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WO2007074798A1 - Method of conveying substrate to substrate processing device - Google Patents

Method of conveying substrate to substrate processing device Download PDF

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Publication number
WO2007074798A1
WO2007074798A1 PCT/JP2006/325833 JP2006325833W WO2007074798A1 WO 2007074798 A1 WO2007074798 A1 WO 2007074798A1 JP 2006325833 W JP2006325833 W JP 2006325833W WO 2007074798 A1 WO2007074798 A1 WO 2007074798A1
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WO
WIPO (PCT)
Prior art keywords
substrate
transfer
processing
transport
unit
Prior art date
Application number
PCT/JP2006/325833
Other languages
French (fr)
Japanese (ja)
Inventor
Hideo Taniguchi
Shigeyuki Yamada
Taimi Oketani
Original Assignee
Sharp Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kabushiki Kaisha filed Critical Sharp Kabushiki Kaisha
Publication of WO2007074798A1 publication Critical patent/WO2007074798A1/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks

Definitions

  • the present invention relates to a substrate transfer method to a substrate processing apparatus that performs processing while transferring a substrate to a processing unit fixed to the apparatus.
  • a pattern following type exposure apparatus 3 as shown in FIG. 6 has been proposed as a substrate processing apparatus that performs processing while transporting a substrate to a processing unit fixed to the apparatus.
  • this pattern following type exposure apparatus 3 a plurality of exposure units 3c each having a camera 3d are arranged, and the camera 3d recognizes an image of a pattern such as a wiring formed in advance on the substrate, and the pattern and the mask of the exposure unit 3c are used. Exposure is performed while correcting misalignment during substrate transport.
  • each exposure unit 3c is configured to perform force exposure without following each existing pattern on the substrate, so conventionally, it was performed in a stationary state using alignment marks attached to the substrate before the exposure process, This eliminates the need for precise alignment adjustments.
  • FIG. 6 As a method of transporting a substrate to such a pattern following type exposure apparatus 3, a procedure as shown in FIG. 6 has been conventionally employed. As shown in FIG. 6 (a), on the substrate loading side of the exposure apparatus 3, a transfer conveyance table 2 on which a substrate to be conveyed to the substrate loading unit 3a of the apparatus is placed, and the transfer conveyance table 2 is conveyed. A stock transfer table 1 on which a substrate to be mounted is placed, and a loading robot (not shown) for mounting the substrate on the stock transfer table 1 are provided.
  • a discharge robot (not shown) is provided for storage and transportation to the next process step.
  • the problem to be solved by the present invention is that the substrate transport capable of continuously transporting the substrate to the substrate processing apparatus that performs processing while transporting the substrate to the processing unit fixed to the apparatus. Is to provide a method.
  • a substrate transport method to a substrate processing apparatus includes a post-process substrate from a substrate discharge unit of a substrate processing apparatus that performs processing while transporting a substrate to a processing unit.
  • the gist of the present invention is to start the introduction of the pre-treatment substrate into the substrate loading portion of the substrate processing apparatus before the substrate is discharged.
  • the post-process substrate is transported and mounted from the transfer transport table on which the unprocessed substrate transported to the substrate loading unit of the substrate processing apparatus is placed, and the substrate discharge unit of the substrate processing apparatus. It is preferable to have a configuration in which the transfer of the unprocessed substrate from the transfer transfer table is started before the processed substrate is transferred to and placed on the receiving transfer table.
  • the substrate may be transferred from the stock transfer table before being processed.
  • the delivery / conveying platform may be provided with a positioning portion, and the positioning of the substrate may be adjusted by the positioning portion.
  • the unprocessed substrate is transferred to the substrate loading unit, the transfer transfer table, and the stock transfer table by floating the unprocessed substrate.
  • the transfer performed by levitating the unprocessed substrate is performed on both end portions of the unprocessed substrate. It is preferable to adopt a configuration in which the substrate holding portion to be held is moved. In addition, it is preferable that the transport performed by floating the pre-treatment substrate is performed by moving a substrate holding unit that holds one end of the pre-treatment substrate.
  • the substrate holding portion may be held by the substrate holding portion by suction.
  • the substrate transfer method to the substrate processing apparatus having the above-described configuration before the processed substrate is discharged from the substrate discharge portion of the substrate processing apparatus that performs processing while transferring the substrate to the processing unit. Since the configuration is such that the introduction of the substrate before processing into the substrate loading unit of the substrate processing apparatus is started, the substrate is continuously loaded into the substrate processing apparatus. Thereby, the processing tact time by the substrate processing apparatus can be shortened.
  • the post-process substrate is transported and mounted from the transfer transport table on which the pre-process substrate transported to the substrate loading unit of the substrate processing apparatus is mounted, and the substrate discharge unit of the substrate processing apparatus.
  • a transfer carrier and before the processed substrate is transferred to and placed on the receiving carrier, the transfer of the pre-process substrate from the transfer carrier is started. Since the unprocessed substrates are transferred one after another to the substrate loading portion of the apparatus, the processing tact time in the substrate processing apparatus can be shortened.
  • the positioning / conveying platform is provided with a positioning portion and the positioning of the substrate is adjusted by the positioning portion, the substrate is usually moved in the substrate loading portion of the substrate processing apparatus.
  • Position adjustment can be performed prior to position adjustment, enabling highly accurate positioning (alignment adjustment).
  • the substrate loading unit, the transfer transport table and the stock transport table to the stock transport table If the unprocessed substrate is transported by floating the unprocessed substrate, the substrate can be transported smoothly.
  • the transport performed by levitating the unprocessed substrate is performed by moving the substrate holding unit that holds both end portions in the width direction of the unprocessed substrate, Holding is stable. Further, if the transport that is performed by levitating the unprocessed substrate is made by moving the substrate holding section that holds one end portion in the width direction of the unprocessed substrate, for example, the first substrate is on the left side thereof. It is possible to carry while carrying the edge, and the next second substrate can be carried while holding the right edge, simplifying the mechanism for moving in the direction opposite to the carrying direction. become.
  • the substrate holding section is configured to hold the unprocessed substrate end by adsorption, damage to the substrate during holding can be reduced.
  • FIG. 1 is a diagram schematically showing a schematic configuration when a transport method according to the present invention is applied to a pattern following type exposure apparatus.
  • FIG. 2 is a diagram showing a schematic configuration of the substrate transfer mechanism of FIG. 1 and its transfer procedure.
  • FIG. 3 is a diagram showing a schematic configuration of a substrate holding unit included in the substrate transport mechanism of FIG.
  • FIG. 4 is a diagram showing a first modification of the transport procedure by the substrate transport mechanism of FIG. 2.
  • FIG. 4 is a diagram showing a first modification of the transport procedure by the substrate transport mechanism of FIG. 2.
  • FIG. 5 is a diagram showing a second modification of the transport procedure by the substrate transport mechanism in FIG. 2.
  • FIG. 6 is a diagram showing a procedure of a substrate transfer method to a substrate processing apparatus conventionally used.
  • FIG. 1 is a view schematically showing a schematic configuration when the substrate transport method according to the present invention is applied as a substrate processing apparatus to, for example, a pattern following type exposure apparatus 3 as shown. Note that the same components as those described in the prior art in FIG. 6 are denoted by the same reference numerals, description thereof is omitted, and different points will be mainly described.
  • the substrate transport method shown in FIGS. 1 (a) to 1 (c) is performed by discharging the substrate of the pattern following type exposure apparatus 3 that performs exposure while transporting the substrate to the exposure unit 3c fixed to the apparatus. Part 3b Thus, before the substrate B is discharged, the substrate D is started to be input into the substrate input portion 3a of the pattern following type exposure apparatus 3.
