WO2013146985A1

WO2013146985A1 - Molding die and manufacturing method for same

Info

Publication number: WO2013146985A1
Application number: PCT/JP2013/059189
Authority: WO
Inventors: 大城谷　健史
Original assignee: コニカミノルタアドバンストレイヤー株式会社
Priority date: 2012-03-30
Filing date: 2013-03-28
Publication date: 2013-10-03
Also published as: JP6124023B2; JPWO2013146985A1

Abstract

Provided is a molding die and a manufacturing method for the same capable of both shortening a molding cycle and improving transferability from a die to a resin. Inside a surface layer (13), a lower surface layer (14) and a thermal insulating layer (15) are formed, and therefore, there is no necessity to significantly vary the temperature of a molding die (10) at injection molding time of a resin, and furthermore, temperature distribution also approaches being uniform, and therefore, it is possible to correspondingly achieve shortening of the molding cycle time. Meanwhile, the temperatures of a convex portion (13a) and the vicinity thereof are also maintained at a high temperature, and therefore, it is possible to achieve improvement of transferability from the molding die (10) to the resin.

Description

Mold for molding and manufacturing method thereof

The present invention relates to a molding die used for forming a resin molded product and a manufacturing method thereof.

Micro-TAS (Total Analysis マイクロ System) with a very fine channel with a width and depth of 1-1000μm, microchips used for analysis of organic compounds and biological samples, and fine steps on the order of tens of nanometers A diffractive optical element or the like having a structure may be formed of a resin molded product formed by injection molding of a resin, and a mold is used for the molding.

When molding a concave shape such as a fine groove in such a resin molded product by injection molding, in the mold, a fine convex shape corresponding to the groove must be formed on a plane, In general, the amount of machining is enormous due to cutting. Therefore, it is generally practiced to transfer and form a fine convex shape by electroforming. As the electroforming material, nickel (Ni) having excellent electroplating properties is often used (see Patent Document 1).

However, since nickel has a high thermal conductivity of 90 W / m · K, heat conduction is too fast to keep the temperature of the resin in contact with the mold high, and the resin must cool before shape transfer is sufficiently obtained. May result in insufficient transfer. On the other hand, transferability is improved by using heat cycle molding, but there is a problem in that the molding cycle becomes long and the number of manufacturing steps increases.

Japanese Patent Application Laid-Open No. 06-158381 International Publication No. 2008/053732 Pamphlet

On the other hand, Patent Document 2 discloses a technique in which a heat insulating layer such as zirconia is provided inside a mold and the temperature of the resin in contact with the mold is maintained at an appropriate temperature. However, when a material with excellent heat insulation, such as zirconia, is used, molding has excellent heat retention, so the vicinity of the gate becomes hot, but the opposite side is held at a low temperature for a long time. The temperature distribution of the product becomes non-uniform, which may cause deformation of the product. Such non-uniform temperature distribution can be eliminated by extending the cooling time until product deformation or the like does not occur, but this increases the molding cycle and increases the number of manufacturing steps.

The object of the present invention has been made in view of the above-mentioned problems, and is to provide a molding die capable of achieving both a shortening of the molding cycle and an improvement in transferability from the die to the resin, and a method for producing the same. is there.

In order to achieve at least one of the above objects, a molding die reflecting one aspect of the present invention is a molding die for molding a member formed with a fine structure made of a resin material by injection molding. Because
Mold body,
A heat insulating layer having a thermal conductivity of 30 W / m · k or less, formed on the mold body;
A lower layer formed on the heat insulating layer and having a thermal conductivity of 60 W / m · k or more;
A transfer portion for forming the microstructure, and a surface layer formed on the lower layer and having a thermal conductivity of 10 W / m · k or less,
The transfer portion of the surface layer is formed by transfer processing from a transfer master.

