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WO2014132186A1 - Led lamp, in particular for a motorcycle headlight - Google Patents

Led lamp, in particular for a motorcycle headlight Download PDF

Info

Publication number
WO2014132186A1
WO2014132186A1 PCT/IB2014/059227 IB2014059227W WO2014132186A1 WO 2014132186 A1 WO2014132186 A1 WO 2014132186A1 IB 2014059227 W IB2014059227 W IB 2014059227W WO 2014132186 A1 WO2014132186 A1 WO 2014132186A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
lamp
halves
lamp socket
light emitting
Prior art date
Application number
PCT/IB2014/059227
Other languages
French (fr)
Inventor
Nadin Roesler
Bertrand Johan Edward Hontele
Matje MAESSEN
Aldo Tralli
Pascal Jean Henri Bloemen
Bijan VATAN KHAH
Lukas Kuepper
Original Assignee
Koninklijke Philips N.V.
Philips Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips N.V., Philips Deutschland Gmbh filed Critical Koninklijke Philips N.V.
Publication of WO2014132186A1 publication Critical patent/WO2014132186A1/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F21S41/192—Details of lamp holders, terminals or connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14—Light emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/19—Attachment of light sources or lamp holders
    • F21S43/195—Details of lamp holders, terminals or connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/49—Attachment of the cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/04—Provision of filling media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/90—Light sources with three-dimensionally disposed light-generating elements on two opposite sides of supports or substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Definitions

