[go: up one dir, main page]

WO2009145003A1 - Procédé pour la fabrication d'une lentille mince ou d'un réseau de lentilles minces - Google Patents

Procédé pour la fabrication d'une lentille mince ou d'un réseau de lentilles minces Download PDF

Info

Publication number
WO2009145003A1
WO2009145003A1 PCT/JP2009/056281 JP2009056281W WO2009145003A1 WO 2009145003 A1 WO2009145003 A1 WO 2009145003A1 JP 2009056281 W JP2009056281 W JP 2009056281W WO 2009145003 A1 WO2009145003 A1 WO 2009145003A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin
molding
substrate
mold
master
Prior art date
Application number
PCT/JP2009/056281
Other languages
English (en)
Japanese (ja)
Inventor
秀 細江
彰 佐藤
宏史 押谷
雄一 藤井
明子 原
Original Assignee
コニカミノルタオプト株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by コニカミノルタオプト株式会社 filed Critical コニカミノルタオプト株式会社
Priority to JP2010514408A priority Critical patent/JP5327221B2/ja
Publication of WO2009145003A1 publication Critical patent/WO2009145003A1/fr

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G02B3/0031—Replication or moulding, e.g. hot embossing, UV-casting, injection moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00278—Lenticular sheets
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0062—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between

