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WO2014036778A1 - 有机发光二极管显示面板及其制造方法 - Google Patents

有机发光二极管显示面板及其制造方法 Download PDF

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Publication number
WO2014036778A1
WO2014036778A1 PCT/CN2012/082835 CN2012082835W WO2014036778A1 WO 2014036778 A1 WO2014036778 A1 WO 2014036778A1 CN 2012082835 W CN2012082835 W CN 2012082835W WO 2014036778 A1 WO2014036778 A1 WO 2014036778A1
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WO
WIPO (PCT)
Prior art keywords
film transistor
thin film
transistor array
array substrate
sintered
Prior art date
Application number
PCT/CN2012/082835
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English (en)
French (fr)
Inventor
吴泰必
Original Assignee
深圳市华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Priority to DE112012006883.1T priority Critical patent/DE112012006883B4/de
Priority to US13/701,813 priority patent/US8883527B2/en
Publication of WO2014036778A1 publication Critical patent/WO2014036778A1/zh

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8722Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851Division of substrate

Definitions

  • the present invention relates to the field of organic light emitting diode display technologies, and in particular, to an organic light emitting diode display panel and a method of fabricating the same.
  • the thin film transistor array substrate 101 and the cap plate 102 are then used.
  • the pair is performed, and the combination of the thin film transistor array substrate 101 and the cap plate 102 is cut at a position between the two sub-substrates.
  • the sinter is provided at the edges of two adjacent sub-substrates of the thin film transistor array substrate 101, as shown in FIGS. 1 and 2, and the two adjacent ones There is a gap between the sintered glues (1032 and 1033) of the sub-substrate, and the thin film transistor array substrate 101 and the cap plate 102 are in a negative pressure state. Therefore, after the thin film transistor array substrate 101 and the cap plate 102 are grouped, the cover is The plate 102 or the thin film transistor array substrate 101 is warped, and the sintered paste disposed between the thin film transistor array substrate 101 and the cap plate 102 becomes a fulcrum of the warpage of the cap plate 102 or the thin film transistor array substrate 101.
  • the thin film transistor array substrate 101 and the cap plate 102 are cut, since the thin film transistor array substrate 101 or the cap plate 102 is warped, the thin film transistor array substrate 101 and the cap plate 102 cannot be fastened, so any one of them The displacement is easy to occur, so that the combined structural strength of the thin film transistor array substrate 101 and the cap plate 102 is low.
  • the sintered paste is disposed between the thin film transistor array substrate 101 and the cap plate 102, when the thin film transistor array substrate 101 or When the middle portion of the cap plate 102 is pressed, the vulcanizate located at the edge of the thin film transistor array substrate 101 and the cap plate 102 tends to serve as a fulcrum, and the edge of the thin film transistor array substrate 101 or the edge of the cap plate 102 surrounds this fulcrum.
  • the warpage causes the structure of the OLED display panel to be unstable, which affects the quality of the OLED display panel.
  • An object of the present invention is to provide a method of fabricating an organic light emitting diode display panel which can slow or prevent warpage of a thin film transistor array substrate or a cover plate and improve the structural strength of a combination of a thin film transistor array substrate and a cover plate.
  • Another object of the present invention is to provide an organic light emitting diode display panel which can slow or prevent warpage of a thin film transistor array substrate or a cover sheet and improve the structural strength of a combination of a thin film transistor array substrate and a cover sheet.
  • the present invention provides a method of fabricating an organic light emitting diode display panel, the method comprising the steps of: (A) providing a thin film transistor array substrate and a cap plate, the thin film transistor array substrate comprising a first thin film transistor array substrate and a second a thin film transistor array substrate having a first connection region between the first and second thin film transistor array substrates, wherein the cover plate is provided with a first sintered rubber, a second sintered rubber, a third sintered rubber, and a fourth sintered rubber a region between the first sintered rubber and the second sintered rubber on the cover plate corresponding to the first thin film transistor array substrate, and a region between the third sintered rubber and the fourth sintered rubber on the cover plate Corresponding to the second thin film transistor array substrate, a second connection region is formed between the second sintered rubber and the third sintered rubber on the cover plate, and the position of the first connection region and the position of the second connection region are Corresponding; (B) disposing a structural strengthening glue on a second connection region of the cover plate
  • the method further comprises the step of: (E) curing the structural strengthening adhesive.
  • the structural strengthening adhesive comprises an ultraviolet curing adhesive
  • the step (E) comprises the steps of: (e1) irradiating the ultraviolet curing adhesive with an ultraviolet light source, so that the UV curing adhesive cures.
  • the structural reinforcing rubber contains particles
  • the step (b1) further includes the following steps: (b2) providing the ultraviolet light curing glue and particles; and (b3) The granules are mixed with the UV curable glue.
  • the particles are a polyhedron or a sphere.
  • Another object of the present invention is to provide a method of fabricating an organic light emitting diode display panel which can slow or prevent warpage of a thin film transistor array substrate or a cover plate and improve the structural strength of a combination of a thin film transistor array substrate and a cover plate.
