WO2011096067A1 - 接触子及び電気的接続装置 - Google Patents
接触子及び電気的接続装置 Download PDFInfo
- Publication number
- WO2011096067A1 WO2011096067A1 PCT/JP2010/051675 JP2010051675W WO2011096067A1 WO 2011096067 A1 WO2011096067 A1 WO 2011096067A1 JP 2010051675 W JP2010051675 W JP 2010051675W WO 2011096067 A1 WO2011096067 A1 WO 2011096067A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- plunger
- contact
- coil spring
- sliding
- compression coil
- Prior art date
Links
- 230000006835 compression Effects 0.000 claims abstract description 31
- 238000007906 compression Methods 0.000 claims abstract description 31
- 238000012360 testing method Methods 0.000 claims description 20
- 238000003780 insertion Methods 0.000 claims description 13
- 230000037431 insertion Effects 0.000 claims description 13
- 239000000758 substrate Substances 0.000 description 39
- 238000007689 inspection Methods 0.000 description 17
- 210000000078 claw Anatomy 0.000 description 7
- 239000011159 matrix material Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
- H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
Definitions
- the present invention relates to a contactor and an electrical connection device that are in contact with electrodes provided on a wiring board, a semiconductor integrated circuit, or the like.
- a contactor for electrically connecting electrical circuits of wiring boards arranged opposite to each other is generally known.
- Examples of such contacts include those described in Patent Document 1 and Patent Document 2, for example.
- the contact 1 of Patent Document 1 includes two contact pins 2 having the same shape and a coil spring 3.
- the contact pin 2 is mainly composed of a locking claw 4, a locking hole 5, a flange portion 6, and a pin tip portion 2A.
- Two locking claws 4 are provided opposite to each other and supported by a flexible support bar 4A. Thereby, the two latching claws 4 come close to and away from each other.
- the locking hole 5 is a hole into which the locking claw 4 is fitted, and is formed in a rectangular shape according to the width of the locking claw 4.
- the flange portion 6 is a portion with which the coil spring 3 is abutted.
- both ends of the coil spring 3 come into contact with the flange portions 6 and the contact 1 is assembled.
- Both ends of the contact 1 assembled in a state in which the two contact pins 2 are fitted to each other are used as pin tip portions 2A that are in contact with and electrically connected to electrodes or the like.
- Patent Document 2 is composed of a plunger 8 and a spring 9 as shown in FIG.
- the plunger 8 is formed in a long and narrow plate shape, and a wide portion 8A for receiving the spring 9 is provided on an upper portion thereof, and a terminal portion 8B that is in contact with the electrode is formed on the upper portion of the wide portion 8A.
- a mandrel portion 8C that is inserted into the spring 9 so as to be movable up and down is formed at the lower portion of the wide portion 8A.
- the spring 9 is formed to have an inner diameter into which the mandrel portion 8C can be inserted up and down. The lower end of the spring 9 is narrowed down and brought into contact with an electrode or the like.
- FIG. 1 In the socket for electrical components of Patent Document 3, a contact member that contacts a terminal of the electrical component, a board conduction member that is formed of a conductive plate material and is connected to a printed circuit board, and the contact member and the board conduction member A coil spring that is disposed between the two and electrically connects the two.
- the contact member and the substrate conducting member are not in contact with each other, and are connected by a coil spring.
- each support bar part 4A is coil coil 3. I support it. And with the expansion and contraction of the contact 1, the support rod portions 4 ⁇ / b> A slide with each other while being supported by the coil spring 3.
- each support bar portion 4A since each support bar portion 4A is only supported by the coil spring 3, due to the change of the inner diameter due to the elasticity of the coil spring 3, each support bar portion 4A rattles each other and becomes unstable. There is a problem that the pin 2 cannot slide accurately and satisfactorily.
- each contact pin 2 when the size of the contact 1 is reduced as the circuit is highly integrated, high accuracy is required for the operation of each contact pin 2, but the structure in which each support bar portion 4 ⁇ / b> A is supported by the coil spring 3. Then, there is a problem that each contact pin 2 cannot be accurately and satisfactorily slid and may cause a contact failure.
- the inner diameter of the spring 9 is set to a dimension that allows the mandrel 8C of the plunger 8 to be inserted in a vertically movable manner.
