WO2011018045A1

WO2011018045A1 - Two-chip signal converting apparatus

Info

Publication number: WO2011018045A1
Application number: PCT/CN2010/075951
Authority: WO
Inventors: 萧烽吉; 杨坤山; 林东赋; 郑清汾; 李至伟
Original assignee: 钒创科技股份有限公司
Priority date: 2009-08-12
Filing date: 2010-08-12
Publication date: 2011-02-17
Also published as: JP5426772B2; CN201479128U; JP2013501986A; KR20120043063A

Abstract

A two-chip signal converting apparatus is disclosed by the present invention, the signal converting apparatus includes: a support plate, the surface of one side of the support plate has at least one first and one second contacts, and the surface of another side has at least one third and one fourth contacts; a first chip, which is provided on the surface of one of the sides of the support plate and electrically connected with the second contact and the fourth contact; a second chip, which is provided on the surface of one of the sides of the support plate and electrically connected with the first chip; and an antenna, which is arranged in the support plate and electrically connected with the second chip.

Description

Dual chip signal conversion device

The invention relates to a two-chip signal conversion device, relating to a user identification module

(SIM: Subscriber Identify Module) application, especially in the field of dual card integration, to improve convenience. Background technique

According to the National Communications and Communications Commission (NCC), as of the end of June 2008, the number of mobile phone users in Taiwan was 24.68 million, which means that each person holds more than one mobile phone. The popularity of mobile phones in Asia is almost always among the top, and it is clear that mobile phones are quite important to everyone! However, most of the users only stay in the function of using the dial-up phone and sending and receiving text messages. The function is stronger, and it is only used for taking pictures and listening to music. The current subscriber identification module (SIM: Subscriber Identify Module^l SIM card is used on the mobile phone to store the user's phone number, phone book and system information, such as: PIN code: Personal Identification Number and user identity, The function of preventing misappropriation or misuse is completed. However, due to the dependence on the mobile phone, the SIM card can be combined with Near Field Communication, for example, combining functions such as a leisure card, a credit card and an access card. NFC (Near Field Communication) is a very short-range radio frequency identification protocol technology standard that allows users to perform two-point electronic point-to-point communication with non-contact point-to-point communication. With the contact card, it is possible to safely exchange data in two electronic devices.

In summary, the two-chip signal conversion apparatus of the present invention is implemented based on the considerations described above without realizing the industrial use of the value-added service without changing the SIM card structure to be attached. Summary of the invention

The present invention provides a two-chip signal conversion device, which can be configured with a dual chip and an antenna on a film carrier to facilitate the bonding of the film substrate to a SIM card. In order to achieve the above object, the present invention provides a two-chip signal conversion device, including: a carrier, one side surface of the carrier is provided with at least a first contact and at least a second contact, and the carrier is further Having at least one third contact and at least one fourth contact on one side surface; a first chip disposed on one side surface of the carrier, and the first chip electrically connecting the second contact and the first a second chip is disposed on one side surface of the carrier, and the second chip is electrically connected to the first chip; and an antenna is disposed in the carrier, and the antenna is electrically connected The second chip.

In order to achieve the above object, the present invention further provides a two-chip signal conversion device, including: a carrier board including a first substrate, a second substrate, and a connecting portion, the connecting portion connecting the first substrate and a second substrate, wherein one side surface of the first substrate is provided with at least one first contact and at least one second contact, and the other side surface of the first substrate is provided with at least a third contact and at least a fourth contact. And the first contact is electrically connected to the third contact; a first chip is disposed on one side surface of the second substrate, and the first chip is electrically connected to the second contact via the connecting portion And a fourth chip; a second chip is disposed on one side surface of the second substrate, and the second chip is electrically connected to the first chip; and an antenna is disposed in the second substrate, And the antenna is electrically connected to the second chip.

In order to achieve the above object, the present invention further provides a two-chip signal conversion device, including: a carrier board including a first substrate, a second substrate, and a connecting portion, the connecting portion connecting the first substrate and a second substrate, wherein one side surface of the first substrate is provided with at least one first contact and at least one second contact, and the other side surface of the first substrate is provided with at least a third contact and at least a fourth contact. And the first contact is electrically connected to the third contact; a first chip is disposed on one side surface of the first substrate, and the first chip is electrically connected to the second contact and the fourth a second chip is disposed on one side surface of the second substrate, and the second chip is electrically connected to the first chip through the connecting portion; and an antenna is disposed in the second substrate, And the antenna is electrically connected to the second chip.

