WO2010084794A1

WO2010084794A1 - Electronic component and method for manufacturing same

Info

Publication number: WO2010084794A1
Application number: PCT/JP2010/050142
Authority: WO
Inventors: 慶一都築
Original assignee: 株式会社村田製作所
Priority date: 2009-01-22
Filing date: 2010-01-08
Publication date: 2010-07-29

Abstract

In order to improve the direct current superimposition characteristics of an electronic component incorporating a coil, a multilayer body (12) is formed by laminating magnetic material layers (16) and non-magnetic material layers (17); coil conductors (18) configured from linear conductors constitute a coil (L) that is contained within the multilayer body (12); the coil conductors (18) have a trapezoidal cross-sectional structure wherein the angles (?1, ?2) at both ends of the bottom (L1) are acute in a plane perpendicular to the extension directions of the linear conductors; and the coil conductors in contact with a non-magnetic material layer (17) at the bottom (L1).

Description

Electronic component and manufacturing method thereof

The present invention relates to an electronic component and a method for manufacturing the same, and more specifically to an electronic component having a coil built in a laminate and a method for manufacturing the same.

As a conventional electronic component, for example, a chip type power inductor described in Patent Document 1 is known. The chip type power inductor is composed of a laminate and a coil. The laminate is configured by laminating a magnetic layer and a nonmagnetic layer, and has a built-in coil. And the nonmagnetic material layer is provided in the laminated body so as to cross the coil. As a result, the coil forms an open magnetic circuit type coil, and magnetic saturation is less likely to occur in the stacked body. As a result, in the chip type power inductor, it is possible to suppress a sudden decrease in inductance value due to magnetic saturation and to obtain a good DC superposition characteristic.

Incidentally, in recent years, better direct current superimposition characteristics are required in electronic parts having a nonmagnetic layer such as a chip type power inductor.

JP 2004-31944 A

Therefore, an object of the present invention is to provide an electronic component incorporating a coil excellent in DC superposition characteristics and a method for manufacturing the same.

An electronic component according to an embodiment of the present invention includes a stacked body in which a plurality of first insulator layers and a second insulator layer having a lower magnetic permeability than the first insulator layers are stacked, and a wire A coil conductor that constitutes a coil built in the laminate, and at least a part of the coil conductor in contact with the second insulator layer is The rectangular conductor has a square cross-sectional structure in which the corners at both ends of the predetermined side form an acute angle on a plane perpendicular to the extending direction of the linear conductor, and the second insulating layer is formed on the predetermined side. It is in contact.

An electronic component manufacturing method according to an aspect of the present invention includes: a step of forming the second insulator layer; a step of forming the coil conductor on the second insulator layer; Forming the first insulator layer on the insulator layer using a mask having an opening other than the region corresponding to the coil conductor; and the first insulator layer and the second insulator layer. A step of forming the laminate using the insulating layer, and a step of pressure-bonding the laminate.

According to the present invention, it is possible to improve the direct current superposition characteristics of an electronic component having a built-in coil.

1 is an external perspective view of an electronic component according to an embodiment of the present invention. It is a disassembled perspective view of the laminated body of the electronic component which concerns on one Embodiment of this invention. FIG. 3A is a cross-sectional view taken along the line AA of the electronic component in FIG. 1, and FIG. 3B is an enlarged view of the coil conductor in FIG. It is process sectional drawing at the time of manufacture of an electronic component. It is process sectional drawing at the time of manufacture of an electronic component. It is sectional structure drawing of the electronic component which concerns on the comparative example used for computer simulation. It is the graph which showed the result of computer simulation.

Hereinafter, an electronic component and a manufacturing method thereof according to an embodiment of the present invention will be described.

(Configuration of electronic parts)
Hereinafter, an electronic component 10 according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an external perspective view of an electronic component 10 according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the laminate 12 of the electronic component 10 of FIG. 3A is a cross-sectional structural view taken along the line AA of the electronic component 10 of FIG. 1, and FIG. 3B is an enlarged view of the coil conductor 18d of FIG. 3A. Hereinafter, the stacking direction of the electronic component 10 is defined as the z-axis direction, the direction along the long side of the electronic component 10 is defined as the x-axis direction, and the direction along the short side of the electronic component 10 is defined as the y-axis direction. To do. The x axis, the y axis, and the z axis are orthogonal to each other.