- the jar 8 rattles and becomes unstable, and there is a problem that the plunger 8 cannot slide accurately and satisfactorily.
- the present invention has been made in view of such problems, and an object of the present invention is to provide a contactor that realizes an accurate and good slide to improve contactability and an electrical connection device using the contactor.
- the contact according to the present invention is made in order to solve the above-described problem.
- the first plunger contacting one member and the other member in contact with the first plunger are in contact with each other.
- a compression coil spring which covers the outer periphery of the plunger and supports each plunger so as to be relatively slidable, and the first plunger and the second plunger are provided on the distal end side and slide A distal end portion that is supported so as to be in contact with each of the members, and a plunger provided on the base end side of each of the plungers so as to slidably overlap each other, and the compression coil sp And a sliding portion which is inserted into the ring, wherein each sliding portion, characterized in that it is set to a length which is slidably supported with the distal end portion of the mating of the plunger.
- An electrical connection device that performs a test by contacting an electrode of an object to be inspected includes a contact that is disposed at a position corresponding to each electrode of the object to be inspected and that is in contact with and energizes the electrode. As described above, the contact is used.
- each plunger is supported stably and slidably without being shaken, thereby realizing reliable electrical contact.
- the electrical connection device 11 is a device used for an energization test of the device under test 12 or the like.
- the device under test 12 is a semiconductor device such as an integrated circuit or other device that requires electrical inspection.
- the object to be inspected 12 is provided with a plurality of bump electrodes 13 on its lower surface.
- the bump electrode 13 is a spherical electrode provided on the lower surface of the inspection object 12.
- Each bump electrode 13 is provided on the lower surface of the object to be inspected 12 in a single row, a plurality of rows, a matrix, or other arrangement. In the present embodiment, the bump electrodes 13 are arranged in a matrix.
- a planar electrode may be provided instead of the spherical bump electrode 13.
- a contact end which will be described later, is crown-cut or formed in a conical shape.
- both the case where the contact end portion is crown-cut and the case where the contact end portion is formed in a conical shape will be described as an example.
- the electrical connecting device 11 mainly includes a wiring board 15, a housing 16, an upper plate 17, a guide plate 18, and a contact 19.
- the wiring substrate 15 is a plate-like member that is disposed on the thick substrate 20 and is supported integrally with the housing 16, the upper plate 17, and the like.
- the wiring 21 of the wiring board 15 is connected to the wiring of a tester body (not shown) for testing the object to be inspected.
- the wiring board 15 is a member constituting an electrode on the tester main body side. When the lower end portion of the contact 19 comes into contact with the contact pad 22 of the wiring 21 on the wiring board 15, the contact 19 and the tester main body are electrically connected.
- the housing 16 is a member for supporting the contact 19 in cooperation with the upper plate 17.
- the housing 16 is formed in the shape of a thick rectangular block as a whole, and an upper plate fitting recess 23 is formed on the upper side surface thereof.
- the upper plate fitting recess 23 is set to have the same vertical, horizontal and depth dimensions as the upper plate 17.
- the housing 16 is provided with a number of support holes 25 in a matrix.
- the support hole 25 is a hole for inserting and supporting the contact 19 therein.
- the support holes 25 are respectively provided at positions corresponding to the bump electrodes 13 of the device under test 12 and the contact pads 22 of the wiring board 15.
- the support hole 25 includes an intermediate hole portion 25A and a substrate side guide hole portion 25B.
- the intermediate hole portion 25A is set to have an inner diameter larger than the outer diameter of the contact 19 so that the contact 19 does not contact.
- the board-side guide hole 25B is set to have an inner diameter that is substantially the same as that of a tip 39 of a board-side plunger 34 of the contact 19 described later. Thereby, the front end 39 of the substrate side plunger 34 is inserted and supported in the substrate side guide hole 25B, and the substrate side plunger 34 can be slid up and down stably without shaking.
- Two pin holes 27 into which positioning pins 30 to be described later are inserted are provided at the peripheral edge of the upper plate fitting recess 23 of the housing 16.
- the housing 16 is fixed so as to overlap the upper side of the wiring board 15.
