WO2013020290A1 - Device and method for wave soldering of workpieces with solder recirculation - Google Patents
Device and method for wave soldering of workpieces with solder recirculation Download PDFInfo
- Publication number
- WO2013020290A1 WO2013020290A1 PCT/CN2011/078252 CN2011078252W WO2013020290A1 WO 2013020290 A1 WO2013020290 A1 WO 2013020290A1 CN 2011078252 W CN2011078252 W CN 2011078252W WO 2013020290 A1 WO2013020290 A1 WO 2013020290A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- solder
- collection
- reservoir
- workpieces
- recirculation
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 171
- 238000005476 soldering Methods 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims abstract description 11
- 239000007788 liquid Substances 0.000 claims abstract description 8
- 230000003134 recirculating effect Effects 0.000 claims abstract description 3
- 230000001681 protective effect Effects 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 8
- 239000001301 oxygen Substances 0.000 description 8
- 229910052760 oxygen Inorganic materials 0.000 description 8
- 230000000694 effects Effects 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 2
- 206010057040 Temperature intolerance Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 230000008543 heat sensitivity Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
Definitions
- the present invention relates to a method and to a device for wave soldering.
- Wave soldering is, together with reflow soldering, one of the most frequently used connection methods in the production of electronic components.
- a workpiece for example a circuit board and components to be soldered on the board, is passed across a pumped wave or waterfall of liquid solder by a conveyor.
- the solder wave is generated via a solder nozzle comprising one or more solder outlet openings from which liquid solder emerges.
- the solder flows along the top of the solder nozzle and wets the bottom of the workpiece and the pin or lead of the component with solder. At specific locations, wettable by solder and corresponding to solder joints, the solder provides the desired connections.
- a critical parameter in wave soldering is oxygen present in the system. Oxygen causes oxidation of the solder and of the corresponding surfaces of the workpiece whereby the quality of the resulting solder joints and/or the reliability of the soldering process may be impaired. By exposure to oxygen, dross is formed which is to be disposed of or regenerated, thus generating additional costs. A major focus in the development of wave soldering processes is therefore the reduction of harmful oxygen effects.
- An inventive device for wave soldering of workpieces comprises a solder reservoir for liquid solder and at least one solder nozzle.
- the at least one solder nozzle comprises at least one solder outlet opening arranged above a solder level of the solder in the solder reservoir.
- At least one solder collection and recirculation device is provided to collect the solder emerging from the at least one solder outlet opening and not adhering to the workpieces, and for stepwise recirculating or guiding the collected solder back into the solder reservoir.
- the solder collection and recirculation device is thus adapted to collect the solder above the solder level and to guide the collected solder back into the solder reservoir while reducing harmful oxgen influences.
- solder nozzles in wave soldering devices comprise nozzle outlet openings located at a considerable height above the solder level. The solder exiting the nozzle, as mentioned, is contacting a workpiece to be soldered, for example a circuit board.
- the surface or upper side of the solder nozzle must therefore be positioned close to the workpiece, and the distance to the solder level can not be arbitrarily reduced due to mandatory constructive requirements and, in some cases, heat sensitivity of the workpieces.
- the cascading effect of the solder wave flow in conventional devices effects an intensive mixing of the solder with air or oxygen, particularly if large drop heights are present. Thus dross formation and oxidation is increased. Via the inventively suggested solder collection and recirculation device, the effective drop height, in contrast, is significantly reduced.
- a solder collection and recirculation device advantageously comprises an open solder collection tray adapted to catch the solder and, fluidly connected to the open solder collection tray, a solder conduct ending at or below the solder level.
- the solder does thus not fall over the entire drop height into the solder reservoir but is caught above the solder level in the open solder collection tray of the solder collection and recirculation device. This results in a stepwise solder recirculation. Turbulences in the solder are reduced because the inventive solder collection and recirculation device ensures a very gentle, low-turbulence solder guidance.
- solder can be isolated in much of its flow path of ambient oxygen in the proposed solder collection and recirculatioh device which can comprise a closed solder duct.
