WO2009076850A1

WO2009076850A1 - Communication device

Info

Publication number: WO2009076850A1
Application number: PCT/CN2008/073305
Authority: WO
Inventors: Linhui Chen; Feng Ao
Original assignee: Huawei Technologies Co., Ltd.
Priority date: 2007-12-03
Filing date: 2008-12-02
Publication date: 2009-06-25
Also published as: CN101453856B; CN101453856A

Abstract

A communicaiton device is provided. The device includes the electronic apparatus. An exterior flue in the communication device runs through the two surfaces of the device. The two outer surfaces of the exterior flue are in contact with the outer environment by setting the exterior flue which extends from the crust of the communication device to the inner of the communication device in the communicaiton device. The heat produced by the electronic apparatus in the communication device is transferred to the crust of the communication device and the side wall of the exterior flue by radiation, conduction or the air convection in the inner of thecommunication device. Then The heat is transferred to the outer environment by radiation, conduction or the outer air convection of the crust of the communication device and the outer surface of the exterior flue. The heat emission area of the outer surfaces of the communication device is increased and the heat emission efficiency of the outer surfaces of the communication device is improved and the heat emission performance of the communication device is improved as a result of the existence of the exterior flue.

Description

The present invention claims priority to Chinese Patent Application No. 200710077487.3, entitled "A Communication Device", filed on Dec. 3, 2007, the entire contents of in. Technical field

The present invention relates to the field of electronic communication technologies, and in particular, to a communication device. Background technique

In order to ensure the normal and reliable operation of the communication equipment, the heat generated by the internal electronic components of the communication device is generally dissipated into the environment in time by natural heat dissipation or air cooling, so that the temperature in the device does not exceed the maximum allowable operating temperature of the electronic device.

The existing solution generally places the electronic device in a sealed machine to form a communication device, and the heat generated when the electronic device works is transmitted to the communication device housing through convection, radiation or conduction, and then through the communication device housing. Convection and radiation between the surface and the external environment dissipate heat from the electronics inside the communication device to the external environment.

Referring to FIG. 1 , FIG. 1 is a conventional communication device. The communication device is internally provided with a plurality of sub-frames 04. A plurality of boards 02 are disposed in the frame 04, and the board 02 is interconnected with the backplane through the connector. . There is a gap between the frame 04 and the frame 04, and between the frame 04 and the communication device housing 01, so that natural convection can be formed inside the sealed casing (as shown by the arrow in the figure). The heat of the power device 03 on the board 02 transfers heat to the housing 01 through the natural convection of the radiation and the air inside the housing, and finally is radiated to the environment through the natural convection and radiation of the outer surface of the housing 01.

In carrying out the process of the present invention, the inventors have found that the prior art has at least the following problems:

Since the surface area of the communication device housing is limited, the heat dissipation capability is also limited. When the power of the electronic device inside the communication device is large and the generated heat is large, the heat dissipation capability of the communication device housing often cannot meet the heat dissipation requirement. Summary of the invention

The embodiment of the invention provides a communication device with high heat dissipation efficiency, so as to meet the heat dissipation requirement of the electronic device with high power in the communication device.

Embodiments of the present invention provide a communication device internally provided with an electronic device, the communication device being provided with an external air passage penetrating through two surfaces of the communication device, and two outer surfaces of the external air passage and the outer surface Environmental contact.

Embodiments of the present invention provide a communication device internally provided with an electronic device, the communication device is provided with an external air passage penetrating through two surfaces of the communication device, and two outer surfaces of the external air channel and an external environment Contacting, at least one of the external air ducts, the at least one external air duct forming an outer air duct area, the outer air duct area being located on one side of the electronic device, and the first air passage area and the electronic device are disposed first A partition, the upper and lower portions of the first partition are provided with ventilation holes.

Embodiments of the present invention provide a communication device internally provided with an electronic device, the communication device is provided with an external air passage penetrating through two surfaces of the communication device, and two outer surfaces of the external air channel and an external environment Contacting, at least one of the external air ducts, the at least one external air duct forming an outer air duct area, the outer air duct area being located on one side of the electronic device, and the first air passage area and the electronic device are disposed first a partition plate, the upper portion and the lower portion of the first partition plate are provided with a vent hole, a second partition plate is disposed at an upper portion of the electronic device, and a height of the second partition plate is lower than a height of the vent hole at the upper portion of the first partition plate, Ventilation is provided on the second partition