The electronic component 10 includes a laminate 12 and external electrodes 14a and 14b as shown in FIG. The laminated body 12 has a rectangular parallelepiped shape and incorporates a coil L. The external electrodes 14a and 14b are provided so as to cover the side surfaces located at both ends in the x-axis direction.

As shown in FIG. 2, the laminated body 12 is configured by laminating magnetic layers (insulator layers) 16a to 16s and nonmagnetic layers (insulator layers) 17g and 17l. The magnetic layers 16a to 16s are made of ferromagnetic ferrite (for example, Ni—Zn—Cu ferrite). Here, the magnetic layers 16a to 16c, 16e, 16h, 16j, 16m, 16o, and 16q to 16s are obtained by cutting a sheet-like ceramic green sheet into a rectangle of a predetermined size and firing it. The

magnetic layers

16d, 16g, 16i, 16l, 16n, and 16p are obtained by applying ceramic paste to the

magnetic layers

16e, 16h, 16j, 16m, 16o, and 16q by screen printing and firing. . The magnetic layers 16f and 16k are obtained by applying a ceramic paste on the magnetic layers 16g and 16l and the nonmagnetic layers 17g and 17l by screen printing and firing.

The nonmagnetic layers 17g and 17l are made of a material having a lower magnetic permeability than the magnetic layers 16a to 16s. In the present embodiment, the nonmagnetic layers 17g and 17l are made of nonmagnetic ferrite (for example, Zn—Cu ferrite). Yes. As shown in FIG. 3, the non-magnetic layer 17g is provided between the magnetic layer 16f and the magnetic layer 16h, and has a square shape. A magnetic layer 16g is provided at the center of the nonmagnetic layer 17g. Further, as shown in FIG. 3, the nonmagnetic layer 17l is provided between the magnetic layer 16k and the magnetic layer 16m, and has a square shape. A magnetic layer 16l is provided at the center of the nonmagnetic layer 17l. The non-magnetic layers 17g and 17l are obtained by applying a ceramic paste on the

magnetic layers

16h and 16m by screen printing and firing. In the following, when referring to the individual magnetic layers 16a to 16s and the non-magnetic layers 17g and 17l, an alphabet is added after the reference symbol, and when these are collectively referred to, the alphabet after the reference symbol is added. Omitted.

As shown in FIG. 2, the coil L is a spiral coil that advances in the positive direction of the z-axis direction while rotating counterclockwise. The coil L includes coil conductors 18a to 18f,

lead portions

20a and 20f, and via hole conductors b1 to b7.

As shown in FIG. 2, the coil conductors 18a to 18f are provided on the main surfaces of the magnetic layer 16e, the nonmagnetic layer 17g, the magnetic layer 16j, the nonmagnetic layer 17l, and the magnetic layers 16o and 16q, respectively. It is a linear conductor. The coil conductors 18a to 18f are surrounded by

magnetic layers

16d, 16f, 16i, 16k, 16n, and 16p, respectively. Each of the coil conductors 18a to 18f is made of a conductive material made of Ag, has a length of 3/4 turns, and is arranged so as to overlap each other in the z-axis direction. Further, as shown in FIG. 3A, the coil conductors 18a to 18f have an isosceles trapezoidal cross-sectional structure on a plane perpendicular to the extending direction of the linear conductor. As shown in FIG. 3B, the coil conductors 18b and 18d are in contact with the nonmagnetic layers 17g and 17l at the lower base L1, respectively. The angles θ1 and θ2 at both ends of the lower base L1 are acute angles. The angles θ1 and θ2 are preferably 45 degrees or greater and 85 degrees or less, and more preferably 45 degrees or greater and 60 degrees or less.

On the other hand, the upper bases of the coil conductors 18a to 18f are in contact with the

magnetic layers

16c, 16e, 16h, 16j, 16m, and 16o, and are not in contact with the nonmagnetic layers 17g and 17l. In the following, when referring to the individual coil conductors 18a to 18f, an alphabet is appended to the reference symbol, and when referring to these, the alphabet after the reference symbol is omitted.

