル)フルオレンから選択された少なくとも1種であってもよい。 Non-epoxy compounds having a 9,9-bisarylfluorene skeleton typically include 9,9-bis (hydroxyphenyl) fluorene, 9,9-bis (alkyl-hydroxyphenyl) fluorene, and 9,9-bis. (Aryl-hydroxyphenyl) fluorene, 9,9-bis (di or trihydroxyphenyl) fluorene, 9,9-bis (hydroxynaphthyl) fluorene, 9,9-bis (hydroxyalkoxyphenyl) fluorene, 9,9-bis It may be at least one selected from (alkyl-hydroxyalkoxyphenyl) fluorene, 9,9-bis (aryl-hydroxyalkoxyphenyl) fluorene, and 9,9-bis (hydroxyalkoxynaphthyl) fluorene.
 非エポキシ系樹脂は、熱可塑性樹脂であってもよく、特に、環状オレフィン樹脂、メタクリル樹脂、芳香族ポリカーボネート樹脂、芳香族ポリエステル樹脂およびセルロース誘導体から選択された少なくとも1種であってもよい。 The non-epoxy resin may be a thermoplastic resin, and in particular, may be at least one selected from a cyclic olefin resin, a methacrylic resin, an aromatic polycarbonate resin, an aromatic polyester resin, and a cellulose derivative.
 エポキシ化合物は、特に、多官能エポキシ化合物を少なくとも含んでいてもよい。 The epoxy compound may particularly contain at least a polyfunctional epoxy compound.
 本発明の樹脂組成物において、非エポキシ系樹脂100重量部に対する各成分の割合は、例えば、9,9-ビスアリールフルオレン骨格を有する非エポキシ系化合物の割合が0.5~50重量部程度であってもよく、エポキシ化合物の割合が0.1~30重量部程度であってもよい。 In the resin composition of the present invention, the ratio of each component to 100 parts by weight of the non-epoxy resin is, for example, that the ratio of the non-epoxy compound having a 9,9-bisarylfluorene skeleton is about 0.5 to 50 parts by weight. The ratio of the epoxy compound may be about 0.1 to 30 parts by weight.
 また、本発明の樹脂組成物において、エポキシ化合物の割合は、9,9-ビスアリールフルオレン骨格を有する非エポキシ系化合物100重量部に対して、例えば、1~100重量部程度であってもよい。 In the resin composition of the present invention, the proportion of the epoxy compound may be, for example, about 1 to 100 parts by weight with respect to 100 parts by weight of the non-epoxy compound having a 9,9-bisarylfluorene skeleton. .
 本発明には、前記樹脂組成物で形成された成形体も含まれる。このような成形体は、光学用成形体[光学フィルム(位相差フィルムなど)など]であってもよい。また、本発明の成形体は、フィルム(フィルム状成形体)であってもよく、このような成形体は、延伸フィルムであってもよい。 The present invention also includes a molded body formed from the resin composition. Such a molded article may be an optical molded article [such as an optical film (such as a retardation film)]. Further, the molded body of the present invention may be a film (film-shaped molded body), and such a molded body may be a stretched film.
 本発明では、非エポキシ系樹脂に、9,9-ビスアリールフルオレン骨格を有する非エポキシ系化合物と、エポキシ化合物とを組み合わせて添加することにより、非エポキシ系樹脂の波長分散性を調整又は制御(例えば、波長分散性を低減)できる。 In the present invention, the wavelength dispersion of the non-epoxy resin is adjusted or controlled by adding a non-epoxy compound having a 9,9-bisarylfluorene skeleton to the non-epoxy resin in combination with the epoxy compound ( For example, the wavelength dispersion can be reduced).
 そのため、本発明には、非エポキシ系樹脂の波長分散性を調整又は制御(例えば、低減)するための添加剤であって、9,9-ビスアリールフルオレン骨格を有する非エポキシ系化合物およびエポキシ化合物で構成された波長分散性調整剤(例えば、波長分散性低減剤)も含まれる。また、本発明には、非エポキシ系樹脂にこのような波長分散性調整剤(例えば、波長分散性低減剤)を添加し、非エポキシ系樹脂の波長分散性を調整又は制御(例えば、低減)する樹脂の波長分散調整方法も含まれる。なお、このような調整剤や方法において、各成分の割合や樹脂に対する使用割合は、樹脂組成物における場合と同様である。 Therefore, the present invention relates to an additive for adjusting or controlling (for example, reducing) the wavelength dispersion of a non-epoxy resin, and a non-epoxy compound having an 9,9-bisarylfluorene skeleton and an epoxy compound Are also included (for example, a wavelength dispersion reducing agent). Further, in the present invention, such a wavelength dispersion adjusting agent (for example, a wavelength dispersion reducing agent) is added to the non-epoxy resin to adjust or control (for example, reduce) the wavelength dispersion of the non-epoxy resin. Also included is a method of adjusting the wavelength dispersion of the resin. In addition, in such a regulator and method, the ratio of each component and the use ratio with respect to resin are the same as in the resin composition.
 なお、分散性を調整する波長の範囲は、特に限定されないが、例えば、300~800nm(例えば、350~770nm)、好ましくは400~750nm(例えば、400~700nm)程度の可視光域であってもよい。 The wavelength range for adjusting the dispersibility is not particularly limited. For example, the visible light range is about 300 to 800 nm (for example, 350 to 770 nm), preferably about 400 to 750 nm (for example, 400 to 700 nm). Also good.
 なお、本明細書において、「9,9-ビス(ヒドロキシアリール)フルオレン類」および「9,9-ビス(ヒドロキシ(ポリ)アルコキシアリール)フルオレン類」とは、「9,9-ビス(ヒドロキシアリール)フルオレン骨格」や「9,9-ビス(ヒドロキシ(ポリ)アルコキシアリール)フルオレン骨格」を有する限り、アリール基やフルオレン骨格(詳細にはフルオレンの2~7位)に置換基を有する化合物を含む意味に用いる。さらに、本明細書において、「9,9-ビス(ヒドロキシ(ポリ)アルコキシアリール)フルオレン」とは、9,9-ビス(ヒドロキシアルコキシアリール)フルオレンおよび9,9-ビス(ヒドロキシポリアルコキシアリール)フルオレンを含む意味に用いる。 In the present specification, “9,9-bis (hydroxyaryl) fluorenes” and “9,9-bis (hydroxy (poly) alkoxyaryl) fluorenes” mean “9,9-bis (hydroxyaryl)”. As long as it has “) fluorene skeleton” or “9,9-bis (hydroxy (poly) alkoxyaryl) fluorene skeleton”, it includes compounds having substituents on aryl groups and fluorene skeletons (specifically, positions 2 to 7 of fluorene) Use for meaning. Further, in this specification, “9,9-bis (hydroxy (poly) alkoxyaryl) fluorene” means 9,9-bis (hydroxyalkoxyaryl) fluorene and 9,9-bis (hydroxypolyalkoxyaryl) fluorene. Used to mean including
 本発明の樹脂組成物は、フルオレン骨格(9,9-ビスアリールフルオレン骨格)を有する化合物(非エポキシ系化合物)を含む新規な樹脂組成物である。このような樹脂組成物は、樹脂(非エポキシ系樹脂)の種類に応じた樹脂特性を有する他、フルオレン骨格を有する化合物の添加により得られる従来公知の効果(屈折率の向上、複屈折の低減、延伸性の向上など)を得ることができる。そして、意外なことに、このような樹脂組成物は、低分子であるフルオレン骨格を有する化合物を含んでいるにもかかわらず、機械的特性を損なうことがなく、特に、単にフルオレン骨格を有する化合物を含む場合に比べても、さらに機械的特性を向上又は改善させることもできるため、非常に有用性が高い。 The resin composition of the present invention is a novel resin composition containing a compound (non-epoxy compound) having a fluorene skeleton (9,9-bisarylfluorene skeleton). Such a resin composition has resin characteristics according to the type of resin (non-epoxy resin), and also conventionally known effects obtained by adding a compound having a fluorene skeleton (improvement of refractive index, reduction of birefringence) , Improvement of stretchability, etc.) can be obtained. Surprisingly, such a resin composition contains a compound having a fluorene skeleton which is a low molecule, but does not impair the mechanical properties, in particular, a compound having only a fluorene skeleton. Compared with the case of containing, the mechanical properties can be further improved or improved, so that it is very useful.
 また、フルオレン骨格を有する化合物は、前記の通り、樹脂に逆波長分散性を付与できるようであるが、このようなフルオレン骨格を有する化合物とエポキシ化合物とを組み合わせることにより、波長分散性を調整又は制御できる。例えば、フルオレン骨格を有する化合物を添加することにより樹脂に逆波長分散性が付与されるが、エポキシ化合物と組み合わせることで、波長分散性が均一化されるためか、低波長分散性の樹脂(組成物)を容易に得ることができる。 In addition, as described above, the compound having a fluorene skeleton seems to be able to impart reverse wavelength dispersion to the resin. By combining such a compound having a fluorene skeleton and an epoxy compound, the wavelength dispersion is adjusted or Can be controlled. For example, the addition of a compound having a fluorene skeleton imparts reverse wavelength dispersibility to the resin, but when combined with an epoxy compound, the wavelength dispersibility becomes uniform, or a low wavelength dispersible resin (composition Product) can be easily obtained.
 本発明の樹脂組成物は、非エポキシ系樹脂(以下、単に樹脂などということがある)と、9,9-ビスアリールフルオレン骨格を有する非エポキシ系化合物(以下、フルオレン化合物などということがある)と、エポキシ化合物とを含む。 The resin composition of the present invention comprises a non-epoxy resin (hereinafter sometimes referred to simply as a resin) and a non-epoxy compound having a 9,9-bisarylfluorene skeleton (hereinafter sometimes referred to as a fluorene compound). And an epoxy compound.
 [樹脂]
 樹脂としては、幅広い樹脂を使用(又は適用)でき、熱可塑性樹脂、硬化性樹脂(熱又は光硬化性樹脂)のいずれであってもよい。
[resin]
As the resin, a wide range of resins can be used (or applied), and any of a thermoplastic resin and a curable resin (thermal or photo-curable resin) may be used.
 熱可塑性樹脂としては、例えば、オレフィン樹脂{例えば、鎖状オレフィン樹脂[エチレン系樹脂(例えば、ポリエチレン)、プロピレン系樹脂(例えば、ポリプロピレン)、ポリメチルペンテンなど]、環状オレフィン樹脂など}、ハロゲン含有ビニル系樹脂(ポリ塩化ビニル、フッ化樹脂など)、ビニル系樹脂(例えば、ポリビニルアルコール、アクリロニトリル系樹脂)、アクリル樹脂(例えば、ポリメタクリル酸メチルなどのメタクリル樹脂)、スチレン系樹脂[例えば、スチレン系単量体の単独又は共重合体(ポリスチレン、スチレン-α-メチルスチレン共重合体など)、スチレン系単量体と共重合性単量体との共重合体(スチレン-アクリロニトリル共重合体(AS樹脂)、スチレン-(メタ)アクリル酸エステル共重合体(スチレン-メタクリル酸メチル共重合体など)、スチレン-無水マレイン酸共重合体など)など]、ポリカーボネート樹脂(例えば、芳香族ポリカーボネート樹脂など)、ポリチオカーボネート樹脂、ポリエステル樹脂[例えば、脂肪族ポリエステル樹脂(ポリ乳酸など)、芳香族ポリエステル樹脂など]、ポリアセタール樹脂、ポリアミド樹脂(例えば、ポリアミド6、ポリアミド66、ポリアミド610、ポリアミド11、ポリアミド12、ポリアミド612、ポリアミド6/66などの脂肪族ポリアミド樹脂;ポリアミドMXDなどの芳香族ポリアミド樹脂)、ポリフェニレンエーテル樹脂、ポリスルホン樹脂、ポリフェニレンスルフィド樹脂、ポリイミド樹脂、ポリエーテルケトン樹脂、セルロース誘導体、熱可塑性エラストマーなどが挙げられる。 Examples of the thermoplastic resin include olefin resin {eg, chain olefin resin [ethylene resin (eg, polyethylene), propylene resin (eg, polypropylene), polymethylpentene, etc.], cyclic olefin resin, etc.}, halogen-containing resin) Vinyl resins (polyvinyl chloride, fluororesins, etc.), vinyl resins (eg, polyvinyl alcohol, acrylonitrile resins), acrylic resins (eg, methacrylic resins such as polymethyl methacrylate), styrene resins [eg, styrene Monomers or copolymers of polystyrene monomers (polystyrene, styrene-α-methylstyrene copolymer, etc.), copolymers of styrene monomers and copolymerizable monomers (styrene-acrylonitrile copolymers ( AS resin), styrene- (meth) acrylic acid ester copolymer Styrene-methyl methacrylate copolymer, etc.), styrene-maleic anhydride copolymer, etc.]], polycarbonate resin (eg, aromatic polycarbonate resin, etc.), polythiocarbonate resin, polyester resin [eg, aliphatic polyester resin, etc. (Polylactic acid, etc.), aromatic polyester resin, etc.], polyacetal resin, polyamide resin (for example, aliphatic polyamide resin such as polyamide 6, polyamide 66, polyamide 610, polyamide 11, polyamide 12, polyamide 612, polyamide 6/66; Aromatic polyamide resins such as polyamide MXD), polyphenylene ether resins, polysulfone resins, polyphenylene sulfide resins, polyimide resins, polyether ketone resins, cellulose derivatives, and thermoplastic elastomers. And so on.
 樹脂は、単独で又は2種以上組み合わせてもよい。 Resins may be used alone or in combination of two or more.
 なお、熱可塑性樹脂の分子量は、樹脂の種類に応じて選択できるが、例えば、数平均分子量で2000以上(例えば、3000以上)の範囲から選択でき、5000以上(例えば、8000~1000000)、好ましくは10000以上(例えば、12000~800000)、さらに好ましくは15000以上(例えば、20000~500000)であってもよい。なお、分子量は、慣用の方法、例えば、ゲルパーミエーションクロマトグラフィ(GPC)によりポリスチレン換算で測定できる。 The molecular weight of the thermoplastic resin can be selected according to the type of the resin. For example, the number average molecular weight can be selected from a range of 2000 or more (for example, 3000 or more), 5000 or more (for example, 8000 to 1000000), preferably May be 10,000 or more (for example, 12,000 to 800,000), more preferably 15,000 or more (for example, 20,000 to 500,000). The molecular weight can be measured in terms of polystyrene by a conventional method such as gel permeation chromatography (GPC).
 また、硬化性樹脂(熱又は光硬化性樹脂、非エポキシ系の硬化性樹脂)としては、例えば、アクリル樹脂(熱又は光硬化性アクリル樹脂)、フェノール樹脂、アミノ樹脂(尿素樹脂、メラミン樹脂など)、フラン樹脂、不飽和ポリエステル系樹脂、熱硬化性ウレタン系樹脂、シリコーン樹脂、熱硬化性ポリイミド系樹脂、ジアリルフタレート樹脂、ビニルエステル樹脂などが挙げられる。硬化性樹脂は、単独で又は2種以上組み合わせてもよい。なお、硬化性樹脂は、その種類に応じて、硬化剤や硬化促進剤などを含有していてもよい。 Examples of the curable resin (thermal or photocurable resin, non-epoxy curable resin) include acrylic resin (thermal or photocurable acrylic resin), phenol resin, amino resin (urea resin, melamine resin, etc.). ), Furan resins, unsaturated polyester resins, thermosetting urethane resins, silicone resins, thermosetting polyimide resins, diallyl phthalate resins, vinyl ester resins, and the like. The curable resins may be used alone or in combination of two or more. The curable resin may contain a curing agent, a curing accelerator, or the like depending on the type.
 樹脂は、単独で又は2種以上組み合わせてもよい。 Resins may be used alone or in combination of two or more.
 なお、樹脂(熱可塑性樹脂、硬化性樹脂)は、結晶性樹脂、非晶性樹脂のいずれであってもよい。 The resin (thermoplastic resin or curable resin) may be either a crystalline resin or an amorphous resin.
 また、樹脂は、正の波長分散性を有する樹脂であってもよく、負の波長分散性(逆波長分散性)を有する樹脂のいずれであってもよい。 In addition, the resin may be a resin having a positive wavelength dispersion or a resin having a negative wavelength dispersion (reverse wavelength dispersion).
 樹脂は、代表的には熱可塑性樹脂であってもよい。特に、樹脂は、透明性に優れた樹脂、例えば、環状オレフィン樹脂、メタクリル樹脂、芳香族ポリカーボネート樹脂、芳香族ポリエステル樹脂、セルロース誘導体などであってもよい。 The resin may typically be a thermoplastic resin. In particular, the resin may be a resin having excellent transparency, for example, a cyclic olefin resin, a methacrylic resin, an aromatic polycarbonate resin, an aromatic polyester resin, a cellulose derivative, or the like.
 以下、これらの樹脂について詳述する。 Hereinafter, these resins will be described in detail.
 (環状オレフィン樹脂)
 環状オレフィン系樹脂は、環状オレフィンを少なくとも重合成分とする樹脂である。
(Cyclic olefin resin)
Cyclic olefin resin is resin which uses cyclic olefin as a polymerization component at least.
 環状オレフィンは、単環式オレフィンであってもよく、多環式オレフィンであってもよい。また、環状オレフィンは、置換基、例えば、炭化水素基[例えば、アルキル基(例えば、メチル基などのC1-10アルキル基、好ましくはC1-5アルキル基)、シクロアルキル基(例えば、シクロヘキシル基などのC5-10シクロアルキル基)、アリール基(例えば、フェニル基などのC6-10アリール基)、アルケニル基(例えば、プロペニル基などのC2-10アルケニル基など)、シクロアルケニル基(例えば、シクロペンテニル基、シクロヘキセニル基などのC5-10シクロアルケニル基など)、アルキリデン基(例えば、エチリデン基などのC2-10アルキリデン基、好ましくはC2-5アルキリデン基など)など]、極性基[例えば、アルコキシ基(例えば、メトキシ基などのC1-10アルコキシ基、好ましくはC1-6アルコキシ基)、アシル基(例えば、アセチル基などのC2-5アルカノイル基など)、アシルオキシ基[例えば、アルコキシカルボニル基(例えば、メトキシカルボニル基、エトキシカルボニル基、ブトキシカルボニル基などのC1-10アルコキシ-カルボニル基)、シクロアルコキシカルボニル基(例えば、シクロヘキシルオキシカルボニル基などのC5-10シクロアルキル-カルボニル基)など]、ヒドロキシル基、カルボキシル基、アミノ基、置換アミノ基、ハロゲン原子、ハロアルキル基、ニトロ基、シアノ基、オキソ基(=O)、複素環基(ピリジル基などの窒素原子含有複素環基など)など}を有していてもよい。環状オレフィンは、単独で又は2種以上組みあわせて置換基を有していてもよい。 The cyclic olefin may be a monocyclic olefin or a polycyclic olefin. In addition, the cyclic olefin includes a substituent such as a hydrocarbon group [eg, an alkyl group (eg, a C 1-10 alkyl group such as a methyl group, preferably a C 1-5 alkyl group), a cycloalkyl group (eg, cyclohexyl group). A C 5-10 cycloalkyl group such as a group), an aryl group (eg, a C 6-10 aryl group such as a phenyl group), an alkenyl group (eg, a C 2-10 alkenyl group such as a propenyl group), a cycloalkenyl group (For example, C 5-10 cycloalkenyl group such as cyclopentenyl group, cyclohexenyl group, etc.), alkylidene group (eg, C 2-10 alkylidene group such as ethylidene group, preferably C 2-5 alkylidene group, etc.) , polar group [e.g., alkoxy groups (e.g., C 1-10 alkoxy group such as methoxy group, preferred Ku is C 1-6 alkoxy group), an acyl group (e.g., a C 2-5 alkanoyl group such as acetyl group), an acyloxy group [e.g., an alkoxycarbonyl group (e.g., methoxycarbonyl group, ethoxycarbonyl group, butoxycarbonyl group C 1-10 alkoxy-carbonyl group such as), cycloalkoxycarbonyl group (for example, C 5-10 cycloalkyl-carbonyl group such as cyclohexyloxycarbonyl group, etc.)], hydroxyl group, carboxyl group, amino group, substituted amino group , A halogen atom, a haloalkyl group, a nitro group, a cyano group, an oxo group (═O), a heterocyclic group (such as a nitrogen atom-containing heterocyclic group such as a pyridyl group). The cyclic olefin may have a substituent alone or in combination of two or more.
