WO2011099222A1

WO2011099222A1 - Substrate processing device

Info

Publication number: WO2011099222A1
Application number: PCT/JP2010/072366
Authority: WO
Inventors: 和幸山崎; 考紘福田
Original assignee: シャープ株式会社
Priority date: 2010-02-12
Filing date: 2010-12-13
Publication date: 2011-08-18
Also published as: JP2013078701A

Abstract

An upper air cleaning unit (5) is disposed above a cleaning region (4) provided in a conveying path, and said upper air cleaning unit (5) cleans the substrate (2) by spraying an air curtain onto the top surface of a substrate (2) and sucking in the sprayed air. A lower air cleaning unit is disposed below the conveying path in a position facing the upper air cleaning unit (5), and said lower air cleaning unit cleans the substrate (2) by spraying an air curtain onto the bottom surface of the substrate (2) and sucking up the sprayed air. The upper air cleaning unit (5) and the lower air cleaning unit spray air curtains such that on the substrate (2), said air curtains are crosswise to the direction in which the edge (3) extends. A substrate guide unit (13) is arranged in the cleaning region (4), and by means of the substrate guide unit (13) which supports the bottom surface of the substrate (2), the substrate (2) is prevented from contact with the lower air cleaning unit caused by the air suction by the lower air cleaning unit. By means of such a constitution, damage due to contact of the substrate (2) with the air cleaning units is avoided.

Description

Substrate processing equipment

The present invention relates to a substrate processing apparatus, and more particularly to a substrate processing apparatus for air-cleaning a substrate.

An apparatus for processing a substrate used in a liquid crystal display device includes a substrate cleaning processing unit. As prior documents disclosing a substrate processing apparatus including a cleaning processing section, there are JP-A-2001-314827 (Patent Document 1) and JP-A-2001-284310 (Patent Document 2). In the substrate processing apparatuses disclosed in Japanese Patent Laid-Open Nos. 2001-314827 and 2001-284310, air knives are arranged above and below the substrate in order to dry the cleaned substrate. While the substrate is being transported by a transport mechanism such as a transport roller, a cleaning process using a cleaning liquid and a drying process using an air knife are sequentially performed.

JP 2001-314827 A JP 2001-284310 A

In the substrate processing apparatuses described in Japanese Patent Application Laid-Open Nos. 2001-314827 and 2001-284310, a drying process using an air knife is performed while the substrate is transferred by a transfer mechanism. Since the air knife sprays pressurized air onto the substrate, the substrate is transported while fluttering on the transport roller when passing between the upper and lower air knives.

Some substrate processing apparatuses include an air cleaning unit that sucks the sprayed air while spraying air on the substrate in order to remove fine dust and the like on the substrate. Similar to the air knife, the air cleaning unit is disposed above and below the conveyance path through which the substrate is conveyed.

Between the upper and lower air cleaning sections, air is blown from above and below and air is sucked in, so that a more intense turbulence occurs between the above air knives. For this reason, the substrate transported between the air cleaning units is severely fluttered on the transport roller. *

Since the air spraying part of the air cleaning part is arranged close to the substrate surface, a transport roller cannot be provided at the position where the air cleaning part is disposed in the substrate transport direction. Therefore, the front end of the substrate in the transport direction sinks downward due to the weight of the substrate and the above-mentioned fluttering of the substrate between the transport rollers disposed across the air cleaning unit, and enters the air cleaning unit disposed below the substrate. May come into contact. In this case, damage such as scratches or cracks occurs in the substrate.

The present invention has been made in view of the above-described problems, and in a substrate processing apparatus that performs air cleaning while transporting a substrate, the substrate processing capable of preventing the substrate from being damaged by contacting the air cleaning unit. An object is to provide an apparatus.

