WO2007123077A1 - 液滴塗布装置 - Google Patents
液滴塗布装置 Download PDFInfo
- Publication number
- WO2007123077A1 WO2007123077A1 PCT/JP2007/058259 JP2007058259W WO2007123077A1 WO 2007123077 A1 WO2007123077 A1 WO 2007123077A1 JP 2007058259 W JP2007058259 W JP 2007058259W WO 2007123077 A1 WO2007123077 A1 WO 2007123077A1
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- WIPO (PCT)
- Prior art keywords
- substrate
- droplet discharge
- droplet
- unit
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- Prior art date
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- 238000001548 drop coating Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 claims abstract description 162
- 238000003384 imaging method Methods 0.000 claims description 43
- 230000007246 mechanism Effects 0.000 description 85
- 230000007547 defect Effects 0.000 description 44
- 230000002950 deficient Effects 0.000 description 25
- 238000010586 diagram Methods 0.000 description 24
- 238000000034 method Methods 0.000 description 21
- 230000008439 repair process Effects 0.000 description 19
- 238000012545 processing Methods 0.000 description 18
- 238000001514 detection method Methods 0.000 description 16
- 238000012423 maintenance Methods 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 15
- 238000007599 discharging Methods 0.000 description 13
- 230000008531 maintenance mechanism Effects 0.000 description 12
- 239000007788 liquid Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 9
- 238000005401 electroluminescence Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 239000000428 dust Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000001444 catalytic combustion detection Methods 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000004575 stone Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000010438 granite Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000005339 levitation Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
- B41J3/28—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for printing downwardly on flat surfaces, e.g. of books, drawings, boxes, envelopes, e.g. flat-bed ink-jet printers
Definitions
- the present invention relates to a droplet coating apparatus for coating droplets on a substrate by an inkjet method or the like.
- inkjet technology is expected to be used not only as a printer device that forms an image on a paper medium but also as a manufacturing device.
- a manufacturing apparatus such as a liquid crystal display, an organic EL display, a plasma display, an electron emission element, an electrophoretic display apparatus, etc.
- an apparatus equipped with an ink jet type droplet discharge element is described. The configuration is shown.
- an apparatus base is used as a stone surface plate, a stage that conveys the substrate in the same direction, and an ink jet in a direction perpendicular to the stage traveling direction.
- a carriage mechanism for moving the head is provided directly on the stone surface plate.
- an inkjet head element having a width of 1Z2 to 2 inches in which nozzle holes are regularly arranged at intervals of 150 to 300 nozzles Z inches is usually provided for each color as an element for ejecting droplets.
- An image is formed using one inkjet head unit mounted several times.
- an image is formed on the recording paper by feeding the recording paper with a paper feed roller and scanning the recording paper a plurality of times in a direction orthogonal to the conveyance direction of the recording paper.
- the inkjet head element is the same as that for a general-purpose printer, and the size in the nozzle row direction is only about 1 to 2 inches at most.
- the manufacturing process for liquid crystal displays, organic EL displays, plasma displays, electron-emitting devices, and electrophoretic display devices can reduce tact time and cost by increasing the number of products that can be obtained using large-area substrates.
- an apparatus capable of handling a large area substrate having a length of several meters has been required.
- As a manufacturing apparatus using an ink jet method capable of processing a large area substrate at a high speed there is a line head method in which a plurality of ink jet head elements are arranged to be longer than the substrate size.
- inkjet elements having a width of 1 to 2 inches at most are arranged in a staggered manner up to the length up to the substrate size. If the substrate size is several meters, it is necessary to arrange at least 100 to 200 heads.
- An apparatus based on this method is very effective when it is necessary to discharge the entire surface of a substrate such as a color filter substrate, and the discharge locations are regular.
- this line head system is unsuitable for the color filter substrate repair method disclosed in, for example, Japanese Patent Application Laid-Open No. 2003-66218.
- Japanese Patent Laid-Open No. 2003-66218 discloses, as a part of a method for manufacturing a color filter substrate, that a color filter material is discharged only to a defective portion when there is a poorly colored portion on the color filter substrate.
- the line head method is used as a means for correcting defective portions scattered on such a color filter substrate, the same processing time as that for discharging droplets on the entire surface of the substrate is required, and most of them are not discharged. It becomes an operating nozzle, and nozzle clogging is likely to occur.
- the line head method discharges droplets one by one to a total of several thousand nozzles in spite of only discharging droplets to the desired scattered locations. It was very inefficient because it was necessary to correct the amount.
- the holding member that holds the head across the substrate needs to be elongated to 2 m to 4 m along with the large area of the color filter substrate. It was. However, it is difficult to manufacture a long holding member with high accuracy, and since a high-precision holding member cannot be obtained, the accuracy of the droplet landing position on the substrate can be improved. There is a risk of getting worse.
- an object of the present invention is to provide a liquid droplet coating apparatus that can efficiently apply liquid droplets to a predetermined portion (such as a poorly colored portion) of the substrate and improve the accuracy of the landing position of the liquid droplet on the substrate. Is to provide.
- a droplet coating apparatus of the present invention includes:
- a base having a mounting surface on which a substrate is mounted
- a beam portion attached to the base so as to face the placement surface and extend in one direction of the placement surface and to be movable relative to the base in the other direction of the placement surface.
- a plurality of droplet discharge portions that are attached to the beam portion so as to be movable in the one direction, and that discharge and apply droplets to the substrate;
- the beam portion has a plurality of planes extending in the one direction
- the droplet discharge section is attached to one of the plurality of planes.
- the droplet applying apparatus of the present invention has a beam part that can move relative to the base and a plurality of droplet discharge parts that are movably attached to the beam part.
- a predetermined part such as a poorly colored portion
- the droplets can be applied by moving the beam unit or the droplet discharge unit.
- the droplet can be applied to a predetermined portion of the substrate.
- the number of droplet discharge units can be minimized, and the number of non-operating droplet discharge units can be reduced. Therefore, clogging of the droplet discharge section due to droplets can be prevented, the amount of waste liquid accompanying the maintenance operation of the droplet discharge section can be reduced, and the discharge amount of all the droplet discharge sections can be made uniform. it can.
- the beam section has a plurality of planes extending in the one direction, and the droplet discharge section is attached to one of the plurality of planes, the mounting surface described above Vs. Therefore, the position accuracy of the one plane can be easily made high, and the accuracy of the landing position of the droplet of the droplet discharge section with respect to the substrate can be improved.
- the beam section is provided in a plurality along the other direction, and the plurality of beam sections are integrally connected and integrated with each other. It can move relative to the base in the other direction.
- the droplet applying apparatus of this embodiment since a plurality of the beam portions are provided side by side in the other direction, the number of the droplet discharge portions that can be mounted on the device can be increased, and The processing time of the substrate can be shortened.
- the beam portion and the base are integrally connected and integrally movable relative to the base in the other direction, the beam portion and the base The number of moving mechanisms that move relative to each other can be reduced. In addition, it is possible to prevent vibration (resonance) that occurs when the plurality of beam portions individually move relative to the base, and to prevent displacement of the landing position of the droplet due to the vibration. .
