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WO2014032263A1 - Anti-skid packaging case for electronic product and manufacturing method thereof - Google Patents

Anti-skid packaging case for electronic product and manufacturing method thereof Download PDF

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Publication number
WO2014032263A1
WO2014032263A1 PCT/CN2012/080807 CN2012080807W WO2014032263A1 WO 2014032263 A1 WO2014032263 A1 WO 2014032263A1 CN 2012080807 W CN2012080807 W CN 2012080807W WO 2014032263 A1 WO2014032263 A1 WO 2014032263A1
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WO
WIPO (PCT)
Prior art keywords
slip
bag body
electronic product
packaging bag
product according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2012/080807
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French (fr)
Chinese (zh)
Inventor
韩勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN JIAHONG INDUSTRIAL Corp Ltd
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SHENZHEN JIAHONG INDUSTRIAL Corp Ltd
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Priority to PCT/CN2012/080807 priority Critical patent/WO2014032263A1/en
Publication of WO2014032263A1 publication Critical patent/WO2014032263A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45C—PURSES; LUGGAGE; HAND CARRIED BAGS
    • A45C3/00—Flexible luggage; Handbags
    • A45C3/001—Flexible materials therefor
    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45C—PURSES; LUGGAGE; HAND CARRIED BAGS
    • A45C11/00—Receptacles for purposes not provided for in groups A45C1/00-A45C9/00
    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45C—PURSES; LUGGAGE; HAND CARRIED BAGS
    • A45C11/00—Receptacles for purposes not provided for in groups A45C1/00-A45C9/00
    • A45C11/003—Receptacles for purposes not provided for in groups A45C1/00-A45C9/00 for storing portable computing devices, e.g. laptops, tablets or calculators
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/16—Indexing scheme relating to G06F1/16 - G06F1/18
    • G06F2200/163—Indexing scheme relating to constructional details of the computer
    • G06F2200/1633—Protecting arrangement for the entire housing of the computer