A substrate processing apparatus according to the present invention is an apparatus for air-cleaning a substrate from above and below a transport path on which a substrate having a straight edge is transported. The substrate processing apparatus includes an upper air cleaning unit, a lower air cleaning unit, a first transport mechanism, and a second transport mechanism. The upper air cleaning unit is disposed above a cleaning region provided in the middle of the conveyance path, and cleans the substrate by inhaling the sprayed air while spraying air in the form of a curtain on the upper surface of the substrate. The lower air cleaning unit is disposed at a position facing the upper air cleaning unit below the conveyance path, and cleans the substrate by inhaling the sprayed air while spraying air on the lower surface of the substrate in a curtain shape. . The first transport mechanism supports the lower surface of the substrate and transports the substrate in a direction orthogonal to the direction in which the end side extends within the substrate surface, thereby transporting the substrate from the end side to the cleaning region. The second transport mechanism supports the lower surface of the substrate and carries the substrate out of the cleaning area. The upper air cleaning unit and the lower air cleaning unit spray air in a curtain shape so as to intersect on the substrate with respect to the direction in which the end side extends. A substrate guide portion is disposed in the cleaning region, and the substrate guide portion prevents the substrate from coming into contact with the lower air cleaning portion by suction of air by the lower air cleaning portion by supporting the lower surface of the substrate.

According to the present invention, the substrate guide is provided in the cleaning region to support the lower surface of the substrate, thereby preventing the tip of the substrate passing through the cleaning region from contacting the lower air cleaning unit and damaging the substrate. It is possible to provide a substrate processing apparatus that can perform cleaning without the need for cleaning.

It is a top view which shows the structure of the substrate processing apparatus which concerns on Embodiment 1 of this invention. FIG. 2 is a cross-sectional view of the substrate processing apparatus of FIG. 1 as viewed from the direction of arrows II-II. It is a perspective view which shows the structure of the upper side air washing | cleaning part which concerns on the same embodiment. It is a perspective view which shows the structure of the lower air washing | cleaning part which concerns on the same embodiment. It is the side view which looked at the lower air washing | cleaning part of FIG. 4 from the arrow V direction. In the substrate processing apparatus concerning the embodiment, it is a perspective view which shows the board | substrate carried in to a washing | cleaning area | region. It is the side view which looked at the board | substrate guide part of FIG. 6 from the arrow VII direction. It is a top view which shows the structure of the substrate processing apparatus which concerns on Embodiment 2 of this invention. It is sectional drawing which looked at the substrate processing apparatus of FIG. 8 from the IX-IX line arrow direction. It is a side view which shows the state which looked at the conveyance mechanism and board | substrate guide part of FIG. 8 from the arrow X direction side.

Hereinafter, a substrate processing apparatus according to Embodiment 1 of the present invention will be described with reference to the drawings.
(Embodiment 1)
FIG. 1 is a plan view showing a configuration of a substrate processing apparatus according to Embodiment 1 of the present invention. 2 is a cross-sectional view of the substrate processing apparatus of FIG. 1 as viewed from the direction of arrows II-II. As shown in FIG. 1, a substrate processing apparatus 1 according to the present embodiment is a substrate processing apparatus that performs air cleaning on a substrate 2 having a straight edge 3. The straight end 3 is a side extending in a straight line among the sides of the substrate 2. In the present embodiment, the substrate 2 has a rectangular shape, but may be any substrate that has at least a straight end 3. The substrate 2 is a glass substrate on which, for example, a TFT (Thin Film Transistor) or a color filter is formed on the upper surface.

The substrate 2 is conveyed in the direction indicated by the arrow 6 with the lower surface of the substrate 2 supported by the first conveying roller 7. The first transport roller 7 is attached to the first transport shaft 8 at a predetermined interval. The first transport shaft 8 is arranged at a predetermined interval in the transport direction of the substrate 2. All the first transport shafts 8 are connected to a drive source (not shown). When the first transport shaft 8 is rotated by the driving force supplied from the drive source, the first transport roller 7 rotates and transports the substrate 2 in the direction indicated by the arrow 6. As the first conveyance roller 7, a resin conveyance roller is used. A metal shaft is used as the first transport shaft 8. The first transport mechanism 9 includes a first transport roller 7 and a first transport shaft 8.

A cleaning region 4 is provided downstream of the first transport mechanism 9 in the transport direction of the substrate 2. As described above, the substrate 2 has the straight edge 3, and the first transport mechanism 9 transports the substrate 2 in a direction orthogonal to the direction in which the edge 3 extends in the plane of the substrate 2. The substrate 2 is carried into the cleaning region 4 from the end 3 side.

