WO2012098840A1 - 樹脂組成物およびそれを含む成形品 - Google Patents
樹脂組成物およびそれを含む成形品 Download PDFInfo
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- WO2012098840A1 WO2012098840A1 PCT/JP2012/000162 JP2012000162W WO2012098840A1 WO 2012098840 A1 WO2012098840 A1 WO 2012098840A1 JP 2012000162 W JP2012000162 W JP 2012000162W WO 2012098840 A1 WO2012098840 A1 WO 2012098840A1
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- WIPO (PCT)
- Prior art keywords
- polyamide
- acid
- resin composition
- μmol
- mol
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 58
- 239000004952 Polyamide Substances 0.000 claims abstract description 105
- 229920002647 polyamide Polymers 0.000 claims abstract description 105
- 229920005989 resin Polymers 0.000 claims abstract description 93
- 239000011347 resin Substances 0.000 claims abstract description 93
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 71
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 44
- 125000003277 amino group Chemical group 0.000 claims abstract description 39
- 125000004018 acid anhydride group Chemical group 0.000 claims abstract description 34
- 239000011231 conductive filler Substances 0.000 claims abstract description 34
- 150000001875 compounds Chemical class 0.000 claims abstract description 28
- KKEYFWRCBNTPAC-UHFFFAOYSA-N terephthalic acid group Chemical group C(C1=CC=C(C(=O)O)C=C1)(=O)O KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims abstract description 23
- 125000004427 diamine group Chemical group 0.000 claims abstract description 12
- 125000001142 dicarboxylic acid group Chemical group 0.000 claims abstract description 11
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical group C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000000446 fuel Substances 0.000 claims description 40
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 17
- GAGWMWLBYJPFDD-UHFFFAOYSA-N 2-methyloctane-1,8-diamine Chemical group NCC(C)CCCCCCN GAGWMWLBYJPFDD-UHFFFAOYSA-N 0.000 claims description 12
- 239000002041 carbon nanotube Substances 0.000 claims description 12
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 12
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical group NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 claims description 12
- 125000004432 carbon atom Chemical group C* 0.000 claims description 11
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 11
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 8
- 239000004917 carbon fiber Substances 0.000 claims description 8
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 6
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 5
- 239000011737 fluorine Substances 0.000 claims description 5
- 229910052731 fluorine Inorganic materials 0.000 claims description 5
- 229920005554 polynitrile Polymers 0.000 claims description 4
- 229920005672 polyolefin resin Polymers 0.000 claims description 4
- -1 aliphatic diamine Chemical class 0.000 abstract description 46
- 239000000203 mixture Substances 0.000 abstract description 22
- 229920001577 copolymer Polymers 0.000 description 31
- 238000006243 chemical reaction Methods 0.000 description 27
- 238000000034 method Methods 0.000 description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 22
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 20
- 238000004898 kneading Methods 0.000 description 19
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 15
- 238000002844 melting Methods 0.000 description 14
- 230000008018 melting Effects 0.000 description 14
- 238000006116 polymerization reaction Methods 0.000 description 13
- 239000002994 raw material Substances 0.000 description 12
- 239000010410 layer Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 11
- 239000000155 melt Substances 0.000 description 11
- 239000005711 Benzoic acid Substances 0.000 description 10
- 230000004888 barrier function Effects 0.000 description 10
- 235000010233 benzoic acid Nutrition 0.000 description 10
- 239000007790 solid phase Substances 0.000 description 10
- 230000000903 blocking effect Effects 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 229920006012 semi-aromatic polyamide Polymers 0.000 description 9
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 8
- 239000012153 distilled water Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 238000000465 moulding Methods 0.000 description 8
- 229910052757 nitrogen Inorganic materials 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- KOUDKOMXLMXFKX-UHFFFAOYSA-N sodium oxido(oxo)phosphanium hydrate Chemical compound O.[Na+].[O-][PH+]=O KOUDKOMXLMXFKX-UHFFFAOYSA-N 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 238000011144 upstream manufacturing Methods 0.000 description 8
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 150000004985 diamines Chemical class 0.000 description 7
- 239000000945 filler Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 235000014113 dietary fatty acids Nutrition 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 239000000194 fatty acid Substances 0.000 description 6
- 229930195729 fatty acid Natural products 0.000 description 6
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical group NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000005038 ethylene vinyl acetate Substances 0.000 description 5
- 150000003951 lactams Chemical group 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
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- 230000009257 reactivity Effects 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- 239000003381 stabilizer Substances 0.000 description 5
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 4
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000004594 Masterbatch (MB) Substances 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 4
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 4
- 239000006229 carbon black Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 239000003484 crystal nucleating agent Substances 0.000 description 4
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 4
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 4
- 150000004665 fatty acids Chemical class 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 239000002828 fuel tank Substances 0.000 description 4
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 4
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 4
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 4
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 4
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 4
- 229920002239 polyacrylonitrile Polymers 0.000 description 4
- 229920000915 polyvinyl chloride Polymers 0.000 description 4
- 239000004800 polyvinyl chloride Substances 0.000 description 4
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 4
- 238000004448 titration Methods 0.000 description 4
- SZHOJFHSIKHZHA-UHFFFAOYSA-N tridecanoic acid Chemical compound CCCCCCCCCCCCC(O)=O SZHOJFHSIKHZHA-UHFFFAOYSA-N 0.000 description 4
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 4
- JZUHIOJYCPIVLQ-UHFFFAOYSA-N 2-methylpentane-1,5-diamine Chemical compound NCC(C)CCCN JZUHIOJYCPIVLQ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 229920000571 Nylon 11 Polymers 0.000 description 3
- 229920000299 Nylon 12 Polymers 0.000 description 3
- 229920002302 Nylon 6,6 Polymers 0.000 description 3
- 239000002033 PVDF binder Substances 0.000 description 3
- 229920009638 Tetrafluoroethylene-Hexafluoropropylene-Vinylidenefluoride Copolymer Polymers 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical group 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 229920001903 high density polyethylene Polymers 0.000 description 3
- 239000004700 high-density polyethylene Substances 0.000 description 3
- 239000003273 ketjen black Substances 0.000 description 3
- 229920001684 low density polyethylene Polymers 0.000 description 3
- 239000004702 low-density polyethylene Substances 0.000 description 3
- 239000000314 lubricant Substances 0.000 description 3
- 238000006386 neutralization reaction Methods 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 3
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 2
- PBLZLIFKVPJDCO-UHFFFAOYSA-N 12-aminododecanoic acid Chemical compound NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000005635 Caprylic acid (CAS 124-07-2) Substances 0.000 description 2
- MHZGKXUYDGKKIU-UHFFFAOYSA-N Decylamine Chemical compound CCCCCCCCCCN MHZGKXUYDGKKIU-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 101000576320 Homo sapiens Max-binding protein MNT Proteins 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
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- 235000021314 Palmitic acid Nutrition 0.000 description 2
- 229930182556 Polyacetal Natural products 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
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- 229920001328 Polyvinylidene chloride Polymers 0.000 description 2
- 229920006121 Polyxylylene adipamide Polymers 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
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- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 229920001893 acrylonitrile styrene Polymers 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- QMKYBPDZANOJGF-UHFFFAOYSA-N benzene-1,3,5-tricarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=CC(C(O)=O)=C1 QMKYBPDZANOJGF-UHFFFAOYSA-N 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- NZNMSOFKMUBTKW-UHFFFAOYSA-N cyclohexanecarboxylic acid Chemical compound OC(=O)C1CCCCC1 NZNMSOFKMUBTKW-UHFFFAOYSA-N 0.000 description 2
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- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
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- 230000005611 electricity Effects 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
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- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 2
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- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 2
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- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
