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WO2012094102A3 - Pressure controlled polishing platen - Google Patents

Pressure controlled polishing platen Download PDF

Info

Publication number
WO2012094102A3
WO2012094102A3 PCT/US2011/064396 US2011064396W WO2012094102A3 WO 2012094102 A3 WO2012094102 A3 WO 2012094102A3 US 2011064396 W US2011064396 W US 2011064396W WO 2012094102 A3 WO2012094102 A3 WO 2012094102A3
Authority
WO
WIPO (PCT)
Prior art keywords
platen
pressure controlled
polishing platen
controlled polishing
polishing
Prior art date
Application number
PCT/US2011/064396
Other languages
French (fr)
Other versions
WO2012094102A2 (en
Inventor
Hung Chih Chen
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to KR1020127021056A priority Critical patent/KR101941586B1/en
Priority to JP2013547510A priority patent/JP2014501455A/en
Priority to CN201180010227.9A priority patent/CN102884612B/en
Publication of WO2012094102A2 publication Critical patent/WO2012094102A2/en
Publication of WO2012094102A3 publication Critical patent/WO2012094102A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A method and apparatus for controlling pressure or forces applied to a substrate in a polishing process is described. In one embodiment, a polishing system is described. The system includes a platen rotatably disposed on a base, the platen having a sidewall and a polishing pad disposed thereon forming an interior volume, and a pad pressure applicator disposed in the interior volume of the platen adjacent the underside of the polishing pad.
PCT/US2011/064396 2011-01-03 2011-12-12 Pressure controlled polishing platen WO2012094102A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020127021056A KR101941586B1 (en) 2011-01-03 2011-12-12 Pressure controlled polishing platen
JP2013547510A JP2014501455A (en) 2011-01-03 2011-12-12 Pressure controlled polishing platen
CN201180010227.9A CN102884612B (en) 2011-01-03 2011-12-12 Pressure controlled polishing platen

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161429422P 2011-01-03 2011-01-03
US61/429,422 2011-01-03

Publications (2)

Publication Number Publication Date
WO2012094102A2 WO2012094102A2 (en) 2012-07-12
WO2012094102A3 true WO2012094102A3 (en) 2012-10-04

Family

ID=46381147

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2011/064396 WO2012094102A2 (en) 2011-01-03 2011-12-12 Pressure controlled polishing platen

Country Status (5)

Country Link
US (1) US20120171933A1 (en)
JP (1) JP2014501455A (en)
KR (1) KR101941586B1 (en)
CN (1) CN102884612B (en)
WO (1) WO2012094102A2 (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9180569B2 (en) 2012-12-18 2015-11-10 Sunedison Semiconductor Limited (Uen201334164H) Double side polisher with platen parallelism control
US20140273766A1 (en) * 2013-03-15 2014-09-18 Applied Materials, Inc. Polishing System with Front Side Pressure Control
US9751189B2 (en) * 2014-07-03 2017-09-05 Applied Materials, Inc. Compliant polishing pad and polishing module
US10105812B2 (en) * 2014-07-17 2018-10-23 Applied Materials, Inc. Polishing pad configuration and polishing pad support
US10076817B2 (en) 2014-07-17 2018-09-18 Applied Materials, Inc. Orbital polishing with small pad
TWI692385B (en) * 2014-07-17 2020-05-01 美商應用材料股份有限公司 Method, system and polishing pad for chemical mechancal polishing
US10207389B2 (en) 2014-07-17 2019-02-19 Applied Materials, Inc. Polishing pad configuration and chemical mechanical polishing system
US9662762B2 (en) 2014-07-18 2017-05-30 Applied Materials, Inc. Modifying substrate thickness profiles
JP6778176B2 (en) * 2014-07-18 2020-10-28 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ Adjusting the board thickness profile
CN104369087B (en) * 2014-10-21 2016-09-07 青岛橡胶谷知识产权有限公司 A kind of compress control method of grinder pneumatic servo
US9873179B2 (en) 2016-01-20 2018-01-23 Applied Materials, Inc. Carrier for small pad for chemical mechanical polishing
KR102363829B1 (en) 2016-03-24 2022-02-16 어플라이드 머티어리얼스, 인코포레이티드 Organized compact pads for chemical mechanical polishing
JP7250311B2 (en) * 2016-04-01 2023-04-03 モ カン，ジューン Carrier head for chemical-mechanical polishing apparatus with substrate receiving member
KR101900472B1 (en) * 2016-10-11 2018-09-20 연세대학교 산학협력단 Stretchable conductive fiber and method of manufacturing the same
CN109732472A (en) * 2017-10-31 2019-05-10 上海新昇半导体科技有限公司 Polissoir and method
US11890717B2 (en) 2018-12-26 2024-02-06 Applied Materials, Inc. Polishing system with platen for substrate edge control
WO2020164685A1 (en) * 2019-02-12 2020-08-20 Applied Materials, Inc. Cathode drive unit, sputtering cathode and method for assembling a cathode drive unit
TWI850338B (en) * 2019-02-28 2024-08-01 美商應用材料股份有限公司 Polishing pads, chemical mechanical polishing systems, and methods of controlling stiffness of the backing layer of the polishing pad
JP7290140B2 (en) * 2020-09-09 2023-06-13 株式会社Sumco Wafer polishing method and wafer polishing apparatus
DE102021103709B4 (en) 2021-02-17 2024-08-29 Lapmaster Wolters Gmbh Double or single-sided processing machine
US11919120B2 (en) 2021-02-25 2024-03-05 Applied Materials, Inc. Polishing system with contactless platen edge control
US20220305613A1 (en) * 2021-03-26 2022-09-29 Applied Materials, Inc. Controlled profile polishing platen
CN116533127B (en) * 2023-07-06 2023-10-31 浙江晶盛机电股份有限公司 Polishing pressure adjusting method, polishing pressure adjusting device, computer equipment and storage medium