- a contact pad 22 provided at a position corresponding to the board-side guide hole 25B on the upper surface of the wiring board 15 is connected to the tester body by wiring.
- Each contact pad 22 is pressed into electrical contact with a contact end 39A of a substrate-side plunger 34 inserted into the substrate-side guide hole 25B.
- the upper plate 17 is a member for supporting the entire contact 19 in cooperation with the housing 16.
- the upper plate 17 is configured to support the contact 19 so as to be extendable and contracted by the housing 16 and the upper plate 17 in a state where the upper plate 17 is fitted in the upper plate fitting recess 23 of the housing 16.
- the upper plate 17 is provided with test object side support holes 28 that support the test object 12 side of the contact 19 at positions corresponding to the support holes 25 of the housing 16.
- the inspection object side support hole 28 includes an inspection object side guide portion 28A and an electrode guide hole portion 28B.
- the inspected object-side guide portion 28A is set to have an inner diameter that is substantially the same as that of the distal end portion 46 of the inspected object-side plunger 35 of the contact 19 described later. As a result, the distal end portion 46 of the inspected object side plunger 35 is inserted and supported in the inspected object side guide portion 28A, and can be slid up and down stably without shaking.
- Pin holes 29 are provided at two positions on the peripheral edge of the upper plate 17.
- This pin hole 29 is a hole into which the positioning pin 30 is inserted.
- the inner diameter of the pin hole 29 is set to be substantially the same as the outer shape of the positioning pin 30, and the positioning pin 30 is fitted into the pin hole 29 without rattling.
- the positioning pin 30 is passed through the pin hole 29 of the upper plate 17 and the pin hole 27 of the housing 16, so that the upper plate 17 and the housing 16 are accurately positioned.
- the electrode guide hole 28B is provided at a position corresponding to each bump electrode 13 provided on the lower surface of the inspection object 12.
- the electrode guide hole 28 ⁇ / b> B is formed in a concave shape that is slightly larger than the outer dimensions of the bump electrode 13.
- the guide plate 18 is a member for receiving, guiding, positioning, and supporting the inspection object 12 when the inspection object 12 is mounted on the electrical connection device 11.
- the object to be inspected 12 positioned and supported is pressed by pressing means (not shown), so that each bump electrode 13 is aligned with each contact 19 and brought into contact with each other.
- the guide plate 18 is formed in a quadrangular annular shape as a whole.
- the outer periphery of the guide plate 18 is set to a dimension that matches the outer periphery of the housing 16.
- the inner periphery of the guide plate 18 includes an inclined surface portion 18A and a contact surface portion 18B.
- the inclined surface portion 18 ⁇ / b> A is a portion that receives and guides the inspection object 12.
- the inclined surface portion 18A is formed on the upper side of the inner circumference of the square annular guide plate 18 and is inclined so as to open upward.
- the contact surface portion 18B is a portion that positions and supports the device under test 12 guided by the inclined surface portion 18A.
- the contact surface portion 18B is positioned below the inclined surface portion 18A and is set to have substantially the same dimensions as the dimensions of the device under test 12. Thereby, the to-be-inspected object 12 fits in the contact surface part 18B, and the to-be-inspected object 12 is correctly positioned and supported.
- the pin holes 31 are provided at two opposing positions of the guide plate 18.
- a positioning pin 32 having an outer diameter substantially the same as the inner diameter of the pin hole 31 is inserted into the pin hole 31.
- the housing 16 is provided with a pin hole (not shown) having the same inner diameter at a position facing the pin hole 31, and a positioning pin 32 is passed from the pin hole 31 to the pin hole of the housing 16, so that the housing 16 and the guide 16 are guided.
- the plate 18 is accurately positioned.
- the wiring board 15, the housing 16, and the guide plate 18 are fixed with through bolts 33.
- Four through bolts 33 are provided at four corners, and integrally fix the wiring board 15, the housing 16, and the guide plate 18.
- the contact 19 is a member for contacting the bump electrode 13 of the device under test 12 and the contact pad 22 of the wiring substrate 15 and energizing between them.
- the shape of the end of the contact 19 is appropriately set according to the shape of a member such as an electrode that comes into contact. That is, the tip end portion 46 of the contact 19 is crown-cut as shown in the upper end portion of FIG. 7 or as shown in FIG. 8, or conically shaped as shown in the lower end portion (tip end portion 39) of FIG. Or formed.
