WO2011142143A1 - 弾性波装置 - Google Patents
弾性波装置 Download PDFInfo
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- WO2011142143A1 WO2011142143A1 PCT/JP2011/050267 JP2011050267W WO2011142143A1 WO 2011142143 A1 WO2011142143 A1 WO 2011142143A1 JP 2011050267 W JP2011050267 W JP 2011050267W WO 2011142143 A1 WO2011142143 A1 WO 2011142143A1
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- Prior art keywords
- electrode
- acoustic wave
- wave device
- width direction
- capacitive
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- 239000003990 capacitor Substances 0.000 claims abstract description 49
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 238000010897 surface acoustic wave method Methods 0.000 claims description 24
- 238000012986 modification Methods 0.000 description 12
- 230000004048 modification Effects 0.000 description 12
- 238000003780 insertion Methods 0.000 description 8
- 230000037431 insertion Effects 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
- -1 SiO 2 Chemical compound 0.000 description 1
- 102000006463 Talin Human genes 0.000 description 1
- 108010083809 Talin Proteins 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
- H03H9/6423—Means for obtaining a particular transfer characteristic
- H03H9/6433—Coupled resonator filters
- H03H9/6483—Ladder SAW filters
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
- H03H9/14544—Transducers of particular shape or position
- H03H9/14573—Arrow type transducers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/0222—Details of interface-acoustic, boundary, pseudo-acoustic or Stonely wave devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/72—Networks using surface acoustic waves
- H03H9/725—Duplexers
Definitions
- the present invention relates to an elastic wave device.
- the present invention relates to an acoustic wave device including a capacitive electrode that is connected in series to an IDT electrode on a piezoelectric substrate and has a comb-like electrode pair.
- the acoustic wave device includes a piezoelectric substrate and an IDT electrode formed on the piezoelectric substrate.
- resonance characteristics, filter characteristics, and the like are realized by using elastic waves excited in the IDT electrodes.
- an additional capacitor may be provided.
- a capacitor is connected in parallel to the IDT electrode constituting the ladder type surface acoustic wave filter device, or a capacitor is connected in series to the IDT electrode.
- capacitance is comprised by the comb-toothed electrode pair currently formed on the piezoelectric substrate and mutually interposing. It is known. By configuring the capacitance with a comb-like electrode pair, the opposing area of the electrodes can be increased, so that a large capacitance can be obtained.
- the elastic wave device can be miniaturized.
- the crossing width of the capacitance forming comb-like electrode pair 101 is increased, the resistance loss in the capacitance forming comb-like electrode pair 101 increases, which causes a problem that the characteristics of the acoustic wave device deteriorate.
- the elastic wave device is an elastic wave filter device, there is a problem that the insertion loss increases.
- the present invention has been made in view of the above points, and an object of the present invention is to provide an acoustic wave device including a capacitive electrode connected in series to an IDT electrode on a piezoelectric substrate and having a comb-like electrode pair.
- the aim is to achieve both performance and miniaturization.
- the elastic wave device includes a piezoelectric substrate, an IDT electrode, and a capacitive electrode.
- the IDT electrode is formed on the piezoelectric substrate.
- the capacitive electrode is formed on the piezoelectric substrate.
- the capacitor electrode is connected in series with the IDT electrode.
- the capacitor electrode has a plurality of capacitor electrode portions. Each of the plurality of capacitive electrode portions is composed of a pair of interdigital electrodes that are interleaved.
- the plurality of capacitive electrode portions are connected in parallel to each other.
- the plurality of capacitor electrode portions are formed such that the cross width direction in the capacitor electrode portion and the cross width direction in the IDT electrode are inclined.
- the plurality of capacitive electrode portions are arranged along the elastic wave propagation direction in the IDT electrode.
- At least a part of the capacitive electrode and the IDT electrode are arranged along a direction perpendicular to the acoustic wave propagation direction.
- each of the plurality of capacitive electrode portions includes a plurality of electrode fingers and a bus bar.
- the plurality of electrode fingers extend in the cross width direction in the capacitive electrode portion.
- a plurality of electrode fingers are connected to the bus bar.
- the bus bar extends in a direction perpendicular to the intersecting width direction in the capacitor electrode portion.
- At least one bus bar among the plurality of comb-shaped electrodes constituting the plurality of capacitive electrode portions is formed integrally with the other one bus bar among the plurality of comb-shaped electrodes.
