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WO2008142821A2 - Ultrasonic cutter - Google Patents

Ultrasonic cutter Download PDF

Info

Publication number
WO2008142821A2
WO2008142821A2 PCT/JP2008/000771 JP2008000771W WO2008142821A2 WO 2008142821 A2 WO2008142821 A2 WO 2008142821A2 JP 2008000771 W JP2008000771 W JP 2008000771W WO 2008142821 A2 WO2008142821 A2 WO 2008142821A2
Authority
WO
WIPO (PCT)
Prior art keywords
ultrasonic cutter
cutter
ultrasonic
pct
Prior art date
Application number
PCT/JP2008/000771
Other languages
French (fr)
Japanese (ja)
Inventor
Mamoru Tano
Yoshihiro Okamoto
Yuichi Tanaka
Original Assignee
Sawa Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sawa Corporation filed Critical Sawa Corporation
Publication of WO2008142821A2 publication Critical patent/WO2008142821A2/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08—Means for treating work or cutting member to facilitate cutting
    • B26D7/086—Means for treating work or cutting member to facilitate cutting by vibrating, e.g. ultrasonically

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Disintegrating Or Milling (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

pct-art17.2apct-art17.2a

PCT/JP2008/000771 2007-05-10 2008-03-27 Ultrasonic cutter WO2008142821A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-125311 2007-05-10
JP2007125311A JP4317884B2 (en) 2007-05-10 2007-05-10 Ultrasonic cutting device

Publications (1)

Publication Number Publication Date
WO2008142821A2 true WO2008142821A2 (en) 2008-11-27

Family

ID=40032275

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/000771 WO2008142821A2 (en) 2007-05-10 2008-03-27 Ultrasonic cutter

Country Status (2)

Country Link
JP (1) JP4317884B2 (en)
WO (1) WO2008142821A2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013159533A (en) * 2012-02-07 2013-08-19 Ihi Corp Method for exfoliating carbon nanowall and method for recovering carbon nanowall
JP2015188811A (en) * 2014-03-27 2015-11-02 日本ゼオン株式会社 Method for producing recycled substrate and method for producing catalyst substrate for carbon nanotube production

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014210219A (en) * 2013-04-17 2014-11-13 三菱マテリアルテクノ株式会社 Cleaning device and cleaning method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013159533A (en) * 2012-02-07 2013-08-19 Ihi Corp Method for exfoliating carbon nanowall and method for recovering carbon nanowall
JP2015188811A (en) * 2014-03-27 2015-11-02 日本ゼオン株式会社 Method for producing recycled substrate and method for producing catalyst substrate for carbon nanotube production

Also Published As

Publication number Publication date
JP2008279354A (en) 2008-11-20
JP4317884B2 (en) 2009-08-19

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