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- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000002715 modification method Methods 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- FTQWRYSLUYAIRQ-UHFFFAOYSA-N n-[(octadecanoylamino)methyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCNC(=O)CCCCCCCCCCCCCCCCC FTQWRYSLUYAIRQ-UHFFFAOYSA-N 0.000 description 1
- RKISUIUJZGSLEV-UHFFFAOYSA-N n-[2-(octadecanoylamino)ethyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCCNC(=O)CCCCCCCCCCCCCCCCC RKISUIUJZGSLEV-UHFFFAOYSA-N 0.000 description 1
- ABMFBCRYHDZLRD-UHFFFAOYSA-N naphthalene-1,4-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1 ABMFBCRYHDZLRD-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- WPUMVKJOWWJPRK-UHFFFAOYSA-N naphthalene-2,7-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=CC2=CC(C(=O)O)=CC=C21 WPUMVKJOWWJPRK-UHFFFAOYSA-N 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- ZWLPBLYKEWSWPD-UHFFFAOYSA-N o-toluic acid Chemical compound CC1=CC=CC=C1C(O)=O ZWLPBLYKEWSWPD-UHFFFAOYSA-N 0.000 description 1
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 1
- CJYCVQJRVSAFKB-UHFFFAOYSA-N octadecane-1,18-diamine Chemical compound NCCCCCCCCCCCCCCCCCCN CJYCVQJRVSAFKB-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- TXRPLFBVYIKTSU-UHFFFAOYSA-N pentadecane-1,15-diamine Chemical compound NCCCCCCCCCCCCCCCN TXRPLFBVYIKTSU-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- ZQBAKBUEJOMQEX-UHFFFAOYSA-N phenyl salicylate Chemical class OC1=CC=CC=C1C(=O)OC1=CC=CC=C1 ZQBAKBUEJOMQEX-UHFFFAOYSA-N 0.000 description 1
- 229960003424 phenylacetic acid Drugs 0.000 description 1
- 239000003279 phenylacetic acid Substances 0.000 description 1
- 150000004986 phenylenediamines Chemical class 0.000 description 1
- XRBCRPZXSCBRTK-UHFFFAOYSA-N phosphonous acid Chemical class OPO XRBCRPZXSCBRTK-UHFFFAOYSA-N 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical class OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- IUGYQRQAERSCNH-UHFFFAOYSA-N pivalic acid Chemical compound CC(C)(C)C(O)=O IUGYQRQAERSCNH-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 1
- 229920006128 poly(nonamethylene terephthalamide) Polymers 0.000 description 1
- 229920002490 poly(thioether-sulfone) polymer Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920001470 polyketone Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920006295 polythiol Polymers 0.000 description 1
- YLLIGHVCTUPGEH-UHFFFAOYSA-M potassium;ethanol;hydroxide Chemical compound [OH-].[K+].CCO YLLIGHVCTUPGEH-UHFFFAOYSA-M 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000446 sulfanediyl group Chemical group *S* 0.000 description 1
- MSVPBWBOFXVAJF-UHFFFAOYSA-N tetradecane-1,14-diamine Chemical compound NCCCCCCCCCCCCCCN MSVPBWBOFXVAJF-UHFFFAOYSA-N 0.000 description 1
- 238000009757 thermoplastic moulding Methods 0.000 description 1
- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- BPSKTAWBYDTMAN-UHFFFAOYSA-N tridecane-1,13-diamine Chemical compound NCCCCCCCCCCCCCN BPSKTAWBYDTMAN-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- KLNPWTHGTVSSEU-UHFFFAOYSA-N undecane-1,11-diamine Chemical compound NCCCCCCCCCCCN KLNPWTHGTVSSEU-UHFFFAOYSA-N 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
- C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/041—Carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C08L101/06—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
- C08L101/08—Carboxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/06—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- F16L11/00—Hoses, i.e. flexible pipes
- F16L11/04—Hoses, i.e. flexible pipes made of rubber or flexible plastics
- F16L11/06—Hoses, i.e. flexible pipes made of rubber or flexible plastics with homogeneous wall
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- F16L9/00—Rigid pipes
- F16L9/12—Rigid pipes of plastics with or without reinforcement
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- F16L9/00—Rigid pipes
- F16L9/12—Rigid pipes of plastics with or without reinforcement
- F16L9/125—Rigid pipes of plastics with or without reinforcement electrically conducting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
- Y10T428/139—Open-ended, self-supporting conduit, cylinder, or tube-type article
Definitions
- the present invention relates to a conductive polyamide resin composition excellent in conductivity, low-temperature impact resistance, fuel barrier property, and moldability, and a molded article containing the same.
- resin is an electrically insulating material, but in many applications, electrical conductivity is required in applications such as members for electric and electronic parts and parts for automobile parts.
- members for electric and electronic parts and parts for automobile parts include a fuel pipe and a fuel tank. Since these members generate static electricity due to friction during the transportation of fuel, it is essential to provide conductivity in order to remove the static electricity.
- components such as automobile fuel pipes and fuel tanks have high heat resistance, high impact resistance (especially at low temperatures), high fuel barrier properties, and good moldability in addition to conductivity. Is required.
- a method of adding a conductive filler such as carbon black to the resin is the most common.
- Polyamide resins are used in automobile fuel pipes and fuel tanks because of their excellent heat resistance and other properties, and it is known that conductive polyamide resins can be obtained by mixing carbon black with polyamide resins. (For example, refer to Patent Document 1).
- the present invention provides a conductive polyamide resin composition that contains a conductive filler, has an appropriate melt viscosity, is excellent in moldability, and is excellent in conductivity, low-temperature impact resistance, and fuel barrier properties. It aims at providing the molded article containing this.
- a semi-aromatic polyamide having a specific terminal amino group content, an unsaturated group having a carboxyl group and / or an acid anhydride group As a result of intensive studies to solve the above-described problems of the prior art, the present inventors have found that a semi-aromatic polyamide having a specific terminal amino group content, an unsaturated group having a carboxyl group and / or an acid anhydride group.
- a polyamide resin composition containing a modified resin modified with a compound and a conductive filler the number of moles of terminal amino groups of the polyamide used, and the number of moles of carboxyl groups and acid anhydride groups of the modified resin.
- the present invention comprises a dicarboxylic acid unit containing 50 to 100 mol% of terephthalic acid units and / or naphthalenedicarboxylic acid units, and a diamine unit containing 60 to 100 mol% of aliphatic diamine units having 4 to 18 carbon atoms.
- the present invention is also a molded article containing the polyamide resin composition described above.
- the present invention is also a fuel pipe including a layer containing the polyamide resin composition.
- a conductive polyamide resin composition having an appropriate melt viscosity, containing a conductive filler, excellent moldability, and having excellent conductivity, low-temperature impact resistance, and fuel barrier properties. Is done. Molded articles containing the conductive polyamide resin composition are useful for various applications, and are particularly suitable for fuel piping.
- the polyamide resin composition of the present invention contains a dicarboxylic acid unit containing 50 to 100 mol% of terephthalic acid units and / or naphthalenedicarboxylic acid units and 60 to 100 mol% of aliphatic diamine units having 4 to 18 carbon atoms.
- Modified resin modified with an unsaturated compound having a diamine unit and a terminal amino group content ([NH 2 ]) of 5 to 60 ⁇ mol / g, a carboxyl group and / or an acid anhydride group (B) and a conductive filler (C) are contained.
- the dicarboxylic acid unit constituting the polyamide (A) contains 50 to 100 mol% of terephthalic acid units and / or naphthalenedicarboxylic acid units.
- the content of the terephthalic acid unit and / or naphthalenedicarboxylic acid unit in the dicarboxylic acid unit is less than 50 mol%, the heat resistance and fuel barrier properties of the obtained polyamide resin composition are lowered.
- the content of the terephthalic acid unit and / or naphthalenedicarboxylic acid unit in the dicarboxylic acid unit is preferably in the range of 75 to 100 mol%, and more preferably in the range of 90 to 100 mol%.
- the dicarboxylic acid unit constituting the polyamide (A) may contain other dicarboxylic acid units other than the terephthalic acid unit and / or the naphthalenedicarboxylic acid unit within a range not impairing the effects of the present invention as long as it is 50 mol% or less. Good.
- carboxylic acid units examples include malonic acid, dimethylmalonic acid, succinic acid, glutaric acid, adipic acid, 2-methyladipic acid, trimethyladipic acid, pimelic acid, 2,2-dimethylglutaric acid, 2, Aliphatic dicarboxylic acids such as 2-diethylsuccinic acid, azelaic acid, sebacic acid and suberic acid; alicyclic dicarboxylic acids such as 1,3-cyclopentanedicarboxylic acid and 1,4-cyclohexanedicarboxylic acid; isophthalic acid, 2, 6-naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,4-phenylenedioxydiacetic acid, 1,3-phenylenedioxydiacetic acid, diphenic acid, diphenylmethane-4,4 '-Dicarboxylic acid, diphenyl
- the content of these other dicarboxylic acid units in the dicarboxylic acid unit is preferably 25 mol% or less, and more preferably 10 mol% or less. Furthermore, a unit derived from a polyvalent carboxylic acid such as trimellitic acid, trimesic acid, pyromellitic acid, and the like may be included within a range in which melt molding is possible.
- the diamine unit constituting the polyamide (A) contains 60 to 100 mol% of an aliphatic diamine unit having 4 to 18 carbon atoms.
- an aliphatic diamine unit having 4 to 18 carbon atoms in this proportion is used, a polyamide resin composition excellent in toughness, slidability, heat resistance, moldability, low water absorption, and lightness can be obtained. can get.
- the content of the aliphatic diamine unit having 4 to 18 carbon atoms in the diamine unit is preferably in the range of 75 to 100 mol%, and more preferably in the range of 90 to 100 mol%.