- the droplet applying apparatus is disposed between the adjacent beam portions, and is attached to at least one of the adjacent beam portions, and is mounted on the mounting surface.
- the imaging body for example, images the substrate to adjust the posture of the substrate on the mounting surface, and the substrate to correct the landing position on the substrate.
- the substrate is imaged in order to image or observe the landing status of the substrate.
- the imaging body attached to the beam portion is provided between the adjacent beam portions, the imaging body is placed between the adjacent beam portions.
- the apparatus can be miniaturized.
- Two beam portions are provided side by side in the other direction,
- Each of the two beam portions has two planes extending in the one direction and facing the opposite sides of the other direction.
- the droplet discharge part is a plane opposite to the other beam part in one beam part. It is attached to the opposite plane and the plane opposite to the plane facing the one beam section in the other beam section.
- the droplet discharge section includes a plane opposite to the plane facing the other beam section in the one beam section, and the other plane. Since the beam portion is attached to the plane opposite to the plane facing the one beam portion, the droplet discharge portion is connected to the two beam portions integrally connected in the other direction. It is attached to the outer plane. Therefore, operations such as attachment / detachment and maintenance of the droplet discharge section can be easily performed from outside the two beam sections.
- the droplet coating apparatus of the present invention has a beam portion that is movable relative to the base, and a plurality of droplet discharge portions that are movably attached to the beam portion,
- the droplet discharge section is attached to one of a plurality of planes formed on the beam section. Therefore, droplets can be efficiently applied to a predetermined portion (such as a poorly colored portion) of the substrate. While being able to apply
- FIG. 1A is a perspective view showing an embodiment of a droplet applying apparatus of the present invention.
- FIG. 1B is a plan view of a droplet applying apparatus.
- FIG. 2 is a CC cross-sectional view of FIG. 1A.
- FIG. 3 is an operation explanatory view of a droplet applying apparatus when a substrate is carried in or out.
- FIG. 4 is a cross-sectional view taken along the line EE in FIG. 1B.
- FIG. 5 is a partial sectional view as seen from the Y direction in FIG. 1A.
- FIG. 6 is a partial cross-sectional view of the force in the X direction in FIG. 1A.
- FIG. 7A is a bottom view of a droplet discharge unit.
- FIG. 7B is a bottom view of another droplet discharge unit.
- FIG. 8A is an operation explanatory diagram showing when the substrate processing is completed.
- FIG. 8B is an operation explanatory diagram showing when the substrate is unloaded.
- FIG. 8C is an operation explanatory diagram showing when the substrate is loaded.
- 9A is a side view of the non-ejection detection mechanism.
- 9B is a bottom view of the non-ejection detection mechanism.
- FIG. 10A is an operation explanatory view showing the alignment operation of the substrate.
- FIG. 10B is an operation explanatory diagram showing the alignment operation of the substrate.
- FIG. 12 is a flowchart showing alignment operation.
- FIG. 13A is an explanatory diagram showing the field of view of the camera unit in the low magnification mode of the image pickup unit of one side.
- 13B An explanatory diagram showing the field of view of the camera unit in the low magnification mode of the other imaging unit.
- FIG. 14A] is an explanatory view showing the field of view of the camera unit in the high magnification mode of the image pickup unit.
- 14B An explanatory diagram showing the field of view of the camera unit in the high magnification mode of the other imaging unit.
- ⁇ 15A] is an operation explanatory diagram showing measurement of a droplet landing position by an observation power mela.
- ⁇ 15B] is an operation explanatory diagram showing measurement of a droplet landing position by an observation power mela.
- FIG. 16A is an operation explanatory diagram showing a state in which the arm portion has moved most to the right in the drawing in the operation of dropping a droplet on the substrate.
- FIG. 16B is an operation explanatory diagram showing a state in which the arm portion has moved to the leftmost side of the paper in the operation of dropping a droplet on the substrate.
- FIG. 17 is an operation explanatory diagram showing an operation of discharging droplets onto a substrate by a droplet discharge unit.
- FIG. 18A is an operation explanatory diagram showing an operation of discharging from a droplet discharge portion to a defect portion.
- FIG. 18B is an action explanatory diagram showing the operation of discharging the droplet discharge portion force also to the defect portion.
- FIG. 18C is an operation explanatory diagram showing the operation of discharging from the droplet discharge portion to the defect portion.
- FIG. 18D is an operation explanatory diagram showing an operation of discharging from a droplet discharge portion to a defect portion.
- FIG. 19A is an operation explanatory diagram showing repair of a defective portion when the force in the pixel longitudinal direction of the defective portion is a direction orthogonal to the moving direction of the arm portion.
- FIG. 19B is an operation explanatory diagram showing repair of a defective portion when the force in the pixel longitudinal direction of the defective portion is a direction orthogonal to the moving direction of the arm portion.
- FIG. 19C is an operation explanatory diagram showing repair of a defect when the force in the pixel longitudinal direction of the defect is in a direction perpendicular to the moving direction of the arm.
- FIG. 20A is an operation explanatory diagram showing repair of a defect when the pixel longitudinal direction of the defect is the moving direction of the arm.
- FIG. 20B is an operation explanatory diagram showing repair of the defect when the force in the pixel longitudinal direction of the defect is the moving direction of the arm.
- FIG. 20C is an operation explanatory diagram showing repair of the defect when the pixel longitudinal direction of the defect is the moving direction of the arm.
- FIG. 21A is a plan view showing a comparative example of a beam portion.
- FIG. 21B is a cross-sectional view showing a comparative example of a beam portion.
- FIGS. 1A and 1B are configuration diagrams showing an embodiment of the droplet applying apparatus of the present invention.
- a droplet discharge device 1 of the present invention includes a base 11 having a mounting surface 11a on which a substrate 10 is mounted, and an arm attached to the base 11 so as to be movable relative to the base 11 And a plurality of droplet discharge sections 6 that are movably attached to the arm section 4 and that discharge droplets onto the substrate 10 placed on the placement surface 11a.
- the substrate 10 is, for example, a color filter substrate used for a liquid crystal display or the like.
- the substrate 10 has a defect 113 such as poor coloring.
- Two alignment marks 110 are formed in the vicinity of the end face of the substrate 10.
- the alignment mark 110 may be at least two.
- the base 11 includes a base 2 and a mounting base 3 that is mounted on the base 2 and moves when the substrate 10 is carried in and transported. That is, the upper surface of the mounting table 3 includes the above mounting surface 11a.
- the arm portion 4 is disposed so as to face the placement surface 11a, and the placement surface 11a extends over one direction of the placement surface 11a, and can reciprocate in the other direction of the placement surface 11a. It is.
- the one direction and the other direction are orthogonal to each other.
- the above-mentioned one direction means the arrow B direction, and the above other direction means the arrow A direction.
- the arm portion 4 is a so-called gantry, is formed in a gate shape, and crosses the mounting table 3 described above.
