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WO2012091316A2 - 레이저 가공 장치 - Google Patents

레이저 가공 장치 Download PDF

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Publication number
WO2012091316A2
WO2012091316A2 PCT/KR2011/009451 KR2011009451W WO2012091316A2 WO 2012091316 A2 WO2012091316 A2 WO 2012091316A2 KR 2011009451 W KR2011009451 W KR 2011009451W WO 2012091316 A2 WO2012091316 A2 WO 2012091316A2
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WO
WIPO (PCT)
Prior art keywords
laser beam
laser
lens
convex lens
cylindrical convex
Prior art date
Application number
PCT/KR2011/009451
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English (en)
French (fr)
Korean (ko)
Other versions
WO2012091316A3 (ko
Inventor
유병소
Original Assignee
(주)큐엠씨
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Application filed by (주)큐엠씨 filed Critical (주)큐엠씨
Publication of WO2012091316A2 publication Critical patent/WO2012091316A2/ko
Publication of WO2012091316A3 publication Critical patent/WO2012091316A3/ko

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/0944—Diffractive optical elements, e.g. gratings, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0955—Lenses

Definitions

  • the present invention relates to an optical unit, a laser processing apparatus comprising the same, a laser processing system, and a laser processing method.
  • Laser processing refers to a process of processing an object using a laser, which is a high density energy source.
  • a method of chip separation of a substrate by scribing or cutting a thin substrate with a laser is known.
  • the shape of the substrate is very diverse, such as a silicon wafer (Si Wafer), a compound semiconductor wafer, a ceramic semiconductor substrate, a sapphire substrate, a metal substrate and a glass substrate.
  • each laser has its own divergence angle (divergence angle), even when using the same kind of laser light source there is a deviation in the divergence angle. Therefore, it is necessary to correct the divergence angle of the laser beam in order to form a spot suitable for internal processing of the substrate.
  • tip division was performed by cutting an board
  • the transmittance of the substrate is lowered at the portion where the phase change region is formed.
  • a decrease in transmittance of the substrate may be a cause of lowering the brightness of the light emitting device.
  • the present invention is to solve the above-mentioned problems of the prior art, an object of the present invention is to provide a laser processing apparatus and method capable of precisely controlling the position and shape of the spot without reducing the processing speed. In particular, it is an object of the present invention to minimize the phase transition region by reducing the size of the spot.
  • a laser light source for generating a laser beam; And an optical unit for guiding the laser beam into an object, the optical unit comprising: a beam shaping module configured to correct a divergence angle of the laser beam; A diffraction grating diffracting the laser beam; And a focusing lens for condensing the laser beam into an object to form a spot.
  • an optical unit for use in a laser processing apparatus for guiding a laser beam into the interior of the object to form a spot, the beam for correcting the divergence angle of the laser beam Orthopedic modules; A diffraction grating diffracting the laser beam; And a condenser lens for condensing the laser beam into the object to form a spot.
  • a laser processing system for irradiating a laser beam to the inside of the object to form a phase change region inside the object, the laser beam generated by the laser light source beam
  • a laser processing system characterized by changing the shape, size, or number of spots formed inside the object.
  • a laser processing system for self-breaking an object using a laser, the laser beam generated from a laser light source and a beam shaping module and a diffraction grating By passing through, a plurality of phase change regions having stress concentration portions are formed in the object, thereby providing a laser processing system.
  • generating a laser beam Correcting the divergence angle of the generated laser beam; Diffracting the laser beam whose divergence angle has been corrected; And condensing the diffracted laser beam into the object to form a spot.
  • the position and shape of the spot can be precisely controlled without reducing the processing speed.
  • the transmittance of the substrate may be increased by reducing the phase change region.
  • the divergence angle of the laser beam can be corrected, and the substrate can be self-cut.
  • FIG. 1 is a configuration diagram schematically showing an embodiment of a laser processing apparatus according to the present invention.
  • FIG. 2 is a detailed block diagram illustrating an embodiment of an optical unit in the laser processing apparatus of FIG. 1.
  • FIG. 3 is a configuration diagram for describing an operation of a beam shaping module in the optical unit of FIG. 2.
  • FIG. 4 is a view for explaining the shape change of the spot according to the operation of the beam shaping module.
