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WO2010067834A1 - Microphone unit and voice input device using same - Google Patents

Microphone unit and voice input device using same Download PDF

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Publication number
WO2010067834A1
WO2010067834A1 PCT/JP2009/070654 JP2009070654W WO2010067834A1 WO 2010067834 A1 WO2010067834 A1 WO 2010067834A1 JP 2009070654 W JP2009070654 W JP 2009070654W WO 2010067834 A1 WO2010067834 A1 WO 2010067834A1
Authority
WO
WIPO (PCT)
Prior art keywords
microphone unit
substrate
sound
sound hole
shield cover
Prior art date
Application number
PCT/JP2009/070654
Other languages
French (fr)
Japanese (ja)
Inventor
岳司 猪田
堀邊　隆介
史記 田中
章 船津
道知 澁谷
Original Assignee
船井電機株式会社
ヒロセ電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 船井電機株式会社, ヒロセ電機株式会社 filed Critical 船井電機株式会社
Priority to US13/133,515 priority Critical patent/US8823115B2/en
Priority to EP09831938.7A priority patent/EP2357844A4/en
Priority to CN200980149262.1A priority patent/CN102246536B/en
Publication of WO2010067834A1 publication Critical patent/WO2010067834A1/en

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/32—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only
    • H04R1/34—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by using a single transducer with sound reflecting, diffracting, directing or guiding means
    • H04R1/38—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by using a single transducer with sound reflecting, diffracting, directing or guiding means in which sound waves act upon both sides of a diaphragm and incorporating acoustic phase-shifting means, e.g. pressure-gradient microphone
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Definitions

  • the present invention relates to a microphone unit that converts sound into an electrical signal, and a sound input device including the microphone unit.
  • a microphone unit is applied to a voice input device such as a voice communication device such as a mobile phone or a transceiver, an information processing system using a technique for analyzing input voice such as a voice authentication system, or a recording device.
  • a voice input device such as a voice communication device such as a mobile phone or a transceiver
  • an information processing system using a technique for analyzing input voice such as a voice authentication system, or a recording device.
  • electronic devices have been reduced in size, and a microphone unit that can be reduced in size and thickness has been actively developed.
  • a MEMS (Micro Electro Mechanical System) microphone device manufactured using semiconductor manufacturing technology is known (see, for example, Patent Documents 1 to 3).
  • Patent Documents 1 to 3 a configuration example of a conventional microphone unit will be described.
  • FIG. 13 is a schematic cross-sectional view showing a configuration example of a conventional microphone unit.
  • a conventional microphone unit 100 includes a MEMS chip 101 that converts input sound waves into an electrical signal, a substrate 102 on which the MEMS chip 101 is mounted, a shield case 103 that covers the MEMS chip 101, Is provided.
  • the shield case 103 is formed with a sound hole 103a for inputting sound waves from the outside.
  • the lower end 103 b of the shield case 103 is electrically connected to a ground circuit pattern (not shown) formed on the substrate 102. Thereby, the microphone unit 100 can shield the electromagnetic wave noise by the shield case 103.
  • the above-described conventional microphone unit 100 is reflow-mounted when mounted on the mounting board of the voice input device. For this reason, when the microphone unit 100 is mounted on the mounting substrate, it is exposed to a high temperature exceeding 200 ° C. and then cooled.
  • the microphone unit 100 as described above is generally surface-mounted on a mounting board, but is also exposed to a high temperature exceeding 200 ° C. and then cooled when it is surface-mounted on the mounting board. .
  • the shield case 103 is made of metal, but the substrate 102 is made of non-metal (such as glass epoxy). For this reason, at the time of reflow mounting, stress is easily applied to the MEMS chip 101 due to a large difference in thermal expansion coefficient between the substrate 102 and the shield case 103 bonded thereto. Then, due to this, the characteristics of the MEMS chip 101 change, and the microphone unit 100 after the reflow mounting may have a characteristic defect.
  • an object of the present invention is to provide a microphone unit that can be assembled efficiently. Another object of the present invention is to provide a microphone unit that can reduce the possibility of a characteristic defect occurring when mounted on a mounting board. A further object of the present invention is to provide a voice input device that includes the microphone unit as described above and can be manufactured with high yield.
  • a microphone unit of the present invention is a microphone unit that converts sound into an electric signal based on vibration of a diaphragm, and has a substrate on which the diaphragm is mounted, and a sound hole, A cover member disposed on the substrate so that the diaphragm is accommodated in an internal space formed between the substrate and a holding member that holds at least the substrate among the substrate and the cover member; It is characterized by providing.
  • the microphone unit of this configuration has at least a holding member that holds the substrate.
  • the holding member that holds the substrate is provided as described above, the cover member can be easily attached while the holding member makes the positional relationship between the substrate and the cover member constant. That is, according to this configuration, the assembly operation of the microphone unit can be facilitated, and the work efficiency at the time of assembly can be improved.
  • the holding member can be interposed between the substrate and the shield cover. For this reason, when the microphone unit is reflow-mounted on the mounting board of the audio input device, even if there is a large difference in thermal expansion coefficient between the board (the board of the microphone unit) and the shield cover, the holding member interposed therebetween Can function as a cushioning material to suppress distortion generated in the substrate. That is, it is possible to reduce the possibility of a characteristic failure when the microphone unit is mounted on the voice input device.
  • the holding member has a space formed by a bottom wall and a side wall, and the substrate and the cover member may be accommodated and held in the space. good.
  • the substrate and the cover member can be aligned just by fitting them into the holding member, and the assembly operation of the microphone unit becomes very easy.
  • a groove may be formed in the bottom wall.
  • the sound hole formed in the cover member includes a first sound hole and a second sound hole, and the first sound hole extends from the first sound hole to the first surface of the diaphragm. And a second sound path that extends from the second sound hole through the groove to the second surface that is the back surface of the first surface of the diaphragm. .
  • the diaphragm of the microphone unit vibrates due to the difference in sound pressure generated between the first surface and the second surface of the diaphragm. And if it is such a structure, it will be easy to acquire the electrical signal which shows the user's audio
  • the diaphragm may be included in a MEMS chip, and the MEMS chip may be mounted on the substrate. According to this configuration, the microphone unit can be easily reduced in size and thickness, and can be reflow mounted on the voice input device.
  • the microphone unit configured as described above further includes a conductive shield cover having a sound hole, the sound hole of the cover member and the sound hole of the shield cover overlap, and the holding member fits in the shield cover.
  • the shield cover may be provided.
  • the shield cover and the cover member may be separate members, and the shield cover may be covered from above the cover member, or the shield cover and the cover member may be integrated. It may be molded.
  • the shield cover may be attached at the stage of being mounted on the voice input device, but there may be a case where the one with the shield cover attached is traded as a microphone unit.
  • the present invention includes such a microphone unit.
  • the present invention is characterized in that it is a voice input device including the microphone unit having the above configuration.
  • the present invention provides a voice input device comprising a mounting board on which a microphone unit is mounted and a microphone unit having the above structure, wherein the shield cover is formed on the mounting board. It is characterized by being electrically connected to.
  • the voice input device including the microphone unit having the above-described configuration can manufacture the microphone unit with high work efficiency, the cost required for the voice input device can be reduced. Further, even when the microphone unit with the shield cover is reflow-mounted on the voice input device, the possibility of characteristic failure is low, and the voice input device can be manufactured with a high yield.
  • the present invention it is possible to provide a microphone unit that can be assembled efficiently.
  • Exploded perspective view showing the configuration of the microphone unit of the present embodiment 1 is a schematic cross-sectional view taken along the line AA in FIG. Schematic cross-sectional view at position BB in FIG. Schematic sectional view showing the configuration of a MEMS chip provided in the microphone unit of the present embodiment.
  • FIG. 1 is a schematic perspective view showing the configuration of the microphone unit of the present embodiment.
  • FIG. 2 is an exploded perspective view showing the configuration of the microphone unit of the present embodiment.
  • FIG. 3 is a schematic sectional view taken along the line AA in FIG.
  • FIG. 4 is a schematic sectional view taken along the line BB in FIG.
  • FIG. 5 is a schematic cross-sectional view showing a configuration of a MEMS (Micro Electro Mechanical System) chip included in the microphone unit of the present embodiment.
  • FIG. 6 is a diagram for explaining a circuit configuration of an ASIC (Application Specific Integrated Circuit) included in the microphone unit of the present embodiment.
  • FIG. 7 is a schematic plan view showing the configuration when the top case provided in the microphone unit of the present embodiment is viewed from the back side.
  • the microphone unit 1 of the present embodiment will be described with reference to FIGS.
  • the microphone unit 1 of the present embodiment is disposed so as to cover the substrate 12, the box-shaped bottom case 11, the substrate 12 on which the MEMS chip 14 and the ASIC 15 are mounted.
  • a top case 13 is an embodiment of the holding member of the present invention.
  • the top case 13 is an embodiment of the cover member of the present invention.
  • the bottom case 11 has a substantially rectangular parallelepiped space (recessed space) 113 surrounded by a bottom wall 111 and four side walls 112.
  • the space 113 has a width (length in the X direction) and a depth (length in the Y direction) that are substantially equal to the size of the substrate 12 (size in the X direction and the Y direction).
  • the bottom case 11 is preferably formed of a resin.
  • heat resistance such as LCP (Liquid Crystal Polymer) or PPS (Polyphenylene sulfide). It is more preferable to form with resin having the property.
  • the bottom wall 111 of the bottom case 11 has a groove 114 formed in a substantially rectangular shape in plan view. 2 and 4, a plurality of electrode terminals 115 and 116 are formed on the inner side and the outer side of the bottom wall 111 of the bottom case 11, respectively.
  • These electrode terminals 115 and 116 include an electrode terminal for power supply that supplies power to the microphone unit 1, an electrode terminal for output that outputs an electric signal generated by the microphone unit 1, and an electrode terminal for ground connection. .
  • the bottom case 11 including these electrode terminals 115 and 116 is preferably formed integrally by, for example, insert molding using a lead frame 117 (see FIG. 4) and a resin.
  • Circuit patterns 121 are formed on both upper and lower surfaces of the substrate 12, and the upper and lower circuit patterns are electrically connected by vias (not shown).
  • the circuit pattern on the upper surface is formed so that, for example, connection between the MEMS chip 14 and the ASIC 15, input of power supply power, output of electric signals, and the like are possible.
  • the circuit pattern on the lower surface is provided for electrical connection with the electrode terminal 115 formed on the bottom case 11 in a state where the substrate 12 is accommodated in the bottom case 12.
  • the electronic components (MEMS chip 14 and ASIC 15) mounted on the substrate 12 can be supplied with electric power and output the generated electric signals to the outside.
  • the substrate 12 is formed of an insulating material, and the specific material is not particularly limited.
  • the substrate 12 is made of a glass epoxy substrate, a polyimide substrate, a silicon substrate, a glass substrate, or the like.
  • the linear expansion coefficient of the substrate 12 is preferably close to the linear expansion coefficient of the MEMS chip 14.
  • the linear expansion coefficient of the substrate 12 is preferably about 2.8 ppm / ° C.
  • the substrate 12 has a first opening 122 and a second opening 123 formed therein. These are provided to form a sound path for guiding sound waves from the outside to the diaphragm of the MEMS chip 14. Details regarding the sound path will be described later.
  • the MEMS chip 14 mounted on the substrate 12 will be described with reference to FIG.
  • the MEMS chip 14 includes an insulating base substrate 141, a vibration film 142, an insulating film 143, and a fixed electrode 144, and forms a condenser microphone.
  • the MEMS chip 14 is manufactured using a semiconductor manufacturing technique.
  • the base substrate 141 is formed with an opening 141a having a substantially circular shape in plan view, so that sound waves coming from the lower side of the vibration film 142 reach the vibration film 142.
  • the vibration film 142 formed on the base substrate 141 is a thin film that vibrates (vibrates in the vertical direction) in response to sound waves, has conductivity, and forms one end of the electrode.
  • the fixed electrode 144 is disposed so as to face the vibration film 142 with the insulating film 143 interposed therebetween. Thereby, the vibrating membrane 142 and the fixed electrode 144 form a capacitance. Note that a plurality of sound holes 144 a are formed in the fixed electrode 144 so that sound waves can pass, so that sound waves coming from the upper side of the vibration film 142 reach the vibration film 142.
  • the vibrating membrane 142 is below the fixed electrode 144, but is configured to have an opposite relationship (relationship in which the vibrating membrane is above and the fixed electrode is below). It doesn't matter.
  • the ASIC 15 mounted on the substrate 12 will be described with reference to FIG.
  • the ASIC 15 is an integrated circuit that outputs an electrical signal based on the vibration of the vibration film 142 of the MEMS chip 14.
  • the ASIC 15 of the present embodiment is configured to amplify an electric signal based on a change in capacitance of a capacitor formed by the MEMS chip 14 by a signal amplifying circuit 153 and output it.
  • a charge pump circuit 151 and an operational amplifier 152 are included so that changes in the capacitance of the capacitor (MEMS chip 14) can be accurately obtained.
  • the gain adjustment circuit 154 is included so that the gain (gain) of the signal amplification circuit 153 can be adjusted.
  • the electrical signal amplified by the ASIC 15 is output to an audio processing unit on a mounting board (not shown) on which the microphone unit 1 is mounted and processed.
  • the MEMS chip 14 and the ASIC 15 are both flip-chip mounted on the substrate 12.
  • the MEMS 14 and the ASIC 15 are electrically connected by a wiring pattern 121 formed on the substrate 12.
  • the MEMS chip 14 and the ASIC 15 are flip-chip mounted.
