有线电子设备 技术领域 本发明涉及通信领域， 具体而言， 涉及一种有线电子设备。 背景技术 线缆在有线通讯产品中的应用非常广， 但是线缆（例如， 光纤） 的耐温性比较差， 一般在工作环境温度 Ta<70°C的情景下才能保证正常工作； 相对而言， 设备主板上的 器件的耐温性要好一些， 一般可以在工作环境温度 Ta<85°C的情景下正常工作。 因此， 在同一温度的工作环境中， 线缆的较差耐温性成为设备散热的短板， 尤其在高温环境 中， 线缆很容易因为工作环境温度过高而损坏。 目前， 一些户外通讯产品基于考虑环保降耗的需求， 开始使用无源散热 （即自然 散热） 设计方法， 例如， 无源散热设计方法在一些无线通讯产品 （例如， RRU) 上的 应用是比较成功的。 对于有线通讯产品， 线缆的耐温性比较差， 所以散热多采用强制 风冷设备， 然而， 强制风冷设备 （例如， 风机） 的应用容易产生噪声超标、 灰尘堵塞 等一系列问题， 如果将无源散热设计方法应用于有线通讯产品， 就必须考虑到为线缆 和发热主板创造不同的应用环境， 而目前对于该技术问题尚未提出有效的解决方案。 发明内容 本发明提供了一种有线电子设备， 以至少解决上述问题。 根据本发明， 提供了一种有线电子设备， 包括： 线缆、 配线箱体和用户单元， 其 中， 线缆容纳于配线箱体内； 用户单元包括： 主板、 器件及导热部件； 配线箱体与用 户单元隔离设置并连接。 优选地， 上述配线箱体设置有第一开口， 用户单元设置有第二开口， 线缆通过第 一开口与第二开口连接至用户单元。 优选地， 上述第一开口位于配线箱体的下部， 第二开口设置在用户单元上与第一 开口对应的位置。 优选地， 上述配线箱体设置有第一信号连接插件， 用户单元设置有第二信号连接 插件， 配线箱体通过第一信号连接插件和第二信号连接插件与用户单元连接。
优选地， 上述第一信号连接插件、 第二信号连接插件分别位于配线箱体、 用户单 元的下部， 且第一信号连接插件与第二信号连接插件吻合连接。 优选地， 上述导热部件为散热壳体。 优选地， 上述散热壳体为表面设置有散热齿的压铸壳体、 中间穿有热管的散热翅 片。 优选地， 上述散热壳体中间埋设有导热块或均热板。 优选地， 上述配线箱体与用户单元的连接部分采用防水密封材料进行封接。 通过本发明， 采用配线箱体与用户单元隔离设置的方式， 解决了由于用户单元的 耐热性强、 线缆耐热性弱导致在同一环境温度下， 影响线缆的信号传输质量的问题， 从而无需使用强制风冷设备对线缆进行散热， 进而达到了降低能耗的效果。 附图说明 此处所说明的附图用来提供对本发明的进一步理解， 构成本申请的一部分， 本发 明的示意性实施例及其说明用于解释本发明， 并不构成对本发明的不当限定。 在附图 中： 图 1是根据本发明实施例的有线电子设备连接状态的结构示意图； 图 2是根据本发明优选实施例一的有线电子设备分离状态的结构示意图； 图 3是根据本发明优选实施例二的有线电子设备分离状态的结构示意图； 图 4是根据本发明实施例的用户单元的结构示意图。 具体实施方式 下文中将参考附图并结合实施例来详细说明本发明。 需要说明的是， 在不冲突的 情况下， 本申请中的实施例及实施例中的特征可以相互组合。 图 1是根据本发明实施例的有线电子设备连接状态的结构示意图， 如图 1所示， 该有线电子设备包括： 线缆 12、 配线箱体 10和用户单元 20， 其中， 线缆 12容纳于配 线箱体 10内； 用户单元 20包括： 主板 21、 器件 22及导热部件 23; 配线箱体 10与用 户单元 20隔离设置并连接。 为了能够清楚说明用户单元 20的结构， 请同时参考图 4，
图 4是根据本发明实施例的用户单元 20的结构示意图， 如图 4所示， 主板 21和器件 22位于导热部件 23内部， 器件 22位于主板 21上（例如， 主板为 PCB， 器件 22通常 被焊接在 PCB上）。 在本发明的一个优选实施方式中， 导热部件为散热壳体。 优选地， 散热壳体可以 为表面设置有散热齿的压铸壳体、 中间穿有热管的散热翅片； 优选地， 散热壳体中间 也可以埋设有导热块或均热板。 在实际应用中，将线缆 12单独内置在配线箱体 10内，可以使线缆 12位于独立的 工作温度环境下， 使其不受周围较高温度的影响， 同时也不必采用强制风冷设备进行 散热降温， 完全可以通过自然散热方式解决线缆 12散热的问题， 同时， 采用上述独立 设置方式设置的用户单元 20也可以通过自然散热的方式自身散热的问题。 采用独立设置的方式， 将线缆 12单独配置在一个箱体 （配线箱体 10 ) 内， 实现 与用户单元 20的隔离， 可以减少用户单元 20散发的热量对箱体的温度影响， 从而使 得线缆 12的环境温度低于发热主板的环境温度， 屏蔽线缆 12由于耐温性差带来的散 热短板效应， 进一步提升了有线电子设备的总体耐温性能， 使得有线电子产品能够在 更高的环境温度下工作， 甚至可以作为室外电子设备使用。 图 2是根据本发明优选实施例一的有线电子设备分离状态的结构示意图， 如图 2 所示， 为了便于配线箱体 10和用户单元 20连接，可以在配线箱体 10设置有第一开口 14， 用户单元 20设置有第二开口 24， 线缆 12通过第一开口 14与第二开口 24连接至 用户单元 20， 优选地， 第一开口 14可以位于配线箱体 10的下部， 第二开口 24可以 设置在用户单元 20上与第一开口 14对应的位置。 图 3是根据本发明优选实施例二的有线电子设备分离状态的结构示意图， 如图 3 所示， 同样， 为了便于配线箱体 10和用户单元 20连接， 可以在配线箱体 10上设置有 第一信号连接插件 16， 在用户单元 20上设置有第二信号连接插件 25， 配线箱体 10 通过第一信号连接插件 16和第二信号连接插件 25与用户单元 20连接，优选地，第一 信号连接插件 16、第二信号连接插件 25可以分别位于配线箱体 10、用户单元 20的下 部， 且第一信号连接插件 16与第二信号连接插件 25吻合连接。 采用上述两种连接方式可以很好地实现配线箱体 10与用户单元 20之间的信号传 输。 其中， 当在配线箱体 10设置有第一开口 14， 用户单元 20设置有第二开口 24时， 最好是将开口的位置均设置在配线箱体 10与用户单元 20的下方， 因为自然散热时， 电子设备 （主要是主板和器件） 产生的热量容易受浮生力影响而向上散发， 所以， 电 子设备周围高位处的环境温度要比低位处的环境温度要高一些。 由此， 在配线箱体 10
与用户单元 20 的开口连接处， 用户单元 20 内的热量会通过开口传导至配线箱体 10 内， 从而对配线箱体 10内的温度有少许的影响。 基于此， 将开口位置设置在低位处， 可以减少用户单元 20对配线箱体 10的热影响。 当然， 当在配线箱体 10设置有第一信号连接插件 16， 用户单元 20设置有第二信 号连接插件 25时， 也可以将插件均设置在配线箱体 10与用户单元 20的下方， 配线箱 体 10与用户单元 20可以通过上述两个插件即可实现盲插，这样，在用户单元 20与配 线箱体 10 的连接处， 用户单元 20 内的热量通常不会通过连接处流入到配线箱体 10 内， 使用户单元腔体内的热量对配线箱体 10的影响作用会更小。 在本发明的一个优选实施方式中， 配线箱体 10与用户单元 20的连接部分可以采 用防水密封材料进行封接。 从以上的描述中， 可以看出， 本发明实现了如下技术效果： 克服现有技术中有线 电子设备通常采用的强制风冷散热手段带来的噪声和防尘问题， 以及现有技术中有线 产品采用无源自然散热手段带来的由于电缆耐温差而成为散热设计短板， 采用将配线 箱体与用户单元分开独立设置的方式， 提升了有线电子设备的使用环境温度， 甚至可 作为室外使用时的热设计方法， 从而实现了环保低耗， 提高了产品的可靠性的效果。 以上所述仅为本发明的优选实施例而已， 并不用于限制本发明， 对于本领域的技 术人员来说， 本发明可以有各种更改和变化。 凡在本发明的精神和原则之内， 所作的 任何修改、 等同替换、 改进等， 均应包含在本发明的保护范围之内。