- Examples of the aliphatic diamine unit having 4 to 18 carbon atoms include 1,4-butanediamine, 1,5-pentanediamine, 1,6-hexanediamine, 1,7-heptanediamine, and 1,8-octane.
- Linear aliphatic diamines such as 1,16-hexadecanediamine, 1,17-heptadecanediamine, 1,18-octadecanediamine; 2-methyl-1,3-propanediamine, 2-methyl-1,4- Butanediamine, 2-methyl-1,5-pentanediamine, 3-methyl-1,5-pentanediamine, 2,2 Branched chains such as 4-trimethyl-1,6-hexanediamine, 2,4,4-trimethyl-1,
- the aliphatic diamine unit having 4 to 18 carbon atoms is preferably an aliphatic diamine unit having 6 to 18 carbon atoms, and a polyamide resin composition that is more excellent in heat resistance, low water absorption and chemical resistance can be obtained. Therefore, 1,9-nonanediamine units and / or 2-methyl-1,8-octanediamine units are more preferable.
- the diamine unit includes both a 1,9-nonanediamine unit and a 2-methyl-1,8-octanediamine unit
- the diamine unit constituting the polyamide (A) may contain other diamine units other than the aliphatic diamine unit having 4 to 18 carbon atoms as long as it is 40 mol% or less.
- examples of such other diamine units include aliphatic diamines such as ethylenediamine, 1,2-propanediamine, and 1,3-propanediamine; alicyclic diamines such as cyclohexanediamine, methylcyclohexanediamine, and isophoronediamine; p-phenylene.
- Examples include units derived from aromatic diamines such as diamine, m-phenylenediamine, xylylenediamine, 4,4′-diaminodiphenylmethane, 4,4′-diaminodiphenylsulfone, and 4,4′-diaminodiphenyl ether. And one or more of these may be included.
- the content of these other diamine units in the diamine unit is preferably 25 mol% or less, and more preferably 10 mol% or less.
- the polyamide (A) may contain an aminocarboxylic acid unit as long as the effects of the present invention are not impaired.
- the aminocarboxylic acid unit include units derived from 11-aminoundecanoic acid, 12-aminododecanoic acid and the like, and two or more aminocarboxylic acid units may be included.
- the content of aminocarboxylic acid units in the polyamide (A) is preferably 40 mol% or less, more preferably 20 mol% or less, based on 100 mol% of all monomer units constituting the polyamide (A). Preferably, it is 10 mol% or less.
- the polyamide (A) may contain a lactam unit as long as the effects of the present invention are not impaired.
- the lactam unit include units derived from caprolactam, lauryl lactam, and the like, and two or more lactam units may be included.
- the content of lactam units in the polyamide (A) is preferably 40 mol% or less, more preferably 20 mol% or less, with respect to 100 mol% of all monomer units constituting the polyamide (A). More preferably, it is 10 mol% or less.
- the polyamide (A) it is preferable that 10% or more of the end groups of the molecular chain are sealed with an end-capping agent.
- the ratio of the end groups of the molecular chain being sealed with the end-capping agent (end-capping rate) is more preferably 20% or more.
- the end capping agent is not particularly limited as long as it is a monofunctional compound having reactivity with the amino group or carboxyl group at the end of the polyamide, but from the viewpoint of reactivity and stability of the capping end, Carboxylic acid or monoamine is preferable, and monocarboxylic acid is more preferable from the viewpoint of easy handling.
- acid anhydrides, monoisocyanates, monoacid halides, monoesters, monoalcohols, and the like can also be used as the end-capping agent.
- the monocarboxylic acid used as the end-capping agent is not particularly limited as long as it has reactivity with an amino group.
- acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, caprylic acid, laurin Aliphatic monocarboxylic acids such as acid, tridecanoic acid, myristic acid, palmitic acid, stearic acid, pivalic acid and isobutyric acid; cycloaliphatic monocarboxylic acids such as cyclohexanecarboxylic acid; benzoic acid, toluic acid, ⁇ -naphthalenecarboxylic acid , ⁇ -naphthalene carboxylic acid, methyl naphthalene carboxylic acid, aromatic monocarboxylic acid such as phenyl acetic acid; any mixtures thereof.
- acetic acid propionic acid, butyric acid, valeric acid, caproic acid, caprylic acid, lauric acid, tridecanoic acid, myristic acid, palmitic acid, stearin, etc. Acid and benzoic acid are preferred.
- the monoamine used as the end-capping agent is not particularly limited as long as it has reactivity with a carboxyl group.
- Aliphatic monoamines such as amine, dimethylamine, diethylamine, dipropylamine and dibutylamine
- Cycloaliphatic monoamines such as cyclohexylamine and dicyclohexylamine
- Aromatic monoamines such as aniline, toluidine, diphenylamine and naphthylamine; any mixtures thereof Can be mentioned.
- butylamine, hexylamine, octylamine, decylamine, stearylamine, cyclohexylamine, and aniline are preferable from the viewpoints of reactivity, boiling point, stability of the sealing end, price, and the like.
- the end-capping rate of the polyamide (A) was determined by measuring the number of carboxyl groups, amino groups, and end groups blocked by the end-capping agent present in the polyamide (A). It is obtained according to 1).
- the number of each terminal group is preferably determined from the integral value of the characteristic signal corresponding to each terminal group by 1 H-NMR in terms of accuracy and simplicity.
- Terminal sealing rate (%) [(TS) / T] ⁇ 100 (1) [Wherein T represents the total number of end groups of the molecular chain of the polyamide (A) (this is usually equal to twice the number of polyamide molecules), and S represents the remaining carboxyl group ends and amino Represents the total number of base ends. ]
- Polyamide (A) can be produced using any method known as a method for producing polyamide. For example, it can be produced by a solution polymerization method or interfacial polymerization method using acid chloride and diamine as raw materials, a melt polymerization method using dicarboxylic acid and diamine as raw materials, a solid phase polymerization method, a melt extrusion polymerization method, or the like.
- phosphoric acid, phosphorous acid, hypophosphorous acid, their salts or esters can be added as a catalyst.
- the salt or ester include phosphoric acid, phosphorous acid or hypophosphorous acid, potassium, sodium, magnesium, vanadium, calcium, zinc, cobalt, manganese, tin, tungsten, germanium, titanium, antimony, and the like.
- Salt with metal ammonium salt of phosphoric acid, phosphorous acid or hypophosphorous acid; ethyl ester, isopropyl ester, butyl ester, hexyl ester, isodecyl ester, decyl of phosphoric acid, phosphorous acid or hypophosphorous acid
- esters stearyl esters, and phenyl esters.
- the polyamide (A) preferably has an intrinsic viscosity [ ⁇ ] measured in concentrated sulfuric acid at 30 ° C. in the range of 0.6 to 2.0 dl / g, and 0.7 to 1.9 dl / g. More preferably, it is in the range of g, more preferably in the range of 0.8 to 1.8 dl / g.
- a polyamide (A) having an intrinsic viscosity of less than 0.6 dl / g is used, the mechanical properties of the resulting polyamide resin composition tend to be lowered, and a polyamide (A) having an intrinsic viscosity of more than 2.0 dl / g If used, the fluidity of the resulting polyamide resin composition tends to decrease and the moldability tends to deteriorate.
- the polyamide (A) has a terminal amino group content ([NH 2 ]) of 5 to 60 ⁇ mol / g, preferably in the range of 5 to 50 ⁇ mol / g, and in the range of 5 to 30 ⁇ mol / g. More preferably, it is within.
- the terminal amino group content ([NH 2 ]) is less than 5 ⁇ mol / g, the compatibility between the polyamide and the modified resin (B) is insufficient, and when the terminal amino group content is greater than 60 ⁇ mol / g. In this case, the conductivity, the long-term heat resistance, and the weld strength are reduced.
- the polyamide (A) having a terminal amino group content ([NH 2 ]) in the above range can be produced, for example, as follows.
- a dicarboxylic acid, a diamine, and optionally an aminocarboxylic acid, a lactam, a catalyst, and a terminal blocking agent are mixed to produce a nylon salt.
- the number of moles (X) of all carboxyl groups and the number of moles (Y) of all amino groups contained in the reaction raw material are represented by the following formula (2). ⁇ 0.5 ⁇ [(Y ⁇ X) / Y] ⁇ 100 ⁇ 2.0 (2) Is satisfied, it is easy to produce a polyamide (A) having a terminal amino group content ([NH 2 ]) of 5 to 60 ⁇ mol / g, which is preferable.
- the produced nylon salt is heated to a temperature of 200 to 250 ° C.
- the polyamide (A) used in the present invention can be obtained.