  • the present invention is not limited to this structure, and for example, a structure that uses die bonding or wire bonding may be used.
  • the top case 13 has a substantially rectangular outer shape in a plan view as shown in FIG. 2, and two sound holes 132 and 133 having a substantially elliptical shape in a plan view are formed in the top plate 131. As shown in FIG. 7 (view of the top case 13 from the back side), a substantially rectangular parallelepiped first space part 134 and a substantially elliptical columnar second space part 135 are formed inside the top case 13. Is formed.
  • the width (length in the X direction) and the depth (length in the Y direction) of the top case 13 are substantially equal to the size of the substrate 12 (size in the X direction and the Y direction). That is, the outer shape of the top case 13 is substantially equal to the width and depth of the space 113 of the bottom case 11.
  • the top case 13 is made of resin. Further, assuming that the microphone unit 1 is reflow-mounted on a mounting board (not shown) of an audio input device, for example, LCP (Liquid Crystal Polymer), PPS (Polyphenylene sulfide), etc. More preferably, it is formed of a resin having heat resistance.
  • LCP Liquid Crystal Polymer
  • PPS Polyphenylene sulfide
  • the microphone unit 1 is obtained by fitting the substrate 12 on which the MEMS chip 14 and the ASIC 15 are mounted in the bottom case 11 and then fitting the bottom case 11 so that the top case 13 covers the substrate 12.
  • the electrode terminal 115 of the bottom case 11 and the circuit pattern (electrode terminal) formed on the back surface side of the substrate 12 are electrically bonded by solder bonding or conductive paste.
  • the circuit pattern formed on the upper surface side of the substrate 12 and the circuit pattern formed on the back surface side are electrically connected by a through wiring (not shown) passing through the substrate 12.
  • the substrate 12 and the top case 13 are joined by an adhesive.
  • the bottom case 13 is covered with an upper portion of the side wall so as to cover the gap between the bottom case 11 and the top case 13.
  • the sealing resin 18 is adhered.
  • an epoxy resin or the like is used as the sealing resin.
  • an internal space 134 (with the same reference numerals as the first space portion of the top case 13 described above) is formed between the top case 13 and the substrate 12. Formed). In the internal space 134, the MEMS chip 14 and the ASIC 15 are arranged.
  • the internal space 134 is connected to the external space via the first sound hole 132 formed in the top plate 131 (see FIG. 2) of the top case 13. That is, the sound generated outside the microphone unit 1 reaches the upper surface (first surface) 142a (see FIG. 5) of the vibrating membrane 142 of the MEMS chip 14 through the first sound hole 132 and the internal space 134. It has become. In this sense, it can be said that the internal space 134 and the first sound hole 132 form a sound path (first sound path 16).
  • the first opening 122 is provided so that the second space 135 of the top case 13 and the groove 114 formed in the bottom case 11 communicate with each other when the top case 13 is covered with the substrate 12. Yes.
  • the first opening 122 has the same shape and the same size as the second sound hole 133 of the top case 13. When the top case 13 is placed on the substrate 12, the side surface of the second space 135 and the side surface of the first opening 122 are flush with each other and communicate with the groove 114.
  • the second opening 123 formed in the substrate 12 is formed so that the vibration film 142 of the MEMS chip 14 mounted on the substrate 12 and the groove 114 of the bottom case 11 communicate with each other.
  • the second opening 123 has a size and shape (substantially circular shape in plan view) matched to the vibrating portion of the vibrating membrane 142.
  • the groove 114 of the bottom case 11 has a width (in the X direction) so as to communicate with the first opening 122 and the second opening 123 of the substrate 12 when the substrate 12 is accommodated and held in the bottom case 11. Length; see FIG. 2)). Further, the depth (the length in the Y direction; see FIG. 2) of the groove 114 of the bottom case 11 is formed to be larger than the diameter of the vibration part of the vibration film 142.
  • the sound generated outside the microphone unit 1 passes through the second sound hole 133, the second space 135, the first opening 122, the groove 114, and the second opening 123, and the vibrating membrane 142 included in the MEMS chip 14. It reaches a lower surface (second surface) 142b (see FIG. 5). In this sense, it can be said that the second sound hole 133, the second space 135, the first opening 122, the groove 114, and the second opening 123 form a sound path (second sound path 17).
  • the sound path 16 and the second sound path 17 are formed.
  • the volume of the space forming the first sound path 16 and the second sound path 17 is preferably 30 mm 3 or less, more preferably 10 mm 3 or less (for example, about 7 to 8 mm 3 ).
  • the volume of the space forming the first sound path 16 and the second sound path 17 is formed so that the volume of both is equal with a difference within ⁇ 30%.
  • the first sound hole 132 and the second sound hole 133 are equal to or larger than the area of a circle of ⁇ 0.5 mm, and both are formed in the same shape, and as such, the length of the ellipse in the longitudinal direction (see FIG. 2 in the Y direction) and the length in the short direction (X direction in FIG. 2).
  • the width of the sound path is preferably 0.1 mm or more, and the length in the short direction is preferably 0.1 mm or more.
  • the depth d (see FIG. 3) of the groove 114 provided in the bottom case 11 is preferably 0.1 mm or more.
  • the first sound hole 132 and the second sound hole 133 do not necessarily have a substantially elliptical shape (long hole shape) in a plan view, and the configuration thereof can be changed, and may be, for example, a substantially circular shape.
  • the center distance L between the first sound hole 132 and the second sound hole 133 will be described. If the distance between the first sound hole 132 and the second sound hole 133 is too short, the difference in sound pressure applied to the upper surface 142a and the lower surface 142b of the vibration film 142 becomes small, and the amplitude of the vibration film 142 becomes small and is output from the ASIC 15. The SNR (S / N ratio) of the electrical signal becomes worse. For this reason, the distance between the first sound hole 132 and the second sound hole 132 is preferably large to some extent.
  • the center-to-center distance L between the first sound hole 132 and the second sound hole 133 is preferably 4 mm or more and 6 mm or less, and more preferably about 5 mm.
  • the sound pressure of sound waves (the amplitude of sound waves) is inversely proportional to the distance from the sound source.
  • the sound pressure attenuates rapidly at a position close to the sound source, and gradually decreases as the distance from the sound source increases.
  • the microphone unit 1 when the microphone unit 1 is applied to a close-talking voice input device, the user's voice is generated in the vicinity of the microphone unit 1. Therefore, the user's voice is greatly attenuated between the first sound hole 132 and the second sound hole 133, and the sound pressure incident on the upper surface 142 a of the vibration film 142 and the sound pressure incident on the lower surface 142 b of the vibration film 142. A big difference appears between and.
  • noise components such as background noise exist at a position where the sound source is farther from the microphone unit 1 than the user's voice. Therefore, the sound pressure of noise is hardly attenuated between the first sound hole 132 and the second sound hole 133, and is incident on the lower surface 142b of the vibration film 142 and the sound pressure incident on the upper surface 142a of the vibration film 142. There is almost no difference between sound pressure.
  • the vibrating membrane 142 of the microphone unit 1 vibrates due to a difference in sound pressure between sound waves that are simultaneously incident on the first sound hole 132 and the second sound hole 133.
  • the difference in sound pressure of noise incident on the upper surface 142a and the lower surface 142b of the vibration film 142 is very small, it is canceled out by the vibration film 142.
  • the difference in sound pressure between user sounds incident on the upper surface 142 a and the lower surface 142 b of the vibration film 142 is large, the user sound is not canceled by the vibration film 142 and vibrates the vibration film 142.
  • the microphone unit 1 it can be considered that the vibrating membrane 142 vibrates only by the user's voice. Therefore, the electrical signal output from the ASIC 15 of the microphone unit 1 can be regarded as a signal indicating only the user voice from which noise (background noise or the like) has been removed. That is, according to the microphone unit 1 of the present embodiment, it is possible to acquire an electrical signal indicating only the user voice from which noise has been removed with a simple configuration.
  • the microphone unit 1 of the present embodiment has a configuration in which the bottom case 11 is prepared as an unconventional configuration and the substrate 12 and the top case 13 are accommodated and held in the bottom case 13.
  • the positional relationship between the substrate 12 and the top case 13 can be set to a desired relationship simply by fitting them into the bottom case 11. For this reason, the work efficiency at the time of assembling the microphone unit 1 can be improved.
  • FIG. 8 is a diagram showing a schematic configuration of an embodiment of an audio input device to which the microphone unit of the present embodiment is applied.
  • FIG. 9 is a schematic sectional view taken along the line CC in FIG. With reference to FIG.8 and FIG.9, the structure of the audio
  • the voice input device 2 is a mobile phone will be described as an example, but the voice input device is not limited to a mobile phone.
  • two sound holes 211 and 212 are provided on the lower side of the casing 21 of the voice input device 2, and the user's voice is transmitted through the sound holes 211 and 212 to the inside of the casing 21. Is input to the microphone unit 1 disposed in the position. As shown in FIGS. 8 and 9, the microphone unit 1 disposed in the voice input device 2 is covered with a conductive shield cover 19 for suppressing the influence of electromagnetic noise.
  • the microphone unit in a state in which the shield cover 19 is covered is denoted by reference numeral 1.
  • the shield cover 19 only needs to be formed of a material having an electromagnetic shielding function.
  • a material having an electromagnetic shielding function for example, Kovar (an alloy in which nickel and cobalt are mixed in iron; examples of components are weight%, Ni 29%, Co 17%, Si 0.2). %, Mn 0.3%, Fe 53.5%), 42 alloy (Fe-42% Ni alloy) and the like.
  • the shield cover 19 has a space surrounded by a top plate 191 and four side walls 192 inside. Then, the top case 13 is placed over the top case 13, and the substrate 12 and the bottom case 11 that accommodates and holds the top case 13 are collectively accommodated in a space inside the shield cover 19.
  • the width (length in the left-right direction in FIG. 9) and depth (length in the direction perpendicular to the paper surface in FIG. 9) of the inner space of the shield case 19 are substantially the same as the width and depth of the bottom case 11. It is said that. For this reason, the shield case 19 is held only by fitting the shield case 19 from above the top case 13.
  • the shield case 19 is formed so that the lower end 192 a of the side wall 192 is substantially the same as the lower surface 11 a of the bottom case 11 in a state of being covered with the top case 13.
  • Two sound holes 193 and 194 are formed in the shield cover 19. Specifically, the two sound holes 193 and 194 are formed so as to overlap the two sound holes 132 and 133 formed in the top case 13, respectively. Further, the microphone unit 1 is arranged such that the two sound holes 193 and 194 formed in the shield cover 19 overlap the two sound holes 211 and 212 formed in the housing 21, respectively. For this reason, the sound generated outside the housing 21 passes through the two sound paths 16 and 17 included in the microphone unit 1 so as to reach the upper surface 142a and the lower surface 142b of the vibrating membrane 142 (both refer to FIG. 5). It has become.
  • an elastic body 22 is disposed between the casing 21 and the microphone unit 1.
  • the elastic body 22 has openings 221, so that sound generated outside the housing 21 reaches the upper surface 142 a and the lower surface 142 b of the vibrating membrane 142 through the two sound paths 16, 17 included in the microphone unit 1. 222 is formed.
  • the elastic body 22 is not necessarily provided. However, by arranging the microphone unit 1 in the casing 21 via the elastic body 22, the vibration of the casing 21 is hardly transmitted to the microphone unit 1, and the operation accuracy of the microphone unit 1 can be improved. For this reason, it is preferable to provide the elastic body 22 like this embodiment.
  • the microphone unit 1 arranged in the housing 21 is mounted on a mounting board 23 provided in the housing 21.
  • the mounting board 23 is configured to supply power to the microphone unit 1 and process an electrical signal output from the microphone unit 1.
  • the microphone unit 1 is reflow-mounted (for example, processed at 250 ° C.) on the mounting substrate 23.
  • the electrode terminal 16 (see FIG. 4) formed on the bottom case 11 of the microphone unit 1 and the circuit pattern formed on the mounting substrate 23 are joined by solder bonding or conductive paste, and are electrically connected.
  • the lower end 192a of the side surface of the shield case 19 and the ground (GND) formed on the mounting substrate 23 are soldered and electrically connected. Thereby, the shield cover 19 shields electromagnetic noise.
  • the schematic configuration of the voice input device 2 to which the microphone unit 1 of the present embodiment is applied is as described above. The effects of such a configuration will be described below.
  • each part which comprises the microphone unit 1 expands thermally.
  • the thermal expansion coefficient between the shield cover formed of metal and the substrate formed of nonmetal (substrate on which the MEMS chip is mounted) Therefore, the substrate is distorted and stress is applied to the MEMS chip.
  • the MEMS chip may be damaged by this stress.
  • the substrate 12 is held by the bottom case 11 formed of a resin such as LCP.
  • the shield cover 19 is made of metal and the substrate 12 is made of non-metal, the substrate 12 is less likely to be distorted during reflow mounting.
  • the stress applied to the MEMS chip 14 mounted on the substrate 12 can be reduced during reflow mounting, and the possibility of a characteristic failure occurring during assembly can be reduced. That is, it can be said that the voice input device 2 of the present embodiment can be manufactured with high yield.
  • the top case 13 is formed of a resin such as LCP, and the shield cover 19 is placed thereon to shield the electromagnetic noise.
  • the top case 13 may be formed to include a member having a conductive electromagnetic wave shielding characteristic, and the top case 13 may be electrically connected to the GND formed on the substrate 12. In this case, there is no need to cover the top case 13 with a shield cover 19. Even in this case, it is possible to improve the working efficiency when assembling the microphone unit described above.
  • the shield cover 19 may be integrally formed with the top case 13 as shown in FIG.