- the arm portion 4 is an arm portion moving mechanism provided on the base 2. 5 can move back and forth in the direction of arrow A.
- the base body 2 is provided with an arm part moving mechanism 5 extending in the arrow A direction on each of both sides of the mounting table 3 in the arrow B direction.
- the arm unit 4 includes a rising and moving mechanism 43 attached to each of the arm unit moving mechanisms 5, and a first beam unit 41 and a second beam unit spanned by the two above-described rising and moving mechanisms 43 and 43. 42. That is, the first beam portion 41 and the second beam portion 42 are integrally connected and can move together in the arrow A direction.
- the first beam portion 41 and the second beam portion 42 extend in the direction of the arrow B, face the mounting surface 11a, and are arranged side by side in the direction of the arrow A with a space therebetween. It has been.
- the first beam section 41 and the second beam section 42 have a plurality of planes extending in the direction of arrow B, and the droplet discharge section 6 is one plane among the plurality of planes. Is attached.
- the first beam portion 41 and the second beam portion 42 each have two planes that extend in the arrow B direction and face each other on the opposite sides of the arrow A direction. Then, the plane (mounting surface 41b) opposite to the plane facing the second beam section 42 (facing surface 41a) in the first beam section 41, and the plane in the second beam section 42 described above.
- the movement direction of the arm portion 4 (arrow A direction)
- a slide mechanism 7 for moving in a different direction (arrow B direction) is mounted, and the droplet discharge section 6 mounted on the slide mechanism 7 is within the range of the movable area on the slide mechanism 7. You can move in the direction of arrow B.
- the droplet discharge unit 6 discharges and applies droplets to a predetermined portion such as the defect 113 of the substrate 10.
- the droplet discharge unit 6 is substantially parallel and closest to the placement surface 11a.
- the substrate has a head ejection surface in which holes for ejecting liquid droplets are formed on the surface, and the substrate on the placement surface 11a described above from the head ejection surface based on a control command from the apparatus. Drip into 10.
- the imaging unit 90 images the substrate 10 in order to adjust the posture of the substrate 10 on the placement surface 11a.
- the imaging unit 90 has a low magnification mode and a high magnification mode, and detects the alignment mark 110 of the substrate 10 placed on the placement surface 11a.
- the imaging unit 90 is attached to the opposing surface 41a of the first beam unit 41 at each of both end portions in the arrow B direction of the first beam unit 41.
- the observation power mela 91 images the substrate 10 to correct the landing position on the substrate 10, or images the substrate 10 to observe the landing state of the substrate 10.
- the observation power mela 91 is attached to the facing surface 42a of the second beam portion 42.
- the base 11 is provided with a posture adjusting unit 12.
- the posture adjustment unit 12 adjusts the posture of the substrate 10 placed on the placement surface 11a based on the detection result of the imaging unit 90.
- the posture adjusting unit 12 adjusts the posture of the substrate by pressing two different points on the one end surface of the substrate 10 and one point on the other end surface orthogonal to the one end surface of the substrate 10. That is, the posture adjusting unit 12 includes a pin 12a that presses one end surface of the substrate 10 and a pin (not shown) that presses the other end surface of the substrate 10.
- a control unit 13 that controls the movement of the arm unit 4 is connected to the arm unit 4.
- the control unit 13 moves the arm unit 4 to move the imaging unit 90 to a predetermined position with respect to the placement surface 11a when the substrate 10 is placed on the placement surface 11a. Wait.
- the predetermined position is, for example, a position where the alignment mark 110 on the substrate 10 is detected.
- a maintenance mechanism 8 is provided on the base 2 adjacent to the mounting table 3 described above.
- the maintenance mechanism 8 has a mechanism for capping the ejection surface when not in use, a mechanism for detecting a defective ejection port, a mechanism for recovering the defective ejection port, and the like with respect to the droplet ejection unit 6.
- the arm part moving mechanism 5 moves the arm part 4 directly above the maintenance mechanism 8, and the maintenance mechanism 8 performs various maintenance operations on the droplet discharge part 6.
- the base body 2 includes a main stage 20 located in the center, and a first substage 21 and a second substage 22 located on both sides of the main stage 20 in the direction of arrow A. And have.
- the substrate 10 is omitted.
- the first substage 21 has the maintenance mechanism 8.
- the main stage 20, the first substage 21 and the second substage 22 are mechanically coupled.
- the main stage 20 is a highly precise stage made of granite. While the droplet discharge unit 6 is also ejecting droplets toward the substrate 10 on the table 3, the table described above. Fix 3 correctly.
- the first substage 21 is equipped with the maintenance mechanism 8 and does not need to be manufactured with higher accuracy than the main stage 20.
- the second substage 22 moves the table 3 above.
- Each of the stages 20, 21, and 22 includes a main moving mechanism 50, a first sub moving mechanism 51, and a second sub moving mechanism 52.
- the moving mechanisms 50, 51, 52 The movement mechanism 50, 51, 52 is connected with a joint so that the arm portion 4 can freely move across the gap.
- the arm portion 4 is always air-floating with the arm portion moving mechanism 5. That is, the arm unit 4 can be moved by linear motor control between the magnet type linear scale 53 provided on the arm unit moving mechanism 5 and the levitation moving mechanism 43 of the arm unit 4. The arm unit 4 is moved to an arbitrary position in the arrow A direction by the control unit 13. [0052]
- the arm part moving mechanism 5 and the magnet type linear scale 53 are continuously configured so as to freely move across the three stages 20, 21, and 22. Note that a general vibration isolation mechanism (not shown) is provided below the base 2.
- a plurality of minute holes are formed on the top surface of the mounting table 3. All of the holes are connected to a suction mechanism (not shown), and the substrate 10 is suction-fixed on the mounting table 3 by suction control by the suction mechanism, while the suction mechanism release control controls the upper surface of the mounting table 3. The force also opens the substrate 10. Further, the upper surface of the mounting table 3 also serves as a stone surface plate with good flatness, and is parallel to the discharge surface of the droplet discharge unit 6.
- the mounting table 3 described above can move in the direction of arrow A by linear motor control on a slide rail (not shown) provided on the base 2, and when the substrate 10 is loaded or unloaded, as shown in FIG. Then, it moves to the end opposite to the maintenance mechanism 8.
- the arm portion 4 is moved immediately above the maintenance mechanism 8 when the substrate 10 is carried in or out.
- FIGS. 1B and 4 four sets of the droplet discharge section 6 and the slide mechanism 7 are mounted on the mounting surface 41b of the first beam section 41.
- Two imaging units 90 are attached to the facing surface 41 a of the first beam unit 41.
- a slide mechanism 92 that is substantially equal to the width of the mounting table 3 in the B direction is attached to the facing surface 42 a of the second beam portion 42.
- the observation force mea 91 is movably attached to the slide mechanism 92, and the observation force mea 91 is movable in the direction of arrow B.
- All the slide mechanisms 7 are arranged in a staggered manner in the direction of arrow B when viewed from the top surface of the mounting table 3 described above.