As shown in FIG. 2, each of the via-hole conductors b1 to b7 includes the magnetic layer 16e, the nonmagnetic layer 17g, the

magnetic layers

16h and 16j, the nonmagnetic layer 17l, and the magnetic layers 16m and 16o in the z-axis direction. It is provided to penetrate. The via-hole conductors b1 to b7 function as connecting portions that connect the ends of the adjacent coil conductors 18 when the magnetic layers 16a to 16s and the nonmagnetic layers 17g and 17l are laminated. More specifically, the via-hole conductor b1 connects the end of the coil conductor 18a where the lead-out portion 20a is not provided and the end of the coil conductor 18b. The via-hole conductor b2 connects the end of the coil conductor 18b to which the via-hole conductor b1 is not connected and the via-hole conductor b3. The via hole conductor b3 connects the via hole conductor b2 and the end of the coil conductor 18c. The via-hole conductor b4 connects the end of the coil conductor 18c that is not connected to the via-hole conductor b3 and the end of the coil conductor 18d. The via-hole conductor b5 connects the end of the coil conductor 18d that is not connected to the via-hole conductor b4 and the via-hole conductor b6. The via hole conductor b6 connects the via hole conductor b5 and the end of the coil conductor 18e. The via-hole conductor b7 includes an end of the coil conductor 18e that is not connected to the via-hole conductor b6, and an end of the coil conductor 18f that is not provided with the lead-out portion 20f. Is connected. Thus, the coil conductors 18a to 18f and the via hole conductors b1 to b7 constitute a spiral coil L.

The

lead portions

20a and 20f are provided at the end portions of the coil conductors 18a and 18f, respectively, and are drawn to the side surface of the multilayer body 12 and connected to the external electrodes 14a and 14b. Thereby, the coil L is connected between the external electrodes 14a and 14b.

(Method for manufacturing electronic parts)
Below, the manufacturing method of the electronic component 10 is demonstrated, referring drawings. 4 and 5 are process cross-sectional views when the electronic component 10 is manufactured. In the drawing, a method for manufacturing one electronic component 10 is described. However, in practice, a plurality of electronic components 10 are simultaneously obtained by stacking mother ceramic sheets to produce a mother laminate and cutting the mother laminate.

First, 48.0 mol% of ferric oxide (Fe ₂ O ₃ ), 20.0 mol% of zinc oxide (ZnO), 23.0 mol% of nickel oxide (NiO), and 9.0 mol of copper oxide (CuO) Each material weighed at a ratio of% is put into a ball mill as a raw material, and wet blending is performed. The obtained mixture is dried and pulverized, and the obtained powder is calcined at 750 ° C. for 1 hour. The obtained calcined powder is wet pulverized by a ball mill, dried and then crushed to obtain a ferrite ceramic powder. The ferrite ceramic powder, a binder such as ethyl cellulose, and a solvent such as terpineol are kneaded to obtain a magnetic ceramic paste.

Next, the respective materials weighed in a ratio of 48.0 mol% of ferric oxide (Fe ₂ O ₃ ), 43.0 mol% of zinc oxide (ZnO), and 9.0 mol% of copper oxide (CuO) were added. The raw material is put into a ball mill and wet blended. The obtained mixture is dried and pulverized, and the obtained powder is calcined at 750 ° C. for 1 hour. The obtained calcined powder is wet pulverized by a ball mill, dried and then crushed to obtain a ferrite ceramic powder. This ferrite ceramic powder, a binder such as ethyl cellulose, and a solvent such as terpineol are kneaded to obtain a non-magnetic ceramic paste.

Next, the production of the magnetic layers 16f to 16h, the nonmagnetic layer 17g, the coil conductor 18b, and the via-hole conductors b2 and b3 will be described. First, 48.0 mol% of ferric oxide (Fe ₂ O ₃ ), 20.0 mol% of zinc oxide (ZnO), 23.0 mol% of nickel oxide (NiO), and 9.0 mol of copper oxide (CuO) Each material weighed at a ratio of% is put into a ball mill as a raw material, and wet blending is performed. The obtained mixture is dried and pulverized, and the obtained powder is calcined at 750 ° C. for 1 hour. The obtained calcined powder is wet pulverized by a ball mill, dried and then crushed to obtain a ferrite ceramic powder.

To the obtained ferrite ceramic powder, a binder (vinyl acetate such as ethyl cellulose, water-soluble acrylic, etc.), a plasticizer, a wetting agent and a dispersing agent are added and mixed with a ball mill, and then defoamed under reduced pressure. . As shown in FIG. 4A, the obtained ceramic slurry is formed into a sheet shape on a carrier sheet 21h and dried by a doctor blade method to form a ceramic green sheet 116h to be the magnetic layer 16h.