 具体的な環状オレフィンとしては、単環式オレフィン類[例えば、シクロアルケン(例えば、シクロブテン、シクロペンテン、シクロヘプテン、シクロオクテンなどのシクロC3-10アルケンなど)など、シクロアルカジエン(例えば、シクロペンタジエンなどのシクロC3-10アルカジエン)など]、二環式オレフィン類{例えば、ノルボルネン類[例えば、ノルボルネン(例えば、2-ノルボルネン)、アルキルノルボルネン(例えば、5-メチル-2-ノルボルネン、5,5又は5,6-ジメチル-2-ノルボルネン、5-エチリデン-2-ノルボルネン)、アリールノルボルネン(例えば、5-フェニル-2-ノルボルネン)、極性基を有するノルボルネン(例えば、5-シアノ-2-ノルボルネンなどのシアノノルボルネン;5-メトキシカルボニル-2-ノルボルネン、5-メチル-5-メトキシカルボニル-2-ノルボルネン、5,6-ジメトキシカルボニル-2-ノルボルネン、5-メチル-5-シクロヘキシルオキシカルボニル-2-ノルボルネンなどのアシルオキシノルボルネン(アルコキシカルボニルノルボルネン、シクロアルコキシカルボニルノルボルネンなど);5,6-ジ(トリフルオロメチル)-2-ノルボルネンなどのハロアルキルノルボルネン;7-オキソ-2-ノルボルネンなどのオキソノルボルネン)など]、ノルボルナジエン類[例えば、ノルボルナジエン(例えば、2,5-ノルボルナジエン)、アルキルノルボルナジエン(例えば、5-メチル-2,5-ノルボルナジエン、5,6-ジメチル-2,5-ノルボルナジエンなど)、アリールノルボルナジエン(5-フェニル-2,5-ノルボルナジエンなど)、極性基を有するノルボルナジエン(例えば、5-シアノ-2,5-ノルボルナジエンなどのシアノノルボルナジエン;5-メトキシカルボニル-2,5-ノルボルナジエンなどのアシルオキシノルボルナジエン(アルコキシカルボニルノルボルナジエンなど);5,6-ジ(トリフルオロメチル)-2,5-ノルボルナジエンなどのハロアルキルノルボルナジエン;7-オキソ-2-ノルボルナジエンなどのオキソノルボルナジエン)など]、三環式オレフィン{例えば、トリシクロアルケン[例えば、ジヒドロジシクロペンタジエン類(ジヒドロジシクロペンタジエンなど)などのC6-25トリシクロアルケンなど]、トリシクロアルカジエン[例えば、ジシクロペンタジエン類(ジシクロペンタジエン、メチルジシクロペンタジエンなど)、トリシクロ[4.4.0.12,5 ]ウンデカ-3,7-ジエン、トリシクロ[4.4.0.12,5]ウンデカ-3,8-ジエンなどのC6-25トリシクロアルカジエンなど]など}、四環以上の多環式オレフィン{例えば、四環式オレフィン[例えば、テトラシクロアルケン(例えば、テトラシクロ[4.4.0.12,5.17,10]-3-ドデセン、8-メチルテトラシクロ[4.4.0.12,5.17,10]-3-ドデセン、8,9-ジメチルテトラシクロ[4.4.0.12,5.17,10]-3-ドデセンなどのC8-30テトラシクロアルケンなど)など]、五環式オレフィン[例えば、ペンタシクロアルカジエン(例えば、トリシクロペンタジエンなどのC10-35ペンタシクロアルカジエン)など]、六環式オレフィン[例えば、ヘキサシクロアルケン(例えば、ヘキサシクロ[6.6.1.13,6.02,7.09,14]-4-ヘプタデセンなどのC12-40ヘキサシクロアルケン)など]など}などの多環式オレフィン類などが挙げられる。 Specific cyclic olefins include monocyclic olefins [eg, cycloalkenes (eg, cycloC 3-10 alkenes such as cyclobutene, cyclopentene, cycloheptene, cyclooctene, etc.), cycloalkadienes (eg, cyclopentadiene, etc. A cyclo C 3-10 alkadiene, etc.)], bicyclic olefins {eg norbornenes [eg norbornene (eg 2-norbornene), alkyl norbornene (eg 5-methyl-2-norbornene, 5, 5 or 5,6-dimethyl-2-norbornene, 5-ethylidene-2-norbornene), aryl norbornene (eg, 5-phenyl-2-norbornene), norbornene having a polar group (eg, 5-cyano-2-norbornene, etc.) Cyanonorbornene Acyloxynorbornene such as 5-methoxycarbonyl-2-norbornene, 5-methyl-5-methoxycarbonyl-2-norbornene, 5,6-dimethoxycarbonyl-2-norbornene, 5-methyl-5-cyclohexyloxycarbonyl-2-norbornene (Alkoxycarbonyl norbornene, cycloalkoxycarbonyl norbornene, etc.); haloalkylnorbornene such as 5,6-di (trifluoromethyl) -2-norbornene; oxonorbornene such as 7-oxo-2-norbornene), etc.], norbornadienes [for example , Norbornadiene (for example, 2,5-norbornadiene), alkylnorbornadiene (for example, 5-methyl-2,5-norbornadiene, 5,6-dimethyl-2,5-norbornadiene, etc.) Arylnorbornadiene (such as 5-phenyl-2,5-norbornadiene), norbornadiene having a polar group (for example, cyanonorbornadiene such as 5-cyano-2,5-norbornadiene; 5-methoxycarbonyl-2,5-norbornadiene, etc. Acyloxynorbornadiene (such as alkoxycarbonylnorbornadiene); haloalkylnorbornadiene such as 5,6-di (trifluoromethyl) -2,5-norbornadiene; oxonorbornadiene such as 7-oxo-2-norbornadiene)], tricyclic olefin { For example, tricycloalkenes [eg, C 6-25 tricycloalkenes such as dihydrodicyclopentadienes (such as dihydrodicyclopentadiene)], tricycloalkadienes [eg, Dicyclopentadiene (dicyclopentadiene, methyldicyclopentadiene, etc.), tricyclo [4.4.0.1 2,5 ] undeca-3,7-diene, tricyclo [4.4.0.1 2,5 ] A C 6-25 tricycloalkadiene such as undeca-3,8-diene, etc.]}, a polycyclic olefin having four or more rings {eg, a tetracyclic olefin [eg, tetracycloalkene (eg, tetracyclo [4. 4.0.1 2,5 . 1 7,10 ] -3-dodecene, 8-methyltetracyclo [4.4.0.1 2,5 . 1 7,10 ] -3-dodecene, 8,9-dimethyltetracyclo [4.4.0.1 2,5 . C 7-30 tetracycloalkene such as 1 7,10 ] -3-dodecene), etc.], pentacyclic olefin [eg C 10-35 pentacycloalkadiene such as tricyclopentadiene, etc. ), etc.], six cyclic olefins [e.g., hexa cycloalkenes (e.g., hexacyclo [6.6.1.1 3,6 .0 2,7 .0 9,14] -4- heptadecene C such as 12-40 Hexacycloalkene) and the like} and the like.
 環状オレフィン樹脂は、環状オレフィンの単独又は共重合体(例えば、単環式オレフィンと多環式オレフィンとの共重合体、複数の多環式オレフィンの共重合体など)であってもよく、環状オレフィンと共重合性単量体との共重合体であってもよい。 The cyclic olefin resin may be a cyclic olefin homopolymer or a copolymer (for example, a copolymer of a monocyclic olefin and a polycyclic olefin, a copolymer of a plurality of polycyclic olefins, etc.), or cyclic. A copolymer of an olefin and a copolymerizable monomer may be used.
 共重合性単量体としては、例えば、鎖状オレフィン[アルケン(例えば、エチレン、プロピレン、1-ブテン、1-ペンテン、1-ヘキセン、3-メチル-1-ブテン、2-メチル-1-ペンテン、3-エチル-1-ペンテン、4-メチル-1-ペンテン、4-メチル-1-ヘキセン、4,4-ジメチル-1-ヘキセン、4,4-ジメチル-1-ペンテン、4-エチル-1-ヘキセン、3-エチル-1-ヘキセン、1-オクテン、1-デセン、1-ドデセン、1-テトラデセン、1-ヘキサデセン、1-オクタデセン、1-エイコセンなどのC2-20アルケン)、アルカジエン(例えば、1,4-ヘキサジエン、4-メチル-1,4-ヘキサジエン、5-メチル-1,4-ヘキサジエン、1,7-オクタジエンなどの非共役C5-20アルカジエン)など]、重合性ニトリル化合物(例えば、(メタ)アクリロニトリルなど)、(メタ)アクリル系単量体(例えば、(メタ)アクリル酸メチル、(メタ)アクリル酸エチルなどの(メタ)アクリル酸エステル類、(メタ)アクリル酸など)、不飽和ジカルボン酸又はその誘導体(無水マレイン酸など)などが挙げられる。共重合性単量体は、単独で又は2種以上組みあわせてもよい。 Examples of the copolymerizable monomer include a chain olefin [alkene (eg, ethylene, propylene, 1-butene, 1-pentene, 1-hexene, 3-methyl-1-butene, 2-methyl-1-pentene). 3-ethyl-1-pentene, 4-methyl-1-pentene, 4-methyl-1-hexene, 4,4-dimethyl-1-hexene, 4,4-dimethyl-1-pentene, 4-ethyl-1 C 2-20 alkenes such as -hexene, 3-ethyl-1-hexene, 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 1-eicocene), alkadienes (for example , 1,4-hexadiene, 4-methyl-1,4-hexadiene, 5-methyl-1,4-hexadiene, 1,7-nonconjugated C 5-20 a such octadiene Cadien etc.), polymerizable nitrile compounds (eg (meth) acrylonitrile etc.), (meth) acrylic monomers (eg (meth) acrylic acid such as methyl (meth) acrylate, ethyl (meth) acrylate) Esters, (meth) acrylic acid and the like), unsaturated dicarboxylic acids or derivatives thereof (maleic anhydride and the like), and the like. The copolymerizable monomers may be used alone or in combination of two or more.
 なお、環状オレフィンと共重合性単量体との共重合体において、環状オレフィンの割合は、環状オレフィンおよび共重合性単量体の総量に対して、例えば、10モル%以上(例えば、20モル%以上)、好ましくは30モル%以上、さらに好ましくは40モル%以上であってもよい。 In the copolymer of cyclic olefin and copolymerizable monomer, the ratio of cyclic olefin is, for example, 10 mol% or more (for example, 20 mol) with respect to the total amount of cyclic olefin and copolymerizable monomer. % Or more), preferably 30 mol% or more, more preferably 40 mol% or more.
 好ましい環状オレフィン樹脂には、環状オレフィン共重合体{例えば、環状オレフィン(例えば、ノルボルネン類を少なくとも含む環状オレフィン)と共重合性単量体[例えば、鎖状オレフィン(例えば、エチレンなどのC2-6アルケン)を少なくとも含む共重合性単量体]との共重合体}が含まれる。 Preferred cyclic olefin resins include cyclic olefin copolymers {eg, cyclic olefins (eg, cyclic olefins containing at least norbornenes) and copolymerizable monomers [eg, chain olefins (eg, C 2− Copolymer) with a copolymerizable monomer containing at least 6 alkene).
 特に、環状オレフィン共重合体の中でも、極性基を有する環状オレフィン共重合体、例えば、極性基を有する環状オレフィン{例えば、極性基を有するノルボルネン[例えば、アシルオキシノルボルネン(例えば、5-メトキシカルボニル-2-ノルボルネン、5-メチル-5-メトキシカルボニル-2-ノルボルネンなどのアルコキシカルボニル基(例えば、C1-10アルコキシカルボニル基、好ましくはC1-4アルコキシカルボニル基)が置換したノルボルネンなど)など]など}を少なくとも含む環状オレフィンと、共重合性単量体[例えば、鎖状オレフィン(例えば、エチレンなどのC2-6アルケン)を少なくとも含む共重合性単量体]との共重合体などが好ましい。 In particular, among cyclic olefin copolymers, a cyclic olefin copolymer having a polar group, for example, a cyclic olefin having a polar group {eg, norbornene having a polar group [eg, acyloxynorbornene (eg, 5-methoxycarbonyl-2 An alkoxycarbonyl group such as norbornene or 5-methyl-5-methoxycarbonyl-2-norbornene (eg, norbornene substituted with a C 1-10 alkoxycarbonyl group, preferably a C 1-4 alkoxycarbonyl group), etc.] } And a copolymerizable monomer [for example, a copolymerizable monomer [for example, a copolymerizable monomer containing at least a chain olefin (eg, C 2-6 alkene such as ethylene)] is preferable. .
 なお、極性基を有する環状オレフィン共重合体において、環状オレフィン全体に対する極性基を有する環状オレフィンの割合は、例えば、10モル%以上、好ましくは20モル%以上、さらに好ましくは30モル%以上であってもよい。 In the cyclic olefin copolymer having a polar group, the ratio of the cyclic olefin having a polar group to the whole cyclic olefin is, for example, 10 mol% or more, preferably 20 mol% or more, more preferably 30 mol% or more. May be.
 環状オレフィン樹脂は、単独で又は2種以上組み合わせてもよい。 The cyclic olefin resins may be used alone or in combination of two or more.
 (メタクリル樹脂)
 メタクリル樹脂(メタクリル系樹脂、メタクリレート樹脂)としては、少なくともメタクリル酸エステルを重合成分とする樹脂などが挙げられる。通常、メタクリル樹脂は、メタクリル酸アルキル[例えば、メタクリル酸アルキルエステル(例えば、メタクリル酸メチル、メタクリル酸エチル、メタクリル酸プロピル、メタクリル酸ブチル、メタクリル酸2-エチルヘキシルなどのメタクリル酸C1-20アルキル、好ましくはメタクリル酸C1-12アルキル、さらに好ましくはメタクリル酸C1-6アルキル、特にメタクリル酸C1-4アルキル)など]を重合成分とする樹脂であってもよい。メタクリル酸アルキルは、単独で又は2種以上組みあわせてもよい。
(Methacrylic resin)
Examples of the methacrylic resin (methacrylic resin or methacrylate resin) include resins having at least a methacrylic acid ester as a polymerization component. Usually, the methacrylic resin is an alkyl methacrylate [for example, an alkyl methacrylate ester (for example, a C 1-20 alkyl methacrylate such as methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl methacrylate, 2-ethylhexyl methacrylate, Preferably, a resin having a polymerization component of C 1-12 alkyl methacrylate, more preferably C 1-6 alkyl methacrylate, particularly C 1-4 alkyl methacrylate) and the like. The alkyl methacrylates may be used alone or in combination of two or more.
 具体的なメタクリル樹脂には、メタクリル酸アルキル(特に、メタクリル酸メチルを少なくとも含むメタクリル酸アルキル)の単独又は共重合体、メタクリル酸アルキル(特に、メタクリル酸メチルを少なくとも含むメタクリル酸アルキル)と共重合性単量体との共重合体などが含まれる。 Specific methacrylic resins include alkyl methacrylates (especially alkyl methacrylates containing at least methyl methacrylate) homopolymers or copolymers, alkyl methacrylates (particularly alkyl methacrylates containing at least methyl methacrylate) and copolymers. And a copolymer with a functional monomer.
 共重合性単量体としては、共重合可能であれば特に限定されないが、例えば、(メタ)アクリル系モノマー{例えば、(メタ)アクリル酸、アクリル酸アルキル(例えば、アクリル酸メチル、アクリル酸エチル、アクリル酸プロピル、アクリル酸ブチルなどのアクリル酸C1-10アルキル)、脂環族(メタ)アクリレート[例えば、(メタ)アクリル酸シクロヘキシルなどの(メタ)アクリル酸C5-10シクロアルキルエステル;デカリニル(メタ)アクリレート、ノルボルニル(メタ)アクリレート、ボルニル(メタ)アクリレート、アダマンチル(メタ)アクリレートなどのビ乃至テトラシクロアルキル(メタ)アクリレートなど]、ヒドロキシアルキル(メタ)アクリレート[例えば、(メタ)アクリル酸ヒドロキシエチルなどの(メタ)アクリル酸ヒドロキシC2-6アルキルなど]、3以上の(メタ)アクリロイルオキシ基を有する化合物[例えば、アルカンジオールジ(メタ)アクリレート(例えば、エチレングリコールジ(メタ)アクリレート、ジエチレングリコールジ(メタ)アクリレート、テトラエチレングリコールジ(メタ)アクリレート、ネオペンチルグリコールジ(メタ)アクリレートなど)、アルカントリオールジ乃至トリ(メタ)アクリレート(例えば、トリメチロールエタントリ(メタ)アクリレート、トリメチロールプロパントリ(メタ)アクリレートなど)、アルカンテトラオールジ乃至テトラ(メタ)アクリレート(ペンタエリスリトールテトラ(メタ)アクリレートなど)などのポリオールポリ(メタ)アクリレート、ポリオールのアルキレンオキシド(例えば、エチレンオキシドなどのC2-4アルキレンオキシド)付加体のポリ(メタ)アクリレートなど]など}、(メタ)アクリロニトリル、スチレン系単量体(スチレンなど)、ビニルエステル系単量体(酢酸ビニルなど)、不飽和カルボン酸又はその無水物(無水マレイン酸、マレイン酸、フマル酸など)などが例示できる。共重合性単量体は、単独で又は2種以上組みあわせてもよい。 The copolymerizable monomer is not particularly limited as long as it is copolymerizable. For example, a (meth) acrylic monomer {for example, (meth) acrylic acid, alkyl acrylate (for example, methyl acrylate, ethyl acrylate) C 1-10 alkyl acrylates such as propyl acrylate and butyl acrylate), alicyclic (meth) acrylates (eg, (meth) acrylic acid C 5-10 cycloalkyl esters such as cyclohexyl (meth) acrylate; Decalinyl (meth) acrylate, norbornyl (meth) acrylate, bornyl (meth) acrylate, bi to tetracycloalkyl (meth) acrylate such as adamantyl (meth) acrylate, etc.], hydroxyalkyl (meth) acrylate [for example, (meth) acrylic Acid hydroxyethyl etc. (Meth) acrylic acid hydroxyalkyl C 2-6 alkyl], 3 or more (meth) acrylate compound having an acryloyloxy group [for example, an alkane diol di (meth) acrylate (e.g., ethylene glycol di (meth) acrylate, diethylene glycol di ( (Meth) acrylate, tetraethylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, etc.), alkanetriol di to tri (meth) acrylate (for example, trimethylolethane tri (meth) acrylate, trimethylolpropane tri ( Meth) acrylates), polyols such as alkanetetraol di to tetra (meth) acrylates (pentaerythritol tetra (meth) acrylate etc.), poly (meth) acrylates, polyols Alkylene oxide (e.g., C 2-4 alkylene oxides such as ethylene oxide) and poly adducts (meth) acrylate, etc.]}, (meth) acrylonitrile, styrene monomers (styrene, etc.), vinyl ester monomers (Vinyl acetate etc.), unsaturated carboxylic acid or its anhydride (maleic anhydride, maleic acid, fumaric acid etc.) etc. can be illustrated. The copolymerizable monomers may be used alone or in combination of two or more.