Definitions

  • the invention relates to the technical field of daily necessities, and more particularly to a non-slip packaging bag for an electronic product and a manufacturing method thereof.
  • existing packaging bags for electronic products are generally made of cloth for isolating electronic products from the external environment.
  • the electronic product packaged in such a package can avoid the damage caused by the above-mentioned external environment to a certain extent, the aesthetic appearance of the electronic product after packaging is greatly reduced; at the same time, the material for making the packaging bag has poor anti-slip performance, such as a user.
  • the placement of the packaged electronic product is negligent and may cause the electronic product to slip and break the electronic product.
  • the technical problem to be solved by the present invention is to provide a strong anti-slip performance and a certain aesthetic appearance for the prior art technical problems of poor anti-slip performance and poor aesthetic appearance of the packaging bag for electronic products.
  • the invention relates to a non-slip packaging bag for an electronic product, comprising:
  • a non-slip layer disposed on an outer surface of the upper bag body and the lower bag body for decoration and anti-slip effect
  • a connecting member for connecting the upper bag body and the lower bag body to isolate the accommodating space from an external environment.
  • the anti-slip layer is a silicone anti-slip layer provided on at least a part of an outer surface of the upper bag body and the lower bag body.
  • the silicone anti-slip layer has a thickness of 0.3 mm to 0.8 mm.
  • the pattern of the anti-slip layer of the silicone rubber is a rhombic or a circle-like shape which is sequentially connected.
  • the pattern of the silicone anti-slip layer has a line width of 1 mm to 2 mm.
  • the connecting member is a zipper.
  • the upper bag body and the lower bag body are synthetic rubber foam or polyamide.
  • the invention also relates to a method for manufacturing an anti-slip packaging bag for an electronic product, comprising the steps of:
  • the bag body to which the silica gel has been attached is divided into an upper bag body and a lower bag body, and the upper bag body and the lower bag body are connected by a connecting member to form an accommodating space separated from the external environment.
  • the step A further includes the following steps:
  • the silica gel and the silica gel curing agent are mixed and subjected to vacuum treatment.
  • the step B includes the following steps:
  • the bag to which the silica gel is attached is peeled off from the template, and then the template is cooled.
  • the temperature of the hot pressing in the step B is 180 to 230 degrees.
  • the hot pressing time in the step B is 40 seconds to 60 seconds.
  • the pressure of the hot pressing in the step B is 0.1 MPa to 0.2 MPa.
  • the silicone image layer has a thickness of 0.3 mm to 0.8 mm.
  • the pattern of the anti-slip silicone layer is a rhombic or a circle-like shape that is sequentially connected.
  • the pattern of the silicone anti-slip layer has a line width of 1 mm to 2 mm.
  • the connecting member is a zipper.
  • the upper bag body and the lower bag body are synthetic rubber foam or polyamide.
  • FIG. 1 is a schematic structural view of a preferred embodiment of a non-slip packaging bag for an electronic product of the present invention
  • FIG. 2 is a schematic structural view of a silicone anti-skid layer of a preferred embodiment of a non-slip packaging bag for an electronic product according to the present invention
  • FIG. 3 is a flow chart of a preferred embodiment of a method for fabricating an anti-slip packaging bag for an electronic product of the present invention
  • FIG. 1 is a schematic structural view of a preferred embodiment of a non-slip packaging bag for an electronic product according to the present invention
  • FIG. 2 is a view showing a preferred embodiment of the non-slip packaging bag for an electronic product.
  • the non-slip packaging bag for an electronic product includes an upper bag body 11, a lower bag body 12, a non-slip layer 13, and a connecting member 14.
  • the upper bag body 11 and the lower bag body 12 form an accommodating space for placing an electronic product; the anti-slip layer 13 is disposed on the outer surfaces of the upper bag body 11 and the lower bag body 12 to serve as a decoration and a non-slip effect; and the connecting member 14
  • the upper bag body 11 and the lower bag body 12 are connected to isolate the electronic product in the accommodating space from the external environment.
  • the anti-slip layer 13 of the non-slip packaging bag for electronic products of the present invention is a silicone anti-slip layer which is disposed on at least a part of the outer surface of the upper bag body 11 and the lower bag body 12 of the non-slip packaging bag, and of course, may also be disposed on the upper bag body. 11 and the entire outer surface of the lower bag body 12.
  • the pattern of the anti-slip layer of the silicone is a diamond or a circle which is sequentially connected, and of course, other patterns can be used according to the requirements of the user, and even personalized patterns can be used.
  • the anti-slip layer of the silicone has a thickness of 0.3 mm to 0.8 mm, and the pattern of the anti-slip layer of the silicone has a line width of 1 mm to 2 mm. If the thickness of the anti-slip layer of the silicone is too large, the manufacturing cost of the non-slip package will be greatly increased. For example, if the thickness of the anti-slip layer of the silicone is too small, the anti-skid layer of the silicone will easily fall off.
  • the line width of the pattern of the silicone anti-slip layer is also to minimize the amount of silica gel on the basis of ensuring a good anti-slip effect.
  • the upper bag body 11 and the lower bag body 12 may both be synthetic rubber foams, such as neoprene rubber, which are delicate, soft, elastic, and have anti-vibration and heat preservation. It is not impervious to water and airtight.
  • the upper bag body 11 and the lower bag body 12 may also be materials such as polyamide (nylon cloth).
  • the upper bag body 11 and the lower bag body 12 of the present invention can be attached to fabrics of different colors and functions on the surface of the synthetic rubber foam by using different bonding glue and bonding processes.
  • the connecting member 14 that connects the upper bag body 11 and the lower bag body 12 of the present invention can use a connecting member such as a zipper.
  • FIG. 3 is a flow chart of a preferred embodiment of a method for manufacturing an anti-slip packaging bag for an electronic product according to the present invention.
  • the manufacturing method of the non-slip packaging bag for electronic products includes:
  • Step 301 mixing silica gel and silica gel curing agent, and then vacuuming;
  • Step 302 coating a silica gel on a template having a pattern of a non-slip silicone layer
  • Step 303 hot pressing the template coated with silica gel onto the bag body, so that the silica gel is attached to the bag body;
  • Step 304 peeling the bag body with the silica gel attached from the template, and then cooling the template;
  • Step 305 the bag body to which the silica gel has been attached is divided into an upper bag body and a lower bag body, and the upper bag body and the lower bag body are connected by a connecting member to form an accommodating space separated from the external environment.
  • the method ends at step 305.
  • the silica gel and the silica gel curing agent may be mixed before the silica gel is used, and the silica gel curing agent may be sulfur, selenium, tellurium, sulfur compounds, Metal oxides, peroxides, resins, terpenes and amines.
  • the mixed silica gel is then vacuumed to eliminate the air mixed into the silica gel when the silica gel and the silica gel curing agent are mixed, so that the silica gel is more dense, and then the process proceeds to step 302.
  • a silica gel mixed with a silica gel curing agent is coated on a template having a pattern of a non-slip silicone layer.
  • the template is generally a template of an aluminum alloy, and the thickness of the anti-slip layer of the silicone is determined by setting the thickness and pattern of the template.
  • the pattern, the pattern of the anti-slip layer of the silicone is preferably a diamond-shaped or a circle-like shape which is sequentially connected, and of course, other patterns can be used according to the requirements of the user, and even personalized patterns can be used.
  • the thickness of the silicone anti-slip layer is preferably from 0.3 mm to 0.8 mm, and the line width of the pattern of the non-slip silicone layer is preferably from 1 mm to 2 mm, and then proceeds to step 303.
  • step 303 the template coated with silica gel is hot pressed onto the bag body, wherein the hot pressing temperature is 130 degrees to 230 degrees, and the hot pressing pressure is 0.1. MPa to 0.2 MPa, hot pressing at the above-mentioned hot pressing temperature and hot pressing pressure for 40 seconds to 60 seconds, so that the silica gel adheres to the bag body under the action of temperature and pressure, and proceeds to step 304.
  • step 304 after the silica gel is completely attached to the bag body, the bag body to which the silica gel is attached is peeled off from the template, that is, the adhesion of the anti-slip layer of the silicone rubber is completed. At this time, the template is cooled so that it can be quickly pressed to the next bag, and the process goes to step 305.
  • the bag body to which the silica gel has been attached is divided into an upper bag body and a lower bag body, and the upper bag body and the lower bag body may both be synthetic rubber foams, such as neoprene rubber, which are delicate, soft and elastic. It has the characteristics of shockproof, heat preservation, impervious to water, and airtight.
  • the upper bag body 11 and the lower bag body 12 may also be materials such as polyamide (nylon cloth).
  • the upper bag body and the lower bag body can be attached with different colors and functions on the surface of the synthetic rubber foam by using different bonding glue and bonding processes; then the upper bag body and the lower bag body are connected by a connecting member to form
  • the connecting member may be a connecting component such as a zipper.
  • the non-slip packaging bag for electronic products of the invention has strong anti-slip performance and certain aesthetic appearance, and the manufacturing method of the non-slip packaging bag is simple and convenient, and the anti-slip performance of the existing packaging bag for electronic products is solved. Poor and technical problems with poor aesthetic appearance.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Bag Frames (AREA)