  • the top case 13 and the bottom case 11 are joined by holding the side wall of the bottom case 11 by using the metal spring force of the shield cover 19 between the shield cover 19 and the top case 13. can do.
  • the above-described spring force can be adjusted by providing a slit in a part of the side wall of the shield cover 19, and a slit may be appropriately provided in the side wall of the shield cover 19.
  • the diaphragm (vibrating plate) 142 is a micro unit configured to vibrate due to the difference in sound pressure applied to the upper surface 142a and the lower surface 142b is shown.
  • the configuration of the microphone unit to which the present invention is applied is not limited to the configuration of the present embodiment.
  • a microphone unit having a configuration in which a diaphragm (provided in the MEMS chip 14) vibrates with sound pressure applied only to one surface of the diaphragm may be used.
  • the microphone unit 1 includes the bottom case 11.
  • the substrate 12 and the top case 13 are configured to include at least a holding member that holds the substrate 12, the working efficiency at the time of assembly can be improved. For example, a configuration as shown in FIG.
  • a holding member 11 ′ that holds the substrate 12 in between is provided instead of the bottom case 11, a holding member 11 ′ that holds the substrate 12 in between is provided. Even in this case, the top case 13 is guided in the fitting position by the holding member 11 ′, and the top case 13 can be attached without performing troublesome position adjustment. That is, the working efficiency at the time of assembling the microphone unit can be improved as compared with the conventional case. Since the holding member 11 ′ is provided, when the shield cover 19 is put on the top case 13, as shown in FIG. 12, the substrate 12 and the shield cover 19 (GND of the mounting substrate on which the microphone unit is mounted) It is easy to adopt a configuration in which the connection is not connected. And if it is this structure, since the holding member 11 'acts as a buffer material at the time of reflow mounting to the audio
  • the MEMS chip 14 and the ASIC 15 are configured as separate chips.
  • the integrated circuit mounted on the ASIC 15 is formed monolithically on the silicon substrate on which the MEMS chip 14 is formed. It doesn't matter.
  • the microphone chip for converting sound into an electrical signal is the MEMS chip 14 formed by using a semiconductor manufacturing technique.
  • the present invention is limited to the configuration of this embodiment. Not intended.
  • condenser microphone was employ
  • the present invention can also be applied to a microphone unit that employs a configuration other than a condenser microphone.
  • the present invention can also be applied to a microphone unit employing an electrodynamic (dynamic), electromagnetic (magnetic), or piezoelectric microphone.
  • the shape of the microphone unit is not limited to the shape of the present embodiment, and may be changed to various shapes.
  • a voice processing system speech authentication system, voice recognition system, etc.
  • voice communication equipment such as a transceiver and a technique for analyzing inputted voice, in addition to a mobile phone, for example.
  • Command generation system electronic dictionary, translator, voice input type remote controller, etc.
  • recording device amplifier system (loudspeaker), microphone system, and the like.
  • the present invention is suitable for an information processing system, a recording device, and the like using a technique for analyzing input voice such as a voice communication device such as a mobile phone and a transceiver, a voice authentication system, and the like.
  • Microphone unit 2 Audio input device 11 Top case (holding member) 11 'holding member 12 substrate 13 top case (cover member) DESCRIPTION OF SYMBOLS 14 MEMS chip 16 1st sound path 17 2nd sound path 19 Shield cover 23 Mounting board 111 Bottom wall 112 Side wall 113 Space part 114 Groove part 132 1st sound hole 133 2nd sound hole 134 Internal space 142 Vibration membrane (diaphragm) ) 142a Upper surface of vibrating membrane (first surface) 142b Lower surface of vibration membrane (second surface) 193, 194 Sound hole of shield cover

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
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Abstract

A microphone unit (1) converts voice into an electric signal according to vibration of a diaphragm contained in an MEMS chip (14).  The microphone unit (1) includes a substrate (12) on which the diaphragm is mounted (the MEMS chip (14) is mounted); a cover member (13) having sound holes (132, 133) and arranged on the substrate (12) so that the diaphragm is contained in the internal space formed by the cover member (13) and the substrate (12); and a holding member (11) which holds only the substrate (12) or both of the substrate (12) and the cover member (13).

Description

マイクロホンユニット及びそれを備えた音声入力装置Microphone unit and voice input device including the same
　本発明は、音声を電気信号に変換するマイクロホンユニット、及び、マイクロホンユニットを備える音声入力装置に関する。 The present invention relates to a microphone unit that converts sound into an electrical signal, and a sound input device including the microphone unit.
　従来、例えば、携帯電話やトランシーバ等の音声通信機器、又は音声認証システム等の入力された音声を解析する技術を利用した情報処理システム、或いは録音機器、といった音声入力装置にマイクロホンユニットが適用されている。近年においては、電子機器の小型化が進んでおり、小型・薄型化等が可能なマイクロホンユニットの開発が盛んである。 Conventionally, for example, a microphone unit is applied to a voice input device such as a voice communication device such as a mobile phone or a transceiver, an information processing system using a technique for analyzing input voice such as a voice authentication system, or a recording device. Yes. In recent years, electronic devices have been reduced in size, and a microphone unit that can be reduced in size and thickness has been actively developed.
　小型・薄型化が可能なマイクロホンユニットとして、半導体製造技術を用いて作製されるＭＥＭＳ（Micro　Electro　Mechanical　System）マイクロホン装置が知られている（例えば、特許文献１～３参照）。ここで、従来のマイクロホンユニットの構成例について説明する。 As a microphone unit that can be reduced in size and thickness, a MEMS (Micro Electro Mechanical System) microphone device manufactured using semiconductor manufacturing technology is known (see, for example, Patent Documents 1 to 3). Here, a configuration example of a conventional microphone unit will be described.
　図１３は、従来のマイクロホンユニットの構成例を示す概略断面図である。図１３に示すように、従来のマイクロホンユニット１００は、入力された音波を電気信号に変換するＭＥＭＳチップ１０１と、ＭＥＭＳチップ１０１が実装される基板１０２と、ＭＥＭＳチップ１０１を覆うシールドケース１０３と、を備える。シールドケース１０３には外部からの音波を入力するための音孔１０３ａが形成されている。 FIG. 13 is a schematic cross-sectional view showing a configuration example of a conventional microphone unit. As shown in FIG. 13, a conventional microphone unit 100 includes a MEMS chip 101 that converts input sound waves into an electrical signal, a substrate 102 on which the MEMS chip 101 is mounted, a shield case 103 that covers the MEMS chip 101, Is provided. The shield case 103 is formed with a sound hole 103a for inputting sound waves from the outside.
　シールドケース１０３の下端１０３ｂは、基板１０２に形成されるグランド用の回路パターン（図示せず）と電気的に接続されている。これにより、マイクロホンユニット１００は、シールドケース１０３によって電磁波ノイズをシールドできるようになっている。 The lower end 103 b of the shield case 103 is electrically connected to a ground circuit pattern (not shown) formed on the substrate 102. Thereby, the microphone unit 100 can shield the electromagnetic wave noise by the shield case 103.
特開２００７－１５０５１４号公報JP 2007-150514 A 特開２００８－７２５８０号公報JP 2008-72580 A 特開２００８－１９９３５３号公報JP 2008-199353 A
　上述した従来のマイクロホンユニット１００においては、組み立て時に、シールドケース１０３の下端１０３ｂがグランド用の回路パターンに接続されるように位置を調整する必要がある。また、音孔１０３ａとＭＥＭＳチップ１０１との位置関係についても所定の位置関係となるように調整する必要がある。このため、マイクロホンユニット１００を大量に製造しようとすると、このような位置合わせ作業は作業効率を低下させ、問題であった。 In the conventional microphone unit 100 described above, it is necessary to adjust the position so that the lower end 103b of the shield case 103 is connected to the ground circuit pattern during assembly. Moreover, it is necessary to adjust the positional relationship between the sound hole 103a and the MEMS chip 101 so as to be a predetermined positional relationship. For this reason, when trying to manufacture a large number of microphone units 100, such alignment work is problematic because it reduces work efficiency.
　また、上述した従来のマイクロホンユニット１００は、音声入力装置の実装基板に実装される際にリフロー実装される。このため、マイクロホンユニット１００は、実装基板に実装するに際して、２００℃を超える高温下に晒され、その後冷却されるという工程を経ることになる。また、上記のようなマイクロホンユニット１００は、一般的に実装基板に表面実装されるが、実装基板への表面実装時においても、２００℃を超える高温下に晒され、その後冷却されることになる。 Further, the above-described conventional microphone unit 100 is reflow-mounted when mounted on the mounting board of the voice input device. For this reason, when the microphone unit 100 is mounted on the mounting substrate, it is exposed to a high temperature exceeding 200 ° C. and then cooled. In addition, the microphone unit 100 as described above is generally surface-mounted on a mounting board, but is also exposed to a high temperature exceeding 200 ° C. and then cooled when it is surface-mounted on the mounting board. .
　通常、シールドケース１０３は金属で形成されるが、基板１０２は非金属（ガラエポ等）で形成される。このため、リフロー実装時に、基板１０２と、それに接合されるシールドケース１０３と、の間の熱膨張係数の大きな違いが原因となって、ＭＥＭＳチップ１０１に応力が加わり易い。そして、このことが原因となってＭＥＭＳチップ１０１の特性が変化し、リフロー実装後のマイクロホンユニット１００には特性不良が生じることがあった。 Usually, the shield case 103 is made of metal, but the substrate 102 is made of non-metal (such as glass epoxy). For this reason, at the time of reflow mounting, stress is easily applied to the MEMS chip 101 due to a large difference in thermal expansion coefficient between the substrate 102 and the shield case 103 bonded thereto. Then, due to this, the characteristics of the MEMS chip 101 change, and the microphone unit 100 after the reflow mounting may have a characteristic defect.
　そこで、本発明の目的は、作業効率良く組み立てることが可能なマイクロホンユニットを提供することである。また、本発明の他の目的は、実装基板への実装時に特性不良が発生する可能性を低減できるマイクロホンユニットを提供することである。また、本発明の更なる目的は、以上のようなマイクロホンユニットを備え、歩留まり良く製造できる音声入力装置を提供することである。 Therefore, an object of the present invention is to provide a microphone unit that can be assembled efficiently. Another object of the present invention is to provide a microphone unit that can reduce the possibility of a characteristic defect occurring when mounted on a mounting board. A further object of the present invention is to provide a voice input device that includes the microphone unit as described above and can be manufactured with high yield.
　上記目的を達成するために本発明のマイクロホンユニットは、振動板の振動に基づいて音声を電気信号に変換するマイクロホンユニットであって、前記振動板が搭載される基板と、音孔を有し、前記基板と間に形成される内部空間に前記振動板が収まるように前記基板上に配置されるカバー部材と、前記基板と前記カバー部材とのうち、少なくとも前記基板を保持する保持部材と、を備えることを特徴としている。 In order to achieve the above object, a microphone unit of the present invention is a microphone unit that converts sound into an electric signal based on vibration of a diaphragm, and has a substrate on which the diaphragm is mounted, and a sound hole, A cover member disposed on the substrate so that the diaphragm is accommodated in an internal space formed between the substrate and a holding member that holds at least the substrate among the substrate and the cover member; It is characterized by providing.
　本構成のマイクロホンユニットは、少なくとも基板を保持する保持部材を有する。このように基板を保持する保持部材を備える構成とすると、保持部材によって基板とカバー部材との位置関係が一定の位置関係となるようにしつつ、カバー部材を容易に取り付けることが可能である。すなわち、本構成によればマイクロホンユニットの組み立て作業を容易として、組み立て時の作業効率を向上できる。 The microphone unit of this configuration has at least a holding member that holds the substrate. When the holding member that holds the substrate is provided as described above, the cover member can be easily attached while the holding member makes the positional relationship between the substrate and the cover member constant. That is, according to this configuration, the assembly operation of the microphone unit can be facilitated, and the work efficiency at the time of assembly can be improved.
　また、本構成によれば、例えば電磁波ノイズをシールドするためにカバー部材の上からシールドカバーを被せる構成とする場合に、基板とシールドカバーとの間に保持部材が介在する構成とできる。このため、マイクロホンユニットを音声入力装置の実装基板にリフロー実装する場合に、基板（マイクロホンユニットの基板）とシールドカバーとの間に大きな熱膨張係数の差があっても、間に介在する保持部材を緩衝材として機能させて基板に発生する歪みを抑制することが可能である。すなわち、マイクロホンユニットを音声入力装置に実装する場合に特性不良が発生する可能性を低減できる。 Further, according to the present configuration, for example, when the shield cover is put on the cover member in order to shield the electromagnetic wave noise, the holding member can be interposed between the substrate and the shield cover. For this reason, when the microphone unit is reflow-mounted on the mounting board of the audio input device, even if there is a large difference in thermal expansion coefficient between the board (the board of the microphone unit) and the shield cover, the holding member interposed therebetween Can function as a cushioning material to suppress distortion generated in the substrate. That is, it is possible to reduce the possibility of a characteristic failure when the microphone unit is mounted on the voice input device.
　上記構成のマイクロホンユニットの具体的な構成として、前記保持部材は底壁と側壁とで形成される空間部を有し、前記基板と前記カバー部材とが前記空間部に収容保持されることとしても良い。このように構成することにより、基板とカバー部材を保持部材に嵌め込むだけで両者の位置合わせができ、マイクロホンユニットの組み立て作業が非常に容易なものとなる。 As a specific configuration of the microphone unit configured as described above, the holding member has a space formed by a bottom wall and a side wall, and the substrate and the cover member may be accommodated and held in the space. good. With this configuration, the substrate and the cover member can be aligned just by fitting them into the holding member, and the assembly operation of the microphone unit becomes very easy.