  • FIG 5 is a view for explaining a change in the optical path according to the divergence angle of the laser beam.
  • FIG. 6 is a perspective view of the blaze diffraction grating.
  • FIG. 7 is a diagram illustrating diffraction of a laser beam passing through the blaze diffraction grating of FIG. 6.
  • FIG. 8 is a configuration diagram for explaining the operation of the blaze diffraction grating in the laser processing apparatus.
  • FIG. 9 is a view for explaining the change in the shape of the spot and the change in the light intensity profile according to the operation of the blaze diffraction grating.
  • FIG. 10 is a view for explaining the shape change of the spot according to the operation of the blaze diffraction grating.
  • FIG. 11 is a detailed block diagram showing another embodiment of the optical unit in the laser processing apparatus of FIG.
  • FIG. 12 is a view for explaining a shape change of a spot according to the operation of the beam shaping module in the optical unit of FIG. 11.
  • FIG. 13 is a detailed configuration diagram illustrating still another embodiment of the optical unit in the laser processing apparatus of FIG. 1.
  • FIG. 1 is a configuration diagram schematically showing an embodiment of a laser processing apparatus according to the present invention.
  • FIG. 2 is a detailed block diagram illustrating an embodiment of an optical unit in the laser processing apparatus of FIG. 1.
  • the laser processing apparatus 1 supports a laser light source 10 that generates a laser beam, an optical unit 20 that guides the laser beam into the inside of the object S, and an object S. And a control unit 40 for controlling one or more of the mounting table 30, the laser light source 10, the optical unit 20, and the mounting table 30.
  • the object S may be a substrate requiring chip division or a metal, nonmetal, resin, or glass requiring work such as processing or cutting.
  • the shape of the substrate requiring chip division may include a silicon substrate, a compound semiconductor substrate, a ceramic semiconductor substrate, a sapphire substrate, a metal substrate, a glass substrate, and the like, but is not limited thereto.
  • a laminate of a material different from the substrate may be formed on the surface of the substrate.
  • the laser light source 10 generates a laser beam used for the processing of the object S.
  • FIG. The generated laser beam may be adjusted in the size of the laser beam, the output of the laser beam, the polarization direction, and the like through a series of non-illustrated devices arranged along the optical axis Lc of the laser light source 10.
  • reference numeral L denotes the optical path of the laser beam exaggerated.
  • the optical path from the laser light source 10 to the object S is formed in a straight line along the optical axis Lc.
  • the optical path may be moved to any other path by using an optical element such as a mirror. It is also possible to change.
  • the laser light source 10 may be a laser light source of any one of a CO 2 laser, an excimer laser, and a DPSS laser.
  • the laser beam generated by the laser light source 10 may have a Gaussian beam profile.
  • the laser beam may be a pulse type laser beam, in particular an ultra-short pulsed laser beam.
  • the ultrashort pulse laser refers to a laser having a period of light pulses of nanosecond, pico second, or femto second.
  • the laser beam generated by the laser light source 10 enters the optical unit 20.
  • the optical unit 20 passes through the laser beam and adjusts the characteristics and path of the laser beam.
  • the optical unit 20 includes a beam shaping module 210 for correcting the divergence angle of the laser beam, a diffraction grating 220 for diffracting the laser beam, and It includes a focusing lens 230 for condensing the laser beam into the object (S) to form a spot (spot).
  • the beam shaping module 210 corrects the divergence angle of the laser beam generated by the laser light source 10.
  • the laser beam has a single wavelength compared to other light rays and has a collimation property, so that the laser beam does not spread when traveling and runs parallel to the optical axis.
  • the laser beam also has wave characteristics, it is affected by diffraction and thus has a divergence angle.
  • the beam shaping module 210 includes a pair of concave and convex lenses. The divergence angle of the laser beam is corrected by adjusting the distance between these concave and convex lenses.
  • the beam shaping module 210 includes a cylindrical concave lens 211 for emitting a laser beam and a cylindrical convex lens for correcting the divergence angle of the laser beam passing through the cylindrical concave lens 211 as shown in FIG. 2. 212.
  • the z-axis is a direction in which the laser beam is irradiated
  • the x-axis is a scribing direction, that is, a direction parallel to a cutting line.
  • the surface of the cylindrical concave lens 211 is curved along the y-axis direction and there is no change along the x-axis direction.