  • the present invention provides a method of fabricating an organic light emitting diode display panel, the method comprising the steps of: (A) providing a thin film transistor array substrate and a cap plate, the thin film transistor array substrate including a first thin film transistor An array substrate and a second thin film transistor array substrate, a first connection region between the first and second thin film transistor array substrates, wherein the cover plate is provided with a first sintered rubber, a second sintered rubber, and a third sintered rubber And a fourth sintered rubber, a region between the first sintered rubber and the second sintered rubber on the cover plate corresponds to the first thin film transistor array substrate, and the third sintered rubber and the fourth sintered rubber on the cover plate Corresponding to the second thin film transistor array substrate, the second sintered rubber on the cover plate and the third sintered rubber have a second connection region, the first connection region is located at the second position Corresponding to the position where the connection region is located; (B) disposing the structural strengthening glue on the second connection region of the cover plate
  • the step (B) includes the steps of: (b1) coating the second connection region of the cap plate or the first connection region of the thin film transistor
  • the structural strengthening adhesive is such that when the cover plate is integrated with the thin film transistor array substrate, the structural reinforcing adhesive is in contact with the cover plate and the thin film transistor array substrate.
  • the method further comprises the step of: (E) curing the structural strengthening adhesive.
  • the structural strengthening adhesive comprises an ultraviolet curing adhesive
  • the step (E) comprises the steps of: (e1) irradiating the ultraviolet curing adhesive with an ultraviolet light source, so that the UV curing adhesive cures.
  • the structural reinforcing rubber contains particles
  • the step (b1) further includes the following steps: (b2) providing the ultraviolet light curing glue and particles; and (b3) The granules are mixed with the UV curable glue.
  • the particles are a polyhedron or a sphere.
  • Another object of the present invention is to provide an organic light emitting diode display panel which can slow or prevent warpage of a thin film transistor array substrate or a cover sheet and improve the structural strength of a combination of a thin film transistor array substrate and a cover sheet.
  • the present invention provides an organic light emitting diode display panel, including: a first thin film transistor array substrate; a first cover plate disposed on the first thin film transistor array substrate, the first cover a first sintered rubber and a second sintered rubber are disposed thereon, a region between the first sintered rubber and the second sintered rubber on the first cover plate corresponds to the first thin film transistor array substrate; and a structural strengthening adhesive, The structural strengthening adhesive is disposed outside the first sintered rubber and the second sintered rubber of the first cover, and the structural strengthening adhesive is in contact with the first thin film transistor array substrate and the first cover.
  • the structural strengthening adhesive is a mixture of ultraviolet curable adhesive and particles.
  • the particles are polyhedrons or spheres.
  • the material of the particles is glass.
  • the structural strengthening adhesive since the structural strengthening adhesive is disposed on the first connection region of the thin film transistor array substrate or the second connection region of the cover plate, the structural strengthening adhesive can connect or support the thin film transistor array substrate and the cover plate.
  • the space corresponding to the first connection region or the second connection region will be partially or completely filled with the structural reinforcing glue, so that the negative pressure state is The air pressure in the space is increased, which slows down or even prevents the warpage of the thin film transistor array substrate or the cover plate due to the presence of a negative pressure state between the thin film transistor array substrate and the cap plate.
  • the thin film transistor array substrate and the cover plate can be combined with the sintered rubber (including the first sintered rubber, the second sintered rubber, the third sintered rubber, and the fourth
  • the sintered adhesive has a large contact area, that is, the thin film transistor array substrate and the cover plate can be more fully flattened on the sintered rubber, and the effective area of the sintered adhesive is sealed by using a laser, thereby making the thin film transistor array substrate, The combination of the cover plate and the sintered glue is more robust.
  • the structural strengthening adhesive can enhance the structure of the organic light emitting diode display panel.
  • the structural reinforcing glue can apply a pulling force to the edge of the cover plate to prevent the cover plate from being warped, thereby making the structure of the organic light emitting diode display panel of the present invention more stable.
  • the structural strengthening rubber contains particles, the particles are mixed with the ultraviolet curing glue. Therefore, the structural strengthening rubber has stronger cohesive force and strength after curing, which is beneficial to strengthening the service life of the structural strengthening rubber, thereby strengthening
  • the OLED of the present invention displays the useful life of the panel.
  • FIG. 1 is a schematic view of a conventional organic light emitting diode display panel array before cutting
  • Figure 2 is a schematic view of the A-A' section of Figure 1;
  • 3A, 3B, 3C and 3D are schematic views showing a method of manufacturing an organic light emitting diode display panel of the present invention.
  • FIG. 4 is a flow chart of a method of fabricating an organic light emitting diode display panel of the present invention.
  • FIG. 5 is a schematic view showing the structure of an organic light emitting diode display panel of the present invention.
  • FIGS. 3A, 3B, 3C, 3D and FIG. 4 are schematic views showing a method of manufacturing an organic light emitting diode display panel according to the present invention
  • FIG. 4 is a flow chart of a method for fabricating an organic light emitting diode display panel according to the present invention.
  • a thin film transistor array substrate 201 and a cap plate 202 are provided, wherein the thin film transistor array substrate 201 includes a plurality of sub-thin film transistor array substrates, such as a first thin film transistor array substrate 2011 and a second thin film transistor array substrate 2012, a first film.
  • a first connection region is disposed between the transistor array substrate 2011 and the second thin film transistor array substrate 2012.
  • the cover plate 202 is provided with a first sintered rubber 2031, a second sintered rubber 2032, a third sintered rubber 2033, and a fourth sintered rubber 2034.
  • the area between the first sintered adhesive 2031 and the second sintered adhesive 2032 on the cover plate 202 corresponds to the first thin film transistor array substrate 2011, and the area between the third sintered adhesive 2033 and the fourth sintered adhesive 2034 on the cover 202 is
  • the second thin film transistor array substrate 2012 corresponds to a second connection region between the second sintered rubber 2032 and the third sintered rubber 2033 on the cover plate 202, and the position of the first connection region corresponds to the position where the second connection region is located.