　また、上記構成のマイクロホンユニットにおいて、前記底壁に溝部が形成されることとしても良い。更に具体的には、前記カバー部材に形成される前記音孔は、第１音孔と第２音孔とから成り、前記第１音孔から前記振動板の第１の面へと至る第１の音道と、前記第２音孔から前記溝部を経て前記振動板の前記第１の面の裏面である第２の面へと至る第２の音道と、が形成されることとしても良い。 Further, in the microphone unit having the above configuration, a groove may be formed in the bottom wall. More specifically, the sound hole formed in the cover member includes a first sound hole and a second sound hole, and the first sound hole extends from the first sound hole to the first surface of the diaphragm. And a second sound path that extends from the second sound hole through the groove to the second surface that is the back surface of the first surface of the diaphragm. .
　このように構成とすることにより、マイクロホンユニットの振動板は、振動板の第１の面と第２の面との間に発生する音圧の差によって振動することになる。そして、このような構成とすると、背景雑音が除去されたユーザの音声を示す電気信号を取得し易く、高性能のマイクロホンユニットを提供可能である。 With this configuration, the diaphragm of the microphone unit vibrates due to the difference in sound pressure generated between the first surface and the second surface of the diaphragm. And if it is such a structure, it will be easy to acquire the electrical signal which shows the user's audio | voice from which the background noise was removed, and a high performance microphone unit can be provided.
　また、上記構成のマイクロホンユニットにおいて、前記振動板はＭＥＭＳチップに含まれ、前記ＭＥＭＳチップが前記基板に搭載されることとしても良い。本構成によれば、マイクロホンユニットの小型・薄型化が図りやすく、また、音声入力装置にリフロー実装可能である。 In the microphone unit having the above-described configuration, the diaphragm may be included in a MEMS chip, and the MEMS chip may be mounted on the substrate. According to this configuration, the microphone unit can be easily reduced in size and thickness, and can be reflow mounted on the voice input device.
　また、上記構成のマイクロホンユニットにおいて、音孔を有する導電性のシールドカバーを更に備え、前記カバー部材の音孔と前記シールドカバーの音孔とが重なると共に、前記保持部材が前記シールドカバー内に収まるように前記シールドカバーが設けられていることとしてもよい。この構成においては、前記シールドカバーと前記カバー部材とが別部材であって、前記シールドカバーが前記カバー部材の上から被せられていることとしてもよいし、前記シールドカバーと前記カバー部材とが一体成型されていることとしてもよい。シールドカバーは音声入力装置に実装される段階で取り付けてもよいが、シールドカバーを取り付けたものをマイクロホンユニットとして取引する場合もある。本発明には、このようなマイクロホンユニットも含む趣旨である。 The microphone unit configured as described above further includes a conductive shield cover having a sound hole, the sound hole of the cover member and the sound hole of the shield cover overlap, and the holding member fits in the shield cover. As described above, the shield cover may be provided. In this configuration, the shield cover and the cover member may be separate members, and the shield cover may be covered from above the cover member, or the shield cover and the cover member may be integrated. It may be molded. The shield cover may be attached at the stage of being mounted on the voice input device, but there may be a case where the one with the shield cover attached is traded as a microphone unit. The present invention includes such a microphone unit.
　また、上記目的を達成するために本発明は、上記構成のマイクロホンユニットを備える音声入力装置であることを特徴としている。 Further, in order to achieve the above object, the present invention is characterized in that it is a voice input device including the microphone unit having the above configuration.
　また、上記目的を達成するために本発明は、マイクロホンユニットを実装する実装基板と、上記構成のマイクロホンユニットと、を備える音声入力装置であって、前記シールドカバーが前記実装基板に形成されるグランドと電気的に接続されることを特徴としている。 In order to achieve the above object, the present invention provides a voice input device comprising a mounting board on which a microphone unit is mounted and a microphone unit having the above structure, wherein the shield cover is formed on the mounting board. It is characterized by being electrically connected to.
　以上のように、上記構成のマイクロホンユニットを備える音声入力装置は、マイクロホンユニットを作業効率良く製造できるために、音声入力装置に要するコストを低減可能である。また、シールドカバーが被せられたマイクロホンユニットを音声入力装置にリフロー実装する場合でも特性不良が発生する可能性が低く、音声入力装置を歩留まり良く製造できる。 As described above, since the voice input device including the microphone unit having the above-described configuration can manufacture the microphone unit with high work efficiency, the cost required for the voice input device can be reduced. Further, even when the microphone unit with the shield cover is reflow-mounted on the voice input device, the possibility of characteristic failure is low, and the voice input device can be manufactured with a high yield.
　本発明によれば、作業効率良く組み立てることが可能なマイクロホンユニットを提供できる。また、本発明によれば、実装基板への実装時に特性不良が発生する可能性を低減したマイクロホンユニットを提供できる。また、本発明によれば、以上のようなマイクロホンユニットを備え、歩留まり良く製造できる音声入力装置を提供できる。 According to the present invention, it is possible to provide a microphone unit that can be assembled efficiently. In addition, according to the present invention, it is possible to provide a microphone unit that reduces the possibility of a characteristic defect occurring when mounted on a mounting board. Further, according to the present invention, it is possible to provide a voice input device that includes the microphone unit as described above and can be manufactured with a high yield.
本実施形態のマイクロホンユニットの構成を示す概略斜視図The schematic perspective view which shows the structure of the microphone unit of this embodiment. 本実施形態のマイクロホンユニットの構成を示す分解斜視図Exploded perspective view showing the configuration of the microphone unit of the present embodiment 図１におけるＡ－Ａ位置の概略断面図1 is a schematic cross-sectional view taken along the line AA in FIG. 図２におけるＢ－Ｂ位置の概略断面図Schematic cross-sectional view at position BB in FIG. 本実施形態のマイクロホンユニットが備えるＭＥＭＳチップの構成を示す概略断面図Schematic sectional view showing the configuration of a MEMS chip provided in the microphone unit of the present embodiment 本実施形態のマイクロホンユニットが備えるＡＳＩＣの回路構成を説明するための図The figure for demonstrating the circuit structure of ASIC with which the microphone unit of this embodiment is provided. 本実施形態のマイクロホンユニットが備えるトップケースを裏面側から見た場合の構成を示す概略平面図The schematic plan view which shows the structure at the time of seeing the top case with which the microphone unit of this embodiment is provided from the back side. 本実施形態のマイクロホンユニットが適用される音声入力装置の実施形態の概略構成を示す図The figure which shows schematic structure of embodiment of the audio | voice input apparatus with which the microphone unit of this embodiment is applied. 図８のＣ－Ｃ位置における概略断面図Schematic cross-sectional view at the CC position in FIG. 本発明が適用されるマイクロホンユニットの別形態を説明するための概略断面図Schematic sectional view for explaining another embodiment of the microphone unit to which the present invention is applied 本発明が適用されるマイクロホンユニットの別形態を説明するための概略断面図Schematic sectional view for explaining another embodiment of the microphone unit to which the present invention is applied 本発明が適用されるマイクロホンユニットの別形態を説明するための概略断面図Schematic sectional view for explaining another embodiment of the microphone unit to which the present invention is applied 従来のマイクロホンユニットの構成例を示す概略断面図Schematic sectional view showing a configuration example of a conventional microphone unit
　以下、本発明を適用したマイクロホンユニット及び音声入力装置の実施形態について、図面を参照しながら詳細に説明する。 Hereinafter, embodiments of a microphone unit and a voice input device to which the present invention is applied will be described in detail with reference to the drawings.
（マイクロホンユニット）
　図１は、本実施形態のマイクロホンユニットの構成を示す概略斜視図である。図２は、本実施形態のマイクロホンユニットの構成を示す分解斜視図である。図３は、図１におけるＡ－Ａ位置の概略断面図である。図４は、図２におけるＢ－Ｂ位置の概略断面図である。図５は、本実施形態のマイクロホンユニットが備えるＭＥＭＳ（Micro　Electro　Mechanical　System）チップの構成を示す概略断面図である。図６は、本実施形態のマイクロホンユニットが備えるＡＳＩＣ（Application　Specific　Integrated　Circuit）の回路構成を説明するための図である。図７は、本実施形態のマイクロホンユニットが備えるトップケースを裏面側から見た場合の構成を示す概略平面図である。以下、図１～図７を参照しながら本実施形態のマイクロホンユニット１について説明する。 (Microphone unit)
FIG. 1 is a schematic perspective view showing the configuration of the microphone unit of the present embodiment. FIG. 2 is an exploded perspective view showing the configuration of the microphone unit of the present embodiment. FIG. 3 is a schematic sectional view taken along the line AA in FIG. FIG. 4 is a schematic sectional view taken along the line BB in FIG. FIG. 5 is a schematic cross-sectional view showing a configuration of a MEMS (Micro Electro Mechanical System) chip included in the microphone unit of the present embodiment. FIG. 6 is a diagram for explaining a circuit configuration of an ASIC (Application Specific Integrated Circuit) included in the microphone unit of the present embodiment. FIG. 7 is a schematic plan view showing the configuration when the top case provided in the microphone unit of the present embodiment is viewed from the back side. Hereinafter, the microphone unit 1 of the present embodiment will be described with reference to FIGS.
　図１及び図２に示すように、本実施形態のマイクロホンユニット１は、箱状のボトムケース１１と、ＭＥＭＳチップ１４とＡＳＩＣ１５とが搭載される基板１２と、基板１２を覆うように配置されるトップケース１３と、から成る。なお、ボトムケース１１は、本発明の保持部材の実施形態である。また、トップケース１３は、本発明のカバー部材の実施形態である。 As shown in FIGS. 1 and 2, the microphone unit 1 of the present embodiment is disposed so as to cover the substrate 12, the box-shaped bottom case 11, the substrate 12 on which the MEMS chip 14 and the ASIC 15 are mounted. A top case 13. The bottom case 11 is an embodiment of the holding member of the present invention. The top case 13 is an embodiment of the cover member of the present invention.
　図２に示すように、ボトムケース１１は、底壁１１１と４つの側壁１１２とに囲まれた略直方体状の空間部（凹部空間）１１３を有する。空間部１１３の幅（Ｘ方向の長さ）と奥行き（Ｙ方向の長さ）は、基板１２のサイズ（Ｘ方向及びＹ方向のサイズ）とほぼ等しく形成されている。ボトムケース１１は樹脂で形成するのが好ましい。また、マイクロホンユニット１を音声入力装置の実装基板（図示せず）にリフロー実装する場合を想定して、例えばＬＣＰ（Liquid　Crystal　Polymer；液晶ポリマ）やＰＰＳ（Polyphenylene sulfide；ポリフェニレンスルファイド）等の耐熱性を有する樹脂で形成するのがより好ましい。 As shown in FIG. 2, the bottom case 11 has a substantially rectangular parallelepiped space (recessed space) 113 surrounded by a bottom wall 111 and four side walls 112. The space 113 has a width (length in the X direction) and a depth (length in the Y direction) that are substantially equal to the size of the substrate 12 (size in the X direction and the Y direction). The bottom case 11 is preferably formed of a resin. Further, assuming that the microphone unit 1 is reflow-mounted on a mounting board (not shown) of an audio input device, for example, heat resistance such as LCP (Liquid Crystal Polymer) or PPS (Polyphenylene sulfide). It is more preferable to form with resin having the property.
　ボトムケース１１の底壁１１１には、平面視略矩形状に形成される溝部１１４が形成されている。また、図２及び図４に示すように、ボトムケース１１の底壁１１１の内部側と外部側には、各々電極端子１１５、１１６が複数形成されている。これらの電極端子１１５、１１６には、マイクロホンユニット１に電力を供給する電源用の電極端子、マイクロホンユニット１で発生した電気信号を出力する出力用の電極端子、グランド接続用の電極端子が含まれる。 The bottom wall 111 of the bottom case 11 has a groove 114 formed in a substantially rectangular shape in plan view. 2 and 4, a plurality of electrode terminals 115 and 116 are formed on the inner side and the outer side of the bottom wall 111 of the bottom case 11, respectively. These electrode terminals 115 and 116 include an electrode terminal for power supply that supplies power to the microphone unit 1, an electrode terminal for output that outputs an electric signal generated by the microphone unit 1, and an electrode terminal for ground connection. .
　なお、これらの電極端子１１５、１１６を含むボトムケース１１は、リードフレーム１１７（図４参照）と樹脂とを用いて、例えばインサート成形により一体的に形成するのが好ましい。 The bottom case 11 including these electrode terminals 115 and 116 is preferably formed integrally by, for example, insert molding using a lead frame 117 (see FIG. 4) and a resin.
　基板１２の上下両面には回路パターン１２１が形成され、上下の回路パターンは図示しないビアによって電気的に接続される。上面の回路パターンは、例えばＭＥＭＳチップ１４とＡＳＩＣ１５との接続や、電源電力の入力、電気信号の出力等が可能となるように形成されている。下面の回路パターンは、基板１２がボトムケース１２に収容された状態で、ボトムケース１１に形成される電極端子１１５と電気的に接続するために設けられる。これにより、基板１２に搭載される電子部品（ＭＥＭＳチップ１４やＡＳＩＣ１５）は、電力の供給を受けたり、発生した電気信号を外部に出力したりすることが可能となっている。 Circuit patterns 121 are formed on both upper and lower surfaces of the substrate 12, and the upper and lower circuit patterns are electrically connected by vias (not shown). The circuit pattern on the upper surface is formed so that, for example, connection between the MEMS chip 14 and the ASIC 15, input of power supply power, output of electric signals, and the like are possible. The circuit pattern on the lower surface is provided for electrical connection with the electrode terminal 115 formed on the bottom case 11 in a state where the substrate 12 is accommodated in the bottom case 12. As a result, the electronic components (MEMS chip 14 and ASIC 15) mounted on the substrate 12 can be supplied with electric power and output the generated electric signals to the outside.