- the intrinsic viscosity [ ⁇ ] of the prepolymer is in the range of 0.10 to 0.60 dl / g, there is little shift in the molar balance of carboxyl groups and amino groups and a decrease in polymerization rate at the stage of increasing the degree of polymerization.
- polyamide (A) excellent in various performance and moldability with a small molecular weight distribution can be obtained.
- the polymerization degree is increased by the solid phase polymerization method, it is preferably performed under reduced pressure or under an inert gas flow.
- the polymerization temperature is in the range of 200 to 280 ° C., the polymerization rate is high and the productivity is increased. And can effectively suppress coloring and gelation.
- the polymerization degree is increased by a melt extruder, the polymerization temperature is preferably 370 ° C. or less.
- the terminal amino group content ([NH 2]) is also by combining a plurality of different kinds of polyamides, it may be polyamide (A) having a terminal amino group content of the desired ([NH 2]). At this time, even if the polyamide (A) contains a polyamide in which only the definition of the terminal amino group content ([NH 2 ]) does not satisfy the specification of the present invention, the terminal amino group content ([NH 2 ]) can be used in the present invention as long as the definition of 2 )) is satisfied.
- the plurality of types of polyamides may be premixed before being melt kneaded with the modified resin (B) and the conductive filler (C). May be used.
- the terminal amino group content ([NH 2 ]) as used herein refers to the amount of terminal amino groups (unit: ⁇ mol) contained in 1 g of the polyamide (A), and is based on the neutralization titration method using an indicator. Can be sought.
- Examples of the unsaturated compound having a carboxyl group in the modified resin (B) modified with the unsaturated compound having a carboxyl group and / or an acid anhydride group include acrylic acid, methacrylic acid, maleic acid, fumaric acid, and itaconic acid.
- ⁇ , ⁇ -unsaturated carboxylic acids such as Examples of the unsaturated compound having an acid anhydride group include dicarboxylic anhydrides having an ⁇ , ⁇ -unsaturated bond such as maleic anhydride and itaconic anhydride.
- the unsaturated compound having a carboxyl group and / or an acid anhydride group is preferably a dicarboxylic acid anhydride having an ⁇ , ⁇ -unsaturated bond, and more preferably maleic anhydride.
- the content of carboxyl group and acid anhydride group in the modified resin (B) is preferably in the range of 25 to 200 ⁇ mol / g, more preferably in the range of 50 to 100 ⁇ mol / g.
- the content of the functional group is less than 25 ⁇ mol / g, the impact resistance improving effect may not be sufficient.
- the content exceeds 200 ⁇ mol / g, the resulting polyamide resin composition
- the fluidity of the resin may decrease, and the moldability may decrease.
- Examples of the base (unmodified) resin in the modified resin (B) modified with an unsaturated compound having a carboxyl group and / or an acid anhydride group used in the present invention include low density polyethylene and medium density.
- the modified resin (B) modified with an unsaturated compound having a carboxyl group and / or an acid anhydride group the impact resistance, mechanical properties and heat resistance of the resulting molded product are further improved.
- at least one resin selected from the group consisting of a resin based on resin, a styrene resin, a polynitrile resin, and a fluorine resin is modified with an unsaturated compound having a carboxyl group and / or an acid anhydride group.
- Low density polyethylene medium density polyethylene, high density polyethylene, polypropylene, ethylene-propylene copolymer, ethylene-butene copolymer, ethylene-propylene-diene copolymer, acrylonitrile-butadiene-styrene copolymer, polyvinylidene fluoride , And ethylene-tetrafluoroethylene More preferably those modified by an unsaturated compound having a carboxyl group and / or acid anhydride groups at least one selected from the group consisting of down copolymer.
- the above resin is copolymerized with an unsaturated compound having a carboxyl group and / or an acid anhydride group when the resin is produced by addition polymerization. And a method in which an unsaturated compound having a carboxyl group and / or an acid anhydride group is grafted to the above resin.
- the modified resin (B) is preferably modified by graft-reacting the above resin with an unsaturated compound having a carboxyl group and / or an acid anhydride group.
- Examples of the conductive filler (C) used in the present invention include granular, flaky and fibrous fillers that impart conductivity to the resin.
- Examples thereof include carbon fiber, conductive carbon black, carbon nanotube, metal fiber, metal powder, metal flake, metal oxide powder, and metal-coated fiber.
- at least one selected from the group consisting of carbon fiber, conductive carbon black, and carbon nanotube is preferable because of its low specific gravity and excellent balance between the conductivity imparting effect and the reinforcing effect.
- the above-mentioned carbon fiber may be either pitch-based or PAN-based carbon fiber, but PAN-based carbon fiber is more preferable in terms of elastic modulus and impact resistance.
- the average fiber length of the carbon fibers is preferably in the range of 10 ⁇ m to 10 mm in the state after melt-kneading from the viewpoint of maintaining good moldability and improving the mechanical properties and heat resistance of the obtained molded product.
- the thickness is more preferably in the range of 50 ⁇ m to 5 mm, and still more preferably in the range of 100 ⁇ m to 2 mm.
- the aspect ratio of the carbon fiber is preferably in the range of 1 to 3000, and more preferably in the range of 10 to 500.
- conductive carbon black commercially available conductive carbon black can be used.
- Ketjen Black EC600JD and EC300J available from Ketjen Black International Co., Ltd .
- Vulcan available from Cabot Corporation XC-72, XC-305
- Printex XE2B available from Degussa, # 5500, # 4500 available from Tokai Carbon Co., Ltd., # 5400B available from Mitsubishi Chemical Corporation, and the like.
- the carbon nanotubes may have a single-layer structure or a multilayer structure.
- a carbon material partially having a carbon nanotube structure can also be used.
- the carbon nanotube is not limited to a cylindrical shape, and may have a coiled shape in which a spiral makes a round at a pitch of 1 ⁇ m or less.
- Carbon nanotubes are commercially available. For example, BAYTUBES C 150 P (manufactured by Bayer MaterialScience), NANOCYL NC7000 (manufactured by Nanosil), VGCF-X (manufactured by Showa Denko KK), Hyperion Catalysis International BN fibrils available from the company.
- the diameter of the carbon nanotube is preferably 0.5 to 100 nm, more preferably 1 to 30 nm. If the diameter of the carbon nanotube is less than 0.5 nm, the dispersibility tends to deteriorate, and the conductivity may be lowered. On the other hand, if the diameter is larger than 100 nm, the appearance of the molded product tends to deteriorate, and the conductivity may be lowered.
- the aspect ratio of the carbon nanotube is preferably 5 or more. If the aspect is less than 5, the conductivity may be lowered.
- the polyamide resin composition of the present invention may be made of a resin other than the polyamide (A) and the modified resin (B), a filler other than the conductive filler (C), a crystal nucleating agent, heat, light or Other components such as a stabilizer against oxygen, a copper-based stabilizer, a colorant, an antistatic agent, a plasticizer, a lubricant, a flame retardant, and a flame retardant aid may be included.
- Examples of other resins include low density polyethylene, medium density polyethylene, high density polyethylene, polypropylene, ethylene-propylene copolymer, ethylene-butene copolymer, ethylene-propylene-diene copolymer, and ethylene-vinyl acetate copolymer.
- Polymer saponified ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-methacrylic acid copolymer, ethylene-methyl acrylate copolymer, ethylene-methyl methacrylate copolymer, ethylene-acrylic Polyolefin resins such as ethyl acid copolymer and polybutadiene; Polyester resins such as polybutylene terephthalate, polyethylene terephthalate, polyethylene naphthalate, polybutylene naphthalate, polyethylene isophthalate, polyarylate, and liquid crystalline polyester Polyether resins such as polyacetal and polyphenylene oxide; Polysulfone resins such as polysulfone and polyethersulfone; Polythioether resins such as polyphenylene sulfide and polythioethersulfone; Polyketone resins such as polyetheretherketone and polyallyletherketone; Styrene Styrene resins such as
- fillers include, for example, fibrous fillers such as glass fibers, calcium carbonate, wollastonite, silica, silica alumina, alumina, titanium dioxide, potassium titanate, magnesium hydroxide, molybdenum disulfide, etc. Fillers; Flaky fillers such as hydrotalcite, glass flakes, mica, clay, montmorillonite, kaolin and the like.
- the crystal nucleating agent is not particularly limited as long as it is generally used as a crystal nucleating agent for polyamide resin.
- talc calcium stearate, aluminum stearate, barium stearate, zinc stearate, antimony oxide
- examples thereof include magnesium oxide and any mixture thereof.
- talc is preferable because it has a great effect of increasing the crystallization speed of the polyamide resin.
- the crystal nucleating agent may be treated with a silane coupling agent, a titanium coupling agent or the like for the purpose of improving compatibility with the polyamide resin.
