WO2010024155A1 - Tabテープの梱包方法およびtabテープの梱包構造 - Google Patents
Tabテープの梱包方法およびtabテープの梱包構造 Download PDFInfo
- Publication number
- WO2010024155A1 WO2010024155A1 PCT/JP2009/064454 JP2009064454W WO2010024155A1 WO 2010024155 A1 WO2010024155 A1 WO 2010024155A1 JP 2009064454 W JP2009064454 W JP 2009064454W WO 2010024155 A1 WO2010024155 A1 WO 2010024155A1
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- WO
- WIPO (PCT)
- Prior art keywords
- tab tape
- reel
- tab
- tape
- packing
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 54
- 238000004804 winding Methods 0.000 claims abstract description 38
- 229910000679 solder Inorganic materials 0.000 claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
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- 238000003860 storage Methods 0.000 claims description 10
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- 229910052757 nitrogen Inorganic materials 0.000 claims description 8
- 239000000155 melt Substances 0.000 claims description 4
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/67—Containers, packaging elements or packages, specially adapted for particular articles or materials for web or tape-like material
- B65D85/671—Containers, packaging elements or packages, specially adapted for particular articles or materials for web or tape-like material wound in flat spiral form
- B65D85/672—Containers, packaging elements or packages, specially adapted for particular articles or materials for web or tape-like material wound in flat spiral form on cores
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
- B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
- B65H75/04—Kinds or types
- B65H75/08—Kinds or types of circular or polygonal cross-section
- B65H75/10—Kinds or types of circular or polygonal cross-section without flanges, e.g. cop tubes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/30—Handled filamentary material
- B65H2701/37—Tapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/50—Storage means for webs, tapes, or filamentary material
- B65H2701/51—Cores or reels characterised by the material
- B65H2701/512—Cores or reels characterised by the material moulded
- B65H2701/5122—Plastics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/085—Using vacuum or low pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/086—Using an inert gas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Definitions
- the present invention relates to a TAB tape packaging method for storing, shipping, and transporting a TAB tape in which a wiring pattern and a solder resist have been formed before the chip component is mounted in a state of being wound around a reel, and
- the present invention relates to a TAB tape packaging structure.
- TAB Transmission Automated Bonding
- COF Chip Phoenix Film
- a chip component such as a semiconductor chip is mounted on a TAB tape on which a wiring pattern is formed by a reel-to-reel method. Further, it is stored and transported in a state of being wound on a reel.
- FIG. 8 is a diagram showing a state in which the TAB tape 502 is wound around the reel 501 in the related art.
- the TAB tape 502 is wound around the reel 501 while being superposed on the embossed spacer 503.
- one lot of TAB tape 502 is wound on one reel (for example, one lot (40 m) of TAB tape 502 and 52 m of embossed spacer 503 are wound on reel 501 having an outer diameter of 405 mm).
- the reel 501 is configured to wind up the TAB tape 502 and the embossed spacer 503 between the flanges on both sides.
- the embossed embossed spacer 503 serves as a cushioning material, so that the circuit surface on which the wiring pattern of the TAB tape 502 is formed is wound around the reel 501. Also protects.
- the TAB tape wound on the reel in this way is stored in and transported in a sealed form as shown in Patent Document 1, for example, in a packing bag.
- Patent Document 2 describes a tape reel in which a core portion, which has conventionally been easy to collect cleaning liquid in a sealed shape, has a skeleton shape in order to increase cleaning and drying efficiency in a cleaning process and improve reusability. Yes.
- the TAB tape needs to be wound around the reel without slipping in order to prevent deformation in the winding state. Therefore, in Patent Document 3, by providing a pressing plate that is mounted on the outer surface of the flange portion of the reel, the convex portion of the pressing plate passes through the hole of the flange portion and protrudes to the inner surface.
- a TAB tape reel is described in which the pinching interval is substantially reduced and the TAB tape can be aligned and wound.
- the reel is generally made of polystyrene (PS) or acrylonitrile butadiene styrene (ABS) as the main material in terms of cost and workability.
- PS and ABS are hard, brittle, and easy to scrape, so they are likely to generate dust due to vibration during transportation. For this reason, dust / foreign matter may adhere to the TAB tape, leading to a leak failure during chip mounting.
- the present invention has been made in view of the above-described conventional problems, and an object of the present invention is to provide a TAB tape packing method that can be reduced in size, and a reduced TAB tape packing structure. .
