WO2014013978A1 - Magnetic air cooling and warming device - Google Patents

Abstract

Provided is a magnetic air cooling and warming device capable of high-speed heat transfer and insulation between magnetic bodies or the like. In order achieve the above, a heat transfer unit is disposed between a plurality of magnetic bodies, and the heat transfer unit has a first electrode (12) and a dielectric body (13) disposed adjacent thereto and a second electrode (14) disposed in a line with and insulated from the first electrode (12), the first electrode (12) and the second electrode (14) being disposed on a wall surface inside a gap (20). Sequentially energizing the first electrode (12) and the second electrode (14) in a line causes a liquid metal (18) to move in the gap (20) by an electro-wetting effect, thereby switching between heat transfer and insulation between magnetic bodies (10, 10').

Description

Magnetic air conditioner

The present invention relates to a magnetic air conditioner, and in particular, a magnet that individually applies magnetism to a plurality of magnetic bodies to develop a magnetocaloric effect and transports the heat of the plurality of magnetic bodies using heat transfer of a solid substance. The present invention relates to an air conditioner.

Most of the refrigeration devices conventionally used at room temperature, for example, refrigerators, freezers, air conditioners, etc., use heat transfer of gaseous refrigerants such as chlorofluorocarbon gas and chlorofluorocarbon alternative gas. Recently, the problem of ozone depletion due to the emission of chlorofluorocarbons has been exposed, and there is also concern about the impact on global warming caused by the emission of alternative chlorofluorocarbons. For this reason, there is a strong demand for the development of an innovative refrigeration apparatus that is clean and has a high heat transport capability, replacing the refrigeration apparatus that uses a gaseous refrigerant such as chlorofluorocarbon gas or alternative chlorofluorocarbon gas.

From this background, the refrigeration technology that has recently attracted attention is the magnetic refrigeration technology. Some magnetic materials exhibit a so-called magnetocaloric effect that changes their temperature according to the change of the magnitude of the magnetic field applied to the magnetic material. A refrigeration technique that transports heat using a magnetic material that exhibits this magnetocaloric effect is a magnetic refrigeration technique.

As an application of the magnetic refrigeration technology, for example, there is a magnetic air conditioner that transports heat using heat transfer of a solid substance as described in Patent Document 1 below. This magnetic air conditioner transmits heat by the following configuration.

¡Positive magnetic materials that increase in temperature when magnetism is applied and negative magnetic materials that decrease in temperature when magnetism is applied are alternately arranged at predetermined intervals. One magnetic body block is formed by a pair of positive and negative magnetic bodies. A plurality of magnetic blocks are arranged in a ring shape to form a magnetic unit. The heat transfer member inserted and removed between the positive and negative magnetic bodies arranged in the magnetic body unit is arranged between the positive and negative magnetic bodies. A permanent magnet is arranged on a hub-like rotator that is concentric with the magnetic unit and has substantially the same inner diameter and outer diameter to form a magnetic circuit. And the rotary body in which the permanent magnet is arrange | positioned is arrange | positioned so as to oppose a magnetic body unit, and it rotates relatively with respect to a magnetic body unit. By the rotation of the rotating body, magnetism is simultaneously applied to and removed from the positive and negative magnetic bodies. As the rotating body rotates, the heat transfer member is inserted and removed between the positive and negative magnetic bodies at a fixed timing. The heat generated by the magnetic body due to the magnetocaloric effect is transported in one direction in which the magnetic body is disposed via the heat transfer member.

JP 2007-147209 A

In the above-described magnetic air conditioner, the heat transfer member disposed between the magnetic bodies is inserted and removed at a constant timing. Friction heat is generated when the heat transfer member is inserted and removed. If the generation of this frictional heat is large, the cooled magnetic material will be heated. For this reason, the heat transfer member must be inserted and removed at such a speed (slowness) that it does not affect the temperature of the magnetic material even if frictional heat is generated. On the other hand, the insertion / removal of the heat transfer member is performed in synchronization with the application / removal of magnetism. For this reason, even if it is desired to speed up the change in temperature of the magnetic body by increasing the timing of applying and removing magnetism, the heat transfer member cannot be raised due to the rate of insertion / removal.

Therefore, an object of the present invention is to provide a magnetic air conditioner capable of performing heat transfer and interruption between magnetic bodies and the like at high speed.

In order to achieve the above object, a magnetic air-conditioning apparatus according to the present invention is arranged in a row at intervals, and a plurality of magnetic bodies that change in temperature by applying and removing magnetism, and each of the plurality of magnetic bodies is magnetic. A magnetic circuit that applies and removes, a low-temperature side heat exchanging portion disposed at one end of the row of the plurality of magnetic bodies and spaced from the magnetic body, and the other end of the row of the plurality of magnetic bodies Between the magnetic bodies, between the magnetic bodies and the low temperature side heat exchange section, and between the magnetic bodies and the high temperature side heat exchange section. And a heat transfer section that is arranged between the two and performs heat transfer and heat insulation therebetween. The heat transfer section includes a dielectric and a first electrode provided in the gap, a liquid metal that moves in the gap, and a second electrode that is electrically connected to the liquid metal, The first electrode is electrically insulated from the liquid metal and the dielectric, and by applying a voltage between the first electrode and the liquid metal, the liquid metal causes the gap to be removed by electrowetting action. It moves to switch the heat transfer and the heat insulation.

According to the magnetic cooling and heating apparatus according to the present invention configured as described above, between a plurality of magnetic bodies arranged in a row, between a magnetic body and a low temperature heat exchange unit, between a magnetic body and a high temperature heat exchange unit. Has a heat transfer section. And this heat transfer part was set as the structure which provided the clearance gap and moved a liquid metal to the clearance gap by electrowetting. In other words, heat transfer is performed in a state where the liquid metal enters the gap, and switching is performed so as to insulate the liquid metal from the gap. Therefore, when switching between heat transfer and heat insulation, the liquid metal only moves in the gap, so no frictional heat is generated, so it is possible to switch between heat transfer and heat insulation at high speed, and to synchronize the magnetic circuit The application and removal of magnetism can be accelerated.

It is a figure which shows the basic composition of the magnetic air conditioning apparatus of embodiment. It is a graph which shows the effect of a magnetic air conditioner. It is a schematic diagram for demonstrating a heat | fever moving, when a magnetic circuit is reciprocatingly moved interlocking with the illustration left-right direction. It is a schematic diagram for demonstrating a heat | fever moving, when a magnetic circuit is reciprocatingly moved interlocking with the illustration left-right direction. It is sectional drawing of the heat-transfer part part for demonstrating the structure of the heat-transfer part in Embodiment 1. FIG. It is a top view (figure of the arrow A of FIG. 5) of the heat transfer part part for demonstrating the structure of the heat transfer part in Embodiment 1. FIG. It is explanatory drawing for demonstrating the principle of electrowetting. It is explanatory drawing for demonstrating the movement of the liquid metal in a clearance gap, and is an enlarged view of the liquid metal part in a clearance gap. It is sectional drawing of the same part as FIG. 5, and is drawing which shows the heat transfer state which the liquid metal went up the clearance gap. It is a perspective view which shows the heat transfer part shape model at the time of trial calculation of a response characteristic. It is a graph which shows the result of having changed the contact angle and the space | interval of a clearance | interval, and having calculated the time required for 1 mm liquid metal to raise. It is a graph which shows a voltage application characteristic, A is a graph which shows the relationship between contact angle (theta) and the frequency f, B is a graph which shows the relationship between the applied voltage V and the frequency f. It is the figure which showed an example of the switching characteristic in 1 cycle of liquid metal taking in / out. It is a top view which shows schematic structure of the magnetic air conditioning apparatus of Embodiment 2. FIG. It is a top view which shows schematic structure of the magnetic air conditioning apparatus of Embodiment 3. It is a top view of the magnetic body and the heat transfer part arrangement | positioning board which comprises the magnetic air conditioning apparatus shown in FIG. It is a top view of the magnet arrangement | positioning board which comprises the magnetic air conditioning apparatus shown in FIG. FIG. 16 is an exploded sectional view of the magnetic air conditioner shown in FIG. 15. It is a schematic diagram for demonstrating a heat | fever moving when rotating the magnet arrangement | positioning board of a magnetic air conditioning apparatus. It is explanatory drawing explaining operation | movement of the magnetic air conditioning apparatus which concerns on Embodiment 3. FIG. It is a flowchart for demonstrating the flow which calculates a response characteristic. It is sectional drawing which showed the form which connected the clearance gap between two heat-transfer parts by the communicating path in the magnetic air conditioning apparatus which concerns on Embodiment 4. FIG. It is a figure which shows the air conditioning circulation system using the magnetic air conditioning apparatus which concerns on Embodiment 4. It is a flowchart which shows the procedure which calculates a thermal switching frequency. It is a perspective view which shows the heat transfer part shape model (communication model) at the time of trial calculation of the response characteristic when two heat transfer parts communicate. It is a graph which shows the result of having calculated the time required for one liquid metal to rise 1 mm in two heat transfer parts, and the other liquid metal to become 0 mm at the same time by changing the gap interval with the contact angle = 60 °. . FIG. 10 is a top view of a magnetic body / heat transfer portion arrangement plate portion according to a fifth embodiment. FIG. 10 is an enlarged schematic diagram of a gap portion in the fifth embodiment. In Embodiment 5, it is explanatory drawing for demonstrating the state which a liquid metal advances. In Embodiment 5, it is a graph for demonstrating the positional relationship of a position sensor and a liquid metal. This graph is a three-dimensional graph in which the x-axis direction is time elapsed, the y-axis direction is the position sensor on (ON) and off (OFF) state, and the z-axis direction is the position of the liquid metal. In Embodiment 5, it is a graph for demonstrating the application state of the position of a liquid metal, and the voltage between the 1st electrode-2nd electrodes by an electric circuit. In this graph, the x-axis direction is time elapsed, the y-axis direction is the application state of the voltage between the first electrode and the second electrode (eV is applied and 0V is not applied), and the z-axis direction is the position of the liquid metal. It is a three-dimensional graph. In Embodiment 5, it is a flowchart which shows the control procedure for synchronizing a liquid metal and the position of the magnet which applies a magnetism to a magnetic body.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted. In addition, the dimensional ratios in the drawings are exaggerated for convenience of explanation, and may be different from the actual ratios.
(Embodiment 1)
FIG. 1 is a diagram illustrating a basic configuration of the magnetic air conditioner according to the first embodiment. First, the principle of magnetic refrigeration will be described with reference to this figure.

In the magnetic bodies 10A to 10F, a positive magnetic body is used as a magnetic body made of the same material and having the same type of magnetocaloric effect. The magnetic bodies 100A and 10B form the magnetic body block 100A, the magnetic bodies 10C and 10D form the magnetic body block 100B, and the magnetic bodies 10E and 10F form the magnetic body block 100C. Further, the magnetic body unit 200 is formed by the magnetic body blocks 100A-100C.

The magnetic circuits 20A, 20B, magnetic circuits 20C, 20D, and magnetic circuits 20E, 20F reciprocate between the magnetic bodies 10A-10F. That is, from the state of FIG. 1A, the magnetic circuits 20A and 20B move from the magnetic bodies 10A to 10B, the magnetic circuits 20C and 20D move from the magnetic bodies 10C to 10D, and the magnetic circuits 20E and 20F move from the magnetic bodies 10E to 10F all at once. Thus, the state shown in FIG. 1B is obtained. Next, from the state of FIG. 1B, the magnetic circuits 20A and 20B are changed from the magnetic bodies 10B to 10A, the magnetic circuits 20C and 20D are changed from the magnetic bodies 10D to 10C, and the magnetic circuits 20E and 20F are changed from the magnetic bodies 10F to 10E all at once. By moving, the positional relationship between the magnetic circuit and the magnetic body returns to the state shown in FIG. Therefore, when the magnetic circuit reciprocates, the states of FIGS. 1A and 1B are alternately repeated.

Here, as the plurality of magnetic bodies 10A-10F made of the same material, a positive magnetic body that generates heat when applying magnetism in the magnetic circuits 20A, 20B-magnetic circuits 20E, 20F and absorbs heat when removed is used. Use only one of the negative magnetic materials that absorbs heat when heat is applied at -20F and generates heat when removed. A positive magnetic body and a negative magnetic body have opposite magneto-caloric effects, and the types of magneto-caloric effects are different. In the case of FIG. 1, a positive magnetic material that is less expensive than a negative magnetic material is used. This is because a negative magnetic material has to be manufactured from a rare magnetic material, which increases the cost, and the magnitude of the magnetocaloric effect of the negative magnetic material is smaller than that of the positive magnetic material. .

The magnetic circuits 20A, 20B-20E, and 20F are provided with permanent magnets (not shown). The magnetic circuits 20A and 20B, the magnetic circuits 20C and 20D, and the magnetic circuits 20E and 20F are integrated to reciprocate in the horizontal direction in the figure, thereby applying magnetism to the magnetic bodies 10A to 10F individually.

The heat transfer units 30A-30G transfer heat generated by the magnetic bodies 10A-10F due to the magnetocaloric effect from the low temperature side heat exchange unit 40A to the high temperature side heat exchange unit 40B. The heat transfer unit 30A switches between a heat transfer state that transfers heat between the low temperature side heat exchange unit 40A and the adjacent magnetic body 10A and an adiabatic state that blocks heat. The heat transfer unit 30B switches between a heat transfer state that transfers heat between the magnetic bodies 10A and 10B and an adiabatic state that blocks heat. Similarly, the heat transfer units 30C, 30D, 30E, and 30F are provided between the magnetic bodies 10B and 10C, between the magnetic bodies 10C and 10D, between the magnetic bodies 10D and 10E, and between the magnetic bodies 10E and 10F. Switch between heat transfer state that transfers heat and heat insulation state that blocks heat. The heat transfer unit 30G switches between a heat transfer state that transfers heat between the magnetic body 10F and the high temperature side heat exchange unit 40B and an adiabatic state that blocks heat.

The heat transfer units 30B, 30D, and 30F switch the heat transfer state and the heat insulation state between the magnetic bodies 10A and 10B, between the magnetic bodies 10C and 10D, and between the magnetic bodies 10E and 10F at the same timing. Similarly, the heat transfer units 30A, 30C, 30E, and 30G are also at the same timing, between the low temperature side heat exchange unit 40A and the magnetic body 10A, between the magnetic bodies 10B and 10C, and between the magnetic bodies 10D and 10E. The heat transfer state and the heat insulation state are switched between the magnetic body 10F and the high temperature side heat exchange unit 40B. The heat transfer units 30B, 30D, and 30F and the heat transfer units 30A, 30C, 30E, and 30G are alternately switched between the heat transfer state and the heat insulation state. The detailed configuration of the heat transfer units 30A-30G and the heat transfer / heat insulation switching operation will be described later.

As shown in FIG. 1A, the magnetic circuits 20A and 20B are the magnetic body 10A of the magnetic body block 100A, the magnetic circuits 20C and 20D are the magnetic body 10C of the magnetic body block 100B, and the magnetic circuits 20E and 20F are the magnetic body block 100C. It is located on each of the magnetic bodies 10E. At this time, magnetism is applied to the magnetic bodies 10A, 10C, and 10E, and no magnetism is applied to the magnetic bodies 10B, 10D, and 10F, and the magnetism is removed. At this time, the magnetic bodies 10A, 10C, and 10E generate heat. At the same time, the heat transfer section 30B heats between the magnetic bodies 10A and 10B, the heat transfer section 30D heats between the magnetic bodies 10C and 10D, and the heat transfer section 30F heats between the magnetic bodies 10E and 10F. Set to transmission. For this reason, heat transfer between adjacent magnetic bodies in each magnetic body block is performed. That is, the heat generated by the magnetic bodies 10A, 10C, and 10E due to the magnetocaloric effect is transferred to the magnetic bodies 10B, 10D, and 10F, respectively.

Further, at this time, the heat transfer units 30A and 30G make heat insulation between the low temperature side heat exchange unit 40A and the magnetic body 10A and between the high temperature side heat exchange unit 40B and the magnetic body 10F. Further, the heat transfer units 30C and 30E are also in a heat insulating state between the magnetic bodies 10B and 10C and between the magnetic bodies 10D and 10E.

