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WO2014033801A1 - Component feed device and electronic component mounting device - Google Patents

Component feed device and electronic component mounting device Download PDF

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Publication number
WO2014033801A1
WO2014033801A1 PCT/JP2012/071541 JP2012071541W WO2014033801A1 WO 2014033801 A1 WO2014033801 A1 WO 2014033801A1 JP 2012071541 W JP2012071541 W JP 2012071541W WO 2014033801 A1 WO2014033801 A1 WO 2014033801A1
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WO
WIPO (PCT)
Prior art keywords
tape
component
electronic component
cutter
supply device
Prior art date
Application number
PCT/JP2012/071541
Other languages
French (fr)
Japanese (ja)
Inventor
亮斗 田ノ口
佐藤　正
臼井　克尚
柳田　勉
Original Assignee
株式会社日立ハイテクインスツルメンツ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立ハイテクインスツルメンツ filed Critical 株式会社日立ハイテクインスツルメンツ
Priority to PCT/JP2012/071541 priority Critical patent/WO2014033801A1/en
Priority to CN201280075440.2A priority patent/CN104663013B/en
Priority to JP2014532585A priority patent/JP6007253B2/en
Publication of WO2014033801A1 publication Critical patent/WO2014033801A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders

Definitions

  • the present invention relates to a component supply apparatus and an electronic component mounting apparatus, and in particular, by peeling a cover tape covering a component storage unit from a carrier tape storing and holding the electronic component in the component storage unit, the electronic component is
  • the present invention relates to a component supply device and an electronic component mounting device suitable for those having an electronic component exposure device to be exposed.
  • a carrier tape in which component storage units for storing electronic components are normally formed at predetermined intervals, and a component storage unit formed on the carrier tape for preventing component popping out of the component storage unit
  • a tape feeding device for intermittently feeding out a component storage tape made of a cover tape provided so as to cover a part from a state wound around a storage tape reel and intermittently to a component removal position, and an electronic component in a component storage part
  • An electronic component exposing device is schematically configured to expose and make it possible to take out the electronic component.
  • FIG. 1 shows an outline of a conventional component supply apparatus.
  • the component storage tape 1 wound around the storage tape reel 2 is conveyed by the tape feeding device 3 in the direction of arrow A or arrow B while being supported by a guide (not shown).
  • the electronic component exposing device 7 provided between the storage tape reel 2 and the tape feeding device 3 exposes the electronic component by peeling the cover tape 6 from the carrier tape holding the electronic component in the component storage portion. It is a thing.
  • the exposed electronic component is held at the tip of the component suction and mounting device 9 by moving the component suction and mounting device 9 up and down as shown by the arrow D.
  • the device by which the component suction and mounting device 9 holds the electronic component at the tip portion is generally a vacuum suction device, and it is conceivable that other devices are held by a chuck mechanism or the like.
  • the cover tape 6 peeled off from the carrier tape is transported in the direction of the arrow C by the cover tape feeding device 8 and stored in a storage (not shown) or the like.
  • the cover tape feeding device 8 may be formed, for example, in the form of a reel such as a storage tape reel 2 and may wind the cover tape 6 so that the reel is rotated by a drive source. Further, the carrier tape from which the cover tape 6 is peeled off and the electronic components are removed is conveyed in the arrow B direction and cut by the cutter unit 4. 5 is the cut tape.
  • the component storage tape 1 comprises a carrier tape 10 and a cover tape 6.
  • the carrier tape 10 includes a component storage portion 13 for storing an electronic component (not shown) and a feed hole 14 for causing the carrier tape 10 to have a conveying force for moving the component storage tape 1.
  • the cover tape 6 is bonded to the carrier tape 10 on both sides in the horizontal direction in the direction orthogonal to the conveyance direction of the component storage unit 13, and the electronic component enclosed in the component storage unit 13 is a carrier. It does not fly out of the tape 10.
  • the full width of the component supply tape 1 has various standards such as 4 mm, 8 mm, and so on, and the thickness specification of the cover tape 6 is in the range of 0.05 to 0.1 mm.
  • the cover tape 6 is mainly made of a PET-based material, and the carrier tape 10 is made of a material such as paper or embossing.
  • a part of the component supply apparatus 53 for supplying various electronic components one by one to the take-out position (component suction position) of each electronic component It is possible to install and fix a plurality of them side by side.
  • a substrate transport conveyor 51 is provided between the opposing component supply devices 53.
  • the substrate conveyance conveyor 51 positions the substrate conveyed from the direction of arrow F at a predetermined position, and after the electronic component is mounted on the substrate 52, conveys the substrate in the direction of arrow G.
  • Reference numeral 55 denotes a pair of X beams which are long in the same direction as the direction in which the substrate 52 is transported, and actuators (for example, a linear motor or the like) (not shown) are attached to both ends.
  • the X beam 55 is movably supported along the Y beam 57 in a direction orthogonal to the direction in which the substrate 52 is transported, and can move between the component supply device 53 and the substrate 52. It is possible.
  • a component suction and mounting device 9 which moves along the X beam in the longitudinal direction of the X beam 55 by an actuator (for example, a linear motor or the like) not shown.
  • a recognition camera 56 and a nozzle storage unit 58 are disposed between the component supply device 53 and the substrate transport conveyor 51.
  • the recognition camera 56 is for acquiring positional deviation information of the electronic component adsorbed to the component suction / mounting device 9 by the component supply device 53, and the electronic component is in the substrate transport direction and in the direction orthogonal to the substrate transport direction. It can be confirmed by photographing the electronic component whether or not the positional deviation and the rotation angle are. Needless to say, by photographing, it is also possible to confirm whether the electronic component is adsorbed or not.
  • the nozzle storage unit 58 stores a plurality of replacement suction nozzles (not shown) attached to the component suction and mounting device 9 which are necessary for suctioning and mounting various electronic components.
  • the component suction / attachment device 9 When instructed to attach the suction nozzle corresponding to the electronic component, the component suction / attachment device 9 is moved to the nozzle storage unit 58 by the parallel operation of the X beam 55 and the Y beam 57 to replace the suction nozzle It is.
  • FIGS. 4 and 5 show an electronic component exposing device 7 described in Patent Document 1.
  • FIG. The electronic component exposing device 7 shown in the figure is a cover tape peeling device 15 for peeling the cover tape 6 from the carrier tape 10 in the vicinity of the conveyance path of the component storage tape 1 (not shown) guiding the component storage tape 1 from below. It consists of a parts removal part 16 for taking out parts 19.
  • the front end of the cover tape peeling device 15 is inserted between the cover tape 6 and the carrier tape 10 so that the cover tape 6 can be peeled from the carrier tape 10 as the component storage tape 1 moves.
  • cover tape 6 after peeling is reversed by the return rod 17 and wound up by the winding mechanism 18.
  • cover tape 6 and the carrier tape 10 are joined by the site
  • FIG. 6 shows an electronic component exposing device 7 described in Patent Document 2.
  • the electronic component exposing device 7 shown in the figure is comprised of a cutter device 20 which is a means for cutting the cover tape 6 above the tape conveyance path (not shown) and a spreading means 21 which spreads the cut cover tape 6.
  • a cutter device 20 which is a means for cutting the cover tape 6 above the tape conveyance path (not shown)
  • a spreading means 21 which spreads the cut cover tape 6.
  • the cutter blade portion 20 a of the cutter device 20 which is a cutting means of the cover tape 6 has an interlayer surface of the cover tape 6 and the carrier tape 10.
  • the tip of the cutter device 20 penetrates the interlayer of the cover tape 6 and the carrier tape 10, and along with the conveyance of the component storage tape 1 in the arrow H direction, It is done by concentrating stress in the central part.
  • the cutter device 20 creates a gap with the cover tape 6 in the vicinity of the tip, and when an external force such as vibration is applied to the electronic component 19, the electronic component 19 has the cutter blade 20 a and the cover tape 6.
  • a dotted line in FIG. 8 indicates the cutter blade 20a and the electronic component 19 hidden inside the cover tape 6, and the arrow x indicates the portion where the cover tape 6 is cut. Show). If the transport of the component storage tape 1 is continued in this state, the electronic component 19 may be damaged, and at the same time, the cutter blade 20a may be damaged. In addition, in the state where the electronic component 19 protrudes from the carrier tape 10, there is also a problem that the component suction by the component suction and mounting device becomes difficult.
  • the present invention has been made in view of the above-described point, and an object thereof is to expose an electronic component without separating a cover tape from a carrier tape, thereby improving productivity and operating reliability. It is an object of the present invention to provide a component supply device and an electronic component mounting device capable of enhancing the property.
  • the component supply device is formed on a carrier tape in which component storage units for storing electronic components are formed side by side at predetermined intervals, and the carrier tape
  • a tape feeding device for sequentially feeding out a component storage tape made of a cover tape provided so as to cover the component storage section from a state wound around a storage tape reel to a component removal position; and the electronic in the component storage section
  • the electronic component exposure device cuts the cover tape and a positioning device that positions a component storage tape.
  • a cutter having an acute cutting edge disposed at a right angle to the interlayer surface of the cover tape and the carrier tape;
  • the apparatus comprises: a spreading means for opening the cut cover tape so that an article can be removed from the carrier tape, and a part removing portion for removing the electronic part exposed by the spreading means. It features.
  • the tape feeding device comprises a first tape feeding device and a second tape feeding device.
  • the electronic component exposing device is disposed between the tape feeding device and the second tape feeding device.
  • an angle formed by a blade portion of the cutter and a bottom surface of the cutter is 30 ° or less.
  • a C-chamfered surface is provided at a tip of the cutter.
  • the components supply apparatus of Claim 5 of this invention is characterized by R chamfering processing surface being given to the front-end
  • a C-chamfered surface is provided at a tip of the cutter and a range in which the C-chamfered surface is provided Is lower than the positioning device and 0.2 mm or less from the bottom surface of the cutter, and the angle formed by the C-chamfered surface with the bottom surface of the cutter is an obtuse angle.
  • a range in which an R-chamfered surface is provided at the tip of the cutter and the R-chamfered surface is provided Is lower than the positioning device, and 0.2 mm or less from the bottom surface of the cutter.
  • the base and the various electronic components are detachably supplied one by one to the take-out position of each electronic component on the base.
  • a plurality of component supply devices provided in a row and installed and fixed, and the component supply device group opposed to each other are positioned at a predetermined position for the substrate being transported, and the electronic components are mounted on the substrate.
  • a pair of X-beams extending in the same direction as the direction in which the substrate is transported, and with actuators attached at both ends, and disposed in a direction orthogonal to the X-beams.
  • a Y-beam, and a component suction / mounting device 9 installed in the longitudinal direction of the X-beam and moving along the X-beam, and the X-beam is parallel to the direction in which the substrate is transported by the actuator.
  • the electronic component mounting apparatus is supported movably along the Y beam in a direction to move between the component supply apparatus and the substrate, and is movable along the Y beam. It is characterized in that it is a component supply device of the above configuration.
  • the present invention it is possible to expose the electronic component without separating the cover tape from the carrier tape, thereby improving productivity and improving the operation reliability as well as the electronic component mounting apparatus. You can get
  • FIG. 1 shows schematic structure of the components supply apparatus of this invention. It is a perspective view showing the structure of a parts storage tape. It is a top view which shows schematic structure of the electronic component mounting apparatus which employ
  • FIG. It is a side view of FIG. It is a perspective view which shows the electronic component exposure apparatus described in patent document 2.
  • FIG. It is a top view which shows the electronic component exposure apparatus described in patent document 2.
  • FIG. is a side view of FIG. It is a figure which shows schematic structure of Example 1 of the components supply apparatus of this invention. It is a perspective view which shows the electronic component exposure apparatus employ
  • FIG. 15 is a view showing a cutting and dividing portion of the cover tape in the case where the C-chamfered surface shown in FIG. 14 is formed, in which a blade tip of the cutter device abuts on a boundary portion between the cover tape and the carrier tape.