- both ends of the contact 19 are conical will be described with reference to FIGS.
- the contact 19 is composed of a substrate-side plunger 34 as a first plunger, a device-side plunger 35 as a second plunger, and a compression coil spring 36. Yes.
- the substrate-side plunger 34 is a plunger for contacting an electrode or the like as one member (here, the contact pad 22 of the wiring substrate 15).
- the substrate-side plunger 34 is formed by processing a conductive material.
- the substrate-side plunger 34 is manufactured by dicing, plating using a photolithography technique, press working, or the like. As shown in FIGS. 14 and 15, the substrate-side plunger 34 includes a sliding portion 38 and a tip portion 39.
- the sliding portion 38 is slidably overlapped with a sliding portion 45 of the inspected object-side plunger 35, which will be described later, and is a portion for electrically contacting the substrate-side plunger 34 and the inspected object-side plunger 35. It is.
- the sliding portion 38 is set to a length that is slidably supported by the inspected object side guide portion 28 ⁇ / b> A of the inspected object side support hole 28 together with the distal end portion 46 of the counterpart plunger 35. Thereby, the board
- the sliding portion 38 includes a sliding rod portion 41, a rear end insertion portion 42, and a stopper 43.
- the sliding bar portion 41 is slidably overlapped with a sliding portion 45 of the inspected object-side plunger 35, which will be described later, for electrically contacting the substrate-side plunger 34 and the inspected object-side plunger 35.
- the sliding rod portion 41 is provided on the base end side (upper side in FIG. 14) of the substrate side plunger 34 and is formed in a half shape. That is, the sliding rod portion 41 is formed in a rod shape having a semicircular cross section. The sliding rod portion 41 occupies most of the entire length of the substrate side plunger 34.
- the tip 39 is only the portion of the substrate-side plunger 34 that is inserted into the substrate-side guide hole 25 ⁇ / b> B of the housing 16, and only occupies about one-sixth of the total length of the substrate-side plunger 34. Absent.
- the sliding bar portion 41 of the sliding portion 38 occupies about 5/6 of the entire length of the substrate side plunger 34.
- a flat surface of the sliding bar portion 41 having a semicircular bar shape in cross section is a sliding surface portion 41A.
- the sliding surface portion 41A of the substrate side plunger 34 comes into contact with and electrically connects with a sliding surface portion 47A of the inspected object side plunger 35, which will be described later, stably in a wide area while sliding on each other. ing.
- the sliding rod portion 41 is slidably overlapped with the sliding rod portion 47 of the object-side plunger 35 and inserted into the compression coil spring 36.
- the rear end insertion portion 42 is a portion for smoothly inserting the sliding portion 38 of the substrate-side plunger 34 and the sliding portion 45 of the subject-side plunger 35 into the compression coil spring 36.
- the rear end insertion portion 42 includes a straight chamfered portion 42A and an R chamfered portion 42B.
- the straight chamfered portion 42A is smoothly inserted without being caught by each other when the sliding rod portion 41 of the substrate-side plunger 34 and the sliding rod portion 47 of the subject-side plunger 35 are inserted into the compression coil spring 36, respectively. It is a chamfer for making it possible.
- the R chamfered portion 42B is located inside the compression coil spring 36 when the sliding rod portion 41 of the substrate side plunger 34 and the sliding rod portion 47 of the inspected object side plunger 35 are inserted into the compression coil spring 36, respectively. It is a chamfered portion for enabling smooth insertion without being caught.
- the straight chamfered portion 42A occupies 2/3 to 3/4 in the thickness direction of the sliding rod portion 41.
- the R chamfered portion 42B occupies one third to one quarter in the thickness direction of the sliding rod portion 41.
- the stopper 43 is a member that comes into contact with the end of the compression coil spring 36.
- the compression coil spring 36 in contact with the stopper 43 urges the substrate side plunger 34 and the inspected object side plunger 35 in a direction away from each other (a direction in which the contact 19 extends).
- the stopper 43 is formed larger than the substrate side guide hole portion 25B of the support hole 25, is positioned in the intermediate hole portion 25A, and abuts on the end portion of the substrate side guide hole portion 25B, thereby the substrate side guide hole 25B.