Next, as shown in FIG. 4B, a nonmagnetic ceramic paste is applied on the ceramic green sheet 116h by screen printing using a mask and dried by heating, whereby the ceramic to be the nonmagnetic layer 17g. A green layer 117g is formed. This mask is a mask having the same letter-shaped opening as the nonmagnetic layer 17g.

Further, as shown in FIG. 4 (c), a ceramic green layer 116g to be the magnetic layer 16g is formed on the ceramic green sheet 116h by applying a magnetic ceramic paste by screen printing using a mask and drying by heating. Form. This mask has an opening that is inverted from the opening of the mask used when the ceramic green layer 117g is formed. More specifically, the mask has a shape in which a region other than the region corresponding to the ceramic green layer 117g is opened, and has a rectangular opening.

Next, in the process of FIG. 4C, via holes are formed by irradiating a laser beam at positions where the via hole conductors b2 and b3 of the ceramic green sheet 116h and the ceramic green layer 117g are to be formed. Then, the via hole is filled with a conductive paste containing Ag as a main component to form via hole conductors b2 and b3.

Next, as shown in FIG. 4 (d), a conductor paste mainly composed of Ag is applied on the ceramic green layer 117g by screen printing using a mask, followed by heating and drying, thereby forming a coil conductor 18b. To do. At this time, the coil conductor 18b has a dome-shaped cross-sectional structure. Note that via hole conductors b2 and b3 may be formed by filling the via hole with a conductive paste simultaneously with the formation of the coil conductor 18b.

Further, as shown in FIG. 4 (e), the ceramic

green layers

116g and 117g are coated with a magnetic ceramic paste by screen printing using a mask and dried by heating, whereby the ceramic green to be the magnetic layer 16f is obtained. Layer 116f is formed. The mask has an opening that is inverted from the opening of the mask used when forming the coil conductor 18b. More specifically, the mask has a shape in which an area other than the area corresponding to the coil conductor 18b is opened. Thereby, the magnetic layers 16f to 16h, the nonmagnetic layer 17g, the coil conductor 18b, and the via-hole conductors b2 and b3 are formed. The magnetic layers 16k to 16m, the nonmagnetic layer 17l, the coil conductor 18d and the via hole conductors b5 and b6 are the same as the magnetic layers 16f to 16h, the nonmagnetic layer 17g, the coil conductor 18b and the via hole conductors b2 and b3. Since it is formed in this process, the description is omitted.

Next, formation of the magnetic layers 16i and 16j, the coil conductor 18c, and the via-hole conductor b4 will be described. First, as shown in FIG. 5A, a ceramic green sheet 116j to be the magnetic layer 16j is formed on the carrier sheet 21j. Details of the formation of the ceramic green sheet 116j are the same as the details of the formation of the ceramic green sheet 116h, and thus description thereof is omitted.

Next, in the process of FIG. 5A, a via hole is formed by irradiating a laser beam to a position where the via hole conductor b4 of the ceramic green sheet 116j is to be formed. Then, the via hole is filled with a conductor paste mainly composed of Ag to form a via hole conductor b4.

Next, as shown in FIG. 5B, a conductor paste mainly composed of Ag is applied on the ceramic green sheet 116j by screen printing using a mask, and is heated and dried to form the coil conductor 18c. To do. At this time, the coil conductor 18c has a dome-shaped cross-sectional structure. Note that the via hole conductor b4 may be formed by filling the via hole with a conductive paste simultaneously with the formation of the coil conductor 18c.

Furthermore, as shown in FIG. 5 (c), a ceramic ceramic layer 116i to be the magnetic body layer 16i is formed by applying a magnetic ceramic paste on the ceramic green sheet 116j by screen printing using a mask and drying by heating. Form. The mask has an opening that is inverted from the opening of the mask used when the coil conductor 18c is formed. Thereby, the magnetic layers 16i and 16j, the coil conductor 18c, and the via-hole conductor b4 are formed. The

magnetic layers

16d, 16e, 16n, 16o, 16p, 16q, the coil conductors 18a, 18e, 18f, and the via-hole conductors b1, b7 are the same steps as the magnetic layers 16i, 16j, the coil conductor 18c, and the via-hole conductor b4. Since it is formed, the description is omitted. The

lead portions

20a and 20f are formed simultaneously with the formation of the coil conductors 18a and 18f.