- the TAB tape packaging method of the present invention is a TAB tape in which a TAB tape in which a circuit composed of metal wiring and solder resist is repeatedly formed on a tape-like insulating film is wound around a reel and packed.
- the reel has a cylindrical shape having a shaft hole on the inner peripheral side, and includes at least a first step of winding the TAB tape around the outer peripheral surface of the reel. It is a feature.
- the TAB tape packaging structure of the present invention has a TAB tape in which a circuit composed of metal wiring and solder resist is repeatedly formed on a tape-shaped insulating film, wrapped around a reel in order to solve the above problems.
- the reel has a cylindrical shape having a shaft hole on the inner peripheral side, and at least the TAB tape is wound around the outer peripheral surface of the reel. It is characterized by that.
- the TAB tape and, if necessary, the spacer tape are wound around the outer peripheral surface of the cylindrical reel, so that the packaging size after winding is determined by the winding width of the tape. Therefore, as compared with the conventional packing size using a flanged reel, the packing size by the TAB tape packing method and the packing structure of the present invention can be downsized because there is no flange.
- the TAB tape packing method of the present invention when the TAB tape is wound around the outer peripheral surface of the reel, the TAB tape is wound so as to be in close contact with the TAB tape on the inner peripheral side while applying a tension of 0.5 N or more and 2 N or less. Is preferred.
- the TAB tape wound around the outer peripheral surface of the reel is in close contact with the adjacent TAB tape on the inner peripheral side.
- the TAB tape can be wound without any problem by winding while applying a tension of 0.5N or more and 2N or less when the winding is performed.
- the reel having a material having a Rockwell hardness of M90 or more and a melt float (g / 10 min) of 7 or more.
- the reel preferably has a material having a Rockwell hardness of M90 or more and a melt float (g / 10 min) of 7 or more.
- the surface resistance value of the reel is preferably set within 10 11 ⁇ .
- one lot of the TAB tape is determined to have a predetermined length, and it is desirable to wind a plurality of TAB tapes around the reel.
- the TAB tape packaging structure according to the present invention it is preferable that one lot of the TAB tape is determined to have a predetermined length, and a plurality of TAB tapes are wound around the reel.
- the TAB tapes of the plurality of lots are connected to each other by sticking the tape on one side. Thereby, the workability is good because the tape is easily peeled off when changing the lot.
- the TAB tape packaging method of the present invention preferably further includes a second step of vacuum-sealing the reel around which the TAB tape is wound in an antistatic bag.
- the reel around which the TAB tape is wound is preferably vacuum-sealed in an antistatic bag.
- the TAB tape packaging method of the present invention preferably further includes a second step of vacuum-sealing the reel on which the plurality of TAB tapes are wound in an antistatic bag.
- a second step of vacuum-sealing the reel on which the plurality of TAB tapes are wound in an antistatic bag it is preferable that the reel around which the plurality of TAB tapes are wound is vacuum-sealed in an antistatic bag.
- the TAB tape packaging method of the present invention encloses nitrogen in an antistatic bag during the vacuum sealing.
- nitrogen is enclosed in the vacuum-sealed antistatic bag.
- silica gel is put in the antistatic bag, it will be dried too much, and the cumulative dimension of IL (inner lead) will shrink. For this reason, it is necessary to perform ILB (inner lead bonding) after taking out the TAB tape from the antistatic bag and leaving it for 24 hours. Therefore, no silica gel is placed in the antistatic bag in order to stabilize the cumulative dimension of IL of the TAB tape and improve the efficiency of the ILB operation.
- the TAB tape packaging method of the present invention preferably further includes a third step of sticking a label indicating the order of the TAB tape lots wound around the reel to the antistatic bag.
- a label indicating the order of lots of TAB tape wound around the reel is attached to the antistatic bag. This makes it possible to quickly and easily recognize the order of the packed TAB tape lots.
- the solder resist has the property that the adhesive strength increases as the temperature increases. Therefore, when stored, shipped, or transported at high temperatures, for example, when a TAB tape wound around a reel is flown in a mounting process, the TAB tapes may stick to each other and may not flow smoothly.
- the adhesion force between the solder resist and the insulating film is 2N or less after storage for 24 hours in an environment of 50 ° C. It is desirable.
- the diameter of the reel is preferably 70 mm or more and 105 mm or less.
- the reel has a cylindrical shape having a shaft hole on the inner peripheral side, and at least the metal wiring and the solder resist are formed on the outer peripheral surface of the reel.