  • a structural strengthening adhesive 204 is provided for reinforcing the structure of the combination of the thin film transistor array substrate 201 and the cap plate 202.
  • a UV curable glue and particles are provided, wherein the particles have less impurities, such that the higher strength and strength of the structural strengthening adhesive 204 are caused, thereby causing the thin film transistor array substrate 201 to The combined structure of the cover plate 202 is more robust.
  • the particles are mixed with the UV curable glue to form a structural strengthening adhesive 204.
  • the ultraviolet curing adhesive and the particles are stirred sufficiently times that the particles are uniformly distributed throughout the ultraviolet curing adhesive, wherein The particles may be polyhedrons or spheres, and the material of the particles may be glass.
  • the structural strengthening adhesive 204 is disposed on the second connection region of the cap plate 202 or the first connection region of the thin film transistor array substrate 201.
  • the structural reinforcing adhesive 204 is coated on the second connection region of the cap plate 202 or the first connection region of the thin film transistor array substrate, and is applied to the second connection region of the cap plate 202 or the thin film transistor array substrate 201.
  • the amount of structural reinforcing adhesive 204 on a connection region is sufficiently large that when the cover plate 202 is integrated with the thin film transistor array substrate 201, the structural reinforcing adhesive 204 is in contact with the cap plate 202 and the thin film transistor array substrate 201.
  • the cap plate 202 and the thin film transistor array substrate 201 are combined into one body.
  • structural strengthening adhesive 204 is cured. Specifically, in step 406, the structural strengthening adhesive 204 is irradiated with an ultraviolet light source to cure the ultraviolet curing adhesive in the structural reinforcing adhesive 204.
  • step 407 the combination of the thin film transistor array substrate 201 and the cap plate 202 is cut at a predetermined position, which is located at a position corresponding to the second connection region, as shown in FIG. 3, the predetermined position is in FIG. The position shown by line 205.
  • the structural reinforcing adhesive 204 since the structural reinforcing adhesive 204 is disposed on the first connection region of the thin film transistor array substrate 201 or the second connection region of the cap plate 202, the structural reinforcing adhesive 204 may be applied to the thin film transistor array substrate 201 and the cap plate 202.
  • the space corresponding to the first connection region or the second connection region will be partially or completely structurally strengthened.
  • the filling of 204 causes the air pressure of the space in the negative pressure state to be increased, slowing down or even preventing the thin film transistor array substrate 201 or the cover plate 202 from being tilted due to the existence of a negative pressure state between the thin film transistor array substrate 201 and the cap plate 202.
  • the phenomenon of music causes the air pressure of the space in the negative pressure state to be increased, slowing down or even preventing the thin film transistor array substrate 201 or the cover plate 202 from being tilted due to the existence of a negative pressure state between the thin film transistor array substrate 201 and the cap plate 202.
  • the thin film transistor array substrate 201 or the cap plate 202 can be combined with the sintered rubber (including the first sintered rubber 2031 and the second sintered rubber 2032,
  • the three sintered rubber 2033 and the fourth sintered rubber 2034 have a large contact area, that is, the thin film transistor array substrate 201 and the cover plate 202 can be more fully flattened on the sintered rubber, and the sintering adhesive is sealed by using a laser.
  • the effective area is such that the combined structure of the thin film transistor array substrate 201, the cap plate 202, and the sintered rubber is more robust.
  • FIG. 5 is a schematic diagram showing the structure of an organic light emitting diode display panel of the present invention.
  • the OLED display panel of the present invention includes a first thin film transistor array substrate 2011, a first cap plate 2021, and a structural reinforced adhesive 204.
  • the first cover 2021 is disposed on the first thin film transistor array substrate 2011.
  • the first cover 2021 is provided with a first sintered adhesive 2031 and a second sintered adhesive 2032, and the first sintered adhesive 2031 is mounted on the first cover 2021.
  • a region between the second sintered paste 2032 corresponds to the first thin film transistor array substrate 2011.
  • the structural strengthening adhesive 204 is disposed on the outer side of the first sintered rubber 2031 and the second sintered rubber 2032 of the first cover 2021, and is coated on the first cover 2021 outside the first sintered rubber 2031 and the second sintered adhesive 2032.
  • the amount of the structural strengthening adhesive 204 at the edge is sufficient, so that when the first cover 2021 is integrated with the first thin film transistor array substrate 2011, the structural reinforcing adhesive 204 is combined with the first thin film transistor array substrate 2011 and the first cover. Contact 2021.
  • the structural strengthening adhesive 204 is used to strengthen the structure of the combination of the first thin film transistor array substrate 2011 and the first cap plate 2021.
  • the structural strengthening adhesive 204 is a mixture of ultraviolet curing glue and particles, the particles have less impurities, so as to make the structural strengthening adhesive have higher cohesion and strength, thereby making the first thin film transistor array substrate 2011 and
  • the combined structure of the first cover 2021 is more robust and the particles are evenly distributed throughout the UV curable glue.
  • the particles can be polyhedral or spheres.
  • the material of the particles may be glass.
  • the structural reinforced adhesive 201 is disposed between the first thin film transistor array substrate 2011 and the first cover 2021 of the OLED display panel of the present invention, and the structural reinforced adhesive 204 is located on the first cover 2021 at the first sintered adhesive.
