WO2010143852A2

WO2010143852A2 - Wafer prober station in which the mechanical strength of a chuck is enhanced, and method for controlling same

Info

Publication number: WO2010143852A2
Application number: PCT/KR2010/003638
Authority: WO
Inventors: 전욱일
Original assignee: 주식회사 쎄믹스
Priority date: 2009-06-09
Filing date: 2010-06-07
Publication date: 2010-12-16
Also published as: WO2010143852A3

Abstract

The present invention relates to a wafer prober station. The wafer prober station comprises: a plurality of pressure sensors arranged in the lower portion of a part for supporting a chuck in a vertical direction to sense the pressure applied to the chuck; and a control device which elevates a Z-axis stage of a chuck transfer device when a wafer and a probe card are arranged on the chuck, in order to overdrive the chuck, which calculates pressure variation information for an X-axis direction and a Y-axis direction of the chuck on the basis of the pressure values inputted from the plurality of pressure sensors when the wafer and the probe card contact each other by means of the overdriving, which estimates position error values in an X-axis direction and a Y-axis direction of the contact point between a probe and a contact electrode using the pressure variation information, and which controls the movement of an X-axis stage and a Y-axis stage of the chuck transfer device using the position error values to correct the position of the contact point.

Description

Wafer prober station and its control method that complements the mechanical rigidity of the chuck

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer prober station. Specifically, a wafer probe capable of measuring and correcting a position error occurring in a chuck due to an eccentric load applied to the chuck by a probe card as the overdrive of the Z-axis stage is performed. It's about a bur station.

1 is a block diagram showing a general wafer prober station as a whole. Conventional wafer prober station, as shown in Figure 1, the probe device 11 for inspecting the wafer (W), the chuck 16 loaded with the wafer (W), the chuck 16 for driving the chuck 16 The conveying apparatus 17 and the control apparatus 18 which controls the whole operation | movement are provided.

In the conventional wafer prober station 10, the probe card 14 used for inspection is fixed to the DUT board 13 of the wafer prober station 10, and the wafer prober station is a vision sensor such as a CCD camera. The position of the contact electrode P on the wafer W and the probe 15 of the probe card, and align the probe card 14 and the chuck 16 based on the determined position information. . Then, the control device 18 of the wafer prober station 10 drives the chuck feeder 17 on the basis of the determined positional information and is mounted on the probe 15 and the chuck 16 of the probe card 14. The probe card 14 and the wafer W are aligned so that the contact electrodes P of the wafer W face each other before performing overdriving for inspection. With the probe card and wafer aligned, the controller 18 of the wafer prober station 10 overdrives the chuck and contacts the probe electrode P of the wafer W to the probe 15 to electrically Connect.

However, the conventional wafer prober station 10 is initially set such that the probe 15 and the contact electrode P are precisely overdried with each other as the probe card 14 and the wafer are aligned. However, an unexpected deformation occurs in the probe card 14 or the probe 15 due to the inspection performed on the plurality of wafers W and the high temperature inspection environment. Therefore, the contact load applied to the contact electrode P by the probe 15 during the overdriving control is non-uniformly acting according to the position of the chuck. For this reason, when an eccentric load is applied to the chuck, the chuck cannot withstand the eccentric load and thus cannot maintain mechanical stiffness. As a result, the chuck undesirably moves in the XY axis direction. As the chuck moves in the XY axis direction by the eccentric load, the contact electrode P and the probe cannot be contacted correctly.

An error in contact between the contact electrode P and the probe 15 generated due to the mechanical rigidity of the chuck 16 lowers the inspection yield of the wafer W. This problem is more serious as the probe card is highly integrated with the wafer to be inspected and the probe card is enlarged to inspect the wafer in the shortest process. In addition, as the size of wafers has recently increased in size and has been highly integrated, the problem due to the stiffness of the chuck causing the above-mentioned problems is considered in view of the fact that the contact load by the probe card is further increased and more precise inspection is required. They are getting more weighted.