 好ましいメタクリル樹脂には、メタクリル酸メチルを重合成分とする樹脂、例えば、ポリメタクリル酸メチル、メタクリル酸メチルを重合成分とする共重合体[例えば、メタクリル酸メチルとメタクリル酸アルキルエステルとの共重合体(例えば、メタクリル酸メチル-メタクリル酸C2-8アルキルエステル共重合体など)など]が挙げられる。なお、メタクリル酸メチルを重合成分とする共重合体において、メタクリル酸メチルの割合は、モノマー全体[メタクリル酸メチルおよび他の単量体(メタクリル酸C2-8アルキルエステル、前記共重合性単量体など)]の50重量%以上(例えば、55~99.9重量%程度)、好ましくは60重量%以上(例えば、65~99重量%程度)、さらに好ましくは70重量%以上(例えば、75~95重量%程度)であってもよい。 Preferred methacrylic resins include resins having methyl methacrylate as a polymerization component, such as polymethyl methacrylate, copolymers having methyl methacrylate as a polymerization component [for example, copolymers of methyl methacrylate and alkyl methacrylate esters. (For example, methyl methacrylate-methacrylic acid C 2-8 alkyl ester copolymer) and the like]. In the copolymer containing methyl methacrylate as a polymerization component, the proportion of methyl methacrylate is determined based on the total amount of monomers [methyl methacrylate and other monomers (methacrylic acid C 2-8 alkyl ester, copolymerizable monomer). Body etc.)], for example, about 55 to 99.9% by weight, preferably 60% or more (for example, about 65 to 99% by weight), more preferably 70% or more (for example, 75%). Or about 95% by weight).
 (芳香族ポリカーボネート樹脂)
 芳香族ポリカーボネート樹脂としては、芳香族ジオールとカーボネート形成性化合物とを重合成分とする樹脂が挙げられる。
(Aromatic polycarbonate resin)
Examples of the aromatic polycarbonate resin include resins having an aromatic diol and a carbonate-forming compound as polymerization components.
 芳香族ジオールとしては、例えば、ビスフェノール類、ジヒドロキシアレーン(ハイドロキノン、レゾルシノールなど)などが挙げられる。ビスフェノール類としては、例えば、ジヒドロキシアレーン[例えば、4,4’-ジヒドロキシビフェニルなどのジ(ヒドロキシC6-10アレーン)]、ビス(ヒドロキシフェニル)アルカン類[例えば、ビス(4-ヒドロキシフェニル)メタン、1,1-ビス(4-ヒドロキシフェニル)エタン、1,1-ビス(4-ヒドロキシフェニル)-1-フェニルエタン、2,2-ビス(4-ヒドロキシフェニル)プロパン、2,2-ビス(4-ヒドロキシ-3-メチルフェニル)プロパン、2,2-ビス(4-ヒドロキシ-3-イソプロピルフェニル)プロパン、2,2-ビス(3-t-ブチル-4-ヒドロキシフェニル)プロパン、2,2-ビス(4-ヒドロキシフェニル)ブタン、2,2-ビス(4-ヒドロキシフェニル)オクタン、2,2-ビス(3-ブロモ-4-ヒドロキシフェニル)プロパン、2,2-ビス(3,5-ジブロモ-4-ヒドロキシフェニル)プロパン、2,2-ビス(3,5-ジクロロ-4-ヒドロキシフェニル)プロパン、2,2-ビス(3,5-ジメチル-4-ヒドロキシフェニル)プロパン、2,2-ビス(3-シクロヘキシル-4-ヒドロキシフェニル)プロパン、ビス(4-ヒドロキシフェニル)ジフェニルメタンなどのビス(ヒドロキシフェニル)C1-10アルカン類、好ましくはビス(ヒドロキシフェニル)C1-8アルカン類]、ビス(ヒドロキシフェニルアリール)アルカン類[例えば、2,2-ビス(4-ヒドロキシ-3,3’-ビフェニル)プロパンなどビス(ヒドロキシビフェニリル)C1-10アルカン類、好ましくはビス(ヒドロキシビフェニリル)C1-8アルカン類]、ビス(ヒドロキシフェニル)シクロアルカン類[例えば、1,1-ビス(4-ヒドロキシフェニル)-3,3,5-トリメチルシクロヘキサン、1,1-ビス(3-シクロヘキシル-4-ヒドロキシフェニル)シクロヘキサン、1,1-ビス(4-ヒドロキシフェニル)シクロヘキサン、1,1-ビス(4-ヒドロキシフェニル)シクロペンタンなどのビス(ヒドロキシフェニル)C4-10シクロアルカン、好ましくはビス(ヒドロキシフェニル)C5-8シクロアルカン]、ビス(ヒドロキシフェニル)エーテル類(例えば、4,4’-ジヒドロキシジフェニルエ-テル、4,4’-ジヒドロキシ-3,3’-ジメチルジフェニルエ-テルなど)、ビス(ヒドロキシフェニル)スルホン類(例えば、4,4’-ジヒドロキシジフェニルスルホン、4,4’-ジヒドロキシ-3,3’-ジメチルジフェニルスルホン、4,4’-ジヒドロキシ-3,3’-ジフェニルジフェニルスルホンなど)、ビス(ヒドロキシフェニル)スルホキシド類(例えば、4,4’-ジヒドロキシジフェニルスルホキシド、4,4’-ジヒドロキシ-3,3’-ジメチルジフェニルスルホキシド、4,4’-ジヒドロキシ-3,3’-ジフェニルジフェニルスルホキシドなど)、ビス(ヒドロキシフェニル)スルフィド類(例えば、4,4’-ジヒドロキシジフェニルスルフィド、4,4’-ジヒドロキシ-3,3’-ジメチルジフェニルスルフィド、4,4’-ジヒドロキシ-3,3’-ジフェニルジフェニルスルフィドなど)、ビス(ヒドロキシフェニル-アルキル)アレーン類[例えば、4,4’-(o,m又はp-フェニレンジイソプロピリデン)ジフェノールなどのビス(ヒドロキシフェニル-C1-4アルキル)C6-10アレーン、好ましくはビス(ヒドロキシフェニル-C1-4アルキル)ベンゼン]などが挙げられる。 Examples of the aromatic diol include bisphenols and dihydroxyarene (hydroquinone, resorcinol, etc.). Examples of bisphenols include dihydroxyarenes [eg, di ( hydroxyC 6-10 arenes) such as 4,4′-dihydroxybiphenyl], bis (hydroxyphenyl) alkanes [eg, bis (4-hydroxyphenyl) methane 1,1-bis (4-hydroxyphenyl) ethane, 1,1-bis (4-hydroxyphenyl) -1-phenylethane, 2,2-bis (4-hydroxyphenyl) propane, 2,2-bis ( 4-hydroxy-3-methylphenyl) propane, 2,2-bis (4-hydroxy-3-isopropylphenyl) propane, 2,2-bis (3-tert-butyl-4-hydroxyphenyl) propane, 2,2 -Bis (4-hydroxyphenyl) butane, 2,2-bis (4-hydroxyphenyl) octane, 2,2 Bis (3-bromo-4-hydroxyphenyl) propane, 2,2-bis (3,5-dibromo-4-hydroxyphenyl) propane, 2,2-bis (3,5-dichloro-4-hydroxyphenyl) propane Bis (hydroxy) such as 2,2-bis (3,5-dimethyl-4-hydroxyphenyl) propane, 2,2-bis (3-cyclohexyl-4-hydroxyphenyl) propane, bis (4-hydroxyphenyl) diphenylmethane Phenyl) C 1-10 alkanes, preferably bis (hydroxyphenyl) C 1-8 alkanes], bis (hydroxyphenylaryl) alkanes [eg 2,2-bis (4-hydroxy-3,3′- biphenyl) propane and bis (hydroxy biphenylyl) C 1-10 alkanes, preferably bis (arsenate B carboxymethyl biphenylyl) C 1-8 alkanes, bis (hydroxyphenyl) cycloalkane [e.g., 1,1-bis (4-hydroxyphenyl) -3,3,5-trimethylcyclohexane, 1,1-bis ( Bis (hydroxyphenyl) C 4-10 cycloalkane such as 3-cyclohexyl-4-hydroxyphenyl) cyclohexane, 1,1-bis (4-hydroxyphenyl) cyclohexane, 1,1-bis (4-hydroxyphenyl) cyclopentane , Preferably bis (hydroxyphenyl) C 5-8 cycloalkane], bis (hydroxyphenyl) ethers (eg, 4,4′-dihydroxydiphenyl ether, 4,4′-dihydroxy-3,3′-dimethyl) Diphenyl ether), bis (hydroxyphenyl) sulfones ( For example, 4,4′-dihydroxydiphenylsulfone, 4,4′-dihydroxy-3,3′-dimethyldiphenylsulfone, 4,4′-dihydroxy-3,3′-diphenyldiphenylsulfone), bis (hydroxyphenyl) Sulfoxides (for example, 4,4′-dihydroxydiphenyl sulfoxide, 4,4′-dihydroxy-3,3′-dimethyldiphenyl sulfoxide, 4,4′-dihydroxy-3,3′-diphenyldiphenyl sulfoxide, etc.), bis ( Hydroxyphenyl) sulfides (for example, 4,4'-dihydroxydiphenyl sulfide, 4,4'-dihydroxy-3,3'-dimethyldiphenyl sulfide, 4,4'-dihydroxy-3,3'-diphenyldiphenyl sulfide) Bis (hydroxyphenyl-alkyl) array [For example, bis (hydroxyphenyl-C 1-4 alkyl) C 6-10 arenes such as 4,4 ′-(o, m or p-phenylenediisopropylidene) diphenol, preferably bis (hydroxyphenyl- C 1-4 alkyl) benzene] and the like.
 これらの芳香族ジオールの中でも、特に、ビス(ヒドロキシフェニル)アルカン類[特に、2,2-ビス(4-ヒドロキシフェニル)プロパンなどのビス(ヒドロキシフェニル)C1-4アルカン]、ビス(ヒドロキシフェニル-アルキル)アレーン類[ビス(ヒドロキシフェニル-C1-4アルキル)ベンゼンなど]などのビスフェノール類が好ましい。芳香族ジオールは、単独で又は2種以上組み合わせてもよい。 Among these aromatic diols, in particular, bis (hydroxyphenyl) alkanes [especially bis (hydroxyphenyl) C 1-4 alkanes such as 2,2-bis (4-hydroxyphenyl) propane], bis (hydroxyphenyl) Bisphenols such as -alkyl) arenes [bis (hydroxyphenyl-C 1-4 alkyl) benzene etc.] are preferred. Aromatic diols may be used alone or in combination of two or more.
 カーボネート形成性化合物としては、例えば、ホスゲン類(ホスゲン、ジホスゲン、トリホスゲンなど)、カーボネート類[例えば、ジアルキルカーボネート(ジメチルカーボネート、ジエチルカーボネートなど)、ジアリールカーボネート(ジフェニルカーボネート、ジナフチルカーボネートなど)などの炭酸ジエステル類]などが挙げられる。これらの中でも、ホスゲン、ジフェニルカーボネートなどを好適に用いてもよい。カーボネート形成性化合物は、単独で又は2種以上組み合わせてもよい。 Examples of the carbonate-forming compound include carbonates such as phosgene (phosgene, diphosgene, triphosgene, etc.), carbonates [eg, dialkyl carbonate (dimethyl carbonate, diethyl carbonate, etc.), diaryl carbonate (diphenyl carbonate, dinaphthyl carbonate, etc.). Diesters] and the like. Among these, phosgene, diphenyl carbonate and the like may be preferably used. The carbonate-forming compounds may be used alone or in combination of two or more.
 芳香族ポリカーボネート樹脂は、単独で又は2種以上組み合わせてもよい。 The aromatic polycarbonate resin may be used alone or in combination of two or more.
 (芳香族ポリエステル樹脂)
 芳香族ポリエステル樹脂としては、例えば、ポリアルキレンアリレート樹脂、ポリアリレート樹脂[例えば、芳香族ジカルボン酸(テレフタル酸など)と芳香族ジオール(ビフェノール、ビスフェノールA、キシリレングリコール、これらのアルキレンオキサイド付加体など)を重合成分として用いたポリアリレート樹脂など)など]、液晶性ポリエステル樹脂などが挙げられる。
(Aromatic polyester resin)
Examples of aromatic polyester resins include polyalkylene arylate resins, polyarylate resins [for example, aromatic dicarboxylic acids (such as terephthalic acid) and aromatic diols (biphenol, bisphenol A, xylylene glycol, alkylene oxide adducts thereof, etc.) And the like)], and liquid crystalline polyester resins.
 ポリアルキレンアリレート樹脂としては、例えば、ポリアルキレンテレフタレート樹脂[例えば、ポリアルキレンテレフタレート(例えば、ポリエチレンテレフタレート、ポリプロピレンテレフタレート、ポリブチレンテレフタレートなどのポリC2-4アルキレンテレフタレート)、アルキレンテレフタレート単位(ポリアルキレンテレフタレート単位)を有するコポリエステルなど]、ポリアルキレンナフタレート樹脂[例えば、ポリアルキレンナフタレート(例えば、ポリエチレンナフタレートなどのポリC2-4アルキレンナフタレート)、アルキレンナフタレート単位(ポリアルキレンナフタレート単位)を有するコポリエステルなど]、ポリシクロアルカンジアルキレンテレフタレート樹脂[例えば、ポリシクロアルカンジアルキレンテレフタレート(例えば、ポリシクロヘキサンジメチレンテレフタレート)、シクロアルカンジアルキレンテレフタレート単位(ポリシクロアルカンジアルキレンテレフタレート単位)を有するコポリエステルなど]などが挙げられる。 Examples of the polyalkylene arylate resin include polyalkylene terephthalate resin [for example, polyalkylene terephthalate (eg, poly C 2-4 alkylene terephthalate such as polyethylene terephthalate, polypropylene terephthalate, polybutylene terephthalate), alkylene terephthalate unit (polyalkylene terephthalate unit) ), Polyalkylene naphthalate resin [for example, polyalkylene naphthalate (for example, poly C 2-4 alkylene naphthalate such as polyethylene naphthalate), alkylene naphthalate unit (polyalkylene naphthalate unit) Having a copolyester], polycycloalkane dialkylene terephthalate resin [for example, polycycloalkanedia Sharp emission terephthalate (e.g., poly cyclohexane dimethylene terephthalate), such as a copolyester having cycloalkandienyl alkylene terephthalate units (poly cycloalkane alkylene terephthalate unit), and the like.
 コポリエステルにおいて、共重合成分としては、例えば、ジオール成分[例えば、アルカンジオール(例えば、エチレングリコール、プロピレングリコール、ブタンジオール、ヘキサンジオールなどのC2-6アルカンジオール)、ポリアルカンジオール(例えば、ジエチレングリコール、ポリテトラメチレングリコールなどのジ乃至ヘキサC2-4アルカンジオールなど)、脂環族ジオール(例えば、1,4-シクロヘキサンジメタノールなど)、芳香族ジオール(例えば、ビスフェノール類のC2-4アルキレンオキシド付加体など)など]、ジカルボン酸成分{例えば、脂肪族ジカルボン酸(例えば、グルタル酸、アジピン酸、セバシン酸などのC4-12アルカンジカルボン酸)、芳香族ジカルボン酸[例えば、非対称芳香族ジカルボン酸(例えば、フタル酸、イソフタル酸など)、ジフェニルジカルボン酸など]など}、ヒドロキシカルボン酸成分(例えば、ヒドロキシ安息香酸など)などが挙げられる。共重合成分は、単独で又は2種以上組み合わせてもよい。 In the copolyester, the copolymer component includes, for example, a diol component [eg, alkane diol (eg, C 2-6 alkane diol such as ethylene glycol, propylene glycol, butane diol, hexane diol), polyalkane diol (eg, diethylene glycol). Di-hexaC 2-4 alkanediols such as polytetramethylene glycol), alicyclic diols (eg 1,4-cyclohexanedimethanol etc.), aromatic diols (eg C 2-4 alkylenes of bisphenols) Oxide adducts, etc.)], dicarboxylic acid components {eg aliphatic dicarboxylic acids (eg C 4-12 alkane dicarboxylic acids such as glutaric acid, adipic acid, sebacic acid), aromatic dicarboxylic acids [eg asymmetric aromatics] Zika Rubonic acid (eg phthalic acid, isophthalic acid etc.), diphenyldicarboxylic acid etc.]}, hydroxycarboxylic acid component (eg hydroxybenzoic acid etc.) and the like. The copolymerization components may be used alone or in combination of two or more.
 なお、コポリエステルにおいて、アルキレンアリレート単位(アルキレンテレフタレート単位、アルキレンナフタレート単位など)の割合は、例えば、40重量%以上、好ましくは50重量%以上であってもよい。 In the copolyester, the proportion of alkylene arylate units (alkylene terephthalate units, alkylene naphthalate units, etc.) may be, for example, 40% by weight or more, preferably 50% by weight or more.
 なお、芳香族ポリエステル樹脂は、結晶性であってもよく、非結晶性であってもよい。 The aromatic polyester resin may be crystalline or non-crystalline.
 また、芳香族ポリエステル樹脂は、直鎖状構造であってもよく、分岐鎖状構造を有していてもよい。 The aromatic polyester resin may have a linear structure or a branched structure.
 芳香族ポリエステル樹脂は、単独で又は2種以上組み合わせてもよい。 Aromatic polyester resins may be used alone or in combination of two or more.
 (セルロース誘導体)
 セルロース誘導体としては、特に制限されず、種々のセルロース誘導体、例えば、セルロースエステル、セルロースカーバメート(例えば、セルロースフェニルカーバメートなど)、セルロースエーテルなどが使用できる。
(Cellulose derivative)
The cellulose derivative is not particularly limited, and various cellulose derivatives such as cellulose ester, cellulose carbamate (for example, cellulose phenyl carbamate), cellulose ether and the like can be used.
 セルロースエステルとしては、例えば、セルロースジアセテート(DAC)、セルローストリアセテート(TAC)などのセルロースアセテート;セルロースプロピオネート、セルロースブチレートなどのセルロースC3-5アシレート;セルロースアセテートプロピオネート(CAP)、セルロースアセテートブチレート(CAB)などのセルロースアセテートC3-5アシレートなどのセルロースアシレートが挙げられる。 Examples of the cellulose ester include cellulose acetate such as cellulose diacetate (DAC) and cellulose triacetate (TAC); cellulose C 3-5 acylate such as cellulose propionate and cellulose butyrate; cellulose acetate propionate (CAP), And cellulose acylate such as cellulose acetate C 3-5 acylate such as cellulose acetate butyrate (CAB).