- the stabilizer against heat, light or oxygen is not particularly limited as long as it is generally used as a stabilizer for polyamide resins.
- a halide eg, chloride, bromide, iodide
- a Group I metal eg, sodium, potassium, lithium
- copper (I) halide eg, copper (I) chloride
- the plasticizer is not particularly limited as long as it is generally used as a plasticizer for polyamide resins.
- benzenesulfonic acid alkylamide compounds for example, benzenesulfonic acid alkylamide compounds, toluenesulfonic acid alkylamide compounds, hydroxybenzoic acid alkylester compounds Compounds and the like.
- the lubricant is not particularly limited as long as it is generally used as a lubricant for polyamide resins.
- examples include alcohol ester compounds and metal soap compounds.
- Fatty acid amide compounds such as stearic acid amide, palmitic acid amide, methylene bisstearamide, ethylene bisstearamide and the like are preferable because they are excellent in external lubricity effect.
- the content of these other components in the polyamide resin composition is preferably 50% by mass or less, more preferably 20% by mass or less, and further preferably 5% by mass or less.
- the polyamide resin composition of the present invention comprises the above polyamide (A), a modified resin (B) modified with an unsaturated compound having a carboxyl group and / or an acid anhydride group, a conductive filler (C), and, if necessary. And other ingredients as described above.
- Polyamide (A), modified resin (B) and conductive filler (C) are used in a proportion of 100 parts by mass of polyamide (A), modified resin (B) and conductive filler (C).
- modified resin (B) 40 to 96.5 parts by mass, modified resin (B) 3 to 30 parts by mass, conductive filler (C) 0.5 to 30 parts by mass, polyamide (A) 60 to 94.5 parts by mass
- the modified resin (B) is preferably 5 to 20 parts by mass
- the conductive filler (C) is preferably 0.5 to 20 parts by mass
- the polyamide (A) is 65 to 94 parts by mass
- the modified resin (B) is 5 to 20 parts by mass. More preferably, 20 parts by mass and the conductive filler (C) is 1 to 15 parts by mass.
- the terminal amino group of the polyamide (A) reacts with the carboxyl group and / or the acid anhydride group of the modified resin (B), whereby (A) phase and (B )
- the affinity of the interface with the phase is increased, and impact resistance and tensile elongation at break are improved.
- the reaction is insufficient, the effect of improving impact resistance or the like cannot be obtained, and if the reaction is excessive, the melt viscosity exceeds the appropriate range.
- the number of moles (M I ) of the terminal amino group of the polyamide (A) in the total 1 g of the polyamide (A) and the modified resin (B), and the modified resin (B) The difference (M I -M II ) from the number of moles (M II ) of the carboxyl group and the acid anhydride group of M is -5.0 ⁇ mol or more and less than 4.0 ⁇ mol, and M II is 4.0 ⁇ mol It needs to be bigger.
- the difference (M I ⁇ M II ) is outside the above range, the melt viscosity is increased or the viscosity is increased by heating.
- M II is 4.0 ⁇ mol or less, the impact resistance is decreased. .
- the difference (M I ⁇ M II ) is preferably ⁇ 5.0 ⁇ mol or more and 2.0 ⁇ mol or less from the viewpoint of making the melt viscosity within an appropriate range and improving impact resistance and moldability. More preferably, it is 0 mol or more and 1.0 ⁇ mol or less.
- the number of moles of the terminal amino group of the polyamide (A) and the number of moles of the carboxyl group and acid anhydride group of the modified resin (B) in a total of 1 g of the polyamide (A) and the modified resin (B) are as follows: The number of moles of terminal amino group of polyamide (A) per gram and the number of moles of carboxyl group and acid anhydride group of modified resin (B) per gram are determined by neutralization titration using an indicator, respectively. It can be calculated by using the weight ratio of the polyamide (A) and the modified resin (B).
- the polyamide resin composition of the present invention is prepared by mixing the polyamide (A), the modified resin (B), the conductive filler (C), and, if necessary, the above other components by a known method such as melt kneading. can do.
- melt-kneading method conventionally known melt-kneading methods can be employed, and for example, it can be carried out using a kneader such as a single-screw extruder, a twin-screw extruder, a kneader, or a Banbury mixer.
- a kneader such as a single-screw extruder, a twin-screw extruder, a kneader, or a Banbury mixer.
- the polyamide resin composition of the present invention is obtained by kneading at a temperature in the range of about 280 to 350 ° C. for 1 to 30 minutes. be able to.
- the melt kneading means kneading performed under a condition that at least the polyamide (A) melts.
- the polyamide resin composition of the present invention is obtained by melt-kneading, the polyamide (A) and the modified resin (B) are melt-kneaded in an extruder or the like, and the conductive filler (C) is mixed in the extruder or the like.
- Side feed from the downstream supply port is preferred because a polyamide resin composition having better mechanical properties can be obtained.
- the polyamide (A), the modified resin (B), and the conductive filler (C) are added.
- a method of kneading in advance and pouring them into the upstream supply port and melting and kneading them [kneading method A], a part or all of the polyamide (A) melt and conductive filler (C) are mixed in advance to prepare a master batch.
- the master batch, the remainder of the polyamide (A), and the modified resin (B) are mixed, put into the upstream supply port of the same-direction rotating twin-screw extruder (a), and melt-kneaded.
- [Kneading method C] preparing a masterbatch by previously mixing a part or all of the polyamide (A) melt and a conductive material, mixing the masterbatch and the remainder of the polyamide (A), A method of kneading by introducing into the upstream supply port of the above-mentioned co-rotating twin-screw extruder (a) and melt-kneading, and introducing a modified resin (B) from the downstream supply port [kneading method D], polyamide ( A part or all of A) and the modified resin (B) are mixed in advance, charged into the upstream supply port of the co-rotating twin screw extruder (a), melt-kneaded, and the conductive filler from the downstream supply port.
- a method [kneading method E] in which (C) and the remainder of polyamide (A) are added and melt-kneaded can be preferably employed.
- the polyamide resin composition of the present invention has an appropriate melt viscosity, excellent moldability, electrical conductivity, toughness such as impact resistance and elongation, and mechanical strength such as tensile strength. It is excellent in both characteristics of the characteristics at the same time, and also excellent in characteristics such as fuel barrier properties, heat resistance, low water absorption, chemical resistance, and long-term heat resistance. Therefore, the molded article containing the polyamide resin composition of the present invention is useful for various applications.
- Molding of the polyamide resin composition of the present invention can be carried out according to thermoplastic molding such as injection molding, extrusion molding, press molding, blow molding, calendar molding, casting molding, etc. It can be performed by a molding method generally used for the combined composition. A molding method combining the above molding methods can also be employed. Furthermore, the polyamide resin composition of the present invention and other polymers can be composite-molded.
- molded articles containing the polyamide resin composition of the present invention are fuel system parts such as fuel caps, fuel tanks, fuel sender modules, fuel cut-off valves, canisters, and fuel pipes.
- the fuel system parts can be used for various devices including engines such as gasoline, light oil and the like, such as automobiles, tractors, cultivators, mowers, lawn mowers, and chainsaws.
- a fuel pipe is preferable because of its characteristics.
- the fuel pipe can be particularly suitably used as an automobile fuel pipe.
- Examples of the fuel piping for automobiles include a fuel filler tube, a fuel delivery pipe, a fuel filler neck, a quick connector, and the like.
- the fuel pipe can be obtained by extruding into a hose shape, for example.
- the layer structure is a fuel pipe in which the polyamide resin composition of the present invention is molded as a single layer, or a fuel pipe having a multilayer structure of two or more layers, and one or more layers are the polyamide resin composition of the present invention.
- the fuel pipe has a multilayer structure of two or more layers using the polyamide resin composition of the present invention as the innermost layer.
- the other layers may be other resin composition layers, rubber layers, reinforcing yarn layers, and the like.
- polyester resins such as polybutylene terephthalate, polyethylene terephthalate, polyethylene naphthalate, polybutylene naphthalate, and polyethylene isophthalate; ethylene-tetrafluoroethylene copolymer Fluorine resins such as polymers, polychlorotrifluoroethylene, ethylene-chlorotrifluoroethylene copolymer, tetrafluoroethylene-hexafluoropropylene copolymer, tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride copolymer; polyethylene Polyolefin resin such as polypropylene and polystyrene; saponified ethylene-vinyl acetate copolymer, polyacetal, polyphenylene sulfide; polyamide 6, polyamido 66, polyamide 46, polyamide 610, polyamide 612, polyamide 11, polyamide 12,
- the molded product containing the polyamide resin composition of the present invention includes, for example, a radiator grill, a rear spoiler, a wheel cover, a wheel cap, a cowl vent grill, an air outlet louver, an air scoop, a hood bulge, a fender, a back door, and the like.
