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WO2007138677A1 - Porcelain substrate for mounting light emitting element, and light source device - Google Patents

Porcelain substrate for mounting light emitting element, and light source device Download PDF

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Publication number
WO2007138677A1
WO2007138677A1 PCT/JP2006/310760 JP2006310760W WO2007138677A1 WO 2007138677 A1 WO2007138677 A1 WO 2007138677A1 JP 2006310760 W JP2006310760 W JP 2006310760W WO 2007138677 A1 WO2007138677 A1 WO 2007138677A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
substrate
emitting element
light
source device
Prior art date
Application number
PCT/JP2006/310760
Other languages
French (fr)
Japanese (ja)
Inventor
Ryuji Suzuki
Original Assignee
Fujikura Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd. filed Critical Fujikura Ltd.
Priority to PCT/JP2006/310760 priority Critical patent/WO2007138677A1/en
Publication of WO2007138677A1 publication Critical patent/WO2007138677A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material

Definitions

  • Light-emitting device mounting enamel substrate and light source device
  • the present invention relates to a light-emitting element mounting enamel substrate and a light source device on which light-emitting elements such as light-emitting diodes (hereinafter referred to as LEDs) are mounted.
  • LED mounting substrate having a reflective recess for efficiently reflecting light emitted from a light emitting element in a predetermined direction is used, and an electrode necessary for supplying power to the LED is formed on the surface of the substrate.
  • An LED is mounted inside, and the LED and the electrode on the board are electrically connected by wire bonding or the like.
  • the LED is sealed by filling and curing the transparent resin in the reflective recess.
  • LEDs have begun to be used as illumination light sources. Since the amount of light emitted by one LED is relatively small, a large number of LEDs must be arranged on the substrate in order to use the LED as a light source for illumination. Furthermore, if LEDs are mounted on both sides of the substrate and emitted in the same direction with a reflector, etc., a large number of LEDs can emit light with a small substrate size, and a larger amount of light can be obtained.
  • Such a double-sided light emitting LED package is disclosed in, for example, Patent Document 1.
  • reflecting cups are formed on both sides of a substrate made of glass epoxy resin, LED elements are mounted on the bottom surface, and light is emitted from both sides of the substrate.
  • Patent Document 1 Japanese Patent Laid-Open No. 2003-229603
  • the present invention has been made in view of the above circumstances, and even when a large number of light emitting elements are mounted, the light emitting element mounting substrate having excellent heat dissipation that can keep the temperature rise of the light emitting elements at a low level, and
  • An object is to provide a light source device in which a light emitting element is mounted on a substrate.
  • the present invention provides a hollow substrate for mounting a light-emitting element, comprising a core metal, a hollow layer coated with the core metal, and recesses provided on both surfaces of the hollow substrate. And a light-emitting element mounting enamel substrate.
  • the present invention is a light source device, comprising: a core metal; a hollow substrate coated with the core metal; and a hollow substrate for mounting a light-emitting element provided with a reflective recess on both sides; And a light emitting device mounted on the reflective recess of the substrate.
  • a light emitting element is mounted only on the reflective recess on one surface side of the enamel substrate, and the reflective recess on the other surface side is a heat radiating portion.
  • the enamel substrate for mounting a light emitting element of the present invention has a core metal covered with an enamel layer
  • the heat dissipation is superior to that of a conventional glass epoxy resin substrate, and even when a large number of light emitting elements are mounted, the temperature rise of the light emitting element can be kept at a low level.
  • the reflective recesses are provided on both sides of the single substrate, when a light emitting element is mounted on both sides of the substrate, a light source device having a small size and a high light quantity can be manufactured.
  • the temperature of the light emitting elements rises even when many light emitting elements are mounted on the substrate for illumination. Therefore, it is possible to provide a light source device that is small in size, has high luminous efficiency, and has a long life.
  • the reflective recess on the other surface side becomes a heat radiating portion, and the heat radiation performance can be further enhanced.
  • FIG. 1 is a cross-sectional view showing a first embodiment of a light source device of the present invention.
  • FIG. 2 is a cross-sectional view showing a second embodiment of the light source device of the present invention.
  • FIG. 3 is a cross-sectional view showing a light source device manufactured in Comparative Example 1.
  • FIG. 1 is a cross-sectional view showing a first embodiment of a light emitting device mounting hollow substrate and a light source device according to the present invention.
  • the light emitting element 6 is mounted on each of the reflective recesses 4 provided on both surfaces A and B of the light emitting element mounting enamel substrate 1, and each reflective recess 4 is filled with a transparent resin 9.
  • the light emitting element 6 is sealed.
  • the light emitting element mounting enamel substrate 1 of the present embodiment is provided with a plurality of reflective recesses 4 on which light emitting elements 6 are mounted on both surfaces of a hollow substrate in which a core metal 2 is covered with an enamel layer 3.
  • a power supply electrode 7 of the light emitting element 6 is provided on the enamel layer 3. A part of the electrode 7 extends on the bottom surface of the reflective recess 7, and the light emitting element 6 is mounted thereon by die bonding or the like.
  • the material of the core metal 3 is not particularly limited, but the enamel layer 3 can be easily baked. Therefore, a low carbon steel plate is desirable because it can be easily machined to form the reflective recesses 4 and the force is low.
  • the enamel layer 3 can be formed by a method of baking glass powder on the surface of the core metal 2.
  • the electrode 7 can be formed using various metal materials such as silver, copper, aluminum, and nickel. For example, a method of printing a silver paste or a copper paste along a desired formation pattern on the enamel layer 3 and then baking it. It is desirable to form by.
  • the shape of the reflective recess 4 is not limited as long as a part of the light emitted from the light emitting element 6 can be efficiently reflected to the front side of the reflective recess.
  • the dimensions are not limited.
  • a plurality of reflective recesses 4 each having a circular mortar shape are formed on both surfaces A and B of a single substrate.
  • the position of the reflective recesses 4 formed on both sides A and B of the enamel substrate is such that the A-side reflective recesses 4 and the B-side reflective recesses 4 coincide with each other in the substrate thickness direction. They may be provided, or may be provided at different positions on the A side and the B side.