  • the structural strengthening adhesive 204 is in contact with the first thin film transistor array substrate 2011 and the first cover 2021, so that the structural reinforcing adhesive 204 can function on the structure of the organic light emitting diode display panel. The role of reinforcement.
  • the structural reinforcing adhesive 204 can apply a pulling force to the edge of the first cover 2021 to prevent the first cover 2021 from warping, thereby causing the organic light emitting diode display of the present invention to be displayed.
  • the structure of the panel is more stable.
  • the first thin film transistor array substrate 2011 or the first cap plate 2021 since the first thin film transistor array substrate 2011 or the first cap plate 2021 is prevented from being warped, the first thin film transistor array substrate 2011 and the first cap plate 2021 can have a large contact area with the sintered rubber, that is, The first thin film transistor array substrate 2011 and the first cover plate 2021 can be more fully flattened on the sintered rubber, and the effective area of the sintered adhesive is sealed by using the laser, so that the first thin film transistor array substrate 2011 and the first cover are The combination of the plate 2021 and the sintered glue is more robust.
  • the structural reinforcing adhesive 204 contains an ultraviolet curing adhesive, in the manufacturing process of the organic light emitting diode display panel of the present invention, the ultraviolet curing adhesive can be cured only by irradiating the ultraviolet curing adhesive with an ultraviolet light source. That is, the structural strengthening adhesive 204 is cured, which is advantageous for saving the manufacturing time of the organic light emitting diode display panel of the present invention.
  • the structural strengthening adhesive 204 contains particles, the particles are mixed with the ultraviolet curing glue. Therefore, the structural strengthening adhesive 204 has stronger cohesive force and strength after curing, which is beneficial to strengthening the service life of the structural strengthening adhesive 204. Thereby enhancing the service life of the organic light emitting diode display panel of the present invention.

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  • Manufacturing & Machinery (AREA)