Description

用于电子产品的防滑包装袋及其制作方法  Non-slip packaging bag for electronic products and manufacturing method thereof 技术领域Technical field

本发明涉及生活用品技术领域，更具体地说，涉及一种用于电子产品的防滑包装袋及其制作方法。The invention relates to the technical field of daily necessities, and more particularly to a non-slip packaging bag for an electronic product and a manufacturing method thereof.

背景技术Background technique

随着社会的发展，越来越多的人都拥有了自己喜欢的电子产品，如智能手机、笔记本电脑、触摸屏电脑或电子书设备等。如这些电子产品长期暴露在外界，容易在电子产品的内部和表面沉积灰尘，可能造成电子产品不能正常工作；有时外界的硬物还会损坏上述电子产品的屏幕。因此人们一般都会给自己心爱的电子产品配上相应的包装袋，以避免外界环境对电子产品造成损伤。With the development of society, more and more people have their favorite electronic products, such as smart phones, laptops, touch screen computers or e-book devices. If these electronic products are exposed to the outside world for a long time, it is easy to deposit dust inside and on the surface of the electronic products, which may cause the electronic products to fail to work normally; sometimes the external hard objects may damage the screen of the above electronic products. Therefore, people generally put their own electronic products with corresponding packaging bags to avoid damage to electronic products caused by the external environment.

但现有的用于电子产品的包装袋一般都是使用布料制成，用于将电子产品和外界环境隔离。虽然用这种包装袋包装后的电子产品可以一定程度的避免上述的外界环境造成的损伤，但包装后电子产品的外观美感大大降低；同时制作包装袋的材料的防滑性能较差，如使用者放置包装后的电子产品时疏忽大意，可能导致电子产品滑落而摔坏电子产品。However, existing packaging bags for electronic products are generally made of cloth for isolating electronic products from the external environment. Although the electronic product packaged in such a package can avoid the damage caused by the above-mentioned external environment to a certain extent, the aesthetic appearance of the electronic product after packaging is greatly reduced; at the same time, the material for making the packaging bag has poor anti-slip performance, such as a user. The placement of the packaged electronic product is negligent and may cause the electronic product to slip and break the electronic product.

故，有必要提供一种用于电子产品的防滑包装袋及其制作方法，以解决现有技术所存在的问题。Therefore, it is necessary to provide a non-slip packaging bag for an electronic product and a manufacturing method thereof to solve the problems existing in the prior art.

技术问题technical problem

本发明要解决的技术问题在于，针对现有技术的用于电子产品的包装袋的防滑性能较差以及外观美感较差的技术问题，提供一种具有较强的防滑性能以及一定外观美感的用于电子产品的防滑包装袋及其制作方法。The technical problem to be solved by the present invention is to provide a strong anti-slip performance and a certain aesthetic appearance for the prior art technical problems of poor anti-slip performance and poor aesthetic appearance of the packaging bag for electronic products. Non-slip packaging bag for electronic products and a manufacturing method thereof.

技术解决方案Technical solution

本发明涉及一种用于电子产品的防滑包装袋，其包括：The invention relates to a non-slip packaging bag for an electronic product, comprising:

由上袋体和下袋体形成的一容置空间，用于放置所述电子产品；An accommodating space formed by the upper bag body and the lower bag body for placing the electronic product;

防滑层，设置在所述上袋体和所述下袋体的外表面，用于装饰以及防滑作用；以及a non-slip layer disposed on an outer surface of the upper bag body and the lower bag body for decoration and anti-slip effect;

连接件，用于连接所述上袋体和所述下袋体，使所述容置空间和外界环境隔离开。a connecting member for connecting the upper bag body and the lower bag body to isolate the accommodating space from an external environment.

在本发明的用于电子产品的防滑包装袋中，所述防滑层为设置在所述上袋体和所述下袋体的至少部分外表面的硅胶防滑层。In the non-slip packaging bag for an electronic product of the present invention, the anti-slip layer is a silicone anti-slip layer provided on at least a part of an outer surface of the upper bag body and the lower bag body.