 また、セルロースエーテルとしては、アルキルセルロース(例えば、メチルセルロース、エチルセルロースなどのC1-4アルキルセルロースなど)、ヒドロキシアルキルセルロース(例えば、ヒドロキシエチルセルロース(HEC)、ヒドロキシプロピルセルロース(HPC)などのヒドロキシC2-4アルキルセルロースなど)、ヒドロキシアルキルアルキルセルロース(例えば、ヒドロキシプロピルメチルセルロースなどのヒドロキシC2-4アルキルC1-4アルキルセルロースなど)、カルボキシアルキルセルロース(カルボキシメチルセルロース(CMC)など)、アルキル-カルボキシアルキルセルロース(メチルカルボキシメチルセルロースなど)など]、これらの誘導体[例えば、カルボキシメチルセルロースナトリウムなどのCMC塩(アルカリ金属塩など)など]などが例示できる。 Examples of the cellulose ether include alkyl celluloses (eg, C 1-4 alkyl celluloses such as methyl cellulose and ethyl cellulose), hydroxyalkyl celluloses (eg, hydroxy C 2− such as hydroxyethyl cellulose (HEC) and hydroxypropyl cellulose (HPC)). 4- alkyl cellulose), hydroxyalkylalkyl cellulose (eg, hydroxy C 2-4 alkyl C 1-4 alkyl cellulose such as hydroxypropylmethyl cellulose), carboxyalkyl cellulose (such as carboxymethyl cellulose (CMC)), alkyl-carboxyalkyl cellulose (Such as methyl carboxymethyl cellulose)], derivatives thereof [for example, carboxymethyl cellulose sodium CMC salts (such as alkali metal salts)].
 これらのセルロース誘導体のうち、セルロースエステル、セルロースエーテルなどが好ましく、特に、セルロースエステル(セルロースアシレート)、例えば、セルロースアセテート、セルロースアセテートC3-4アシレートなどが好ましい。より具体的には、セルロース誘導体として、セルロースジアセテート、セルローストリアセテート、セルロースアセテートプロピオネート、セルロースアセテートブチレートなどのセルロースエステルを好適に用いてもよい。 Among these cellulose derivatives, cellulose esters and cellulose ethers are preferable, and cellulose esters (cellulose acylates) such as cellulose acetate and cellulose acetate C 3-4 acylate are particularly preferable. More specifically, cellulose esters such as cellulose diacetate, cellulose triacetate, cellulose acetate propionate, and cellulose acetate butyrate may be suitably used as the cellulose derivative.
 セルロース誘導体は、単独で又は二種以上組み合わせてもよい。 The cellulose derivatives may be used alone or in combination of two or more.
 [フルオレン化合物]
 フルオレン化合物は、9,9-ビスアリールフルオレン骨格を有していればよく、反応性基を有しない化合物[例えば、9,9-ビスアリールフルオレン(例えば、9,9-ビスフェニルフルオレン)などの後述の式(1)においてpが0である化合物など]であってもよいが、通常、反応性基を有している。
[Fluorene compound]
The fluorene compound only needs to have a 9,9-bisarylfluorene skeleton, such as a compound having no reactive group [for example, 9,9-bisarylfluorene (for example, 9,9-bisphenylfluorene), etc. A compound in which p is 0 in formula (1) described later] may be used, but usually has a reactive group.
 反応性基としては、例えば、ヒドロキシル基、メルカプト基、カルボキシル基、アミノ基、(メタ)アクリロイルオキシ基などの非エポキシ系反応性基が挙げられる。フルオレン化合物は、これらの反応性基を、単独で又は2種以上組み合わせて有していてもよい。 Examples of the reactive group include non-epoxy reactive groups such as a hydroxyl group, a mercapto group, a carboxyl group, an amino group, and a (meth) acryloyloxy group. The fluorene compound may have these reactive groups singly or in combination of two or more.
 反応性基は、9,9-ビスアリールフルオレンに直接的に結合していてもよく、適当な連結基(例えば、(ポリ)オキシアルキレン基など)を介して結合していてもよい。 The reactive group may be directly bonded to 9,9-bisarylfluorene, or may be bonded via an appropriate linking group (for example, a (poly) oxyalkylene group).
 具体的なフルオレン化合物としては、例えば、下記式(1)で表される化合物などが挙げられる。 Specific examples of the fluorene compound include a compound represented by the following formula (1).
Figure JPOXMLDOC01-appb-C000005
Figure JPOXMLDOC01-appb-C000005
[式中、環Zは芳香族炭化水素環、RおよびRは置換基、Xは、基-[(OR)n-Y](式中、Yは、ヒドロキシル基、メルカプト基、又は(メタ)アクリロイルオキシ基、Rはアルキレン基、nは0以上の整数を示す)又はアミノ基、kは0~4の整数、mは0以上の整数、pは1以上の整数を示す]。 [Wherein ring Z is an aromatic hydrocarbon ring, R 1 and R 2 are substituents, X is a group — [(OR 3 ) nY] (wherein Y is a hydroxyl group, a mercapto group, or A (meth) acryloyloxy group, R 3 is an alkylene group, n is an integer of 0 or more) or an amino group, k is an integer of 0 to 4, m is an integer of 0 or more, and p is an integer of 1 or more] .
 上記式(1)において、環Zで表される芳香族炭化水素環としては、ベンゼン環、縮合多環式芳香族炭化水素環[例えば、縮合二環式炭化水素(例えば、インデン、ナフタレンなどのC8-20縮合二環式炭化水素、好ましくはC10-16縮合二環式炭化水素)、縮合三環式炭化水素(例えば、アントラセン、フェナントレンなど)などの縮合二乃至四環式炭化水素など]、環集合炭化水素環(ビフェニル環、テルフェニル環、ビナフチル環などのビ又はテルC6-10アレーン環など)などが挙げられる。なお、2つの環Zは同一の又は異なる環であってもよく、通常、同一の環であってもよい。好ましい環Zには、ベンゼン環、ナフタレン環、ビフェニル環が含まれ、特に、ベンゼン環であってもよい。 In the above formula (1), examples of the aromatic hydrocarbon ring represented by the ring Z include a benzene ring, a condensed polycyclic aromatic hydrocarbon ring [for example, a condensed bicyclic hydrocarbon (for example, indene, naphthalene, etc. Condensed bicyclic to tetracyclic hydrocarbons such as C 8-20 condensed bicyclic hydrocarbons, preferably C 10-16 condensed bicyclic hydrocarbons), condensed tricyclic hydrocarbons (eg anthracene, phenanthrene, etc.), etc. A ring assembly hydrocarbon ring (bi or ter C 6-10 arene ring such as biphenyl ring, terphenyl ring or binaphthyl ring). The two rings Z may be the same or different rings, and may usually be the same ring. Preferred rings Z include a benzene ring, a naphthalene ring, and a biphenyl ring, and may be a benzene ring.
 前記式(1)において、基Rとしては、例えば、シアノ基、ハロゲン原子(フッ素原子、塩素原子、臭素原子など)、炭化水素基[例えば、アルキル基、アリール基(フェニル基などのC6-10アリール基)など]、アシル基(例えば、メチルカルボニル、エチルカルボニル、ペンチルカルボニルなどのアルキルカルボニル基)などの非反応性置換基が挙げられ、特に、アルキル基などである場合が多い。アルキル基としては、メチル基、エチル基、プロピル基、イソプロピル基、ブチル基、t-ブチル基などのC1-12アルキル基(例えば、C1-8アルキル基、特にメチル基などのC1-4アルキル基)などが例示できる。なお、kが複数(2~4)である場合、複数の基Rの種類は互いに同一又は異なっていてもよい。また、異なるベンゼン環に置換した基Rの種類は、同一又は異なっていてもよい。また、基Rの結合位置(置換位置)は、特に限定されず、例えば、フルオレン環の2位、7位、2および7位などが挙げられる。好ましい置換数kは、0~1、特に0である。なお、2つの置換数kは、同一又は異なっていてもよい。 In the formula (1), examples of the group R 1 include a cyano group, a halogen atom (a fluorine atom, a chlorine atom, a bromine atom, etc.), a hydrocarbon group [eg, an alkyl group, an aryl group (C 6 such as a phenyl group). -10 aryl group) and the like] and acyl groups (for example, alkylcarbonyl groups such as methylcarbonyl, ethylcarbonyl, pentylcarbonyl, etc.) and the like, and in particular, alkyl groups are often used. Examples of the alkyl group include C 1-12 alkyl groups such as a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, and a t-butyl group (for example, a C 1-8 alkyl group, particularly a C 1-1 such as a methyl group). 4 alkyl group) and the like. When k is plural (2 to 4), the types of the plural groups R 1 may be the same or different from each other. Moreover, the kind of group R < 1 > substituted by the different benzene ring may be the same or different. Further, the bonding position (substitution position) of the group R 1 is not particularly limited, and examples thereof include the 2nd, 7th, 2nd and 7th positions of the fluorene ring. The preferred substitution number k is 0 to 1, in particular 0. The two substitution numbers k may be the same or different.
 環Zに置換する置換基Rとしては、通常、非反応性置換基、例えば、アルキル基(例えば、メチル基、エチル基、プロピル基、イソプロピル基、ブチル基などのC1-12アルキル基、好ましくはC1-8アルキル基など)、シクロアルキル基(シクロへキシル基などのC5-8シクロアルキル基など)、アリール基(例えば、フェニル基、トリル基、キシリル基、ナフチル基などのC6-10アリール基など)、アラルキル基(ベンジル基、フェネチル基などのC6-10アリール-C1-4アルキル基など)などの炭化水素基;アルコキシ基(メトキシ基、エトキシ基などのC1-8アルコキシ基など)、シクロアルコキシ基(シクロへキシルオキシ基などのC5-10シクロアルキルオキシ基など)、アリールオキシ基(フェノキシ基などのC6-10アリールオキシ基)、アラルキルオキシ基(ベンジルオキシ基などのC6-10アリール-C1-4アルキルオキシ基)などの基-OR[式中、Rは炭化水素基(前記例示の炭化水素基など)を示す。];アルキルチオ基(メチルチオ基などのC1-8アルキルチオ基など)などの基-SR(式中、Rは前記と同じ。);アシル基(アセチル基などのC1-6アシル基など);アルコキシカルボニル基(メトキシカルボニル基などのC1-4アルコキシ-カルボニル基など);ハロゲン原子(フッ素原子、塩素原子、臭素原子、ヨウ素原子など);ニトロ基;シアノ基;置換アミノ基(例えば、ジメチルアミノ基などのジアルキルアミノ基など)などが挙げられる。 The substituent R 2 substituted on the ring Z is usually a non-reactive substituent, for example, an alkyl group (eg, a C 1-12 alkyl group such as a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, C 1-8 alkyl group etc.), cycloalkyl group (C 5-8 cycloalkyl group such as cyclohexyl group), aryl group (eg phenyl group, tolyl group, xylyl group, naphthyl group etc.) Hydrocarbon groups such as 6-10 aryl groups), aralkyl groups (C 6-10 aryl-C 1-4 alkyl groups such as benzyl and phenethyl groups); alkoxy groups (C 1 such as methoxy groups and ethoxy groups) -8 an alkoxy group), such as C 5-10 cycloalkyl group such as a cycloalkoxy group (hexyloxy group cyclohexylene), an aryloxy group (Fe C 6-10 aryloxy groups such as alkoxy groups), the radical -OR [expression such aralkyloxy groups (C 6-10 aryl -C 1-4 alkyl group such as a benzyl group), R is a hydrocarbon radical (Such as the hydrocarbon groups exemplified above). A group such as an alkylthio group (such as a C 1-8 alkylthio group such as a methylthio group) —SR (wherein R is as defined above); an acyl group (such as a C 1-6 acyl group such as an acetyl group); Alkoxycarbonyl group (C 1-4 alkoxy-carbonyl group such as methoxycarbonyl group); halogen atom (fluorine atom, chlorine atom, bromine atom, iodine atom etc.); nitro group; cyano group; substituted amino group (for example, dimethyl group) And a dialkylamino group such as an amino group).
 好ましい基Rとしては、炭化水素基[例えば、アルキル基(例えば、C1-6アルキル基)、シクロアルキル基(例えば、C5-8シクロアルキル基)、アリール基(例えば、C6-10アリール基)、アラルキル基(例えば、C6-8アリール-C1-2アルキル基)など]、アルコキシ基(C1-4アルコキシ基など)などが挙げられる。さらに好ましい基Rには、アルキル基[C1-4アルキル基(特にメチル基)など]、アリール基[例えば、C6-10アリール基(特にフェニル基)など]などが含まれる。なお、基Rがアリール基であるとき、基Rは、環Zとともに前記環集合炭化水素環を形成してもよい。 Preferred groups R 2 include hydrocarbon groups [eg, alkyl groups (eg, C 1-6 alkyl groups), cycloalkyl groups (eg, C 5-8 cycloalkyl groups), aryl groups (eg, C 6-10 Aryl group), aralkyl group (for example, C 6-8 aryl-C 1-2 alkyl group and the like), alkoxy group (C 1-4 alkoxy group and the like) and the like. Further preferred groups R 2 include an alkyl group [C 1-4 alkyl group (particularly methyl group) and the like], an aryl group [eg C 6-10 aryl group (particularly phenyl group) and the like] and the like. When the group R 2 is an aryl group, the group R 2 may form the ring assembly hydrocarbon ring together with the ring Z.
 なお、同一の環Zにおいて、mが複数(2以上)である場合、基Rの種類は互いに同一又は異なっていてもよい。また、2つの環Zにおいて、基Rの種類は同一又は異なっていてもよい。また、置換数mは、環Zの種類に応じて選択でき、例えば、0~8、好ましくは0~4(例えば、0~3)、さらに好ましくは0~2であってもよい。なお、異なる環Zにおいて、置換数mは、互いに同一又は異なっていてもよく、通常同一であってもよい。 In the same ring Z, when m is plural (two or more), the types of the groups R 2 may be the same or different from each other. In the two rings Z, the type of the group R 2 may be the same or different. The number of substitutions m can be selected according to the type of the ring Z, and may be, for example, 0 to 8, preferably 0 to 4 (eg, 0 to 3), and more preferably 0 to 2. In different rings Z, the number of substitutions m may be the same or different from each other, and may usually be the same.
 前記式(1)の基Xにおいて、基Rで表されるアルキレン基としては、例えば、エチレン基、プロピレン基、トリメチレン基、1,2-ブタンジイル基、テトラメチレン基などのC2-6アルキレン基、好ましくはC2-4アルキレン基、さらに好ましくはC2-3アルキレン基が挙げられる。なお、nが2以上であるとき、アルキレン基の種類は異なるアルキレン基で構成されていてもよく、通常、同一のアルキレン基で構成されていてもよい。また、2つの芳香族炭化水素環Zにおいて、基Rの種類は同一又は異なっていてもよく、通常同一であってもよい。 In the group X of the formula (1), examples of the alkylene group represented by the group R 3 include C 2-6 alkylene such as ethylene group, propylene group, trimethylene group, 1,2-butanediyl group, and tetramethylene group. A group, preferably a C 2-4 alkylene group, and more preferably a C 2-3 alkylene group. When n is 2 or more, the type of alkylene group may be composed of different alkylene groups, and may be generally composed of the same alkylene group. In the two aromatic hydrocarbon rings Z, the types of the groups R 3 may be the same or different, and may be usually the same.
 オキシアルキレン基(OR)の数(付加モル数)nは、0以上(例えば、0~20)であればよく、例えば、0~15(例えば、1~12)、好ましくは0~10(例えば、1~6)、さらに好ましくは0~4(例えば、1~4)、特に0~2(例えば、0~1)であってもよい。また、樹脂の種類によっては、nが0である場合又はnが1以上である場合において、顕著な改善効果が得られる場合などがある。そのため、樹脂の種類などによって、nが0である化合物、nが1以上である化合物のいずれかを選択してもよい。なお、置換数nは、異なる環Zに対して、同一又は異なっていてもよい。 The number (addition mole number) n of oxyalkylene groups (OR 3 ) may be 0 or more (for example, 0 to 20), for example, 0 to 15 (for example, 1 to 12), preferably 0 to 10 ( For example, it may be 1 to 6), more preferably 0 to 4 (eg 1 to 4), particularly 0 to 2 (eg 0 to 1). Further, depending on the type of resin, there may be a case where a remarkable improvement effect is obtained when n is 0 or when n is 1 or more. Therefore, either a compound in which n is 0 or a compound in which n is 1 or more may be selected depending on the type of resin. The number of substitutions n may be the same or different for different rings Z.
 好ましいXは、基-[(OR)n-Y]であり、特に、Yはヒドロキシル基であるのが好ましい。なお、式(1)において、Yがヒドロキシル基である化合物は、下記式(1A)で表される。 Preferred X is a group — [(OR 3 ) nY], and particularly Y is preferably a hydroxyl group. In addition, in Formula (1), the compound whose Y is a hydroxyl group is represented by following formula (1A).
Figure JPOXMLDOC01-appb-C000006
Figure JPOXMLDOC01-appb-C000006
(式中、Z、R、R、k、m、R、n、pは前記式(1)と同じ)。 (In the formula, Z, R 1 , R 2 , k, m, R 3 , n, and p are the same as those in the formula (1)).
 基Xの置換数pは、1以上(例えば、1~6)であればよく、例えば、1~4、好ましくは1~3、さらに好ましくは1~2、特に1であってもよい。なお、置換数pは、それぞれの環Zにおいて、同一又は異なっていてもよく、通常、同一である場合が多い。 The substitution number p of the group X may be 1 or more (for example, 1 to 6), for example, 1 to 4, preferably 1 to 3, more preferably 1 to 2, particularly 1. In addition, the substitution number p may be the same or different in each ring Z, and is usually the same in many cases.
 また、前記式(1)[又は(1A)]において、基Xの置換位置は、特に限定されず、環Zの適当な置換位置に置換していればよい。例えば、基Xは、環Zがベンゼン環である場合、フェニル基の2~6位に置換していればよく、好ましくは4位に置換していてもよい。また、基Xは、環Zが縮合多環式炭化水素環である場合、縮合多環式炭化水素環において、フルオレンの9位に結合した炭化水素環とは別の炭化水素環(例えば、ナフタレン環の5位、6位など)に少なくとも置換している場合が多い。 In the formula (1) [or (1A)], the substitution position of the group X is not particularly limited, and it may be substituted at an appropriate substitution position on the ring Z. For example, when the ring Z is a benzene ring, the group X may be substituted at the 2-6 position of the phenyl group, and may preferably be substituted at the 4 position. In addition, when the ring Z is a condensed polycyclic hydrocarbon ring, the group X is a hydrocarbon ring different from the hydrocarbon ring bonded to the 9-position of fluorene in the condensed polycyclic hydrocarbon ring (for example, naphthalene In many cases, the ring is substituted at least on the 5th and 6th positions of the ring.
 具体的なフルオレン化合物(又は前記式(1)又は(1A)で表される化合物)には、9,9-ビス(ヒドロキシアリール)フルオレン類[又は9,9-ビス(ヒドロキシアリール)フルオレン骨格を有する化合物、例えば、9,9-ビス(ヒドロキシフェニル)フルオレン類、9,9-ビス(ヒドロキシナフチル)フルオレン類]、9,9-ビス(ヒドロキシ(ポリ)アルコキシアリール)フルオレン類[又は9,9-ビス(ヒドロキシ(ポリ)アルコキシアリール)フルオレン骨格を有する化合物、例えば、9,9-ビス(ヒドロキシ(ポリ)アルコキシフェニル)フルオレン類、9,9-ビス(ヒドロキシ(ポリ)アルコキシナフチル)フルオレン類]などの前記式(1)においてXが基-[(OR)n-OH]である化合物;これらの化合物において、ヒドロキシル基が、メルカプト基、又は(メタ)アクリロイルオキシ基に置換した化合物などが含まれる。 Specific fluorene compounds (or compounds represented by the above formula (1) or (1A)) include 9,9-bis (hydroxyaryl) fluorenes [or 9,9-bis (hydroxyaryl) fluorene skeletons. Compounds having, for example, 9,9-bis (hydroxyphenyl) fluorenes, 9,9-bis (hydroxynaphthyl) fluorenes], 9,9-bis (hydroxy (poly) alkoxyaryl) fluorenes [or 9,9 -Compounds having a bis (hydroxy (poly) alkoxyaryl) fluorene skeleton, such as 9,9-bis (hydroxy (poly) alkoxyphenyl) fluorenes, 9,9-bis (hydroxy (poly) alkoxynaphthyl) fluorenes] X is a group in the formula (1), such as - [(OR 3) n- OH] , compound; this In al compounds, hydroxyl group, and the like mercapto group, or (meth) acrylate compound substituted acryloyloxy group.