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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种有机发光二极管显示面板及其制造方法,该面板包括:第一薄膜晶体管阵列基板(2011);第一盖板(2021);结构强化胶(201),设置在所述第一盖板(2021)的第一烧结胶(2031)和第二烧结胶(2032)的外侧,并且与所述第一薄膜晶体管阵列基板(2011)和所述第一盖板(2021)相接触。所述面板的结构更加坚固和稳定。

Description

有机发光二极管显示面板及其制造方法 技术领域
本发明涉及有机发光二极管显示技术领域,特别涉及一种有机发光二极管显示面板及其制造方法。
背景技术
在传统的有机发光二极管显示面板的制造过程中,需要在薄膜晶体管阵列基板101和盖板102之间设置烧结(Frit)胶(1031、1032、1033和1034),该烧结胶设置在薄膜晶体管阵列基板101的子基板(第一薄膜晶体管阵列基板1011和第二薄膜晶体管阵列基板1012)的边缘处,然后将薄膜晶体管阵列基板101和盖板102(第一盖板1021和第二盖板1022)进行对组,再将薄膜晶体管阵列基板101和盖板102的组合在位于两个子基板之间的位置上进行切割。
在上述有机发光二极管显示面板的制造过程中,由于薄膜晶体管阵列基板101的两个相邻的子基板的边缘处设置有烧结胶,如图1和图2所示,并且该两个相邻的子基板的烧结胶(1032和1033)之间存在着间距,薄膜晶体管阵列基板101和盖板102之间处于负压状态,因此,在将薄膜晶体管阵列基板101和盖板102对组之后,盖板102或薄膜晶体管阵列基板101会出现翘曲,而设置于薄膜晶体管阵列基板101和盖板102之间的烧结胶则成为了盖板102或薄膜晶体管阵列基板101翘曲的支点。
进一步地,在将薄膜晶体管阵列基板101和盖板102的组合切割后,由于薄膜晶体管阵列基板101或盖板102翘曲,薄膜晶体管阵列基板101和盖板102无法固紧,因此其中的任意一者容易发生位移,使得薄膜晶体管阵列基板101和盖板102的组合的结构强度较低,具体地,由于薄膜晶体管阵列基板101和盖板102之间设置有烧结胶,当薄膜晶体管阵列基板101或盖板102的中部受到按压时,位于薄膜晶体管阵列基板101和盖板102的边缘处的烧结胶往往会充当支点,而薄膜晶体管阵列基板101的边缘或盖板102的边缘则会绕着这个支点翘曲,从而使得有机发光二极管显示面板的结构不稳定,影响了有机发光二极管显示面板成品质量。
故,有必要提出一种新的技术方案,以解决上述技术问题。
技术问题
本发明的一个目的在于提供一种有机发光二极管显示面板的制造方法,其能减缓或防止薄膜晶体管阵列基板或盖板翘曲,提高薄膜晶体管阵列基板和盖板的组合的结构强度。
本发明的另一个目的在于提供一种有机发光二极管显示面板,其能减缓或防止薄膜晶体管阵列基板或盖板翘曲,提高薄膜晶体管阵列基板和盖板的组合的结构强度。
技术解决方案
本发明提供了一种有机发光二极管显示面板的制造方法,所述方法包括以下步骤:(A)提供薄膜晶体管阵列基板和盖板,所述薄膜晶体管阵列基板包括第一薄膜晶体管阵列基板和第二薄膜晶体管阵列基板,所述第一与第二薄膜晶体管阵列基板之间具有第一连接区,所述盖板上设置有第一烧结胶、第二烧结胶、第三烧结胶和第四烧结胶,所述盖板上第一烧结胶与第二烧结胶之间的区域与所述第一薄膜晶体管阵列基板对应,所述盖板上第三烧结胶与第四烧结胶之间的区域与所述第二薄膜晶体管阵列基板对应,所述盖板上第二烧结胶与第三烧结胶之间具有第二连接区,所述第一连接区所在的位置与所述第二连接区所在的位置对应;(B)将结构强化胶设置在所述盖板的第二连接区或所述薄膜晶体管阵列基板的第一连接区上,所述结构强化胶用于强化所述第一薄膜晶体管阵列基板与所述盖板的组合的结构;(C)将所述盖板与所述薄膜晶体管阵列基板组合为一体;以及(D)对所述薄膜晶体管阵列基板和所述盖板的组合在预定位置上进行切割,所述预定位置位于与所述第二连接区对应的位置上;所述步骤(B)包括以下步骤:(b1)在所述盖板的第二连接区或所述薄膜晶体管的第一连接区上涂布所述结构强化胶,使得当所述盖板与所述薄膜晶体管阵列基板组合为一体时,所述结构强化胶均与所述盖板和所述薄膜晶体管阵列基板相接触。
在上述有机发光二极管显示面板的制造方法中,在所述步骤(C)和步骤(D)之间,所述方法还包括以下步骤:(E)将所述结构强化胶固化。
在上述有机发光二极管显示面板的制造方法中,所述结构强化胶包括紫外光固化胶,所述步骤(E)包括以下步骤:(e1)利用紫外线光源照射所述紫外光固化胶,使得所述紫外光固化胶固化。
在上述有机发光二极管显示面板的制造方法中,所述结构强化胶内含有颗粒,所述步骤(b1)之前还包括以下步骤:(b2)提供所述紫外光固化胶和颗粒;以及(b3)将所述颗粒与所述紫外光固化胶混合在一起。
在上述有机发光二极管显示面板的制造方法中,所述颗粒是多面体或球体。
本发明的另一个目的在于提供一种有机发光二极管显示面板的制造方法,其能减缓或防止薄膜晶体管阵列基板或盖板翘曲,提高薄膜晶体管阵列基板和盖板的组合的结构强度。