- the slidable areas of the two slide mechanisms 7 and 7 are partially overlapped in the direction of arrow B. . It should be noted that it is desirable that the overlapping movable areas overlap one-third or more as the area is larger.
- the droplet discharge section 6 is mounted on the slide mechanism 7 installed on the arm section 4 and can move independently in the direction of arrow B.
- the droplet discharge section 6 includes a box body 66, discharge elements 61 housed in the box body 66, a drive control circuit 62, an electrical connection cable 63, an ink tank 64, and an ink pipe 65.
- the box body 66 moves on the slide mechanism 7.
- a nozzle plate 69 is bonded to a surface parallel to the upper surface of the mounting table 3 above the discharge element 61, and a plurality of nozzle holes 67 are formed in the nozzle plate 69.
- the diameter of this nodule 67 is 10 ⁇ m to 20 ⁇ m.
- the ejection element 61 is a general one. For example, after forming grooves as a plurality of ink chambers on a piezoelectric substrate, an electrode is formed on a part of the side wall of the partition wall. By applying an electric field between both side surfaces of this, the partition wall itself is sheared to generate discharge energy.
- the drive control circuit 62 is connected to a drive control system (not shown) by a cable (not shown) to perform discharge control.
- the distance between the droplet discharge surface, which is the lowermost surface of the nozzle plate 69, and the upper surface of the substrate 10 is set to 0.5 mm to Lmm. It has been adjusted in advance.
- the slide mechanism 7 for the droplet discharge section 6 attached to the second beam section 42 has two rows of LM guides 70, 70 ( (Manufactured by T HK Co., Ltd.) and a linear guide 71 arranged between the two rows of LM guides 70, 70.
- a part of the LM guide 70 is attached to the droplet discharge section 6, and the other part of the LM guide 70 is attached to the second beam section 42.
- the other parts of the LM guide 70 are slidable with respect to each other.
- the linear guide 71 is attached to the second beam portion 42, and drives and controls a linear drive mechanism 68 attached to the droplet discharge portion 6 so as to face the linear guide 71.
- the droplet discharge unit 6 can be moved to a predetermined position in front of or on the back of FIG. 6 (in the direction of arrow B in FIG. 1A).
- the linear guide 71 is one in which small N-pole and S-pole permanent magnets are alternately and regularly arranged.
- the above linear drive mechanism 68 can freely control N and S poles with AC control
- the position of the droplet discharge section 6 on the slide mechanism 7 can be controlled by the magnetic force of the linear guide 71 and the linear drive mechanism 68.
- the effective movement stroke of the LM guide 70 is 250 mm, and the linear guide 71 is installed in a range exceeding the effective stroke. Since the slide mechanism 7 attached to the first beam portion 41 has the same configuration, the description thereof is omitted.
- the slide mechanism 92 for the observation force mea- ter 91 attached to the second beam portion 42 has the same configuration as the slide mechanism 7, and is arranged vertically.
- Two rows of LM guides 93, 93 (manufactured by THK Co., Ltd.) and a linear guide 94 installed between the two rows of LM guides 93, 93.
- a part of the LM guide 93 is attached to the observation power mecha 91, and the other part of the LM guide 93 is attached to the second beam part 42.
- the other part of the LM guide 93 can slide freely.
- the linear guide 94 is attached to the second beam portion 42 and attached to the observation force mesa 91 so as to oppose the linear guide 71, thereby driving and controlling the linear drive mechanism 95.
- the observation power mela 91 can be moved to a predetermined position in front of or on the back of FIG. 6 (in the direction of arrow B in FIG. 1A).
- the linear guide 94 and the linear drive mechanism 95 have the same configurations as the linear guide 71 and the linear drive mechanism 68, and thus the description thereof is omitted.
- the effective movement stroke of the LM guide 93 is 25 OOmm, and the linear guide 94 is installed in a range exceeding this effective stroke.
- the observation power mela 91 includes the above-described information acquisition function in the arrow A direction provided on the arm unit moving mechanism 5 and the information acquisition function in the arrow B direction provided on the slide mechanism 92.
- the address information of the substrate 10 with respect to the alignment mark 110 can be output.
- the observation power mela 91 mainly observes the landing image that the droplet discharge section 6 has landed on the substrate 10, and the discharge state or alignment of each of the droplet discharge sections 6 is observed.
- the address of the mark reference landing position can be output.
- each droplet discharge section 6 Using the landing position coordinates obtained with the observation power mela 91, each droplet discharge section 6 Then, while correcting the ejection timing in the direction of arrow A, the droplet is landed at a desired position on the substrate 10 by correcting the amount of movement of the slide mechanism 7 in the direction of arrow B. be able to.
- the droplet discharge section 6 includes the discharge element 61 that discharges one type of liquid.
- the nozzle holes 67 on the bottom surface of the droplet discharge section 6 are arranged in a line, and the right-angle force is inclined several degrees with respect to the arrow B direction. All the nozzle holes 67 discharge the same droplet material.
- a droplet discharge section 6A having discharge elements 61A, 61B, 61C for discharging three types of liquids may be used. That is, the droplet discharge section 6A includes the discharge element 61A that discharges the first droplet material, the discharge element 61B that discharges the second droplet material, and the third droplet material. The discharge element 61C for discharging is included.
- the nozzle holes 67A, 67B, 67C of the ejection elements 61A, 61B, 61C are inclined at a right angle of several degrees with respect to the direction of the arrow B, and the respective arrows of the nozzle holes 67A, 67B, 67C.
- the projection areas in the B direction are configured to substantially coincide with each other.
- each of the nozzle holes 67A, 67B, 67C may be minutely movable in the direction of arrow B in the droplet discharge section 6.
- FIG.8A the processing of the substrate 10 is completed, and after the processing of the substrate 10, as shown in FIG.8B, the mounting table 3 is slid to the left side of the paper, and the arm portion 4 is Move directly above the maintenance mechanism 8. Then, after the adsorption of the processed substrate 10 is released, the substrate 10 is delivered to a transfer robot (not shown). Thereafter, the transfer robot places the next substrate 10 on the mounting table 3.
- the substrate 10 placed on the mounting table 3 is immediately air-adsorbed to the mounting table 3, and the mounting table 3 and the arm unit 4 are moved to FIG. 8A. Return to the original position as shown.
- the substrate 10 is unloaded from the table 3 and the next substrate 10 is loaded. While the table 3 returns to the original position, a normal maintenance operation for the droplet discharge unit 6 is performed in parallel.
- the arm unit 4 is moved onto the maintenance mechanism 8 and then maintenance work is performed.
- the lower surface of the nozzle plate 69 of the droplet discharge section 6 is capped by a rubber cap member 81 as shown in FIG. 8B. Then, negative pressure is sucked from the vent hole at the bottom of the cap member 81, and the force of the nozzle hole 67 of the nozzle plate 69 is also discharged to remove the dust and the like in the nozzle hole 67.