在本发明的用于电子产品的防滑包装袋中，所述硅胶防滑层的厚度为0.3毫米至0.8毫米。In the non-slip packaging bag for electronic products of the present invention, the silicone anti-slip layer has a thickness of 0.3 mm to 0.8 mm.

在本发明的用于电子产品的防滑包装袋中，所述硅胶防滑层的图案为依次连接的菱形或类圆形。In the non-slip packaging bag for electronic products of the present invention, the pattern of the anti-slip layer of the silicone rubber is a rhombic or a circle-like shape which is sequentially connected.

在本发明的用于电子产品的防滑包装袋中，所述硅胶防滑层的图案的线宽为1毫米至2毫米。In the non-slip packaging bag for electronic products of the present invention, the pattern of the silicone anti-slip layer has a line width of 1 mm to 2 mm.

在本发明的用于电子产品的防滑包装袋中，所述连接件为拉链。In the non-slip packaging bag for an electronic product of the present invention, the connecting member is a zipper.

在本发明的用于电子产品的防滑包装袋中，所述上袋体和所述下袋体为合成橡胶发泡体或聚酰胺。In the non-slip package for an electronic product of the present invention, the upper bag body and the lower bag body are synthetic rubber foam or polyamide.

本发明还涉及一种电子产品的防滑包装袋的制作方法，其包括步骤：The invention also relates to a method for manufacturing an anti-slip packaging bag for an electronic product, comprising the steps of:

A、在具有硅胶防滑层的图案的模板上涂覆硅胶；A. Applying a silica gel on a template having a pattern of a silicone anti-slip layer;

B、将已涂覆硅胶的模板热压到袋体上，使所述硅胶附着在所述袋体上；B, hot pressing the template coated with silica gel onto the bag body, so that the silica gel is attached to the bag body;

C、将已附着硅胶的所述袋体分成上袋体和下袋体，通过连接件将所述上袋体和所述下袋体连接，以形成一与外界环境隔离开的容置空间。C. The bag body to which the silica gel has been attached is divided into an upper bag body and a lower bag body, and the upper bag body and the lower bag body are connected by a connecting member to form an accommodating space separated from the external environment.

在本发明的所述的用于电子产品的防滑包装袋的制作方法中，所述步骤A之前还包括步骤：In the manufacturing method of the non-slip packaging bag for electronic products according to the present invention, the step A further includes the following steps:

将所述硅胶和硅胶固化剂混合后进行抽真空处理。The silica gel and the silica gel curing agent are mixed and subjected to vacuum treatment.

在本发明的所述的用于电子产品的防滑包装袋的制作方法中，所述步骤B之后包括步骤：In the manufacturing method of the non-slip packaging bag for electronic products according to the present invention, the step B includes the following steps:

将附着有所述硅胶的所述袋体从所述模板上剥离，然后对所述模板进行冷却。The bag to which the silica gel is attached is peeled off from the template, and then the template is cooled.

在本发明的所述的用于电子产品的防滑包装袋的制作方法中，所述步骤B中的热压的温度为180度-230度。In the method of manufacturing the non-slip packaging bag for an electronic product according to the present invention, the temperature of the hot pressing in the step B is 180 to 230 degrees.

在本发明的所述的用于电子产品的防滑包装袋的制作方法中，所述步骤B中的热压的时间为40秒至60秒。In the manufacturing method of the non-slip packaging bag for electronic products according to the present invention, the hot pressing time in the step B is 40 seconds to 60 seconds.

在本发明的所述的用于电子产品的防滑包装袋的制作方法中，所述步骤B中的热压的压强为0.1MPa至0.2MPa。In the method for producing a non-slip packaging bag for an electronic product according to the present invention, the pressure of the hot pressing in the step B is 0.1 MPa to 0.2 MPa.

在本发明的所述的用于电子产品的防滑包装袋的制作方法中，所述硅胶图像层的厚度为0.3毫米至0.8毫米。In the method of manufacturing an anti-slip packaging bag for an electronic product according to the present invention, the silicone image layer has a thickness of 0.3 mm to 0.8 mm.

在本发明的所述的用于电子产品的防滑包装袋的制作方法中，所述硅胶防滑层的图案为依次连接的菱形或类圆形。In the method for manufacturing a non-slip packaging bag for an electronic product according to the present invention, the pattern of the anti-slip silicone layer is a rhombic or a circle-like shape that is sequentially connected.

在本发明的所述的用于电子产品的防滑包装袋的制作方法中，所述硅胶防滑层的图案的线宽为1毫米至2毫米。In the manufacturing method of the non-slip packaging bag for electronic products according to the present invention, the pattern of the silicone anti-slip layer has a line width of 1 mm to 2 mm.

在本发明的所述的用于电子产品的防滑包装袋的制作方法中，所述连接件为拉链。In the method of manufacturing an anti-slip packaging bag for an electronic product according to the present invention, the connecting member is a zipper.

在本发明的所述的用于电子产品的防滑包装袋的制作方法中，所述上袋体和所述下袋体为合成橡胶发泡体或聚酰胺。In the method for producing a non-slip packaging bag for an electronic product according to the present invention, the upper bag body and the lower bag body are synthetic rubber foam or polyamide.

