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WO2008090768A1 - 感光性樹脂組成物、及びこれを用いたパターン形成方法 - Google Patents

感光性樹脂組成物、及びこれを用いたパターン形成方法 Download PDF

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Publication number
WO2008090768A1
WO2008090768A1 PCT/JP2008/050234 JP2008050234W WO2008090768A1 WO 2008090768 A1 WO2008090768 A1 WO 2008090768A1 JP 2008050234 W JP2008050234 W JP 2008050234W WO 2008090768 A1 WO2008090768 A1 WO 2008090768A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
photosensitive resin
same
pattern
forming pattern
Prior art date
Application number
PCT/JP2008/050234
Other languages
English (en)
French (fr)
Inventor
Takahiro Senzaki
Koichi Misumi
Atsushi Yamanouchi
Koji Saito
Original Assignee
Tokyo Ohka Kogyo Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007013799A external-priority patent/JP5020646B2/ja
Priority claimed from JP2007013798A external-priority patent/JP5020645B2/ja
Application filed by Tokyo Ohka Kogyo Co., Ltd. filed Critical Tokyo Ohka Kogyo Co., Ltd.
Priority to US12/449,060 priority Critical patent/US8288078B2/en
Publication of WO2008090768A1 publication Critical patent/WO2008090768A1/ja

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0385—Macromolecular compounds which are rendered insoluble or differentially wettable using epoxidised novolak resin
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

　安全性が高く、塗膜の均一性に優れ、硬化樹脂パターンの硬化密度を向上することができ、さらに高膜厚、高アスペクト比の微細なレジストパターンを形成できる高感度、高解像性の感光性樹脂組成物を提供する。 　特定の構造を有するオニウムフッ素化アルキルフルオロリン酸塩系のカチオン重合開始剤に加えて、特定の溶剤又は特定の増感剤を必須成分として含有する感光性樹脂組成物によれば、塗膜の均一性に優れ、硬化樹脂パターンの硬化密度を向上することができ、さらに高膜厚、高アスペクト比の微細なレジストパターンを形成できる高感度、高解像性の感光性樹脂組成物を提供できる。
PCT/JP2008/050234 2007-01-24 2008-01-11 感光性樹脂組成物、及びこれを用いたパターン形成方法 WO2008090768A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/449,060 US8288078B2 (en) 2007-01-24 2008-01-11 Photosensitive resin composition, and pattern formation method using the same

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-013799 2007-01-24
JP2007-013798 2007-01-24
JP2007013799A JP5020646B2 (ja) 2007-01-24 2007-01-24 感光性樹脂組成物、及びこれを用いたパターン形成方法
JP2007013798A JP5020645B2 (ja) 2007-01-24 2007-01-24 感光性樹脂組成物、及びこれを用いたパターン形成方法

Publications (1)

Publication Number Publication Date
WO2008090768A1 true WO2008090768A1 (ja) 2008-07-31

Family

ID=39644343

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050234 WO2008090768A1 (ja) 2007-01-24 2008-01-11 感光性樹脂組成物、及びこれを用いたパターン形成方法

Country Status (2)

Country Link
US (1) US8288078B2 (ja)
WO (1) WO2008090768A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008310089A (ja) * 2007-06-15 2008-12-25 Tokyo Ohka Kogyo Co Ltd 感光性樹脂組成物、感光性樹脂積層体、及びパターン形成方法
JP2012056915A (ja) * 2010-09-13 2012-03-22 San Apro Kk フッ素化アルキルリン酸スルホニウム塩、酸発生剤及び硬化性組成物
CN114262404A (zh) * 2020-09-16 2022-04-01 宁波南大光电材料有限公司 光敏树脂及应用该光敏树脂的光刻胶组合物