In order to achieve the above object, the present invention further provides a two-chip signal conversion device, including: a carrier board, including a first substrate, a second substrate, and a connecting portion, wherein the connecting portion connects the first a substrate and a second substrate, wherein one side surface of the first substrate is provided with at least one first contact and at least one second contact, and the other side surface of the first substrate is provided with at least a third contact and at least one a fourth contact, wherein the first contact is electrically connected to the third contact; a first chip is disposed on one side surface of the first substrate, and the first chip is electrically connected to the second contact a second chip is disposed on one side surface of the first substrate, and the second chip is electrically connected to the first chip; and an antenna is disposed in the second substrate, and The antenna is electrically connected to the second chip via the connecting portion.

In order to achieve the above object, the present invention further provides a two-chip signal conversion device, including: a first substrate, a second substrate, and a connecting portion, wherein the connecting portion connects the first substrate and the second substrate, wherein One side surface of the first substrate is disposed with at least one first contact and at least one second contact, and the other side surface of the first substrate is provided with at least a third contact and at least a fourth contact, and the first The contact is electrically connected to the third contact, and the second substrate has a plurality of electrical contacts; a third substrate has a plurality of electrical contacts, and the second substrate and the third substrate pass the electrical properties a first chip is disposed on one side surface of the second substrate, and the first chip electrically connects the second contact and the fourth contact through the connecting portion, and The first chip is electrically connected to the plurality of electrical contacts of the second substrate; a second chip is disposed on one of the surfaces of the third substrate, and the second chip is electrically connected to the third substrate Multiple electrical connections And an antenna disposed in the third substrate, and the antenna is electrically connected to the second chip.

In order to achieve the above object, the present invention further provides a two-chip signal conversion device, including: a first substrate, a second substrate, and a connecting portion, wherein the connecting portion connects the first substrate and the second substrate, wherein One side surface of the first substrate is disposed with at least one first contact and at least one second contact, and the other side surface of the first substrate is provided with at least a third contact and at least a fourth contact, and the first The contact is electrically connected to the third contact, and the second substrate has a plurality of electrical contacts; a third substrate has a plurality of electrical contacts, and the second substrate and the third substrate pass the electrical properties a first chip is disposed on one side surface of the second substrate, and the first chip electrically connects the second contact and the fourth contact through the connecting portion; Two core a chip disposed on one side surface of the second substrate, wherein the second chip is electrically connected to the first chip, and the second chip is electrically connected to the plurality of electrical contacts of the second substrate; and an antenna Provided in the third substrate, and the antenna is electrically connected to the plurality of electrical contacts of the third substrate.

In order to achieve the above object, the present invention further provides a two-chip signal conversion device, including: a first substrate, a second substrate, and a connecting portion, wherein the connecting portion connects the first substrate and the second substrate, wherein One side surface of the first substrate is disposed with at least one first contact and at least one second contact, and the other side surface of the first substrate is provided with at least a third contact and at least a fourth contact, and the first The contact is electrically connected to the third contact, and the second substrate has a plurality of electrical contacts; a third substrate has a plurality of electrical contacts, and the second substrate and the third substrate pass the electrical properties a first chip is disposed on one side surface of the first substrate, and the first chip is electrically connected to the second contact and the fourth contact; a second chip is disposed on One side surface of the second substrate, and the second chip is electrically connected to the first chip through the connecting portion, and the second chip is electrically connected to the plurality of electrical contacts of the second substrate; Antenna, To the third substrate, and the antenna is electrically connected to the plurality of electrical contacts of the third substrate.

The first chip is a signal processing unit.

The second chip is an authentication unit, and the authentication unit performs a bank-side authentication permission encryption and decryption algorithm.

Wherein, the first chip and the second chip adopt a wafer level chip size package (WLCSP) or a flip chip process.

The first chip converts a signal between the second contact and the fourth contact, and the signal includes a data signal.

The electrical connection between the first contact and the third contact is electrically grounded.

The electrical connection between the first contact and the third contact is a power connection.

The first contact and the second contact are used for electrically connecting to a SIM card.

The third contact and the fourth contact are electrically connected to a portable communication device. Wherein the second substrate has a plurality of electrical contacts, and the plurality of electrical contacts are at least one set of electrical contacts.