A second transport mechanism 12 is provided downstream of the cleaning region 4 in the transport direction of the substrate 2. The substrate 2 is conveyed in the direction indicated by the arrow 6 with the lower surface of the substrate 2 supported by the second conveyance roller 10. The second transport roller 10 is attached to the second transport shaft 11 at a predetermined interval. The second transport shaft 11 is arranged at a predetermined interval in the transport direction of the substrate 2. The second transport shaft 11 is connected to a drive source (not shown). When the second transport shaft 11 is rotated by the driving force supplied from the drive source, the second transport roller 10 rotates and transports the substrate 2 in the direction indicated by the arrow 6. As the second transport roller 10, a resin transport roller is used. A metal shaft is used as the second transport shaft 11. The second transport mechanism 12 includes a second transport roller 10 and a second transport shaft 11. The second transport mechanism 12 unloads the substrate 2 from the cleaning region 4.

As shown in FIG. 2, a transport path 14 through which the substrate 2 is transported is formed by the first transport mechanism 9 and the second transport mechanism 12. The cleaning region 4 is provided in the middle of the conveyance path 14. An upper air cleaning unit 5 is disposed above the cleaning region 4. The upper air cleaning unit 5 cleans the substrate 2 by inhaling the sprayed air as indicated by an arrow 17 while spraying air on the upper surface of the substrate 2 as indicated by an arrow 16 in the form of a curtain.

In other words, the substrate 2 to be cleaned is inhaled by the upper air cleaning unit 5 from the front end side in the transport direction of the substrate 2, and then air is sprayed from the upper air cleaning unit 5, and thereafter Inhaled by the upper air cleaning unit 5. In this way, fine dust or the like adhering to the upper surface of the substrate 2 is removed.

On the other hand, a lower air cleaning unit 15 is disposed below the cleaning region 4. The lower air cleaning unit 15 is disposed at a position facing the upper air cleaning unit 5. The lower air cleaning unit 15 cleans the substrate 2 by inhaling the sprayed air as indicated by an arrow 19 while spraying air in a curtain shape on the lower surface of the substrate 2 as indicated by an arrow 18. .

In other words, the substrate 2 to be cleaned is blown from the lower air cleaning unit 15 after the lower surface of the substrate 2 is sucked by the lower air cleaning unit 15 from the front end side in the transport direction of the substrate 2, Thereafter, the air is sucked by the lower air cleaning unit 15. In this way, fine dust attached to the lower surface of the substrate 2 is removed.

The upper air cleaning unit 5 and the lower air cleaning unit 15 are arranged close to the surface of the substrate 2 in order to efficiently clean the substrate 2. Therefore, the first conveyance roller 7 and the second conveyance roller 10 cannot be arranged in the cleaning region 4. In order to prevent the substrate 2 from coming into contact with the upper air cleaning unit 5, the distance between the upper air cleaning unit 5 and the upper surface of the substrate 2 is longer than the distance between the lower air cleaning unit 15 and the lower surface of the substrate 2. It is trying to become.

In FIG. 1, the position of the air sprayed onto the substrate 2 by the upper air cleaning unit 5 and the lower air cleaning unit 15 is indicated by a two-dot chain line 26. The direction in which the edge 3 of the substrate 2 extends is indicated by a two-dot chain line 27. Assuming that the angle 28 formed by the two-dot chain line 26 and the two-dot chain line 27 is θ, θ = 3 ° in the present embodiment, but 3 ° ≦ θ ≦ 45 ° is preferable.

Thus, the upper air cleaning unit 5 and the lower air cleaning unit 15 spray air in a curtain shape so as to intersect on the substrate 2 with respect to the direction in which the edge 3 of the substrate 2 extends.

As shown in FIG. 1, in the edge 3 of the board | substrate 2, let the upper end side of a figure be U side, and let a lower end side be D side. In the following description, the U side and the D side may be reversed. When θ at the corner 28 is 3 °, the substrate 2 is carried into the cleaning region 4 from the periphery on the D side of the edge 3. By doing in this way, since the area which acts on the board | substrate 2 immediately after the turbulent flow between the upper side air washing | cleaning part 5 and the lower side air washing | cleaning part 15 was carried in into the washing | cleaning area | region 4 can be made small, board | substrate 2 Can be prevented from fluttering of the substrate 2 when it is carried into the cleaning region 4.