Definitions

  • the present invention relates to a method for manufacturing a wafer lens or a wafer lens assembly.
  • Patent Document 1 does not describe a specific molding and manufacturing method, an optical lens cannot actually be manufactured.
  • the wafer lens is a double-sided lens array in which optical members are provided on both the front and back surfaces of the glass substrate
  • the wafer lens assembly obtained by laminating a plurality of such wafer lenses
  • when applying pressure In order not to apply pressure to the optical member, only the periphery of the wafer lens should be in contact with the bonder. As a result, there is a problem in that only the periphery of the wafer lens is pressurized and the central portion and the like are easily bent and cannot be laminated with high accuracy.
  • the main object of the present invention is to improve the shape accuracy of the optical member and to simplify the number of steps, and to provide a wafer lens manufacturing method capable of simplifying the number of steps, without causing the wafer lens to bend accurately. It is an object of the present invention to provide a method for manufacturing a wafer lens assembly that can be manufactured by stacking.
  • the first aspect for solving the above problem is as follows.
  • Each of the curable resins filled between the first molding die and the second molding die and the substrate after the second filling step of filling the functional resin, and after the first and second filling steps And a curing step for simultaneously curing.
  • any one of a 1st and 2nd filling process includes the process of dripping curable resin on the molding surface of a shaping
  • a third aspect is the first aspect described above, wherein the first or second filling step includes a step of dispersing and dripping the curable resin in a plurality of locations.
  • a 4th aspect is a 2nd aspect mentioned above.
  • WHEREIN The process of dripping curable resin on the shaping
  • the fifth aspect is A wafer lens assembly manufacturing method for manufacturing a wafer lens assembly by stacking wafer lenses each having an optical member made of a curable resin on at least one surface of a substrate with a spacer interposed therebetween.
  • a molded body obtained by filling and curing the curable resin between a molding die having a plurality of negative molding surfaces corresponding to the optical surface shape of the optical member and the one surface of the substrate.
  • a plurality of molded bodies are arranged so that the other surfaces of the substrate face each other, and the spacer is interposed between the other surfaces facing each other to form a plurality of molded bodies.
  • the sixth aspect is a method of manufacturing a wafer lens assembly according to the fifth aspect described above, wherein the sub-master mold of a plurality of molded bodies is released from each substrate and then post-cured.
  • the molding surface is coated with Ni. Further, a release agent is applied.
  • the curing step is executed after the first and second filling steps, the resin is cured and shrunk simultaneously on both sides of the substrate without the resin being cured and shrunk only on one side of the substrate.
  • each becomes an optical member. Therefore, unlike the case where the optical member is provided in order on each surface of the substrate, the warpage of the substrate can be prevented and the shape accuracy of the optical member can be improved.
  • the filled resins can be simultaneously cured and simultaneously molded on both sides of the substrate, so that the number of steps can be simplified.
  • the molded bodies can be pressed with the molding dies attached, so that the entire surface of the molding dies can be uniformly pressed without contacting the optical member. .
  • the wafer lenses can be stacked with high accuracy without the wafer lenses being bent.
  • FIG. 7 is a schematic diagram for explaining a subsequent process of FIG. 6. It is the schematic for demonstrating the one part process (mold release process) of FIG. It is the schematic which shows the modification of the one part process (resin dripping process) of FIG.
  • FIG. 4 is a reaction diagram of a release agent using an alkoxylane group as an example of a functional group capable of being hydrolyzed at the terminal and an OH group on a master surface.
  • the wafer lens 1 has a circular glass substrate 3 and a plurality of convex lens portions 5 and concave lens portions 7 as optical members.
  • a plurality of convex lens portions 5 are arranged in an array on the surface of the glass substrate 3, and a plurality of concave lens portions 7 are arranged on the back surface of the glass substrate 3.
  • the convex lens portion 5 and the concave lens portion 7 are arranged at positions corresponding to each other in the vertical direction.
  • the convex lens portion 5 and the concave lens portion 7 may have a fine structure such as a diffraction groove or a step on the surface of the optical surface.
  • the convex lens portion 5 is made of resin 5A.
  • a curable resin material is used as the resin 5A.
  • the curable resin material is roughly classified into a photocurable resin and a thermosetting resin, and the resin 5A may be either a photocurable resin or a thermosetting resin.
  • photocurable resin for example, an acrylic resin or an allyl ester resin can be used, and these resins can be cured by radical polymerization.
  • an epoxy-based resin can be used, and the resin can be reaction-cured by cationic polymerization.
  • thermosetting resin for example, a silicone resin can be used, and the resin can be cured by addition polymerization in addition to the radical polymerization or cationic polymerization.
  • the concave lens portion 7 is made of resin 7A.
  • a curable resin similar to the resin 5A is used as the resin 7A.
  • the resin 7A and the resin 5A may be the same type of resin or different types of resins.
  • FIG. 1B is a perspective view showing a schematic configuration of the wafer lens assembly.
  • Wafer lens assembly 100 is formed by laminating wafer lens 1 and wafer lens 1B with spacer 40 interposed therebetween.
  • the wafer lens 1 shown in FIG. 1B has a circular glass substrate 3 and a plurality of convex lens portions 4 and 5 (see FIG. 12), and a plurality of convex lens portions 4 on both the front and back surfaces of the glass substrate 3.
  • 5 has a configuration arranged in an array.
  • the convex lens portions 4 and 5 may have a fine structure such as a diffraction groove or a step on the surface of the optical surface.
  • the convex lens portions 4 and 5 are formed of resins 4A and 5A.
  • a curable resin material is used as the resins 4A and 5A.
  • the curable resin material is roughly classified into a photocurable resin and a thermosetting resin, and the resins 4A and 5A may be either a photocurable resin or a thermosetting resin.
  • photocurable resin for example, an acrylic resin or an allyl resin can be used, and these resins can be cured by radical polymerization.
  • an epoxy-based resin can be used, and the resin can be reaction-cured by cationic polymerization.
  • thermosetting resin can be cured by addition polymerization such as silicone in addition to the above radical polymerization and cationic polymerization.
  • resins that can be used as the above-described resins 4A, 5A, and 7A are as follows.
  • the (meth) acrylate used for the polymerization reaction is not particularly limited, and the following (meth) acrylate produced by a general production method can be used. Ester (meth) acrylate, urethane (meth) acrylate, epoxy (meth) acrylate, ether (meth) acrylate, alkyl (meth) acrylate, alkylene (meth) acrylate, (meth) acrylate having an aromatic ring, alicyclic structure
  • the (meth) acrylate which has is mentioned. One or more of these can be used.
  • (Meth) acrylate having an alicyclic structure is particularly preferable, and may be an alicyclic structure containing an oxygen atom or a nitrogen atom.
  • 2-alkyl-2-adamantyl (meth) acrylate (refer to Japanese Patent Laid-Open No. 2002-193883), adamantyl di (meth) acrylate (Japanese Patent Laid-Open No. 57-5000785), diallyl adamantyl dicarboxylate (Japanese Patent Laid-Open No. 60-100537). ), Perfluoroadamantyl acrylate (JP 2004-123687), manufactured by Shin-Nakamura Chemical Co., Ltd.
  • adamantane skeleton having no aromatic ring such as tetraadamantane (see JP-A-2006-169177), 2-alkyl-2-hydroxyadamantane, 2-alkyleneadamantane, 1,3-adamantane dicarboxylate di-tert-butyl, etc.
  • Curable resins see JP-A-2001-322950), bis (hydroxyphenyl) adamantanes, bis (glycidyloxyphenyl) adamantanes (see JP-A-11-35522, JP-A-10-130371) and the like. It is done.
  • (meth) acrylate for example, methyl acrylate, methyl methacrylate, n-butyl acrylate, n-butyl methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, isobutyl acrylate, isobutyl methacrylate, tert-butyl acrylate Tert-butyl methacrylate, phenyl acrylate, phenyl methacrylate, benzyl acrylate, benzyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate, and the like.
  • polyfunctional (meth) acrylate examples include trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol penta (meth) ) Acrylate, dipentaerythritol tetra (meth) acrylate, dipentaerythritol tri (meth) acrylate, tripentaerythritol octa (meth) acrylate, tripentaerythritol septa (meth) acrylate, tripentaerythritol hexa (meth) acrylate, tripenta Erythritol penta (meth) acrylate, tripentaerythritol tetra (meth) acrylate, tripent
  • Bromine-containing (meth) allyl ester not containing an aromatic ring see JP-A-2003-66201
  • allyl (meth) acrylate see JP-A-5-286896
  • allyl ester resin JP-A-5-286896
  • JP 2003-66201 A a copolymer of an acrylate ester and an epoxy group-containing unsaturated compound
  • JP 2003-128725 A an acrylate compound
  • an acrylic And ester compounds see JP 2005-2064 A.
  • Epoxy resin is not particularly limited as long as it has an epoxy group and is polymerized and cured by light or heat, and an acid anhydride, a cation generator, or the like can be used as a curing initiator. Epoxy resin is preferable in that it has a low cure shrinkage and can be a lens with excellent molding accuracy.
  • Examples of the epoxy include novolak phenol type epoxy resin, biphenyl type epoxy resin, and dicyclopentadiene type epoxy resin.
  • Examples include bisphenol F diglycidyl ether, bisphenol A diglycidyl ether, 2,2′-bis (4-glycidyloxycyclohexyl) propane, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, vinyl Cyclohexene dioxide, 2- (3,4-epoxycyclohexyl) -5,5-spiro- (3,4-epoxycyclohexane) -1,3-dioxane, bis (3,4-epoxycyclohexyl) adipate, 1,2 -Cyclopropanedicarboxylic acid bisglycidyl ester and the like.
  • curing agent is used when comprising curable resin material, and there is no limitation in particular. Moreover, in this invention, when comparing the transmittance
  • the curing agent an acid anhydride curing agent, a phenol curing agent, or the like can be preferably used.
  • acid anhydride curing agents include phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, hexahydrophthalic anhydride, 3-methyl-hexahydrophthalic anhydride, 4-methyl-hexahydrophthalic anhydride
  • acid anhydride curing agents include phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, hexahydrophthalic anhydride, 3-methyl-hexahydrophthalic anhydride, 4-methyl-hexahydrophthalic anhydride
  • examples thereof include an acid, a mixture of 3-methyl-hexahydrophthalic anhydride and 4-methyl-hexahydrophthalic anhydride, tetrahydrophthalic anhydride, nadic anhydride, and methyl nadic anhydride.
  • a hardening accelerator is contained as needed.
  • the curing accelerator is not particularly limited as long as it has good curability, is not colored, and does not impair the transparency of the thermosetting resin.
  • 2-ethyl-4-methylimidazole is not limited. Imidazoles such as (2E4MZ), tertiary amines, quaternary ammonium salts, bicyclic amidines such as diazabicycloundecene and their derivatives, phosphines, phosphonium salts, etc. can be used, Two or more kinds may be mixed and used.
  • (Silicone resin) A silicone resin having a siloxane bond with Si—O—Si as the main chain can be used.
  • a silicone resin made of a predetermined amount of polyorganosiloxane resin can be used (see, for example, JP-A-6-9937).
  • thermosetting polyorganosiloxane resin is not particularly limited as long as it becomes a three-dimensional network structure with a siloxane bond skeleton by a continuous hydrolysis-dehydration condensation reaction by heating. It exhibits curability and has the property of being hard to be re-softened by overheating once cured.
  • Such a polyorganosiloxane resin includes the following general formula (A) as a structural unit, and the shape thereof may be any of a chain, a ring, and a network.
  • R 1 and R 2 represent the same or different substituted or unsubstituted monovalent hydrocarbon groups.
  • R 1 and R 2 an alkyl group such as a methyl group, an ethyl group, a propyl group and a butyl group, an alkenyl group such as a vinyl group and an allyl group, an allyl group such as a phenyl group and a tolyl group Group, a cycloalkyl group such as a cyclohexyl group or a cyclooctyl group, or a group in which a hydrogen atom bonded to a carbon atom of these groups is substituted with a halogen atom, a cyano group, an amino group, or the like, such as a chloromethyl group, 3, 3, Examples include 3-trifluoropropyl group,
  • the polyorganosiloxane resin is usually used after being dissolved in a hydrocarbon solvent such as toluene, xylene or petroleum solvent, or a mixture of these with a polar solvent. Moreover, you may mix
  • a hydrocarbon solvent such as toluene, xylene or petroleum solvent, or a mixture of these with a polar solvent.
  • the method for producing the polyorganosiloxane resin is not particularly limited, and any known method can be used. For example, it can be obtained by hydrolysis or alcoholysis of one or a mixture of two or more organohalogenosilanes.
  • Polyorganosiloxane resins generally contain hydrolyzable groups such as silanol groups or alkoxy groups. The group is contained in an amount of 1 to 10% by weight in terms of a silanol group.
  • These reactions are generally performed in the presence of a solvent capable of melting organohalogenosilane. It can also be obtained by a method of synthesizing a block copolymer by cohydrolyzing a linear polyorganosiloxane having a hydroxyl group, an alkoxy group or a halogen atom at the molecular chain terminal with an organotrichlorosilane.
  • the polyorganosiloxane resin thus obtained generally contains the remaining HCl, but in the composition of the present embodiment, the storage stability is good, so that the one having 10 ppm or less, preferably 1 ppm or less is used. Is good.
  • master 10A the master mold 10A
  • submaster 20 the sub master mold 20
  • master 10B the master of FIG.
  • submaster 30 the master of FIG.
  • the master 10A is a mother die used when the sub master 20 is manufactured, and the sub master 20 is a molding die used when the wafer lens 1 (convex lens portion 5) is molded.
  • the master 10B is a mother die used when the sub master 30 is manufactured, and the sub master 30 is a molding die used when the wafer lens 1 (concave lens portion 7) is molded.
  • the sub masters 20 and 30 are used a plurality of times for mass production of the wafer lens 1, and are different from the masters 10A and 10B in the purpose of use and frequency of use.