The two-chip signal conversion device provided by the present invention can be configured with a dual chip and an antenna on a film carrier to facilitate the bonding of the film substrate to a SIM card. DRAWINGS

1 is a block diagram of a two-chip signal conversion apparatus of the present invention.

2A is a structural configuration diagram of a two-chip signal conversion device according to a first embodiment of the present invention. 2B is a structural configuration diagram of a two-chip signal conversion device according to a second embodiment of the present invention. 2C is a structural configuration diagram of a two-chip signal conversion device according to a third embodiment of the present invention. 3A is a structural configuration diagram of a two-chip signal conversion apparatus according to a fourth embodiment of the present invention. 3B is a structural configuration diagram of a two-chip signal conversion apparatus according to a fifth embodiment of the present invention. 3C is a structural configuration diagram of a two-chip signal conversion apparatus according to a sixth embodiment of the present invention. 3D is a structural configuration diagram of a plurality of sets of antenna electrical contacts of a two-chip signal conversion apparatus according to fourth to sixth embodiments of the present invention.

Reference number

1 SIM card

2 mobile phone

100 dual chip signal conversion device

10 first substrate

11 first contact

12 second contact

13 third contact

14 fourth junction

15 signal processing unit

16 certification unit 20 second substrate

21 electrical contacts

22 connection

30 third substrate

31 Electrical contact Specific implementation

The two-chip signal conversion device of the present invention is interposed between the SIM/USIM card and the mobile phone to realize the value-added service of the mobile phone. Referring to FIG. 1, a block diagram of a two-chip signal conversion apparatus of the present invention is shown. The two-chip signal conversion device 100 includes: at least one first contact 11, at least one second contact 12, at least one third contact 13, at least one fourth contact 14, a signal processing unit 15, an authentication unit 16, and an antenna. 17. The first contact 11 and the second contact 12 are electrically connected to a SIM card 1 , and the third contact 13 and the fourth contact 14 are electrically connected to a mobile phone 2, The first contact 11 is electrically connected to the third contact 13 , the signal processing unit 15 is electrically connected to the second contact 12 and the fourth contact 14 , and the authentication unit 16 is electrically connected to the signal processing unit 15 . And an antenna 17.

The signal processing unit 15 and the authentication unit 16 of the apparatus of the present invention each function by a chip of an integrated circuit, and the chip of the integrated circuit is a wafer level chip scale package (WLCSP) or a flip chip process.

2A is a structural configuration diagram of a two-chip signal conversion device according to a first embodiment of the present invention. The signal conversion device includes a first substrate 10, a second substrate 20, and a connecting portion 22, wherein the connecting portion 22 is used to connect the first substrate 10 and the second substrate 20. The first substrate 10, the second substrate 20, and the connecting portion 22 are all constructed using a flexible printed circuit board (soft board:) technology. A second contact area is disposed on a side surface of the first substrate 10, the second contact area includes at least a third contact and at least a fourth contact, and the third contact and the fourth contact are used. Electrical connection To a portable communication device (eg mobile phone:). In an embodiment of the invention, the second contact area conforms to the ISO 7816 international standard, and the ISO 7816 international standard includes eight contacts (contact l.Vcc, contact 2.RST, contact 3.CLK, contact 4.RFU). , contact 5. GND, contact 6.Vpp, contact 7.0/1, contact 8.RFU), where the contact l.Vcc and the contact 5. GND can be regarded as the third contact; the contact point 7.1 / 0 can be regarded as Said the fourth junction. The first side of the first substrate 10 is provided with a first contact area, the first contact area includes at least one first contact and at least one second contact, and the first contact and the second contact are used for electricity Connected to a SIM card, wherein the first contact is electrically connected to the third contact. Further, the other side surface has a partial region having a viscous material so that the other side surface can be correspondingly attached to the SIM card. In an embodiment of the present invention, the first contact area also conforms to the ISO 7816 international standard, and the contacts of the first contact area and the second contact area correspond to each other, wherein the contact l. Vcc and the contact 5. GND can be regarded as the first contact; the contact 7.0/1 can be regarded as the second contact.