Further, a manufacturing method of a molding die reflecting one aspect of the present invention is a molding die for molding a member formed with a fine structure made of a resin material by injection molding, the mold body, A heat insulating layer having a thermal conductivity of 30 W / m · k or less formed on the mold main body, a bottom layer having a thermal conductivity of 60 W / m · k or more formed on the heat insulating layer, and In a manufacturing method of a molding die having a transfer portion for forming a fine structure and having a surface layer having a thermal conductivity of 10 W / m · k or less formed on the lower surface layer,
A first step of cutting the microstructure element shape on the transfer master;
A second step of forming the surface layer on the transfer master by transfer processing;
And a third step of forming the lower surface layer on the surface layer.

According to the present invention, both shortening of the molding cycle time and improvement of transferability from the mold to the resin can be achieved.

1 is a cross-sectional view of a molding die 1. FIG. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a molding apparatus incorporating a molding die 10. FIG. (A) is an expanded sectional view of the fine groove | channel of a metal mold | die for shaping | molding, (b) is the enlarged view which looked at the cross crossing part of the fine groove from the upper surface. It is a figure which shows the evaluation result of Example 1 and Comparative Examples 1-3.

Embodiments according to the present invention will be described below with reference to the drawings. However, the embodiments described below are given various technically preferable limitations for carrying out the present invention, but the scope of the invention is not limited to the following embodiments and examples.

First, a schematic configuration of a molding die 10 according to the present embodiment will be described with reference to FIG. The molding die 10 is a die for molding a member (resin molded product) having a fine structure made of a resin material by injection molding. For example, a microchip having a fine channel having a width of 1 to 1000 μm. And is suitably used for transfer-forming resin molded products such as optical elements. The molding die 10 has a mold body 12 (base mold) that has a substantially rectangular parallelepiped appearance and is made of a metal material such as steel. On the mold body 12, a surface layer 13 is formed. The lower surface layer 14 and the heat insulating layer 15 are formed in this order from the transfer surface side.

The surface layer 13 is a layer for substantially forming the shape of the fine flow path, and is formed by a transfer process described later. The surface layer 13 is formed on the mold body 2 via the lower surface layer 14 and the heat insulating layer 15, and is 0.03 to 1.0 mm (preferably 0.1 to 0.5 mm) on the lower surface layer 14. It is formed with a thickness t1 in the range. The surface layer 13 is made of a material having a thermal conductivity of 10 W / m · K or less, such as nickel composite alloy plating such as nickel-phosphorus, nickel-cobalt-phosphorus alloy plating, nickel-PTFE plating, nickel boron plating, etc. A convex portion 13a is formed on the surface layer 13 (transfer surface side).

The convex portion 13a as the transfer portion corresponds to a concave portion (groove) having a fine structure formed in the resin molded product, and has a fine shape having a width W and a height H in the range of 0.1 to 1 mm. In particular, the convex portion 13a may have a fine channel shape having a width W and a height H of 1 to 1000 μm. In this case, a resin molded product such as a microchip molded from the molding die 10 is used. A fine channel having a width and a depth of 1 to 1000 μm can be formed. Preferably, the width W is 100 μm or less.

The lower surface layer 14 has a function to quickly spread the heat of the resin injected on the surface of the surface layer 13 over the entire transfer surface. The lower surface layer 14 is sandwiched between the surface layer 13 and the heat insulating layer 15 and is provided with a thickness t2 in the range of 0.1 to 2.0 mm. The lower surface layer 14 has a higher thermal conductivity than the surface layer 13, and is specifically composed of a material of 60 W / m · K or more, for example, Ni plating, Cu plating, Cr plating, Ni—Co plating or the like. Yes.

The heat insulating layer 15 has a function of preventing the heat of the resin injected to the surface of the surface layer 13 from spreading over the entire mold body 12, and the region where the resin has been injected and its vicinity. Holds heat. The heat insulating layer 15 is made of a material such as a ceramic material, titanium alloy, or glass (here, zirconia), and has a thermal conductivity lower than that of the lower surface layer 14, specifically 30 W / m · K or less. (Preferably 10 W / m · K or less). The heat insulating layer 15 is formed by a thermal spraying method described later, and has a thickness of 0.1 to 3.0 mm.