　なお、基板１２は絶縁性の材質で形成され、具体的な材質は特に限定されるものではないが、例えば、ガラスエポキシ基板、ポリイミド基板、シリコン基板、ガラス基板等から成る。ここで、基板１２の線膨張係数は、ＭＥＭＳチップ１４の線膨張係数に近いのが好ましい。ＭＥＭＳチップ１４がシリコンで形成される場合は、基板１２の線膨張係数は２．８ｐｐｍ／℃程度であることが好ましい。これにより、リフロー時の加熱冷却によるＭＥＭＳチップ１４への残留応力の発生を低減することができる。 The substrate 12 is formed of an insulating material, and the specific material is not particularly limited. For example, the substrate 12 is made of a glass epoxy substrate, a polyimide substrate, a silicon substrate, a glass substrate, or the like. Here, the linear expansion coefficient of the substrate 12 is preferably close to the linear expansion coefficient of the MEMS chip 14. When the MEMS chip 14 is formed of silicon, the linear expansion coefficient of the substrate 12 is preferably about 2.8 ppm / ° C. Thereby, generation | occurrence | production of the residual stress to the MEMS chip | tip 14 by the heating / cooling at the time of reflow can be reduced.
　また、図２及び図３に示すように、基板１２には第１の開口１２２と第２の開口１２３とが形成されている。これらは、外部からの音波をＭＥＭＳチップ１４が有する振動板へと導くための音道を形成するために設けられるものである。音道に関する詳細は後述する。 Further, as shown in FIGS. 2 and 3, the substrate 12 has a first opening 122 and a second opening 123 formed therein. These are provided to form a sound path for guiding sound waves from the outside to the diaphragm of the MEMS chip 14. Details regarding the sound path will be described later.
　基板１２に搭載されるＭＥＭＳチップ１４について図５を参照して説明する。ＭＥＭＳチップ１４は、絶縁性のベース基板１４１と、振動膜１４２と、絶縁膜１４３と、固定電極１４４と、を有し、コンデンサ型のマイクロホンを形成している。なお、このＭＥＭＳチップ１４は半導体製造技術を用いて製造される。 The MEMS chip 14 mounted on the substrate 12 will be described with reference to FIG. The MEMS chip 14 includes an insulating base substrate 141, a vibration film 142, an insulating film 143, and a fixed electrode 144, and forms a condenser microphone. The MEMS chip 14 is manufactured using a semiconductor manufacturing technique.
　ベース基板１４１には平面視略円形状の開口１４１ａが形成され、これにより振動膜１４２の下部側から来る音波は振動膜１４２に到達するようになっている。ベース基板１４１の上に形成される振動膜１４２は、音波を受けて振動（上下方向に振動）する薄膜で、導電性を有し、電極の一端を形成している。 The base substrate 141 is formed with an opening 141a having a substantially circular shape in plan view, so that sound waves coming from the lower side of the vibration film 142 reach the vibration film 142. The vibration film 142 formed on the base substrate 141 is a thin film that vibrates (vibrates in the vertical direction) in response to sound waves, has conductivity, and forms one end of the electrode.
　固定電極１４４は、絶縁膜１４３を挟んで振動膜１４２と対向するように配置されている。これにより、振動膜１４２と固定電極１４４とは容量を形成する。なお、固定電極１４４には音波が通過できるように複数の音孔１４４ａが形成されており、振動膜１４２の上部側から来る音波が振動膜１４２に到達するようになっている。 The fixed electrode 144 is disposed so as to face the vibration film 142 with the insulating film 143 interposed therebetween. Thereby, the vibrating membrane 142 and the fixed electrode 144 form a capacitance. Note that a plurality of sound holes 144 a are formed in the fixed electrode 144 so that sound waves can pass, so that sound waves coming from the upper side of the vibration film 142 reach the vibration film 142.
　このようなＭＥＭＳチップ１４においては、ＭＥＭＳチップ１４に音波が入射すると、振動膜１４２の上面１４２ａに音圧ｐｆ、下面１４２ｂに音圧ｐｂが各々加わる。その結果、音圧ｐｆと音圧ｐｂとの差に応じて振動膜１４２が振動して振動膜１４２と固定電極１４４との間隔Ｇｐが変化し、振動膜１４２と固定電極１４４との間の静電容量が変化する。すなわち、コンデンサ型のマイクロホンとして機能するＭＥＭＳチップ１４によって、入射した音波を電気信号として取り出せるようになっている。 In such a MEMS chip 14, when sound waves are incident on the MEMS chip 14, the sound pressure pf is applied to the upper surface 142a of the vibration film 142, and the sound pressure pb is applied to the lower surface 142b. As a result, the vibrating membrane 142 vibrates according to the difference between the sound pressure pf and the sound pressure pb, and the gap Gp between the vibrating membrane 142 and the fixed electrode 144 changes, and the static between the vibrating membrane 142 and the fixed electrode 144 is changed. The capacitance changes. That is, the incident sound wave can be extracted as an electric signal by the MEMS chip 14 functioning as a condenser microphone.
　なお、本実施形態では振動膜１４２の方が固定電極１４４よりも下となっているが、これとは逆の関係（振動膜が上で、固定電極が下となる関係）となるように構成しても構わない。 In the present embodiment, the vibrating membrane 142 is below the fixed electrode 144, but is configured to have an opposite relationship (relationship in which the vibrating membrane is above and the fixed electrode is below). It doesn't matter.
　基板１２に搭載されるＡＳＩＣ１５について図６を参照して説明する。ＡＳＩＣ１５は、ＭＥＭＳチップ１４の振動膜１４２の振動に基づいて電気信号を出力する集積回路である。本実施形態のＡＳＩＣ１５は、ＭＥＭＳチップ１４によって形成されるコンデンサの容量の変化に基づく電気信号を信号増幅回路１５３で増幅して出力するように構成されている。また、コンデンサ（ＭＥＭＳチップ１４）の静電容量の変化を精密に取得できるように、チャージポンプ回路１５１とオペアンプ１５２とを含む構成としている。また、信号増幅回路１５３の増幅率（ゲイン）を調整できるようにゲイン調整回路１５４を含む構成としている。ＡＳＩＣ１５で増幅処理された電気信号は、例えばマイクロホンユニット１が実装される図示しない実装基板の音声処理部に出力されて処理される。 The ASIC 15 mounted on the substrate 12 will be described with reference to FIG. The ASIC 15 is an integrated circuit that outputs an electrical signal based on the vibration of the vibration film 142 of the MEMS chip 14. The ASIC 15 of the present embodiment is configured to amplify an electric signal based on a change in capacitance of a capacitor formed by the MEMS chip 14 by a signal amplifying circuit 153 and output it. In addition, a charge pump circuit 151 and an operational amplifier 152 are included so that changes in the capacitance of the capacitor (MEMS chip 14) can be accurately obtained. In addition, the gain adjustment circuit 154 is included so that the gain (gain) of the signal amplification circuit 153 can be adjusted. The electrical signal amplified by the ASIC 15 is output to an audio processing unit on a mounting board (not shown) on which the microphone unit 1 is mounted and processed.
　なお、本実施形態においては、ＭＥＭＳチップ１４及びＡＳＩＣ１５は、いずれも基板１２にフリップチップ実装される。そして、ＭＥＭＳ１４とＡＳＩＣ１５とは基板１２に形成される配線パターン１２１によって電気的に接続されている。なお、本実施形態においては、ＭＥＭＳチップ１４及びＡＳＩＣ１５をフリップチップ実装する構成としているがこの構成に限られる趣旨ではなく、例えばダイボンディング及びワイヤボンディングを用いて実装する構成等としても構わない。 In the present embodiment, the MEMS chip 14 and the ASIC 15 are both flip-chip mounted on the substrate 12. The MEMS 14 and the ASIC 15 are electrically connected by a wiring pattern 121 formed on the substrate 12. In the present embodiment, the MEMS chip 14 and the ASIC 15 are flip-chip mounted. However, the present invention is not limited to this structure, and for example, a structure that uses die bonding or wire bonding may be used.
　トップケース１３は、図２に示すように平面視略矩形状の外形をしており、その天板１３１には平面視略楕円形状の２つの音孔１３２、１３３が形成されている。図７（トップケース１３を裏側から見た図）に示すように、トップケース１３の内部側には、略直方体状の第１空間部１３４と、略楕円柱形状の第２空間部１３５とが形成されている。 The top case 13 has a substantially rectangular outer shape in a plan view as shown in FIG. 2, and two sound holes 132 and 133 having a substantially elliptical shape in a plan view are formed in the top plate 131. As shown in FIG. 7 (view of the top case 13 from the back side), a substantially rectangular parallelepiped first space part 134 and a substantially elliptical columnar second space part 135 are formed inside the top case 13. Is formed.
　なお、トップケース１３の幅（Ｘ方向の長さ）と奥行き（Ｙ方向の長さ）とは基板１２のサイズ（Ｘ方向及びＹ方向のサイズ）とほぼ等しく形成されている。すなわち、トップケース１３の外形は、ボトムケース１１の空間部１１３の幅及び奥行きとほぼ等しくなっている。 Note that the width (length in the X direction) and the depth (length in the Y direction) of the top case 13 are substantially equal to the size of the substrate 12 (size in the X direction and the Y direction). That is, the outer shape of the top case 13 is substantially equal to the width and depth of the space 113 of the bottom case 11.
　また、トップケース１３は樹脂で形成するのが好ましい。更には、マイクロホンユニット１を音声入力装置の実装基板（図示せず）にリフロー実装する場合を想定して、例えばＬＣＰ（Liquid　Crystal　Polymer；液晶ポリマ）やＰＰＳ（Polyphenylene　sulfide；ポリフェニレンスルファイド）等の耐熱性を有する樹脂で形成するのがより好ましい。 Moreover, it is preferable that the top case 13 is made of resin. Further, assuming that the microphone unit 1 is reflow-mounted on a mounting board (not shown) of an audio input device, for example, LCP (Liquid Crystal Polymer), PPS (Polyphenylene sulfide), etc. More preferably, it is formed of a resin having heat resistance.
　ボトムケース１１に、ＭＥＭＳチップ１４及びＡＳＩＣ１５が搭載された基板１２を嵌め込み、次いで、トップケース１３を基板１２に被せるようにボトムケース１１に嵌め込むとマイクロホンユニット１が得られる。 The microphone unit 1 is obtained by fitting the substrate 12 on which the MEMS chip 14 and the ASIC 15 are mounted in the bottom case 11 and then fitting the bottom case 11 so that the top case 13 covers the substrate 12.
　なお、本実施形態においては、ボトムケース１１の電極端子１１５と基板１２の裏面側に形成される回路パターン（電極端子）とは半田接合もしくは導電ペースト等により電気接合されている。基板１２の上面側に形成される回路パターンと裏面側に形成される回路パターンとは基板１２の中を通る貫通配線（図示せず）により電気的に接続されている。また、基板１２とトップケース１３とは接着剤によって接合されている。更に、マイクロホンユニット１における音漏れを防止するために、ボトムケース１１にトップケース１３を嵌め込んだ後、ボトムケース１１とトップケース１３の間の隙間を覆うように、ボトムケース１３の側壁上部には図１に示すように封止樹脂１８が接着される。封止樹脂としては、例えばエポキシ系の樹脂等が使用される。 In the present embodiment, the electrode terminal 115 of the bottom case 11 and the circuit pattern (electrode terminal) formed on the back surface side of the substrate 12 are electrically bonded by solder bonding or conductive paste. The circuit pattern formed on the upper surface side of the substrate 12 and the circuit pattern formed on the back surface side are electrically connected by a through wiring (not shown) passing through the substrate 12. Further, the substrate 12 and the top case 13 are joined by an adhesive. Furthermore, in order to prevent sound leakage in the microphone unit 1, after the top case 13 is fitted into the bottom case 11, the bottom case 13 is covered with an upper portion of the side wall so as to cover the gap between the bottom case 11 and the top case 13. As shown in FIG. 1, the sealing resin 18 is adhered. For example, an epoxy resin or the like is used as the sealing resin.
　次に、主に図３を参照して、本実施形態のマイクロホンユニット１の構成について更に詳しく説明する。図３に示すように、基板１２上にトップケース１３が載置されることによって、トップケース１３と基板１２との間に内部空間１３４（上述のトップケース１３の第１空間部と同じ符号としている）が形成される。そして、この内部空間１３４には、ＭＥＭＳチップ１４とＡＳＩＣ１５とが配置されている。 Next, the configuration of the microphone unit 1 of this embodiment will be described in more detail with reference mainly to FIG. As shown in FIG. 3, by placing the top case 13 on the substrate 12, an internal space 134 (with the same reference numerals as the first space portion of the top case 13 described above) is formed between the top case 13 and the substrate 12. Formed). In the internal space 134, the MEMS chip 14 and the ASIC 15 are arranged.
　内部空間１３４は、トップケース１３の天板１３１（図２参照）に形成される第１音孔１３２を介して外部空間とつながっている。すなわち、マイクロホンユニット１の外部で発生した音声は、第１音孔１３２及び内部空間１３４を経てＭＥＭＳチップ１４が有する振動膜１４２の上面（第１の面）１４２ａ（図５参照）に到達するようになっている。この意味で、内部空間１３４と第１音孔１３２とは音道（第１の音道１６）を形成していると言える。 The internal space 134 is connected to the external space via the first sound hole 132 formed in the top plate 131 (see FIG. 2) of the top case 13. That is, the sound generated outside the microphone unit 1 reaches the upper surface (first surface) 142a (see FIG. 5) of the vibrating membrane 142 of the MEMS chip 14 through the first sound hole 132 and the internal space 134. It has become. In this sense, it can be said that the internal space 134 and the first sound hole 132 form a sound path (first sound path 16).
