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WO2009001497A1 - Laser processing apparatus - Google Patents

Laser processing apparatus Download PDF

Info

Publication number
WO2009001497A1
WO2009001497A1 PCT/JP2008/000838 JP2008000838W WO2009001497A1 WO 2009001497 A1 WO2009001497 A1 WO 2009001497A1 JP 2008000838 W JP2008000838 W JP 2008000838W WO 2009001497 A1 WO2009001497 A1 WO 2009001497A1
Authority
WO
WIPO (PCT)
Prior art keywords
processing apparatus
laser processing
laser
workpiece
holding
Prior art date
Application number
PCT/JP2008/000838
Other languages
French (fr)
Japanese (ja)
Inventor
Katsuhiko Hiratsuka
Manabu Nishihara
Yoshiya Shiraishi
Toshiichi Murakoshi
Noriyuki Tanaka
Takahiro Yano
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to CN2008800222457A priority Critical patent/CN101687281B/en
Priority to JP2009520285A priority patent/JP4947146B2/en
Publication of WO2009001497A1 publication Critical patent/WO2009001497A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work for planar work
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)

Abstract

A laser processing apparatus wherein an XY table for holding a workpiece has a plurality of placement portions for holding the workpiece. The plurality of placement portions are designed to move up and down. When processing a through-hole by a laser, only the placement portion immediately below the laser moves down.
PCT/JP2008/000838 2007-06-28 2008-04-01 Laser processing apparatus WO2009001497A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008800222457A CN101687281B (en) 2007-06-28 2008-04-01 Laser processing apparatus
JP2009520285A JP4947146B2 (en) 2007-06-28 2008-04-01 Laser processing equipment

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007169938 2007-06-28
JP2007-169938 2007-06-28

Publications (1)

Publication Number Publication Date
WO2009001497A1 true WO2009001497A1 (en) 2008-12-31

Family

ID=40185325

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/000838 WO2009001497A1 (en) 2007-06-28 2008-04-01 Laser processing apparatus

Country Status (4)

Country Link
JP (1) JP4947146B2 (en)
CN (1) CN101687281B (en)
TW (1) TWI388390B (en)
WO (1) WO2009001497A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102596484A (en) * 2010-09-24 2012-07-18 松下电器产业株式会社 Laser Processing Apparatus
JP2013071153A (en) * 2011-09-28 2013-04-22 Hitachi Via Mechanics Ltd Laser beam machining apparatus and method
WO2013136695A1 (en) * 2012-03-16 2013-09-19 パナソニック株式会社 Laser processing device and laser processing method
WO2020165140A1 (en) * 2019-02-11 2020-08-20 Theodor Gräbener GmbH & Co. KG Device and method for producing laser-welded metal sheets, in particular for indexing such metal sheets and use of the device and method
JP2021159948A (en) * 2020-03-31 2021-10-11 本田技研工業株式会社 Laser processing apparatus and laser processing method

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102639282B (en) * 2010-09-16 2015-01-07 松下电器产业株式会社 Laser processing device and laser processing method
DE102011003426A1 (en) * 2011-02-01 2012-08-02 Trumpf Laser- Und Systemtechnik Gmbh Laser processing system with extraction
CN102528300B (en) * 2011-12-28 2015-08-19 北京工业大学 Sucker-type clamping device
CN103433619B (en) * 2013-08-30 2015-10-21 大族激光科技产业集团股份有限公司 The preparation method of laser melting coating printer and wiring board
JP6333786B2 (en) * 2015-09-17 2018-05-30 ファナック株式会社 Laser processing system with laser optical path cleaning function
JP6948888B2 (en) * 2017-08-31 2021-10-13 株式会社神戸製鋼所 Joint manufacturing method and joint manufacturing equipment
CN112643226A (en) * 2020-12-30 2021-04-13 赣州金顺科技有限公司 Positioning method and device for laser forming of printed circuit board
CN112996248A (en) * 2021-02-03 2021-06-18 深圳市同创鑫电子有限公司 Circuit board blind hole processing method and related device
CN113001782A (en) * 2021-02-24 2021-06-22 鄢丽媛 Graphite thin film cutting equipment
CN117943761B (en) * 2024-03-27 2024-06-21 山东义和鼎晟机械制造有限公司 Straight arm type overhead working truck chassis welding tool

