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WO2008133209A1 - Conductive contact and conductive contact unit - Google Patents

Conductive contact and conductive contact unit Download PDF

Info

Publication number
WO2008133209A1
WO2008133209A1 PCT/JP2008/057615 JP2008057615W WO2008133209A1 WO 2008133209 A1 WO2008133209 A1 WO 2008133209A1 JP 2008057615 W JP2008057615 W JP 2008057615W WO 2008133209 A1 WO2008133209 A1 WO 2008133209A1
Authority
WO
WIPO (PCT)
Prior art keywords
plunger
conductive contact
end portion
leading end
longitudinal direction
Prior art date
Application number
PCT/JP2008/057615
Other languages
French (fr)
Japanese (ja)
Inventor
Toshio Kazama
Kohei Hironaka
Shigeki Ishikawa
Original Assignee
Nhk Spring Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co., Ltd. filed Critical Nhk Spring Co., Ltd.
Priority to JP2009511860A priority Critical patent/JP5361710B2/en
Priority to TW097114449A priority patent/TWI383153B/en
Publication of WO2008133209A1 publication Critical patent/WO2008133209A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

Provided are a conductive contact, which can suppress reduction of an allowable current due to diameter reduction, and a conductive contact unit. The conductive contact is provided with a first plunger composed of a substantially needle-shaped conductive material; a second plunger, which is composed of a substantially needle-shaped conductive material with the leading end portion directed opposite to the direction where the leading end portion of the first plunger is directed; and an elastic member, which is composed of a conductive material, has one end attached to the first plunger and the other attached to the second plunger and is extendable and retractable in the longitudinal direction. The center axis of the leading end portion of the first plunger in the longitudinal direction and the center axis of the leading end portion of the second plunger in the longitudinal direction are different from each other but parallel to each other.
PCT/JP2008/057615 2007-04-19 2008-04-18 Conductive contact and conductive contact unit WO2008133209A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009511860A JP5361710B2 (en) 2007-04-19 2008-04-18 Conductive contact and conductive contact unit
TW097114449A TWI383153B (en) 2007-04-19 2008-04-21 Conductive contact and conductive contact unit

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-110942 2007-04-19
JP2007110942 2007-04-19

Publications (1)

Publication Number Publication Date
WO2008133209A1 true WO2008133209A1 (en) 2008-11-06

Family

ID=39925663

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057615 WO2008133209A1 (en) 2007-04-19 2008-04-18 Conductive contact and conductive contact unit

Country Status (3)

Country Link
JP (1) JP5361710B2 (en)
TW (1) TWI383153B (en)
WO (1) WO2008133209A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011048890A1 (en) * 2009-10-23 2011-04-28 株式会社ヨコオ Contact probe and socket
WO2014017157A1 (en) * 2012-07-23 2014-01-30 山一電機株式会社 Contact probe and semiconductor element socket provided with same
KR20160096968A (en) * 2015-02-06 2016-08-17 리노공업주식회사 A probe for the test device
JP2017146119A (en) * 2016-02-15 2017-08-24 オムロン株式会社 Probe pin and inspection device using the same
KR102162476B1 (en) * 2019-07-18 2020-10-06 박상량 High Performance Semiconductor Test Socket With Single Body Housing
WO2023181906A1 (en) * 2022-03-25 2023-09-28 株式会社ヨコオ Spring connector
WO2023228844A1 (en) * 2022-05-26 2023-11-30 株式会社ヨコオ Probe

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180060565A (en) * 2016-11-29 2018-06-07 주식회사 파인디앤씨 A probe-pin for measuring

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06201725A (en) * 1992-11-09 1994-07-22 Nhk Spring Co Ltd Electrically conductive contactor and electrically conductive contactor unit
JPH0743419A (en) * 1993-06-29 1995-02-14 Matsushita Electric Ind Co Ltd Printed circuit board inspection jig
JPH095356A (en) * 1995-06-23 1997-01-10 Matsushita Electric Ind Co Ltd Inspection equipment for electronic device
JP2000028638A (en) * 1998-07-10 2000-01-28 Nhk Spring Co Ltd Conductive contact
JP2002350487A (en) * 2001-03-19 2002-12-04 Inoue Shoji Kk Inspection jig for printed wiring board
JP2003021658A (en) * 2001-07-06 2003-01-24 Murata Mfg Co Ltd Electric characteristic inspection device for electronic part
JP2006170633A (en) * 2004-12-13 2006-06-29 Inoue Shoji Kk Tool for inspecting printed wiring board

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6685492B2 (en) * 2001-12-27 2004-02-03 Rika Electronics International, Inc. Sockets for testing electronic packages having contact probes with contact tips easily maintainable in optimum operational condition
JP4614434B2 (en) * 2004-09-30 2011-01-19 株式会社ヨコオ probe
JP4757531B2 (en) * 2005-04-28 2011-08-24 日本発條株式会社 Conductive contact holder and conductive contact unit

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06201725A (en) * 1992-11-09 1994-07-22 Nhk Spring Co Ltd Electrically conductive contactor and electrically conductive contactor unit
JPH0743419A (en) * 1993-06-29 1995-02-14 Matsushita Electric Ind Co Ltd Printed circuit board inspection jig
JPH095356A (en) * 1995-06-23 1997-01-10 Matsushita Electric Ind Co Ltd Inspection equipment for electronic device
JP2000028638A (en) * 1998-07-10 2000-01-28 Nhk Spring Co Ltd Conductive contact
JP2002350487A (en) * 2001-03-19 2002-12-04 Inoue Shoji Kk Inspection jig for printed wiring board
JP2003021658A (en) * 2001-07-06 2003-01-24 Murata Mfg Co Ltd Electric characteristic inspection device for electronic part
JP2006170633A (en) * 2004-12-13 2006-06-29 Inoue Shoji Kk Tool for inspecting printed wiring board

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011048890A1 (en) * 2009-10-23 2011-04-28 株式会社ヨコオ Contact probe and socket
JP2011089930A (en) * 2009-10-23 2011-05-06 Yokowo Co Ltd Contact probe and socket
WO2014017157A1 (en) * 2012-07-23 2014-01-30 山一電機株式会社 Contact probe and semiconductor element socket provided with same
JP2014021054A (en) * 2012-07-23 2014-02-03 Yamaichi Electronics Co Ltd Contact probe and semiconductor element socket including the same
US9684031B2 (en) 2012-07-23 2017-06-20 Yamaichi Electronics Co., Ltd. Contact probe and semiconductor element socket provided with same
KR20160096968A (en) * 2015-02-06 2016-08-17 리노공업주식회사 A probe for the test device
KR101704710B1 (en) 2015-02-06 2017-02-08 리노공업주식회사 A probe for the test device
JP2017146119A (en) * 2016-02-15 2017-08-24 オムロン株式会社 Probe pin and inspection device using the same
WO2017141564A1 (en) * 2016-02-15 2017-08-24 オムロン株式会社 Probe pin and inspection device using same
KR102162476B1 (en) * 2019-07-18 2020-10-06 박상량 High Performance Semiconductor Test Socket With Single Body Housing
WO2023181906A1 (en) * 2022-03-25 2023-09-28 株式会社ヨコオ Spring connector
WO2023228844A1 (en) * 2022-05-26 2023-11-30 株式会社ヨコオ Probe

Also Published As

Publication number Publication date
TW200902983A (en) 2009-01-16
TWI383153B (en) 2013-01-21
JP5361710B2 (en) 2013-12-04
JPWO2008133209A1 (en) 2010-07-22

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