  • the master 10 ⁇ / b> A has a plurality of convex portions 14 formed in an array with respect to a rectangular parallelepiped base portion 12.
  • the convex portion 14 is a portion corresponding to the convex lens portion 5 of the wafer lens 1 and protrudes in a substantially hemispherical shape.
  • the outer shape of the master 10A may be a square or a circle as described above. Although the scope of rights of the present invention is not limited by this difference, the following description will be made taking a rectangular shape as an example.
  • the surface (molding surface) shape of the convex portion 14 is a positive shape corresponding to the optical surface shape of the convex lens portion 5 that is molded and transferred onto the glass substrate 3.
  • metal or metal glass can be used as a material of the master 10A.
  • the classification includes ferrous materials and other alloys.
  • the iron system include hot dies, cold dies, plastic dies, high-speed tool steel, general structural rolled steel, carbon steel for mechanical structure, chromium / molybdenum steel, and stainless steel.
  • plastic molds include pre-hardened steel, quenched and tempered steel, and aging treated steel.
  • pre-hardened steel include SC, SCM, and SUS. More specifically, the SC system is PXZ. SCM systems include HPM2, HPM7, PX5, and IMPAX.
  • Examples of the SUS system include HPM38, HPM77, S-STAR, G-STAR, STAVAX, RAMAX-S, and PSL.
  • Examples of iron-based alloys include JP-A-2005-113161 and JP-A-2005-206913.
  • As the non-ferrous alloys copper alloys, aluminum alloys and zinc alloys are well known. Examples include the alloys disclosed in JP-A-10-219373 and JP-A-2000-176970.
  • PdCuSi, PdCuSiNi, etc. are suitable as metallic glass materials because they have high machinability in diamond cutting and less tool wear.
  • Amorphous alloys such as electroless and electrolytic nickel phosphorous plating are also suitable because they have good machinability in diamond cutting.
  • These highly machinable materials may constitute the entire master 10A, or may cover only the surface of the optical transfer surface, in particular, by a method such as plating or sputtering.
  • the master 10A As a material for the master 10A, machining is somewhat difficult, but glass can also be used. If glass is used for the master 10A, the merit of allowing light to pass through can also be obtained. If it is the glass generally used, it will not specifically limit.
  • the molding material of the master 10A there can be mentioned materials that can easily ensure fluidity at a low temperature, such as low melting point glass and metallic glass.
  • a low-melting glass is advantageous because it allows irradiation from the mold side of the sample when molding a UV curable material.
  • the low melting point glass include glass having a glass transition point of about 600 ° C. or lower and a glass composition of ZnO—PbO— B2O3, PbO—SiO2—B2O3, PbO—P2O5-SnF2, and the like.
  • the glass that melts at 400 ° C. or less include PbF2-SnF2-SnO—P2O5 and similar structures.
  • Specific materials include S-FPL51, S-FPL53, S-FSL-5, S-BSL-7, S-BSM-2, S-BSM-4, S-BSM-9, S-BSM10, S-BSM14, S-BSM15 , S-BSM16, S-BSM18, S-BSM22, S-BSM25, S-BSM28, S-BSM71, S-BSM81, S-NSL 3, S-NSL 5, S-NSL36, S-BAL 2, S- BAL 3, S-BAL11, S-BAL12, S-BAL14, S-BAL35, S-BAL41, S-BAL42, S-BAM 3, S-BAM 4, S-BAM12, S-BAH10, S-BAH11, S -BAH27, S-BAH28, S-BAH32, S-PHM52, S-PHM53, S-TIL 1, S-TIL 2, S-TIL 6, S-TIL25, S-TIL26,
  • metallic glass can be easily formed by molding as well.
  • the metal glass has a structure such as JP-A-8-109419, JP-A-8-333660, JP-A-10-81944, JP-A-10-92619, JP-A-2001-140047, JP-A-2001-303218, and JP-T-2003-534925. Although mentioned, it is not necessary to specifically limit to these.
  • the master 10B has a plurality of concave portions 16 formed in an array with respect to a rectangular parallelepiped base portion 12.
  • the concave portion 16 is a portion corresponding to the concave lens portion 7 of the wafer lens 1 and is concave in a substantially hemispherical shape.
  • the outer shape of the master 10B may be a quadrangle or a circle as described above.
  • the surface (molded surface) shape of the concave portion 16 is a negative shape corresponding to the optical surface shape of the concave lens portion 7 molded and transferred onto the glass substrate 3.
  • the material of the master 10B the same material as the master 10A is used.
  • the “submaster 20” is a mold for molding the “convex lens portion 5”, and the “submaster 20B” shown in FIG. 12 is a mold for molding the “convex lens portion 4”. Distinguishes these.
  • the “submaster 20B” is basically the same configuration and material as the “submaster 20”, and the surface shape of the concave portion 24 is only a negative shape corresponding to the convex lens portion 4, and therefore, the submaster 20B is a submaster. Only the master 20 will be described in detail.
  • the sub master 20 is used for molding the convex lens portion 5 of the wafer lens 1 .
  • the sub master 20 is not limited to this, and the sub master 20 has a fine and precise uneven shape (nano-size) on the surface. It can also be applied to molding of optical elements and precision elements that are required to form scale irregularities). For example, molding of a lens array with a single lens or a plurality of lenses arranged in an array, patterned It can also be applied to media substrate molding and nanohole molding technology in nanoimprint technology.
  • the sub master 20 is mainly composed of a molding part 22 and a base material 26.
  • a plurality of recesses 24 are formed in the molding portion 22 in an array.
  • the surface (molding surface) shape of the concave portion 24 is a negative shape corresponding to the convex lens portion 5 in the wafer lens 1, and is concave in a substantially hemispherical shape in FIG.
  • the sub master 30 is mainly composed of a molding part 32 and a base material 36.
  • a plurality of convex portions 34 are formed in an array on the molding portion 32.
  • the surface (molding surface) shape of the convex portion 34 is a positive shape corresponding to the concave lens portion 7 in the wafer lens 1, and protrudes in a substantially hemispherical shape in this figure.
  • the molding part 22 is formed of a resin 22A.
  • the resin 22A a resin having good releasability, particularly a transparent resin is preferable. It is excellent in that it can be released without applying a release agent.
  • any of a photocurable resin, a thermosetting resin, and a thermoplastic resin may be used.
  • the photo-curable resin examples include a fluorine-based resin
  • examples of the thermosetting resin include a fluorine-based resin and a silicone-based resin.
  • a resin having good releasability that is, a resin having a low surface energy when cured is preferable.
  • examples of the thermoplastic resin include transparent and relatively good releasable olefin resins such as polycarbonate and cycloolefin polymer.
  • the release property is improved in the order of fluorine resin, silicone resin, and olefin resin.
  • the base material 26 may be omitted. By using such a resin, it can be bent, so that it becomes more advantageous at the time of mold release.
  • the molding part 32 is also made of the same material (resin 32A) as the molding part 22.
  • the resin 32A and the resin 22A may be the same type of resin or different types of resins.
  • fluorine resin As fluororesin, PTFE (polytetrafluoroethylene), PFA (tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer), FEP (tetrafluoroethylene / hexafluoropropylene copolymer (4,6 fluorinated)), ETFE (tetrafluoroethylene / ethylene copolymer), PVDF (polyvinylidene fluoride (difluoride)), PCTFE (polychlorotrifluoroethylene (trifluoride)), ECTFE (chlorotrifluoroethylene / ethylene copolymer) ), PVF (polyvinyl fluoride) and the like.
  • fluorine resin polytetrafluoroethylene
  • PFA tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer
  • FEP tetrafluoroethylene / hexafluoropropylene copoly
  • Fluorine-based resin has advantages such as releasability, heat resistance, chemical resistance, insulation, and low friction, but the disadvantage is that it is inferior in transparency because it is crystalline. Since the melting point is high, a high temperature (about 300 ° C.) is required during molding.
  • the molding method is cast molding, injection molding, extrusion molding, blow molding, transfer molding, etc.
  • FEP, PFA, PVDF, etc. that are excellent in light transmittance and can be injection molding and extrusion molding are particularly preferable. .
  • melt moldable grades examples include Asahi Glass Fluon PFA, Sumitomo 3M Dyneon PFA, Dyneon THV, and the like.
  • the Dyneon THV series is preferable because it has a low melting point (about 120 ° C.) and can be molded at a relatively low temperature and is highly transparent.
  • Silicone resins include one-part moisture curing type and two-part addition reaction type and two-part condensation type.
  • Advantages include releasability, flexibility, heat resistance, flame resistance, moisture permeability, low water absorption, and many transparent grades, but disadvantages include large linear expansion.
  • a silicone resin for mold making that contains a PDMS (polydimethylsiloxane) structure is preferable because of good release properties, and a highly transparent grade of RTV elastomer is desirable.
  • RTV elastomer for example, TSE3450 manufactured by Momentive Performance Materials (2-component mixed, additive type), ELASTOSIL M 4647 (2-component RTV silicone rubber) manufactured by Asahi Kasei Wacker Silicone, and KE-1603 manufactured by Shin-Etsu Silicone (added two-component mixed, added) Type RTV rubber), SH-9555 manufactured by Toray Dow Corning (two-component mixed, addition type RTV rubber), SYLGARD 184, Sylpot 184, WL-5000 series (photosensitive silicone buffer material, which can be patterned by UV) and the like are preferable.
  • the molding method is room temperature curing or heat curing in the case of a two-component RTV rubber.
  • the advantage of the silicone resin is that it can be easily released from the master 10 and is excellent in transferability.
  • the drawback is soft and fragile. Therefore, when the convex lens portion 5 is molded, it has several tens to 100 shots. There is no point.
  • Ni nickel
  • the coating method may be any of electroforming, vapor deposition, sputtering and the like. This increases the number of shots. However, the releasability to the convex lens portion 5 is not so good. Therefore, a release agent is further applied on the Ni coat.
  • the resin part 22A of the molding part 22 is PDMS, and the surface thereof is Ni-coated, and further, by applying a release agent, the release property from the master 10 and the convex lens part 5 is improved, The life of the sub master 20 can be extended. In addition, it is easy to make the submaster 20, which leads to cost reduction.
  • a material having a hydrolyzable functional group bonded to the end such as a silane coupling agent structure, that is, dehydration condensation or hydrogen bonding with an OH group present on the metal surface is caused. And those having a structure that binds to each other.
  • a release agent having a silane coupling structure at the end and a release function at the other end the more OH groups are formed on the surface of the submaster, the more points of covalent bonding on the surface of the submaster. , A stronger bond is possible.
  • the release effect is not diminished and the durability is increased.
  • a primer underlayer, SiO 2 coat, etc.
  • the material having a hydrolyzable functional group bonded to the terminal preferably includes a material composed of an alkoxysilane group, a halogenated silane group, a quaternary ammonium salt, a phosphate ester group or the like as a functional group.
  • the terminal group may be a group that causes a strong bond with the mold, such as triazine thiol. Specifically, it has an alkoxysilane group (the following general formula (B)) or a halogenated silane group (the following general formula (C)) represented by the following general formula.
  • R1 and R2 are alkyl groups (eg, methyl, ethyl, propyl, butyl, etc.), n and m are 1, 2 or 3, and R3 is an alkyl group (eg, methyl, ethyl, propyl) Group, butyl group, etc.) or alkoxy group (for example, methoxy group, ethoxy group, butoxy group, etc.).
  • X is a halogen atom (for example, Cl, Br, I).
  • R1, R2, R3 or X when two or more of R1, R2, R3 or X are bonded to Si, they may be different within the above group or atom range, for example, so that two Rm are an alkyl group and an alkoxy group. Good.
  • the alkoxysilane group —SiOR1 and the halogenated silane group —SiX react with moisture to become —SiOH, which further undergoes dehydration condensation or hydrogen bonding with the OH group present on the surface of the mold material such as glass or metal. Wake up and join.
  • FIG. 13 shows a reaction diagram between a release agent using an alkoxysilane group as an example of a hydrolyzable functional group at the terminal and an OH group on the surface of the master 10.
  • FIG. 13A —OR represents methoxy (—OCH 3 ) or ethoxy (—OC 2 H 5 ), and generates methanol (CH 3 OH) or ethanol (C 2 H 5 OH) by hydrolysis.
  • silanol (—SiOH) in FIG. 13B is obtained. Thereafter, it is partially dehydrated and condensed to form a silanol condensate as shown in FIG. Further, as shown in FIG. 13 (d), it is adsorbed by OH groups and hydrogen bonds on the surface of the master 10 (inorganic material), and finally dehydrated as shown in FIG. 13 (e) to form —O—chemical bonds (covalent bonds).
  • FIG. 13 shows the case of an alkoxysilane group, basically the same reaction occurs in the case of a halogenated silane group.
  • the mold release agent used in the present invention is chemically bonded to the surface of the submaster at one end, and the functional group is oriented at the other end to cover the submaster, which is thin and uniform in durability.
  • a release layer can be formed.
  • a structure having a releasability function preferably has a low surface energy, such as a fluorine-substituted hydrocarbon group or a hydrocarbon group.
  • Fluorine-substituted hydrocarbon groups include fluorine-substituted hydrocarbons that have a perfluoro group (a and b are integers) such as CF3 (CF2) a- and CF3 / CF3 / CF (CF2) b- groups at one end of the molecular structure.
  • a hydrocarbon group is preferable, and the length of the perfluoro group is preferably 2 or more, and the number of CF2 groups following CF3 of CF3 (CF2) a- is 5 or more.
  • the perfluoro group does not need to be a straight chain and may have a branched structure.
  • a structure such as CF3 (CF2) c- (CH2) d- (CF2) e- may be used in response to recent environmental problems.
  • c is 3 or less
  • d is an integer (preferably 1)
  • e is 4 or less.
  • the above-mentioned fluorine release agent is usually a solid, but in order to apply it to the surface of the submaster, it is necessary to make it a solution dissolved in an organic solvent.
  • a fluorinated hydrocarbon solvent or a mixture of some organic solvent is suitable as the solvent.