In the signal conversion device of the present invention, a first chip 15 is disposed on one side surface of the second substrate 20, wherein the second contact and the fourth contact are electrically connected to the first chip 15 via the connecting portion 22, wherein A chip 15 is a signal processing unit for converting a signal between the second contact and the fourth contact (eg, a data signal, a second chip 16 is disposed on a side surface of the second substrate 20, and a second The chip 16 is electrically connected to the first chip 15, wherein the second chip 16 is an authentication unit for performing a bank-side authentication permission algorithm. An antenna 17 is disposed on one side surface of the second substrate, and the antenna 17 is electrically connected to The second chip 16.

It should be noted that the first chip 15 and the second chip 16 in the first embodiment may be disposed on either side of the second substrate 20, and the antenna 17 may be disposed on either side of the second substrate 20 or Inside the second substrate 20.

Referring to FIG. 2B, FIG. 2B is a structural configuration diagram of a two-chip signal conversion apparatus according to a second embodiment of the present invention. The signal conversion device includes a first substrate 10, a second substrate 20, and a connecting portion 22, wherein the connecting portion 22 is used to connect the first substrate 10 and the second substrate 20. The first substrate 10, the second substrate 20, and the connecting portion 22 are all constructed using a flexible printed circuit board (soft board:) technology. Said A second contact region is disposed on a side surface of the first substrate 10, the second contact region includes at least a third contact and at least a fourth contact, and the third contact and the fourth contact are electrically connected To a portable communication device (eg mobile phone:). In an embodiment of the invention, the second contact area conforms to the ISO 7816 international standard, and the ISO 7816 international standard includes eight contacts (contact l.Vcc, contact 2.RST, contact 3.CLK, contact 4.RFU). , contact 5. GND, contact 6.Vpp, contact 7.0/1, contact 8.RFU), where the contact l.Vcc and the contact 5. GND can be regarded as the third contact; the contact point 7.1 / 0 can be regarded as Said the fourth junction. The first side of the first substrate 10 is provided with a first contact area, the first contact area includes at least one first contact and at least one second contact, and the first contact and the second contact are used for electricity Connected to a SIM card, wherein the first contact is electrically connected to the third contact. Further, the other side surface has a partial region having a viscous material so that the other side surface can be correspondingly attached to the SIM card. In an embodiment of the present invention, the first contact area also conforms to the ISO 7816 international standard, and the contacts of the first contact area and the second contact area correspond to each other, wherein the contact l. Vcc and the contact 5. GND can be regarded as the first contact; the contact 7.0/1 can be regarded as the second contact.

In the signal conversion device of the present invention, a first chip 15 is disposed on one side surface of the first substrate 10, wherein the second contact and the fourth contact are electrically connected to the first chip 15, wherein the first chip 15 is A signal processing unit is configured to convert a signal (eg, a data signal) between the second contact and the fourth contact. A second chip 16 is disposed on one side surface of the second substrate 20, and the second chip 16 is electrically connected to the first chip 15 via the connecting portion 22, wherein the second chip 16 is an authentication unit for performing a bank end authentication license. Algorithm. An antenna 17 is disposed on one side of the second substrate, and the antenna 17 is electrically connected to the second chip 16.

It should be noted that the first chip 15 and the second chip 16 in the second embodiment may be disposed on either side of the first substrate 10 and the second substrate 20, and the antenna 17 may be disposed on the second substrate 20. Either side or within the second substrate 20.

Referring to FIG. 2C, FIG. 2C is a structural configuration diagram of a two-chip signal conversion apparatus according to a third embodiment of the present invention. The signal conversion device includes a first substrate 10, a second substrate 20, and a connecting portion. 22, wherein the connecting portion 22 is used to connect the first substrate 10 and the second substrate 20. The first substrate 10, the second substrate 20, and the connecting portion 22 are all constructed using a flexible printed circuit board (soft board:) technology. A second contact area is disposed on a side surface of the first substrate 10, the second contact area includes at least a third contact and at least a fourth contact, and the third contact and the fourth contact are used. Electrically connected to a portable communication device (eg mobile phone:). In an embodiment of the invention, the second contact area conforms to the ISO 7816 international standard, and the ISO 7816 international standard includes eight contacts (contact l.Vcc, contact 2.RST, contact 3.CLK, contact 4.RFU). , contact 5. GND, contact 6.Vpp, contact 7.0/1, contact 8.RFU), where the contact l.Vcc and the contact 5. GND can be regarded as the third contact; the contact point 7.1 / 0 can be regarded as Said the fourth junction. The first side of the first substrate 10 is provided with a first contact area, the first contact area includes at least one first contact and at least one second contact, and the first contact and the second contact are used for electricity Connected to a SIM card, wherein the first contact is electrically connected to the third contact. Further, the other side surface has a partial region having a viscous material so that the other side surface can be correspondingly attached to the SIM card. In an embodiment of the present invention, the first contact area also conforms to the ISO 7816 international standard, and the contacts of the first contact area and the second contact area correspond to each other, wherein the contact l. Vcc and the contact 5. GND can be regarded as the first contact; the contact 7.0/1 can be regarded as the second contact.

