WO2014036778A1 - 有机发光二极管显示面板及其制造方法 - Google Patents
有机发光二极管显示面板及其制造方法 Download PDFInfo
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- WO2014036778A1 WO2014036778A1 PCT/CN2012/082835 CN2012082835W WO2014036778A1 WO 2014036778 A1 WO2014036778 A1 WO 2014036778A1 CN 2012082835 W CN2012082835 W CN 2012082835W WO 2014036778 A1 WO2014036778 A1 WO 2014036778A1
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- film transistor
- thin film
- transistor array
- array substrate
- sintered
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- 239000000758 substrate Substances 0.000 claims abstract description 140
- 239000010409 thin film Substances 0.000 claims abstract description 138
- 239000000853 adhesive Substances 0.000 claims abstract description 94
- 230000001070 adhesive effect Effects 0.000 claims abstract description 94
- 238000005728 strengthening Methods 0.000 claims abstract description 53
- 239000002245 particle Substances 0.000 claims description 36
- 239000003292 glue Substances 0.000 claims description 24
- 230000003014 reinforcing effect Effects 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 15
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims 1
- 229920003023 plastic Polymers 0.000 claims 1
- 238000005245 sintering Methods 0.000 abstract description 3
- 238000001723 curing Methods 0.000 description 19
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000003848 UV Light-Curing Methods 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/851—Division of substrate
Definitions
- the present invention relates to the field of organic light emitting diode display technologies, and in particular, to an organic light emitting diode display panel and a method of fabricating the same.
- the thin film transistor array substrate 101 and the cap plate 102 are then used.
- the pair is performed, and the combination of the thin film transistor array substrate 101 and the cap plate 102 is cut at a position between the two sub-substrates.
- the sinter is provided at the edges of two adjacent sub-substrates of the thin film transistor array substrate 101, as shown in FIGS. 1 and 2, and the two adjacent ones There is a gap between the sintered glues (1032 and 1033) of the sub-substrate, and the thin film transistor array substrate 101 and the cap plate 102 are in a negative pressure state. Therefore, after the thin film transistor array substrate 101 and the cap plate 102 are grouped, the cover is The plate 102 or the thin film transistor array substrate 101 is warped, and the sintered paste disposed between the thin film transistor array substrate 101 and the cap plate 102 becomes a fulcrum of the warpage of the cap plate 102 or the thin film transistor array substrate 101.
- the thin film transistor array substrate 101 and the cap plate 102 are cut, since the thin film transistor array substrate 101 or the cap plate 102 is warped, the thin film transistor array substrate 101 and the cap plate 102 cannot be fastened, so any one of them The displacement is easy to occur, so that the combined structural strength of the thin film transistor array substrate 101 and the cap plate 102 is low.
- the sintered paste is disposed between the thin film transistor array substrate 101 and the cap plate 102, when the thin film transistor array substrate 101 or When the middle portion of the cap plate 102 is pressed, the vulcanizate located at the edge of the thin film transistor array substrate 101 and the cap plate 102 tends to serve as a fulcrum, and the edge of the thin film transistor array substrate 101 or the edge of the cap plate 102 surrounds this fulcrum.
- the warpage causes the structure of the OLED display panel to be unstable, which affects the quality of the OLED display panel.
- An object of the present invention is to provide a method of fabricating an organic light emitting diode display panel which can slow or prevent warpage of a thin film transistor array substrate or a cover plate and improve the structural strength of a combination of a thin film transistor array substrate and a cover plate.
- Another object of the present invention is to provide an organic light emitting diode display panel which can slow or prevent warpage of a thin film transistor array substrate or a cover sheet and improve the structural strength of a combination of a thin film transistor array substrate and a cover sheet.