Next, as shown in FIG. 1B, the magnetic circuits 20A and 20B are the magnetic body 10B of the magnetic block 100A, the magnetic circuits 20C and 20D are the magnetic body 10D of the magnetic block 100B, and the magnetic circuits 20E and 20F are the magnetic bodies. It is located on the magnetic body 10F of the block 100C. At this time, magnetism is applied to the magnetic bodies 10B, 10D, and 10F, and no magnetism is applied to the magnetic bodies 10A, 10C, and 10E, and the magnetism is removed. At this time, the magnetic bodies 10B, 10D, and 10F generate heat. Further, the heat transfer unit 30A is between the low temperature side heat exchange unit 40A and the magnetic body 10A, the heat transfer unit 30C is between the magnetic bodies 10B and 10C, and the heat transfer unit 30E is between the magnetic bodies 10D and 10E. The heat transfer part 30G makes a heat transfer state between the magnetic body 10F and the high temperature side heat exchange part 40B. Thereby, between low temperature side heat exchange part 40A, high temperature side heat exchange part 40B, and magnetic bodies 10A and 10F located in the both ends of magnetic body unit 200, and between adjacent magnetic bodies of adjacent magnetic body blocks Heat transfer. That is, the magnetic bodies 10A, 10C, and 10E absorb heat by the magnetocaloric effect, and the magnetic bodies 10B, 10D, and 10F generate heat by the magnetocaloric effect. For this reason, heat moves from the low temperature side heat exchange section 40A to the magnetic body 10A, from the magnetic body 10B to the magnetic body 10C, from the magnetic body 10D to the magnetic body 10E, and from the magnetic body 10F to the high temperature side heat exchange section 40B. At this time, the heat transfer portions 30B, 30D, and 30F are in a heat insulating state between the magnetic bodies 10A and 10B, between the magnetic bodies 10C and 10D, and between the magnetic bodies 10E and 10F.

As described above, by reciprocating the magnetic circuit provided corresponding to each magnetic body block 100A-100C in the left-right direction in the figure, the magnetic bodies located at both ends of each magnetic body block 100A-100C are alternately arranged. Repeat the application and removal of magnetism. Further, in conjunction with the movement of the magnetic circuit, the heat transfer units 30A-30G repeat heat transfer and heat insulation among the low temperature side heat exchange unit 40A, the magnetic bodies 10A-10F, and the high temperature side heat exchange unit 40B. Thereby, the heat obtained by the magnetocaloric effect moves from the low temperature side heat exchange unit 40A to the high temperature side heat exchange unit 40B.

FIG. 2 is a graph showing the effect of the magnetic refrigeration of the present invention. As shown in this graph, the temperature difference between the low-temperature side heat exchange unit 40A and the high-temperature side heat exchange unit 40B is small at a relatively initial time after the operation of the magnetic cooling / heating apparatus. As time passes, the temperature difference between the low temperature side heat exchange section 40A and the high temperature side heat exchange section 40B gradually increases, and finally, as shown by the straight line after a long time has passed, The temperature difference between the heat exchange unit 40A and the high temperature side heat exchange unit 40B is maximized. In this state, for example, the indoor temperature can be lowered using the heat of the low temperature side heat exchange unit 40A, and the indoor temperature can be increased, for example, using the heat of the high temperature side heat exchange unit 40B.

Next, as shown in FIG. 1, the schematic diagram of FIGS. 3 and 4 shows how heat moves when a magnetic circuit provided corresponding to each magnetic block is reciprocated in the left-right direction in the figure. Based on

As a premise, all the magnetic bodies forming the magnetic body unit 200 are made of the same material, and all the magnetic bodies have the same type of magnetocaloric effect and have a temperature change of 5 ° C. Assume a case. Specifically, it is assumed that the temperature of 5 ° C. rises when magnetism is applied to all the magnetic materials, and the temperature decreases by 5 ° C. when the magnetism is removed.

First, as shown in (1) of FIG. 3, in the initial state, all magnetic materials are at room temperature of 20 ° C.

Next, as shown in (2) of FIG. 3, in this state, the magnetic circuit is moved to the right side, the magnetism is removed from the magnetic body located at one end of each magnetic body block 100A-100C, and the magnetic circuit is located at the other end. Magnetism is applied to the magnetic material. At the same time, between the adjacent magnetic bodies of the adjacent magnetic body blocks 100A-100C, between the magnetic body positioned at one end of the magnetic body unit 200 and the low-temperature side heat exchange unit 40A, and at the other end of the magnetic body unit 200. The heat transfer unit is set in a heat transfer state so that heat transfer between the magnetic body located at the high temperature side and the high temperature side heat exchange unit 40B is possible.

In the state of (2) in FIG. 3, the temperature of the magnetic material from which magnetism has been removed decreases to 15 ° C., and the temperature of the magnetic material to which magnetism has been applied increases to 25 ° C. For this reason, as shown in the figure, heat moves from the higher temperature to the lower temperature via the heat transfer section.

Due to this heat transfer, the temperature of the magnetic body located at one end of the magnetic body unit 200 and the low-temperature side heat exchanging section 40A becomes 18 ° C. as shown in FIG. The temperature of the magnetic body located at the end and the high temperature side heat exchange section 40B becomes 22 ° C.

Next, as shown in FIG. 3 (3), in this state, the magnetic circuit is moved to the left to remove the magnetism from the magnetic body located at the other end of each magnetic body block 100A-100C, and located at one end. Magnetism is applied to the magnetic material. At the same time, the heat transfer section is set in a heat transfer state so that heat transfer between adjacent magnetic bodies in each magnetic block 100A-100C is possible.

In the state of (3) in FIG. 3, the temperature of the magnetic material to which magnetism is applied rises by 5 ° C. from the temperature of the state of (2) ′ in FIG. (2) Decrease by 5 ° C. from the temperature in state '. For this reason, as shown in the figure, in each of the magnetic body blocks 100A-100C, heat moves from the higher temperature to the lower temperature through the heat transfer section.

This heat transfer causes the temperature of the low temperature side heat exchanging portion 40A to be 18 ° C. and the temperature of the magnetic material of the magnetic block 100A to be 19 ° C. as shown in FIG. Further, the temperature of the magnetic body of the magnetic block 100B is 20 ° C., and the temperature of the magnetic body of the magnetic block 100C is 21 ° C. And the temperature of the high temperature side heat exchange part 40B will be 22 degreeC.

As described above, the magnetic circuit is reciprocated to the left and right along the magnetic body, and the heat transfer unit is switched between the heat transfer state and the heat insulation state in synchronization with the movement of the magnetic circuit. Heat moves to the side heat exchange section 40B. As time elapses, the temperature difference between the low temperature side heat exchange section 40A and the high temperature side heat exchange section 40B increases. And finally, the state of FIG. 4 (1) and (2) will be repeated, the low temperature side heat exchange part 40A will be about 5 degreeC, and the high temperature side heat exchange part 40B will be 35 degreeC, The temperature difference becomes constant.

In this state, for example, the indoor temperature can be lowered using the heat of the low temperature side heat exchange unit 40A, and the indoor temperature can be increased, for example, using the heat of the high temperature side heat exchange unit 40B.

The description of FIGS. 1 and 3 is applicable when a positive magnetic material is used as a magnetic material of the same material having the same type of magnetocaloric effect. When a negative magnetic material is used as a magnetic material of the same material having the same type of magnetocaloric effect, the heat transfer direction is opposite to the direction shown in FIG. Therefore, when a negative magnetic material is used, the positions of the low temperature side heat exchange part 40A and the high temperature side heat exchange part 40B are opposite to those in FIGS.

As described above, the magnetic air conditioner switches the heat transfer state and the heat insulation state by the heat transfer units 30A to 30G and moves the heat.

Conventionally, the heat transfer unit has switched between a heat transfer state and a heat insulation state by inserting and removing a metal plate such as aluminum or copper between magnetic bodies. Although such a metal plate is excellent in heat transfer coefficient, frictional heat is generated when moving between magnetic bodies. Since the insertion / removal of the metal plate is synchronized with the magnetic movement, if the magnetic movement is to be accelerated, the insertion / removal of the metal plate must be accelerated accordingly. If it does so, the frictional heat by a metal plate will become large and the temperature of a magnetic body will not fall. For this reason, the speed of magnetic movement cannot be increased.

Therefore, in the first embodiment, the heat transfer portion has a structure that does not generate frictional heat.

FIG. 5 is a cross-sectional view of the heat transfer portion for explaining the configuration of the heat transfer portion in the first embodiment. FIG. 6 is a plan view of the heat transfer portion for explaining the configuration of the heat transfer portion in the first embodiment (a view of arrow A in FIG. 5).

Here, the heat transfer part 30 provided between the magnetic body 10 and the magnetic body 10 'adjacent thereto will be described as an example. The magnetic body 10 and the magnetic body 10 'adjacent thereto described here correspond to the magnetic body 10A in FIG. 1 as 10B, 10C and 10D, 10E and 10F. Moreover, it corresponds similarly to the low temperature side heat exchange part 40A and the magnetic body 10A, the magnetic body 10F, and the high temperature side heat exchange part 40B. However, in that case, one of the magnetic bodies 10 or 10 'becomes the low temperature side heat exchange part 40A or the high temperature side heat exchange part 40B. The heat transfer unit 30 corresponds to 30A-30G in FIG.

The heat transfer unit 30 includes a first electrode structure 11 in contact with the magnetic body 10, a second electrode structure 21 in contact with the magnetic body 10 ′, and between the first electrode structure 11 and the second electrode body structure 21. And a liquid metal 18 that is taken in and out of the gap 20. In addition, at one end of the gap 20, there is a liquid reservoir 17 that stores liquid metal. In the gap 20, the end opposite to the one end where the liquid reservoir 17 is provided is an open end 24.

The first electrode structure 11 and the second electrode structure 21 have the same structure and are symmetrical structures with the gap 20 as the center line. The first electrode structure 11 includes a first electrode 12, a dielectric 13, a second electrode 14, and a liquid repellent coating layer 15 in order from the magnetic body 10 side. Similarly, the second electrode body structure 21 includes the first electrode 12, the dielectric 13, the second electrode 14, and the liquid repellent coating layer 15 in this order from the magnetic body 10 'side. That is, when the gap 20 is taken as the center, both the first electrode structure 11 and the second electrode body structure 21 are in order from the gap 20 side, the liquid repellent coating layer 15, the second electrode 14, the dielectric 13, and the first electrode 12. It is arranged to become.

A lower substrate 16 is provided below the entire magnetic material. The lower substrate 16 has a liquid reservoir 17 communicating with the gap 20. The liquid reservoir 17 is a liquid storage portion that stores liquid metal.

The second electrode 14 extends into the liquid reservoir 17 and can be electrically connected to the liquid metal 18. On the other hand, the first electrode 12 is insulated from the liquid reservoir 17. That is, the first electrode 12 is insulated from the liquid metal 18.

As a result, the first electrode 12 and the second electrode 14 have a capacitor structure with the dielectric 13 between them, and this acts as a capacitor of the liquid metal 18 and the first electrode 12 (details). Later).

The upper substrate 100 on which wirings led from the first and second electrodes 12 and 14 are formed is provided above the first electrode structure 11 and the second electrode structure 21. The upper substrate 100 is separated and insulated by the extension of the gap 20 on the first electrode structure 11 side and the second electrode body structure 21 side, and is the same as the first electrode structure 11 and the second electrode structure 21. The same structure is symmetrical with respect to the gap 20. In the upper substrate 100, the first wiring 111 from the first electrode 12 and the second wiring 112 from the second electrode 14 are insulated by an insulating layer 113. The wires 111 and 112 are connected to a control device (not shown) of the magnetic air conditioner in order to control the heat transfer unit 30. The control device switches between the heat transfer state and the heat insulation state by the heat transfer unit 30 in synchronization with the magnetic movement.

Hereinafter, each part of the heat transfer unit will be described in detail.

The first electrode 12 and the second electrode 14 are not particularly limited as long as they are conductive, such as copper and aluminum. The shapes of the first electrode 12 and the second electrode 14 are the same, and are electrode plates that match the size of the gap 20 (excluding the gap interval).

The dielectric 13 is not particularly limited as long as it is between the first electrode 12 and the second electrode 14 and is a dielectric 13 such as a silicon oxide film or a silicon nitride film. The shape of the dielectric 13 is the same size as the first electrode 12 and the second electrode 14, and the first electrode 12 and the second electrode 14 are not short-circuited.

The liquid repellent coating layer 15 has liquid repellency with respect to the liquid metal 18. The liquid repellent coating layer 15 is preferably conductive. Examples of the material used for the liquid repellent coating layer 15 include a conductive oxide film (for example, LaSrTiO ₃ system), a conductive glass material (for example, V—Fe—Ba—O system), and a conductive ceramic (for example, SiC system). ) And graphene are preferred.

Since the liquid repellent coating layer 15 is liquid repellent with respect to the liquid metal 18, the liquid metal 18 can be easily stored in the liquid reservoir 17 when no electricity is applied. Further, since the liquid repellent coating layer 15 has conductivity, the electricity that has flowed to the second electrode 14 can be directly flowed to the liquid metal 10, which is efficient. In addition, when the liquid metal 18 is filled in the gap 20 between the first electrode structure 11 and the second electrode structure 21 by supplying electricity to the second electrode 14, the inside of the liquid reservoir 17 can be emptied. The amount of liquid metal 18 used can be reduced.

If a part of the liquid metal 18 always remains in the liquid reservoir 17 and electricity can flow from the second electrode 14 to the liquid metal 18, the liquid repellent coating layer 15 only has liquid repellency and is conductive. It may be non-sexual. Further, an insulating liquid repellent member such as an extremely thin silicon oxide film or silicon nitride film may be formed on the surface of the second electrode 14 on the gap 20 side. If an extremely thin silicon oxide film or silicon nitride film is present, electricity can be supplied to the liquid metal 18 by the tunnel effect when electricity is supplied to the second electrode 14 even if they are present.

The shape of the liquid repellent coating layer 15 constituted by such a member is large enough to cover the second electrode 14.

Furthermore, a member that is conductive and has a liquid repellent surface may be used for the second electrode 14 itself. That is, the second electrode 14 itself is formed of, for example, a conductive oxide film, a conductive glass material, a conductive ceramic material, graphene, or the like. In this case, it is not necessary to provide the liquid repellent coating layer 15 on the gap side surface of the second electrode 14.

The lower substrate 16 only needs to be insulated from at least the first and second electrodes 12 and 14. For example, an epoxy substrate, a phenol substrate, an ABS resin substrate, or the like is used as a material having insulation properties as a whole. A liquid reservoir 17 is provided on these substrates. In this case, the inner wall surface of the liquid reservoir is made lyophilic so that the liquid metal 18 can be easily stored in the liquid reservoir 17. In order to impart lyophilicity, it is preferable to form a metal film 19 (for example, a metal film of copper, nickel, aluminum, etc.) on the liquid reservoir wall surface.

Further, as the lower substrate 16, for example, a silicon substrate can be used. In the case of using a silicon substrate, first, after the liquid reservoir 17 is formed, an insulating layer (not shown) is formed on the entire surface including the wall surface inside the liquid reservoir 17 with a silicon oxide film, a silicon nitride film, or the like. Then, a metal film 19 (for example, a metal film such as copper, nickel, aluminum or the like, or polysilicon provided with conductivity in the case of a silicon substrate) may be formed to make the liquid reservoir 17 lyophilic. It is preferable to do.

The metal film 19 formed in the liquid reservoir 17 may be electrically connected to the second electrode 14.

Note that the metal film 19 in the liquid reservoir 17 may be omitted. As described above, the metal film 19 in the liquid reservoir 17 makes the liquid metal 18 easily stored in the liquid reservoir 17 when the liquid metal 18 is lowered by making the inner wall surface of the liquid reservoir 17 lyophilic. belongs to. For this reason, the metal film 19 may be omitted if the liquid reservoir 17 is sufficiently large and the liquid metal 18 can be smoothly stored even if the inner wall surface of the liquid reservoir 17 is not lyophilic.

Furthermore, the liquid reservoir 17 of the lower substrate 16 is provided with a hole 25 that does not leak the liquid metal 18 (the function of the hole 25 will be described later).

The upper substrate 100 has the same configuration on the first electrode structure 11 side and the second electrode body structure 21 side, and the first wiring 111 electrically connected to the first electrode 12 and the second electrode 14 are electrically connected. Connected second wiring 112 and an insulating layer 113 for insulating and separating them. Further, as already described, since the first electrode structure 11 side and the second electrode body structure 21 side are insulated and separated by the gap 20, naturally, the upper substrate 100 is also separated from the first electrode structure 11 side. The second electrode body structures 21 are provided so as to be separated and have the same configuration. In addition, a liquid repellent coating layer 15 is formed on the portion of each second wiring 112 facing the gap 20. Further, when viewed from above, the gap 20 portion is formed so that the liquid repellent coating layer 15 surrounds the gap 20 as shown in FIG. 6, so that the liquid metal does not leak from the side surface portion 15 a of the gap 20. It has become. Although not shown, the side surface portion 15a of the gap 20 has a structure (not shown) that covers the side surface portion of the gap (or the entire side surface including the side surface of the magnetic body) outside the liquid repellent coating layer 15. May be. Such a structure is preferably a non-magnetic, non-conductive member such as resin or ceramic.

A portion of the upper substrate 100 facing the wiring (a portion surrounded by a circle in FIG. 5) is an open end 24 so that the pressure in the gap 20 does not increase or decrease due to the movement of the liquid metal 18. ing. For this reason, the liquid metal 18 can move in the gap 20 smoothly.

The wirings 111 and 112 used for the upper substrate 100 are made of copper, aluminum or the like, like the first and second electrodes 12 and 14. On the other hand, the insulating layer 113 is preferably an insulator (insulating material) having a dielectric constant lower than that of the dielectric 13 at least.