An embodiment of the present invention provides a communication device, which is internally provided with an electronic device, and the communication device is provided with an external air passage penetrating through two surfaces of the communication device, and two outer surfaces of the external air channel are in contact with an external environment. The external air duct is located at one side of the electronic device, and the external air passage is an external air passage or a plurality of contacting, the at least one external air passage forming an outer air passage area, and the outer air passage area is disposed at one side of the outer air passage area In the inner duct area, a third partition is disposed between the outer duct area and the inner duct area, and a first partition is disposed between the outer duct area and the electronic device, the first partition and the third The upper and lower parts of the partition are separately set There is a ventilation hole, and the external air passage has a plurality of communication ports communicating with the external environment, and the external air passage is in contact with the first partition plate and the third partition plate, or is integrally formed.

An embodiment of the present invention provides a communication device, which is internally provided with an electronic device, and the communication device is provided with an external air passage penetrating through two surfaces of the communication device, and two outer surfaces of the external air channel are in contact with an external environment. The external air duct is located at one side of the electronic device, and the external air duct has at least one, the at least one external air passage constitutes an outer air passage area, and the inner air passage area is provided with an inner air passage area, the communication The device is further provided with a supplemental external air duct area and a supplementary internal air duct area, and the supplementary external air duct area includes at least one external air duct, and the inner air duct area is adjacent to the outer air duct area to supplement the outer air duct area and the inner air duct area. Adjacent to the area, the supplementary internal air duct area is adjacent to the supplementary external air duct area.

In contrast to the prior art, embodiments of the present invention provide for the outer surface of the outer air duct to be in contact with the outside environment by the communication device being provided with an outer air duct extending from the communication device housing to the interior of the communication device. The heat generated by the electronics inside the communication device is transmitted to the side walls of the communication device housing and the outer air duct by convection of radiation, conduction or air inside the communication device, and then transmitted through the radiation of the outer surface of the communication device and the outer surface of the outer air passage. Or the convection of the outside air is distributed to the external environment. The presence of the external air duct increases the heat dissipation area of the outer surface of the communication device, improves the heat dissipation efficiency of the outer surface of the communication device, and improves the heat dissipation performance of the communication device. DRAWINGS

1 is a schematic structural view of a conventional communication device;

Figure 2 is a schematic view of an embodiment of the present invention;

3a, 3b are schematic views of another embodiment of the present invention;

4a, 4b, 4c are schematic views showing a cross-sectional shape of an external air passage in an embodiment of the present invention; and Fig. 5a is a cross-sectional view of a partition, a side wall of an outer air passage, and a side wall of a communication device according to an embodiment of the present invention; Schematic diagram

5b, 5c are schematic views showing the shape of a partition, a side wall of an external air passage, and a side wall of a communication device in an embodiment of the present invention;

6 is a schematic diagram of an external air duct extending to the outside of a communication device according to an embodiment of the present invention; Figure 7 is a schematic view of another embodiment of the present invention;

Figures 8, 9 are schematic views of another embodiment of the present invention;

10a, 10b are schematic views of another embodiment of the present invention. detailed description

The embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

In an embodiment of the invention, the outer surface of the outer air duct is in contact with the outer environment by the communication device being provided with an outer air duct extending from the outer casing of the communication device to the interior of the communication device. The heat generated by the electronics inside the communication device is transmitted to the side wall of the communication device housing and the outer air duct by convection of radiation, conduction or air inside the communication device, and then transmitted through the radiation of the outer surface of the communication device and the outer surface of the outer air passage. Or the convection of the outside air is distributed to the external environment. The presence of the external air duct increases the heat dissipation area of the outer surface of the communication device, improves the heat dissipation efficiency of the outer surface of the communication device, and improves the heat dissipation performance of the communication device.

The external air duct may be located at any position of the communication device that needs to dissipate heat, such as: an electronic device that generates more heat, so that the heat-generating electronic device can easily pass the generated heat through the external air passage. The side walls are passed to the outside environment. The presence of an external air duct can narrow the distance between the internal components of the communication device and the external environment, and improve the heat dissipation efficiency of the internal electronic components.

The external air duct may extend through two opposite surfaces of the communication device, two adjacent surfaces, or any two surfaces, and the external air duct may be connected to the communication device housing at the end, or may be connected to the communication device housing at the side wall. You can connect in one place or in multiple places.