有益效果 Beneficial effect

具有较强的防滑性能以及一定外观美感，解决了现有的用于电子产品的包装袋的防滑性能较差以及外观美感较差的技术问题。It has strong anti-slip performance and certain aesthetic appearance, and solves the technical problems of poor anti-slip performance and poor aesthetic appearance of the existing packaging bags for electronic products.

附图说明DRAWINGS

图1为本发明的用于电子产品的防滑包装袋的优选实施例的结构示意图；1 is a schematic structural view of a preferred embodiment of a non-slip packaging bag for an electronic product of the present invention;

图2为本发明的用于电子产品的防滑包装袋的优选实施例的硅胶防滑层的结构示意图；2 is a schematic structural view of a silicone anti-skid layer of a preferred embodiment of a non-slip packaging bag for an electronic product according to the present invention;

图3为本发明的用于电子产品的防滑包装袋的制作方法的优选实施例的流程图；3 is a flow chart of a preferred embodiment of a method for fabricating an anti-slip packaging bag for an electronic product of the present invention;

其中，附图标记说明如下：Among them, the reference numerals are as follows:

11、上袋体；11. Upper bag body;

12、下袋体；12. Lower bag body;

13、防滑层；13. Anti-slip layer;

14、连接件。14, the connector.

本发明的最佳实施方式BEST MODE FOR CARRYING OUT THE INVENTION

下面结合图示，对本发明的优选实施例作详细介绍。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail in conjunction with the drawings.

请参照图1和图2，图1为本发明的用于电子产品的防滑包装袋的优选实施例的结构示意图，图2为本发明的用于电子产品的防滑包装袋的优选实施例的硅胶防滑层的结构示意图。该用于电子产品的防滑包装袋包括上袋体11、下袋体12、防滑层13以及连接件14。上袋体11和下袋体12形成一用于放置电子产品的容置空间；防滑层13设置在上袋体11和下袋体12的外表面，起到装饰以及防滑的作用；连接件14用于连接上袋体11和下袋体12，使容置空间内的电子产品与外界环境隔离开。1 and FIG. 2, FIG. 1 is a schematic structural view of a preferred embodiment of a non-slip packaging bag for an electronic product according to the present invention, and FIG. 2 is a view showing a preferred embodiment of the non-slip packaging bag for an electronic product. Schematic diagram of the anti-slip layer. The non-slip packaging bag for an electronic product includes an upper bag body 11, a lower bag body 12, a non-slip layer 13, and a connecting member 14. The upper bag body 11 and the lower bag body 12 form an accommodating space for placing an electronic product; the anti-slip layer 13 is disposed on the outer surfaces of the upper bag body 11 and the lower bag body 12 to serve as a decoration and a non-slip effect; and the connecting member 14 The upper bag body 11 and the lower bag body 12 are connected to isolate the electronic product in the accommodating space from the external environment.

本发明的用于电子产品的防滑包装袋的防滑层13为硅胶防滑层，其设置在防滑包装袋的上袋体11和下袋体12的至少部分外表面，当然也可设置在上袋体11和下袋体12的整个外表面。该硅胶防滑层的图案为依次连接的菱形或类圆形等，当然这里可以根据用户的要求采用其他的图形，甚至使用个性化的图形。硅胶防滑层的厚度为0.3毫米至0.8毫米，硅胶防滑层的图案的线宽为1毫米至2毫米。如硅胶防滑层的厚度太大则会大大增加防滑包装袋的制作成本，如硅胶防滑层的厚度太小则会造成硅胶防滑层容易脱落。硅胶防滑层的图案的线宽的设置也是在保证较好的防滑效果基础上尽量减少硅胶的用量。The anti-slip layer 13 of the non-slip packaging bag for electronic products of the present invention is a silicone anti-slip layer which is disposed on at least a part of the outer surface of the upper bag body 11 and the lower bag body 12 of the non-slip packaging bag, and of course, may also be disposed on the upper bag body. 11 and the entire outer surface of the lower bag body 12. The pattern of the anti-slip layer of the silicone is a diamond or a circle which is sequentially connected, and of course, other patterns can be used according to the requirements of the user, and even personalized patterns can be used. The anti-slip layer of the silicone has a thickness of 0.3 mm to 0.8 mm, and the pattern of the anti-slip layer of the silicone has a line width of 1 mm to 2 mm. If the thickness of the anti-slip layer of the silicone is too large, the manufacturing cost of the non-slip package will be greatly increased. For example, if the thickness of the anti-slip layer of the silicone is too small, the anti-skid layer of the silicone will easily fall off. The line width of the pattern of the silicone anti-slip layer is also to minimize the amount of silica gel on the basis of ensuring a good anti-slip effect.