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63111291U (en) * 1987-01-12 1988-07-16
JPH0671475A (en) * 1992-08-27 1994-03-15 Shibuya Kogyo Co Ltd Laser beam machine
JPH10296473A (en) * 1997-02-06 1998-11-10 Matsushita Electric Ind Co Ltd Laser beam machine and method for laser beam machining
JPH11192571A (en) * 1998-01-07 1999-07-21 Matsushita Electric Ind Co Ltd Laser processing method and apparatus therefor
JP2000153427A (en) * 1998-11-17 2000-06-06 Amada Co Ltd Workpiece supporting work device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63111291A (en) * 1986-10-23 1988-05-16 Nobuyoshi Kuboyama Heat generating device
CN87212702U (en) * 1987-10-03 1988-05-11 青岛发动机厂 Laser beam treatment machine tool with working piece hole controlled by micro-computer
US6090330A (en) * 1997-02-06 2000-07-18 Matsushita Electric Industrial Co., Ltd. Laser processing method
JP3341154B2 (en) * 1998-10-23 2002-11-05 ダイトーエムイー株式会社 3D coordinate measuring machine
JP2005300248A (en) * 2004-04-08 2005-10-27 Mitsutoyo Corp Mounting table, surface property measuring instrument, and surface property measuring method
CN2703602Y (en) * 2004-05-12 2005-06-08 武汉楚天激光（集团）股份有限公司 Multifunction laser processing machine

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63111291U (en) * 1987-01-12 1988-07-16
JPH0671475A (en) * 1992-08-27 1994-03-15 Shibuya Kogyo Co Ltd Laser beam machine
JPH10296473A (en) * 1997-02-06 1998-11-10 Matsushita Electric Ind Co Ltd Laser beam machine and method for laser beam machining
JPH11192571A (en) * 1998-01-07 1999-07-21 Matsushita Electric Ind Co Ltd Laser processing method and apparatus therefor
JP2000153427A (en) * 1998-11-17 2000-06-06 Amada Co Ltd Workpiece supporting work device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102596484A (en) * 2010-09-24 2012-07-18 松下电器产业株式会社 Laser Processing Apparatus
JP2013071153A (en) * 2011-09-28 2013-04-22 Hitachi Via Mechanics Ltd Laser beam machining apparatus and method
WO2013136695A1 (en) * 2012-03-16 2013-09-19 パナソニック株式会社 Laser processing device and laser processing method
JP5370622B1 (en) * 2012-03-16 2013-12-18 パナソニック株式会社 Laser processing apparatus and laser processing method
CN103492118A (en) * 2012-03-16 2014-01-01 松下电器产业株式会社 Laser processing device and laser processing method
WO2020165140A1 (en) * 2019-02-11 2020-08-20 Theodor Gräbener GmbH & Co. KG Device and method for producing laser-welded metal sheets, in particular for indexing such metal sheets and use of the device and method
JP2021159948A (en) * 2020-03-31 2021-10-11 本田技研工業株式会社 Laser processing apparatus and laser processing method
JP7370293B2 (en) 2020-03-31 2023-10-27 本田技研工業株式会社 Laser processing equipment and laser processing method

Also Published As

Publication number Publication date
TWI388390B (en) 2013-03-11
TW200924894A (en) 2009-06-16
JP4947146B2 (en) 2012-06-06
CN101687281B (en) 2012-06-27
JPWO2009001497A1 (en) 2010-08-26
CN101687281A (en) 2010-03-31

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