 9,9-ビス(ヒドロキシフェニル)フルオレン類には、例えば、9,9-ビス(ヒドロキシフェニル)フルオレン[例えば、9,9-ビス(4-ヒドロキシフェニル)フルオレン]、9,9-ビス(アルキル-ヒドロキシフェニル)フルオレン[例えば、9,9-ビス(4-ヒドロキシ-3-メチルフェニル)フルオレン、9,9-ビス(4-ヒドロキシ-3,5-ジメチルフェニル)フルオレンなどの9,9-ビス(モノ又はジC1-4アルキル-ヒドロキシフェニル)フルオレン]、9,9-ビス(アリール-ヒドロキシフェニル)フルオレン[例えば、9,9-ビス(4-ヒドロキシ-3-フェニルフェニル)フルオレンなどの9,9-ビス(モノ又はジC6-10アリール-ヒドロキシフェニル)フルオレン]、9,9-ビス(ポリヒドロキシフェニル)フルオレン[例えば、9,9-ビス(3,4-ジヒドロキシフェニル)フルオレン、9,9-ビス(2,4-ジヒドロキシフェニル)フルオレンなどの9,9-ビス(ジ又はトリヒドロキシフェニル)フルオレン]などが挙げられる。 The 9,9-bis (hydroxyphenyl) fluorenes include, for example, 9,9-bis (hydroxyphenyl) fluorene [for example, 9,9-bis (4-hydroxyphenyl) fluorene], 9,9-bis (alkyl 9,9-bis such as 9,9-bis (4-hydroxy-3-methylphenyl) fluorene, 9,9-bis (4-hydroxy-3,5-dimethylphenyl) fluorene (Mono or di C 1-4 alkyl-hydroxyphenyl) fluorene], 9,9-bis (aryl-hydroxyphenyl) fluorene [eg, 9,9-bis (4-hydroxy-3-phenylphenyl) fluorene, etc. , 9-bis (mono- or di-C 6-10 aryl - hydroxyphenyl) fluorene], 9,9-bis ( Rehydroxyphenyl) fluorene [for example, 9,9-bis (di or trihydroxyphenyl) such as 9,9-bis (3,4-dihydroxyphenyl) fluorene, 9,9-bis (2,4-dihydroxyphenyl) fluorene ) Fluorene].
 また、9,9-ビス(ヒドロキシナフチル)フルオレン類としては、前記9,9-ビス(ヒドロキシフェニル)フルオレン類に対応し、フェニル基がナフチル基に置換した化合物、例えば、9,9-ビス(ヒドロキシナフチル)フルオレン[例えば、9,9-ビス(6-ヒドロキシ-2-ナフチル)フルオレン、9,9-ビス(5-ヒドロキシ-1-ナフチル)フルオレン]などが含まれる。 The 9,9-bis (hydroxynaphthyl) fluorenes correspond to the 9,9-bis (hydroxyphenyl) fluorenes, and are compounds in which the phenyl group is substituted with a naphthyl group, for example, 9,9-bis ( Hydroxynaphthyl) fluorene [eg, 9,9-bis (6-hydroxy-2-naphthyl) fluorene, 9,9-bis (5-hydroxy-1-naphthyl) fluorene] and the like.
 9,9-ビス(ヒドロキシ(ポリ)アルコキシフェニル)フルオレン類には、例えば、9,9-ビス(ヒドロキシアルコキシフェニル)フルオレン{例えば、9,9-ビス[4-(2-ヒドロキシエトキシ)フェニル]フルオレン、9,9-ビス[4-(2-ヒドロキシプロポキシ)フェニル]フルオレンなどの9,9-ビス(ヒドロキシC2-4アルコキシフェニル)フルオレン}、9,9-ビス(アルキル-ヒドロキシアルコキシフェニル)フルオレン{例えば、9,9-ビス[4-(2-ヒドロキシエトキシ)-3-メチルフェニル]フルオレン、9,9-ビス[4-(2-ヒドロキシプロポキシ)-3-メチルフェニル]フルオレン、9,9-ビス[4-(2-ヒドロキシエトキシ)-3,5-ジメチルフェニル]フルオレンなどの9,9-ビス(モノ又はジC1-4アルキル-ヒドロキシC2-4アルコキシフェニル)フルオレン}、9,9-ビス(アリール-ヒドロキシアルコキシフェニル)フルオレン{例えば、9,9-ビス[4-(2-ヒドロキシエトキシ)-3-フェニルフェニル]フルオレン、9,9-ビス[4-(2-ヒドロキシプロポキシ)-3-フェニルフェニル]フルオレンなどの9,9-ビス(モノ又はジC6-10アリール-ヒドロキシC2-4アルコキシフェニル)フルオレン}などの9,9-ビス(ヒドロキシアルコキシフェニル)フルオレン類(前記式(1)において、nが1である化合物);9,9-ビス(ヒドロキシジアルコキシフェニル)フルオレン{例えば、9,9-ビス{4-[2-(2-ヒドロキシエトキシ)エトキシ]フェニル}フルオレンなどの9,9-ビス(ヒドロキシジC2-4アルコキシフェニル)フルオレン}などの9,9-ビス(ヒドロキシポリアルコキシフェニル)フルオレン類(前記式(1)において、nが2以上である化合物)などが含まれる。 9,9-bis (hydroxy (poly) alkoxyphenyl) fluorenes include, for example, 9,9-bis (hydroxyalkoxyphenyl) fluorene {eg, 9,9-bis [4- (2-hydroxyethoxy) phenyl] fluorene, 9,9-bis [4- (2-hydroxypropoxy) phenyl] fluorene such as 9,9-bis (hydroxy C 2-4 alkoxyphenyl) fluorene}, 9,9-bis (alkyl - hydroxy alkoxyphenyl) Fluorene {eg, 9,9-bis [4- (2-hydroxyethoxy) -3-methylphenyl] fluorene, 9,9-bis [4- (2-hydroxypropoxy) -3-methylphenyl] fluorene, Such as 9-bis [4- (2-hydroxyethoxy) -3,5-dimethylphenyl] fluorene 9,9-bis (mono or di C 1-4 alkyl-hydroxy C 2-4 alkoxyphenyl) fluorene}, 9,9-bis (aryl-hydroxyalkoxyphenyl) fluorene {eg, 9,9-bis [4- 9,9-bis (mono or di C 6-10 ) such as (2-hydroxyethoxy) -3-phenylphenyl] fluorene, 9,9-bis [4- (2-hydroxypropoxy) -3-phenylphenyl] fluorene 9,9-bis (hydroxyalkoxyphenyl) fluorenes such as aryl- hydroxyC 2-4 alkoxyphenyl) fluorene} (a compound in which n is 1 in the formula (1)); 9,9-bis (hydroxydi) Alkoxyphenyl) fluorene {eg, 9,9-bis {4- [2- (2-hydroxyethoxy) ethoxy] phenyl Eniru} 9,9-bis (hydroxy polyalkoxy phenyl) fluorene such as 9,9-bis fluorene (hydroxy-di-C 2-4 alkoxyphenyl) fluorene} (In Formula (1), with n is 2 or more A certain compound) and the like.
 また、9,9-ビス(ヒドロキシ(ポリ)アルコキシナフチル)フルオレン類としては、前記9,9-ビス(ヒドロキシ(ポリ)アルコキシフェニル)フルオレン類に対応し、フェニル基がナフチル基に置換した化合物、例えば、9,9-ビス(ヒドロキシアルコキシナフチル)フルオレン{例えば、9,9-ビス[6-(2-ヒドロキシエトキシ)-2-ナフチル]フルオレン、9,9-ビス[6-(2-ヒドロキシプロポキシ)-2-ナフチル]フルオレンなどの9,9-ビス(ヒドロキシC2-4アルコキシナフチル)フルオレン}などの9,9-ビス(ヒドロキシアルコキシナフチル)フルオレン類などが含まれる。 Further, as 9,9-bis (hydroxy (poly) alkoxynaphthyl) fluorenes, compounds corresponding to the 9,9-bis (hydroxy (poly) alkoxyphenyl) fluorenes, wherein a phenyl group is substituted with a naphthyl group, For example, 9,9-bis (hydroxyalkoxynaphthyl) fluorene {eg, 9,9-bis [6- (2-hydroxyethoxy) -2-naphthyl] fluorene, 9,9-bis [6- (2-hydroxypropoxy) 9,9-bis (hydroxyalkoxynaphthyl) fluorenes such as 9,9-bis (hydroxyC 2-4 alkoxynaphthyl) fluorene} such as) -2-naphthyl] fluorene.
 これらのフルオレン化合物のうち、特に、9,9-ビス(ヒドロキシフェニル)フルオレン、9,9-ビス(アルキル-ヒドロキシフェニル)フルオレン[例えば、9,9-ビス(モノ又はジC1-4アルキル-ヒドロキシフェニル)フルオレン]、9,9-ビス(アリール-ヒドロキシフェニル)フルオレン[例えば、9,9-ビス(モノ又はジC6-10アリール-ヒドロキシフェニル)フルオレン]、9,9-ビス(ジ又はトリヒドロキシフェニル)フルオレン、9,9-ビス(ヒドロキシナフチル)フルオレンなどの前記式(1A)においてnが0である化合物;9,9-ビス(ヒドロキシアルコキシフェニル)フルオレン{例えば、9,9-ビス(ヒドロキシC2-4アルコキシフェニル)フルオレン}、9,9-ビス(アルキル-ヒドロキシアルコキシフェニル)フルオレン{例えば、9,9-ビス(モノ又はジC1-4アルキル-ヒドロキシC2-4アルコキシフェニル)フルオレン}、9,9-ビス(アリール-ヒドロキシアルコキシフェニル)フルオレン{例えば、9,9-ビス(モノ又はジC6-10アリール-ヒドロキシC2-4アルコキシフェニル)フルオレン}、9,9-ビス(ヒドロキシアルコキシナフチル)フルオレン{例えば、9,9-ビス(ヒドロキシC2-4アルコキシナフチル)フルオレン}などの前記式(1A)においてnが1以上(例えば、1~4、好ましくは1~2、さらに好ましくは1)である化合物が好ましい。特に、エポキシ化合物による波長分散性の均一化効果が顕著に表れる点から、9,9-ビス(ヒドロキシエトキシフェニル)フルオレンなどの9,9-ビス(ヒドロキシアルコキシフェニル)フルオレンであってもよい。 Among these fluorene compounds, in particular, 9,9-bis (hydroxyphenyl) fluorene, 9,9-bis (alkyl-hydroxyphenyl) fluorene [for example, 9,9-bis (mono or di C 1-4 alkyl- Hydroxyphenyl) fluorene], 9,9-bis (aryl-hydroxyphenyl) fluorene [eg, 9,9-bis (mono or diC 6-10 aryl-hydroxyphenyl) fluorene], 9,9-bis (di or A compound in which n is 0 in the above formula (1A) such as trihydroxyphenyl) fluorene and 9,9-bis (hydroxynaphthyl) fluorene; 9,9-bis (hydroxyalkoxyphenyl) fluorene {eg, 9,9-bis (hydroxy C 2-4 alkoxyphenyl) fluorene}, 9,9-bis (alkyl - hydroxy alkoxyphenyl) fluorene {e.g., 9,9-bis (mono- or di-C 1-4 alkyl - hydroxy C 2-4 alkoxyphenyl) fluorene}, 9,9-bis (aryl - hydroxyalkoxy phenyl) fluorene {e.g. 9,9-bis (mono or di C 6-10 aryl-hydroxy C 2-4 alkoxyphenyl) fluorene}, 9,9-bis (hydroxyalkoxynaphthyl) fluorene {eg, 9,9-bis (hydroxy C 2 A compound in which n is 1 or more (for example, 1 to 4, preferably 1 to 2, more preferably 1) in the above formula (1A) such as -4alkoxynaphthyl) fluorene} is preferable. In particular, 9,9-bis (hydroxyalkoxyphenyl) fluorene such as 9,9-bis (hydroxyethoxyphenyl) fluorene may be used from the standpoint that the effect of homogenizing wavelength dispersion by the epoxy compound appears remarkably.
 フルオレン化合物は、単独で又は2種以上組み合わせてもよい。 Fluorene compounds may be used alone or in combination of two or more.
 なお、フルオレン化合物は、市販品を用いてもよく、慣用の方法により合成したものを用いてもよい。 In addition, a commercial item may be used for a fluorene compound, and what was synthesize | combined by the conventional method may be used.
 フルオレン化合物の割合は、例えば、樹脂100重量部に対して、0.1重量部以上(例えば、0.2~200重量部)程度の範囲から選択でき、0.3~100重量部、好ましくは0.5~80重量部、さらに好ましくは1~50重量部程度であってもよく、通常0.5~50重量部(例えば、0.5~40重量部、好ましくは0.7~30重量部、さらに好ましくは1~20重量部、特に2~18重量部、特に好ましくは3~15重量部)程度であってもよい。特に、エポキシ化合物による波長分散性の均一化効果が顕著に表れる点から、フルオレン化合物の割合は、樹脂100重量部に対して5~15重量部(特に8~13重量部)程度であってもよい。 The ratio of the fluorene compound can be selected, for example, from the range of about 0.1 parts by weight or more (for example, 0.2 to 200 parts by weight) with respect to 100 parts by weight of the resin. It may be 0.5 to 80 parts by weight, more preferably about 1 to 50 parts by weight, usually 0.5 to 50 parts by weight (for example, 0.5 to 40 parts by weight, preferably 0.7 to 30 parts by weight). Parts, more preferably 1 to 20 parts by weight, particularly 2 to 18 parts by weight, particularly preferably 3 to 15 parts by weight). In particular, since the effect of homogenizing the wavelength dispersion by the epoxy compound appears remarkably, the ratio of the fluorene compound is 5 to 15 parts by weight (particularly 8 to 13 parts by weight) with respect to 100 parts by weight of the resin. Good.
 本発明では、フルオレン化合物の使用割合を、樹脂100重量部に対して、20重量部以下(例えば、0.1~18重量部)、好ましくは15重量部以下(例えば、0.2~12重量部)、さらに好ましくは10重量部以下(例えば、0.3~7重量部)、特に5重量部以下(例えば、0.5~5重量部)とすることもできる。 In the present invention, the proportion of the fluorene compound used is 20 parts by weight or less (for example, 0.1 to 18 parts by weight), preferably 15 parts by weight or less (for example, 0.2 to 12 parts by weight) with respect to 100 parts by weight of the resin. Part), more preferably 10 parts by weight or less (for example, 0.3 to 7 parts by weight), particularly 5 parts by weight or less (for example, 0.5 to 5 parts by weight).
 また、本発明では、比較的多い割合でフルオレン化合物を添加しても樹脂特性を高いレベルで維持又は向上できる場合が多い。そのため、フルオレン化合物の使用割合を、樹脂100重量部に対して、20重量部以上(例えば、20~100重量部)、好ましくは25重量部以上(例えば、25~80重量部)、さらに好ましくは30重量部以上(例えば、30~70重量部)とすることもできる。 In the present invention, the resin properties can often be maintained or improved at a high level even if a relatively large proportion of the fluorene compound is added. Therefore, the proportion of the fluorene compound used is 20 parts by weight or more (for example, 20 to 100 parts by weight), preferably 25 parts by weight or more (for example, 25 to 80 parts by weight), more preferably 100 parts by weight of the resin. It may be 30 parts by weight or more (for example, 30 to 70 parts by weight).
 [エポキシ化合物]
 エポキシ化合物(又はエポキシ樹脂)としては、単官能エポキシ化合物(単官能性エポキシ化合物)、多官能エポキシ化合物(多官能性エポキシ化合物)に大別できる。単官能エポキシ化合物としては、例えば、グリシジルエーテル類(モノグリシジルエーテル)[例えば、アルキルグリシジルエーテル(例えば、2-エチルへキシルグリシジルエーテルなど)アルケニルグリシジルエーテル(例えば、アリルグリシジルエーテルなど)、アリールグリシジルエーテル(例えば、フェニルグリシジルエーテル、p-t-ブチルフェニルグリシジルエーテルなど)、これらの化合物に対応するアルキレンオキサイド付加体のグリシジルエーテル(例えば、フェノールのアルキレンオキサイド付加体のグリシジルエーテル)など]、アルケンオキサイド類(例えば、オクチレンオキサイド、スチレンオキサイドなど)などが挙げられる。単官能性エポキシ化合物は、単独で又は2種以上組み合わせてもよい。
[Epoxy compound]
The epoxy compound (or epoxy resin) can be roughly classified into a monofunctional epoxy compound (monofunctional epoxy compound) and a polyfunctional epoxy compound (polyfunctional epoxy compound). Examples of monofunctional epoxy compounds include glycidyl ethers (monoglycidyl ether) [eg, alkyl glycidyl ether (eg, 2-ethylhexyl glycidyl ether), alkenyl glycidyl ether (eg, allyl glycidyl ether), aryl glycidyl ether, etc. (Eg, phenyl glycidyl ether, pt-butylphenyl glycidyl ether, etc.), glycidyl ethers of alkylene oxide adducts corresponding to these compounds (eg, glycidyl ethers of alkylene oxide adducts of phenol), etc.], alkene oxides (For example, octylene oxide, styrene oxide, etc.). Monofunctional epoxy compounds may be used alone or in combination of two or more.
