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WO2014130967A3 - Layered assemblies - Google Patents

Layered assemblies Download PDF

Info

Publication number
WO2014130967A3
WO2014130967A3 PCT/US2014/018096 US2014018096W WO2014130967A3 WO 2014130967 A3 WO2014130967 A3 WO 2014130967A3 US 2014018096 W US2014018096 W US 2014018096W WO 2014130967 A3 WO2014130967 A3 WO 2014130967A3
Authority
WO
WIPO (PCT)
Prior art keywords
layered assemblies
layers
societies
enterprises
translating
Prior art date
Application number
PCT/US2014/018096
Other languages
French (fr)
Other versions
WO2014130967A2 (en
Inventor
Pratheev Sreetharan
Original Assignee
Pratheev Sreetharan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pratheev Sreetharan filed Critical Pratheev Sreetharan
Publication of WO2014130967A2 publication Critical patent/WO2014130967A2/en
Publication of WO2014130967A3 publication Critical patent/WO2014130967A3/en
Priority to US14/834,336 priority Critical patent/US10349543B2/en
Priority to US15/073,436 priority patent/US20160201662A1/en
Priority to US16/279,966 priority patent/US11325828B2/en
Priority to US16/431,476 priority patent/US10721828B2/en
Priority to US16/933,585 priority patent/US11832404B2/en
Priority to US17/739,959 priority patent/US20220259038A1/en
Priority to US18/385,320 priority patent/US20240074073A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00007—Assembling automatically hinged components, i.e. self-assembly processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/019—Bonding or gluing multiple substrate layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

An assembly structure is formed of generally rigid layers of material bonded to generally flexible layers so as to form apparatus including hinges, bearings, and other translating and rotating subunits along with embedded functional devices. The ability to manufacture goods efficiently and with superior functionality has long been a key determinant of economic success for individuals, enterprises and societies.
PCT/US2014/018096 2013-02-22 2014-02-24 Layered assemblies WO2014130967A2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
US14/834,336 US10349543B2 (en) 2013-02-22 2015-08-24 Layered assemblies
US15/073,436 US20160201662A1 (en) 2013-02-22 2016-03-17 Zipping actuator fluid motivation
US16/279,966 US11325828B2 (en) 2013-02-22 2019-02-19 High-volume millimeter scale manufacturing
US16/431,476 US10721828B2 (en) 2013-02-22 2019-06-04 Layered assemblies
US16/933,585 US11832404B2 (en) 2013-02-22 2020-07-20 Layered assemblies
US17/739,959 US20220259038A1 (en) 2013-02-22 2022-05-09 High-volume millimeter scale manufacturing
US18/385,320 US20240074073A1 (en) 2013-02-22 2023-10-30 Layered assemblies

Applications Claiming Priority (22)

Application Number Priority Date Filing Date Title
US201361768397P 2013-02-22 2013-02-22
US61/768,397 2013-02-22
US201361768494P 2013-02-24 2013-02-24
US61/768,494 2013-02-24
US201361771847P 2013-03-02 2013-03-02
US61/771,847 2013-03-02
US201361772239P 2013-03-04 2013-03-04
US201361772257P 2013-03-04 2013-03-04
US61/772,239 2013-03-04
US61/772,257 2013-03-04
US201361775867P 2013-03-11 2013-03-11
US201361775852P 2013-03-11 2013-03-11
US61/775,867 2013-03-11
US61/775,852 2013-03-11
US201361788698P 2013-03-15 2013-03-15
US61/788,698 2013-03-15
US201361821495P 2013-05-09 2013-05-09
US61/821,495 2013-05-09
US201461933037P 2014-01-29 2014-01-29
US201461933027P 2014-01-29 2014-01-29
US61/933,027 2014-01-29
US61/933,037 2014-01-29

Related Parent Applications (4)

Application Number Title Priority Date Filing Date
US14/834,336 Continuation-In-Part US10349543B2 (en) 2013-02-22 2015-08-24 Layered assemblies
US15/073,436 Continuation-In-Part US20160201662A1 (en) 2013-02-22 2016-03-17 Zipping actuator fluid motivation
US16/279,966 Continuation US11325828B2 (en) 2013-02-22 2019-02-19 High-volume millimeter scale manufacturing
US16/431,476 Continuation US10721828B2 (en) 2013-02-22 2019-06-04 Layered assemblies