Referring to FIG. 2, an embodiment of the present invention is a communication device. The communication device is provided with at least one external air duct 11 extending from the communication device housing to the interior of the communication device to form an external air duct area 1, and the external air is formed. The track 11 communicates with two opposite outer surfaces of the communication device, and the outer air duct region 1 is located on one side of the electronic device 2 of the communication device, and the heat radiated by the electronic device 2 is transferred to the surrounding air to form a hot air flow. Hot air flow To the upper portion of the electronic device 2, and then flowing from the upper portion of the electronic device 2 to the external air passage region 1, the heat flow around the external air passage 11 gradually becomes a cold air flow by heat exchange with the external environment through the external air passage 11. It descends to the lower portion of the outer duct region 1, and then flows from the lower portion of the outer duct region 1 to the side of the electronic device 2, continues to flow upward from the lower portion of the electronic device 2, and cools the electronic device 2.

Further, the outer duct region 1 may be located on either side of the electronic device 2 or distributed around the electronic device 2. Referring to Fig. 2, another embodiment of the present invention, a communication device is provided with an outer air duct region 1 and an electronic device 2, wherein the outer air duct region 1 includes at least one outer air duct 11. A first partition plate 71 is disposed between the outer air passage portion 1 and the electronic device 2, and the outer air passage portion 1 and the electronic device 2 are respectively located at two sides of the first partition plate 71, and ventilation is provided at upper and lower portions of the first partition plate 71. The hole 9, the heat generated by the electronic device enters the outer air passage region 1 through the vent hole 9 in the upper portion of the first partition plate 71, and the air flow cooled through the outer air passage region 1 enters the electronic device through the vent hole 9 in the lower portion of the first partition plate 71. 2 The area, continues from the lower part of the electronic device 2, and cools the electronic device 2.

In addition, the first partition plate 71 may also be disposed in a lower form than the communication device, and the first partition plate 71 leaves a gap between the top end and the top plate of the communication device, and the first partition plate is at the bottom end and the bottom plate of the communication device. A gap is formed, the gap forms a vent hole, and the hot air flow generated by the electronic device enters the external air passage area through a gap between the top end of the first partition plate and the top plate of the communication device, and the air flow cooled by the external air passage passes through the first A gap between the bottom end of the baffle and the bottom plate of the communication device enters the electronics region, continuing to flow upward from the lower portion of the electronic device, cooling the electronic device.

In addition, one side of the outer air passage area is a first partition, and the other side of the outer air passage area opposite to the first partition may be a side wall 6 of the communication device (see FIG. 2), and the outer air passage area The other side walls may also be the side walls of the communication device, so that the communication device side wall 6 can also dissipate heat to the external environment by exchanging heat with the external environment, so that the communication device can be reduced together with the external air duct 11 The effect of the temperature of the air stream.

The side wall of the communication device located on one side of the outer air passage area or the outer air passage The side wall may be provided in a shape to enhance heat transfer, such as: the wavy shape shown in FIG. 5b, FIG. 5c, the outer surface or the inner surface of the side wall of the communication device on one side of the outer air passage region, and The inner or outer surface of the outer duct may be provided with fins (see Fig. 5a) to enhance heat transfer.

In addition, the side wall of the communication device opposite to the first partition located on one side of the outer air passage area may be a side wall opposite to the communication device door 5 (see FIG. 2), or may be another side wall of the communication device. .

In addition, in order to promote air circulation inside the communication device, a fan 4 (see FIG. 2) may be disposed inside the communication device, and the fan may be disposed at a position where the cold airflow enters the air inlet of the electronic device region from the external air passage region to promote The flow of cold air into the electronics region may also be provided at the outlet of the hot gas stream from the electronics region to the outer duct region to facilitate the flow of hot gas into the outer duct region. There is no limit to the type of fan, and it can be an axial fan or a centrifugal fan.

In addition, the electronic device can have a certain gap between the machine rejecting the bottom plate and the top plate to make the air flow more smooth when flowing.