　上述のように、基板１２には２つの開口１２２、１２３が形成される。このうち、第１の開口１２２は、トップケース１３を基板１２に被せた場合に、トップケース１３の第２空間部１３５とボトムケース１１に形成される溝部１１４とが連通するように設けられている。第１の開口１２２は、トップケース１３の第２音孔１３３と同一形状、同一サイズとされている。そして、トップケース１３が基板１２に被せられた場合に、第２空間部１３５の側面と、第１の開口１２２の側面とが面一となって溝部１１４へと連通するようになっている。 As described above, two openings 122 and 123 are formed in the substrate 12. Among these, the first opening 122 is provided so that the second space 135 of the top case 13 and the groove 114 formed in the bottom case 11 communicate with each other when the top case 13 is covered with the substrate 12. Yes. The first opening 122 has the same shape and the same size as the second sound hole 133 of the top case 13. When the top case 13 is placed on the substrate 12, the side surface of the second space 135 and the side surface of the first opening 122 are flush with each other and communicate with the groove 114.
　基板１２に形成される第２の開口１２３は、基板１２上に実装されるＭＥＭＳチップ１４の振動膜１４２と、ボトムケース１１の溝部１１４とが連通するように形成されている。第２の開口１２３は、振動膜１４２の振動部分に合わせたサイズ及び形状（平面視略円形状）とされている。 The second opening 123 formed in the substrate 12 is formed so that the vibration film 142 of the MEMS chip 14 mounted on the substrate 12 and the groove 114 of the bottom case 11 communicate with each other. The second opening 123 has a size and shape (substantially circular shape in plan view) matched to the vibrating portion of the vibrating membrane 142.
　なお、ボトムケース１１の溝部１１４は、基板１２がボトムケース１１に収容保持された時点で、基板１２の第１の開口１２２及び第２の開口１２３と連通するように、その幅（Ｘ方向の長さ；図２参照））が決められている。また、ボトムケース１１の溝部１１４の奥行き（Ｙ方向の長さ；図２参照）は、振動膜１４２の振動部分の直径よりも大きくなるように形成されている。 The groove 114 of the bottom case 11 has a width (in the X direction) so as to communicate with the first opening 122 and the second opening 123 of the substrate 12 when the substrate 12 is accommodated and held in the bottom case 11. Length; see FIG. 2)). Further, the depth (the length in the Y direction; see FIG. 2) of the groove 114 of the bottom case 11 is formed to be larger than the diameter of the vibration part of the vibration film 142.
　以上より、マイクロホンユニット１の外部で発生した音声は、第２音孔１３３、第２空間部１３５、第１の開口１２２、溝部１１４及び第２の開口１２３を経てＭＥＭＳチップ１４が有する振動膜１４２の下面（第２の面）１４２ｂ（図５参照）に到達するようになっている。この意味で、第２音孔１３３、第２空間部１３５、第１の開口１２２、溝部１１４及び第２の開口１２３は、音道（第２の音道１７）を形成していると言える。 As described above, the sound generated outside the microphone unit 1 passes through the second sound hole 133, the second space 135, the first opening 122, the groove 114, and the second opening 123, and the vibrating membrane 142 included in the MEMS chip 14. It reaches a lower surface (second surface) 142b (see FIG. 5). In this sense, it can be said that the second sound hole 133, the second space 135, the first opening 122, the groove 114, and the second opening 123 form a sound path (second sound path 17).
　なお、音波が第１音孔１３２から振動膜１４２の上面１４２ａへと至る時間と、音波が第２音孔１３３から振動膜１４２の下面１４２ｂへと至る時間と、が同じとなるように第１の音道１６と第２の音道１７とは形成されている。第１の音道１６と第２の音道１７とを形成する空間の容積は３０ｍｍ3以下が好ましく、更には１０ｍｍ3以下（例えば７～８ｍｍ3程度）が好ましい。また、第１の音道１６と第２の音道１７とを形成する空間の容積は、両者の容積が±３０％以内の差で等しくなるように形成されることが好ましい。 Note that the time required for the sound wave to travel from the first sound hole 132 to the upper surface 142a of the vibrating membrane 142 is the same as the time required for the sound wave to travel from the second sound hole 133 to the lower surface 142b of the vibrating membrane 142. The sound path 16 and the second sound path 17 are formed. The volume of the space forming the first sound path 16 and the second sound path 17 is preferably 30 mm 3 or less, more preferably 10 mm 3 or less (for example, about 7 to 8 mm 3 ). Moreover, it is preferable that the volume of the space forming the first sound path 16 and the second sound path 17 is formed so that the volume of both is equal with a difference within ± 30%.
　また、第１音孔１３２及び第２音孔１３３はφ０．５ｍｍの円の面積以上で、かつ、両者は同一形状で形成されることが好ましく、そのように楕円の長手方向の長さ（図２のＹ方向）と短手方向の長さ（図２のＸ方向）が決められている。音響特性の劣化を防止するために、音道の幅は０．１ｍｍ以上とするのが好ましく、前述の短手方向の長さは０．１ｍｍ以上とするのが好ましい。なお、同様の意味で、ボトムケース１１に設ける溝部１１４の深さｄ（図３参照）は０．１ｍｍ以上とするのが好ましい。 Further, it is preferable that the first sound hole 132 and the second sound hole 133 are equal to or larger than the area of a circle of φ0.5 mm, and both are formed in the same shape, and as such, the length of the ellipse in the longitudinal direction (see FIG. 2 in the Y direction) and the length in the short direction (X direction in FIG. 2). In order to prevent deterioration of the acoustic characteristics, the width of the sound path is preferably 0.1 mm or more, and the length in the short direction is preferably 0.1 mm or more. In the same sense, the depth d (see FIG. 3) of the groove 114 provided in the bottom case 11 is preferably 0.1 mm or more.
　ところで、第１音孔１３２及び第２音孔１３３は必ずしも平面視略楕円形状（長孔形状）である必要はなく、その構成は変更可能であり、例えば略円形状等としても構わない。ただし、本実施例のように長軸が、第１音孔１３２及び第２音孔１３３の並び方向に対して垂直となるような長孔形状とした方がマイクロホンユニット１のサイズを小型化しやすく、音響特性的にも有利であるために、長孔形状とするのが好ましい。 Incidentally, the first sound hole 132 and the second sound hole 133 do not necessarily have a substantially elliptical shape (long hole shape) in a plan view, and the configuration thereof can be changed, and may be, for example, a substantially circular shape. However, it is easier to reduce the size of the microphone unit 1 when the long axis has a long axis perpendicular to the arrangement direction of the first sound hole 132 and the second sound hole 133 as in this embodiment. Since it is advantageous in terms of acoustic characteristics, a long hole shape is preferable.
　第１音孔１３２と第２音孔１３３との中心間距離Ｌについて述べておく。第１音孔１３２と第２音孔１３３との距離が近すぎると振動膜１４２の上面１４２ａと下面１４２ｂに加わる音圧の差が小さくなって振動膜１４２の振幅が小さくなり、ＡＳＩＣ１５から出力される電気信号のＳＮＲ（Ｓ／Ｎ比）が悪くなる。このため、第１音孔１３２と第２音孔１３２との間の距離はある程度大きいのが好ましい。一方で、第１音孔１３２と第２音孔１３３との中心間距離Ｌが大きく成りすぎると、音源から発せられた音波が、第１音孔１３２及び第２音孔１３３を通って振動膜１４２に到達するまでの時間差すなわち位相差が大きくなり、雑音除去性能が低下してしまう。このため、第１音孔１３２と第２音孔１３３との中心間距離Ｌは、４ｍｍ以上６ｍｍ以下とするのが好ましく、更には５ｍｍ程度が好ましい。 The center distance L between the first sound hole 132 and the second sound hole 133 will be described. If the distance between the first sound hole 132 and the second sound hole 133 is too short, the difference in sound pressure applied to the upper surface 142a and the lower surface 142b of the vibration film 142 becomes small, and the amplitude of the vibration film 142 becomes small and is output from the ASIC 15. The SNR (S / N ratio) of the electrical signal becomes worse. For this reason, the distance between the first sound hole 132 and the second sound hole 132 is preferably large to some extent. On the other hand, if the distance L between the centers of the first sound hole 132 and the second sound hole 133 becomes too large, the sound wave emitted from the sound source passes through the first sound hole 132 and the second sound hole 133, and the vibrating membrane. The time difference until reaching 142, that is, the phase difference increases, and the noise removal performance decreases. For this reason, the center-to-center distance L between the first sound hole 132 and the second sound hole 133 is preferably 4 mm or more and 6 mm or less, and more preferably about 5 mm.
　次に、マイクロホンユニット１の動作について説明する。動作の説明に先立って音波の性質について述べておく。音波の音圧（音波の振幅）は、音源からの距離に反比例する。そして、音圧は、音源に近い位置では急激に減衰し、音源から離れる程、なだらかに減衰する。 Next, the operation of the microphone unit 1 will be described. Prior to the description of the operation, the properties of sound waves will be described. The sound pressure of sound waves (the amplitude of sound waves) is inversely proportional to the distance from the sound source. The sound pressure attenuates rapidly at a position close to the sound source, and gradually decreases as the distance from the sound source increases.
　例えば、マイクロホンユニット１を接話型の音声入力装置に適用する場合、ユーザの音声はマイクロホンユニット１の近傍で発生する。そのため、ユーザの音声は、第１音孔１３２と第２音孔１３３との間で大きく減衰し、振動膜１４２の上面１４２ａに入射する音圧と、振動膜１４２の下面１４２ｂに入射する音圧との間には、大きな差が現れる。 For example, when the microphone unit 1 is applied to a close-talking voice input device, the user's voice is generated in the vicinity of the microphone unit 1. Therefore, the user's voice is greatly attenuated between the first sound hole 132 and the second sound hole 133, and the sound pressure incident on the upper surface 142 a of the vibration film 142 and the sound pressure incident on the lower surface 142 b of the vibration film 142. A big difference appears between and.
　一方、背景雑音等の雑音成分は、ユーザの音声に比べて音源がマイクロホンユニット１から遠い位置に存在する。そのため、雑音の音圧は、第１音孔１３２と第２音孔１３３との間でほとんど減衰せず、振動膜１４２の上面１４２ａに入射する音圧と、振動膜１４２の下面１４２ｂに入射する音圧との間には、ほとんど差が現れない。 On the other hand, noise components such as background noise exist at a position where the sound source is farther from the microphone unit 1 than the user's voice. Therefore, the sound pressure of noise is hardly attenuated between the first sound hole 132 and the second sound hole 133, and is incident on the lower surface 142b of the vibration film 142 and the sound pressure incident on the upper surface 142a of the vibration film 142. There is almost no difference between sound pressure.
　マイクロホンユニット１の振動膜１４２は、第１音孔１３２と第２音孔１３３に同時に入射する音波の音圧差によって振動する。上述のように、振動膜１４２の上面１４２ａと下面１４２ｂに入射する雑音の音圧の差は非常に小さいために、振動膜１４２で打ち消される。これに対して、振動膜１４２の上面１４２ａと下面１４２ｂに入射するユーザ音声の音圧の差は大きいために、ユーザ音声は振動膜１４２で打ち消されずに振動膜１４２を振動させる。 The vibrating membrane 142 of the microphone unit 1 vibrates due to a difference in sound pressure between sound waves that are simultaneously incident on the first sound hole 132 and the second sound hole 133. As described above, since the difference in sound pressure of noise incident on the upper surface 142a and the lower surface 142b of the vibration film 142 is very small, it is canceled out by the vibration film 142. On the other hand, since the difference in sound pressure between user sounds incident on the upper surface 142 a and the lower surface 142 b of the vibration film 142 is large, the user sound is not canceled by the vibration film 142 and vibrates the vibration film 142.
　このことから、マイクロホンユニット１によると、振動膜１４２はユーザの音声のみによって振動しているとみなすことができる。そのため、マイクロホンユニット１のＡＳＩＣ１５から出力される電気信号は、雑音（背景雑音等）が除去された、ユーザ音声のみを示す信号とみなすことができる。すなわち、本実施形態のマイクロホンユニット１によると、簡易な構成で、雑音が除去されたユーザ音声のみを示す電気信号を取得することが可能である。 From this, according to the microphone unit 1, it can be considered that the vibrating membrane 142 vibrates only by the user's voice. Therefore, the electrical signal output from the ASIC 15 of the microphone unit 1 can be regarded as a signal indicating only the user voice from which noise (background noise or the like) has been removed. That is, according to the microphone unit 1 of the present embodiment, it is possible to acquire an electrical signal indicating only the user voice from which noise has been removed with a simple configuration.
　以上に示したように、本実施形態のマイクロホンユニット１は、従来にない構成としてボトムケース１１を用意して、基板１２とトップケース１３をボトムケース１３に収容保持する構成となっている。この構成の場合、基板１２とトップケース１３をボトムケース１１に嵌め込むだけで両者の位置関係を所望の関係とすることができる。このため、マイクロホンユニット１を組み立てる際の作業効率を向上できる。 As described above, the microphone unit 1 of the present embodiment has a configuration in which the bottom case 11 is prepared as an unconventional configuration and the substrate 12 and the top case 13 are accommodated and held in the bottom case 13. In the case of this configuration, the positional relationship between the substrate 12 and the top case 13 can be set to a desired relationship simply by fitting them into the bottom case 11. For this reason, the work efficiency at the time of assembling the microphone unit 1 can be improved.