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US14/834,336 Continuation-In-Part US10349543B2 (en) 2013-02-22 2015-08-24 Layered assemblies

Publications (2)

Publication Number Publication Date
WO2014130967A2 WO2014130967A2 (en) 2014-08-28
WO2014130967A3 true WO2014130967A3 (en) 2014-10-16

Family

ID=51391980

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2014/018096 WO2014130967A2 (en) 2013-02-22 2014-02-24 Layered assemblies

Country Status (1)

Country Link
WO (1) WO2014130967A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10315220B2 (en) 2014-02-11 2019-06-11 Vibrant Composites Inc. Complex mass trajectories for improved haptic effect

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10710118B2 (en) 2014-02-11 2020-07-14 Vibrant Composites Inc. Complex mass trajectories for improved haptic effect
US9778772B2 (en) 2015-09-16 2017-10-03 Microsoft Technology Licensing, Llc Bendable device with display in movable connection with body

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020168144A1 (en) * 2001-04-30 2002-11-14 Xerox Corporation Micro-opto-electro-mechanical system (MOEMS)
US20040007970A1 (en) * 2000-07-18 2004-01-15 Kelvin Ma Micro electro mechanical system controlled organic LED and pixel arrays and method of using and of manufacturing same
US20040055151A1 (en) * 2002-06-14 2004-03-25 Samuel Obi Micro systems
US20070013052A1 (en) * 2005-07-15 2007-01-18 Silicon Matrix, Pte., Ltd. MEMS packaging method for enhanced EMI immunity using flexible substrates
US20090213450A1 (en) * 2004-09-27 2009-08-27 Idc, Llc Support structures for electromechanical systems and methods of fabricating the same
US20110186943A1 (en) * 2005-11-10 2011-08-04 Epcos Ag MEMS Package and Method for the Production Thereof
WO2012109559A1 (en) * 2011-02-11 2012-08-16 President And Fellows Of Harvard College Monolithic fabrication of three-dimensional structures
US20120217031A1 (en) * 2008-05-21 2012-08-30 Stalford Harold L Three dimentional (3d) robotic micro electro mechanical systems (mems) arm and system

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040007970A1 (en) * 2000-07-18 2004-01-15 Kelvin Ma Micro electro mechanical system controlled organic LED and pixel arrays and method of using and of manufacturing same
US20020168144A1 (en) * 2001-04-30 2002-11-14 Xerox Corporation Micro-opto-electro-mechanical system (MOEMS)
US20040055151A1 (en) * 2002-06-14 2004-03-25 Samuel Obi Micro systems
US20090213450A1 (en) * 2004-09-27 2009-08-27 Idc, Llc Support structures for electromechanical systems and methods of fabricating the same
US20070013052A1 (en) * 2005-07-15 2007-01-18 Silicon Matrix, Pte., Ltd. MEMS packaging method for enhanced EMI immunity using flexible substrates
US20110186943A1 (en) * 2005-11-10 2011-08-04 Epcos Ag MEMS Package and Method for the Production Thereof
US20120217031A1 (en) * 2008-05-21 2012-08-30 Stalford Harold L Three dimentional (3d) robotic micro electro mechanical systems (mems) arm and system
WO2012109559A1 (en) * 2011-02-11 2012-08-16 President And Fellows Of Harvard College Monolithic fabrication of three-dimensional structures

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10315220B2 (en) 2014-02-11 2019-06-11 Vibrant Composites Inc. Complex mass trajectories for improved haptic effect
US10828674B2 (en) 2014-02-11 2020-11-10 Vibrant Composites Inc. Complex mass trajectories for improved haptic effect
US11465175B2 (en) 2014-02-11 2022-10-11 Vibrant Composites Inc. Complex mass trajectories for improved haptic effect

Also Published As

Publication number Publication date
WO2014130967A2 (en) 2014-08-28

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