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WO2010080446A3 - Microcrystalline silicon alloys for thin film and wafer based solar applications - Google Patents

Microcrystalline silicon alloys for thin film and wafer based solar applications Download PDF

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Publication number
WO2010080446A3
WO2010080446A3 PCT/US2009/068305 US2009068305W WO2010080446A3 WO 2010080446 A3 WO2010080446 A3 WO 2010080446A3 US 2009068305 W US2009068305 W US 2009068305W WO 2010080446 A3 WO2010080446 A3 WO 2010080446A3
Authority
WO
WIPO (PCT)
Prior art keywords
thin film
microcrystalline silicon
based solar
layers
wafer based
Prior art date
Application number
PCT/US2009/068305
Other languages
French (fr)
Other versions
WO2010080446A2 (en
Inventor
Shuran Sheng
Yongkee Chae
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to JP2011542409A priority Critical patent/JP2012513125A/en
Priority to CN2009801512659A priority patent/CN102272950A/en
Priority to EP09837898.7A priority patent/EP2359411A4/en
Publication of WO2010080446A2 publication Critical patent/WO2010080446A2/en
Publication of WO2010080446A3 publication Critical patent/WO2010080446A3/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/70Surface textures, e.g. pyramid structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F10/00Individual photovoltaic cells, e.g. solar cells
    • H10F10/10Individual photovoltaic cells, e.g. solar cells having potential barriers
    • H10F10/17Photovoltaic cells having only PIN junction potential barriers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F10/00Individual photovoltaic cells, e.g. solar cells
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F10/00Individual photovoltaic cells, e.g. solar cells
    • H10F10/10Individual photovoltaic cells, e.g. solar cells having potential barriers
    • H10F10/17Photovoltaic cells having only PIN junction potential barriers
    • H10F10/172Photovoltaic cells having only PIN junction potential barriers comprising multiple PIN junctions, e.g. tandem cells
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • H10F71/10Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material
    • H10F71/103Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material including only Group IV materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • H10F71/121The active layers comprising only Group IV materials
    • H10F71/1224The active layers comprising only Group IV materials comprising microcrystalline silicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/40Optical elements or arrangements
    • H10F77/413Optical elements or arrangements directly associated or integrated with the devices, e.g. back reflectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/70Surface textures, e.g. pyramid structures
    • H10F77/703Surface textures, e.g. pyramid structures of the semiconductor bodies, e.g. textured active layers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/545Microcrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/548Amorphous silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Photovoltaic Devices (AREA)

Abstract

A method and apparatus for forming solar cells is provided. Doped crystalline semiconductor alloys including carbon, oxygen, and nitrogen are used as light-trapping enhancement layers and charge collection layers for thin-film solar cells. The semiconductor alloy layers are formed by providing semiconductor source compound and a co-component source compound to a processing chamber and ionizing the gases to deposit a layer on a substrate. The alloy layers provide improved control of refractive index, wide optical bandgap and high conductivity.
PCT/US2009/068305 2008-12-19 2009-12-16 Microcrystalline silicon alloys for thin film and wafer based solar applications WO2010080446A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011542409A JP2012513125A (en) 2008-12-19 2009-12-16 Microcrystalline silicon alloys for thin film and wafer based solar applications
CN2009801512659A CN102272950A (en) 2008-12-19 2009-12-16 Microcrystalline silicon alloys for thin-film and wafer-based solar applications
EP09837898.7A EP2359411A4 (en) 2008-12-19 2009-12-16 MICROCRYSTALLINE SILICON ALLOYS FOR SOLAR APPLICATIONS BASED ON THIN FILMS AND SLICES

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13939008P 2008-12-19 2008-12-19
US61/139,390 2008-12-19

Publications (2)

Publication Number Publication Date
WO2010080446A2 WO2010080446A2 (en) 2010-07-15
WO2010080446A3 true WO2010080446A3 (en) 2010-10-28

Family

ID=42317062

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/068305 WO2010080446A2 (en) 2008-12-19 2009-12-16 Microcrystalline silicon alloys for thin film and wafer based solar applications