  • the concentration of the solvent is not particularly limited, but the required release film is characterized by being particularly thin. Therefore, a low concentration is sufficient, and it may be 1 to 3% by weight.
  • a usual application method such as dip coating, spray coating, brush coating, spin coating, or the like can be used. After coating, the solvent is evaporated by natural drying to obtain a dry coating film.
  • the film thickness applied at this time is not particularly specified, but 20 ⁇ m or less is appropriate.
  • the hydrocarbon group may be linear, such as CnH2n + 1, or may be branched. Silicone release agents are included in this category.
  • compositions having an organopolysiloxane resin as a main component and forming a cured film exhibiting water repellency.
  • JP-A-55-48245 discloses a hydroxyl group-containing methylpolysiloxane resin, ⁇ , ⁇ -dihydroxydiorganopolysiloxane, and organosilane, which are cured to provide excellent releasability and antifouling properties.
  • Compositions have been proposed that form the films shown.
  • 59-140280 discloses a composition mainly composed of a partial cohydrolyzed condensate of an organosilane mainly composed of a perfluoroalkyl group-containing organosilane and an amino group-containing organosilane.
  • a composition that forms a cured film excellent in oil repellency has been proposed.
  • thermoplastic resin examples include transparent resins such as alicyclic hydrocarbon resins, acrylic resins, polycarbonate resins, polyester resins, polyether resins, polyamide resins, and polyimide resins.
  • transparent resins such as alicyclic hydrocarbon resins, acrylic resins, polycarbonate resins, polyester resins, polyether resins, polyamide resins, and polyimide resins.
  • a hydrocarbon-based resin is preferably used.
  • the submaster 20 is made of a thermoplastic resin, the injection molding technique that has been conventionally performed can be used as it is, and the submaster 20 can be easily manufactured. Further, if the thermoplastic resin is an alicyclic hydrocarbon-based resin, the hygroscopic property is very low, so the life of the submaster 20 is extended. In addition, since cycloaliphatic hydrocarbon resins such as cycloolefin resins are excellent in light resistance and light transmittance, in order to cure actinic ray curable resins, light having a short wavelength such as a UV light source may be used. There is little deterioration and it can be used as a mold for a long time.
  • Examples of the alicyclic hydrocarbon-based resin include those represented by the following formula (1).
  • “x” and “y” represent copolymerization ratios and are real numbers satisfying 0/100 ⁇ y / x ⁇ 95/5.
  • “N” is 0, 1 or 2, and represents the number of substitutions of the substituent Q.
  • “R 1 ” is one or more (2 + n) -valent groups selected from a hydrocarbon group having 2 to 20 carbon atoms.
  • “R 2 ” is a hydrogen atom or a monovalent group of one or more selected from the group consisting of carbon and hydrogen and having 1 to 10 carbon atoms.
  • “R 3 ” is one or two or more divalent groups selected from a hydrocarbon group having 2 to 20 carbon atoms.
  • Q is COOR 4 (R 4 is a hydrogen atom or a hydrocarbon, and is one or more monovalent groups selected from a structural group having 1 to 10 carbon atoms). It is 1 type or 2 or more types of monovalent group chosen from the structural group made.
  • R1 is preferably one or more divalent groups selected from the group of hydrocarbon groups having 2 to 12 carbon atoms, more preferably the following general formula (2) ( In formula (2), p is an integer of 0 to 2);
  • R1 preferably a divalent group in which p is 0 or 1 in the general formula (2).
  • the structure of R1 may be used alone or in combination of two or more.
  • R2 include a hydrogen atom, a methyl group, an ethyl group, an n-propyl group, an i-propyl group, an n-butyl group, a 2-methylpropyl group, etc., preferably a hydrogen atom and / or A methyl group, most preferably a hydrogen atom.
  • Etc. N is preferably 0.
  • the type of copolymerization is not particularly limited, and known copolymerization types such as random copolymerization, block copolymerization, and alternating copolymerization can be applied, but random copolymerization is preferable. is there.
  • the polymer used in the present embodiment has a repeating structural unit derived from another copolymerizable monomer as required, as long as the physical properties of the product obtained by the molding method of the present embodiment are not impaired. You may do it.
  • the copolymerization ratio is not particularly limited, but is preferably 20 mol% or less, more preferably 10 mol% or less.
  • the optical characteristics are impaired and a high-precision optical component is obtained. May not be obtained.
  • the type of copolymerization at this time is not particularly limited, but random copolymerization is preferred.
  • thermoplastic alicyclic hydrocarbon polymer applied to the submaster 20 is an alicyclic structure in which the repeating unit having an alicyclic structure is represented by the following general formula (4):
  • the total content of the repeating unit (a) having a chain structure repeating unit (b) represented by the following formula (5) and / or the following formula (6) and / or the following formula (7) is 90.
  • examples thereof include a polymer that is contained in an amount of not less than mass%, and further the content of the repeating unit (b) is not less than 1 mass% and less than 10 mass%.
  • R21 to R33 each independently represent a hydrogen atom, a chain hydrocarbon group, a halogen atom, an alkoxy group, a hydroxy group, an ether group, Chains substituted with ester groups, cyano groups, amino groups, imide groups, silyl groups, and polar groups (halogen atoms, alkoxy groups, hydroxy groups, ester groups, cyano groups, amide groups, imide groups, or silyl groups) Represents a hydrocarbon group or the like.
  • the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
  • Examples of the chain hydrocarbon group substituted with a polar group include, for example, 1 to 20 carbon atoms, preferably Examples thereof include 1 to 10, more preferably 1 to 6 halogenated alkyl groups.
  • As the chain hydrocarbon group for example, an alkyl group having 1 to 20 carbon atoms, preferably 1 to 10 carbon atoms, more preferably 1 to 6 carbon atoms: 2 to 20 carbon atoms, preferably 2 to 10 carbon atoms, more preferably 2 to 6 carbon atoms. 6 alkenyl groups.
  • X in the above formula (4) represents an alicyclic hydrocarbon group, and the number of carbon atoms constituting the group is usually 4 to 20, preferably 4 to 10, more preferably 5 to 7 It is. Birefringence can be reduced by setting the number of carbon atoms constituting the alicyclic structure within this range.
  • the alicyclic structure is not limited to a monocyclic structure, and may be a polycyclic structure such as a norbornane ring.
  • the alicyclic hydrocarbon group may have a carbon-carbon unsaturated bond, but the content thereof is 10% or less, preferably 5% or less, more preferably 3% or less of the total carbon-carbon bonds. is there. By setting the carbon-carbon unsaturated bond of the alicyclic hydrocarbon group within this range, transparency and heat resistance are improved.
  • the carbon constituting the alicyclic hydrocarbon group includes a hydrogen atom, hydrocarbon group, halogen atom, alkoxy group, hydroxy group, ester group, cyano group, amide group, imide group, silyl group, and polar group (
  • a chain hydrocarbon group substituted with a halogen atom, an alkoxy group, a hydroxy group, an ester group, a cyano group, an amide group, an imide group, or a silyl group) may be bonded, and among them, the number of hydrogen atoms or carbon atoms 1 to 6 chain hydrocarbon groups are preferred in terms of heat resistance and low water absorption.
  • the above formula (6) has a carbon-carbon unsaturated bond in the main chain
  • the above formula (7) has a carbon-carbon saturated bond in the main chain.
  • the content of unsaturated bonds is usually 10% or less, preferably 5% or less, more preferably 3% or less, of all carbon-carbon bonds constituting the main chain.
  • the total content with the repeating unit (b) having a chain structure represented by (6) and / or the general formula (7) is usually 90% or more, preferably 95% or more, more preferably 97 on a weight basis. % Or more.
  • an aromatic vinyl compound is copolymerized with another monomer that can be copolymerized, and a carbon-carbon unsaturated bond of the main chain and the aromatic ring is formed.
  • the method of hydrogenating is mentioned.
  • the molecular weight of the copolymer before hydrogenation is 1,000 to 1,000,000, preferably 5,000 to 500,000 in terms of polystyrene (or polyisoprene) equivalent weight average molecular weight (Mw) measured by GPC. More preferably, it is in the range of 10,000 to 300,000.
  • Mw weight average molecular weight
  • aromatic vinyl compound used in the above method include, for example, styrene, ⁇ -methylstyrene, ⁇ -ethylstyrene, ⁇ -propylstyrene, ⁇ -isopropylstyrene, ⁇ -t-butylstyrene, 2- Methylstyrene, 3-methylstyrene, 4-methylstyrene, 2,4-diisopropylstyrene, 2,4-dimethylstyrene, 4-t-butylstyrene, 5-t-butyl-2-methylstyrene, monochlorostyrene, dichlorostyrene Monofluorostyrene, 4-phenylstyrene and the like, and styrene, 2-methylstyrene, 3-methylstyrene, 4-methylstyrene and the like are preferable.
  • aromatic vinyl compounds can be used alone or in combination of two
  • Other monomers that can be copolymerized are not particularly limited, but chain vinyl compounds and chain conjugated diene compounds are used. When chain conjugated dienes are used, the operability in the production process is excellent. The resulting alicyclic hydrocarbon copolymer is excellent in strength properties.
  • chain vinyl compound examples include chain olefin monomers such as ethylene, propylene, 1-butene, 1-pentene and 4-methyl-1-pentene; 1-cyanoethylene (acrylonitrile), 1-cyano- Nitrile monomers such as 1-methylethylene (methacrylonitrile) and 1-cyano-1-chloroethylene ( ⁇ -chloroacrylonitrile); 1- (methoxycarbonyl) -1-methylethylene (methacrylic acid methyl ester), 1- (Ethoxycarbonyl) -1-methylethylene (methacrylic acid ethyl ester), 1- (propoxycarbonyl) -1-methylethylene (methacrylic acid propyl ester), 1- (butoxycarbonyl) -1-methylethylene (methacrylic) Acid butyl ester), 1-methoxycarbo (Meth) acrylic acid such as ruethylene (acrylic acid methyl ester), 1-ethoxycarbonylethylene (acrylic acid ethyl ester), 1-propoxycarbonylethylene (acryl
  • chain conjugated diene examples include 1,3-butadiene, isoprene, 2,3-dimethyl-1,3-butadiene, 1,3-pentadiene, 1,3-hexadiene, and the like.
  • chain vinyl compounds and chain conjugated dienes chain conjugated dienes are preferable, and butadiene and isoprene are particularly preferable.
  • These chain vinyl compounds and chain conjugated dienes can be used alone or in combination of two or more.
  • the polymerization reaction is not particularly limited, such as radical polymerization, anionic polymerization, and cationic polymerization.
  • the polymerization operation, the ease of the hydrogenation reaction in the post-process, and the mechanical properties of the finally obtained hydrocarbon copolymer are not limited.
  • the anionic polymerization method is preferable.
  • anionic polymerization bulk polymerization, solution polymerization, slurry polymerization, etc. in the temperature range of usually 0 ° C. to 200 ° C., preferably 20 ° C. to 100 ° C., particularly preferably 20 ° C. to 80 ° C. in the presence of an initiator.
  • solution polymerization is preferable in view of removal of reaction heat.
  • an inert solvent capable of dissolving the polymer and its hydride is used.
  • Examples of the inert solvent used in the solution reaction include aliphatic hydrocarbons such as n-butane, n-pentane, iso-pentane, n-hexane, n-heptane, and iso-octane; cyclopentane, cyclohexane, methylcyclopentane, Examples thereof include alicyclic hydrocarbons such as methylcyclohexane and decalin; aromatic hydrocarbons such as benzene and toluene.
  • Examples of the initiator for anionic polymerization include monoorganolithium such as n-butyllithium, sec-butyllithium, t-butyllithium, hexyllithium, and phenyllithium, dilithiomethane, 1,4-diobtan, 1,4-dilithiol.
  • a polyfunctional organolithium compound such as 2-ethylcyclohexane can be used.
  • the reaction method and reaction form are special. There is no particular limitation, and it may be carried out according to a known method, but a hydrogenation method that can increase the hydrogenation rate and has little polymer chain scission reaction that occurs simultaneously with the hydrogenation reaction is preferable, for example, in an organic solvent, nickel,
  • the method is performed using a catalyst containing at least one metal selected from cobalt, iron, titanium, rhodium, palladium, platinum, ruthenium, and rhenium.
  • the hydrogenation reaction is usually from 10 ° C.
  • the hydrogen pressure is usually 0.1 MPa to 30 MPa, but in addition to the above reasons, it is preferably 1 MPa to 20 MPa, more preferably 2 MPa to 10 MPa from the viewpoint of operability.
  • the hydrogenation rate of the hydride obtained in this way is determined by 1 H-NMR as measured by the main chain carbon-carbon unsaturated bond, aromatic ring carbon-carbon double bond, unsaturated ring carbon- All of the carbon double bonds are usually 90% or more, preferably 95% or more, more preferably 97% or more. When the hydrogenation rate is low, the low birefringence, thermal stability, etc. of the resulting copolymer are lowered.
  • the method for recovering the hydride after completion of the hydrogenation reaction is not particularly limited. Usually, after removing the hydrogenation catalyst residue by a method such as filtration or centrifugation, the solvent is removed directly from the hydride solution by drying, the hydride solution is poured into a poor solvent for the hydride, and the hydride A method of coagulating can be used.
  • the surface of the sub-master made of thermoplastic resin is Ni-coated to provide a release agent.
  • Base material Even if the base material 26 is inferior in strength only by the molding part 22 of the sub master 20, the strength of the sub master 20 is increased by sticking the base material 26 to the molding part 22, and can be molded many times. It is a backing material.
  • the base material 26 may be made of a material different from that of the molding part 22 or may be integrally made of the same material as that of the molding part 22.
  • any material having smoothness such as quartz, silicone wafer, metal, glass, resin, ceramics and the like may be used. Constructing the base material 26 integrally with the same material as the molding part 22 means that the sub-master 20 is substantially constituted only by the molding part 22.
  • the base material 36 is also the same as the base material 26, and may be made of a material different from that of the molding part 32, or may be integrally made of the same material as that of the molding part 32.
  • any material having smoothness such as quartz, silicone wafer, metal, glass, resin, ceramics, etc. may be used. Constructing the base material 36 integrally with the molding part 32 and the same material means that the sub-master 30 is substantially constituted only by the molding part 32. From the viewpoint of transparency, considering that UV irradiation can be performed from above or below the submaster 20, a transparent mold such as quartz, glass, or transparent resin is preferable.