  • FIG. 17 is a view showing a state in which the cutter device is mounted on the upper surface of the carrier tape while the C-chamfered surface is in contact with the end surface corner portion of the carrier tape along with the movement of the component storage tape from the state of FIG.
  • the schematic configuration of the component supply device according to the first embodiment of the present invention will be described with reference to FIG.
  • the arrangement configuration in which the component supply device shown in FIG. 9 differs from the component supply device shown in FIG. 1 is that the second tape feeding device 3b is provided in front of the first tape feeding device 3a in the tape transport path.
  • the electronic component exposing device 7 is installed between the first tape feeding device 3a and the second tape feeding device 3b.
  • the component storage tape 1 wound around the storage tape reel 2 is taken through the intake port for taking in the component storage tape 1 provided in the housing of the component supply device not shown. It is taken into the component feeding device and conveyed in the direction of arrow A by the second tape feeding device 3b while being supported by a tape conveyance path (not shown).
  • the storage tape reel 2 may be replaceably held and fixed to the take-in port, or may be held at a position away from the component supply device.
  • the second tape feeding device 3b may be, for example, a gear-like device having a projection that engages with a hole provided in the component storage tape 1, or a pair of sandwiching the upper surface and the lower surface of the component storage tape.
  • the roller may be provided.
  • the electronic component exposing device 7 provided between the first tape feeding device 3a and the second tape feeding device 3b partially peels off the cover tape 6 from the carrier tape holding the electronic component in the component storage unit. As a result, the electronic components are exposed.
  • the first tape feeding device 3a may be, for example, a gear-like device having a projection that engages with a hole provided in the component storage tape 1, or a component It is also possible to have a pair of rollers sandwiching the upper surface and the lower surface of the storage tape.
  • the exposed electronic component is held at the tip of the component suction and mounting device 9 as the component suction and mounting device 9 constituting the electronic component mounting device moves up and down as shown by the arrow D.
  • the device by which the component suction and mounting device 9 holds the electronic component at the tip portion is generally a vacuum suction device, and it is conceivable that other devices are held by a chuck mechanism or the like.
  • the partially peeled cover tape 6 is conveyed to the cutter unit 4 together with the carrier tape in the direction of the arrow B by the first tape feeding device 3a and the second tape feeding device 3b, and is cut by the cutter portion 4 . 5 is the cut tape.
  • the component storage tape 1 is fed to the electronic component exposing device 7 by the second tape feeding device 3b.
  • the first tape feeding device 3a and the second tape feeding device It is good to make distance with 3b close.
  • one or more third tape feeding devices may be separately provided although not shown.
  • the electronic component exposing device 7 shown in the figure is disposed above the component storage tape 1 transported along a tape transport path (not shown), contacts the upper surface of the cover tape 6 constituting the component storage tape 1, and a cutter device A positioning device 35 for guiding so that the layer between the cover tape 6 and the carrier tape 10 is positioned at the tip of 20, and a right angle to the layer surface of the cover tape 6 and the carrier tape 10 to cut the cover tape 6 And a push-spreading means 21 for spreading the cover tape 6 cut and divided by the cutter device 20 on both sides to expose the electronic parts, and The electronic component exposed by the spreading means 21 is taken out of the component storage unit of the carrier tape 10 and the component extraction unit 16 It is configured.
  • the electronic component exposing device 7 is configured to be pressed in the direction indicated by the arrow in FIG. 11, and the component storage is performed by a not-shown tape transport path disposed below the component storage tape 1.
  • the positioning device 35 is configured to be in contact with the upper surface of the component storage tape 1 so that the tip of the cutter device 20 can be positioned between the cover tape 6 and the carrier tape 10. it can.
  • a spring or the like (not shown) is bridged between the positioning device 35 and a frame portion (not shown) having a tape transport path (not shown) formed on the upper surface, and the spring or the like moves the positioning device 35 in the direction of the tape transport path.
  • the component storage tape 1 which has been pulled between and held between them is pressed against the tape transport path.
  • the cutter apparatus 20 which comprises the electronic component exposure apparatus 7 demonstrated in FIG.10 and FIG.11 is demonstrated using FIG.12 and FIG.13.
  • the cutter blade 20a is opposed to the lower surface side of the cover tape 6 with an angle 20z formed by the cutter blade 20a and the cutter bottom 20b as 20 °. Is located in
  • the cover tape 6 is smoothly deformed so as to be lifted upward on the upstream side and the downstream side in the tape feeding direction centering on the front end of the cutter device 20 . Therefore, the cover tape 6 is in contact with the upper surface of the carrier tape 10 on the upstream side (upstream side of the arrow H) in the tape feeding direction centering on the tip of the cutter device 20, while the cutter bottom surface 20b is on the downstream side.
  • the electronic component 19 is prevented from popping out of the carrier tape 10 even when an external force such as vibration is applied while being in contact with the upper surface of the carrier tape 10, and the reliability of extraction of the component can be enhanced (see FIG. 13).
  • the dotted line shows the cutter blade 20a and the electronic component 19 hidden inside the cover tape 6, and the arrow x shows the part where the cover tape 6 is cut).
  • the thickness of the cover tape 6 varies within the specification by 0.05 to 0.1 mm, there is some variation, but for the case where the overall width of the component storage tape 1 is 4 mm and 8 mm, According to the study of the inventors, it is desirable that the angle 20z formed by the cutter blade 20a and the cutter bottom 20b be 30 ° or less. This is based on experiments by the present inventors that when the angle 20z formed by the cutter blade portion 20a and the cutter bottom surface 20b is 30 ° or less, there is no winding of the electronic component 19 between the cutter blade portion 20a and the cover tape 6. It is because it became clear.
  • the cutter apparatus 20 arrange
  • the electronic component 19 can be exposed without separating the cover tape 6 from the carrier tape 10.
  • the cover tape 6 is smoothly deformed on the upstream side and the downstream side in the tape feeding direction centering on the tip of the cutter device 20. Become. Therefore, the cover tape 6 is in contact with the upper surface of the carrier tape 10 on the upstream side in the tape feeding direction centering on the tip of the cutter device 20, and the cutter bottom 20b is in contact with the upper surface of the carrier tape 10 on the downstream side. Since the cover tape 6 or the cutter bottom surface 20b is in contact with the carrier tape 10 at any place, the electronic component 19 is prevented from jumping out of the carrier tape 10 even when an external force such as vibration is applied. The reliability of taking out the electronic component 19 by the component suction and mounting apparatus can be enhanced.
  • the cutter blade portion 20a has no gap from the tip to the portion where the cover tape 6 is cut, and the external force such as vibration is applied between the cutter blade portion 20a and the cover tape 6 as well. It is possible to prevent the electronic component 19 from being pinched. This can prevent the electronic component from being damaged, and can also prevent the electronic component from damaging the cutter device.
  • chipping may occur at the tip of the cutter device 20 if the angle 20z formed by the cutter blade portion 20a and the cutter bottom surface 20b constituting the cutter device 20 is reduced, but C at the tip of the cutter device 20 as shown in FIG.
  • the occurrence of chipping breaking of the cutting edge or chipping of the blade
  • the tip of the cutter device 20 is not a sharp blade, so that the stress is dispersed and chipping hardly occurs.
  • the C-chamfered surface 20c and the R-chamfered surface 20d break the bonded portion of the cover tape 6 and the carrier tape 10 before cutting the cover tape 6 if the distance 20e from the cutter bottom surface 20b is too large. It is preferable that the C-chamfered surface 20c or the R-chamfered surface 20d has a distance 20e of 0.2 mm or less from the cutter bottom surface 20b.
  • the C-chamfered surface 20c by making the angle 20x formed by the C-chamfered surface 20c with the cutter bottom surface 20b an obtuse angle, this operates even when the leading end of the cutter device 20 bites into the carrier tape 10.
  • the leading edge of the cutter device 20 is corrected to a position between the cover tape 6 and the carrier tape 10 in the interlayer direction.
  • the material of the cutter device 20 preferably has high toughness from the viewpoint of chipping prevention, but since it slides with the cover tape during operation, it is necessary to select a material that is also excellent in wear resistance. It is desirable to use a material that is excellent in toughness among cemented carbides obtained by mixing and sintering carbide and cobalt.
  • FIG. 16 shows a state in which the blade tip of the cutter device 20 abuts on the boundary between the cover tape 6 and the carrier tape 10. With further movement of the component storage tape 1 in the arrow direction H from the state of FIG. 16, the cutter device 20 runs on the upper surface of the carrier tape 10 while the C-chamfered surface 20 c abuts on the end surface corner portion of the carrier tape 10. It will be in the state of FIG.
  • the cutter device 20 since the cutter device 20 is pressed downward together with the positioning device 35 by a spring or the like, the cutter device 20 ascends against the pressing force and rides on the upper surface of the carrier tape 10. At this time, the cutter blade portion 20 a abuts on the central portion in the width direction orthogonal to the feed direction H of the cover tape 6 and advances relative to the component storage tape 1 while pushing up the cover tape 6. When the left end reaches the top of the cutter blade 20a to a certain extent, it is cut.
  • the cover tape 6 shown in FIG. 17 is not cut and remains on the cutter blade 20a, and the left side of this portion is not shown in FIG. 17 because it is cut. That is, since both sides of the cover tape 6 sandwiching the component storage unit 13 are bonded to the carrier tape 10, the tension increases as the height raised by the cutter blade 20a increases. A portion of the cover tape 6 where a predetermined tension or more is applied to the cutter blade 20a is cut and divided by the cutter blade 20a.
  • FIG 16 shows the case where the blade tip of the cutter device 20 hits the leading end surface 11 of the component storage tape 1 at the boundary between the cover tape 6 and the carrier tape 10, depending on the type of the component storage tape 1.
  • the thickness of the cover tape 6 may be different.
  • the cutter device 20 is attached to the positioning device 35 pressed downward by a spring or the like, and the component storage tape 1 is pressed against the transport surface placed by the positioning device 35.
  • the height of the upper surface of the component storage tape 1 is always kept in a fixed positional relationship.
  • the blade tip of the cutter device 20 abuts on the same height position of the leading end surface 11 of the component storage tape 1. Therefore, when the cover tape 6 is thinner than FIG. 16, the blade tip of the cutter blade portion 20 a will hit the end face of the carrier tape 10 at a position below the boundary position (interlayer) between the cover tape 6 and the carrier tape 10. .
  • the cutter device 20 is upward when the C-chamfered surface 20 c is pressed into the vicinity of the corner portion of the carrier tape 10 by the movement of the component storage tape 1 in the arrow H direction. Receive the power of Therefore, the cutter device 20 is raised to a position where the cutter bottom surface 20 b is on the upper surface of the carrier tape 10 while the cutter blade portion 20 a cuts the carrier tape 10 upward.
  • the cutter blade 20 a lifts the cover tape 6 above the carrier tape 10 as shown in FIG. 17, but cuts the cover tape 6 as described above with the movement of the component storage tape 1.
  • the cutter device 20 and the positioning device 35 are raised against the pressing force of FIG. 11 by the spring or the like, the pressing of the component storage tape 1 by the positioning device 35 is slightly weakened. Since the cutter bottom surface 20b of the cutter device 20 presses, the pressing of the component storage tape 1 as a whole is not weakened.
  • the tip of the cutter blade 20a is stuck in the middle of the end face of the carrier tape 10 As a result, it is possible to prevent the component storage tape 6 from being buckled to make it impossible to cut the cover tape 6, or to prevent the tip of the blade from being chipped.
  • the cutter device 20 attaches to the positioning device 35 so that the position where the blade tip of the cutter device 20 having the C-chamfered surface 20c hits the component storage tape is at a height position substantially at the center of these tolerance ranges. Is desirable.
  • the electronic component exposing device includes a cutter device for cutting and dividing the cover tape, and a spreading unit for the electronic component to open so as to be able to be taken out from the carrier tape.