- the reel has a cylindrical shape having a shaft hole on the inner peripheral side, and a circuit comprising at least metal wiring and solder resist on the outer peripheral surface of the reel. Is a structure in which a TAB tape formed repeatedly on a tape-like insulating film is wound.
- the packaging size by the TAB tape packaging method and the packaging structure of the present invention has an effect that it can be miniaturized because there is no flange.
- FIG. 1 It is a perspective view which shows one Embodiment of the packing structure of the TAB tape in this invention. It is a perspective view which shows one structural example of the core aryl in the packing structure of the said TAB tape. It is a figure which shows one structural example of the TAB tape in the packing structure of the said TAB tape, (a) is a top view, (b) is the sectional view on the AA line of (a). (A)-(g) is a figure which shows the packing process of the said TAB tape. It is a perspective view which shows other embodiment of the packing structure of the TAB tape in this invention. In the said TAB tape packing structure, it is a figure which shows the state at the time of 1 core multiple lot structure. 5 is a table showing a winding length of a TAB tape that can be carried out and a length of one lot in the TAB tape packing structure. It is a perspective view which shows the structure of the packaging structure of the conventional TAB tape.
- FIG. 1 is a diagram showing a state where the TAB tape 120 and the flat spacer 130 are wound around the core reel 110.
- an example of a packing method and a packing structure of the TAB tape 120 for storage, shipment and transportation in a form in which the TAB tape 120 is wound in a reel shape is shown.
- the configurations of the core reel 110, the TAB tape 120, and the flat spacer 130 will be described in order, and then the method for packing the TAB tape 120 will be described.
- FIG. 2 is a perspective view showing an example of the configuration of the core reel 110.
- the core reel 110 is a reel having only a core portion without a flange provided on a general reel.
- the core aryl 110 is an insulator made of PS, and a resin in which glass fibers are kneaded into PS is used. Thereby, the strength is improved, and the core aryl 110 is desirably a material having a high hardness (Rockwell hardness: M90 or more) and a high viscosity (melt float (g / 10 min): 7 or more). This makes it possible to suppress dust generation.
- the surface of the core aryl 110 is provided with conductivity as a countermeasure against foreign matter caused by charging.
- the surface resistance value is within 10 11 ⁇ , preferably 10 6 ⁇ to 10 10 when the core aryl 110 is molded. Knead a resin that is stably bonded with a polymer material so that the resistance becomes ⁇ . As a result, it is possible to prevent a leakage defect or the like caused by the foreign matter that has generated dust adhering to the TAB tape 120.
- Torayac Parel of Toray is used as the material of the core aryl 110.
- Toyolac parrel is an alloy material of ABS resin and antistatic polymer. Glass fiber may be kneaded into this.
- the core reel 110 has a cylindrical shape in appearance, and a TAB tape 120 and a flat spacer 130 are wound around the outer peripheral surface 111.
- the width of the outer peripheral surface 111 may be determined according to the TAB tape 120.
- the diameter of the core aryl 110 is 70 mm to 105 mm. Since the diameter of the core portion of the conventional flanged reel 501 is 105 mm to 127 mm when the outer size of the reel 501 is ⁇ 405 mm, the core reel 110 is miniaturized by winding only the raw tape without chips. Yes.
- the core reel 110 has a shaft hole 112 through which a shaft is inserted and removed on a cylindrical central axis. Since a 1 inch shaft is generally used as the shaft, the shaft hole 112 is formed with a diameter that fits into the shaft. In addition, since the shape of a shaft exists in various ways, what is necessary is just to determine a diameter so that it may respond
- the core reel 110 is formed with a plurality of ribs 114 provided so as to hold a portion where the shaft hole 112 is formed.
- the rib 114 is formed so as to form a cross shape when viewed from the axial direction of the core reel 110.
- the core aryl 110 has a framework structure (hollow structure).
- the shape (structure) is not limited to that shown in FIG. 2 and is a hermetically sealed shape as long as it has strength to hold the above portion when the shaft is attached to the shaft hole 112 and rotated. But you can.
- the shape of the other inner peripheral side of the core aryl 110 is not particularly limited as long as it has a good moldability.
- the core aryl 110 having the above-described configuration is manufactured by first preparing a resin chip as a material for the core aryl 110, and subsequently introducing the resin chip into a mold and melting and integrally molding the resin chip. Further, the molding may be two-component molding in which resin is supplied to the mold at two locations. Thereby, productivity can be improved. It should be noted that a resin such as polyacetal (POM), which is difficult to generate dust, may be used only for the shaft receiving portion (1 inch fitting portion) that is likely to generate dust due to two different liquids. POM has a material with a low coefficient of friction, excellent wear resistance and formability, and a small amount of dust generation.