  • the substrate C before the exposure processing is placed on the substrate loading unit 3a of the exposure apparatus 3.
  • a substrate D to be exposed next to the substrate C is placed on the transfer carrier 2.
  • a substrate E to be exposed next to the substrate D is placed on the stock transfer table 1.
  • the substrate B after the exposure processing is placed on the substrate discharge unit 3b. Further, the substrate A subjected to the exposure process before the substrate B is placed on the receiving carrier 4.
  • the substrate B is received from the substrate discharge unit 3b and transferred to the transfer table 4.
  • the substrate A placed on the receiving / transporting table 4 is transported by a discharge robot (not shown).
  • the substrate D placed on the transfer carrier 2 is transferred to the substrate loading unit 3a, and the substrate E placed on the stock carrier 1 is transferred to the transfer carrier 2.
  • the next substrate F is transferred to the stock transfer table 1 by a loading robot (not shown).
  • the loading of the substrate D into the substrate loading portion 3a is started.
  • the distance between the substrates in the substrate conveyance can be narrowed, and the processing tact can be shortened by the almost continuous conveyance.
  • the substrate loading unit 3a, the transfer carrier 2 and the stock carrier 1 shown in the figure are equipped with a mechanism for placing the substrate in a floating state. Specifically, as shown in FIG. 3, air is placed on the upper surface (substrate mounting surface) of the surface plate 10 constituting the substrate mounting portion of the substrate loading unit 3a, the delivery transfer table 2, and the stock transfer table 1. A plurality of holes 10a through which air is blown are formed, and has a mechanism for floating the substrate. In addition, the dimensions of the substrate loading part 3a, the transfer carrier 2 and the stock carrier 1 in the width direction (the direction perpendicular to the conveyance direction) are shorter than the width of the substrate. The substrate loading part 3a, the transfer carrier 2, the stock A predetermined length is projected from the carrier 1.
  • substrate holding portions 11, 11 and substrate holding portions 12, 12 for sucking and holding the both end portions in the width direction of the substrate by suction are connected by connecting plates 11a, 12a, respectively.
  • the substrate holder 12 is provided so as to reciprocate from the transfer carrier 2 to the substrate loading part 3a
  • the substrate holder 11 is provided so as to reciprocate from the stock carrier 1 to the transfer carrier 2. It has been.
  • the substrate holding portions 11 and 12 are formed with a plurality of suction holes l ib and 12b on the upper surface, and suck and hold the lower surface of the substrate end protruding from the surface plate 10. Is possible.
  • the substrate holders 11 and 12 are lifted and lowered by the lifting devices 11c and 12c, respectively, and can be lowered when the substrate suction is not performed.
  • positioning units 13 and 14 are provided at a position in front of the exposure unit 3c, that is, a front position in the transport direction of the substrate loading unit 3a and a front position in the transport direction of the transfer transport base 2, respectively.
  • the substrate is positioned by an external reference stopper (not shown).
  • FIGS. 2 (a) to 2 (d) a procedure for transporting the substrate will be described with reference to FIGS. 2 (a) to 2 (d).
  • the substrate C before the exposure processing is placed on the substrate loading unit 3a of the exposure apparatus 3.
  • a substrate D to be exposed next to the substrate C is placed on the transfer carrier 2.
  • a substrate E to be exposed next to the substrate D is placed on the stock transfer table 1.
  • the substrate B after the exposure processing is placed on the substrate discharge unit 3b. Further, the substrate A subjected to the exposure process before the substrate B is placed on the receiving carrier 4.
  • the substrate B is received from the substrate discharge unit 3b and transferred to the transfer table 4. Then, the substrate A placed on the receiving / transporting table 4 is transported by a discharge robot (not shown).
  • the substrate D placed on the delivery carrier 2 is brought into a floating state and is transported by the substrate holder 12 to the substrate loading unit 3a.
  • the substrate E placed on the stock transfer table 1 is also floated and received by the substrate holding unit 11 and transferred to the transfer table 2.
  • the next substrate F is transferred to the stock transfer table 1 by a loading robot (not shown).
  • FIG. 2 (c) when the substrates D and E are placed on the substrate loading unit 3a and the transfer carrier 2, respectively, positioning is performed by the positioning units 14 and 13, respectively.
  • the substrate holders 12 and 11 stop the substrate suction operation and move to positions where the next substrates E and F are transferred, respectively. Start suction operation. Thereafter, the substrate is transferred to the exposure apparatus 3 in the same procedure.
  • the transfer transfer table 2 and the stock transfer table 1 is performed by floating the substrate, smooth substrate transfer can be performed. Further, since the substrate end portions are held by the substrate holding portions 11 and 12 by adsorption, damage to the substrate during holding is reduced.
  • the position adjustment of the substrate is usually performed in the positioning unit 14 of the substrate loading unit 3a of the exposure apparatus 3. Since the position of the substrate can be adjusted, the substrate can be positioned (alignment adjustment) with high accuracy by the two positioning portions 13 and 14.
  • FIG. 4 shows a modified example of the movement of the substrate holders 12 and 11 in FIG. 2 described above, and only the differences will be described.
  • the substrate holding unit 12 stops the substrate suction operation, moves to the position where the next substrate F is transported, and performs the suction operation.
  • the substrate holding unit 11 does not move while continuing the suction operation.
  • FIG. 4 (e) when the exposure processing of the substrate D placed on the substrate loading unit 3a is started, the substrate E placed on the transfer carrier 2 is held on the substrate.
  • the substrate F transferred to the substrate loading unit 3a by the unit 11 and placed on the stock transfer table 1 is received by the substrate holding unit 12 and transferred to the transfer table 2.
  • the substrate E is carried by the substrate holding unit 11 as part of the conveyance from the stock conveyance table 1 to the substrate loading unit 3a. It will be.
  • the movement of the substrate holders 11 and 12 in the direction opposite to the conveyance direction only needs to move one of the substrate holders, the number of suction operations by the substrate holder can be reduced and the conveyance can be performed. The displacement of the substrate at the time is suppressed.
  • FIG. 5 shows a configuration in which the substrate holding portions 12 and 11 of FIG. 2 described above are provided only at one end portion of the substrate.
  • the procedure for transporting the substrate is described. And explain.
  • the substrate C before exposure processing is placed on the substrate loading unit 3a of the exposure apparatus 3.
  • a substrate D to be exposed next to the substrate C is placed on the transfer carrier 2.
  • a substrate E to be exposed next to the substrate D is placed on the stock transfer table 1.
  • the substrate B after the exposure processing is placed on the substrate discharge unit 3b. Further, the substrate A subjected to the exposure process before the substrate B is placed on the receiving carrier 4.
  • the substrate B is received from the substrate discharge unit 3b and transferred to the transfer table 4. Then, the substrate A placed on the receiving / transporting table 4 is transported by a discharge robot (not shown).
  • the substrate D placed on the transfer carrier 2 is brought into a floating state and is transferred to the substrate loading unit 3a by the substrate holding unit 12 provided only on the lower side.
  • the substrate E placed on the stock transfer table 1 is also floated, and is received and transferred to the transfer table 2 by the substrate holder 11 provided only on the upper side.
  • the next substrate F is transferred to the stock transfer table 1 by a transfer port bot (not shown).
  • the substrate holding unit 12 stops the substrate suction operation, moves to a position where the next substrate F is transported, and starts the suction operation.
  • the substrate holder 11 should not move while the suction operation is stopped or continued.
  • the substrate placed on the delivery carrier 2 E is transferred to the substrate loading unit 3a by the substrate holding unit 11, and the substrate F placed on the stock transfer table 1 is received by the substrate holding unit 12 and transferred to the transfer table 2.