In the signal conversion device of the present invention, a first chip 15 is disposed on one side surface of the first substrate 10, wherein the second contact and the fourth contact are electrically connected to the first chip 15, wherein the first chip 15 is A signal processing unit is configured to convert a signal (eg, a data signal) between the second contact and the fourth contact. A second chip 16 is disposed on one side surface of the first substrate 10, and the second chip 16 is electrically connected to the first chip 15, wherein the second chip 16 is an authentication unit for performing a bank end authentication permission algorithm. An antenna 17 is disposed on one side surface of the second substrate, and the antenna 17 is electrically connected to the second chip 16.

It should be noted that the first chip 15 and the second chip 16 in the third embodiment may be disposed on either side of the first substrate 20, and the antenna 17 may be disposed on either side of the second substrate 20 or Inside the second substrate 20. Referring to FIG. 3A, a structural configuration diagram of a two-chip signal conversion apparatus according to a fourth embodiment of the present invention is shown. The signal conversion device includes a first substrate 10, a second substrate 20, a connecting portion 22, and a third substrate 30. The connecting portion 22 is used to connect the first substrate 10 and the second substrate 20. The first substrate 10, the second substrate 20, the connecting portion 22, and the third substrate 30 are all constructed using a flexible printed circuit board (soft board:) technology. A second contact area is disposed on a side surface of the first substrate 10, the second contact area includes at least a third contact and at least a fourth contact, and the third contact and the fourth contact are used. Electrically connected to a portable communication device (eg mobile phone:). In an embodiment of the invention, the second contact area conforms to the ISO 7816 international standard, and the ISO 7816 international standard includes eight contacts (contact l.Vcc, contact 2.RST, contact 3.CLK, contact 4.RFU). , contact 5. GND, contact 6.Vpp, contact 7.0/1, contact 8.RFU), where the contact l.Vcc and the contact 5. GND can be regarded as the third contact; the contact point 7.1 / 0 can be regarded as Said the fourth junction. The first side of the first substrate 10 is provided with a first contact area, the first contact area includes at least one first contact and at least one second contact, and the first contact and the second contact are used for electricity Connected to a SIM card, wherein the first contact is electrically connected to the third contact. Further, the other side surface has a partial region having a viscous material so that the other side surface can be correspondingly attached to the SIM card. In an embodiment of the present invention, the first contact area also conforms to the ISO 7816 international standard, and the contacts of the first contact area and the second contact area correspond to each other, wherein the contact l. Vcc and the contact 5. GND can be regarded as the first contact; the contact 7.0/1 can be regarded as the second contact. The second substrate 20 has a plurality of electrical contacts 21 (such as a bus or a copper pillar), and the third substrate 30 has a plurality of electrical contacts 31 (such as a bus or a copper pillar), wherein the second substrate 20 and the third substrate 30 are The electrical contacts 21 and the electrical contacts 31 are electrically connected.

In the signal conversion device of the present invention, a first chip 15 is disposed on one side surface of the second substrate 20, wherein the second contact and the fourth contact are electrically connected to the first chip 15 via the connecting portion 22, and A chip 15 is electrically connected to the electrical contact 21 of the second substrate 20, wherein the first chip 15 is a signal processing unit for converting a signal between the second contact and the fourth contact (for example: a data signal) . A second chip 16 is disposed on one side surface of the third substrate 30, and the second chip 16 The electrical connection 31 is electrically connected to the third substrate, wherein the second chip 16 is an authentication unit for performing a bank-side authentication permission algorithm. An antenna 17 is disposed on one side surface of the third substrate, and the antenna 17 is electrically connected to the second chip 16.

It should be noted that the first chip 15 and the second chip 16 in the fourth embodiment may be disposed on either side of the second substrate 20 and the third substrate 30, and the antenna 17 may be disposed on the third substrate 30. Either side or within the third substrate 30.