TECHNICAL FIELD The present invention relates to the field of communications, and in particular to a wired electronic device. BACKGROUND OF THE INVENTION Cables are widely used in wired communication products, but cables (for example, optical fibers) have relatively poor temperature resistance, and generally work under the working environment temperature Ta < 70 ° C to ensure normal operation; The temperature resistance of the device on the motherboard of the device is better. Generally, it can work normally under the working environment temperature Ta<85°C. Therefore, in the working environment of the same temperature, the poor temperature resistance of the cable becomes a short board for heat dissipation of the device, especially in a high temperature environment, the cable is easily damaged due to excessive working temperature. At present, some outdoor communication products are based on the consideration of environmental protection and consumption reduction, and begin to use passive heat dissipation (ie, natural heat dissipation) design methods. For example, the passive heat dissipation design method is more successful in some wireless communication products (for example, RRU). of. For wired communication products, the temperature resistance of the cable is relatively poor, so the forced air cooling equipment is often used for heat dissipation. However, the application of forced air cooling equipment (for example, a fan) is prone to a series of problems such as excessive noise and dust clogging. The passive thermal design method applied to wired communication products must take into account the different application environments for cable and heat-generating motherboards, and no effective solution has been proposed for this technical problem. SUMMARY OF THE INVENTION The present invention provides a wired electronic device to address at least the above problems. According to the present invention, there is provided a wired electronic device comprising: a cable, a wiring box body and a subscriber unit, wherein the cable is housed in the wiring box; the subscriber unit comprises: a main board, a device and a heat conducting component; The body is set up and connected to the user unit. Preferably, the wiring box body is provided with a first opening, and the subscriber unit is provided with a second opening, and the cable is connected to the subscriber unit through the first opening and the second opening. Preferably, the first opening is located at a lower portion of the wiring box body, and the second opening is disposed at a position corresponding to the first opening on the subscriber unit. Preferably, the wiring box body is provided with a first signal connection plug-in, and the subscriber unit is provided with a second signal connection plug-in, and the wiring box body is connected to the subscriber unit through the first signal connection plug-in and the second signal connection plug-in. Preferably, the first signal connection plug and the second signal connection plug are respectively located in a lower part of the wiring box body and the subscriber unit, and the first signal connection plug is connected to the second signal connection plug. Preferably, the heat conducting member is a heat dissipation housing. Preferably, the heat dissipation housing is a die-cast housing having heat dissipating teeth on its surface, and heat dissipating fins with a heat pipe interposed therebetween. Preferably, a heat conducting block or a heat equalizing plate is embedded in the middle of the heat dissipating casing. Preferably, the connecting portion of the wiring box body and the subscriber unit is sealed by a waterproof sealing material. The invention solves the problem that the signal transmission quality of the cable is affected at the same ambient temperature due to the strong heat resistance of the subscriber unit and the weak heat resistance of the subscriber unit by means of the isolation arrangement of the wiring box body and the subscriber unit. Therefore, it is not necessary to use a forced air-cooling device to dissipate the cable, thereby achieving the effect of reducing energy consumption. BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are set to illustrate,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic structural view showing a connection state of a wired electronic device according to an embodiment of the present invention; FIG. 2 is a schematic structural view showing a separated state of a wired electronic device according to a preferred embodiment of the present invention; FIG. 4 is a schematic structural diagram of a user unit according to an embodiment of the present invention. FIG. BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. It should be noted that the embodiments in the present application and the features in the embodiments may be combined with each other without conflict. 