  • the substrate E is transported by the substrate holder 11 from the stock transport table 1 to the substrate loading unit 3a as a part. It will be.
  • the substrate holding part is provided only on one end of the substrate, and the positions where the board holding parts are provided on the front and rear substrates are reversed so that the substrate holding parts 11 and 12 are transported in the opposite direction.
  • This movement can be achieved by moving either one of the substrate holders, and the mechanism for movement can be simplified. Easy. As a result, the number of suction operations by the substrate holder is reduced, and displacement of the substrate during transport is suppressed.
  • the present invention is of course not limited to such embodiment and can be implemented in various modes without departing from the gist of the present invention.
  • the description has been given using the pattern following type exposure apparatus as an example of the substrate processing apparatus to which the substrate transport method of the present invention is applied, but the substrate follows the existing pattern on the substrate.
  • the substrate transfer method according to the present invention is applicable to any pattern following type substrate processing apparatus that performs processing.
  • a coloring layer forming apparatus for a color filter used in a liquid crystal panel and a pattern following type drawing apparatus for discharging colored ink to a black matrix opening while following a black matrix pattern by an ink jet method. It can be applied and is not limited to the pattern following type exposure apparatus described above.

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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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Abstract

A substrate conveyance method capable of continuously conveying substrates to a substrate processing device, the method being capable of processing the substrates while conveying them to a processing unit fixed to the substrate processing device. The substrate conveyance method has a reception/delivery/conveyance table (2) for placing a not-yet-processed substrate (D) that is to be conveyed to a substrate loading section (3a) of the substrate processing device (3) and also has a reception/conveyance table (4) on which a processed substrate (B) conveyed from a substrate discharge section (3b) of the substrate processing device (3) is placed. Conveyance of the not-yet-processed substrate (D) from the reception/delivery/conveyance table (2) is started before the processed substrate (B) is conveyed and placed on the reception/conveyance table (4).

Description

明 細 書  Specification
基板処理装置への基板搬送方法  Substrate transport method to substrate processing apparatus
技術分野  Technical field
[0001] 本発明は、装置に固定された処理ユニットに対して基板を搬送しながら処理を行う 基板処理装置への基板搬送方法に関する。  The present invention relates to a substrate transfer method to a substrate processing apparatus that performs processing while transferring a substrate to a processing unit fixed to the apparatus.
背景技術  Background art
[0002] 近年、装置に固定された処理ユニットに対して基板を搬送しながら処理を行う基板 処理装置として、例えば図 6に示すようなパターン追従型露光装置 3が提案されてい る。このパターン追従型露光装置 3は、カメラ 3dを備えた露光ユニット 3cを複数配置 し、基板上に予め形成された配線などのパターンをカメラ 3dが画像認識し、パターン と露光ユニット 3cのマスクとの位置ズレを基板搬送中に補正しつつ露光を行うもので ある。このように各露光ユニット 3cを、基板上の既存パターンにそれぞれ追従させな 力 露光を行うという構成なので、従来、露光処理前に、基板に付されたァライメント マークを用いて静止状態で行って 、た精密なァライメント調整が不要となって 、る。  In recent years, for example, a pattern following type exposure apparatus 3 as shown in FIG. 6 has been proposed as a substrate processing apparatus that performs processing while transporting a substrate to a processing unit fixed to the apparatus. In this pattern following type exposure apparatus 3, a plurality of exposure units 3c each having a camera 3d are arranged, and the camera 3d recognizes an image of a pattern such as a wiring formed in advance on the substrate, and the pattern and the mask of the exposure unit 3c are used. Exposure is performed while correcting misalignment during substrate transport. In this way, each exposure unit 3c is configured to perform force exposure without following each existing pattern on the substrate, so conventionally, it was performed in a stationary state using alignment marks attached to the substrate before the exposure process, This eliminates the need for precise alignment adjustments.
[0003] このようなパターン追従型露光装置 3への基板搬送方法としては、従来、図 6に示 すような手順が採られていた。図 6 (a)に示されるように露光装置 3の基板投入側には 、装置の基板投入部 3aへ搬送される基板が載置される受け渡し搬送台 2、この受け 渡し搬送台 2へ搬送される基板が載置されるストック搬送台 1、そして、ストック搬送台 1へ基板を載置する図示しな 、搬入ロボットが備えられて 、る。  [0003] As a method of transporting a substrate to such a pattern following type exposure apparatus 3, a procedure as shown in FIG. 6 has been conventionally employed. As shown in FIG. 6 (a), on the substrate loading side of the exposure apparatus 3, a transfer conveyance table 2 on which a substrate to be conveyed to the substrate loading unit 3a of the apparatus is placed, and the transfer conveyance table 2 is conveyed. A stock transfer table 1 on which a substrate to be mounted is placed, and a loading robot (not shown) for mounting the substrate on the stock transfer table 1 are provided.
[0004] また、露光装置 3の基板排出側には、装置の基板排出部 3bから搬送される基板が 載置される受け取り搬送台 4、この受け取り搬送台 4に載置された基板をカセット等に 収納したり、次のプロセス工程へ搬送する図示しない排出ロボットが備えられている。  [0004] Further, on the substrate discharge side of the exposure apparatus 3, a receiving transfer table 4 on which a substrate transferred from the substrate discharge unit 3b of the apparatus is mounted, and a substrate mounted on the receiving transfer table 4 is a cassette or the like A discharge robot (not shown) is provided for storage and transportation to the next process step.
[0005] 従来の搬送方法では、図 6 (a)〜図 6 (c)に示すように、搬送方向下流側の搬送台 等に基板が存在しないことを確認してカゝら搬送を行っていた。つまり、ストック搬送台 1、受け渡し搬送台 2、基板排出部 3bからの基板の搬送は、それぞれの搬送先であ る受け渡し搬送台 2、基板投入部 3a、受け取り搬送台 4に基板が存在しないことを確 認して力も搬送を行うという間欠搬送方法となっている。尚、本発明に関連する先行 技術文献としては、特開 2002— 176091号公報と特開 2005— 119818号公報が 挙げられる。 In the conventional transfer method, as shown in FIGS. 6 (a) to 6 (c), it is confirmed that there is no substrate on the transfer table or the like on the downstream side in the transfer direction, and then the transfer is performed. It was. In other words, the substrate transfer from the stock transfer table 1, the transfer transfer table 2, and the substrate discharge unit 3b must be free from the transfer transfer table 2, the substrate loading unit 3a, and the receiving transfer table 4 that are the transfer destinations. This is an intermittent conveyance method that confirms the above and conveys force. It should be noted that the preceding related to the present invention As technical literatures, JP-A-2002-176091 and JP-A-2005-119818 can be mentioned.
発明の開示  Disclosure of the invention
発明が解決しょうとする課題  Problems to be solved by the invention
[0006] し力しながら、このような搬送方向下流側の搬送先に基板が存在しないことを確認 してから次の基板搬送を行う方法では、図示されるように搬送における基板と基板と の間隔が広くなり、処理タクトが悪くなるという問題があった。 [0006] In the method of carrying out the next substrate conveyance after confirming that there is no substrate at the conveyance destination downstream in the conveyance direction, however, as shown in the drawing, There is a problem that the interval becomes wide and the processing tact becomes worse.
[0007] そこで、本発明が解決する課題は、装置に固定された処理ユニットに対して基板を 搬送しながら処理を行う基板処理装置への基板の搬送を連続して行うことができる基 板搬送方法を提供することである。 [0007] Therefore, the problem to be solved by the present invention is that the substrate transport capable of continuously transporting the substrate to the substrate processing apparatus that performs processing while transporting the substrate to the processing unit fixed to the apparatus. Is to provide a method.