Referring to FIG. 3B, FIG. 3B is a structural configuration diagram of a two-chip signal conversion apparatus according to a fifth embodiment of the present invention. The signal conversion device includes a first substrate 10, a second substrate 20, a connecting portion 22, and a third substrate 30. The connecting portion 22 is used to connect the first substrate 10 and the second substrate 20. The first substrate 10, the second substrate 20, the connecting portion 22, and the third substrate 30 are all constructed using a flexible printed circuit board (soft board:) technology. A second contact area is disposed on a side surface of the first substrate 10, the second contact area includes at least a third contact and at least a fourth contact, and the third contact and the fourth contact are used. Electrically connected to a portable communication device (eg mobile phone:). In an embodiment of the invention, the second contact area conforms to the ISO 7816 international standard, and the ISO 7816 international standard includes eight contacts (contact l.Vcc, contact 2.RST, contact 3.CLK, contact 4.RFU). , contact 5. GND, contact 6.Vpp, contact 7.0/1, contact 8.RFU; >, where the contact l.Vcc and the contact 5. GND can be regarded as the third contact; contact 7.0/1 can be regarded as The fourth contact is disposed on the other side surface of the first substrate 10, the first contact region includes at least one first contact and at least one second contact, and the first contact and the first contact The second contact is electrically connected to a SIM card, wherein the first contact has an electrical connection with the third contact. Further, the other side surface has a partial region having a viscous material, so that the other side The first contact area also conforms to the ISO 7816 international standard, and the contacts of the first contact area and the second contact area are respectively attached to the SIM card. There is a corresponding position in each other, wherein the contact l.Vcc and the contact 5.GND are visible The first contact; the contact 7.0/1 can be regarded as the second contact. The second substrate 20 has a plurality of electrical contacts 21 such as a bus or a copper post, and the third substrate 30 has a plurality of electrical contacts 31 ( Such as bus or copper column), where, The two substrates 20 and the third substrate 30 are electrically connected via the electrical contacts 21 and the electrical contacts 31.

In the signal conversion device of the present invention, a first chip 15 is disposed on one side surface of the second substrate 20, wherein the second contact and the fourth contact are electrically connected to the first chip 15 via the connecting portion 22, wherein A chip 15 is a signal processing unit for converting a signal between the second contact and the fourth contact (eg, a data signal, a second chip 16 is disposed on a side surface of the second substrate 20, and a second The chip 16 is electrically connected to the first chip 15 and the electrical contact 21 electrically connected to the second substrate 20. The second chip 16 is an authentication unit for performing a bank end authentication permission algorithm. One side surface of the three substrates, and the antenna 17 is electrically connected to the electrical contacts 31 of the third substrate 30.

It should be noted that the first chip 15 and the second chip 16 in the fifth embodiment may be disposed on either side of the second substrate 20, and the antenna 17 may be disposed on either side of the third substrate 30 or Inside the third substrate 30.

Referring to FIG. 3C, FIG. 3C is a structural configuration diagram of a two-chip signal conversion apparatus according to a sixth embodiment of the present invention. The signal conversion device includes a first substrate 10, a second substrate 20, a connecting portion 22, and a third substrate 30. The connecting portion 22 is used to connect the first substrate 10 and the second substrate 20. The first substrate 10, the second substrate 20, the connecting portion 22, and the third substrate 30 are all constructed using a flexible printed circuit board (soft board:) technology. A second contact area is disposed on a side surface of the first substrate 10, the second contact area includes at least a third contact and at least a fourth contact, and the third contact and the fourth contact are used. Electrically connected to a portable communication device (eg mobile phone:). In an embodiment of the invention, the second contact area conforms to the ISO 7816 international standard, and the ISO 7816 international standard includes eight contacts (contact l.Vcc, contact 2.RST, contact 3.CLK, contact 4.RFU). , contact 5. GND, contact 6.Vpp, contact 7.0/1, contact 8.RFU; >, where the contact l.Vcc and the contact 5. GND can be regarded as the third contact; contact 7.0/1 can be regarded as The fourth contact is disposed on the other side surface of the first substrate 10, the first contact region includes at least one first contact and at least one second contact, and the first contact and the first contact The second contact is electrically connected to a SIM card, wherein the first contact is electrically connected to the third contact. Further, a portion of the other side surface has a viscous material such that the other side surface is affixed to the SIM card. In an embodiment of the present invention, the first contact area also conforms to the ISO 7816 international standard, and the contacts of the first contact area and the second contact area correspond to each other, wherein the contact l. Vcc and the contact 5. GND can be regarded as the first contact; the contact 7.0/1 can be regarded as the second contact. The second substrate 20 has a plurality of electrical contacts 21 (such as a bus or a copper pillar), and the third substrate 30 has a plurality of electrical contacts 31 (such as a bus or a copper pillar), wherein the second substrate 20 and the third substrate 30 are The electrical contacts 21 and the electrical contacts 31 are electrically connected.