- the solder collection and recirculation device thus provides a beneficial effect as, on the one hand, it reduces turbulences and, on the other hand, it reduces the contact areas between solder flow and the ambient atmosphere.
- An advantageous device comprises a solder collection and recirculation device provided for collecting solder emerging from several solder nozzles.
- wave soldering devices may be constructed significantly easier.
- a solder nozzle may be surrounded by an annular solder collection tray.
- the advantages of the invention can especially be realized if, additionally to the solder collection and recirculation device, at least one protective gas device is provided.
- an appropriate protective gas device for example via corresponding shielding gas nozzles, protective gas can be supplied specifically to areas of the solder which is collected in an appropriate solder collection and recirculation device. Especially in such critical areas, oxidation can be reduced significantly. As not the overall device, however, is to be supplied with protective gas, protective gas consumption is significantly reduced as compared to conventional devices.
- the solder collection and recirculation device can be benificial in particular in wave soldering devices which comprise at least one solder pump.
- a solder pump can be tuned in its capacity to the solder stream provided by the solder collection and recirculation device.
- Devices of the invention advantageously comprise at least one heating device which is provided for continuous liquefaction of the solder.
- a heater can be arranged in close proximity to the solder collection and recirculation device to ensure a targeted reheating of the solder flowing back into a defined area. An overheating of the overall solder batch can thus be reduced.
- Figure 1 shows an apparatus for wave soldering according to the prior art.
- Figure 2 shows an apparatus for wave soldering according to a particularly preferred embodiment of the invention.
- Figure 1 shows an apparatus 10 for wave soldering of workpieces 2.
- the device comprises a solder reservoir 3 in which liquid solder 4 (shaded) is contained.
- the solder 4 in the solder reservoir, is contained up to a certain height, variable to some extent, and a solder level 4' is formed.
- a solder nozzle 5 is provided which has at least one solder outlet opening 5'. The solder outlet opening 5' is located above the solder level 4'.
- the workpiece 2 is moved via a conveyor, not shown, in processing direction 2' obliquely upward, illustrated by a dashed arrow, across the solder nozzle 5 or the solder outlet opening 5' and gets in contact with solder 4 emerging from solder nozzle 5.
- Workpiece 2 is wetted in specific areas (solder joints) by the solder 4. Solder not adhering to the workpiece 2 flows back into the solder reservoir 3 via solder streams 4".
- the flow of the solder 4 is illustrated by solid arrows.
- the solder 4 in the solder reservoir 3 is kept liquid by means of a heating device 9 and is pumped by means of a soldering pump 8 through solder nozzle 5.
- Figure 2 shows a device according to a particularly preferred embodiment of the invention.
- the device is generally designated with 1 and comprises the elements of device 100 previously explained in relation to figure 1 .
- a solder collection and recirculation device 6 for the solder 4 is provided, which comprises, in the exemplary illustration of figure 2, a solder collection tray 6' and a solder duct 6".
- the solder collection tray 6' is arranged above the solder level 4' and thereby ensures a greatly reduced drop height of the solder 4.
- a solder guiding means 7 can be provided, for example in the form of accordingly bent metal sheets, and ensures a particularly gentle transfer of the solder 4 into the tray 6' of the collection and recirculation device 6.
- the collection and recirculation device 6 may surround the solder nozzle 5 in an annular manner.
- at least one protective gas device may be provided by which specific areas of the tray 6' or solder 4 collected therein can be supplied with an inert protective gas.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Abstract
A device (1) for wave soldering of workpieces (2), comprises a solder reservoir (3) for liquid solder (4) and at least one solder nozzle (5) with at least one solder outlet opening (5') above a solder level (4') of solder (4) in the solder reservoir (3), wherein at least one solder collection and recirculation device (6) adapted to collect solder (4) exiting at least one solder outlet opening (5') and not adhering to the workpieces (2) and for recirculating the solder (4) into the solder reservoir (3) is provided and wherein the at least one collection and recirculation device (6) is arranged above the solder level (4'). A corresponding method for wave soldering of workpieces (2) is also provided.
