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WO2008120461A1 - 部品実装方法 - Google Patents

部品実装方法 Download PDF

Info

Publication number
WO2008120461A1
WO2008120461A1 PCT/JP2008/000662 JP2008000662W WO2008120461A1 WO 2008120461 A1 WO2008120461 A1 WO 2008120461A1 JP 2008000662 W JP2008000662 W JP 2008000662W WO 2008120461 A1 WO2008120461 A1 WO 2008120461A1
Authority
WO
WIPO (PCT)
Prior art keywords
mounting
correction amount
component
calculation step
amount calculation
Prior art date
Application number
PCT/JP2008/000662
Other languages
English (en)
French (fr)
Inventor
Yasuhiro Maenishi
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to US12/531,139 priority Critical patent/US8156642B2/en
Priority to DE200811000767 priority patent/DE112008000767T5/de
Priority to CN2008800099429A priority patent/CN101647333B/zh
Publication of WO2008120461A1 publication Critical patent/WO2008120461A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Operations Research (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

　部品実装機の搬送方向にサイズが大きい基板であっても高い実装精度で部品を実装することができる部品実装方法は、第１実装領域に設けられた基板マークの位置を認識し、部品装着位置の補正量を算出する第１補正量算出ステップ（Ｓ４）と、第１補正量算出ステップで算出された補正量に基づいて、部品の装着位置を補正しながら、当該部品を第１実装領域に装着する第１装着ステップ（Ｓ６）と、第２実装領域に設けられた基板マークの位置を認識し、部品装着位置の補正量を算出する第２補正量算出ステップ（Ｓ１０）と、第２補正量算出ステップで算出された補正量に基づいて、部品の装着位置を補正しながら、当該部品を第２実装領域に装着する第２装着ステップ（Ｓ１２）とを含む。
PCT/JP2008/000662 2007-04-03 2008-03-19 部品実装方法 WO2008120461A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/531,139 US8156642B2 (en) 2007-04-03 2008-03-19 Component mounting method
DE200811000767 DE112008000767T5 (de) 2007-04-03 2008-03-19 Verfahren zum Bestücken von Bauelementen
CN2008800099429A CN101647333B (zh) 2007-04-03 2008-03-19 元件安装方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007097839 2007-04-03
JP2007-097773 2007-04-03
JP2007097773 2007-04-03
JP2007-097839 2007-04-03

Publications (1)

Publication Number Publication Date
WO2008120461A1 true WO2008120461A1 (ja) 2008-10-09

Family

ID=39808047

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/000662 WO2008120461A1 (ja) 2007-04-03 2008-03-19 部品実装方法

Country Status (4)

Country Link
US (1) US8156642B2 (ja)
KR (1) KR20090125151A (ja)
DE (1) DE112008000767T5 (ja)
WO (1) WO2008120461A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102098907A (zh) * 2009-12-14 2011-06-15 Juki株式会社 部件安装装置以及部件安装方法
CN105759861A (zh) * 2014-12-18 2016-07-13 齐鲁工业大学 Led芯片上蜡机器人的运动控制方法

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WO2009025016A1 (ja) * 2007-08-17 2009-02-26 Fujitsu Limited 部品実装装置及び方法
JP5501696B2 (ja) * 2009-08-19 2014-05-28 オリンパス株式会社 実装装置および実装方法
KR20120132615A (ko) * 2010-03-31 2012-12-06 파나소닉 주식회사 실장 라인 전력 제어 장치 및 실장 라인 전력 제어 방법
CN105393652B (zh) 2013-06-27 2018-10-19 株式会社富士 元件安装机
JP6152169B2 (ja) * 2013-08-09 2017-06-21 富士機械製造株式会社 電子部品装着機が用いるデータを表示する装置
US10165717B2 (en) * 2013-08-26 2018-12-25 Fuji Corporation Component mounting device
EP3062339B1 (en) * 2013-10-21 2019-08-28 FUJI Corporation Substrate working apparatus
JP6314319B2 (ja) * 2014-11-05 2018-04-25 パナソニックＩｐマネジメント株式会社 電子部品実装システム
DE102015101759B3 (de) * 2015-02-06 2016-07-07 Asm Assembly Systems Gmbh & Co. Kg Bestückmaschine und Verfahren zum Bestücken eines Trägers mit ungehäusten Chips
WO2018163322A1 (ja) * 2017-03-08 2018-09-13 株式会社Ｆｕｊｉ ３次元実装装置及び３次元実装方法
DE102017205453B3 (de) * 2017-03-30 2018-07-12 Continental Automotive Gmbh Verfahren zum Bestücken einer Leiterplatte und Bestückungsvorrichtung
US11272649B2 (en) 2018-10-12 2022-03-08 Panasonic Corporation Of North America Electronic component mounting system with cross line communication
JP7076585B2 (ja) * 2019-02-05 2022-05-27 株式会社Fuji 許容値設定装置および許容値設定方法
JP7350696B2 (ja) * 2019-08-29 2023-09-26 芝浦メカトロニクス株式会社 電子部品の実装装置

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JP2003174294A (ja) * 2001-12-07 2003-06-20 Fuji Mach Mfg Co Ltd 電気部品装着システム

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102098907A (zh) * 2009-12-14 2011-06-15 Juki株式会社 部件安装装置以及部件安装方法
CN105759861A (zh) * 2014-12-18 2016-07-13 齐鲁工业大学 Led芯片上蜡机器人的运动控制方法

Also Published As

Publication number Publication date
DE112008000767T5 (de) 2010-04-29
US8156642B2 (en) 2012-04-17
US20100050429A1 (en) 2010-03-04
KR20090125151A (ko) 2009-12-03

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