在本发明的用于电子产品的防滑包装袋中，上袋体11和下袋体12可均为合成橡胶发泡体，如氯丁橡胶，其手感细腻、柔软，富有弹性，具有防震、保温、不透水、不透气等特点，当然上袋体11和下袋体12也可为聚酰胺（尼龙布）等材料。本发明的上袋体11和下袋体12可采用不同的贴合胶水和贴合工艺在合成橡胶发泡体表面贴合不同颜色和功能的布料。本发明的连接上袋体11和下袋体12的连接件14可使用拉链等连接部件。In the non-slip packaging bag for electronic products of the present invention, the upper bag body 11 and the lower bag body 12 may both be synthetic rubber foams, such as neoprene rubber, which are delicate, soft, elastic, and have anti-vibration and heat preservation. It is not impervious to water and airtight. Of course, the upper bag body 11 and the lower bag body 12 may also be materials such as polyamide (nylon cloth). The upper bag body 11 and the lower bag body 12 of the present invention can be attached to fabrics of different colors and functions on the surface of the synthetic rubber foam by using different bonding glue and bonding processes. The connecting member 14 that connects the upper bag body 11 and the lower bag body 12 of the present invention can use a connecting member such as a zipper.

本发明还涉及一种用于电子产品的防滑包装袋的制作方法，请参照图3，图3为本发明的用于电子产品的防滑包装袋的制作方法的优选实施例的流程图。该用于电子产品的防滑包装袋的制作方法包括：The invention further relates to a method for manufacturing an anti-slip packaging bag for an electronic product. Referring to FIG. 3, FIG. 3 is a flow chart of a preferred embodiment of a method for manufacturing an anti-slip packaging bag for an electronic product according to the present invention. The manufacturing method of the non-slip packaging bag for electronic products includes:

步骤301，将硅胶和硅胶固化剂混合后进行抽真空处理；Step 301, mixing silica gel and silica gel curing agent, and then vacuuming;

步骤302，在具有硅胶防滑层的图案的模板上涂覆硅胶；Step 302, coating a silica gel on a template having a pattern of a non-slip silicone layer;

步骤303，将已涂覆硅胶的模板热压到袋体上，使硅胶附着在袋体上；Step 303, hot pressing the template coated with silica gel onto the bag body, so that the silica gel is attached to the bag body;

步骤304，将附着有硅胶的袋体从模板上剥离，然后对模板进行冷却；Step 304, peeling the bag body with the silica gel attached from the template, and then cooling the template;

步骤305，将已附着硅胶的袋体分成上袋体和下袋体，通过连接件将上袋体和下袋体连接，以形成一与外界环境隔离开的容置空间。Step 305, the bag body to which the silica gel has been attached is divided into an upper bag body and a lower bag body, and the upper bag body and the lower bag body are connected by a connecting member to form an accommodating space separated from the external environment.

该方法结束于步骤305。The method ends at step 305.

下面详细说明本发明的用于电子产品的防滑包装袋的制作方法的各步骤的详细流程。The detailed flow of each step of the method for producing a non-slip packaging bag for an electronic product of the present invention will be described in detail below.

在步骤301中，为了使硅胶在设定温度下和设定时间内固化，会在使用硅胶之前，将硅胶和硅胶固化剂混合，该硅胶固化剂可为硫黄、硒、碲、含硫化合物、金属氧化物、过氧化物、树酯、醌类和胺类等。随后对混合后的硅胶进行抽真空处理，以消除硅胶和硅胶固化剂混合时混入硅胶中的空气，使硅胶更加致密，随后转到步骤302。In step 301, in order to cure the silica gel at the set temperature and the set time, the silica gel and the silica gel curing agent may be mixed before the silica gel is used, and the silica gel curing agent may be sulfur, selenium, tellurium, sulfur compounds, Metal oxides, peroxides, resins, terpenes and amines. The mixed silica gel is then vacuumed to eliminate the air mixed into the silica gel when the silica gel and the silica gel curing agent are mixed, so that the silica gel is more dense, and then the process proceeds to step 302.

在步骤302中，将混合有硅胶固化剂的硅胶涂覆在具有硅胶防滑层的图案的模板上，该模板一般为铝合金的模板，通过设定模板的厚度和图案确定硅胶防滑层的厚度和图案，该硅胶防滑层的图案优选为依次连接的菱形或类圆形等，当然这里可以根据用户的要求采用其他的图形，甚至使用个性化的图形。硅胶防滑层的厚度优选为0.3毫米至0.8毫米，硅胶防滑层的图案的线宽优选为1毫米至2毫米，随后转到步骤303。In step 302, a silica gel mixed with a silica gel curing agent is coated on a template having a pattern of a non-slip silicone layer. The template is generally a template of an aluminum alloy, and the thickness of the anti-slip layer of the silicone is determined by setting the thickness and pattern of the template. The pattern, the pattern of the anti-slip layer of the silicone is preferably a diamond-shaped or a circle-like shape which is sequentially connected, and of course, other patterns can be used according to the requirements of the user, and even personalized patterns can be used. The thickness of the silicone anti-slip layer is preferably from 0.3 mm to 0.8 mm, and the line width of the pattern of the non-slip silicone layer is preferably from 1 mm to 2 mm, and then proceeds to step 303.