- the present invention provides a method of fabricating an organic light emitting diode display panel, the method comprising the steps of: (A) providing a thin film transistor array substrate and a cap plate, the thin film transistor array substrate comprising a first thin film transistor array substrate and a second a thin film transistor array substrate having a first connection region between the first and second thin film transistor array substrates, wherein the cover plate is provided with a first sintered rubber, a second sintered rubber, a third sintered rubber, and a fourth sintered rubber a region between the first sintered rubber and the second sintered rubber on the cover plate corresponding to the first thin film transistor array substrate, and a region between the third sintered rubber and the fourth sintered rubber on the cover plate Corresponding to the second thin film transistor array substrate, a second connection region is formed between the second sintered rubber and the third sintered rubber on the cover plate, and the position of the first connection region and the position of the second connection region are Corresponding; (B) disposing a structural strengthening glue on a second connection region of the cover plate
- the method further comprises the step of: (E) curing the structural strengthening adhesive.
- the structural strengthening adhesive comprises an ultraviolet curing adhesive
- the step (E) comprises the steps of: (e1) irradiating the ultraviolet curing adhesive with an ultraviolet light source, so that the UV curing adhesive cures.
- the structural reinforcing rubber contains particles
- the step (b1) further includes the following steps: (b2) providing the ultraviolet light curing glue and particles; and (b3) The granules are mixed with the UV curable glue.
- the particles are a polyhedron or a sphere.
- Another object of the present invention is to provide a method of fabricating an organic light emitting diode display panel which can slow or prevent warpage of a thin film transistor array substrate or a cover plate and improve the structural strength of a combination of a thin film transistor array substrate and a cover plate.
- the present invention provides a method of fabricating an organic light emitting diode display panel, the method comprising the steps of: (A) providing a thin film transistor array substrate and a cap plate, the thin film transistor array substrate including a first thin film transistor An array substrate and a second thin film transistor array substrate, a first connection region between the first and second thin film transistor array substrates, wherein the cover plate is provided with a first sintered rubber, a second sintered rubber, and a third sintered rubber And a fourth sintered rubber, a region between the first sintered rubber and the second sintered rubber on the cover plate corresponds to the first thin film transistor array substrate, and the third sintered rubber and the fourth sintered rubber on the cover plate Corresponding to the second thin film transistor array substrate, the second sintered rubber on the cover plate and the third sintered rubber have a second connection region, the first connection region is located at the second position Corresponding to the position where the connection region is located; (B) disposing the structural strengthening glue on the second connection region of the cover plate
- the step (B) includes the steps of: (b1) coating the second connection region of the cap plate or the first connection region of the thin film transistor
- the structural strengthening adhesive is such that when the cover plate is integrated with the thin film transistor array substrate, the structural reinforcing adhesive is in contact with the cover plate and the thin film transistor array substrate.
- the method further comprises the step of: (E) curing the structural strengthening adhesive.
- the structural strengthening adhesive comprises an ultraviolet curing adhesive
- the step (E) comprises the steps of: (e1) irradiating the ultraviolet curing adhesive with an ultraviolet light source, so that the UV curing adhesive cures.
- the structural reinforcing rubber contains particles
- the step (b1) further includes the following steps: (b2) providing the ultraviolet light curing glue and particles; and (b3) The granules are mixed with the UV curable glue.
- the particles are a polyhedron or a sphere.
- Another object of the present invention is to provide an organic light emitting diode display panel which can slow or prevent warpage of a thin film transistor array substrate or a cover sheet and improve the structural strength of a combination of a thin film transistor array substrate and a cover sheet.
- the present invention provides an organic light emitting diode display panel, including: a first thin film transistor array substrate; a first cover plate disposed on the first thin film transistor array substrate, the first cover a first sintered rubber and a second sintered rubber are disposed thereon, a region between the first sintered rubber and the second sintered rubber on the first cover plate corresponds to the first thin film transistor array substrate; and a structural strengthening adhesive, The structural strengthening adhesive is disposed outside the first sintered rubber and the second sintered rubber of the first cover, and the structural strengthening adhesive is in contact with the first thin film transistor array substrate and the first cover.
- the structural strengthening adhesive is a mixture of ultraviolet curable adhesive and particles.
- the particles are polyhedrons or spheres.
- the material of the particles is glass.
- the structural strengthening adhesive since the structural strengthening adhesive is disposed on the first connection region of the thin film transistor array substrate or the second connection region of the cover plate, the structural strengthening adhesive can connect or support the thin film transistor array substrate and the cover plate.