SUMMARY OF THE INVENTION An object of the present invention for solving the above problems is a mechanism for misaligning a contact between a probe and a contact electrode generated due to a limitation of mechanical stiffness of a chuck during an overdriving process for inspecting a wafer using a highly integrated and large-scale probe card. It is an object of the present invention to provide a wafer prober station that can be complemented in software without any design changes.

According to the first aspect of the present invention for achieving the above technical problem, a chuck for loading a wafer, a chuck transfer device for supporting and transporting the chuck, including a probe card that has been aligned and installed to inspect the wafer A wafer prober station, wherein the wafer prober station includes: a plurality of pressure sensors installed at a lower portion of a portion supporting the chuck in a vertical direction to sense pressure applied to the chuck; And overdriving the chuck by raising the Z-axis stage of the chuck transfer apparatus in a state where the wafer and the probe card on the chuck are aligned, and when the wafer and the probe card are contacted by overdriving, the plurality of pressure sensors The pressure displacement information of the chuck in the x direction and the y direction is calculated based on the detected pressure values, and the position error values of the x direction and the y direction with respect to the contact point of the probe and the contact electrode are calculated using the pressure displacement information. And a control device for estimating and correcting the position of the contact point by controlling the movement of the XY axis stage of the chuck feeder using the position error values.

In the wafer prober station of the above-mentioned feature, the pressure sensors are respectively installed at four corners of the mating surface to which the XY axis stage and the Z axis stage of the chuck feeder are coupled, and the rear corner of the left edge of the mating surface. And a first pressure sensor and a third pressure sensor at the front corners, respectively, and a second pressure sensor and a third pressure sensor at the rear corners and the front corners of the right corner of the coupling surface, respectively.

The control device calculates left pressure information applied to the left side of the chuck by using the pressure values sensed by the first pressure sensor and the third pressure sensor, and detects from the second pressure sensor and the fourth pressure sensor. Calculate right pressure information applied to the right side of the chuck by using the pressure values, calculate rear pressure information applied to the rear of the chuck by using the pressure values detected from the first pressure sensor and the second pressure sensor, and Preferably, the front pressure information applied to the front of the chuck is calculated using the pressure values detected from the third pressure sensor and the fourth pressure sensor.

In the wafer prober station according to the above features, the control device calculates a difference value between the left pressure information and the right pressure information to extract pressure displacement information in the x direction of the chuck, and the front pressure information and the rear pressure. Calculate the difference value of the information to extract the pressure displacement information in the y direction of the chuck, and the position error in the x direction and the y direction of the chuck by multiplying the pressure displacement information in the x direction and the y direction by a predetermined conversion gain value, respectively. It is desirable to estimate the values respectively.

According to another aspect of the present invention, a control method includes: a chuck for loading a wafer, a chuck transfer device for supporting and transferring the chuck, a probe card installed to inspect the wafer, and a lower portion of the chuck supporting the vertical direction of the chuck; A method of controlling by the controller in a wafer prober station having a plurality of pressure sensors and a control device for controlling the same, the method comprising: (a) Z of the chuck feeder with the wafer on the chuck and the probe card aligned; Driving and driving the shaft stage; (b) calculating left pressure information, right pressure information, rear pressure information, and front pressure information based on pressure values detected from the plurality of pressure sensors, respectively; (d) calculating pressure displacement information for the x and y directions of the chuck, respectively, using the left, right, rear and front pressure information; (e) estimating position error values in the x and y directions with respect to the contact position of the probe and the contact electrode using the pressure displacement information; (f) controlling the movement of the XY axis stage of the chuck feeder using position error values in the x and y directions to correct the contact position.

In the control method according to the above feature, the pressure displacement information in the x direction of step (d) is composed of the difference between the left pressure information and the right pressure information, the pressure displacement information in the y direction is the front pressure information and The positional error values in the x and y directions of the step (e) are preferably calculated by multiplying the pressure displacement information in the x and y directions by the preset conversion gain values. .

The wafer prober station according to the present invention detects and detects pressure values applied to the chuck when the probe of the probe card and the contact electrode of the wafer are contacted by a plurality of pressure sensors disposed between the Z axis stage and the XY axis stage. The used pressure values are used as a new feedback variable for overdriving control. As a result, the deviation of the contact position between the probe and the contact electrode caused by the eccentric load applied unevenly to the chuck is compensated by software without changing the mechanical design of the chuck feeder, thereby improving the wafer inspection yield easily and inexpensively. You can.