  • the surface of the cylindrical convex lens 212 protrudes along the y-axis direction, and there is no change along the x-axis direction. Therefore, using the cylindrical concave lens 211 and the cylindrical convex lens 212 as shown, divergence angle correction is performed only for the y-axis component of the laser beam.
  • the divergence angle correction is performed only in one direction of the laser beam, so that the shape of the spot of the laser beam formed inside the object S is changed only in one direction. For example, it becomes possible to form an advantageous oval or line (linear) spot when scribing the object S.
  • the long axis (x-axis direction) of the spot may be arranged along the scribing direction, that is, along the line to be cut.
  • divergence angle correction is not performed in the long axis direction of the spot.
  • reducing the size of the spot (shortening the spot, or the width of the spot) in the direction perpendicular to the cut line will allow energy to be concentrated in a small area, allowing precise machining, but parallel to the cut line.
  • Reducing the spot size (the long axis of the spot, or the length of the spot) to the furnace reduces the processing speed and is therefore disadvantageous in the process.
  • divergence angle correction is performed in either direction.
  • the cylindrical concave lens 211 and the cylindrical convex lens 212 is configured such that the relative distance is changeable.
  • the laser processing apparatus 1 may further include an unshown lens moving part for moving at least one of the cylindrical concave lens 211 and the cylindrical convex lens 212.
  • the lens moving unit may finely adjust the distance between the cylindrical concave lens 211 and the cylindrical convex lens 212 by a screw or an actuator.
  • the diffraction grating 220 is an optical element that diffracts a laser beam and may be disposed between the beam shaping module 210 and the condenser lens 230.
  • the diffraction grating 220 may be configured to diffract the laser beam only in either direction on the perpendicular plane in a plane perpendicular to the direction of travel of the laser beam. For example, as shown in FIGS. 2A and 2B, when the laser beam travels in a direction parallel to the z-axis, the diffraction grating 220 diffracts the laser beam in the x-axis direction and y It can be configured to pass the laser beam as it is in the axial direction. To this end, the diffraction grating 220 may be a blazed diffraction grating.
  • the diffraction grating 220 is divergent. It may be arranged to diffract the laser beam only in the direction perpendicular to the direction in which the calibration is performed, ie in the x-axis direction. Arranging the cylindrical concave lens 211, the cylindrical convex lens 212, and the diffraction grating 220 in this way, while reducing the size of the spot in the direction perpendicular to the line to be cut, the direction parallel to the line to be cut As a result, a plurality of fine spots can be formed.
  • phase change region having a stress concentration portion which is advantageous for self-cutting of the object S while maintaining the processing speed.
  • the microspot since the microspot is formed, the overall size of the phase change region is reduced, so that the decrease in transmittance of the substrate can be suppressed. Detailed description thereof will be described later.
  • the condenser lens 230 condenses the laser beam to the condensing point P inside the object S, and performs a processing process such as scribing or cutting.
  • a phase change region is formed inside the object S by the spot, and as described above, the size of the spot may be changed in at least one axial direction by the divergence angle correction of the laser beam.
  • the condenser lens 230 is also called an objective lens.
  • the mounting table 30 loads the object S on the upper side.
  • the mounting table 30 may be moved and rotated by an object moving unit such as an actuator or a motor, which is not shown, and thus the relative position between the mounting table 30 and the condenser lens 230 may be changed.
  • an object moving unit such as an actuator or a motor, which is not shown
  • the controller 40 is connected to and controls one or more of the laser light source 10, the optical unit 20, and the mounting table 30.
  • the controller 40 may adjust the distance between the condenser lens 230 and the object S by controlling the position of the mounting table 30.
  • the controller 40 may control the mounting table 30 such that a plurality of spots are formed in the vertical direction in the inside of the object S.
  • the controller 40 may control the loading table 30 such that a plurality of spots are formed in the horizontal direction in the inside of the object S.
  • 3 is a configuration diagram for describing an operation of a beam shaping module in the optical unit of FIG. 2.
  • 4 is a view for explaining the shape change of the spot according to the operation of the beam shaping module.
  • 5 is a view for explaining a change in the optical path according to the divergence angle of the laser beam.