  • the transparent resin may be a thermoplastic resin, a thermosetting resin, or a UV curable resin, and may have an effect of reducing the linear expansion coefficient by adding fine particles to the resin.
  • a resin in this way, it is easier to release when it is released because it bends than glass.
  • the resin since the resin has a large coefficient of linear expansion, the shape is deformed when heat is generated during UV irradiation. There is a drawback that it cannot be transferred cleanly.
  • a ring-shaped spacer 40 is arranged on the peripheral portion of the submaster 30 and a predetermined amount of resin 7A is dropped on the molding portion 32 of the submaster 30.
  • the glass substrate 3 is arranged and pressed on the resin 7 ⁇ / b> A
  • the resin 7 ⁇ / b> A is filled between the submaster 30 and the glass substrate 3, and the convex portion 34 of the submaster 30 is The shape is transferred to the resin 7A.
  • the shape of the convex portion 34 of the sub master 30 is transferred to the resin 7A, it is preferably performed in a vacuum atmosphere, thereby suppressing or preventing air bubbles from being mixed into the resin 7A.
  • the resin 7A is a photocurable resin
  • the resin 7A is cured by irradiating light from one or both of the upper side of the glass substrate 3 and the lower side of the submaster 30 to form the concave lens portion 7.
  • the submaster 30 needs to be made of a light transmissive (transparent) material.
  • the resin 7A is a thermosetting resin
  • the resin 7A is heated to cure the resin 7A, and the concave lens portion 7 is formed.
  • the molding surface of the mold is lowered as it is and the molding surface of the molding die is pressed against the glass substrate. Will be. At this time, the resin does not spread uniformly, and bubbles are mixed in, so that a high-performance wafer lens may not be manufactured.
  • a preparation step of preparing a molding die having a plurality of molding surfaces corresponding to the optical surface shape of the optical member A filling step of filling the curable resin between the mold and the substrate; a curing step of curing the curable resin filled between the mold and the substrate; and from the substrate to the molding die.
  • the mold is preferably pressed against the substrate while the central portion of the mold is bent toward the substrate.
  • the mold is pressed against the substrate while the central portion of the mold is bent toward the substrate, so that the contact area with the resin of the mold can be gradually increased, and the resin is uniformly spread. Can continue. Therefore, it is possible to prevent air bubbles from being mixed in and to stably manufacture a high-performance wafer lens.
  • a glass substrate 3 is placed on a base 50 made of quartz, glass, etc., and a predetermined amount is placed on the glass substrate 3.
  • the resin 7A may be dropped, and the center portion of the submaster 30 may be gradually pressed from the center portion in a state where the center portion of the submaster 30 is bent downward (in a bent state).
  • the glass substrate 3 is placed on the base 50, a predetermined amount of the resin 7A is dropped on the glass substrate 3, and the sub master 30 is tilted with respect to the resin 7A.
  • the pressing may be performed while gradually descending from one end to the other end.
  • the vacuum apparatus 100 has a lower table 110 and an upper table 130, which are arranged to face each other.
  • the position of the lower table 110 is fixed, and the upper table 130 is movable in the vertical direction with respect to the lower table 110.
  • a support portion 112 is provided at the center of the lower table 110, and a communication groove 114 is formed concentrically on the support portion 112.
  • a suction mechanism 116 is connected to the communication groove 114. When the suction mechanism 116 is operated, air is sucked from the communication groove 114, and members on the support portion 112 can be sucked and fixed. .
  • the lower table 110 is provided with a suction mechanism 118, and by operating the suction mechanism 118, it is possible to suck the area (the molding chamber 150) between the lower table 110 and the upper table 130. It has become.
  • a seal 120 is provided at the peripheral edge of the lower table 110 to bring the lower table 110 and the upper table 130 into close contact with each other.
  • the upper table 130 is mainly composed of a vacuum chuck part 132 and a holding part 134.
  • a ring-shaped seal 136 (O-ring) is interposed between the vacuum chuck part 132 and the holding part 134, and the adhesion between the vacuum chuck part 132 and the holding part 134 is enhanced.
  • a communication groove 138 is formed concentrically below the vacuum chuck portion 132.
  • a suction / delivery mechanism 140 is connected to the communication groove 138, and air can be sucked or delivered from the communication groove 138 by operating the suction / delivery mechanism 140.
  • a mold retainer 144 is provided at a lower portion of the holding portion 134 via a screw 142. By rotating the screw 142, the mold retainer 144 can be moved in the vertical direction.
  • a ring-shaped seal 146 (O-ring) is provided between the mold retainer 144 and the vacuum chuck part 132, and a member (submaster 30) fixed between the vacuum chuck part 132 and the holding part 134. Adhesion with the vacuum chuck part 132 is improved.
  • the lower table 110 is shown in FIG.
  • the glass substrate 3 is placed on the support portion 112 and the suction mechanism 116 is operated to suck and fix the glass substrate 3 on the support portion 112, and a predetermined amount of resin 7A is dropped onto the glass substrate 3.
  • the rotation amount of the screw 142 of the upper table 130 is adjusted to fix the sub master 30 between the mold retainer 144 and the holding portion 134.
  • the suction / delivery mechanism 140 of the upper table 130 is operated to send out air from the communication groove 138, and the sub master 30 is bent downward. Then, the upper table 130 is lowered while the suction mechanism 118 of the lower table 110 is operated, and can be pressed against the resin 7A in a state where the central portion of the molding portion 32 of the sub master 30 is curved.
  • the sub master 30 is pressed against the glass substrate 3 while being bent toward the glass substrate 3, so that the contact area of the sub master 30 with the resin 7A can be gradually increased, and the resin 7A Can be spread evenly. Therefore, it is possible to prevent bubbles from entering the resin 7A.
  • the upper table 130 abuts on the seal 120 of the lower table 110, and a closed region (that is, the molding chamber 150) is formed between the upper table 130 and the lower table 110.
  • the inside of the molding chamber 150 can be in a vacuum or a state close to this, and the resin 7A can be molded in this state. If the resin 7A is molded while the inside of the molding chamber 150 is held in a vacuum or a state close to this, it is possible to reliably suppress or prevent bubbles from entering the resin 7A.
  • the resin 5A is dropped on the glass substrate 3, and the sub-master 20 is disposed above the resin 5A.
  • an alignment member 60 having a ball-shaped tip is disposed between the spacer 40 and the sub master 20, and in this state, the sub master 20 faces the sub master 30. The position is lowered to adjust (position) the inclination of the sub master 20 relative to the sub master 30 and the position of the XY plane.
  • the alignment member 60 is removed from between the sub master 20 and the spacer 40, and the glass substrate 3 and the sub master 20 are
  • the resin 5A is filled in between, and the shape of the concave portion 24 of the molding portion 22 of the sub master 20 is transferred to the resin 5A.
  • the shape of the concave portion 24 of the sub master 20 is transferred to the resin 5A, it is preferably performed in a vacuum atmosphere, thereby suppressing or preventing air bubbles from being mixed into the resin 5A.
  • the resin 5A is a photocurable resin, as shown in FIG. 4 (f)
  • the light source 70 is arranged above one or both of the upper side of the sub master 20 and the lower side of the sub master 30.
  • the resin 5 ⁇ / b> A is cured by irradiating with light to form the convex lens portion 5.
  • the submasters 20 and 30 need to be made of a light transmissive (transparent) material.
  • Examples of the light source 70 include a high pressure mercury lamp, a metal halide lamp, a xenon lamp, a halogen lamp, a fluorescent lamp, a black light, a G lamp, and an F lamp, and may be a linear light source or a point light source.
  • the high-pressure mercury lamp is a lamp having a narrow spectrum at 365 nm and 436 nm.
  • a metal halide lamp is a kind of mercury lamp, and its output in the ultraviolet region is several times higher than that of a high-pressure mercury lamp.
  • a xenon lamp is a lamp having a spectrum closest to sunlight.
  • Halogen lamps contain a lot of long-wavelength light and are mostly near-infrared light. Fluorescent lamps have uniform illumination intensity for the three primary colors of light. Black light has a peak top at 351 nm and emits near-ultraviolet light from 300 nm to 400 nm.
  • a plurality of linear or point light sources 70 may be arranged in a lattice shape so that the light reaches the entire surface of the resin 5A at one time, or linear or dotted.
  • the light source 70 may be scanned in parallel to the surface of the resin 5A so that the light sequentially reaches the resin 5A.
  • a luminance distribution and an illuminance (intensity) distribution during light irradiation are measured, and the number of irradiations, irradiation amount, irradiation time, and the like are controlled based on the measurement results.
  • the convex lens portion 5 may be post-cured (heat treatment). If post cure is performed, the resin 5A of the convex lens portion 5 can be completely cured, and the life of the convex lens portion 5 can be extended.
  • the resin 5A is a thermosetting resin
  • the resin 5A is heated to cure the resin 5A, and the convex lens portion 5 is formed.
  • the resin 7A is kept uncured without being cured by light or heat, and in the molding process of the convex lens portion 5 in FIG.
  • the resin 5A and the resin 7A may be simultaneously cured by light or heat to form the convex lens portion 5 and the concave lens portion 7 simultaneously.
  • the sub-masters 20 and 30 are released from the glass substrate 3 on which the convex lens portion 5 and the concave lens portion 7 are formed, and the wafer lens 1 is manufactured.
  • the peripheral portion of the sub master 20 is directed upward so that the center portion of the sub master 20 is curved downward.
  • the submaster 20 may be released from the glass substrate 3 while being peeled off and gradually raised from the peripheral edge to the center.
  • the other end is raised with respect to the convex lens portion 5 with one end of the sub-master 20 as a fulcrum, and the other end is gradually raised from the glass substrate 3.
  • the sub master 20 may be released.
  • the central portion of the sub-master 30 is moved using the vacuum device and the pressing method shown in FIGS.
  • the submaster 20 is released from the glass substrate 3 in the reverse order of the process in which the resin 7A is pressed while being bent downward.
  • the resin 7A in the step of forming the concave lens portion 7 in FIG. 4B, the resin 7A is not cured by light or heat and is kept uncured, and the convex lens portion 5 in FIG.
  • the resin 7A is not cured and contracted on only one surface of the glass substrate 3, and the glass 7 Resins 5A and 7A are simultaneously cured and shrunk on both surfaces of substrate 3 to form convex lens portion 5 and concave lens portion 7, respectively.
  • the warp of the glass substrate 3 can be prevented, and the shape of the convex lens portion 5 and the concave lens portion 7 Accuracy can be improved.
  • the filled resins 5A and 7A can be simultaneously cured and simultaneously molded on both surfaces of the glass substrate 3, so that the number of steps can be simplified.
  • the sub masters 20 and 30 are used to show the convex lens portion 5 on the front surface of the glass substrate 3 and the concave lens portion 7 on the back surface.
  • the convex lens portions 5 may be formed on both the front and back surfaces of the glass substrate 3, or the concave lens portions 7 may be formed on both the front and back surfaces of the glass substrate 3 using only the submaster 30.
  • [Modification] In the process of FIG. 4A, a predetermined amount of the resin 7A is simply dropped on the molding portion 32 of the submaster 30, but as shown in FIG. 9A, the resin 7A is dropped while being dispersed over a plurality of locations. Alternatively, the glass substrate 3 may be pressed by dropping the resin 7A while dispersing the resin 7A for each convex portion 34 so as to correspond to each convex portion 34 of the molding portion 32 of the submaster 30.
  • the resin 7A is dropped on the glass substrate 3 while being dispersed over a plurality of locations, and preferably the glass 7A is dispersed for each convex portion 34 so as to correspond to each convex portion 34 of the molding portion 32. It may be dropped on the substrate 3 and the sub master 30 may be pressed against the resin 7A.
  • a predetermined amount of resin 5A is simply dropped on the glass substrate 3, but as shown in FIG. 9B, the resin 5A is dropped while being dispersed over a plurality of locations.
  • the resin 5A may be dropped while being dispersed for each recess 24 so as to correspond to each recess 24 of the molding portion 22 of the sub master 20, and the sub master 20 may be pressed.
  • the resins 5A and 7A are dropped while being dispersed over a plurality of locations, the resins 5A and 7A are filled when the resins 5A and 7A are filled between the glass substrate 3 and the submasters 20 and 30.
  • the glass substrate 3 and the sub master 20 are pressed against the resin 5A, 7A. It is difficult to apply a uniform pressure.
  • the pressing force of the glass substrate 3 and the sub master 20 is easily applied to the resins 5A and 7A.
  • the resins 5A and 7A are applied to the concave portions 24 of the sub masters 20 and 30, respectively.
  • the convex lens portion 5 and the concave lens portion 7 can be formed from any of the concave portions 24 and the convex portions 34.
  • the sub master 20 is molded from the master 10A.
  • master 10A refers to a matrix for molding “submaster 20” for molding “convex lens portion 5”, and for molding “submaster 20B” for molding “convex lens portion 4”. And “master” (not shown).
  • a resin 22A is applied on the master 10A, the convex portions 14 of the master 10A are transferred to the resin 22A, the resin 22A is cured, and a plurality of concave portions 24 are formed on the resin 22A. Thereby, the shaping
  • the resin 22A may be thermosetting, photocurable, or volatile curable (the solvent is volatilized and cured, HSQ (hydrogen silsesquioxane or the like)).
  • HSQ hydrogen silsesquioxane or the like