In particular, the wafer prober station according to the present invention can improve the yield of wafer inspection by having a chuck having rigidity that can effectively cope with an increase in contact load caused by a recently enlarged probe card.

1 is a block diagram of a conventional wafer prober station.

2 is a block diagram of a wafer prober station in accordance with a preferred embodiment of the present invention.

3 is a view showing the arrangement position of the pressure sensor of the wafer prober station in accordance with a preferred embodiment of the present invention.

4 is a diagram illustrating a structure of a pressure sensor of a wafer prober station according to an exemplary embodiment of the present invention.

5 is a block diagram of a controller of a wafer prober station according to a preferred embodiment of the present invention.

6 is a position control block diagram of a wafer prober station in accordance with a preferred embodiment of the present invention.

7 is a flowchart sequentially illustrating the operation of the transducer of the control device of the wafer prober station according to the preferred embodiment of the present invention.

8 is a control flowchart of a wafer prober station according to a preferred embodiment of the present invention.

1, 10: wafer prober station

100: Chuck

200: chuck feeder

300: probe device

400: pressure sensor

500 control device

510: position controller

520: Converter

530: feedback signal processor

The present invention relates to a wafer prober station including a chuck for loading a wafer, a chuck transfer device for supporting and transferring the chuck, and a probe card that is aligned and installed to inspect the wafer. The apparatus may include a plurality of pressure sensors installed at a lower portion of the portion supporting the chuck in a vertical direction to sense pressure applied to the chuck; And overdriving the chuck by raising the Z-axis stage of the chuck transfer apparatus in a state where the wafer and the probe card on the chuck are aligned, and when the wafer and the probe card are contacted by overdriving, the plurality of pressure sensors The pressure displacement information of the chuck in the x direction and the y direction is calculated based on the detected pressure values, and the position error values of the x direction and the y direction with respect to the contact point of the probe and the contact electrode are calculated using the pressure displacement information. And a control device for estimating and correcting the position of the contact point by controlling the movement of the XY axis stage of the chuck feeder using the position error values.

Hereinafter, a wafer prober station according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

A wafer prober station according to an embodiment of the present invention will be described with reference to FIG. 2. 2 is a block diagram of a wafer prober station in accordance with one embodiment of the present invention.

As shown in FIG. 2, the wafer prober station 1 includes a chuck 100 for loading a wafer W, a chuck transfer device 200, a probe device 300, a pressure sensor 400, and a control device 500. ). The wafer prober station having the above-described configuration overdrives the chuck while the wafer on the chuck and the probe card are aligned to bring the probe electrode of the probe card into contact with the contact electrode of the wafer. The wafer prober station according to the present invention is able to compensate for the unwanted movement of the chuck in the XY direction during overdriving due to the limitation of the mechanical rigidity of the chuck due to the eccentric load.

With reference to FIGS. 2-7, each structure of the wafer prober station 1 which concerns on this invention is demonstrated concretely.

Figure 2 is a block diagram showing the overall wafer prober station according to the present invention. As illustrated in FIG. 2, the probe device 300 includes a probe card 310, a tester 320, and a DUT board 330. The probe card 310 includes a probe 312 that makes electrical contact with the wafer to inspect the wafer W. The tester 320 operates in conjunction with the probe card 310 and performs various programs for inspecting whether the wafer W is defective. The DUT board 330 serves as an interface connecting the tester 320, the probe card 310, and the tester 320.

As shown in FIG. 2, the chuck feeder 200 is installed on the XY axis stage 210 that moves a plane and the XY axis stage 210, and the Z axis stage 220 that moves the chuck 100 up and down. ), A rotating shaft (not shown) for rotating the chuck about the Z axis. Since the configuration and operation of the chuck transfer device 200 is well known in the art, a detailed description thereof will be omitted.