- the surface acoustic wave device is a surface acoustic wave device that uses surface acoustic waves.
- the elastic wave device is a boundary acoustic wave device using a boundary acoustic wave.
- the elastic wave device is a ladder-type elastic wave filter device including a series arm resonator having an IDT electrode.
- the elastic wave device is a ladder-type elastic wave filter device including a series arm resonator having an IDT electrode.
- the acoustic wave device further includes an inductor that is in series with the IDT electrode and connected in parallel with the capacitive electrode. According to this configuration, an attenuation pole can be generated at a desired frequency by using an LC parallel resonant circuit including a capacitive electrode and an inductor.
- the plurality of capacitor electrode portions are formed such that the cross width direction in the capacitor electrode portion and the cross width direction in the IDT electrode are orthogonal to each other.
- the capacitive electrode is composed of a pair of interdigital electrodes that are interleaved, and has a plurality of capacitive electrode portions connected in parallel to each other.
- the plurality of capacitor electrode portions are formed so that the intersecting width direction in the capacitor electrode portion and the intersecting width direction in the IDT electrode are orthogonal to each other.
- the plurality of capacitive electrode portions are arranged along the elastic wave propagation direction in the IDT electrode. Therefore, for example, as compared with the case where the capacitive electrode is composed of a pair of comb-like electrodes, a large capacitance can be obtained while reducing the crossing width. Therefore, it is possible to achieve both high performance and downsizing of the acoustic wave device.
- FIG. 1 is an equivalent circuit diagram of an elastic wave device according to an embodiment of the present invention.
- FIG. 2 is a schematic plan view of a part of the acoustic wave device according to the embodiment of the present invention.
- FIG. 3 is a schematic cross-sectional view of a part of an acoustic wave filter device according to an embodiment of the present invention.
- FIG. 4 is an enlarged schematic cross-sectional view of the capacitive electrode portion of the acoustic wave device according to the embodiment of the present invention.
- FIG. 5 is an example of a graph showing the insertion loss of the acoustic wave device according to the embodiment of the present invention.
- FIG. 6 is a graph showing the filter characteristics of the acoustic wave filter device in the example and the comparative example.
- FIG. 1 is an equivalent circuit diagram of an elastic wave device according to an embodiment of the present invention.
- FIG. 2 is a schematic plan view of a part of the acoustic wave device according to the embodiment of the present
- FIG. 7 is a schematic plan view of a part of the acoustic wave device according to the comparative example.
- FIG. 8 is a schematic plan view of a part of the acoustic wave device according to the first modification.
- FIG. 9 is a schematic plan view of a part of the acoustic wave device according to the second modification.
- FIG. 10 is a schematic cross-sectional view of an acoustic wave filter device according to a third modification.
- FIG. 11 is a schematic cross-sectional view of an acoustic wave filter device according to a fourth modification.
- FIG. 12 is a schematic plan view for explaining the arrangement of the IDT electrode and the capacitance forming comb-like electrode pair in the acoustic wave device according to the first reference example.
- FIG. 13 is a schematic plan view for explaining the arrangement of the IDT electrode and the capacitance forming comb-like electrode pair in the acoustic wave device according to the second reference example.
- an elastic wave device 1 as an elastic wave filter device shown in FIG. 1 as an example.
- the elastic wave device 1 is merely an example.
- the elastic wave device according to the present invention is not limited to the elastic wave device 1 at all.
- the elastic wave device according to the present invention may not be an elastic wave filter device, and may be, for example, an elastic wave resonator.
- FIG. 1 is an equivalent circuit diagram of the acoustic wave device according to the present embodiment.
- FIG. 2 is a schematic plan view of a part of the acoustic wave device according to the present embodiment.
- FIG. 3 is a schematic cross-sectional view of a part of the acoustic wave filter device according to this embodiment.
- FIG. 4 is an enlarged schematic cross-sectional view of the capacitive electrode portion of the acoustic wave device according to the present embodiment.
- FIG. 5 is an example of a graph showing the insertion loss of the elastic wave device in the present embodiment.
- the surface acoustic wave device 1 is a surface acoustic wave device that uses surface acoustic waves.
- the acoustic wave device 1 is a ladder-type surface acoustic wave filter device having a ladder-type surface acoustic wave filter unit 20.
- the elastic wave device 1 of this embodiment is used as a transmission-side bandpass filter (transmission frequency band: 1850 MHz to 1910 MHz) of a UMTS Band2 duplexer.