  • molding with UV curable or volatile curable resin, which is less affected by thermal expansion of resin 22A is preferable because it does not apply heat to curing, but is not limited thereto. Since the resin 22A having good releasability from the master 10A after curing does not require a large force at the time of peeling, the molded optical surface shape and the like are more preferable without being inadvertently deformed.
  • the optical surface shape (convex part 14) of the master 10A is preferably cured by shrinkage or resin of the resin 22A. Designed for 5A cure shrinkage.
  • the resin 22A When the resin 22A is applied on the master 10A, a technique such as spray coating or spin coating is used. In this case, the resin 22A may be applied while evacuating. If the resin 22A is applied while evacuating, the resin 22A can be cured without introducing bubbles into the resin 22A.
  • the release agent described above may be applied to the surface of the master 10A to improve the release property.
  • the surface of the master 10A is modified. Specifically, an OH group is made to stand on the surface of the master 10A.
  • the surface modification method may be any method that allows OH groups to stand on the surface of the master 10A, such as UV ozone cleaning and oxygen plasma ashing.
  • the light source 50 disposed above the master 10A is turned on and irradiated with light.
  • Examples of the light source 51 include a high-pressure mercury lamp, a metal halide lamp, a xenon lamp, a halogen lamp, a fluorescent lamp, a black light, a G lamp, and an F lamp, and may be a linear light source or a point light source.
  • the high-pressure mercury lamp is a lamp having a narrow spectrum at 365 nm and 436 nm.
  • a metal halide lamp is a kind of mercury lamp, and its output in the ultraviolet region is several times higher than that of a high-pressure mercury lamp.
  • a xenon lamp is a lamp having a spectrum closest to sunlight.
  • Halogen lamps contain a lot of long-wavelength light and are mostly near-infrared light. Fluorescent lamps have uniform illumination intensity for the three primary colors of light. Black light has a peak top at 351 nm and emits near-ultraviolet light from 300 nm to 400 nm.
  • a plurality of linear or point light sources 51 may be arranged in a lattice shape so that the light reaches the entire surface of the resin 22A at one time, or linear or dotted.
  • the light source 51 may be scanned in parallel with the surface of the resin 22A so that the light sequentially reaches the resin 22A.
  • a luminance distribution and an illuminance (intensity) distribution during light irradiation are measured, and the number of irradiations, irradiation amount, irradiation time, and the like are controlled based on the measurement results.
  • the sub master 20 may be post-cured (heat treatment). If post cure is performed, the resin 22A of the submaster 20 can be completely cured, and the mold life of the submaster 20 can be extended.
  • the resin 22A is a thermosetting resin
  • the resin 22A is heated while controlling the heating temperature and the heating time within an optimum range.
  • the resin 22A can be molded by a technique such as injection molding, press molding, light irradiation and then cooling.
  • the base material 26 is attached to the back surface (the surface opposite to the concave portion 24) of the molded portion 22 (resin 22A), and the molded portion 22 is lined.
  • the substrate 26 may be quartz or a glass plate, and it is important to have sufficient bending strength and UV transmittance.
  • a treatment such as applying a silane coupling agent to the base material 26 may be performed.
  • the base material 26 is mounted (lining at room temperature). In some cases, use an adhesive.
  • the convex portion 14 of the master 10A may be transferred to the resin 22A and the base material 26 may be mounted (backed at room temperature) before the resin 22A is cured.
  • the base material 26 is adhered by the adhesive force of the resin 22A without using an adhesive, or the base material 26 is coated with a coupling agent to increase the adhesive force and thereby adhere to the resin 22A. Material 26 is deposited.
  • a conventionally known vacuum chuck device 260 is used, and the base material 26 is sucked and held on the suction surface 260A of the vacuum chuck device 260.
  • the suction portion 260A is parallel to the molding surface of the convex portion 14 in the master 10A, and the molding portion 22 is lined with the base material 26.
  • the back surface 20A (surface on the base material 26 side) of the sub master 20 is parallel to the molding surface of the convex portion 14 in the master 10A, and the molding surface of the recess 24 in the sub master 20 is parallel to the back surface 20A.
  • the reference surface of the submaster 20 that is, the back surface 20 ⁇ / b> A can be made parallel to the molding surface of the recess 24. And variation in thickness can be prevented, and the shape accuracy of the lens unit 5 can be improved. Further, since the sub master 20 is sucked and held by the vacuum chuck device 260, the sub master 20 can be attached and detached only by turning on / off the vacuum exhaust. Therefore, the sub master 20 can be easily arranged.
  • back surface 20A is parallel to the molding surface of the recess 24 specifically means that the back surface 20A is perpendicular to the central axis of the molding surface of the recess 24.
  • the sub master 20 is preferably formed by being cured while being lined with the base material 26, but may be formed by being cured before being lined.
  • a thermosetting resin is used as the resin 22A, and the resin 22A is filled between the master 10A and the base material 26, and the resin 22A is charged into a baking furnace.
  • a UV curable resin is used as the resin 22A, a UV transmissive substrate is used as the base material 26, and the resin 22A is filled between the master 10A and the base material 26 from the base material 26 side. There is a method of irradiating 22A with UV light.
  • the suction surface 260A of the vacuum chuck device 260 is preferably made of a ceramic material.
  • the hardness of the suction surface 260A is high and the suction surface 260A is hardly damaged by the attachment / detachment of the submaster 20 (base material 26), the surface accuracy of the suction surface 260A can be maintained high.
  • the linear expansion coefficient is as small as 1.3 ppm, the flatness of the suction surface 260A can be kept high with respect to the temperature change.
  • the following method is used as a method for bringing the suction surface 260A in parallel with the molding surface of the convex portion 14 in the master 10A.
  • the front and back surfaces of the master 10A are parallelized with high accuracy. Thereby, in the master 10A, the shaping
  • reference members 260C and 260D are provided in a projecting manner on the support surface 260B that supports the master 10A from the back surface (surface opposite to the convex portion 14) and the suction surface 260A, respectively.
  • the shapes of these reference members 260C and 260D are such that when the master 10A and the sub master 20 come into contact with each other in a state where the support surface 260B and the suction surface 260A are parallel to each other, there is no backlash.
  • the reference member may be provided on at least one of the support surface 260B and the suction surface 260A.
  • the shape of the reference member is When the master 10A and the sub master 20 are in contact with each other in a state where the surface 260B and the suction surface 260A are parallel to each other, the shape may be configured to contact the suction surface 260A without backlash.
  • the shape of the reference member is such that when the master 10A and the sub master 20 are in contact with each other with the support surface 260B and the suction surface 260A being parallel to each other, What is necessary is just to make it the shape which contact
  • the molding part 22 and the base material 26 are released from the master 10A, and the sub master 20 is formed.
  • a resin such as PDMS (polydimethylsiloxane) is used as the resin 22A, and further coated with Ni and a release agent is applied to the surface, the releasability from the master 10 is very good. No great force is required for peeling from 10, and the molded optical surface is not distorted.
  • PDMS polydimethylsiloxane
  • the sub master 20B (refer FIG.12 (e)) which has the negative shaped recessed part 24 corresponding to the convex lens part 4 is also formed from the master (not shown) in the same procedure.
  • the convex lens portions 4 and 5 are molded.
  • the resin 5A is filled between the glass substrate 3 and the sub master 20 and cured. More specifically, as shown in FIG. 12A, resin 5A is applied on glass substrate 3, and resin 5A is cured by pressing submaster 20 from above against glass substrate 3 on which resin 5A has been applied.
  • the sub master 20 When the sub master 20 is pressed from above, it may be pressed while evacuating. If pressed while evacuating, the resin 5A can be cured without mixing bubbles in the resin 5A.
  • the concave portion 24 of the submaster 20 is filled with the resin 5A, and the filled resin 5A is The resin 5A may be cured while pressing the glass substrate 3 from above.
  • the glass substrate 3 When the glass substrate 3 is pressed, the glass substrate 3 is preferably provided with a structure for axial alignment with the submaster 20.
  • the glass substrate 3 has a circular shape, for example, it is preferable to form a D cut, an I cut, a marking, a notch, or the like.
  • the glass substrate 3 may have a polygonal shape, and in this case, the axis alignment with the submaster 20 is easy.
  • the resin 5A When the resin 5A is cured, if the resin 5A is a thermosetting resin, it is cured by heating (see FIG. 12B).
  • the resin 5A when the resin 5A is a photo-curable resin, the light source 52 disposed above the sub master 20 may be turned on to emit light from the sub master 20 side, or the light source disposed below the glass substrate 3. 54 may be turned on and light may be irradiated from the glass substrate 3 side, or both the light sources 52 and 54 may be turned on simultaneously and light may be irradiated from both sides of the submaster 20 side and the glass substrate 3 side.
  • a high pressure mercury lamp a metal halide lamp, a xenon lamp, a halogen lamp, a fluorescent lamp, a black light, a G lamp, an F lamp, or the like can be used, which may be a linear light source or a point light source. May be.
  • a plurality of linear or point light sources 52 and 54 may be arranged in a lattice shape so that the light reaches the resin 5A at one time.
  • the point light sources 52 and 54 may be scanned in parallel to the submaster 20 and the glass substrate 3 so that the light sequentially reaches the resin 5A.
  • a luminance distribution and an illuminance (intensity) distribution during light irradiation are measured, and the number of irradiations, irradiation amount, irradiation time, and the like are controlled based on the measurement results.
  • the convex lens portion 5 is formed.
  • the convex lens portion 5 and the glass substrate 3 are turned upside down as they are without being released from the sub master 20.
  • the resin 4A is further applied on the glass substrate 3 in the inverted state, and the sub-master 20B is pressed from above against the glass substrate 3 on which the resin 4A has been applied to cure the resin 4A.
  • the resin 4A When the resin 4A is cured, when the resin 4A is a thermosetting resin, it is cured by heating. On the other hand, when the resin 4A is a photocurable resin, it may be cured by irradiating the light sources 52 and 54 from above the submaster 20B or from below the submaster 20 as described above, or both light sources. 52, 54 may be used.
  • the resin 5A need not be cured, particularly in FIG. 12B, and the curing step in FIG. 12B is omitted. May be.
  • the resin 4A may be filled while evacuating when the sub master 20B is pressed. Further, although not shown, the resin 4A may be filled in the recess 24 of the sub master 20B, and the resin 4A may be cured while pressing the glass substrate 3 from above with respect to the filled resin 4A.
  • the one-side sub master 20 ⁇ / b> B is released from the convex lens portion 4.
  • a molded body 6 composed of the sub master 20, the convex lens portion 5, the glass substrate 3, and the convex lens portion 4 is molded.
  • a molded body 6B is molded in the same procedure as the molded body 6 described above, and a spacer 40 interposed between the two molded bodies 6 and 6B is prepared.
  • the spacer 40 is a disk-shaped member made of glass or transparent resin, and an opening 71 is formed at a position corresponding to the convex lens portions 4 and 5 of the wafer lens 1 (from the opening 71 to the convex lens). The parts 4 and 5 are exposed).
  • the spacer 40 is placed on the convex lens portion 4 of the molded body 6. Specifically, an adhesive (not shown) is applied to the upper surface of the convex lens portion 4 or the lower surface of the spacer 40, and the spacer 40 is placed on the molded body 6. Then, the convex lens portion 4 of the molded body 6B is placed on the placed spacer 40. Specifically, an adhesive (not shown) is applied to the upper surface of the spacer 7 or the lower surface of the lens portion 4 of the molded body 6 ⁇ / b> B, and the molded body 6 ⁇ / b> B is placed on the spacer 40.
  • the submasters 20 and 20 attached to one side are pressed against each other.
  • the lower surface of the sub master 20 of the molded body 6 and the upper surface of the sub master 20 of the molded body 6B are both flat surfaces, pressure can be uniformly applied to the entire surface.
  • the adhesive when the adhesive is a thermosetting resin, the adhesive is cured by heating.
  • the adhesive when the adhesive is a photocurable resin, the light sources 52 and 54 are irradiated from below the sub master 20 of the molded body 6 or above the sub master 20 of the molded body 6B to cure the adhesive, and the spacer 7 Is fixed to the molded bodies 6 and 6B. Both light sources 52, 54 may be used for curing.
  • the sub master 20 is released from the molded body 6 and the sub master 20 is released from the molded body 6B.
  • the wafer lens assembly 100 in which the wafer lens 1B is laminated on the wafer lens 1 via the spacer 40 is manufactured by post-curing and heat-curing.
  • the resin 5A is filled between the sub master 20 and one surface of the glass substrate 3 and cured, and the resin 4A is interposed between the sub master 20B and the other surface of the glass substrate 3. Is filled and cured, and the molded body 6 is molded in advance by releasing only one of the submasters 20B in advance.
  • the sub masters 20 and 20 are pressed against each other.
  • the two molded bodies 6 and 6B and the spacer 40 are bonded and fixed.
  • the sub-masters 20 and 20 that are still attached to one side are released from each other.
  • the compacts 6 and 6B are pressed with the sub-masters 20 and 20 on one side attached, so that the entire surfaces of the sub-masters 20 and 20 are uniformly pressed without contacting the convex lens portions 4 and 5. be able to.
  • the wafer lenses 1 and 1B can be stacked with high accuracy without bending.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Ophthalmology & Optometry (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