  • the cutter device which comprises an electronic component exposure device, includes a component extraction unit for extracting the electronic component exposed by the spreading unit, and the cutter blade portion and the cutter bottom surface form an angle of 20.degree.
  • the chamfered surface or R-chamfered surface exposes the electronic component without separating the cover tape from the carrier tape, and prevents damage to the electronic component and secures the adsorptivity of the electronic component to improve productivity. It is possible to provide a component supply device that can be
  • the electronic component exposing apparatus having the above-described features exposes the electronic component without separating the cover tape from the carrier tape by being mounted on the electronic component mounting apparatus. It becomes possible to provide as an electronic component mounting apparatus which can prevent breakage of the electronic component and attractability of the electronic component and can improve productivity.
  • SYMBOLS 1 Component storage tape, 2 ... Storage tape reel, 3 ... Tape feeding apparatus, 3a ... 1st tape feeding apparatus, 3b ... 2nd tape feeding apparatus, 4 ... Cutter part, 5 ... Cut

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  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

The present invention provides a component feed device that is capable of exposing an electronic component without separating a cover tape from a carrier tape and thus capable of achieving high productivity and high reliability. This component feed device is equipped with a tape feed unit that sequentially dispenses a component accommodating tape that has been wound around an accommodating tape reel and sends the tape to a component take-out position, and an electronic component exposure unit that exposes the electronic component so that the electronic component can be taken out. The electronic component exposure unit comprises a positioning section for positioning the component accommodating tape, a cutter that is positioned at the right angle to the interlayer surface between a cover tape and a carrier tape and has an acute-angled blade edge, a push-opening means that opens the cut cover tape so as to allow the electronic component to be taken out of the carrier tape, and a component take-out unit for taking out the electronic component exposed by the push-opening means.

Description

部品供給装置及び電子部品装着装置Component supply device and electronic component mounting device
　本発明は部品供給装置及び電子部品装着装置に係り、特に、電子部品を部品収納部に収納保持しているキャリアテープから、部品収納部を覆っているカバーテープを剥離させることにより、電子部品を露出させる電子部品露出装置を備えているものに好適な部品供給装置及び電子部品装着装置に関する。 The present invention relates to a component supply apparatus and an electronic component mounting apparatus, and in particular, by peeling a cover tape covering a component storage unit from a carrier tape storing and holding the electronic component in the component storage unit, the electronic component is The present invention relates to a component supply device and an electronic component mounting device suitable for those having an electronic component exposure device to be exposed.
　この種の部品供給装置は、通常、電子部品を収納する部品収納部が所定の間隔で並んで形成されたキャリアテープと部品収納部からの部品飛び出し防止のためにキャリアテープに形成された部品収納部を覆うように設けられたカバーテープからなる部品収納テープを、収納テープリールに巻き付けられた状態から順次繰り出して部品取出し位置まで間欠的に送るテープ送り装置と、部品収納部にある電子部品を露出させて電子部品を取出し可能にする電子部品露出装置とから概略構成されている。 In this type of component supply apparatus, a carrier tape in which component storage units for storing electronic components are normally formed at predetermined intervals, and a component storage unit formed on the carrier tape for preventing component popping out of the component storage unit A tape feeding device for intermittently feeding out a component storage tape made of a cover tape provided so as to cover a part from a state wound around a storage tape reel and intermittently to a component removal position, and an electronic component in a component storage part An electronic component exposing device is schematically configured to expose and make it possible to take out the electronic component.
　図１に、従来の部品供給装置の概略を示す。該図に示すように、収納テープリール２に巻き付けられた部品収納テープ１は、図示していないガイドにより支持されながら、テープ送り装置３により矢印Ａや矢印Ｂの方向に搬送される。収納テープリール２とテープ送り装置３の間に設けられた電子部品露出装置７は、電子部品を部品収納部に保持しているキャリアテープからカバーテープ６を剥離させることにより、電子部品を露出させるものである。 FIG. 1 shows an outline of a conventional component supply apparatus. As shown in the figure, the component storage tape 1 wound around the storage tape reel 2 is conveyed by the tape feeding device 3 in the direction of arrow A or arrow B while being supported by a guide (not shown). The electronic component exposing device 7 provided between the storage tape reel 2 and the tape feeding device 3 exposes the electronic component by peeling the cover tape 6 from the carrier tape holding the electronic component in the component storage portion. It is a thing.
　露出させられた電子部品は、部品吸着装着装置９が矢印Ｄのように上下に移動することにより、部品吸着装着装置９の先端部に保持させられる。部品吸着装着装置９が電子部品を先端部に保持する装置は、一般的には真空吸着装置であり、他にチャック機構などで保持することが考えられる。キャリアテープから剥離させられたカバーテープ６は、カバーテープ送り装置８により矢印Ｃの方向へ搬送させられて、図示しない収納庫などに収納される。 The exposed electronic component is held at the tip of the component suction and mounting device 9 by moving the component suction and mounting device 9 up and down as shown by the arrow D. The device by which the component suction and mounting device 9 holds the electronic component at the tip portion is generally a vacuum suction device, and it is conceivable that other devices are held by a chuck mechanism or the like. The cover tape 6 peeled off from the carrier tape is transported in the direction of the arrow C by the cover tape feeding device 8 and stored in a storage (not shown) or the like.
　カバーテープ送り装置８は、例えば、収納テープリール２のようなリール状に形成され、リールが駆動源により回転するようにしてカバーテープ６を巻き取るようにしても良い。また、カバーテープ６が剥離され、電子部品が取り除かれたキャリアテープは、矢印Ｂ方向に搬送され、カッター部４で切断される。５は、その切断されたテープである。 The cover tape feeding device 8 may be formed, for example, in the form of a reel such as a storage tape reel 2 and may wind the cover tape 6 so that the reel is rotated by a drive source. Further, the carrier tape from which the cover tape 6 is peeled off and the electronic components are removed is conveyed in the arrow B direction and cut by the cutter unit 4. 5 is the cut tape.
　図２を用いて部品収納テープを説明する。図２に示す如く、部品収納テープ１は、キャリアテープ１０とカバーテープ６とから成っている。また、キャリアテープ１０は、電子部品（図示せず）を収納する部品収納部１３と、部品収納テープ１を移動させる搬送力をキャリアテープ１０に作用させる送り孔１４とから成っている。更に、カバーテープ６は、部品収納部１３の搬送方向と直交する方向の水平方向両側にて、キャリアテープ１０に接着されており、部品収納部１３の中に封入されている電子部品が、キャリアテープ１０から飛び出すことが無いようにしている。 The component storage tape will be described with reference to FIG. As shown in FIG. 2, the component storage tape 1 comprises a carrier tape 10 and a cover tape 6. Further, the carrier tape 10 includes a component storage portion 13 for storing an electronic component (not shown) and a feed hole 14 for causing the carrier tape 10 to have a conveying force for moving the component storage tape 1. Furthermore, the cover tape 6 is bonded to the carrier tape 10 on both sides in the horizontal direction in the direction orthogonal to the conveyance direction of the component storage unit 13, and the electronic component enclosed in the component storage unit 13 is a carrier. It does not fly out of the tape 10.
　通常、部品供給テープ１の全幅には、４ｍｍ、８ｍｍ・・・とさまざまな規格があり、また、カバーテープ６の厚みの仕様は、０.０５～０.１ｍｍの範囲である。カバーテープ６は、主にＰＥＴ系の材料からなり、キャリアテープ１０は、紙やエンボス等の材料からなっている。 Usually, the full width of the component supply tape 1 has various standards such as 4 mm, 8 mm, and so on, and the thickness specification of the cover tape 6 is in the range of 0.05 to 0.1 mm. The cover tape 6 is mainly made of a PET-based material, and the carrier tape 10 is made of a material such as paper or embossing.
　次に、このような部品供給装置から供給された電子部品を基板等に装着する電子部品装着装置について、図３を参照して説明する。 Next, an electronic component mounting apparatus for mounting an electronic component supplied from such a component supply apparatus on a substrate or the like will be described with reference to FIG.
　図３に示す如く、電子部品装着装置５０の基台５９上に、種々の電子部品をそれぞれの電子部品の取り出し位置（部品吸着位置）に１個ずつ供給する部品供給装置５３の一部が着脱可能に複数個並んで設置固定されている。対向する部品供給装置５３群の間には、基板搬送コンベア５１が設けられている。 As shown in FIG. 3, on the base 59 of the electronic component mounting apparatus 50, a part of the component supply apparatus 53 for supplying various electronic components one by one to the take-out position (component suction position) of each electronic component It is possible to install and fix a plurality of them side by side. A substrate transport conveyor 51 is provided between the opposing component supply devices 53.
　基板搬送コンベア５１は、矢印Ｆの方向から搬送されてくる基板を所定の位置に位置決めして、基板５２上に電子部品が装着された後、矢印Ｇの方向に搬送する。５５は、基板５２が搬送される方向と同方向に長い一対のＸビームであり、その両端部には、図示していないアクチュエータ（例えば、リニアモータなど）が取り付けられている。このアクチュエータによりＸビーム５５は、基板５２が搬送される方向と直交する方向に、Ｙビーム５７に沿って移動可能に支持されており、部品供給装置５３と基板５２との間を行き来することが可能となっている。更に、Ｘビーム５５には、図示していないアクチュエータ（例えば、リニアモータなど）により、Ｘビーム５５の長手方向に、Ｘビームに沿って移動する部品吸着装着装置９が設置されている。 The substrate conveyance conveyor 51 positions the substrate conveyed from the direction of arrow F at a predetermined position, and after the electronic component is mounted on the substrate 52, conveys the substrate in the direction of arrow G. Reference numeral 55 denotes a pair of X beams which are long in the same direction as the direction in which the substrate 52 is transported, and actuators (for example, a linear motor or the like) (not shown) are attached to both ends. By this actuator, the X beam 55 is movably supported along the Y beam 57 in a direction orthogonal to the direction in which the substrate 52 is transported, and can move between the component supply device 53 and the substrate 52. It is possible. Further, on the X beam 55, there is installed a component suction and mounting device 9 which moves along the X beam in the longitudinal direction of the X beam 55 by an actuator (for example, a linear motor or the like) not shown.
　部品供給装置５３と基板搬送コンベア５１との間には、認識カメラ５６とノズル保管部５８が配置されている。認識カメラ５６は、部品供給装置５３にて部品吸着装着装置９に吸着した電子部品の位置ずれ情報を取得するためのもので、電子部品が基板搬送方向及び基板搬送方向と直交する方向にどれだけ位置ずれしているか、また回転角度はどの程度かを、電子部品を撮影することにより確認できる。言うまでもなく、撮影することにより、電子部品が吸着されているか否かを確認することもできる。 A recognition camera 56 and a nozzle storage unit 58 are disposed between the component supply device 53 and the substrate transport conveyor 51. The recognition camera 56 is for acquiring positional deviation information of the electronic component adsorbed to the component suction / mounting device 9 by the component supply device 53, and the electronic component is in the substrate transport direction and in the direction orthogonal to the substrate transport direction. It can be confirmed by photographing the electronic component whether or not the positional deviation and the rotation angle are. Needless to say, by photographing, it is also possible to confirm whether the electronic component is adsorbed or not.
　Ｘビーム５５及びＹビーム５７が並行して動作することにより、電子部品が部品供給装置５３から基板５２上に移動する際に、部品吸着装着装置９は認識カメラ５６上を通過させられ、前述した電子部品の位置ずれ情報を取得することができる。ノズル保管部５８は、種々の電子部品を吸着及び装着するために必要な、部品吸着装着装置９に取り付けられた図示していない複数の交換用吸着ノズルを保管しておくところである。 By moving the electronic component from the component supply device 53 onto the substrate 52 by operating the X beam 55 and the Y beam 57 in parallel, the component suction and mounting device 9 is passed over the recognition camera 56, as described above. The positional deviation information of the electronic component can be acquired. The nozzle storage unit 58 stores a plurality of replacement suction nozzles (not shown) attached to the component suction and mounting device 9 which are necessary for suctioning and mounting various electronic components.