- the acoustic wave device 1 includes a signal output terminal 21 connected to the antenna 11 and a signal input terminal 22 connected to the transmission-side signal terminal 12.
- a ladder type surface acoustic wave filter unit 20 is connected between the signal output terminal 21 and the signal input terminal 22.
- the ladder-type surface acoustic wave filter unit 20 has a series arm 23 connected between a signal input terminal 22 and a signal output terminal 21.
- a plurality of series arm resonators S1, S2-1, S2-2, and S3 are connected in series.
- a plurality of parallel arms 24 to 26 are connected between the series arm 23 and the ground potential.
- Each of the parallel arms 24 to 26 is provided with parallel arm resonators P1 to P3.
- An inductor L2 is connected between the parallel arm resonator P1 and the ground potential.
- An inductor L3 is connected between the connection point of the parallel arm resonators P2 and P3 and the ground potential.
- the series arm resonators S1, S2-1, S2-2, and S3 and the parallel arm resonators P1 to P3 include an IDT electrode composed of a pair of comb-like electrodes that are interleaved with each other, and both sides of the IDT electrode. It is comprised from two reflectors provided.
- the capacitor C2 is connected in parallel to the series arm resonator S2-2.
- an LC resonance circuit 27 is connected between the series arm resonator S 1 and the signal input terminal 22.
- the LC resonance circuit 27 includes an inductor L1 and a capacitor C1 connected in parallel to each other. By providing this LC resonance circuit 27, an attenuation pole indicated by an arrow is formed in the vicinity of 4300 MHz as shown in FIG.
- the graph shown in FIG. 5 is a graph in the case of the following design parameters.
- Series arm resonator S2-2 Logarithm: 230 pairs, intersection width: 37.34 ⁇ m, wavelength: 1.9232 ⁇ m, duty ratio: 0.475, number of steps: 2
- Series arm resonator S2-1 Logarithm: 200 pairs, intersection width: 30.47 ⁇ m, wavelength: 1.9148 ⁇ m, duty ratio: 0.441, number of steps: 1
- Series arm resonator S1 Logarithm: 168 pairs, intersection width: 30.26 ⁇ m, wavelength: 1.8938 ⁇ m, duty ratio: 0.476, number of steps: 3
- Parallel arm resonator P3 Logarithm: 124 pairs, intersection width: 58.22 ⁇ m, wavelength: 1.9811 ⁇ m, duty ratio: 0.475, number of steps: 2
- Parallel arm resonator P2 Logarithm: 120 pairs, intersection width: 49.47 ⁇ m, wavelength: 1.9744 ⁇ m, duty ratio: 0.475, number of steps: 2
- Parallel arm resonator P1 Logarithm: 104 pairs, intersection width: 42.77 ⁇ m, wavelength: 1.9828 ⁇ m, duty ratio: 0.475, number of steps: 2
- Capacitance C1 0.57 pF Capacitance C2: 0.21 pF Inductor L1: 1.5 nH Inductor L2: 0.1 nH Inductor L3: 1.0 nH Inductor L4: 3.6 nH
- the ladder type surface acoustic wave filter unit 20 includes a piezoelectric substrate 30 and an electrode 31 formed on the piezoelectric substrate 30.
- the electrode 31 constitutes the series arm 23, the parallel arms 24 to 26, the series arm resonators S1, S2-1, S2-2, and S3, the parallel arm resonators P1 to P3, the LC resonance circuit 27, and the like. Yes.
- the inductors L1 to L3 are configured by electrodes formed on a mounting substrate (not shown) on which the piezoelectric substrate 30 is mounted.
- the piezoelectric substrate 30 what consists of an appropriate piezoelectric material can be used.
- the piezoelectric substrate 30 may be formed of, for example, LiTaO 3 , LiNbO 3 , quartz, piezoelectric ceramics, or the like.
- the electrode 31 can be formed of an appropriate conductive material.
- the electrode 31 can be formed of, for example, a metal such as Al, Pt, Au, Ag, Cu, Ni, Ti, Pd, or an alloy containing one or more of these metals.
- the electrode 31 can also be comprised by the laminated body of the some electrically conductive film which consists of said metal and alloy, for example.
- the capacitor C1 is formed on the piezoelectric substrate 30 and includes a capacitor electrode 28 (see FIG. 2) connected in series to the IDT electrode 29 that forms part of the series arm resonator S1. ing. As shown in FIG. 4, the capacitor electrode 28 and the IDT electrode 29 are arranged along the intersecting width direction D2 perpendicular to the elastic wave propagation direction D3.