- the space corresponding to the first connection region or the second connection region will be partially or completely filled with the structural reinforcing glue, so that the negative pressure state is The air pressure in the space is increased, which slows down or even prevents the warpage of the thin film transistor array substrate or the cover plate due to the presence of a negative pressure state between the thin film transistor array substrate and the cap plate.
- the thin film transistor array substrate and the cover plate can be combined with the sintered rubber (including the first sintered rubber, the second sintered rubber, the third sintered rubber, and the fourth
- the sintered adhesive has a large contact area, that is, the thin film transistor array substrate and the cover plate can be more fully flattened on the sintered rubber, and the effective area of the sintered adhesive is sealed by using a laser, thereby making the thin film transistor array substrate, The combination of the cover plate and the sintered glue is more robust.
- the structural strengthening adhesive can enhance the structure of the organic light emitting diode display panel.
- the structural reinforcing glue can apply a pulling force to the edge of the cover plate to prevent the cover plate from being warped, thereby making the structure of the organic light emitting diode display panel of the present invention more stable.
- the structural strengthening rubber contains particles, the particles are mixed with the ultraviolet curing glue. Therefore, the structural strengthening rubber has stronger cohesive force and strength after curing, which is beneficial to strengthening the service life of the structural strengthening rubber, thereby strengthening
- the OLED of the present invention displays the useful life of the panel.
- FIG. 1 is a schematic view of a conventional organic light emitting diode display panel array before cutting
- Figure 2 is a schematic view of the A-A' section of Figure 1;
- 3A, 3B, 3C and 3D are schematic views showing a method of manufacturing an organic light emitting diode display panel of the present invention.
- FIG. 4 is a flow chart of a method of fabricating an organic light emitting diode display panel of the present invention.
- FIG. 5 is a schematic view showing the structure of an organic light emitting diode display panel of the present invention.
- FIGS. 3A, 3B, 3C, 3D and FIG. 4 are schematic views showing a method of manufacturing an organic light emitting diode display panel according to the present invention
- FIG. 4 is a flow chart of a method for fabricating an organic light emitting diode display panel according to the present invention.
- a thin film transistor array substrate 201 and a cap plate 202 are provided, wherein the thin film transistor array substrate 201 includes a plurality of sub-thin film transistor array substrates, such as a first thin film transistor array substrate 2011 and a second thin film transistor array substrate 2012, a first film.
- a first connection region is disposed between the transistor array substrate 2011 and the second thin film transistor array substrate 2012.
- the cover plate 202 is provided with a first sintered rubber 2031, a second sintered rubber 2032, a third sintered rubber 2033, and a fourth sintered rubber 2034.
- the area between the first sintered adhesive 2031 and the second sintered adhesive 2032 on the cover plate 202 corresponds to the first thin film transistor array substrate 2011, and the area between the third sintered adhesive 2033 and the fourth sintered adhesive 2034 on the cover 202 is
- the second thin film transistor array substrate 2012 corresponds to a second connection region between the second sintered rubber 2032 and the third sintered rubber 2033 on the cover plate 202, and the position of the first connection region corresponds to the position where the second connection region is located.
- a structural strengthening adhesive 204 is provided for reinforcing the structure of the combination of the thin film transistor array substrate 201 and the cap plate 202.
- a UV curable glue and particles are provided, wherein the particles have less impurities, such that the higher strength and strength of the structural strengthening adhesive 204 are caused, thereby causing the thin film transistor array substrate 201 to The combined structure of the cover plate 202 is more robust.
- the particles are mixed with the UV curable glue to form a structural strengthening adhesive 204.
- the ultraviolet curing adhesive and the particles are stirred sufficiently times that the particles are uniformly distributed throughout the ultraviolet curing adhesive, wherein The particles may be polyhedrons or spheres, and the material of the particles may be glass.
- the structural strengthening adhesive 204 is disposed on the second connection region of the cap plate 202 or the first connection region of the thin film transistor array substrate 201.
- the structural reinforcing adhesive 204 is coated on the second connection region of the cap plate 202 or the first connection region of the thin film transistor array substrate, and is applied to the second connection region of the cap plate 202 or the thin film transistor array substrate 201.