- the lower surface of the nozzle plate 69 is wiped with a wipe blade (not shown). Then, the discharge state from the nozzle hole 67 is checked by a non-discharge detection mechanism (not shown). Note that the order of the series of maintenance operations may be different.
- This maintenance operation includes non-discharge detection, cap, suction purge inside cap, and wiping.
- the droplet discharge unit 6 is mounted at the same time as the instruction for the unloading operation of the previous substrate 10 is given.
- the arm unit 4 is given a command to move directly above the maintenance mechanism 8.
- the maintenance mechanism 8 has a non-discharge detection mechanism that detects a discharge failure of the droplet discharge unit 6. This non-ejection detection mechanism is installed for each droplet ejection section 6.
- the non-ejection detection mechanism 85 includes a laser light emitting element 84 and a laser light receiving element 83 as shown in FIGS. 9A and 9B. Note that a droplet discharge unit 6A shown in FIG. 7B is used as the droplet discharge unit.
- the laser light emitting element 84 and a laser light emitting circuit receive a non-ejection detection command, the laser light 82 is continuously emitted toward the laser light receiving element 83.
- the received light amount measuring means connected to the laser light receiving element 83 stores a normal received light amount.
- the irradiation direction of the laser beam 82 is substantially parallel to the upper surface of the substrate 10 and substantially parallel to the ejection surface of the liquid droplet ejection section 6A (the lower surface of the nozzle plate 69).
- the diameter of the laser beam 82 is 1 mm, and the droplets ejected from all the nozzle holes 67A, 67B, 67C of one droplet ejection unit 6A are within the optical axis of the laser beam 82. Pass through.
- the laser light-emitting element 84 and the laser light-receiving element 83 have a fine movement mechanism, and in the unlikely event that a liquid droplet does not pass through the optical axis of the laser light 82, the fine light movement mechanism The positions of the element 84 and the laser receiving element 83 are adjusted.
- droplets are ejected from the first ejection element 61A for a certain period of time, the amount of light from the received light amount measuring means is read, and the amount of light shielded is measured by comparison with the normal amount of received light. Then, it is determined whether or not the force is within the range of the preset set value. If this value is within the set value range, it is regarded as normal ejection, and if this value is not within the set value range, it is regarded as ejection failure.
- the droplet ejection section 6A is moved to the cap position, and then the capping is performed until just before the loading operation of the substrate 10 is completed.
- a generally known recovery operation for example, the droplet discharge unit 6A is moved to a cap position, is capped, and the cap is pulled to a negative pressure to forcibly discharge from the nozzle hole. Then, the cap is released, wiping is performed, and non-ejection detection is performed again. Then, non-discharge detection and recovery operations are performed up to several times until there is no discharge failure. If the discharge failure does not recover, output a message to that effect.
- the last non-discharge detection result immediately before processing the substrate 10 is compared with the first non-discharge detection result performed while the previous substrate 10 is being carried out, and the discharge state is changed. Accepted If this is the case, the above processing of the substrate 10 may be discarded as inappropriate or may be sent to a repair process.
- the two imaging units 90, 90 fixed to the arm unit 4 are moved from the position of Fig. 10A to the position of Fig. 10B integrally with the arm unit 4, and the imaging unit 90 Based on the image information, the posture adjustment unit 12 shown in FIG. 1B corrects the posture of the substrate 10 in the direction of the arrow in FIG. 10B.
- the two alignment marks 110, 110 with high precision are provided in advance on the substrate 10, and the droplet application position of the substrate 10 is based on the alignment mark 110.
- the alignment mark 110 is a concentric mark, and the pitch deviation between the two alignment marks 110 and 110 is within 2 / z m.
- the two imaging units 90 and 90 are installed on the arm unit 4 at the same pitch as the two alignment marks 110 and 110.
- the reference position of the imaging unit 90 and the landing position of the droplet discharge unit 6 are corrected in advance by the correction operation by the observation power camera 91.
- the alignment mark 110 of the substrate 10 coincide with the reference position of the imaging unit 90, the landing position of the droplet and the position where the droplet should be applied can be matched.
- the imaging unit 90 includes a camera unit 98 in a high magnification mode and a camera unit 97 in a low magnification mode.
- the high magnification mode camera unit 98 and the low magnification mode camera unit 97 are attached to the arm 4 side by side in the direction of arrow A. That is, the low magnification mode camera unit 97 and the high magnification mode camera unit 98 are attached to the first beam unit 41 in order.
- the alignment reference position of the camera unit 97 in the low magnification mode and the alignment reference position of the camera unit 98 in the high magnification mode are positioned in advance so as to coincide with each other by appropriately moving the arm unit 4. It has been corrected.
- the low magnification mode camera unit 97 has a camera mechanism with a focus magnification of 0.5x.
- the 2 million pixels (1400 * 1400 pixels) CCD camera can be used to capture images on the substrate 10.
- the imaging field of view is approximately 10 mm square and the image resolution is approximately 13 m.
- the high magnification mode camera unit 98 has a camera mechanism with a focus magnification of 10 times
- the above-mentioned substrate 10 can be imaged by a 1.4 million pixel (1400 * 1000 pixel) CCD camera, the imaging field of view is approximately 0.5 mm square, and the image resolution is approximately 0.7 m.
- the camera unit 97 in the low magnification mode and the camera unit 98 in the high magnification mode are not shown! ⁇ ⁇ Connected to image processing means! Speak.
- binary mark processing is performed from the alignment mark images picked up by the camera units 97 and 98 to determine the position of the center of gravity of the mark and set it as the current alignment mark center position.
- the two alignment marks 110, 110 on the substrate 10 are imaged by the two camera units 97, 98, and the alignment position of the alignment mark is determined by determining the center position of the alignment mark. Can be determined.
- FIG. 12 is a flowchart showing the movement of the mounting table 3, the imaging unit 90, and the arm unit 4 described above for the alignment operation.
- the arm unit 4 moves to the alignment position (S31), and the low magnification mode camera unit 97 is moved to the alignment standard position where the alignment mark 110 of the substrate 10 is detected. Move (S32).
- FIGS. 13A and 13B show the field of view of the camera unit 97 in the low-magnification mode when the movement of the mounting table 3 and the arm unit 4 is completed.
- FIG. 13A shows the field of view of the low magnification mode camera unit 97 of one imaging unit 90
- FIG. 13B shows the field of view of the low magnification mode camera unit 97 of the other imaging unit 90.
- the alignment mark 110 is concentric and the outer ring is for coarse alignment.
- the outer ring has an outer diameter of 1 mm, while the inner black circle is for fine alignment. The diameter of this black circle is 0.2 mm.
- the accuracy with which the transfer robot mounts the substrate 10 on the mounting table 3 described above is ⁇ 3 mm from the ideal position, and the low magnification mode camera unit 97 with a viewing area of 10 mm square is the alignment standard position. When it comes, the alignment mark 110 is always within the field of view as shown in FIGS. 13A and 13B.
- the camera unit 97 in the low magnification mode has a field of view that exceeds the substrate mounting accuracy of the transfer robot, and can perform the alignment operation immediately after performing the alignment operation after mounting the substrate. Also, there is no separate sequence or mechanism for searching around.