The electronic device can be: a MicroTCA plug-in box, or a DSLAM access device, or a BBU micro base station, and the like. The communication device may be a communication device rejection, or a router, or a server, or an outdoor access device, or a wireless micro base station, or the like. Referring to FIG. 2, another embodiment of the present invention, a communication device is provided with an external air duct area 1 and an electronic device 2, wherein the external air duct area 1 includes at least one external air duct 11, wherein, in the electronic device The second partition 72 is disposed on the upper portion, and the height of the second partition 72 is lower than the height of the vent hole 9 on the first partition 71, and the vent hole 9 is formed in the second partition 72, so that the heat generated by the electronic device The airflow can enter the gap between the second partition 72 and the top plate of the communication device through the vent hole 9 of the second partition plate 72, and then enter the outer air passage region 1 through the vent hole 9 of the first partition plate 71, thereby ensuring the electronic device. 2 The generated hot gas flows into the outer duct region 1 without returning to the area where the electronic device 2 is located. As shown in FIG. 3a and FIG. 3b, another embodiment of the present invention, a communication device, An outer duct zone 1 and an inner duct zone 3, and electronics are provided. The outer duct zone 1 includes at least one outer duct 11 . An inner air duct region 3 may be disposed on one side of the outer air duct region 1, and the inner air duct region 3 may be located between the outer air duct region 1 and the electronic device 2, or may be located at the outer air duct region 1 and the electronic device 2 The opposite side. A third partition 73 may be disposed between the outer duct region 1 and the inner duct region 3, or a third partition 73 may not be provided, and the upper and lower portions of the third partition 73 are provided with ventilation holes. In the case where the third partition 73 is disposed between the outer duct region 1 and the inner duct region 3, the inner duct region 3 transfers heat to the outer duct region 1 through the third partition 73, cooling the inner duct region The air flow of 1; in the case where the third partition 73 is not provided between the outer duct area 1 and the inner duct area 3, the inner duct area 3 can directly exchange heat with the outer duct area 1, cooling the inner duct Airflow in Zone 3. In addition, the third partition may also be disposed in a lower form than the communication device, leaving a gap between the top and bottom ends and the top and bottom plates of the communication device, the gap forming a ventilation 孑

There is no third partition between the outer air duct area and the inner air duct area. In the case where no first partition is provided between the outer air duct area and the electronic device, heat radiated from the electronic device is transmitted to the surrounding air. Forming a hot gas flow, the hot gas flows to the upper part of the electronic device, and then flows from the upper portion of the electronic device to the outer air passage region and the inner air passage region, through the external air passage to the external environment, in the outer air passage region and the inner wind The hot air flow in the tunnel zone slowly becomes a cold airflow, descending to the lower part of the outer air duct area and the inner air duct area, and then flowing from the lower part of the outer air duct area and the inner air duct area to the side of the electronic device, from the electronic device The lower part continues to flow upwards, cooling the electronics.

A third baffle is not disposed between the outer air duct region and the inner air duct region, and in the case where the first baffle is disposed between the outer air duct region and the electronic device, heat radiated from the electronic device is transmitted to the surrounding air to form The hot air flow, the hot air flow to the upper part of the electronic device, and then the upper part of the electronic device flows through the vent hole in the upper part of the first partition plate to the outer air passage area and the inner air duct area, and exchanges heat with the external environment through the external air passage. The hot air flow in the outer air duct area and the inner air duct area gradually becomes a cold air flow, descending to the lower part of the outer air duct area and the inner air duct area, and then flowing to the electronic device by the ventilation hole of the lower part of the first partition plate On the side, the lower part of the electronics continues to flow upwards, cooling the electronics. A third baffle is disposed between the outer air duct region and the inner air duct region, and in the case where the first baffle is not disposed between the outer air duct region and the electronic device, heat radiated from the electronic device is transmitted to the surrounding air to form The hot air flow, the hot air flow to the upper part of the electronic device, flows from the upper part of the electronic device to the outer air duct area, and flows through the vent hole in the upper part of the third partition to the inner air duct area, through the outer air passage and the external environment Heat exchange, the hot air flow in the outer air duct area and the inner air duct area gradually becomes a cold air flow, descending to the lower part of the outer air duct area and the inner air duct area, and the cold air flow of the inner air duct area passes through the lower part of the third partition The venting holes flow to the outer air duct area, and then flow from the outer air duct area to the side of the electronic device, continuing to flow upward from the lower portion of the electronic device to cool the electronic device. As shown in FIG. 7, another embodiment of the present invention, a communication device is provided with an outer air duct region and an inner air duct region 3, and an electronic device. The outer duct zone includes an outer duct 11 or a plurality of outer ducts 11 that are in contact. A third partition plate 73 is disposed between the outer air passage region and the inner air passage region 3, and a first partition plate 71 is disposed between the outer air passage portion and the electronic device, and the outer air passage 11 has a plurality of communication ports The first port is connected to the external environment, and the communication port 110 can be disposed on two upper and lower opposite side walls of the communication device or other side walls, and the outer air channel 11 and the first partition plate 71 and the third partition plate 73 Contact, or integrally formed.