- the amount of structural reinforcing adhesive 204 on a connection region is sufficiently large that when the cover plate 202 is integrated with the thin film transistor array substrate 201, the structural reinforcing adhesive 204 is in contact with the cap plate 202 and the thin film transistor array substrate 201.
- the cap plate 202 and the thin film transistor array substrate 201 are combined into one body.
- structural strengthening adhesive 204 is cured. Specifically, in step 406, the structural strengthening adhesive 204 is irradiated with an ultraviolet light source to cure the ultraviolet curing adhesive in the structural reinforcing adhesive 204.
- step 407 the combination of the thin film transistor array substrate 201 and the cap plate 202 is cut at a predetermined position, which is located at a position corresponding to the second connection region, as shown in FIG. 3, the predetermined position is in FIG. The position shown by line 205.
- the structural reinforcing adhesive 204 since the structural reinforcing adhesive 204 is disposed on the first connection region of the thin film transistor array substrate 201 or the second connection region of the cap plate 202, the structural reinforcing adhesive 204 may be applied to the thin film transistor array substrate 201 and the cap plate 202.
- the space corresponding to the first connection region or the second connection region will be partially or completely structurally strengthened.
- the filling of 204 causes the air pressure of the space in the negative pressure state to be increased, slowing down or even preventing the thin film transistor array substrate 201 or the cover plate 202 from being tilted due to the existence of a negative pressure state between the thin film transistor array substrate 201 and the cap plate 202.
- the phenomenon of music causes the air pressure of the space in the negative pressure state to be increased, slowing down or even preventing the thin film transistor array substrate 201 or the cover plate 202 from being tilted due to the existence of a negative pressure state between the thin film transistor array substrate 201 and the cap plate 202.
- the thin film transistor array substrate 201 or the cap plate 202 can be combined with the sintered rubber (including the first sintered rubber 2031 and the second sintered rubber 2032,
- the three sintered rubber 2033 and the fourth sintered rubber 2034 have a large contact area, that is, the thin film transistor array substrate 201 and the cover plate 202 can be more fully flattened on the sintered rubber, and the sintering adhesive is sealed by using a laser.
- the effective area is such that the combined structure of the thin film transistor array substrate 201, the cap plate 202, and the sintered rubber is more robust.
- FIG. 5 is a schematic diagram showing the structure of an organic light emitting diode display panel of the present invention.
- the OLED display panel of the present invention includes a first thin film transistor array substrate 2011, a first cap plate 2021, and a structural reinforced adhesive 204.
- the first cover 2021 is disposed on the first thin film transistor array substrate 2011.
- the first cover 2021 is provided with a first sintered adhesive 2031 and a second sintered adhesive 2032, and the first sintered adhesive 2031 is mounted on the first cover 2021.
- a region between the second sintered paste 2032 corresponds to the first thin film transistor array substrate 2011.
- the structural strengthening adhesive 204 is disposed on the outer side of the first sintered rubber 2031 and the second sintered rubber 2032 of the first cover 2021, and is coated on the first cover 2021 outside the first sintered rubber 2031 and the second sintered adhesive 2032.
- the amount of the structural strengthening adhesive 204 at the edge is sufficient, so that when the first cover 2021 is integrated with the first thin film transistor array substrate 2011, the structural reinforcing adhesive 204 is combined with the first thin film transistor array substrate 2011 and the first cover. Contact 2021.
- the structural strengthening adhesive 204 is used to strengthen the structure of the combination of the first thin film transistor array substrate 2011 and the first cap plate 2021.
- the structural strengthening adhesive 204 is a mixture of ultraviolet curing glue and particles, the particles have less impurities, so as to make the structural strengthening adhesive have higher cohesion and strength, thereby making the first thin film transistor array substrate 2011 and
- the combined structure of the first cover 2021 is more robust and the particles are evenly distributed throughout the UV curable glue.
- the particles can be polyhedral or spheres.
- the material of the particles may be glass.
- the structural reinforced adhesive 201 is disposed between the first thin film transistor array substrate 2011 and the first cover 2021 of the OLED display panel of the present invention, and the structural reinforced adhesive 204 is located on the first cover 2021 at the first sintered adhesive.