The wirings 111 and 112 are wirings for applying a voltage to the first and second electrodes 12 and 14. For this reason, the same voltage as that of the first and second electrodes 12 and 14 is applied to the portion where the wiring is opposed (the portion in the vicinity of the open end 24 surrounded in FIG. 5). Then, if a material having a high dielectric constant is used as the insulating layer of the upper substrate 100, a capacitor structure is formed between the liquid metal 18 and the wiring even in this portion. Then, when the liquid metal 18 rises, there is a possibility that the liquid metal 18 may come from the enclosed portion to the upper side and be discharged at that momentum. In order to prevent this, in the portion where the wiring layers 112 face each other, an insulating material having a low dielectric constant is used to prevent the liquid metal 18 from entering the gap 20 between the portions where the wiring layers face each other. Yes. Specifically, for example, a so-called Low-k material used in a semiconductor device can be used. For example, silicon oxide added with fluorine or carbon, organic polymer, and the like. In addition, any material having a lower dielectric constant than the dielectric 13 used between the first and second electrodes 12 and 14 may be used. These Low-k materials may be used. These Low-k materials are known to have a relative dielectric constant of 3.0 or less with respect to a relative dielectric constant of 4.2 to 4.0 of SiO ₂ .

Note that the vicinity of the open end 24 where the insulating layer 113 that is an insulator is disposed has a thickness at which the wirings 112 and 113 are insulated. For example, if the thickness is about the thickness of the dielectric 13 from the upper end of the gap, the liquid When the metal 18 rises, it is not discharged from the upper end.

The liquid metal 18 (sometimes referred to as a conductive fluid) is a liquid metal at least in a temperature range in which the magnetic air conditioner is used. For example, galinstan which is a eutectic alloy of gallium, indium and tin can be used. Galinstan is a metal that is liquid at room temperature and has a different melting point depending on the composition of gallium, indium, and tin. For example, a galinstan of 68.5% gallium, 21.5% indium and 10% tin has a melting point: −19 ° C., a boiling point: 1300 ° C. or more, a specific gravity: 6.44 g / cm ³ , and a viscosity: 0.0024 Pa · s ( at 20 ° C.) and thermal conductivity: 16.5 W / (m · K). In addition, various known liquid metals 18 may be used, and those having a high heat transfer coefficient are preferable.

Next, the operation of the heat transfer unit 30 configured as described above will be described.

As described above, the function of the heat transfer unit 30 is to transfer and block heat (insulation) between magnetic bodies and the like. Since it has such a function, it may be called a thermal switch.

In the first embodiment, this thermal switch function is performed by the liquid metal 18 that moves back and forth between the gap 20 and the liquid reservoir 17. Electrowetting is used to move the liquid metal 18 back and forth between the gap 20 and the liquid reservoir 17. The movement of the liquid metal 18 by electrowetting is known per se and is disclosed in, for example, Japanese Patent Application Laid-Open No. 2007-103363. Therefore, the principle necessary for understanding the present embodiment will be described here.

FIG. 7 is an explanatory diagram for explaining the principle of electrowetting.

Electrowetting is performed by placing a liquid metal 18 (shown as a droplet here) on the surface of a dielectric 501 provided on the electrode plate 500 and applying a voltage between the electrode plate 500 and the liquid metal 18. This is a technique for controlling wettability with the liquid metal 18 on the dielectric surface.

A capacitor is formed between the electrode plate 500 and the liquid metal 18 via a dielectric 501. As shown in FIG. 7A, when a voltage is applied between the electrode plate 500 and the liquid metal 18, the electrostatic energy of the capacitor changes (increases), and the corresponding surface energy of the liquid metal 18 decreases, The surface tension of the liquid metal 18 is reduced. As a result, the contact angle θ with respect to the surface of the liquid metal 18 changes. Here, the contact angle θ is an angle between the surface of the dielectric 501 on which the liquid metal 18 is placed and the surface of the liquid metal. The contact angle θ varies in the range of 0 ° to 180 ° depending on the surface tension of the liquid metal 18.

Here, as shown in FIG. 7A (when voltage is applied), when the contact angle θ is 0 ° to 90 °, the surface has good wettability with respect to the liquid metal 18, that is, a lyophilic state. On the other hand, as shown in FIG. 7B (when no voltage is applied), the contact angle θ exceeds 90 ° and is 180 ° or less, which is a state of poor wettability, that is, a liquid repellent state. Electrowetting can change the contact angle θ of the liquid metal 18 placed on the dielectric surface in this way by applying a voltage.

FIG. 8 is an explanatory diagram for explaining the movement of the liquid metal in the gap, and is an enlarged view of the liquid metal portion in the gap.

In the first embodiment, the surface on which the liquid metal 18 moves is the liquid repellent coating layer 15 provided so as to face the gap 20 between the magnetic bodies 10 and 10 '. The liquid repellent coating layer 15 has liquid repellency with respect to the liquid metal 18 as already described. Therefore, if no voltage is applied between the first and second electrodes 12 and 14, the liquid metal 18 has a contact angle of 90 ° or more on the surface of the liquid repellent coating layer 15 as shown in FIG. 8A. It becomes liquid repellency (also called lyophobic).

In this way, the contact angle with the liquid contact surface (the surface of the liquid repellent coating layer 15) is 90 ° or more, so that the center of the liquid surface of the liquid metal 18 is convex as shown in FIG. 8A. Thus, the contact portion of the liquid metal 18 with the surface of the liquid repellent coating layer 15 is lowered. For this reason, the liquid metal 18 acts on the liquid repellent coating layer 15 surface in a liquid pool direction. As a result, the liquid metal 18 returns to the liquid reservoir 17.

This state is the state shown in FIG. 5 as a whole of the heat transfer section 30, the liquid metal 18 is in the liquid reservoir 17, and the gap 20 is filled with air (or inert gas (hereinafter the same)). ing. Therefore, the gap 20 filled with air provides a heat insulating state between the magnetic bodies 10 and 10 '.

On the other hand, when a voltage is applied between the first electrode 12 and the second electrode 14 in each of the magnetic bodies 10 and 10 ′, the dielectric 13 between the first electrode 12 and the second electrode 14 is polarized and statically applied. Electric energy changes (increases). At this time, since the second electrode 14 and the liquid metal 18 are electrically connected, the liquid metal 18 and the first electrode 12 have a capacitor structure with the dielectric 13 interposed therebetween. This structure is the same structure as the capacitor structure formed by the liquid metal 18 via the electrode plate 500 and the dielectric 501 in FIG. 7 explaining the principle of electrowetting.

For this reason, by applying a voltage between the first electrode 12 and the second electrode 14, the surface energy of the liquid metal 18 increases, and accordingly, the liquid metal 18 on the surface of the liquid repellent coating layer 15 (dielectric film) is increased. Surface tension is reduced and wettability is improved. Then, as shown in FIG. 8B, the contact angle θ of the surface of the liquid metal 18 in contact with the surface of the liquid repellent coating layer 15 becomes 90 ° or less. For this reason, the liquid metal 18 acts on the surface of the liquid repellent coating layer 15 in the direction toward the open end 24 of the gap 20 (in the direction of the upper substrate 100). Further, although the surface tension of the liquid metal 18 itself is lost, the tension that climbs the gap 20 by a capillary phenomenon also works. As a result, the liquid metal 18 moves up the gap 20 and is filled in the gap 20, and enters a heat transfer state (see FIG. 9). In FIG. 8B, h is the amount of increase from the position (FIG. 8A) on the original liquid level. In FIG. 8, d is the gap 20 interval.

FIG. 9 is a cross-sectional view of the same portion as in FIG. 5 and shows a state in which the liquid metal 18 has gone up through the gap 20, that is, a heat transfer state.

As shown in the figure, the liquid metal 18 reaches the position of the upper substrate 100 that is the top of the gap 20. As already described, there is no dielectric between the first wiring 111 and the second wiring 112 of the upper substrate 100 (or the dielectric constant is low) in the gap portion of the upper substrate 100. For this reason, since the electrostatic energy in this portion hardly changes, the wettability of the raised liquid metal 18 does not improve, so the liquid metal 18 does not rise any further.

Then, as the liquid metal 18 rises, the gap 20 is filled with the liquid metal 18 and enters a heat transfer state in which heat is transferred between the magnetic bodies 10 and 10 '.

Thus, in the heat transfer unit 30 of the first embodiment, the heat transfer state in which the liquid metal 18 is filled in the gap 20 provided in the heat transfer unit 30 by electrowetting and the liquid metal 18 is excluded from the gap 20. The adiabatic state can be electrically controlled.

Note that, as shown in FIG. 9, when the liquid metal 18 rises through the gap 20, the liquid metal 18 comes out from the liquid reservoir 17. At this time, if the liquid reservoir 17 is in a sealed state, the inside of the liquid reservoir 17 becomes a negative pressure (vacuum), so that the liquid metal 18 does not easily go out of the liquid reservoir 17 into the gap 20. Therefore, in the first embodiment, the hole 25 is provided at the lower end of the liquid reservoir 17. The size of the hole 25 is set such that the liquid metal 18 does not leak and the gas flows in and out. The position of the hole 25 may be other than the lower end of the liquid reservoir 17 and may be arranged so that the liquid metal 18 can easily go out from the liquid reservoir 17 into the gap 20.

Here, in the first embodiment, the first and second electrode structures 11 and 21 that face each other with the gap 20 are parallel to the first electrode 12 and the second electrode 14 through the dielectric 13, respectively. Provided. Among these, the capacitor that is constituted by the first electrode 12, the liquid metal 18, and the dielectric 13 between them is acting on the electrowetting. For this reason, as a principle of electrowetting, the second electrode 14 may be omitted as long as a voltage can be applied to the liquid metal 18. For example, an electrode electrically connected to the liquid metal is provided through the lower substrate. In this case, since the second electrode does not exist in the gap, the opposing surface of the gap becomes a dielectric and has liquid repellency with respect to the liquid metal.

However, in such a case (when the second electrode is omitted), the electrode structure is increased or decreased because the liquid metal 18 serving as the counter electrode of the first electrode 12 moves as the capacitor structure. For this reason, the electrostatic energy in the dielectric material that causes the electrowetting action also increases or decreases. Therefore, even if the same voltage is applied, the force for moving the liquid metal is changed by the electrowetting action depending on the rising amount of the liquid metal, and the rising speed of the liquid metal may change (the second electrode is omitted). Even in this case, although the moving speed of the liquid metal may be slightly unstable, it is possible to switch between heat transfer and heat insulation without generating friction as in the case of providing the second electrode).

In the first embodiment, since the first electrode 12 and the second electrode 14 are provided in parallel via the dielectric 13, the size of the capacitor by the first electrode 12 and the second electrode 14 is the same as that of the liquid metal 18. Does not change with movement. Therefore, even when the same voltage is applied, the transfer speed of the liquid metal is not changed by the movement of the liquid metal, and the heat transfer and the heat insulation can be switched stably.

Next, the results of trial calculation of the response characteristics of the heat transfer unit 30 will be described.

FIG. 10 is a perspective view showing a heat transfer section shape model when the response characteristics are estimated.

In this trial calculation, as shown in FIG. 10, the shape of the heat transfer unit 30 is such that the gap 20 is dg, the height is 1 mm, and the width is 1 mm.

Also, the height at which the liquid metal 18 rises when the gap wall surface becomes lyophilic with respect to the liquid metal 18 is defined as h.

The flow velocity of liquid, which is important as a response characteristic, can be obtained by applying the formulas of surface tension T acting on the liquid metal 18, shear stress (wall surface) τ, volume force mg, and laminar flow between parallel walls. The directions of forces such as surface tension T, shear stress (wall surface) τ, and body force mg are as shown in FIG.

That is,
τ = − (dp / ds) · (dg / 2)
V = − (dp / ds) · dg ² / (12 μ)
From the above equation, τ = 6 μV / dg.

Here, liquid density: ρ [kg / m ³ ], gravitational acceleration: g [m / s ² ], gap interval: dg [m], surface tension: T [N / m], contact angle: θ [rad] , Shear stress (wall surface): τ [pa], body force: mg (m = dg · h · ρ), liquid surface flow velocity: V [m / s], viscosity: μ [pa · s], liquid surface height Length: h [m], liquid surface acceleration: α [m / s ² ], pressure: p [pa], flow direction length: s [m], gap liquid mass: m [kg], time: t [ sec], time variation: Δt [sec] = 10 ⁻⁶ .

Further, the relationship between the surface tension, the contact angle, and the rising amount of the liquid metal 18 can be expressed by the following formula.

h = (4T cos θ) / (ρgd)
Response characteristics were calculated using this equation.

FIG. 20 is a flowchart for explaining the flow of calculating the response characteristics.

As shown in the figure, initialization is performed so that the variables t = 0, V ₀ = 0 (V ₀ is the initial value of the liquid surface flow velocity), and h = 5 μm (S1). Subsequently, time t = t + Δt is set (S2).

Thereafter, α (t) = (surface tension−shear stress−volume force) / m is calculated (S3). Thereafter, if α (t) is 0 or more (S4: YES), V and h are calculated (S5), and if h is 1 mm or more (S6: YES), the process is terminated. On the other hand, if h is less than 1 mm (S6: NO), the process returns to S2.

In S4, if α (t) is less than 0 (S4: NO), surface tension = shear stress + volume force (S7). Thereafter, V and h are calculated (S5). If h is 1 mm or more (S6: YES), the process is terminated. If h is less than 1 mm (S6: NO), the process returns to S2.

Here, liquid level height: h [m], liquid density: ρ [kg / m ³ ], gravitational acceleration: g [m / s ² ], liquid column diameter: d [m] (here, liquid column Diameter d = gap spacing dg), surface tension: T [N / m], and contact angle: θ [rad].

Using this calculation flowchart, the time t required for the liquid metal to rise by 1 mm was calculated by changing the contact angle and the gap 20 in the model shown in FIG.

The result is shown in FIG. FIG. 11 is a graph showing the result of calculating the time taken for the liquid metal to rise by changing the contact angle and the gap 20. In the graph, the vertical axis represents the time (msec) required for the 1 mm liquid metal to rise, and the horizontal axis represents the interval dg (μm) of the gap 20.

In addition, the value of mercury (Hg) was used for the viscosity μ and density ρ of the liquid. That is, the viscosity is 1.55 × 10 ⁻³ Pa · s (20 ° C.), and the density is 13.5951 × 10 ³ kg / m ³ . In addition, normal temperature (20 ° C.) and normal pressure (1 atm) were set.

As can be seen from the graph shown in FIG. 11, when the contact angle is 70 ° or less, the time required for the liquid to rise can be adjusted to 1.0 msec or less by appropriately adjusting the gap 20 after that. . This time indicates that the repetition of loading / unloading can be increased from about 50 Hz to about 100 Hz by allowing the liquid metal 18 to enter and leave the gap 20 to act as a thermal switch.

This makes it possible to reduce the number of times the heat transfer member is put in and out between the magnetic bodies and the like, which has been a neck until now, to about 50 Hz to 100 Hz. Accordingly, the magnetic movement (magnetization and removal) can be increased from 50 Hz to about 100 Hz accordingly.

Next, the heat transfer characteristic and heat insulation characteristic of the heat transfer part 30 will be described.

As the magnetic air conditioner, a model in which the heat transfer unit 30 is provided between the 24 magnetic bodies is assumed. In this model, the size of the surface where the magnetic bodies face each other was a square of 10 mm in length and width, and the thickness of the magnetic body was 1 mm. The thermal conductivity of the magnetic material is 200 W / (m · K). Further, the gap 20 where the liquid metal 18 enters and exits was set to 200 μm. The heat transfer coefficient of the first and second metal plates of the heat transfer unit 30 was assumed to be the same as that of aluminum. The dielectric 13 is assumed to have a thickness of 1 μm and the liquid repellent coating layer 15 has a thickness of several tens of nanometers. However, these thicknesses are ignored because they hardly affect heat transfer (existence). Incidentally, the thermal conductivity of SiO ₂ is 1.38 W / (m · K) at 300 K, and SiN is 20 to 28 W / (m · K) (however, the crystallinity is improved to contain oxygen In addition, graphene has a thermal conductivity of 5 × 10 ³ W / (m · K), and V—Fe—Ba— as a conductive glass. In the O system, the thermal conductivity is 1.0 W / (m · K), and in the LaSrTiO ₃ system as the conductive oxide film, the thermal conductivity is 6.0 to 10.0 W / (m · K). In the case of SiC as a conductive ceramic, its thermal conductivity is 200 W / m is a · K).

In this model, it was assumed that the temperature difference between the 24 ends was 60 ° C. by repeating heat transfer and heat insulation by putting in and out the liquid metal 18 at a temperature change of 5 ° C. and 50 Hz or more of each magnetic body. In this case, the heat transfer characteristics when the necessary liquid metal 18 rises in the heat transfer section 30 and the heat insulation characteristics when the liquid metal 18 rises were considered.