1 is a schematic structural diagram of a connection state of a wired electronic device according to an embodiment of the present invention. As shown in FIG. 1, the wired electronic device includes: a cable 12, a wiring box 10, and a subscriber unit 20, wherein the cable 12 accommodates The user unit 20 includes: a main board 21, a device 22, and a heat conducting member 23; the wiring box body 10 is disposed and connected to the user unit 20. In order to clearly explain the structure of the subscriber unit 20, please refer to FIG. 4 at the same time. 4 is a schematic structural diagram of a subscriber unit 20 according to an embodiment of the present invention. As shown in FIG. 4, the motherboard 21 and the device 22 are located inside the heat conducting component 23, and the device 22 is located on the motherboard 21. (For example, the motherboard is a PCB, and the device 22 is usually Soldered on the PCB). In a preferred embodiment of the invention, the thermally conductive component is a heat sink housing. Preferably, the heat dissipating housing may be a die-cast housing with heat dissipating teeth on the surface and heat dissipating fins with a heat pipe interposed therebetween. Preferably, a heat conducting block or a heat equalizing plate may be embedded in the middle of the heat dissipating housing. In practical applications, the cable 12 is separately built into the wiring box body 10, so that the cable 12 can be placed in an independent working temperature environment, so as not to be affected by the high temperature of the surroundings, and it is not necessary to use forced air cooling. The device performs heat dissipation and cooling, and the problem of heat dissipation of the cable 12 can be solved by the natural heat dissipation method. At the same time, the user unit 20 set by the above independent setting method can also radiate heat by itself. The cable 12 is separately disposed in a box (the wiring box body 10) in an independent manner to achieve isolation from the subscriber unit 20, thereby reducing the influence of the heat radiated by the subscriber unit 20 on the temperature of the cabinet, thereby The ambient temperature of the cable 12 is lower than the ambient temperature of the heat-generating motherboard, and the shielded cable 12 has a heat-dissipating short-board effect due to poor temperature resistance, further improving the overall temperature resistance of the wired electronic device, enabling the wired electronic product to be higher. Working at ambient temperatures, it can even be used as an outdoor electronic device. 2 is a schematic structural diagram of a separated state of a wired electronic device according to a preferred embodiment of the present invention. As shown in FIG. 2, in order to facilitate connection between the wiring box 10 and the subscriber unit 20, the wiring box body 10 may be provided with a first The opening 14 , the subscriber unit 20 is provided with a second opening 24 , and the cable 12 is connected to the subscriber unit 20 through the first opening 14 and the second opening 24 . Preferably, the first opening 14 may be located at a lower portion of the wiring enclosure 10 , The two openings 24 may be disposed at positions on the subscriber unit 20 corresponding to the first openings 14. 