  • the laser beam is focused inside the object S via the cylindrical concave lens 211, the cylindrical convex lens 212, and the condenser lens 230. Assume that the light is collected at point P. That is, the operation of the diffraction grating will be described later separately.
  • the laser beam generated from the laser light source 10 is incident on the cylindrical concave lens 211, and the divergent angle of the laser beam emitted by the cylindrical concave lens 211 is corrected by the cylindrical convex lens 212.
  • the distance between the cylindrical concave lens 211 and the cylindrical convex lens 212 is d f1
  • the focal length of the cylindrical concave lens 211 is shown.
  • f c1 and the focal length of the cylindrical convex lens 212 is f v1 , the size of the spot of the laser beam formed inside the object S is minimized when the following conditions are satisfied.
  • the actual laser beam has a divergence angle of a predetermined size, whereby the point where the spot size of the laser beam is minimized is changed as follows.
  • ⁇ is an increase component of the focal length of the cylindrical concave lens 211 lengthened by the divergence angle of the laser beam
  • ⁇ is an increase component of the focal length of the cylindrical convex lens 212 lengthened by the divergence angle of the laser beam. to be.
  • the positive lens laser beam passing through the (C c) is corresponding to the lens (C c) focal length (f 1) in the optical axis line of the lens (C c) Pass the position (see light path B1 in FIG. 5).
  • the increasing component of the focal length that is, the distance between f 1 and f 2 is a function of ⁇ .
  • Equation 2 when the beam shaping module 210 is configured as a pair of the cylindrical concave lens 211 and the cylindrical convex lens 212, Equation 2 may be expressed as follows.
  • size of the spot of the laser beam formed in the condensing point P is represented as follows.
  • M 2 is a beam quality factor and is expressed as a function of divergence angle as follows.
  • Equations 4 and 5 f is the focal length of the condenser lens, and D is the diameter of the laser beam incident on the condenser lens.
  • M 2 is proportional to the divergence angle ( ⁇ ) of the laser beam, and as can be seen from Equation 4 above, since the spot size d is proportional to M 2 , the spot of the laser beam is eventually obtained. It can be seen that the magnitude d is proportional to the divergence angle ⁇ of the laser beam. Therefore, when the divergence angle of the laser beam is given a predetermined value, the spot size can be controlled by correcting the divergence angle.
  • the shape of the spot Sp inside the object S that is, the width of the spot (the size of the spot in the y-axis direction in the drawing) ) Can be controlled.
  • the shape of the spot is expressed as a function of the size of the incident beam, the divergence angle, and the wavelength. As described above, only the correction of the divergence angle makes it possible to form a spot Sp having a desired shape and size. This is particularly useful in the case of scribing by condensing a laser beam inside the object S.
  • the spot Sp can be formed into an elliptical shape, or even more linearly linear.
  • the major axis of the elliptical or linear spot Sp is in the scribing direction of the object S, that is, the direction of the cutting line, the processing speed is significantly improved, and the laser beam is irradiated to the inside of the object S. Only by being able to induce self-cutting of the object (S).
  • D is the normal size of the phase shift region and R is the radius of curvature of the point.
  • the stress concentration coefficient at the vertical end point of the phase transition region is S1.
  • the stress concentration coefficient at the vertical end point of the phase transition region is S2.
  • the vertical magnitude D1 of the area T and the vertical magnitude D2 of the phase change area in the elliptical spot are approximately D1 ⁇ D2 and the radius of curvature is R1> R2, which results in stress concentration at the vertical end point.
  • the magnitude of the coefficient is S1 ⁇ S2. That is, in the case of an elliptical spot, it can be seen that the stress is concentrated at the vertical end point of the region of the phase transition as compared with the case of the circular spot.
  • cracks may be concentrated at an end point in the longitudinal direction of the elliptical spot due to the concentration of such stress.
  • a stress concentration part is formed in which the stress is concentrated in comparison with other points in the phase change region.
  • the stress concentration part is formed at an end point close to the upper surface or the lower surface of the object S in the phase change region.
  • the radius of curvature of the phase transition region is minimized at the stress concentration portion, so that the generation of cracks at the stress concentration portion is more active than at other points.
  • the object S When the crack C reaches the upper or lower surface of the object S, the object S may be self-breaking. In this case, by simply irradiating the laser beam inside the object S, the wafer can be separated into chips without any subsequent cutting process, thereby reducing the number of processes, reducing process time, and reducing costs. have. In addition, even when the cutting process after the scribing of the object (S), the cutting process can be performed only with a small external force, thereby increasing the process efficiency.