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020142704A1 (en) * 2001-03-28 2002-10-03 Taiwan Semiconductor Manufacturing Co., Ltd. Linear chemical mechanical polishing apparatus equipped with programmable pneumatic support platen and method of using
US20040238493A1 (en) * 2001-12-20 2004-12-02 Lam Research Corporation Method for chemical mechanical planarization
US7018273B1 (en) * 2003-06-27 2006-03-28 Lam Research Corporation Platen with diaphragm and method for optimizing wafer polishing
US20060094341A1 (en) * 2004-10-29 2006-05-04 Gunter Schneider Polishing tool with several pressure zones

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US5212910A (en) * 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
US5961372A (en) * 1995-12-05 1999-10-05 Applied Materials, Inc. Substrate belt polisher
US5980368A (en) * 1997-11-05 1999-11-09 Aplex Group Polishing tool having a sealed fluid chamber for support of polishing pad
JPH11307486A (en) * 1998-04-23 1999-11-05 Toshiba Corp Cmp method and cmp equipment used in the method
US6126527A (en) * 1998-07-10 2000-10-03 Aplex Inc. Seal for polishing belt center support having a single movable sealed cavity
US6186877B1 (en) * 1998-12-04 2001-02-13 International Business Machines Corporation Multi-wafer polishing tool
US6135859A (en) * 1999-04-30 2000-10-24 Applied Materials, Inc. Chemical mechanical polishing with a polishing sheet and a support sheet
JP4402228B2 (en) * 1999-12-21 2010-01-20 パナソニック株式会社 Polishing tool, polishing apparatus and polishing method
US6358118B1 (en) * 2000-06-30 2002-03-19 Lam Research Corporation Field controlled polishing apparatus and method
US6607425B1 (en) * 2000-12-21 2003-08-19 Lam Research Corporation Pressurized membrane platen design for improving performance in CMP applications
US6776695B2 (en) * 2000-12-21 2004-08-17 Lam Research Corporation Platen design for improving edge performance in CMP applications
US20020081945A1 (en) * 2000-12-21 2002-06-27 Rod Kistler Piezoelectric platen design for improving performance in CMP applications
US6561870B2 (en) * 2001-03-30 2003-05-13 Lam Research Corporation Adjustable force applying air platen and spindle system, and methods for using the same
US6656024B1 (en) * 2001-12-21 2003-12-02 Lam Research Corporation Method and apparatus for reducing compressed dry air usage during chemical mechanical planarization
US6749491B1 (en) * 2001-12-26 2004-06-15 Lam Research Corporation CMP belt stretch compensation apparatus and methods for using the same
US6769970B1 (en) * 2002-06-28 2004-08-03 Lam Research Corporation Fluid venting platen for optimizing wafer polishing
JP2004160573A (en) * 2002-11-11 2004-06-10 Ebara Corp Polishing device
US6752898B1 (en) * 2002-12-20 2004-06-22 Lam Research Corporation Method and apparatus for an air bearing platen with raised topography
US7025660B2 (en) * 2003-08-15 2006-04-11 Lam Research Corporation Assembly and method for generating a hydrodynamic air bearing
US20090305610A1 (en) * 2008-06-06 2009-12-10 Applied Materials, Inc. Multiple window pad assembly
US8337279B2 (en) * 2008-06-23 2012-12-25 Applied Materials, Inc. Closed-loop control for effective pad conditioning
US7749052B2 (en) * 2008-09-08 2010-07-06 Applied Materials, Inc. Carrier head using flexure restraints for retaining ring alignment
US8083570B2 (en) * 2008-10-17 2011-12-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having sealed window

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020142704A1 (en) * 2001-03-28 2002-10-03 Taiwan Semiconductor Manufacturing Co., Ltd. Linear chemical mechanical polishing apparatus equipped with programmable pneumatic support platen and method of using
US20040238493A1 (en) * 2001-12-20 2004-12-02 Lam Research Corporation Method for chemical mechanical planarization
US7018273B1 (en) * 2003-06-27 2006-03-28 Lam Research Corporation Platen with diaphragm and method for optimizing wafer polishing
US20060094341A1 (en) * 2004-10-29 2006-05-04 Gunter Schneider Polishing tool with several pressure zones

Also Published As

Publication number Publication date
WO2012094102A2 (en) 2012-07-12
US20120171933A1 (en) 2012-07-05
JP2014501455A (en) 2014-01-20
CN102884612B (en) 2017-02-15
CN102884612A (en) 2013-01-16
KR20140001733A (en) 2014-01-07
KR101941586B1 (en) 2019-01-23

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