  • the present invention relates to a LED lamp (LED: light emitting diode) comprising at least two light emitting diodes arranged on two opposing sides of a carrier, in particular of a printed circuit board (PCB), a heat sink and a lamp socket.
  • LED light emitting diode
  • LED lamps are getting increasingly important in order to replace other types of lamps like halogen lamps or incandescent lamps due to their lower power consumption. It is often necessary to adapt the design of the LED lamps to the design of the lamps to be replaced in order to avoid any change of the lamp holder.
  • Such LED retrofits are also desirable in the field of motorcycle or scooter headlights. In a motorcycle headlight typically a S2 incandescent light bulb has to be replaced. Reliable LED retrofits with optical performance comparable or better than S2 incandescent solutions are not available up to now. Current LED retrofits on the market are more than one order lower in optical performance compared to the minimum legal requirements for such headlights.
  • the proposed LED lamp comprises at least two light emitting diodes arranged on two opposing sides of a carrier, in particular a printed circuit board, a typically metallic heat sink and a lamp socket.
  • the carrier preferably includes the driver electronics for the light emitting diodes.
  • the driver electronics usually provides a constant current for operation of the LEDs and may comprise e.g. one or several integrated circuits, resistors and inductors as known to the skilled person.
  • the carrier is sandwiched between two halves of the heat sink and electrically connected with the lamp socket, which is mechanically connected to the heat sink.
  • the two halves of the heat sink comprise openings at the location of the light emitting diodes allowing light emission of the light emitting diodes through the openings.
  • halves in this context is not used in a mathematical sense, i.e. does not mean that each half is 50% of the complete heat sink, but only means two parts of the heat sink which together form the complete heat sink.
  • the two halves can be completely identical, but also may differ from each other in their outer shape.
  • the two parts may be separate parts or may also be portions of a one-piece heat sink. In the latter case a slit is formed between the two parts which allows to slide in the carrier.
  • the slit is shaped such that the LEDs on the carrier can pass through the slit , e.g. the slit may have a cross-section with an increased width in the center.
  • the LED lamp is described using a printed circuit board as the carrier. Nevertheless also other types of carriers may be used in the same manner,
  • the electrical driver is preferably implemented in one single printed circuit board which enables short electrical connections.
  • the light emitting diodes are arranged on two opposing sides of the printed circuit board which, when mounted in a motorcycle headlamp, create the high and low beam.
  • the printed circuit board comprises at least six light emitting diodes distributed over the two opposing sides of the printed circuit board.
  • the heat sink is formed by two halves, between which the printed circuit board is sandwiched. The printed circuit board is fully enclosed by the two halves of the heat sink with the exception of a portion of the heat sink extending into the lamp socket, if applicable.
  • the two halves of the heat sink are preferably separate parts connected by screws.
  • the screws have mechanical as well as thermal functionality.
  • the two openings in the heat sink allow nevertheless the light emission by the light emitting diodes. These openings are dimensioned to allow as much as possible unobstructed light emission in each half-space.
  • the printed circuit board sandwiched between the two halves of the heat sink, extents into the lamp socket and may optionally be mechanically fixed in the lamp socket.
  • the printed circuit board is additionally mechanically stabilized when mechanically fixed in the lamp socket.
  • the printed circuit board is mechanically fixed in the lamp socket using a potting material. This allows a very easy mounting of the lamp.
  • at least one half of the heat sink comprises at least one hole to the inside of the lamp socket. This hole is dimensioned to allow injection of the potting material after connecting the socket to the heat sink.
  • the printed circuit board is first sandwiched between the two halves of the heat sink.
  • the lamp socket is then mechanically connected to the heat sink and, as the last step, the potting material is injected through the at least one hole into the lamp socket.
  • the two halves of the heat sink preferably form a circular adapter at the side connected to the lamp socket, onto which the lamp socket fits.
  • the inner sides of the heat sinks are appropriately shaped, e.g. provide corresponding inlays and alignment protrusions, in particular pins.
  • the shape, protrusions or pins only allow the placement of the printed circuit board in one defined position.
