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WO2009132005A3 - Apparatus and methods for using a polishing tape cassette - Google Patents

Apparatus and methods for using a polishing tape cassette Download PDF

Info

Publication number
WO2009132005A3
WO2009132005A3 PCT/US2009/041256 US2009041256W WO2009132005A3 WO 2009132005 A3 WO2009132005 A3 WO 2009132005A3 US 2009041256 W US2009041256 W US 2009041256W WO 2009132005 A3 WO2009132005 A3 WO 2009132005A3
Authority
WO
WIPO (PCT)
Prior art keywords
polishing tape
methods
tape cassette
head portion
guide walls
Prior art date
Application number
PCT/US2009/041256
Other languages
French (fr)
Other versions
WO2009132005A2 (en
Inventor
Antoine P. Manens
Gary C. Ettinger
Paul D. Butterfield
Shou-Sung Chang
Ricardo Martinez
Eashwer Kollata
Robert A. Ewald
Kuldip Sumbria
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Publication of WO2009132005A2 publication Critical patent/WO2009132005A2/en
Publication of WO2009132005A3 publication Critical patent/WO2009132005A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/004—Machines or devices using grinding or polishing belts; Accessories therefor using abrasive rolled strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

Methods and apparatus are provided for housing a polishing tape adapted to polish a substrate. The invention includes a cassette comprising a body portion; and a head portion, wherein the head portion includes: a pair of guide walls; one or more supply rollers positioned between the guide walls in the head portion; and wherein the guide walls are adapted to guide a polishing tape housed in the body over the one or more supply rollers. Numerous other aspects are provided.
PCT/US2009/041256 2008-04-21 2009-04-21 Apparatus and methods for using a polishing tape cassette WO2009132005A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US4645308P 2008-04-21 2008-04-21
US61/046,453 2008-04-21

Publications (2)

Publication Number Publication Date
WO2009132005A2 WO2009132005A2 (en) 2009-10-29
WO2009132005A3 true WO2009132005A3 (en) 2010-03-04

Family

ID=41201494

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/041256 WO2009132005A2 (en) 2008-04-21 2009-04-21 Apparatus and methods for using a polishing tape cassette

Country Status (3)

Country Link
US (1) US20090264053A1 (en)
TW (1) TW201002472A (en)
WO (1) WO2009132005A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6113960B2 (en) * 2012-02-21 2017-04-12 株式会社荏原製作所 Substrate processing apparatus and substrate processing method
JP6223873B2 (en) * 2014-03-14 2017-11-01 株式会社荏原製作所 Polishing apparatus and polishing method
CN105397597B (en) * 2015-10-26 2017-07-11 长安大学 A kind of full-automatic metallographical polishing machine of multistage integratedization
USD834075S1 (en) 2016-08-05 2018-11-20 Ebara Corporation Pressing member for substrate polishing apparatus
US10416575B2 (en) * 2016-11-16 2019-09-17 Suss Microtec Photomask Equipment Gmbh & Co. Kg Apparatus and method for cleaning a partial area of a substrate
TWI739361B (en) * 2020-03-26 2021-09-11 南茂科技股份有限公司 Cleaning device and manufacturing equipment for tape automatic bonding package structure

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US5065548A (en) * 1988-06-06 1991-11-19 Speedfam Company, Ltd. Surface treating tape cartridge and surface treating machine
US6309278B1 (en) * 1996-02-27 2001-10-30 The Furukawa Electric Co., Ltd. Method and apparatus for polishing optical connector end faces
US20020098787A1 (en) * 2001-01-09 2002-07-25 Junji Kunisawa Polishing apparatus
US7179154B1 (en) * 2005-06-29 2007-02-20 Lam Research Corporation Method and apparatus for cleaning a wafer bevel edge and notch using a pin and an abrasive film cassette
JP2008087136A (en) * 2006-10-04 2008-04-17 Ebara Corp Polishing apparatus, polishing method, processing apparatus