  • the hollow substrate 1 for mounting a light emitting element of the present embodiment has the core metal 2 covered with the hollow layer 3, it has heat dissipation superior to that of a conventional glass epoxy resin substrate. Even when the light emitting element 6 is mounted, the temperature rise of the light emitting element 6 can be kept at a low level.
  • the reflective recesses 4 are provided on both sides A and B of the hollow substrate, when the light emitting element 6 is mounted on both sides A and B of the substrate, it is possible to produce a light source device 5A that is small and has a high light quantity. I'll do it.
  • a light source device 5A of the present embodiment includes a light emitting element 6 mounted on the bottom surface of each reflective recess 4 provided on both surfaces A and B of the light emitting element mounting enamel substrate 1 described above.
  • the electrode 7 is connected by a thin metal wire 8, and the reflective recess 4 is filled with a transparent resin 9 and cured to seal the light emitting element 6.
  • the light emitting element 6 is preferably an LED.
  • a phosphor is mixed with the transparent resin 9
  • a light source having an arbitrary color can be formed by the light from the light emitting element 6 and the light excited by the phosphor.
  • a blue LED is used as the light emitting element 6, and the blue LED is sealed with a transparent resin 9 mixed with a yellow light emitting phosphor, thereby emitting white light preferable as a light source for illumination.
  • a white LED can be configured.
  • a metal plate such as a low-carbon steel plate prepared as the core metal 2 of the enamel substrate is subjected to machining such as drilling, and mortar-shaped reflective recesses 4 are formed on both sides A and B thereof.
  • a liquid in which glass powder is dispersed in an appropriate dispersion medium is applied to the entire surface of the core metal 2 and sintered at a high temperature to form the enamel layer 3.
  • a thick film copper paste or a silver paste is printed by a screen printing method or the like according to an electrode formation pattern in which a part is extended into the reflective recess 4. Thereafter, the electrode 7 is formed by baking at a high temperature. As a result, a hollow substrate 1 for mounting light emitting elements is manufactured.
  • the light emitting element 6 is mounted on one electrode 7 extending in the reflective recess 4 of the light emitting element mounting enamel substrate 1.
  • the other electrode 7 in the reflective recess 4 and the light emitting element 6 are bonded with a thin metal wire 8.
  • the reflective recess 4 is filled with a transparent resin such as an epoxy resin or a silicone resin and cured. Let the oil seal.
  • the light source device 5A can turn on a large number of light-emitting elements 6 mounted on both surfaces A and B by supplying power to the electrode 7, and can obtain a high amount of light. A part of the light emitted from each light emitting element 6 is directly emitted to the outside, and part of the light is emitted to the outside by being reflected on the bottom surface of the reflecting recess 4 and the tapered side wall.
  • This double-sided light source device 5A can be used as an illumination light source as it is. If you want to direct light to only one surface, use either a reflector or an appropriate light guide to It is also possible to guide the light on the other side to the other side.
  • this light source device 5A since the light emitting element 6 is mounted in the reflective recess 4 of the light emitting element mounting enamel substrate 1, even if a large number of light emitting elements 6 are mounted on the substrate for illumination, the light emitting element 6A The temperature rise of 6 is suppressed to a low level, and the performance degradation of the light-emitting element 6 due to the temperature rise Therefore, it is possible to provide a light source device 5A that is small, has high luminous efficiency, and has a long life.
  • FIG. 2 is a cross-sectional view showing a second embodiment of the light source device of the present invention.
  • the light source device 5B of the present embodiment is configured by mounting the light emitting element 6 in the reflective recess 4 of the light emitting element mounting enamel substrate 1 in the same manner as the light source device 5A of the first embodiment described above.
  • the light emitting element mounting enamel substrate 1 has the light emitting element 6 mounted only on the reflective recess 4 on one surface A side, and the reflective recess 4 on the other surface B side is a heat radiating portion. Different from light source device 5A.
  • the light emitting element 6 is mounted only on one surface A side of the substrate, and the reflective recess 4 on the other surface B side is a heat radiating portion. Compared with the light source device 15 using the substrate 11 having the flat surface B on the other side, the heat dissipation can be further improved, and the light emitting element 6 is less likely to deteriorate in performance or cause a failure due to temperature rise.
  • the light source device 5B having high efficiency and long life can be provided.
  • the core metal 2 is a low-carbon steel plate with a length of 30 mm, a width of 10 mm, and a thickness of 1.5 mm.
  • the core is drilled so that a circular mortar-shaped reflective recess is formed on both sides of the steel plate.
  • Metal 2 was produced.
  • a total of 18 reflective recesses 4 were formed, 9 on each side at intervals of 3 mm.
  • the dimensions of the reflective recess 4 were such that the bottom surface had a diameter of 1 mm, a depth of 0.5 mm, and the inclination angle of the tapered side wall portion was 45 degrees.
  • glass powder was mixed with a dispersion medium, applied to the entire surface of the core metal 2, dried and fired at 850 ° C. to form a hollow layer 3.
  • the thickness of the enamel layer 3 was 200 ⁇ m.
  • a copper paste is screen-printed in an electrode formation pattern and then baked to form an electrode 7 having a thickness of 0.1 mm. Produced.
  • a single-sided light source device 5B shown in FIG. 2 was produced. As shown in Fig. 2, nine blue LED elements with an output of 20mW are mounted in the reflective recess 4 on one side A of the light-emitting element enamel substrate 1, and bonded using gold wires, and then the reflective recess 4 was filled with epoxy resin and sealed.
  • the blue LED element of the light source device 5B was made to emit light, and after being left standing, the center temperature of the substrate was measured and found to be 36 ° C.
  • Example 2 Using the core metal 12 of the same size as in Example 1 and forming the reflective recess 14 of the same size only on one side, the enamel layer 13 and the electrode 7 are produced in the same manner, and the reflective recess only on one side shown in FIG. A hollow substrate 11 for mounting light-emitting elements having 14 was produced.
  • the same nine blue LED elements as in Examples 1 and 2 are mounted in the reflective recess 14 of the light emitting element mounting enamel substrate 11, bonded using gold wires, filled with epoxy resin, and reflected recess 14.
  • the light source device 15 was produced.
  • the present invention can be applied to a light-emitting element mounting enamel substrate and a light source device on which light-emitting elements such as LEDs are mounted.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)

