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WO2005041294A3 - Integrated circuit packaging - Google Patents

Integrated circuit packaging Download PDF

Info

Publication number
WO2005041294A3
WO2005041294A3 PCT/IB2004/003451 IB2004003451W WO2005041294A3 WO 2005041294 A3 WO2005041294 A3 WO 2005041294A3 IB 2004003451 W IB2004003451 W IB 2004003451W WO 2005041294 A3 WO2005041294 A3 WO 2005041294A3
Authority
WO
WIPO (PCT)
Prior art keywords
lead frame
attached
paddle
exposed
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2004/003451
Other languages
French (fr)
Other versions
WO2005041294A2 (en
Inventor
Der Wiel Appolonius Jacobu Van
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Melexis NV
Original Assignee
Melexis NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Melexis NV filed Critical Melexis NV
Publication of WO2005041294A2 publication Critical patent/WO2005041294A2/en
Publication of WO2005041294A3 publication Critical patent/WO2005041294A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10W76/134—
    • H10W70/40—
    • H10W72/0198—
    • H10W72/5363—
    • H10W72/552—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

A number of substantially identical lead frames are formed in a rectangular array. Each lead frame comprises a paddle area (101a) and connector leads (101b). Each lead frame is initially partially encapsulated in a moulding compound in such a manner that after encapsulation, the upper surface of the paddle (101a) is exposed and the ends of the connector leads (101b) are exposed. The partial encapsulation forms an open top box having a base (102a) and walls (102b) projecting upwardly from the periphery of the base (102a). After each lead frame is partially encapsulated, a semiconductor die (113) is attached to the exposed surface of each paddle (101a) and electrical connections (114) are made between the die and the connector leads (101b). Once a die (113) has been attached to each lead frame, a lid (116) is attached to the upper surface of walls (102b), to provide a sealed package (102). Each individual package in the array is separated by cutting.
PCT/IB2004/003451 2003-10-22 2004-10-21 Integrated circuit packaging Ceased WO2005041294A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0324632A GB0324632D0 (en) 2003-10-22 2003-10-22 Integrated circuit packaging
GB0324632.9 2003-10-22

Publications (2)

Publication Number Publication Date
WO2005041294A2 WO2005041294A2 (en) 2005-05-06
WO2005041294A3 true WO2005041294A3 (en) 2005-10-13

Family

ID=29595599

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2004/003451 Ceased WO2005041294A2 (en) 2003-10-22 2004-10-21 Integrated circuit packaging

Country Status (2)

Country Link
GB (1) GB0324632D0 (en)
WO (1) WO2005041294A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006045896A1 (en) * 2006-09-28 2008-04-03 Siemens Ag Electronic housing for accommodating e.g. electronic device, has cover flexibly formed such that inner area is moved within preset operating temperature range with respect to compression strength of base, cover or sealing coupling

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6058020A (en) * 1996-06-28 2000-05-02 Siemens Aktiengesellschaft Component housing for surface mounting of a semiconductor component
US6384472B1 (en) * 2000-03-24 2002-05-07 Siliconware Precision Industries Co., Ltd Leadless image sensor package structure and method for making the same
WO2002043134A1 (en) * 2000-11-20 2002-05-30 Handy & Harman Method and system for manufacturing electronic packaging units
US6476478B1 (en) * 1999-11-12 2002-11-05 Amkor Technology, Inc. Cavity semiconductor package with exposed leads and die pad
US20030102540A1 (en) * 2001-12-03 2003-06-05 Azimuth Industrial Co. Inc. Method and apparatus for a lead-frame air-cavity package

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6058020A (en) * 1996-06-28 2000-05-02 Siemens Aktiengesellschaft Component housing for surface mounting of a semiconductor component
US6476478B1 (en) * 1999-11-12 2002-11-05 Amkor Technology, Inc. Cavity semiconductor package with exposed leads and die pad
US6384472B1 (en) * 2000-03-24 2002-05-07 Siliconware Precision Industries Co., Ltd Leadless image sensor package structure and method for making the same
WO2002043134A1 (en) * 2000-11-20 2002-05-30 Handy & Harman Method and system for manufacturing electronic packaging units
US20030102540A1 (en) * 2001-12-03 2003-06-05 Azimuth Industrial Co. Inc. Method and apparatus for a lead-frame air-cavity package

Also Published As

Publication number Publication date
GB0324632D0 (en) 2003-11-26
WO2005041294A2 (en) 2005-05-06

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