Hereinafter, the pressure sensor 400 according to an embodiment of the present invention will be described with reference to FIGS. 2 to 4. 3 is a view showing the arrangement position of the pressure sensor of the wafer prober station according to an embodiment of the present invention, Figure 4 shows the structure of the pressure sensor of the wafer prober station according to an embodiment of the present invention Drawing.

As shown in FIGS. 2 to 4, the pressure sensor 400 is disposed between the Z-axis stage 220 and the XY-axis stage 210. That is, the pressure sensor 400 is installed at the lower portion of the Z-axis stage 220 which is a mechanical part supporting the chuck 100 in the vertical direction so as to sense the pressure corresponding to the inclination of the chuck 100.

As shown in FIG. 3, the pressure sensor 400 is installed at four corners of the coupling surface to which the XY axis stage and the Z axis stage of the chuck transfer device are coupled, respectively, and the rear corner of the left edge of the coupling surface. And a first pressure sensor 401 and a third pressure sensor 403 are installed at the front corners, respectively, and the second pressure sensor 402 and the fourth pressure sensor at the rear corners and the front corners of the right edge of the coupling surface, respectively. 404 is preferably installed. More specifically with respect to the installation position of the pressure sensor, the four pressure sensor 400 is installed on the protrusions protruding in the four corners of the upper surface of the XY axis stage (210). Correspondingly, four corners of the lower surface of the Z-axis stage 220 are provided with grooves through which protrusions provided with the first to

fourth pressure sensors

401, 402, 403, and 404 are respectively inserted. That is, the pressure sensor 400 is disposed between the grooves of the Z-axis stage 220 and the protrusions of the XY-axis stage 210 to apply a pressure value applied to four corners of the Z-axis stage 220 vertically. Sensing and outputting to the control device 500. Here, the pressure sensor 400 may use a load cell, a displacement gauge, a strain gauge, a capacitor sensor, and the like.

As shown in FIG. 4, the load cell, which is the pressure sensor 400 according to the present embodiment, includes a pressing part 4002, a measuring part 4004, and a fixing part 4006. The pressing unit 4002 is coupled to the lower surface of the Z-axis stage 220 to receive external pressure acting on the chuck 100 transmitted through the Z-axis stage 220. A strain gauge is attached to the measuring unit 4004 and outputs a value that changes according to the pressure transmitted through the pressing unit 4002. In addition, the strain gauge of the measuring unit 4004 performs temperature compensation for changes in the surrounding environment. The fixing part 4006 includes a fastening part for fixing the load cell.

Hereinafter, the control device 500 will be described in detail with reference to FIGS. 5 and 6. 5 is a block diagram of the control device according to the present embodiment, and FIG. 6 is a position control block diagram of the wafer prober station 1 according to the present embodiment. As shown in FIG. 5, the control apparatus 500 according to the present exemplary embodiment includes a position controller 510, a transducer 520, and a feedback signal processor 530.

The feedback signal processor 530 receives target position information (X1, Y1, Z1), and the current position information (x, y ,,) of the chuck 100 from the encoder 450 for the X, Y, and Z axes. z) is fed back, the position error values Δx, Δy are fed back from the transducer, and the difference between the target position information X1, Y1, Z1 and the current position information (x, y, z) of the chuck 100; Contact error correction value (ΔE) is generated using the position error value and, and provided to the position controller. Here, the contact position correction value ΔE provided to the position controller 510 is expressed by Equation 1 below.

Equation 1

The position controller 510 generates a drive control signal according to the contact error correction value provided from the feedback signal processor, and controls the chuck feeder 200 according to the drive control signal to control the chuck 100 on the X and Y axes. By moving along the Z axis and the θ axis, the contact position of the chuck is corrected. Here, the position controller 510 may be provided with various controllers such as a PID controller capable of real-time control, an intelligent controller such as fuzzy neural, and an optimum / adaptable controller.

The transducer 520 generates and outputs position error values Δx and Δy in the x and y directions using four pressure values input from the pressure sensor 400. The operation of the converter will be described in more detail with reference to FIG. 7. 7 is a flowchart for sequentially explaining the operation of the converter 520 of the control device according to the present invention.

