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WO2005119363A3 - Assembly for supporting a workpiece or specimen in a charged particle beam system - Google Patents

Assembly for supporting a workpiece or specimen in a charged particle beam system Download PDF

Info

Publication number
WO2005119363A3
WO2005119363A3 PCT/GB2005/050066 GB2005050066W WO2005119363A3 WO 2005119363 A3 WO2005119363 A3 WO 2005119363A3 GB 2005050066 W GB2005050066 W GB 2005050066W WO 2005119363 A3 WO2005119363 A3 WO 2005119363A3
Authority
WO
WIPO (PCT)
Prior art keywords
assembly
chuck
specimen
workpiece
supporting
Prior art date
Application number
PCT/GB2005/050066
Other languages
French (fr)
Other versions
WO2005119363A2 (en
Inventor
Tao Zhang
Original Assignee
Nanobeam Ltd
Tao Zhang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanobeam Ltd, Tao Zhang filed Critical Nanobeam Ltd
Publication of WO2005119363A2 publication Critical patent/WO2005119363A2/en
Publication of WO2005119363A3 publication Critical patent/WO2005119363A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electron Beam Exposure (AREA)

Abstract

An assembly (1) for an electron beam lithography system comprises a chuck (2) and an interferometer mirror assembly (3). The chuck (3) has three hemispherical feet (6 , 7, 8). The interferometer stage has three radial ‘V’ grooves (22, 23, 24) pointing to a common origin (25). When the chuck is placed on the mirror assembly, the feet stand in the grooves. If the chuck expands or contracts, the feet slide along the grooves.
PCT/GB2005/050066 2004-06-03 2005-05-13 Assembly for supporting a workpiece or specimen in a charged particle beam system WO2005119363A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0412430A GB2414858A (en) 2004-06-03 2004-06-03 A workpiece or specimen support assembly for a charged particle beam system
GB0412430.1 2004-06-03

Publications (2)

Publication Number Publication Date
WO2005119363A2 WO2005119363A2 (en) 2005-12-15
WO2005119363A3 true WO2005119363A3 (en) 2006-02-02

Family

ID=32696631

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2005/050066 WO2005119363A2 (en) 2004-06-03 2005-05-13 Assembly for supporting a workpiece or specimen in a charged particle beam system

Country Status (3)

Country Link
GB (1) GB2414858A (en)
TW (1) TW200603263A (en)
WO (1) WO2005119363A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2476476B (en) 2009-12-23 2013-05-22 Nanobeam Ltd Charged particle beam system
JP6906786B2 (en) * 2017-03-27 2021-07-21 株式会社日立ハイテクサイエンス Sample holders, member mounting devices, and charged particle beam devices

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6188150B1 (en) * 1999-06-16 2001-02-13 Euv, Llc Light weight high-stiffness stage platen
US20020101956A1 (en) * 1996-03-12 2002-08-01 Shinichi Hara X-ray projection exposure apparatus and a device manufacturing method
EP1237045A2 (en) * 2001-03-01 2002-09-04 ASML Netherlands B.V. Lithographic mask handling
EP1274121A1 (en) * 2001-06-29 2003-01-08 Infineon Technologies SC300 GmbH & Co. KG Wafer chuck for supporting a semiconductor wafer
EP1304727A2 (en) * 2001-10-19 2003-04-23 ASML US, Inc. Wafer handling system and method for use in lithography patterning
US6563586B1 (en) * 1999-02-01 2003-05-13 Therma-Wave, Inc. Wafer metrology apparatus and method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07183364A (en) * 1993-12-24 1995-07-21 Toshiba Corp Semiconductor manufacturing device
EP1036406B1 (en) * 1997-11-03 2003-04-02 ASM America, Inc. Improved low mass wafer support system
JP2004247484A (en) * 2003-02-13 2004-09-02 Canon Inc Mirror holding device, aligner, and method of manufacturing device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020101956A1 (en) * 1996-03-12 2002-08-01 Shinichi Hara X-ray projection exposure apparatus and a device manufacturing method
US6563586B1 (en) * 1999-02-01 2003-05-13 Therma-Wave, Inc. Wafer metrology apparatus and method
US6188150B1 (en) * 1999-06-16 2001-02-13 Euv, Llc Light weight high-stiffness stage platen
EP1237045A2 (en) * 2001-03-01 2002-09-04 ASML Netherlands B.V. Lithographic mask handling
EP1274121A1 (en) * 2001-06-29 2003-01-08 Infineon Technologies SC300 GmbH & Co. KG Wafer chuck for supporting a semiconductor wafer
EP1304727A2 (en) * 2001-10-19 2003-04-23 ASML US, Inc. Wafer handling system and method for use in lithography patterning

Also Published As

Publication number Publication date
WO2005119363A2 (en) 2005-12-15
GB0412430D0 (en) 2004-07-07
GB2414858A (en) 2005-12-07
TW200603263A (en) 2006-01-16

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