- the board side plunger 34 is prevented from falling off from the portion 25B.
- the front end 39 is a part for contacting the contact pad 22 of the wiring board 15.
- the distal end portion 39 is provided on the distal end side of the substrate side plunger 34, and is slidably inserted into and supported by the substrate side guide hole portion 25 ⁇ / b> B of the housing 16.
- the front end 39 is formed in a circular rod shape having an outer diameter substantially the same as the inner diameter of the board-side guide hole 25B of the housing 16, and smoothly slides within the board-side guide hole 25B without rattling. Yes.
- a tip end side of the tip end portion 39 is provided with a contact end portion 39A formed in a conical shape.
- the contact end portion 39A is in direct contact with the contact pad 22 of the wiring board 15.
- the inspected object-side plunger 35 is in contact with the other member (bump electrode 13) in a state of being overlapped with the substrate-side plunger 34, and cooperates with the substrate-side plunger 34 so that the one member and the other member are in contact with each other. It is a member for electrically connecting between.
- the device-side plunger 35 has the same configuration as the substrate-side plunger 34.
- the inspected object-side plunger 35 includes a sliding portion 45, a tip portion 46, a sliding rod portion 47, a rear end insertion portion 48, and a stopper 49. These members have the same configuration and function as the substrate-side plunger 34.
- the compression coil spring 36 is a spring for covering the outer periphery of the overlapped substrate side plunger 34 and the inspected object side plunger 35 and supporting the plungers 34 and 35 so as to be relatively slidable.
- the compression coil spring 36 is positioned between the contact winding portions 51 elastically supporting the sliding portions 38 and 45 which are positioned at both ends and overlapped with each other, and is elastically positioned between the contact winding portions 51.
- a spring part 52 that expands and contracts.
- the inner diameter of the compression coil spring 36 is set slightly smaller than the outer diameter in a state where the sliding portions 38 and 45 are overlapped with each other, and supports the sliding portions 38 and 45.
- the tightly wound portion 51 is tightly wound without a gap, and thus supports the sliding portions 38 and 45 with a relatively strong force. Since the spring portion 52 is wound with a gap, the force for supporting the sliding portions 38 and 45 is weak, and an urging force for separating the substrate-side plunger 34 and the inspected-device-side plunger 35 is applied. Yes.
- the outer diameter of the substrate side plunger 34 and the inspected object side plunger 35 is approximately 0.04 mm, the outer diameter of the compression coil spring 36 is approximately 0.06 mm, and the inner diameter of the compression coil spring 36 is approximately. About 0.035 mm, the wire diameter of the compression coil spring 36 is about 0.0125 mm.
- substrate side plunger 34 and the said to-be-tested object side plunger 35 are very small things, they are the special shapes as mentioned above.
- the contact 19 is supported by the housing 16 and the upper plate 17.
- the contact 19 is inserted into the support hole 25 of the housing 16, and the substrate-side plunger 34 of the contact 19 is inserted into the substrate-side guide hole 25 ⁇ / b> B of the support hole 25.
- a wiring board 15 is attached to the lower side of the housing 16. Thereby, the contact pad 22 of the wiring board 15 contacts the contact end portion 39A of the board-side plunger 34, and the board-side plunger 34 is pushed upward.
- the front end portion 39 of the substrate side plunger 34 is supported by the substrate side guide hole portion 25 ⁇ / b> B, and the rear end insertion portion 42 is supported by the inspection subject side guide portion 28 ⁇ / b> A of the inspection subject side support hole 28. It slides upwards stably without any problems.
- the stopper 49 of the inspected object side plunger 35 supports the upper end of the compression coil spring 36 in a state of being in contact with the lower end of the inspected object side guide portion 28A of the inspected object side support hole 28.
- the compression coil spring 36 supported by the stopper 49 urges the substrate-side plunger 34 downward, and the contact end 39A of the substrate-side plunger 34 is pressed against the contact pad 22.
- the distal end portion 46 of the inspected object-side plunger 35 is inserted and supported in the inspected object-side guide portion 28A of the upper plate 17 so that it can slide up and down stably without shaking.