- POM polyacetal
- the core reel 110 is smaller than the conventional flanged reel because it has no flange. Therefore, it is not necessary to manage the shape of the flange, and the amount of resin used can be reduced, so that the cost of the reel can be reduced. Moreover, even when reused, the burden on the work is reduced.
- FIG. 3A and 3B are diagrams showing an example of the configuration of the TAB tape 120, in which FIG. 3A is a top view and FIG. 3B is an enlarged cross-sectional view taken along line AA in FIG.
- the TAB tape 120 has a configuration in which a circuit formed by a general circuit manufacturing process is continuously (repeatedly) provided along the longitudinal direction on one surface side of a long tape-shaped film 121. Have. The portion where the circuit is formed finally becomes a semiconductor device such as an IC driver.
- the film 121 is an insulating material made of an organic resin material such as polyimide.
- the thickness of the film 121 is, for example, 25 ⁇ m to 100 ⁇ m, and the width is 35 to 300 mm. Further, conveyance holes 124 called sprocket holes are continuously formed at both ends in the width direction of the film 121.
- the wiring pattern 122 is formed of a conductive thin film lead made of copper, and the surface thereof is plated with tin (0.1 to 0.5 ⁇ mt). An inner lead, an outer lead, a test pad, and the like are formed at the end of the lead. Wirings other than the outer leads used by the user as joint portions and the inner leads on which the semiconductor chip is mounted are covered with an insulating solder resist 123.
- the TAB tape 120 shown in FIG. 3 is a COF
- the opening of the semiconductor chip mounting portion in the film 121 and the slit for bending are not provided.
- the TAB tape 120 is not limited to the COF but is a TAB. Any structure using technology may be used, for example, TCP.
- the flat spacer 130 is made of a long tape-shaped film, and both surfaces thereof are flat.
- the material of the flat spacer 130 is preferably polyethylene terephthalate (PET) that can be stably molded, but such as polyethylene naphthalate, polyimide, polyetherimide, polysulfone, polyethylene, polypropylene, polyamide, or polyethersulfine. Resin may be used.
- the thickness of the flat spacer 130 is 50 ⁇ m to 125 ⁇ m, and the width can be variously changed according to the design, but is preferably substantially the same as the width of the TAB tape 120.
- the width of the flat spacer 130 is desirably 48 ⁇ 0.5 mm.
- TAB tape packing method Next, a flow until the TAB tape 120 is wound around the core reel 110 together with the flat spacer 130 to form a packing form for storage, shipment and transportation will be described.
- the core reel 110 is attached to a shaft (not shown). Then, the superposed TAB tape 120 and flat spacer 130 are placed along the outer peripheral surface 111 of the core reel 110 (wound several times). At this time, it is preferable that the flat spacer 130 is overlapped on the surface of the TAB tape 120 opposite to the circuit forming surface, and the TAB tape 120 is arranged so that the circuit forming surface of the TAB tape 120 is on the inner side (axial side). As a result, when the TAB tape 120 after being wound is passed through the process, the circuit surface faces upward, so that chip components can be mounted efficiently.
- the ends of the TAB tape 120 and the flat spacer 130 along the outer peripheral surface 111 are not taped. This is because, if fixed, it causes trouble when flowing in the process.
- the shaft is rotated to rotate the core reel 110, and the TAB tape 120 and the flat spacer 130 are wound up while being superimposed on the core reel 110.
- the core reel 110 does not have a flange, so that the TAB tape 120 is wound while being fixed with a reinforcing plate so as not to cause a winding shift.
- the packing size (packing structure) of the TAB tape 120 wound up in this manner is a flange size compared with the packing size (packing structure) using the conventional flanged reel 501 and the embossed spacer 503 shown in FIG. Since the flat spacer 130 is used, the size can be reduced.
- FIG. 4 is a diagram showing a packing process of the TAB tape 120.
- the core reel 110 around which the TAB tape 120 shown in FIG. 4A is wound is placed in an antistatic bag 160 as shown in FIG. 4B.
- the antistatic bag 160 is made of an aluminum laminate, and can be both antistatic and moisture-proof.