The heat emitted by the electronic device is transferred to the surrounding air to form a hot air flow, and the hot air flow flows to the upper portion of the electronic device, and then flows from the upper portion of the electronic device through the vent hole in the upper portion of the first partition plate 71 to the outer air passage region, and through the first The venting holes in the upper part of the three partitions 73 flow to the inner duct area 3, and the heat flow in the outer duct area and the inner duct area 3 gradually becomes a cold air flow by the heat exchange between the outer duct and the external air passage, and is lowered to The lower part of the outer air duct area and the inner air duct area, and the vent hole of the lower part of the third partition plate, and the vent hole of the lower part of the first partition plate flow to the side of the electronic device, continue to flow upward from the lower portion of the electronic device, and are cooled Electronic device.

In addition, the vent hole of the first partition plate 71 and the vent hole of the third partition plate 73 may be connected through the first passage 701, and the outer air passage 11 may be in contact with the first passage 701, or may be integrally formed. . In the upper portion of the first spacer 71 and the third spacer 73, the electronic device The hot gas flow generated by the zone may enter the inner air duct region through the first passage 701. In the lower portion of the first partition plate 71 and the third partition plate 73, the cold air flow of the inner air passage region 3 may enter the electronic device region through the first passage 701. .

In addition, the outer air passage may be in contact with the first partition plate and the third partition plate, and the contact portions may be integrally formed; the outer air passage may also be in contact with the first passage, and the contact portion may be One piece is formed.

Referring to FIG. 3a, FIG. 3b and FIG. 7, the inner air duct area may be a side wall of the communication device on the other side opposite to the outer air duct area, and the other side walls of the inner air duct area may also be communication. The side walls of the device, such that the side walls of the device can also dissipate heat to the external environment by exchanging heat with the external environment, so that the temperature of the airflow in the communication device can be reduced together with the external air passage.

The side wall of the communication device on one side of the inner air passage area may be arranged to enhance the shape of heat transfer, such as: the wavy shape shown in FIG. 5b and FIG. 5c, the side located on the outer air passage area The outer or inner surface of the side wall of the communication device may be provided with fins to enhance heat transfer (Fig. 5a).

In addition, the side wall of the communication device on the side of the inner air duct area opposite to the outer air duct area may be a side wall opposite to the communication device door 5 (see FIG. 2), or may be another side wall of the communication device. . As shown in FIGS. 8 and 9, another embodiment of the present invention, a communication device is provided with an outer air duct region 1 and an electronic device 2, and the outer air duct region 1 includes at least one outer air duct 11 and an outer air duct region. A first spacer 71 is disposed between the electronic device 2 and the electronic device 2. The vent holes of the first partition plate 71 may be disposed on the upper right side and the lower left side, or on the upper left side and the lower right side.

The electronic device is arranged laterally, and the fan can drive the internal air to flow through the electronic device from left to right to remove heat. The discharged hot air is blocked by the first partition plate and the machine rejecting the top plate, and the hot air changes direction, passing through the first partition plate. The vent hole on the upper right side flows to the outer air duct area, and the flow direction is interlaced with the outer air duct 11 (not vertical or parallel), and heat exchange heat is performed therewith. The cooled cold air enters the electronic device area from the vent hole on the lower left side of the first partition plate 71. The cooling fan is sucked back into the air inlet of the electronic device to complete the cooling cycle of the electronic device. Of course, after the electronic device is laterally arranged, the fan can also drive the internal air to flow through the electronic device from right to left to remove the heat. The discharged hot air is blocked by the first partition plate and the machine rejecting the top plate, and the hot air changes direction. The venting opening on the upper left side of a partition flows to the outer air duct area, and the flow direction is interleaved (non-vertical or parallel) with the outer air passage, and heat exchange heat is performed therewith. The cooled cold air enters the electronic device area from the vent hole on the lower right side of the first partition, and is sucked back to the air inlet of the electronic device by the cooling fan to complete the cooling cycle of the electronic device.

In order to ensure that the inner circulation air can exchange heat with the outer air passage area, there is a circulation passage between the outer air passages in the outer air passage area, which can be: the outer air passage is neither in contact with the first partition or the external air. The other side walls of the track zone are in contact with each other, and the side wall may be a side wall of the communication device; or the outer air channel is in contact with the first baffle, but does not contact other side walls of the outer air duct area, and the side wall may be The side wall of the communication device; or the outer air duct is not in contact with the first bulkhead, but is in contact with the other side walls of the outer air duct region, which may be the side wall of the communication device.