Subsequently, a manufacturing method of the molding die according to the present embodiment will be described with reference to FIG. Here, it is assumed that the molding die 10 is manufactured using the master M which is a transfer mold master. In the actual manufacturing of the mold 10, first, a plating layer is applied to the transfer surface of the master M, and then the upper surface of the plating layer is cut with a tool T as shown in FIG. A flow path portion V corresponding to a concave portion such as a fine flow path of the resin molded product is formed (first step).

In the master M, the plating layer is not necessarily essential, but it is preferable that the plating layer is formed particularly from the viewpoint of the homogeneity of the material. In the first step, an electroless Ni plating process may be performed on the master M (without forming a plating layer), and then a cutting process may be performed. In this case, it is more preferable from the viewpoint of machinability and hardness.

Thereafter, as shown in FIG. 2B, in order to improve the releasability from the mold main body 12, a pretreatment treatment or a release treatment is performed, and a release treatment film P is formed on the upper surface of the master M. Form. After that, as shown in FIG. 2 (c), the thickness formed by nickel composite alloy plating or the like by performing other transfer processing such as electroless Ni plating processing on the upper part of the release treatment film (not shown). The first processed body 20 is formed. In forming the first processed body 20, electroforming may be performed instead of electroless plating.

Here, electroforming is a technique in which a metal such as a nickel-cobalt-phosphorus alloy is deposited on the surface of the master M by electroplating, and then the metal is peeled off from the master M to make a product. In casting, the shape of the master M can be transferred faithfully and accurately.

Thereafter, as shown in FIG. 2 (d), the first workpiece 20 is ground by the tool T, and the thickness t1 of the first workpiece 20 is reduced to about 0.03 to 1.0 mm. Make the top surface flat. The first processed body 20 corresponds to the surface layer 13, and the step of forming the first processed body 20 corresponds to the second step.

After that, as shown in FIG. 2 (e), a mask member (not shown) is masked on a portion other than the portion on which the lower surface layer 14 is to be formed above the first processed body 20, and the mask member A metal such as Ni is deposited on the surface of the enclosed first processed body 20 by electroplating to form a second processed body (electroformed processed body) 21. Note that the second processed body 21 may be formed by a normal plating method.

Next, as shown in FIG. 2 (f), the second workpiece 21 is ground by the tool T, and the thickness t2 of the second workpiece 21 is reduced to about 0.1 to 2.0 mm. Make the top surface flat. The second processed body 21 corresponds to the lower surface layer 14.

Thereafter, as shown in FIG. 2G, the processed

bodies

20 and 21 are integrally released from the master M. As a result, a convex portion 13 a corresponding to the flow path portion V of the master M is formed on the lower surface of the first processed body 20.

Further, as shown in FIG. 2 (h), the outer circumferences of the

workpieces

20 and 21 are appropriately cut (shaped) with the tool T, and as shown in FIG. A heat insulating layer 15 made of flat zirconia (thermal conductivity 3 W / m · k) having a thickness of 0.1 to 3.0 mm is interposed in a mold body 12 made of carbon steel (which may be made of ordinary carbon steel). Then, the upper surface of the second processed body 21 is pasted with an adhesive (third and fourth steps). After affixing the heat insulation layer 15 to the 2nd process body 21, you may affix the metal mold body 12 further from it. Thus, the molding die 10 is completed.

In one variation of this embodiment, the steps are the same up to FIG. 2F, but the subsequent steps are different. Although illustration is omitted, specifically, after the second processed body 21 is formed, a mask member (not shown) is masked to a portion other than the portion where the heat insulating layer 15 is to be formed, and the mask member is used. A thermal insulation layer 15 is formed on the surface of the enclosed second processed body 21 by spraying a ceramic material (zirconia) or the like to a certain thickness. At this point, the heat insulating layer 15 may be adhered. If polyimide is used as the material, it can be formed by spin coating or by directly bonding a polyimide film.

Note that masking of the mask member is not always essential, and the masking range of the mask member is preferably arranged on the inner side within a range of 0.1 to 2 mm with respect to the outer shape of the final molding die 10. . This range assumes the subsequent formation of an electroformed body (re-electroforming, holding by thick-walled electroforming), and 0.1 mm with respect to the outer shape of the final molding die 10 Masking the inner side means that the thickness of the electroformed layer on the side surface is synonymous with 0.1 mm, but if it is less than this, there is a possibility of breakage, and the upper limit effectively acts as a heat insulating layer 15. It is for making it happen.