First, when the heat switch is OFF, that is, when the liquid metal 18 is lowered in the heat transfer section 30 and there is no liquid metal 18 in the gap 20. In this case, it is necessary for the heat insulating property to have a thermal conductivity of 1 W / (m · K) or less. This corresponds to, for example, when the gap 20 is filled with a heat insulating material having a thermal conductivity of acrylic resin. In addition, this corresponds to a distance of about several tens of millimeters when the gap 20 is an air layer (the same applies to an inert gas). For this reason, if the space | interval of the clearance gap 20 is ensured about several dozen micrometers, it will become sufficient heat insulation characteristic.

On the other hand, the thermal conductivity required when the thermal switch is turned on, that is, the heat conduction when the liquid metal 18 is filled up through the gap 20, is 200 W / mm at the gap of the gap 20 where the liquid metal 18 enters and exits in the above model. A member having a heat transfer coefficient of about (m · K) is required. This corresponds to the heat transfer coefficient of a metal such as aluminum.

When the above-described galinstan is used as the liquid metal 18, the thermal conductivity is 16.5 W / (m · K). Therefore, if the gap 20 is not 200 μm but 20 μm, the length of heat transfer becomes 1/10. Then, since the necessary heat transfer coefficient is effective by the square of the length to be transmitted, it is only necessary to have 2 W / (m · K) which is 1/100. Therefore, if the gap 20 is 20 μm, a temperature difference of 60 ° can be obtained with a sufficiently 50 Hz operation even when Galinstan is used. Therefore, if the gap 20 is about 1/4 of 200 μm, the required thermal conductivity is 1/16 of 200 W / (m · K), that is, 12.5 W / (m · K). Therefore, when using Galinstan, the maximum value of the gap 20 is approximately 1/4 of 200 μm, that is, a temperature difference of 60 ° can be obtained at 50 Hz operation even at about 50 μm.

From the above, the preferred size of each part constituting the heat transfer part 30 is such that when the gallinstan is used as the liquid metal 18, the gap 20 is preferably 10 μm to 50 μm. The reason why the lower limit is set to 10 is to provide sufficient heat insulation when the liquid metal 18 is lowered and air enters the gap 20 by opening the gap 20 of this level. On the other hand, the upper limit of 50 μm is to maintain heat transfer performance when the liquid metal 18 rises and fills the gap 20 as already described.

In addition, it is preferable to make the electrode plate, the dielectric 13, the liquid repellent coating layer 15, etc. as thin as possible. In particular, if the dielectric 13 is too thick, it becomes a heat insulating material, so it is preferable to make it as thin as possible. For example, if the total thickness of the dielectrics 13 of the first electrode structure 11 and the second electrode structure 21 is 10 μm or less, the influence caused thereby is negligible (as in the above example, Since the heat transfer thickness is the square of 200 W / (m · K), which is about the same as aluminum, the thermal conductivity is about 1/200 at 10 μm, so 1 W / (m · K) If the dielectric 13 is 1 μm as in the above model, the dielectric 13 is 1/20000, which is 0.01 W / (m · K), which is almost negligible.

It should be noted that the size of each part may be appropriately set according to the liquid metal 18 to be used and the frequency to be taken in and out, and is not limited to such a value.

Next, the voltage application characteristics will be described.

12 is a graph showing voltage application characteristics, FIG. 12A is a graph showing the relationship between the contact angle θ and the frequency f, and FIG. 12B is a graph showing the relationship between the applied voltage V and the frequency f.
From these graphs, it can be seen that in order to increase the frequency, it is necessary to reduce the contact angle, and in order to increase the frequency, it is necessary to increase the voltage. That is, by raising the voltage applied to the first electrode 12 and the second electrode 14 and lowering the contact angle, the frequency of taking in and out the liquid metal 18 can be raised.

FIG. 13 is a diagram showing an example of switching characteristics in one cycle of liquid metal loading and unloading. As shown in the figure, when viewed as one cycle and 360 °, the rise at the time of voltage application (ON) is maintained for 18 ° of one cycle, and then the ON voltage is maintained for 162 °. When the voltage is turned off (OFF), the falling off voltage is obtained over a period of 18 ° of one cycle. Of course, the switching characteristic is not limited to this special characteristic, and it is preferable to obtain an on / off characteristic close to a rectangular wave.

(Embodiment 2)
Subsequently, Embodiment 2 will be described. FIG. 14 is a plan view for explaining the structure of the heat transfer unit of the second embodiment, as viewed from the direction corresponding to the arrow A in FIG.

In the second embodiment, blades 31 are arranged on the wall surfaces of the first electrode structure 11 side and the second electrode body structure 21 side in the gap 20 of the heat transfer section 30, that is, on the surface of the liquid repellent coating layer 15. It is. The blade 31 extends vertically from the liquid reservoir 17 of the lower substrate 16 in the direction of the upper substrate 100, and the blade 31 on the first electrode structure 11 side and the blade 31 on the second electrode body structure 21 side do not contact each other. It is wide. The blade 31 itself may be formed, for example, so that the material of the liquid repellent coating layer 15 has the structure of the blade 31 as it is.

Other configurations are the same as those in the first embodiment, and thus description thereof is omitted.

By doing in this way, the contact surface area of the liquid metal 18, the wall surface of the 1st electrode body structure 11, and the wall surface of the 2nd electrode body structure 21 becomes large, and heat transfer efficiency improves. Further, since the gap d _B is formed between the blade 31 of the first electrode structure 11 side and the second electrode structure body 21 side of the blade 31, the liquid to the blade wall even gap d _B between the blade 31 The surface tension of the metal 18 works and the liquid metal 18 is more likely to rise (when voltage is applied). As the gap d _B also previously described between the blade 31, it is preferably about 10 [mu] m ~ 50 [mu] m.

(Embodiment 3)
Next, a more practical embodiment of the magnetic air-conditioning apparatus using a plurality of magnetic bodies using the configuration of the heat transfer unit of the first or second embodiment as described above will be described as a third embodiment.

FIG. 15 is a top view showing a schematic configuration of the magnetic cooling / heating device of Embodiment 3, and shows a state seen through from above so that the positional relationship among the magnetic body, the permanent magnet forming the magnetic circuit, and the heat transfer unit can be understood. It is a figure. 16A to 16B are top views of the magnetic body / heat transfer portion arrangement plate and the magnet arrangement plate constituting the magnetic air conditioner shown in FIG. 17 is an exploded cross-sectional view of the magnetic air conditioner shown in FIG. 15 (A is a cross-sectional view of the magnet arrangement plate 800 portion, and B is a cross-sectional view of the magnetic body / heat transfer portion arrangement plate 700 portion). FIG. 18 is a schematic diagram for explaining a state in which heat moves when the magnet arrangement plate of this magnetic air conditioner is rotated (FIG. 18A is a cross section taken along the line AA in FIG. 15, 15 corresponds to a cross section taken along line AA in FIG. 15, and FIG. 18B corresponds to a cross section taken along line BB in FIG. FIG. 19 is an explanatory diagram for explaining the operation of the magnetic air conditioner according to the third embodiment. In FIG. 19, the description of the drive section shown in FIG. 17 is omitted for easy understanding of the invention.

This magnetic air conditioner uses the same principle as the magnetic refrigeration shown in FIG. In order to perform magnetic refrigeration using this principle, it is configured as follows.

As shown in FIG. 15 to FIG. 19, the magnetic air conditioner 500 according to the third embodiment includes a hollow disk-shaped magnetic body / heat transfer unit arrangement plate 700 (in particular, see FIG. 16A) having an open center part, and a center part. Has a hollow disk-shaped magnet arrangement plate 800 (see FIG. 16B in particular). The magnetic body / heat transfer section arrangement plate 700 has a low temperature side heat exchange section 40A disposed at the center thereof and a high temperature side heat exchange section 40B disposed at the outer periphery thereof. The magnet arrangement plate 800 has two discs, an upper disc 800A and a lower disc 800B, which are arranged with a gap (see particularly FIG. 17).

In the magnetic cooling / heating device 500, the magnetic body / heat transfer portion arrangement plate 700 and the magnet arrangement plate 800 are arranged concentrically (refer to FIGS. 15, 17, and 18 in particular). The magnetic body / heat transfer portion arrangement plate 700 is inserted between the upper disc 800A and the lower disc 800B of the magnet arrangement plate 800 (see particularly FIGS. 17 and 18). The low temperature side heat exchanging unit 40A is arranged at the center of the magnetic body / heat transfer unit arrangement plate 700 and the magnet arrangement plate 800. The high temperature side heat exchanging part 40B is arranged on the outer periphery of the magnetic body / heat transfer part arrangement plate 700 and the magnet arrangement plate 800 (see particularly FIGS. 15, 17, and 18).

In the third embodiment, since it is assumed that a positive magnetic body is disposed on the magnetic body / heat transfer section disposition plate 700, the low temperature side heat exchange section 40A is disposed at the center thereof, and the outer peripheral section thereof. The high temperature side heat exchange part 40B is arrange | positioned. When a negative magnetic material is arranged on the magnetic material / heat transfer part arrangement plate 700, the high temperature side heat exchange unit 40B is arranged at the center, and the low temperature side heat exchange unit 40A is arranged at the outer periphery thereof. The arrangement of the low temperature side heat exchanging part 40A and the high temperature side heat exchanging part 40B differs depending on which of the positive and negative magnetic substances is used for the magnetic substance / heat transfer part arrangement plate 700.

As shown in FIG. 16A, the magnetic body / heat transfer part arrangement plate 700 is a hollow disk whose center part is open, and the opening diameter of the center part is larger than the diameter of the cylindrical low temperature side heat exchange part 40A. Slightly larger. In addition, the diameter of the magnetic body / heat transfer part arrangement plate 700 is the same as the inner circumference of the cylindrical high temperature side heat exchange part 40B.

Further, as shown in FIGS. 17 and 18, the magnetic body / heat transfer portion arrangement plate 700 is fixed to the high temperature side heat exchange portion 40B. Not shown between the magnetic body / heat transfer section arrangement plate 700 and the high temperature side heat exchange section 40B so that heat does not move between the magnetic body / heat transfer section arrangement plate 700 and the high temperature side heat exchange section 40B. It is preferable to interpose a heat insulating material.

As shown in FIGS. 16A and 17B, a plurality of magnetic bodies are formed annularly and radially on one side of the magnetic body / heat transfer portion arrangement plate 700 (opposing surface of the disc 800A). . In the third embodiment, twelve magnetic body units 200A, 200B, 200C,..., 200G, adjacent to the region on the magnetic body / heat transfer portion arrangement plate 700 divided at a central angle of 30 ° in the circumferential direction. ..., 200L is formed. And the heat transfer part is arrange | positioned between all the magnetic bodies, between a magnetic body and the low temperature side heat exchange part, and between the magnetic body and the high temperature side heat exchange part (after-mentioned).

Each magnetic body unit 200A, 200B, 200C,..., 200G,..., 200L has six magnetic bodies arranged from the center of the magnetic body / heat transfer section arrangement plate 700 toward the outer periphery. For example, the magnetic body unit 200A arranges magnetic bodies 10Aa, 10Ab, 10Ac, 10Ad, 10Ae, and 10Af, and the magnetic body unit 200B arranges magnetic bodies 10Ba, 10Bb, 10Bc, 10Bd, 10Be, and 10Bf, respectively.

The six magnetic bodies constituting each magnetic unit are all positive magnetic bodies whose temperature rises when magnetism is applied. It is made of magnetic material suitable for each operating temperature range.

In each magnetic body unit, two magnetic bodies form a set to form a magnetic body block. For example, in the magnetic unit 200A, the magnetic bodies 10Aa and 10Ab form the magnetic body block 100Aa, the magnetic bodies 10Ac and 10Ad form the magnetic body block 100Ab, and the magnetic bodies 10Ae and 10Af form the magnetic body block 100Ac. In the magnetic unit 200B, the magnetic bodies 10Ba and 10Bb form the magnetic body block 100Ba, the magnetic bodies 10Bc and 10Bd form the magnetic body block 100Bb, and the magnetic bodies 10Be and 10Bf form the magnetic body block 100Bc.

Therefore, in the magnetic body / heat transfer portion arrangement plate 700 of the third embodiment, each of the magnetic body units 200A, 200B, 200C,..., 200G, ..., 200L has three magnetic body blocks 100Aa-100Ab-100Ac, 100Ba- 100Bb-100Bc,... Each of the magnetic blocks 100Aa, 100Ab, 100Ac, 100Ba, 100Bb, 100Bc,... Has two magnetic bodies, 10Aa-10Ab, 10Ac-10Ad, 10Ae-10Af, 10Ba-10Bb, 10Bc-10Bd, 10Be-10Bf ... is formed.

When attention is paid to one magnetic body unit 200A of the magnetic body / heat transfer portion arrangement plate 700 of Embodiment 3, the magnetic body unit 200A is formed of six magnetic bodies 10Aa, 10Ab, 10Ac, 10Ad, 10Ae, and 10Af. . These magnetic bodies have three magnetic body blocks 100Aa, 100Ab, and 100Ac. These magnetic blocks are formed of a set of two magnetic bodies 10Aa-10Ab, 10Ac-10Ad, and 10Ae-10Af. The magnetic body units 200B to 200L are formed in the same manner as the magnetic body unit 200A. For this reason, the magnetic body / heat transfer portion arrangement plate 700 of Embodiment 3 has a configuration equivalent to that obtained by arranging the magnetic body units 200 shown in FIG. 1A in 12 rows in parallel.

The magnetic body 10Aa used in the third embodiment may be directly formed on the magnetic body / heat transfer portion arrangement plate 700. However, in order to effectively use the magnetocaloric effect, the magnetic body 10Aa,. The heat transfer portion arrangement plate 700 is preferably made of a material having a large thermal resistance. This is because if the thermal resistance is small, the heat generated by the magnetic bodies 10Aa,... Will be dissipated through the magnetic body / heat transfer portion arrangement plate 700. Further, in order to increase the thermal resistance, the magnetic bodies 10Aa,... Are not directly formed on the magnetic body / heat transfer portion arrangement plate 700, but the magnetic bodies 10Aa,. A heat insulating film or a heat insulating layer may be provided between the two.

Further, the magnetic bodies 10Aa,... May be integrally formed on the magnetic body / heat transfer portion arrangement plate 700 as a magnetic unit 200A,... Via a heat insulating film or a heat insulating layer. Further, the magnetic material blocks 100Aa,... May be divided and formed via a heat insulating film or a heat insulating layer, and arranged on the magnetic material / heat transfer portion arrangement plate 700.

The magnetic bodies 10Aa,... Are the same as those in the first embodiment as already described in the third embodiment. Similarly, La _x Ca _1-x MnO ₃ , La (Fe _1-x Si _x ) ₁₃ H _{y and the} like can be used for the material composition.

In the third embodiment, the shape of the magnetic bodies 10Aa,... Is as shown in FIG. 15, FIG. 16A, FIG. A shape such as a spherical shape, an ellipsoidal shape, a cubic shape, a cylindrical shape, or an elliptical columnar shape may be employed.

As described above, the magnetic body / heat transfer portion arrangement plate 700 includes the magnetic body unit 200A in which the magnetic bodies 10Aa... Of the same material are arranged in a plurality of rows in the radial direction. In the magnetic body / heat transfer portion arrangement plate 700, a plurality of the magnetic body units 200A are arranged in an annular shape adjacent to each other at intervals in the circumferential direction intersecting with the arrangement direction of the magnetic bodies 10Aa,.

The magnetic unit 200A includes magnetic body blocks 100Aa,... In which magnetic bodies 10Aa,... Of the same material are arranged in a radial direction at intervals in a plurality of rows, and the magnetic body blocks 100Aa are arranged as magnetic bodies 10Aa,. They are formed in a plurality of rows with intervals in the direction.

In the magnetic body unit 200A of the magnetic body / heat transfer section arrangement plate 700, between all the magnetic bodies 10Aa, between the magnetic bodies 10Aa and the low temperature side heat exchange section 40A, between the magnetic body 10Af and the high temperature side heat exchange. A heat transfer portion is disposed between the portions 40B. This heat exchange unit has the same configuration as that described in the first or second embodiment. That is, the heat transfer units 30Ba, 30Ab, 30Bc, 30Ad, 30Be, 30Af, and 30Bg are arranged in the direction from the low temperature side heat exchange unit 40A to the high temperature side heat exchange unit 40B. The same applies to the magnetic body unit 200B. Heat transfer is performed between all the magnetic bodies 10Aa, between the magnetic bodies 10Aa and the low-temperature side heat exchange unit 40A, and between the magnetic body 10Af and the high-temperature side heat exchange unit 40B. The parts 30Aa, 30Bb, 30Ac, 30Bd, 30Ae, 30Bf, and 30Ag are arranged (see FIG. 16A).