The first partition may be in the form of a flat plate or [like (as shown in Fig. 8), and the other side of the outer duct region other than the first partition may be a side wall of the communication device. The fan can be in the form of a draft or a blower. As shown in Figures 10a and 10b, another embodiment of the present invention, a communication device is provided with an external air duct area 1, an internal air duct area 3, an electronic device, and a supplementary external air duct area 12 and a supplementary internal air duct area. 31, the outer air duct area 1 includes at least one outer air duct, the supplementary outer air duct area 12 includes at least one outer air duct, the outer air duct area 1 is disposed on one side of the electronic device, and the inner air duct area 3 and the outer air duct area 1 Adjacent to the arrangement, the supplemental outer duct zone 12 is disposed adjacent to the inner duct zone 3, and the supplemental inner duct zone 31 is disposed adjacent to the supplemental outer duct zone 12.

Wherein, the supplementary external air duct area 12 may be disposed between the inner air duct area 3 and the supplementary inner air duct area 31, and the inner air duct area 3 may be disposed between the supplementary outer air duct area 12 and the outer air duct area 1 . A fourth partition 74 may be provided between the supplementary external air duct area 12 and the inner air duct area, or the fourth partition 74 may not be provided; a fifth partition may be provided between the supplementary internal air duct area 31 and the supplementary external air duct area. The plate 75 may not be provided with the fifth partition plate 75. Ventilation holes are provided in the fourth partition plate 74 and the fifth partition plate 75, and the ventilation holes may be arranged in the same manner as in FIG. 7, FIG. 8, or FIG. Cooling is performed by passing the hot gas stream I generated in the electronics region into the inner duct region and the supplemental inner duct region, and then the cooled air stream is introduced into the electronics region from the inner duct region and the supplemental inner duct region.

The side walls of the outer duct, the first partition, the third partition, the fourth partition, and the fifth partition may be provided to enhance the shape of heat transfer, such as: the wavy shape shown in Figs. 5b, 5c, It is also possible to set fins to enhance heat transfer (Figure 5a)

As shown in Figures 4a, 4b, and 4c, the cross-sectional shape of the outer duct may be square, or circular, or prismatic, or hexagonal, or polygonal. The side wall of the outer air duct may be in contact with the side wall of the communication device, or the first partition, or the third partition, or the fourth partition, or the fifth partition, may be in contact with a plurality of sides, or may be in contact with one side After the side wall of the external air duct is in contact with the side wall of the communication device, the external air channel can directly exchange heat with the external environment through the side wall of the communication device; after the side wall of the external air channel contacts the first partition plate, the The first baffle directly cools the air on the side of the electronic device; after the side wall of the outer air passage is in contact with the third baffle, the fourth baffle, or the fifth baffle, the third baffle may be passed through the third baffle, the fourth baffle, Or the fifth baffle directly cools the air in the inner duct area.

The portion of the side wall of the outer air duct and the side wall of the communication device, or the first partition, or the third partition, or the fourth partition, or the fifth partition may be integrally formed.

Further, the vent holes of the third partition, the fourth partition, and the fifth partition may be provided on the upper right side and the lower left side, or on the upper left side and the lower right side.

As shown in Figures 4a, 4b, and 4c, the side walls of the outer air duct can be respectively in contact with the side wall of the communication device and the first partition, and the outer air passage can directly exchange heat with the external environment through the side wall of the communication device. And the air on the side of the electronic device can be directly cooled by the first spacer.

In addition, the external air duct may extend from the communication device housing to the outside of the communication device, for example: one end of the external air duct extends beyond the top of the communication device (see FIG. 6), Or one end of the external air duct extends beyond the bottom plate of the communication device, and one end of the external air duct can extend beyond any side wall of the communication device, thereby forming a "chimney" effect, promoting air circulation in the external air duct, and improving communication The heat dissipation efficiency of the device.

In an embodiment of the invention, the outer surface of the outer air duct is in contact with the outer environment by providing the communication device with an outer air duct extending from the outer casing of the communication device to the interior of the communication device. The heat generated by the electronics inside the communication device is transmitted to the side walls of the casing and the external air duct by convection of radiation, conduction or communication equipment internal air, and then radiated, conducted or external air through the outer surfaces of the casing and the external air duct. Convection, distributed to the external environment. The presence of the external air duct increases the heat dissipation area of the outer surface of the communication device, improves the heat dissipation efficiency of the outer surface of the communication device, and improves the heat dissipation performance of the communication device.