  • FIG. 6 is a perspective view of the blaze diffraction grating.
  • FIG. 7 is a diagram illustrating diffraction of a laser beam passing through the blaze diffraction grating of FIG. 6.
  • 8 is a configuration diagram for explaining the operation of the blaze diffraction grating in the laser processing apparatus.
  • 9 is a view for explaining the change in the shape of the spot and the change in the light intensity profile according to the operation of the blaze diffraction grating.
  • 10 is a view for explaining the shape change of the spot according to the operation of the blaze diffraction grating.
  • the diffraction grating 220 is a component that diffracts a laser beam.
  • a plurality of diffractive elements such as openings and protrusions are repeatedly formed to change the phase, amplitude, or the like of incident light.
  • the diffraction grating 220 may be a blaze diffraction grating having a shape in which one surface is a plane and the other surface is continuously attached with a long triangular prism-shaped diffraction element.
  • the distance between adjacent diffractive elements in the blaze diffraction grating 220 is referred to as a, and the angle formed by the diffractive elements is referred to as ⁇ .
  • ⁇ the angle formed by the diffractive elements.
  • FIG. 9A illustrates a case where the laser beam passing through the beam shaping module 210 is irradiated to the object S through the condenser lens 230 without being passed through the diffraction grating 220.
  • 6 (b) shows the y-axis light intensity profile of the laser beam
  • FIG. 9 (a) shows the x-axis light intensity profile of the same laser beam.
  • the laser beam incident on the diffraction grating 220 is diffracted in the x-axis direction to form a main maximum.
  • the position at which the optical path difference becomes an integer multiple of the wavelength of the light under the influence of diffraction ..., P- 2 , P- 1 , P 0 , P 1 , P 2 , ...), the light intensity I represents a peak value, and this position means a position where the main pole is formed.
  • three light intensities equal to or greater than the reference intensity Ic, which can form the phase shift region, are formed in the vicinity of P ⁇ 1 , P 0 , and P 1 , which is actually three spots Sp. Formed in
  • the spot Sp when the light intensity I profile as shown at the bottom of FIG. 9 (b) is formed, the spot Sp includes three minute spots.
  • the light intensity peak value above the reference intensity Ic may be formed at five locations, for example, in this case, as shown in FIG. 10, the spot Sp includes five minute spots. It is also possible to form one or five or more micro spots.
  • the microspots are substantially oval. However, when the spot Sp has a sufficiently small width (y-axis size), the microspots may also be formed substantially linearly. .
  • the spot Sp may include a plurality of minute spots.
  • the object S may be scribed so that the long axis of the spot Sp is disposed along the scheduled cutting line.
  • the overall size of the phase change region becomes smaller when a plurality of minute spots are formed. Therefore, when performing the process which irradiates a laser beam to a light transmissive board
  • FIGS. 11 and 12 The same reference numerals are used to refer to the same elements as in the previous embodiment, and duplicate description thereof will be omitted.
  • the beam shaping module 210 adjusts the divergence angle of the laser beam passing through the spherical concave lens 213 and the spherical concave lens 213. And a second cylindrical convex lens 215 for correcting, and a second cylindrical convex lens 215 for correcting the divergence angle of the laser beam passing through the first cylindrical convex lens 214.
  • the spherical concave lens 213 is distinguished from the cylindrical concave lens 211 described above in that the spherical concave lens 213 can emit a laser beam for both orthogonal x-axis and y-axis direction components. In this way, since the laser beam is divergent on both the x-axis and the y-axis, two cylindrical convex lenses capable of correcting the divergence angle on the x- and y-axis components in order to correct the divergence angle of the divergent laser beam. Will be needed.
  • the laser processing apparatus 1 further comprises an unillustrated lens shifter for moving at least one of the spherical concave lens 213, the first cylindrical convex lens 214, and the second cylindrical convex lens 215. It may include.
  • the lens shift unit may finely adjust the distance between the spherical concave lens 213, the first cylindrical convex lens 214, and the second cylindrical convex lens 215 by a screw or an actuator.