L'invention porte sur un procédé pour la fabrication d'une lentille mince (1) qui comprend : une première étape de remplissage dans laquelle l'espace entre une matrice sous-maître (30) et un substrat en verre (3) est rempli par une résine durcissable ; une seconde étape de remplissage dans laquelle, après la première étape de remplissage, la résine durcissable est amenée à tomber de l'autre côté du substrat pour remplir l'espace entre le substrat en verre (3) et une matrice sous-maître (20) par la résine durcissable ; et une étape de durcissement dans laquelle après la seconde étape de remplissage, les résines durcissables respectivement chargées dans les espaces entre le substrat en verre (3) et chacune de la matrice sous-maître (30) et de la matrice sous-maître (20) sont durcies simultanément.
PCT/JP2009/056281 2008-05-28 2009-03-27 Procédé pour la fabrication d'une lentille mince ou d'un réseau de lentilles minces WO2009145003A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010514408A JP5327221B2 (ja) 2008-05-28 2009-03-27 ウエハレンズ又はウエハレンズ集合体の製造方法

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2008-140014 2008-05-28
JP2008140016 2008-05-28
JP2008-140017 2008-05-28
JP2008140014 2008-05-28
JP2008140017 2008-05-28
JP2008-140016 2008-05-28

Publications (1)