- the imaging unit 90 has a field of view for detecting the alignment mark 110 on the substrate 10 before the posture is adjusted by the posture adjusting unit 12 in the low magnification mode, so that the substrate It is not necessary to detect the alignment mark 110 and place the alignment mark 110 within the field of view of the imaging unit 90 before adjusting the posture of 10, and a separate alignment detection mechanism is required.
- the time until the posture of the substrate 10 is adjusted can be omitted.
- the alignment marks 110 and 110 are imaged by the two low magnification mode camera units 97 and 97, respectively (S21), and the center of gravity position of the outer ring is determined. Then, the amount of alignment, which is a numerical value to which the substrate 10 should be moved, is calculated from the direction and amount of deviation from the reference position of the two marks (S22).
- the arm unit 4 moves to detect the high-magnification mode camera unit 98 and the alignment mark 110 on the substrate 10. The position is moved to the alignment standard position (S33).
- the coarse alignment is to move the alignment mark 110 to the alignment reference position indicated by the dotted cross! Uh.
- FIGS. 14A and 14B the alignment in the field of view of the camera unit 98 in the high magnification mode is as shown in FIGS. 14A and 14B. There is a slight misalignment of the mark 110.
- Figure 14A one of the above The field of view of the camera unit 98 in the high magnification mode of the image unit 90 is shown, and in FIG. 14B, the field of view of the camera unit 98 in the high magnification mode of the other imaging unit 90 is shown.
- the camera unit 98 in the high magnification mode images the black circle inside the alignment mark 110 (S23), and reads the center of gravity position of the black circle inside.
- the alignment amount which is a numerical value to which the substrate 10 should be moved, is calculated from the displacement direction and displacement amount of the two marks from the reference position (S24). Based on the alignment amount, the posture adjustment unit 12 performs the above-described substrate adjustment. 10 fine alignments are executed (S14).
- the fine alignment is the alignment mark 11 as shown in FIG. 14A and FIG. 14B.
- the camera unit 98 in the high-magnification mode again images the black circle inside the alignment mark 110 (S25), and confirms the accuracy of the deviation.
- the observation power mela 91 is used when acquiring information for correcting the landing position by exchanging the discharge element 61 of the droplet discharge section 6, or when reconfirming the landing position in use. Yes.
- the observation power mecha 91 takes an image of an arbitrary position on the upper surface of the apparatus and calculates the position by the arm part moving mechanism 5 and the slide mechanism 92.
- the imaging position of the observation power mela 91 is output by a scale built in the arm unit moving mechanism 5 and the slide mechanism 92.
- a dummy substrate 10A provided with a predetermined alignment mark 110A similar to the normal substrate 10 is carried into the apparatus as the substrate, Perform normal substrate attitude control.
- the observation power mela 91 is the dummy substrate 10A.
- the upper two alignment marks 110A and 110A are imaged, and the position information is obtained.
- the arm portion 4 moves to an arbitrary position on the dummy substrate 10A. Droplets are ejected from the nozzle holes of the respective droplet ejection sections 6 toward the dummy substrate 10A. At this time, all nozzle pore force droplets may be discharged.
- the observation force memer 91 sequentially images the droplet landing positions 111 while moving by the arm part moving mechanism 5 and the slide mechanism 92, and the Determine the actual landing position from the LI mark 110A.
- the arm unit 4 moves in the direction of arrow A while the droplet discharge unit 6 performs droplet discharge. It can be corrected by adjusting.
- the amount of movement of the slide mechanism 7 is offset corrected. In this operation, it is possible to detect non-ejection for each nozzle and to detect landing.
- FIG. 16A shows a state in which the arm portion 4 has moved most to the right in the drawing in the operation of dropping a droplet on the substrate 10, while FIG. 16B shows that in the operation of dropping a droplet on the substrate 10.
- the arm portion 4 is shown as having moved to the leftmost side of the paper, and the arm portion 4 reciprocates in the range of the length L in the direction of arrow A one or more times.
- the plurality of droplet discharge sections 6 mounted on the arm section 4 can move independently in the direction of arrow B, respectively.
- the arm portion 4 reciprocates on the substrate 10 in the direction of arrow A.
- Each of the droplet discharge units 6 is in a desired position before the droplet discharge operation is performed. Move to the address in the direction of arrow B and stop. Then, in the process in which the arm portion 4 reciprocates in the direction of arrow A, a droplet is ejected when the addresses of the desired positions, arrow A direction and arrow B direction, match. This operation is controlled independently for each of the plurality of droplet discharge sections 6.
- the arm unit 4 is equipped with nine droplet discharge units 6 that can move independently in the direction of arrow B, and each droplet discharge unit 6 has a handle on the substrate 10. The area is set.
- each droplet discharge portion 6 has a band-shaped receiving region in the direction of arrow B.
- the first droplet discharge section 6A is responsible for the hatched area 114 in the figure.
- the second droplet discharge unit 6B is responsible for the region 115.
- Each droplet discharge section 6 performs a droplet discharge operation on the defect portion 113 in the handling area.
- each droplet discharge part 6 individually moves in the direction of arrow B, which moves directly above the defect part 113 that it handles. , Stop at the location where the addresses in the arrow B direction match, and wait until the addresses in the arrow A direction match as the arm 4 moves. Then, at the timing when the desired position on the substrate 10 comes directly below, the droplet discharge unit 6 is driven to discharge the droplet from the discharge port to the desired position on the substrate 10.
- the droplet discharge section 6 discharges droplets to the defect portions 113 of a plurality of rectangular recesses in the process of reciprocating movement of the arm section 4.
- the defective portion 113 is a portion in which a defective portion is dented and corrected by a laser or the like in a portion where dust is mixed in a manufacturing process or a portion where a blank recess is formed.
- FIG. 18A to FIG. 18D focus on one of the plurality of droplet discharge portions 6 mounted on the arm portion 4, and from one droplet discharge portion 6 to a plurality of defective portions 113.
- FIG. 7 is an explanatory diagram of time series for performing a discharge operation.
- the defective portions 113A, 113B, 113C on the substrate are concave portions having a depth of about 2 / zm, and the opening portion indicates the moving direction of the arm portion 4 (arrow A direction). It has a rectangular shape with a long side of about 200m x 70m. Note that the arrangement direction of the nozzle holes 67 of the droplet discharge section 6 is a force parallel to the direction of the arrow A, and is actually inclined several degrees as shown in FIG. 7A.
- the droplet discharge part 6 is moved at a high speed using the slide mechanism 7, and the nozzle hole 67 is moved to the center of the defect 113A. Stop along the line.
- the movement time of the droplet discharge section 6 is not limited to the actual movement time, but after the droplet discharge section 6 stops, the residual vibration due to the movement of the droplet discharge section 6 is It is necessary to include a settling time until the level is reduced to a level that does not adversely affect the droplet ejection of the droplet ejection unit 6.