- the structural strengthening adhesive 204 is in contact with the first thin film transistor array substrate 2011 and the first cover 2021, so that the structural reinforcing adhesive 204 can function on the structure of the organic light emitting diode display panel. The role of reinforcement.
- the structural reinforcing adhesive 204 can apply a pulling force to the edge of the first cover 2021 to prevent the first cover 2021 from warping, thereby causing the organic light emitting diode display of the present invention to be displayed.
- the structure of the panel is more stable.
- the first thin film transistor array substrate 2011 or the first cap plate 2021 since the first thin film transistor array substrate 2011 or the first cap plate 2021 is prevented from being warped, the first thin film transistor array substrate 2011 and the first cap plate 2021 can have a large contact area with the sintered rubber, that is, The first thin film transistor array substrate 2011 and the first cover plate 2021 can be more fully flattened on the sintered rubber, and the effective area of the sintered adhesive is sealed by using the laser, so that the first thin film transistor array substrate 2011 and the first cover are The combination of the plate 2021 and the sintered glue is more robust.
- the structural reinforcing adhesive 204 contains an ultraviolet curing adhesive, in the manufacturing process of the organic light emitting diode display panel of the present invention, the ultraviolet curing adhesive can be cured only by irradiating the ultraviolet curing adhesive with an ultraviolet light source. That is, the structural strengthening adhesive 204 is cured, which is advantageous for saving the manufacturing time of the organic light emitting diode display panel of the present invention.
- the structural strengthening adhesive 204 contains particles, the particles are mixed with the ultraviolet curing glue. Therefore, the structural strengthening adhesive 204 has stronger cohesive force and strength after curing, which is beneficial to strengthening the service life of the structural strengthening adhesive 204. Thereby enhancing the service life of the organic light emitting diode display panel of the present invention.
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Abstract
Description
Claims (15)
