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WO2014023809A3 - Laserbasiertes verfahren und bearbeitungstisch zur metallisierung der rückseite eines halbleiterbauelements - Google Patents

Laserbasiertes verfahren und bearbeitungstisch zur metallisierung der rückseite eines halbleiterbauelements Download PDF

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Publication number
WO2014023809A3
WO2014023809A3 PCT/EP2013/066665 EP2013066665W WO2014023809A3 WO 2014023809 A3 WO2014023809 A3 WO 2014023809A3 EP 2013066665 W EP2013066665 W EP 2013066665W WO 2014023809 A3 WO2014023809 A3 WO 2014023809A3
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor component
metal film
metallising
photovoltaic cell
machining table
Prior art date
Application number
PCT/EP2013/066665
Other languages
English (en)
French (fr)
Other versions
WO2014023809A2 (de
Inventor
Hubert Hauser
Jan Nekarda
Ralf Preu
Benedikt BLÄSI
Original Assignee
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. filed Critical Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
Priority to CN201380043573.6A priority Critical patent/CN104584230B/zh
Priority to SG11201500981PA priority patent/SG11201500981PA/en
Priority to MYPI2015000350A priority patent/MY195240A/en
Publication of WO2014023809A2 publication Critical patent/WO2014023809A2/de
Publication of WO2014023809A3 publication Critical patent/WO2014023809A3/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H10F77/206—Electrodes for devices having potential barriers
    • H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/30—Coatings
    • H10F77/306—Coatings for devices having potential barriers
    • H10F77/311—Coatings for devices having potential barriers for photovoltaic cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/42—Optical elements or arrangements directly associated or integrated with photovoltaic cells, e.g. light-reflecting means or light-concentrating means
    • H10F77/48—Back surface reflectors [BSR]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/70—Surface textures, e.g. pyramid structures
    • H10F77/703—Surface textures, e.g. pyramid structures of the semiconductor bodies, e.g. textured active layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/52—PV systems with concentrators

Landscapes

  • Photovoltaic Devices (AREA)
  • Laser Beam Processing (AREA)

Abstract

Die Erfindung betrifft ein Verfahren zur Metallisierung der Rückseite eines Halbleiterbauelements, welches Halbleiterbauelement Teil einer photovoltaische Solarzelle oder einer Vorstufe im Herstellungsprozess einer photovoltaischen Solarzeile ist, folgende Verfahrensschritte umfassend; A Aufbringen zumindest einer zumindest einschichtigen Metallfolie auf die Rückseite des Halbleiterbauelements, B Lokales Erhitzen zumindest der Metallfolie, derart, dass in lokalen Bereichen kurzzeitig ein Aufschmelzen der Metallfolie erfolgt. Wesentlich ist, dass zwischen Metallfolie und Rückseite des Halbleiterbauelementes zumindest bereichsweise ein Hohlraum ausgebildet wird, welcher Hohlraum mit einem Füllmedium gefüllt ist, welches Füllmedium einen optischen Brechungsindex kleiner als 1,4 aufweist. Die Erfindung betrifft weiterhin eine Solarzelle, die unter Verwendung solch eines Verfahrens hergestellt wird sowie einen Bearbeitungstisch zur Durchführung solch eines Verfahrens.
PCT/EP2013/066665 2012-08-10 2013-08-08 Laserbasiertes verfahren und bearbeitungstisch zur metallisierung der rückseite eines halbleiterbauelements WO2014023809A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201380043573.6A CN104584230B (zh) 2012-08-10 2013-08-08 用于金属化半导体元件背面的基于激光的方法和加工台
SG11201500981PA SG11201500981PA (en) 2012-08-10 2013-08-08 Laser-based method and machining table for metallising the back of a semiconductor component
MYPI2015000350A MY195240A (en) 2012-08-10 2013-08-08 Laser-Based Method and Machining Table for Metallizing the Rear Side of a Semiconductor Component

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012214253.3 2012-08-10
DE102012214253.3A DE102012214253A1 (de) 2012-08-10 2012-08-10 Laserbasiertes Verfahren und Bearbeitungstisch zur Metallisierung der Rückseite eines Halbleiterbauelements

Publications (2)

Publication Number Publication Date
WO2014023809A2 WO2014023809A2 (de) 2014-02-13
WO2014023809A3 true WO2014023809A3 (de) 2014-04-10