Thereafter, the mask member is removed, and a conductive film (not shown) is formed on the upper surface of the heat insulating layer 15 to impart conductivity. The conductive film may be formed by performing Ni—P plating, or may be formed by spraying a metal material.

Thereafter, the upper part of the heat insulating layer 15 is subjected to electroforming again to form a thick third processed body, which are integrated (third and fourth steps). The third processed body corresponds to the mold body 12. Thereafter, these outer peripheries are integrally cut to an appropriate size. However, the heat insulating layer 15 and the separately formed mold body 12 may be bonded together with an adhesive. Thus, the molding die 10 is completed.

FIG. 3 is a perspective view showing the molding die 10 according to the present embodiment assembled in a molding apparatus. In FIG. 3, the molding die 10 is inserted into a rectangular tube-shaped frame member 31 to form a lower die 30. The molding die 10 is fixed to the frame member 31 with a bolt or the like directly or via a fixing member, or is fixed by vacuum suction or the like. A block-shaped upper mold 40 is provided facing the lower mold 30. The upper mold 40 is clamped with respect to the lower mold 30, the molten resin is injected into the internal space through a gate (not shown), solidified, and then released from the mold so that the convex portion 13 a A molded product obtained by transfer molding can be obtained. Note that the inner periphery of the upper edge of the frame member 31 may be protruded inward to suppress the surface layer of the molding die 10.

In the above embodiment, since the lower surface layer 14 and the heat insulating layer 15 are formed inside the surface layer 13, there is no need to greatly change the temperature of the molding die 10 during resin injection molding. Since the temperature distribution becomes nearly uniform, the molding cycle time can be shortened accordingly. On the other hand, the temperature of the convex portion 13a and the vicinity thereof is also maintained at a high temperature, and the transferability from the molding die 10 to the resin can be improved.

Furthermore, when forming the convex portion 13a, since the convex portion 13a is formed by performing transfer processing on the master M instead of cutting, one single M forms a plurality of identical fine shapes. When forming the molding die 10, it is possible to prevent processing variations in forming a fine shape on the surface layer 13, and a plurality of molding dies 10 exhibiting the same shape from one master M. In the case of manufacturing, it is possible to prevent processing variations between the molding dies 10. Furthermore, the master M can be reused any number of times. From the above, it is possible to prevent variations in processing when forming a fine shape on the mold while simultaneously reducing the molding cycle time and improving the transferability from the mold to the resin.

For optical elements such as microchips with fine channels and lenses and prisms with fine structures, it is essential to suppress variation in shape between parts, as well as transferability of fine shapes. The molding die 10 and the manufacturing method thereof according to the invention are very effective.

Hereinafter, the result of the study conducted by the present inventor will be described. The inventor manufactured an example and three comparative examples with the following specifications, and compared and evaluated the shape transferability and the molding cycle time.
[Example 1]
Surface layer (Ni-P layer with a thickness of 0.15 mm, thermal conductivity 9 W / m · k), bottom layer (Ni layer with a thickness of 0.15 mm, thermal conductivity 87.6 W / m · k), heat insulation layer (Sintered zirconia with a thickness of 1 mm, thermal conductivity 3 W / m · k), mold body (thickness adjusting plate, made by STAVAX, thermal conductivity 20 W / m · k)
[Comparative Example 1]
Surface layer (Ni-P layer with a thickness of 0.15 mm, thermal conductivity 9 W / m · k), bottom layer (Ni layer with a thickness of 0.15 mm, thermal conductivity 87.6 W / m · k), backing material (STAVAX, thermal conductivity 20W / m · k)
[Comparative Example 2]
Electroformed layer (Ni layer with a thickness of 0.3 mm, thermal conductivity 87.6 W / m · k), receiving part ((sintered zirconia with a thickness of 1 mm, thermal conductivity 3 W / m · k), base (STAVAX) Manufactured, thermal conductivity 20W / m ・ k)
[Comparative Example 3]
Electroformed layer (Ni layer with a thickness of 0.3 mm, thermal conductivity 87.6 W / m · k), base (made by STAVAX, thermal conductivity 20 W / m · k)

Table 1 shows the thermal conductivity of the tested materials for reference.