- the droplet discharge section 6 that has been moved to the center line of the defect portion 113A in advance moves in the direction of arrow D by the constant speed movement of the arm section 4, and the nozzle on the defect portion 113A. A droplet is discharged from the hole 67.
- the nozzle hole 67 to be used can use a plurality of nozzle holes 67 immediately above the defective portion 113A, the above-mentioned error is greater than when one nozzle hole 67 is used. As a result, it is possible to increase the processing speed of the entire substrate.
- the droplet discharge section 6 that has discharged a droplet onto the defect portion 113A, as shown in FIG. 18B, uses the slide mechanism 7 to restore the arrow to repair another defect portion 113C. It moves in the E direction and stops at a position where the center line of the defect 113C and the arrangement direction of the nozzle holes 67 coincide. At this time, since the arm unit 4 is also moving leftward at a constant speed, the droplet discharge unit 6 moves the arrow F with respect to the substrate 10 as shown in FIG. 18C. Move in the direction.
- the droplet discharge portion 6 discharges a droplet from the nozzle hole 67 immediately above the defect portion 113C while moving in the arrow G direction, and the defect portion Repair 113C.
- the arm section 4 starts moving in the opposite direction after completing movement in one direction.
- the droplet discharge section 6 moves in the direction of the arrow K using the slide mechanism 7 to repair another defect portion 113B, and the above-described drop line 113B is placed on the center line of the defect portion 113B.
- the nozzle holes 67 are aligned and stopped.
- the droplet discharge portion 6 moves in the direction of arrow L, and discharges droplets from the nozzle hole 67 immediately above the defect portion 113B.
- the three missing parts 113A, 113B, 113C are repaired in the order of the missing part 113A, the missing part 113C, and the missing part 113B. It takes full advantage of the structural advantages of
- the impossible region H includes the moving speed of the arm unit 4 and the movement in the direction of arrow E in addition to the band-shaped region corresponding to the distance between both ends of the nozzle hole 67 that also uses the defect end force immediately after processing. It also includes the area multiplied by the sum of the time required for movement and the time required to stabilize the residual vibration after movement.
- a droplet is dropped onto the defective portion 113 of the R pixel by the droplet discharge unit 6A, and further, as shown in FIG. 19C, by the droplet discharge unit 6A. Then, a droplet is dropped on the defective portion 113 of the G pixel.
- a droplet is dropped onto the defective portion 113 of the R pixel by the droplet discharge unit 6A, and further, as shown in FIG. 20C, the droplet discharge unit 6A Then, a droplet is dropped on the defective portion 113 of the G pixel.
- the arm unit 4 that is movable relative to the base 11 and a plurality of droplet discharge units that are movably attached to the arm unit 4 6, when applying droplets to the predetermined portion (such as a poorly colored portion) of the substrate 10 by the droplet discharge portion 6, the arm portion 4 or the droplet discharge portion 6
- the droplets can be applied by moving the droplets, and the droplets can be applied to the predetermined portion of the substrate 10 with efficiency.
- the number of the droplet discharge units 6 can be minimized, and the number of the non-operating droplet discharge units 6 can be reduced.
- the amount of waste liquid accompanying the maintenance operation of the droplet discharge section 6 can be reduced, and the discharge of all the droplet discharge sections 6 can be further reduced.
- the amount can be made uniform.
- the beam portions 41, 42 have a plurality of planes extending in the direction of the arrow B, and the droplet discharge section 6 is attached to one of the plurality of planes,
- the position accuracy of the one plane with respect to the placement surface 11a can be easily made high, and the accuracy of the landing position of the droplet of the droplet discharge section 6 with respect to the substrate 10 can be improved.
- the beam portions 41 and 42 are 2 m or more in the direction of arrow B, and it is difficult to obtain surface accuracy of two surfaces among the four surfaces of the beam portions 41 and 42. In addition, it is very difficult to ensure the parallelism of the two opposing surfaces of the beam portions 41 and 42.
- the facing surface 42a when the mounting surface 42b is set perpendicular to the mounting table 3, the facing surface 42a does not become vertical, and in the worst case, the facing surface 42a Will have different inclination angles in the direction of arrow B.
- the angle of inclination varies in the direction of arrow B means that the facing surface 42a shown in FIG. 21B is a solid line on the front side of the page, while the dotted line in FIG. 21B is on the back side of the page. It is to become.
- the droplet discharge section 6 used as a manufacturing apparatus is heavier than the observation power mea 91 because it reaches at least several kg. Therefore, even if the inclination angle can be corrected by the adjustment member, the mounting rigidity of the slide mechanism 7 is reduced, and the movement locus becomes unstable when the droplet discharge unit 6 that is a heavy object is slid. As a result, the landing accuracy may be deteriorated.
- the droplet applying device of the present invention only one surface of the beam portions 41, 42 in the longitudinal direction (the mounting surfaces 41b, 42b) is provided for one beam portion 41, 42.
- the slide mechanism 7 and the droplet discharge unit 6 are attached. Therefore, the mounting surfaces 41b and 42b can be made substantially perpendicular to the surface of the substrate 10 and can be made substantially parallel to the arrow B direction.
- the two beam portions 41 and 42 are provided side by side in the direction of the arrow A. Therefore, the number of the droplet discharge portions 6 that can be mounted on the device is reduced. Increased calorie can reduce the processing time of the substrate 10.
- the two beam portions 41, 42 are integrally connected to each other, and can be moved relative to the base 10 in the direction of arrow A.
- the number of moving mechanisms that move relative to 41 and 42 and the base 10 can be reduced.
- vibration (resonance) that occurs when the two beam portions 41 and 42 individually move relative to the base 10 is prevented, and the landing position of the droplet due to the vibration is prevented. Can be prevented from shifting.
- the imaging unit 90 and the observation power mea 91 91 attached to the beam units 41 and 42 are provided between the adjacent beam units 41 and 42, the imaging unit 90 and the observation camera are included. 91 can be arranged in a dead space between the adjacent beam portions 41 and 42, and it is not necessary to separately provide a beam portion for attaching the imaging unit 90 and the observation power mea 91, so that the size of the apparatus can be reduced.
- the imaging unit 90 and the observation force mea 91 91 are forces attached to the facing surfaces 4la and 42a that are difficult to obtain surface accuracy.
- the imaging unit 90 does not move relative to the beam unit 41. Since the position of the imaging unit 90 is easy to adjust, the observation camera 91 can measure and correct the shift of its own movement trajectory in advance.
- an adjusting member (not shown) may be attached between the facing surface 42a and the slide mechanism 92 of the observation force mea- ter 91 to ensure parallelism with the mounting surface 42b. This place however, since the observation power mea 91 is lighter than the droplet discharge unit 6 (generally 2 kg or less), the observation power mea 91 is placed on the slide mechanism 92. There is no risk of observing errors even when moved.
- the imaging unit 90 and the observation power mela 91 are easier to adjust than the droplet discharge unit 6, even if they are attached to the facing surfaces 41a and 42a, which are difficult to obtain accuracy, No problem.