Here, in the magnetic unit 200A, the heat transfer units 30Ab, 30Ad, and 30Af are simultaneously in a heat transfer state (ON), and at that time, the heat transfer units 30Ba, 30Bc, 30Be, and 30Bg are in a heat insulation state (OFF). Conversely, the heat transfer units 30Ab, 30Ad, and 30Af are simultaneously insulative (off), and at that time, the heat transfer units 30Ba, 30Bc, 30Be, and 30Bg are in the heat transfer state (on). The same applies to the magnetic unit 200B, and the heat transfer units 30Bb, 30Bd, and 30Bf are simultaneously in a heat transfer state (ON), and at that time, the heat transfer units 30Aa, 30Ac, 30Ae, and 30Ag are in a heat insulation state (OFF). Conversely, the heat transfer units 30Bb, 30Bd, and 30Bf are simultaneously insulative (off), and at that time, the heat transfer units 30Aa, 30Bc, 30Ae, and 30Ag are in the heat transfer state (on). That is, in the figure, when the heat transfer part of the subscript A of 30 is simultaneously turned on, the heat transfer part of the subscript B is simultaneously turned off or vice versa.

In FIG. 15, in order to provide an explanation of the operation, the heat transfer unit that is in the heat transfer state (ON) in the illustrated operation state is indicated by a symbol. However, as already described, the heat transfer units are all the same. The structure is between all the magnetic bodies, between the heat exchange part and the magnetic body.

Since the magnetic body / heat transfer portion arrangement plate 700 is configured as described above, the low temperature side heat exchanging portion 40A has the magnetic body units 200A, 200B, 200C formed on the magnetic body / heat transfer portion arrangement plate 700. ,..., 200G,..., 200L are adjacent to the magnetic bodies 10Aa, 10Bb,. Further, the high temperature side heat exchanging portion 40B is formed of the magnetic body 10Af located at the other end of the magnetic body units 200A, 200B, 200C,..., 200L formed on the magnetic body / heat transfer portion arrangement plate 700, 10Bf,... Also in all the magnetic units, heat transfer portions 30Ba, 30Ab... Or 30Aa, 30Bb,.

As shown in FIG. 16B, the magnet arrangement plate 800 is a hollow disc having an opening at the center thereof, and the opening diameter at the center is slightly larger than the diameter of the columnar low temperature side heat exchange portion 40A. is there. Moreover, the diameter of the magnet arrangement | positioning board 800 is made a little smaller than the dimension of the inner periphery of the cylindrical high temperature side heat exchange part 40B. This is because the magnet arrangement plate 800 can rotate between the low temperature side heat exchange unit 40A and the high temperature side heat exchange unit 40B. As shown in FIGS. 17 and 18, the magnet arrangement plate 800 includes two upper and lower disks 800 </ b> A that are magnetically connected with a gap therebetween to sandwich the magnetic body / heat transfer portion arrangement plate 700. It is composed of 800B.

The upper and lower two disks 800A and 800B can be separately rotated around the low-temperature side heat exchange unit 40A, and the bearings provided in the low-temperature side heat exchange unit 40A and the upper and lower two discs It is supported by bearings provided at the outer peripheral ends of the disks 800A and 800B. As shown in FIG. 17, the upper disk 800A is rotatably supported by bearings 520Aa and 520Ab, and the lower disk 800B is rotatably supported by bearings 520Ba and 520Bb. Therefore, the upper disk 800A can rotate separately from the lower disk 800B.

The support board 530 is arrange | positioned so that the magnet arrangement | positioning board 800 may be surrounded. The support board 530 fixes servo motors 540A and 540B for separately rotating the upper and lower disks 800A and 800B. The servo motor 540A is fixed to a portion facing the upper disc 800A of the support plate 530, and the servo motor 540B is fixed to a portion facing the lower disc 800B of the support plate 530. Gears 550A and 550B are attached to the respective rotation shafts of the servo motors 540A and 540B. A ring gear 560A that meshes with the gear 550A is attached to the outer periphery of the upper disk 800A. A ring gear 560B that meshes with the gear 550B is attached to the outer periphery of the lower disc 800B. The servo motors 540A and 540B, the gears 550A and 550B, and the ring gears 560A and 560B constitute a drive unit.

When the servo motor 540A rotates, the ring gear 560A meshing with the gear 550A rotates and the upper disk 800A rotates. When the servo motor 540B rotates, the ring gear 560B meshing with the gear 550B rotates to rotate the lower disk 800B. When the servo motors 540A and 540B are rotated in synchronization, the upper and lower disks 800A and 800B rotate together.

In the third embodiment, the servo motors 540A and 540B are rotated synchronously. Therefore, the magnet arrangement plate 800 is arranged such that the magnetic body / heat transfer unit arrangement plate 700 is sandwiched between the upper and lower disks 800A and 800B with the low temperature side heat exchange unit 40A as the center, and the low temperature side heat exchange unit 40A. It rotates with the high temperature side heat exchange part 40B.

As shown in FIG. 16B, a plurality of permanent magnets are arranged annularly and radially on one side of the upper disk 800A forming the magnet arrangement plate 800 (the lower side of the disk 800A shown in FIGS. 17 and 18). It is. The permanent magnets are magnetic body blocks 100Aa, 100Ab, 100Ac, 100Ba, 100Bb of the magnetic body units 200A, 200B, 200C, ..., 200G, ..., 200L of the magnetic body / heat transfer portion arrangement plate 700 shown in Fig. 16A. , 100Bc,... Are arranged so that one permanent magnet faces each other. Each time the magnet arrangement plate 800 rotates 30 ° and moves to the adjacent magnetic body unit, the permanent magnet is moved to the adjacent magnetic body unit 200A, 200B, 200C,..., 200G,. 100Ab, 100Ac, 100Ba, 100Bb, 100Bc,... Reciprocate in the radial direction. Therefore, the permanent magnet individually applies magnetism to the magnetic bodies 200A, 200B, 200C,..., 200G,.

For example, as shown in FIGS. 15, 16A, 16B, and 18, permanent magnets 20Aa, 20Ac, and 20Ae at the corresponding positions of the magnetic body unit 200A in the upper disk 800A of the magnet arrangement plate 800 in the drawing are The magnetic body / heat transfer portion arrangement plate 700 is in a position facing the magnetic bodies 10Aa, 10Ac, and 10Ae of the magnetic body unit 200A. Further, the permanent magnets 20Ba, 20Bc, and 20Be at the corresponding positions of the magnetic body unit 200B are respectively at positions facing the magnetic bodies 10Bb, 10Bd, and 10Bf of the magnetic body unit 200B. In this state, when the magnet arrangement plate 800 is rotated 30 ° clockwise, the permanent magnets 20Aa, 20Ac, 20Ae at the corresponding positions of the magnetic body unit 200A are opposed to the magnetic bodies 10Ba, 10Bc, 10Be of the magnetic body unit 200B, respectively. It becomes the position to do. In addition, the permanent magnets at the corresponding positions of the magnetic body unit 200L are positions facing the magnetic bodies 10Ab, 10Ad, and 10Af of the magnetic body unit 200A. That is, each time the magnet arrangement plate 800 rotates 30 ° clockwise, the permanent magnets reciprocate for each magnetic body block in each of the magnetic body units 200A, 200B, 200C, ..., 200G, ..., 200L. The positional relationship between the permanent magnet and the magnetic body is the same positional relationship as the positional relationship in FIG. 1A and the positional relationship in FIG. 1B are repeated each time the magnet arrangement plate 800 rotates 30 °.

Therefore, when the magnet arrangement plate 800 is moved in the direction in which the magnetic body units 200A, 200B, 200C,..., 200G, ..., 200L are moved, the positional relationship between the permanent magnet and the magnetic body shifts as follows.

First, as shown in FIGS. 16B and 18A, the permanent magnets 20Aa, 20Ac, and 20Ae are formed of magnetic bodies 10Aa, 10Ac, Magnetism is simultaneously applied to 10Ae. At this time, the heat transfer portions 30Ab, 30Ad, and 30Af of the magnetic body unit 200A are in a heat transfer state, and the heat transfer portions 30Ba, 30Bc, 30Be, and 30Bg are in a heat insulating state.

Also, as shown in FIGS. 16B and 18B, the permanent magnets 20Ba, 20Bc, and 20Be are magnetic bodies 10Bb and 10Bd that are positioned at the other ends of the respective magnetic body blocks 100Ba, 100Bb, and 100Bc of the other adjacent magnetic body unit 200B. 10Bf is simultaneously magnetized. At this time, the heat transfer portions 30Ba, 30Bc, 30Be, and 30Bg of the magnetic body unit 200B are in a heat transfer state, and the heat transfer portions 30Ab, 30Ad, and 30Af are in a heat insulation state.

Also in the other magnetic body units 200C-200L, the positional relationship between the permanent magnet and the magnetic body between two adjacent magnetic body units is the same as in the case of the magnetic body units 200A and 200B. The positional relationship between the permanent magnet and the magnetic body as described above between two adjacent magnetic body units is referred to as state 1.

Next, when the magnet arrangement plate 800 is rotated clockwise by 30 °, the permanent magnets 20Aa, 20Ac, 20Ae are magnetized at one end of each of the magnetic body blocks 100Ba, 100Bb, 100Bc of the other adjacent magnetic body unit 200B. Magnetism is simultaneously applied to the bodies 10Ba, 10Bc, and 10Be. This state is equivalent to the movement of the permanent magnets 20Ba, 20Bc, 20Be shown in FIG. 18B to the left magnetic bodies 10Ba, 10Bc, 10Be. On the other hand, the permanent magnet present at the corresponding position of the magnetic body unit 200L is simultaneously magnetized to the magnetic bodies 10Ab, 10Ad, 10Af located at the other ends of the respective magnetic body blocks 100Aa, 100Ab, 100Ac of one adjacent magnetic body unit 200A. Apply. This state is equivalent to the movement of the permanent magnets 20Aa, 20Ac, 20Ae shown in FIG. 18A to the right magnetic bodies 10Ab, 10Ad, 10Af. Also in the other magnetic body units 200C-200L, the positional relationship between the permanent magnet and the magnetic body between two adjacent magnetic body units changes in the same manner as in the case of the magnetic body units 200A and 200B. The positional relationship between the permanent magnet and the magnetic body as described above between two adjacent magnetic body units is referred to as state 2.

Thus, every time the magnet arrangement plate 800 rotates 30 °, the above-described state 1 and state 2 are repeated in all the magnetic body units 200A, 200B, 200C,..., 200G,. That is, in each magnetic body unit 200A, 200B, 200C, ..., 200G, ..., 200L, the states of FIGS. 1A and 1B are repeated.

Magnetic protrusions are formed on one side of the lower disk 800B that forms the magnet arrangement plate 800 (the upper side of the disk 800B shown in FIGS. 17 and 18). The magnetic protrusions are arranged in correspondence with the arrangement of the permanent magnets arranged on one side of the upper disk 800A. For example, as shown in FIGS. 17 and 18, a magnetic projection 20Ab is arranged corresponding to the permanent magnet 20Aa, a magnetic projection 20Ad is arranged corresponding to the permanent magnet 20Ac, and a magnetic projection 20Af is arranged corresponding to the permanent magnet 20Ae. ing. Further, a magnetic protrusion 20Bb is disposed corresponding to the permanent magnet 20Ba, a magnetic protrusion 20Bd is disposed corresponding to the permanent magnet 20Bc, and a magnetic protrusion 20Bf is disposed corresponding to the permanent magnet 20Be. Receiving the magnetic lines of force from each permanent magnet with magnetic protrusions that confront each other to minimize the magnetic resistance between the permanent magnets and the magnetic protrusions, and to allow the magnetic lines of force from the permanent magnet to pass through the magnetic material without leakage. Because.

The magnet arrangement plate 800 is composed of two magnetically connected flat plates that sandwich the magnetic material / heat transfer portion arrangement plate 700 with a gap. The permanent magnets disposed on the upper disk 800A and the magnetic protrusions disposed on the lower disk 800B form a magnetic circuit between the upper disk 800A and the lower disk 800B. This magnetic circuit constitutes a magnetic application unit.

In the third embodiment, a permanent magnet is used as means for generating magnetism in the magnetic application unit. However, instead of using a permanent magnet, a superconducting magnet or an electromagnet can be used. When the magnetic circuit is composed of an electromagnet, the magnitude of the magnetism applied to the magnetic body can be changed within a certain range, so that the magnetism applying unit can have versatility. However, it is desirable to use a permanent magnet from the viewpoint of energy saving and practicality.

In the third embodiment, a permanent magnet is disposed on the upper disk 800A and a magnetic protrusion is disposed on the lower disk 800B. Conversely, a magnetic protrusion is disposed on the upper disk 800A. It is also possible to arrange a permanent magnet on the lower disk 800B. In the third embodiment, both disks are rotated as a unit. However, both disks may be provided separately as long as they are magnetically connected. Since the upper disc 800A and the lower disc 800B are magnetically connected and the permanent magnet and the magnetic projection are provided opposite to each other, the magnetic flux from the permanent magnet can be effectively utilized, and the permanent magnet can be downsized. Weight reduction is possible.

The magnet arrangement plate 800 is preferably made of a low heat transfer material having a large thermal resistance so as not to let the heat generated by the magnetic bodies 10Aa,... And the heat transferred by the heat transfer units 30Aa,.

When the magnet arrangement plate 800 having the above-described configuration rotates with respect to the magnetic body / heat transfer portion arrangement plate 700, the heat transfer portions 30Ab,... Transmit heat as follows.

First, when the positional relationship between the permanent magnet and the magnetic material is in the state 1 shown in FIGS. 15 and 19, the positional relationship between the heat transfer unit 30 and the magnetic material is shown in FIG. 19A at the corresponding position of the magnetic material unit 200A. As shown.

That is, in the state 1, at the corresponding position of the magnetic body unit 200A, the permanent magnet 20Aa is located on the magnetic body 10Aa, the permanent magnet 20Ac is located on the magnetic body 10Ac, and the permanent magnet 20Ae is located on the magnetic body 10Ae (FIG. 18A, (See FIG. 19A). At this time, magnetism is applied to the magnetic bodies 10Aa, 10Ac, and 10Ae, and no magnetism is applied to the magnetic bodies 10Ab, 10Ad, and 10Af, and the magnetism is removed. At this time, the magnetic bodies 10Aa, 10Ac, and 10Ae generate heat. At the same time, the heat transfer section 30Ab is in a heat transfer state between the magnetic bodies 10Aa and 10Ab, the heat transfer section 30Ad is in the magnetic bodies 10Ac and 10Ad, and the heat transfer section 30Af is in the heat transfer state between the magnetic bodies 10Ae and 10Af. . For this reason, heat transfer between adjacent magnetic bodies in each magnetic body block is performed. That is, the heat generated by the magnetic bodies 10Aa, 10Ac, and 10Ae due to the magnetocaloric effect is transferred to the magnetic bodies 10Ab, 10Ad, and 10Af, respectively. At this time, heat is not transferred between the low temperature side heat exchange unit 40A and the magnetic body 10Aa and between the high temperature side heat exchange unit 40B and the magnetic body 10Af. Also, heat transfer between the magnetic blocks is not performed.

Further, in the corresponding position of the magnetic body unit 200B, the positional relationship between the heat transfer section 30 and the magnetic body is as shown in FIG. 18B.

That is, the corresponding position of the magnetic body unit 200B is such that the permanent magnet 20Ba is positioned on the magnetic body 10Bb, the permanent magnet 20Bc is positioned on the magnetic body 10Bd, and the permanent magnet 20Be is positioned on the magnetic body 10Af (see FIGS. 18B and 19A). At this time, magnetism is applied to the magnetic bodies 10Bb, 10Bd, and 10Bf, and no magnetism is applied to the magnetic bodies 10Ba, 10Bc, and 10Be, and the magnetism is removed. At this time, the magnetic bodies 10Bb, 10Bd, and 10Bf generate heat. At the same time, the heat transfer section 30Ba is between the low temperature side heat exchange section 40A and the magnetic body 10Ba, the heat transfer section 30Bc is between the magnetic bodies 10Bb and 10Bc, and the heat transfer section 30Be is between the magnetic bodies 10Bd and 10Be. The heat transfer unit 30Bg is in a heat transfer state between the magnetic body 10Bf and the high temperature side heat exchange unit 40B. Therefore, heat transfer is performed between the adjacent magnetic bodies 10Bb-10Bc, 10Bd-10Be in the adjacent magnetic body blocks 100Ba, 100Bb, 100Bc. Further, heat is generated between the magnetic body 10Ba located at one end of the magnetic body unit 200B and the low temperature side heat exchange unit 40A and between the magnetic body 10Bf located at the other end of the magnetic body unit 200B and the high temperature side heat exchange unit 40B. Transmission takes place. That is, 10Ba, 10Bc, 10Be are absorbed by the magnetocaloric effect, and heat is generated by the magnetic bodies 10Bb, 10Bd, 10Bf. For this reason, heat moves from the low temperature side heat exchange part 40A to the magnetic body 10Ba, from the magnetic body 10Bb to the magnetic body 10Bc, from the magnetic body 10Bd to the magnetic body 10Be, and from the magnetic body 10Bf to the high temperature side heat exchange part 40B.

As described above, the plurality of magnetism applying units arranged on the magnet arrangement plate 800 are moved relative to the magnet arrangement plate 800 and the magnetic body / heat transfer unit arrangement plate 700 by the relative movement between the magnet arrangement plate 800 and the magnetic body / heat transfer unit arrangement plate 700. The magnetocaloric effect is developed by moving close to and away from the plurality of magnetic bodies arranged in the plate. In addition, the plurality of heat transfer units arranged on the magnetic body / heat transfer unit arrangement plate 700 “switch the heat transfer state and the heat insulation state in accordance with the movement of the magnet arrangement plate 800.