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US3524284A (en) * 1967-08-22 1970-08-18 Corning Glass Works Abrasive milling head for numerically controlled apparatus
BE755166A (en) * 1969-08-23 1971-02-22 Philips Nv CASSETTE
US4114751A (en) * 1976-10-22 1978-09-19 Teletype Corporation Printing machine with automatic off-center crown roller ribbon-wear compensation
US4347689A (en) * 1980-10-20 1982-09-07 Verbatim Corporation Method for burnishing
US4930259A (en) * 1988-02-19 1990-06-05 Magnetic Perpherals Inc. Magnetic disk substrate polishing assembly
US4964557A (en) * 1989-04-28 1990-10-23 Datatape Incorporated Bidirectional web guiding system
JP3024947B2 (en) * 1997-07-03 2000-03-27 日本ミクロコーティング株式会社 Polishing equipment
JP2003209082A (en) * 2002-01-15 2003-07-25 Nitto Denko Corp Sticking method for protecting tape, device therefor and releasing method for protecting tape
JP4125148B2 (en) * 2003-02-03 2008-07-30 株式会社荏原製作所 Substrate processing equipment
EP1719161B1 (en) * 2004-02-25 2014-05-07 Ebara Corporation Polishing apparatus
US20060256465A1 (en) * 2005-05-11 2006-11-16 Biskeborn Robert G Tape system with dynamically controlled flangeless rollers
US7993485B2 (en) * 2005-12-09 2011-08-09 Applied Materials, Inc. Methods and apparatus for processing a substrate
US20070131653A1 (en) * 2005-12-09 2007-06-14 Ettinger Gary C Methods and apparatus for processing a substrate
US20070238393A1 (en) * 2006-03-30 2007-10-11 Shin Ho S Methods and apparatus for polishing an edge of a substrate
US7662024B2 (en) * 2006-05-03 2010-02-16 V.I. Mfg. Inc. Method and apparatus for precision polishing of optical components
US8142260B2 (en) * 2007-05-21 2012-03-27 Applied Materials, Inc. Methods and apparatus for removal of films and flakes from the edge of both sides of a substrate using backing pads
US20080293329A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for identifying a substrate edge profile and adjusting the processing of the substrate according to the identified edge profile
US20080293337A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for polishing a notch of a substrate by substrate vibration
US20080293344A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for polishing a notch of a substrate using a polishing pad
JP2008290233A (en) * 2007-05-21 2008-12-04 Applied Materials Inc Method and apparatus for high performance and low cost polishing tapes for polishing substrate bevels and edges in semiconductor manufacturing
JP2008284684A (en) * 2007-05-21 2008-11-27 Applied Materials Inc Method and apparatus for polishing an edge of a substrate using a polishing arm
US20080291448A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for finding a substrate notch center
US20080293336A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus to control substrate bevel and edge polishing profiles of films
JP2008284682A (en) * 2007-05-21 2008-11-27 Applied Materials Inc Method and apparatus using a slant polishing head having an efficient tape routing arrangement
JP2008288600A (en) * 2007-05-21 2008-11-27 Applied Materials Inc Method and apparatus for controlling the size of an edge exclusion region of a substrate
TW200908122A (en) * 2007-05-21 2009-02-16 Applied Materials Inc Methods and apparatus for using a rolling backing pad for substrate polishing

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5065548A (en) * 1988-06-06 1991-11-19 Speedfam Company, Ltd. Surface treating tape cartridge and surface treating machine
US6309278B1 (en) * 1996-02-27 2001-10-30 The Furukawa Electric Co., Ltd. Method and apparatus for polishing optical connector end faces
US20020098787A1 (en) * 2001-01-09 2002-07-25 Junji Kunisawa Polishing apparatus
US7179154B1 (en) * 2005-06-29 2007-02-20 Lam Research Corporation Method and apparatus for cleaning a wafer bevel edge and notch using a pin and an abrasive film cassette
JP2008087136A (en) * 2006-10-04 2008-04-17 Ebara Corp Polishing apparatus, polishing method, processing apparatus

Also Published As

Publication number Publication date
US20090264053A1 (en) 2009-10-22
WO2009132005A2 (en) 2009-10-29
TW201002472A (en) 2010-01-16

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