Description
Description
Device and method for wave soldering of workpieces with solder recirculation
The present invention relates to a method and to a device for wave soldering. Prior art
Wave soldering is, together with reflow soldering, one of the most frequently used connection methods in the production of electronic components. In wave soldering, a workpiece, for example a circuit board and components to be soldered on the board, is passed across a pumped wave or waterfall of liquid solder by a conveyor. The solder wave is generated via a solder nozzle comprising one or more solder outlet openings from which liquid solder emerges. The solder flows along the top of the solder nozzle and wets the bottom of the workpiece and the pin or lead of the component with solder. At specific locations, wettable by solder and corresponding to solder joints, the solder provides the desired connections.
A critical parameter in wave soldering is oxygen present in the system. Oxygen causes oxidation of the solder and of the corresponding surfaces of the workpiece whereby the quality of the resulting solder joints and/or the reliability of the soldering process may be impaired. By exposure to oxygen, dross is formed which is to be disposed of or regenerated, thus generating additional costs. A major focus in the development of wave soldering processes is therefore the reduction of harmful oxygen effects.
From DE 195 41 445 A1 and from DE 10 2004 048 474 A1 , devices for wave soldering of workpieces are known in which specific areas can be supplied with a protective gas atmosphere, resulting in an almost complete exclusion of oxygen.
However, devices and procedures are desirable which are operable without or with reduced protective gas flow and nevertheless provide satisfying results, or which, leaving the amount of protective gas unchanged, provide improved results.
Disclosure of the invention
In view of the above, according to the invention a device for wave soldering of workpieces and a corresponding method with the features of the respective independent claims is provided. Preferred embodiments of the invention are subject of the corresponding subclaims and of the description below.
An inventive device for wave soldering of workpieces comprises a solder reservoir for liquid solder and at least one solder nozzle. The at least one solder nozzle comprises at least one solder outlet opening arranged above a solder level of the solder in the solder reservoir. At least one solder collection and recirculation device is provided to collect the solder emerging from the at least one solder outlet opening and not adhering to the workpieces, and for stepwise recirculating or guiding the collected solder back into the solder reservoir. The solder collection and recirculation device is thus adapted to collect the solder above the solder level and to guide the collected solder back into the solder reservoir while reducing harmful oxgen influences.
By means of the device according to the invention, the effective drop height of the solder from the solder outlet opening(s) to the solder level is reduced significantly. The higher a solder wave, the more air, and therefore oxygen, can be introduced by the solder wave into the solder reservoir. As explained below with reference to Figure 1 , conventional solder nozzles in wave soldering devices comprise nozzle outlet openings located at a considerable height above the solder level. The solder exiting the nozzle, as mentioned, is contacting a workpiece to be soldered, for example a circuit board. The surface or upper side of the solder nozzle must therefore be positioned close to the workpiece, and the distance to the solder level can not be arbitrarily reduced due to mandatory constructive requirements and, in some cases, heat sensitivity of the workpieces. The cascading effect of the solder wave flow in conventional devices effects an intensive mixing of the solder with air or oxygen, particularly if large drop heights are present. Thus dross formation and oxidation is increased. Via the inventively suggested solder collection and recirculation device, the effective drop height, in contrast, is significantly reduced.
For this purpose, a solder collection and recirculation device advantageously comprises an open solder collection tray adapted to catch the solder and, fluidly
connected to the open solder collection tray, a solder conduct ending at or below the solder level. The solder does thus not fall over the entire drop height into the solder reservoir but is caught above the solder level in the open solder collection tray of the solder collection and recirculation device. This results in a stepwise solder recirculation. Turbulences in the solder are reduced because the inventive solder collection and recirculation device ensures a very gentle, low-turbulence solder guidance. The solder can be isolated in much of its flow path of ambient oxygen in the proposed solder collection and recirculatioh device which can comprise a closed solder duct. The solder collection and recirculation device thus provides a beneficial effect as, on the one hand, it reduces turbulences and, on the other hand, it reduces the contact areas between solder flow and the ambient atmosphere.