　電子部品に対応した吸着ノズルを取り付けるように指示された場合、部品吸着装着装置９は、Ｘビーム５５及びＹビーム５７の並行動作により、ノズル保管部５８まで移動させられ、吸着ノズルを交換するものである。 When instructed to attach the suction nozzle corresponding to the electronic component, the component suction / attachment device 9 is moved to the nozzle storage unit 58 by the parallel operation of the X beam 55 and the Y beam 57 to replace the suction nozzle It is.
　次に、上述した電子部品露出装置７の従来例について、図４乃至図６を用いて説明する。 Next, a conventional example of the electronic component exposing device 7 described above will be described with reference to FIGS. 4 to 6.
　図４及び図５は、特許文献１に記載されている電子部品露出装置７を示すものである。
該図に示す電子部品露出装置７は、部品収納テープ１を下からガイドする図示しない部品収納テープ１の搬送路近傍に、カバーテープ６をキャリアテープ１０から剥離させるカバーテープ剥離装置１５と、電子部品１９を取出すための部品取出し部１６とから成っている。そして、カバーテープ剥離装置１５は、先端をカバーテープ６とキャリアテープ１０の層間に挿入され、部品収納テープ１の移動にともないカバーテープ６をキャリアテープ１０から剥離できるようになっている。 FIGS. 4 and 5 show an electronic component exposing device 7 described in Patent Document 1. FIG.
The electronic component exposing device 7 shown in the figure is a cover tape peeling device 15 for peeling the cover tape 6 from the carrier tape 10 in the vicinity of the conveyance path of the component storage tape 1 (not shown) guiding the component storage tape 1 from below. It consists of a parts removal part 16 for taking out parts 19. The front end of the cover tape peeling device 15 is inserted between the cover tape 6 and the carrier tape 10 so that the cover tape 6 can be peeled from the carrier tape 10 as the component storage tape 1 moves.
　剥離後のカバーテープ６は、リターン棒１７で反転させられ、巻き取り機構１８により巻き取る構成となっている。尚、カバーテープ６とキャリアテープ１０は、図４の矢印の部位で接合されている。 The cover tape 6 after peeling is reversed by the return rod 17 and wound up by the winding mechanism 18. In addition, the cover tape 6 and the carrier tape 10 are joined by the site | part of the arrow of FIG.
　図６は、特許文献２に記載されている電子部品露出装置７を示すものである。該図に示す電子部品露出装置７は、図示していないテープ搬送路の上方にカバーテープ６を切断する手段であるカッター装置２０と、切断されたカバーテープ６を押し広げる押し広げ手段２１とから構成することで、カバーテープ６をキャリアテープ１０から分離させること無く、電子部品を露出させることを可能としている。 FIG. 6 shows an electronic component exposing device 7 described in Patent Document 2. As shown in FIG. The electronic component exposing device 7 shown in the figure is comprised of a cutter device 20 which is a means for cutting the cover tape 6 above the tape conveyance path (not shown) and a spreading means 21 which spreads the cut cover tape 6. By configuring, it is possible to expose the electronic component without separating the cover tape 6 from the carrier tape 10.
特開２０１０－００３７１４号公報JP, 2010-003714, A 特開２０１０－１９９５６７号公報JP, 2010-199567, A
　しかしながら、特許文献１に記載されている電子部品露出装置７では、電子部品１９を取り終わった部品収納テープ１はゴミとして収集し廃棄されるが、このときキャリアテープ１０とカバーテープ６は分離されるため、各々を収集し廃棄する必要がある。そのため、別々のゴミ収集に手間がかかることや、カバーテープ６とキャリアテープ１０が分離されるため、ゴミのカサが増える等の課題があった。 However, in the electronic component exposing device 7 described in Patent Document 1, the component storage tape 1 after the removal of the electronic component 19 is collected as waste and discarded, but at this time the carrier tape 10 and the cover tape 6 are separated. It is necessary to collect and discard each one. For this reason, it takes time and effort to separately collect dust, and the cover tape 6 and the carrier tape 10 are separated, which causes problems such as an increase in the amount of dust and the like.
　また、特許文献２の電子部品露出装置７では、図７及び図８に示す如く、カバーテープ６の切断手段であるカッター装置２０のカッター刃部２０aは、カバーテープ６とキャリアテープ１０の層間面に対して直角に配置され、カバーテープ６の切断は、カッター装置２０の先端がカバーテープ６とキャリアテープ１０の層間に入り込み、部品収納テープ１の矢印Ｈ方向の搬送に伴い、カバーテープ６の中央部に応力を集中させることで行われる。 Further, in the electronic component exposing device 7 of Patent Document 2, as shown in FIGS. 7 and 8, the cutter blade portion 20 a of the cutter device 20 which is a cutting means of the cover tape 6 has an interlayer surface of the cover tape 6 and the carrier tape 10. When the cover tape 6 is cut, the tip of the cutter device 20 penetrates the interlayer of the cover tape 6 and the carrier tape 10, and along with the conveyance of the component storage tape 1 in the arrow H direction, It is done by concentrating stress in the central part.
　そのため、カッター装置２０は、形状によっては先端部付近でカバーテープ６との間に隙間を生じ、電子部品１９に振動などの外力が加わった場合、電子部品１９はカッター刃部２０aとカバーテープ６の間に挟みこまれた状態となる（図８の点線部は、カバーテープ６の内側に隠れたカッター刃部２０aと電子部品１９を示し、矢印xはカバーテープ６が切断されている部位を示す）。その状態で部品収納テープ１の搬送が継続された場合、電子部品１９に損傷を与える恐れがあり、同時にカッター刃部２０aを傷めることになる。
また、電子部品１９がキャリアテープ１０から飛び出した状態では、部品吸着装着装置による部品吸着が困難になるという課題もある。 Therefore, depending on the shape, the cutter device 20 creates a gap with the cover tape 6 in the vicinity of the tip, and when an external force such as vibration is applied to the electronic component 19, the electronic component 19 has the cutter blade 20 a and the cover tape 6. (A dotted line in FIG. 8 indicates the cutter blade 20a and the electronic component 19 hidden inside the cover tape 6, and the arrow x indicates the portion where the cover tape 6 is cut. Show). If the transport of the component storage tape 1 is continued in this state, the electronic component 19 may be damaged, and at the same time, the cutter blade 20a may be damaged.
In addition, in the state where the electronic component 19 protrudes from the carrier tape 10, there is also a problem that the component suction by the component suction and mounting device becomes difficult.
　本発明は上述の点に鑑みなされたもので、その目的とするところは、カバーテープをキャリアテープから分離させること無く電子部品を露出させることができ、これにより生産性を向上しつつ、動作信頼性も高めることのできる部品供給装置及び電子部品装着装置を提供することにある。 The present invention has been made in view of the above-described point, and an object thereof is to expose an electronic component without separating a cover tape from a carrier tape, thereby improving productivity and operating reliability. It is an object of the present invention to provide a component supply device and an electronic component mounting device capable of enhancing the property.
　本発明の請求項１に記載の部品供給装置は、上記目的を達成するために、電子部品を収納する部品収納部が所定の間隔で並んで形成されたキャリアテープ及び該キャリアテープに形成された前記部品収納部を覆うように設けられたカバーテープからなる部品収納テープを、収納テープリールに巻き付けられた状態から順次繰り出して部品取出し位置まで送るテープ送り装置と、前記部品収納部にある前記電子部品を露出させて該電子部品を取出し可能にする電子部品露出装置とを備えた部品供給装置において、前記電子部品露出装置は、部品収納テープの位置決めを行う位置決め装置と、前記カバーテープを切断するために、該カバーテープと前記キャリアテープの層間面に対して直角に配置された刃先が鋭角であるカッターと、前記電子部品が前記キャリアテープから取出し可能にするために、切断した前記カバーテープを開口する押し広げ手段と、該押し広げ手段により露出させられた前記電子部品を取出すための部品取出し部とから成ることを特徴とする。 In order to achieve the above object, the component supply device according to claim 1 of the present invention is formed on a carrier tape in which component storage units for storing electronic components are formed side by side at predetermined intervals, and the carrier tape A tape feeding device for sequentially feeding out a component storage tape made of a cover tape provided so as to cover the component storage section from a state wound around a storage tape reel to a component removal position; and the electronic in the component storage section In a component supply device provided with an electronic component exposure device that exposes a component and makes it possible to take out the electronic component, the electronic component exposure device cuts the cover tape and a positioning device that positions a component storage tape. A cutter having an acute cutting edge disposed at a right angle to the interlayer surface of the cover tape and the carrier tape; The apparatus comprises: a spreading means for opening the cut cover tape so that an article can be removed from the carrier tape, and a part removing portion for removing the electronic part exposed by the spreading means. It features.
　また、本発明の請求項２に記載の部品供給装置は、請求項１の構成に加え、前記テープ送り装置は、第１のテープ送り装置と第２のテープ送り装置とから成り、該第１のテープ送り装置と第２のテープ送り装置との間に前記電子部品露出装置が配置されていることを特徴とする。 Further, according to a second aspect of the present invention, in addition to the configuration of the first aspect, the tape feeding device comprises a first tape feeding device and a second tape feeding device. The electronic component exposing device is disposed between the tape feeding device and the second tape feeding device.
　また、本発明の請求項３に記載の部品供給装置は、請求項１又は２の構成に加え、前記カッターの刃部とカッターの底面が成す角が３０°以下であることを特徴とする。 Further, in the component supply device according to a third aspect of the present invention, in addition to the configuration of the first or second aspect, an angle formed by a blade portion of the cutter and a bottom surface of the cutter is 30 ° or less.
　また、本発明の請求項４に記載の部品供給装置は、請求項１又は２の構成に加え、前記カッターの先端にＣ面取り加工面が施されていることを特徴とする。 Further, in the component supply device according to a fourth aspect of the present invention, in addition to the configuration according to the first or second aspect, a C-chamfered surface is provided at a tip of the cutter.
　また、本発明の請求項５に記載の部品供給装置は、請求項１又は２の構成に加え、前記カッターの先端にＲ面取り加工面が施されていることを特徴とする。 Moreover, in addition to the structure of Claim 1 or 2, the components supply apparatus of Claim 5 of this invention is characterized by R chamfering processing surface being given to the front-end | tip of the said cutter.
　また、本発明の請求項６に記載の部品供給装置は、請求項１又は２の構成に加え、前記カッターの先端にＣ面取り加工面が施され、該Ｃ面取り加工面が施されている範囲は、前記位置決め装置より下側で、かつ、前記カッターの底面から０.２ｍｍ以下であり、前記Ｃ面取り加工面が前記カッターの底面と成す角度は鈍角であることを特徴とする。 Further, in the component supply device according to a sixth aspect of the present invention, in addition to the configuration according to the first or second aspect, a C-chamfered surface is provided at a tip of the cutter and a range in which the C-chamfered surface is provided Is lower than the positioning device and 0.2 mm or less from the bottom surface of the cutter, and the angle formed by the C-chamfered surface with the bottom surface of the cutter is an obtuse angle.
　また、本発明の請求項７に記載の部品供給装置は、請求項１又は２の構成に加え、前記カッターの先端にＲ面取り加工面が施され、該Ｒ面取り加工面が施されている範囲は、前記位置決め装置より下側で、かつ、前記カッターの底面から０.２ｍｍ以下であることを特徴とする。 Further, in the component supply device according to claim 7 of the present invention, in addition to the configuration according to claim 1 or 2, a range in which an R-chamfered surface is provided at the tip of the cutter and the R-chamfered surface is provided Is lower than the positioning device, and 0.2 mm or less from the bottom surface of the cutter.