課題を解決するための手段  Means for solving the problem
[0008] 上記課題を解決するため、本発明に係る基板処理装置への基板搬送方法は、処 理ユニットに対して基板を搬送しながら処理を行う基板処理装置の基板排出部から、 処理後基板が排出される以前に、前記基板処理装置の基板投入部に処理前基板の 投入を開始することを要旨とするものである。 [0008] In order to solve the above problems, a substrate transport method to a substrate processing apparatus according to the present invention includes a post-process substrate from a substrate discharge unit of a substrate processing apparatus that performs processing while transporting a substrate to a processing unit. The gist of the present invention is to start the introduction of the pre-treatment substrate into the substrate loading portion of the substrate processing apparatus before the substrate is discharged.
[0009] この場合、前記基板処理装置の基板投入部へ搬送される処理前基板が載置され る受け渡し搬送台と、前記基板処理装置の基板排出部から処理後基板が搬送され て載置される受け取り搬送台とを備えると共に、前記受け取り搬送台へ処理後基板 が搬送されて載置される前に、前記受け渡し搬送台から処理前基板の搬送が開始さ れる構成にすると良い。  [0009] In this case, the post-process substrate is transported and mounted from the transfer transport table on which the unprocessed substrate transported to the substrate loading unit of the substrate processing apparatus is placed, and the substrate discharge unit of the substrate processing apparatus. It is preferable to have a configuration in which the transfer of the unprocessed substrate from the transfer transfer table is started before the processed substrate is transferred to and placed on the receiving transfer table.
[0010] また、更に、前記受け渡し搬送台へ搬送される処理前基板が載置されるストック搬 送台が備えられると共に、前記基板投入部へ処理前基板が搬送されて載置される前 に、前記ストック搬送台から処理前基板の搬送が開始される構成にすると良い。更に 、前記受け渡し搬送台には、位置決め部が設けられ、この位置決め部により基板の 位置調整が行われる構成にすると良い。  [0010] Further, a stock transport table on which a pre-process substrate to be transported to the delivery transport table is placed, and before the pre-process substrate is transported to and placed on the substrate loading unit. The substrate may be transferred from the stock transfer table before being processed. Further, the delivery / conveying platform may be provided with a positioning portion, and the positioning of the substrate may be adjusted by the positioning portion.
[0011] そして、前記基板投入部、前記受け渡し搬送台及び前記ストック搬送台への前記 処理前基板の搬送が、前記処理前基板を浮上させて行われる構成にすると良い。  [0011] It is preferable that the unprocessed substrate is transferred to the substrate loading unit, the transfer transfer table, and the stock transfer table by floating the unprocessed substrate.
[0012] この場合、前記処理前基板を浮上させて行う搬送が、前記処理前基板の両端部を 保持する基板保持部の移動によりなされる構成にすると良い。また、前記処理前基 板を浮上させて行う搬送が、前記処理前基板の一端部を保持する基板保持部の移 動によりなされる構成にすると良い。 [0012] In this case, the transfer performed by levitating the unprocessed substrate is performed on both end portions of the unprocessed substrate. It is preferable to adopt a configuration in which the substrate holding portion to be held is moved. In addition, it is preferable that the transport performed by floating the pre-treatment substrate is performed by moving a substrate holding unit that holds one end of the pre-treatment substrate.
[0013] そして、前記基板保持部による前記処理前基板端部の保持が、吸着によりなされる 構成にすると良い。  [0013] The substrate holding portion may be held by the substrate holding portion by suction.
発明の効果  The invention's effect
[0014] 上記構成を有する基板処理装置への基板搬送方法によれば、処理ユニットに対し て基板を搬送しながら処理を行う基板処理装置の基板排出部から、処理後基板が排 出される以前に、前記基板処理装置の基板投入部に処理前基板の投入を開始する という構成なので、基板処理装置へ連続した基板投入が行われる。これにより、基板 処理装置による処理タクトの短縮が図られる。  [0014] According to the substrate transfer method to the substrate processing apparatus having the above-described configuration, before the processed substrate is discharged from the substrate discharge portion of the substrate processing apparatus that performs processing while transferring the substrate to the processing unit. Since the configuration is such that the introduction of the substrate before processing into the substrate loading unit of the substrate processing apparatus is started, the substrate is continuously loaded into the substrate processing apparatus. Thereby, the processing tact time by the substrate processing apparatus can be shortened.
[0015] この場合、前記基板処理装置の基板投入部へ搬送される処理前基板が載置され る受け渡し搬送台と、前記基板処理装置の基板排出部から処理後基板が搬送され て載置される受け取り搬送台とを備えると共に、前記受け取り搬送台へ処理後基板 が搬送されて載置される前に、前記受け渡し搬送台から処理前基板の搬送が開始さ れる構成にすれば、受け渡し搬送台から次々に処理前基板が装置の基板投入部に 搬送されるので、基板処理装置における処理タクトの短縮が図られる。  [0015] In this case, the post-process substrate is transported and mounted from the transfer transport table on which the pre-process substrate transported to the substrate loading unit of the substrate processing apparatus is mounted, and the substrate discharge unit of the substrate processing apparatus. A transfer carrier, and before the processed substrate is transferred to and placed on the receiving carrier, the transfer of the pre-process substrate from the transfer carrier is started. Since the unprocessed substrates are transferred one after another to the substrate loading portion of the apparatus, the processing tact time in the substrate processing apparatus can be shortened.
[0016] また、更に、前記受け渡し搬送台へ搬送される処理前基板が載置されるストック搬 送台が備えられると共に、前記基板投入部へ処理前基板が搬送されて載置される前 に、前記ストック搬送台から処理前基板の搬送が開始される構成にすれば、ストック 搬送台から次々に処理前基板が受け渡し搬送台に搬送されるので、搬送における 基板と基板との間隔を狭くすることができ、基板処理装置における処理タクトの短縮 が図られる。  [0016] Furthermore, a stock transport table on which the pre-processed substrate to be transported to the delivery transport table is placed, and before the pre-process substrate is transported to and placed on the substrate loading unit. If the configuration is such that the transfer of the pre-process substrate from the stock transfer table is started, the pre-process substrates are transferred from the stock transfer table to the transfer transfer table one after another, so that the distance between the substrate and the substrate in the transfer is reduced. Therefore, the processing tact time in the substrate processing apparatus can be shortened.
[0017] 更に、前記受け渡し搬送台には、位置決め部が設けられ、この位置決め部により基 板の位置調整が行われる構成にすれば、通常、基板処理装置の基板投入部におい て行われる基板の位置調整に先駆けて位置調整を行うことができるので、高精度な 位置決め(ァライメント調整)が可能となる。  [0017] Furthermore, if the positioning / conveying platform is provided with a positioning portion and the positioning of the substrate is adjusted by the positioning portion, the substrate is usually moved in the substrate loading portion of the substrate processing apparatus. Position adjustment can be performed prior to position adjustment, enabling highly accurate positioning (alignment adjustment).
[0018] そして、前記基板投入部、前記受け渡し搬送台及び前記ストック搬送台への前記 処理前基板の搬送が、前記処理前基板を浮上させて行われる構成にすれば、円滑 な基板搬送を行うことができる。 [0018] Then, the substrate loading unit, the transfer transport table and the stock transport table to the stock transport table If the unprocessed substrate is transported by floating the unprocessed substrate, the substrate can be transported smoothly.