- the antistatic bag 160 is not limited to this, and if necessary, a moisture-proof bag made of an aluminum laminate instead of the antistatic bag 160. Can also be used. If it is desired to check the contents, a transparent bag having both antistatic and moistureproof functions may be used. In this case, for example, a letterpress printing GX film is suitable.
- the inside of the bag is evacuated and filled with nitrogen, and the bag entrance is sealed by thermocompression bonding.
- the TAB tape 120 is fixed and is prevented from shifting due to shaking during transportation.
- oxidation of tin plated on the surface of the wiring pattern 122 is also suppressed.
- the suppression of the oxidation of the tin is more effectively performed by enclosing nitrogen.
- silica gel is put in the antistatic bag, it will be dried too much, and the cumulative dimension of IL (inner lead) will shrink. For this reason, it is necessary to carry out ILB (inner lead bonding) after taking out the product from the antistatic bag and leaving it for 24 hours. Therefore, no silica gel is placed in the antistatic bag in order to stabilize the cumulative dimension of IL of the product and improve the efficiency of the ILB operation.
- a shipping label 165 on which information on the enclosed TAB tape 120 is written is pasted on the antistatic bag 160.
- information described in the shipping label 165 for example, there are a product name, a quantity, a manufacturing date, and the like formed on the TAB tape 120.
- the antistatic bag 160 in which the core reel 110 with the TAB tape 120 is hermetically sealed is used as a cushioning material as shown in FIG. ) And put it in the antistatic level petit bag 170 made in step 1).
- the damage by the contact between the antistatic bags 160 due to vibration during transportation or an impact during dropping can be suppressed.
- the moisture-proof function is significantly lowered.
- the packed product is put in a nylon bag 175.
- a plurality of nylon bags 175 can be placed according to the shipping size. If it cannot be put in the nylon bag 175, the foreign matter of the cardboard that is finally stored is transferred to the antistatic bag 160 and brought into the clean room as it is, which may cause contamination of the clean room and transfer of the foreign matter to the product. is there. If the product is put in the nylon bag 175, foreign substances brought into the clean room can be reduced.
- the packaged product is put in the outer case 180.
- the outer case 180 is paper cardboard or plastic cardboard.
- a maximum of 32 corels (4 ⁇ 8 steps) can be stored in one exterior case 180.
- a maximum of 20 corels (4 ⁇ 5 steps) can be stored in one exterior case 180.
- the antistatic bag 160 in which the core 110 with the TAB tape 120 shown in FIG. You may put it in the nylon bag 175 while laying the petit bag 170 between the layers of the prevention bag 160. These packed products are similarly put in the outer case 180.
- the TAB tape 120 is stored, shipped and transported in a form packed in the outer case 180.
- the outer case 180 having a size corresponding to the outer size of the core reel 110 with the TAB tape 120 is used, so that the outer case 180 is also downsized with the miniaturization of the core reel 110 with the TAB tape 120. It becomes possible to do. Therefore, it is possible to improve the efficiency of shipping / conveying and improve productivity.
- the storage space for the exterior case 180 that has been required in the past is only 1/5 in the packing structure of the TAB tape 120 of this embodiment.
- the packaging structure of the TAB tape 120 shown in FIG. 1 described in the first embodiment is smaller than the packaging structure of the conventional TAB tape 502 shown in FIG.
- the flat spacer 130 uses PET which is an insulator, it is very easy to be charged, and since it is wound in layers, static electricity is likely to be generated. Because of these factors, the flat spacer 130 is easy to attach peripheral foreign matters. If a foreign object is caught during chip mounting, it will lead to defective dents on the TAB tape 120 and leakage during chip mounting.
- the flat spacer 130 after use is usually discarded. Therefore, the flat spacer 130 is reused and used to reduce waste materials, but costs more than purchasing a new one are required. In the first place, since the flat spacer 130 is used, the size at the time of shipment is increased, and the transportation cost is also increased.
- FIG. 5 is a diagram showing a state where the TAB tape 120 is wound around the core reel 110.
- the TAB tape 120 is placed along the outer peripheral surface 111 of the core reel 110 (wound several times). At this time, it is preferable that the circuit forming surface of the TAB tape 120 be aligned along the inner side (axis side).
- the shaft is rotated to rotate the core reel 110, and the TAB tape 120 is wound around the core reel 110.
- the core reel 110 does not have a flange, so that the TAB tape 120 is wound while being fixed with a reinforcing plate so as not to cause a winding shift.