 多官能性エポキシ化合物は、例えば、ジグリシジルエーテル、アルカンジオールジグリシジルエーテル(例えば、ブタンジオールジグリシジルエーテル、ネオペンチルグリコールジグリシジルエーテル、1,6-ヘキサンジオールジグリシジルエーテルなどのC2-10アルカンジオールジグリシジルエーテル)、ポリアルカンジオールジグリシジルエーテル(例えば、ポリプロピレングリコールジグリシジルエーテルなどのポリC2-4アルカンジオージグリシジルエーテル)、シクロアルカンジアルカノールジグリシジルエーテル(例えば、シクロヘキサンジメタノールジグリシジルエーテルなどのC4-10シクロアルカンジC1-4アルカノールジグリシジルエーテル)、3以上のヒドロキシル基を有する脂肪族ポリオールのポリグリシジルエーテル[例えば、アルカントリ乃至ヘキサオールのジ乃至ヘキサグリシジルエーテル(例えば、トリメチロールプロパンジ又はトリグリシジルエーテル、グリセリンジ又はトリグリシジルエーテルなどのC3-10アルカントリ又はテトラオールのジ又はトリグリシジルエーテル)など]、ビスフェノール型エポキシ樹脂(ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂などの前記例示のビスフェノール類とエピクロロヒドリンとの反応物)、臭素化ビスフェノール型エポキシ樹脂、フェノール型エポキシ樹脂(フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂など)、グリコール型エポキシ樹脂[例えば、ビスフェノール類(ビスフェノールAなど)又はその水添物のアルキレンオキシド付加体とエピクロロヒドリンとの反応物など]、ジシクロペンタジエン型エポキシ樹脂、ポリ(グリシジルオキシフェニル)アルカン[例えば、1,1,2,2-テトラキス(4-グリシジルオキシフェニル)エタン、1,1,1-トリス(グリシジルオキシフェニル)メタンなどのトリ又はテトラ(グリシジルオキシフェニル)C1-4アルカン]、ナフタレン骨格を有するグリシジルエーテル化合物[例えば、1,5-ジ(グリシジルオキシ)ナフタレン、1,6-ジ(グリシジルオキシ)ナフタレン、2,6-ジ(グリシジルオキシ)ナフタレン、2,7-ジ(グリシジルオキシ)ナフタレン、2,7-ジ(2-メチル-2,3-エポキシプロピルオキシ)ナフタレン、2,2’-ジグリシジルオキシビナフタレンなどのジ(グリシジルオキシ)ナフタレン、ビス(2-グリジルオキシナフチル)メタンなどのビス(グリシジルオキシナフチル)C1-6アルカンなどのジグリシジルオキシナフタレン類、これらのジ(グリシジルオキシ)ナフタレン類が直接結合又は連結基(例えば、メチレン基、エチレン基などのアルキレン基又はアルキリデン基など)を介して連結されたテトラグリシジルエーテル(例えば、ビス[2,7-ジ(グリシジルオキシ)ナフチル]メタンなど)など]、キサンテン骨格を有するグリシジルエーテル化合物(例えば、9-フェニル-2,7-ジグリシジルオキシ-1,3,4,5,6,8-ヘキサメチルキサンテンなど)などのグリシジルエーテル型エポキシ化合物;グリシジルエステル型エポキシ化合物[例えば、芳香族ジカルボン酸(フタル酸など)又はその水添物(テトラヒドロフタル酸、ヘキサヒドロフタル酸など)とエピクロロヒドリンとの反応物、ダイマー酸グリシジルエステルなど];グリシジルアミン型エポキシ化合物(例えば、ジグリシジルアニリン、テトラグリシジルジアミノジフェニルメタン、トリグリシジルパラアミノフェノール、N,N-ジグリシジル-4-グリシジルオキシアニリンなど);アルケニルシクロアルケンジオキシド(例えば、ビニルシクロヘキセンジオキサイドなど);トリグリシジルイソシアヌレートなどが含まれる。 Examples of the polyfunctional epoxy compound include diglycidyl ether, alkanediol diglycidyl ether (for example, C 2-10 alkane such as butanediol diglycidyl ether, neopentyl glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether). Diol diglycidyl ether), polyalkane diol diglycidyl ether (eg, poly C 2-4 alkane diaudiglycidyl ether such as polypropylene glycol diglycidyl ether), cycloalkane dialkanol diglycidyl ether (eg cyclohexane dimethanol diglycidyl ether) C 4-10 cycloalkanedi-C 1-4 alkanol diglycidyl ether)), aliphatic polyol poly having 3 or more hydroxyl groups Glycidyl ethers [for example, di- or triglycidyls of C 3-10 alkanetri- or tetraols such as di- to hexa-glycidyl ethers of alkane tri to hexaols (eg trimethylolpropane di or triglycidyl ethers, glycerin di or triglycidyl ethers) Ether), etc.], bisphenol type epoxy resin (reaction product of the above-mentioned bisphenols such as bisphenol A type epoxy resin and bisphenol F type epoxy resin and epichlorohydrin), brominated bisphenol type epoxy resin, phenol type epoxy resin (Phenol novolac type epoxy resin, cresol novolac type epoxy resin, etc.), glycol type epoxy resin [for example, bisphenols (bisphenol A etc.) or its hydrogenated alkyl A reaction product of a lenoxide adduct and epichlorohydrin], a dicyclopentadiene type epoxy resin, a poly (glycidyloxyphenyl) alkane [for example, 1,1,2,2-tetrakis (4-glycidyloxyphenyl) ethane, Tri- or tetra (glycidyloxyphenyl) C 1-4 alkane such as 1,1,1-tris (glycidyloxyphenyl) methane], a glycidyl ether compound having a naphthalene skeleton [for example, 1,5-di (glycidyloxy) naphthalene 1,6-di (glycidyloxy) naphthalene, 2,6-di (glycidyloxy) naphthalene, 2,7-di (glycidyloxy) naphthalene, 2,7-di (2-methyl-2,3-epoxypropyl) Oxy) naphthalene, 2,2'-diglycidyloxybinaphthalene, etc. (Glycidyloxy) naphthalene, bis (2-glycidyl Jill oxy naphthyl) diglycidyl sulfopropyl such as bis (glycidyloxy naphthyl) C 1-6 alkanes such as methane, binding these di (glycidyloxy) naphthalenes directly or Tetraglycidyl ether (eg bis [2,7-di (glycidyloxy) naphthyl] methane etc.) linked via a linking group (eg alkylene group such as methylene group, ethylene group or alkylidene group)], Glycidyl ether type epoxy compounds such as glycidyl ether compounds having a xanthene skeleton (for example, 9-phenyl-2,7-diglycidyloxy-1,3,4,5,6,8-hexamethylxanthene); glycidyl ester type Epoxy compounds [eg aromatic dica Boric acid (such as phthalic acid) or a hydrogenated product thereof (tetrahydrophthalic acid, hexahydrophthalic acid, etc.) and epichlorohydrin, dimer acid glycidyl ester, etc.]; glycidylamine type epoxy compound (eg, diglycidyl) Aniline, tetraglycidyldiaminodiphenylmethane, triglycidylparaaminophenol, N, N-diglycidyl-4-glycidyloxyaniline, etc.); alkenylcycloalkene dioxide (eg, vinylcyclohexenedioxide, etc.);
 また、多官能性エポキシ化合物(特に、グリシジルエーテル型エポキシ化合物)には、フルオレン骨格を有するエポキシ化合物(多官能性エポキシ化合物)も含まれる。フルオレン骨格を有するエポキシ化合物としては、下記式(1B)で表される化合物(すなわち、前記式(1)のXにおいて、Yがグリシジルオキシ基である化合物)などが挙げられる。 Also, the polyfunctional epoxy compound (particularly, glycidyl ether type epoxy compound) includes an epoxy compound having a fluorene skeleton (polyfunctional epoxy compound). Examples of the epoxy compound having a fluorene skeleton include a compound represented by the following formula (1B) (that is, a compound in which Y is a glycidyloxy group in X of the formula (1)).
Figure JPOXMLDOC01-appb-C000007
Figure JPOXMLDOC01-appb-C000007
(式中、Z、R、R、k、m、R、n、pは前記式(1)と同じ)。 (In the formula, Z, R 1 , R 2 , k, m, R 3 , n, and p are the same as those in the formula (1)).
 具体的なフルオレン骨格を有するエポキシ化合物(又は前記式(1B)で表される化合物)には、9,9-ビス(グリシジルオキシアリール)フルオレン類[又は9,9-ビス(グリシジルオキシアリール)フルオレン骨格を有する化合物、例えば、9,9-ビス(グリシジルオキシフェニル)フルオレン類、9,9-ビス(グリシジルオキシナフチル)フルオレン類]、9,9-ビス(グリシジルオキシ(ポリ)アルコキシアリール)フルオレン類[又は9,9-ビス(グリシジルオキシ(ポリ)アルコキシアリール)フルオレン骨格を有する化合物、例えば、9,9-ビス(グリシジルオキシ(ポリ)アルコキシフェニル)フルオレン類、9,9-ビス(グリシジルオキシ(ポリ)アルコキシナフチル)フルオレン類]などが含まれる。 Specific epoxy compounds having a fluorene skeleton (or a compound represented by the formula (1B)) include 9,9-bis (glycidyloxyaryl) fluorenes [or 9,9-bis (glycidyloxyaryl) fluorenes. Compounds having a skeleton, such as 9,9-bis (glycidyloxyphenyl) fluorenes, 9,9-bis (glycidyloxynaphthyl) fluorenes], 9,9-bis (glycidyloxy (poly) alkoxyaryl) fluorenes [Or a compound having a 9,9-bis (glycidyloxy (poly) alkoxyaryl) fluorene skeleton, such as 9,9-bis (glycidyloxy (poly) alkoxyphenyl) fluorenes, 9,9-bis (glycidyloxy ( Poly) alkoxynaphthyl) fluorenes] and the like
 9,9-ビス(グリシジルオキシフェニル)フルオレン類には、例えば、9,9-ビス(グリシジルオキシフェニル)フルオレン[例えば、9,9-ビス(4-グリシジルオキシフェニル)フルオレン]、9,9-ビス(アルキル-グリシジルオキシフェニル)フルオレン[例えば、9,9-ビス(4-グリシジルオキシ-3-メチルフェニル)フルオレン、9,9-ビス(4-グリシジルオキシ-3,5-ジメチルフェニル)フルオレンなどの9,9-ビス(モノ又はジC1-4アルキル-グリシジルオキシフェニル)フルオレン]、9,9-ビス(アリール-グリシジルオキシフェニル)フルオレン[例えば、9,9-ビス(4-グリシジルオキシ-3-フェニルフェニル)フルオレンなどの9,9-ビス(モノ又はジC6-10アリール-グリシジルオキシフェニル)フルオレン]、9,9-ビス(ポリグリシジルオキシフェニル)フルオレン[例えば、9,9-ビス(3,4-ジグリシジルオキシフェニル)フルオレン、9,9-ビス(2,4-ジグリシジルオキシフェニル)フルオレンなどの9,9-ビス(ジ又はトリグリシジルオキシフェニル)フルオレン]などが挙げられる。 9,9-bis (glycidyloxyphenyl) fluorenes include, for example, 9,9-bis (glycidyloxyphenyl) fluorene [eg, 9,9-bis (4-glycidyloxyphenyl) fluorene], 9,9- Bis (alkyl-glycidyloxyphenyl) fluorene [eg, 9,9-bis (4-glycidyloxy-3-methylphenyl) fluorene, 9,9-bis (4-glycidyloxy-3,5-dimethylphenyl) fluorene, etc. 9,9-bis (mono- or di-C 1-4 alkyl-glycidyloxyphenyl) fluorene], 9,9-bis (aryl-glycidyloxyphenyl) fluorene [for example, 9,9-bis (4-glycidyloxy- 9,9-bis such as 3-phenylphenyl) fluorene (mono- or di-C 6-10 ants Ru-glycidyloxyphenyl) fluorene], 9,9-bis (polyglycidyloxyphenyl) fluorene [eg, 9,9-bis (3,4-diglycidyloxyphenyl) fluorene, 9,9-bis (2,4 9,9-bis (di- or triglycidyloxyphenyl) fluorene such as -diglycidyloxyphenyl) fluorene].
 また、9,9-ビス(グリシジルオキシナフチル)フルオレン類としては、前記9,9-ビス(グリシジルオキシフェニル)フルオレン類に対応し、フェニル基がナフチル基に置換した化合物、例えば、9,9-ビス(グリシジルオキシナフチル)フルオレン[例えば、9,9-ビス(6-グリシジルオキシ-2-ナフチル)フルオレン、9,9-ビス(5-グリシジルオキシ-1-ナフチル)フルオレン]などが含まれる。 The 9,9-bis (glycidyloxynaphthyl) fluorenes correspond to the 9,9-bis (glycidyloxyphenyl) fluorenes and are compounds in which a phenyl group is substituted with a naphthyl group, such as 9,9- Bis (glycidyloxynaphthyl) fluorene [eg, 9,9-bis (6-glycidyloxy-2-naphthyl) fluorene, 9,9-bis (5-glycidyloxy-1-naphthyl) fluorene] and the like.
 9,9-ビス(グリシジルオキシ(ポリ)アルコキシフェニル)フルオレン類には、例えば、9,9-ビス(グリシジルオキシアルコキシフェニル)フルオレン{例えば、9,9-ビス[4-(2-グリシジルオキシエトキシ)フェニル]フルオレン、9,9-ビス[4-(2-グリシジルオキシプロポキシ)フェニル]フルオレンなどの9,9-ビス(グリシジルオキシC2-4アルコキシフェニル)フルオレン}、9,9-ビス(アルキル-グリシジルオキシアルコキシフェニル)フルオレン{例えば、9,9-ビス[4-(2-グリシジルオキシエトキシ)-3-メチルフェニル]フルオレン、9,9-ビス[4-(2-グリシジルオキシプロポキシ)-3-メチルフェニル]フルオレン、9,9-ビス[4-(2-グリシジルオキシエトキシ)-3,5-ジメチルフェニル]フルオレンなどの9,9-ビス(モノ又はジC1-4アルキル-グリシジルオキシC2-4アルコキシフェニル)フルオレン}、9,9-ビス(アリール-グリシジルオキシアルコキシフェニル)フルオレン{例えば、9,9-ビス[4-(2-グリシジルオキシエトキシ)-3-フェニルフェニル]フルオレン、9,9-ビス[4-(2-グリシジルオキシプロポキシ)-3-フェニルフェニル]フルオレンなどの9,9-ビス(モノ又はジC6-10アリール-グリシジルオキシC2-4アルコキシフェニル)フルオレン}などの9,9-ビス(グリシジルオキシアルコキシフェニル)フルオレン類(前記式(1B)において、nが1である化合物);9,9-ビス(グリシジルオキシジアルコキシフェニル)フルオレン{例えば、9,9-ビス{4-[2-(2-グリシジルオキシエトキシ)エトキシ]フェニル}フルオレンなどの9,9-ビス(グリシジルオキシジC2-4アルコキシフェニル)フルオレン}などの9,9-ビス(グリシジルオキシポリアルコキシフェニル)フルオレン類(前記式(1B)において、nが2以上である化合物)などが含まれる。 9,9-bis (glycidyloxy (poly) alkoxyphenyl) fluorenes include, for example, 9,9-bis (glycidyloxyalkoxyphenyl) fluorene {eg, 9,9-bis [4- (2-glycidyloxyethoxy) ) Phenyl] fluorene, 9,9-bis [4- (2-glycidyloxypropoxy) phenyl] fluorene and other 9,9-bis (glycidyloxy C 2-4 alkoxyphenyl) fluorene}, 9,9-bis (alkyl) -Glycidyloxyalkoxyphenyl) fluorene {eg, 9,9-bis [4- (2-glycidyloxyethoxy) -3-methylphenyl] fluorene, 9,9-bis [4- (2-glycidyloxypropoxy) -3 -Methylphenyl] fluorene, 9,9-bis [4- (2-glycidyloxy) 9,9-bis (mono or di C 1-4 alkyl-glycidyloxy C 2-4 alkoxyphenyl) fluorene}, 9,9-bis (aryl-glycidyloxy) such as ethoxy) -3,5-dimethylphenyl] fluorene Alkoxyphenyl) fluorene {eg, 9,9-bis [4- (2-glycidyloxyethoxy) -3-phenylphenyl] fluorene, 9,9-bis [4- (2-glycidyloxypropoxy) -3-phenylphenyl ] 9,9-bis (glycidyloxyalkoxyphenyl) fluorenes such as 9,9-bis (mono or diC 6-10 aryl-glycidyloxy C 2-4 alkoxyphenyl) fluorene} such as fluorene (formula (1B In which n is 1); 9,9-bis (glycidyloxydial) Coxiphenyl) fluorene {eg, 9,9-bis (glycidyloxydiC 2-4 alkoxyphenyl) fluorene} such as 9,9-bis {4- [2- (2-glycidyloxyethoxy) ethoxy] phenyl} fluorene} 9,9-bis (glycidyloxypolyalkoxyphenyl) fluorenes (compounds wherein n is 2 or more in the formula (1B)), and the like.
 また、9,9-ビス(グリシジルオキシ(ポリ)アルコキシナフチル)フルオレン類としては、前記9,9-ビス(グリシジルオキシ(ポリ)アルコキシフェニル)フルオレン類に対応し、フェニル基がナフチル基に置換した化合物、例えば、9,9-ビス(グリシジルオキシアルコキシナフチル)フルオレン{例えば、9,9-ビス[6-(2-グリシジルオキシエトキシ)-2-ナフチル]フルオレン、9,9-ビス[6-(2-ヒドロキシプロポキシ)-2-ナフチル]フルオレンなどの9,9-ビス(グリシジルオキシC2-4アルコキシナフチル)フルオレン}などの9,9-ビス(グリシジルオキシアルコキシナフチル)フルオレン類などが含まれる。 The 9,9-bis (glycidyloxy (poly) alkoxynaphthyl) fluorenes correspond to the 9,9-bis (glycidyloxy (poly) alkoxyphenyl) fluorenes, and the phenyl group is substituted with a naphthyl group. Compounds such as 9,9-bis (glycidyloxyalkoxynaphthyl) fluorene {eg 9,9-bis [6- (2-glycidyloxyethoxy) -2-naphthyl] fluorene, 9,9-bis [6- ( such as 2-hydroxypropoxy) -2-naphthyl] 9,9-bis (glycidyloxy C 2-4 alkoxy naphthyl) fluorene} 9,9-bis (glycidyloxy alkoxy naphthyl) fluorene such as a fluorene are included.
 多官能性エポキシ化合物は、単独で又は2種以上組み合わせてもよい。 The multifunctional epoxy compounds may be used alone or in combination of two or more.
 エポキシ化合物は、単独で又は2種以上組み合わせてもよい。 The epoxy compounds may be used alone or in combination of two or more.
 これらのうち、多官能エポキシ化合物を好適に使用してもよい。そのため、エポキシ化合物は、少なくとも多官能エポキシ化合物を含んでいてもよい。この場合、エポキシ化合物は、多官能エポキシ化合物のみで構成してもよく、多官能エポキシ化合物と単官能エポキシ化合物とを組み合わせてもよい。多官能エポキシ化合物と単官能エポキシ化合物とを組み合わせる場合、これらの割合は、前者/後者(重量比)=99.5/0.5~10/90(例えば、99/1~15/85)、好ましくは98/2~20/80(例えば、97/3~25/75)、さらに好ましくは95/5~30/70(例えば、95/5~35/65)程度であってもよく、通常99/1~40/60(例えば、95/5~50/50)程度であってもよい。 Of these, polyfunctional epoxy compounds may be suitably used. Therefore, the epoxy compound may contain at least a polyfunctional epoxy compound. In this case, an epoxy compound may be comprised only with a polyfunctional epoxy compound, and may combine a polyfunctional epoxy compound and a monofunctional epoxy compound. When combining a polyfunctional epoxy compound and a monofunctional epoxy compound, these ratios are the former / the latter (weight ratio) = 99.5 / 0.5 to 10/90 (for example, 99/1 to 15/85), Preferably, it may be about 98/2 to 20/80 (for example, 97/3 to 25/75), more preferably about 95/5 to 30/70 (for example, 95/5 to 35/65). It may be about 99/1 to 40/60 (for example, 95/5 to 50/50).
 なお、エポキシ化合物は、常温(例えば、15~25℃程度)において、固体状であってもよく、液体状であってもよい。なお、液体状のエポキシ化合物の粘度(25℃)は、例えば、1~6000mPa・s、好ましくは10~4000mPa・s、さらに好ましくは50~2000mPa・s程度であってもよく、1000mPa・s以下[例えば、1~500mPa・s、好ましくは300mPa・s以下(例えば、50~200mPa・s)、さらに好ましくは150mPa・s以下(例えば、70~140mPa・s)]程度の低粘度のエポキシ化合物を使用してもよい。 The epoxy compound may be solid or liquid at normal temperature (eg, about 15 to 25 ° C.). The viscosity (25 ° C.) of the liquid epoxy compound may be, for example, 1 to 6000 mPa · s, preferably 10 to 4000 mPa · s, more preferably about 50 to 2000 mPa · s, and 1000 mPa · s or less. An epoxy compound having a low viscosity of [for example, 1 to 500 mPa · s, preferably 300 mPa · s or less (eg 50 to 200 mPa · s), more preferably 150 mPa · s or less (eg 70 to 140 mPa · s)] May be used.
