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WO2009054203A1 - 積層型電子部品及びその製造方法 - Google Patents

積層型電子部品及びその製造方法 Download PDF

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Publication number
WO2009054203A1
WO2009054203A1 PCT/JP2008/066439 JP2008066439W WO2009054203A1 WO 2009054203 A1 WO2009054203 A1 WO 2009054203A1 JP 2008066439 W JP2008066439 W JP 2008066439W WO 2009054203 A1 WO2009054203 A1 WO 2009054203A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
manufacturing
via hole
hole conductors
inductor
Prior art date
Application number
PCT/JP2008/066439
Other languages
English (en)
French (fr)
Inventor
Tomoshiro Ishoshima
Original Assignee
Murata Manufacturing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co., Ltd. filed Critical Murata Manufacturing Co., Ltd.
Priority to EP08841023A priority Critical patent/EP2200179B1/en
Priority to JP2009538006A priority patent/JP4720940B2/ja
Priority to CN2008801123302A priority patent/CN101821943B/zh
Publication of WO2009054203A1 publication Critical patent/WO2009054203A1/ja
Priority to US12/765,083 priority patent/US8334735B2/en
Priority to US13/690,036 priority patent/US8754724B2/en

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/203—Strip line filters
    • H01P1/20327—Electromagnetic interstage coupling
    • H01P1/20336—Comb or interdigital filters
    • H01P1/20345—Multilayer filters
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/09—Filters comprising mutual inductance
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/17—Structural details of sub-circuits of frequency selective networks
    • H03H7/1716—Comprising foot-point elements
    • H03H7/1725—Element to ground being common to different shunt paths, i.e. Y-structure
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/17—Structural details of sub-circuits of frequency selective networks
    • H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
    • H03H7/1791—Combined LC in shunt or branch path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H01F2017/0026—Multilayer LC-filter
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H2001/0021—Constructional details
    • H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Filters And Equalizers (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

　インダクタ同士の磁界結合度を容易に調整できる積層型電子部品及びその製造方法を提供する。 　ビアホール導体（５４，６２）は、積層体（１２）内において積層方向に延びるように形成され、第１のインダクタとして機能する。ビアホール導体（５６，６４）は、積層体（１２）内において積層方向に延びるように形成され、第２のインダクタとして機能する。第１のコンデンサ及び第１のインダクタは、第１の共振回路を形成していると共に、第２のコンデンサ及び第２のインダクタは、第２の共振回路を形成している。ビアホール導体（５４，５６）は、第１の距離Ｄ１だけ離された状態で第１の絶縁体層に形成されており、ビアホール導体（６２，６４）は、第２の距離Ｄ２だけ離された状態で第２の絶縁体層に形成されている。
PCT/JP2008/066439 2007-10-23 2008-09-11 積層型電子部品及びその製造方法 WO2009054203A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP08841023A EP2200179B1 (en) 2007-10-23 2008-09-11 Laminated electronic component and method for manufacturing the same
JP2009538006A JP4720940B2 (ja) 2007-10-23 2008-09-11 積層型電子部品及びその製造方法
CN2008801123302A CN101821943B (zh) 2007-10-23 2008-09-11 层叠型电子元器件及其制造方法
US12/765,083 US8334735B2 (en) 2007-10-23 2010-04-22 Multilayer electronic component and multilayer electronic component manufacturing method
US13/690,036 US8754724B2 (en) 2007-10-23 2012-11-30 Multilayer electronic component and multilayer electronic component manufacturing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007275587 2007-10-23
JP2007-275587 2007-10-23

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/765,083 Continuation US8334735B2 (en) 2007-10-23 2010-04-22 Multilayer electronic component and multilayer electronic component manufacturing method

Publications (1)

Publication Number Publication Date
WO2009054203A1 true WO2009054203A1 (ja) 2009-04-30

Family

ID=40579310

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/066439 WO2009054203A1 (ja) 2007-10-23 2008-09-11 積層型電子部品及びその製造方法

Country Status (6)

Country Link
US (2) US8334735B2 (ja)
EP (1) EP2200179B1 (ja)
JP (1) JP4720940B2 (ja)
KR (1) KR101092390B1 (ja)
CN (2) CN101821943B (ja)
WO (1) WO2009054203A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120319801A1 (en) * 2010-03-18 2012-12-20 Murata Manufacturing Co., Ltd. High-frequency laminated component and laminated high-frequency filter
EP2469648A4 (en) * 2010-01-19 2013-05-01 Murata Manufacturing Co FREQUENCY STABILIZATION CIRCUIT, FREQUENCY STABILIZATION DEVICE, ANTENNA DEVICE, COMMUNICATION TERMINAL, AND IMPEDANCE TRANSFORMATION ELEMENT
CN105552490A (zh) * 2010-01-19 2016-05-04 株式会社村田制作所 高耦合度变压器、电子电路及电子设备
JP2021019304A (ja) * 2019-07-22 2021-02-15 株式会社村田製作所 ダイプレクサ
JP2023039687A (ja) * 2021-09-09 2023-03-22 Tdk株式会社 Ｌｃ回路およびフィルタ