- a tension (winding tension) is applied in the longitudinal direction of the TAB tape 120 to wind it. That is, the TAB tape 120 is wound around the core reel 110 while being pulled in the longitudinal direction.
- the winding of the TAB tape 120 becomes loose.
- the shaft hole 112 of the core reel 110 is lifted after the winding is finished, the TAB tape 120 is broken like a bamboo shoot and untied apart. Further, since one core reel 110 has a limit on the total winding length, it cannot be wound in a plurality of lots.
- the solder resist 123 formed on the TAB tape 120 serves as an adhesive material and cannot be wound smoothly, causing stress to the TAB tape 120 and causing problems such as tearing. Sometimes. Further, the holes 124 and defective punch holes of the TAB tape 120 are transferred to the surface of the solder resist 123 and the film 121 to cause damage.
- the packaging structure of the TAB tape 120 wound up in this way is TAB tape without using the flat spacer 130 as compared with the packaging structure using the flat spacer 130 of the first embodiment shown in FIG. Since 120 is wound directly around the core aryl 110, it is possible to reduce the size.
- the core reel 110 around which the TAB tape 120 is wound is put in order into the antistatic bag 160, the small bag 170, the nylon bag 175, the outer case 180, and the like as shown in FIG.
- the TAB tape 120 is packed for storage, shipment and transportation.
- the outer case 180 having a size corresponding to the outer size of the core reel 110 with the TAB tape 120, the outer case 180 is further reduced in size with the downsizing of the core reel 110 with the TAB tape 120. Can be realized. As a result, it is possible to further improve the efficiency of shipping / conveyance and productivity, and further reduce the transportation cost.
- TAB tape 120 is taken as one lot, and thousands to tens of thousands of lots are made to flow to the transportation lane of the manufacturing facility in one month. For this reason, when one lot is wound around one core reel 110 (one core, one lot configuration), the core reel 110 must be replaced with a shaft and passed through the transport lane for each lot, resulting in poor work efficiency. , Productivity is low.
- the packaging structure of the TAB tape 120 since the size reduction is realized by the direct winding of the TAB tape 120, it is possible to change from a 1-core 1-lot configuration to a 1-core multiple-lot configuration. It has become. Therefore, after the assembly of the first lot is completed, it is not necessary to go through the next lot to the transport lane, and the work efficiency and productivity can be improved. In addition, since a plurality of lots are continuously flowed to the process, the Assy workability can be improved and the cost can be reduced accordingly.
- FIG. 6 is a diagram showing a state in which the TAB tape 120 is wound around the core reel 110 in the case of a one-core multiple lot configuration.
- the TAB tape 120 is actually provided with a leader tape 125 at the front and rear in order to improve workability in the manufacturing process.
- the leader tape 125 has an industry standard length of 6 m, 3 m on each side.
- the leader tape 125 between the lots is joined and wound. This joining is generally performed by sticking a tape on both sides of the leader tape 125 after a pin is set up and aligned in the transport feed hole 124 using a splicer.
- the tape 150 is attached to the center only on one side as shown in FIG. Thereby, it is easy to peel off the tape 150, and the workability is improved. Further, between the lots, only one side of the leader tape 125 is connected by the tape 150, but the conveyance can be performed without any problem.
- FIG. 7 is a table showing the possible winding length of the TAB tape 120 and the length of one lot.
- the packing structure of the TAB tape 120 of this embodiment when one lot is 40 m, four lots or more, and a maximum of six lots can be wound. That is, the TAB tape 120 having a total length of 160 m (40 m ⁇ 4 lots) or more and a maximum of 240 m could be wound. When trying to wind 240 m or more, it was necessary to tighten the winding more (2N or more), which was not possible.
- the place of one lot of 40 m may be replaced with 80 m, 120 m, or 160 m. Thereby, it becomes possible to raise productivity further.
- a tape manufacturer generally has a length of 120 m and 160 m, and a length that is a multiple of 40 is good in productivity. Therefore, when one lot is 40 m, the tape manufacturer sends a set divided into 40 m in 3 or 4 sets. Therefore, by setting one lot to 80 m, 120 m, or 160 m, it is possible to reduce the editing work at the tape maker and thereby reduce the cost.
- a TAB tape of 40 m is wound around one reel, and the lengthening of the TAB tape causes an increase in the reel size, resulting in an increase in the packing structure.
- the packaging structure of the present embodiment it is possible to wind up a TAB tape of 40 m or more even if it is the same size as the conventional packaging size before lengthening. Is realized.