Further, ceramic green sheets 116a to 116c, 116r, and 116s (not shown) that are to become the magnetic layers 16a to 16c, 16r, and 16s are also formed by the same process as the formation of the ceramic green sheet 116h.

Next, the produced ceramic green sheets 116a to 116c, 116e, 116h, 116j, 116m, 116o, and 116p to 116s are laminated so as to be arranged in this order from the positive side in the z-axis direction. Specifically, a ceramic green sheet 116s is disposed. Next, the ceramic green sheet 116r is disposed and temporarily pressed onto the ceramic green sheet 116s. Thereafter, the ceramic

green sheets

116q, 116p, 116o, 116m, 116j, 116h, 116e, 116c, 116b, and 116a are similarly laminated and temporarily bonded in this order to obtain a mother laminated body. Further, the mother laminate is subjected to main pressure bonding by a hydrostatic pressure press or the like. The conditions for the main pressure bonding are, for example, a temperature of 45 ° C. and a pressure of 1.0 t / cm ² . At the time of provisional pressure bonding and main pressure bonding, the upper surfaces of the dome-shaped

coil conductors

18b and 18c are crushed as shown in FIGS. 4 and 5 to form a trapezoidal shape as shown in FIG. .

Next, the mother laminated body is cut into a laminated body 12 having a predetermined dimension (3.2 mm × 2.5 mm × 0.8 mm) by pressing to obtain an unfired laminated body 12. The unfired laminate 12 is subjected to binder removal processing and firing. The binder removal treatment is performed, for example, in a low oxygen atmosphere at 500 ° C. for 2 hours. Firing is performed at 890 ° C. for two and a half hours, for example.

The fired laminated body 12 is obtained through the above steps. The laminated body 12 is chamfered by barrel processing. Thereafter, a silver electrode to be the external electrodes 14a and 14b is formed on the surface of the laminate 12 by applying and baking an electrode paste whose main component is silver by a method such as an immersion method. The silver electrode is dried at 100 ° C. for 10 minutes, and the silver electrode is baked at 780 ° C. for 2.5 hours. Finally, the external electrodes 14a and 14b are formed by performing Ni plating / Sn plating on the surface of the silver electrode. Through the above steps, the electronic component 10 as shown in FIG. 1 is completed.

As described above, after the coil conductor 18 is formed on the nonmagnetic material layer 17, the magnetic material layer 16 is formed around the coil conductor 18, thereby forming the coil conductor 18 having a dome-shaped cross-sectional structure. Further, the coil conductor 18 is crushed by the temporary pressure bonding and the main pressure bonding of the laminated body 12 to have a trapezoidal cross-sectional structure. Then, the lower bottom of the coil conductor 18 comes into contact with the nonmagnetic layer 17.

(effect)
The electronic component 10 configured as described above has excellent direct current superposition characteristics as described below. Hereinafter, the coil conductor 18d will be described as an example. As shown in FIG. 3B, the coil conductor 18d has a trapezoidal cross-sectional structure in a plane perpendicular to the extending direction of the linear conductor, and is in contact with the nonmagnetic layer 17l at the bottom of the trapezoid. is doing. Furthermore, the angles θ1 and θ2 located at both ends of the lower base L1 are acute angles. Therefore, the cross-sectional area of the magnetic layer 16k sandwiched between the coil conductor 18d and the nonmagnetic layer 17l is larger than when the angles θ1 and θ2 are 90 degrees or an obtuse angle. Thereby, the magnetic flux density in the magnetic layer 16k is lowered, and the occurrence of magnetic saturation is suppressed. As a result, the DC superposition characteristics of the electronic component 10 are improved.

The inventor of the present application conducted a computer simulation described below in order to make the effect of the electronic component 10 clearer. The computer simulation will be described below with reference to the drawings. FIG. 6 is a cross-sectional structure diagram of an electronic component 210 according to a comparative example used in computer simulation.