The evaluation of the shape transferability was performed by observing the radius (sag amount) of the corner R portion where the fine groove G intersects the cross in a test molded product as shown in FIG. The test molded product is a plate-shaped molded product having a thickness of 2 mm and a thickness of 30 mm, and a groove G (width X: 20 μm, depth Z: 20 μm) shown in FIG. As shown in (b), the crosses were provided. The example and the comparative example were evaluated by comparing the radii of the corners R of the intersecting shape. As the molding conditions, the resin used for molding was PC (product name: UPILON H4000, manufactured by Mitsubishi Engineer Plastics), the resin temperature was 290 ° C., the pressure holding condition was 70 MPa, and the mold temperature was 130 ° C. did. FIG. 5 shows the evaluation results.

According to the evaluation results shown in FIG. 5, it was found that in Comparative Example 1, the radius of the R portion was increased to about 10 μm, and the transferability was poor. However, even in Comparative Example 1, the transferability is improved if the mold temperature is raised above the glass transition temperature Tg, but this causes a problem because the molding cycle time becomes 120 seconds.

Next, in Comparative Example 2, it was found that the radius of the R portion was about 20 μm and the transferability was further poor. However, even in Comparative Example 2, the transferability is improved by raising the mold temperature to the glass transition temperature Tg or higher and using heat cycle molding, which increases the molding cycle time to 5 minutes and increases the equipment cost. It is a problem because it increases.

Next, in Comparative Example 3, it was found that the radius of the R portion was about 25 μm and the transferability was further poor. However, even in Comparative Example 2, the transferability is improved by raising the mold temperature above the glass transition temperature Tg and using heat cycle molding, which increases the molding cycle time to 20 minutes and increases the equipment cost. It is a problem because it increases.

On the other hand, in Example 1, even when the resin temperature and the mold temperature are lowered, the radius of the R portion is 0.3 μm or less and the transfer property is excellent, thereby making it possible to shorten the molding cycle time to 60 seconds. It was found that it can contribute to cost reduction while performing accurate molding.

The following is a summary of preferred configurations in the above-described embodiment.

The molding die according to the present embodiment is a molding die for molding a member having a fine structure made of a resin material by injection molding, and is formed on the mold body and the mold body. , A heat insulating layer having a thermal conductivity of 30 W / m · k or less, a lower layer formed on the heat insulating layer and having a thermal conductivity of 60 W / m · k or more, and a transfer portion for forming the microstructure And a surface layer having a thermal conductivity of 10 W / m · k or less formed on the lower surface layer, and the transfer portion of the surface layer is formed by transfer processing from a transfer mold master. Yes.

In order to shorten the molding cycle, it is generally considered that the temperature of the mold is lowered. However, if the mold temperature is lowered, the resin filled in the mold is cooled quickly, and the mold flows into the molded product. Since there is a risk that appearance defects such as marks and jetting may occur, there is a limit in reducing the mold temperature.

On the other hand, according to the present embodiment, since the surface layer, the lower surface layer, the heat insulating layer, and the mold body are arranged in this order from the member side to be molded, the following effects are obtained. It is done. First, by placing the surface layer having a heat conductivity of 10 W / m · k or less on the surface of the mold that contacts the material to be molded, the mold temperature is extremely raised from the glass transition point Tg. The surface shape transferability can be improved and the lower surface layer having a thermal conductivity of 60 W / m · k or more can be provided on the inner side of the surface layer to increase the thermal conductivity. This eliminates the non-uniformity of the temperature distribution between the opposite sides and the molding cycle. In addition, by arranging the heat insulating layer having a thermal conductivity of 30 W / m · k or less inside the lower surface layer, the heat insulation property of the surface layer can be appropriately secured, so that the molding cycle can be further shortened. . Here, “to form on” includes not only direct formation but also adhesion with an adhesive.