In the signal conversion device of the present invention, a first chip 15 is disposed on one side surface of the first substrate 10, wherein the second contact and the fourth contact are electrically connected to the first chip 15, wherein the first chip 15 is A signal processing unit is configured to convert a signal (eg, a data signal) between the second contact and the fourth contact. A second chip 16 is disposed on one side surface of the second substrate 20, and the second chip 16 is electrically connected to the first chip 15 and the electrical contact 21 electrically connected to the second substrate 20 via the connecting portion 22, wherein the second chip 16 is an algorithm for an authentication unit to perform a bank-side authentication license. An antenna 17 is disposed on one side surface of the third substrate, and the antenna 17 is electrically connected to the electrical contact 31 of the third substrate 30. It should be noted that the first chip 15 and the second chip 16 in the sixth embodiment may be disposed on either side of the first substrate 10 and the second substrate 20, and the antenna 17 may be disposed on the third substrate 30. Either side or within the third substrate 30.

Referring to FIG. 3D, FIG. 3D is a structural configuration diagram of a plurality of sets of antenna electrical contacts of a two-chip signal conversion apparatus according to fourth to sixth embodiments of the present invention. In the fourth to sixth embodiments of the present invention, the electrical contacts 21 may be composed of at least one group.

The technical contents and technical features of the present invention have been disclosed as above, and those skilled in the art can still make various substitutions and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention should be construed as not limited by the scope of the invention, and the scope of the appended claims.

Claims

Claim

A two-chip signal conversion device, wherein the signal conversion device comprises: a carrier, one side surface of the carrier is provided with at least a first contact and at least a second contact, The other side surface of the board is provided with at least a third contact and at least a fourth contact;

a first chip is disposed on one side surface of the carrier, and the first chip electrically connects the second contact and the fourth contact;

a second chip disposed on one side surface of the carrier, and the second chip is electrically connected to the first chip;

An antenna is disposed in the carrier, and the antenna is electrically connected to the second chip.

2. A two-chip signal conversion device, wherein the signal conversion device comprises: a carrier board, comprising a first substrate, a second substrate, and a connecting portion, wherein the connecting portion is connected to the first a substrate and a second substrate, wherein one side surface of the first substrate is provided with at least one first contact and at least one second contact, and the other side surface of the first substrate is provided with at least a third contact and at least a fourth a contact, and the first contact and the third contact are electrically connected;

a first chip is disposed on one side surface of the second substrate, and the first chip electrically connects the second contact and the fourth contact through the connecting portion;

a second chip is disposed on one side surface of the second substrate, and the second chip is electrically connected to the first chip;

An antenna is disposed in the second substrate, and the antenna is electrically connected to the second chip.

3. A two-chip signal conversion device, wherein the signal conversion device comprises: a carrier board, comprising a first substrate, a second substrate, and a connecting portion, wherein the connecting portion is connected to the first a substrate and a second substrate, wherein one side surface of the first substrate is provided with at least one first contact and at least one second contact, and the other side surface of the first substrate is provided with at least a third contact and at least a fourth a contact, and the first contact and the third contact are electrically connected;

a first chip disposed on one side surface of the first substrate, and the first chip is electrically connected a second chip disposed on one side surface of the second substrate, and the second chip is electrically connected to the first chip through the connecting portion;

A two-chip signal conversion device, wherein the signal conversion device comprises: a carrier board, comprising a first substrate, a second substrate, and a connecting portion, wherein the connecting portion is connected to the first a substrate and a second substrate, wherein one side surface of the first substrate is provided with at least one first contact and at least one second contact, and the other side surface of the first substrate is provided with at least a third contact and at least a fourth a contact, and the first contact and the third contact are electrically connected;

a first chip is disposed on one side surface of the first substrate, and the first chip electrically connects the second contact and the fourth contact;

a second chip disposed on one side surface of the first substrate, and the second chip is electrically connected to the first chip;

An antenna is disposed in the second substrate, and the antenna is electrically connected to the second core through the connecting portion.