- the capacitor electrode 28 has a plurality of capacitor electrode portions 28a to 28e connected in parallel to each other.
- Each of the plurality of capacitive electrode portions 28a to 28e is formed by a pair of interdigital electrodes 28a1, 28a2, 28b1, 28b2, 28c1, 28c2, 28d1, 28d2, 28e1, 28e2 that are interleaved with each other.
- Each of the comb-like electrodes 28a1, 28a2, 28b1, 28b2, 28c1, 28c2, 28d1, 28d2, 28e1, and 28e2 includes a plurality of electrode fingers 32 and a bus bar 33 to which the plurality of electrode fingers 32 are connected. Yes.
- At least one bus bar among the plurality of comb-like electrodes 28a1, 28a2, 28b1, 28b2, 28c1, 28c2, 28d1, 28d2, 28e1, and 28e2 constituting the plurality of capacitive electrode portions 28a to 28e. 33 is formed integrally with the other bus bar 33 among the plurality of comb-like electrodes 28a1, 28a2, 28b1, 28b2, 28c1, 28c2, 28d1, 28d2, 28e1, and 28e2.
- the bus bar 33 of the comb-like electrode 28a2 and the bus bar 33 of the comb-like electrode 28b1 are integrally formed.
- the bus bar 33 of the comb-like electrode 28b2 and the bus bar 33 of the comb-like electrode 28c1 are integrally formed.
- the bus bar 33 of the comb-shaped electrode 28c2 and the bus bar 33 of the comb-shaped electrode 28d1 are integrally formed.
- the bus bar 33 of the comb-like electrode 28d2 and the bus bar 33 of the comb-like electrode 28e1 are integrally formed. For this reason, for example, compared with the case where each bus bar 33 is provided separately, the capacity electrode 28 can be reduced in size. Therefore, the elastic wave device 1 can be reduced in size.
- the plurality of capacitive electrode portions 28a to 28e are formed so that the intersecting width direction D1 of the capacitive electrode portions 28a to 28e and the intersecting width direction D2 of the IDT electrode 29 are orthogonal to each other.
- the present invention is not limited to this configuration.
- the intersecting width direction in the capacitor electrode portion and the intersecting width direction in the IDT electrode need only be inclined and do not necessarily need to be orthogonal.
- the capacitive electrode 28 is configured by connecting a plurality of capacitive electrode portions 28a to 28e in parallel. For this reason, even when the crossing widths of the capacitive electrode portions 28a to 28e are small, a large capacitance can be obtained. Therefore, deterioration of the insertion loss of the acoustic wave device 1 can be suppressed while obtaining a large capacitance.
- FIG. 6 shows the filter characteristics of the elastic wave device according to the example having the same configuration as the elastic wave device according to the above embodiment. Further, as shown in FIG. 7, except that the capacitive electrode 28 is formed of a pair of comb-shaped electrodes and the capacitive electrode 28 is configured so that the capacitance value of the capacitor C1 is 0.30 pF.
- the filter characteristics of the elastic wave device of the comparative example having the same configuration as that of the above embodiment are shown in FIG.
- the intersecting widths of the capacitor electrode portions 28a to 28e are all 34 ⁇ m. In the comparative example, the intersection width was 89 ⁇ m.
- the acoustic wave device 1 according to the example has a pass band (in the example) even though the capacitance value of the capacitor C1 is nearly twice as large as that of the acoustic wave device according to the comparative example.
- the insertion loss of 1850 MHz to 1910 MHz was equivalent to the insertion loss of the passband in the comparative example. Therefore, the capacitive electrode 28 is constituted by a plurality of capacitive electrode portions 28a to 28e connected in parallel, and the crossing width of the capacitive electrode portions 28a to 28e is shortened, thereby obtaining a large electrostatic capacitance and a pass band. It can be seen that the deterioration of the insertion loss can be suppressed.
- the intersecting width direction D1 of the capacitive electrode portions 28a to 28e and the intersecting width direction D3 of the IDT electrode 29 are perpendicular to each other. For this reason, even if surface acoustic waves are excited by the capacitive electrode portions 28a to 28e, the characteristics of the acoustic wave device 1 are not substantially affected. Therefore, characteristic deterioration of the acoustic wave device 1 can be suppressed.