In addition, in a high-humidity environment with large temperature difference, condensation may occur on the inner surface of the communication device. In the case where the first spacer is disposed, the inner wall surface of the communication device is isolated from the electronic device, and the generated condensation does not affect the electron. The device has an impact. In conclusion, the above description is only a preferred embodiment of the present invention and is not intended to limit the scope of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and scope of the present invention are intended to be included within the scope of the present invention.

Claims

Rights request

What is claimed is: 1. A communication device internally provided with an electronic device, characterized in that the communication device is provided with an external air passage running through two surfaces of the communication device, two outer surfaces of the external air passage and an outer surface Environmental contact.

2. A communication device according to claim 1, characterized in that the two surfaces of the communication device are the opposite surfaces of the communication device or the adjacent surfaces of the communication device.

3. A communication device according to claim 1, wherein the two outer surfaces of the outer air duct are connected to the communication device housing or the side walls are connected to the communication device housing.

4. The communication device according to claim 1, wherein the external air duct extends from the communication device housing to a side of the communication device.

The communication device according to claim 1, wherein at least one of the external air ducts comprises an outer air duct area, and the outer air duct area is located at an electronic device side. At least one side wall of the outer air duct region is a side wall of the communication device.

6. The communication device according to claim 1, wherein: at least one of the external air ducts, the at least one external air duct constitutes an outer air duct area, and the outer air duct area is located at an electronic device side. A first partition is disposed between the outer duct region and the electronic device, and the upper and lower portions of the first partition are provided with ventilation holes.

7. The communication device according to claim 6, wherein a second spacer is disposed at an upper portion of the electronic device, and a height of the second spacer is lower than a height of a vent hole at an upper portion of the first spacer, Ventilation holes are formed in the second partition.

The communication device according to claim 6, wherein the first partition plate has a flat plate shape or a shape.

9. The communication device according to claim 1, wherein: at least one of the external air ducts, the at least one external air duct constitutes an outer air duct area, and the outer air duct area is located at an electronic device side. a first partition is provided between the outer air duct area and the electronic device The board has a gap between the top end and the top plate of the communication device, and the first partition has a gap between the bottom end and the bottom plate of the communication device.

10. The communication device according to claim 9, wherein a second spacer is disposed on an upper portion of the electronic device, and a height of the second spacer is lower than a height of the first spacer at the top end of the communication device A gap is formed between the top plates, and a vent hole is formed in the second partition.

11. The communication device according to claim 1, wherein: at least one of the external air ducts, the at least one external air duct constitutes an outer air duct area, and the inner air duct is disposed at one side of the outer air duct area. Area.

12. The communication device of claim 11, wherein the outer air duct region is located between the inner air duct region and an electronic device.

13. The communication device of claim 11, wherein at least one side wall of the inner air duct region is a side wall of a communication device.

The communication device according to claim 12, wherein a first partition is disposed between the outer air passage region and the electronic device, and the upper and lower portions of the first partition are provided with ventilation holes. A third partition is disposed between the outer air passage region and the inner air passage region, and the upper and lower portions of the third partition plate are provided with ventilation holes.

The communication device according to claim 14, wherein a vent hole in an upper portion of the first partition and a vent hole in an upper portion of the third partition are connected by a first passage.

16. The communication device according to claim 1, wherein the outer air passage is one or a plurality of contacting, and the at least one outer air passage constitutes an outer air passage region, and is disposed on one side of the outer air passage region. In the inner duct area, a third partition is disposed between the outer duct area and the inner duct area, and a first partition is disposed between the outer duct area and the electronic device, and the first partition and the third The upper and lower portions of the partition are respectively provided with ventilation holes, and the external air passage has a plurality of communication ports communicating with the external environment, the external air passages are in contact with the first partition plate and the third partition plate, or are integrally formed.

The communication device according to claim 16, wherein the ventilation hole of the upper portion of the first partition and the ventilation hole of the upper portion of the third partition are connected by a first passage, the external air passage and the One channel contact, or one piece.

18. The communication device according to claim 1, wherein said external wind The track constitutes an outer air duct area, the outer air duct area is located on one side of the electronic device, and an inner air duct area is disposed on one side of the outer air duct area, and the communication device is further provided with a supplementary external air duct area and a supplementary internal air duct. The additional external air duct area includes at least one external air duct, and the inner air duct area is adjacent to the outer air duct area, and the supplementary outer air duct area is adjacent to the inner air duct area, supplementing the inner air duct area and supplementing the external wind area. The road area is adjacent to the setting.