When the angle θ of the corner 28 is 0 °, the entire end of the substrate 2 from the U side to the D side of the end side 3 is simultaneously carried into the cleaning region 4. In this case, since the area where the turbulent flow between the upper air cleaning unit 5 and the lower air cleaning unit 15 acts on the substrate 2 immediately after being transferred into the cleaning region 4 is large, the substrate 2 is transferred into the cleaning region 4. The fluttering of the substrate 2 at the time becomes large.

Therefore, in this embodiment, θ = 3 °. However, even if 3 ° <θ ≦ 45 °, the fluttering of the substrate 2 can be suppressed. However, if θ is increased within the above range, the required lengths of the upper air cleaning unit 5 and the lower air cleaning unit 15 are increased, so that the apparatus cost of the substrate processing apparatus 1 is increased. In order to suppress the flutter of the substrate 2 while suppressing an increase in apparatus cost, it is particularly preferable that θ = 3 °.

1 and 2, the cleaning region 4 is provided with a substrate guide portion 13 that supports the substrate 2 from the lower surface. In this embodiment, the board | substrate guide part 13 is comprised from the some free roller. For this reason, when the substrate 2 is transported with the free roller supporting the lower surface of the substrate 2, the free roller rolls, so that the transport resistance applied to the substrate 2 can be kept low. The free rollers are preferably arranged evenly in the cleaning area, and may be arranged in a staggered manner, for example.

The height of the upper end of the substrate guide 13 that contacts the substrate 2 when supporting the substrate 2 is lower than the height of the upper end of the first transport roller 7 and higher than the height of the upper end of the lower air cleaning unit 15. Is set. The free roller is installed by connecting the shaft portion of the free roller to a mounting portion (not shown), and its mounting height can be adjusted.

The substrate guide unit 13 supports the lower surface of the substrate 2 carried into the cleaning region 4 from the first transport mechanism 9, thereby preventing the D side of the edge 3 of the substrate 2 from contacting the lower air cleaning unit 15. be able to. Specifically, the substrate 2 carried into the cleaning region 4 is subjected to the lower air cleaning due to the fluttering of the substrate 2 due to the turbulent flow between the upper air cleaning unit 5 and the lower air cleaning unit 15 and the dead weight of the substrate 2. It is attracted to the part 15. At this time, since the substrate guide unit 13 supports the lower surface of the substrate 2, the substrate 2 is carried out of the cleaning region 4 by the second transport mechanism 12 without contacting the lower air cleaning unit 15.

FIG. 3 is a perspective view showing the structure of the upper air cleaning unit according to the present embodiment. FIG. 4 is a perspective view showing the structure of the lower air cleaning unit according to the present embodiment. As shown in FIG. 3, a spraying unit 20 that sprays air in a curtain shape is provided on the lower surface of the upper air cleaning unit 5 so as to extend in the longitudinal direction of the upper air cleaning unit 5.

When the lower surface of the upper air cleaning unit 5 is viewed in plan, the spraying part 20 is arranged in the center, and the air sprayed from the spraying part 20 on both sides of the spraying part 20 so as to sandwich the spraying part 20 A suction part 21a and a suction part 21b are provided.

As shown in FIG. 4, on the upper surface of the lower air cleaning unit 15, a spraying unit 22 that sprays air in a curtain shape is provided so as to extend in the longitudinal direction of the lower air cleaning unit 15. When the upper surface of the lower air cleaning unit 15 is viewed in plan, the spraying part 22 is arranged in the center, and is sprayed from the spraying part 22 on both sides of the spraying part 22 so as to sandwich the spraying part 22. A suction part 23a and a suction part 23b for sucking air are provided.

In the present embodiment, the substrate guide portion 25a is disposed in the region where the suction portion 23a is disposed. Further, the substrate guide portion 25b is disposed in the region where the suction portion 23b is disposed.

Substrate guide portions

25a and 25b are constituted by free rollers as with the substrate guide portion 13.