Referring to FIG. 7, the transducer calculates left pressure information applied to the left side of the chuck by summing pressure values detected from the first pressure sensor and the third pressure sensor, and the second pressure sensor and the fourth pressure. The right pressure information applied to the right side of the chuck is calculated by adding the pressure values detected from the sensor, and the back pressure information applied to the rear of the chuck is calculated by adding the pressure values detected from the first pressure sensor and the second pressure sensor. In operation 700, the front pressure information applied to the front of the chuck is calculated by adding the pressure values detected from the third pressure sensor and the fourth pressure sensor. Next, the pressure displacement information in the x direction of the chuck is extracted by calculating the difference value between the left pressure information and the right pressure information, and the pressure displacement information in the y direction of the chuck is calculated by calculating the difference value between the front pressure information and the rear pressure information. Is extracted (step 710). Next, the position error values Δx and Δy in the x and y directions of the chuck are respectively estimated by multiplying the pressure displacement information in the x and y directions by predetermined conversion gain values, respectively (step 720).

The feedback signal processor 530 receives feedback of target position information, position error values of the estimated x direction and y direction, and current position information, and calculates a contact position correction value ΔE using these to the position controller. to provide.

On the other hand, the control device according to the present embodiment includes an emergency control routine for preventing damage to the probe 312 and the contact electrode (P) by the process of correcting the positional error of the contact according to the eccentric load of the chuck 100 can do. When at least one of the deviations of the pressure values applied to the chuck 100 is outside the preset effective range, it is determined that the automatic correction of the position error of the contact is not possible by the overdriving control operation according to the present embodiment. Emergency control routine is performed. That is, the control device 500 is the wafer prober station 1 according to the present embodiment when one or more of the deviations of the pressure values input to the transducer 520 shown in FIG. 5 is outside the predetermined effective range. Performs a predetermined emergency control routine. A general consideration as an emergency control routine is to stop the operation being performed and to lower the chuck 100 along the Z axis. This may be variously provided according to the characteristics of the equipment.

Hereinafter, the operation of the control apparatus of the wafer prober station 1 according to an embodiment of the present invention will be described with reference to FIG. 7. The probe card 310 is normally installed and aligned in advance.

First, the control device 500 analyzes image information photographed by a vision sensor such as a CCD camera (not shown) to determine the position information of the probes 312 and the position information of the contact electrodes 212, respectively. The probe card 310 and the wafer W are aligned based on the detected position information of the probes 312 and the position information of the contact electrodes 212 (S810). As a result, the chuck 100 reaches the position (X1, Y1, Z1) before the overdriving is performed, and the alignment of the probe card 310 and the wafer W for the overdriving is completed.

Next, the control device 500 targets position information X1, Y1, Z1 + for the position controller 510 according to a preset overdrive amount Δz for contacting the contact electrode P with the probe 312. Δz) is set (S820), and the Z stage is raised by a predetermined overdrive amount Δz to overdrive the chuck (S830).

Next, the current position information (x, y, z) of the chuck 100 detected by the encoder 450 is obtained (S840), and the pressure values detected by the pressure sensors 400 are received (step 850). ), The left, right, rear and front pressure information is calculated using the input pressure values (step 860). Next, it is determined whether at least one of the deviations of the pressure values is out of the preset valid range (step 870), and if it is determined that the deviation is out of the valid range, the control device 500 prepares the emergency control routine. Perform step 872. Otherwise, the position error values Δx and Δy for the x and y directions used as feedback variables of the position controller 510 are calculated using the left, right, rear and front pressure information (step 880). ), The positional position correction value for correcting the positional error of the contact by feeding back the current positional information (x, y, z) and positional error value (Δx, Δy) to the target positional information (X1, Y1, Z1 + Δz) ΔE) is calculated and a drive control signal corresponding to the calculated contact position correction value ΔE is generated, and the driving of the chuck feeder 200 is controlled according to the drive control signal (S890).

As described above, the wafer prober station 1 according to the exemplary embodiment of the present invention has a non-uniform contact between the probe 312 of the probe card 310 and the contact electrode 212 of the wafer W from the pressure sensor 400. By immediately detecting the inclination of the chuck generated by the overdrive control can be performed while correcting in real time the displacement of the contact between the probe 312 and the contact electrode (P) due to the inclination of the chuck.