19. The communication device according to claim 18, wherein the supplemental external air duct region is disposed between the inner air duct region and the supplementary inner air duct region, or

The inner duct zone is disposed between the supplemental outer duct zone and the outer duct zone.

The communication device according to claim 19, wherein a fourth partition is disposed between the supplementary external air passage region and the inner air passage region, and the fourth partition is provided with a ventilation hole, or

A fifth partition is disposed between the supplementary inner duct area and the supplementary outer duct area, and the fifth partition is provided with a vent hole.

A communication apparatus according to claim 1, wherein the side wall of the outer duct is wavy or provided with fins.

22. A communication device according to claim 6 or claim 13 wherein the side wall of the communication device is wavy or the side walls of the communication device are provided with fins.

23. A communication device according to claim 6 or 7 or 13 or 14 or 20, characterized in that

At least one side wall of the outer air duct is in contact with the side wall of the communication device, or the first partition, or the third partition, or the fourth partition, or the fifth partition, or

At least one side wall of the outer air duct is integrally formed with the side wall of the communication device, or the first partition, or the third partition, or the fourth partition, or the fifth partition.

24. A communication device internally provided with an electronic device, characterized in that the communication device is provided with an external air passage extending through two surfaces of the communication device, two outer surfaces of the external air passage and an external environment Contacting, at least one of the external air ducts, the at least one external air duct forming an outer air duct area, the outer air duct area being located on one side of the electronic device, and the first air passage area and the electronic device are disposed first A partition, the upper and lower portions of the first partition are provided with ventilation holes.

25. A communication device internally provided with an electronic device, characterized in that the communication device is provided with an external air passage extending through two surfaces of the communication device, two outer surfaces of the external air passage and an external environment Contacting, at least one of the external air ducts, the at least one external air duct forming an outer air duct area, the outer air duct area being located on one side of the electronic device, and the first air passage area and the electronic device are disposed first a partition plate, the upper portion and the lower portion of the first partition plate are provided with a vent hole, a second partition plate is disposed at an upper portion of the electronic device, and a height of the second partition plate is lower than a height of the vent hole at the upper portion of the first partition plate, Ventilation is provided on the second partition

26 . A communication device internally provided with an electronic device, wherein the communication device is provided with an external air passage penetrating through two surfaces of the communication device, and two outer surfaces of the external air passage are in contact with an external environment, The external air duct is located at one side of the electronic device, and the external air passage is an external air passage or a plurality of contacting, the at least one external air passage forming an outer air passage area, and the outer air passage area is disposed at one side of the outer air passage area In the inner duct area, a third partition is disposed between the outer duct area and the inner duct area, and a first partition is disposed between the outer duct area and the electronic device, the first partition and the third The upper and lower portions of the partition are respectively provided with ventilation holes, and the external air passage has a plurality of communication ports communicating with the external environment, and the external air passages are in contact with the first partition plate and the third partition plate, or are integrally formed.

The communication device according to claim 26, wherein the ventilation hole of the upper portion of the first partition and the ventilation hole of the upper portion of the third partition are connected by a first passage, the external air passage and the One channel contact, or one piece.

28. A communication device internally provided with an electronic device, wherein the communication device is provided with an outer air passage extending through two surfaces of the communication device, and two outer surfaces of the outer air passage are in contact with an external environment. The external air duct is located at one side of the electronic device, and the external air duct has at least one, the at least one external air passage constitutes an outer air passage area, and the inner air passage area is provided with an inner air passage area, the communication The device is further provided with a supplemental external air duct area and a supplementary internal air duct area, and the supplementary external air duct area includes at least one external air duct, and the inner air duct area is adjacent to the outer air duct area to supplement the outer air duct area and the inner air duct area. Adjacent to the area, the supplementary internal air duct area is adjacent to the supplementary external air duct area.

29. The communication device according to claim 28, wherein the external device is supplemented The air duct area is disposed between the inner air duct area and the supplementary inner air duct area, and the inner air duct area is disposed between the outer air duct area and the outer air duct area.

30. The communication device according to claim 28, wherein a fourth partition is provided between the supplementary external air duct area and the inner air duct area, or

A fifth partition is disposed between the supplementary inner air passage area and the supplementary outer air passage area; and the fourth partition plate and the fifth partition plate are provided with ventilation holes.