  • the laser beam generated from the laser light source 10 is incident on the spherical concave lens 213, and the x-axis component of the laser beam emitted by the spherical concave lens 213 is zero.
  • the divergence angle is corrected by the second cylindrical convex lens 215 after passing through the one cylindrical convex lens 214 as it is. That is, the first cylindrical convex lens 214 can be treated as if the x-axis component of the laser beam does not exist.
  • the distance between the spherical concave lens 213 and the second cylindrical convex lens 215 is the focal length of the spherical concave lens 213 and the focal length of the second cylindrical convex lens 215 and the divergence of the laser beam.
  • the length (x-axis direction size) of the spot Sp of the laser beam collected by the condenser lens 230 becomes large (Fig. 12 (b)). Reference).
  • the distance between the spherical concave lens 213 and the second cylindrical convex lens 215 is the focal length of the spherical concave lens 213 and the focal length of the second cylindrical convex lens 215 and the divergence angle of the laser beam.
  • the increase component of the focal length is closer to the sum value, the length of the spot Sp of the laser beam collected by the condenser lens 230 becomes small (see Fig. 12 (c)).
  • the y-axis component of the laser beam emitted by the spherical concave lens 213 is the second cylinder after the divergence angle is corrected by the first cylindrical convex lens 214,
  • the convex lens 215 passes through as it is. That is, the second cylindrical convex lens 215 can be treated as if the y-axis component of the laser beam does not exist. Therefore, the distance between the spherical concave lens 213 and the first cylindrical convex lens 214 is the focal length of the spherical concave lens 213 and the focal length of the first cylindrical convex lens 214 and the divergence of the laser beam.
  • the width (y-axis size) of the spot of the laser beam focused by the condenser lens 230 becomes small (see Fig. 12 (b)).
  • the distance between the spherical concave lens 213 and the first cylindrical convex lens 214 is the focal length of the spherical concave lens 213 and the focal length of the first cylindrical convex lens 214 and the divergence angle of the laser beam.
  • the width of the spot of the laser beam focused by the condenser lens 230 becomes large (see FIG. 12 (a)).
  • the diffraction grating 220 is located in the rear end of the beam shaping module 210 on the optical path of the laser beam, the present invention is not limited to this embodiment.
  • the diffraction grating 220 may be disposed at the tip of the beam shaping module 210, that is, between the laser light source 10 and the beam shaping module 210.
  • the beam shaping module 210 is illustrated in FIG. 13 as including the cylindrical concave lens 211 and the cylindrical convex lens 212, the beam shaping module 210 is different from the spherical concave lens 213.
  • the first cylindrical convex lens 214, and the second cylindrical convex lens 215 may be included.
  • the present invention relates to a laser processing apparatus, which can be applied to a process of scribing a thin substrate with a laser, and thus has industrial applicability.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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  • Laser Beam Processing (AREA)
PCT/KR2011/009451 2010-12-28 2011-12-08 레이저 가공 장치 WO2012091316A2 (ko)

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US20170157700A1 (en) * 2014-07-15 2017-06-08 Innolas Solutions Gmbh Method and device for the laser-based working of two-dimensional, crystalline substrates, in particular semiconductor substrates
US10821555B2 (en) * 2014-07-15 2020-11-03 Innolas Solutions Gmbh Method and device for the laser-based working of two-dimensional, crystalline substrates, in particular semiconductor substrates
CN104148802A (zh) * 2014-08-04 2014-11-19 北京万恒镭特机电设备有限公司 光束形成装置及其形成方法
WO2017135543A1 (ko) * 2016-02-05 2017-08-10 (주)이오테크닉스 레이저 빔의 경사각을 이용한 레이저 가공방법
EP3340402B1 (en) * 2016-12-21 2022-01-26 Samsung Display Co., Ltd. Laser polycrystallization apparatus
CN113894411A (zh) * 2020-07-07 2022-01-07 住友重机械工业株式会社 光束整形光学装置及圆度调整方法
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CN114152194A (zh) * 2021-11-16 2022-03-08 华中科技大学 一种基于反射光栅的微位移测量装置及方法
WO2025044107A1 (zh) * 2023-09-01 2025-03-06 深圳市绎立锐光科技开发有限公司 激光光源及加工装置

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TWI466748B (zh) 2015-01-01
WO2012091316A3 (ko) 2012-09-07

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