The above state 1 is as shown in FIG. 19A. At the corresponding position of the magnetic unit 200A, heat is transferred between adjacent magnetic bodies in each magnetic block, and between the adjacent magnetic bodies of the adjacent magnetic blocks at the corresponding position of the magnetic unit 200B. In addition, heat is transferred between the magnetic body positioned at one end of the magnetic unit 200B and the low-temperature side heat exchange unit 40A and between the magnetic body positioned at the other end of the magnetic unit 200B and the high-temperature side heat exchange unit 40B. .

When the positional relationship between the permanent magnet and the magnetic body is in the state 1 shown in FIG. 19, the relationship between the heat transfer state of the heat transfer unit and the magnetic body is as shown in FIG. 18A at the corresponding position of the magnetic body unit 200A. It is equivalent. At the same time, at the corresponding position of the magnetic body unit 200B, the relationship between the heat transfer state of the heat transfer section and the magnetic body is equivalent to that shown in FIG. 18B.

Next, when the magnet arrangement plate 800 is rotated 30 ° clockwise, and the positional relationship between the permanent magnet and the magnetic body is in the state 2 shown in FIG. 19B, the heat transfer section 30 is at the corresponding position of the magnetic body unit 200A. The positional relationship between the magnetic body and the magnetic body is equivalent to that shown in FIG. 18B. At the same time, at the corresponding position of the magnetic body unit 200B, the positional relationship between the heat transfer section 30 and the magnetic body is equivalent to that shown in FIG. 18A. The positional relationship between the permanent magnet and the magnetic body in the state 2 is obtained by reversing the positional relationship between the permanent magnet and the magnetic body in the state 1 between adjacent magnetic units.

State 2 above is as shown in FIG. 19B. At the corresponding position of the magnetic body unit 200A, between the adjacent magnetic bodies of the adjacent magnetic body blocks, between the magnetic body located at one end of the magnetic body unit 200A and the low-temperature side heat exchange unit 40A, and between the magnetic body units 200A. Heat is transmitted between the magnetic body located at the other end and the high temperature side heat exchanging section 40B, and heat is transmitted between adjacent magnetic bodies in each magnetic body block at the corresponding position of the magnetic body unit 200B. .

As described above, when the heat transfer portion of the magnet arrangement plate 800 is in the state 1, the heat transfer portion transfers heat between adjacent magnetic bodies in each magnetic block of one adjacent magnetic body unit and the other magnetic body. Between adjacent magnetic bodies of adjacent magnetic body blocks of the body unit, between the magnetic body located at one end of the other magnetic body unit and the low temperature side heat exchange section, and at the other end of the other magnetic body unit Heat is transferred between the magnetic body located at the high temperature side and the high temperature side heat exchange part. In state 2, heat is transferred between adjacent magnetic bodies in each magnetic block of the other adjacent magnetic body unit, and adjacent magnetic bodies of adjacent magnetic body blocks of one magnetic body unit are transferred. And between the magnetic body located at one end of the one magnetic body unit and the low-temperature side heat exchange section and between the magnetic body located at the other end of the one magnetic body unit and the high-temperature side heat exchange section. Heat to and from.

17 and 18 has a magnetic body / heat transfer portion arrangement plate 700 for relatively moving the magnetic body / heat transfer portion arrangement plate 700 and the magnet arrangement plate 800 in the arrangement direction of the magnetic unit. Alternatively, either one of the magnet arrangement plates 800 is rotated. Any type of electric motor can be used as the drive unit as long as it can rotate the magnetic body / heat transfer unit arrangement plate 700 and the magnet arrangement plate 800. In the present embodiment, the magnet arrangement plate 800 is rotated with its central portion as the rotation axis.

The low temperature side heat exchange unit 40A and the high temperature side heat exchange unit 40B are provided with a mechanism capable of exchanging heat with an external environment such as indoor air. For example, a mechanism may be adopted in which a refrigerant is supplied from the outside and heat exchange with the external environment can be performed via the refrigerant.

The magnetic air conditioner 500 according to the present embodiment configured as described above performs magnetic refrigeration as follows.

First, when the drive unit is actuated to rotate the magnet arrangement plate 800 clockwise or counterclockwise, the state shown in FIGS. 1A and 1B, that is, FIG. 19A and FIG. The state of 19B is repeated. That is, state 1 and state 2 are repeated. By repeating this, in each magnetic unit, heat is transferred from the low temperature side heat exchange section 40A to the high temperature side heat exchange section 40B.

At this time, also in the third embodiment, since the magnetic material having the starting temperature within the operating temperature range is mixed with at least the lowest temperature side and the higher temperature side magnetic body, the steady state is reached quickly from the starting time. Can do. That is, the steady state is reached while the number of rotations of the magnet arrangement plate 800 is small compared to a magnetic air conditioner having the same configuration using a conventional magnetic body.

When the final steady state is reached, the temperature of the low temperature side heat exchange unit 40A can be lowered and the temperature of the high temperature side heat exchange unit 40B can be increased, and the low temperature side heat exchange unit 40A and the high temperature side heat exchange unit 40B can be increased. A temperature difference can be produced between them.

In the case of configuring a magnetic air conditioner with a large refrigerating capacity, the number of magnetic blocks arranged in series is increased and connected to the low temperature side heat exchange unit 40A and the high temperature side heat exchange unit 40B. By increasing the number of magnetic blocks arranged in series, the temperature difference between the low temperature side heat exchange unit 40A and the high temperature side heat exchange unit 40B can be increased. In such a case as well, a magnetic material whose starting temperature is in the operating temperature range is mixed with at least the lowest temperature side and the higher temperature side magnetic body. In addition, in the case of a magnetic cooling / heating device with a large refrigerating capacity, not only the magnetic material at the lowest temperature side and the high temperature side but also the magnetic material arranged between the magnetic material at the lowest temperature side and the high temperature side and the magnetic material at the starting temperature. In this case, it is preferable to mix a magnetic material having a starting temperature.

The magnetic air conditioner of Embodiment 3 is applied to an air conditioner that performs indoor air conditioning, a refrigerator, an air conditioner that performs air conditioning of a vehicle interior, in addition to a vehicle refrigeration apparatus (particularly a cooling device for a fuel cell or a secondary battery). be able to.

In the third embodiment, an example in which permanent magnets and magnetic protrusions are arranged on the magnet arrangement plate 800 is illustrated. Thus, if a permanent magnet and a magnetic protrusion are integrally formed, the magnet arrangement | positioning board 800 can be reduced in size and weight.

Furthermore, in the third embodiment, the magnetic body / heat transfer portion arrangement plate 700 and the magnet arrangement plate 800 are illustrated in a disk shape, and both plates are relatively rotated. And the magnet arrangement | positioning board 800 may be made into flat form, and both plates may be reciprocated relatively linearly.

When the magnetic cooling / heating apparatus is configured as described above, magnetic refrigeration can be performed only by relatively moving the magnetic body / heat transfer portion arrangement plate 700 and the magnet arrangement plate 800 in the arrangement direction of the magnetic body unit. The configuration of the magnetic air conditioner can be simplified, and downsizing, weight reduction, and cost reduction can be realized.

(Embodiment 4)
Embodiment 4 is a form in which the gaps in the two heat transfer units are connected by a communication path.

FIG. 21 is a cross-sectional view showing a configuration in which the gaps in the two heat transfer units are connected by a communication path in the magnetic air conditioning apparatus according to the fourth embodiment. This cross-sectional view shows the same cross-sectional position as in FIGS.

As shown in the figure, in the fourth embodiment, the gaps 20 in the two heat transfer portions 30a and 30b are connected by the communication path 50. The open end 24 of the gap 20 is covered with a lid portion 55 that covers these open ends 24 to form a sealed space 56. The inside of the sealed space 56 formed by the lid portion 55 is filled with an inert gas. For example, helium can be used as the inert gas.

The fourth embodiment is the same as any one of the first to third embodiments except that the communication path 50 and the lid 55 are provided in the heat transfer parts 30a and 30b. Omitted.

The communication path 50 connects the gaps 20 between the heat transfer section 30a and the heat transfer section 30b so that the liquid metal 18 can move. In the figure, the communication passage 50 is connected without providing a liquid reservoir. However, as in the first embodiment, the liquid transfer reservoirs 50a and 30b are provided with respective liquid reservoirs. May be connected by the communication path 50.

The wirings 111a and 112a of the heat transfer unit 30a and the wirings 111b and 112b of the heat transfer unit 30b constitute the upper substrate 100 independently of each other. For this reason, the insulating material 52 is provided between the wiring 111a and 112a located between the heat transfer parts 30a and 30b and the wiring 111b and 112b. The insulating material 52 may be the same member as the insulating layer 113, or may be provided separately to insulate the wiring.

By using such wiring, both the heat transfer units 30a and 30b can be operated independently. Here, when one is off, the other is on. That is, when the heat transfer unit 30a side is off, no voltage is applied to the first and second electrodes 12 and 14 on the heat transfer unit 30a side, and the first and second electrodes on the heat transfer unit 30b side are not applied. A voltage is applied to 12 and 14 and they are on.

Thus, if the heat transfer part 30a side is off and the heat transfer part 30b side is on, as shown in the figure, the gap 20 on the heat transfer part 30a side disappears, while the gap 20 on the heat transfer part 30b side disappears. Will be filled with the liquid metal 18. Thereby, the heat transfer part 30a side is a heat insulation state, and the heat transfer part 30b side is a heat state.

From this state, when the heat transfer unit 30a side is switched on and the heat transfer unit 30b side is switched off, the liquid metal 18 flows through the communication path 50 and moves from the gap 20 on the heat transfer unit 30b side to the gap 20 on the heat transfer unit 30a side. To do.

This is because the gap 20 on the heat transfer section 30a side that is turned on rises the liquid a metal 17 by electrowetting, while the gap 20 on the heat transfer section 30b side that is turned off no longer applies voltage. This is because the liquid metal 18 descends in the gap 20. Electrowetting is as described in the first embodiment.

By such movement of the liquid metal 18, in the fourth embodiment, the gap 20 on the heat transfer section side that is turned on functions as a liquid storage section for the gap 20 on the heat transfer section side that is turned off. become.

It is preferable that the internal wall surface of the communication path 50 has liquid repellency with respect to the liquid metal 18 so that the liquid metal 18 can easily move. For example, a liquid repellent coating layer (not shown) may be provided in the same manner as the gap 20, or the inner wall surface itself may be liquid repellent processed.

The lid portion 55 forms one sealed space 56 that covers at least the open end 24 of each gap 20 between the heat transfer portions 30a and 30b connected by the communication path 50. The liquid metal 18 is prevented from being oxidized by filling the sealed space 56 formed by the lid portion 55 with an inert gas.

The liquid metal 18 is still a metal. For this reason, it is oxidized when exposed to air for a long time. Although the degree of oxidation varies depending on the composition of the liquid metal, it is possible to prevent the oxidation of the liquid metal 18 by providing the sealed space 56 and filling the inside with an inert gas, thereby extending the life of the apparatus. it can. In particular, when galinstan mentioned as an example of the liquid metal is used, oxidation of galinstan can be prevented.

In the illustrated example, the open ends 24 of the gaps 20 of the heat transfer portions 30a and 30b connected by the communication passage 50 are covered with the lid portion 55, but instead, the entire magnetic air conditioner (at least) A plurality of heat transfer units) may be placed in a sealed casing, and the entire interior of the casing may be used as a sealed space, and an inert gas may be placed therein.

It is also possible to apply the first embodiment by providing the sealed space 56 with such a casing covering the entire apparatus and filling the inside with an inert gas to prevent the liquid metal 18 from being oxidized. In particular, in Embodiment 1, not only the open end 24 where each heat transfer unit 30 is independent, but also a hole 25 is provided on the liquid reservoir 17 side so that gas can enter and exit. For this reason, it is possible to prevent oxidation not only from the open end 24 of the gap 20 but also from the hole 25 by putting the entire apparatus in a casing and filling the inside with an inert gas.

In addition, instead of filling with an inert gas, the inside of the sealed space 56 may be evacuated (depressurized state) so that air (mainly oxygen and moisture) does not enter. In that case, it is preferable that the inside of the sealed space 56 is purged with an inert gas and then sealed under reduced pressure. By reducing the pressure after purging, the inside of the sealed space is filled with a slight amount of inert gas, so that oxidation of the liquid metal can be prevented.

The heat transfer units 30a and 30b connected by the communication path 52 may be connected in any way as long as the heat transfer units that are turned on when one is turned on are connected to each other. In the example shown in FIG. 21, the cross sections of the heat transfer portions 30a and 30b adjacent to each other in the direction in which heat is transferred are not limited to this.

For example, as in the third embodiment, in a device in which magnetic bodies and heat transfer units are concentrically arranged, circumferential heat transfer units may be connected to each other. Specifically, referring to FIG. 16A, heat transfer units 30Aa and 30Ba are connected, 30Bb and 30Ab are connected, 30Ac and 30Bc are connected, 30Bd and 30Ad are connected, 30Ae and 30Be are connected, 30Bf and 30Af are connected, and 30Ag and 30Bg are connected. As described above, in the apparatus in which the magnetic body and the heat transfer section are concentrically arranged, the capacities of the gaps 20 can be made the same by connecting in the circumferential direction.

Further, for example, a part may be a circumferential direction and another part may be a heat transfer direction. Specifically, referring to FIG. 16A, the heat transfer units 30Aa and 30Ba are connected. Then, 30Bb and 30Ac are connected, 30Bd and 30Ae are connected, and 30Bf and 30Ag are connected. Similarly, 30Ab and 30Bc are connected, 30Ad and 30Be are connected, and 30Af and 30Bg are connected.

In this case, since the magnetic body and the heat transfer portion are arranged concentrically, the capacities of the gaps 20 are different between the heat transfer portions connected in the heat transfer direction. Therefore, when the gaps have different capacities, the capacities of both may be made uniform by changing the interval of one of the gaps.

Furthermore, three or more heat transfer units may be connected by a communication path. In this case, when at least one of the three or more connected heat transfer units is turned on, at least one of the other heat transfer units is always turned off. Become. In this case, when at least one heat transfer unit is off, the liquid metal is accommodated in the gap between the heat transfer units that are on. For this reason, the capacity | capacitance which a liquid metal can mutually accommodate is set as the relationship of ON and OFF. If only one heat transfer section turned on is turned off and the liquid metal from the heat transfer section cannot be accommodated, a liquid reservoir is provided in the middle of the communication path and adjusted accordingly. Also good.

As one form of connecting the three or more heat transfer units, for example, in the case of the third embodiment, a form in which all the heat transfer units are connected by a communication path may be used.

However, when three or more heat transfer parts are connected, the communication path is inevitably long, and the amount of liquid metal that stays in the communication path increases accordingly. A configuration in which two heat transfer units are connected is most preferable.

Here, the operation of the fourth embodiment will be described by taking an example of connecting two heat transfer units.

Here, a heat exchanger model using the magnetic air conditioner of Embodiment 4 was created to simulate the heat exchange state.

FIG. 22 is a diagram showing an air conditioning circulation system using the magnetic air conditioning apparatus according to the fourth embodiment. In the heat exchanger model shown in FIG. 22, the overall configuration of the magnetic cooling and heating apparatus 500 is the same as that of the third embodiment, but only the configuration of the heat transfer unit is modeled so as to be the fourth embodiment. That is, two heat transfer parts in the circumferential direction are connected to each other. Specifically, as already described, referring to FIG. 16A, heat transfer units 30Aa and 30Ba are connected, 30Bb and 30Ab are connected, 30Ac and 30Bc are connected, 30Bd and 30Ad are connected, and 30Ae and 30Be are connected. Are connected, 30Bf and 30Af are connected, and 30Ag and 30Bg are connected.

As shown in the figure, in the heat exchanger model, a low temperature side heat exchanger 630 is connected to the low temperature side heat exchange section 40A (see Embodiment 3) of the magnetic cooling and heating apparatus 500, and the high temperature side heat exchange section 40B (implemented). A high-temperature side radiator 730 is connected to the third embodiment). The low temperature side radiator 630 is connected to the air inlet and outlet of the inner refrigerant passage 600 via the inner refrigerant passage pump 780. The high temperature side radiator 730 is connected to the air inlet and outlet of the outer refrigerant passage 720 via the outer refrigerant passage pump 790.

The inner peripheral refrigerant passage pump 780 controls the flow rate of the refrigerant flowing through the inner peripheral refrigerant passages 600A-600F. The peripheral refrigerant passage pump 790 controls the flow rate of the refrigerant flowing through the outer peripheral refrigerant passage 720.