在步骤303中，将已涂覆硅胶的模板热压到袋体上，其中热压温度为130度至230度，热压压强为0.1 MPa至0.2MPa，在上述的热压温度和热压压强下热压40秒至60秒，这样硅胶在温度和压力的作用下会附着到袋体上，转到步骤304。In step 303, the template coated with silica gel is hot pressed onto the bag body, wherein the hot pressing temperature is 130 degrees to 230 degrees, and the hot pressing pressure is 0.1. MPa to 0.2 MPa, hot pressing at the above-mentioned hot pressing temperature and hot pressing pressure for 40 seconds to 60 seconds, so that the silica gel adheres to the bag body under the action of temperature and pressure, and proceeds to step 304.

在步骤304中，硅胶完全附着到袋体上之后，将附着有硅胶的袋体从模板上剥离，即完成了硅胶防滑层的贴附。这时对模板进行冷却处理，使之可以快速地对下一袋体进行热压，转到步骤305。In step 304, after the silica gel is completely attached to the bag body, the bag body to which the silica gel is attached is peeled off from the template, that is, the adhesion of the anti-slip layer of the silicone rubber is completed. At this time, the template is cooled so that it can be quickly pressed to the next bag, and the process goes to step 305.

在步骤305中，将已附着硅胶的袋体分成上袋体和下袋体，上袋体和下袋体可均为合成橡胶发泡体，如氯丁橡胶，其手感细腻、柔软，富有弹性，具有防震、保温、不透水、不透气等特点，当然上袋体11和下袋体12也可为聚酰胺（尼龙布）等材料。上袋体和下袋体可采用不同的贴合胶水和贴合工艺在合成橡胶发泡体表面贴合不同颜色和功能的布料；然后通过连接件将上袋体和下袋体连接，以形成一与外界环境隔离开的容置空间，该连接件可为拉链等连接部件。In step 305, the bag body to which the silica gel has been attached is divided into an upper bag body and a lower bag body, and the upper bag body and the lower bag body may both be synthetic rubber foams, such as neoprene rubber, which are delicate, soft and elastic. It has the characteristics of shockproof, heat preservation, impervious to water, and airtight. Of course, the upper bag body 11 and the lower bag body 12 may also be materials such as polyamide (nylon cloth). The upper bag body and the lower bag body can be attached with different colors and functions on the surface of the synthetic rubber foam by using different bonding glue and bonding processes; then the upper bag body and the lower bag body are connected by a connecting member to form The accommodating space separated from the external environment, the connecting member may be a connecting component such as a zipper.

本发明的用于电子产品的防滑包装袋具有较强的防滑性能以及一定的外观美感，同时该防滑包装袋的制作方法简单方便，解决了现有的用于电子产品的包装袋的防滑性能较差以及外观美感较差的技术问题。The non-slip packaging bag for electronic products of the invention has strong anti-slip performance and certain aesthetic appearance, and the manufacturing method of the non-slip packaging bag is simple and convenient, and the anti-slip performance of the existing packaging bag for electronic products is solved. Poor and technical problems with poor aesthetic appearance.

以上所述仅为本发明的优选实施例，并不用以限制本发明，凡在本发明的精神和原则内所作的任何修改、等同替换或改进等，均应包含在本发明的保护范围内。 The above are only the preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalents, and improvements made within the spirit and scope of the present invention are intended to be included in the scope of the present invention.

本发明的实施方式Embodiments of the invention

工业实用性Industrial applicability

序列表自由内容Sequence table free content

Claims (18)