- the contact end portion 46A of the tip end portion 46 protrudes upward from the upper side surface of the upper plate 17.
- FIGS. Specific operations of the substrate side plunger 34 and the inspected object side plunger 35 are as shown in FIGS.
- the inspected object side plunger 35 is pushed upward as shown in FIG. Then, the contact end portion 46A protrudes above the upper plate 17.
- the rear end insertion portion 48 of the inspected object-side plunger 35 is slidably supported by the board-side guide hole 25B of the support hole 25.
- the contact end portion 39 ⁇ / b> A protrudes to the lower side of the housing 16.
- the rear end insertion portion 42 of the substrate side plunger 34 is slidably supported by the inspection object side guide portion 28 ⁇ / b> A of the inspection object side support hole 28.
- the substrate-side plunger 34 and the inspected object-side plunger 35 slide up and down stably without shaking, and are reliably brought into contact with the contact pad 22 and the bump electrode 13.
- the electrical connection device 11 incorporating the contact 19 is used as follows.
- the device under test 12 is mounted on the electrical connection device 11. At this time, the device under test 12 is attached to the guide plate 18. In other words, the device under test 12 is mounted on the contact surface portion 18B while being positioned along the inclined surface portion 18A. As a result, the bump electrode 13 of the device under test 12 is received in the electrode guide hole 28 ⁇ / b> B of the upper plate 17.
- each bump electrode 13 comes into contact with the contact end portion 46A of each inspection object side plunger 35 and is electrically connected.
- the inspected object side plunger 35 is slidably supported by the inspected object side guide portion 28A of the inspected object side support hole 28 and the rear end insertion portion 48 is a substrate in the support hole 25. It is slidably supported by the side guide hole 25B. Thereby, the to-be-inspected object-side plunger 35 slides up and down stably without shaking, and the contact end portion 46A is reliably brought into contact with the bump electrode 13.
- the substrate side plunger 34 and the inspected object side plunger 35 are supported by the compression coil spring 36, and the sliding surface portions 41A and 47A are slid over each other over a wide area so as to be in electrical contact reliably.
- the object-side plunger 35 is formed by the substrate-side guide hole 25B and the object-side guide 28A. Since it is supported, the contact end portion 46A does not shift and contacts the bump electrode 13 stably.
- each member (the contact pad 22 and the bump electrode 13 of the wiring board 15) is electrically and reliably connected by the contact 19. In this state, an electrical signal or the like is transmitted between the members via the contact 19.
- the substrate side plunger 34 and the inspected object side plunger 35 are electrically and reliably in contact with each other, and the plungers 34 and 35 are stably supported at the upper and lower ends thereof.
- the electrical contact between each member is greatly improved.
- the contact 19 has a small number of parts and a simple structure, there are few causes of failure, so that durability is improved.
- Each of the plungers 34 and 35 can be easily manufactured by a photolithography technique or the like.
- the structure of the contact 19 is simple and the number of parts is small, the cost can be reduced.
- the contact 19 Since the contact 19 has a small number of parts and a simple structure, the electrical contact can be maintained in a good state for a long time and the durability is improved. As a result, the reliability with respect to the contact 19 and the electrical connection device 11 is improved.
- the substrate side plunger 34 and the inspected object side plunger 35 have a circular cross section and a semicircular cross section, but they may have a polygonal cross section.
- the tip portions 39 and 46 may be formed in a hexagonal cross section, and the sliding portions 38 and 45 may be formed in a half shape of the hexagonal cross section.
- the end portions 39 and 46 may be formed in a quadrangular cross section, and the sliding portions 38 and 45 may be formed in a half shape of the cross sectional quadrilateral.
- other polygonal shapes may be used. Also by this, the same operation and effect as the above-mentioned embodiment can be produced.
- the contact of the present invention can be used for all devices that are in contact with electrodes provided on a wiring board, a semiconductor integrated circuit, or the like.
- the electrical connection device can be applied to all devices that can use the contact of the present invention.