（音声入力装置）
　図８は、本実施形態のマイクロホンユニットが適用される音声入力装置の実施形態の概略構成を示す図である。図９は、図８のＣ－Ｃ位置における概略断面図である。図８及び図９を参照して、マイクロホンユニット１が適用される音声入力装置２の構成について説明する。ここでは、音声入力装置２が携帯電話である場合を例に説明するが、音声入力装置が携帯電話に限られないのは勿論である。 (Voice input device)
FIG. 8 is a diagram showing a schematic configuration of an embodiment of an audio input device to which the microphone unit of the present embodiment is applied. FIG. 9 is a schematic sectional view taken along the line CC in FIG. With reference to FIG.8 and FIG.9, the structure of the audio | voice input apparatus 2 with which the microphone unit 1 is applied is demonstrated. Here, a case where the voice input device 2 is a mobile phone will be described as an example, but the voice input device is not limited to a mobile phone.
　図８に示すように、音声入力装置２の筐体２１の下部側には２つの音孔２１１、２１２が設けられており、この音孔２１１、２１２を介してユーザの音声が筐体２１内部に配置されるマイクロホンユニット１に入力されるようになっている。音声入力装置２に配置されるマイクロホンユニット１は、図８及び図９に示されるように、電磁波ノイズによる影響を抑制するための導電性のシールドカバー１９が被された状態となっている。ここでは、シールドカバー１９が被せられた状態のマイクロホンユニットを符号１で示している。 As shown in FIG. 8, two sound holes 211 and 212 are provided on the lower side of the casing 21 of the voice input device 2, and the user's voice is transmitted through the sound holes 211 and 212 to the inside of the casing 21. Is input to the microphone unit 1 disposed in the position. As shown in FIGS. 8 and 9, the microphone unit 1 disposed in the voice input device 2 is covered with a conductive shield cover 19 for suppressing the influence of electromagnetic noise. Here, the microphone unit in a state in which the shield cover 19 is covered is denoted by reference numeral 1.
　なお、シールドカバー１９は電磁的シールド機能を有する材料で形成されれば良く、例えば、コバール（鉄にニッケル、コバルトを配合した合金；成分例は重量％で、Ｎｉ２９％、Ｃｏ１７％、Ｓｉ０．２％、Ｍｎ０．３％、Ｆｅ５３．５％）、４２アロイ（Ｆｅ－４２％Ｎｉ合金）などの金属材料で形成される。 The shield cover 19 only needs to be formed of a material having an electromagnetic shielding function. For example, Kovar (an alloy in which nickel and cobalt are mixed in iron; examples of components are weight%, Ni 29%, Co 17%, Si 0.2). %, Mn 0.3%, Fe 53.5%), 42 alloy (Fe-42% Ni alloy) and the like.
　シールドカバー１９は、天板１９１と４つの側壁１９２で囲まれた空間を内側に有する。そして、トップケース１３の上から被せられて、基板１２及びトップケース１３を収容保持するボトムケース１１ごとまとめてシールドカバー１９内側の空間に収容している。本実施形態では、シールドケース１９の内側空間の幅（図９の左右方向の長さ）と奥行き（図９の紙面と垂直な方向の長さ）は、ボトムケース１１の幅と奥行きと略同一とされている。このため、シールドケース１９をトップケース１３の上から嵌め込むだけでシールドケース１９は保持されるようになっている。また、シールドケース１９は、トップケース１３に被せられた状態で側壁１９２の下端１９２ａがボトムケース１１の下面１１ａと略同一となるように形成されている。 The shield cover 19 has a space surrounded by a top plate 191 and four side walls 192 inside. Then, the top case 13 is placed over the top case 13, and the substrate 12 and the bottom case 11 that accommodates and holds the top case 13 are collectively accommodated in a space inside the shield cover 19. In the present embodiment, the width (length in the left-right direction in FIG. 9) and depth (length in the direction perpendicular to the paper surface in FIG. 9) of the inner space of the shield case 19 are substantially the same as the width and depth of the bottom case 11. It is said that. For this reason, the shield case 19 is held only by fitting the shield case 19 from above the top case 13. The shield case 19 is formed so that the lower end 192 a of the side wall 192 is substantially the same as the lower surface 11 a of the bottom case 11 in a state of being covered with the top case 13.
　シールドカバー１９には、２つの音孔１９３、１９４が形成されている。詳細には、この２つの音孔１９３、１９４はそれぞれトップケース１３に形成される２つの音孔１３２、１３３と重なるように形成されている。また、マイクロホンユニット１は、シールドカバー１９に形成される２つの音孔１９３、１９４が、それぞれ筐体２１に形成される２つの音孔２１１、２１２と重なるように配置されている。このため、筐体２１の外部で発生した音声が、マイクロホンユニット１が備える２つの音道１６、１７を通って振動膜１４２の上面１４２ａ及び下面１４２ｂ（いずれも図５参照）に到達するようになっている。 Two sound holes 193 and 194 are formed in the shield cover 19. Specifically, the two sound holes 193 and 194 are formed so as to overlap the two sound holes 132 and 133 formed in the top case 13, respectively. Further, the microphone unit 1 is arranged such that the two sound holes 193 and 194 formed in the shield cover 19 overlap the two sound holes 211 and 212 formed in the housing 21, respectively. For this reason, the sound generated outside the housing 21 passes through the two sound paths 16 and 17 included in the microphone unit 1 so as to reach the upper surface 142a and the lower surface 142b of the vibrating membrane 142 (both refer to FIG. 5). It has become.
　なお、本実施形態の音声入力装置２においては、筐体２１とマイクロホンユニット１との間には弾性体２２が配置されている。弾性体２２には、筐体２１の外部で発生した音声が、マイクロホンユニット１が備える２つの音道１６、１７を通って振動膜１４２の上面１４２ａ及び下面１４２ｂに到達するように、開口２２１、２２２が形成されている。この弾性体２２は必ずしも設ける必要はない。しかし、弾性体２２を介してマイクロホンユニット１を筐体２１に配置することにより、筐体２１の振動がマイクロホンユニット１に伝わり難くなって、マイクロホンユニット１の動作精度を高められる。このため、本実施形態のように弾性体２２を設けるのが好ましい。 In the voice input device 2 of this embodiment, an elastic body 22 is disposed between the casing 21 and the microphone unit 1. The elastic body 22 has openings 221, so that sound generated outside the housing 21 reaches the upper surface 142 a and the lower surface 142 b of the vibrating membrane 142 through the two sound paths 16, 17 included in the microphone unit 1. 222 is formed. The elastic body 22 is not necessarily provided. However, by arranging the microphone unit 1 in the casing 21 via the elastic body 22, the vibration of the casing 21 is hardly transmitted to the microphone unit 1, and the operation accuracy of the microphone unit 1 can be improved. For this reason, it is preferable to provide the elastic body 22 like this embodiment.
　図９に示すように、筐体２１内に配置されるマイクロホンユニット１は、筐体２１内に設けられる実装基板２３に実装される。実装基板２３は、マイクロホンユニット１に電力を供給したり、マイクロホンユニット１から出力される電気信号を処理したりするように構成されている。 As shown in FIG. 9, the microphone unit 1 arranged in the housing 21 is mounted on a mounting board 23 provided in the housing 21. The mounting board 23 is configured to supply power to the microphone unit 1 and process an electrical signal output from the microphone unit 1.
　マイクロホンユニット１は、実装基板２３にリフロー実装（例えば２５０℃等で処理）される。これにより、マイクロホンユニット１のボトムケース１１に形成される電極端子１６（図４参照）と実装基板２３に形成される回路パターンとは半田接合もしくは導電性ペースト等により接合されて、電気的に接続されている。また、シールドケース１９の側面下端１９２ａと実装基板２３に形成されるグランド（ＧＮＤ）とは半田接合されて、電気的に接続されている。これにより、シールドカバー１９は電磁波ノイズをシールドする。 The microphone unit 1 is reflow-mounted (for example, processed at 250 ° C.) on the mounting substrate 23. As a result, the electrode terminal 16 (see FIG. 4) formed on the bottom case 11 of the microphone unit 1 and the circuit pattern formed on the mounting substrate 23 are joined by solder bonding or conductive paste, and are electrically connected. Has been. The lower end 192a of the side surface of the shield case 19 and the ground (GND) formed on the mounting substrate 23 are soldered and electrically connected. Thereby, the shield cover 19 shields electromagnetic noise.
　本実施形態のマイクロホンユニット１が適用される音声入力装置２の概略構成は以上のようであるが、以下、このような構成とすることによる効果を説明する。 The schematic configuration of the voice input device 2 to which the microphone unit 1 of the present embodiment is applied is as described above. The effects of such a configuration will be described below.
　マイクロホンユニット１を実装基板２３に実装する場合、上述のように高温（例えば２００～２５０℃程度）でリフロー実装する。このような高温で処理する場合、マイクロホンユニット１を構成する各部は熱膨張する。この点、上述のように、従来のマイクロホンユニット１００（図１３参照）においては、金属で形成されるシールドカバーと非金属で形成される基板（ＭＥＭＳチップが実装される基板）との熱膨張係数が大きく異なるために、基板に歪みが生じてＭＥＭＳチップに応力が加わる場合があった。そして、この応力によってＭＥＭＳチップが破損する場合があった。 When the microphone unit 1 is mounted on the mounting board 23, reflow mounting is performed at a high temperature (for example, about 200 to 250 ° C.) as described above. When processing at such high temperature, each part which comprises the microphone unit 1 expands thermally. In this regard, as described above, in the conventional microphone unit 100 (see FIG. 13), the thermal expansion coefficient between the shield cover formed of metal and the substrate formed of nonmetal (substrate on which the MEMS chip is mounted). Therefore, the substrate is distorted and stress is applied to the MEMS chip. The MEMS chip may be damaged by this stress.
　しかしながら、本実施形態のマイクロホンユニット１では、基板１２が例えばＬＣＰ等の樹脂で形成されるボトムケース１１で保持されている。この場合、ボトムケース１１が緩衝材として機能して、シールドカバー１９が金属、基板１２が非金属で形成されているにもかかわらず、リフロー実装時に基板１２に歪みが生じにくくなる。このため、本実施形態の音声入力装置２では、リフロー実装時に、基板１２に実装されるＭＥＭＳチップ１４に加わる応力を低減でき、組み立て時に特性不良が発生する可能性を低減できる。すなわち、本実施形態の音声入力装置２は歩留まり良く製造できると言える。 However, in the microphone unit 1 of the present embodiment, the substrate 12 is held by the bottom case 11 formed of a resin such as LCP. In this case, even though the bottom case 11 functions as a buffer material, the shield cover 19 is made of metal and the substrate 12 is made of non-metal, the substrate 12 is less likely to be distorted during reflow mounting. For this reason, in the voice input device 2 of the present embodiment, the stress applied to the MEMS chip 14 mounted on the substrate 12 can be reduced during reflow mounting, and the possibility of a characteristic failure occurring during assembly can be reduced. That is, it can be said that the voice input device 2 of the present embodiment can be manufactured with high yield.
（その他）
　以上に示した実施形態は一例であり、本発明のマイクロホンユニット及び音声入力装置は以上に示した実施形態の構成に限定されるものではない。本発明の目的を逸脱しない範囲で、以上に示した実施形態の構成について種々の変更を行っても構わない。 (Other)
The embodiment described above is an example, and the microphone unit and the audio input device of the present invention are not limited to the configuration of the embodiment described above. Various modifications may be made to the configuration of the embodiment described above without departing from the object of the present invention.
　例えば、以上に示した実施形態では、トップケース１３をＬＣＰ等の樹脂で形成し、その上からシールドカバー１９を被せて電磁波ノイズをシールドする構成とした。しかし、この構成に限定されない。トップケース１３を導電性の電磁波シールド特性を有する部材を含んで形成し、トップケース１３を基板１２に形成されるＧＮＤと電気的に接続する構成としても良い。この場合、トップケース１３の上から更にシールドカバー１９を被せる必要がない。そして、この場合でも、上述したマイクロホンユニットの組み立て時の作業効率を向上できるという効果を得られる。 For example, in the above-described embodiment, the top case 13 is formed of a resin such as LCP, and the shield cover 19 is placed thereon to shield the electromagnetic noise. However, it is not limited to this configuration. The top case 13 may be formed to include a member having a conductive electromagnetic wave shielding characteristic, and the top case 13 may be electrically connected to the GND formed on the substrate 12. In this case, there is no need to cover the top case 13 with a shield cover 19. Even in this case, it is possible to improve the working efficiency when assembling the microphone unit described above.
　しかし、この構成の場合には、音声入力装置の実装基板にマイクロホンユニットを実装する場合にＭＥＭＳチップに応力が加わって特性不良が生じる可能性が高くなる。このため、本実施形態のように、トップケース１３とは別にシールドカバー１９を設けて、基板１２とシールドカバー１９とが直接接続されない（両者が離れている）構成とするのが好ましい。 However, in the case of this configuration, when the microphone unit is mounted on the mounting board of the voice input device, there is a high possibility that the MEMS chip is stressed and a characteristic defect is caused. For this reason, as in this embodiment, it is preferable to provide a shield cover 19 separately from the top case 13 so that the substrate 12 and the shield cover 19 are not directly connected (both are separated).