An advantageous device comprises a solder collection and recirculation device provided for collecting solder emerging from several solder nozzles. Thus, wave soldering devices may be constructed significantly easier. For example, a solder nozzle may be surrounded by an annular solder collection tray.
The advantages of the invention can especially be realized if, additionally to the solder collection and recirculation device, at least one protective gas device is provided. By an appropriate protective gas device, for example via corresponding shielding gas nozzles, protective gas can be supplied specifically to areas of the solder which is collected in an appropriate solder collection and recirculation device. Especially in such critical areas, oxidation can be reduced significantly. As not the overall device, however, is to be supplied with protective gas, protective gas consumption is significantly reduced as compared to conventional devices.
The solder collection and recirculation device can be benificial in particular in wave soldering devices which comprise at least one solder pump. A solder pump can be tuned in its capacity to the solder stream provided by the solder collection and recirculation device.
Devices of the invention advantageously comprise at least one heating device which is provided for continuous liquefaction of the solder. A heater can be arranged in close proximity to the solder collection and recirculation device to ensure a targeted
reheating of the solder flowing back into a defined area. An overheating of the overall solder batch can thus be reduced.
As to the method according to the invention, reference is explicitly made to the above explanations regarding the device features and the respective embodiments and advantages.
Brief description of the drawings The invention and further details and advantageous embodiments of the invention are hereinafter explained with reference to the drawings in which schematically illustrated embodiments are shown.
Figure 1 shows an apparatus for wave soldering according to the prior art.
Figure 2 shows an apparatus for wave soldering according to a particularly preferred embodiment of the invention.
In the figures, corresponding elements are indicated by identical reference numerals. A repeated explanation thereof is omitted for clarity.
For wave soldering according to the prior art, devices as shown in Figure 1 are used. Figure 1 shows an apparatus 10 for wave soldering of workpieces 2. The device comprises a solder reservoir 3 in which liquid solder 4 (shaded) is contained. The solder 4, in the solder reservoir, is contained up to a certain height, variable to some extent, and a solder level 4' is formed. A solder nozzle 5 is provided which has at least one solder outlet opening 5'. The solder outlet opening 5' is located above the solder level 4'. The workpiece 2 is moved via a conveyor, not shown, in processing direction 2' obliquely upward, illustrated by a dashed arrow, across the solder nozzle 5 or the solder outlet opening 5' and gets in contact with solder 4 emerging from solder nozzle 5. Workpiece 2 is wetted in specific areas (solder joints) by the solder 4. Solder not adhering to the workpiece 2 flows back into the solder reservoir 3 via solder streams 4". The flow of the solder 4 is illustrated by solid arrows. The solder 4 in the solder reservoir 3 is kept liquid by means of a heating device 9 and is pumped by means of a soldering pump 8 through solder nozzle 5.
Figure 2 shows a device according to a particularly preferred embodiment of the invention. The device is generally designated with 1 and comprises the elements of device 100 previously explained in relation to figure 1 .
In the apparatus 1 , a solder collection and recirculation device 6 for the solder 4 is provided, which comprises, in the exemplary illustration of figure 2, a solder collection tray 6' and a solder duct 6". The solder collection tray 6' is arranged above the solder level 4' and thereby ensures a greatly reduced drop height of the solder 4. In addition, a solder guiding means 7 can be provided, for example in the form of accordingly bent metal sheets, and ensures a particularly gentle transfer of the solder 4 into the tray 6' of the collection and recirculation device 6. The collection and recirculation device 6 may surround the solder nozzle 5 in an annular manner. Additionally, but not shown in Figure 2, at least one protective gas device may be provided by which specific areas of the tray 6' or solder 4 collected therein can be supplied with an inert protective gas.