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Abstract
Description
前記実施形態では、基板側プランジャー34と被検査体側プランジャー35を断面円形状及び断面半円形状にしたが、断面多角形状にしてもよい。例えば、図21に示すように、その先端部39,46を断面六角形状に、その摺動部38,45を前記断面六角形の半割状に形成してもよい。また、図22に示すように、その先端部39,46を断面四角形状に、その摺動部38,45を前記断面四角形の半割状に形成してもよい。さらに、他の多角形状にしてもよい。これによっても、前記実施形態同様の作用、効果を奏することができる。
半導体集積回路等に備えられた電極に接触される装置全般に用いることができる。
Claims (6)
- 一方の部材に接触する第1のプランジャーと、
当該第1のプランジャーと重ね合わさった状態で他方の部材に接触して前記第1のプランジャーと協働して前記一方の部材と他方の部材との間を電気的に導通させる第2のプランジャーと、
重ね合わさった前記第1のプランジャーと前記第2のプランジャーの外周を覆って、各プランジャーを相対的にスライド可能に支持する圧縮コイルスプリングとを備え、
前記第1のプランジャー及び前記第2のプランジャーが、その先端側に設けられ摺動可能に支持されて前記各部材にそれぞれ接触される先端部と、その基端側に設けられ前記各プランジャーをそれぞれ半割状にして互いに摺動可能に重ね合わされて前記圧縮コイルスプリング内に挿入される摺動部とを備え、
前記各摺動部が、相手側のプランジャーの先端部と共に摺動可能に支持される長さに設定されたことを特徴とする接触子。 - 請求項1に記載の接触子において、
前記圧縮コイルスプリングが、その両端に位置して互いに重ね合わされた各摺動部を互いに弾性的に支持する密着巻き部と、各密着巻き部の中間に位置して弾性的に伸縮するバネ部とを備えたことを特徴とする接触子。 - 請求項1に記載の接触子において、
前記第1のプランジャー及び前記第2のプランジャーが、その先端部を断面円形状に、その摺動部を断面半円形状に形成されたことを特徴とする接触子。 - 請求項1に記載の接触子において、
前記第1のプランジャー及び前記第2のプランジャーが、その先端部を断面多角形状に、その摺動部を前記断面多角形の半割状に形成されたことを特徴とする接触子。 - 請求項1乃至4のいずれか1項に記載の接触子において、
前記摺動部は、相手側のプランジャーと摺動可能に重ね合わされて各プランジャーを互いに電気的に接触させる摺動棒部と、面取りが施されて各プランジャーを前記圧縮コイルスプリングにスムーズに挿入させる後端挿入部と、前記圧縮コイルスプリングの端部に当接するストッパーとを備えて構成されたことを特徴とする接触子。 - 被検査体の電極に接触して試験を行う電気的接続装置において、
前記被検査体の各電極に対応する位置に配設され当該各電極に接触して通電する接触子を備え、
当該接触子として前記請求項1乃至5のいずれか1項に記載の接触子を用いたことを特徴とする電気的接続装置。
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US13/503,877 US8721372B2 (en) | 2010-02-05 | 2010-02-05 | Contact and electrical connecting apparatus |
JP2011552620A JPWO2011096067A1 (ja) | 2010-02-05 | 2010-02-05 | 接触子及び電気的接続装置 |
KR1020127008405A KR101307365B1 (ko) | 2010-02-05 | 2010-02-05 | 접촉자 및 전기적 접속장치 |
PCT/JP2010/051675 WO2011096067A1 (ja) | 2010-02-05 | 2010-02-05 | 接触子及び電気的接続装置 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017096787A (ja) * | 2015-11-25 | 2017-06-01 | 株式会社日本マイクロニクス | 電気的接触子及び電気的接続装置 |
CN107672467A (zh) * | 2017-09-27 | 2018-02-09 | 北京瑞德明电控技术有限公司 | 一种电动汽车自动充电装置及其充电方法 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101307365B1 (ko) * | 2010-02-05 | 2013-09-11 | 가부시키가이샤 니혼 마이크로닉스 | 접촉자 및 전기적 접속장치 |
PT2836847T (pt) * | 2012-04-13 | 2016-08-23 | Capital Formation Inc | Sonda de ensaio e processos relacionados |
US9396847B2 (en) | 2014-05-27 | 2016-07-19 | Vishay Dale Electronics, Llc | Edge-wound resistor, resistor assembly, and method of making same |
USD758970S1 (en) * | 2014-05-27 | 2016-06-14 | Vishay Dale Electronics, Llc | Edge-wound resistor |
JP6269337B2 (ja) * | 2014-06-16 | 2018-01-31 | オムロン株式会社 | プローブピン、および、これを用いた電子デバイス |