 エポキシ化合物の割合は、例えば、樹脂100重量部に対して、0.05重量部以上(例えば、0.07~100重量部)程度の範囲から選択でき、0.1~80重量部、好ましくは0.3~50重量部、さらに好ましくは0.5~40重量部程度であってもよく、通常0.1~30重量部(例えば、0.3~25重量部、好ましくは0.5~20重量部、さらに好ましくは0.7~15重量部、特に0.8~10重量部、特に好ましくは1~5重量部)程度であってもよい。 The proportion of the epoxy compound can be selected from the range of, for example, about 0.05 parts by weight or more (for example, 0.07 to 100 parts by weight) with respect to 100 parts by weight of the resin. It may be about 0.3 to 50 parts by weight, more preferably about 0.5 to 40 parts by weight, usually 0.1 to 30 parts by weight (eg, 0.3 to 25 parts by weight, preferably 0.5 to 20 parts by weight, more preferably 0.7 to 15 parts by weight, particularly 0.8 to 10 parts by weight, particularly preferably 1 to 5 parts by weight.
 また、エポキシ化合物の割合は、フルオレン化合物100重量部に対して、例えば、0.1~200重量部(例えば、0.5~150重量部)、好ましくは1~100重量部(例えば、2~80重量部)、さらに好ましくは3~60重量部、特に5~40重量部程度であってもよく、通常1~100重量部(例えば、2~80重量部、好ましくは3~50重量部、さらに好ましくは5~30重量部、特に8~25重量部)程度であってもよい。 The ratio of the epoxy compound is, for example, 0.1 to 200 parts by weight (eg 0.5 to 150 parts by weight), preferably 1 to 100 parts by weight (eg 2 to 2 parts by weight) with respect to 100 parts by weight of the fluorene compound. 80 parts by weight), more preferably 3 to 60 parts by weight, particularly about 5 to 40 parts by weight, usually 1 to 100 parts by weight (eg 2 to 80 parts by weight, preferably 3 to 50 parts by weight, More preferably, it may be about 5 to 30 parts by weight, particularly 8 to 25 parts by weight.
 なお、本発明の樹脂組成物は、必要に応じて、他の添加剤{フルオレン化合物およびエポキシ化合物のいずれでもない添加剤、例えば、充填剤又は補強剤、着色剤(染顔料)、導電剤、難燃剤、可塑剤、滑剤、安定剤[酸化防止剤(ヒンダードフェノール系酸化防止剤、リン系酸化防止剤など)、紫外線吸収剤、熱安定剤など]、硬化剤(エポキシ化合物又はエポキシ樹脂の硬化剤など)、硬化促進剤、離型剤、帯電防止剤、分散剤、流動調整剤、レベリング剤、消泡剤、表面改質剤、低応力化剤、炭素材など}を含んでいてもよい。これらの添加剤は単独で又は2種以上組み合わせてもよい。 The resin composition of the present invention may contain other additives {additives that are neither a fluorene compound nor an epoxy compound, for example, a filler or a reinforcing agent, a colorant (dye pigment), a conductive agent, if necessary. Flame retardants, plasticizers, lubricants, stabilizers [antioxidants (hindered phenol antioxidants, phosphorus antioxidants, etc.), UV absorbers, heat stabilizers, etc.], curing agents (epoxy compounds or epoxy resins) Curing agents, etc.), curing accelerators, mold release agents, antistatic agents, dispersants, flow regulators, leveling agents, antifoaming agents, surface modifiers, low stress agents, carbon materials, etc.} Good. These additives may be used alone or in combination of two or more.
 なお、他の添加剤の割合は、その種類に応じて適宜選択できる。例えば、安定剤の割合は、熱可塑性樹脂100重量部に対して、0.001~10重量部、好ましくは0.01~7重量部、さらに好ましくは0.05~5重量部程度であってもよい。 In addition, the ratio of another additive can be suitably selected according to the kind. For example, the proportion of the stabilizer is about 0.001 to 10 parts by weight, preferably 0.01 to 7 parts by weight, more preferably about 0.05 to 5 parts by weight with respect to 100 parts by weight of the thermoplastic resin. Also good.
 なお、樹脂組成物は、樹脂とフルオレン化合物とエポキシ化合物[さらに、必要に応じて他の成分(他の添加剤など)と]を混合することで得ることができる。混合方法は、特に限定されず、例えば、溶融混練により混合してもよく、溶媒に各成分を溶解させることで混合してもよい。 The resin composition can be obtained by mixing a resin, a fluorene compound, and an epoxy compound [further, with other components (such as other additives) as necessary]. The mixing method is not particularly limited, and may be mixed by, for example, melt kneading or may be mixed by dissolving each component in a solvent.
 また、本発明には、このような樹脂組成物で形成された成形体も含まれる。このような成形体の形状は、特に限定されず、用途に応じて適宜選択でき、例えば、二次元的構造(フィルム状、シート状、板状など)、三次元的構造(管状、棒状、チューブ状、中空状など)などが挙げられる。 The present invention also includes a molded body formed of such a resin composition. The shape of such a molded body is not particularly limited, and can be appropriately selected depending on the application. For example, a two-dimensional structure (film shape, sheet shape, plate shape, etc.), a three-dimensional structure (tubular, rod shape, tube) Shape, hollow shape, etc.).
 特に、本発明の樹脂組成物は、光学的特性に優れている場合が多く、光学材料又は光学用成形体(特に、光学フィルム、光学レンズなど)を好適に形成してもよい。 In particular, the resin composition of the present invention is often excellent in optical properties, and an optical material or an optical molded body (in particular, an optical film, an optical lens, etc.) may be suitably formed.
 成形体は、例えば、射出成形法、射出圧縮成形法、押出成形法、トランスファー成形法、ブロー成形法、加圧成形法、キャスティング成形法などを利用して製造することができる。 The molded body can be manufactured using, for example, an injection molding method, an injection compression molding method, an extrusion molding method, a transfer molding method, a blow molding method, a pressure molding method, a casting molding method, and the like.
 特に、本発明の樹脂組成物は、種々の光学的特性に優れている場合が多く、フィルム(特に光学フィルム)を形成するのに有用である。そのため、本発明には、前記樹脂組成物で形成されたフィルム(光学フィルムなど)も含まれる。 In particular, the resin composition of the present invention is often excellent in various optical properties and is useful for forming a film (particularly an optical film). Therefore, the present invention also includes a film (such as an optical film) formed from the resin composition.
 フィルムの厚みは、1~1000μm程度の範囲から用途に応じて選択でき、例えば、1~200μm、好ましくは5~150μm、さらに好ましくは10~120μm程度であってもよい。 The thickness of the film can be selected from the range of about 1 to 1000 μm according to the application, and may be, for example, 1 to 200 μm, preferably 5 to 150 μm, and more preferably about 10 to 120 μm.
 このようなフィルム(光学フィルムなど)は、前記樹脂組成物を、慣用の成膜方法、キャスティング法(溶剤キャスト法)、溶融押出法、カレンダー法などを用いて成膜(又は成形)することにより製造できる。 Such a film (such as an optical film) is formed by forming (or molding) the resin composition using a conventional film forming method, casting method (solvent casting method), melt extrusion method, calendar method, or the like. Can be manufactured.
 フィルムは、延伸フィルムであってもよい。なお、このような延伸フィルムは、一軸延伸フィルム又は二軸延伸フィルムのいずれであってもよい。 The film may be a stretched film. Such a stretched film may be either a uniaxially stretched film or a biaxially stretched film.
 延伸倍率は、一軸延伸又は二軸延伸において各方向にそれぞれ1.05~10倍(例えば、1.1~5倍)程度であってもよく、通常1.1~3倍(例えば、1.2~2.5倍)程度であってもよい。なお、二軸延伸の場合、等延伸であっても偏延伸であってもよい。また、一軸延伸の場合、縦延伸であっても横延伸であってもよい。 The stretching ratio may be about 1.05 to 10 times (for example, 1.1 to 5 times) in each direction in uniaxial stretching or biaxial stretching, and is usually 1.1 to 3 times (for example, 1. 2 to 2.5 times). In the case of biaxial stretching, it may be equal stretching or partial stretching. In the case of uniaxial stretching, longitudinal stretching or lateral stretching may be used.
 延伸フィルムの厚みは、例えば、1~150μm、好ましくは3~120μm、さらに好ましくは5~100μm程度であってもよい。 The thickness of the stretched film may be, for example, about 1 to 150 μm, preferably 3 to 120 μm, and more preferably about 5 to 100 μm.
 なお、このような延伸フィルムは、成膜後のフィルム(又は未延伸フィルム)に、延伸処理を施すことにより得ることができる。延伸方法は、特に制限がなく、一軸延伸の場合、湿式延伸法又は乾式延伸法などであってもよく、二軸延伸の場合、テンター法(フラット法ともいわれる)、チューブ法などであってもよい。 Such a stretched film can be obtained by subjecting a film after film formation (or an unstretched film) to a stretching treatment. The stretching method is not particularly limited. In the case of uniaxial stretching, a wet stretching method or a dry stretching method may be used. In the case of biaxial stretching, a tenter method (also referred to as a flat method), a tube method, or the like may be used. Good.
 以下に、実施例に基づいて本発明をより詳細に説明するが、本発明はこれらの実施例によって限定されるものではない。 Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited to these examples.
 なお、実施例において、各種特性は、以下のようにして測定した。 In the examples, various characteristics were measured as follows.
 (降伏点強度、破断伸度)
 島津製作所製 オートグラフ(ロードセル:1kN)を用い、引張試験を実施した。なお、サンプルは幅を約7.5mm、長さを5cmのものを用い、チャック間距離を20mm、引張速度を10mm/分とした。
(Yield point strength, elongation at break)
A tensile test was performed using an autograph (load cell: 1 kN) manufactured by Shimadzu Corporation. A sample having a width of about 7.5 mm and a length of 5 cm was used, the distance between chucks was 20 mm, and the tensile speed was 10 mm / min.
 (引裂強度)
 デジタルエルメンドルフ引裂き試験機SA-WP(東洋精機製作所製)を用い、引裂試験を実施した。尚、サンプルは75mm×63mmの長方形型サンプル(JISK7128-2に準拠)の中央へ20mmの切り込みを入れたものを用い、得られた結果については、30μmあたりの引裂強度に換算した。
(Tear strength)
A tear test was performed using a digital Elmendorf tear tester SA-WP (manufactured by Toyo Seiki Seisakusho). The sample used was a 75 mm × 63 mm rectangular sample (conforming to JISK7128-2) with a 20 mm cut in the center, and the obtained results were converted to tear strength per 30 μm.
 (位相差および波長分散特性の評価)
 フィルムのレタデーションについては、大塚電子(株)製、高速レタデーション測定装置RE-100にて測定を行った。また、波長分散性を評価する上で、400nm、589nm、700nmのレタデーション値を測定した(各波長でのレタデーション値をN400、N589、N700とする)。
(Evaluation of phase difference and chromatic dispersion characteristics)
The retardation of the film was measured with a high-speed retardation measuring device RE-100 manufactured by Otsuka Electronics Co., Ltd. Moreover, (the retardation value at each wavelength and N 400, N 589, N 700 ) in evaluating the wavelength dispersion, the 400 nm, 589 nm, measurement of retardation values of 700 nm.
 (ヘイズ、全光線透過率)
 全光線透過率およびヘイズを、スガ試験機(株)ヘーズメーターHZ-2にて測定した。
(Haze, total light transmittance)
The total light transmittance and haze were measured with Suga Test Instruments Co., Ltd. Haze Meter HZ-2.
 (参考例1)
 セルローストリアセテート((株)ダイセル製、LT55、以下、TACという)100重量部、9,9-ビス[4-(2-ヒドロキシエトキシ)フェニル]フルオレン(大阪ガスケミカル(株)製、以下、BPEFという)11重量部、安定剤[ヒンダードフェノール系酸化防止剤(BASFジャパン(株)製、IRGANOX1010)およびリン系酸化防止剤(住友化学(株)製、SUMILIZER GP)]を、二軸押出機(テクノベル社製 KZW15/30 MG)を用いて210~290℃のシリンダー温度にて溶融混練し、ペレット状の樹脂組成物を得た。なお、ヒンダードフェノール系酸化防止剤の割合は、TACとBPEFの総量に対して2000ppm、リン系酸化防止剤の割合はTACとBPEFの総量に対して1000ppmとした。なお、樹脂組成物は、透明であり、均一に混合されていた。
(Reference Example 1)
100 parts by weight of cellulose triacetate (manufactured by Daicel Corporation, LT55, hereinafter referred to as TAC), 9,9-bis [4- (2-hydroxyethoxy) phenyl] fluorene (manufactured by Osaka Gas Chemical Co., Ltd., hereinafter referred to as BPEF) ) 11 parts by weight, stabilizer [hindered phenol antioxidant (BASF Japan, IRGANOX1010) and phosphorus antioxidant (Sumitomo Chemical Co., Ltd., SUMILIZER GP)] Using KZW15 / 30 MG) manufactured by Technobel, melt-kneading was performed at a cylinder temperature of 210 to 290 ° C. to obtain a pellet-shaped resin composition. In addition, the ratio of hindered phenolic antioxidant was 2000 ppm with respect to the total amount of TAC and BPEF, and the ratio of phosphorus antioxidant was 1000 ppm with respect to the total amount of TAC and BPEF. In addition, the resin composition was transparent and was mixed uniformly.
 得られた樹脂組成物を、プレス成形機を用いて溶融プレス(ホットプレス)し、フィルム(未延伸フィルム)を得た。 The obtained resin composition was melt-pressed (hot pressed) using a press molding machine to obtain a film (unstretched film).
 そして、得られたフィルムを用いて各種特性を測定した。 And various characteristics were measured using the obtained film.
 まず、フィルムにおいて、引裂強度は0.11N、降伏点強度は71.6MPa、破断伸度は9.9%であった。 First, the tear strength of the film was 0.11 N, the yield strength was 71.6 MPa, and the elongation at break was 9.9%.
 また、フィルムにおいて、波長400nmにおける位相差(N400)は0.12nm、波長589nmにおける位相差(N589)は0.21nm、波長700nmにおける位相差(N700)は0.24nmであり、逆波長分散性を示した(N400/N589=0.57、N700/N589=1.14)。 In the film, the phase difference (N 400 ) at a wavelength of 400 nm is 0.12 nm, the phase difference (N 589 ) at a wavelength of 589 nm is 0.21 nm, and the phase difference (N 700 ) at a wavelength of 700 nm is 0.24 nm. shows a wavelength dispersion (N 400 / N 589 = 0.57 , N 700 / N 589 = 1.14).
 さらに、フィルムのヘーズは0.9、全光線透過率は92%であった。 Furthermore, the haze of the film was 0.9, and the total light transmittance was 92%.
 (実施例1)
 参考例1において、さらに、エポキシ化合物(トリメチロールプロパントリグリシジルエーテル)1.6重量部を溶融混練したこと以外は、参考例1と同様にして樹脂組成物を得た。なお、樹脂組成物は、透明であり、均一に混合されていた。
(Example 1)
In Reference Example 1, a resin composition was obtained in the same manner as in Reference Example 1 except that 1.6 parts by weight of an epoxy compound (trimethylolpropane triglycidyl ether) was further melt-kneaded. In addition, the resin composition was transparent and was mixed uniformly.
 そして、参考例1と同様にして、フィルムを作成し、各種特性を評価した。 Then, in the same manner as in Reference Example 1, films were prepared and various characteristics were evaluated.
 まず、フィルムにおいて、引裂強度は0.13N、降伏点強度は79.8MPa、破断伸度は11.2%であり、参考例1に比べて、機械的特性が大きく改善されていることを確認した。 First, in the film, the tear strength is 0.13 N, the yield point strength is 79.8 MPa, the elongation at break is 11.2%, and it is confirmed that the mechanical properties are greatly improved compared to Reference Example 1. did.
 また、フィルムにおいて、波長400nmにおける位相差(N400)は0.16nm、波長589nmにおける位相差(N589)は0.15nm、波長700nmにおける位相差(N700)は0.15nmであり、フラットな波長分散特性を有することが確認された(N400/N589=1.07、N700/N589=1.00)。 In the film, the phase difference (N 400 ) at a wavelength of 400 nm is 0.16 nm, the phase difference (N 589 ) at a wavelength of 589 nm is 0.15 nm, the phase difference (N 700 ) at a wavelength of 700 nm is 0.15 nm, and flat (N 400 / N 589 = 1.07, N 700 / N 589 = 1.00).
 この結果から、エポキシ化合物を添加することで、参考例1に比べ、波長分散性が抑えられることがわかった。 From this result, it was found that the wavelength dispersion can be suppressed by adding an epoxy compound as compared with Reference Example 1.
 さらに、フィルムにおいて、へーズは0.6、全光線透過率は92%であった。 Furthermore, in the film, the haze was 0.6 and the total light transmittance was 92%.
 この結果から、エポキシ化合物を添加しても、透明性が損なわれない(むしろ透明性が向上する)ことがわかった。 From this result, it was found that even when an epoxy compound was added, transparency was not impaired (rather, transparency was improved).
 (実施例2)
 参考例1において、さらに、エポキシ化合物として、9,9-ビス(4-グリシジルオキシフェニル)フルオレン(大阪ガスケミカル(株)製)2.0重量部を溶融混練したこと以外は、参考例1と同様にして樹脂組成物を得た。なお、樹脂組成物は、透明であり、均一に混合されていた。
(Example 2)
Reference Example 1 and Reference Example 1 except that 2.0 parts by weight of 9,9-bis (4-glycidyloxyphenyl) fluorene (Osaka Gas Chemical Co., Ltd.) were melt-kneaded as an epoxy compound. Similarly, a resin composition was obtained. In addition, the resin composition was transparent and was mixed uniformly.
 そして、参考例1と同様にして、フィルムを作成し、各種特性を評価した。 Then, in the same manner as in Reference Example 1, films were prepared and various characteristics were evaluated.
 まず、フィルムにおいて、引裂強度は0.12N、降伏点強度は77.4MPa、破断伸度は12.9%であり、参考例1に比べて、機械的特性が大きく改善されていることを確認した。 First, in the film, the tear strength is 0.12 N, the yield point strength is 77.4 MPa, and the elongation at break is 12.9%, confirming that the mechanical properties are greatly improved as compared with Reference Example 1. did.
 また、フィルムにおいて、波長400nmにおける位相差(N400)は0.21nm、波長589nmにおける位相差(N589)は0.20nm、波長700nmにおける位相差(N700)は0.20nmであり、フラットな波長分散特性を有することが確認された(N400/N589=1.05、N700/N589=1.00)。 In the film, the retardation (N 400 ) at a wavelength of 400 nm is 0.21 nm, the retardation (N 589 ) at a wavelength of 589 nm is 0.20 nm, the retardation (N 700 ) at a wavelength of 700 nm is 0.20 nm, and the film is flat. (N 400 / N 589 = 1.05, N 700 / N 589 = 1.00).
 この結果から、エポキシ化合物を添加することで、参考例1に比べ、波長分散性が抑えられることがわかった。 From this result, it was found that the wavelength dispersion can be suppressed by adding an epoxy compound as compared with Reference Example 1.
 さらに、フィルムにおいて、へーズは1.2、全光線透過率は92%であった。 Furthermore, in the film, the haze was 1.2 and the total light transmittance was 92%.