　また、本発明の電子部品装着装置は、上記目的を達成するために、基台と、該基台上に、種々の電子部品をそれぞれの電子部品の取り出し位置に１個ずつ供給する着脱可能に複数個並んで設置固定された部品供給装置と、相対向する前記部品供給装置群の間に設けられ、搬送されてくる基板を所定の位置に位置決めし、前記基板上に前記電子部品が装着された後に搬送する基板搬送コンベアと、前記基板が搬送される方向と同方向に伸び、かつ、その両端部にアクチュエータが取り付けられている一対のＸビームと、該Ｘビームと直交する方向に配置されたＹビームと、前記Ｘビームの長手方向に設置され、該Ｘビームに沿って移動する部品吸着装着装置９とを備え、前記アクチュエータによりＸビームは、前記基板が搬送される方向と直交する方向に前記Ｙビームに沿って移動可能に支持されていると共に、前記部品供給装置と基板との間を行き来することが可能となっている電子部品装着装置において、前記部品供給装置は、上記した構成の部品供給装置であることを特徴とする。 Further, in the electronic component mounting apparatus according to the present invention, in order to achieve the above object, the base and the various electronic components are detachably supplied one by one to the take-out position of each electronic component on the base. A plurality of component supply devices provided in a row and installed and fixed, and the component supply device group opposed to each other are positioned at a predetermined position for the substrate being transported, and the electronic components are mounted on the substrate. And a pair of X-beams extending in the same direction as the direction in which the substrate is transported, and with actuators attached at both ends, and disposed in a direction orthogonal to the X-beams. A Y-beam, and a component suction / mounting device 9 installed in the longitudinal direction of the X-beam and moving along the X-beam, and the X-beam is parallel to the direction in which the substrate is transported by the actuator. In the electronic component mounting apparatus, the electronic component mounting apparatus is supported movably along the Y beam in a direction to move between the component supply apparatus and the substrate, and is movable along the Y beam. It is characterized in that it is a component supply device of the above configuration.
　本発明によれば、カバーテープをキャリアテープから分離させること無く電子部品を露出させることができ、これにより生産性を向上しつつ、動作信頼性も高めることのできる部品供給装置及び電子部品装着装置を得ることができる。 According to the present invention, it is possible to expose the electronic component without separating the cover tape from the carrier tape, thereby improving productivity and improving the operation reliability as well as the electronic component mounting apparatus. You can get
従来の部品供給装置の概略構成を示す図である。It is a figure which shows schematic structure of the conventional components supply apparatus. 部品収納テープの構造を示す斜視図である。It is a perspective view showing the structure of a parts storage tape. 従来の部品供給装置を採用している電子部品装着装置の概略構成を示す平面図である。It is a top view which shows schematic structure of the electronic component mounting apparatus which employ | adopts the conventional component supply apparatus. 特許文献１に記載されている電子部品露出装置を示す上面図である。It is a top view which shows the electronic component exposure apparatus described in patent document 1. FIG. 図４の側面図である。It is a side view of FIG. 特許文献２に記載されている電子部品露出装置を示す斜視図である。It is a perspective view which shows the electronic component exposure apparatus described in patent document 2. FIG. 特許文献２に記載されている電子部品露出装置を示す上面図である。It is a top view which shows the electronic component exposure apparatus described in patent document 2. FIG. 図７の側面図である。It is a side view of FIG. 本発明の部品供給装置の実施例１の概略構成を示す図である。It is a figure which shows schematic structure of Example 1 of the components supply apparatus of this invention. 本発明の部品供給装置の実施例１に採用される電子部品露出装置を示す斜視図である。It is a perspective view which shows the electronic component exposure apparatus employ | adopted in Example 1 of the components supply apparatus of this invention. 図１０の側面図である。It is a side view of FIG. 本発明の部品供給装置の実施例１に採用される電子部品露出装置を構成するカッターの側面図である。It is a side view of the cutter which comprises the electronic component exposure apparatus employ | adopted in Example 1 of the components supply apparatus of this invention. 図１２に示したカッターを採用している電子部品露出装置を示す側面図である。It is a side view which shows the electronic component exposure apparatus which employ | adopts the cutter shown in FIG. カッターの他の例を採用した電子部品露出装置を示す側面図である。It is a side view which shows the electronic component exposure apparatus which employ | adopted the other example of the cutter. カッターの更に他の例を採用した電子部品露出装置を示す側面図である。It is a side view which shows the electronic component exposure apparatus which employ | adopted the other example of the cutter. 図１４に示したC面取り加工面が形成してある場合のカバーテープの切断分割部を示し、カッター装置の刃先端がカバーテープとキャリアテープの境界部分に突き当たった状態を示す図である。FIG. 15 is a view showing a cutting and dividing portion of the cover tape in the case where the C-chamfered surface shown in FIG. 14 is formed, in which a blade tip of the cutter device abuts on a boundary portion between the cover tape and the carrier tape. 図１６の状態から部品収納テープの移動に伴い、C面取り加工面がキャリアテープの端面角部に当接しつつカッター装置がキャリアテープの上面に乗り上がった状態を示す図である。FIG. 17 is a view showing a state in which the cutter device is mounted on the upper surface of the carrier tape while the C-chamfered surface is in contact with the end surface corner portion of the carrier tape along with the movement of the component storage tape from the state of FIG.
　以下、本発明の部品供給装置の一実施例について図面を用いて詳細に説明する。尚、符号は従来と同一のものは同符号を使用し、その詳細説明は省略する。 Hereinafter, an embodiment of the component supply apparatus of the present invention will be described in detail with reference to the drawings. In addition, the code | symbol same as the conventional one uses the same code | symbol, and the detailed description is abbreviate | omitted.
　図９を用いて本発明の実施例１の部品供給装置の概略構成を説明する。図９に示す部品供給装置が、図１に示した部品供給装置と異なる配置構成は、テープ搬送路中の第１のテープ送り装置３ａの手前に第２のテープ送り装置３ｂを設け、その第１のテープ送り装置３ａと第２のテープ送り装置３ｂの間に電子部品露出装置７を設置した点である。 The schematic configuration of the component supply device according to the first embodiment of the present invention will be described with reference to FIG. The arrangement configuration in which the component supply device shown in FIG. 9 differs from the component supply device shown in FIG. 1 is that the second tape feeding device 3b is provided in front of the first tape feeding device 3a in the tape transport path. The electronic component exposing device 7 is installed between the first tape feeding device 3a and the second tape feeding device 3b.
　このような配置構成の部品供給装置において、収納テープリール２に巻き付けられた部品収納テープ１は、図示していない部品供給装置の筐体に設けられた部品収納テープ１を取り込む取込口を介して、部品供給装置に取り込まれ、図示していないテープ搬送路により支持されながら、第２のテープ送り装置３ｂにより矢印Ａの方向に搬送される。 In the component supply device having such an arrangement configuration, the component storage tape 1 wound around the storage tape reel 2 is taken through the intake port for taking in the component storage tape 1 provided in the housing of the component supply device not shown. It is taken into the component feeding device and conveyed in the direction of arrow A by the second tape feeding device 3b while being supported by a tape conveyance path (not shown).
　収納テープリール２は、取込口に取り替え可能に保持固定されても良いし、部品供給装置から離れた位置に保持されても良い。また、第２のテープ送り装置３ｂは、例えば、部品収納テープ１に設けられた孔と勘合する突起部を持つ歯車状のものであっても良いし、部品収納テープの上面と下面の挟み込む一対のローラを有して成るものであっても良い。 The storage tape reel 2 may be replaceably held and fixed to the take-in port, or may be held at a position away from the component supply device. In addition, the second tape feeding device 3b may be, for example, a gear-like device having a projection that engages with a hole provided in the component storage tape 1, or a pair of sandwiching the upper surface and the lower surface of the component storage tape. The roller may be provided.
　第１のテープ送り装置３ａと第２のテープ送り装置３ｂの間に設けられた電子部品露出装置７は、電子部品を部品収納部に保持しているキャリアテープからカバーテープ６を部分的に剥離させることにより、電子部品を露出させるものである。 The electronic component exposing device 7 provided between the first tape feeding device 3a and the second tape feeding device 3b partially peels off the cover tape 6 from the carrier tape holding the electronic component in the component storage unit. As a result, the electronic components are exposed.
　第１のテープ送り装置３ａは、第２のテープ送り装置３ｂと同様に、例えば、部品収納テープ１に設けられた孔と勘合する突起部を持つ歯車状のものであっても良いし、部品収納テープの上面と下面の挟み込む一対のローラを有して成るものであっても良い。 Like the second tape feeding device 3b, the first tape feeding device 3a may be, for example, a gear-like device having a projection that engages with a hole provided in the component storage tape 1, or a component It is also possible to have a pair of rollers sandwiching the upper surface and the lower surface of the storage tape.
　露出させられた電子部品は、電子部品装着装置を構成する部品吸着装着装置９が矢印Ｄのように上下に移動することにより、部品吸着装着装置９の先端部に保持させられる。部品吸着装着装置９が電子部品を先端部に保持する装置は、一般的には真空吸着装置であり、他にチャック機構などで保持することが考えられる。 The exposed electronic component is held at the tip of the component suction and mounting device 9 as the component suction and mounting device 9 constituting the electronic component mounting device moves up and down as shown by the arrow D. The device by which the component suction and mounting device 9 holds the electronic component at the tip portion is generally a vacuum suction device, and it is conceivable that other devices are held by a chuck mechanism or the like.
　部分的に剥離させられたカバーテープ６は、第１のテープ送り装置３ａと第２のテープ送り装置３ｂにより矢印Ｂの方向へキャリアテープとともにカッター部４へ搬送され、カッター部４で切断される。５は、その切断されたテープである。 The partially peeled cover tape 6 is conveyed to the cutter unit 4 together with the carrier tape in the direction of the arrow B by the first tape feeding device 3a and the second tape feeding device 3b, and is cut by the cutter portion 4 . 5 is the cut tape.
　図９に示す部品供給装置では、部品収納テープ１は、第２のテープ送り装置３ｂにより電子部品露出装置７に送り込まれる。このとき部品収納テープ１の剛性などテープ状態に依存することなく、確実に部品収納テープ１を電子部品露出装置７に挿入させるためには、第１のテープ送り装置３ａと第２のテープ送り装置３ｂとの距離を近接させるのが良い。その結果、収納テープリール２と第２のテープ送り装置３ｂとの距離が長くなった場合には、図示していないが、１個以上の第３のテープ送り装置を別途設けても良い。 In the component supply device shown in FIG. 9, the component storage tape 1 is fed to the electronic component exposing device 7 by the second tape feeding device 3b. At this time, in order to reliably insert the component storage tape 1 into the electronic component exposing device 7 without depending on the tape condition such as the rigidity of the component storage tape 1, the first tape feeding device 3a and the second tape feeding device It is good to make distance with 3b close. As a result, when the distance between the storage tape reel 2 and the second tape feeding device 3b becomes long, one or more third tape feeding devices may be separately provided although not shown.
　図１０及び図１１を用いて、本発明の実施例１の部品供給装置に搭載する電子部品露出装置７の概略構成を説明する。 The schematic configuration of the electronic component exposure device 7 mounted on the component supply device according to the first embodiment of the present invention will be described with reference to FIGS. 10 and 11.