Family

ID=49035533

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2013/066665 WO2014023809A2 (de) 2012-08-10 2013-08-08 Laserbasiertes verfahren und bearbeitungstisch zur metallisierung der rückseite eines halbleiterbauelements

Country Status (5)

Country Link
CN (1) CN104584230B (de)
DE (1) DE102012214253A1 (de)
MY (1) MY195240A (de)
SG (1) SG11201500981PA (de)
WO (1) WO2014023809A2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017154384A1 (ja) * 2016-03-10 2017-09-14 株式会社カネカ 太陽電池モジュール
DE102016210910A1 (de) * 2016-06-19 2017-12-21 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Verschaltung von Solarzellen, die Aluminiumfolie als Rückkontakt aufweisen
DE102016210908A1 (de) * 2016-06-19 2017-12-21 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Verschaltung von Solarzellen
DE102016115355A1 (de) * 2016-08-18 2018-02-22 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Anheften einer metallischen Folie an eine Oberfläche eines Halbleitersubstrats und Halbleiterbauelement mit einer metallischen Folie

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0418984A1 (de) * 1989-09-21 1991-03-27 Interuniversitair Microelektronica Centrum Vzw Halbleiter-Photobauelement und Herstellungsverfahren
US20060275547A1 (en) * 2005-06-01 2006-12-07 Lee Chung J Vapor Phase Deposition System and Method
EP1911584A1 (de) * 2006-06-27 2008-04-16 Mitsubishi Electric Corporation Siebdruckmaschine und solarbatteriezelle
WO2008156366A1 (en) * 2007-06-21 2008-12-24 Asml Netherlands B.V. Clamping device and object loading method
WO2009128678A2 (en) * 2008-04-17 2009-10-22 Lg Electronics Inc. Solar cell and method of manufacturing the same
DE102009042018A1 (de) * 2009-09-21 2011-03-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Solarzelle
WO2011155639A1 (ja) * 2010-06-11 2011-12-15 昭和シェル石油株式会社 薄膜太陽電池
DE102011112696A1 (de) * 2011-08-31 2013-02-28 Martin-Luther-Universität Halle-Wittenberg Folie zur Rückseitenkontaktierung einer Solarzelle

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006044936B4 (de) * 2006-09-22 2008-08-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Metallisierung von Solarzellen und dessen Verwendung
FR2915834B1 (fr) * 2007-05-04 2009-12-18 Saint Gobain Substrat transparent muni d'une couche electrode perfectionnee
DE102008012286A1 (de) * 2008-03-03 2009-09-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Solarmodul sowie Verfahren zur Herstellung eines Solarmoduls
DE102009061071B3 (de) * 2009-02-27 2013-01-17 Solarworld Innovations Gmbh Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements
CN101807616B (zh) * 2010-02-24 2011-10-12 中国科学院半导体研究所 一种背光面黑硅太阳能电池结构及其制作方法
CN101820004A (zh) * 2010-04-28 2010-09-01 中国科学院半导体研究所 一种光电分离的太阳能电池背反射器

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0418984A1 (de) * 1989-09-21 1991-03-27 Interuniversitair Microelektronica Centrum Vzw Halbleiter-Photobauelement und Herstellungsverfahren
US20060275547A1 (en) * 2005-06-01 2006-12-07 Lee Chung J Vapor Phase Deposition System and Method
EP1911584A1 (de) * 2006-06-27 2008-04-16 Mitsubishi Electric Corporation Siebdruckmaschine und solarbatteriezelle
WO2008156366A1 (en) * 2007-06-21 2008-12-24 Asml Netherlands B.V. Clamping device and object loading method
WO2009128678A2 (en) * 2008-04-17 2009-10-22 Lg Electronics Inc. Solar cell and method of manufacturing the same
DE102009042018A1 (de) * 2009-09-21 2011-03-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Solarzelle
WO2011155639A1 (ja) * 2010-06-11 2011-12-15 昭和シェル石油株式会社 薄膜太陽電池
DE102011112696A1 (de) * 2011-08-31 2013-02-28 Martin-Luther-Universität Halle-Wittenberg Folie zur Rückseitenkontaktierung einer Solarzelle

Also Published As

Publication number Publication date
SG11201500981PA (en) 2015-04-29
CN104584230B (zh) 2017-01-18
DE102012214253A1 (de) 2014-06-12
CN104584230A (zh) 2015-04-29
MY195240A (en) 2023-01-11
WO2014023809A2 (de) 2014-02-13

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