一种用于电子产品的防滑包装袋，其特征在于，包括：A non-slip packaging bag for an electronic product, comprising: 由上袋体和下袋体形成的一容置空间，用于放置电子产品；An accommodating space formed by the upper bag body and the lower bag body for placing an electronic product; 防滑层，设置在所述上袋体和所述下袋体的外表面，用于装饰以及防滑作用；以及a non-slip layer disposed on an outer surface of the upper bag body and the lower bag body for decoration and anti-slip effect; 连接件，用于连接所述上袋体和所述下袋体，使所述容置空间和外界环境隔离开。a connecting member for connecting the upper bag body and the lower bag body to isolate the accommodating space from an external environment. 根据权利要求1所述的用于电子产品的防滑包装袋，其特征在于，所述防滑层为设置在所述上袋体和所述下袋体的至少部分外表面的硅胶防滑层。The non-slip packaging bag for an electronic product according to claim 1, wherein the anti-slip layer is a silicone anti-slip layer provided on at least a part of an outer surface of the upper bag body and the lower bag body. 根据权利要求2所述的用于电子产品的防滑包装袋，其特征在于，所述硅胶防滑层的厚度为0.3毫米至0.8毫米。The non-slip packaging bag for an electronic product according to claim 2, wherein the silicone anti-slip layer has a thickness of from 0.3 mm to 0.8 mm. 根据权利要求2所述的用于电子产品的防滑包装袋，其特征在于，所述硅胶防滑层的图案为依次连接的菱形或类圆形。The non-slip packaging bag for electronic products according to claim 2, wherein the pattern of the anti-slip layer of the silicone rubber is a diamond-shaped or circular-like shape that is sequentially connected. 根据权利要求2所述的用于电子产品的防滑包装袋，其特征在于，所述硅胶防滑层的图案的线宽为1毫米至2毫米。The non-slip packaging bag for an electronic product according to claim 2, wherein the pattern of the silicone anti-slip layer has a line width of 1 mm to 2 mm. 根据权利要求1所述的用于电子产品的防滑包装袋，其特征在于，所述连接件为拉链。The non-slip packaging bag for an electronic product according to claim 1, wherein the connecting member is a zipper. 根据权利要求1所述的用于电子产品的防滑包装袋，其特征在于，所述上袋体和所述下袋体为合成橡胶发泡体或聚酰胺。The non-slip packaging bag for an electronic product according to claim 1, wherein the upper bag body and the lower bag body are synthetic rubber foam or polyamide. 一种用于电子产品的防滑包装袋的制作方法，其特征在于，包括步骤：A method for manufacturing an anti-slip packaging bag for an electronic product, comprising the steps of: A、在具有硅胶防滑层的图案的模板上涂覆硅胶；A. Applying a silica gel on a template having a pattern of a silicone anti-slip layer; B、将已涂覆硅胶的模板热压到袋体上，使所述硅胶附着在所述袋体上；B, hot pressing the template coated with silica gel onto the bag body, so that the silica gel is attached to the bag body; C、将已附着硅胶的所述袋体分成上袋体和下袋体，通过连接件将所述上袋体和所述下袋体连接，以形成一与外界环境隔离开的容置空间。C. The bag body to which the silica gel has been attached is divided into an upper bag body and a lower bag body, and the upper bag body and the lower bag body are connected by a connecting member to form an accommodating space separated from the external environment. 根据权利要求8所述的用于电子产品的防滑包装袋的制作方法，其特征在于，所述步骤A之前还包括步骤：The method for manufacturing a non-slip packaging bag for an electronic product according to claim 8, wherein the step A further comprises the steps of: 将所述硅胶和硅胶固化剂混合后进行抽真空处理。The silica gel and the silica gel curing agent are mixed and subjected to vacuum treatment. 根据权利要求8所述的用于电子产品的防滑包装袋的制作方法，其特征在于，所述步骤B之后包括步骤：The method for manufacturing a non-slip packaging bag for an electronic product according to claim 8, wherein the step B comprises the following steps: 将附着有所述硅胶的所述袋体从所述模板上剥离，然后对所述模板进行冷却。The bag to which the silica gel is attached is peeled off from the template, and then the template is cooled. 根据权利要求8所述的用于电子产品的防滑包装袋的制作方法，其特征在于，所述步骤B中的热压的温度为180度-230度。The method of manufacturing an anti-slip packaging bag for an electronic product according to claim 8, wherein the temperature of the hot pressing in the step B is from 180 degrees to 230 degrees. 根据权利要求8所述的用于电子产品的防滑包装袋的制作方法，其特征在于，所述步骤B中的热压的时间为40秒至60秒。The method of manufacturing an anti-slip packaging bag for an electronic product according to claim 8, wherein the hot pressing time in the step B is from 40 seconds to 60 seconds. 根据权利要求8所述的用于电子产品的防滑包装袋的制作方法，其特征在于，所述步骤B中的热压的压强为0.1MPa至0.2MPa。The method of manufacturing an anti-slip packaging bag for an electronic product according to claim 8, wherein the pressure of the hot pressing in the step B is 0.1 MPa to 0.2 MPa. 根据权利要求8所述的用于电子产品的防滑包装袋的制作方法，其特征在于，所述硅胶防滑层的图案的厚度为0.3毫米至0.8毫米。The method of manufacturing an anti-slip packaging bag for an electronic product according to claim 8, wherein the pattern of the non-slip silicone layer has a thickness of 0.3 mm to 0.8 mm. 根据权利要求8所述的用于电子产品的防滑包装袋的制作方法，其特征在于，所述硅胶防滑层的图案为依次连接的菱形或类圆形。The method for manufacturing an anti-slip packaging bag for an electronic product according to claim 8, wherein the pattern of the anti-slip silicone layer is a diamond-shaped or circular-like shape that is sequentially connected. 根据权利要求8所述的用于电子产品的防滑包装袋的制作方法，其特征在于，所述硅胶防滑层的图案的线宽为1毫米至2毫米。The method of manufacturing an anti-slip packaging bag for an electronic product according to claim 8, wherein the pattern of the anti-slip layer of the silicone rubber has a line width of 1 mm to 2 mm. 根据权利要求8所述的用于电子产品的防滑包装袋的制作方法，其特征在于，所述连接件为拉链。The method of manufacturing an anti-slip packaging bag for an electronic product according to claim 8, wherein the connecting member is a zipper. 根据权利要求8所述的用于电子产品的防滑包装袋的制作方法，其特征在于，所述上袋体和所述下袋体为合成橡胶发泡体或聚酰胺。The method of manufacturing an anti-slip packaging bag for an electronic product according to claim 8, wherein the upper bag body and the lower bag body are synthetic rubber foam or polyamide.
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