为解决上述问题,本发明提供了一种有机发光二极管显示面板的制造方法,所述方法包括以下步骤:(A)提供薄膜晶体管阵列基板和盖板,所述薄膜晶体管阵列基板包括第一薄膜晶体管阵列基板和第二薄膜晶体管阵列基板,所述第一与第二薄膜晶体管阵列基板之间具有第一连接区,所述盖板上设置有第一烧结胶、第二烧结胶、第三烧结胶和第四烧结胶,所述盖板上第一烧结胶与第二烧结胶之间的区域与所述第一薄膜晶体管阵列基板对应,所述盖板上第三烧结胶与第四烧结胶之间的区域与所述第二薄膜晶体管阵列基板对应,所述盖板上第二烧结胶与第三烧结胶之间具有第二连接区,所述第一连接区所在的位置与所述第二连接区所在的位置对应;(B)将结构强化胶设置在所述盖板的第二连接区或所述薄膜晶体管阵列基板的第一连接区上;(C)将所述盖板与所述薄膜晶体管阵列基板组合为一体;以及(D)对所述薄膜晶体管阵列基板和所述盖板的组合在预定位置上进行切割,所述预定位置位于与所述第二连接区对应的位置上。
在上述有机发光二极管显示面板的制造方法中,所述步骤(B)包括以下步骤:(b1)在所述盖板的第二连接区或所述薄膜晶体管的第一连接区上涂布所述结构强化胶,使得当所述盖板与所述薄膜晶体管阵列基板组合为一体时,所述结构强化胶均与所述盖板和所述薄膜晶体管阵列基板相接触。
在上述有机发光二极管显示面板的制造方法中,在所述步骤(C)和步骤(D)之间,所述方法还包括以下步骤:(E)将所述结构强化胶固化。
在上述有机发光二极管显示面板的制造方法中,所述结构强化胶包括紫外光固化胶,所述步骤(E)包括以下步骤:(e1)利用紫外线光源照射所述紫外光固化胶,使得所述紫外光固化胶固化。
在上述有机发光二极管显示面板的制造方法中,所述结构强化胶内含有颗粒,所述步骤(b1)之前还包括以下步骤:(b2)提供所述紫外光固化胶和颗粒;以及(b3)将所述颗粒与所述紫外光固化胶混合在一起。
在上述有机发光二极管显示面板的制造方法中,所述颗粒是多面体或球体。
本发明的另一个目的在于提供一种有机发光二极管显示面板,其能减缓或防止薄膜晶体管阵列基板或盖板翘曲,提高薄膜晶体管阵列基板和盖板的组合的结构强度。
为解决上述问题,本发明提供了一种有机发光二极管显示面板,包括:第一薄膜晶体管阵列基板;第一盖板,设置在所述第一薄膜晶体管阵列基板之上,所述第一盖板上设置有第一烧结胶和第二烧结胶,所述第一盖板上第一烧结胶和第二烧结胶之间的区域与所述第一薄膜晶体管阵列基板对应;以及结构强化胶,所述结构强化胶设置在所述第一盖板的第一烧结胶和第二烧结胶的外侧,并且所述结构强化胶与所述第一薄膜晶体管阵列基板和所述第一盖板相接触。
在上述有机发光二极管显示面板中,所述结构强化胶为紫外光固化胶与颗粒的混合物。
在上述有机发光二极管显示面板中,所述颗粒是多面体或球体。
在上述有机发光二极管显示面板中,所述颗粒的材料是玻璃。
本发明中,由于在薄膜晶体管阵列基板的第一连接区或盖板的第二连接区上设置结构强化胶,因此该结构强化胶可以对薄膜晶体管阵列基板和盖板起到连接或支撑的作用,此外,在将薄膜晶体管阵列基板和盖板组合为一体后,该第一连接区或第二连接区对应的空间将会部分地或全部地被结构强化胶填充,使得该处于负压状态的空间的气压得以升高,减缓甚至防止了因薄膜晶体管阵列基板和盖板之间存在负压状态而造成的薄膜晶体管阵列基板或盖板翘曲的现象。
此外,由于减缓或防止了薄膜晶体管阵列基板或盖板翘曲,因此,薄膜晶体管阵列基板和盖板均可以与烧结胶(包括第一烧结胶、第二烧结胶、第三烧结胶和第四烧结胶)具有较大的接触面积,即,薄膜晶体管阵列基板和盖板均可以更加充分地平贴于烧结胶上,增加了在利用激光封止烧结胶的有效面积,从而使得薄膜晶体管阵列基板、盖板和烧结胶的组合的结构更加坚固。
此外,该结构强化胶能够对有机发光二极管显示面板的结构起到强化的作用。当盖板的中部受到按压时,结构强化胶能够向盖板的边缘施加拉力,防止该盖板翘曲,从而使得本发明的有机发光二极管显示面板的结构更加稳定。
有益效果
由于结构强化胶内含有颗粒,该颗粒与紫外光固化胶混合在一起,因此,该结构强化胶在固化后具有更强的凝结力和强度,有利于加强该结构强化胶的使用寿命,从而加强本发明的有机发光二极管显示面板的使用寿命。
附图说明
图1为传统的有机发光二极管显示面板阵列切割前的示意图;
图2为图1的A-A’截面的示意图;
图3A、3B、3C和3D为本发明的有机发光二极管显示面板制造方法的示意图;
图4为本发明的有机发光二极管显示面板制造方法的流程图;
图5为本发明的有机发光二极管显示面板的结构的示意图。
本发明的最佳实施方式
以下各实施例的说明是参考附加的图式,用以例示本发明可用以实施的特定实施例。
参考图3A、3B、3C、3D和图4,图3A、3B、3C和3D为本发明的有机发光二极管显示面板制造方法的示意图,图4为本发明的有机发光二极管显示面板制造方法的流程图。
在步骤401,提供薄膜晶体管阵列基板201和盖板202,其中,薄膜晶体管阵列基板201包括多个子薄膜晶体管阵列基板,如第一薄膜晶体管阵列基板2011和第二薄膜晶体管阵列基板2012,第一薄膜晶体管阵列基板2011与第二薄膜晶体管阵列基板2012之间具有第一连接区,盖板202上设置有第一烧结胶2031、第二烧结胶2032、第三烧结胶2033和第四烧结胶2034,盖板202上第一烧结胶2031与第二烧结胶2032之间的区域与第一薄膜晶体管阵列基板2011对应,盖板202上第三烧结胶2033与第四烧结胶2034之间的区域与第二薄膜晶体管阵列基板2012对应,盖板202上第二烧结胶2032与第三烧结胶2033之间具有第二连接区,第一连接区所在的位置与第二连接区所在的位置对应。
在步骤402至步骤403中,提供结构强化胶204,该结构强化胶204用于强化薄膜晶体管阵列基板201与盖板202的组合的结构。具体地,在步骤402,提供紫外光固化胶和颗粒,其中,该颗粒具有较少的杂质,这样是为了使得结构强化胶204的较高的凝结力和强度,从而使得薄膜晶体管阵列基板201与盖板202的组合的结构更加坚固。在步骤403,将颗粒与紫外光固化胶混合在一起以形成结构强化胶204,具体地,将紫外光固化胶与颗粒搅拌足够多的次数,使得颗粒均匀地遍布于紫外光固化胶内,其中,颗粒可以是多面体或球体,该颗粒的材料可以是玻璃。