- Automotive exterior parts cylinder head cover, engine mount, air intake manifold, throttle body, air intake pipe, radiator tank, radiator support, water pump inlet, water pump outlet, thermostat housing, cooling fan, fan shroud , Oil pan, oil filter housing, oil filler cap, oil level gauge, timing belt, timing belt cover, air Automotive engine compartment parts such as gin covers; automotive drive system parts such as shift lever housings and propeller shafts; automotive chassis parts such as stabilizer bars and linkage rods; window regulators, door locks, door handles, outs Functional parts for automobiles such as side door mirror stays, accelerator pedals, pedal modules, seal rings, bearings, bearing retainers, gears, actuators; wire harnesses / connectors, relay blocks, sensor housings, encapsulations, ignition coils, It can also be used in applications such as automotive electronic parts such as distributors and caps; electrical and electronic parts such as connectors and LED reflectors.
- Terminal amino group content [NH 2 ]
- carboxyl group and acid anhydride group content production method of molded article (test piece)
- conductivity impact resistance
- melt viscosity and its change and fuel barrier properties
- the content of the carboxyl group and the acid anhydride group of the modified resin (B) was determined using a sample solution prepared by dissolving 5 g of the pellet of the modified resin (B) in 170 mL of toluene and further adding 30 mL of ethanol. It was determined by neutralization titration with 0.1 N KOH ethanol solution using phenolphthalein as an indicator.
- test piece (2) Production of molded product (test piece) Using an injection molding machine (clamping force: 80 tons, screw diameter: ⁇ 32 mm) manufactured by Toshiba Machine Co., Ltd., a cylinder temperature of 320 ° C. and a mold temperature of 150 ° C. Below, the polyamide resin composition was shape
- melt viscosity Using a capillograph (manufactured by Toyo Seiki Seisakusho Co., Ltd.), the melt viscosity of the polyamide resin composition was measured under the conditions of a measurement temperature of 310 ° C, a melting time of 4 minutes, and a shear rate of 122 s- 1 .
- the reaction was continued as it was for 2 hours, then the temperature was raised to 230 ° C., and then the temperature was maintained at 230 ° C. for 2 hours, and the reaction was carried out while gradually removing water vapor and keeping the pressure at 2 MPa. Next, the pressure was reduced to 1 MPa over 30 minutes, and the reaction was further continued for 1 hour to obtain a prepolymer having an intrinsic viscosity [ ⁇ ] of 0.16 dl / g. This was dried at 100 ° C. under reduced pressure for 12 hours and pulverized to a particle size of 2 mm or less. This was solid-phase polymerized at 230 ° C. and 13 Pa (0.1 mmHg) for 10 hours.
- the melting point was 318 ° C.
- the intrinsic viscosity [ ⁇ ] was 1.30 dl / g
- the terminal amino group content ([NH 2 ]) was 10 ⁇ mol.
- a white polyamide having a terminal carboxyl group content of 58 ⁇ mol / g and a terminal blocking rate of 48% was obtained. This polyamide is abbreviated as “PA10T”.
- EBR-1 Maleic anhydride modified ethylene-butene copolymer (“Tafmer MH7020” manufactured by Mitsui Chemicals, content of acid anhydride group: 100 ⁇ mol / g)
- EBR-2 Maleic anhydride modified ethylene-butene copolymer (“Tafmer MH7010” manufactured by Mitsui Chemicals, content of acid anhydride group: 50 ⁇ mol / g)
- EBR-3 Maleic anhydride modified ethylene-butene copolymer (“Tafmer MH7007” manufactured by Mitsui Chemicals, content of acid anhydride group: 25 ⁇ mol / g)
- EBR-4 Maleic anhydride modified ethylene-butene copolymer (“Tafmer MH5010” manufactured by Mitsui Chemicals, content of acid anhydride group: 50 ⁇ mol / g)
- Conductive filler (C) CB Carbon black (“KB EC600JD” manufactured by Ketjen Black International)
- CNT carbon nanotube (“VGCF-X” manufactured by Showa Denko KK, diameter 10-15 nm, fiber length 3 ⁇ m, aspect ratio 200-300)
- Examples 1 to 12 and Comparative Examples 1 to 9 Polyamide (A), modified resin (B) and conductive filler (C) were mixed in advance in the proportions shown in Tables 1 and 2 below, and a twin-screw extruder (“BTN-32” manufactured by Plastic Engineering Laboratory Co., Ltd.) A method of batch feeding into the upstream supply port (top batch method), or a mixture of polyamide (A) and conductive filler (C) in advance, and feeding into the upstream feed port of the above twin screw extruder to melt kneading Then, a modified polyamide resin (B) is introduced from the downstream supply port (elastomer side feed method), melt-kneaded under conditions of a cylinder temperature of 320 to 340 ° C., extruded, cooled and cut to form a pellet-like polyamide resin A composition was prepared. Various physical property evaluations were performed using the obtained polyamide resin composition. The results are shown in Tables 3 and 4 below.
