[go: up one dir, main page]

WO2009075079A1 - Circuit board, circuit board manufacturing method, and cover ray film - Google Patents

Circuit board, circuit board manufacturing method, and cover ray film Download PDF

Info

Publication number
WO2009075079A1
WO2009075079A1 PCT/JP2008/003612 JP2008003612W WO2009075079A1 WO 2009075079 A1 WO2009075079 A1 WO 2009075079A1 JP 2008003612 W JP2008003612 W JP 2008003612W WO 2009075079 A1 WO2009075079 A1 WO 2009075079A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
ray film
conductor
circuit
cover ray
Prior art date
Application number
PCT/JP2008/003612
Other languages
French (fr)
Japanese (ja)
Inventor
Masatosi Mitomi
Original Assignee
Sumitomo Bakelite Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co., Ltd. filed Critical Sumitomo Bakelite Co., Ltd.
Priority to CN200880119966XA priority Critical patent/CN101897243A/en
Priority to JP2009545337A priority patent/JPWO2009075079A1/en
Publication of WO2009075079A1 publication Critical patent/WO2009075079A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

Provided is a circuit board (300) including: a circuit substrate (130) having a base (201) and a conductor circuit (203) formed on at least one of the surfaces of the base (201); and a cover ray film (100) used as an insulation cover layer which covers the conductor circuit (203). The cover ray film (100) is formed by a resin film (101) and an adhesive layer (105). A conductor layer (103) is arranged between the resin film (101) and the adhesive layer (105), so that the conductor layer (103) is electrically connected to the conductor circuit (203). This increases the bending characteristic and reliability of the circuit board (300).
PCT/JP2008/003612 2007-12-11 2008-12-05 Circuit board, circuit board manufacturing method, and cover ray film WO2009075079A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200880119966XA CN101897243A (en) 2007-12-11 2008-12-05 Circuit board, circuit board manufacturing method, and cover ray film
JP2009545337A JPWO2009075079A1 (en) 2007-12-11 2008-12-05 Circuit board, circuit board manufacturing method, and coverlay film

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007319127 2007-12-11
JP2007-319127 2007-12-11

Publications (1)

Publication Number Publication Date
WO2009075079A1 true WO2009075079A1 (en) 2009-06-18

Family

ID=40755327

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/003612 WO2009075079A1 (en) 2007-12-11 2008-12-05 Circuit board, circuit board manufacturing method, and cover ray film

Country Status (5)

Country Link
JP (2) JPWO2009075079A1 (en)
KR (2) KR20100088628A (en)
CN (2) CN101909405A (en)
TW (1) TW200938015A (en)
WO (1) WO2009075079A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2014192490A1 (en) * 2013-05-28 2017-02-23 タツタ電線株式会社 Shape-retaining film and shape-retaining flexible wiring board provided with the shape-retaining film
CN115226326A (en) * 2021-04-16 2022-10-21 群光电子股份有限公司 Electronic module

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9716258B2 (en) 2011-04-26 2017-07-25 Samsung Sdi Co., Ltd. Battery pack
JP2017220516A (en) * 2016-06-06 2017-12-14 富士通株式会社 Wiring board
JP7020942B2 (en) * 2018-02-01 2022-02-16 日東電工株式会社 Film stretching device and method for manufacturing retardation film
CN110769670B (en) * 2018-07-27 2023-12-05 广州方邦电子股份有限公司 Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film
CN110769667B (en) * 2018-07-27 2023-12-05 广州方邦电子股份有限公司 Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film
CN110783017B (en) * 2018-11-26 2024-03-19 广州方邦电子股份有限公司 Conductive adhesive film, circuit board and preparation method of conductive adhesive film
WO2022140944A1 (en) * 2020-12-28 2022-07-07 深圳清华大学研究院 Display structure and display

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07106787A (en) * 1993-09-29 1995-04-21 Fuji Xerox Co Ltd Shielding device of flexible printed wiring board
JPH08236937A (en) * 1995-02-27 1996-09-13 Sharp Corp Multilayered flexible printed wiring board
JP2001160673A (en) * 1999-12-02 2001-06-12 Sony Chem Corp Manufacturing method for flexible wiring board
JP2004119445A (en) * 2002-09-24 2004-04-15 Matsushita Electric Ind Co Ltd Thin electromagnetic shield and flexible circuit board using the thin electromagnetic shield