- the plurality of capacitive electrode portions 28 a to 28 e are arranged along the elastic wave propagation direction D 3 of the IDT electrode 29.
- the capacitive electrode 28 has an elongated shape whose longitudinal direction faces the elastic wave propagation direction D3. Therefore, it is difficult for a dead space to occur on the piezoelectric substrate 30.
- the capacitance value of the capacitor C1 can be increased, the inductance value required for the inductor L1 is reduced, and the mounting substrate on which the inductor L1 is formed can be reduced in size. Therefore, the piezoelectric substrate 30 and the mounting substrate can be reduced in size, and as a result, the acoustic wave device 1 can be reduced in size.
- FIG. 8 is a schematic plan view of a part of the acoustic wave device according to the first modification.
- FIG. 9 is a schematic plan view of a part of the acoustic wave device according to the second modification.
- the capacitive electrode portions 28a to 28e have substantially the same shape.
- the capacitive electrode portions 28a to 28e may have different shapes. That is, in the present invention, as long as each of the plurality of capacitive electrode portions is composed of a pair of comb-like electrodes, the logarithm, the crossing width, the electrode finger pitch, etc. are not limited at all.
- the logarithms of the capacitive electrode portions 28a to 28e may be different from each other. Further, as shown in FIG. 9, the crossing widths of the capacitor electrode portions 28a to 28e may be different from each other.
- the bus bar 29a of the IDT electrode 29 weighted with the cross width has a concavo-convex shape on the outer periphery according to the cross width, and the capacitor electrode portions 28a to 28a ⁇
- the logarithm of 28e is made different. Specifically, the logarithm of the capacitor electrode portions 28a to 28e is increased as the cross width of the portion adjacent to the IDT electrode 29 in the cross width direction D2 becomes smaller. More specifically, the capacitor electrode 28c adjacent in the cross width direction D2 to the portion of the IDT electrode 29 having a large cross width and a large dimension along the cross width direction D2 has a reduced logarithm. The dimension along the cross width direction D2 is reduced.
- Capacitance electrode portions 28a and 28e adjacent to each other in the cross width direction D2 in a portion having a small cross width and a small size along the cross width direction D2 in the IDT electrode 29 are increased in logarithm.
- the dimension along the direction D2 is increased.
- the logarithm of the capacitive electrode part 28b is between the logarithm of the capacitive electrode part 28a and the logarithm of the capacitive electrode part 28c.
- the logarithm of the capacitive electrode part 28d is between the logarithm of the capacitive electrode part 28c and the logarithm of the capacitive electrode part 28e.
- the logarithm of the capacitor electrode portions 28a to 28e is such that the intersection width of the adjacent portions in the intersecting width direction D2 of the IDT electrode 29 is the same. The smaller it is, the more it is. Of the capacitor electrode portions 28a to 28e, the smaller the logarithm, the longer the crossing width.
- the intersecting width of the capacitor electrode portion 28b is made larger than the intersecting width of the other capacitor electrode portions 28a, 28c to 28e.
- FIG. 10 is a schematic cross-sectional view of an acoustic wave filter device according to a third modification.
- FIG. 11 is a schematic cross-sectional view of an acoustic wave filter device according to a fourth modification.
- a surface acoustic wave device using a surface acoustic wave is exemplified as an embodiment of the present invention, but the surface acoustic wave device of the present invention is not limited to a surface acoustic wave device.
- the present invention can be suitably applied not only to a surface acoustic wave device but also to a boundary acoustic wave device.
- the elastic wave device of the present invention may be a boundary acoustic wave device that uses boundary acoustic waves. More specifically, the acoustic wave device of the present invention may be a so-called two-medium type boundary acoustic wave device as shown in FIG. 10, for example, or a so-called three-medium type elastic wave device as shown in FIG. A boundary wave device may be used.
- a dielectric layer 34 is formed on the piezoelectric substrate 30.
- the dielectric layer 34 covers a region where boundary acoustic waves propagate, such as a region where an IDT electrode is formed.
- the thickness of the dielectric layer 34 is not particularly limited as long as the elastic wave excited by the IDT electrode becomes a boundary acoustic wave, and can be appropriately set according to required characteristics.
- the dielectric layer 34 can be formed of, for example, silicon oxide such as SiO 2 or silicon nitride such as SiN.
- a further dielectric layer 35 is formed on the dielectric layer 34.