[0019] この場合、前記処理前基板を浮上させて行う搬送が、前記処理前基板の幅方向の 両端部を保持する基板保持部の移動によりなされる構成にすれば、移動の際の基板 の保持が安定する。また、前記処理前基板を浮上させて行う搬送が、前記処理前基 板の幅方向の一端部を保持する基板保持部の移動によりなされる構成にすれば、例 えば、第 1基板はその左側端部を保持して搬送を行い、次の第 2基板はその右側端 部を保持して搬送を行うということが可能になり、搬送方向とは反対の方向への移動 のための機構が簡略になる。  [0019] In this case, if the transport performed by levitating the unprocessed substrate is performed by moving the substrate holding unit that holds both end portions in the width direction of the unprocessed substrate, Holding is stable. Further, if the transport that is performed by levitating the unprocessed substrate is made by moving the substrate holding section that holds one end portion in the width direction of the unprocessed substrate, for example, the first substrate is on the left side thereof. It is possible to carry while carrying the edge, and the next second substrate can be carried while holding the right edge, simplifying the mechanism for moving in the direction opposite to the carrying direction. become.
[0020] そして、前記基板保持部による前記処理前基板端部の保持が、吸着によりなされる 構成にすれば、保持の際の基板への損傷が軽減される。  [0020] Further, if the substrate holding section is configured to hold the unprocessed substrate end by adsorption, damage to the substrate during holding can be reduced.
図面の簡単な説明  Brief Description of Drawings
[0021] [図 1]本発明に係る搬送方法をパターン追従型露光装置に適用した場合の概略構 成を模式的に示した図である。  FIG. 1 is a diagram schematically showing a schematic configuration when a transport method according to the present invention is applied to a pattern following type exposure apparatus.
[図 2]図 1の基板搬送機構の概略構成とその搬送手順を示した図である。  2 is a diagram showing a schematic configuration of the substrate transfer mechanism of FIG. 1 and its transfer procedure.
[図 3]図 1の基板搬送機構が有する基板保持部の概略構成を示した図である。  3 is a diagram showing a schematic configuration of a substrate holding unit included in the substrate transport mechanism of FIG.
[図 4]図 2の基板搬送機構による搬送の手順の変形例 1を示した図である。  4 is a diagram showing a first modification of the transport procedure by the substrate transport mechanism of FIG. 2. FIG.
[図 5]図 2の基板搬送機構による搬送の手順の変形例 2を示した図である。  FIG. 5 is a diagram showing a second modification of the transport procedure by the substrate transport mechanism in FIG. 2.
[図 6]従来用いられてきた基板処理装置への基板搬送方法の手順を示した図である 発明を実施するための最良の形態  FIG. 6 is a diagram showing a procedure of a substrate transfer method to a substrate processing apparatus conventionally used. BEST MODE FOR CARRYING OUT THE INVENTION
[0022] 以下に、本発明に係る基板処理装置への基板搬送方法の実施の形態について図 面を参照して説明する。図 1は本発明に係る基板搬送方法を、基板処理装置として、 例えば図示されるようなパターン追従型露光装置 3に適用した場合の概略構成を模 式的に示した図である。尚、図 6の従来技術で説明したものと同一の構成については 同符号を付して説明を省略し、異なる点を中心に説明する。  Hereinafter, an embodiment of a method for transporting a substrate to a substrate processing apparatus according to the present invention will be described with reference to the drawings. FIG. 1 is a view schematically showing a schematic configuration when the substrate transport method according to the present invention is applied as a substrate processing apparatus to, for example, a pattern following type exposure apparatus 3 as shown. Note that the same components as those described in the prior art in FIG. 6 are denoted by the same reference numerals, description thereof is omitted, and different points will be mainly described.
[0023] 図 1 (a)〜図 1 (c)に示される基板搬送方法は、装置に固定された露光ユニット 3cに 対して基板を搬送しながら露光を行うパターン追従型露光装置 3の基板排出部 3bか ら、基板 Bが排出される前に、パターン追従型露光装置 3の基板投入部 3aに基板 D の投入を開始することを特徴として 、る。 [0023] The substrate transport method shown in FIGS. 1 (a) to 1 (c) is performed by discharging the substrate of the pattern following type exposure apparatus 3 that performs exposure while transporting the substrate to the exposure unit 3c fixed to the apparatus. Part 3b Thus, before the substrate B is discharged, the substrate D is started to be input into the substrate input portion 3a of the pattern following type exposure apparatus 3.
[0024] 図 1 (a)に示すように、露光装置 3の基板投入部 3aには、露光処理前の基板 Cが載 置されている。受け渡し搬送台 2には、基板 Cの次に露光処理される基板 Dが載置さ れている。そして、ストック搬送台 1には、基板 Dの次に露光処理される基板 Eが載置 されている。 As shown in FIG. 1 (a), the substrate C before the exposure processing is placed on the substrate loading unit 3a of the exposure apparatus 3. A substrate D to be exposed next to the substrate C is placed on the transfer carrier 2. A substrate E to be exposed next to the substrate D is placed on the stock transfer table 1.
[0025] 露光装置 3に基板排出部 3bには、露光処理後の基板 Bが載置されている。また、 受け取り搬送台 4には基板 Bより前に露光処理された基板 Aが載置されている。  In the exposure apparatus 3, the substrate B after the exposure processing is placed on the substrate discharge unit 3b. Further, the substrate A subjected to the exposure process before the substrate B is placed on the receiving carrier 4.
[0026] そして図 1 (b)に示すように、基板投入部 3aに載置されて 、た基板 Cの露光処理が 開始されると、基板排出部 3bから基板 Bが受け取り搬送台 4に搬送され、受け取り搬 送台 4に載置されていた基板 Aは図示しない排出ロボットによって搬送される。また、 受け渡し搬送台 2に載置されて 、た基板 Dは基板投入部 3aに搬送され、ストック搬送 台 1に載置されていた基板 Eは受け渡し搬送台 2に搬送される。そして、ストック搬送 台 1には図示しな!、搬入ロボットによって次の基板 Fが搬送される。  Then, as shown in FIG. 1 (b), when the exposure processing of the substrate C placed on the substrate loading unit 3a is started, the substrate B is received from the substrate discharge unit 3b and transferred to the transfer table 4. Then, the substrate A placed on the receiving / transporting table 4 is transported by a discharge robot (not shown). In addition, the substrate D placed on the transfer carrier 2 is transferred to the substrate loading unit 3a, and the substrate E placed on the stock carrier 1 is transferred to the transfer carrier 2. Then, the next substrate F is transferred to the stock transfer table 1 by a loading robot (not shown).
[0027] このとき図示されるように、露光装置 3の基板排出部 3aから基板 Bが排出される前 に、基板投入部 3aへの基板 Dの投入が開始されるようになっている。これにより、基 板搬送における基板と基板との間隔を狭くすることができ、ほぼ連続した搬送によつ て処理タクトの短縮が図られる。  At this time, as shown in the figure, before the substrate B is discharged from the substrate discharge portion 3a of the exposure apparatus 3, the loading of the substrate D into the substrate loading portion 3a is started. As a result, the distance between the substrates in the substrate conveyance can be narrowed, and the processing tact can be shortened by the almost continuous conveyance.
[0028] 図 2及び図 3は、上述したストック搬送台 1から受け渡し搬送台 2への基板の搬送、 及び受け渡し搬送台 2から露光装置 3の基板投入部 3aへの基板の搬送に用いられ る搬送機構の概略構成を示して 、る。  2 and 3 are used for transporting the substrate from the stock transport table 1 to the transfer transport table 2 and for transporting the substrate from the transfer transport table 2 to the substrate loading unit 3a of the exposure apparatus 3. The schematic structure of the transport mechanism is shown.