Abstract

A porcelain substrate for mounting light emitting elements is provided with a core metal, a porcelain layer applied on the core metal, and a light emitting elements mounted on recessed sections arranged on the both surfaces of the porcelain substrate. A light source device is provided with a porcelain substrate for mounting light emitting elements. The porcelain substrate has a core metal, a porcelain layer applied on the core metal and reflecting recessed sections on the both surfaces. The light source device is also provided with light emitting elements mounted in the reflecting recessed sections on the porcelain substrate.

Description

発光素子実装用ホーロー基板及び光源装置  Light-emitting device mounting enamel substrate and light source device

技術分野  Technical field

[0001] 本発明は、発光ダイオード (以下、 LEDと記す。）などの発光素子を実装する発光 素子実装用ホーロー基板及び光源装置に関する。  The present invention relates to a light-emitting element mounting enamel substrate and a light source device on which light-emitting elements such as light-emitting diodes (hereinafter referred to as LEDs) are mounted.

背景技術  Background art

[0002] 現在使用されて!、る LEDを用いた光源装置は、ガラスエポキシ榭脂などの絶縁材 料力 なる。発光素子力 発する光を効率よく所定方向に反射するための反射凹部 を有する LED実装用基板が用いられており、該基板の表面に LEDへ給電するため に必要な電極が形成され、前記反射凹部内に LEDが実装され、ワイヤボンディング などによって LEDと基板上電極とが電気的に接続されている。さらに反射凹部内に 透明榭脂を充填、硬化させて LEDが封止されている。  [0002] Currently used! Light source devices using LEDs become a material for insulating materials such as glass epoxy resin. An LED mounting substrate having a reflective recess for efficiently reflecting light emitted from a light emitting element in a predetermined direction is used, and an electrode necessary for supplying power to the LED is formed on the surface of the substrate. An LED is mounted inside, and the LED and the electrode on the board are electrically connected by wire bonding or the like. In addition, the LED is sealed by filling and curing the transparent resin in the reflective recess.

[0003] 近年、 LEDは照明用光源として使用され始めている。 1つの LED力も発する光量 は比較的小さいことから、 LEDを照明用光源として使用するためには、多数の LED を基板上に配置する必要がある。さらに、基板両面に LEDを実装し、反射板等で同 一方向へ出射させれば、小さい基板サイズで多数の LEDを発光させ、より多くの光 量を得ることができる。このような両面発光用 LEDパッケージは、例えば特許文献 1 に開示されている。特許文献 1に開示された従来技術は、ガラスエポキシ榭脂からな る基板の両面に反射カップを形成し、その底面に LED素子を実装し、基板の両面か ら発光させる。  In recent years, LEDs have begun to be used as illumination light sources. Since the amount of light emitted by one LED is relatively small, a large number of LEDs must be arranged on the substrate in order to use the LED as a light source for illumination. Furthermore, if LEDs are mounted on both sides of the substrate and emitted in the same direction with a reflector, etc., a large number of LEDs can emit light with a small substrate size, and a larger amount of light can be obtained. Such a double-sided light emitting LED package is disclosed in, for example, Patent Document 1. In the prior art disclosed in Patent Document 1, reflecting cups are formed on both sides of a substrate made of glass epoxy resin, LED elements are mounted on the bottom surface, and light is emitted from both sides of the substrate.

特許文献 1：特開 2003 - 229603号公報  Patent Document 1: Japanese Patent Laid-Open No. 2003-229603

発明の開示  Disclosure of the invention

発明が解決しょうとする課題  Problems to be solved by the invention

[0004] LEDに給電し発光させている時、発光に寄与しない電力は熱に変換され、 LEDの 温度及び周囲の基板温度が上昇する。 LEDは温度上昇に伴って発光効率が低下し てしまうため、 LEDの発光効率を高めるためには、ノ¾ /ケージの放熱性を高め、発光 素子の温度上昇を抑えることが必要である。しかし、従来のガラスエポキシ榭脂製の 基板は、放熱性が不十分であった。そのため LEDの発光効率を高めることができる 放熱性の良好な発光素子実装用基板の提供が期待されていた。 [0004] When an LED is supplied with power to emit light, the power that does not contribute to light emission is converted into heat, and the LED temperature and the surrounding substrate temperature rise. Since the luminous efficiency of the LED decreases as the temperature rises, in order to increase the luminous efficiency of the LED, it is necessary to improve the heat dissipation of the battery / cage and suppress the temperature rise of the light emitting element. However, it is made of conventional glass epoxy resin The substrate had insufficient heat dissipation. Therefore, it was expected to provide a substrate for mounting light-emitting elements with good heat dissipation that can increase the luminous efficiency of LEDs.