It is preferable that the transfer process is an electroforming process. As a result, even fine grooves that are difficult to cut can be easily formed.

The surface layer is preferably composed of nickel-PTFE, nickel-cobalt-phosphorus alloy or nickel-boron. However, a more preferable material for the surface layer is a Ni—P composite plating material from the viewpoint that higher heat insulation can be obtained and the hardness can be increased to improve the durability of the mold, It is preferable to use a compound whose blending is 15% by weight or less. Many of these materials have a thermal conductivity of 10 W / m · k or less, and are suitable for the surface layer. However, the material is not limited to the above. The surface layer is manufactured by a method such as electroless plating or electroplating.

The surface layer is preferably formed with a thickness in the range of 0.03 to 1.0 mm on the lower surface layer. If the thickness of the surface layer is greater than 0.03 mm, the heat retaining property can be maintained, and if the thickness is less than 1.0 mm, nonuniformity of the temperature distribution can be suppressed and the time for formation can be reduced. However, the thickness of the surface layer is more preferably 0.1 to 0.5 mm.

The lower surface layer is preferably formed by electroforming or plating on the heat insulating layer. Thereby, a lower surface layer having a thermal conductivity of 60 W / m · k or more can be easily formed.

The lower surface layer is preferably formed by Ni plating, Cu plating, Cr plating or Ni—Co plating. Such a material is suitable for constituting a lower surface layer having a thermal conductivity of 60 W / m · k or more.

The lower surface layer is preferably formed on the heat insulating layer with a thickness in the range of 0.1 to 2.0 mm. If the thickness of the lower surface layer is greater than 0.1 mm, sufficient thermal conductivity can be ensured, and if it is less than 2.0 mm, the manufacturing time can be reduced. However, the thickness of the lower layer is more preferably 0.1 to 0.5 mm.

It is preferable that the heat conductivity of the heat insulating layer is 10 W / m · K or less. When the thermal conductivity of the heat insulating layer is 10 W / m · K or less, it is possible to further secure sufficient heat retention.

The heat insulating layer is preferably made of a stainless material, a ceramic material, a titanium alloy, cermet, glass or resin. Many of these materials have a thermal conductivity of 30 W / m · k or less, and are suitable for the surface layer. In particular, ceramic materials, titanium alloys, glass, and the like are preferable because the thermal conductivity is 10 W / m · k or less. However, the material is not limited to the above. Moreover, the method of laminating the plating layer used for the surface layer again is also mentioned.

The transfer part preferably has a fine shape with a size of 0.1 μm to 1 mm. Thereby, a microchip used for analysis of Micro-TAS, an organic compound, or a biological sample can be manufactured.

It is preferable that the surface layer has a convex portion corresponding to a fine flow channel having a width and a depth of 1 to 1000 μm formed in the microchip. Thereby, the microchip used for the analysis of an organic compound, a biological sample, etc. can be manufactured. Preferably, the width of the fine channel is 100 μm or less. Note that the transfer portion may be a fine recess having the same size.

A method for manufacturing a molding die according to the present embodiment is a molding die for molding a member formed with a fine structure made of a resin material by injection molding, the mold body, and the mold body on the mold body In order to mold the formed heat insulating layer having a thermal conductivity of 30 W / m · k or less, a lower layer formed on the heat insulating layer and having a thermal conductivity of 60 W / m · k or more, and the microstructure. In a manufacturing method of a molding die having a transfer portion, and a surface layer having a thermal conductivity of 10 W / m · k or less formed on the lower surface layer, the microstructure element shape is cut on the transfer mold master. A first step of processing, a second step of forming the surface layer on the transfer master by transfer processing, and a third step of forming the lower surface layer on the surface layer. Thereby, the molding die which has the above-mentioned effect can be manufactured easily.

After forming the surface layer, the lower surface layer, and the heat insulation layer on the transfer mold master, the surface layer, the lower surface layer, and the heat insulation layer are released from the transfer mold master, and further, the heat insulation layer It is preferable to have the 4th process of joining a metallic mold main part. Thereby, the joint strength of the said heat insulation layer and the said lower surface layer can be raised.