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WO2007094396A1 (ja) * 2006-02-16 2007-08-23 Tokyo Ohka Kogyo Co., Ltd. 感光性樹脂組成物およびこれを用いたパターン形成方法
US8702819B2 (en) 2008-09-10 2014-04-22 Poet Research, Inc. Oil composition and method of recovering the same
BR112012028293B1 (pt) 2010-05-03 2023-12-19 Creatv Microtech, Inc Microfiltro, método de formar um microfiltro e método de filtração
US9658207B2 (en) 2011-04-01 2017-05-23 Creatv Microtech, Inc. Polymer microfiltration devices, methods of manufacturing the same and the uses of the microfiltration devices
US20170176856A1 (en) 2015-12-21 2017-06-22 Az Electronic Materials (Luxembourg) S.A.R.L. Negative-working photoresist compositions for laser ablation and use thereof
US11112696B2 (en) * 2016-09-16 2021-09-07 Nissan Chemical Corporation Protective film-forming composition
CN113906077B (zh) * 2019-05-22 2024-08-13 日产化学株式会社 抗蚀剂下层膜形成用组合物

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JP2005055865A (ja) * 2003-07-24 2005-03-03 Tokyo Ohka Kogyo Co Ltd 感光性樹脂組成物および該組成物を用いたパターン形成方法
WO2005116038A1 (ja) * 2004-05-28 2005-12-08 San-Apro Limited 新規なオニウムおよび遷移金属錯体のフッ素化アルキルフルオロリン酸塩
JP2006227544A (ja) * 2005-01-21 2006-08-31 Tokyo Ohka Kogyo Co Ltd 精密微細空間の天板部形成用感光性積層フィルムおよび精密微細空間の形成方法
WO2007094396A1 (ja) * 2006-02-16 2007-08-23 Tokyo Ohka Kogyo Co., Ltd. 感光性樹脂組成物およびこれを用いたパターン形成方法
WO2007119391A1 (ja) * 2006-03-22 2007-10-25 San-Apro Limited 感活性エネルギー線ネガ型フォトレジスト組成物およびその硬化物

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US7153909B2 (en) * 1994-11-17 2006-12-26 Dow Global Technologies Inc. High density ethylene homopolymers and blend compositions
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005055865A (ja) * 2003-07-24 2005-03-03 Tokyo Ohka Kogyo Co Ltd 感光性樹脂組成物および該組成物を用いたパターン形成方法
WO2005116038A1 (ja) * 2004-05-28 2005-12-08 San-Apro Limited 新規なオニウムおよび遷移金属錯体のフッ素化アルキルフルオロリン酸塩
JP2006227544A (ja) * 2005-01-21 2006-08-31 Tokyo Ohka Kogyo Co Ltd 精密微細空間の天板部形成用感光性積層フィルムおよび精密微細空間の形成方法
WO2007094396A1 (ja) * 2006-02-16 2007-08-23 Tokyo Ohka Kogyo Co., Ltd. 感光性樹脂組成物およびこれを用いたパターン形成方法
WO2007119391A1 (ja) * 2006-03-22 2007-10-25 San-Apro Limited 感活性エネルギー線ネガ型フォトレジスト組成物およびその硬化物

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008310089A (ja) * 2007-06-15 2008-12-25 Tokyo Ohka Kogyo Co Ltd 感光性樹脂組成物、感光性樹脂積層体、及びパターン形成方法
JP2012056915A (ja) * 2010-09-13 2012-03-22 San Apro Kk フッ素化アルキルリン酸スルホニウム塩、酸発生剤及び硬化性組成物
CN114262404A (zh) * 2020-09-16 2022-04-01 宁波南大光电材料有限公司 光敏树脂及应用该光敏树脂的光刻胶组合物
CN114262404B (zh) * 2020-09-16 2023-06-30 宁波南大光电材料有限公司 光敏树脂及应用该光敏树脂的光刻胶组合物

Also Published As

Publication number Publication date
US8288078B2 (en) 2012-10-16
US20100068649A1 (en) 2010-03-18

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