[0005] 特に、多数の LEDを基板上に配置して照明用光源を作製する場合、基板の放熱 性が不十分であると、 LEDが直ぐに高温になって発光効率が低下し、故障し易くなり 、寿命が短くなる可能性がある。したがって、高性能な照明用 LED光源の提供のた めに、多数の LEDを実装した場合でも LEDの温度上昇を低レベルに保つことができ る優れた放熱性を有する発光素子実装用基板の提供が切望されている。  [0005] In particular, when manufacturing a light source for illumination by arranging a large number of LEDs on a substrate, if the heat dissipation of the substrate is insufficient, the LEDs will soon become hot and the light emission efficiency will decrease, leading to failure. The life may be shortened. Therefore, in order to provide a high-performance LED light source for lighting, provide a substrate for mounting light-emitting elements with excellent heat dissipation that can keep LED temperature rise at a low level even when many LEDs are mounted. Is anxious.

[0006] 本発明は前記事情に鑑みてなされ、多数の発光素子を実装した場合でも発光素 子の温度上昇を低レベルに保つことができる優れた放熱性を有する発光素子実装 用基板、及び該基板に発光素子を実装した光源装置の提供を目的とする。  [0006] The present invention has been made in view of the above circumstances, and even when a large number of light emitting elements are mounted, the light emitting element mounting substrate having excellent heat dissipation that can keep the temperature rise of the light emitting elements at a low level, and An object is to provide a light source device in which a light emitting element is mounted on a substrate.

課題を解決するための手段  Means for solving the problem

[0007] 前記目的を達成するため、本発明は、発光素子実装用ホーロー基板であって、コ ァ金属と、前記コア金属に被覆したホーロー層と、前記ホーロー基板の両面に設けら れた凹部に実装された発光素子と、を有する発光素子実装用ホーロー基板を提供 する。 [0007] In order to achieve the above object, the present invention provides a hollow substrate for mounting a light-emitting element, comprising a core metal, a hollow layer coated with the core metal, and recesses provided on both surfaces of the hollow substrate. And a light-emitting element mounting enamel substrate.

[0008] また本発明は、光源装置であって、コア金属と、前記コア金属に被覆したホーロー 層と、を有し、両面に反射凹部が設けられた発光素子実装用ホーロー基板と、前記 ホーロー基板の前記反射凹部に実装された発光素子と、を有する光源装置を提供 する。  [0008] Further, the present invention is a light source device, comprising: a core metal; a hollow substrate coated with the core metal; and a hollow substrate for mounting a light-emitting element provided with a reflective recess on both sides; And a light emitting device mounted on the reflective recess of the substrate.

[0009] 本発明の光源装置において、前記ホーロー基板の一方の面側の前記反射凹部の みに発光素子が実装され、他方の面側の反射凹部が放熱部とされていることが望ま しい。  [0009] In the light source device of the present invention, it is desirable that a light emitting element is mounted only on the reflective recess on one surface side of the enamel substrate, and the reflective recess on the other surface side is a heat radiating portion.

発明の効果  The invention's effect

[0010] 本発明の発光素子実装用ホーロー基板は、コア金属をホーロー層で被覆したので [0010] Since the enamel substrate for mounting a light emitting element of the present invention has a core metal covered with an enamel layer,

、従来のガラスエポキシ榭脂製基板よりも優れた放熱性を有しており、多数の発光素 子を実装した場合でも発光素子の温度上昇を低レベルに保つことができる。またホ 一口一基板の両面に反射凹部を設けているので、該基板の両面に発光素子を実装 した場合には、小型で高光量の光源装置を作製することができる。 また本発明の光源装置は、本発明の発光素子実装用ホーロー基板の反射凹部内 に発光素子を実装したので、照明用として多数の発光素子を基板に実装しても、発 光素子の温度上昇が低レベルに抑えられ、温度上昇による発光素子の性能低下や 故障発生などが起こりにくくなり、小型で発光効率が高く長寿命の光源装置を提供す ることがでさる。 The heat dissipation is superior to that of a conventional glass epoxy resin substrate, and even when a large number of light emitting elements are mounted, the temperature rise of the light emitting element can be kept at a low level. In addition, since the reflective recesses are provided on both sides of the single substrate, when a light emitting element is mounted on both sides of the substrate, a light source device having a small size and a high light quantity can be manufactured. In the light source device of the present invention, since the light emitting elements are mounted in the reflective recesses of the enamel substrate for mounting the light emitting elements of the present invention, the temperature of the light emitting elements rises even when many light emitting elements are mounted on the substrate for illumination. Therefore, it is possible to provide a light source device that is small in size, has high luminous efficiency, and has a long life.

また、前記基板の一方の面側のみに発光素子を実装した場合、他方の面側の反射 凹部は放熱部となり、より一層放熱性を高めることができる。  Further, when the light emitting element is mounted only on one surface side of the substrate, the reflective recess on the other surface side becomes a heat radiating portion, and the heat radiation performance can be further enhanced.

図面の簡単な説明  Brief Description of Drawings

[0011] [図 1]本発明の光源装置の第 1実施形態を示す断面図である。  FIG. 1 is a cross-sectional view showing a first embodiment of a light source device of the present invention.

[図 2]本発明の光源装置の第 2実施形態を示す断面図である。  FIG. 2 is a cross-sectional view showing a second embodiment of the light source device of the present invention.

[図 3]比較例 1で作製した光源装置を示す断面図である。  FIG. 3 is a cross-sectional view showing a light source device manufactured in Comparative Example 1.