[0029] 図示される基板投入部 3a、受け渡し搬送台 2、ストック搬送台 1には基板を浮上状 態で載置する機構が備えられている。具体的には、図 3に示されるように、基板投入 部 3a、受け渡し搬送台 2、ストック搬送台 1の基板載置部を構成する定盤 10の上面( 基板載置面)には、エアーが吹き出される複数の孔 10aが形成されており、基板をェ ァー浮上させる機構を有している。また、基板投入部 3a、受け渡し搬送台 2、ストック 搬送台 1の幅方向(搬送方向に対して直交する方向)の寸法は、基板の幅よりも短く なっており、基板の幅方向の両端部は、基板投入部 3a、受け渡し搬送台 2、ストック 搬送台 1から所定長さ突出される。 [0029] The substrate loading unit 3a, the transfer carrier 2 and the stock carrier 1 shown in the figure are equipped with a mechanism for placing the substrate in a floating state. Specifically, as shown in FIG. 3, air is placed on the upper surface (substrate mounting surface) of the surface plate 10 constituting the substrate mounting portion of the substrate loading unit 3a, the delivery transfer table 2, and the stock transfer table 1. A plurality of holes 10a through which air is blown are formed, and has a mechanism for floating the substrate. In addition, the dimensions of the substrate loading part 3a, the transfer carrier 2 and the stock carrier 1 in the width direction (the direction perpendicular to the conveyance direction) are shorter than the width of the substrate. The substrate loading part 3a, the transfer carrier 2, the stock A predetermined length is projected from the carrier 1.
[0030] そして、搬送のために基板の幅方向の両端部を吸引により吸着保持する基板保持 部 11、 11及び基板保持部 12, 12がそれぞれ連結板 11a, 12aによって連結されて 設けられている。基板保持部 12は、受け渡し搬送台 2から基板投入部 3aまでを往復 動できるように設けられており、基板保持部 11は、ストック搬送台 1から受け渡し搬送 台 2までを往復動できるように設けられている。基板保持部 11, 12には、図 3に示さ れるように、上面に吸引用の複数の孔 l ib, 12bが形成されており、定盤 10から突出 した基板端部下面を吸引保持することが可能になっている。また、基板保持部 11, 1 2はそれぞれ昇降装置 11c, 12cによって昇降駆動され、基板吸引を行わないときは 下降することができるようになって!/ヽる。  [0030] For transporting, substrate holding portions 11, 11 and substrate holding portions 12, 12 for sucking and holding the both end portions in the width direction of the substrate by suction are connected by connecting plates 11a, 12a, respectively. . The substrate holder 12 is provided so as to reciprocate from the transfer carrier 2 to the substrate loading part 3a, and the substrate holder 11 is provided so as to reciprocate from the stock carrier 1 to the transfer carrier 2. It has been. As shown in FIG. 3, the substrate holding portions 11 and 12 are formed with a plurality of suction holes l ib and 12b on the upper surface, and suck and hold the lower surface of the substrate end protruding from the surface plate 10. Is possible. The substrate holders 11 and 12 are lifted and lowered by the lifting devices 11c and 12c, respectively, and can be lowered when the substrate suction is not performed.
[0031] また、露光ユニット 3cの手前位置、つまり基板投入部 3aの搬送方向の前方位置と、 受け渡し搬送台 2の搬送方向の前方位置には、位置決め部 13, 14がそれぞれ設け られている。各位置決め部 13, 14においては、図示しない外形基準のストッパ等に よって基板の位置決めが行われる。  [0031] In addition, positioning units 13 and 14 are provided at a position in front of the exposure unit 3c, that is, a front position in the transport direction of the substrate loading unit 3a and a front position in the transport direction of the transfer transport base 2, respectively. In each of the positioning portions 13 and 14, the substrate is positioned by an external reference stopper (not shown).
[0032] 次に、図 2 (a)〜図 2 (d)を用いて、基板が搬送される手順について説明する。先ず 、図 2 (a)に示されるように、露光装置 3の基板投入部 3aには、露光処理前の基板 C が載置されている。受け渡し搬送台 2には、基板 Cの次に露光処理される基板 Dが載 置されている。そして、ストック搬送台 1には、基板 Dの次に露光処理される基板 Eが 載置されている。  Next, a procedure for transporting the substrate will be described with reference to FIGS. 2 (a) to 2 (d). First, as shown in FIG. 2 (a), the substrate C before the exposure processing is placed on the substrate loading unit 3a of the exposure apparatus 3. A substrate D to be exposed next to the substrate C is placed on the transfer carrier 2. A substrate E to be exposed next to the substrate D is placed on the stock transfer table 1.
[0033] 露光装置 3に基板排出部 3bには、露光処理後の基板 Bが載置されている。また、 受け取り搬送台 4には基板 Bより前に露光処理された基板 Aが載置されている。  In the exposure apparatus 3, the substrate B after the exposure processing is placed on the substrate discharge unit 3b. Further, the substrate A subjected to the exposure process before the substrate B is placed on the receiving carrier 4.
[0034] そして図 2 (b)に示すように、基板投入部 3aに載置されて 、た基板 Cの露光処理が 開始されると、基板排出部 3bから基板 Bが受け取り搬送台 4に搬送され、受け取り搬 送台 4に載置されていた基板 Aは図示しない排出ロボットによって搬送される。  [0034] Then, as shown in FIG. 2 (b), when the exposure processing of the substrate C placed on the substrate loading unit 3a is started, the substrate B is received from the substrate discharge unit 3b and transferred to the transfer table 4. Then, the substrate A placed on the receiving / transporting table 4 is transported by a discharge robot (not shown).
[0035] このとき、受け渡し搬送台 2に載置されていた基板 Dは浮上状態にされ、基板保持 部 12によって基板投入部 3aに搬送される。また、ストック搬送台 1に載置されていた 基板 Eも浮上状態にされ、基板保持部 11によって受け取り搬送台 2に搬送される。そ して、ストック搬送台 1には図示しない搬入ロボットによって次の基板 Fが搬送される。 [0036] そして、図 2 (c)に示すように、基板 D, Eがそれぞれ基板投入部 3a,受け渡し搬送 台 2に載置されると、それぞれ位置決め部 14, 13による位置決めが行われる。その 後、図 2 (c)〜図 2 (d)に示すように、基板保持部 12, 11は基板吸引動作を停止して 、それぞれ次の基板 E, Fの搬送を行う位置に移動し、吸引動作を開始する。以下、 同様の手順で露光装置 3への基板搬送が行われる。 At this time, the substrate D placed on the delivery carrier 2 is brought into a floating state and is transported by the substrate holder 12 to the substrate loading unit 3a. In addition, the substrate E placed on the stock transfer table 1 is also floated and received by the substrate holding unit 11 and transferred to the transfer table 2. Then, the next substrate F is transferred to the stock transfer table 1 by a loading robot (not shown). Then, as shown in FIG. 2 (c), when the substrates D and E are placed on the substrate loading unit 3a and the transfer carrier 2, respectively, positioning is performed by the positioning units 14 and 13, respectively. After that, as shown in FIGS. 2 (c) to 2 (d), the substrate holders 12 and 11 stop the substrate suction operation and move to positions where the next substrates E and F are transferred, respectively. Start suction operation. Thereafter, the substrate is transferred to the exposure apparatus 3 in the same procedure.