Country Status (6)

Country Link
EP (1) EP2359411A4 (en)
JP (1) JP2012513125A (en)
KR (1) KR20110106889A (en)
CN (1) CN102272950A (en)
TW (1) TW201029208A (en)
WO (1) WO2010080446A2 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2426737A1 (en) * 2010-09-03 2012-03-07 Applied Materials, Inc. Thin-film solar fabrication process, deposition method for solar cell precursor layer stack, and solar cell precursor layer stack
EP2439792A1 (en) * 2010-10-05 2012-04-11 Applied Materials, Inc. Thin-film solar cell fabrication process, deposition method for solar cell precursor layer stack, and solar cell precursor layer stack
JP2012114296A (en) * 2010-11-25 2012-06-14 Mitsubishi Electric Corp Thin-film solar cell and method of manufacturing the same
US8088990B1 (en) * 2011-05-27 2012-01-03 Auria Solar Co., Ltd. Color building-integrated photovoltaic (BIPV) panel
TWI473281B (en) * 2011-04-01 2015-02-11 Nexpower Technology Corp Thin film solar cell structure
TW201246588A (en) * 2011-05-06 2012-11-16 Auria Solar Co Ltd Solar cell module and manufacturing method thereof
EP2533318A1 (en) * 2011-06-08 2012-12-12 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Thin film solar cell module and greenhouse provided with the same
DE102011081655A1 (en) * 2011-08-26 2013-02-28 Robert Bosch Gmbh Thin film solar cell
WO2013106439A1 (en) * 2012-01-13 2013-07-18 Applied Materials, Inc. High work-function buffer layers for silicon-based photovoltaic devices
US20150136210A1 (en) * 2012-05-10 2015-05-21 Tel Solar Ag Silicon-based solar cells with improved resistance to light-induced degradation
TWI484076B (en) * 2012-07-20 2015-05-11 Sino American Silicon Prod Inc Improved solar polysilicon wafer fabrication method and solar polysilicon wafer
KR20150078549A (en) * 2013-12-31 2015-07-08 한국과학기술원 Apparatus for manufacturing integrated thin film solar cell
US10192717B2 (en) * 2014-07-21 2019-01-29 Applied Materials, Inc. Conditioning remote plasma source for enhanced performance having repeatable etch and deposition rates
JP2017143103A (en) * 2016-02-08 2017-08-17 本田技研工業株式会社 Power generation battery
CN111640816B (en) * 2020-06-10 2025-07-08 通威太阳能(金堂)有限公司 Heterojunction solar cell, laminated tile assembly and manufacturing method
CN112018207B (en) * 2020-08-14 2023-02-03 隆基绿能科技股份有限公司 Laminated solar cell and preparation method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005045129A (en) * 2003-07-24 2005-02-17 Kaneka Corp Stacked photoelectric converter device and its manufacturing method
JP2008060605A (en) * 2007-11-06 2008-03-13 Kaneka Corp Stacked photoelectric converter
JP2008181965A (en) * 2007-01-23 2008-08-07 Sharp Corp Multilayer photoelectric conversion device and manufacturing method thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7189917B2 (en) * 2003-03-26 2007-03-13 Canon Kabushiki Kaisha Stacked photovoltaic device
JP2009231505A (en) * 2008-03-21 2009-10-08 Sanyo Electric Co Ltd Solar battery

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005045129A (en) * 2003-07-24 2005-02-17 Kaneka Corp Stacked photoelectric converter device and its manufacturing method
JP2008181965A (en) * 2007-01-23 2008-08-07 Sharp Corp Multilayer photoelectric conversion device and manufacturing method thereof
JP2008060605A (en) * 2007-11-06 2008-03-13 Kaneka Corp Stacked photoelectric converter

Also Published As

Publication number Publication date
KR20110106889A (en) 2011-09-29
EP2359411A4 (en) 2013-07-10
TW201029208A (en) 2010-08-01
EP2359411A2 (en) 2011-08-24
CN102272950A (en) 2011-12-07
WO2010080446A2 (en) 2010-07-15
JP2012513125A (en) 2012-06-07

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