符号の説明  Explanation of symbols

[0012] 1…発光素子実装用ホーロー基板、 2· ··コア金属、 3…ホーロー層、 4· ··反射凹部、 5A, 5Β· ··光源装置、 6…発光素子、 7…電極、 8…金属細線、 9…透明榭脂。  [0012] 1 ... Hollow substrate for mounting light emitting element, 2 ... Core metal, 3 ... Hollow layer, 4 ... Reflective recess, 5A, 5, ... Light source device, 6 ... Light emitting element, 7 ... Electrode, 8 ... fine metal wire, 9 ... transparent resin.

発明を実施するための最良の形態  BEST MODE FOR CARRYING OUT THE INVENTION

[0013] 以下、図面を参照して本発明の実施形態を説明する。ただし、本発明は以下の各 実施例に限定されるものではなぐ例えばこれら実施例の構成要素同士を適宜組み 合わせてもよい。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the present invention is not limited to the following examples. For example, the constituent elements of these examples may be appropriately combined.

図 1は、本発明に係る発光素子実装用ホーロー基板及び光源装置の第 1実施形態 を示す断面図である。本実施形態の光源装置 5Aは、発光素子実装用ホーロー基板 1の両面 A, Bに設けられた反射凹部 4にそれぞれ発光素子 6を実装するとともに、各 反射凹部 4に透明榭脂 9を充填して発光素子 6を封止して構成されている。  FIG. 1 is a cross-sectional view showing a first embodiment of a light emitting device mounting hollow substrate and a light source device according to the present invention. In the light source device 5A of the present embodiment, the light emitting element 6 is mounted on each of the reflective recesses 4 provided on both surfaces A and B of the light emitting element mounting enamel substrate 1, and each reflective recess 4 is filled with a transparent resin 9. The light emitting element 6 is sealed.

[0014] 本実施形態の発光素子実装用ホーロー基板 1は、コア金属 2をホーロー層 3で被覆 したホーロー基板の両面に発光素子 6が実装される複数の反射凹部 4が設けられ、さ らにホーロー層 3上に発光素子 6の給電用の電極 7が設けられた構成を有する。この 電極 7の一部は、反射凹部 7の底面に延設され、その上に発光素子 6がダイボンディ ングなどにより実装される。  [0014] The light emitting element mounting enamel substrate 1 of the present embodiment is provided with a plurality of reflective recesses 4 on which light emitting elements 6 are mounted on both surfaces of a hollow substrate in which a core metal 2 is covered with an enamel layer 3. A power supply electrode 7 of the light emitting element 6 is provided on the enamel layer 3. A part of the electrode 7 extends on the bottom surface of the reflective recess 7, and the light emitting element 6 is mounted thereon by die bonding or the like.

[0015] 前記コア金属 3の材料は特に限定されないが、ホーロー層 3の焼き付けが容易にで き、反射凹部 4形成のための機械加工が容易にでき、し力も低価格であることから、 低炭素鋼板などが望ましい。 [0015] The material of the core metal 3 is not particularly limited, but the enamel layer 3 can be easily baked. Therefore, a low carbon steel plate is desirable because it can be easily machined to form the reflective recesses 4 and the force is low.

前記ホーロー層 3の材料は、ガラスなどが用いられる。このホーロー層 3は、コア金 属 2の表面にガラス粉末を焼き付ける方法などによって形成することができる。  As the material of the enamel layer 3, glass or the like is used. The enamel layer 3 can be formed by a method of baking glass powder on the surface of the core metal 2.

前記電極 7は、銀、銅、アルミニウム、ニッケルなどの各種金属材料を用いて形成で き、例えば、ホーロー層 3上に銀ペーストまたは銅ペーストを所望の形成パターンに 沿って印刷し、その後焼き付ける方法により形成することが望ましい。  The electrode 7 can be formed using various metal materials such as silver, copper, aluminum, and nickel. For example, a method of printing a silver paste or a copper paste along a desired formation pattern on the enamel layer 3 and then baking it. It is desirable to form by.

[0016] 前記反射凹部 4は、その底面上に発光素子 6を実装した際に、発光素子 6から発す る一部の光を効率よく反射凹部前方側に反射させることができればよぐその形状や 寸法は限定されない。図示した例では、円形のすり鉢状をした反射凹部 4を、ホー口 一基板の両面 A, Bにそれぞれ複数個、形成している。ホーロー基板の両面 A, Bに 形成する反射凹部 4の位置関係は、図 1に示すように、 A面側の反射凹部 4と B面側 の反射凹部 4とが基板厚み方向で一致する位置に設けてもよいし、 A面と B面とで異 なる位置に設けてもよい。  [0016] When the light emitting element 6 is mounted on the bottom surface of the reflective recess 4, the shape of the reflective recess 4 is not limited as long as a part of the light emitted from the light emitting element 6 can be efficiently reflected to the front side of the reflective recess. The dimensions are not limited. In the example shown in the figure, a plurality of reflective recesses 4 each having a circular mortar shape are formed on both surfaces A and B of a single substrate. As shown in Fig. 1, the position of the reflective recesses 4 formed on both sides A and B of the enamel substrate is such that the A-side reflective recesses 4 and the B-side reflective recesses 4 coincide with each other in the substrate thickness direction. They may be provided, or may be provided at different positions on the A side and the B side.

[0017] 本実施形態の発光素子実装用ホーロー基板 1は、コア金属 2をホーロー層 3で被覆 したので、従来のガラスエポキシ榭脂製基板よりも優れた放熱性を有しており、多数 の発光素子 6を実装した場合でも発光素子 6の温度上昇を低レベルに保つことがで きる。またホーロー基板の両面 A, Bに反射凹部 4を設けているので、該基板の両面 A, Bに発光素子 6を実装した場合には、小型で高光量の光源装置 5Aを作製するこ とがでさる。  [0017] Since the hollow substrate 1 for mounting a light emitting element of the present embodiment has the core metal 2 covered with the hollow layer 3, it has heat dissipation superior to that of a conventional glass epoxy resin substrate. Even when the light emitting element 6 is mounted, the temperature rise of the light emitting element 6 can be kept at a low level. In addition, since the reflective recesses 4 are provided on both sides A and B of the hollow substrate, when the light emitting element 6 is mounted on both sides A and B of the substrate, it is possible to produce a light source device 5A that is small and has a high light quantity. I'll do it.