3 is a schematic structural diagram of a separated state of a wired electronic device according to a preferred embodiment 2 of the present invention. As shown in FIG. 3, similarly, in order to facilitate connection between the wiring box 10 and the subscriber unit 20, the wiring box 10 can be disposed on the wiring box 10. The first signal connection plug-in 16 is provided, and the second signal connection plug-in 25 is disposed on the subscriber unit 20, and the wiring box body 10 is connected to the subscriber unit 20 via the first signal connection plug-in 16 and the second signal connection plug-in 25, preferably, The first signal connection plug-in 16 and the second signal connection plug-in 25 can be respectively located in the lower part of the wiring box body 10 and the subscriber unit 20, and the first signal connection plug-in 16 is matched with the second signal connection plug-in 25. The signal transmission between the wiring box 10 and the subscriber unit 20 can be well achieved by using the above two connection methods. Wherein, when the wiring box body 10 is provided with the first opening 14 and the subscriber unit 20 is provided with the second opening 24, it is preferable to set the positions of the openings below the wiring box body 10 and the subscriber unit 20, because When the heat is naturally dissipated, the heat generated by the electronic devices (mainly the main board and the device) is easily absorbed by the floating force, so the ambient temperature around the high position of the electronic device is higher than the ambient temperature at the lower position. Thereby, in the wiring box body 10 At the junction with the opening of the subscriber unit 20, heat within the subscriber unit 20 is conducted through the opening into the wiring enclosure 10, thereby having a slight effect on the temperature within the wiring enclosure 10. Based on this, by setting the opening position at a low position, the thermal influence of the subscriber unit 20 on the wiring box body 10 can be reduced. Of course, when the first signal connection plug-in 16 is disposed in the wiring box body 10, and the second signal connection card 25 is disposed in the user unit 20, the plug-ins may also be disposed under the wiring box body 10 and the subscriber unit 20, The wiring box body 10 and the subscriber unit 20 can be blindly inserted through the above two plug-ins, so that at the junction of the subscriber unit 20 and the wiring box body 10, the heat in the subscriber unit 20 usually does not flow through the connection. In the wiring box body 10, the effect of the heat in the user unit cavity on the wiring box body 10 is smaller. In a preferred embodiment of the present invention, the connection portion of the wiring box body 10 and the subscriber unit 20 may be sealed with a waterproof sealing material. From the above description, it can be seen that the present invention achieves the following technical effects: Overcoming the noise and dust-proof problems caused by the forced air-cooling heat dissipation method commonly used in wired electronic devices in the prior art, and the wired products in the prior art The use of passive natural heat dissipation means that the heat dissipation design is short due to the temperature difference of the cable, and the wiring cabinet and the user unit are separately and independently arranged, thereby improving the operating environment temperature of the wired electronic device, and even being used outdoors. At the time of the thermal design method, the environmental protection and low consumption are realized, and the reliability of the product is improved. The above is only the preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes can be made to the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and scope of the present invention are intended to be included within the scope of the present invention.