　該図に示す電子部品露出装置７は、図示しないテープ搬送路に沿って搬送される部品収納テープ１の上方に配置され、部品収納テープ１を構成するカバーテープ６の上面と接触し、カッター装置２０の先端にカバーテープ６とキャリアテープ１０との層間が位置するようにガイドする位置決め装置３５と、カバーテープ６を切断するために、該カバーテープ６とキャリアテープ１０の層間面に対して直角に配置された刃先が鋭角であるカッター刃とカッター底部から成るカッター装置２０と、カッター装置２０により切断分割されたカバーテープ６を両側に広げて、電子部品を露出させる押し広げ手段２１と、押し広げ手段２１により露出させられた電子部品をキャリアテープ１０の部品収納部から取出すための部品取出し部１６とから概略構成されている。 The electronic component exposing device 7 shown in the figure is disposed above the component storage tape 1 transported along a tape transport path (not shown), contacts the upper surface of the cover tape 6 constituting the component storage tape 1, and a cutter device A positioning device 35 for guiding so that the layer between the cover tape 6 and the carrier tape 10 is positioned at the tip of 20, and a right angle to the layer surface of the cover tape 6 and the carrier tape 10 to cut the cover tape 6 And a push-spreading means 21 for spreading the cover tape 6 cut and divided by the cutter device 20 on both sides to expose the electronic parts, and The electronic component exposed by the spreading means 21 is taken out of the component storage unit of the carrier tape 10 and the component extraction unit 16 It is configured.
　尚、電子部品露出装置７は、図１１中の矢印で示す方向に押圧される構成となっていて、部品収納テープ１の下側に配置される図示していないテープ搬送路とにより、部品収納テープ１を挟み込む構成となっており、ゆえに位置決め装置３５は、部品収納テープ１に対し上面に接触した形となり、カッター装置２０の先端をカバーテープ６とキャリアテープ１０との層間に位置決めすることができる。 The electronic component exposing device 7 is configured to be pressed in the direction indicated by the arrow in FIG. 11, and the component storage is performed by a not-shown tape transport path disposed below the component storage tape 1. The positioning device 35 is configured to be in contact with the upper surface of the component storage tape 1 so that the tip of the cutter device 20 can be positioned between the cover tape 6 and the carrier tape 10. it can.
　例えば、図示していないテープ搬送路が上面に形成された図示しないフレーム部と位置決め装置３５との間に図示しないバネ等が掛け渡され、このバネ等により位置決め装置３５がこのテープ搬送路の方向に引っ張られ、間に挟まれた部品収納テープ１をテープ搬送路に押し付けるようにしている。 For example, a spring or the like (not shown) is bridged between the positioning device 35 and a frame portion (not shown) having a tape transport path (not shown) formed on the upper surface, and the spring or the like moves the positioning device 35 in the direction of the tape transport path. The component storage tape 1 which has been pulled between and held between them is pressed against the tape transport path.
　図１２及び図１３を用いて、図１０及び図１１で説明した電子部品露出装置７を構成するカッター装置２０の説明をする。 The cutter apparatus 20 which comprises the electronic component exposure apparatus 7 demonstrated in FIG.10 and FIG.11 is demonstrated using FIG.12 and FIG.13.
　図１２及び図１３に示す如く、本実施例のカッター装置２０は、カッター刃部２０ａとカッター底面２０ｂが成す角２０ｚを２０゜として、カバーテープ６の下面側にカッター刃部２０ａが対向するように配置されている。 As shown in FIGS. 12 and 13, in the cutter device 20 of this embodiment, the cutter blade 20a is opposed to the lower surface side of the cover tape 6 with an angle 20z formed by the cutter blade 20a and the cutter bottom 20b as 20 °. Is located in
　これにより部品収納テープ１を矢印Ｈ方向に搬送した時、カバーテープ６は、カッター装置２０の先端部を中心としてテープ送り方向の上流側と下流側で、上方に持ち上げられるように滑らかに変形する。そのため、カッター装置２０の先端を中心としてテープ送り方向の上流側（矢印Ｈの上流側）では、カバーテープ６がキャリアテープ１０の上面に接触した状態となり、一方、下流側では、カッター底面２０ｂがキャリアテープ１０の上面と接触した状態となり、振動等の外力が加わった際にも電子部品１９がキャリアテープ１０から飛び出すことを抑制し、部品の取出しの信頼性を高めることができる（図１３の点線部は、カバーテープ６の内側に隠れたカッター刃部２０ａと電子部品１９を示し、矢印ｘはカバーテープ６が切断されている部位を示す）。 Thereby, when the component storage tape 1 is conveyed in the direction of arrow H, the cover tape 6 is smoothly deformed so as to be lifted upward on the upstream side and the downstream side in the tape feeding direction centering on the front end of the cutter device 20 . Therefore, the cover tape 6 is in contact with the upper surface of the carrier tape 10 on the upstream side (upstream side of the arrow H) in the tape feeding direction centering on the tip of the cutter device 20, while the cutter bottom surface 20b is on the downstream side. The electronic component 19 is prevented from popping out of the carrier tape 10 even when an external force such as vibration is applied while being in contact with the upper surface of the carrier tape 10, and the reliability of extraction of the component can be enhanced (see FIG. 13). The dotted line shows the cutter blade 20a and the electronic component 19 hidden inside the cover tape 6, and the arrow x shows the part where the cover tape 6 is cut).
　これにより電子部品１９を破損してしまうことを防止でき、電子部品１９がカッター装置２０にダメージを与えることも回避できる。 Thereby, damage to the electronic component 19 can be prevented, and damage to the cutter device 20 by the electronic component 19 can be avoided.
　この効果を実現するには、カバーテープ６の厚みが仕様内０.０５～０.１ｍｍで変化することで多少のばらつきはあるが、部品収納テープ１の全幅が４ｍｍ及び８ｍｍの場合については、カッター刃部２０ａとカッター底面２０ｂの成す角２０ｚを３０°以下とすることが、発明者等の検討によると望ましい。これは、カッター刃部２０ａとカッター底面２０ｂの成す角２０ｚを３０°以下とすると、カッター刃部２０ａとカバーテープ６の間に、電子部品１９の巻き込みがないことが本発明者等の実験により明らかとなったことによる。 In order to realize this effect, although the thickness of the cover tape 6 varies within the specification by 0.05 to 0.1 mm, there is some variation, but for the case where the overall width of the component storage tape 1 is 4 mm and 8 mm, According to the study of the inventors, it is desirable that the angle 20z formed by the cutter blade 20a and the cutter bottom 20b be 30 ° or less. This is based on experiments by the present inventors that when the angle 20z formed by the cutter blade portion 20a and the cutter bottom surface 20b is 30 ° or less, there is no winding of the electronic component 19 between the cutter blade portion 20a and the cover tape 6. It is because it became clear.
　このような本実施例によれば、電子部品露出装置７を構成するカバーテープ６とキャリアテープ１０の層間を成す面に対して直角に配置されたカッター装置２０が、カバーテープ６を切断することで、カバーテープ６をキャリアテープ１０から分離させること無く電子部品１９を露出させることができる。 According to such a present Example, the cutter apparatus 20 arrange | positioned at right angles with respect to the surface which forms the interlayer of the cover tape 6 which comprises the electronic component exposure apparatus 7, and the carrier tape 10 cut | disconnects the cover tape 6. Thus, the electronic component 19 can be exposed without separating the cover tape 6 from the carrier tape 10.
　このときカッター刃部２０ａとカッター底面２０ｂの成す角２０ｚを鋭角とすることで、カバーテープ６はカッター装置２０の先端部を中心としてテープ送り方向の上流側と下流側が滑らかな変形をすることになる。そのため、カッター装置２０の先端部を中心としてテープ送り方向の上流側では、カバーテープ６がキャリアテープ１０の上面に接触した状態、下流側では、カッター底面２０ｂがキャリアテープ１０の上面と接触した状態となり、いずれの場所においても、カバーテープ６かカッター底面２０ｂがキャリアテープ１０と接触した状態にあるため、振動等の外力が加わった際にも電子部品１９がキャリアテープ１０から飛び出すことを抑制し、部品吸着装着装置による電子部品１９の取出しの信頼性を高めることができる。 At this time, by making the angle 20z formed by the cutter blade portion 20a and the cutter bottom surface 20b acute, the cover tape 6 is smoothly deformed on the upstream side and the downstream side in the tape feeding direction centering on the tip of the cutter device 20. Become. Therefore, the cover tape 6 is in contact with the upper surface of the carrier tape 10 on the upstream side in the tape feeding direction centering on the tip of the cutter device 20, and the cutter bottom 20b is in contact with the upper surface of the carrier tape 10 on the downstream side. Since the cover tape 6 or the cutter bottom surface 20b is in contact with the carrier tape 10 at any place, the electronic component 19 is prevented from jumping out of the carrier tape 10 even when an external force such as vibration is applied. The reliability of taking out the electronic component 19 by the component suction and mounting apparatus can be enhanced.
　また、カッター刃部２０ａは、先端部からカバーテープ６が切断されている部位までの間に隙間はなく、振動等の外力が加わった際にも、カッター刃部２０ａとカバーテープ６の間に電子部品１９を挟み込むことが防止できる。これにより電子部品を破損してしまうことを防止でき、電子部品がカッター装置にダメージを与えることも回避できる。 Further, the cutter blade portion 20a has no gap from the tip to the portion where the cover tape 6 is cut, and the external force such as vibration is applied between the cutter blade portion 20a and the cover tape 6 as well. It is possible to prevent the electronic component 19 from being pinched. This can prevent the electronic component from being damaged, and can also prevent the electronic component from damaging the cutter device.
　次に、カッター装置２０の他の例について、図１４及び図１５を用いて説明する。 Next, another example of the cutter device 20 will be described using FIGS. 14 and 15.
　カッター装置２０を構成するカッター刃部２０ａとカッター底面２０ｂの成す角２０ｚを小さくすると、カッター装置２０の先端にチッピングが発生する懸念があるが、図１４に示すようなカッター装置２０の先端にＣ面取り加工面２０ｃ、或いは図１５に示すようなカッター装置２０の先端にＲ面取り加工面２０ｄを施すことで、チッピング（刃先が折れたり、刃が欠けること）の発生を抑制することができる。即ち、Ｃ面取り加工面２０ｃ或いはＲ面取り加工面２０ｄを施すことで、カッター装置２０の先端は、鋭利な刃ではなくなるため応力が分散し、チッピングが発生し難くなる。 There is a concern that chipping may occur at the tip of the cutter device 20 if the angle 20z formed by the cutter blade portion 20a and the cutter bottom surface 20b constituting the cutter device 20 is reduced, but C at the tip of the cutter device 20 as shown in FIG. By forming the R-chamfered surface 20 d on the chamfered surface 20 c or the tip of the cutter device 20 as shown in FIG. 15, the occurrence of chipping (breaking of the cutting edge or chipping of the blade) can be suppressed. That is, by providing the C-chamfered surface 20c or the R-chamfered surface 20d, the tip of the cutter device 20 is not a sharp blade, so that the stress is dispersed and chipping hardly occurs.
　Ｃ面取り加工面２０ｃ及びＲ面取り加工面２０ｄは、カッター底面２０ｂからの距離２０ｅが大きすぎると、カバーテープ６を切断する前に、カバーテープ６とキャリアテープ１０の接着部を破壊してしまうため、Ｃ面取り加工面２０ｃ或いはＲ面取り加工面２０ｄは、カッター底面２０ｂからの距離２０ｅを０.２ｍｍ以内とすることが望ましい。 The C-chamfered surface 20c and the R-chamfered surface 20d break the bonded portion of the cover tape 6 and the carrier tape 10 before cutting the cover tape 6 if the distance 20e from the cutter bottom surface 20b is too large. It is preferable that the C-chamfered surface 20c or the R-chamfered surface 20d has a distance 20e of 0.2 mm or less from the cutter bottom surface 20b.
　また、Ｃ面取り加工面２０ｃ及びＲ面取り加工面２０ｄは、位置決め装置３５より下側に位置決め装置３５との距離２０ｆをとって施工するよう配慮する必要があるが、これはカッター装置２０の最先端部をカバーテープ６とキャリアテープ１０の層間に位置決めする必要があるからである。 In addition, it is necessary to consider that the C chamfered surface 20c and the R chamfered surface 20d have a distance 20f to the positioning device 35 below the positioning device 35. This is because it is necessary to position the portion between the cover tape 6 and the carrier tape 10.