[0018] 本実施形態の光源装置 5Aは、前述した発光素子実装用ホーロー基板 1の両面 A , Bに設けられたそれぞれの反射凹部 4の底面上に発光素子 6を実装し、発光素子 6 と電極 7とを金属細線 8によって接続し、さらに反射凹部 4に透明榭脂 9を充填、硬化 させて発光素子 6を封止して構成されて ヽる。  [0018] A light source device 5A of the present embodiment includes a light emitting element 6 mounted on the bottom surface of each reflective recess 4 provided on both surfaces A and B of the light emitting element mounting enamel substrate 1 described above. The electrode 7 is connected by a thin metal wire 8, and the reflective recess 4 is filled with a transparent resin 9 and cured to seal the light emitting element 6.

[0019] 前記発光素子 6としては、 LEDが好ましい。また、透明榭脂 9に蛍光体を混合すれ ば、発光素子 6からの光と蛍光体で励起された光とで、任意の色合いの光源とするこ とができる。例えば、発光素子 6として青色 LEDを用い、黄色発光蛍光体を混ぜた透 明榭脂 9で該青色 LEDを封止することで、照明用光源として好ましい白色光を発す る白色 LEDを構成することができる。 [0019] The light emitting element 6 is preferably an LED. In addition, when a phosphor is mixed with the transparent resin 9, a light source having an arbitrary color can be formed by the light from the light emitting element 6 and the light excited by the phosphor. For example, a blue LED is used as the light emitting element 6, and the blue LED is sealed with a transparent resin 9 mixed with a yellow light emitting phosphor, thereby emitting white light preferable as a light source for illumination. A white LED can be configured.

[0020] 次に、前記発光素子実装用ホーロー基板 1及び光源装置 5Aの製造方法の一例を 説明する。 Next, an example of a manufacturing method of the light emitting element mounting enamel substrate 1 and the light source device 5A will be described.

まず、ホーロー基板のコア金属 2として用意した低炭素鋼板などの金属板に、ドリル 加工などの機械加工を施し、その両面 A, Bにすり鉢形状の反射凹部 4を形成する。 次に、適当な分散媒にガラス粉末を分散した液体をコア金属 2の全面に塗布し、高 温で焼結して、ホーロー層 3を形成する。  First, a metal plate such as a low-carbon steel plate prepared as the core metal 2 of the enamel substrate is subjected to machining such as drilling, and mortar-shaped reflective recesses 4 are formed on both sides A and B thereof. Next, a liquid in which glass powder is dispersed in an appropriate dispersion medium is applied to the entire surface of the core metal 2 and sintered at a high temperature to form the enamel layer 3.

次に、得られたホーロー基板の両面 A, Bに、一部が反射凹部 4内に延設されるよう な電極形成パターンに従って、スクリーン印刷法などにより厚膜銅ペーストまたは銀 ペーストを印刷し、その後高温で焼き付けて電極 7を形成する。これによつて発光素 子実装用ホーロー基板 1が作製される。  Next, on both surfaces A and B of the obtained enamel substrate, a thick film copper paste or a silver paste is printed by a screen printing method or the like according to an electrode formation pattern in which a part is extended into the reflective recess 4. Thereafter, the electrode 7 is formed by baking at a high temperature. As a result, a hollow substrate 1 for mounting light emitting elements is manufactured.

[0021] 次に、前記発光素子実装用ホーロー基板 1の反射凹部 4内に延設された一方の電 極 7上に、発光素子 6を実装する。 Next, the light emitting element 6 is mounted on one electrode 7 extending in the reflective recess 4 of the light emitting element mounting enamel substrate 1.

次に、反射凹部 4内の他方の電極 7と発光素子 6とを金属細線 8でボンディングする 次に、反射凹部 4内にエポキシ榭脂ゃシリコーン榭脂のような透明榭脂を充填、硬 化させて榭脂封止する。この発光素子 6の実装から榭脂封止までの工程を基板両面 A, Bでそれぞれ行って、図 1に示す両面発光タイプの光源装置 5Aが得られる。  Next, the other electrode 7 in the reflective recess 4 and the light emitting element 6 are bonded with a thin metal wire 8. Next, the reflective recess 4 is filled with a transparent resin such as an epoxy resin or a silicone resin and cured. Let the oil seal. By performing the steps from mounting of the light emitting element 6 to sealing of the resin on both sides A and B of the substrate, a double-sided light-emitting type light source device 5A shown in FIG. 1 is obtained.

[0022] この光源装置 5Aは、電極 7に給電することで、両面 A, Bに実装した多数の発光素 子 6を点灯させ、高い光量の光を得ることができる。個々の発光素子 6から発した光の 一部は、直接外部に出射され、一部は反射凹部 4の底面及びテーパ状の側壁に反 射して外部に出射される。この両面発光タイプの光源装置 5Aは、そのまま照明用光 源として利用することもできる力 一方の面のみに光を向けたい場合には、反射板や 適当なライトガイドなどによって、いずれか一方の面側の光を他方の面側に導くことも できる。 [0022] The light source device 5A can turn on a large number of light-emitting elements 6 mounted on both surfaces A and B by supplying power to the electrode 7, and can obtain a high amount of light. A part of the light emitted from each light emitting element 6 is directly emitted to the outside, and part of the light is emitted to the outside by being reflected on the bottom surface of the reflecting recess 4 and the tapered side wall. This double-sided light source device 5A can be used as an illumination light source as it is. If you want to direct light to only one surface, use either a reflector or an appropriate light guide to It is also possible to guide the light on the other side to the other side.