- the polyamide resin compositions of Examples 1 to 12 having each requirement defined in the present invention are excellent in conductivity, impact resistance, fuel barrier property and fluidity, and have a negative change in melt viscosity. I understand that.
- the polyamide resin compositions obtained in Comparative Examples 1 to 3 and Comparative Examples 6 to 8 had a positive change in melt viscosity because the difference (M I -M II ) was too large.
- the polyamide resin composition obtained in Comparative Example 4 had a high melt viscosity because the difference (M I -M II ) was too small.
- the polyamide resin composition of the present invention is excellent in electrical conductivity, impact resistance, melt viscosity stability and moldability, and also has excellent fuel barrier properties, so that it can be used as a material for various molded products including fuel pipes. Useful.
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Abstract
Description
カルボキシル基および/または酸無水物基を有する不飽和化合物により変性された変性樹脂(B)、並びに
導電フィラー(C)を含有するポリアミド樹脂組成物であって、
前記ポリアミド(A)、前記変性樹脂(B)、および前記導電フィラー(C)の合計100質量部に対して、前記ポリアミド(A)を40~96.5質量部、前記変性樹脂(B)を3~30質量部、前記導電フィラー(C)を0.5~30質量部含み、かつ
前記ポリアミド(A)および前記変性樹脂(B)の合計1g中における、前記ポリアミド(A)の末端アミノ基のモル数(MI)と、前記変性樹脂(B)が有するカルボキシル基および酸無水物基のモル数(MII)との差(MI-MII)が、-5.0μモル以上4.0μモル未満であり、かつMIIが4.0μモルより大きいポリアミド樹脂組成物である。
末端封止率(%)=[(T-S)/T]×100 (1)
[式中、Tはポリアミド(A)の分子鎖の末端基の総数(これは通常、ポリアミド分子の数の2倍に等しい)を表し、Sは封止されずに残ったカルボキシル基末端およびアミノ基末端の合計数を表す。]
-0.5≦[(Y-X)/Y]×100≦2.0 (2)
を満足するようにすると、末端アミノ基含量([NH2])が5~60μモル/gであるポリアミド(A)を製造し易くなり好ましい。次に、生成したナイロン塩を200~250℃の温度に加熱し、濃硫酸中30℃における極限粘度[η]が0.10~0.60dl/gのプレポリマーとし、さらに高重合度化することにより、本発明において使用されるポリアミド(A)を得ることができる。プレポリマーの極限粘度[η]が0.10~0.60dl/gの範囲内にあると、高重合度化の段階においてカルボキシル基とアミノ基のモルバランスのずれや重合速度の低下が少なく、さらに分子量分布の小さい、各種性能や成形性により優れたポリアミド(A)が得られる。高重合度化の段階を固相重合法により行う場合、減圧下または不活性ガス流通下に行うことが好ましく、重合温度が200~280℃の範囲内であれば、重合速度が大きく、生産性に優れ、着色およびゲル化を有効に抑制することができる。また、高重合度化の段階を溶融押出機により行う場合、重合温度は370℃以下であることが好ましく、かかる条件で重合を行うと、ポリアミドの分解がほとんどなく、劣化の少ないポリアミド(A)が得られる。
ポリアミド(A)1gをフェノール35mLに溶解し、メタノールを2mL混合し、試料溶液とした。チモールブルーを指示薬とし、0.01規定のHCl水溶液を使用した滴定を実施し、末端アミノ基含量([NH2]、単位:μモル/g)を測定した。また、変性樹脂(B)のカルボキシル基および酸無水物基の含有量は、該変性樹脂(B)のペレット5gをトルエン170mLに溶解し、さらにエタノールを30mL加えて調製した試料溶液を用いて、フェノールフタレインを指示薬とし、0.1規定のKOHエタノール溶液で中和滴定することにより求めた。
東芝機械株式会社製の射出成形機(型締力:80トン、スクリュ径:φ32mm)を使用して、シリンダ温度320℃および金型温度150℃の条件下で、Tランナー金型または二重Tランナー金型を用いてポリアミド樹脂組成物を成形し、試験片を作製した。
上記の方法で作製した試験片を用いて、ASTM D257に準じて、低抵抗率計(ロレスタ-GP、三菱化学株式会社製)を使用して、90Vの印加電圧で試験片中央部の1点の表面抵抗率を測定した。測定は5個の異なる試験片を用いて行い、その加算平均値を表面抵抗率(平均値)として導電性を評価した。
上記の方法で作製した試験片を用いて、ASTM D256に準じて、アイゾット衝撃試験機(株式会社東洋精機製作所製)を使用して、23℃および-40℃におけるノッチ付きアイゾット衝撃値を測定して耐衝撃性を評価した。
キャピログラフ(株式会社東洋精機製作所製)を使用して、測定温度310℃、溶融時間4分、せん断速度122s-1の条件でポリアミド樹脂組成物の溶融粘度を測定した。
メルトインデクサー(株式会社東洋精機製作所製)を使用して、測定温度310℃、荷重5kg、溶融時間4分および溶融時間15分の条件でポリアミド樹脂組成物のMFR値を測定し、比較した。なお、溶融時間15分のMFR値が溶融時間4分のMFR値よりも大きい場合を正(+)、小さい場合を負(-)として表3および4に記載した。
ポリアミド樹脂組成物を用いて直径100mm、厚み150μmのフィルムを作製し、液体透過率測定装置(GTRテック株式会社製)を使用して40℃、65RH%雰囲気下における燃料透過係数を測定した。測定溶媒として、イソオクタン/エタノール/トルエン=45/10/45(体積比)の模擬燃料を用いた。
テレフタル酸9922.1g(59.73モル)、1,9-ノナンジアミンと2-メチル-1,8-オクタンジアミンの混合物[前者/後者=50/50(モル比)]9497.4g(60.00モル)、安息香酸67.2g(0.55モル)、次亜リン酸ナトリウム一水和物19.5g(原料の総質量に対して0.1質量%)および蒸留水5リットルを内容積40リットルのオートクレーブに入れ、窒素置換した。100℃で30分間攪拌し、2時間かけてオートクレーブ内部の温度を220℃に昇温した。この時、オートクレーブ内部の圧力は2MPaまで昇圧した。そのまま2時間反応を続けた後230℃に昇温し、その後2時間、230℃に温度を保ち、水蒸気を徐々に抜いて圧力を2MPaに保ちながら反応させた。次に、30分かけて圧力を1MPaまで下げ、さらに1時間反応させて、極限粘度[η]が0.16dl/gのプレポリマーを得た。これを、100℃、減圧下で12時間乾燥し、2mm以下の粒径まで粉砕した。これを230℃、13Pa(0.1mmHg)にて10時間固相重合し、融点が265℃、極限粘度[η]が1.60dl/g、末端アミノ基含量([NH2])が3μモル/g、末端カルボキシル基含量が65μモル/g、末端封止率が30%である白色のポリアミドを得た。このポリアミドを「PA9T-1」と略称する。
テレフタル酸9947.9g(59.88モル)、1,9-ノナンジアミンと2-メチル-1,8-オクタンジアミンの混合物[前者/後者=50/50(モル比)]9734.8g(61.50モル)、安息香酸29.3g(0.24モル)、次亜リン酸ナトリウム一水和物19.7g(原料の総質量に対して0.1質量%)および蒸留水5リットルを内容積40リットルのオートクレーブに入れ、窒素置換した。100℃で30分間攪拌し、2時間かけてオートクレーブ内部の温度を220℃に昇温した。この時、オートクレーブ内部の圧力は2MPaまで昇圧した。そのまま2時間反応を続けた後230℃に昇温し、その後2時間、230℃に温度を保ち、水蒸気を徐々に抜いて圧力を2MPaに保ちながら反応させた。次に、30分かけて圧力を1MPaまで下げ、さらに1時間反応させて、極限粘度[η]が0.14dl/gのプレポリマーを得た。これを、100℃、減圧下で12時間乾燥し、2mm以下の粒径まで粉砕した。これを230℃、13Pa(0.1mmHg)にて10時間固相重合し、融点が256℃、極限粘度[η]が1.60dl/g、末端アミノ基含量([NH2])が80μモル/g、末端カルボキシル基含量が5μモル/g、末端封止率が12%である白色のポリアミドを得た。このポリアミドを「PA9T-2」と略称する。
テレフタル酸9868.1g(59.40モル)、1,9-ノナンジアミンと2-メチル-1,8-オクタンジアミンの混合物[前者/後者=50/50(モル比)]9734.8g(61.50モル)、安息香酸146.5g(1.20モル)、次亜リン酸ナトリウム一水和物19.7g(原料の総質量に対して0.1質量%)および蒸留水5リットルを内容積40リットルのオートクレーブに入れ、窒素置換した。100℃で30分間攪拌し、2時間かけてオートクレーブ内部の温度を220℃に昇温した。この時、オートクレーブ内部の圧力は2MPaまで昇圧した。そのまま2時間反応を続けた後230℃に昇温し、その後2時間、230℃に温度を保ち、水蒸気を徐々に抜いて圧力を2MPaに保ちながら反応させた。次に、30分かけて圧力を1MPaまで下げ、さらに1時間反応させて、極限粘度[η]が0.14dl/gのプレポリマーを得た。これを、100℃、減圧下で12時間乾燥し、2mm以下の粒径まで粉砕した。これを230℃、13Pa(0.1mmHg)にて10時間固相重合し、融点が265℃、極限粘度[η]が1.20dl/g、末端アミノ基含量([NH2])が80μモル/g、末端カルボキシル基含量が5μモル/g、末端封止率が42%である白色のポリアミドを得た。このポリアミドを「PA9T-3」と略称する。