List of Reference Numerals
1 , 10 device for wave soldering
2 workpiece
2' processing direction
3 solder reservoir
4 solder
4' solder level
5 solder nozzle
5' solder nozzle outlet opening
6 collection and recirculation device
6' collection tray
6" solder duct
7 solder guiding means
8 solder pump
9 heater
Claims
1 . Device (1 ) for wave soldering of workpieces (2), comprising a solder reservoir (3) for liquid solder (4) and at least one solder nozzle (5) with at least one solder outlet opening (5') above a solder level (4') of solder (4) in the solder reservoir (3), characterized by at least one collection and recirculation device (6) adapted to collect solder (4) exiting at least one solder outlet opening (5') and not adhering to the work pieces (2) and for returning or recirculating the collected solder (4) into the solder reservoir (3), wherein the at least one collection and recirculation device (6) is arranged at least in part above the solder level (4').
2. Device (1 ) according to claim 1 , in which the collection and recirculation device (6) comprises an open collection tray (6') and, connected with the collection tray (6'), a solder duct (6") ending at or below the solder level (4') in the solder reservoir (3).
3. Device (1 ) according to claim 1 or 2, comprising a solder guiding means (7) to guide solder (4) into the at least one solder collection and recirculation device (6).
4. Device (1 ) according to any one of the preceding claims, comprising at least one solder collection and recirculation device (6) adapted for the collection of solder (4) from several solder nozzles (5).
5. Device (1 ) according to any one of the preceding claims, comprising at least one protective gas device (8).
6. Device (1 ) according any one of the preceding claims, comprising at least one solder pump (9).
7. Device (1 ) according to any one of the preceding claims, comprising at least one heating device (10).
8. Method for wave soldering of workpieces (2) using a device (1 ) according to any one of the preceding claims, comprising contacting the workpieces (2) with liquid solder (4) provided in a solder reservoir (3) of the device (1 ) via at least one solder nozzle (5) comprising at least one solder outlet opening (5') arranged above a solder level (4') of solder (4) in the solder reservoir (3), wherein solder (4) not adhering to the workpieces (2) is collected above the solder level (4') and is recirculated to the solder reservoir (3) via a at least one solder collection and recirculation device (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2011/078252 WO2013020290A1 (en) | 2011-08-11 | 2011-08-11 | Device and method for wave soldering of workpieces with solder recirculation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2011/078252 WO2013020290A1 (en) | 2011-08-11 | 2011-08-11 | Device and method for wave soldering of workpieces with solder recirculation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2013020290A1 true WO2013020290A1 (en) | 2013-02-14 |
Family
ID=47667872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2011/078252 WO2013020290A1 (en) | 2011-08-11 | 2011-08-11 | Device and method for wave soldering of workpieces with solder recirculation |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2013020290A1 (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4802617A (en) * | 1988-02-19 | 1989-02-07 | Electrovert Limited | Restriction of dross formation in a soldering apparatus |
| CN2274540Y (en) * | 1996-08-19 | 1998-02-18 | 张国琦 | Single/dual wave crest asynchronous inductive electric pump for liquid metal soldering |
| US20020047039A1 (en) * | 2000-10-23 | 2002-04-25 | Shohei Mawatari | Automatic wave soldering apparatus and method |
| CN1479568A (en) * | 2002-06-11 | 2004-03-03 | 千住金属工业株式会社 | Wave soldering equipment |
| CN101563181A (en) * | 2007-01-18 | 2009-10-21 | 林德股份公司 | Device and method for selective soldering |
-
2011
- 2011-08-11 WO PCT/CN2011/078252 patent/WO2013020290A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4802617A (en) * | 1988-02-19 | 1989-02-07 | Electrovert Limited | Restriction of dross formation in a soldering apparatus |
| CN2274540Y (en) * | 1996-08-19 | 1998-02-18 | 张国琦 | Single/dual wave crest asynchronous inductive electric pump for liquid metal soldering |
| US20020047039A1 (en) * | 2000-10-23 | 2002-04-25 | Shohei Mawatari | Automatic wave soldering apparatus and method |
| CN1479568A (en) * | 2002-06-11 | 2004-03-03 | 千住金属工业株式会社 | Wave soldering equipment |
| CN101563181A (en) * | 2007-01-18 | 2009-10-21 | 林德股份公司 | Device and method for selective soldering |
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