WO2008126559A1 - Polyimide film - Google Patents
Polyimide film Download PDFInfo
- Publication number
- WO2008126559A1 WO2008126559A1 PCT/JP2008/054363 JP2008054363W WO2008126559A1 WO 2008126559 A1 WO2008126559 A1 WO 2008126559A1 JP 2008054363 W JP2008054363 W JP 2008054363W WO 2008126559 A1 WO2008126559 A1 WO 2008126559A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polyimide film
- polyimide
- group
- thickness
- general formula
- Prior art date
Links
- 229920001721 polyimide Polymers 0.000 title abstract 6
- 239000004642 Polyimide Substances 0.000 abstract 2
- 125000003545 alkoxy group Chemical group 0.000 abstract 1
- 125000000217 alkyl group Chemical group 0.000 abstract 1
- 125000003118 aryl group Chemical group 0.000 abstract 1
- 125000004432 carbon atom Chemical group C* 0.000 abstract 1
- 239000000470 constituent Substances 0.000 abstract 1
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- 150000002367 halogens Chemical class 0.000 abstract 1
- 125000000962 organic group Chemical group 0.000 abstract 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 abstract 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Laminated Bodies (AREA)
Abstract
Disclosed is a polyimide film which has excellent dimensional stability, heat resistance and other properties of a polyimide, and can exhibit excellent tear resistance even when the film has a small thickness. The polyimide film comprises a polyimide which contains a constituent unit represented by the general formula (1) in an amount of 60 mol% or more, has a Z value calculated in accordance with the following formula: Z = Y/X1.5 [wherein Y represents a value of tear propagation resistance (mN); and X represents a thickness (μm) of the polyimide film] of 0.7 or more, has a thickness of 5 to 40 μm, and has a thermal expansion coefficient of 30 ppm/K or less. In the general formula (1), Ar1 represents a tetravalent organic group having one or more aromatic rings; and R represents a lower alkyl group having 1 to 6 carbon atoms, a lower alkoxy group, a phenyl group, a phenoxy group or a halogen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009508988A JP5249203B2 (en) | 2007-03-30 | 2008-03-11 | Polyimide film |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007092730 | 2007-03-30 | ||
| JP2007-092730 | 2007-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2008126559A1 true WO2008126559A1 (en) | 2008-10-23 |
Family
ID=39863706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2008/054363 WO2008126559A1 (en) | 2007-03-30 | 2008-03-11 | Polyimide film |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5249203B2 (en) |
| TW (1) | TWI422645B (en) |
| WO (1) | WO2008126559A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014058620A (en) * | 2012-09-18 | 2014-04-03 | Du Pont-Toray Co Ltd | Board for cof for tablet terminal |
| JP2017025214A (en) * | 2015-07-23 | 2017-02-02 | 大日本印刷株式会社 | Polyimide resin and laminate |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5691996B2 (en) * | 2011-10-21 | 2015-04-01 | Jsr株式会社 | Liquid crystal alignment agent, liquid crystal alignment film, and liquid crystal display element |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001028767A1 (en) * | 1999-10-21 | 2001-04-26 | Nippon Steel Chemical Co., Ltd. | Laminate and process for producing the same |
| JP2004322441A (en) * | 2003-04-24 | 2004-11-18 | Nippon Steel Chem Co Ltd | Method for producing polyimide film |
| WO2005066242A1 (en) * | 2003-12-26 | 2005-07-21 | Nippon Steel Chemical Co., Ltd. | Aromatic polyamic acid and polyimide |
| WO2005084088A1 (en) * | 2004-02-26 | 2005-09-09 | Nippon Steel Chemical Co., Ltd. | Laminate for wiring board |
| JP2005314630A (en) * | 2004-03-30 | 2005-11-10 | Nippon Steel Chem Co Ltd | Aromatic polyamic acid and polyimide |
| JP2006117791A (en) * | 2004-10-21 | 2006-05-11 | Nippon Steel Chem Co Ltd | Method for producing polyimide film |
| WO2006090658A1 (en) * | 2005-02-23 | 2006-08-31 | Nippon Steel Chemical Co., Ltd. | Laminate for wiring board |
| JP2006269558A (en) * | 2005-03-22 | 2006-10-05 | Nippon Steel Chem Co Ltd | Method of producing flexible laminate substrate |
| JP2006272626A (en) * | 2005-03-28 | 2006-10-12 | Nippon Steel Chem Co Ltd | Method for manufacturing flexible laminated substrate |
-
2008
- 2008-03-11 JP JP2009508988A patent/JP5249203B2/en active Active
- 2008-03-11 WO PCT/JP2008/054363 patent/WO2008126559A1/en active Application Filing
- 2008-03-11 TW TW97108450A patent/TWI422645B/en not_active IP Right Cessation
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001028767A1 (en) * | 1999-10-21 | 2001-04-26 | Nippon Steel Chemical Co., Ltd. | Laminate and process for producing the same |
| JP2004322441A (en) * | 2003-04-24 | 2004-11-18 | Nippon Steel Chem Co Ltd | Method for producing polyimide film |
| WO2005066242A1 (en) * | 2003-12-26 | 2005-07-21 | Nippon Steel Chemical Co., Ltd. | Aromatic polyamic acid and polyimide |
| WO2005084088A1 (en) * | 2004-02-26 | 2005-09-09 | Nippon Steel Chemical Co., Ltd. | Laminate for wiring board |
| JP2005314630A (en) * | 2004-03-30 | 2005-11-10 | Nippon Steel Chem Co Ltd | Aromatic polyamic acid and polyimide |
| JP2006117791A (en) * | 2004-10-21 | 2006-05-11 | Nippon Steel Chem Co Ltd | Method for producing polyimide film |
| WO2006090658A1 (en) * | 2005-02-23 | 2006-08-31 | Nippon Steel Chemical Co., Ltd. | Laminate for wiring board |
| JP2006269558A (en) * | 2005-03-22 | 2006-10-05 | Nippon Steel Chem Co Ltd | Method of producing flexible laminate substrate |
| JP2006272626A (en) * | 2005-03-28 | 2006-10-12 | Nippon Steel Chem Co Ltd | Method for manufacturing flexible laminated substrate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014058620A (en) * | 2012-09-18 | 2014-04-03 | Du Pont-Toray Co Ltd | Board for cof for tablet terminal |
| JP2017025214A (en) * | 2015-07-23 | 2017-02-02 | 大日本印刷株式会社 | Polyimide resin and laminate |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI422645B (en) | 2014-01-11 |
| JP5249203B2 (en) | 2013-07-31 |
| JPWO2008126559A1 (en) | 2010-07-22 |
| TW200902627A (en) | 2009-01-16 |
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