The substrate guide part 25a is provided so that a part of the free roller protrudes from the opening 24a formed on the upper surface of the lower air cleaning part 15. The substrate guide portion 25b is provided so that a part of the free roller protrudes from an opening 24b formed on the upper surface of the lower air cleaning portion 15. The substrate support height of the

substrate guide portions

25a and 25b is adjusted in accordance with the substrate support height of the substrate guide portion 13.

FIG. 5 is a side view of the lower air cleaning unit in FIG. As shown in FIG. 5, the lower air cleaning unit 15 sprays air in the direction shown by the arrow 18 from the spraying unit 22 and sucks air in the direction shown by the arrow 19 from the suction unit 23a and the suction unit 23b. Yes.

When the substrate 2 passes above the lower air cleaning unit 15, the substrate 2 includes a substrate guide unit 25 a disposed in the area of the suction unit 23 a through which air is sucked and a suction unit through which air is sucked. The lower surface is supported by the substrate guide portion 25b disposed in the region 23b. As a result, the substrate 2 can stably pass through the cleaning region 4 without contacting the lower air cleaning unit 15. In the present embodiment, the substrate guides 25a and 25b are provided. However, the substrate guides 13 may be provided, and the substrate guides 25a and 25b are not necessarily provided.

FIG. 6 is a perspective view showing a substrate carried into the cleaning region in the substrate processing apparatus according to the present embodiment. In FIG. 6, for simplicity, only the substrate 2, the lower air cleaning unit 15, and some substrate guide units are illustrated, and other configurations are not illustrated. FIG. 7 is a side view of the substrate guide portion of FIG. 6 as viewed from the direction of arrow VII.

As shown in FIG. 6, an area adjacent to the first transport mechanism 9 (not shown) in the cleaning area 4 is referred to as an adjacent area 29. In FIG. 6, only the substrate guides 13A to 13E disposed in the adjacent region 29 among the substrate guides 13 disposed in the cleaning region 4 are displayed. For convenience of explanation, the five substrate guide portions 13A to 13E are illustrated in the adjacent region 29, but the number of the substrate guide portions 13 disposed in the adjacent region 29 is not limited thereto.

The substrate 2 transported in the direction of the arrow 6 by the first transport mechanism 9 is transported into the cleaning region 4 with the edge 3 as the head. At this time, the edge 3 side of the substrate 2 extends from the first conveyance roller 7 (not shown) arranged on the most downstream side in the conveyance direction of the first conveyance mechanism 9 to the substrate guide portions 13A to 13E arranged in the adjacent region 29. I will change.

As shown in FIG. 6, there is a suction part 23 b of the lower air cleaning part 15 in the vicinity of the adjacent area 29. As the periphery of the edge 3 of the substrate 2 is further away from the first conveyance roller 7 on the downstream side in the conveyance direction, the edge 3 side of the substrate 2 is indicated by an arrow 19 due to the weight of the substrate 2 and the suction of air in the suction portion 23b. It is drawn down.

Particularly, the D side of the edge 3 of the substrate 2 located closest to the suction part 23b receives a large pulling force. Therefore, at the edge 3 of the substrate 2, the substrate 2 is transferred to the substrate guides 13A to 13E in an inclined state so that the height of the substrate 2 decreases from the U side toward the D side. Therefore, it is preferable that the support height of the substrate 2 of the substrate guides 13A to 13E corresponds to the inclination of the substrate 2.

Specifically, as shown in FIG. 7, the substrate support height h _B which is the upper end position of the substrate guide portion 13B is higher than the substrate support height h _A which is the upper end position of the substrate guide portion 13A. To do. The substrate support height h _C that is the position of the upper end of the substrate guide portion 13C is made higher than the substrate support height h _{B of the} substrate guide portion 13B. The substrate support height h _D which is the position of the upper end of the substrate guide portion 13D is made higher than the substrate support height h _{C of the} substrate guide portion 13C. The substrate support height h _E that is the position of the upper end of the substrate guide portion 13E is made higher than the substrate support height h _{D of the} substrate guide portion 13D.

By making the support height of the substrate 2 of the substrate guide portions 13A to 13E as described above, the D side of the edge 3 of the substrate 2 collides with the substrate guide portion 13A, thereby causing damage such as scratches or cracks to the substrate 2. Occurrence can be prevented. Further, it is possible to prevent a gap from being generated between the lower surface on the U side of the edge 3 of the substrate 2 and the upper end of the substrate guide portion 13E, and to support the substrate 2 by all of the substrate guide portions 13A to 13E. it can.