[0023] この光源装置 5Aは、前記発光素子実装用ホーロー基板 1の反射凹部 4内に発光 素子 6を実装したので、照明用として多数の発光素子 6を基板に実装しても、発光素 子 6の温度上昇が低レベルに抑えられ、温度上昇による発光素子 6の性能低下や故 障発生などが起こりにくくなり、小型で発光効率が高く長寿命の光源装置 5Aを提供 することができる。 [0023] In this light source device 5A, since the light emitting element 6 is mounted in the reflective recess 4 of the light emitting element mounting enamel substrate 1, even if a large number of light emitting elements 6 are mounted on the substrate for illumination, the light emitting element 6A The temperature rise of 6 is suppressed to a low level, and the performance degradation of the light-emitting element 6 due to the temperature rise Therefore, it is possible to provide a light source device 5A that is small, has high luminous efficiency, and has a long life.

[0024] 図 2は、本発明の光源装置の第 2実施形態を示す断面図である。本実施形態の光 源装置 5Bは、前述した第 1実施形態の光源装置 5Aと同様に、前記発光素子実装 用ホーロー基板 1の反射凹部 4内に発光素子 6を実装して構成されている。しかし、 発光素子実装用ホーロー基板 1の一方の面 A側の反射凹部 4のみに発光素子 6を実 装し、他方の面 B側の反射凹部 4は放熱部としている点が第 1実施形態の光源装置 5 Aと異なっている。  FIG. 2 is a cross-sectional view showing a second embodiment of the light source device of the present invention. The light source device 5B of the present embodiment is configured by mounting the light emitting element 6 in the reflective recess 4 of the light emitting element mounting enamel substrate 1 in the same manner as the light source device 5A of the first embodiment described above. However, the light emitting element mounting enamel substrate 1 has the light emitting element 6 mounted only on the reflective recess 4 on one surface A side, and the reflective recess 4 on the other surface B side is a heat radiating portion. Different from light source device 5A.

[0025] 本実施形態の光源装置 5Bは、基板の一方の面 A側のみに発光素子 6を実装し、 他方の面 B側の反射凹部 4は放熱部としたものなので、図 3に示すように他方の面 B 側が平坦な基板 11を用いた光源装置 15と比べ、より一層放熱性を高めることができ 、温度上昇による発光素子 6の性能低下や故障発生などが起こりにくくなり、小型で 発光効率が高く長寿命の光源装置 5Bを提供することができる。  In the light source device 5B of the present embodiment, the light emitting element 6 is mounted only on one surface A side of the substrate, and the reflective recess 4 on the other surface B side is a heat radiating portion. Compared with the light source device 15 using the substrate 11 having the flat surface B on the other side, the heat dissipation can be further improved, and the light emitting element 6 is less likely to deteriorate in performance or cause a failure due to temperature rise. The light source device 5B having high efficiency and long life can be provided.

実施例  Example

[0026] [発光素子実装用ホーロー基板の作製]  [Manufacture of enamel substrate for mounting light-emitting elements]

コア金属 2として、長さ 30mm、幅 10mm、厚さ 1. 5mmの低炭素鋼板を用い、この 鋼板の両面に、円形のすり鉢状をした反射凹部が形成されるようにドリル加工を施し 、コア金属 2を作製した。反射凹部 4は、 3mm間隔で片面 9個ずつ、合計 18個形成 した。反射凹部 4の寸法は、底面が直径 lmm、深さ 0. 5mm,テーパ状側壁部の傾 斜角度は 45度とした。  The core metal 2 is a low-carbon steel plate with a length of 30 mm, a width of 10 mm, and a thickness of 1.5 mm. The core is drilled so that a circular mortar-shaped reflective recess is formed on both sides of the steel plate. Metal 2 was produced. A total of 18 reflective recesses 4 were formed, 9 on each side at intervals of 3 mm. The dimensions of the reflective recess 4 were such that the bottom surface had a diameter of 1 mm, a depth of 0.5 mm, and the inclination angle of the tapered side wall portion was 45 degrees.

次に、ガラス粉体を分散媒に混ぜ、前記コア金属 2の全面に塗布し、乾燥後 850°C で焼成してホーロー層 3を形成した。このホーロー層 3の厚みは 200 μ mであった。 次に、ホーロー層 3の両面 A, B上に、銅ペーストを電極形成パターンにスクリーン 印刷し、その後焼成して厚さ 0. 1mmの電極 7を形成し、発光素子実装用ホーロー基 板 1を作製した。  Next, glass powder was mixed with a dispersion medium, applied to the entire surface of the core metal 2, dried and fired at 850 ° C. to form a hollow layer 3. The thickness of the enamel layer 3 was 200 μm. Next, on both surfaces A and B of the enamel layer 3, a copper paste is screen-printed in an electrode formation pattern and then baked to form an electrode 7 having a thickness of 0.1 mm. Produced.

[0027] [実施例 1] [Example 1]

前記発光素子実装用ホーロー基板 1を用い、図 1に示す両面発光タイプの光源装 置 5Aを作製した。図 1に示すように、発光素子実装用ホーロー基板 1の両面 A, Bの 全ての反射凹部 4内に、出力 20mWの青色 LED素子 18個を実装し、金細線を用い てボンディングし、その後反射凹部 4にエポキシ榭脂を充填して封止した。 A double-sided light source device 5A shown in FIG. As shown in Fig. 1, both sides A, B 18 blue LED elements with an output of 20 mW were mounted in all the reflective recesses 4, bonded using gold wires, and then the reflective recesses 4 were filled with epoxy resin and sealed.