Publication Number Publication Date
WO2009145003A1 true WO2009145003A1 (fr) 2009-12-03

Family

ID=41376889

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2009/056281 WO2009145003A1 (fr) 2008-05-28 2009-03-27 Procédé pour la fabrication d'une lentille mince ou d'un réseau de lentilles minces

Country Status (2)

Country Link
JP (1) JP5327221B2 (fr)
WO (1) WO2009145003A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011194842A (ja) * 2010-03-23 2011-10-06 Fujifilm Corp レンズアレイの製造方法及びレンズアレイの製造装置
JP2011255603A (ja) * 2010-06-10 2011-12-22 Toray Ind Inc 凹凸基板およびその製造方法
WO2012060217A1 (fr) * 2010-11-02 2012-05-10 東京エレクトロン株式会社 Procédé de modification de la surface d'un substrat, support de stockage informatique et dispositif de modification de la surface d'un substrat
EP2463689A1 (fr) * 2010-12-13 2012-06-13 Everphoton Energy Corporation Lentille et son procédé de fabrication
WO2014098075A1 (fr) * 2012-12-18 2014-06-26 コニカミノルタ株式会社 Matrice de lentilles en couches, procédé de production d'une matrice de lentilles en couches et procédé de production d'une lentille en couches
EP2639033A4 (fr) * 2010-11-09 2016-12-21 Konica Minolta Inc Procédé de production de lentille mince

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101964401B1 (ko) * 2017-08-25 2019-04-01 한국광기술원 열경화 웨이퍼 공정을 통한 어레이 타입 렌즈 제조 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5838125A (ja) * 1981-09-01 1983-03-05 Toppan Printing Co Ltd 情報記録担体の製造方法
JPH07112443A (ja) * 1993-10-20 1995-05-02 Canon Inc 複合型成形品及びその製造方法及び成形型
JP2000246810A (ja) * 1999-03-03 2000-09-12 Sharp Corp 光学素子の製造装置および光学素子の製造方法
JP2004017555A (ja) * 2002-06-19 2004-01-22 Nippon Sheet Glass Co Ltd 樹脂レンズアレイの製造方法
JP3926380B1 (ja) * 2006-12-07 2007-06-06 マイルストーン株式会社 撮像レンズ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5838125A (ja) * 1981-09-01 1983-03-05 Toppan Printing Co Ltd 情報記録担体の製造方法
JPH07112443A (ja) * 1993-10-20 1995-05-02 Canon Inc 複合型成形品及びその製造方法及び成形型
JP2000246810A (ja) * 1999-03-03 2000-09-12 Sharp Corp 光学素子の製造装置および光学素子の製造方法
JP2004017555A (ja) * 2002-06-19 2004-01-22 Nippon Sheet Glass Co Ltd 樹脂レンズアレイの製造方法
JP3926380B1 (ja) * 2006-12-07 2007-06-06 マイルストーン株式会社 撮像レンズ

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011194842A (ja) * 2010-03-23 2011-10-06 Fujifilm Corp レンズアレイの製造方法及びレンズアレイの製造装置
JP2011255603A (ja) * 2010-06-10 2011-12-22 Toray Ind Inc 凹凸基板およびその製造方法
WO2012060217A1 (fr) * 2010-11-02 2012-05-10 東京エレクトロン株式会社 Procédé de modification de la surface d'un substrat, support de stockage informatique et dispositif de modification de la surface d'un substrat
JP2012099677A (ja) * 2010-11-02 2012-05-24 Tokyo Electron Ltd 基板の表面改質方法、プログラム、コンピュータ記憶媒体及び基板の表面改質装置
EP2639033A4 (fr) * 2010-11-09 2016-12-21 Konica Minolta Inc Procédé de production de lentille mince
EP2463689A1 (fr) * 2010-12-13 2012-06-13 Everphoton Energy Corporation Lentille et son procédé de fabrication
WO2014098075A1 (fr) * 2012-12-18 2014-06-26 コニカミノルタ株式会社 Matrice de lentilles en couches, procédé de production d'une matrice de lentilles en couches et procédé de production d'une lentille en couches
CN104871041A (zh) * 2012-12-18 2015-08-26 柯尼卡美能达株式会社 层叠透镜阵列、层叠透镜阵列的制造方法以及层叠透镜的制造方法

Also Published As

Publication number Publication date
JPWO2009145003A1 (ja) 2011-10-06
JP5327221B2 (ja) 2013-10-30

Similar Documents

Publication Publication Date Title
JP5617636B2 (ja) ウエハレンズの製造方法
JP5429159B2 (ja) ウエハレンズの製造方法
JP5440492B2 (ja) ウエハレンズの製造方法
JP5327221B2 (ja) ウエハレンズ又はウエハレンズ集合体の製造方法
CN103279009B (zh) 一种柔性紫外光压印复合模板及其制备方法
JP5292621B2 (ja) ナノインプリント用樹脂製モールド
JP5212463B2 (ja) ウエハレンズの製造方法
WO2011148756A1 (fr) Procédé pour la production d'une lentille de plaquette
JP2010107891A (ja) ウエハレンズ集合体及びその製造方法、レンズユニット、撮像装置
JP2009226638A (ja) ウエハレンズの製造方法
JP5315737B2 (ja) ウエハレンズの製造方法
JP5488464B2 (ja) 光学素子、光学素子の製造方法、及び電子機器の製造方法
JP2009226637A (ja) マスター成形型の製造方法
JP5130977B2 (ja) サブマスター成形型の製造方法
TW201635012A (zh) 複製模及其製造方法
JP2010015095A (ja) 光学素子、光学素子の製造方法及び電子機器の製造方法
WO2009142116A1 (fr) Matrice de formation, pour traitement de précision, procédé de formation de résine durcissable moulée et objet formé
JP2013122480A (ja) ウエハレンズおよびその製造方法
KR100503498B1 (ko) 구조화된 표면을 포함하는 구조물과 그 제조방법

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09754511

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2010514408

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 09754511

Country of ref document: EP

Kind code of ref document: A1