- a solder resist 123 is formed on the TAB tape 120.
- the solder resist 123 is originally sticky, and the thicker the thickness, the stronger the adhesive force. For this reason, if the TAB tape 120 is wound too tightly, the TAB tapes 120 may stick to each other. In this case, the TAB tape 120 cannot be smoothly flowed in the process.
- the thickness l of the solder resist 123 be within 30 ⁇ m at the maximum.
- the thickness of the solder resist is usually within a maximum of 30 ⁇ m, so that the conventional TAB tape can be used as it is.
- solder resist 123 has a property that the adhesive strength increases as the temperature increases.
- the TAB tape 120 is usually placed in an environment of 25 ° C. when stored, shipped or transported in a form packaged in an outer case, but may be placed in a high temperature environment in summer.
- the solder resist 123 has a sticking force characteristic of 2N or less after being stored in a space of 50 ° C. for 24 hours. Therefore, for example, when the TAB tape 120 wound around the core reel 110 is flowed in the mounting process, the TAB tapes can be separated from each other at 2N or less, and operational problems are solved.
- the TAB tape 120 can be stably flowed in the process even if they are stuck together. In other words, it is possible to solve the problem of adhesion by attaching a tension to the TAB tape 120 and pulling it out while pulling. For example, when a sticking problem occurs, a weight of about 50 to 100 g may be added.
- the present invention can be suitably used in the field related to a TAB tape packaging method for storing, shipping and transporting a TAB tape before being mounted with a chip component in a state wound on a reel. It can also be suitably used in the field related to the packaging structure, and can also be widely used in the field of using tapes that are stored, shipped, or transported in a reeled state.
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Abstract
Description
本発明の一実施形態について図面に基づいて説明すれば、以下の通りである。
図2は、コアリール110の一構成例を示す斜視図である。
図3は、TABテープ120の一構成例を示す図であり、(a)は上面図であり、(b)は(a)のA-A線断面拡大図である。
フラットスペーサ130は、長尺のテープ形状のフィルムからなり、その両面がフラットとなっている。フラットスペーサ130の材料としては、好ましくは安定して成型可能なポリエチレンテレフタレート(PET)であるが、ポリエチレンナフタレート、ポリイミド、ポリエーテルイミド、ポリスルフォン、ポリエチレン、ポリプロピレン、ポリアミド、またはポリエーテルスルフィンなどの樹脂であってもよい。
次に、TABテープ120を、フラットスペーサ130とともにコアリール110に巻き付けて、保管や出荷・搬送用の梱包形態にするまでの流れについて説明する。
本発明の他の実施の形態について図面に基づいて説明すれば、以下の通りである。なお、本実施の形態において説明すること以外の構成は、前記実施の形態1と同じである。また、説明の便宜上、前記の実施の形態1の図面に示した部材と同一の機能を有する部材については、同一の符号を付し、その説明を省略する。
111 外周面
112 軸穴
120 TABテープ
121 フィルム(絶縁フィルム)
122 配線パターン(金属配線)
123 ソルダーレジスト
125 リーダテープ
130 フラットスペーサ
150 テープ
160 帯電防止袋
165 出荷ラベル(ラベル)
170 プチ袋
175 ナイロン袋
180 外装ケース
Claims (26)
- 金属配線およびソルダーレジストからなる回路がテープ状の絶縁フィルムに繰り返し形成されてなるTABテープを、リールに巻き付けて梱包するTABテープの梱包方法であって、