- the droplet discharge section 6 is attached to the mounting surface 41b of the first beam section 41 and the mounting surface 42b of the second beam section 42.
- the droplet discharge unit 6 is attached to a plane outside the arrow A direction in the two beam units 41 and 42 that are integrally connected. Therefore, operations such as attachment and detachment and maintenance of the droplet discharge unit 6 can be easily performed from the outside of the two beam portions 41 and 42.
- the droplet discharge section 6 is attached to the side surfaces of the beam sections 41, 42, when a slide mechanism such as the LM guide 70 is used for the beam sections 41, 42, this slurry is removed.
- the id mechanism is always pushed down by its own weight due to the weight of the droplet discharge section 6, and the droplet discharge section 6 can slide while reducing backlash and vibration, and the landing position is stabilized.
- the present invention is not limited to the above-described embodiment.
- the droplet discharge section 6 may be attached to one of the plurality of planes using a beam section having a plurality of planes extending in the direction of arrow B.
- the droplet discharge section 6 may be attached to the upper surfaces of the beam portions 41 and 42 via an L-shaped attachment member or the like, due to the weight of the droplet discharge section 6 that is The backlash of the droplet discharge unit 6 is reduced, the droplet landing position accuracy is improved, and the droplet discharge unit 6 can be easily attached to and detached from the beam portions 41 and 42.
- the quantity of the beam portions 41, 42 can be freely increased or decreased. Further, when a plurality of the beam portions are provided, the plurality of beam portions are arranged side by side in the arrow A direction.
- the imaging body may be an imaging body other than the imaging unit 90 or the observation power mela 91.
- the imaging unit 90 is used to switch between a high magnification mode and a low magnification mode by zooming. There may be two camera units.
- the imaging unit 90 may be configured to simultaneously observe a high magnification and a low magnification by optical path division. More specifically, the light from the substrate 10 may be divided and guided to each of two CCDs having different numbers of pixels.
- the moving direction of the droplet discharge section 6 and the moving direction of the arm section 4 do not have to be orthogonal to each other when viewed from the plane.
- the arm 4 may be stationary while the table 3 is movable.
- the droplet discharge section 6 may discharge and apply droplets to the entire surface of the substrate 10. Further, the number of the droplet discharge units 6 can be freely increased or decreased.
- the droplet applying apparatus of the present invention is applied to an apparatus for repairing a defective portion of a color filter substrate, it is applied to another apparatus that discharges to desired locations scattered on the substrate. It's good.
- a device that draws a wiring pattern by discharging conductive ink on a substrate a device that manufactures an organic EL display by discharging a material that forms organic EL (Electro Luminescence) on the substrate, an organic EL
- the present invention can be applied to a device that repairs a defective portion of a display portion, a device that prints an image on a large signboard, a device that repairs an image, and a manufacturing device that applies other inkjet technology.
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Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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US12/226,496 US8066367B2 (en) | 2006-04-19 | 2007-04-16 | Drop coating apparatus |
CN2007800207791A CN101460257B (zh) | 2006-04-19 | 2007-04-16 | 液滴涂布装置 |
EP07741695A EP2014374B1 (en) | 2006-04-19 | 2007-04-16 | Drop coating apparatus |
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JP2006115488A JP4086879B2 (ja) | 2006-04-19 | 2006-04-19 | 液滴塗布装置 |
JP2006-115488 | 2006-04-19 |
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US (1) | US8066367B2 (ja) |
EP (1) | EP2014374B1 (ja) |
JP (1) | JP4086879B2 (ja) |
KR (1) | KR20080113108A (ja) |
CN (1) | CN101460257B (ja) |
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JP4086878B2 (ja) * | 2006-04-19 | 2008-05-14 | シャープ株式会社 | 液滴塗布装置 |
JP4057037B2 (ja) | 2006-04-21 | 2008-03-05 | シャープ株式会社 | 欠陥修復装置、欠陥修復方法、プログラム及びコンピュータ読み取り可能な記録媒体 |
KR101203982B1 (ko) * | 2007-08-28 | 2012-11-23 | 울박, 인크 | 스테이지 장치 조립 방법 |
US8191979B2 (en) * | 2009-04-01 | 2012-06-05 | Fujifilm Dimatix, Inc. | Depositing drops on a substrate carried by a stage |
JP5621276B2 (ja) * | 2010-03-01 | 2014-11-12 | セイコーエプソン株式会社 | 液滴吐出装置 |
JP5140103B2 (ja) * | 2010-03-17 | 2013-02-06 | 株式会社日立ハイテクノロジーズ | リニアモータ対、移動ステージ、及び電子顕微鏡 |
US9414288B2 (en) | 2012-08-21 | 2016-08-09 | Kyocera Corporation | Handover management based on speeds of wireless communication devices |
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DE102017002271A1 (de) | 2017-03-09 | 2018-09-13 | Ima Klessmann Gmbh Holzbearbeitungssysteme | Verfahren zum Aufteilen eines plattenförmigen Werkstücks |
CN107941804A (zh) * | 2017-11-21 | 2018-04-20 | 清华大学 | 一种基于微小液滴的晶体生长原位观测装置及其观测方法 |
DE102019207185A1 (de) * | 2019-05-16 | 2020-11-19 | Siemens Aktiengesellschaft | Druckeinrichtung und Verfahren zum Bedrucken eines Gegenstands |
DE102019207158A1 (de) | 2019-05-16 | 2020-11-19 | Robert Bosch Gmbh | Verfahren und Vorrichtung zur Steuerung des Bremsverhaltens eines Elektrofahrzeugs |
JP7120681B2 (ja) * | 2020-06-18 | 2022-08-17 | Aiメカテック株式会社 | 薄膜形成装置および薄膜形成方法 |
KR20220019143A (ko) * | 2020-08-06 | 2022-02-16 | 삼성디스플레이 주식회사 | 잉크젯 프린팅 장치 및 이를 이용한 프린팅 방법 |
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KR100463520B1 (ko) * | 2002-04-08 | 2004-12-29 | 엘지전자 주식회사 | 디스플레이 패널 제작을 위한 잉크젯 도포 장치 |
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- 2007-04-16 KR KR1020087028088A patent/KR20080113108A/ko not_active Ceased
- 2007-04-16 US US12/226,496 patent/US8066367B2/en not_active Expired - Fee Related
- 2007-04-16 WO PCT/JP2007/058259 patent/WO2007123077A1/ja active Application Filing
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Also Published As
Publication number | Publication date |
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US8066367B2 (en) | 2011-11-29 |
JP2007283247A (ja) | 2007-11-01 |
CN101460257A (zh) | 2009-06-17 |
US20100165065A1 (en) | 2010-07-01 |
EP2014374A1 (en) | 2009-01-14 |
KR20080113108A (ko) | 2008-12-26 |
JP4086879B2 (ja) | 2008-05-14 |
CN101460257B (zh) | 2012-04-18 |
EP2014374B1 (en) | 2011-05-25 |
EP2014374A4 (en) | 2010-02-03 |
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