5. The signal conversion device of the two-chip device, wherein the signal conversion device comprises: a first substrate, a second substrate, and a connecting portion, wherein the connecting portion connects the first substrate and the second substrate The one surface of the first substrate is provided with at least one first contact and at least one second contact, and the other side surface of the first substrate is provided with at least a third contact and at least a fourth contact, and the The first contact is electrically connected to the third contact, and the second substrate has a plurality of electrical contacts;

a third substrate having a plurality of electrical contacts, and the second substrate and the third substrate are electrically connected via the electrical contacts;

a first chip is disposed on one side surface of the second substrate, and the first chip electrically connects the second contact and the fourth contact through the connecting portion, and the first chip is electrically Connecting a plurality of electrical contacts of the second substrate; a second chip disposed on one side surface of the third substrate, and the second chip electrically connecting the plurality of electrical contacts of the third substrate;

An antenna is disposed in the third substrate, and the antenna is electrically connected to the second chip.

6. A two-chip signal conversion device, wherein the signal conversion device comprises: a first substrate, a second substrate, and a connecting portion, wherein the connecting portion connects the first substrate and the second substrate The one surface of the first substrate is provided with at least one first contact and at least one second contact, and the other side surface of the first substrate is provided with at least a third contact and at least a fourth contact, and the The first contact is electrically connected to the third contact, and the second substrate has a plurality of electrical contacts;

a second chip is disposed on one side surface of the second substrate, and the second chip is electrically connected to the first chip, and the second chip is electrically connected to the plurality of electrical contacts of the second substrate; And an antenna disposed in the third substrate, and the antenna is electrically connected to the plurality of electrical contacts of the third substrate.

The signal conversion device of the two-chip device, the signal conversion device includes: a first substrate, a second substrate, and a connecting portion, wherein the connecting portion connects the first substrate and the second substrate The one surface of the first substrate is provided with at least one first contact and at least one second contact, and the other side surface of the first substrate is provided with at least a third contact and at least a fourth contact, and the The first contact is electrically connected to the third contact, and the second substrate has a plurality of electrical contacts;

a third substrate having a plurality of electrical contacts, and the second substrate and the third substrate are electrically connected via the electrical contacts; a first chip is disposed on one side surface of the first substrate, and the first chip electrically connects the second contact and the fourth contact;

a second chip is disposed on one side surface of the second substrate, and the second chip is electrically connected to the first chip through the connecting portion, and the second chip is electrically connected to the second substrate Electrical contacts; and

An antenna is disposed in the third substrate, and the antenna is electrically connected to the plurality of electrical contacts of the third substrate.

The two-chip signal conversion device according to any one of claims 1 to 7, wherein the first chip is a signal processing unit.

The two-chip signal conversion device according to any one of claims 1 to 7, wherein the second chip is an authentication unit.

The two-chip signal conversion apparatus according to claim 9, wherein said authentication unit performs a bank-side authentication permission encryption/decryption algorithm.

The two-chip signal conversion device according to any one of claims 1 to 7, wherein the first chip converts a signal between the second contact and the fourth contact.

The two-chip signal conversion apparatus according to claim 11, wherein the signal is a data signal.

The two-chip signal conversion device according to any one of claims 1 to 7, wherein the electrical connection between the first contact and the third contact is electrically grounded.

The two-chip signal conversion device according to any one of claims 1 to 7, wherein the electrical connection between the first contact and the third contact is a power connection.

The two-chip signal conversion device according to any one of claims 1 to 7, wherein the first contact and the second contact are electrically connected to a SIM card.

The two-chip signal conversion device according to any one of claims 1 to 7, wherein the third contact and the fourth contact are electrically connected to a portable communication device.

The two-chip signal conversion device according to any one of claims 1 to 7, wherein the first chip and the second chip are in a wafer level chip size package or a flip chip process.

The two-chip signal conversion device according to any one of claims 5 to 7, wherein the second substrate has a plurality of electrical contacts, and the plurality of electrical contacts are at least one set of electrical