上記リールは、内周側に軸穴を有する円筒型の形状を有しており、
上記リールの外周面に、少なくとも上記TABテープを巻き付ける第1のステップを含むことを特徴とするTABテープの梱包方法。 - 上記TABテープを上記リールの外周面に巻き付ける際、0.5N以上かつ2N以下のテンションをかけながら内周側のTABテープに密着させるように巻き付けることを特徴とする請求項1に記載のTABテープの梱包方法。
- 上記リールとしては、ロックウエル硬さがM90以上、かつ、メルトフロート(g/10min)が7以上の材質を有しているものを用いることを特徴とする請求項1または2に記載のTABテープの梱包方法。
- 上記リールの表面抵抗値は、1011Ω以内に設定されていることを特徴とする請求項1または2に記載のTABテープの梱包方法。
- 上記TABテープは、1ロットが所定の長さで定められており、
上記リールには、複数ロットの上記TABテープを巻き付けることを特徴とする請求項2に記載のTABテープの梱包方法。 - 上記複数ロットのTABテープ間は、片面にテープが貼られることにより接続されていることを特徴とする請求項5に記載のTABテープの梱包方法。
- 上記TABテープが巻き付けられたリールを、帯電防止袋に真空封止する第2のステップをさらに含むことを特徴とする請求項1または2に記載のTABテープの梱包方法。
- 上記真空封止の際、帯電防止袋に窒素を封入することを特徴とする請求項7に記載のTABテープの梱包方法。
- 上記複数ロットのTABテープが巻き付けられたリールを、帯電防止袋に真空封止する第2のステップをさらに含むことを特徴とする請求項5に記載のTABテープの梱包方法。
- 上記真空封止の際、帯電防止袋に窒素を封入することを特徴とする請求項9に記載のTABテープの梱包方法。
- 上記リールに巻き付けているTABテープのロットの順番が表記されたラベルを、上記帯電防止袋に貼る第3のステップをさらに含むことを特徴とする請求項9に記載のTABテープの梱包方法。
- 上記ソルダーレジストと上記絶縁フィルムとのくっ付き力は、50℃の環境下で24時間保管後2N以下であることを特徴とする請求項2に記載のTABテープの梱包方法。
- 上記リールの直径は、70mm以上かつ105mm以下であることを特徴とする請求項1または2に記載のTABテープの梱包方法。
- 金属配線およびソルダーレジストからなる回路がテープ状の絶縁フィルムに繰り返し形成されてなるTABテープが、リールに巻き付けられて梱包されているTABテープの梱包構造であって、
上記リールは、内周側に軸穴を有する円筒型の形状を有しており、
上記リールの外周面に、少なくとも上記TABテープが巻き付けられていることを特徴とするTABテープの梱包構造。 - 上記リールの外周面に巻き付けられているTABテープは、内周側の隣り合うTABテープと密着していることを特徴とする請求項14に記載のTABテープの梱包構造。
- 上記リールは、ロックウエル硬さがM90以上、かつ、メルトフロート(g/10min)が7以上の材質を有していることを特徴とする請求項14または15に記載のTABテープの梱包構造。
- 上記リールの表面抵抗値は、1011Ω以内に設定されていることを特徴とする請求項14または15に記載のTABテープの梱包構造。
- 上記TABテープは、1ロットが所定の長さで定められており、
上記リールには、複数ロットの上記TABテープが巻き付けられていることを特徴とする請求項15に記載のTABテープの梱包構造。 - 上記複数ロットのTABテープ間は、片面にテープが貼られることにより接続されていることを特徴とする請求項18に記載のTABテープの梱包構造。
- 上記TABテープが巻き付けられたリールは、帯電防止袋に真空封止されていることを特徴とする請求項14または15のいずれか1項に記載のTABテープの梱包構造。
- 上記真空封止された帯電防止袋には、窒素が封入されていることを特徴とする請求項20に記載のTABテープの梱包構造。
- 上記複数ロットのTABテープが巻き付けられたリールは、帯電防止袋に真空封止されていることを特徴とする請求項18に記載のTABテープの梱包構造。
- 上記真空封止された帯電防止袋には、窒素が封入されていることを特徴とする請求項22に記載のTABテープの梱包構造。
- 上記リールに巻き付けられているTABテープのロットの順番が表記されたラベルが、上記帯電防止袋に貼られていることを特徴とする請求項22に記載のTABテープの梱包構造。
- 上記ソルダーレジストと上記絶縁フィルムとのくっ付き力は、50℃の環境下で24時間保管後2N以下であることを特徴とする請求項15に記載のTABテープの梱包構造。
- 上記リールの直径は、70mm以上かつ105mm以下であることを特徴とする請求項14または15に記載のTABテープの梱包構造。
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CN200980133309.5A CN102137798B (zh) | 2008-08-28 | 2009-08-18 | Tab带的捆包方法及tab带的捆包构造 |
US12/737,861 US8662309B2 (en) | 2008-08-28 | 2009-08-18 | Method for packing tab tape, and packing structure for tab tape |
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Also Published As
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US20110147262A1 (en) | 2011-06-23 |
JP2010052774A (ja) | 2010-03-11 |
CN102137798A (zh) | 2011-07-27 |
CN102137798B (zh) | 2014-09-03 |
US8662309B2 (en) | 2014-03-04 |
TW201018637A (en) | 2010-05-16 |
TWI423917B (zh) | 2014-01-21 |
JP5274938B2 (ja) | 2013-08-28 |
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