As described above, the portion of the substrate guide portions 13A to 13E located in the region 29 adjacent to the first transport mechanism 9 in the cleaning region 4 is located farther from the portion located near the lower air cleaning portion 15. The support height of the substrate is set to be lower than the portion.

According to the substrate processing apparatus 1 of the present embodiment, the substrate 2 passing through the cleaning region 4 contacts the lower air cleaning unit 15 by providing the substrate guide unit 13 in the cleaning region 4 and supporting the lower surface of the substrate 2. The substrate 2 can be cleaned without causing damage to the substrate 2.

A substrate processing apparatus according to Embodiment 2 of the present invention will be described below with reference to the drawings.
(Embodiment 2)
FIG. 8 is a plan view showing the configuration of the substrate processing apparatus according to the second embodiment of the present invention. FIG. 9 is a cross-sectional view of the substrate processing apparatus of FIG. 8 as seen from the direction of the arrow IX-IX. In the substrate processing apparatus 30 according to the second embodiment of the present invention, two upper

air cleaning units

32 and 35 and lower

air cleaning units

37 and 38 are provided in the middle of the conveyance path 14 of the substrate 2.

As shown in FIGS. 8 and 9, by arranging two upper air cleaning units and two lower air cleaning units in the middle of the conveyance path 14 of the substrate 2, a high removal rate can be achieved without reducing the cleaning speed of the substrate 2. The substrate 2 can be cleaned. In the present embodiment, two upper air cleaning units and two lower air cleaning units are disposed. However, a plurality of upper air cleaning units and three or more lower air cleaning units may be disposed. Since the configuration other than the arrangement of the plurality of upper air cleaning units and the lower air cleaning unit is the same as that of the first embodiment, the description of the other configurations will not be repeated.

A substrate guide 33 is disposed in the cleaning region 31 located on the upstream side in the transport direction of the substrate 2. A substrate guide portion 36 is disposed in the cleaning region 34 located on the downstream side in the transport direction of the substrate 2. The substrate 2 is loaded in the direction of arrow 6 by the first transport mechanism 9, passes through the cleaning region 34 from the cleaning region 31, and is unloaded by the second transport mechanism 12.

FIG. 10 is a side view showing a state in which the transport mechanism and the substrate guide part of FIG. 8 are viewed from the arrow X direction side. As shown in FIG. 10, the substrate support height h _I of the first transport mechanism 9 that is the position of the upper end of the first transport roller 7 is higher than the substrate support height h _S that is the position of the upper end of the substrate guide 33. Like that. The substrate support height h _{S of the} substrate guide portion 33 is set to be higher than the substrate support height h _T which is the position of the upper end of the substrate guide portion 36. The substrate support height h _T of the substrate guide 36 is set to be higher than the substrate support height h _O that is the position of the upper end of the second transport roller 10.

By adjusting the substrate support height as described above, the edge 3 of the substrate 2 is prevented from colliding with the substrate guide 33 when the substrate 2 is transferred from the first transport roller 7 to the substrate guide 33. be able to. Similarly, it is possible to prevent the edge 3 of the substrate 2 from colliding with the substrate guide portion 36 when the substrate 2 is transferred from the substrate guide portion 33 to the substrate guide portion 36. Further, it is possible to prevent the edge 3 of the substrate 2 from colliding with the second transport roller 10 when the substrate 2 is transferred from the substrate guide part 36 to the second transport roller 10. As a result, it is possible to prevent the substrate 2 from being damaged such as scratches or cracks during the conveyance.

In addition, the said embodiment disclosed this time is an illustration in all the points, Comprising: It does not become the basis of a limited interpretation. Therefore, the technical scope of the present invention is not interpreted only by the above-described embodiments, but is defined based on the description of the scope of claims. In addition, meanings equivalent to the claims and all modifications within the scope are included.