  • the two halves of the heat sink can be formed different from one another, i.e. must not have the same dimensions or form, but are preferably formed identical.
  • the proposed LED lamp is easy to assemble and can be designed to meet the optical, thermal, electrical and mechanical requirements for the use in a motorcycle or scooter headlight. Nevertheless, the proposed LED lamp may also be used in other types of lamps. BRIEF DESCRIPTION OF THE DRAWINGS
  • Fig. 1 an exploded view of an example of the proposed LED lamp
  • Fig. 2 an exemplary view showing the connection of the heat sink with the lamp socket
  • Fig. 3 an exemplary view of the inner sides of the two halves of the heat sinks with the printed circuit board attached to one of the two halves;
  • Fig 4 an exemplary view of the completely mounted LED lamp showing the hole through which the potting material is injected.
  • FIG. 1 An exploded view of an example of the proposed LED lamp is shown in figure 1.
  • the figure shows the printed circuit board 1, the two halves 3a, 3b of the heat sink and the lamp socket 4.
  • Four light emitting diodes 2 can be recognized at one of the sides of the printed circuit board.
  • the two halves 3a, 3b of the heat sink comprise openings 5 which correspond in location to the position of the light emitting diodes 2 on the printed circuit board 1.
  • the openings 5 widen from the printed circuit board 1 towards the outside in order to achieve a sufficiently large solid angle of optical emission.
  • the surface of the heat sink may be provided with a white color, e.g. by anodisation, in order to avoid absorption of light emitted by the LEDs.
  • the lamp socket 4 is designed like a S2 lamp socket (BA20), so that the mounted lamp can replace such a S2 bulb in a corresponding lamp holder.
  • the lamp socket 4 is mechanically connected to the heat sink.
  • the two halves 3 a, 3b of the heat sink form a circular adapter 6 when mounted together, onto which the lamp socket 4 fits.
  • the printed circuit board 1 comprises an upper portion carrying the light emitting diodes and a lower portion extending into the lamp socket 4.
  • the upper portion and the lower portion are connected by small bars of the printed circuit board in this embodiment. These small bars match the cooling fins of the heat sink so that the printed circuit board is completely covered by the two halves 3 a, 3b of the heat sink outside the lamp socket 4.
  • a potting material is injected into the lamp socket 4 in order to fix the extended portion of the printed circuit board 1 within the lamp socket 4.
  • Fig. 2 shows the situation after screwing the two halves 3a, 3b of the heat sink together, sandwiching the printed circuit board 1, and before connecting the lamp socket 4 to the heat sink.
  • the extended portion of the printed circuit board 1 which extents into the lamp socket 4 after mounting of the lamp can be recognized.
  • the three light emitting diodes 2 on one side of the printed circuit board 1 are visible through the opening 5 of one of the halves 3b of the heat sink.
  • Fig. 3 shows the inner sides of the two halves 3a, 3b of the heat sink.
  • the printed circuit board 1 is already arranged in one of these halves 3b.
  • the inner sides of the two halves comprise a flat deepening 7 into which the printed circuit board 1 fits.
  • additional pins 8 are arranged in these inner sides. These additional pins 8 ensure that the printed circuit board 1 is placed in the proper position and orientation.
  • the part of the printed circuit board which does not extend into the lamp socket 4 is completely enclosed by the two halves 3a, 3b of the heat sink. Therefore, the whole surface of the printed circuit board, except of the region of the light emitting diodes 2, is in thermal contact with the heat sink achieving a high cooling performance.
  • the heat sink also provides cooling fins 9 extending from the region of the printed circuit board 1 to at least two sides as shown in the figure.
  • Fig. 4 shows a view of the mounted LED-lamp.
  • the hole 10 for the injection of potting material into the lamp socket 4 can be recognized.
  • the figure also shows a corresponding injection gun 12.
  • An example for an appropriate potting material is a silicon based potting material.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The present invention relates to a LED lamp suitable as a retrofit for S2 incandescent bulbs. The lamp comprises at least two light emitting diodes (2) arranged on two opposing sides of a carrier (1), a heat sink and a lamp socket (4). The carrier (1) preferably includes the driver electronics for the light emitting diodes (2). The carrier (1) is sandwiched between two halves (3a, 3b) of the heat sink and electrically connected with the lamp socket (4), which is connected to the heat sink. The two halves (3a, 3b) of the heat sink comprise openings (5) at the location of the light emitting diodes (2) allowing light emission of the light emitting diodes (2) through the openings (5). The proposed LED lamp has a high thermal and optical performance allowing the replacement of S2 incandescent bulbs in headlights of motorcycles or scooters.