テレフタル酸9843.2g(59.25モル)、1,9-ノナンジアミンと2-メチル-1,8-オクタンジアミンの混合物[前者/後者=50/50(モル比)]9497.4g(60.00モル)、安息香酸183.2g(1.50モル)、次亜リン酸ナトリウム一水和物19.5g(原料の総質量に対して0.1質量%)および蒸留水5リットルを内容積40リットルのオートクレーブに入れ、窒素置換した。100℃で30分間攪拌し、2時間かけてオートクレーブ内部の温度を220℃に昇温した。この時、オートクレーブ内部の圧力は2MPaまで昇圧した。そのまま2時間反応を続けた後230℃に昇温し、その後2時間、230℃に温度を保ち、水蒸気を徐々に抜いて圧力を2MPaに保ちながら反応させた。次に、30分かけて圧力を1MPaまで下げ、さらに1時間反応させて、極限粘度[η]が0.16dl/gのプレポリマーを得た。これを、100℃、減圧下で12時間乾燥し、2mm以下の粒径まで粉砕した。これを230℃、13Pa(0.1mmHg)にて10時間固相重合し、融点が256℃、極限粘度[η]が1.20dl/g、末端アミノ基含量([NH2])が3μモル/g、末端カルボキシル基含量が65μモル/g、末端封止率が54%である白色のポリアミドを得た。このポリアミドを「PA9T-4」と略称する。
テレフタル酸9870.6g(59.42モル)、1,9-ノナンジアミンと2-メチル-1,8-オクタンジアミンの混合物[前者/後者=50/50(モル比)]9497.4g(60.00モル)、安息香酸142.9g(1.17モル)、次亜リン酸ナトリウム一水和物19.5g(原料の総質量に対して0.1質量%)および蒸留水5リットルを内容積40リットルのオートクレーブに入れ、窒素置換した。100℃で30分間攪拌し、2時間かけてオートクレーブ内部の温度を220℃に昇温した。この時、オートクレーブ内部の圧力は2MPaまで昇圧した。そのまま2時間反応を続けた後230℃に昇温し、その後2時間、230℃に温度を保ち、水蒸気を徐々に抜いて圧力を2MPaに保ちながら反応させた。次に、30分かけて圧力を1MPaまで下げ、さらに1時間反応させて、極限粘度[η]が0.16dl/gのプレポリマーを得た。これを、100℃、減圧下で12時間乾燥し、2mm以下の粒径まで粉砕した。これを230℃、13Pa(0.1mmHg)にて10時間固相重合し、融点が265℃、極限粘度[η]が1.30dl/g、末端アミノ基含量([NH2])が10μモル/g、末端カルボキシル基含量が60μモル/g、末端封止率が46%である白色のポリアミドを得た。このポリアミドを「PA9T-5」と略称する。
テレフタル酸9883.1g(59.49モル)、1,6-ヘキサンジアミンと2-メチル-1,5-ペンタンジアミンの混合物[前者/後者=50/50(モル比)]6972.6g(60.00モル)、安息香酸124.6g(1.02モル)、次亜リン酸ナトリウム一水和物17.0g(原料の総質量に対して0.1質量%)および蒸留水5リットルを内容積40リットルのオートクレーブに入れ、窒素置換した。100℃で30分間攪拌し、2時間かけてオートクレーブ内部の温度を220℃に昇温した。この時、オートクレーブ内部の圧力は2MPaまで昇圧した。そのまま2時間反応を続けた後230℃に昇温し、その後2時間、230℃に温度を保ち、水蒸気を徐々に抜いて圧力を2MPaに保ちながら反応させた。次に、30分かけて圧力を1MPaまで下げ、さらに1時間反応させて、極限粘度[η]が0.16dl/gのプレポリマーを得た。これを、100℃、減圧下で12時間乾燥し、2mm以下の粒径まで粉砕した。これを230℃、13Pa(0.1mmHg)にて10時間固相重合し、融点が315℃、極限粘度[η]が1.30dl/g、末端アミノ基含量([NH2])が10μモル/g、末端カルボキシル基含量が59μモル/g、末端封止率が47%である白色のポリアミドを得た。このポリアミドを「PA6T」と略称する。
テレフタル酸9861.5g(59.36モル)、1,10-デカンジアミン10339.2g(60.00モル)、安息香酸156.3g(1.28モル)、次亜リン酸ナトリウム一水和物20.4g(原料の総質量に対して0.1質量%)および蒸留水5リットルを内容積40リットルのオートクレーブに入れ、窒素置換した。100℃で30分間攪拌し、2時間かけてオートクレーブ内部の温度を220℃に昇温した。この時、オートクレーブ内部の圧力は2MPaまで昇圧した。そのまま2時間反応を続けた後230℃に昇温し、その後2時間、230℃に温度を保ち、水蒸気を徐々に抜いて圧力を2MPaに保ちながら反応させた。次に、30分かけて圧力を1MPaまで下げ、さらに1時間反応させて、極限粘度[η]が0.16dl/gのプレポリマーを得た。これを、100℃、減圧下で12時間乾燥し、2mm以下の粒径まで粉砕した。これを230℃、13Pa(0.1mmHg)にて10時間固相重合し、融点が318℃、極限粘度[η]が1.30dl/g、末端アミノ基含量([NH2])が10μモル/g、末端カルボキシル基含量が58μモル/g、末端封止率が48%である白色のポリアミドを得た。このポリアミドを「PA10T」と略称する。
2.6-ナフタレンジカルボン酸12823.3g(59.32モル)、1,9-ノナンジアミンと2-メチル-1,8-オクタンジアミンの混合物[前者/後者=50/50(モル比)]9497.4g(60.00モル)、安息香酸167.3g(1.37モル)、次亜リン酸ナトリウム一水和物22.5g(原料の総質量に対して0.1質量%)および蒸留水5リットルを内容積40リットルのオートクレーブに入れ、窒素置換した。100℃で30分間攪拌し、2時間かけてオートクレーブ内部の温度を220℃に昇温した。この時、オートクレーブ内部の圧力は2MPaまで昇圧した。そのまま2時間反応を続けた後230℃に昇温し、その後2時間、230℃に温度を保ち、水蒸気を徐々に抜いて圧力を2MPaに保ちながら反応させた。次に、30分かけて圧力を1MPaまで下げ、さらに1時間反応させて、極限粘度[η]が0.16dl/gのプレポリマーを得た。これを、100℃、減圧下で12時間乾燥し、2mm以下の粒径まで粉砕した。これを230℃、13Pa(0.1mmHg)にて10時間固相重合し、融点が275℃、極限粘度[η]が1.30dl/g、末端アミノ基含量([NH2])が10μモル/g、末端カルボキシル基含量が58μモル/g、末端封止率が46%である白色のポリアミドを得た。このポリアミドを「PA9N」と略称する。
上記参考例1~8で製造したPA9T-1~PA9T-5、並びにPA6T、PA10T、PA9Nをそのまま使用するか、あるいは下記の表1に記載した割合で併用した。
EBR-1:無水マレイン酸変性エチレン-ブテン共重合体(三井化学製「タフマーMH7020」、酸無水物基の含有量:100μモル/g)
EBR-2:無水マレイン酸変性エチレン-ブテン共重合体(三井化学製「タフマーMH7010」、酸無水物基の含有量:50μモル/g)
EBR-3:無水マレイン酸変性エチレン-ブテン共重合体(三井化学製「タフマーMH7007」、酸無水物基の含有量:25μモル/g)
EBR-4:無水マレイン酸変性エチレン-ブテン共重合体(三井化学製「タフマーMH5010」、酸無水物基の含有量:50μモル/g)
CB:カーボンブラック(ケッチェンブラックインターナショナル社製「KB EC600JD」)
CNT:カーボンナノチューブ(昭和電工株式会社製「VGCF-X」、直径10~15nm、繊維長3μm、アスペクト比200~300)
ポリアミド(A)、変性樹脂(B)および導電フィラー(C)を下記の表1および2に示す割合で予め混合して、二軸押出機(株式会社プラスチック工学研究所製「BTN-32」)の上流部供給口に一括投入する方法(トップ一括法)、もしくは、ポリアミド(A)および導電フィラー(C)を予め混合して、上記二軸押出機の上流部供給口に投入して溶融混練し、下流部供給口から変性樹脂(B)を投入する方法(エラストマーサイドフィード法)により、シリンダ温度320~340℃の条件下において溶融混練し、押出し、冷却、切断してペレット状のポリアミド樹脂組成物を製造した。得られたポリアミド樹脂組成物を用いて各種物性評価を行った。結果を下記の表3および4に示す。
Claims (7)
- テレフタル酸単位および/またはナフタレンジカルボン酸単位を50~100モル%含有するジカルボン酸単位と、炭素数4~18の脂肪族ジアミン単位を60~100モル%含有するジアミン単位とを含み、末端アミノ基含量([NH2])が5~60μモル/gであるポリアミド(A)、
カルボキシル基および/または酸無水物基を有する不飽和化合物により変性された変性樹脂(B)、並びに
導電フィラー(C)を含有するポリアミド樹脂組成物であって、
前記ポリアミド(A)、前記変性樹脂(B)、および前記導電フィラー(C)の合計100質量部に対して、前記ポリアミド(A)を40~96.5質量部、前記変性樹脂(B)を3~30質量部、前記導電フィラー(C)を0.5~30質量部含み、かつ
前記ポリアミド(A)および前記変性樹脂(B)の合計1g中における、前記ポリアミド(A)の末端アミノ基のモル数(MI)と、前記変性樹脂(B)が有するカルボキシル基および酸無水物基のモル数(MII)との差(MI-MII)が、-5.0μモル以上4.0μモル未満であり、かつMIIが4.0μモルより大きいポリアミド樹脂組成物。 - 前記炭素数4~18の脂肪族ジアミン単位が、1,9-ノナンジアミン単位および/または2-メチル-1,8-オクタンジアミン単位である、請求項1に記載のポリアミド樹脂組成物。
- 前記変性樹脂(B)が、ポリオレフィン系樹脂、スチレン系樹脂、ポリニトリル系樹脂、およびフッ素系樹脂からなる群から選ばれる少なくとも1種の樹脂をカルボキシル基および/または酸無水物基を有する不飽和化合物により変性したものである、請求項1に記載のポリアミド樹脂組成物。
- 前記導電フィラー(C)が、炭素繊維、導電性カーボンブラック、およびカーボンナノチューブからなる群から選ばれる少なくとも1種である、請求項1に記載のポリアミド樹脂組成物。
- 前記カーボンナノチューブの直径が0.5nm~100nmであり、かつそのアスペクト比が5以上である、請求項4に記載のポリアミド樹脂組成物。
- 請求項1に記載のポリアミド樹脂組成物を含む成形品。
- 請求項1に記載のポリアミド樹脂組成物を含む層を含む燃料配管。
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MX348171B (es) | 2017-06-01 |
KR20140007845A (ko) | 2014-01-20 |
CN103328574A (zh) | 2013-09-25 |
EP2666823A4 (en) | 2014-12-31 |
US20130295308A1 (en) | 2013-11-07 |
ES2626607T3 (es) | 2017-07-25 |
JP5981852B2 (ja) | 2016-08-31 |
CN103328574B (zh) | 2015-11-25 |
KR101863740B1 (ko) | 2018-06-01 |
EP2666823A1 (en) | 2013-11-27 |
EP2666823B1 (en) | 2017-03-15 |
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US10090077B2 (en) | 2018-10-02 |
MX2013008263A (es) | 2013-08-12 |
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