The cold air generated in the inner peripheral refrigerant passage 600 is supplied to the low-temperature side radiator 630 and is heat-exchanged with the external air forcedly blown by the low-temperature side radiator fan 630F. The air after the heat exchange is returned to the inner peripheral refrigerant passage 600 and cooled. Further, the hot air generated in the outer peripheral refrigerant passage 720 is supplied to the high-temperature side radiator 730, and heat exchange is performed with the external air forcedly blown by the high-temperature side radiator fan 730F. The air after heat exchange returns to the outer refrigerant passage 720 and is heated again. The low temperature side radiator 630 cools outside air, and the high temperature side radiator 730 heats outside air. In such a heat exchanger model, calculate the heat switching frequency of the heat transfer section that is closely related to the heat transfer rate. FIG. 23 is a flowchart showing a procedure for calculating the thermal switching frequency.

First, in the heat exchanger model shown in FIG. 22, a desired temperature is set as a set temperature as a temperature of a predetermined space (for example, assuming a vehicle interior), and a required heat amount and a required temperature difference corresponding to this temperature are input. (S10).

Referring to the capacity of the predetermined space, the current temperature in the predetermined space, and the set temperature in the predetermined space, the required amount of heat required for setting the predetermined space in the predetermined space is obtained. Further, the difference between the temperature of the air flowing out from the outer peripheral refrigerant passage and the temperature of the air flowing out from the inner peripheral refrigerant passage is obtained. The obtained values are input as the required heat amount and the required temperature difference.

Next, the switching operation frequency f of the heat transfer unit in which the input required heat amount and the required temperature difference are set in advance is input. Here, the switching operation frequency f is one cycle from on to off until it is turned on again. Also, the air temperature that serves as a reference for the temperature of the air flowing into the outer refrigerant passage from the magnetic calorific material ambient temperature, the temperature of the air that flows out of the outer refrigerant passage from the temperature that is half the required temperature difference from the magnetic calorific material ambient temperature, and the magnetic calorific value The air temperature serving as a reference for the temperature of the air flowing into the inner peripheral refrigerant passage from the material ambient temperature, and the temperature of the air flowing out from the inner peripheral refrigerant passage from a temperature half the required temperature difference from the ambient temperature of the magnetic calorific value material are input. Further, the air flow rate of the outer periphery refrigerant passage pump 780 that supplies the refrigerant to the outer periphery refrigerant passage and the air flow rate of the inner periphery refrigerant passage pump 790 that supplies the refrigerant to the inner periphery refrigerant passage are also input. Further, the air volume of the low-temperature side radiator fan 630F and the air volume of the high-temperature side radiator fan 730F are also input (S20).

In this state, the magnetic air conditioner 500 is operated. Specifically, in order to realize the input operating frequency f, the heat transfer unit is switched as described in the third embodiment.

Subsequently, the amount of heat generated by the magnetic air conditioner 500 estimated based on the ambient temperature of the magnetocaloric material, the temperatures of the low temperature side heat exchange unit 450A and the high temperature side heat exchange unit 450B, and the operating frequency f is an error from the required heat amount. It is determined whether it is within the range (S30). The error range is set in advance. If the generated heat amount is not within the error range (S30: NO), the operating frequency f is changed so as to be within the error range (S40). Specifically, if the amount of heat generated by the magnetic cooling / heating device 500 is considerably smaller than the required amount of heat, the switching frequency of the heat transfer unit is increased in order to increase the amount of heat generated. Conversely, if the amount of heat generated by the magnetic cooling / heating device 500 is too large than the required amount of heat, the switching frequency of the heat transfer unit is decreased in order to decrease the amount of heat generated.

If the amount of generated heat is within the error range (S30: YES), the temperature of the air at the inlet of the outer refrigerant passage and the temperature of the air at the inlet of the inner refrigerant passage are respectively the outer refrigerant passage and the inner refrigerant. The temperature of the air flowing into the passage serves as a standard for the temperature of the air, and the temperature of the air at the outlet of the outer refrigerant passage and the temperature of the air at the outlet of the inner refrigerant passage are respectively set to the outer peripheral refrigerant. It is determined whether the temperature of the air flowing out of the passage and the inner refrigerant passage is within an error (S50). The error range is set in advance.

If the temperature of the air at the inlet and outlet of the outer refrigerant passage and the inner refrigerant passage is not within the error (S50: NO), the outer refrigerant passage for flowing air to the outer refrigerant passage so as to be within the error range While changing the air flow rate of the inner peripheral refrigerant passage pump 790 for flowing air to the pump 780 and the inner peripheral refrigerant passage, the air flow rates of the low temperature side radiator fan 630F and the high temperature side radiator fan 730F are changed (S60).

If the temperature of the air flowing into the outer peripheral refrigerant passage and the inner peripheral refrigerant passage and the temperature of the air flowing out from the outer peripheral refrigerant passage and the inner peripheral refrigerant passage are within the error (S50: YES), the process is terminated.

Thus, it is possible to obtain the operating frequency f of the heat transfer unit necessary for the amount of heat exchanged by the heat exchanger to be within a predetermined range (the value of the last frequency changed by S40).

Next, the response characteristics were estimated in a model in which two heat transfer units communicated (referred to as a communication model). FIG. 24 is a perspective view showing a heat transfer portion shape model (communication model) when trial calculation of response characteristics when two heat transfer portions communicate with each other.

In this trial calculation, the direction of the surface tension T and the shear stress (wall surface) τ acting on the liquid metal 18 is different from that in FIG. 10 and the gap wall surface becomes lyophilic with respect to the liquid metal 18. The height at which the liquid metal 18 rises is h1 and h2 for each heat transfer section. The rest is the same as described with reference to FIG.

In this communication model, since the liquid metal 18 moves back and forth through the communication path 50, the total value of h1 and h2 is always 1 mm. That is, h1 + h2 = 1 mm.

Then, the response characteristics were estimated using the procedure described in FIG. In this trial calculation, it is the time until the state of h1 = 1 mm and h2 = 0 mm as the initial state and the state of h1 = 0 and h2 = 1 mm. Similarly, the response characteristics based on the model (referred to as an independent model) of two heat transfer units that operate independently by the liquid pool shown in FIG. 5 were also estimated. That is, one of the two independent heat transfer parts is turned off to turn off the liquid metal from the gap (h = 1 mm becomes h = 0 mm), and the other is turned off to turn on to fill the gap with the liquid metal. (H = 0 mm becomes h = 1 mm).

Also, the calculation was made by changing the distance dg of the gap 20 with only the contact angle = 60 °.

Results are shown in FIG. FIG. 25 shows the result of calculating the time required for one liquid metal to rise by 1 mm and the other liquid metal to become 0 mm at the same time in two heat transfer sections by changing the gap interval with the contact angle = 60 °. It is a graph to show.

As can be seen from FIG. 25, in the gap interval dg where the operating frequency is between 50 Hz and 100 Hz, when compared with the same gap interval, the communication model has a higher operating frequency by about 30% than the independent model. . This indicates that the two heat transfer portions can be operated faster by communicating with each other through the communication path.

(Embodiment 5)
In the fifth embodiment, only the configuration of the heat transfer unit is different from that of the other embodiments, and the configuration other than the heat transfer unit is the same as that of the third embodiment. Moreover, the member which has the same function attached | subjected the same code | symbol, and a part or all of description was abbreviate | omitted about the member of the same code | symbol.

FIG. 26 is a top view of the magnetic material / heat transfer portion arrangement plate portion of the fifth embodiment.

The basic form of the fifth embodiment is the same as that of the third embodiment. That is, it has each magnetic body unit 200A, 200B, 200C, ..., 200G, ..., 200L. In the magnetic body units 200A, 200B, 200C,..., 200G,..., 200L, six magnetic bodies are arranged from the center portion of the magnetic body / heat transfer portion arrangement plate 700 toward the outer peripheral portion. For example, the magnetic body unit 200A arranges magnetic bodies 10Aa, 10Ab, 10Ac, 10Ad, 10Ae, and 10Af, and the magnetic body unit 200B arranges magnetic bodies 10Ba, 10Bb, 10Bc, 10Bd, 10Be, and 10Bf, respectively. Each magnetic body is a positive magnetic body whose temperature rises when magnetism is applied. It is made of magnetic material suitable for each operating temperature range.

Also, as already described in the third embodiment, the application of magnetism to each magnetic body is performed by a magnet arrangement plate (see FIG. 16B). Accordingly, when viewed as a single magnetic body unit, the direction in which the magnet rotates intersects the direction in which the magnetic bodies are arranged with a gap therebetween. The magnet is a permanent magnet that rotates in the circumferential direction.

In the fifth embodiment, focusing on the magnetic body unit 200A, between each of the magnetic bodies 10Aa to Af, between the low temperature side heat exchange unit 40A and the magnetic body 10Aa, and between the magnetic body 10Af and the high temperature side heat exchange unit 40B. Are provided in the direction intersecting the row direction of the magnetic bodies, that is, in the circumferential direction. The liquid metal 18 moves in the gap 300. The gap 300 is independent between each of the magnetic bodies 10Aa to Af, between the low temperature side heat exchange section 40A and the magnetic body 10Aa, and between the magnetic body 10Af and high temperature side heat exchange section 40B. , 200G,..., 200L are formed in a circular shape so as to penetrate the units 200A, 200B, 200C,.

The liquid metal 18 is arranged so that one magnetic body is separated and always moves in synchronism in both the circumferential direction and the row direction of the magnetic bodies. That is, in the illustrated state, when the heat transfer units 30Ba, 30Bc, 30Be, and 30Bg are located at the positions of the magnetic bodies in the magnetic unit 200A, the heat transfer units 30Bb, 30Bd, It is moved so that it is at the position of 30Bf. The liquid metal 10 conducts heat transfer at these positions.

FIG. 27 is an enlarged schematic diagram of the gap portion. In this figure, a gap portion extending over two magnetic body units is shown.

A gap 300 is formed between the magnetic bodies 10 and 10 ′ arranged in the row direction. In the gap 300, the dielectric 13 and the first electrode 12 are formed in this order from the gap side on one wall surface of the gap. Further, the second electrode 14 is formed side by side on the same wall surface in a state of being electrically insulated separately from the first electrode 12 (here, physically separated). The dielectric 13 and the second electrode are exposed on one wall surface of the gap 300. And the liquid metal 18 is arrange | positioned so that the inside of this clearance gap 300 may be moved. Therefore, the liquid metal 18 is electrically connected to the second electrode 14 and insulated from the first electrode 12 by the dielectric 13.

The first electrode 12 and the second electrode 14 are connected to the electric circuit 301. In one electric circuit 301, one first electrode 12 and one second electrode 14 are connected in a pair. The first electrode 12 and the second electrode 14 are provided in two pairs in the length of one magnetic body in the circumferential direction, and can be switched independently by the electric circuit 301.

In the figure, the first electrode 12 and the second electrode 14 are connected to one electric circuit 301 one by one. However, in the actual circuit configuration, each first electrode 12 is shown. As long as the second electrode 14 can be individually switched, any circuit configuration may be used.

Furthermore, a position sensor (position detector) 302 for detecting the position of the liquid metal 18 is provided on the wall surface in the gap 300. As the position sensor 302, for example, a resistance sensor whose resistance value changes depending on the liquid metal 18 can be used. More specifically, for example, two electrodes that are exposed on the wall surface and insulated from each other are provided, and the resistance value between the two electrodes changes by simultaneously touching the liquid metal between the two electrodes. Such a simple sensor may be used. Of course, any other material can be used as long as the position of the liquid metal 18 can be detected.

In the fifth embodiment, the position sensor 302 is disposed on the wall surface facing the wall surface where the second electrode 14 is exposed. Thereby, it can be detected that the liquid metal 18 has passed between the first electrodes 12 arranged in the circumferential direction.

Further, the gap 300 is a sealed space, and the inside thereof is filled with vacuum (depressurized state) or inert gas. This prevents the liquid metal from being oxidized. If the liquid metal 18 is resistant to oxidation, it is not necessary to fill with a vacuum or an inert gas. However, it is preferable to seal so that the liquid metal 18 does not leak.

The length of the liquid metal 18 in the circumferential direction (ML in the drawing) is one lump of liquid metal 18, and it is necessary to perform heat transfer and heat insulation. Is necessary.

If one lump of liquid metal 18 is detected by the position sensor 302, the first electrode 12 and the second electrode 14 immediately after the position sensor 302 are energized, and the liquid metal 18 and the first electrode 12 are energized. Capacitors are formed. On the end side (in the direction of the arrow in the figure) where such a capacitor is formed, the contact angle θ with the wall surface of the liquid metal 18 becomes 90 ° or less. Thereby, the liquid metal 18 proceeds in the direction of the arrow shown in the figure.

Although not shown, a liquid repellent coating layer may be provided on the wall surface (including the exposed surface of the dielectric 13) other than the surface of the second electrode 14 as in the other embodiments. Further, a liquid repellent coating layer may be provided on the surface of the second electrode 14 so as not to interfere with the conductivity with the liquid metal 18 (or to be in a conductive state).

In the fifth embodiment, the liquid pool in the first embodiment (see FIG. 9) or the passage in the fourth embodiment (see FIG. 21) is unnecessary. In the fifth embodiment, since the liquid metal 18 is moved in the circumferential direction to function as a thermal switch, a liquid reservoir and a passage for storing the liquid metal 18 are not necessary. Because.

FIG. 28 is an explanatory diagram for explaining a state in which the liquid metal advances. In this figure, the electric circuits are denoted by 301a, 301b, 301c, and 301d from the left in the figure for explanation. For the sake of explanation, the position sensors are denoted by 302a, 302b, 302c, and 302d from the left in the drawing. First, in step 1, the liquid metal 18 passes through the position sensor 302b, and the electric circuits 301a and 301b are on. , And others indicate the off state.

When the liquid metal 18 moves from the state of step 1 to the state of step 2, it is detected by the position sensor 302c before the electric circuit 301c that the liquid metal 18 has come. This turns on the electric circuit 301c. At this time, in the first electrode 12 portion where the liquid metal 18 has reached, the contact angle θ between the tip of the liquid metal and the wall surface is 90 ° or less. For this reason, the liquid metal 18 travels with a driving force generated in the direction of the arrow shown in the drawing. On the other hand, since the position sensor 302a does not detect the liquid metal 18, the electric circuit 301a is turned off accordingly. Then, since the capacitor component is not generated between the rear end side of the liquid metal 18 and the first electrode 12, the contact angle θ with the wall surface becomes 90 ° or more. For this reason, the liquid metal 18 does not generate a driving force in the backward direction (opposite to the arrow). In this way, the driving force in the direction of the arrow further acts on the liquid metal 18.

Similarly, when the liquid metal 18 moves to the state of step 3, it is detected by the position sensor 302d. This turns on the electric circuit 301d. On the other hand, when it is no longer detected by the position sensor 302b, the electric circuit 301b is turned off. In this way, the driving force in the direction of the arrow acts on the liquid metal 18 to continue the movement.

Thus, by sequentially applying a voltage between the paired first electrode 12 and second electrode 14 in the order in which the liquid metal 18 is detected by the position sensor 302, the liquid metal 18 is moved in one direction. Can be moved.

FIG. 29 is a graph for explaining the positional relationship between the position sensor and the liquid metal. This graph is a three-dimensional graph in which the x-axis direction is time elapsed, the y-axis direction is the position sensor on (ON) and off (OFF) state, and the z-axis direction is the position of the liquid metal.

As shown in the figure, the position sensor 302b is turned on when the liquid metal 18 moves and reaches the position sensor 302b (the state of step 1 in FIG. 28). Thereafter, while the position sensor 302b detects the liquid metal 18, the ON state continues. When the liquid metal 18 is no longer detected, it is turned off.

When the liquid metal 18 further moves and reaches the position sensor 302c, the position sensor 302c is turned on (state of step 2 in FIG. 28). Thereafter, while the position sensor 302c detects the liquid metal 18, the on state continues. When the liquid metal 18 is no longer detected, it is turned off.

When the liquid metal 18 further moves and reaches the position sensor 302d, the position sensor 302d is turned on (state of step 3 in FIG. 28). Thereafter, while the position sensor 302d detects the liquid metal 18, the ON state continues. When the liquid metal 18 is no longer detected, it is turned off.

FIG. 30 is a graph for explaining the position of the liquid metal and the application state of the voltage between the first electrode and the second electrode by the electric circuit. In this graph, the x-axis direction is time elapsed, the y-axis direction is the application state of the voltage between the first electrode and the second electrode (eV is applied and 0V is not applied), and the z-axis direction is the position of the liquid metal. It is a three-dimensional graph.

As shown in the drawing, when the liquid metal 18 moves and reaches the position sensor 302b, a voltage of eV is applied to the electric circuit 301b. Thereafter, while the position sensor 302b detects the liquid metal 18, voltage application by the electric circuit 301b is continued. When the liquid metal 18 is no longer detected, voltage application by the electric circuit 301b is not performed (that is, 0V).

Further, when the liquid metal 18 moves and reaches the position sensor 302c, an eV voltage is applied to the electric circuit 301c. Thereafter, while the position sensor 302b detects the liquid metal 18, the voltage application by the electric circuit 301c is continued. When the liquid metal 18 is no longer detected, voltage application by the electric circuit 301c is not performed (that is, 0V).