The wafer prober station according to the present invention can be usefully used in the field of semiconductor inspection of a wafer prober station using a probe card.

Claims

A wafer prober station comprising a chuck for loading a wafer, a chuck transfer device for supporting and transferring the wafer, and a probe card installed to inspect the wafer,

A plurality of pressure sensors installed under the portion supporting the chuck in a vertical direction to sense pressure applied to the chuck; And

When the wafer on the chuck and the probe card are aligned, the Z-axis stage of the chuck transfer device is raised to overdrive the chuck, and when the wafer and the probe card are contacted by overdriving, the plurality of pressure sensors Based on the detected pressure values, pressure displacement information for the x direction and the y direction of the chuck is calculated, and position error values of the x direction and the y direction with respect to the contact point of the probe and the contact electrode are estimated using the pressure displacement information. And a control device for correcting the position of the contact point by controlling the movement of the XY axis stage of the chuck feeder using the position error values.

Wafer prober station comprising a.
The wafer prober station of claim 1, wherein the pressure sensors are respectively installed at four corners of a coupling surface to which the XY axis stage and the Z axis stage of the chuck transfer device are coupled.
The pressure sensor of claim 1, wherein the pressure sensors are provided with a first pressure sensor and a third pressure sensor at the rear corners and the front corners of the left edge of the coupling surface, respectively, and the rear corners and the front corners of the right edge of the coupling surface. The second pressure sensor and the third pressure sensor are respectively installed in the

The control device calculates left pressure information applied to the left side of the chuck by using the pressure values sensed by the first pressure sensor and the third pressure sensor, and detects from the second pressure sensor and the fourth pressure sensor. Calculate right pressure information applied to the right side of the chuck by using the pressure values, calculate rear pressure information applied to the rear of the chuck by using the pressure values detected from the first pressure sensor and the second pressure sensor, and Calculating front pressure information applied to the front of the chuck by using the pressure values detected from the third pressure sensor and the fourth pressure sensor,

And the control device extracts pressure displacement information in the x and y directions of the chuck using the left pressure information, right pressure information, front pressure information, and back pressure information.
The apparatus of claim 3, wherein the control device calculates a difference value between the left pressure information and the right pressure information to extract pressure displacement information in the x direction of the chuck, and calculates a difference value between the front pressure information and the rear pressure information. And extracting pressure displacement information in the y direction of the chuck.
The apparatus of claim 1, wherein the control device estimates position error values in the x direction and the y direction of the chuck by multiplying the pressure displacement information in the x direction and the y direction by predetermined conversion gain values, respectively. Wafer prober station.
A chuck for loading a wafer, a chuck transfer device for supporting and transporting the chuck, a probe card installed to inspect the wafer, a plurality of pressure sensors installed at a lower portion of the vertical support of the chuck, and a control device for controlling them. In the wafer prober station having a control method by the control device,

(a) overdriving by driving the Z-axis stage of the chuck feeder with the wafer on the chuck and the probe card aligned;

(b) calculating left pressure information, right pressure information, rear pressure information, and front pressure information based on pressure values detected from the plurality of pressure sensors, respectively;

(d) calculating pressure displacement information for the x and y directions of the chuck, respectively, using the left, right, rear and front pressure information;

(e) estimating position error values in the x and y directions with respect to the contact position of the probe and the contact electrode using the pressure displacement information;

(f) correcting the contact position by controlling the movement of the XY axis stage of the chuck feeder using the position error values in the x and y directions;

Method of controlling a wafer prober station having a.
7. The wafer prober of claim 6, wherein the position error values in the x and y directions of the step (e) are calculated by multiplying the pressure displacement information in the x and y directions by the preset conversion gain values, respectively. How to control the station.
According to claim 6, wherein the pressure displacement information in the x direction of the step (d) consists of the difference between the left pressure information and the right pressure information, the pressure displacement information in the y direction of the front pressure information and the rear pressure information A method for controlling a wafer prober station, comprising a difference value.