In this computer simulation, a model of the electronic component 10 shown in FIG. 3 was produced as the first model. Further, a model of the electronic component 210 shown in FIG. 6 was produced as a second model that is a comparative example. The difference between the electronic component 10 and the electronic component 210 is only the structure of the coil conductor 18 and the coil conductor 218. More specifically, the coil conductor 18 has a trapezoidal cross-sectional structure, while the coil conductor 218 has a rectangular cross-sectional structure. In both the first model and the second model, the number of turns of the coil L was set to 5.5. And the change of the inductance value was calculated by changing the direct current value passed through the first model and the second model.

FIG. 7 is a graph showing the results of this computer simulation. The vertical axis represents the inductance value, and the horizontal axis represents the direct current value. According to FIG. 7, it can be seen that the first model has a smaller decrease in the inductance value due to the increase in the direct current value than the second model. Therefore, it can be seen that the first model has better DC superposition characteristics than the second model. As described above, according to this computer simulation, the electronic component 10 can obtain superior DC superposition characteristics as compared with the electronic component 210 in which the coil made of the coil conductor 218 having a rectangular cross-sectional structure is built. I understand.

(Other embodiments)
The electronic component according to the present invention is not limited to the electronic component 10 and may be changed within the scope of the gist thereof.

In the electronic component 10, all the coil conductors 18 have a trapezoidal cross-sectional structure at all positions. However, not all coil conductors 18 need to have a trapezoidal cross-sectional structure at all positions. The coil conductor 18 only needs to have a trapezoidal cross-sectional structure in a portion in contact with the nonmagnetic layer 17. In particular, the coil conductor 18 preferably has a trapezoidal cross-sectional structure in the entire portion in contact with the nonmagnetic layer 17. However, the coil conductor 18 does not need to have a trapezoidal cross-sectional structure in the entire portion in contact with the nonmagnetic layer 17. Therefore, the coil conductor 18 may have a trapezoidal cross-sectional structure in a part of the portion in contact with the nonmagnetic layer 17. Also by this, it is possible to improve the direct current superposition characteristics of the electronic component 10.

Furthermore, in the electronic component 10, the coil conductor 18 has a trapezoidal cross-sectional structure, but the cross-sectional structure of the coil conductor 18 is not limited to a trapezoidal shape. The coil conductor 18 need only be at least a quadrangular shape in which the corners at both ends of the side in contact with the nonmagnetic layer 17 are acute.

The present invention is useful for an electronic component and a manufacturing method thereof, and is particularly excellent in that the direct current superposition characteristics of an electronic component having a built-in coil can be improved.

L coil L1 bottom bottom b1 to b7 via hole conductor 10 electronic component 12 laminate 14a, 14b external electrode 16a to 16s magnetic layer 17g, 17l nonmagnetic layer 18a to

18f coil conductor

20a, 20f lead-out part

Claims

A laminate in which a plurality of first insulator layers and a second insulator layer having a lower magnetic permeability than the first insulator layers are laminated;
A coil conductor composed of a linear conductor and constituting a coil built in the laminate; and
With
At least a portion of the coil conductor in contact with the second insulator layer has a rectangular cross section in which the corners at both ends of a predetermined side form an acute angle in a plane perpendicular to the extending direction of the linear conductor. Having a structure and being in contact with the second insulating layer at the predetermined side;
Electronic parts characterized by
The coil conductor has a quadrangular shape in which the corners of both ends of a predetermined side form an acute angle in a plane perpendicular to the extending direction of the linear conductor in the entire portion in contact with the second insulator layer. Having a cross-sectional structure of
The electronic component according to claim 1.
At least a portion of the coil conductor in contact with the second insulator layer has a trapezoidal cross-sectional structure in a plane perpendicular to the extending direction of the linear conductor;
The electronic component according to claim 1, wherein:
Angles at both ends of the predetermined side are 45 degrees or more and 85 degrees or less,
The electronic component according to any one of claims 1 to 3, wherein:
Angles at both ends of the predetermined side are 45 degrees or more and 60 degrees or less,
The electronic component according to any one of claims 1 to 3, wherein:
The second insulating layer is a non-magnetic layer;
The electronic component according to claim 1, wherein:
In the manufacturing method of the electronic component of Claim 1,
Forming the second insulator layer;
Forming the coil conductor on the second insulator layer;
Forming the first insulator layer on the second insulator layer using a mask in which a region other than the region corresponding to the coil conductor is opened;
Forming the laminate using the first insulator layer and the second insulator layer;
Crimping the laminate; and
Having
A method of manufacturing an electronic component characterized by the above.