在步骤404,将结构强化胶204设置在盖板202的第二连接区或薄膜晶体管阵列基板201的第一连接区上。具体地,在盖板202的第二连接区或薄膜晶体管阵列基板的第一连接区上涂布结构强化胶204,并且涂布于盖板202的第二连接区或薄膜晶体管阵列基板201的第一连接区上的结构强化胶204的量足够多,使得当盖板202与薄膜晶体管阵列基板201组合为一体时,结构强化胶204均与盖板202和薄膜晶体管阵列基板201相接触。
在步骤405,将盖板202与薄膜晶体管阵列基板201组合为一体。
在步骤406,将结构强化胶204固化。具体地,在步骤406,利用紫外线光源照射结构强化胶204,使得结构强化胶204中的紫外光固化胶固化。
在步骤407,对薄膜晶体管阵列基板201和盖板202的组合在预定位置上进行切割,该预定位置位于与第二连接区对应的位置上,如图3所示,该预定位置为图3中直线205所示的位置。
在上述方法中,由于在薄膜晶体管阵列基板201的第一连接区或盖板202的第二连接区上设置结构强化胶204,因此该结构强化胶204可以对薄膜晶体管阵列基板201和盖板202起到连接或支撑的作用,此外,在将薄膜晶体管阵列基板201和盖板202组合为一体后,该第一连接区或第二连接区对应的空间将会部分地或全部地被结构强化胶204填充,使得该处于负压状态的空间的气压得以升高,减缓甚至防止了因薄膜晶体管阵列基板201和盖板202之间存在负压状态而造成的薄膜晶体管阵列基板201或盖板202翘曲的现象。
此外,由于减缓或防止了薄膜晶体管阵列基板201或盖板202翘曲,因此,薄膜晶体管阵列基板201和盖板202均可以与烧结胶(包括第一烧结胶2031、第二烧结胶2032、第三烧结胶2033和第四烧结胶2034)具有较大的接触面积,即,薄膜晶体管阵列基板201和盖板202均可以更加充分地平贴于烧结胶上,增加了在利用激光封止烧结胶的有效面积,从而使得薄膜晶体管阵列基板201、盖板202和烧结胶的组合的结构更加坚固。
参考图5,图5为本发明的有机发光二极管显示面板的结构的示意图。本发明的有机发光二极管显示面板包括第一薄膜晶体管阵列基板2011、第一盖板2021和结构强化胶204。其中,第一盖板2021设置在第一薄膜晶体管阵列基板2011之上,第一盖板2021上设置有第一烧结胶2031和第二烧结胶2032,第一盖板2021上第一烧结胶2031和第二烧结胶2032之间的区域与第一薄膜晶体管阵列基板2011对应。结构强化胶204设置在第一盖板2021的第一烧结胶2031和第二烧结胶2032的外侧,并且涂布于第一盖板2021上位于第一烧结胶2031和第二烧结胶2032外侧的边缘处的结构强化胶204的量足够多,使得当第一盖板2021与第一薄膜晶体管阵列基板2011组合为一体时,结构强化胶204均与第一薄膜晶体管阵列基板2011和第一盖板2021相接触。结构强化胶204用于强化第一薄膜晶体管阵列基板2011与第一盖板2021的组合的结构。其中,结构强化胶204为紫外光固化胶与颗粒的混合物,该颗粒具有较少的杂质,这样是为了使得结构强化胶的较高的凝结力和强度,从而使得第一薄膜晶体管阵列基板2011与第一盖板2021的组合的结构更加坚固,该颗粒均匀地遍布于紫外光固化胶内。该颗粒可以是多面体或球体。颗粒的材料可以是玻璃。
由于本发明的有机发光二极管显示面板的第一薄膜晶体管阵列基板2011和第一盖板2021之间设置有结构强化胶201,并且该结构强化胶204位于第一盖板2021上位于第一烧结胶2031和第二烧结胶2032外侧的边缘处,结构强化胶204与第一薄膜晶体管阵列基板2011和第一盖板2021均接触,因此该结构强化胶204能够对有机发光二极管显示面板的结构起到强化的作用。具体地,当第一盖板2021的中部受到按压时,结构强化胶204能够向第一盖板2021的边缘施加拉力,防止该第一盖板2021翘曲,从而使得本发明的有机发光二极管显示面板的结构更加稳定。
此外,由于防止了第一薄膜晶体管阵列基板2011或第一盖板2021翘曲,因此,第一薄膜晶体管阵列基板2011和第一盖板2021均可以与烧结胶具有较大的接触面积,即,第一薄膜晶体管阵列基板2011和第一盖板2021均可以更加充分地平贴于烧结胶上,增加了在利用激光封止烧结胶的有效面积,从而使得第一薄膜晶体管阵列基板2011、第一盖板2021和烧结胶的组合的结构更加坚固。
此外,由于结构强化胶204内含有紫外光固化胶,因此在本发明的有机发光二极管显示面板的制造过程中,只需对紫外光固化胶利用紫外线光源进行照射,即可使得紫外光固化胶固化,即,使得结构强化胶204固化,有利于节省本发明的有机发光二极管显示面板的制造时间。
由于结构强化胶204内含有颗粒,该颗粒与紫外光固化胶混合在一起,因此,该结构强化胶204在固化后具有更强的凝结力和强度,有利于加强该结构强化胶204的使用寿命,从而加强本发明的有机发光二极管显示面板的使用寿命。
综上所述,虽然本发明已以优选实施例揭露如上,但上述优选实施例并非用以限制本发明,本领域的普通技术人员,在不脱离本发明的精神和范围内,均可作各种更动与润饰,因此本发明的保护范围以权利要求界定的范围为准。
本发明的实施方式
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Claims (15)

  1. 一种有机发光二极管显示面板的制造方法,其中
    所述方法包括以下步骤:
    (A)提供薄膜晶体管阵列基板和盖板,所述薄膜晶体管阵列基板包括第一薄膜晶体管阵列基板和第二薄膜晶体管阵列基板,所述第一与第二薄膜晶体管阵列基板之间具有第一连接区,所述盖板上设置有第一烧结胶、第二烧结胶、第三烧结胶和第四烧结胶,所述盖板上第一烧结胶与第二烧结胶之间的区域与所述第一薄膜晶体管阵列基板对应,所述盖板上第三烧结胶与第四烧结胶之间的区域与所述第二薄膜晶体管阵列基板对应,所述盖板上第二烧结胶与第三烧结胶之间具有第二连接区,所述第一连接区所在的位置与所述第二连接区所在的位置对应;
    (B)将结构强化胶设置在所述盖板的第二连接区或所述薄膜晶体管阵列基板的第一连接区上,所述结构强化胶用于强化所述第一薄膜晶体管阵列基板与所述盖板的组合的结构;
    (C)将所述盖板与所述薄膜晶体管阵列基板组合为一体;以及
    (D)对所述薄膜晶体管阵列基板和所述盖板的组合在预定位置上进行切割,所述预定位置位于与所述第二连接区对应的位置上;
    所述步骤(B)包括以下步骤:
    (b1)在所述盖板的第二连接区或所述薄膜晶体管的第一连接区上涂布所述结构强化胶,使得当所述盖板与所述薄膜晶体管阵列基板组合为一体时,所述结构强化胶均与所述盖板和所述薄膜晶体管阵列基板相接触。
  2. 根据权利要求1所述的有机发光二极管显示面板的制造方法,其中
    在所述步骤(C)和步骤(D)之间,所述方法还包括以下步骤:
    (E)将所述结构强化胶固化。
  3. 根据权利要求2所述的有机发光二极管显示面板的制造方法,其中
    所述结构强化胶包括紫外光固化胶,
    所述步骤(E)包括以下步骤:
    (e1)利用紫外线光源照射所述紫外光固化胶,使得所述紫外光固化胶固化。
  4. 根据权利要求3所述的有机发光二极管显示面板的制造方法,其中
    所述结构强化胶内含有颗粒,
    所述步骤(b1)之前还包括以下步骤:
    (b2)提供所述紫外光固化胶和颗粒;以及
    (b3)将所述颗粒与所述紫外光固化胶混合在一起。
  5. 根据权利要求4所述的有机发光二极管显示面板的制造方法,其中
    所述颗粒是多面体或球体。
  6. 一种有机发光二极管显示面板的制造方法,其中
    所述方法包括以下步骤:
    (A)提供薄膜晶体管阵列基板和盖板,所述薄膜晶体管阵列基板包括第一薄膜晶体管阵列基板和第二薄膜晶体管阵列基板,所述第一与第二薄膜晶体管阵列基板之间具有第一连接区,所述盖板上设置有第一烧结胶、第二烧结胶、第三烧结胶和第四烧结胶,所述盖板上第一烧结胶与第二烧结胶之间的区域与所述第一薄膜晶体管阵列基板对应,所述盖板上第三烧结胶与第四烧结胶之间的区域与所述第二薄膜晶体管阵列基板对应,所述盖板上第二烧结胶与第三烧结胶之间具有第二连接区,所述第一连接区所在的位置与所述第二连接区所在的位置对应;
    (B)将结构强化胶设置在所述盖板的第二连接区或所述薄膜晶体管阵列基板的第一连接区上;
    (C)将所述盖板与所述薄膜晶体管阵列基板组合为一体;以及
    (D)对所述薄膜晶体管阵列基板和所述盖板的组合在预定位置上进行切割,所述预定位置位于与所述第二连接区对应的位置上。
  7. 根据权利要求6所述的有机发光二极管显示面板的制造方法,其中
    所述步骤(B)包括以下步骤:
    (b1)在所述盖板的第二连接区或所述薄膜晶体管的第一连接区上涂布所述结构强化胶,使得当所述盖板与所述薄膜晶体管阵列基板组合为一体时,所述结构强化胶均与所述盖板和所述薄膜晶体管阵列基板相接触。
  8. 根据权利要求7所述的有机发光二极管显示面板的制造方法,其中
    在所述步骤(C)和步骤(D)之间,
    所述方法还包括以下步骤:
    (E)将所述结构强化胶固化。
  9. 根据权利要求8所述的有机发光二极管显示面板的制造方法,其中
    所述结构强化胶包括紫外光固化胶,
    所述步骤(E)包括以下步骤:
    (e1)利用紫外线光源照射所述紫外光固化胶,使得所述紫外光固化胶固化。
  10. 根据权利要求9所述的有机发光二极管显示面板的制造方法,其中
    所述结构强化胶内含有颗粒,
    所述步骤(b1)之前还包括以下步骤:
    (b2)提供所述紫外光固化胶和颗粒;以及
    (b3)将所述颗粒与所述紫外光固化胶混合在一起。
  11. 根据权利要求10所述的有机发光二极管显示面板的制造方法,其中
    所述颗粒是多面体或球体。
  12. 一种有机发光二极管显示面板,其包括:
    第一薄膜晶体管阵列基板;
    第一盖板,设置在所述第一薄膜晶体管阵列基板之上,所述第一盖板上设置有第一烧结胶和第二烧结胶,所述第一盖板上第一烧结胶和第二烧结胶之间的区域与所述第一薄膜晶体管阵列基板对应;以及
    结构强化胶,所述结构强化胶设置在所述第一盖板的第一烧结胶和第二烧结胶的外侧,并且所述结构强化胶与所述第一薄膜晶体管阵列基板和所述第一盖板相接触。
  13. 根据权利要求12所述的有机发光二极管显示面板,其中
    所述结构强化胶为紫外光固化胶与颗粒的混合物。
  14. 根据权利要求13所述的有机发光二极管显示面板,其中
    所述颗粒是多面体或球体。
  15. 根据权利要求14所述的有机发光二极管显示面板,其中
    所述颗粒的材料是玻璃。
PCT/CN2012/082835 2012-09-06 2012-10-12 有机发光二极管显示面板及其制造方法 WO2014036778A1 (zh)

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