　更に、Ｃ面取り加工面２０ｃについては、Ｃ面取り加工面２０ｃがカッター底面２０ｂと成す角２０ｘを鈍角とすることで、これはカッター装置２０の最先端部がキャリアテープ１０に食い込んだ場合でも、動作の進行にともない上方向に力をうけ、カッター装置２０の最先端部は、カバーテープ６とキャリアテープ１０の層間方向の位置に修正される。カッター装置２０の材質は、チッピング防止の観点からは靭性が大きいものがよいが、動作中はカバーテープと摺動するので耐摩耗性にも優れる材質を選定することが必要であるため、タングステン・カーバイドとコバルトを混合して焼結した超硬材のなかでも靭性に優れる材質を使用することが望ましい。 Furthermore, with regard to the C-chamfered surface 20c, by making the angle 20x formed by the C-chamfered surface 20c with the cutter bottom surface 20b an obtuse angle, this operates even when the leading end of the cutter device 20 bites into the carrier tape 10. The leading edge of the cutter device 20 is corrected to a position between the cover tape 6 and the carrier tape 10 in the interlayer direction. The material of the cutter device 20 preferably has high toughness from the viewpoint of chipping prevention, but since it slides with the cover tape during operation, it is necessary to select a material that is also excellent in wear resistance. It is desirable to use a material that is excellent in toughness among cemented carbides obtained by mixing and sintering carbide and cobalt.
　例えば、図１４のように、Ｃ面取りしてＣ面取り加工面２０ｃが形成してある場合のカバーテープ６の切断分割について図１６及び図１７に基づき説明する。 For example, as shown in FIG. 14, cutting and division of the cover tape 6 in the case where the C-chamfered surface 20 c is formed by C-chamfering will be described based on FIGS. 16 and 17.
　部品収納テープ１が矢印方向Ｈに送られると、図１６に示すように、カッター装置２０の刃先端（最先端部）が、部品収納テープ１の先頭端面１１に突き当たる。 When the component storage tape 1 is fed in the arrow direction H, as shown in FIG. 16, the blade tip (most end portion) of the cutter device 20 abuts on the leading end surface 11 of the component storage tape 1.
　図１６は、カッター装置２０の刃先端がカバーテープ６とキャリアテープ１０の略境界部分に突き当たった状態を示す。図１６の状態からさらなる部品収納テープ１の矢印方向Ｈへの移動に伴い、Ｃ面取り加工面２０ｃがキャリアテープ１０の端面角部に当接しつつカッター装置２０はキャリアテープ１０の上面に乗り上がり、図１７の状態となる。 FIG. 16 shows a state in which the blade tip of the cutter device 20 abuts on the boundary between the cover tape 6 and the carrier tape 10. With further movement of the component storage tape 1 in the arrow direction H from the state of FIG. 16, the cutter device 20 runs on the upper surface of the carrier tape 10 while the C-chamfered surface 20 c abuts on the end surface corner portion of the carrier tape 10. It will be in the state of FIG.
　即ち、カッター装置２０は、位置決め装置３５と共にバネ等により下方に押し付けられているので、この押し付け力に抗しながら上昇し、キャリアテープ１０の上面に乗り上がる。このとき、カバーテープ６の送り方向Ｈと直交する幅方向の中央部にカッター刃部２０ａが当接し、カバーテープ６を押し上げながら部品収納テープ１に対して相対的に進むが、カバーテープ６の左側端部がある程度カッター刃部２０ａの上部に達すると切断される。 That is, since the cutter device 20 is pressed downward together with the positioning device 35 by a spring or the like, the cutter device 20 ascends against the pressing force and rides on the upper surface of the carrier tape 10. At this time, the cutter blade portion 20 a abuts on the central portion in the width direction orthogonal to the feed direction H of the cover tape 6 and advances relative to the component storage tape 1 while pushing up the cover tape 6. When the left end reaches the top of the cutter blade 20a to a certain extent, it is cut.
　図１７のカバーテープ６は、切断されずにカッター刃部２０ａ上に残っている状態を示し、この部分より左側は切断されるため図１７には図示していない。即ち、カバーテープ６は、部品収納部１３を挟んだ両側がキャリアテープ１０に接着されているので、カッター刃部２０ａにより持ちあげられた高さが増す毎に張力が増加する。カバーテープ６の所定以上の張力がカッター刃部２０ａに掛る部分が、カッター刃部２０ａにより切断され分割される。 The cover tape 6 shown in FIG. 17 is not cut and remains on the cutter blade 20a, and the left side of this portion is not shown in FIG. 17 because it is cut. That is, since both sides of the cover tape 6 sandwiching the component storage unit 13 are bonded to the carrier tape 10, the tension increases as the height raised by the cutter blade 20a increases. A portion of the cover tape 6 where a predetermined tension or more is applied to the cutter blade 20a is cut and divided by the cutter blade 20a.
　図１６は、カッター装置２０の刃先端の高さがカバーテープ６とキャリアテープ１０の境界にて、刃先端が部品収納テープ１の先頭端面１１に当たる場合であるが、部品収納テープ１の種類により、カバーテープ６の厚さは異なることがある。カッター装置２０は、バネ等により下方に押し付けられている位置決め装置３５に取り付けられており、部品収納テープ１は位置決め装置３５により載置されている搬送面に押し付けられているため、カッター装置２０と部品収納テープ１の上面の高さは常に一定の位置関係に保たれる。 16 shows the case where the blade tip of the cutter device 20 hits the leading end surface 11 of the component storage tape 1 at the boundary between the cover tape 6 and the carrier tape 10, depending on the type of the component storage tape 1. The thickness of the cover tape 6 may be different. The cutter device 20 is attached to the positioning device 35 pressed downward by a spring or the like, and the component storage tape 1 is pressed against the transport surface placed by the positioning device 35. The height of the upper surface of the component storage tape 1 is always kept in a fixed positional relationship.
　こうして、例えば、図１６のように、カッター装置２０の刃先端は、部品収納テープ１の先頭端面１１の同じ高さ位置に突き当たる。従って、カバーテープ６が図１６より薄い場合には、カバーテープ６とキャリアテープ１０の境界位置（層間）より下の位置で、カッター刃部２０ａの刃先端がキャリアテープ１０の端面に当たることとなる。 Thus, for example, as shown in FIG. 16, the blade tip of the cutter device 20 abuts on the same height position of the leading end surface 11 of the component storage tape 1. Therefore, when the cover tape 6 is thinner than FIG. 16, the blade tip of the cutter blade portion 20 a will hit the end face of the carrier tape 10 at a position below the boundary position (interlayer) between the cover tape 6 and the carrier tape 10. .
　この場合、キャリアテープ１０はある程度剛性があるため、部品収納テープ１の矢印Ｈ方向への移動によりＣ面取り加工面２０ｃがキャリアテープ１０の角部付近内部に押し当ることにより、カッター装置２０は上方への力を受ける。従って、カッター装置２０は、カッター刃部２０ａがキャリアテープ１０を上方に削りつつ、カッター底面２０ｂがキャリアテープ１０の上面に乗る位置まで上昇する。 In this case, since the carrier tape 10 has a certain degree of rigidity, the cutter device 20 is upward when the C-chamfered surface 20 c is pressed into the vicinity of the corner portion of the carrier tape 10 by the movement of the component storage tape 1 in the arrow H direction. Receive the power of Therefore, the cutter device 20 is raised to a position where the cutter bottom surface 20 b is on the upper surface of the carrier tape 10 while the cutter blade portion 20 a cuts the carrier tape 10 upward.
　その過程で、キャリアテープ１０より上方でカッター刃部２０ａは、図１７に示すように、カバーテープ６を持ち上げるが、部品収納テープ１の移動に伴い上述と同様にカバーテープ６を切断する。この時、カッター装置２０及び位置決め装置３５は、バネ等による図１１の押し付け力に抗して上昇しているので、位置決め装置３５による部品収納テープ１の押圧は少し弱まるが、代わりにキャリアテープ１０をカッター装置２０のカッター底面２０ｂが押さえるので、全体として部品収納テープ１の押さえが弱まることはない。 In the process, the cutter blade 20 a lifts the cover tape 6 above the carrier tape 10 as shown in FIG. 17, but cuts the cover tape 6 as described above with the movement of the component storage tape 1. At this time, since the cutter device 20 and the positioning device 35 are raised against the pressing force of FIG. 11 by the spring or the like, the pressing of the component storage tape 1 by the positioning device 35 is slightly weakened. Since the cutter bottom surface 20b of the cutter device 20 presses, the pressing of the component storage tape 1 as a whole is not weakened.
　このように、Ｃ面取り加工面２０ｃが形成されているので、カバーテープ６の厚さにある程度のばらつきがあっても、キャリアテープ１０の端面の途中にカッター刃部２０ａの先端が突き刺さったままになり、部品収納テープ６を座屈させてカバーテープ６を切断できない状態になったり、刃先端が欠けてしまったりすることを防止できる。 Thus, since the C-chamfered surface 20c is formed, even if the thickness of the cover tape 6 varies to some extent, the tip of the cutter blade 20a is stuck in the middle of the end face of the carrier tape 10 As a result, it is possible to prevent the component storage tape 6 from being buckled to make it impossible to cut the cover tape 6, or to prevent the tip of the blade from being chipped.
　また、カッター装置２０の刃先端の高さが、カバーテープ６とキャリアテープ１０の境界より少し上で刃先端が部品収納テープ１の先頭端面１１に当たる場合であっても、カバーテープ６の端面の下側で当たるのであれば、カバーテープ６は上方に逃げ、その下に刃先端が入り込むことができる。従って、Ｃ面取り加工面２０ｃを有するカッター装置２０の刃先端が部品収納テープに当たる位置が、これらのばらつき許容範囲の略中央の高さ位置とするように、カッター装置２０を位置決め装置３５に取り付けることが望ましい。 Further, even if the height of the blade tip of the cutter device 20 is slightly above the boundary between the cover tape 6 and the carrier tape 10 and the blade tip hits the leading end surface 11 of the component storage tape 1, the end surface of the cover tape 6 If it hits on the lower side, the cover tape 6 can escape upward and the blade tip can enter below it. Therefore, attach the cutter device 20 to the positioning device 35 so that the position where the blade tip of the cutter device 20 having the C-chamfered surface 20c hits the component storage tape is at a height position substantially at the center of these tolerance ranges. Is desirable.
　図１５のように、Ｒ面取りしてＲ面取り加工面２０ｄが形成されている場合も同様である。 The same applies to the case where the R-chamfered surface 20 d is formed by R-chamfering as shown in FIG. 15.
　このような本実施例の構成でも上述した実施例と同様な効果が得られることは勿論、カッター装置２０の先端部にＣ面取り加工面２０ｃ或いはＲ面取り加工面２０ｄを施すことで、カッター刃部２０ａとカッター底面２０ｂの成す角を小さくしたことで懸念されるカッター装置２０の先端部に発生するチッピングを抑制することができ、より信頼性の高い電子部品露出装置とすることが可能となる。 Even with the configuration of this embodiment, the same effect as that of the above-described embodiment can be obtained, of course, and the C-chamfered surface 20c or the R-chamfered surface 20d is applied to the tip of the cutter device 20 By reducing the angle formed by 20a and the cutter bottom surface 20b, it is possible to suppress chipping that may occur at the tip of the cutter device 20, which makes it possible to provide a more reliable electronic component exposure device.