　また、他の構成として、図１０に示すように、シールドカバー１９をトップケース１３と一体成型しても構わない。これにより、組み立て時の作業効率の向上、及び、音声入力装置への実装時における特性不良の発生確率低減といった上述のメリットを維持しつつ、全体の部品点数を減らして製造工程の簡略化を図ることも可能になる。また、この構成では、シールドカバー１９とトップケース１３とで、ボトムケース１１の側壁をシールドカバー１９の金属バネ力を利用して挟み込んで保持することにより、トップケース１３とボトムケース１１とを接合することができる。なお、シールドカバー１９の側壁の一部にスリットを設けることで、前述のバネ力の調整が可能であり、シールドカバー１９の側壁に適宜スリットを設けてもよい。 As another configuration, the shield cover 19 may be integrally formed with the top case 13 as shown in FIG. As a result, while maintaining the above-described advantages such as improvement in work efficiency during assembly and reduction in the probability of occurrence of characteristic defects when mounted on a voice input device, the number of parts is reduced and the manufacturing process is simplified. It becomes possible. Further, in this configuration, the top case 13 and the bottom case 11 are joined by holding the side wall of the bottom case 11 by using the metal spring force of the shield cover 19 between the shield cover 19 and the top case 13. can do. The above-described spring force can be adjusted by providing a slit in a part of the side wall of the shield cover 19, and a slit may be appropriately provided in the side wall of the shield cover 19.
　また、以上に示した実施形態では、振動膜（振動板）１４２が、その上面１４２ａと下面１４２ｂとに加わる音圧の差で振動する構成のマイクロユニットである場合を示した。しかし、本発明が適用されるマイクロホンユニットの構成は、本実施形態の構成に限定されない。例えば、図１１に示すように、振動板（ＭＥＭＳチップ１４に備えられる）が振動板の片面にのみ加わる音圧で振動する構成のマイクロホンユニットであっても構わない。この構成の場合には、ボトムケース１１に、本実施形態のような溝部１１４を設ける必要がなく、音道も１つで良い。 Further, in the embodiment described above, the case where the diaphragm (vibrating plate) 142 is a micro unit configured to vibrate due to the difference in sound pressure applied to the upper surface 142a and the lower surface 142b is shown. However, the configuration of the microphone unit to which the present invention is applied is not limited to the configuration of the present embodiment. For example, as shown in FIG. 11, a microphone unit having a configuration in which a diaphragm (provided in the MEMS chip 14) vibrates with sound pressure applied only to one surface of the diaphragm may be used. In the case of this configuration, it is not necessary to provide the groove 114 in the bottom case 11 as in the present embodiment, and only one sound path is required.
　また、以上に示した実施形態では、マイクロホンユニット１がボトムケース１１を備える構成とした。しかし、基板１２とトップケース１３のうち、少なくとも基板１２を保持する保持部材を備える構成とすれば、組み立て時の作業効率を向上でき、例えば図１２に示すような構成等としても構わない。 In the embodiment described above, the microphone unit 1 includes the bottom case 11. However, if the substrate 12 and the top case 13 are configured to include at least a holding member that holds the substrate 12, the working efficiency at the time of assembly can be improved. For example, a configuration as shown in FIG.
　図１２では、ボトムケース１１の代わりに基板１２を挟み込んで保持する保持部材１１´を設ける構成としている。この場合でも、トップケース１３は保持部材１１´によって嵌め込み位置をガイドされ、面倒な位置調整を行うことなくトップケース１３の取り付けができる。すなわち、マイクロホンユニットの組み立て時の作業効率を従来に比べて向上できる。そして、保持部材１１´を設けているために、シールドカバー１９をトップケース１３の上から被せる場合に、図１２に示すように基板１２とシールドカバー１９（マイクロホンユニットが実装される実装基板のＧＮＤと接続される）とが接続されない構成とし易い。そして、この構成であれば、マイクロホンユニットの音声入力装置へのリフロー実装時において、保持部材１１´が緩衝材として作用するために、ＭＥＭＳチップ１４の特性不良が生じる可能性を低減できる。 In FIG. 12, instead of the bottom case 11, a holding member 11 ′ that holds the substrate 12 in between is provided. Even in this case, the top case 13 is guided in the fitting position by the holding member 11 ′, and the top case 13 can be attached without performing troublesome position adjustment. That is, the working efficiency at the time of assembling the microphone unit can be improved as compared with the conventional case. Since the holding member 11 ′ is provided, when the shield cover 19 is put on the top case 13, as shown in FIG. 12, the substrate 12 and the shield cover 19 (GND of the mounting substrate on which the microphone unit is mounted) It is easy to adopt a configuration in which the connection is not connected. And if it is this structure, since the holding member 11 'acts as a buffer material at the time of reflow mounting to the audio | voice input apparatus of a microphone unit, possibility that the characteristic defect of the MEMS chip 14 will arise can be reduced.
　また、以上に示した実施形態では、ＭＥＭＳチップ１４とＡＳＩＣ１５とは別チップで構成したが、ＡＳＩＣ１５に搭載される集積回路はＭＥＭＳチップ１４を形成するシリコン基板上にモノリシックで形成するものであっても構わない。 In the embodiment described above, the MEMS chip 14 and the ASIC 15 are configured as separate chips. However, the integrated circuit mounted on the ASIC 15 is formed monolithically on the silicon substrate on which the MEMS chip 14 is formed. It doesn't matter.
　また、以上に示した実施形態では、音声を電気信号に変換するためのマイクロホンチップが、半導体製造技術を利用して形成されるＭＥＭＳチップ１４である構成としたが、本実施形態の構成に限定される趣旨ではない。また、以上の実施形態では、マイクロホンユニット１が備えるマイクロホンチップ（本実施形態のＭＥＭＳチップ１４が該当）の構成として、いわゆるコンデンサ型マイクロホンを採用した。しかし、本発明はコンデンサ型マイクロホン以外の構成を採用したマイクロホンユニットにも適用できる。例えば、動電型（ダイナミック型）、電磁型（マグネティック型）、圧電型等のマイクロホン等が採用されたマイクロホンユニットにも本発明は適用できる。 In the embodiment described above, the microphone chip for converting sound into an electrical signal is the MEMS chip 14 formed by using a semiconductor manufacturing technique. However, the present invention is limited to the configuration of this embodiment. Not intended. Moreover, in the above embodiment, what was called a capacitor | condenser microphone was employ | adopted as a structure of the microphone chip (the MEMS chip 14 of this embodiment corresponds) with which the microphone unit 1 is provided. However, the present invention can also be applied to a microphone unit that employs a configuration other than a condenser microphone. For example, the present invention can also be applied to a microphone unit employing an electrodynamic (dynamic), electromagnetic (magnetic), or piezoelectric microphone.
　その他、マイクロホンユニットの形状は本実施形態の形状に限定される趣旨ではなく、種々の形状に変更可能性あるのは勿論である。また、本発明が適用される音声入力装置として、携帯電話以外に、例えば、トランシーバ等の音声通信機器や、入力された音声を解析する技術を採用した音声処理システム（音声認証システム、音声認識システム、コマンド生成システム、電子辞書、翻訳機、音声入力方式のリモートコントローラ等）、或いは録音機器やアンプシステム（拡声器）、マイクシステムなどが挙げられる。 Other than that, the shape of the microphone unit is not limited to the shape of the present embodiment, and may be changed to various shapes. Moreover, as a voice input device to which the present invention is applied, a voice processing system (speech authentication system, voice recognition system, etc.) adopting voice communication equipment such as a transceiver and a technique for analyzing inputted voice, in addition to a mobile phone, for example. Command generation system, electronic dictionary, translator, voice input type remote controller, etc.), recording device, amplifier system (loudspeaker), microphone system, and the like.
　本発明は、例えば携帯電話やトランシーバ等の音声通信機器、音声認証システム等の入力された音声を解析する技術を利用した情報処理システム、録音機器等に好適である。 The present invention is suitable for an information processing system, a recording device, and the like using a technique for analyzing input voice such as a voice communication device such as a mobile phone and a transceiver, a voice authentication system, and the like.
　　　１　マイクロホンユニット
　　　２　音声入力装置
　　　１１　トップケース（保持部材）
　　　１１´　保持部材
　　　１２　基板
　　　１３　トップケース（カバー部材）
　　　１４　ＭＥＭＳチップ
　　　１６　第１の音道
　　　１７　第２の音道
　　　１９　シールドカバー
　　　２３　実装基板
　　　１１１　底壁
　　　１１２　側壁
　　　１１３　空間部
　　　１１４　溝部
　　　１３２　第１音孔
　　　１３３　第２音孔
　　　１３４　内部空間
　　　１４２　振動膜（振動板）
　　　１４２ａ　振動膜の上面（第１の面）
　　　１４２ｂ　振動膜の下面（第２の面）
　　　１９３、１９４　シールドカバーの音孔 1 Microphone unit 2 Audio input device 11 Top case (holding member)
11 'holding member 12 substrate 13 top case (cover member)
DESCRIPTION OF SYMBOLS 14 MEMS chip 16 1st sound path 17 2nd sound path 19 Shield cover 23 Mounting board 111 Bottom wall 112 Side wall 113 Space part 114 Groove part 132 1st sound hole 133 2nd sound hole 134 Internal space 142 Vibration membrane (diaphragm) )
142a Upper surface of vibrating membrane (first surface)
142b Lower surface of vibration membrane (second surface)
193, 194 Sound hole of shield cover

Claims (10)

  1. 　振動板の振動に基づいて音声を電気信号に変換するマイクロホンユニットであって、
    　前記振動板が搭載される基板と、
    　音孔を有し、前記基板と間に形成される内部空間に前記振動板が収まるように前記基板上に配置されるカバー部材と、
    　前記基板と前記カバー部材とのうち、少なくとも前記基板を保持する保持部材と、
    　を備えるマイクロホンユニット。     A microphone unit that converts sound into an electrical signal based on vibrations of a diaphragm,
    A substrate on which the diaphragm is mounted;
    A cover member that has a sound hole and is disposed on the substrate so that the diaphragm is accommodated in an internal space formed between the substrate,
    Of the substrate and the cover member, at least a holding member that holds the substrate;
    A microphone unit with
  2. 　請求項１に記載のマイクロホンユニットであって、
    　前記保持部材は底壁と側壁とで形成される空間部を有し、
    　前記基板と前記カバー部材とが前記空間部に収容保持される。     The microphone unit according to claim 1,
    The holding member has a space formed by a bottom wall and a side wall;
    The substrate and the cover member are accommodated and held in the space.
  3. 　請求項２に記載のマイクロホンユニットであって、
    　前記底壁に溝部が形成される。     A microphone unit according to claim 2,
    A groove is formed in the bottom wall.
  4. 　請求項３に記載のマイクロホンユニットであって、
    　前記カバー部材に形成される前記音孔は、第１音孔と第２音孔とから成り、
    　前記第１音孔から前記振動板の第１の面へと至る第１の音道と、前記第２音孔から前記溝部を経て前記振動板の前記第１の面の裏面である第２の面へと至る第２の音道と、が形成される。     The microphone unit according to claim 3,
    The sound hole formed in the cover member comprises a first sound hole and a second sound hole,
    A first sound path extending from the first sound hole to the first surface of the diaphragm; and a second sound path that is a back surface of the first surface of the diaphragm through the groove portion from the second sound hole. A second sound path leading to the surface is formed.
  5. 　請求項１に記載のマイクロホンユニットであって、
    　前記振動板はＭＥＭＳチップに含まれ、前記ＭＥＭＳチップが前記基板に搭載される。     The microphone unit according to claim 1,
    The diaphragm is included in a MEMS chip, and the MEMS chip is mounted on the substrate.
  6. 　請求項１に記載のマイクロホンユニットであって、
    　音孔を有する導電性のシールドカバーを更に備え、
    　前記カバー部材の音孔と前記シールドカバーの音孔とが重なると共に、前記保持部材が前記シールドカバー内に収まるように前記シールドカバーが設けられている。     The microphone unit according to claim 1,
    A conductive shield cover having sound holes;
    The shield cover is provided so that the sound hole of the cover member and the sound hole of the shield cover overlap and the holding member is accommodated in the shield cover.
  7. 　請求項６に記載のマイクロホンユニットであって、
    　前記シールドカバーと前記カバー部材とが別部材であって、前記シールドカバーが前記カバー部材の上から被せられている。     The microphone unit according to claim 6, wherein
    The shield cover and the cover member are separate members, and the shield cover is placed over the cover member.
  8. 　請求項６に記載のマイクロホンユニットであって、
    　前記シールドカバーと前記カバー部材とが一体成型されている。     The microphone unit according to claim 6, wherein
    The shield cover and the cover member are integrally formed.
  9. 　請求項１から８のいずれかに記載のマイクロホンユニットを備える音声入力装置。 A voice input device comprising the microphone unit according to any one of claims 1 to 8.
  10. 　請求項６から８のいずれかに記載のマイクロホンユニットと、
    　前記マイクロホンユニットを実装する実装基板と、
    　を備える音声入力装置であって、
    　前記シールドカバーが前記実装基板に形成されるグランドと電気的に接続される。     A microphone unit according to any one of claims 6 to 8,
    A mounting board for mounting the microphone unit;
    A voice input device comprising:
    The shield cover is electrically connected to a ground formed on the mounting substrate.
PCT/JP2009/070654 2008-12-12 2009-12-10 Microphone unit and voice input device using same WO2010067834A1 (en)

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EP09831938.7A EP2357844A4 (en) 2008-12-12 2009-12-10 Microphone unit and voice input device using same
CN200980149262.1A CN102246536B (en) 2008-12-12 2009-12-10 Microphone unit and voice input device using same

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JP2008-317297 2008-12-12
JP2008317297A JP5481852B2 (en) 2008-12-12 2008-12-12 Microphone unit and voice input device including the same

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