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009054203A1 (ja) * 2007-10-23 2009-04-30 Murata Manufacturing Co., Ltd. 積層型電子部品及びその製造方法
TWI484694B (zh) * 2010-07-06 2015-05-11 Murata Manufacturing Co Electronic parts and manufacturing methods thereof
JP6100903B2 (ja) * 2012-08-15 2017-03-22 ノキア テクノロジーズ オーユー 電気エネルギーハーベスティングおよび／または無線通信のための装置および方法
JP5585740B1 (ja) * 2013-03-18 2014-09-10 株式会社村田製作所 積層型インダクタ素子および通信装置
US9634640B2 (en) * 2013-05-06 2017-04-25 Qualcomm Incorporated Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods
KR101548808B1 (ko) * 2013-10-24 2015-08-31 삼성전기주식회사 복합 전자부품 및 그 실장 기판
CN103825076B (zh) * 2014-01-14 2017-01-11 深圳顺络电子股份有限公司 片式LTCC微型3dB定向耦合器
JP6459946B2 (ja) * 2015-12-14 2019-01-30 株式会社村田製作所 電子部品及びその製造方法
CN218959175U (zh) * 2020-05-07 2023-05-02 株式会社村田制作所 多层基板模块
TWI776290B (zh) * 2020-11-27 2022-09-01 財團法人工業技術研究院 電容器以及包含所述電容器的濾波器與重佈線層結構

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0935936A (ja) * 1995-07-19 1997-02-07 Murata Mfg Co Ltd インダクタ内蔵電子部品
JPH11251856A (ja) * 1998-02-27 1999-09-17 Tdk Corp 積層フィルタ

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EP0917232B1 (en) * 1993-08-24 2003-11-05 Matsushita Electric Industrial Co., Ltd. Laminated dielectric filter
JP3120682B2 (ja) * 1995-01-09 2000-12-25 株式会社村田製作所 チップ型フィルタ
JP2002057543A (ja) 2000-08-09 2002-02-22 Murata Mfg Co Ltd 積層型ｌｃ部品
JP2002076809A (ja) * 2000-09-01 2002-03-15 Murata Mfg Co Ltd 積層型ｌｃ複合部品及び積層型ｌｃ複合部品の周波数特性調整方法
JP3567885B2 (ja) * 2000-11-29 2004-09-22 株式会社村田製作所 積層型ｌｃフィルタ
JP4372334B2 (ja) 2000-12-01 2009-11-25 セイコーインスツル株式会社 リフローハンダ付け用コイン型二次電池及びキャパシタ
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See also references of EP2200179A4

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2469648A4 (en) * 2010-01-19 2013-05-01 Murata Manufacturing Co FREQUENCY STABILIZATION CIRCUIT, FREQUENCY STABILIZATION DEVICE, ANTENNA DEVICE, COMMUNICATION TERMINAL, AND IMPEDANCE TRANSFORMATION ELEMENT
US9019168B2 (en) 2010-01-19 2015-04-28 Murata Manufacturing Co., Ltd. Frequency stabilization circuit, frequency stabilization device, antenna apparatus and communication terminal equipment, and impedance conversion element
CN105552490A (zh) * 2010-01-19 2016-05-04 株式会社村田制作所 高耦合度变压器、电子电路及电子设备
CN105552490B (zh) * 2010-01-19 2018-11-30 株式会社村田制作所 天线装置及通信终端装置
US20120319801A1 (en) * 2010-03-18 2012-12-20 Murata Manufacturing Co., Ltd. High-frequency laminated component and laminated high-frequency filter
US9184720B2 (en) * 2010-03-18 2015-11-10 Murata Manufacturing Co., Ltd. High-frequency laminated component and laminated high-frequency filter
JP2021019304A (ja) * 2019-07-22 2021-02-15 株式会社村田製作所 ダイプレクサ
JP7352145B2 (ja) 2019-07-22 2023-09-28 株式会社村田製作所 ダイプレクサ
JP2023039687A (ja) * 2021-09-09 2023-03-22 Tdk株式会社 Ｌｃ回路およびフィルタ
JP7681477B2 (ja) 2021-09-09 2025-05-22 Tdk株式会社 Ｌｃ回路およびフィルタ

Also Published As

Publication number Publication date
KR101092390B1 (ko) 2011-12-09
CN101821943A (zh) 2010-09-01
EP2200179A1 (en) 2010-06-23
US8334735B2 (en) 2012-12-18
EP2200179B1 (en) 2012-08-29
US20130093536A1 (en) 2013-04-18
KR20100050563A (ko) 2010-05-13
CN102842425A (zh) 2012-12-26
CN102842425B (zh) 2016-05-25
US8754724B2 (en) 2014-06-17
JPWO2009054203A1 (ja) 2011-03-03
JP4720940B2 (ja) 2011-07-13
EP2200179A4 (en) 2011-04-20
US20100194498A1 (en) 2010-08-05
CN101821943B (zh) 2012-11-14

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