[0037] このように、基板投入部 3a、受け渡し搬送台 2及びストック搬送台 1への基板搬送が 、基板を浮上させて行われる構成なので、円滑な基板搬送を行うことができる。また、 基板保持部 11 , 12による基板端部の保持が、吸着によりなされる構成なので、保持 の際の基板への損傷が軽減される。  [0037] As described above, since the substrate transfer to the substrate loading unit 3a, the transfer transfer table 2 and the stock transfer table 1 is performed by floating the substrate, smooth substrate transfer can be performed. Further, since the substrate end portions are held by the substrate holding portions 11 and 12 by adsorption, damage to the substrate during holding is reduced.
[0038] 更に、受け渡し搬送台 2に設けられた位置決め部 13により基板の位置調整が行わ れる構成なので、通常、露光装置 3の基板投入部 3aの位置決め部 14において行わ れる基板の位置調整に先駆けて、基板の位置調整を行うことができるので、 2つの位 置決め部 13, 14による高精度な基板の位置決め(ァライメント調整)が可能となる。  [0038] Further, since the position of the substrate is adjusted by the positioning unit 13 provided on the delivery carrier 2, the position adjustment of the substrate is usually performed in the positioning unit 14 of the substrate loading unit 3a of the exposure apparatus 3. Since the position of the substrate can be adjusted, the substrate can be positioned (alignment adjustment) with high accuracy by the two positioning portions 13 and 14.
[0039] 図 4は、上述した図 2における基板保持部 12, 11の移動の変形例を示しており、異 なる点のみを説明する。この場合、図 4 (c)〜図 4 (d)に示されるように、基板保持部 1 2は基板吸引動作を停止して、次の基板 Fの搬送を行う位置に移動し、吸引動作を 開始するが、基板保持部 11は吸引動作を継続した状態で移動しない。そして、図 4 ( e)に示されるように、基板投入部 3aに載置されていた基板 Dの露光処理が開始され ると、受け渡し搬送台 2に載置されていた基板 Eは、基板保持部 11によって基板投 入部 3aに搬送され、ストック搬送台 1に載置されていた基板 Fは、基板保持部 12によ つて受け取り搬送台 2に搬送される。  FIG. 4 shows a modified example of the movement of the substrate holders 12 and 11 in FIG. 2 described above, and only the differences will be described. In this case, as shown in FIGS. 4 (c) to 4 (d), the substrate holding unit 12 stops the substrate suction operation, moves to the position where the next substrate F is transported, and performs the suction operation. The substrate holding unit 11 does not move while continuing the suction operation. Then, as shown in FIG. 4 (e), when the exposure processing of the substrate D placed on the substrate loading unit 3a is started, the substrate E placed on the transfer carrier 2 is held on the substrate. The substrate F transferred to the substrate loading unit 3a by the unit 11 and placed on the stock transfer table 1 is received by the substrate holding unit 12 and transferred to the transfer table 2.
[0040] つまり、図 4 (a)〜図 4 (e)に順に示されるように、基板 Eは基板保持部 11によって、 ストック搬送台 1から基板投入部 3aまでの搬送を一環して行われることになる。このよ うに、基板保持部 11, 12の搬送方向とは反対の方向への移動は、いずれか一方の 基板保持部が移動すればよいので、基板保持部による吸引動作の回数が削減され 、搬送時の基板のズレが抑制される。  That is, as shown in FIG. 4 (a) to FIG. 4 (e) in order, the substrate E is carried by the substrate holding unit 11 as part of the conveyance from the stock conveyance table 1 to the substrate loading unit 3a. It will be. As described above, since the movement of the substrate holders 11 and 12 in the direction opposite to the conveyance direction only needs to move one of the substrate holders, the number of suction operations by the substrate holder can be reduced and the conveyance can be performed. The displacement of the substrate at the time is suppressed.
[0041] 次に、図 5は上述した図 2の基板保持部 12, 11が、基板の片側端部にだけ設けら れた構成を示している。この図 5 (a)〜図 5 (e)を用いて、基板が搬送される手順につ いて説明する。先ず、図 5 (a)に示されるように、露光装置 3の基板投入部 3aには、露 光処理前の基板 Cが載置されている。受け渡し搬送台 2には、基板 Cの次に露光処 理される基板 Dが載置されている。そして、ストック搬送台 1には、基板 Dの次に露光 処理される基板 Eが載置されて ヽる。 Next, FIG. 5 shows a configuration in which the substrate holding portions 12 and 11 of FIG. 2 described above are provided only at one end portion of the substrate. Using these Fig. 5 (a) to Fig. 5 (e), the procedure for transporting the substrate is described. And explain. First, as shown in FIG. 5A, the substrate C before exposure processing is placed on the substrate loading unit 3a of the exposure apparatus 3. A substrate D to be exposed next to the substrate C is placed on the transfer carrier 2. A substrate E to be exposed next to the substrate D is placed on the stock transfer table 1.
[0042] 露光装置 3に基板排出部 3bには、露光処理後の基板 Bが載置されている。また、 受け取り搬送台 4には基板 Bより前に露光処理された基板 Aが載置されている。  In the exposure apparatus 3, the substrate B after the exposure processing is placed on the substrate discharge unit 3b. Further, the substrate A subjected to the exposure process before the substrate B is placed on the receiving carrier 4.
[0043] そして図 5 (b)に示すように、基板投入部 3aに載置されて 、た基板 Cの露光処理が 開始されると、基板排出部 3bから基板 Bが受け取り搬送台 4に搬送され、受け取り搬 送台 4に載置されていた基板 Aは図示しない排出ロボットによって搬送される。  Then, as shown in FIG. 5 (b), when the exposure processing of the substrate C placed on the substrate loading unit 3a is started, the substrate B is received from the substrate discharge unit 3b and transferred to the transfer table 4. Then, the substrate A placed on the receiving / transporting table 4 is transported by a discharge robot (not shown).
[0044] このとき、受け渡し搬送台 2に載置されていた基板 Dは浮上状態にされ、下側にだ け設けられた基板保持部 12によって基板投入部 3aに搬送される。また、ストック搬送 台 1に載置されていた基板 Eも浮上状態にされ、上側にだけ設けられた基板保持部 1 1によって受け取り搬送台 2に搬送される。そして、ストック搬送台 1には図示しない搬 入口ボットによって次の基板 Fが搬送される。  [0044] At this time, the substrate D placed on the transfer carrier 2 is brought into a floating state and is transferred to the substrate loading unit 3a by the substrate holding unit 12 provided only on the lower side. In addition, the substrate E placed on the stock transfer table 1 is also floated, and is received and transferred to the transfer table 2 by the substrate holder 11 provided only on the upper side. Then, the next substrate F is transferred to the stock transfer table 1 by a transfer port bot (not shown).
[0045] そして、図 5 (c)に示すように、基板 D, Eがそれぞれ基板投入部 3a,受け渡し搬送 台 2に載置されると、それぞれ位置決め部 14, 13による位置決めが行われる。その 後、図 5 (c)〜図 5 (d)に示すように、基板保持部 12は基板吸引動作を停止して、次 の基板 Fの搬送を行う位置に移動し、吸引動作を開始するが、基板保持部 11は吸引 動作を停止又は継続した状態で移動しな ヽ。  Then, as shown in FIG. 5 (c), when the substrates D and E are placed on the substrate loading unit 3a and the transfer carrier 2, respectively, positioning is performed by the positioning units 14 and 13, respectively. Thereafter, as shown in FIGS. 5 (c) to 5 (d), the substrate holding unit 12 stops the substrate suction operation, moves to a position where the next substrate F is transported, and starts the suction operation. However, the substrate holder 11 should not move while the suction operation is stopped or continued.