TWI573332B (zh) * | 2014-07-23 | 2017-03-01 | 鴻騰精密科技股份有限公司 | 電連接器及其端子 |
JP6610322B2 (ja) * | 2016-02-15 | 2019-11-27 | オムロン株式会社 | プローブピンおよびそれを用いた検査装置 |
JP6907530B2 (ja) * | 2016-12-27 | 2021-07-21 | ブラザー工業株式会社 | 画像形成装置 |
EP3627978A1 (en) * | 2018-09-19 | 2020-03-25 | Infineon Technologies AG | Power semiconductor module arrangement and housing for a power semiconductor arrangement |
JP7095753B2 (ja) * | 2018-12-13 | 2022-07-05 | 株式会社村田製作所 | プローブ |
DE102019112697A1 (de) * | 2019-05-15 | 2020-11-19 | Andreas Veigel | Drahtverbindungselement |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000241447A (ja) * | 1999-02-18 | 2000-09-08 | Delaware Capital Formation Inc | ばねプローブ、ばねプローブ組立体及びそれらの組立方法 |
JP2008032743A (ja) * | 2007-10-01 | 2008-02-14 | Nhk Spring Co Ltd | 導電性接触子 |
WO2008136396A1 (ja) * | 2007-04-27 | 2008-11-13 | Nhk Spring Co., Ltd. | 導電性接触子 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3979478B2 (ja) | 1998-05-01 | 2007-09-19 | 株式会社エンプラス | コンタクトピン及びこのコンタクトピンを用いた電気部品用ソケット |
US6506082B1 (en) * | 2001-12-21 | 2003-01-14 | Interconnect Devices, Inc. | Electrical contact interface |
JP3768183B2 (ja) | 2002-10-28 | 2006-04-19 | 山一電機株式会社 | 狭ピッチicパッケージ用icソケット |
KR100584225B1 (ko) * | 2004-10-06 | 2006-05-29 | 황동원 | 전자장치용 콘택트 |
CN201029131Y (zh) * | 2007-03-02 | 2008-02-27 | 富士康(昆山)电脑接插件有限公司 | 电连接器端子 |
US7862391B2 (en) * | 2007-09-18 | 2011-01-04 | Delaware Capital Formation, Inc. | Spring contact assembly |
TWM343263U (en) * | 2008-04-07 | 2008-10-21 | Hon Hai Prec Ind Co Ltd | Electrical contact |
TWM349590U (en) * | 2008-06-16 | 2009-01-21 | Hon Hai Prec Ind Co Ltd | Electrical contact |
JP5291585B2 (ja) * | 2008-11-07 | 2013-09-18 | 株式会社日本マイクロニクス | 接触子及び電気的接続装置 |
KR101307365B1 (ko) * | 2010-02-05 | 2013-09-11 | 가부시키가이샤 니혼 마이크로닉스 | 접촉자 및 전기적 접속장치 |
-
2010
- 2010-02-05 KR KR1020127008405A patent/KR101307365B1/ko active IP Right Grant
- 2010-02-05 US US13/503,877 patent/US8721372B2/en active Active
- 2010-02-05 JP JP2011552620A patent/JPWO2011096067A1/ja active Pending
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000241447A (ja) * | 1999-02-18 | 2000-09-08 | Delaware Capital Formation Inc | ばねプローブ、ばねプローブ組立体及びそれらの組立方法 |
WO2008136396A1 (ja) * | 2007-04-27 | 2008-11-13 | Nhk Spring Co., Ltd. | 導電性接触子 |
JP2008032743A (ja) * | 2007-10-01 | 2008-02-14 | Nhk Spring Co Ltd | 導電性接触子 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017096787A (ja) * | 2015-11-25 | 2017-06-01 | 株式会社日本マイクロニクス | 電気的接触子及び電気的接続装置 |
CN107672467A (zh) * | 2017-09-27 | 2018-02-09 | 北京瑞德明电控技术有限公司 | 一种电动汽车自动充电装置及其充电方法 |
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