この光源装置 5Aの青色 LED素子を発光させ、放置後に基板の中心温度を測定し たところ、 50°Cであった。  When the blue LED element of the light source device 5A was caused to emit light and the center temperature of the substrate was measured after being left standing, it was 50 ° C.

[0028] [実施例 2] [Example 2]

前記発光素子実装用ホーロー基板 1を用い、図 2に示す片面発光タイプの光源装 置 5Bを作製した。図 2に示すように、発光素子実装用ホーロー基板 1の一方の面 A の反射凹部 4内に、出力 20mWの青色 LED素子 9個を実装し、金細線を用いてボン デイングし、その後反射凹部 4にエポキシ榭脂を充填して封止した。  Using the hollow substrate 1 for mounting light emitting elements, a single-sided light source device 5B shown in FIG. 2 was produced. As shown in Fig. 2, nine blue LED elements with an output of 20mW are mounted in the reflective recess 4 on one side A of the light-emitting element enamel substrate 1, and bonded using gold wires, and then the reflective recess 4 was filled with epoxy resin and sealed.

この光源装置 5Bの青色 LED素子を発光させ、放置後に基板の中心温度を測定し たところ、 36°Cであった。  The blue LED element of the light source device 5B was made to emit light, and after being left standing, the center temperature of the substrate was measured and found to be 36 ° C.

[0029] [比較例] [0029] [Comparative Example]

実施例 1と同じサイズのコア金属 12を使用し、同じサイズの反射凹部 14を片面の みに形成し、同様にホーロー層 13と電極 7を作製し、図 3に示す片面のみに反射凹 部 14を有する発光素子実装用ホーロー基板 11を作製した。  Using the core metal 12 of the same size as in Example 1 and forming the reflective recess 14 of the same size only on one side, the enamel layer 13 and the electrode 7 are produced in the same manner, and the reflective recess only on one side shown in FIG. A hollow substrate 11 for mounting light-emitting elements having 14 was produced.

この発光素子実装用ホーロー基板 11の反射凹部 14内に、実施例 1, 2と同じ青色 LED素子 9個を実装し、金細線を用いてボンディングし、エポキシ榭脂を充填して反 射凹部 14を封止し、光源装置 15を作製した。  The same nine blue LED elements as in Examples 1 and 2 are mounted in the reflective recess 14 of the light emitting element mounting enamel substrate 11, bonded using gold wires, filled with epoxy resin, and reflected recess 14. The light source device 15 was produced.

この光源装置 15の青色 LED素子を発光させ、放置後に基板の中心温度を測定し たところ、 40°Cであった。  When the blue LED element of the light source device 15 was caused to emit light and the center temperature of the substrate was measured after being left standing, it was 40 ° C.

産業上の利用可能性  Industrial applicability

[0030] 本発明は、 LEDなどの発光素子を実装する発光素子実装用ホーロー基板及び光 源装置に適用可能である。 The present invention can be applied to a light-emitting element mounting enamel substrate and a light source device on which light-emitting elements such as LEDs are mounted.

Claims

請求の範囲 The scope of the claims [1] 発光素子実装用ホーロー基板であって、  [1] A hollow substrate for mounting a light emitting device, コア金属と、  With core metal, 前記コア金属に被覆したホーロー層と、  An enamel layer coated on the core metal; 前記ホーロー基板の両面に設けられた凹部に実装された発光素子と、を有する発 光素子実装用ホーロー基板。  A light emitting element mounting enamel substrate, comprising: a light emitting element mounted in a recess provided on both sides of the enamel substrate. [2] 光源装置であって、  [2] a light source device, コア金属と、前記コア金属に被覆したホーロー層と、を有し、両面に反射凹部が設 けられた発光素子実装用ホーロー基板と、  A hollow substrate for mounting a light-emitting element, having a core metal and a hollow layer coated on the core metal, and having reflective recesses on both sides; 前記ホーロー基板の前記反射凹部に実装された発光素子と、を有する光源装置。  A light emitting device mounted on the reflective recess of the enamel substrate. [3] 前記ホーロー基板の一方の面側の前記反射凹部のみに発光素子が実装され、他 方の面側の反射凹部が放熱部とされている請求項 2に記載の光源装置。 [3] The light source device according to claim 2, wherein a light emitting element is mounted only on the reflective recess on one surface side of the enamel substrate, and the reflective recess on the other surface side is a heat radiating portion.
PCT/JP2006/310760 2006-05-30 2006-05-30 Porcelain substrate for mounting light emitting element, and light source device WO2007138677A1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010539424A (en) * 2008-08-27 2010-12-16 パナソニック株式会社 refrigerator
EP2317569A4 (en) * 2008-08-21 2013-05-29 Panasonic Corp LIGHT SOURCE FOR LIGHTING

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003229603A (en) * 2002-01-31 2003-08-15 Citizen Electronics Co Ltd Double-sided LED package
JP2005209763A (en) * 2004-01-21 2005-08-04 Nichia Chem Ind Ltd Light-emitting device and manufacturing method therefor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003229603A (en) * 2002-01-31 2003-08-15 Citizen Electronics Co Ltd Double-sided LED package
JP2005209763A (en) * 2004-01-21 2005-08-04 Nichia Chem Ind Ltd Light-emitting device and manufacturing method therefor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2317569A4 (en) * 2008-08-21 2013-05-29 Panasonic Corp LIGHT SOURCE FOR LIGHTING
JP2010539424A (en) * 2008-08-27 2010-12-16 パナソニック株式会社 refrigerator

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