 この結果から、エポキシ化合物を添加しても、透明性が大きく損なわれないことがわかった。 From this result, it was found that even when an epoxy compound was added, the transparency was not greatly impaired.
 (参考例2)
 参考例1において、BPEF11重量部を6,6-ビス(9-フルオレニリデン)―ジ(2-ナフトール)(大阪ガスケミカル(株)製、以下、BNFという)18重量部に代えた以外は、参考例1と同様にして、フィルム(未延伸フィルム)を得た。なお、シリンダー温度は210~280℃とした。そして、得られたフィルムを用いて各種特性を測定した。
(Reference Example 2)
Reference Example 1 except that 11 parts by weight of BPEF was replaced with 18 parts by weight of 6,6-bis (9-fluorenylidene) -di (2-naphthol) (Osaka Gas Chemical Co., Ltd., hereinafter referred to as BNF). In the same manner as in Example 1, a film (unstretched film) was obtained. The cylinder temperature was 210 to 280 ° C. And various characteristics were measured using the obtained film.
 まず、フィルムにおいて、引裂強度は0.38N、降伏点強度は63.7MPa、破断伸度は2.8%であった。 First, the tear strength of the film was 0.38 N, the yield strength was 63.7 MPa, and the elongation at break was 2.8%.
 また、得られたフィルムについて、位相差を測定したところ、波長400nmにおける位相差(N400)は4.70nm、波長589nmにおける位相差(N589)は5.08nm、波長700nmにおける位相差(N700)は5.18nmであり、逆波長分散性を示した(N400/N589=0.93、N700/N589=1.02)。 Further, the obtained film was measured for a phase difference, a phase difference at a wavelength of 400 nm (N 400) is 4.70Nm, the phase difference at a wavelength of 589 nm (N 589) is 5.08Nm, the phase difference at a wavelength 700 nm (N 700 ) was 5.18 nm, and showed reverse wavelength dispersion (N 400 / N 589 = 0.93, N 700 / N 589 = 1.02).
 さらに、フィルムのヘーズは0.9、全光線透過率は92%であった。 Furthermore, the haze of the film was 0.9, and the total light transmittance was 92%.
 (実施例3)
 参考例2において、さらに、エポキシ化合物(トリメチロールプロパントリグリシジルエーテル)1.6重量部を溶融混練したこと以外は、参考例2と同様にして樹脂組成物を得た。なお、樹脂組成物は、透明であり、均一に混合されていた。
(Example 3)
In Reference Example 2, a resin composition was obtained in the same manner as in Reference Example 2 except that 1.6 parts by weight of an epoxy compound (trimethylolpropane triglycidyl ether) was further melt-kneaded. In addition, the resin composition was transparent and was mixed uniformly.
 そして、参考例1と同様にして、フィルムを作成し、各種特性を評価した。 Then, in the same manner as in Reference Example 1, films were prepared and various characteristics were evaluated.
 まず、フィルムにおいて、引裂強度は0.58N、降伏点強度は67.4MPa、破断伸度は5.7%であり、参考例2に比べて、機械的特性が大きく改善されていることを確認した。 First, in the film, the tear strength is 0.58 N, the yield point strength is 67.4 MPa, the elongation at break is 5.7%, and it is confirmed that the mechanical properties are greatly improved compared to Reference Example 2. did.
 また、フィルムにおいて、波長400nmにおける位相差(N400)は4.43nm、波長589nmにおける位相差(N598)は4.59nm、波長700nmにおける位相差(N700)は4.63nmであり、フラットな波長分散特性を有することが確認された(N400/N589=0.96、N700/N589=1.01)。 In the film, the phase difference (N 400 ) at a wavelength of 400 nm is 4.43 nm, the phase difference (N 598 ) at a wavelength of 589 nm is 4.59 nm, the phase difference (N 700 ) at a wavelength of 700 nm is 4.63 nm, and is flat. (N 400 / N 589 = 0.96, N 700 / N 589 = 1.01).
 さらに、フィルムにおいて、へーズは0.6、全光線透過率は92%であった。 Furthermore, in the film, the haze was 0.6 and the total light transmittance was 92%.
 この結果から、エポキシ化合物を添加しても、透明性が損なわれない(むしろ透明性が向上する)ことがわかった。 From this result, it was found that even when an epoxy compound was added, transparency was not impaired (rather, transparency was improved).
 (参考例3)
 参考例1において、BPEF11重量部を9,9-ビス[4-(2-ヒドロキシエトキシ)-3-フェニルフェニル]フルオレン(大阪ガスケミカル(株)製、以下、BOPPEFという)18重量部に代えた以外は、参考例1と同様にして、フィルム(未延伸フィルム)を得た。なお、シリンダー温度は210~280℃とした。そして、得られたフィルムを用いて各種特性を測定した。
(Reference Example 3)
In Reference Example 1, 11 parts by weight of BPEF was replaced with 18 parts by weight of 9,9-bis [4- (2-hydroxyethoxy) -3-phenylphenyl] fluorene (Osaka Gas Chemical Co., Ltd., hereinafter referred to as BOPPEF). Except for the above, a film (unstretched film) was obtained in the same manner as in Reference Example 1. The cylinder temperature was 210 to 280 ° C. And various characteristics were measured using the obtained film.
 そして、得られたフィルムを用いて各種特性を測定した。 And various characteristics were measured using the obtained film.
 まず、フィルムにおいて、引裂強度は0.41N、降伏点強度は68.0MPa、破断伸度は4.5%であった。 First, the tear strength of the film was 0.41 N, the yield strength was 68.0 MPa, and the elongation at break was 4.5%.
 また、得られたフィルムについて、位相差を測定したところ、波長400nmにおける位相差(N400)は4.66nm、波長589nmにおける位相差(N589)は5.79nm、波長700nmにおける位相差(N700)は6.07nmであり、逆波長分散性を示した(N400/N589=0.81、N700/N589=1.02)。 Further, when the retardation of the obtained film was measured, the retardation at a wavelength of 400 nm (N 400 ) was 4.66 nm, the retardation at a wavelength of 589 nm (N 589 ) was 5.79 nm, and the retardation at a wavelength of 700 nm (N 700 ) was 6.07 nm, and showed reverse wavelength dispersion (N 400 / N 589 = 0.81, N 700 / N 589 = 1.02).
 さらに、フィルムのヘーズは0.9、全光線透過率は92%であった。 Furthermore, the haze of the film was 0.9, and the total light transmittance was 92%.
 (実施例4)
 参考例3において、さらに、エポキシ化合物(トリメチロールプロパントリグリシジルエーテル)1.6重量部を溶融混練したこと以外は、参考例3と同様にして樹脂組成物を得た。なお、樹脂組成物は、透明であり、均一に混合されていた。
Example 4
In Reference Example 3, a resin composition was obtained in the same manner as in Reference Example 3, except that 1.6 parts by weight of an epoxy compound (trimethylolpropane triglycidyl ether) was further melt-kneaded. In addition, the resin composition was transparent and was mixed uniformly.
 そして、参考例1と同様にして、フィルムを作成し、各種特性を評価した。 Then, in the same manner as in Reference Example 1, films were prepared and various characteristics were evaluated.
 まず、フィルムにおいて、引裂強度は0.56N、降伏点強度は70.8MPa、破断伸度は4.9%であり、参考例3に比べて、機械的特性が大きく改善されていることを確認した。 First, in the film, the tear strength is 0.56 N, the yield point strength is 70.8 MPa, the elongation at break is 4.9%, and it is confirmed that the mechanical properties are greatly improved compared to Reference Example 3. did.
 また、フィルムにおいて、波長400nmにおける位相差(N400)は5.39nm、波長589nmにおける位相差(N598)は6.60nm、波長700nmにおける位相差(N700)は6.9nmであり、逆波長分散性を示した(N400/N589=0.82、N700/N589=1.04)。 In the film, the phase difference (N 400 ) at a wavelength of 400 nm is 5.39 nm, the phase difference (N 598 ) at a wavelength of 589 nm is 6.60 nm, and the phase difference (N 700 ) at a wavelength of 700 nm is 6.9 nm. shows a wavelength dispersion (N 400 / N 589 = 0.82 , N 700 / N 589 = 1.04).
 さらに、フィルムにおいて、へーズは0.6、全光線透過率は92%であった。 Furthermore, in the film, the haze was 0.6 and the total light transmittance was 92%.
 この結果から、エポキシ化合物を添加しても、透明性が損なわれない(むしろ透明性が向上する)ことがわかった。 From this result, it was found that even when an epoxy compound was added, transparency was not impaired (rather, transparency was improved).
 本発明の樹脂組成物は、フルオレン化合物とエポキシ化合物とを組み合わせて含んでいるため、機械的特性を損なうことなく、フルオレン化合物由来の優れた特性を樹脂に付与できる。また、フルオレン化合物とエポキシ化合物との組み合わせにより、樹脂の波長分散性を調整(例えば、樹脂の波長分散性を低減)できる。 Since the resin composition of the present invention contains a combination of a fluorene compound and an epoxy compound, it can impart excellent properties derived from the fluorene compound to the resin without impairing mechanical properties. Further, the wavelength dispersion of the resin can be adjusted (for example, the wavelength dispersion of the resin can be reduced) by a combination of a fluorene compound and an epoxy compound.
 そのため、本発明の樹脂組成物は、構成する樹脂の種類にもよるが、例えば、高屈折率、高耐熱性、高透明性、優れた成形性(溶融流動性が高いなど)などの優れた特性を有している。 Therefore, the resin composition of the present invention is excellent in, for example, high refractive index, high heat resistance, high transparency, excellent moldability (such as high melt fluidity), although it depends on the type of resin constituting the resin composition. It has characteristics.
 このような樹脂組成物は、特に、光学的特性に優れている場合が多いため、光学用途の成形体(光学用成形体)を構成(又は形成)するのに有用である。このような前記樹脂組成物で形成(構成)された光学用成形体としては、例えば、光学フィルム、光学レンズなどが挙げられる。 Such a resin composition is particularly useful for constructing (or forming) a molded product for optical use (optical molded product) because it is often excellent in optical properties. Examples of the optical molded body formed (configured) with such a resin composition include optical films and optical lenses.
 光学フィルムとしては、位相フィルム(又は位相差板)の他、偏光フィルム(及びそれを構成する偏光素子と偏光板保護フィルム)、配向膜(配向フィルム)、視野角拡大(補償)フィルム、拡散板(フィルム)、プリズムシート、導光板、輝度向上フィルム、近赤外吸収フィルム、反射フィルム、反射防止(AR)フィルム、反射低減(LR)フィルム、アンチグレア(AG)フィルム、透明導電(ITO)フィルム、異方導電性フィルム(ACF)、電磁波遮蔽(EMI)フィルム、電極基板用フィルム、カラーフィルタ基板用フィルム、バリアフィルム、カラーフィルタ層、ブラックマトリクス層、光学フィルム同士の接着層もしくは離型層などが挙げられる。とりわけ、本発明のフィルムは、機器のディスプレイに用いる光学フィルムとして有用である。このような本発明の光学フィルムを備えたディスプレイ用部材(又はディスプレイ)としては、具体的には、パーソナル・コンピュータのモニタ、テレビジョン、携帯電話、カー・ナビゲーションシステム、タッチパネルなどのFPD装置(例えば、LCD、PDPなど)などが挙げられる。 As an optical film, in addition to a phase film (or a retardation plate), a polarizing film (and a polarizing element and a polarizing plate protective film constituting the polarizing film), an alignment film (alignment film), a viewing angle expansion (compensation) film, a diffusion plate (Film), prism sheet, light guide plate, brightness enhancement film, near infrared absorption film, reflection film, antireflection (AR) film, reflection reduction (LR) film, antiglare (AG) film, transparent conductive (ITO) film, Anisotropic conductive film (ACF), electromagnetic wave shielding (EMI) film, electrode substrate film, color filter substrate film, barrier film, color filter layer, black matrix layer, adhesive layer or release layer between optical films, etc. Can be mentioned. In particular, the film of the present invention is useful as an optical film for use in an apparatus display. Specific examples of the display member (or display) including the optical film of the present invention include FPD devices such as personal computer monitors, televisions, mobile phones, car navigation systems, and touch panels (for example, , LCD, PDP, etc.).

Claims (15)

  1.  非エポキシ系樹脂と、9,9-ビスアリールフルオレン骨格を有する非エポキシ系化合物と、エポキシ化合物とを含む樹脂組成物。 A resin composition comprising a non-epoxy resin, a non-epoxy compound having a 9,9-bisarylfluorene skeleton, and an epoxy compound.
  2.  9,9-ビスアリールフルオレン骨格を有する非エポキシ系化合物が、下記式(1)で表される化合物である請求項1記載の樹脂組成物。
    Figure JPOXMLDOC01-appb-C000001
    [式中、環Zは芳香族炭化水素環、RおよびRは置換基、Xは、基-[(OR)n-Y](式中、Yは、ヒドロキシル基、メルカプト基、又は(メタ)アクリロイルオキシ基、Rはアルキレン基、nは0以上の整数を示す)又はアミノ基、kは0~4の整数、mは0以上の整数、pは1以上の整数を示す]
    The resin composition according to claim 1, wherein the non-epoxy compound having a 9,9-bisarylfluorene skeleton is a compound represented by the following formula (1).
    Figure JPOXMLDOC01-appb-C000001
    [Wherein ring Z is an aromatic hydrocarbon ring, R 1 and R 2 are substituents, X is a group — [(OR 3 ) nY] (wherein Y is a hydroxyl group, a mercapto group, or A (meth) acryloyloxy group, R 3 is an alkylene group, n is an integer of 0 or more) or an amino group, k is an integer of 0 to 4, m is an integer of 0 or more, and p is an integer of 1 or more]
  3.  9,9-ビスアリールフルオレン骨格を有する非エポキシ系化合物が、下記式(1A)で表される化合物である請求項1又は2記載の樹脂組成物。
    Figure JPOXMLDOC01-appb-C000002
    (式中、Z、R、R、k、m、R、n、pは前記式(1)と同じ)
    The resin composition according to claim 1 or 2, wherein the non-epoxy compound having a 9,9-bisarylfluorene skeleton is a compound represented by the following formula (1A).
    Figure JPOXMLDOC01-appb-C000002
    (In the formula, Z, R 1 , R 2 , k, m, R 3 , n, and p are the same as those in the formula (1)).
  4.  環Zがベンゼン環又はナフタレン環、Rがアルキル基、kが0~1、Rがアルキル基、シクロアルキル基、アリール基、アラルキル基又はアルコキシ基、mが0~2、RがC2-4アルキレン基、nが0~2、pが1~3である請求項2又は3記載の樹脂組成物。 Ring Z is a benzene ring or naphthalene ring, R 1 is an alkyl group, k is 0 to 1, R 2 is an alkyl group, cycloalkyl group, aryl group, aralkyl group or alkoxy group, m is 0 to 2, and R 3 is C The resin composition according to claim 2 or 3, wherein 2-4 alkylene group, n is 0 to 2, and p is 1 to 3.
  5.  9,9-ビスアリールフルオレン骨格を有する非エポキシ系化合物が、9,9-ビス(ヒドロキシフェニル)フルオレン、9,9-ビス(アルキル-ヒドロキシフェニル)フルオレン、9,9-ビス(アリール-ヒドロキシフェニル)フルオレン、9,9-ビス(ジ又はトリヒドロキシフェニル)フルオレン、9,9-ビス(ヒドロキシナフチル)フルオレン、9,9-ビス(ヒドロキシアルコキシフェニル)フルオレン、9,9-ビス(アルキル-ヒドロキシアルコキシフェニル)フルオレン、9,9-ビス(アリール-ヒドロキシアルコキシフェニル)フルオレン、9,9-ビス(ヒドロキシアルコキシナフチル)フルオレンから選択された少なくとも1種である請求項1~4のいずれかに記載の樹脂組成物。 Non-epoxy compounds having a 9,9-bisarylfluorene skeleton include 9,9-bis (hydroxyphenyl) fluorene, 9,9-bis (alkyl-hydroxyphenyl) fluorene, and 9,9-bis (aryl-hydroxyphenyl). ) Fluorene, 9,9-bis (di or trihydroxyphenyl) fluorene, 9,9-bis (hydroxynaphthyl) fluorene, 9,9-bis (hydroxyalkoxyphenyl) fluorene, 9,9-bis (alkyl-hydroxyalkoxy) The resin according to any one of claims 1 to 4, which is at least one selected from phenyl) fluorene, 9,9-bis (aryl-hydroxyalkoxyphenyl) fluorene, and 9,9-bis (hydroxyalkoxynaphthyl) fluorene. Composition.
  6.  非エポキシ系樹脂が、熱可塑性樹脂である請求項1~5のいずれかに記載の樹脂組成物。 6. The resin composition according to claim 1, wherein the non-epoxy resin is a thermoplastic resin.
  7.  非エポキシ系樹脂が、環状オレフィン樹脂、メタクリル樹脂、芳香族ポリカーボネート樹脂、芳香族ポリエステル樹脂およびセルロース誘導体から選択された少なくとも1種である請求項1~6のいずれかに記載の樹脂組成物。 7. The resin composition according to claim 1, wherein the non-epoxy resin is at least one selected from a cyclic olefin resin, a methacrylic resin, an aromatic polycarbonate resin, an aromatic polyester resin, and a cellulose derivative.
  8.  エポキシ化合物が、多官能エポキシ化合物を含む請求項1~7のいずれかに記載の樹脂組成物。 The resin composition according to any one of claims 1 to 7, wherein the epoxy compound comprises a polyfunctional epoxy compound.
  9.  非エポキシ系樹脂100重量部に対して、9,9-ビスアリールフルオレン骨格を有する非エポキシ系化合物の割合が0.5~50重量部、エポキシ化合物の割合が0.1~30重量部である請求項1~8のいずれかに記載の樹脂組成物。 The proportion of the non-epoxy compound having a 9,9-bisarylfluorene skeleton is 0.5 to 50 parts by weight and the proportion of the epoxy compound is 0.1 to 30 parts by weight with respect to 100 parts by weight of the non-epoxy resin. The resin composition according to any one of claims 1 to 8.
  10.  エポキシ化合物の割合が、9,9-ビスアリールフルオレン骨格を有する非エポキシ系化合物100重量部に対して、1~100重量部である請求項1~9のいずれかに記載の樹脂組成物。 10. The resin composition according to claim 1, wherein the ratio of the epoxy compound is 1 to 100 parts by weight with respect to 100 parts by weight of the non-epoxy compound having a 9,9-bisarylfluorene skeleton.
  11.  請求項1~10のいずれかに記載の樹脂組成物で形成された成形体。 A molded body formed of the resin composition according to any one of claims 1 to 10.
  12.  光学用成形体である請求項11記載の成形体。 The molded article according to claim 11, which is an optical molded article.
  13.  光学フィルムである請求項11又は12記載の成形体。 The molded article according to claim 11 or 12, which is an optical film.
  14.  非エポキシ系樹脂の波長分散性を低減するための添加剤であって、9,9-ビスアリールフルオレン骨格を有する非エポキシ系化合物およびエポキシ化合物で構成された波長分散性低減剤。 A wavelength dispersion reducing agent composed of a non-epoxy compound having an 9,9-bisarylfluorene skeleton and an epoxy compound, which is an additive for reducing the wavelength dispersion of a non-epoxy resin.
  15.  非エポキシ系樹脂に請求項14記載の波長分散性低減剤を添加し、非エポキシ系樹脂の波長分散性を低減する方法。 A method for reducing the wavelength dispersibility of a non-epoxy resin by adding the wavelength dispersibility reducing agent according to claim 14 to the non-epoxy resin.
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