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WO2008081752A1 - 検査方法、検査装置及びプログラムを記憶したコンピュータ読み取り可能な記憶媒体 - Google Patents

検査方法、検査装置及びプログラムを記憶したコンピュータ読み取り可能な記憶媒体 Download PDF

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Publication number
WO2008081752A1
WO2008081752A1 PCT/JP2007/074683 JP2007074683W WO2008081752A1 WO 2008081752 A1 WO2008081752 A1 WO 2008081752A1 JP 2007074683 W JP2007074683 W JP 2007074683W WO 2008081752 A1 WO2008081752 A1 WO 2008081752A1
Authority
WO
WIPO (PCT)
Prior art keywords
probes
inspecting
flitting
storage medium
computer readable
Prior art date
Application number
PCT/JP2007/074683
Other languages
English (en)
French (fr)
Inventor
Yasunori Kumagai
Ka Toh
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Priority to JP2008552100A priority Critical patent/JP5020261B2/ja
Priority to US12/441,957 priority patent/US20100039130A1/en
Publication of WO2008081752A1 publication Critical patent/WO2008081752A1/ja

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

　本発明においては、検査装置のプローブカードに、基板の電極に接触した２本一組のプローブ対間に電圧を印加しフリッティング現象を生じさせてプローブと基板の間の電気的な導通を図るフリッティング回路と、プローブ対とフリッティング回路を電気的に接続し、プローブ対に印加される電圧の極性を切り替え自在なスイッチング回路が設けられる。本発明によれば。基板の電極に対してフリッティングが行われる度に、プローブ対に印加される電圧の極性が変更され、プローブ対間に生じる付着物の量の偏りが解消する。
PCT/JP2007/074683 2006-12-27 2007-12-21 検査方法、検査装置及びプログラムを記憶したコンピュータ読み取り可能な記憶媒体 WO2008081752A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008552100A JP5020261B2 (ja) 2006-12-27 2007-12-21 検査方法、検査装置及びプログラムを記憶したコンピュータ読み取り可能な記憶媒体
US12/441,957 US20100039130A1 (en) 2006-12-27 2007-12-21 Inspecting method, inspecting apparatus and computer readable storage medium having program stored therein

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-351581 2006-12-27
JP2006351581 2006-12-27

Publications (1)

Publication Number Publication Date
WO2008081752A1 true WO2008081752A1 (ja) 2008-07-10

Family

ID=39588436

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/074683 WO2008081752A1 (ja) 2006-12-27 2007-12-21 検査方法、検査装置及びプログラムを記憶したコンピュータ読み取り可能な記憶媒体

Country Status (4)

Country Link
US (1) US20100039130A1 (ja)
JP (1) JP5020261B2 (ja)
TW (1) TW200843010A (ja)
WO (1) WO2008081752A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2013282701B2 (en) * 2012-06-29 2016-10-27 Dhi Water & Environment (S) Pte. Ltd. An improved suspended sediment meter
JP6042761B2 (ja) * 2013-03-28 2016-12-14 東京エレクトロン株式会社 プローブ装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005037199A (ja) * 2003-07-18 2005-02-10 Yamaha Corp プローブユニット、導通試験方法及びその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4841737B2 (ja) * 2000-08-21 2011-12-21 東京エレクトロン株式会社 検査方法及び検査装置
JP2004093451A (ja) * 2002-09-02 2004-03-25 Tokyo Electron Ltd プローブ方法及びプローブ装置
JP4456325B2 (ja) * 2002-12-12 2010-04-28 東京エレクトロン株式会社 検査方法及び検査装置
JP4387125B2 (ja) * 2003-06-09 2009-12-16 東京エレクトロン株式会社 検査方法及び検査装置
JP2008157818A (ja) * 2006-12-25 2008-07-10 Tokyo Electron Ltd 検査方法、検査装置及びプログラムを記憶したコンピュータ読み取り可能な記憶媒体

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005037199A (ja) * 2003-07-18 2005-02-10 Yamaha Corp プローブユニット、導通試験方法及びその製造方法

Also Published As

Publication number Publication date
JP5020261B2 (ja) 2012-09-05
US20100039130A1 (en) 2010-02-18
TWI366241B (ja) 2012-06-11
JPWO2008081752A1 (ja) 2010-04-30
TW200843010A (en) 2008-11-01

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