1, 30 substrate processing apparatus, 2 substrates, 3 edges, 4, 31, 34 cleaning area, 5, 32, 35 upper air cleaning section, 7 first transport roller, 8 first transport shaft, 9 first transport mechanism, 10 Second transport roller, 11 Second transport shaft, 12 Second transport mechanism, 13, 13A, 13B, 13C, 13D, 13E, 25a, 25b, 33, 36 Substrate guide unit, 14 Transport path, 15, 37, 38 Lower air cleaning part, 20, 22 spraying part, 21a, 21b, 23a, 23b suction part, 24a, 24b opening part, 29 adjacent area.

Claims

A substrate processing apparatus (1, 30) for air-cleaning the substrate (2) from above and below a conveyance path (14) through which a substrate (2) having a straight edge (3) is conveyed,
It is arranged above the cleaning area (4, 31, 34) provided in the middle of the transport path (14), and sucks the sprayed air while spraying air on the upper surface of the substrate (2) in the form of a curtain. An upper air cleaning section (5, 32, 35) for cleaning the substrate (2) by
Air that is disposed below the transport path (14) at a position facing the upper air cleaning section (5, 32, 35) and sprays air on the lower surface of the substrate (2) in the form of a curtain. A lower air cleaning section (15, 37, 38) for cleaning the substrate (2) by inhaling air;
The substrate (2) is supported by supporting the lower surface of the substrate (2) and transporting the substrate (2) in a direction perpendicular to the direction in which the end (3) extends within the surface of the substrate (2). A first transport mechanism (9) for transporting the liquid from the end (3) side to the cleaning region (4, 31, 34);
A second transport mechanism (12) that supports the lower surface of the substrate (2) and unloads the substrate (2) from the cleaning region (4, 31, 34);
The upper air cleaning part (5, 32, 35) and the lower air cleaning part (15, 37, 38) intersect on the substrate (2) with respect to the direction in which the end side (3) extends. Air is sprayed on the curtain
Substrate guide portions (13, 25a, 25b, 33, 36) are arranged in the cleaning regions (4, 31, 34), and the substrate is sucked by the lower air cleaning portions (15, 37, 38). (2) is in contact with the lower air cleaning portion (15, 37, 38), and the substrate guide portion (13, 25a, 25b, 33, 36) supports the lower surface of the substrate (2). Prevent the substrate processing apparatus (1, 30).
The upper air cleaning part (5, 32, 35) and the lower air cleaning part (15, 37, 38) are 3 ° or more on the substrate (2) with respect to the direction in which the end (3) extends. The substrate processing apparatus (1, 30) according to claim 1, wherein air is sprayed in a curtain shape so as to intersect at an angle of 45 ° or less.
The substrate guide portion (13, 33, 36) in the region (29) adjacent to the first transport mechanism (9) in the cleaning region (4, 31, 34) is the lower air cleaning unit. 3. The substrate processing apparatus according to claim 1, wherein a support height of the substrate (2) is lower in a portion located near (15, 37, 38) than in a portion located far away. (1, 30).
The lower air cleaning section (15, 37, 38) is provided with a spray section (22) for spraying air in a curtain shape, and a suction section (23a, 23b) for sucking the sprayed air,
The spraying part (22) is disposed in the center of the lower air cleaning part (15, 37, 38) in plan view,
The suction parts (23a, 23b) are arranged on both sides of the spraying part (22) so as to sandwich the spraying part (22) in plan view,
The part (25a, 25b) of the substrate guide part is disposed in a region where the suction part (23a, 23b) is disposed, according to any one of claims 1 to 3. Substrate processing apparatus (1, 30).
The upper air cleaning unit (32, 35) and the lower air cleaning unit (37, 38) are continuously arranged in the middle of the transport path (14) of the substrate (2). The substrate processing apparatus (30) according to any one of ranges 1 to 4.
The support height of the substrate (2) of the substrate guide portion (33) disposed in the cleaning region (31) located upstream in the transport direction of the substrate (2) is downstream in the transport direction. The substrate processing apparatus (30) according to claim 5, wherein the substrate guide (36) disposed in the cleaning region (34) located at a position higher than the support height of the substrate (2).
The substrate processing apparatus (1, 30) according to any one of claims 1 to 6, wherein the substrate guide portion (13, 25a, 25b, 33, 36) comprises a plurality of free rollers. .