　以上説明してきたように、電子部品露出装置は、カバーテープを切断して分割するカッター装置と、切断して分割されたカバーテープを電子部品がキャリアテープから取出し可能に開口する押し広げ手段と、押し広げ手段により露出させられた電子部品を取出すための部品取出し部と、を備え、電子部品露出装置を構成するカッター装置は、カッター刃部とカッター底面の成す角は２０゜でカッター先端にＣ面取り加工面、若しくはＲ面取り加工面を施すことで、カバーテープをキャリアテープから分離させること無く電子部品を露出させ、かつ電子部品の破損防止と電子部品の吸着性を確保し、生産性を向上させることが可能な部品供給装置を提供することが可能となる。 As described above, the electronic component exposing device includes a cutter device for cutting and dividing the cover tape, and a spreading unit for the electronic component to open so as to be able to be taken out from the carrier tape. The cutter device, which comprises an electronic component exposure device, includes a component extraction unit for extracting the electronic component exposed by the spreading unit, and the cutter blade portion and the cutter bottom surface form an angle of 20.degree. The chamfered surface or R-chamfered surface exposes the electronic component without separating the cover tape from the carrier tape, and prevents damage to the electronic component and secures the adsorptivity of the electronic component to improve productivity. It is possible to provide a component supply device that can be
　また、図を用いた説明は行わないが、上記特徴を備えた電子部品露出装置は、電子部品装着装置に搭載することで、カバーテープをキャリアテープから分離させること無く電子部品を露出させ、かつ電子部品の破損防止と電子部品の吸着性を確保し、生産性を向上させることが可能な電子部品装着装置として提供することが可能となる。 Further, although not described using the drawings, the electronic component exposing apparatus having the above-described features exposes the electronic component without separating the cover tape from the carrier tape by being mounted on the electronic component mounting apparatus. It becomes possible to provide as an electronic component mounting apparatus which can prevent breakage of the electronic component and attractability of the electronic component and can improve productivity.
　尚、本発明は、上述した実施例に限定されるものではなく、その技術思想の範囲内で種々変形可能であることは言うまでも無い。 The present invention is not limited to the embodiments described above, and it goes without saying that various modifications can be made within the scope of the technical idea thereof.
　１…部品収納テープ、２…収納テープリール、３…テープ送り装置、３ａ…第１のテープ送り装置、３ｂ…第２のテープ送り装置、４…カッター部、５…切断されたテープ、６…カバーテープ、７…電子部品露出装置、８…カバーテープ送り装置、９…部品吸着装着装置、１０…キャリアテープ、１３…部品収納部、１４…送り孔、１５…カバーテープ剥離装置、１６…部品取出し部、１７…リターン棒、１８…巻き取り機構、１９…電子部品、２０…カッター装置、２０ａ…カッター刃部、２０ｂ…カッター底面、２０ｃ…Ｃ面取り加工面、２０ｄ…Ｒ面取り加工面、２０ｅ…カッター底面からの距離、２０ｆ…位置決め装置との距離、２０ｘ…Ｃ面取り加工面がカッター底面と成す角、２０ｚ…カッター刃部とカッター底面の成す角、２１…押し広げ手段、３５…位置決め装置、５０…電子部品装着装置、５１…基板搬送コンベア、５２…基板、５３…部品供給装置、５５…Ｘビーム、５６…認識カメラ、５７…Ｙビーム、５８…ノズル保管部、５９…基台。 DESCRIPTION OF SYMBOLS 1 ... Component storage tape, 2 ... Storage tape reel, 3 ... Tape feeding apparatus, 3a ... 1st tape feeding apparatus, 3b ... 2nd tape feeding apparatus, 4 ... Cutter part, 5 ... Cut | disconnected tape, 6 ... Cover tape 7: Electronic parts exposing device 8: Cover tape feeding device 9: Parts suction attachment device 10: Carrier tape 13: Parts storage portion 14: Feeding hole 15: Cover tape peeling device 16: Parts Take-out part, 17: return bar, 18: take-up mechanism, 19: electronic component, 20: cutter device, 20a: cutter blade portion, 20b: cutter bottom surface, 20c: C chamfering surface, 20d: R chamfering surface, 20e ... Distance from the cutter bottom, 20f ... Distance to the positioning device, 20x ... C Chamfered surface angle with the cutter bottom, 20z ... Angle between the cutter blade and the cutter bottom, DESCRIPTION OF SYMBOLS 1 ... Spreading means, 35 ... Positioning device, 50 ... Electronic component mounting apparatus, 51 ... Substrate conveyance conveyor, 52 ... Substrate, 53 ... Component supply apparatus, 55 ... X beam, 56 ... Recognition camera, 57 ... Y beam, 58 ... Nozzle storage unit, 59 ... Base.

Claims (10)

  1. 　電子部品を収納する部品収納部が所定の間隔で並んで形成されたキャリアテープ及び該キャリアテープに形成された前記部品収納部を覆うように設けられたカバーテープからなる部品収納テープを、収納テープリールに巻き付けられた状態から順次繰り出して部品取出し位置まで送るテープ送り装置と、前記部品収納部にある前記電子部品を露出させて該電子部品を取出し可能にする電子部品露出装置とを備えた部品供給装置において、
    　前記電子部品露出装置は、部品収納テープの位置決めを行う位置決め装置と、前記カバーテープを切断するために、該カバーテープと前記キャリアテープの層間面に対して直角に配置された刃先が鋭角であるカッターと、前記電子部品が前記キャリアテープから取出し可能にするために、切断した前記カバーテープを開口する押し広げ手段と、該押し広げ手段により露出させられた前記電子部品を取出すための部品取出し部とから成ることを特徴とする部品供給装置。     A component storage tape comprising a carrier tape in which component storage sections for storing electronic components are formed side by side at predetermined intervals, and a cover tape provided to cover the component storage section formed on the carrier tape, a storage tape A component provided with a tape feeding device which sequentially feeds out from a state wound around a reel and feeds it to a component take-out position, and an electronic component exposure device which exposes the electronic component in the component storage section and allows the electronic component to be taken out. In the feeder,
    In the electronic component exposing device, a positioning device for positioning a component storage tape, and a cutting edge at a right angle to an interlayer surface of the cover tape and the carrier tape for cutting the cover tape have an acute angle. A cutter, spreading means for opening the cut cover tape so that the electronic component can be removed from the carrier tape, and a component removal portion for removing the electronic component exposed by the spreading device. And a component supply device characterized by comprising:
  2. 　請求項１に記載の部品供給装置において、
    　前記テープ送り装置は、第１のテープ送り装置と第２のテープ送り装置とから成り、該第１のテープ送り装置と第２のテープ送り装置との間に前記電子部品露出装置が配置されていることを特徴とする部品供給装置。     In the parts supply device according to claim 1,
    The tape feeding apparatus comprises a first tape feeding apparatus and a second tape feeding apparatus, and the electronic component exposing apparatus is disposed between the first tape feeding apparatus and the second tape feeding apparatus. Parts supply device characterized by
  3. 　請求項１又は２に記載の部品供給装置において、
    　前記カッターの刃部とカッターの底面が成す角が３０°以下であることを特徴とする部品供給装置。     In the parts supply device according to claim 1 or 2,
    An angle formed by a blade portion of the cutter and a bottom surface of the cutter is 30 ° or less.
  4. 　請求項１又は２に記載の部品供給装置において、
    　前記カッターの先端にＣ面取り加工面が施されていることを特徴とする部品供給装置。     In the parts supply device according to claim 1 or 2,
    A component feeding device characterized in that a C-chamfered surface is provided at the tip of the cutter.
  5. 　請求項１又は２に記載の部品供給装置において、
    　前記カッターの先端にＲ面取り加工面が施されていることを特徴とする部品供給装置。     In the parts supply device according to claim 1 or 2,
    An R-chamfered surface is provided at the tip of the cutter.
  6. 　請求項１又は２に記載の部品供給装置において、
    　前記カッターの先端にＣ面取り加工面が施され、該Ｃ面取り加工面が施されている範囲は、前記位置決め装置より下側で、かつ、前記カッターの底面から０.２ｍｍ以下であり、前記Ｃ面取り加工面が前記カッターの底面と成す角度は鈍角であることを特徴とする部品供給装置。     In the parts supply device according to claim 1 or 2,
    A C-chamfered surface is applied to the tip of the cutter, and a range in which the C-chamfered surface is applied is 0.2 mm or less from the bottom surface of the cutter below the positioning device, and the C An angle between the chamfered surface and the bottom surface of the cutter is an obtuse angle.
  7. 　請求項１又は２に記載の部品供給装置において、
    　前記カッターの先端にＲ面取り加工面が施され、該Ｒ面取り加工面が施されている範囲は、前記位置決め装置より下側で、かつ、前記カッターの底面から０.２ｍｍ以下であることを特徴とする部品供給装置。     In the parts supply device according to claim 1 or 2,
    An R-chamfered surface is applied to the tip of the cutter, and a range in which the R-chamfered surface is applied is 0.2 mm or less from the bottom surface of the cutter below the positioning device. Parts supply device to be.
  8. 　基台と、該基台上に、種々の電子部品をそれぞれの電子部品の取り出し位置に１個ずつ供給する着脱可能に複数個並んで設置固定された部品供給装置と、相対向する前記部品供給装置群の間に設けられ、搬送されてくる基板を所定の位置に位置決めし、前記基板上に前記電子部品が装着された後に搬送する基板搬送コンベアと、前記基板が搬送される方向と同方向に伸び、かつ、その両端部にアクチュエータが取り付けられている一対のＸビームと、該Ｘビームと直交する方向に配置されたＹビームと、前記Ｘビームの長手方向に設置され、該Ｘビームに沿って移動する部品吸着装着装置とを備え、前記Ｘビームは、アクチュエータにより前記基板が搬送される方向と直交する方向に前記Ｙビームに沿って移動可能に支持されていると共に、前記部品供給装置と基板との間を行き来することが可能となっている電子部品装着装置において、
    　前記部品供給装置は、請求項１乃至７のいずれかに記載の部品供給装置であることを特徴とする電子部品装着装置。     A base and a component supply apparatus in which a plurality of detachable electronic components are supplied one by one to each take-out position of the electronic component on the base and the component supply apparatus installed and fixed side by side A substrate transport conveyor provided between the device groups for positioning the transported substrate at a predetermined position and transporting after the electronic component is mounted on the substrate, and the same direction as the direction in which the substrate is transported And a pair of X beams having actuators attached at both ends thereof, a Y beam arranged in a direction orthogonal to the X beams, and a longitudinal direction of the X beams, And a component suction and mounting device that moves along the Y beam, and the X beam is movably supported along the Y beam in a direction orthogonal to a direction in which the substrate is transported by an actuator. In the electronic component mounting apparatus that it is possible to go back and forth between the serial component supplying device and the substrate,
    The said components supply apparatus is a components supply apparatus in any one of the Claims 1 thru | or 7, The electronic component mounting apparatus characterized by the above-mentioned.
  9. 　請求項８に記載の電子部品装着装置において、
    　前記部品供給装置と基板搬送コンベアとの間に、前記部品吸着装着装置で吸着した電子部品の位置ずれ情報を取得するか及び/又は前記電子部品が吸着されているか否かを確認するための認識カメラが配置されていることを特徴とする電子部品装着装置。     In the electronic component mounting apparatus according to claim 8,
    Recognition for acquiring positional deviation information of the electronic component adsorbed by the component suction and mounting apparatus and / or confirming whether or not the electronic component is adsorbed between the component supply device and the substrate conveyance conveyor An electronic component mounting apparatus characterized in that a camera is disposed.
  10. 　請求項８又は９に記載の電子部品装着装置において、
    　前記部品供給装置と基板搬送コンベアとの間に、前記部品吸着装着装置に取り付けられている吸着ノズルの交換用吸着ノズルが保管されているノズル保管部が配置されていることを特徴とする電子部品装着装置。     In the electronic component mounting apparatus according to claim 8 or 9,
    An electronic component characterized in that a nozzle storage unit in which a suction nozzle for replacing a suction nozzle attached to the component suction and mounting device is stored is disposed between the component supply device and the substrate conveyance conveyor. Mounting device.
PCT/JP2012/071541 2012-08-27 2012-08-27 Component feed device and electronic component mounting device WO2014033801A1 (en)

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