- the dielectric layer 35 is formed of a material that makes the sound speed of the dielectric layer 35 faster than the sound speed of the dielectric layer 34.
- the dielectric layer 34 is made of silicon oxide such as SiO 2
- the dielectric layer 35 is formed of silicon nitride such as SiN. For this reason, the boundary acoustic wave propagates while being substantially confined in the dielectric layer 34.
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Abstract
Description
直列腕共振子S3:
対数:168対、交差幅:30.29μm、波長:1.8931μm、デューティー比:0.486、段数:3
対数:230対、交差幅:37.34μm、波長:1.9232μm、デューティー比:0.475、段数:2
対数:200対、交差幅:30.47μm、波長:1.9148μm、デューティー比:0.441、段数:1
対数:168対、交差幅:30.26μm、波長:1.8938μm、デューティー比:0.476、段数:3
対数:124対、交差幅:58.22μm、波長:1.9811μm、デューティー比:0.475、段数:2
対数:120対、交差幅:49.47μm、波長:1.9744μm、デューティー比:0.475、段数:2
対数:104対、交差幅:42.77μm、波長:1.9828μm、デューティー比:0.475、段数:2
容量C2:0.21pF
インダクタL1:1.5nH
インダクタL2:0.1nH
インダクタL3:1.0nH
インダクタL4:3.6nH
図8は、第1の変形例に係る弾性波装置の一部分の模式的平面図である。図9は、第2の変形例に係る弾性波装置の一部分の模式的平面図である。
図10は、第3の変形例に係る弾性波フィルタ装置の略図的断面図である。図11は、第4の変形例に係る弾性波フィルタ装置の略図的断面図である。
11…アンテナ
12…送信側信号端子
20…ラダー型弾性表面波フィルタ部
21…信号出力端子
22…信号入力端子
23…直列腕
24~26…並列腕
27…LC共振回路
28…容量電極
28a~28e…容量電極部
28a1,28a2,28b1,28b2,28c1,28c2,28d1,28d2,28e1,28e2…くし歯状電極
29…IDT電極
29a…バスバー
30…圧電基板
31…電極
32…電極指
33…バスバー
34…誘電体層
35…誘電体層
L1~L4…インダクタ
S1,S2-1,S2-2,S3…直列腕共振子
P1,P2,P3…並列腕共振子
C1,C2…容量
D1…容量電極部の交差幅方向
D2…交差幅方向
D3…IDT電極の交差幅方向
Claims (8)
- 圧電基板と、
前記圧電基板の上に形成されているIDT電極と、
前記圧電基板の上に形成されており、前記IDT電極に直列に接続されている容量電極とを備える弾性波装置であって、
前記容量電極は、互いに並列に接続されており、それぞれ、間挿し合っている一対のくし歯状電極からなる複数の容量電極部を有し、
前記複数の容量電極部は、前記容量電極部における交差幅方向と、前記IDT電極における交差幅方向とが傾斜するように形成されており、
前記複数の容量電極部は、前記IDT電極における弾性波伝搬方向に沿って配列されている、弾性波装置。 - 前記容量電極の少なくとも一部と前記IDT電極とは、弾性波伝搬方向に垂直な方向に沿って配列されている、請求項1に記載の弾性波装置。
- 前記複数の容量電極部のそれぞれは、前記容量電極部における交差幅方向に延びる複数の電極指と、前記複数の電極指が接続されており、前記容量電極部における交差幅方向に対して垂直な方向に延びるバスバーとを有し、
前記複数の容量電極部を構成している複数のくし歯状電極のうちの少なくとも一つのバスバーは、前記複数のくし歯状電極のうちの他の一つのバスバーと一体に形成されている、請求項1または2に記載の弾性波装置。 - 弾性表面波を利用する弾性表面波装置である、請求項1~3のいずれか一項に記載の弾性波装置。
- 弾性境界波を利用する弾性境界波装置である、請求項1~3のいずれか一項に記載の弾性波装置。
- 前記IDT電極を有する直列腕共振子を備える、ラダー型弾性波フィルタ装置である、請求項1~5のいずれか一項に記載の弾性波装置。
- 前記IDT電極に直列であって、前記容量電極に並列に接続されているインダクタをさらに備える、請求項6に記載の弾性波装置。
- 前記複数の容量電極部は、前記容量電極部における交差幅方向と、前記IDT電極における交差幅方向とが直交するように形成されている、請求項1~6のいずれか一項に記載の弾性波装置。
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