[0046] そして、図 5 (e)に示されるように、基板投入部 3aに載置されて ヽた基板 Dの露光処 理が開始されると、受け渡し搬送台 2に載置されていた基板 Eは、基板保持部 11によ つて基板投入部 3aに搬送され、ストック搬送台 1に載置されていた基板 Fは、基板保 持部 12によって受け取り搬送台 2に搬送される。  Then, as shown in FIG. 5 (e), when the exposure processing of the substrate D placed on the substrate loading unit 3a is started, the substrate placed on the delivery carrier 2 E is transferred to the substrate loading unit 3a by the substrate holding unit 11, and the substrate F placed on the stock transfer table 1 is received by the substrate holding unit 12 and transferred to the transfer table 2.
[0047] つまり、図 5 (a)〜図 5 (e)に順に示されるように、基板 Eは基板保持部 11によって、 ストック搬送台 1から基板投入部 3aまでの搬送を一環して行われることになる。このよ うに、基板保持部を基板端部の一方にだけ設け、更には前後の基板では設ける位置 を逆にした構成にすることで、基板保持部 11, 12の搬送方向とは反対の方向への移 動は、いずれか一方の基板保持部が移動すればよぐ更には移動のための機構も簡 易である。これにより、基板保持部による吸引動作の回数が削減され、搬送時の基板 のズレが抑制される。 That is, as shown in FIGS. 5 (a) to 5 (e) in order, the substrate E is transported by the substrate holder 11 from the stock transport table 1 to the substrate loading unit 3a as a part. It will be. In this way, the substrate holding part is provided only on one end of the substrate, and the positions where the board holding parts are provided on the front and rear substrates are reversed so that the substrate holding parts 11 and 12 are transported in the opposite direction. This movement can be achieved by moving either one of the substrate holders, and the mechanism for movement can be simplified. Easy. As a result, the number of suction operations by the substrate holder is reduced, and displacement of the substrate during transport is suppressed.
以上、本発明の一実施形態について説明したが、本発明はこうした実施形態に何 ら限定されるものではなぐ本発明の要旨を逸脱しない範囲において、種々なる態様 で実施できることは勿論である。例えば、上述した実施の形態では、本発明の基板搬 送方法が適用される基板処理装置の例としてパターン追従型露光装置を用いて説 明したが、基板上の既存のパターンに追従しながら基板へ処理を行うパターン追従 型の基板処理装置であれば本発明に係る基板搬送方法は適用可能である。例えば 、液晶パネルに用いられるカラーフィルタの着色層形成装置であって、着色インクを インクジェット方式によりブラックマトリックスパターンに追従しながらブラックマトリック ス開口部に着色インクを吐出するパターン追従型描画装置等にも適用でき、上述し たパターン追従型露光装置に限定されない。  Although one embodiment of the present invention has been described above, the present invention is of course not limited to such embodiment and can be implemented in various modes without departing from the gist of the present invention. For example, in the above-described embodiment, the description has been given using the pattern following type exposure apparatus as an example of the substrate processing apparatus to which the substrate transport method of the present invention is applied, but the substrate follows the existing pattern on the substrate. The substrate transfer method according to the present invention is applicable to any pattern following type substrate processing apparatus that performs processing. For example, a coloring layer forming apparatus for a color filter used in a liquid crystal panel, and a pattern following type drawing apparatus for discharging colored ink to a black matrix opening while following a black matrix pattern by an ink jet method. It can be applied and is not limited to the pattern following type exposure apparatus described above.

Claims

請求の範囲 The scope of the claims
[1] 処理ユニットに対して基板を搬送しながら処理を行う基板処理装置の基板排出部 から、処理後基板が排出される以前に、前記基板処理装置の基板投入部に処理前 基板の投入を開始することを特徴とする基板処理装置への基板搬送方法。  [1] Before the processed substrate is discharged from the substrate discharge unit of the substrate processing apparatus that performs processing while transporting the substrate to the processing unit, the substrate processing unit is loaded with the substrate before processing. A substrate transport method to a substrate processing apparatus, characterized by starting.
[2] 前記基板処理装置の基板投入部へ搬送される処理前基板が載置される受け渡し 搬送台と、前記基板処理装置の基板排出部から処理後基板が搬送されて載置され る受け取り搬送台とを備えると共に、前記受け取り搬送台へ処理後基板が搬送され て載置される前に、前記受け渡し搬送台から処理前基板の搬送が開始されることを 特徴とする請求項 1に記載の基板処理装置への基板搬送方法。  [2] A transfer carrier on which a pre-processed substrate to be transported to the substrate loading unit of the substrate processing apparatus is placed, and a receiving transport on which the processed substrate is transported and placed from the substrate discharge unit of the substrate processing apparatus 2. The transfer of the pre-process substrate from the transfer transfer table is started before the post-process substrate is transferred to and placed on the receiving transfer table. A substrate transport method to a substrate processing apparatus.
[3] 更に、前記受け渡し搬送台へ搬送される処理前基板が載置されるストック搬送台が 備えられると共に、前記基板投入部へ処理前基板が搬送されて載置される前に、前 記ストック搬送台から処理前基板の搬送が開始されることを特徴とする請求項 2に記 載の基板処理装置への基板搬送方法。  [3] Furthermore, a stock transfer table on which a pre-process substrate to be transferred to the delivery transfer table is placed, and before the pre-process substrate is transferred to and placed on the substrate loading unit, 3. The method for transporting a substrate to a substrate processing apparatus according to claim 2, wherein the transport of the substrate before processing is started from the stock transport table.
[4] 前記受け渡し搬送台には、位置決め部が設けられ、この位置決め部により基板の 位置調整が行われることを特徴とする請求項 2又は 3に記載の基板処理装置への基 板搬送方法。  4. The method for transporting a substrate to a substrate processing apparatus according to claim 2 or 3, wherein the transfer transport table is provided with a positioning portion, and the position of the substrate is adjusted by the positioning portion.
[5] 前記基板投入部、前記受け渡し搬送台及び前記ストック搬送台への前記処理前基 板の搬送が、前記処理前基板を浮上させて行われることを特徴とする請求項 3又は 4 に記載の基板処理装置への基板搬送方法。  [5] The transfer of the substrate before processing to the substrate loading unit, the transfer transfer table and the stock transfer table is performed by floating the substrate before processing. Substrate transport method to a substrate processing apparatus.
[6] 前記処理前基板を浮上させて行う搬送が、前記処理前基板の幅方向の両端部を 保持する基板保持部の移動によりなされることを特徴とする請求項 5に記載の基板処 理装置への基板搬送方法。 [6] The substrate processing according to [5], wherein the transfer performed by levitating the unprocessed substrate is performed by movement of a substrate holding unit that holds both end portions in the width direction of the unprocessed substrate. A substrate transport method to the apparatus.
[7] 前記処理前基板を浮上させて行う搬送が、前記処理前基板の幅方向の一端部を 保持する基板保持部の移動によりなされることを特徴とする請求項 5に記載の基板処 理装置への基板搬送方法。 [7] The substrate processing according to [5], wherein the transfer performed by floating the substrate before processing is performed by movement of a substrate holding unit that holds one end portion of the substrate before processing in the width direction. A substrate transport method to the apparatus.
[8] 前記基板保持部による前記処理前基板端部の保持が、吸着によりなされることを特 徴とする請求項 6又は 7に記載の基板処理装置への基板搬送方法。 8. The method for transporting a substrate to a substrate processing apparatus according to claim 6, wherein the pre-processing substrate end is held by the substrate holding unit by suction.
PCT/JP2006/325833 2005-12-27 2006-12-26 Method of conveying substrate to substrate processing device WO2007074798A1 (en)

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ITUD20090041A1 (en) * 2009-02-23 2010-08-23 Applied Materials Inc SUBSTRATE REVERSAL SYSTEM
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