After forming the surface layer and the lower surface layer on the transfer mold master, the surface layer and the lower surface layer are released from the transfer mold master and shaped, and then the heat insulating layer and the lower layer are formed on the lower surface layer. It is preferable to have the 4th process of joining a metallic mold main part. Thereby, the mold for molding can be manufactured in a shorter time.

The present invention is not limited to the embodiments and examples described in the specification, and includes other examples and modifications based on the embodiments, examples, and technical ideas described in the present specification. It will be apparent to those skilled in the art. For example, products that can be manufactured according to the present invention include products having a fine shape such as a prism sheet, a Fresnel sheet, a microlens array, a cell culture plate, a DNA analysis plate, and the like that require high transferability.

DESCRIPTION OF SYMBOLS 10 Mold for shaping | molding 12 Mold main body 13 Surface layer 13a Convex part 14 Lower surface layer 15 Heat insulation layer 20 1st processed body 21 2nd processed body 30 Lower mold 31 Frame member 40 Upper mold | type M Master P Release process film T Tool V channel

Claims

A molding die for molding a member formed with a fine structure made of a resin material by injection molding,
Mold body,
A heat insulating layer having a thermal conductivity of 30 W / m · k or less, formed on the mold body;
A lower layer formed on the heat insulating layer and having a thermal conductivity of 60 W / m · k or more;
A transfer portion for forming the microstructure, and a surface layer formed on the lower layer and having a thermal conductivity of 10 W / m · k or less,
The transfer portion of the surface layer is a molding die formed by transfer processing from a transfer mold master.
The molding die according to claim 1, wherein the transfer processing is electroforming.
3. The molding die according to claim 1, wherein the surface layer is made of nickel-phosphorus, nickel-PTFE, nickel-cobalt-phosphorus alloy or nickel-boron.
The molding die according to any one of claims 1 to 3, wherein the surface layer is formed with a thickness in the range of 0.03 to 1.0 mm on the lower surface layer.
The molding die according to any one of claims 1 to 4, wherein the lower surface layer is formed on the heat insulating layer by electroforming or plating.
The molding die according to claim 5, wherein the lower surface layer is formed by Ni plating, Cu plating, Cr plating or Ni-Co plating.
The molding die according to any one of claims 1 to 6, wherein the lower surface layer is formed with a thickness in the range of 0.1 to 2.0 mm on the heat insulating layer.
The molding die according to any one of claims 1 to 7, wherein the heat conductivity of the heat insulating layer is 10 W / m · K or less.
The molding die according to any one of claims 1 to 8, wherein the heat insulating layer is made of a stainless material, a ceramic material, a titanium alloy, cermet, glass, or a resin.
10. The molding die according to claim 1, wherein the transfer portion has a fine shape with a size of 0.1 μm to 1 mm.
The molding die according to any one of claims 1 to 10, wherein the transfer part includes a convex part corresponding to a fine flow path having a width and a depth of 1 to 1000 µm formed in the microchip.
A molding die for molding a member formed with a fine structure made of a resin material by injection molding, the mold body and a thermal conductivity of 30 W / m · k formed on the mold body The following heat insulating layer, a lower surface layer having a thermal conductivity of 60 W / m · k or more formed on the heat insulating layer, and a transfer portion for forming the microstructure are formed on the lower surface layer. In addition, in a method for producing a molding die having a surface layer having a thermal conductivity of 10 W / m · k or less,
A first step of cutting the microstructure element shape on the transfer master;
A second step of forming the surface layer on the transfer master by transfer processing;
And a third step of forming the lower surface layer on the surface layer.
After forming the surface layer, the lower surface layer, and the heat insulation layer on the transfer mold master, the surface layer, the lower surface layer, and the heat insulation layer are released from the transfer mold master, and further, the heat insulation layer The method for producing a molding die according to claim 12, further comprising a fourth step of joining the die body.
After forming the surface layer and the lower surface layer on the transfer mold master, the surface layer and the lower surface layer are released from the transfer mold master and shaped, and then the heat insulating layer and the lower layer are formed on the lower surface layer. The method for producing a molding die according to claim 12, further comprising a fourth step of joining the die body.