Description

LED lamp, in particular for a motorcycle headlight
FIELD AND BACKGROUND OF THE INVENTION
The present invention relates to a LED lamp (LED: light emitting diode) comprising at least two light emitting diodes arranged on two opposing sides of a carrier, in particular of a printed circuit board (PCB), a heat sink and a lamp socket..
LED lamps are getting increasingly important in order to replace other types of lamps like halogen lamps or incandescent lamps due to their lower power consumption. It is often necessary to adapt the design of the LED lamps to the design of the lamps to be replaced in order to avoid any change of the lamp holder. Such LED retrofits are also desirable in the field of motorcycle or scooter headlights. In a motorcycle headlight typically a S2 incandescent light bulb has to be replaced. Reliable LED retrofits with optical performance comparable or better than S2 incandescent solutions are not available up to now. Current LED retrofits on the market are more than one order lower in optical performance compared to the minimum legal requirements for such headlights.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide a LED lamp which can be designed as a LED retrofit of a S2 incandescent bulb, having a similar optical beam performance as such a bulb and thus allowing to replace this bulb, in particular in motorcycle or scooter headlights.
The object is achieved with the LED lamp according to claim 1. Advantageous embodiments of this LED lamp are subject matter of the dependent claims or are described in the subsequent portions of the description and preferred embodiment.
The proposed LED lamp comprises at least two light emitting diodes arranged on two opposing sides of a carrier, in particular a printed circuit board, a typically metallic heat sink and a lamp socket. The carrier preferably includes the driver electronics for the light emitting diodes. The driver electronics usually provides a constant current for operation of the LEDs and may comprise e.g. one or several integrated circuits, resistors and inductors as known to the skilled person. In the proposed LED lamp the carrier is sandwiched between two halves of the heat sink and electrically connected with the lamp socket, which is mechanically connected to the heat sink. The two halves of the heat sink comprise openings at the location of the light emitting diodes allowing light emission of the light emitting diodes through the openings. The term "halves" in this context is not used in a mathematical sense, i.e. does not mean that each half is 50% of the complete heat sink, but only means two parts of the heat sink which together form the complete heat sink. The two halves can be completely identical, but also may differ from each other in their outer shape. The two parts may be separate parts or may also be portions of a one-piece heat sink. In the latter case a slit is formed between the two parts which allows to slide in the carrier. The slit is shaped such that the LEDs on the carrier can pass through the slit , e.g. the slit may have a cross-section with an increased width in the center.
In the following, the LED lamp is described using a printed circuit board as the carrier. Nevertheless also other types of carriers may be used in the same manner, In this LED lamp the electrical driver is preferably implemented in one single printed circuit board which enables short electrical connections. The light emitting diodes are arranged on two opposing sides of the printed circuit board which, when mounted in a motorcycle headlamp, create the high and low beam. Preferably, the printed circuit board comprises at least six light emitting diodes distributed over the two opposing sides of the printed circuit board. The heat sink is formed by two halves, between which the printed circuit board is sandwiched. The printed circuit board is fully enclosed by the two halves of the heat sink with the exception of a portion of the heat sink extending into the lamp socket, if applicable. This results in a large- area thermal contact between the printed circuit board and the heat sink which enables perfect thermal performance and at the same time creates the mechanical mounting. The two halves of the heat sink are preferably separate parts connected by screws. The screws have mechanical as well as thermal functionality. The two openings in the heat sink allow nevertheless the light emission by the light emitting diodes. These openings are dimensioned to allow as much as possible unobstructed light emission in each half-space. With such a construction a compact design of the lamp is achieved, allowing at the same time a high thermal and thus also optical performance as well as a cost efficient way of assembly in production. Due to this compact design and the high optical performance the lamp can be dimensioned as a retrofit for a S2 incandescent bulb and can replace such a bulb in motorcycle or scooter head lights.
In a preferred embodiment, the printed circuit board, sandwiched between the two halves of the heat sink, extents into the lamp socket and may optionally be mechanically fixed in the lamp socket. With this design, separate electrical connections, in particular cables, between the printed circuit board and the lamp socket are avoided, allowing an easier mounting of the lamp. Furthermore, the printed circuit board is additionally mechanically stabilized when mechanically fixed in the lamp socket. Preferably, the printed circuit board is mechanically fixed in the lamp socket using a potting material. This allows a very easy mounting of the lamp. To this end, at least one half of the heat sink comprises at least one hole to the inside of the lamp socket. This hole is dimensioned to allow injection of the potting material after connecting the socket to the heat sink. During mounting, the printed circuit board is first sandwiched between the two halves of the heat sink. The lamp socket is then mechanically connected to the heat sink and, as the last step, the potting material is injected through the at least one hole into the lamp socket.
For the connection between the lamp socket and the heat sink, the two halves of the heat sink preferably form a circular adapter at the side connected to the lamp socket, onto which the lamp socket fits. In order to allow an easy alignment of the printed circuit board between the two halves of the heat sink, the inner sides of the heat sinks are appropriately shaped, e.g. provide corresponding inlays and alignment protrusions, in particular pins. The shape, protrusions or pins only allow the placement of the printed circuit board in one defined position. The two halves of the heat sink can be formed different from one another, i.e. must not have the same dimensions or form, but are preferably formed identical.
