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WO2006054732A3 - Polishing apparatus and polishing method - Google Patents

Polishing apparatus and polishing method Download PDF

Info

Publication number
WO2006054732A3
WO2006054732A3 PCT/JP2005/021314 JP2005021314W WO2006054732A3 WO 2006054732 A3 WO2006054732 A3 WO 2006054732A3 JP 2005021314 W JP2005021314 W JP 2005021314W WO 2006054732 A3 WO2006054732 A3 WO 2006054732A3
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
workpiece
polishing liquid
supply port
polishing apparatus
Prior art date
Application number
PCT/JP2005/021314
Other languages
French (fr)
Other versions
WO2006054732A2 (en
Inventor
Tatsuya Kohama
Itsuki Kobata
Toshikazu Nomura
Original Assignee
Ebara Corp
Tatsuya Kohama
Itsuki Kobata
Toshikazu Nomura
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp, Tatsuya Kohama, Itsuki Kobata, Toshikazu Nomura filed Critical Ebara Corp
Priority to KR1020077013603A priority Critical patent/KR101088785B1/en
Priority to EP05806653A priority patent/EP1830985A2/en
Publication of WO2006054732A2 publication Critical patent/WO2006054732A2/en
Publication of WO2006054732A3 publication Critical patent/WO2006054732A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A polishing apparatus can supply a polishing liquid uniformly and efficiently to a surface to be polished of a workpiece. The polishing apparatus includes a polishing table (22) having a polishing surface, and a top ring (24) for holding a workpiece and pressing the workpiece against the polishing surface. The polishing apparatus also includes a polishing liquid supply port (57) for supplying a polishing liquid to the polishing surface, and a moving mechanism for moving the polishing liquid supply port to distribute the polishing liquid uniformly over an entire surface of the workpiece due to relative movement of the workpiece and the polishing surface.
PCT/JP2005/021314 2004-11-18 2005-11-15 Polishing apparatus and polishing method WO2006054732A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020077013603A KR101088785B1 (en) 2004-11-18 2005-11-15 Polishing device and polishing method
EP05806653A EP1830985A2 (en) 2004-11-18 2005-11-15 Polishing apparatus and polishing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004334548A JP2006147773A (en) 2004-11-18 2004-11-18 Polishing apparatus and polishing method
JP2004-334548 2004-11-18

Publications (2)

Publication Number Publication Date
WO2006054732A2 WO2006054732A2 (en) 2006-05-26
WO2006054732A3 true WO2006054732A3 (en) 2006-08-03

Family

ID=35726381

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2005/021314 WO2006054732A2 (en) 2004-11-18 2005-11-15 Polishing apparatus and polishing method

Country Status (6)

Country Link
US (2) US20060105678A1 (en)
EP (1) EP1830985A2 (en)
JP (1) JP2006147773A (en)
KR (1) KR101088785B1 (en)
TW (1) TWI290507B (en)
WO (1) WO2006054732A2 (en)

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US11136667B2 (en) 2007-01-08 2021-10-05 Eastman Kodak Company Deposition system and method using a delivery head separated from a substrate by gas pressure
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US8360817B2 (en) * 2009-04-01 2013-01-29 Ebara Corporation Polishing apparatus and polishing method
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US10065288B2 (en) * 2012-02-14 2018-09-04 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing (CMP) platform for local profile control
US20140080229A1 (en) * 2012-09-14 2014-03-20 Stmicroelectronics, Inc. Adaptive semiconductor processing using feedback from measurement devices
JP5890768B2 (en) * 2012-11-19 2016-03-22 株式会社東京精密 Semiconductor wafer processing equipment
JP5890767B2 (en) * 2012-11-19 2016-03-22 株式会社東京精密 Semiconductor wafer thickness measuring method and semiconductor wafer processing apparatus
US9718164B2 (en) 2012-12-06 2017-08-01 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing system and polishing method
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JP7083722B2 (en) * 2018-08-06 2022-06-13 株式会社荏原製作所 Polishing equipment and polishing method
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CN111283548B (en) * 2018-12-07 2023-07-18 株式会社迪思科 Processing method of disc-shaped workpiece
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JP7145098B2 (en) 2019-02-21 2022-09-30 株式会社荏原製作所 A recording medium recording a polishing apparatus, a polishing method, and a polishing liquid supply position determination program
JP7493966B2 (en) * 2020-03-06 2024-06-03 株式会社荏原製作所 Polishing Equipment and Processing Systems
KR20210113041A (en) 2020-03-06 2021-09-15 가부시키가이샤 에바라 세이사꾸쇼 Polishing apparatus, treatment system, and polishing method
US11819976B2 (en) * 2021-06-25 2023-11-21 Applied Materials, Inc. Spray system for slurry reduction during chemical mechanical polishing (cmp)
JP2023009482A (en) 2021-07-07 2023-01-20 株式会社荏原製作所 Polishing device and polishing method
CN115229646B (en) * 2022-07-05 2023-11-10 肇庆宏旺金属实业有限公司 Polishing device for silicon steel sheet processing and application method thereof

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Also Published As

Publication number Publication date
JP2006147773A (en) 2006-06-08
US20060105678A1 (en) 2006-05-18
KR20070086291A (en) 2007-08-27
EP1830985A2 (en) 2007-09-12
TWI290507B (en) 2007-12-01
TW200624224A (en) 2006-07-16
KR101088785B1 (en) 2011-12-01
US20090142990A1 (en) 2009-06-04
WO2006054732A2 (en) 2006-05-26

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