- 一种有机发光二极管显示面板的制造方法,其中所述方法包括以下步骤:(A)提供薄膜晶体管阵列基板和盖板,所述薄膜晶体管阵列基板包括第一薄膜晶体管阵列基板和第二薄膜晶体管阵列基板,所述第一与第二薄膜晶体管阵列基板之间具有第一连接区,所述盖板上设置有第一烧结胶、第二烧结胶、第三烧结胶和第四烧结胶,所述盖板上第一烧结胶与第二烧结胶之间的区域与所述第一薄膜晶体管阵列基板对应,所述盖板上第三烧结胶与第四烧结胶之间的区域与所述第二薄膜晶体管阵列基板对应,所述盖板上第二烧结胶与第三烧结胶之间具有第二连接区,所述第一连接区所在的位置与所述第二连接区所在的位置对应;(B)将结构强化胶设置在所述盖板的第二连接区或所述薄膜晶体管阵列基板的第一连接区上,所述结构强化胶用于强化所述第一薄膜晶体管阵列基板与所述盖板的组合的结构;(C)将所述盖板与所述薄膜晶体管阵列基板组合为一体;以及(D)对所述薄膜晶体管阵列基板和所述盖板的组合在预定位置上进行切割,所述预定位置位于与所述第二连接区对应的位置上;所述步骤(B)包括以下步骤:(b1)在所述盖板的第二连接区或所述薄膜晶体管的第一连接区上涂布所述结构强化胶,使得当所述盖板与所述薄膜晶体管阵列基板组合为一体时,所述结构强化胶均与所述盖板和所述薄膜晶体管阵列基板相接触。
- 根据权利要求1所述的有机发光二极管显示面板的制造方法,其中在所述步骤(C)和步骤(D)之间,所述方法还包括以下步骤:(E)将所述结构强化胶固化。
- 根据权利要求2所述的有机发光二极管显示面板的制造方法,其中所述结构强化胶包括紫外光固化胶,所述步骤(E)包括以下步骤:(e1)利用紫外线光源照射所述紫外光固化胶,使得所述紫外光固化胶固化。
- 根据权利要求3所述的有机发光二极管显示面板的制造方法,其中所述结构强化胶内含有颗粒,所述步骤(b1)之前还包括以下步骤:(b2)提供所述紫外光固化胶和颗粒;以及(b3)将所述颗粒与所述紫外光固化胶混合在一起。
- 根据权利要求4所述的有机发光二极管显示面板的制造方法,其中所述颗粒是多面体或球体。
- 一种有机发光二极管显示面板的制造方法,其中所述方法包括以下步骤:(A)提供薄膜晶体管阵列基板和盖板,所述薄膜晶体管阵列基板包括第一薄膜晶体管阵列基板和第二薄膜晶体管阵列基板,所述第一与第二薄膜晶体管阵列基板之间具有第一连接区,所述盖板上设置有第一烧结胶、第二烧结胶、第三烧结胶和第四烧结胶,所述盖板上第一烧结胶与第二烧结胶之间的区域与所述第一薄膜晶体管阵列基板对应,所述盖板上第三烧结胶与第四烧结胶之间的区域与所述第二薄膜晶体管阵列基板对应,所述盖板上第二烧结胶与第三烧结胶之间具有第二连接区,所述第一连接区所在的位置与所述第二连接区所在的位置对应;(B)将结构强化胶设置在所述盖板的第二连接区或所述薄膜晶体管阵列基板的第一连接区上;(C)将所述盖板与所述薄膜晶体管阵列基板组合为一体;以及(D)对所述薄膜晶体管阵列基板和所述盖板的组合在预定位置上进行切割,所述预定位置位于与所述第二连接区对应的位置上。
- 根据权利要求6所述的有机发光二极管显示面板的制造方法,其中所述步骤(B)包括以下步骤:(b1)在所述盖板的第二连接区或所述薄膜晶体管的第一连接区上涂布所述结构强化胶,使得当所述盖板与所述薄膜晶体管阵列基板组合为一体时,所述结构强化胶均与所述盖板和所述薄膜晶体管阵列基板相接触。
- 根据权利要求7所述的有机发光二极管显示面板的制造方法,其中在所述步骤(C)和步骤(D)之间,所述方法还包括以下步骤:(E)将所述结构强化胶固化。
- 根据权利要求8所述的有机发光二极管显示面板的制造方法,其中所述结构强化胶包括紫外光固化胶,所述步骤(E)包括以下步骤:(e1)利用紫外线光源照射所述紫外光固化胶,使得所述紫外光固化胶固化。
- 根据权利要求9所述的有机发光二极管显示面板的制造方法,其中所述结构强化胶内含有颗粒,所述步骤(b1)之前还包括以下步骤:(b2)提供所述紫外光固化胶和颗粒;以及(b3)将所述颗粒与所述紫外光固化胶混合在一起。
- 根据权利要求10所述的有机发光二极管显示面板的制造方法,其中所述颗粒是多面体或球体。
- 一种有机发光二极管显示面板,其包括:第一薄膜晶体管阵列基板;第一盖板,设置在所述第一薄膜晶体管阵列基板之上,所述第一盖板上设置有第一烧结胶和第二烧结胶,所述第一盖板上第一烧结胶和第二烧结胶之间的区域与所述第一薄膜晶体管阵列基板对应;以及结构强化胶,所述结构强化胶设置在所述第一盖板的第一烧结胶和第二烧结胶的外侧,并且所述结构强化胶与所述第一薄膜晶体管阵列基板和所述第一盖板相接触。
- 根据权利要求12所述的有机发光二极管显示面板,其中所述结构强化胶为紫外光固化胶与颗粒的混合物。
- 根据权利要求13所述的有机发光二极管显示面板,其中所述颗粒是多面体或球体。
- 根据权利要求14所述的有机发光二极管显示面板,其中所述颗粒的材料是玻璃。
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CN106548987A (zh) * | 2016-12-29 | 2017-03-29 | 长春海谱润斯科技有限公司 | 显示面板及显示面板封装胶涂布方法 |
CN107658391B (zh) * | 2017-09-01 | 2019-12-31 | 信利半导体有限公司 | 一种窄边框pmoled器件的封装方法 |
CN108511500B (zh) * | 2018-05-07 | 2021-10-15 | 广州国显科技有限公司 | 显示屏、其制备方法及显示终端 |
CN111081903A (zh) * | 2019-10-14 | 2020-04-28 | 信利半导体有限公司 | 一种窄边框pmoled器件的封装方法 |
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