The proposed LED lamp is easy to assemble and can be designed to meet the optical, thermal, electrical and mechanical requirements for the use in a motorcycle or scooter headlight. Nevertheless, the proposed LED lamp may also be used in other types of lamps. BRIEF DESCRIPTION OF THE DRAWINGS
The proposed LED lamp is described in the following by way of example in connection with the accompanying figures. The figures show:
Fig. 1 an exploded view of an example of the proposed LED lamp;
Fig. 2 an exemplary view showing the connection of the heat sink with the lamp socket;
Fig. 3 an exemplary view of the inner sides of the two halves of the heat sinks with the printed circuit board attached to one of the two halves; and
Fig 4 an exemplary view of the completely mounted LED lamp showing the hole through which the potting material is injected. DETAILED DESCRIPTION OF EMBODIMENTS
An exploded view of an example of the proposed LED lamp is shown in figure 1. The figure shows the printed circuit board 1, the two halves 3a, 3b of the heat sink and the lamp socket 4. Four light emitting diodes 2 can be recognized at one of the sides of the printed circuit board. The two halves 3a, 3b of the heat sink comprise openings 5 which correspond in location to the position of the light emitting diodes 2 on the printed circuit board 1. The openings 5 widen from the printed circuit board 1 towards the outside in order to achieve a sufficiently large solid angle of optical emission. The surface of the heat sink may be provided with a white color, e.g. by anodisation, in order to avoid absorption of light emitted by the LEDs. Other three light emitting diodes are arranged on the opposite side of the printed circuit board 1 on the same location. These further light emitting diodes can not be seen in this exploded view. When mounting this LED lamp the printed circuit board 1 is sandwiched between the two halves 3 a, 3b of the heat sink which are screwed together layering the printed circuit board 1. The screws 11 are indicated in the figure. The lamp socket 4 is designed like a S2 lamp socket (BA20), so that the mounted lamp can replace such a S2 bulb in a corresponding lamp holder. After sandwiching the printed circuit board 1 between the two halves 3 a, 3b of the heat sink, the lamp socket 4 is mechanically connected to the heat sink. To this end, the two halves 3 a, 3b of the heat sink form a circular adapter 6 when mounted together, onto which the lamp socket 4 fits.
In this embodiment, the printed circuit board 1 comprises an upper portion carrying the light emitting diodes and a lower portion extending into the lamp socket 4. The upper portion and the lower portion are connected by small bars of the printed circuit board in this embodiment. These small bars match the cooling fins of the heat sink so that the printed circuit board is completely covered by the two halves 3 a, 3b of the heat sink outside the lamp socket 4. After mounting the two halves 3 a, 3b of the heat sink and fitting the lamp socket 4, a potting material is injected into the lamp socket 4 in order to fix the extended portion of the printed circuit board 1 within the lamp socket 4.
Fig. 2 shows the situation after screwing the two halves 3a, 3b of the heat sink together, sandwiching the printed circuit board 1, and before connecting the lamp socket 4 to the heat sink. In this view, the extended portion of the printed circuit board 1 which extents into the lamp socket 4 after mounting of the lamp can be recognized. Also the three light emitting diodes 2 on one side of the printed circuit board 1 are visible through the opening 5 of one of the halves 3b of the heat sink. Fig. 3 shows the inner sides of the two halves 3a, 3b of the heat sink. The printed circuit board 1 is already arranged in one of these halves 3b. The inner sides of the two halves comprise a flat deepening 7 into which the printed circuit board 1 fits. In order to achieve a proper alignment additional pins 8 are arranged in these inner sides. These additional pins 8 ensure that the printed circuit board 1 is placed in the proper position and orientation. The part of the printed circuit board which does not extend into the lamp socket 4 is completely enclosed by the two halves 3a, 3b of the heat sink. Therefore, the whole surface of the printed circuit board, except of the region of the light emitting diodes 2, is in thermal contact with the heat sink achieving a high cooling performance. The heat sink also provides cooling fins 9 extending from the region of the printed circuit board 1 to at least two sides as shown in the figure.
Fig. 4 shows a view of the mounted LED-lamp. In this figure, the hole 10 for the injection of potting material into the lamp socket 4 can be recognized. The figure also shows a corresponding injection gun 12. An example for an appropriate potting material is a silicon based potting material.
While the invention has been illustrated and described in detail in the drawings and forgoing description, such illustration and description are to be considered illustrative or exemplary and not restrictive; the invention is not limited to the disclosed embodiments. For example, although the figures show a particular geometrical form of the heat sink, including the number and form of the cooling fins and the form of the openings, also another form of the heat sink may be selected. The same applies to the geometrical form of the printed circuit board. The heat sink and/or the printed circuit board may also be mechanically connected to the socket by other measures, e.g. by soldering or by clamping. Other variations of the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed invention, from a study of the drawings, the disclosure, and the appended claims. In the claims the word "comprising" does not exclude other elements or steps and the indefinite article "a" or "an" does not exclude a plurality. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures can not be used to advantage. In particular, all claims of the lamp can be freely combined. The reference signs in the claims should not be construed as limiting the scope. LIST OF REFERENCE SIGNS:
1 printed circuit board
2 light emitting diodes
3a, b halves of the heat sink
4 lamp socket
5 opening
6 circular adapter
7 flat deepening
8 pins
9 cooling fin
10 injection hole
11 screw
12 injection gun