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001024323A (en) * 1999-07-12 2001-01-26 Ibiden Co Ltd Method for filling conductive paste and manufacture of single sided circuit board for multilayer printed wiring board
US8153901B2 (en) * 2005-11-04 2012-04-10 Sumitomo Bakelite Co., Ltd. Method for fabricating multilayer circuit board, circuit plate, and method for fabricating the circuit plate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07106787A (en) * 1993-09-29 1995-04-21 Fuji Xerox Co Ltd Shielding device of flexible printed wiring board
JPH08236937A (en) * 1995-02-27 1996-09-13 Sharp Corp Multilayered flexible printed wiring board
JP2001160673A (en) * 1999-12-02 2001-06-12 Sony Chem Corp Manufacturing method for flexible wiring board
JP2004119445A (en) * 2002-09-24 2004-04-15 Matsushita Electric Ind Co Ltd Thin electromagnetic shield and flexible circuit board using the thin electromagnetic shield

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2014192490A1 (en) * 2013-05-28 2017-02-23 タツタ電線株式会社 Shape-retaining film and shape-retaining flexible wiring board provided with the shape-retaining film
CN115226326A (en) * 2021-04-16 2022-10-21 群光电子股份有限公司 Electronic module

Also Published As

Publication number Publication date
KR20100096172A (en) 2010-09-01
KR101538186B1 (en) 2015-07-20
TW200938015A (en) 2009-09-01
CN101909405A (en) 2010-12-08
JPWO2009075079A1 (en) 2011-04-28
CN101897243A (en) 2010-11-24
KR20100088628A (en) 2010-08-09
JP2010219564A (en) 2010-09-30

Similar Documents

Publication Publication Date Title
WO2009075079A1 (en) Circuit board, circuit board manufacturing method, and cover ray film
DE502008000072D1 (en) Circuit arrangement with connecting device and manufacturing method thereof
WO2009066629A1 (en) Antenna element and method for manufacturing the same
WO2011084216A3 (en) Substrate for integrated circuit devices including multi-layer glass core and methods of making the same
WO2008093414A1 (en) Semiconductor device and method for manufacturing the same
WO2012074783A3 (en) Low-profile microelectronic package, method of manufacturing same, and electronic assembly containing same
TW200733824A (en) Wiring circuit board
EP1337136A3 (en) Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate
WO2011081456A3 (en) Heating element and manufacturing method thereof
WO2009044863A1 (en) Module, wiring board and module manufacturing method
EP2779810A3 (en) Printed circuit board package structure and manufacturing method thereof
TW200742518A (en) Flexible printed circuit board and method for manufacturing the same
WO2006094025A3 (en) Fabricated adhesive microstructures for making an electrical connection
TW200612440A (en) Polymer-matrix conductive film and method for fabricating the same
WO2008146793A1 (en) Electric device, connecting method and adhesive film
TW200633609A (en) Electrical connector structure of circuit board and method for fabricating the same
WO2007134308A3 (en) Thin film battery on an integrated circuit or circuit board and method thereof
WO2008003287A3 (en) Electric component comprising a sensor element, method for encapsulating a sensor element and method for producing a board assembly
WO2008152934A1 (en) Metal-integral conductive rubber component
TW200629662A (en) Electronic device package and electronic equipment
KR20150092625A (en) Embedded printed circuit substrate
WO2002100140A3 (en) Circuit board with at least one electronic component
WO2008141898A3 (en) Method for producing an electronic assembly
WO2009072493A1 (en) Photosensitive adhesive, semiconductor device and method for manufacturing semiconductor device
WO2012085472A3 (en) Printed circuit board with an insulated metal substrate

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880119966.X

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08860174

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2009545337

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20107013177

Country of ref document: KR

Kind code of ref document: A

122 Ep: pct application non-entry in european phase

Ref document number: 08860174

Country of ref document: EP

Kind code of ref document: A1