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WO2013006442A3 - Method for handling a wafer - Google Patents

Method for handling a wafer Download PDF

Info

Publication number
WO2013006442A3
WO2013006442A3 PCT/US2012/044955 US2012044955W WO2013006442A3 WO 2013006442 A3 WO2013006442 A3 WO 2013006442A3 US 2012044955 W US2012044955 W US 2012044955W WO 2013006442 A3 WO2013006442 A3 WO 2013006442A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
handling
film
relates
dbg
Prior art date
Application number
PCT/US2012/044955
Other languages
French (fr)
Other versions
WO2013006442A2 (en
Inventor
Maria Parals SENDIN
Terry Sterrett
Albert P. Perez
Dave PEARD
Ciaran Mcardle
Original Assignee
Henkel Ag & Co. Kgaa
Henkel Ireland Limited
Henkel Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Ag & Co. Kgaa, Henkel Ireland Limited, Henkel Corporation filed Critical Henkel Ag & Co. Kgaa
Publication of WO2013006442A2 publication Critical patent/WO2013006442A2/en
Publication of WO2013006442A3 publication Critical patent/WO2013006442A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to a method for handling a wafer which comprises a plurality of grooves on its surface. The invention further relates to an assembly, comprising a wafer and a shape memory polymer film and to the use of said film as a fixing device device in dicing before grinding (DBG) processes.
PCT/US2012/044955 2011-07-01 2012-06-29 Method for handling a wafer WO2013006442A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161503796P 2011-07-01 2011-07-01
US61/503,796 2011-07-01

Publications (2)

Publication Number Publication Date
WO2013006442A2 WO2013006442A2 (en) 2013-01-10
WO2013006442A3 true WO2013006442A3 (en) 2013-05-10

Family

ID=47437640

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2012/044955 WO2013006442A2 (en) 2011-07-01 2012-06-29 Method for handling a wafer

Country Status (2)

Country Link
TW (1) TW201312683A (en)
WO (1) WO2013006442A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI540644B (en) 2011-07-01 2016-07-01 漢高智慧財產控股公司 Use of repellent material to protect fabrication regions in semiconductor assembly
US9623813B2 (en) * 2013-11-14 2017-04-18 GM Global Technology Operations LLC Fit and finish methods
CN104891426B (en) * 2015-04-07 2016-06-22 哈尔滨工业大学 A kind of preparation method with the micro-patterned films of selective stimulating recovery function

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0316666A1 (en) * 1987-11-13 1989-05-24 The Firestone Tire & Rubber Company Amine curable prepolymer or polymer precured elastomer tread application at ambient or relatively low temperatures
US5211877A (en) * 1988-09-08 1993-05-18 Consortium Fur Elektrochemische Industrie Gmbh Liquid-crystalline polyorganosiloxanes containing (meth) acryloxy groups
US20040146715A1 (en) * 2001-07-17 2004-07-29 Guire Patrick E. Self assembling monolayer compositions
US20060046433A1 (en) * 2004-08-25 2006-03-02 Sterrett Terry L Thinning semiconductor wafers
US20060159867A1 (en) * 2005-01-19 2006-07-20 O'donnell Stephen D High-strength optical bonding method using optical silicone as a bonding medium and pressure sensitive adhesive as an intermediate layer

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0316666A1 (en) * 1987-11-13 1989-05-24 The Firestone Tire & Rubber Company Amine curable prepolymer or polymer precured elastomer tread application at ambient or relatively low temperatures
US5211877A (en) * 1988-09-08 1993-05-18 Consortium Fur Elektrochemische Industrie Gmbh Liquid-crystalline polyorganosiloxanes containing (meth) acryloxy groups
US20040146715A1 (en) * 2001-07-17 2004-07-29 Guire Patrick E. Self assembling monolayer compositions
US20060046433A1 (en) * 2004-08-25 2006-03-02 Sterrett Terry L Thinning semiconductor wafers
US20060159867A1 (en) * 2005-01-19 2006-07-20 O'donnell Stephen D High-strength optical bonding method using optical silicone as a bonding medium and pressure sensitive adhesive as an intermediate layer

Also Published As

Publication number Publication date
WO2013006442A2 (en) 2013-01-10
TW201312683A (en) 2013-03-16

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