Claims

CLAIMS:
1. A LED lamp comprising at least two light emitting diodes (2) arranged on two opposing sides of a carrier (1), a heat sink and a lamp socket (4), wherein
the carrier (1) is sandwiched between two halves (3a, 3b) of the heat sink and electrically connected to the lamp socket (4), which is mechanically connected to the heat sink, and
the two halves (3a, 3b) of the heat sink comprise openings (5) at the location of the light emitting diodes (2) allowing light emission of the light emitting diodes (2) through the openings (5).
2. The lamp according to claim 1,
wherein the carrier (1) extends into the lamp socket (4).
3. The lamp according to claim 2,
wherein the carrier (1) is mechanically fixed in the lamp socket (4) by a potting material.
4. The lamp according to claim 3,
wherein at least one of the two halves (3 a, 3b) of the heat sink comprises at least one hole (10) to the inside of the lamp socket (4), said hole (10) being dimensioned to allow injection of the potting material after connecting the lamp socket (4) to the heat sink.
5. The lamp according to claim 1,
wherein the carrier (1) includes a driver electronics for the light emitting diodes (2).
6. The lamp according to claim 1,
wherein the carrier (1) is a printed circuit board.
7. The lamp according to claim 1,
wherein the two halves (3a, 3b) of the heat sink form a circular adaptor (6) at the side connected to the lamp socket (4), onto which the lamp socket (4) fits.
8. The lamp according to claim 1
wherein inner sides of the two halves (3 a, 3b) of the heat sink are shaped to align the printed circuit board (1) in a defined position and orientation between the two halves (3a, 3b).
9. The lamp according to claim 1,
wherein two halves (3a, 3b) of the heat sink are formed identical.
10. The lamp according to claim 1,
wherein the two halves (3a, 3b) of the heat sink are separate parts connected by screws (11).
11. The lamp according to claim 1,
wherein lamp is dimensioned to form a retrofit of a S2 incandescent lamp.
12. The use of the lamp according to claim 1 in a headlight of a motorcycle or scooter.
PCT/IB2014/059227 2013-02-27 2014-02-25 Led lamp, in particular for a motorcycle headlight WO2014132186A1 (en)

Applications Claiming Priority (4)

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US201361769784P 2013-02-27 2013-02-27
US61/769,784 2013-02-27
US201361802827P 2013-03-18 2013-03-18
US61/802,827 2013-03-18

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EP3104067A1 (en) * 2015-06-08 2016-12-14 Epistar Corporation Lighting apparatus
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WO2016177584A1 (en) * 2015-05-04 2016-11-10 Philips Lighting Holding B.V. Repeatable louver accessory for luminaires
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JP2018190488A (en) * 2017-04-28 2018-11-29 Ｉｐｆ株式会社 LED bulb for vehicle
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