Further, when the liquid metal 18 moves and reaches the position sensor 302d, an eV voltage is applied to the electric circuit 301d. Thereafter, while the position sensor 302d detects the liquid metal 18, the voltage application by the electric circuit 301d is continued. When the liquid metal 18 is no longer detected, voltage application by the electric circuit 301d is not performed (that is, 0 V).

FIG. 31 is a flowchart showing a control procedure for synchronizing the liquid metal and the position of the magnet that applies magnetism to the magnetic material.

First, the angular velocity vm and phase of the magnet arrangement plate are input (S1). Here, the angular velocity vm of the magnet arrangement plate is a value obtained by dividing the angle (Mθ in FIG. 26) when the magnet arrangement plate 800 is moved by the length of the magnetic body in the circumferential direction by time t. In the present embodiment, since there are twelve magnetic blocks 200A to 200L in the circumferential direction, the value is obtained by dividing 30 degrees by the time to move, which is determined in advance by the cooling / heating capacity. The phase is where in the magnet block 200A to 200L the position where the innermost magnet exists in the magnet arrangement plate 800.

Subsequently, the moving angular velocity vL and phase of the liquid metal are calculated. The movement angular velocity vL of the liquid metal is an angular velocity when the liquid metal moves by one circumferential length of the magnetic body. In this embodiment, 12 magnetic body blocks 200A to 200L are arranged in the circumferential direction. Therefore, the angle is 30 degrees, and this is a value divided by the time from when the position sensor (for example, 302b) is turned on until the next position sensor (for example, 302c) is turned on. The phase is a position corresponding to the magnetic material in which the liquid metal currently exists.

Subsequently, it is determined whether the phases of the magnet arrangement plate 800 and the liquid metal 18 are the same (S3). Here, when the phase is the same, for example, when the magnet is on the innermost magnetic body, the liquid metal is inside the magnetic body, and the thermal switch of this portion is turned on. The same applies to the relationship between the magnet position on the Tao magnetic body and the liquid metal inside. If the phases are the same (S3: YES), the process proceeds directly to S4. On the other hand, if the phases are different (S3: NO), both the voltage between the first and second electrodes and the application time are increased (S5). Thereby, the moving speed of the liquid metal is accelerated so that the phases are matched. Thereafter, the process returns to S2.

In S3, when the phases are the same, it is subsequently determined whether or not the absolute value of the difference between the angular velocity vm of S1 and the angular velocity vL of S2 is equal to or less than a predetermined value (S4). Here, the predetermined value is an allowable range for the position of the magnet and the position of the liquid metal to move together. For example, the circumferential interval between the magnetic blocks 200A to 200L (the magnetic bodies arranged in the circumferential direction) Since a difference of about a gap) is acceptable, a speed difference that falls within the difference is set as a predetermined value.

Here, if it is not less than the predetermined value (S4: NO), both the voltage between the first and second electrodes and the application time are increased (S5). Thereby, the moving speed of the liquid metal is accelerated. Thereafter, the process returns to S2.

On the other hand, if it is less than the predetermined value (S4: YES), the process returns to S1, and the subsequent processing is continued until the entire apparatus is stopped.

As described above, the magnet position on the magnet arrangement plate and the on / off of the heat transfer unit (thermal switch) by the liquid metal 18 are synchronized.

As described above, in the fifth embodiment, the liquid metal 18 is moved in one direction. For this reason, compared with the case where liquid metals, such as Embodiment 1 and 4 mentioned above, are reciprocated, the movement of a liquid smoother is attained. In addition, since the liquid metal only moves in one direction, once the liquid metal starts moving, high-speed movement is possible with a smaller driving force (ie, low applied voltage) (where driving force = surface tension−friction force− Body force).

In the fifth embodiment, two pairs of the first electrode 12 and the second electrode 14 are arranged in the length of one magnetic body in the circumferential direction, but the present invention is not limited to this. For example, as many as 3 pairs, 4 pairs, etc. may be arranged in the length of one magnetic body in the circumferential direction, or vice versa.

Also, as long as the rotational speed (angular speed) of the magnetic material arranging plate and the moving speed (angular speed) of the liquid metal can be the same speed, the position sensor (position detector) may be omitted. For example, the moving speed (angular speed) of the liquid metal is adjusted in advance so as to match the rotational speed (angular speed) of the magnetic material arranging plate, and thereafter, the current is sequentially applied between the first and second electrodes so as to maintain the speed. Even if it does, it can synchronize to some extent. In particular, when the rotation speed of the magnetic material arranging plate is slow, such control is possible. However, when the rotating speed of the magnetic material arranging plate is high, the configuration and control described in the fifth embodiment are used. Is preferred.

Further, the first electrode 12 and the dielectric 13 and the second electrode 14 are arranged on one wall surface in the gap 300, but the present invention is not limited to this, and may be arranged on opposing wall surfaces in the gap 300.

According to the first to fifth embodiments described above, the following effects are obtained.

(1) In the first to fifth embodiments, a heat transfer section is provided between a plurality of magnetic bodies arranged in a row, between the magnetic body and the low temperature heat exchange section, and between the magnetic body and the high temperature heat exchange section. . In this heat transfer portion, a gap is provided, and liquid metal is taken in and out (moved) by electrowetting in the gap. In other words, heat transfer is performed in a state where the liquid metal enters the gap, and switching is performed so as to insulate the liquid metal from the gap. Therefore, when the heat transfer and the heat insulation are switched, the liquid metal only moves in the gap and therefore no frictional heat is generated, so that the heat transfer and the heat insulation can be switched at a high speed. For this reason, the application and removal of magnetism by the magnetic circuit to be synchronized can be accelerated.

In particular, the movement of the liquid metal by electrowetting is such that when the voltage is applied, the contact angle between the liquid metal and the surface of the gap becomes 90 ° or less, so that the liquid metal has improved wettability with the surface of the gap and the surface. It moves in the gap by the action of tension. On the other hand, when the voltage is turned off, the contact angle exceeds 90 ° and the wettability on the surface is lost, and the liquid metal loses the moving force.

(2) In particular, in Embodiment 5, gaps are provided in a circumferential shape between the magnetic bodies that perform heat transfer and between the heat exchanger and the magnetic body. In the gap, the first electrodes and the second metal are alternately arranged in the circumferential direction. Of these, the first electrode is insulated by a dielectric, and the second electrode and the dielectric are exposed on the wall surface forming the gap. The liquid metal is moved in one direction by sequentially energizing the first electrode and the second electrode in one direction of the gap. For this reason, compared with the case where a liquid metal is reciprocated, the movement of the liquid smoother is attained. Further, since the movement is only in one direction, once the liquid metal starts to move, it can be moved at a high speed with a smaller driving force (that is, a low applied voltage).

(3) In the fifth embodiment, since the position detector for detecting the position of the liquid metal is provided, the position between the first and second electrodes is adjusted according to the position of the liquid metal detected by the position detector. What is necessary is just to apply a voltage and to energize.

(4) In the fifth embodiment, synchronization can be obtained from the moving speed (angular speed) of the magnet and the moving speed (angular speed) of the liquid metal obtained from the position of the liquid metal detected by the position detector.

(5) In the fifth embodiment, the gap is a sealed space, and the inside is filled with a vacuum (depressurized state) or an inert gas. This prevents the liquid metal from being oxidized.

(6) In the first to fourth embodiments, the first electrode structure and the second electrode structure having the same structure are provided via a gap. The first electrode structure and the second electrode structure are a liquid repellent coating layer, a second electrode, a dielectric, and a first electrode, respectively, in order from the gap side. The first electrode is insulated from the liquid metal, and the second electrode is electrically connected to the liquid metal. With this structure, even if the liquid metal moves by electrowetting, the electrostatic energy of the capacitor formed by the first electrode, the dielectric, and the second electrode does not change, and the moving speed of the liquid metal can be stabilized. it can.

(7) In Embodiments 1 to 4, the liquid metal moves smoothly by providing the liquid repellent coating layer on the surface of the gap where the liquid metal contacts. Also in the fifth embodiment, a liquid repellent coating layer may be provided, and similarly the liquid metal can be moved smoothly.

(8) In the first to fourth embodiments, when the contact angle between the liquid metal and the surface of the gap is 90 ° or less, the wettability between the liquid metal and the surface of the gap is improved and the surface tension acts to Get inside. On the other hand, when the voltage is turned off, the contact angle exceeds 90 ° and the wettability on the surface is lost, and the liquid metal escapes from the gap.

(9) In the fourth embodiment, at least two heat transfer portions are connected by a communication path so that the liquid metal can move between these at least two heat transfer portions. As a result, when one heat transfer section is turned on and the other is turned off, a force in the direction in which the liquid metal enters the gap works in the one heat transfer section, and the liquid metal in the direction in which the liquid metal leaves the gap in the other. Power will work. For this reason, a force twice as large as that of the isolated liquid reservoir (Embodiment 1) is applied to the liquid metal that moves back and forth through the communication path. Operation as a thermal switch becomes possible at higher speed.

(10) In Embodiments 1 to 3, the inner wall surface of the liquid pool is made lyophilic with respect to the liquid metal. Thereby, it becomes easy to store the liquid metal in the liquid reservoir.

(11) In the first to third embodiments, the liquid metal can smoothly move between the gap and the liquid reservoir by having the open end in the gap.

(12) In the first to third embodiments, an insulator having a dielectric constant lower than that of the dielectric is disposed near the open end. This eliminates (or reduces) the action of electrowetting at this portion and prevents the liquid metal from being discharged from the open end.

(13) In Embodiments 1 to 3, the open end provided in the gap is opened in a sealed space filled with an inert gas. As a result, the liquid metal can be prevented from coming into contact with the air to prevent the liquid metal from being oxidized, and the life of the magnetic air conditioner can be extended.

(14) In Embodiments 1 to 3, the higher the frequency of the heat transfer and heat insulation switching cycle, the higher the voltage. Thereby, the frequency of the heat transfer and heat insulation switching cycle can be increased.

(15) In the first to third embodiments, the gap has a width that is perpendicular to the surface of the opposing liquid repellent coating layer and does not reach the surfaces facing each other, and the liquid reservoir communicates from the liquid reservoir. A plurality of blades extending to the end opposite to one end of the gap is provided. As a result, the gap is further subdivided, and the area of the surface in contact with the liquid metal is increased when a voltage is applied, and the force of the liquid metal going up the surface is likely to act. For this reason, heat transfer and heat insulation can be switched at higher speed.

Although the embodiment to which the present invention is applied has been described above, the present invention is not limited to the above-described embodiment, and various modifications are possible.

For example, when the voltage applied between the first electrode and the second electrode is cut, the first electrode and the second electrode may be short-circuited. Thereby, by cutting off the voltage and short-circuiting, the electrostatic energy stored in the dielectric between the first electrode and the second electrode is released at once, and the liquid metal that has gone up the gap more quickly is stored in the liquid. It can be lowered and housed inside.

Further, for example, the open end of the gap and the hole of the liquid reservoir may be connected via a gas communication path different from the gap. That is, this gas communication path forms a sealed space structure between the gap and the liquid reservoir. The gas communication path is preferably filled with an inert gas. In this case, when the voltage is applied, when the liquid metal enters the gap, the gas pushed out of the gap enters the liquid pool through the hole of the liquid pool. Conversely, when the voltage is turned off, the liquid metal is accommodated in the liquid pool. The gas goes back into the gap. Therefore, even when the heat transfer unit is used alone, the liquid metal can be prevented from coming into contact with air.

Further, in the above-described embodiment, the normal temperature (20 ° C.) is assumed as the temperature at the start, but the present invention is applicable when the start temperature is not necessarily the normal temperature.

In addition, it goes without saying that the present invention can be modified in various ways defined by the matters defined by the claims.

Furthermore, this application is based on Japanese Patent Application No. 2012-158830 filed on July 17, 2013, the disclosures of which are referenced and incorporated as a whole.

10, 10 'magnetic material,
11 First electrode structure,
12 first electrode,
13 dielectric,
14 second electrode,
15 liquid repellent coating layer,
16 Lower substrate,
17 Liquid pool,
18 Liquid metal,
18 Upper substrate,
20 gap,
20A-20F magnetic circuit,
21 2nd electrode structure,
25 holes,
30 heat transfer section,
31 blades,
50 passages,
55 lid,
56 sealed space,
300 gap,
301 electrical circuit,
302 Position sensor (position detector).

Claims (15)

A plurality of magnetic bodies arranged in rows at intervals and changing in temperature by applying and removing magnetism;
A magnetic circuit for applying and removing magnetism to each of the plurality of magnetic bodies;
A low temperature side heat exchanging portion disposed at one end of the row of the plurality of magnetic bodies and spaced from the magnetic body;
A high temperature side heat exchanging portion disposed at a distance from the magnetic body at the other end of the row of the plurality of magnetic bodies;
Heat transfer between the magnetic bodies, between the magnetic body and the low temperature side heat exchange unit, and between the magnetic body and the high temperature side heat exchange unit, and performing heat transfer and heat insulation between them. And
Have
The heat transfer unit is
A dielectric and a first electrode provided in the gap;
A liquid metal moving in the gap;
A second electrode electrically connected to the liquid metal,
The first electrode is electrically insulated from the liquid metal and the dielectric, and by applying a voltage between the first electrode and the liquid metal, the liquid metal is separated by the electrowetting action. A magnetic air-conditioning apparatus, wherein the heat transfer and the heat insulation are switched by moving an object. The gap has a circumferential shape, and a plurality of the first electrodes and the second electrodes are alternately arranged in the circumferential direction, the dielectric is formed on the first electrode, and the gap is formed on the inner surface of the gap. The second electrode and the dielectric are exposed;
The magnetic cooling / heating apparatus according to claim 1, wherein the liquid metal is moved in one direction by sequentially energizing the first electrode and the second electrode in one direction of the gap. The magnetic air conditioner according to claim 1 or 2, wherein a position detector for detecting the position of the liquid metal is provided in the gap. The row of the plurality of magnetic bodies is a direction intersecting the circumferential direction, and the magnetic circuit has a permanent magnet that rotates in the circumferential direction,
By controlling the voltage value and voltage application time applied to the first electrode and the second electrode, the angular velocity and phase of the rotating permanent magnet are synchronized with the angular velocity and phase of the liquid metal, The magnetic air conditioner according to claim 2 or 3. The magnetic air conditioner according to any one of claims 1 to 4, wherein the gap is a sealed space and is filled with a vacuum or an inert gas. The heat transfer unit further includes a liquid storage unit that is connected to one end of the gap and from which the liquid metal goes back and forth.
The first electrode and the dielectric each have at least a pair, and are arranged in the same structure on both sides of the gap so as to be the dielectric and the first electrode in order from the gap side,
By applying a voltage between the first electrode and the liquid metal, the liquid metal enters the gap by an electrowetting action, thereby performing the heat transfer, and not applying the voltage to the liquid. The magnetic cooling / heating device according to claim 1, wherein metal is accommodated in the liquid accommodating portion and the gap is emptied to perform the heat insulation. The second electrode is provided on the gap side in parallel with the first electrode with the dielectric interposed therebetween, and a liquid repellent coating layer having a liquid repellency to the liquid metal on the surface of the second electrode The magnetic air conditioner according to claim 6, further comprising: By applying the voltage, the contact angle of the surface of the liquid metal that is in contact with the opposing surface in the gap becomes 90 ° or less, and the liquid metal moves through the gap and moves in the gap. To enter the,
The said contact angle exceeds 90 degrees because the said voltage is cut | disconnected, The said liquid metal comes out of the said clearance gap, and is accommodated in the said liquid accommodating part, The Claim 6 or 7 characterized by the above-mentioned. Magnetic air conditioning unit. At least two of the heat transfer parts are connected by a communication path, and the liquid metal is movable between at least two of the heat transfer parts connected by the communication path,
Among the connected heat transfer units, when a voltage is applied between the first electrode of the at least one heat transfer unit and the liquid metal, at least one other heat transfer unit The magnetic air conditioner according to any one of claims 6 to 8, wherein no voltage is applied between the first electrode and the liquid metal. The liquid container is a liquid pool in which the metal liquid accumulates, and an inner wall surface of the liquid pool is lyophilic with respect to the liquid metal. Magnetic air conditioning unit. The magnetic air conditioner according to any one of claims 6 to 10, wherein the gap has an open end. The magnetic air conditioner according to claim 11, wherein an insulator having a dielectric constant lower than that of the dielectric is disposed in the gap portion in the vicinity of the open end. The magnetic air conditioner according to claim 11 or 12, wherein the open end is open to a sealed space, and the inside of the sealed space is filled with an inert gas. The magnetic air conditioner according to any one of claims 6 to 13, wherein the voltage is increased as the frequency of the heat transfer and heat insulation switching cycle is higher. The gap has a width that is perpendicular to the surfaces of the opposing liquid repellent coating layers and does not reach the opposing surfaces, and is opposite to the one end where the liquid reservoir communicates with the liquid reservoir. The magnetic air conditioner according to any one of claims 7 to 14, further comprising a plurality of blades extending to the end of the magnetic head.

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